IC-SP-13030 R2

3-Phase BLDC Motor Driver IC

ECN30210 Product Specification Rev. 2
1. Product Description
1.1 Features
(1) Maximum Ratings: 600VDC/1.5A (condition: Tj=25℃), suitable for the system from 200VAC to
240VAC
(2) Drives a motor using high voltage PWM (Pulse Width Modulation) control and increases efficiency
(3) Variable speed control by an analog speed command signal (VSP signal)
(4) Six IGBTs, six FWDs (Free-Wheeling Diodes), drivers for IGBTs, protection circuits, etc. integrated
into a single chip, resulting in space reduction
(5) Drives a motor using a high voltage DC power supply and a low voltage DC power supply (15V)
(6) Lineup of two packages, DIP26 and SOP26 ensuring insulation distance for high voltage pins

1.2 Functions
(1) Hall elements applicable (Hall amplifiers are embedded)
(2) Power on/off sequence-free (condition: output pin current is less than 1A)
(3) Charge pump circuit (built-in high voltage diodes for charge pump)
(4) FG (Frequency Generator) signal outputs for motor rotational speed monitor (three pulses and one
pulse)
(5) All IGBT shutoff function
(6) Current limit function (detects at 0.5V)
(7) Over-current protection function (detects at 1.0V)
(8) VCC low-voltage detection function
(9) Over temperature protection function
(10) Motor lock protection function
(11) PWM circuit (enable 20kHz PWM operation)
(12) Three-phase distributor circuit
(13) VCC standby function

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1.3 Block Diagram
The ECN30210 is shown inside the bold line.

Hall elements

C3 C4 C5 C1 CV2 DZ VS
V CC(15V) C0 C2
CB HA HUP HVP HWP CD C+ CL VS
VB HUN HVN HWN D1
power + - + - + - Vcc Charge
VCC Vcc standby pump
supply
CV1
VB
D2 Clock

Hall
FG1 Top arm elements
FG
driver

Filter circuit
FG2 MU
Microcontroller
3-phase
VSP distributor MV
+ PWM
CMP circuit MW
- ALL OFF Bottom
arm OFF
+ Bottom
CMP Motor
- arm driver
Over-temperature Vcc low-voltage
protection detection
SAW wave Current limit
generator Over-current
Clock Motor lock
protection protection

FG1

GL CR VTR CML RF CS RS GH
RTR CB
RS
CTR CM CF

FIGURE 1.3.1 Block Diagram

1.4 Packages

ECN30210F ECN30210P
(Package: SOP26) (Package: DIP26)

FIGURE 1.4.1 Packages of ECN30210

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2. Specification
2.1 Maximum ratings
TABLE 2.1.1 Maximum ratings Condition: Ta=25℃
No. Item Symbol Pin Rating Unit Condition
1 Output device VSM VS, CL, CD, 600 V
breakdown voltage MU, MV, MW
2 VCC power supply VCC VCC 18 V
voltage
3 Voltage between C+ VCPM C+, VS 18 V
and VS
4 Input voltage VIN VSP, RS, -0.5 to VB+0.5 V
HUP, HUN, HVP,
HVN, HWP, HWN
5 Output current Pulse IP MU, MV, MW 1.5 A Note 1
6 DC IDC 0.7
7 VB supply output IBMAX CB, HA 50 mA Note 3
current
8 Junction operating Tjop － -40 to +135 ℃ Note 2
temperature
9 Storage temperature Tstg － -40 to +150 ℃

Note 1: Output IGBTs can handle this peak current.

Note 2: Thermal resistance
Between junction and case (tab): Rjc = 3℃/W (Reference value)
Note 3: “IBMAX” represents the sum of output currents at the CB pin and the HA pin.

