RM3100 RM2100 Sensor Suite User Manual R09 1

User Manual
RM3100 & RM2100

Sensor Suite
Table of Contents
1 COPYRIGHT & WARRANTY INFORMATION ........................................................................ 3
2 INTRODUCTION ...................................................................................................................... 4
3 SPECIFICATIONS .................................................................................................................... 5
3.1 GEOMAGNETIC SENSOR CHARACTERISTICS ............................................... 5
3.2 SEN-XY-F AND SEN-Z-F CHARACTERISTICS ................................................. 6
3.3 MAGI2C CHARACTERISTICS ............................................................................ 7
3.4 DIMENSIONS, PACKAGING, AND PAD & MASK LAYOUT ............................. 8
3.4.1 Sen-XY-f................................................................................................... 8
3.4.2 Sen-Z-f ................................................................................................... 10
3.4.3 MagI2C .................................................................................................. 12
3.5 SOLDERING ...................................................................................................... 13
4 GEOMAGNETIC SENSOR OVERVIEW & SET-UP ............................................................ 15
4.1 OVERVIEW ........................................................................................................ 15
4.2 LAYOUT ............................................................................................................. 18
4.2.1 Sensor Coil Orientation ......................................................................... 18
4.2.2 Local Magnetic Field Considerations .................................................... 18
4.2.3 Other Layout Considerations ................................................................ 19
4.3 MAGI2C PIN-OUT .............................................................................................. 20
4.3.1 General Pins .......................................................................................... 20
4.3.2 SPI Pins ..................................................................................................22
4.3.3 I2C Pins .................................................................................................. 23
4.4 SPI TIMING REQUIREMENTS ......................................................................... 24
4.5 I2C REQUIREMENTS ........................................................................................ 26
4.5.1 I2C Register Write .................................................................................. 26
4.5.2 I2C Register Read .................................................................................. 27
5 MAGI2C OPERATION ........................................................................................................... 28
5.1 SET THE CYCLE COUNT REGISTERS (0X04 – 0X09) ................................. 28
5.2 INITIATE CONTINUOUS MEASUREMENT MODE (0X01) ............................ 29
5.2.1 Setting the CMM Update Rate with TMRC (0x0B) .............................. 31
5.3 INITIATE A SINGLE MEASUREMENT (0X00) ................................................ 32
5.4 CONFIRM NEW DATA READY ........................................................................ 33
5.4.1 STATUS Register (0x34) ...................................................................... 33
5.5 READ THE MEASUREMENT RESULTS ......................................................... 33
5.6 TROUBLESHOOTING AND GENERAL INFORMATION................................. 34
5.6.1 Built-In Self Test Register (0x33) ......................................................... 34
5.6.2 HSHAKE Register (0x35) ..................................................................... 36
5.6.3 REVID Register (0x36) ......................................................................... 36
5.7 EXAMPLES USING THE SPI INTERFACE ..................................................... 37
5.7.1 Set the Cycle Count Registers ............................................................. 37
5.7.2 Making and Reading Measurements ................................................... 37
5.8 EXAMPLES USING THE I2C INTERFACE ...................................................... 40
5.8.1 Set the Cycle Count Registers ............................................................. 40
5.8.2 Initiate a Single Measurement .............................................................. 40
5.8.3 Initiate Continuous Measurement Mode............................................... 41
5.8.4 Read the Measurement Results ........................................................... 41
PNI Sensor Doc 1017252 R09

RM3100 & RM2100 Sensor Suite User Manual Page 1 of 43
List of Figures
Figure 3-1: Sen-XY-f Sensor Dimensions ..................................................................................... 8
Figure 3-2: Sen-XY-f Tape and Reel Dimensions ........................................................................ 9
Figure 3-3: Sen-XY-f Recommended Solder Pad, Paste, & Mask Layout.................................. 9
Figure 3-4: Sen-Z-f Sensor Dimensions ..................................................................................... 10
Figure 3-5: Sen-Z-f Tape and Reel Dimensions ......................................................................... 11
Figure 3-6: Sen-Z-f Recommended Solder Pad, Paste, & Mask Layout .................................. 11
Figure 3-7: MagI2C MLF Mechanical Drawing ........................................................................... 12
Figure 3-8: MagI2C MLF Tape Dimensions................................................................................ 13
Figure 3-9: Recommended Solder Reflow Profile ...................................................................... 14
Figure 4-1: RM3100 reference schematic – SPI Configuration ................................................. 15
Figure 4-2: RM3100 reference schematic – I2C Configuration .................................................. 16
Figure 4-3: LR Oscillator Circuit Biasing Diagram ...................................................................... 17
Figure 4-4: RM3100 North-East-Down (NED) Sensor Layout ................................................... 18
Figure 4-5: SPI Timing Diagram, CPOL = CPHA = 0 ................................................................ 25
Figure 4-6: SPI Timing Diagram, CPOL = CPHA = 1 ................................................................ 25
Figure 5-1: SPI Activity Sequence Diagram ............................................................................... 38
List of Tables
................................................................................................................
Table 3-1: Geomagnetic Sensor Performance1 5
Table 3-2: Sen-XY-f and Sen-Z-f Absolute Maximum Ratings .................................................... 6
Table 3-3: Sen-XY-f and Sen-Z-f Characteristics ......................................................................... 6
Table 3-4: MagI2C Absolute Maximum Ratings ........................................................................... 7
Table 3-5: MagI2C Recommended Operating Conditions ........................................................... 7
................................................................................
Table 3-6: Recommended Solder Processing Parameters1 14
Table 4-1: MagI2C Pin Assignments ........................................................................................... 21
Table 4-2: SPI Timing Specifications .......................................................................................... 26
Table 5-1: MagI2C Register Map ................................................................................................ 28
Table 5-2: Cycle Count Registers ............................................................................................... 29
Table 5-3: Continuous Mode DRDY Options .............................................................................. 30
Table 5-4: CMM Update Rates .................................................................................................... 32
Table 5-5: Measurement Results Registers ............................................................................... 34
Table 5-6: BIST Timeout Period .................................................................................................. 35
Table 5-7: BIST LR Periods ......................................................................................................... 35

1 Copyright & Warranty Information
© Copyright 2013 PNI Sensor
All Rights Reserved. Reproduction, adaptation, or translation without prior written permission is prohibited, except as allowed
under copyright laws.
Revised Dec 2022
PNI Sensor 2331 Circadian

