Brochure X13 Servers

X13 Server Solutions
Supporting 4th Gen Intel® Xeon® Scalable Processors

(Sapphire Rapids)
January 2023
INTRODUCING
SUPERMICRO X13 GENERATION
Performance Redefined with 4th Gen Intel® Xeon® Scalable Processors
(Sapphire Rapids)
The Supermicro X13 Advantage
Supermicro’s tried-and-tested Building Block Solutions® approach and industry-
leading first-to-market advantage deliver optimized systems for the most
demanding AI, Cloud, and 5G Edge workloads.
Supermicro Total IT Solutions Optimized, Open Architectures 4th Gen Intel® Xeon® Scalable
• Industry’s broadest portfolio of • More than 15 families of systems Processors
systems based on 4th Gen Intel Xeon optimized for AI, Cloud, 5G Edge and • Up to 60 cores and 350W TDP per CPU
Scalable processors more
• Support for Intel Xeon® Max Series
• Rack Scale plug-and-play service to • Resource saving architecture to reduce CPUs with High Bandwidth Memory
deliver complete, validated solutions materials and energy usage
• Support for PCIe 5.0, DDR5 and CXL 1.1
within weeks, not months • Enhanced thermal capacity to support
• Support for Next-gen Intel® Optane®
• Production capacity of up to 3,500 next-gen CPUs, GPUs and other
Persistent Memory (Crow Pass)
racks per month worldwide components
• Built in accelerators:
• Made in the USA program with • Flexible networking with Advanced I/O
manufacturing in San Jose Modules (AIOM) up to 400G per card • Intel AMX
headquarters • High ambient temperature operation up • Intel® Dynamic Load Balancer
• Industry standard compliance for to 40°C with liquid cooling options • Intel® QuickAssist
hardware and silicon Root of Trust • Support for open and industry standards • Technology (QAT)
(RoT) and cryptographical attestation including OCP 3.0, OAM, ORV2, OSF, Open • Intel vRAN Boost
of components throughout the entire BMC and EDSFF • Built on the Intel® 7 process
supply chain
2 X13 Server Solutions - January 2023

X13 PCIe GPU Tailored for Omniverse and Metaverse
High Performance and Flexibility for AI/ML and HPC Applications
Dual socket 4th Gen Intel® Xeon® Scalable processors

32 DIMM slots supporting DDR5-4800MHz 5U 10-GPU
Supports NVIDIA H100, A100, Intel® Ponte Vecchio

(PVC) and Intel® Data Center GPU Flex Series (ATS-M)
PCIe GPUs
Double the CPU to GPU throughput with PCIe 5.0
Single root, dual root and direct-connect GPU
configurations available
5U option available for enhanced thermal capacity
Flexible storage with U.2 NVMe direct to CPU and
storage options
NVIDIA-certified system supporting NVIDIA GPUs SYS-521GE-TNRT
SYS-521GE-TNRT (5U) SYS-521GE-TNRT2 (5U) SYS-421GE-TNRT (4U) SYS-421GE-TNRT3 (4U) SYS-741GE-TNRT (4U Tower)
Up to 10 FHFL double-width PCIe GPUs Up to 10 FHFL double-width PCIe GPUs Up to 10 FHFL double-width PCIe GPUs Up to 8 FHFL double-width direct Up to 4 double-width PCIe GPUs
8x 2.5” SAS/SATA hybrid + 8x 2.5” 8x 2.5” SAS/SATA hybrid + 8x 2.5” 8x 2.5” SAS/SATA hybrid + 8x 2.5” U.2 connect PCIe GPUs, 8x 3.5” SATA + 8x 2.5” U.2 NVMe
U.2 NVMe direct to CPU + 8x 2.5” U.2 U.2 NVMe direct to CPU + 8x 2.5” U.2 NVMe direct to CPU + 8x 2.5” U.2 NVMe 8x 2.5” SATA + 4x 2.5” U.2 NVMe direct to CPU
NVMe direct to storage (optional) NVMe direct to storage (optional) direct to storage (optional) direct to CPU
High Ambient Temperature: 38°C High Ambient Temperature: 38°C Dual-root Direct-Connect
Dual-root Single-root
Flexible Platform Key Applications

• AI model training
Optimized for the next generation of HPC, action-oriented AI, 3D simulation, and • Digital twins
advanced graphic design and rendering, Supermicro X13 PCIe accelerated solutions • 3D simulation
empower the creation of 3D worlds, digital twins, 3D simulation models and the • Real-time ray-tracing
Metaverse. • Animation and Modeling
• Cloud Gaming
These systems support next-generation accelerators based on the industry-standard
• Design & Visualization
PCIe form factor, with up to 10 double-width GPUs in a 4U or 5U chassis.
• 3D Rendering
Support for the latest industry-standard PCIe 5.0 provides unprecedented throughput • VDI
for graphics accelerators, supporting the most demanding workloads, with CPU-direct • Media/Video
U.2 NVMe bays ensuring maximum data throughput. Additional networking slots Streaming
provide connectivity of up to 400Gb/s to create high performance clusters of up to 32 • Diagnostic Imaging
nodes. Liquid Cooling options are available for delivering superior efficiency for the
most demanding performance.
X13 Server Solutions - January 2023 3