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2.2 Electrical Characteristics
TABLE 2.2.1 Electrical Characteristics (1/2) Suffix (T: Top arm, B: Bottom arm) Condition: Ta=25℃
No. Item Symbol Pin Min. Typ. Max. Unit Condition
1 Standby current ISH VS － 0.1 0.4 mA VSP=0V, VS=325V,
VCC=15V
2 ICC VCC － 4 10 mA VSP=0V, VCC=15V,
IB=0A
Note 7
3 IGBT collector-emitter VONT MU, MV, － 2.0 3.0 V I=0.35A, VCC=15V
4 saturation voltage VONB MW － 2.0 3.0 V
5 Free-wheeling diode VFDT － 1.6 2.8 V I=0.35A
6 forward voltage VFDB － 1.6 2.8 V
7 VTR output resistance RVTR VTR － 200 400 Ω IVTR=±1mA, VCC=15V
8 SAW wave High/Low level VSAWH CR 4.9 5.4 5.9 V VCC=15V
9 VSAWL 1.7 2.1 2.4 V
10 Amplitude VSAWW 2.8 3.3 3.8 V VCC=15V Note 1
11 Current limit Reference voltage Vref1 RS 0.45 0.50 0.55 V VCC=15V
12 Delay time Tref1 1.2 2.0 4.5 μs
13 Over-current Reference voltage Vref2 RS,CS 0.8 1.0 1.2 V VCC=15V
14 protection Delay time Tref2 － 1.7 2.7 μs VCC=15V, CF=470pF
15 Recovery time Trs － 1.0 2.0 ms RF=2MΩ
16 RS input current IILRS RS -100 － － μA VCC=15V, RS=0V
Note 5
17 Hall signal Minimum differential VHOS HUP, 60 － － mVp-p VCC=15V
input voltage HUN, Note 2
18 Current IH HVP, － － 2 μA
19 Common mode VHCM HVN, 3 － 6 V
voltage range HWP,
20 Hysteresis VHHYS HWN 20 40 60 mV
21 Voltage L→H VHLH -5 20 45 mV
22 Voltage H→L VHHL -45 -20 5 mV
23 VSP input Current IVSPH VSP 5 － 100 μA VSP=5.0V, VCC=15V
Pull-down resistor
Note 3
24 Offset voltage SPCOMOF -40 60 160 mV VCC=15V
Voltage from CR pin
25 All off operating Voff 0.85 1.23 1.60 V VCC=15V
voltage
26 VB supply Voltage VB CB 6.8 7.5 8.2 V VCC=15V, IB=0A
output Note 7
27 Current IB － － 45 mA VCC=15V Note 7
28 HA output resistance RHA HA － 20 40 Ω VCC=15V, IHA=10mA
29 FG1, FG2 output resistance RFGP FG1, － 0.9 3.0 kΩ IFG=1mA, VCC=15V
FG2 Note 4
30 RFGN － 0.4 1.5 kΩ IFG=-1mA, VCC=15V
Note 4
31 VCC Operating voltage LVSDON VCC, 11.0 12.0 12.9 V
32 low-voltage Recovery voltage LVSDOFF MU, MV, 11.1 12.5 13.0 V
detection MW
33 Minimum pulse width (bottom arms) TMINB MU, MV, 0.8 － － μs VCC=15V
MW Note 6

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TABLE 2.2.1 Electrical Characteristics (2/2) Suffix (T: Top arm, B: Bottom arm) Condition: Ta=25℃
No. Item Symbol Pin Min. Typ. Max. Unit Condition
34 Charge pump diode VFDCP VCC, － 0.8 1.4 V I=1mA
forward voltage CD, C+
35 Over Operating TSDON 140 170 195 ℃ VCC=15V
MU, MV,
temperature temperature
MW
36 protection Recovery TSDOFF 115 145 170 ℃
temperature
37 Motor lock Operating time TMLON CML 0.6 2.0 3.0 ms VCC=15V, CM=1000pF
38 protection Recovery time TMLOFF 5 12 20 ms

Note 1: The amplitude of SAW wave (i.e., VSAWW) is determined by the following equation.
VSAWW = VSAWH - VSAWL (V)
Note 2: The equivalent circuit is shown in FIGURE 2.2.1.
Note 3: Internal pull-down resistor is typically 240kΩ. The equivalent circuit is shown in FIGURE 2.2.2.
Note 4: The equivalent circuit is shown in FIGURE 2.2.3.
Note 5: Internal pull-up resistor is typically 200kΩ. The equivalent circuit is shown in FIGURE 2.2.4.
Note 6: The minimum pulse width to pass the filter circuit.
Note 7: “IB” represents the sum of output currents at the CB pin and the HA pin.

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VB

Comparator
HUP, HVP, HWP
+
HUN, HVN, HWN -

FIGURE 2.2.1 Equivalent Circuit around Hall Signal Pins

VB

Comparator
VSP +
-
typ.
240kΩ

From CR pin

FIGURE 2.2.2 Equivalent Circuit around VSP Pin

VB

FG1
FG2

FIGURE 2.2.3 Equivalent Circuit around FG1, FG2 Pins

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VB
typ.
Current limit comparator
200kΩ
RS +
-
Vref1
(typ. 0.5V)

Over-current protection comparator

+
-
Vref2
(typ. 1.0V)

FIGURE 2.2.4 Equivalent Circuit around RS Pin

2.3 Operating Condition

TABLE 2.3.1 Operating Condition
No. Item Symbol Pin Min. Typ. Max. Unit
1 VSop VS 15 325 450 V
Supply voltage
2 VCCop VCC 13.5 15.0 16.5 V