Way
Santa Rosa, CA 95407, USA
Tel: (707) 566-2260
Fax: (707) 566-2261
Warranty and Limitation of Liability. PNI Sensor ("PNI") manufactures its Products from parts and components that are new
or equivalent to new in performance. PNI warrants that each Product to be delivered hereunder, if properly used, will, for ninety
(90) days following the date of shipment unless a different warranty time period for such Product is specified: (i) in PNI’s Price
List in effect at time of order acceptance; or (ii) on PNI’s web site (www.pnicorp.com) at time of order acceptance, be free
from defects in material and workmanship and will operate in accordance with PNI’s published specifications and documentation
for the Product in effect at time of order. PNI will make no changes to the specifications or manufacturing processes that af fect
form, fit, or function of the Product without written notice to the Customer, however, PNI may at any time, without such notice,
make minor changes to specifications or manufacturing processes that do not affect the form, fit, or function of the Product. This
warranty will be void if the Products’ serial number, or other identification marks have been defaced, damaged, or removed. This
warranty does not cover wear and tear due to normal use, or damage to the Product as the result of improper usage, neglect of
care, alteration, accident, or unauthorized repair.
THE ABOVE WARRANTY IS IN LIEU OF ANY OTHER WARRANTY, WHETHER EXPRESS, IMPLIED, OR
STATUTORY, INCLUDING, BUT NOT LIMITED TO, ANY WARRANTY OF MERCHANTABILITY, FITNESS FOR ANY
PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION,
OR SAMPLE. PNI NEITHER ASSUMES NOR AUTHORIZES ANY PERSON TO ASSUME FOR IT ANY OTHER
LIABILITY.
If any Product furnished hereunder fails to conform to the above warranty, Customer’s sole and exclusive remedy and PNI’s sol e
and exclusive liability will be, at PNI’s option, to repair, replace, or credit Customer’s account with an amount equal to the price
paid for any such Product which fails during the applicable warranty period provided that (i) Customer promptly notifies PNI in
writing that such Product is defective and furnishes an explanation of the deficiency; (ii) such Product is returned to PNI’s service
facility at Customer’s risk and expense; and (iii) PNI is satisfied that claimed deficiencies exist and were not caused by ac cident,
misuse, neglect, alteration, repair, improper installation, or improper testing. If a Product is defective, transportation cha rges for
the return of the Product to Customer within the United States and Canada will be paid by PNI. For all other locations, th e
warranty excludes all costs of shipping, customs clearance, and other related charges. PNI will have a reasonable time to mak e
repairs or to replace the Product or to credit Customer’s account. PNI warrants any such repaired or replacement Product to b e
free from defects in material and workmanship on the same terms as the Product originally purchased.
Except for the breach of warranty remedies set forth herein, or for personal injury, PNI shall have no liability for any indi rect or
speculative damages (including, but not limited to, consequential, incidental, punitive and special damages) relating to the use of
or inability to use this Product, whether arising out of contract, negligence, tort, or under any warranty theory, or for inf ringement
of any other party’s intellectual property rights, irrespective of whether PNI had advance notice of the possibility of any such
damages, including, but not limited to, loss of use, revenue or profit. In no event shall PNI’s total liability for all claim s regarding
a Product exceed the price paid for the Product. PNI neither assumes nor authorizes any person to assume for it any other
liabilities.
Some states and provinces do not allow limitations on how long an implied warranty lasts or the exclusion or limitation of
incidental or consequential damages, so the above limitations or exclusions may not apply to you. This warranty gives you
specific legal rights and you may have other rights that vary by state or province.

2 Introduction
Thank you for purchasing PNI Sensor’s RM2100 or RM3100 Geomagnetic Sensor, pn 90052 or
pn 90053, respectively. The RM2100 is comprised of two Sen-XY-f sensor coils, pn 13104, and
a MagI2C ASIC controller, pn 13156, which forms the basis for a 2-axis digital compass. The
RM3100 is the same as the RM2100 but adds a Sen-Z-f sensor coil, pn 13101, such that
compassing measurements are not constricted to the horizontal plane.
PNI’s geomagnetic sensor technology provides high resolution, low power consumption, large
signal noise immunity, a large dynamic range, and high sampling rates. Measurements are stable
over temperature and inherently free from offset drift. The RM3100’s MagI2C ASIC features
both continuous measurement mode and single measurement polling, software-configurable
resolution and sample rate, and the ability to operate one, two, or three PNI sensor coils. And it
incorporates both I2C and SPI interfaces for system design flexibility.
When implementing an RM3100 or RM2100 Geomagnetic Sensor, each sensor coil serves as the
inductive element in a simple LR relaxation oscillation circuit, where the coil’s effective
inductance is proportional to the magnetic field parallel to the sensor axis. The LR circuit is
driven by the MagI2C ASIC, and the MagI2C’s internal clock is used to measure the circuit’s
oscillation frequency, and hence the magnetic field. Since PNI’s Geomagnetic Sensor works in
the frequency domain, resolution and noise are established cleanly by the number of MagI2C
internal clock counts (cycle counts). In comparison, fluxgate and MR technologies require
expensive and complex signal processing to obtain similar resolution and noise, and in many
respects the geomagnetic sensor’s performance simply cannot be matched. Also, the output from
the MagI2C is inherently digital and can be fed directly into a microprocessor, eliminating the
need for signal conditioning or an analog/digital interface between the sensor and a
microprocessor. The simplicity of PNI’s geomagnetic sensor combined with the lack of signal
conditioning makes it easier and less expensive to implement than alternative fluxgate or
magneto-resistive (MR) technologies.
For more information on PNI’s magneto-inductive sensor technology, see PNI’s whitepaper
“Magneto-Inductive Technology Overview” at http://www.pnicorp.com/technology/papers.

3 Specifications
3.1 Geomagnetic Sensor Characteristics

Table 3-1: Geomagnetic Sensor Performance1
Cycle Counts2
Parameter Units
50 100 200
Field Measurement Range3 -800 to +800 μT
Gain 20 38 75 LSB/μT
Sensitivity 50 26 13 nT
Noise 30 20 15 nT
Noise Density @ Max. Single-Axis Sample Rate 1.2 nT/√Hz
Repeatability over ±200 μT 15 8 8 nT
Hysteresis over ±200 μT 15 nT
Linearity over ±200 μT 0.5 %

Maximum Single-Axis Sample Rate
1600 850 440 Hz
(divide by 3 for max. 3-axis sample rate)
Single-Axis Average Current @ 24 Hz Sample
70 135 260 µA
Rate (equivalent to 3-axis @ 8 Hz)
Bias Resistor, Rb 121 Ω
External Timing Resistor for Clock, REXT 33 kΩ
Circuit Oscillation Frequency 180 kHz
Operating Temperature -40 to +85 C
Footnotes:
1. Performance values are typical. Performance specifications established with a supply voltage of
3.0 V, a bias resistor of 121 Ω, an external timing resistor of 33 kΩ, and with measurements taken
at room temperature. Other bias resistors, external timing resistors and operating voltages may
be used, but performance will differ from the values listed. Contact PNI for additional information.
2. The cycle count setting (eg. 50 ,100, and 200) is user-configurable and set in the Cycle Count
Registers. See Section 4.1 for a discussion on how the RM3100 works, and Section 5.1 for how
to set the Cycle Count Registers.
3. Field measurement range is defined as the monotonic region of the output characteristic curve.
Field measurement range can be extended using different bias resistors.

3.2 Sen-XY-f and Sen-Z-f Characteristics
Table 3-2: Sen-XY-f and Sen-Z-f Absolute Maximum Ratings
Parameter Minimum Maximum Units

Input Pin Current @ 25 C 50 mA
Voltage Across Coil 2.0 VDC
Storage Temperature -40 +85 C
CAUTION:
Stresses beyond those listed above may cause permanent damage to the device. These
are stress ratings only. Assuming operation with the MagI2C per the guidelines in this
manual, these maximum ratings will not be violated.
Table 3-3: Sen-XY-f and Sen-Z-f Characteristics
Parameter Min Typical Max Units

Inductance1 500-600 μH
DC resistance @ 25C ±15C 30 45 Ω
Resistance versus
0.4 %/C
temperature
Sen-XY-f 0.06 [0.002] gm [oz]
Weight
Sen-Z-f 0.09 [0.003] gm [oz]
Operating Temperature -40 +85 C
Footnote:
1. 1 V peak-to-peak across the coil @ 100 kHz sinewave. No DC bias resistance.
Measured orthogonal to Earth’s magnetic field.