X13 Universal GPU
Optimized Integrated Performance for AI/ML and HPC Applications
8U Universal GPU
Most comprehensive AI building block platform
Supercharged for the largest workloads with next-
generation architecture
All set to break through the barriers of AI at Scale
Powered by NVIDIA HGX H100 8 SXM5 GPUs up to
700W TDP
9X more performance, 2X faster networking, and
high-speed scalability
AIOM Slot (OCP 3.0 compliant) Support
Optional Liquid Cooling Support
SYS-821GE-TNHR
SYS-821GE-TNHR (8U) SYS-821GE-FTNHR (8U Front IO) SYS-521GU-TNXR (5U) SYS-421GU-TNXR (4U)
NVIDIA H100-8 NVIDIA H100-8 NVIDIA H100-4 NVIDIA H100-4
8 PCIe 5.0 networking slots + 8 PCIe 5.0 networking slots + 5U 10 PCIe 5.0 networking slots 4U 8 PCIe 5.0 networking slots
optional AOC/AIOM optional AOC/AIOM 10x 2.5” U.2 NVMe drives 6x 2.5” U.2 NVMe drives
Up to 16x 2.5” U.2 NVMe drives Up to 16x 2.5” U.2 NVMe drives Thermal capacity up 700W per GPU Thermal capacity up 700W per GPU
Open, Modular, Standards-Based Universal GPU System Key Applications

• High Performance Computing
• AI/Deep Learning Training
Supermicro X13 Universal GPU systems feature an open, modular, standards-based • Industrial Automation
architecture designed for maximum flexibility. Support for multiple industry-standard • Retail
GPUs allows organizations to take advantage of different GPU configurations based • Healthcare
on workload while only deploying a single server architecture, reducing infrastructure • Conversational AI
complexity and simplifying future upgrades.
• Business Intelligence & Analytics
Designed for serviceability with hot-swappable, tool-less components in a modular • Drug Discovery
construction, the chassis are optimized for thermal capacity, supporting next- • Climate and
generation GPUs up to 700W TDP. Weather Modeling
• Finance &
Economics

X13 SuperBlade®
Ultra High-Density Multi-Node Systems for Enterprise, Cloud, HPC, and AI Applications
8U 20-node and 6U 10-node SuperBlade® with integrated switches
Single or dual 4th Gen Intel® Xeon® Scalable processors with air-cooled support for up to 350W TDP CPUs
Up to 32 DIMM slots per node supporting DDR5-4800 and Intel® Optane™ Persistent Memory 300 Series
High-performance networking with 400G NDR InfiniBand and 400Gb Ethernet support up to 4 GPUs per
server in a high-density, balanced architecture
High-performance NVMe support in E1.S, U.2 and M.2 form factors
8U SuperBlade® 6U SuperBlade®
SBE-820J2-830/630 Liquid-Cooled SuperBlade SBE-610J2-830/630

High-density configuration with 20 hot-pluggable Up to 10 hot-pluggable nodes in 6U,
nodes in 8U, Optimized for performance and advanced Performance and memory optimized architecture
networking
8U SuperBlade® 6U SuperBlade®
20/10 DP Nodes in 8U 10/5 UP/DP Nodes in 6U
SBI-421E-1T3N SBI-421E-5T3N SBI-621E-1C2N SBI-621E-5T2N SBI-611E-1C2N SBI-611E-5T2N

SBI-621E-1T2N SBI-611E-1T2N
3 SATA or 2 NVMe 3 SATA or 2 NVMe 3 SAS/SATA/NVMe 3 SAS/SATA/NVMe 2 SAS/SATA/NVMe 2 SAS/SATA/NVMe
DP/16 DIMM DP/16 DIMM DP/32 DIMM DP/32 DIMM UP/16 DIMM UP/16 DIMM
Resource-Saving Architecture Key Applications

• AI/ML/DL
Supermicro’s high performance, density-optimized, and energy-efficient SuperBlade® • HPC
can significantly reduce initial capital and operational expenses for many • Cloud
organizations. SuperBlade® utilizes shared, redundant components including cooling
• EDA
fans, switches or passthrough modules and power supplies to deliver the compute
• Virtualization
performance of a full server rack in a much smaller physical footprint.
• Health
With both air and liquid cooling options available, SuperBlade® systems can • Financial Services
be configured to maximize density and performance for a range of operating
environments. The 6U SuperBlade® features a disaggregated design between the
motherboard and I/O module, where each resource can be refreshed independently
allowing datacenters to reduce refresh cycle costs and reuse components to reduce
the Total Cost to the Environment (TCE).