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2.4 Functions and Operations
2.4.1 Truth Table
TABLE 2.4.1.1 Truth Table
Mode Hall signal input Phase-U Phase-V Phase-W
FG1 FG2
Top Bottom Top Bottom Top Bottom
HU HV HW output output
arm arm arm arm arm arm
(1) H L H OFF ON ON OFF OFF OFF H H
(2) H L L OFF ON OFF OFF ON OFF L H
(3) H H L OFF OFF OFF ON ON OFF H H
(4) L H L ON OFF OFF ON OFF OFF L L
(5) L H H ON OFF OFF OFF OFF ON H L
(6) L L H OFF OFF ON OFF OFF ON L L
－ L L L OFF OFF OFF OFF OFF OFF L L
－ H H H OFF OFF OFF OFF OFF OFF H H
Note: Inputs H: Input voltage between H*P and H*N > VHLH
Inputs L: Input voltage between H*P and H*N < VHHL

2.4.2 Timing Chart

Mode (6) (1) (2) (3) (4) (5) (6) (1) (2) (3) (4)
Hall Signal
Input

HUP -HUN

HVP-HVN

HWP-HWN

MU Output
Voltage

MV Output
Voltage

MW Output
Voltage

FG1 Output
Voltage
FG2 Output
Voltage

FIGURE 2.4.2.1 Timing Chart

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2.4.3 PWM Operation
The PWM signal is generated by comparing the input voltage at the VSP pin with an internal
SAW wave voltage (available at the CR pin). The relation between VSP input voltage and PWM
duty is shown in FIGURE 2.4.3.1. The PWM duty represents the duty of IGBT gate drive signals.
The voltages at output pins (MU,MV,MW) may be different from the figure depending on
conditions. The PWM is operated by bottom arms.
100
PWM duty （%） ← duty=(1-TMINB×fPWM)×100%

fPWM ： PWM frequency

← duty=(TMINB×fPWM)×100%
0
↑ ↑
VSAWL VSP Input Voltage （V） VSAWH

FIGURE 2.4.3.1 Relation between VSP Input Voltage and PWM Duty

2.4.4 Current Limit

This IC detects current using an external shunt resistor Rs. When the voltage at the shunt resistor Rs
exceeds the current limit reference voltage (Vref1, typ. 0.5V), all bottom arm IGBTs are turned off. This
off state is automatically reset once per internal CLOCK period (available at VTR pin).

2.4.5 Over-current Protection

When the voltage at the shunt resistor Rs exceeds the over-current protection reference voltage (Vref2,
typ. 1.0V), all IGBTs (top and bottom arms) are turned off. When the over-current protection recovery
time (Trs, typ. 1ms) passes, the IC returns to the state in which the IGBTs operate depending on input
signals.
When this function is not used, connect the CS pin to the CB pin.
When the IGBTs of the top and bottom arms are all turned off by operation of this protection or other
function during motor driving, the power supply voltage may rise as a result of a regenerative current
flow. The power supply voltage must not exceed the maximum rating (600V).

2.4.6 VCC Low-Voltage Detection

When VCC voltage drops below the operating voltage of the VCC low-voltage detection (LVSDON), all
IGBTs (top and bottom arms) are turned off. When VCC voltage goes up above the recovery voltage of
the VCC low-voltage detection (LVSDOFF), the IC returns to the state in which the IGBTs operate
depending on input signals.

2.4.7 All IGBT Shutoff Function

When the input voltage at the VSP pin drops below VSAWL (typ. 2.1V), the IC stops the motor drive.
When the input voltage at the VSP pin drops further from VSAWL and becomes below Voff (typ. 1.23V),
the IGBTs (top and bottom arms) are all shut off to reduce current consumption within the IC. The state
of the output IGBTs with regard to the VSP input voltage is shown in Table 2.4.7.1.
TABLE 2.4.7.1 IGBT Operation to VSP Input Voltage
VSP Input Voltage Motor drive state Top Arm IGBTs Bottom Arm IGBTs
0V≦VSP＜Voff All OFF All OFF
Stop
Voff≦VSP＜VSAWL Based on TABLE 2.4.1 All OFF
VSAWL≦VSP Drive Based on TABLE 2.4.1 Based on TABLE 2.4.1