3.3 MagI2C Characteristics
Table 3-4: MagI2C Absolute Maximum Ratings
Parameter Minimum Maximum Units

Analog/Digital DC Supply Voltage, AVDD & DVDD -0.3 +3.7 VDC
Input Pin Voltage -0.3 AVDD or DVDD VDC
Input Pin Current @ 25C -10.0 +10.0 mA
Storage Temperature -40° +125° C
CAUTION:
Stresses beyond those listed above may cause permanent damage to the device. These
are stress ratings only. Operation of the device at these or other conditions beyond those
indicated in the operational sections of the specifications is not implied.
Table 3-5: MagI2C Recommended Operating Conditions
Parameter Symbol Min Typ Max Units

AVDD,
Analog/Digital DC Supply Voltage1 2.0 3.0 3.6 VDC
DVDD
Supply Voltage During Operation ∆VDD_OP -0.1 0 +0.1 VDC
Difference
(DVDD-AVDD) Analog Unpowered ∆VDD_OFF DVDD-0.1 DVDD DVDD+0.1 VDC
Voltage Ripple on AVDD or DVDD VDD_ripple 0.05 VPP

High level input voltage VIH 0.7*DVDD DVDD VDC
Low level input voltage VIL 0 0.3*DVDD VDC
High level output current IOH -1 mA
Low level output current IOL 1 mA
Idle Mode Current 1 µA
Leakage Current @ DVDD pin
100 nA
(AVDD=AVSS=DVSS=0V, DVDD=3.6V)
Operating Temperature TOP -40 +85 C
Footnote:
1. Please contact PNI if operation at <2.0 V is required.

3.4 Dimensions, Packaging, and Pad & Mask Layout
3.4.1 Sen-XY-f
Figure 3-1: Sen-XY-f Sensor Dimensions

Dimensions in mm
Full reel is 5000 pcs. Smaller quantities on cut tape.
Tape & reel meets ANSI/EIA standard EIA-418-B
Figure 3-2: Sen-XY-f Tape and Reel Dimensions
Note: PNI recommends a 5 mil stencil. The solder paste area is much smaller than the pad
to reduce sensor tilt and misalignment. The above layout allows for rework: for minimal
footprint, contact PNI.
Figure 3-3: Sen-XY-f Recommended Solder Pad, Paste, & Mask Layout

3.4.2 Sen-Z-f
Figure 3-4: Sen-Z-f Sensor Dimensions

Dimensions in mm
Full reel is 1200 pcs. Smaller quantities on cut tape.
Tape & reel meets ANSI/EIA standard EIA-418-B
Figure 3-5: Sen-Z-f Tape and Reel Dimensions
Note: PNI recommends a 5 mil stencil. The solder paste area is much smaller than the pad
to reduce sensor tilt and misalignment. The above layout allows for rework: for minimal
footprint, contact PNI.
Figure 3-6: Sen-Z-f Recommended Solder Pad, Paste, & Mask Layout

3.4.3 MagI2C
Figure 3-7: MagI2C MLF Mechanical Drawing
Note: PNI recommends not soldering to the exposed die pad in the center of the ASIC

Dimensions: mm
Full reel is 5000 pcs. Smaller quantities on cut-tape.
Tape & Reel meets ANSI/EIA standard EIA-418
Figure 3-8: MagI2C MLF Tape Dimensions
3.5 Soldering
Figure 3-9 and Table 3-6 provide the recommended solder reflow profile and processing
parameters for RM3100 components. After soldering PNI components to a board, it is
possible to wave solder the opposite side of the PCB.
IMPORTANT: PNI sensor coils require the use of halide-free solder pastes and processes for
reflow and cleaning. Contact PNI if you would like recommendations.

PB
Figure 3-9: Recommended Solder Reflow Profile
Table 3-6: Recommended Solder Processing Parameters1
Parameter Symbol Value

Preheat Temperature, Minimum TSmin 150°C
Preheat Temperature, Maximum TSmax 200°C
Preheat Time (TSmin to TSmax) 60 – 180 seconds
Solder Melt Temperature TL >218°C
Ramp-Up Rate (TSmax to TL) 3°C/second maximum
Peak Temperature TP <260°C
Time from 25°C to Peak (TP) 6 minutes maximum
Time above TL tL 60 – 120 seconds
Soak Time (within 5°C of TP) tP 10 – 20 seconds
Rampdown Rate 4°C/second maximum
Footnote:
1. Meets IPC/JEDEC J-STD-020 profile recommendations. Sen-XY-f and Sen-
Z-f classified as moisture sensitivity level 1. MagI2C MLF classified as
moisture sensitivity level 3.

4 Geomagnetic Sensor Overview & Set-Up
4.1 Overview
Figure 4-1 and Figure 4-2 provide basic schematics for implementing the RM3100 Sensor
Suite when using the SPI interface and I2C interface, respectively. The MagI2C is at the
center of the schematic, as it ties the user’s host controller, on the left, to the three sensor
coils, on the right. Unused sensor connections should remain floating.
Note: RM3100 and RM2100 Geomagnetic Sensors typically are used in compassing applications,
where each channel represents a Cartesian coordinate axis, X, Y, or Z. For this reason, the term
“axis” generally is used instead of “channel”.
Figure 4-1: RM3100 reference schematic – SPI Configuration

Note: The RM2100 Pins 6, 7, 8, and 9 are no-connect.

Figure 4-2: RM3100 reference schematic – I2C Configuration
Note: The RM2100 Pins 6, 7, 8, and 9 are no-connect.
A Sen-XY-f or Sen-Z-f sensor coil serves as the inductive element in a simple LR relaxation
oscillation circuit which is composed of an external bias resistor along with digital gates and
a comparator internal to the MagI2C. The coil’s inductance is a function of the magnetic
field strength. As such, the frequency of oscillation of the circuit varies with the strength of
the total magnetic field parallel to the sensor. To make a measurement, one side of the coil is
grounded while the other side is alternately driven with positive and negative current through
the oscillator. The circuit is driven for a set number of circuit oscillations, and the time to
complete the oscillations is measured using the MagI2C’s internal high-speed clock. The
MagI2C next switches the bias connection to the coil and makes another measurement. The
side that was previously grounded is now charged and discharged while the other is now
grounded.

Because:
• the total magnetic field represents the sum of the local field and the circuit-induced
field, and
• the circuit-induced magnetic field has the same magnitude but opposite direction for
the two bias polarities,
the local magnetic field is proportional to the difference in the time to complete the
measurement for each bias. The difference in the number of clock oscillations between the
forward and reverse bias directions is output from the MagI2C, and this number is directly
proportional to the strength of the local magnetic field in the direction of the sensor.
Figure 4-3 provides a detail of the biasing circuit. For more on PNI’s magneto-inductive
technology, refer to the “Magneto-Inductive Technology Overview” white paper found on
PNI’s website.
Figure 4-3: LR Oscillator Circuit Biasing Diagram
Since PNI’s Geomagnetic Sensor Suite works in the frequency domain, resolution is cleanly
established by the number of circuit oscillations. Also, the output from the MagI2C is
inherently digital and can be fed directly into a microprocessor, which eliminates the need for
signal conditioning or an analog/digital interface between the sensor and host processor.

4.2 Layout
4.2.1 Sensor Coil Orientation

Figure 4-4 indicates how the three sensor coils in a RM3100 Geomagnetic Sensor should
be oriented for a system referenced as north-east-down (NED). The arrow represents the
direction of travel or pointing. The Sen-XY-f is insensitive to the location of the polarity
indicator, while the location of the polarity indicator is critical for the Sen-Z-f.
Figure 4-4: RM3100 North-East-Down (NED) Sensor Layout
If the Sen-Z-f sensor coil is flipped to the bottom of the board such that the polarity
indicator still points back or the curved portion of the sensor still points forward, then to
retain NED the Sen-Z-f’s ZDRVN and ZDRVP pads should be as shown above, except
on the bottom of the board. As the pads on the Sen-Z-f have switched positions, the
connections to the Sen-Z-f sensor will be reversed.
4.2.2 Local Magnetic Field Considerations

Because the RM3100 sensor measure magnetic field, it is important to consider what
items in the vicinity of the sensors can affect the sensor readings. Note that magnetic
field drops off as (1/distance)3. Specific issues to consider include:
• The sensors have a specified linear regime of ±200 μT. (Earth’s field is ~50 μT.)
To ensure the sensors operate in their linear regime, do not place the sensors close
to large electric currents, large masses of ferrous material, or devices
incorporating permanent magnets, such as speakers and electric motors.