X13 GrandTwin™
Multi-node Architecture with Front or Rear I/O
2U 4-Node GrandTwin™
Purpose-built Architecture for 1S
Support max DIMM, E1.S, PCIe Gen5, and CXL
- Edge to Enterprise Datacenter Deployments
Field serviceable from front/cold aisle to reduce
downtime for higher availability
X13SET-G/-GC
Flexible Front & Rear I/O config designed to help reduce
cable complexities
SYS-211GT-HNTF (Front View)
2U 4-Node Front I/O GrandTwin™ 2U 4-Node Rear I/O GrandTwin™
SYS-211GT-HNTF SYS-211GT-HNC8F SYS-211GT-HNTR SYS-211GT-HNC8R
Up to 4 U.2 NVMe/SATA drives Up to 4 U.2 NVMe/SAS/SATA drives Up to 6 U.2 NVMe/SATA drives Up to 6 U.2 NVMe/SAS/SATA drives
per node per node per node per node
Highly Configurable Single Processor Systems with Front or Rear I/O Key Applications
• MEC (Multi-Access Edge Computing)
GrandTwin™ is an all-new architecture purpose-built for single-processor • HPC
performance. The design maximizes compute, memory and efficiency to deliver • Cloud Gaming
maximum density. Powered by 4th Gen Intel® Xeon® Scalable processors, GrandTwin’s
• Multi-Purpose CDN
flexible modular design can be easily adapted for a wide range of applications, with
• High-Availability Cache Cluster
the ability to add or remove components as required, reducing cost.
• Telco Edge Cloud
For front configurations, all I/O and node trays are fully accessible from the cold aisle, • EDA (Electronic Design Automation)
simplifying installation and servicing in space-constrained environments. Flexible • Mission-Critical
storage and networking options are available via front AIOM modules, allowing Web Applications
countless custom configurations.

X13 BigTwin®
Industry-leading Multi-node Architectures
Highly configurable 2U 4-node and 2U 2U 4-Node BigTwin®

2-node systems optimized for density or
storage
Optimized thermal design for dual socket
4th Gen Intel® Xeon® Scalable processors
Optional direct-to-chip liquid cooling for
increased thermal capacity
16 DIMM slots per node supporting
DDR5-4800MHz
All-hybrid hot-swappable
NVMe/SAS/SATA drive bays -
Up to 12 drives per node Liquid Cooled Node SYS-221BT-H Series
Flexible networking with

up to 400G Ethernet per node
2U 4-Node BigTwin® 2U 4-Node BigTwin® 2U 2-Node BigTwin® 2U 2-Node BigTwin®
(Liquid cooling option)
SYS-621BT-H Series SYS-221BT-H Series SYS-621BT-D Series SYS-221BT-D Series

3x 3.5” NVMe/SAS/SATA drives 6x 2.5” NVMe/SAS/SATA drives 6x 3.5” NVMe/SAS/SATA drives 12x 2.5” NVMe/SAS/SATA drives
(per node) (per node) (per node) (per node)
Highly Modular Multi-Node Systems with Tool-Less Design Key Applications

• HCI
Supermicro X13 BigTwin® systems provide superior performance and serviceability • HPC
with dual 4th Gen Intel® Xeon® Scalable processors per node and hot-swappable tool- • CDN
less design.
• Hybrid Cloud
Superior modular mid-plane design with NVMe Gen 5 storage controller options. • Container-as-a-Service
Optimized for density (2U4N) or storage (2U2N), BigTwin® systems with shared • Cloud Computing
components can be more cost effective than standard 1U servers. • Big Data Analytics
• Back-up and
Recovery
• Scale-Out Storage

X13 FatTwin®
Advanced Multi-node 4U Twin Architecture with 4 or 8 Nodes
4U 8-Node FatTwin®
Highly configurable 4U 8-node and 4-node
systems
Single socket 4th Gen Intel® Xeon® Scalable
processors per node
16 DIMM slots per node supporting 4TB
DDR5-4800MHz
Front accessible service design for cold-aisle
serviceability
Hot-swappable drive bays – interchangeable
NVMe, SAS or SATA
X13SEFR-A SYS-F511E2-RT
Improved thermal management with new,
optimized airflow designs
4U 8-Node 4U 4-Node
SYS-F511E2-RT (4U8N) SYS-F521E3-RTB (4U4N)

6x 2.5” hot-swap drives per node 8x 3.5” hot-swap drives per node
Innovative Twin Architecture to Maximize Serviceability and Key Applications

Reliability • Hyperscale/Hyperconverged
• Cloud Optimized Servers
Supermicro X13 FatTwin® systems offer an advanced multi-node 4U twin architecture • Data Center Enterprise Applications
with 8 or 4 nodes. Front-accessible service design allows cold-aisle serviceability, with • Scale-out Storage Expansion
highly configurable systems optimized for data center compute or storage density. • Telcom Data Center
Supports all-hybrid hot-swappable NVMe/SAS/SATA hybrid drive bays with up to 6 • Virtualization Server
drives per node (8-node) and up to 8 drives per node (4-node).
Supermicro X13 FatTwin® systems provide superior density, performance and front
serviceability with 4th Gen Intel® Xeon® Scalable processors per node and hot-
swappable, tool-less design.

X13 Hyper and Hyper-E
Best-in-class Performance and Flexibility Rackmount Server
2U Hyper-E
1U and 2U optimized thermal designs for dual Optimized for 5G and Telco
socket 4th Gen Intel® Xeon® Scalable processors with
liquid cooling options
32 DIMM slots per node supporting DDR5-4800MHz
and Intel® Optane™ Persistent Memory 300 Series
NVMe SSD support with up to 24 drives in 2U
Optional 2.5”/E1.S SSD hybrid configuration X13DEM
Up to 3 PCIe 5.0 slots in 1U or 8 PCIe 5.0 slots in 2U

PCIe 5.0 AIOM slots supporting up to 400G
networking
Tool-less system for simplified maintenance SYS-221HE-FTNRD
2U Hyper-E 2U Hyper-E 2U Hyper 2U Hyper 1U Hyper