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2.4.8 Motor Lock Protection
If a motor is locked, the FG1 signal is fixed at “H” or “L”. When the operating time (t1) passes in this
state, the motor lock state is detected. Then all IGBTs (top and bottom arms) are turned off. After that,
when the recovery time (t2) passes, the IC returns to the state in which the IGBTs operate depending on
input signals.
The operating time and recovery time are adjustable by the capacitance of the external capacitor CM.
Operating time: t1(s) = {TMLON(ms)/1000}×{CM(pF)/1000(pF)}
Recovery time: t2(s) = {TMLOFF(ms)/1000}×{CM(pF)/1000(pF)}
If the motor takes long time to start up because of low VS voltage or high-load, and so on, the motor
lock state may be detected during motor start-up. Set the capacitance of the external capacitor CM
considering star-up time variation.
The motor lock state is not detected under any of the following conditions (1) to (3).
(1) VSP input voltage ≦ typ. 2.2V
(2) VCC low-voltage detection operates.
(3) Over temperature protection operates.
When the motor lock protection is not used, connect the CML pin to the GL pin.

2.4.9 Over Temperature Protection

When IC temperature exceeds the operating temperature of over temperature protection (TSDON), all
IGBTs (top and bottom arms) are turned off. When IC temperature goes below the recovery
temperature of over temperature protection (TSDOFF), the IC returns to the state in which the IGBTs
operate depending on input signals.

2.4.10 VCC Standby Function

When the input voltage at the VSP pin is more than the all off operating voltage (Voff, typ.1.23V), the
current is applied from the HA pin to the Hall elements.
When the input voltage at the VSP pin is less than the all off operating voltage, the current to the Hall
elements is shut off to reduce standby power consumption from VCC power supply.
When the current to the Hall elements is shut off, the voltages at the Hall signal input pins (H*P, H*N) are
fixed at “L”. At this time, the FG1 and the FG2 output “L”. If there is need to confirm the motor rotating
state through the FG1 or the FG2 output signal while the VSP input voltage is below the all off operating
voltage, do not use this function (the HA pin). Use the CB pin as the power supply for the Hall elements.
When this function is not used, open the HA pin or connect it to the CB pin.

CB

All IGBT shutoff signal

C0
HA

Hall elements

FIGURE 2.4.10.1 Usage Example of Hall Elements and Internal Equivalent Circuit

2.4.11 Power On/Off Sequence-Free

When the current at the output pins is below 1A, IGBT current saturation does not occur regardless of
power on/off sequence of the VCC power supply, VS power supply and VSP input voltage.
However, be aware that when the VS is powered on after the VCC and VSP power on with the motor
lock protection enabled, the motor may take long time to start up because the motor lock protection
operates.

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3. Standard Applications
3.1 External Components
TABLE 3.1.1 External Components
Component Standard value Usage Remark
C0 1.0μF±10%, 25V Smooths the internal power supply (VB)
CV1 1.0μF±10%, 25V Smooths the Vcc power supply Note 1
CV2 33nF±10%, 630V Smooths the Vs power supply Note 2
DZ 5W Absorbs Vs line surge voltage
C1, C2 0.22μF±10%, 25V For charge pump
C3, C4, C5 1000pF±10%, 25V Eliminates Hall signal noise Note 3
Rs 1Ω±1%,1W Sets current limit Note 4
CTR 2200pF±5%, 25V Sets PWM frequency Note 5
RTR 11kΩ±5%
CM 1.0μF±10%, 25V For motor lock protection
CF 470pF±10%, 25V For over-current protection
RF 2MΩ±10%
Note 1: As necessary, increase the capacitance and add a zener diode in consideration of noise immunity.
Note 2: As necessary, increase the capacitance in consideration of noise immunity.
Note 3: Optimize the capacitance corresponding to conditions.
Note 4: The current limit set value can be calculated as follows.
I＝Vref1/ Rs (A)
To determine the shunt resistor Rs, see Table 3.1.1 and Appendix.
Note 5: The PWM frequency is approximated by the following equation.
fPWM≒0.494 / (CTR×RTR) (Hz)

Hall elements

C3 C4 C5 C1 CV2 DZ VS
V CC(15V) C0 C2
CB HA HUP HVP HWP CD C+ CL VS
VB HUN HVN HWN D1
power + - + - + - Vcc Charge
VCC Vcc standby pump
supply
CV1
VB
D2 Clock

Hall
FG1 Top arm elements
FG
driver
Filter circuit

FG2 MU
Microcontroller
3-phase
VSP distributor MV
+ PWM
CMP circuit MW
- ALL OFF Bottom
arm OFF
+ Bottom
CMP Motor
- arm driver
Over-temperature Vcc low-voltage
protection detection
SAW wave Current limit
generator Over-current
Clock Motor lock
protection protection

FG1

GL CR VTR CML RF CS RS GH
RTR CB
RS
CTR CM CF

FIGURE 3.1.1 Block Diagram (ECN30210 is shown inside the bold line.)