• Locate the sensor coils away from changing magnetic fields. If this is not
possible, but the local magnetic field is known to have multiple states, try to take
readings only when the field is in a known state. For instance, if a motor runs part
of the time, take readings only when the motor is in a known state.
• If you are uncertain about the effect a specific component may have on the
system, the RM3100 Evaluation Board can be used to help ascertain this. Place
the RM3100 Evaluation Board on a firm surface and gradually bring the
component in question close to the board, then note when the magnetic field starts
to change. If the component cannot be moved, then gradually move the RM3100
Evaluation Board towards the component, carefully ensuring the orientation of the
board remains constant while doing this.
• If an RM3100 Evaluation Board is not available, gradually bring the component

in question closer to one of the sensor coils and observe when the sensor reading
from the MagI2C starts to change.
4.2.3 Other Layout Considerations

Other design considerations include:
• To minimize the effect of gradients in the magnetic field, position the sensor coils
as close to each other as possible.
• To reduce coupling to and from other signals, keep the two traces from the
MagI2C to each sensor coil as close as possible to each other. PNI recommends
locating the MagI2C within 10 cm from the sensor coils.
• Keep capacitors, especially tantalum capacitors, far away from the sensor coils.

4.3 MagI2C Pin-Out
The MagI2C’s pin-out is summarized on the following page in Table 4-1. Pin numbers run
counterclockwise, when looking from the top, starting at the Pin 1 designator as shown in
Figure 3-7.
4.3.1 General Pins

AVDD and DVDD (pins 4, 14, & 26)
AVDD and DVDD should be tied to the analog and digital supply voltages,
respectively. The recommend voltages are defined in Table 3-5, and the maximum
voltages are given in Table 3-4. DVDD must be on whenever AVDD is on, so
DVDD should either be brought up first or at precisely the same time as AVDD.
AVDD can be turned off when not making a measurement to conserve power, since
all other operations are supported with DVDD. Under this condition, register values
will be retained as long as DVDD is powered. Also, AVDD must be within 0.1 V of
DVDD when AVDD is on.
AVSS and DVSS (pins 5 & 19)
AVSS and DVSS should be tied to the analog and digital ground, respectively.
Assuming the ground plane is clean, they may share a common ground.
Alternatively, they may have their own ground planes if this is more convenient.
DVSS and AVSS should be within 0.1 V of each other.

Table 4-1: MagI2C Pin Assignments
Pin# Pin Name Description

MOSI / SPI interface (MOSI) – Master Output, Slave Input Serial Data
1
SDA I2C interface (SDA) – Serial Data Line
2 RES Reserved – connect to ground
SSN / SPI interface – Active low to select port
3
SA0 I2C interface – Bit 0 of MagI2C’s slave address
4 AVDD Supply voltage for analog section of ASIC
5 AVSS Ground pin for analog section of ASIC
6 ZDRVP Z sensor drive output
7 ZINP Z sensor measurement input
8 ZINN Z sensor measurement input
9 ZDRVN Z sensor drive output
10 YDRVP Y sensor drive output
11 YINP Y sensor measurement input
12 YINN Y sensor measurement input
13 YDRVN Y sensor drive output
14 DVDD Supply voltage for digital section of ASIC.
15 XDRVP X sensor drive output
16 XINP X sensor measurement input
17 XINN X sensor measurement input
18 XDRVN X sensor drive output
19 DVSS Ground pin for digital section of ASIC
20 RES Reserved – connect to ground
21 NC Do not connect
22 I2CEN I2C enable pin (HIGH = I2C, LOW = SPI)
23 DRDY Status line
24 NC Do not connect
25 REXT External timing resistor for high speed clock.
26 DVDD Supply voltage for digital section of ASIC.
SCLK / SPI interface (SCLK) – Serial clock input
27
SCL I2C interface (SCL) – Serial clock line
MISO / SPI interface (MISO) – Master Input, Slave Output
28
SA1 I2C interface – Bit 1 of MagI2C’s slave address

Sensor Drive and Measurement Pins (pins 6 – 13 & 15 – 18)
The various sensor drive and measurement pins should be connected to the sensor
coils. For a north-east-down (NED) reference frame, the connections should be as
defined in Figure 4-4.
I2CEN (pin 22)
This pin should be pulled LOW when using the SPI interface or pulled HIGH when
using the I2C interface.
DRDY (pin 23)
DRDY is used to ensure data is read from the MagI2C only when it is available. The
DRDY pin will go HIGH when the measurement is complete. This signals the host
that data is ready to be read. The DRDY pin automatically is set LOW when the
Measurement Result registers are read or a write operation is performed.
It is not mandatory to use the DRDY pin, as alternative methods exist to determine if
data is available. Specifically, the STATUS register provides this information. And,
if using the SPI interface where CPHA=CPOL=1, the MISO line also indicates if data
is available when SSN is LOW.
REXT (pin 25)
REXT ties to the external timing resistor for the high-speed clock. The recommended
value for the resistor and associated clock speed are defined in Table 3-1.
4.3.2 SPI Pins

MOSI (pin 1)
MOSI is an SPI input that provides data from the master device to the MagI2C. Data
is transferred most significant bit first. Data must be presented at least 50 ns before
the rising edge of SCLK, and remain valid for 50 ns after the edge. New data
typically is presented to the MOSI pin on the falling edge of SCLK.
SSN (pin 3)
This signal sets the MagI2C as the operating slave device on the SPI bus. The SSN
pin must be LOW prior to data transfer in either direction, and must stay LOW during
the entire transfer.
The SSN pin must transition from HIGH to LOW prior to reading from or writing to
the registers. It must stay LOW for the remainder of the operation.

After communication between the MagI2C and master device is finished, the SPI bus
can be freed up (SSN pin set HIGH) to communicate with other slave devices while
the MagI2C takes a measurement or is idle.
SCLK (pin 27)
SCLK is a SPI input used to synchronize the data sent in and out through the MISO
and MOSI pins. SCLK is generated by the customer-supplied master device and
should be 1 MHz or less. One byte of data is exchanged over eight clock cycles.
Data is captured by the master device on the rising edge of SCLK. Data is shifted out
and presented to the MagI2C on the MOSI pin on the falling edge of SCLK, except
for the first bit (MSB) which must be present before the first rising edge of SCLK.
MISO (pin 28)
MISO is an SPI output that sends data from the MagI2C to the master device. Data is
transferred most significant bit first and is captured by the master device on the rising
edge of SCLK. The MISO pin is placed in a high impedance state if the MagI2C is
not selected (i.e. if SSN=1).
4.3.3 I2C Pins

SDA (pin 1)
The SDA line is a bi-directional line used to send commands to the MagI2C and used
to transmit data from the MagI2C. Data is transferred most significant bit first. All
communication between the host and the MagI2C occurs on this line when
implementing the I2C interface.
SA1 (pin 3)
SA1 represents the second-least significant bit in the MagI2C’s slave address.
Pulling this HIGH represents a ‘1’ and pulling it low represents a ‘0’. Along with pin
28 (bit 0) and the higher 5 bits (0b01000), which are pre-defined in hardware, SA1
establishes the 7-bit slave address of the MagI2C on the I2C bus.
SCL (pin 27)
SCL is used to synchronize the data sent in and out through the SDA pin. SCL is
generated by the customer-supplied master device and should be 1 MHz or less. Data
is captured by the master device on the rising edge of SCL. Data is shifted out and
presented to the MagI2C on the SDA pin on the falling edge of SCL, except for the
first bit which must be present before the first rising edge of SCL.