Optimized for 5G and Telco Optimized for 5G and Telco Optimized for Storage Capacity Optimized for Storage Performance Compute & Storage Powerhouse
(Liquid Cooling options) (Liquid Cooling options)
SYS-221H-TNR
SYS-221HE-FTNR SYS-221HE-FTNRD SYS-621H-TN12R SYS-121H-TNR
SYS-221H-TN24R
6x 2.5” NVMe/SAS/SATA drives, 6x 2.5” NVMe/SAS/SATA drives, 12x 3.5” NVMe/SAS/SATA drives Up to 24x 2.5” NVMe/SAS/SATA 12x 2.5” NVMe/SAS/SATA drives
short depth, front I/O, AC power short depth, front I/O, drives
-48V DC power
Ultimate Configurability for Enterprise and Telco Applications Key Applications

• 5G Core and Edge
The new X13 Hyper series brings next-generation performance to Supermicro’s range • Telco Micro Data Center
of rackmount servers, built to take on the most demanding workloads along with the • Enterprise Server
storage & I/O flexibility that provide a custom fit for a wide range of application needs.
• Cloud Computing
Telco-optimized configurations include short depth carrier grade (NEBS Level 3) and • Big Data Analytics
optional DC power options on selected models. • Hyperconverged Storage
• AI Inference and Machine Learning
Maintenance-friendly design innovations eliminate the need for tools when servicing
• Network Function
the system to simplify rollout and installation.
Virtualization

X13 CloudDC
All-in-one Rackmount Platform for Cloud Data Centers
Single and dual socket 4th Gen

Intel® Xeon® Scalable processors
16 DIMM slots per node supporting
DDR5-4800MHz
Up to 12 U.2 NVMe/SAS/SATA drives
with all-hybrid options X13DDW-A (DP CloudDC) X13SEDW-F (UP CloudDC)
2 PCIe 5.0 slots in 1U or 6 PCIe 5.0

slots in 2U
Dual PCIe 5.0 AIOM slots supporting
up to 400G networking
SYS-121C-TN10R SYS-111C-NR
High Density Cloud Storage Compact Cloud Compute General Purpose Balanced Compact Storage Optimized
SYS-621C-TN12R SYS-521C-NR SYS-121C-TN10R SYS-111C-NR SYS-121C-TN2R SYS-611C-TN4R

2U/DP with 12x 3.5” NVMe/ 2U/UP with 12x 3.5” SAS/ 1U/DP with 10x 2.5” NVMe/ 1U/UP with 10x 2.5” 1U/DP with 8x 2.5” SATA/SAS 1U/DP with 4x 3.5”
SAS/SATA drives and 6x PCIe SATA drives, 2x hybrid NVMe SAS/SATA drives NVMe/SAS/SATA drives and 2x hybrid NVMe drives NVMe/SAS/SATA drives
5.0 slots drives and 6x PCIe 5.0 slots
High-density, Tool-less Mechanical Design for Rapid Cloud Deployment Key Applications
and Easy Maintenance • Cloud Computing
• Web Servers
Ultimate flexibility on I/O and storage with 2 or 6 PCIe 5.0 slots and dual AIOM • Hyper-Converged Storage
slots (PCIe 5.0; OCP 3.0 compliant) for maximum data throughput. Supermicro X13 • Virtualization
CloudDC systems are designed for convenient serviceability with tool-less brackets, • File Servers
hot-swap drive trays and redundant power supplies that ensure a rapid deployment • Head-Node Computing
and more efficient maintenance in data centers. High-efficiency Titanium Level
• 5G Telco AI Inferencing
redundant power supplies provide resiliency and lower carbon footprint.
Rich Security Features include Intel® SGX, TPM 2.0, signed firmware, Silicon Root of
Trust, Secure Boot, System Erase, Runtime FW protection, FIPS Compliance and Trusted
Execution Environment.

X13 All-Flash EDSFF
Revolutionary Petascale NVMe for Unprecedented Density and Capacity
24x EDSFF (E1.S) NVMe SSD

Dual socket 4th Gen Intel® Xeon® Scalable
processors
32 DIMM slots per node supporting DDR5-
4800MHz
2x AIOM supporting PCIe 5.0 x16 and up
to 2x PCIe 5.0 x16 slots
Up to 24 high-performance EDSFF Short
(E1.S) drives in a 1U chassis
E1.S (9.5mm and 15mm) form factor
support for maximum performance and
storage density
SSG-121E-NES24R
1U High-performance All-Flash 1U High-capacity All-Flash 2U TCO Optimized All-Flash
on!) on!)
ing So ing So
(Com (Com
SSG-121E-NES24R SSG-121E-NE316R SSG-221E-NE324R

24 EDSFF (E1.S 15mm) NVMe SSD 16 EDSFF (E3 7.5mm NVMe SSD) 32 EDSFF (E3 7.5mm NVMe SSD)
Extreme Density, High-performance All-flash Servers Key Applications

• Data Intensive HPC/AI
Supermicro X13 All-Flash systems offer industry-leading storage density and • Private & Hybrid Cloud
performance with EDSFF drives allowing for Petabyte scale flash applications to run • Software-Defined Storage
efficiently in fully symmetrical I/O optimized 1U & 2U servers.
• NVMe Over Fabrics Solution
The advanced high-density server design paired with the unmatched efficiency of • In-Memory Computing
EDSFF flash media provides exceptional IOP-per-Watt performance. This combination • Composable Infrastructure Platform
of performance and TCO value will accelerate the transition from legacy HDD for many
large scale, capacity hungry applications used worldwide.