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4. Pin Locations

CL 1 26 GL 1 CL
GL 26
CD 2 25 VCC 2 CD
VCC 25
24 VSP VSP 24
C+ 3 3 C+
23 CB CB 23
VS 4 CS 4 VS
22 CS 22
21 HA HA 21
MW 5 20 CR 5 MW
CR 20
19 VTR VTR 19
MV 6 CML 6 MV
18 CML 18
17 HWP HWP 17
MU 7 7 MU
16 HWN HWN 16
15 HVP HVP 15
GH 8 8 GH
14 HVN HVN 14
RS 9 HUP 9 RS
FG2 10 13 HUP 13
12 HUN 10 FG2
FG1 11 HUN 12
11 FG1

DIP26 (Top view) SOP26 (Top view)

FIGURE 4.1 Pin Locations
5. Explanations of Pins
TABLE 5.1 Explanations of Pins
Pin No. Symbol Explanation Remark
1 CL For the charge pump circuit Note 1
2 CD For the charge pump circuit Note 1
3 C+ For the charge pump circuit Note 1
4 VS High voltage power supply Note 1
5 MW W phase output Note 1
6 MV V phase output Note 1
7 MU U phase output Note 1
8 GH Emitters of bottom arm IGBTs and anodes of bottom arm FWDs
(Connected to a shunt resistor)
9 RS Input for current limit and over-current protection
10 FG2 Output for motor rotational speed monitor
(one pulse / 360 electrical degrees)
11 FG1 Output for motor rotational speed monitor
(three pulses / 360 electrical degrees)
12 HUN U phase Hall signal minus input
13 HUP U phase Hall signal plus input
14 HVN V phase Hall signal minus input
15 HVP V phase Hall signal plus input
16 HWN W phase Hall signal minus input
17 HWP W phase Hall signal plus input
18 CML For motor lock protection
19 VTR Connect a resistor to set the PWM frequency
20 CR Connect a resistor and a capacitor to set the PWM frequency
21 HA Output for VCC standby function
22 CS For over-current protection
23 CB VB power supply output
24 VSP Analog speed command signal input
25 VCC 15V power supply
26 GL Ground
Note1: High voltage pin. Because the voltage between CD and CL and the voltage between C+ and VS are
low voltage, the distances between the pins are the same as low voltage pins.
Note2: The voltage at exposed tap is the same as GL pin.

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6. Inspection
Hundred percent inspection shall be conducted on electric characteristics at room temperature. For the
operating temperature and recovery temperature of the over temperature protection, equivalent inspections
are conducted at room temperature.

7. Precautions for use

7.1 Countermeasures against Electrostatic Discharge (ESD)
(a) Customers need to take precautions to protect ICs from electrostatic discharge (ESD). The material of
the container or any other device used to carry ICs should be free from ESD, which can be caused by
vibration during transportation. Use of electrically conductive containers is recommended as an
effective countermeasure.
(b) Everything that touches ICs, such as the work platform, machine, measuring equipment, and test
equipment, should be grounded.
(c) Workers should be high-impedance grounded (100kΩ to 1MΩ) while working with ICs, to avoid
damaging the ICs by ESD.
(d) Friction with other materials, such as high polymers, should be avoided.
(e) When carrying a PCB with a mounted IC, ensure that the electric potential is maintained at a constant
level using the short-circuit terminals and that there is no vibration or friction.
(f) The humidity at an assembly line where ICs are mounted on circuit boards should be kept around 45 to
75 percent using humidifiers or such. If the humidity cannot be controlled effectively, using ionized air
blowers (ionizers) is effective.

7.2 Output Short-Circuit Protection

A short circuit (ex. load short) could damage this IC (the products of Hitachi Power Semiconductor
Device, hereinafter called “HPSD’s IC”). External protection is needed to prevent HPSD’s IC breakdown.

7.3 Maximum ratings

Regardless of changes in external conditions during use of HPSD’s IC, the “maximum ratings”
described in this document should never be exceeded when designing electronic circuits that employ
HPSD’s IC. If maximum ratings are exceeded, HPSD’s IC may be damaged or destroyed. In no event
shall Hitachi Power Semiconductor Device (hereinafter called “HPSD”) be liable for any failure in
HPSD’s IC or any secondary damage resulting from use at a value exceeding the maximum ratings.

7.4 Derating Design

Continuous high-load operation (high temperatures, high voltages, large currents) should be avoided
and derating design should be applied, even within the ranges of the maximum ratings, to ensure
reliability.