SA0 (pin 28)
SA0 represents the least significant bit in the MagI2C’s slave address. Pulling this
HIGH represents a ‘1’ and pulling it low represents a ‘0’. Along with pin 3 (bit 1)
and the higher 5 bits (0b01000), which are pre-defined in hardware, SA0 establishes
the 7-bit slave address of the MagI2C on the I2C bus.
4.4 SPI Timing Requirements

The MagI2C can act as a slave device on a SPI bus. The SPI interface consists of four
signals, as carried on SCLK, MOSI, MISO, and SSN. The SPI clock, SCLK, should run at
1 MHz or less. Data sent out on MOSI is considered valid while SCLK is HIGH, and data is
in transition when SCLK is LOW. The first byte sent to the MagI2C contains the
Read/Write bit (Write=0) followed by the 7-bit register address. When the register address
byte is received the MagI2C returns the STATUS register contents. Assuming SSN stays
low and SCLK continues, multiple registers can be written to or read from as the MagI2C
will automatically increment to the next register address. The clock polarity when the bus is
idle can either be LOW (CPOL=CPHA=0) or HIGH (CPOL=CPHA=1).
As long as SSN is LOW data can transfer to or from the MagI2C. Generally it is a good idea
to pull SSN to HIGH after a read or write operation has completed such that the SPI bus can
be freed up for other devices. The MagI2C can perform measurements while the SSN line is
HIGH, as this does not involve communication with the master. Pulling the SSN to HIGH
during a data read or write will terminate the transaction.
The timing parameters, defined in Figure 4-5 or Figure 4-6 and specified in Table 4-2, must
be met to ensure reliable communication.

Figure 4-5: SPI Timing Diagram, CPOL = CPHA = 0
Figure 4-6: SPI Timing Diagram, CPOL = CPHA = 1

Table 4-2: SPI Timing Specifications
Symbol Description Min Max Units

tSHZD SSN LOW to data output 100 ns
tSSDV SSN LOW to Command Byte 100 ns
tDBSH Setup data before active edge 50 ns
tDASH Hold data after active edge 50 ns
tDRDV Clock falling edge to valid data 20 ns
tSSH Final clock cycle falling edge to SSN HIGH 100 ns
tSHDZ SSN HIGH to output data tri-state 100 ns
tSSW SSN HIGH to LOW (time between transactions) 100
4.5 I2C Requirements

The MagI2C can operate as a slave device on an I2C bus. It is identified by a 7-bit slave
address. The higher 5 bits of the slave address are pre-defined in hardware and the same for
all MagI2C devices. PNI has registered these first 5 bits as 0b01000. The lower 2 bits of the
slave address are user-configurable, using pins 3 and 28. As such, 4 different slave addresses
are possible. For example, setting pin 3 HIGH and pin 28 LOW results in an address of
0b0100001.
The MagI2C’s I2C interface complies with NXP’s UM10204 specification and user manual,
revision 03. Standard, fast, fast plus, and high speed modes of the I2C protocol are
supported. Below is a link to this document.
http://www.nxp.com/documents/user_manual/UM10204.pdf
4.5.1 I2C Register Write

A generic Write transaction is given below.
START MagI2C ADDRESS RW ACK MagI2C REG. ADDRESS (N) ACK DATA TO REGISTER (N) ACK DATA TO REGISTER (N+1) ACK STOP
S A6 A5 A4 A3 A2 A1 A0 0 0 A7 A6 A5 A4 A3 A2 A1 A0 0 A7 A6 A5 A4 A3 A2 A1 A0 0 A7 A6 A5 A4 A3 A2 A1 A0 0 P
From Host to MagI2C

------------ Data Transferred (n bytes + acknowledge) ------------
From MagI2C to Host

All communication is on the SDA line. The transaction is initiated by the host, or master,
sending the Start condition followed by the MagI2C’s slave address, and then the RW bit
is set to ‘0’, indicating a Write operation. The slave address is acknowledged by the
MagI2C by setting SDA to LOW. This is followed by the desired 7-bit register address
and then the register data. The register value automatically increments after every
received data byte. The transaction is terminated by the host sending the Stop condition.
The MagI2C will always acknowledge the start of an I2C Write transaction by sending a
‘0’ (i.e. the ACK signal). But if the Write command cannot be executed for some reason
the MagI2C will send a ‘1’ instead (i.e. the NACK signal). The reasons a NACK signal
might be sent are established by the HSHAKE register, and include writing to an
undefined register or writing to the POLL register while CMM is in progress, or vice
versa. See Section 0 for more information.
4.5.2 I2C Register Read

To perform a Read transaction, it is first necessary for the master to Write the desired
register address, and then to Read the register data. A generic transaction is given below.
START SLAVE ADDRESS RW ACK REGISTER ADDRESS (N) ACK STOP
S A6 A5 A4 A3 A2 A1 A0 0 0 A7 A6 A5 A4 A3 A2 A1 A0 0 P
From Host to MagI2C
From MagI2C to Host
START SLAVE ADDRESS RW ACK DATA FROM REG. (N) ACK DATA FROM REG. (N+1) NACK STOP
S A6 A5 A4 A3 A2 A1 A0 1 0 A7 A6 A5 A4 A3 A2 A1 A0 0 A7 A6 A5 A4 A3 A2 A1 A0 1 P
-------------- Data Transferred (n bytes + acknowledge) --------------
The Write sequence is described in the prior section, except for this case there is no data
to send. For the Read sequence the host again sends the MagI2C’s slave address, but this
time sets the RW bit is set to ‘1’. The MagI2C acknowledges that it is has been
addressed and then sends data from the register address that was previously sent. The
host acknowledges receipt of the data, and then the MagI2C increments the register
address and sends data from this register. This continues until the host sends the NACK
command followed by the Stop command, which terminates the transaction.

5 MagI2C Operation
The primary functions of the MagI2C are:
• Set the Cycle Count Registers if the default is not desired.
• Initiate either a Single Measurement or Continuous Measurement.
• Confirm New Data Ready.
• Read the Measurement Results Registers.
Each of these steps is discussed in detail in the following sections.
Note: The MagI2C incorporates an Idle Mode to reduce power consumption. The device automatically
idles when not exchanging data or taking a measurement. The MagI2C starts in Idle Mode at power-up.
The MagI2C’s register map is given in Table 5-1. Register addresses are 7 bits. To Write to a
register, a ‘0’ followed by the 7-bit register number should be sent, followed by the register
value. To Read from a register, a ‘1’ followed by the 7-bit register number should be sent,
effectively adding 0x80 to the register number.
Table 5-1: MagI2C Register Map
Register # Default Payload