X13 UP WIO
Industry’s Widest Variety of I/O Optimized Servers
2U WIO with 4 PCIe Slots

Cost-effective systems supporting
up to 4 PCIe 5.0 devices
Single socket 4th Gen Intel® Xeon®
Scalable processor
8 DIMM slots supporting DDR5-4800MHz
Hot-swappable 2.5” or 3.5” storage
Up to 10x NVMe hybrid storage supported
(optional)
X13SEW-F (WIO) SYS-521E-WR
1U UP WIO 1U UP WIO 2U UP WIO
SYS-511E-WR SYS-111E-WR SYS-521E-WR

4x 3.5” SATA/SAS and 3 PCIe 5.0 slots 10x 2.5” SATA/SAS/NVMe with 3 PCIe 5.0 slots 8x 3.5” SATA/SAS/NVMe with 4 PCIe 5.0 slots
Wide-Ranging Flexibility for any Enterprise Workload Key Applications

• Enterprise Applications
Supermicro WIO systems offer a wide range of I/O options to deliver truly optimized • Networking Appliance
systems for specific requirements. Users can optimize the storage and networking • Firewall/Security Appliances
alternatives to accelerate performance, increase efficiency and find the perfect fit for • General Purpose Computing
their applications. • Cloud Computing
• Media Entertainment
In addition to enabling customizable configurations and optimization for multiple
application requirements, Supermicro WIO SuperServers® also provide attractive cost
advantages and investment protection.

X13 SuperEdge
High-Density Computing and Flexibility at the Intelligent Edge
2U Short-depth (430mm), 3-node system 2U 3-Node SuperEdge

Single 4th Gen Intel® Xeon® Scalable processor
per node
Front-access hot-swappable nodes
Up to 8 DIMMs slots per node supporting
DDR5-4800 and Intel® Optane™ Persistent
Memory 300 Series
Up to 3 PCIe 5.0 slots per node
Operating temperatures from -5ºC to 55ºC
(CPU TDP-dependent)
SYS-211SE-31D
Redundant AC power Redundant DC power
SYS-211SE-31A SYS-211SE-31D
SYS-211SE-31AS SYS-211SE-31DS
RJ45 or SFP management port options RJ45 or SFP management port options
Data Center-Class Performance and Expandability at the Edge Key Applications

• 5G Open RAN/Flex-RAN
Supermicro’s SuperEdge is designed to handle increasing compute and I/O density • C-RAN (vRAN)
requirements of modern edge applications. With 3 customizable single-processor • Telecom/Networking Appliance
nodes, SuperEdge delivers high-class performance in a 2U, short-depth form factor.
• Multi-Access Edge Computing
Each node is hot-swappable and offers front access I/O, making the system ideal for
• Edge Data Center
remote IoT, Edge, or Telco deployments.
• Enterprise Edge Computing
Each node can accommodate three PCIe 5.0 slots, enabling a wide range of add-on
cards that allow the SuperEdge to be outfitted for networking, FPGA, DPU, eASIC, and
TimeSync Options.
The SuperEdge features an optimized airflow, providing an operating temperate
range of -5ºC to 55ºC. Combined with the ability to withstand a wide range of humidity
and other environmental conditions, this allows the server to be deployed in harsh
conditions outside of a traditional data center.

X13 5G/Edge
Compact and short-depth rackmount systems for telco Edge deployments
High-density processing power in compact form

factors suitable for Edge deployments
Flexible I/O with up to 3 PCIe 5.0 slots in 1U
or 4 slots in 2U
Both AC and DC power configurations available
with redundant power supplies
Enhanced operating temperatures from -5ºC to
55ºC (CPU TDP-dependent)
SYS-211E-FRDN2T
1U UP short-depth server with front I/O 2U UP compact OpenRAN server
SYS-111E-FWTR SYS-211E-FRN2T
SYS-111E-FDWTR SYS-211E-FRDN2T
2x 2.5” internal SATA 2x 2.5” hot-swap NVMe
AC/DC power supply options AC/DC power supply options
Expanding our Product Portfolio to address 5G, Edge Computing Key Applications
and Emerging IoT Systems • Multi-Access Edge Computing
• Flex-RAN/Open RAN
Supermicro provides innovative and first-to-market technologies that are the • Edge AI Outdoor 5G
building blocks for today’s embedded computing platforms. Rapid growth in
embedded markets and open standards are driving the need for higher levels of
product integration and optimization through virtualization, AI inferencing, network
connectivity, remote management, mobile communication, expanded I/O, and
device-to-device communications using space and power efficient configurations.
Supermicro’s family of high-performance embedded products are optimized for
a wide range of applications and solutions. Supermicro offers many flexible and
customized solutions for critical OEM projects, as well as advanced designs for
stringent environments, firmware customization, BOM enhancements, and a wide
range of legacy IO support.