7.5 Safe Design

The HPSD’s IC may fail due to accidents or unexpected surge voltages. Accordingly, adopt safe design
features, such as redundancy and measures to prevent misuse, in order to avoid extensive damage in
the event of a failure.

7.6 Application
If HPSD’s IC is applied to the following uses where high reliability is required, obtain the document of
permission from HPSD in advance.
・Automobile, Train, Vessel, etc.
Do not apply HPSD’s IC to the following uses where extremely high reliability is required.
・Nuclear power control system, Aerospace instrument, Life-support-related medical equipment, etc.

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7.7 Soldering
(1) DIP26 Soldering Condition
o
The peak temperature of flow soldering* must be less than 260 C, and the dip time must be
less than 10 seconds. High stress by mounting, such as long time thermal stress by preheating,
mechanical stress, etc, can lead to degradation or destruction. Make sure that your mounting
method does not cause problem as a system.

* Flow soldering: Only pins enter a solder bath, while the resin or tab does not.

(2) SOP26 Soldering Condition

The recommended reflow soldering condition is shown in FIGURE 7.7.1.
temperature (℃)

2 4250℃Max
5 ℃ Max

3 0 s Max
2245℃
40℃
表面温度　(℃)

3 ℃/ s Max 6 ℃/ s Max
217℃
6 0 ～1 5 0 s

150℃ 200℃
surface
Packageパッケージ

6 0 ～1 2 0 s

※)本プロファイルは目標仕様であり、
　　見直しとなる場合があります

時間　(s)
Time (s)
FIGURE 7.7.1 Recommended Conditions for Infrared Reflow or Air Reflow

(3) Reliability of Solder Connection

The reliability of solder connection depends on soldering condition, materials of circuit boards, footprint,
etc. Test it sufficiently by heat cycle test, heat shock test, and so on after mounting ICs on circuit boards.

7.8 Others
See “Instructions for Use of Hitachi High-Voltage Monolithic ICs” for other precautions and instructions
on how to deal with these kinds of products.

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8. Usage
(1) HPSD warrants that the HPSD products have the specified performance according to the respective
specifications at the time of its sale. Testing and other quality control techniques of the HPSD products
by HPSD are utilized to the extent HPSD needs to meet the specifications described in this document.
Not every device of the HPSD products is specifically tested on all parameters, except those mandated
by relevant laws and/or regulations.

(2) Following any claim regarding the failure of a product to meet the performance described in this
document made within one month of product delivery, all the products in relevant lot(s) shall be re-tested
and re-delivered. The HPSD products delivered more than one month before such a claim shall not be
counted for such response.

(3) HPSD assumes no obligation nor makes any promise of compensation for any fault which should be
found in a customer’s goods incorporating the products in the market. If a product failure occurs for
reasons obviously attributable to HPSD and a claim is made within six months of product delivery, HPSD
shall offer free replacement or payment of compensation. The maximum compensation shall be the
amount paid for the products, and HPSD shall not assume responsibility for any other compensation.

(4) HPSD reserves the right to make changes in this document and to discontinue mass production of the
relevant products without notice. Customers are advised to confirm specification of the product of inquiry
before purchasing of the products that the customer desired. Customers are further advised to confirm
before purchasing of such above products that the product of inquiry is the latest version and that the
relevant product is in mass production status if the purchasing of the products by the customer is
suspended for one year or more.

(5) When you dispose of HPSD products and/or packing materials, comply with the laws and regulations of
each country and/or local government. Conduct careful preliminary studies about environmental laws
applying to your products such as RoHS, REACH. HPSD shall not assume responsibility for
compensation due to contravention of laws and/or regulations.

(6) HPSD shall not be held liable in any way for damages and infringement of patent rights, copyright or
other intellectual property rights arising from or related to the use of the information, products, and
circuits in this document.

(7) No license is granted by this document of any patents, copyright or other intellectual property rights of
any third party or of HPSD.

(8) This document may not be reprinted, reproduced or duplicated, in any form, in whole or in part without
the express written permission of HPSD.

(9) You shall not use the HPSD products (technologies) described in this document and any other products
(technologies) manufactured or developed by using them (hereinafter called “END Products”) or supply
the HPSD products (technologies) and END Products for the purpose of disturbing international peace
and safety, including (ⅰ) the design, development, production, stockpiling or any use of weapons of
mass destruction such as nuclear, chemical or biological weapons or missiles, (ⅱ) the other military
activities, or (ⅲ) any use supporting these activities. You shall not sell, export, dispose of, license, rent,
transfer, disclose or otherwise provide the HPSD products (technologies) and END Products to any third
party whether directly or indirectly with knowledge or reason to know that the third party or any other
party will engage in the activities described above.
When exporting, re-export transshipping or otherwise transferring the HPSD products (technologies)
and END Products, all necessary procedures are to be taken in accordance with Foreign Exchange
and Foreign Trade Act (Foreign Exchange Act) of Japan, Export Administration Regulations (EAR) of
US, and any other applicable export control laws and regulations promulgated and administered by the
governments of the countries asserting jurisdictions over the parties or transaction.