Name R/W Description
(Hex) (Hex) Format
POLL 00 RW 00 [7:0] Polls for a Single Measurement
CMM 01 RW 00 [7:0] Initiates Continuous Measurement Mode
CCX 04 – 05 RW 00C8 UInt16 Cycle Count Register – X Axis
CCY 06 – 07 RW 00C8 UInt16 Cycle Count Register – Y Axis
CCZ 08 – 09 RW 00C8 Uint16 Cycle Count Register – Z Axis
TMRC 0B RW 96 [7:0] Sets Continuous Measurement Mode Data Rate
MX 24 – 26 R 000000 Uint24 Measurement Results – X Axis
MY 27 – 29 R 000000 Uint24 Measurement Results – Y Axis
MZ 2A – 2C R 000000 Uint24 Measurement Results – Z Axis
BIST 33 RW 00 [7:0] Built-In Self Test
STATUS 34 R 00 [7:0] Status of DRDY
HSHAKE 35 RW 1B [7:0] Handshake Register
REVID 36 R -- Unit8 MagI2C Revision Identification
5.1 Set the Cycle Count Registers (0x04 – 0x09)

The Cycle Count Registers establish the number of sensor oscillation cycles (cycle counts)
that will be counted for each sensor in both the forward and reverse bias directions during a
measurement sequence. Each sensor has its own cycle count value, and each can be
different. Increasing the cycle count value increases measurement gain and resolution.
Lowering the cycle count value reduces acquisition time, which increases maximum

achievable sample rate or, with a fixed sample rate, decreases power consumption. The
Cycle Count read and write addresses, plus their default values, are given in Table 5-2
Table 5-2: Cycle Count Registers
Default Write Address Read Address

Register Description
Value (Hex) (Hex) (Hex)
X Axis Cycle Count Value - MSB 0x00 04 84
X Axis Cycle Count Value - LSB 0xC8 05 85
Y Axis Cycle Count Value - MSB 0x00 06 86
Y Axis Cycle Count Value - LSB 0xC8 07 87
Z Axis Cycle Count Value - MSB 0x00 08 88
Z Axis Cycle Count Value - LSB 0xC8 09 89
Since the registers are adjacent, it is not necessary to send multiple register addresses, as the
MagI2C automatically will read/write to the next adjacent register.
The default values for the Cycle Count Registers are 0xC8 in the LSB and 0x0 in the MSB,
or 200D. This default value provides a good trade-off between acquisition time and
resolution, but favors resolution. If the user is more interested in low power consumption or
running at high data rates, a lower cycle count value of (ex. 50D or 100D) would be more
appropriate. To estimate the appropriate cycle count value for your application review the
specifications given at 50, 100, and 200 cycle counts in Table 3-1. Note that these 3 cycle
counts by no means represent all the cycle count options, as the minimum value is ‘0’ and the
maximum is 65,536. Having said this, quantization issues generally dictate working above a
cycle count value of ~30, while noise limits the useful upper range to ~400 cycle counts.
Assuming a non-default cycle count value is desired, then prior to sending a command to
take a sensor measurement it is necessary to Write values to the Cycle Count Registers.
Once the Cycle Count Registers are set, they do not need to be repopulated unless the user
wants to change the values or the system is powered down, in which case the default value
repopulates the register fields when powered up again.
5.2 Initiate Continuous Measurement Mode (0x01)

The MagI2C can either take measurements automatically on a regular frequency (Continuous
Measurement Mode) or by polling for single measurement. This section discusses
Continuous Measurement Mode. See Section 5.3 for polling a single measurement.

To initiate Continuous Measurement Mode, write to the CMM register address, 0x01,
followed by the CMM register contents. To set the rate of data acquisition in Continuous
Measurement Mode, see Section 5.2.1. Below are the contents of the CMM register.
Bit # 7 6 5 4 3 2 1 0
Value Reserved CMZ CMY CMX 0 DRDM Reserved START
Set to 0 Set to 0
Where:
• START – A “1” in this bit position initiates Continuous Measurement Mode. To turn
off Continuous Measurement Mode it is necessary to write a “0” to this bit position.
Note that writing to POLL (i.e. initiating a single measurement command) while
operating in Continuous Measurement Mode results in the single measurement
command being ignored.
• DRDM – These two bits establish the required condition to trigger the DRDY pin to
HIGH. There are 4 possible conditions, as set out in Table 5-3.
Table 5-3: Continuous Mode DRDY Options
DRDY Requirements DRDM

DRDY to HIGH after a full measurement 0
sequence is completed, as established by
CMX, CMY, and CMZ.
DRDY to HIGH after the completion of a 1
measurement on any axis.
• CMX, CMY, CMZ – A “1” in either of these three bit positions indicates a
measurement will be taken on that sensor axis when operating in Continuous
Measurement Mode. For instance, to take measurements on all three axis, CMX =
CMY = CMZ = 1.
To read from the CMM register, send 0x81. The return byte will provide the same
information as above.
Note: Certain commands, such as reading from the CMM register or writing to the TMRC register,
will terminate Continuous Measurement Mode.

5.2.1 Setting the CMM Update Rate with TMRC (0x0B)
The time between measurements in Continuous Measurement Mode is established with
the TMRC register. The TMRC register is defined below.
Bit # 7 6 5 4 3 2 1 0
Value 1 0 0 1 TMRC3 TMRC2 TMRC1 TMRC0
The LSB is used set the CMM updatee rate. The MSB should be 0x9, as indicated above.
The larger the TMRC value, the longer the interval between measurements. Available
data rates are given in Table 5-4. Note that the update rates are approximate, and have a
one standard deviation tolerance of about ~7%. The default value for TMRC is 0x96,
establishing a data update rate of ~37 Hz.
To set the TMRC register, send the register address, 0x0B, followed by the desired
TMRC register value. To read the TMRC register, send 0x8B.
Note: The Cycle Count Registers establish the maximum data rate of the sensors. For instance,
if the cycle count is set to 200D, then the maximum 3-axis update rate is ~430 Hz. If TMRC is set
to 0x92, indicating an update rate of ~600 Hz, the rate established by the cycle count will override
the TMRC request, and the actual update rate will be ~430 Hz.

Table 5-4: CMM Update Rates
TMRC Value Time Between Update

(Hex) Readings Rate
92 ~1.7 ms ~600 Hz
93 ~3 ms ~300 Hz
94 ~7 ms ~150 Hz
95 ~13 ms ~75 Hz
96 ~27 ms ~37 Hz
97 ~55 ms ~18 Hz
98 ~110 ms ~9 Hz
99 ~220 ms ~4.5 Hz
9A ~440 ms ~2.3 Hz
9B ~0.8 s ~1.2 Hz
9C ~1.6 s ~0.6 Hz
9D ~3.3 s ~0.3 Hz
9E ~6.7 s ~0.015 Hz
9F ~13 s ~0.075 Hz
5.3 Initiate a Single Measurement (0x00)

The MagI2C can operate in either a continuous measurement mode or a polling mode. This
section discusses the Single Measurement Command used in a polling mode. See Section 5.2
for operation in continuous measurement mode.
To make a single measurement it is necessary to write the POLL address register, 0x00, and
follow this by the POLL register byte which establishes which axes are to be measured. It is
defined as shown below, where a “1” for PMX, PMY, and/or PMZ indicates the X, Y, and/or
Z axis, respectively, is to be measured. Note that the DRDY line will go HIGH after all
measurements requested in the Single Measurement Command byte have been completed.
Bit # 7 6 5 4 3 2 1 0
Value 0 PMZ PMY PMX 0 0 0 0

5.4 Confirm New Data Ready
There are several ways to determine if a measurement has been completed and data is
available in the Measurement Results Registers. One method is monitoring the DRDY line
for it to go HIGH. Recall that for continuous measurement mode, the DRDM bits of the
Continuous Measurement Command byte establish the conditions for DRDY to go HIGH.
Another option when using the SPI interface is monitoring the MISO pin for it to go HIGH.
(The MISO pin is unavailable when using the I2C interface, as it is used to set the slave
address of the device.) Another option is to read from the STATUS register, as discussed
below. Only one method need be used.
5.4.1 STATUS Register (0x34)