X13 Multi-Processor Systems
Highest Performance and Flexibility for Enterprise Applications
2U 4-Way Compute-Optimized Hyper

4- and 8-way systems with 4th Gen Intel®
Xeon® Scalable processors
Next-generation PCIe 5.0 for GPU/
accelerator and high-speed network
interface cards
Compute and hybrid storage-optimized
configurations
Large memory footprint with up 64 DIMMs
in 2U and 128 DIMMs in 8U supporting
DDR5-4800MHz and Intel® Optane™
Persistent Memory 300 Series
SYS-241H-TNRTTP
2U 4-way Compute-Optimized Hyper 2U 4-way Storage-Optimized Hyper 6U 8-way GPU-Optimized
SYS-241H-TNRTTP SYS-241E-TNRTTP SYS-681E-TR

64 DIMM/12 PCIe 5.0 (7 x16 + 5 x8)/8 NVMe hybrid 64 DIMM/8 PCIe 5.0 (54 x16 + 3 x8)/24 NVMe hybrid 128 DIMM/26 PCIe 5.0 x16/24 NVMe hybrid
Maximum Configurability and Scalability Key Applications

• Artificial Intelligence (AI)
X13 multi-processor systems bring new levels of compute performance and flexibility • Business Intelligence
with support for 4th Gen Intel® Xeon® Scalable processors to support mission-critical • ERP
enterprise workloads.
• CRM
A large memory footprint is ideal for large database and in-memory compute • Scientific Virtualization
applications, with support for Intel® Optane™ persistent memory to enable even • In-Memory Database
the most memory-intensive applications. Dynamic storage options support direct- • HCI
attached full-hybrid all NVMe for lower latency with higher throughput and IOPS • SAP HANA
and up to 24x 2.5” hybrid NVMe/SAS3/SATA3 drive bays in a 2U chassis. Flexible
networking is available via an AIOM slot supporting OCP 3.0 NIC devices.

X13 Universal GPU
8U 8U Front IO
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SYS-821GE-TNHR SYS-821GE-FTNHR
4th Gen Intel® Xeon® Scalable processors 4th Gen Intel® Xeon® Scalable processors
Processor Support Dual Socket LGA-4677 (Socket E) supported Dual Socket LGA-4677 (Socket E) supported
TDP up to 350W TDP up to 350W
• Finance & Economics • Finance & Economics
• Climate and Weather Modeling • Climate and Weather Modeling
• Drug Discovery • Drug Discovery
• Business Intelligence & Analytics • Business Intelligence & Analytics
Key Applications • Conversational AI • Conversational AI
• Healthcare • Healthcare
• Industrial Automation, Retail • Industrial Automation, Retail
• AI/Deep Learning Training • AI/Deep Learning Training
• High Performance Computing • High Performance Computing
• Highest GPU communication using NVIDIA® NVLINK™ + NVIDIA® • Highest GPU communication using NVIDIA® NVLINK™ + NVIDIA®
NVSwitch™ NVSwitch™
Outstanding • High density 8U system with NVIDIA® HGX™ H100 8-GPU • High density 8U system with NVIDIA® HGX™ H100 8-GPU
Features • 8 NVMe for GPU direct storage • 8 NVMe for GPU direct storage
• 8 NIC for GPU direct RDMA (1:1 GPU Ratio) • 8 NIC for GPU direct RDMA (1:1 GPU Ratio)
• 2 M.2 NVMe for boot drive only • 2 M.2 NVMe for boot drive only
Serverboard SUPER ® X13DEG-OAD SUPER ® X13DEG-OAD
Chipset Intel® C741 Intel® C741
System Memory 32 DIMM slots 32 DIMM slots

(Max.) UP to 8TB: 32x 256GB DRAM UP to 8TB: 32x 256GB DRAM
Expansion Slots 8 PCIe 5.0 x16 LP, 2 FHFL PCIe 5.0 x16 Slots 8 PCIe 5.0 x16 LP, 2 FHFL PCIe 5.0 x16 Slots
Onboard Storage
Intel® SATA Intel® SATA
Controller
2x 10GbE RJ45 with Intel® X550-AT2 (optional) 2x 10GbE RJ45 with Intel® X550-AT2 (optional)
Connectivity 2x 10GbE RJ45 with Intel® X710-AT2 (optional) 2x 10GbE RJ45 with Intel® X710-AT2 (optional)
2x 25GbE SFP28 with Broadcom® BCM57414 (optional) 2x 25GbE SFP28 with Broadcom® BCM57414 (optional)
VGA/Audio 1 VGA port 1 VGA port
Intel® Node Manager; IPMI 2.0; KVM with dedicated LAN; NMI; OOB Intel® Node Manager; IPMI 2.0; KVM with dedicated LAN; NMI; OOB
Management Management Package (SFT-OOB-LIC ); Redfish API; SPM; SSM; SUM; Management Package (SFT-OOB-LIC ); Redfish API; SPM; SSM; SUM;
SuperDoctor® 5; Watch Dog SuperDoctor® 5; Watch Dog
20x 2.5” hot-swap NVMe/SATA drive bays; 8x 2.5” NVMe dedicated; 20x 2.5” hot-swap NVMe/SATA drive bays; 8x 2.5” NVMe dedicated;
Drive Bays
Peripheral Bays None None
Power Supply 6x 3000W (3+3) Redundant Power Supplies, Titanium Level 6x 3000W (3+3) Redundant Power Supplies, Titanium Level
Cooling System 10 heavy duty fan(s) 10 heavy duty fan(s)
8U Rackmount 8U Rackmount
Enclosure: 437 x 355.6 x 843.28mm (17.2” x 14” x 33.2”) Enclosure: 437 x 355.6 x 843.28mm (17.2” x 14” x 33.2”)
Form Factor
Package: 698 x 750 x 1300mm (27.5” x 29.5” x 51.2”) Package: 698 x 750 x 1300mm (27.5” x 29.5” x 51.2”)