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 ＜ECN30210 Product Specification＞ 16/20
IC-SP-13030 R2
◆Appendix - Supplementary Data

See derating information below when designing with the ECN30210.

1. Safe Operation Area (SOA)

The current and voltage at output pins must not be outside the SOA shown in FIGURE A.

VCC=15V
Tj=25℃

Output Pin Current (A)

1.5

SOA

0
0 450
Output Pin Voltage (V)

FIGURE A: SOA

2. Power On/Off Sequence and Current Derating for VCC

The current derating for VCC is shown in FIGURE B. Use the output pin current below the derating
curve. When the output pin current is less than 1A, power on/off sequence is free.

2.0
1.8 Tj=135℃
1.6
Output Pin Current (A)

LVSDON min
1.4
1.2
1.0
0.8 VCCop min
0.6
(VCCop)
0.4
0.2
0.0
5 10 15 20
Vcc (V)

FIGURE 2.1 Current Derating for VCC

FIGURE B: Current Derating for VCC

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 ＜ECN30210 Product Specification＞ 17/20
IC-SP-13030 R2
3. Current Derating for Junction Operating Temperature
The current derating for junction operating temperature is shown in FIGURE C. Use the output pin
current below the derating curve.

FIGURE C: Current Dating for Junction Operating Temperature

4. Shunt Resistor Setting

When setting the current limit, consider the variability of the reference voltage (Vref1), the variability of
shunt resistor (Rs) and the delay time.
The current must be below the derating curves of FIGURE B and FIGURE C.

5. General Design Derating Standards

o
(a) Temperature - Junction operating temperature must be kept under 110 C.
(b) Supply voltage - VS power supply voltage must be kept under 450V.

Junction operating temperature depends on various parameters such as power supply voltages, ambient
temperature, load, heat dissipation routes. Test it sufficiently by using actual systems.

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 ＜ECN30210 Product Specification＞ 18/20
IC-SP-13030 R2
6. Dimensions

A
2 2 2 2 2 2 2 2 2 2 2 2 2 2
Exposed tab
on front
26pin
0°～15°
(10)

(0.6)

11.84
11.0
(5)
(11.793)

1pin
0.95 2.6 0°～15°
2 3.9 2 3.9 3.9 3.9 3.9 2 2 2

2.00±0.05
31.5±0.2

0.25±0.04
Enlarged view of A

0.60±0.05

Unit: mm
FIGURE D: Dimensions of DIP26

2 3.9 2 3.9 3.9 3.9 3.9 2 2 2

0.95
Exposed tab
1pin on back

(10)
0.42
(0.6)

11.0
(5)

13

(11.793)

26pin
2 2 2 2 2 2 2 2 2 2 2 2 2 2 0.25±0.04
2.00±0.05

31.5±0.2

0.60±0.05

Unit: mm
FIGURE E: Dimensions of SOP26

Note: Unless otherwise specified, the tolerance is ±0.1 in figure D and figure E.

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 ＜ECN30210 Product Specification＞ 19/20
IC-SP-13030 R2
7. External Packaging
FIGURE F shows the external packaging. In the case of reel, order quantities are basically multiples of 700.

Magazine Reel
(ECN30210P) (ECN30210F)

Packing tape Packing tape

Outer box

Inner box Inner box

Inner box

リール

内装ラベル
Reel
Magazine 乾燥剤
湿度インジケータ リール 防湿袋
Emboss 内装ラベル
tape
Magazine 乾燥剤 エンボステープ
IC
& 湿度インジケータ Aluminum
防湿袋
Reel laminate bag

エンボステープ 内装ラベル

内装箱

内装ラベル 内装ラベル
Stopper
内装箱
30
The number of ICs:15/magazine 内装ラベル
The number of ICs:700/reel
27 8
3 28
FIGURE F: External
30 packaging

27 8
3 28 外装箱

外装箱

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 ＜ECN30210 Product Specification＞ 20/20
IC-SP-13030 R2
8. Storage conditions
The following conditions are applied to ECN30210F (SOP26).
(1) Before opening the moisture prevention bag (aluminum laminate bag)
Temperature: 5 to 35℃
Humidity: less than 85%RH
Period: less than 2 years

(2) After opening the moisture prevention bag (aluminum laminate bag)
Temperature: 5 to 30℃
Humidity: less than 70%RH
Period: less than 1 week (from opening the bag to reflow soldering)

(3) Temporal storage after opening the moisture prevention bag

When ICs are stored temporarily after opening the bag they should be returned into the bags with
desiccant within 10 minutes. Then, opening side of bags should be fold into two, and close with
adhesive tape. And they should be kept in the following conditions.
Temperature: 5 to 35℃
Humidity: less than 85%RH
Period: less than 1 month

※ When the period of (1) to (3) is expected to expire, it is recommended to store the ECN30210F
(SOP26) in a drying furnace (30%RH or lower) at ordinary temperature.