To read the Status Register, first send a read command to the STATUS register, 0xB4.
The return byte provides the contents of the Status Register:
Bit # 7 6 5 4 3 2 1 0
Value DRDY - - - - - - -
Bit 7 will be HIGH if data is available and LOW if it is unavailable. Bits 0 – 6 are
indeterminate and should be ignored.
5.5 Read the Measurement Results

Each sensor reading consists of 3 bytes of data which are stored in 2’s complement format
(range: -8388608 to 8388607) in the Results Registers within the MagI2C and this number is
directly proportional to the strength of the local magnetic field in the direction of the
specified axis. Note that the greater the Period Select value, the higher the resolution of the
measurement and the longer the sample time. These registers are read by sending the Read
Results byte, as defined below, where the values of A, B, C, and D establish the register to be
addressed, as given in Table 5-5.
Bit # 7 6 5 4 3 2 1 0
Value 1 0 1 0 A B C D

Table 5-5: Measurement Results Registers
Write Address Read Address

Register Description
(Hex) (Hex)
X Axis Measurement (2) 24 A4
Y Axis Measurement (2) 27 A7
Z Axis Measurement (2) 2A AA
Z Axis Measurement (1) 2B AB
Z Axis Measurement (0) 2C AC
Normally it is only necessary to send “A4H”, since the register value automatically
increments on the clock cycles such that after sending “A4H” all 3 bytes for the X axis
measurement would be clocked out, then the 3 bytes for the Y axis measurement, then the 3
bytes for the Z axis measurement. After these 9 bytes have been clocked out, the subsequent
output data has no relevance.
5.6 Troubleshooting and General Information

The MagI2C incorporates several registers that can be used to help troubleshoot the system
or device. These include the Built-In Self Test (BIST) register, the Handshake register, and
the RevID register.
5.6.1 Built-In Self Test Register (0x33)

The Built-In Self Test (BIST) register checks the status of the internal LR circuit
oscillator. Write to the BIST register by sending 0x33 followed by the BIST register
values, and request a read from the BIST register by sending 0xB3. The register contents
are defined below.
Bit # 7 6 5 4 3 2 1 0
Value STE ZOK YOK XOK BW1 BW0 BP1 BP0

Where:
• STE – Setting this to ‘1’ commands the MagI2C to run the built-in self test when
the POLL register is written to. The end of the built-in self test sequence will be
indicated by DRDY going HIGH.
• ZOK, YOK, and XOK – These read-only bits indicate whether or not the X, Y,
and Z LR oscillators functioned correctly during the built-in self test. A ‘1’
indicates a properly function oscillator. Note that STE also should be HIGH
when this is read, or the reading is invalid.
• BW – These two bits define the timeout period for the LR oscillator periods, as
given in Table 5-6.
Table 5-6: BIST Timeout Period
BIST Wait Time BW1 BW0

Unused 0 0
1 Sleep Oscillation Cycle (30 µs) 0 1
2 Sleep Oscillation Cycles (60 µs) 1 0
4 Sleep Oscillation Cycles (120 µs) 1 1
• BP – These two bits define the number of LR periods for measurement during the
built-in self test, as given in Table 5-7.
Table 5-7: BIST LR Periods
BIST LR Periods BW1 BW0

Unused 0 0
1 LR Period 0 1
2 LR Periods 1 0
4 LR Periods 1 1

5.6.2 HSHAKE Register (0x35)
The HSHAKE register is used to set conditions for clearing the DRDY pin and for
determining why a register command was not fulfilled. Write to the HSHAKE register
by sending 0x35 followed by the BIST register values, and request a read from the
HSHAKE register by sending 0xB5. The register contents are defined below.
Bit # 7 6 5 4 3 2 1 0
Value 0 NACK2 NACK1 NACK0 1 0 DRC1 DRC0
Where:
• DRC0 – Setting this to ‘1’ means DRDY is cleared by any device register write.
Clearing occurs during reception of the register address byte for the write
transaction on either the SPI or I2C interface. This is the default setting.
• DRC1 – Setting this to ‘1’ means DRDY is cleared by reading the Measurement
Results registers. Clearing occurs when the MagI2C sends back the first byte of
data. This is the default setting.
• NACK0 – This read-only bit is set to ‘1’ when writing to an undefined register.
• NACK1 – This read-only bit is set to ‘1’ when writing into POLL when CMM is
in progress or when writing to CMM when POLL is in progress.
• NACK2 – This read-only bit is set to ‘1’ when a read for the Measurement
Results registers is requested but data is not ready (DRDY = 0).
5.6.3 REVID Register (0x36)

The REVID register provides revision identification of the MagI2C. This is a single byte,
read-only register. To read the REVID register, send 0xB6.

5.7 Examples using the SPI Interface
5.7.1 Set the Cycle Count Registers

A sample command sequence is provided below which sets the cycle count value to 100D
(64H) for all 3 axes. This is purely for illustrative purposes and the value could be
different and/or the number of axes to be addressed could be different.
• Start with SSN set HIGH, then set SSN to LOW.

• Send 04H (this is the Write Command Byte to address the MSB for the X axis)
• Send 0 (value for the MSB for the X axis)
• Send 64H (value for the LSB for the X axis - pointer automatically increments)
• Send 0 (value for the MSB for the Y axis - pointer automatically increments)
• Send 64H (value for the LSB for the Y axis - pointer automatically increments)
• Send 0 (value for the MSB for the Z axis - pointer automatically increments)
• Send 64H (value for the LSB for the Z axis - pointer automatically increments)
• Set SSN to HIGH
5.7.2 Making and Reading Measurements

Figure 5-1 gives the SPI activity sequence for initiating a single measurement and
reading the results. The MagI2C works for either CPOL=CPHA=0 or CPOL=CPHA=1,
so both cases are given. The assumption in the diagram is that the DRDY pin or the
MISO line is used to establish when data is ready, but a query of the Status Register
could be used instead. SPI timing requirements are discussed in Section 4.4.

Figure 5-1: SPI Activity Sequence Diagram
The steps to make measurements in Continuous Measurement Mode are given below.

• Initiate Continuous Measurement Mode by writing to the CMM register address,
0x01, followed by the CMM register value. This value defines which axes are to
be measured, how the DRDY line will be set HIGH. Assuming all 3 axes are to
be measured, DRDY goes HIGH after completing measurements on all axes, the
CMM value would be 0x79.
• The RM3100 Evaluation Board will now initiate Continuous Measurement Mode.

• Return SSN to HIGH. This will not affect the measurement process, but will free
up the host to communicate with other devices and ensure the next write
command sent to the module is interpreted properly.
• Once the measurement sequence is completed on all axes the MISO pin goes low
and the DRDY pin is set HIGH, assuming 0x79 is the CMM register value. The
module will be placed in Idle Mode until it is time to take another measurement,
as defined by the TMRC register.
• When the host is ready to read the measured values, set SSN to LOW. If SSN
already is LOW, then toggle SSN from LOW to HIGH to LOW.
• Assuming the X axis was one of the axes to be measured, send the MX2 Read
address, 0xA4, to begin reading the Measurement Results registers. The
measurement readings will now clock out, with the 3 bytes of X-axis data
presented first, then Y-axis data, then Z-axis data. The first nine (9) bytes
represent a complete 3-axis measurement. This will clear the DRDY line.
• Return SSN to HIGH to free up the host to communicate with other devices and
to ensure the next Command Byte sent to the module is interpreted properly.
The steps to make a single measurement are given as follows.