X13 Universal GPU
5U 4U
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SYS-521GU-TNXR SYS-421GU-TNXR
Key Applications
• Highest GPU communication using NVIDIA® NVLINK™
• Highest GPU communication using NVIDIA® NVLINK™
Outstanding • High density 4U Universal GPU system with NVIDIA® HGX™ H100
Features • High density 5U Universal GPU system with NVIDIA® HGX™ H100 4-GPU
4-GPU
• 8 NIC for GPU direct RDMA (1:1 GPU Ratio)
Serverboard SUPER ® X13DGU SUPER ® X13DGU

Expansion Slots 10 PCIe 5.0 X16 LP Slots 8 PCIe 5.0 X16 LP Slots
Onboard Storage
Controller
Connectivity 2x 10GbE RJ45 port(s) with Intel® Ethernet Controller X710-AT2 2x 10GbE RJ45 port(s) with Intel® Ethernet Controller X710-AT2
10x 2.5” hot-swap NVMe/SATA drive bays; 10x 2.5” NVMe hybrid; 6x 2.5” hot-swap NVMe/SATA drive bays; 6x 2.5” NVMe hybrid;
Drive Bays
Power Supply Redundant 3000W Titanium level (96%) Redundant 3000W Titanium level (96%)
5U Rackmount
4U Rackmount
Enclosure: 449 x 222.5 x 833mm (17.67” x 8.75” x 32.79”)
Form Factor Enclosure: 449 x 175.6 x 833mm (17.67” x 7.0” x 32.79”)
Package: 700 x 370 x 1260mm (27.55” x 14.57” x 49.6”)
Package: 700 x 370 x 1260mm (27.55” x 14.57” x 49.6”)

X13 PCIe GPU
10 PCIe GPUs 8 PCIe GPUs
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SYS-421GE-TNRT SYS-421GE-TNRT3
• Diagnostic Imaging • Diagnostic Imaging
• 3D Rendering • 3D Rendering
• Design & Visualization • Design & Visualization
• Animation and Modeling • Animation and Modeling
Key Applications • Cloud Gaming • Cloud Gaming
• Media/Video Streaming • Media/Video Streaming
• VDI • VDI
• Flexible networking options
Outstanding Features • 8 NVMe for GPU direct storage
• 2 M.2 NVMe for boot drive only
Serverboard SUPER ® X13DEG-OA SUPER ® X13DEG-OA

Expansion Slots 13 PCIe 5.0 X16 Slots 8 PCIe 5.0 X16 Slots
Onboard Storage
Controller
24x 2.5” hot-swap NVMe/SATA/SAS drive bays; 8x 2.5” NVMe hybrid; 8x 24x 2.5” hot-swap NVMe/SATA/SAS drive bays; 4x 2.5” NVMe hybrid; 4x
Drive Bays 2.5” NVMe dedicated; 2.5” NVMe dedicated;
Enclosure: 437 x 178 x 737mm (17.2” x 7” x 29”) Enclosure: 437 x 178 x 737mm (17.2” x 7” x 29”)
Form Factor
Package: (27” x 26.57” x 41”) Package: (27” x 26.57” x 41”)

5U
X13 PCIe GPU 4U Tower
10 PCIe GPUs 4 PCIe GPUs
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SYS-521GE-TNRT SYS-741GE-TNRT
• AI Training
• Diagnostic Imaging
• Diagnostic Imaging
• 3D Rendering
• 3D Rendering
• Animation and Modeling
• Animation and Modeling
Key Applications • Cloud Gaming
• Cloud Gaming
• Media/Video Streaming
• Media/Video Streaming
• VDI
• VDI
• Workstation or 4U Rackmountable System
Outstanding • Performance Anywhere
• 8 NVMe for GPU direct storage
Features • Innovate Faster
• Flexible Solution
Serverboard SUPER ® X13DEG-OA SUPER ® X13DEG-QT

Expansion Slots 13 PCIe 5.0 X16 Slots 7 PCIe 5.0 X16 FHFL Slots
Onboard Storage
Controller
24x 2.5” hot-swap NVMe/SATA/SAS drive bays; 8x 2.5” NVMe hybrid; 8x 8x 3.5” hot-swap NVMe/SATA/SAS drive bays; 8x 2.5” NVMe hybrid;
Drive Bays 2.5” NVMe dedicated;
5U Rackmount
TowerEnclosure: 437 x 178 x 737mm (17.2” x 7” x 29”)
Enclosure: 437 x 222.5 x 737mm (17.2” x 8.75” x 29”)
Form Factor Package: 330.2 x 685.8 x 965.2mm (13” x 27” x 38”)
Package: (27” x 26.57” x 41”)