(4) Baking process

When the period of (1) to (3) has expired, the ECN30210F (SOP26) should be baked in
accordance with the following conditions. (However, when the ECN30210F (SOP26) is stored in a
drying furnace (30%RH or lower) at ordinary temperature, there is no need to bake.)
Do not bake the tape and the reel of the taping package because they are not heat resistant.
Transfer the ECN30210F (SOP26) to a heat resistant container prior to baking.
Temperature: 125±5℃
Period: 16 to 24 hours

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 Precautions for Safe Use and Notices
If semiconductor devices are handled in an inappropriate manner, failures may result. For this reason, be
sure to read the latest version of “Instructions for Use of Hitachi High-Voltage Monolithic ICs” before use.


　　　　　This
! mark indicates an item requiring caution.


　　　CAUTION
!
This mark indicates a potentially hazardous situation which, if not avoided, may result
in minor or moderate injury and damage to property.

 CAUTION
!

(1) Regardless of changes in external conditions during use of semiconductor devices, the “maximum ratings” and “safe
operating area(SOA)” should never be exceeded when designing electronic circuits that employ semiconductor devices.
(2) Semiconductor devices may fail due to accidents or unexpected surge voltages. Accordingly, adopt safe design features,
such as redundancy and measures to prevent misuse, in order to avoid extensive damage in the event of a failure.
(3) If semiconductor devices are applied to uses where high reliability is required, obtain the document of permission from
HPSD in advance (Automobile, Train, Vessel, etc.). Do not apply semiconductor devices to uses where extremely high
reliability is required (Nuclear power control system, Aerospace instrument, Life-support-related medical equipment, etc.).
(If a semiconductor device fails, there may be cases in which the semiconductor device, wiring or wiring pattern will emit
smoke or cause a fire or in which the semiconductor device will burst.)

NOTICES
1. This Data Sheet contains the specifications, characteristics, etc. concerning power semiconductor products (hereinafter
called “products”).
2. All information included in this document such as product data, diagrams, charts, algorithms, and application circuit
examples, is current as of the date this document is issued. Such information, specifications of products, etc. are subject to
change without prior notice. Before purchasing or using any of the HPSD products listed in this document, please confirm
the latest product information with a HPSD sales office.
3. HPSD shall not be held liable in any way for damages and infringement of patent rights, copyright or other intellectual
property rights arising from or related to the use of the information, products, and circuits in this document.
4. No license is granted by this document of any patents, copyright or other intellectual property rights of any third party or of
HPSD.
5. This document may not be reprinted, reproduced or duplicated, in any form, in whole or in part without the express written
permission of HPSD.
6. You shall not use the HPSD products (technologies) described in this document and any other products (technologies)
manufactured or developed by using them (hereinafter called “END Products”) or supply the HPSD products (technologies)
and END Products for the purpose of disturbing international peace and safety, including (ⅰ) the design, development,
production, stockpiling or any use of weapons of mass destruction such as nuclear, chemical or biological weapons or
missiles, (ⅱ) the other military activities, or (ⅲ) any use supporting these activities. You shall not sell, export, dispose of,
license, rent, transfer, disclose or otherwise provide the HPSD products (technologies) and END Products to any third party
whether directly or indirectly with knowledge or reason to know that the third party or any other party will engage in the
activities described above.
When exporting, re-export transshipping or otherwise transferring the HPSD products (technologies) and END Products, all
necessary procedures are to be taken in accordance with Foreign Exchange and Foreign Trade Act (Foreign Exchange Act)
of Japan, Export Administration Regulations (EAR) of US, and any other applicable export control laws and regulations
promulgated and administered by the governments of the countries asserting jurisdictions over the parties or transaction.
7. In no event shall HPSD be liable for any failure in HPSD products or any secondary damage resulting from use at a value
exceeding the maximum ratings.

Refer to the following website for the latest information. Contact a HPSD sales office if you have any questions.

http://www.hitachi-power-semiconductor-device.co.jp/en/

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