• Initiate a single measurement by writing to the POLL register address, 0x00,
followed the register address with either the POLL register value. This defines
which axes are to be measured, and should be 0x70 if measurements on all three
axes are desired.
• The MagI2C will now take the prescribed measurements.
• Return SSN to HIGH. This will not affect the measurement process, but will free
up the host to communicate with other devices and ensure the next write
command sent to the MagI2C is interpreted properly.
• Once the measurement sequence is completed on all desired axes, the DRDY pin
is set HIGH and the MISO pin goes low, indicating data is read. The MagI2C is
placed in Idle Mode.
• When the host is ready to read the measured values, set SSN to LOW. If SSN
already is LOW, then toggle SSN from LOW to HIGH to LOW.
• Assuming the X axis was one of the axes to be measured, send the MX2 Read
address, 0xA4, to begin reading the Measurement Results registers. The
measurement readings will now clock out, with the 3 bytes of X-axis data
presented first, then Y-axis data, then Z-axis data. The first nine (9) bytes
represent a complete 3-axis measurement.

• Return SSN to HIGH to free up the host to communicate with other devices and
to ensure the next Command Byte sent to the MagI2C is interpreted properly.
5.8 Examples using the I2C Interface
5.8.1 Set the Cycle Count Registers

A sample command sequence is provided below which sets the cycle count value to 100D
(64H) for all 3 axes. This is for illustrative purposes and the value could be different
and/or the number of axes to be addressed could be different. Note only the initial Cycle
Count register address needs to be sent, as the MagI2C automatically increments to the
next register.
START MagI2C ADDRESS RW ACK CCX1 REG. ADDRESS (N) ACK DATA TO CCX1 REG (N) ACK DATA TO CCX0 REG (N+1) ACK
S 0 1 0 0 0 X X 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 0 0 1 0 0 0
From Host to MagI2C
From MagI2C to Host
DATA TO CCY1 REG (N+2) ACK DATA TO CCY0 REG (N+3) ACK DATA TO CCZ1 REG (N+4) ACK DATA TO CCZ0 REG (N+5) ACK STOP
0 0 0 0 0 0 0 0 0 0 1 1 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 0 0 1 0 0 0 P
5.8.2 Initiate a Single Measurement

The I2C transactions to initiate a single measurement on all 3 axes are given below.
START MagI2C ADDRESS RW ACK POLL REG. ADDRESS (N) ACK DATA TO POLL REG (N) ACK STOP
S 0 1 0 0 0 X X 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 0 0 0 0 0 P
From Host to MagI2C
From MagI2C to Host
After this transaction sequence the MagI2C will initiate a measurement sequence, and
this can run in the background. At the end of the measurement sequence the DRDY pin
is set HIGH and the Status Register will have a “1” in bit 7, indicating data is ready. The
MagI2C will be placed in Idle Mode.

5.8.3 Initiate Continuous Measurement Mode
A sample I2C transaction to initiate continuous measurement mode is given below.
START MagI2C ADDRESS RW ACK CMM REG. ADDRESS (N) ACK DATA TO CMM REG (N) ACK STOP
S 0 1 0 0 0 X X 0 0 0 0 0 0 0 0 0 1 0 0 1 1 1 1 0 0 1 0 P
From Host to MagI2C
From MagI2C to Host
In this example, the CMM register is set to initiate measurements on all 3 axes, and to set
DRDY to HIGH after all three measurements are made.
5.8.4 Read the Measurement Results

When the host is ready to read the Measurement Results registers, the following
transactions should occur. Note only the initial Measurement Results register address
needs to be sent, as the MagI2C automatically increments to the subsequent registers.
START MagI2C ADDRESS RW ACK MX2 ADDRESS (N) ACK STOP
S 0 1 0 0 0 X X 0 0 0 0 1 0 0 1 0 0 0 P
From Host to MagI2C
From MagI2C to Host
START MagI2C ADDRESS RW ACK DATA FROM MX2 (N) ACK DATA FROM MX1 (N+1) ACK
S 0 1 0 0 0 X X 1 0 X X X X X X X X 0 X X X X X X X X 0
DATA FROM MX0 REG (N+2) ACK DATA FROM MY2 REG (N+3) ACK DATA FROM MY1 REG (N+4) ACK DATA FROM MY0 REG (N+5) ACK
X X X X X X X X 0 X X X X X X X X 0 X X X X X X X X 0 X X X X X X X X 0
DATA FROM MZ2 REG (N+6) ACK DATA FROM MZ1 REG (N+7) ACK DATA FROM MZ0 REG (N+8) NACK STOP
X X X X X X X X 0 X X X X X X X X 0 X X X X X X X X 0 P
The final NACK is optional, as communication will stop by simply implementing the
Stop condition.

Revision Control Block
Revision Description of Change Effective Date Approval

R03 Added Revision Control Block. On Figures 4-1 and 4-2, A. Leuzinger
changed pins 2 and 20 to “RES” from “GND”, and changed
Table 4-1 appropriately. In Section 4.2.3, indicated the
MagI2C should be within 10 cm of the sensor coils, not 0.5 m
R04 Correction to cycle count command example 06/05/15 D. McKenzie
R05 Removal of “Alarm” feature described in section 5.2.2 of 02/01/16 D. McKenzie
previous revision
R06 Updated Figure 3-7 to indicate that the exposed die pad in the 02/24/16 D. McKenzie
center of the ASIC should not be soldered and should remain
unconnected
R07 Correction to Figure 4-4: RM3100 North-East-Down (NED) 06/24/16 J. Back
Sensor Layout
R08 Added information about RM2100 09/14/22 H. Nguyen
R09 Revised tDRDV 12/14/22 J. Miller


RM3100 RM2100 Sensor Suite User Manual R09 1

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User Manual

RM3100 & RM2100

PNI Sensor Doc 1017252 R09

PNI Sensor Doc 1017252 R09

Revised Dec 2022

PNI Sensor 2331 Circadian

PNI Sensor Doc 1017252 R09

PNI Sensor Doc 1017252 R09

3.1 Geomagnetic Sensor Characteristics

Hysteresis over ±200 μT 15 nT

Linearity over ±200 μT 0.5 %

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Parameter Minimum Maximum Units

Table 3-3: Sen-XY-f and Sen-Z-f Characteristics

Parameter Min Typical Max Units

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Parameter Minimum Maximum Units

Table 3-5: MagI2C Recommended Operating Conditions

Parameter Symbol Min Typ Max Units

Voltage Ripple on AVDD or DVDD VDD_ripple 0.05 VPP

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Figure 3-1: Sen-XY-f Sensor Dimensions

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Figure 3-2: Sen-XY-f Tape and Reel Dimensions

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Figure 3-4: Sen-Z-f Sensor Dimensions

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Figure 3-5: Sen-Z-f Tape and Reel Dimensions

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Figure 3-7: MagI2C MLF Mechanical Drawing

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Figure 3-9: Recommended Solder Reflow Profile

Table 3-6: Recommended Solder Processing Parameters1

Parameter Symbol Value

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Figure 4-1: RM3100 reference schematic – SPI Configuration

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Figure 4-3: LR Oscillator Circuit Biasing Diagram

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4.2.1 Sensor Coil Orientation

Figure 4-4: RM3100 North-East-Down (NED) Sensor Layout

4.2.2 Local Magnetic Field Considerations

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• If an RM3100 Evaluation Board is not available, gradually bring the component

4.2.3 Other Layout Considerations

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4.3.1 General Pins

AVSS and DVSS (pins 5 & 19)

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Pin# Pin Name Description

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I2CEN (pin 22)

DRDY (pin 23)

REXT (pin 25)

4.3.2 SPI Pins

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SCLK (pin 27)