X13 SuperEdge
Redundant AC power Redundant AC power Redundant DC power Redundant DC power
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SYS-211SE-31A SYS-211SE-31AS SYS-211SE-31D SYS-211SE-31DS
4th Gen Intel® Xeon® Scalable 4th Gen Intel® Xeon® Scalable 4th Gen Intel® Xeon® Scalable 4th Gen Intel® Xeon® Scalable
processors processors processors processors
Processor Support Single Socket LGA-4677 (Socket E) Single Socket LGA-4677 (Socket E) Single Socket LGA-4677 (Socket E) Single Socket LGA-4677 (Socket E)
supported supported supported supported
TDP up to 300W TDP up to 300W TDP up to 300W TDP up to 300W
• Enterprise Edge Computing • Enterprise Edge Computing • Enterprise Edge Computing • Enterprise Edge Computing
• Telecom DRAN, CRAN, and Edge • Telecom DRAN, CRAN, and Edge • Telecom DRAN, CRAN, and Edge • Telecom DRAN, CRAN, and Edge
Key Applications Core Application Core Application Core Application Core Application
• Flex-RAN, Open-RAN vBBU • Flex-RAN, Open-RAN vBBU • Flex-RAN, Open-RAN vBBU • Flex-RAN, Open-RAN vBBU
• Multi-Access Edge Computing • Multi-Access Edge Computing • Multi-Access Edge Computing • Multi-Access Edge Computing
• Three front hot-swappable nodes • Three front hot-swappable nodes • Three front hot-swappable nodes • Three front hot-swappable nodes
with single CPU socket and 8 with single CPU socket and 8 with single CPU socket and 8 with single CPU socket and 8
Outstanding DIMM design DIMM design DIMM design DIMM design
Features • Front access IO design, and tool • Front access IO design, and tool • Front access IO design, and tool • Front access IO design, and tool
less serviceability less serviceability less serviceability less serviceability
• 16.9” (430mm) chassis depth • 16.9” (430mm) chassis depth • 16.9” (430mm) chassis depth • 16.9” (430mm) chassis depth
Serverboard SUPER ® X13SEED-F SUPER ® X13SEED-SF SUPER ® X13SEED-F SUPER ® X13SEED-SF
Chipset Intel® C741 Intel® C741 Intel® C741 Intel® C741
8 DIMM slots 8 DIMM slots 8 DIMM slots 8 DIMM slots

System Memory
UP to 2TB: DDR5 ECC RDIMM/ UP to 2TB: DDR5 ECC RDIMM/ UP to 2TB: DDR5 ECC RDIMM/ UP to 2TB: DDR5 ECC RDIMM/
(Max.)
RDIMM RDIMM RDIMM RDIMM
Expansion Slots 2 PCIe 5.0 x16 FHHL, PCIe 5.0 x16 LP 2 PCIe 5.0 x16 FHHL, PCIe 5.0 x16 LP 2 PCIe 5.0 x16 FHHL, PCIe 5.0 x16 LP 2 PCIe 5.0 x16 FHHL, PCIe 5.0 x16 LP
Onboard Storage
Intel® SATA Intel® SATA Intel® SATA Intel® SATA
Controller
Connectivity 1x 1GbE RJ45 port(s) 1x 1GbE SFP port(s) 1x 1GbE RJ45 port(s) 1x 1GbE SFP port(s)
VGA/Audio 1 VGA port 1 VGA port 1 VGA port 1 VGA port
Management IPMI 2.0; SuperDoctor® 5 IPMI 2.0; SuperDoctor® 5 IPMI 2.0; SuperDoctor® 5 IPMI 2.0; SuperDoctor® 5
Drive Bays N/A N/A N/A N/A
Peripheral Bays None None None None
Power Supply 2000W AC Redundant PSU 2000W AC Redundant PSU 2000W DC Redundant PSU 2000W DC Redundant PSU
Cooling System 4 heavy duty fan(s) 4 heavy duty fan(s) 4 heavy duty fan(s) 4 heavy duty fan(s)
2U Rackmount 2U Rackmount 2U Rackmount 2U Rackmount

Enclosure: 449 x 88 x 430mm (17.7” Enclosure: 449 x 88 x 430mm (17.7” Enclosure: 449 x 88 x 430mm (17.7” Enclosure: 449 x 88 x 430mm (17.7”
x 3.5” x 16.9”) x 3.5” x 16.9”) x 3.5” x 16.9”) x 3.5” x 16.9”)
Form Factor
Package: 750 x 240 x 590mm (29.5” Package: 750 x 240 x 590mm (29.5” Package: 750 x 240 x 590mm (29.5” Package: 750 x 240 x 590mm (29.5”
x 9.5” x 23.2”) x 9.5” x 23.2”) x 9.5” x 23.2”) x 9.5” x 23.2”)

X13 5G/Edge
1U UP short-depth server 1U UP short-depth server 2U UP compact 2U UP compact
with front I/O with front I/O OpenRAN server OpenRAN server
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SYS-111E-FWTR SYS-111E-FDWTR SYS-211E-FRN2T SYS-211E-FRDN2T
4th Gen Intel® Xeon® Scalable 4th Gen Intel® Xeon® Scalable
4th Gen Intel® Xeon® Scalable 4th Gen Intel® Xeon® Scalable
processors processors
processors processors
Processor Support Single Socket LGA-4677 (Socket E) Single Socket LGA-4677 (Socket E)
Single Socket LGA-4677 (Socket E) Single Socket LGA-4677 (Socket E)
supported supported
supported supported
•
Machine Learning (ML) • Machine Learning (ML) • Cloud Computing • Cloud Computing
•
Artificial Intelligence (AI) on Edge • Artificial Intelligence (AI) on Edge • Network Function Virtualization • Network Function Virtualization
Key Applications •
Flex-RAN, Open-RAN vBBU • Flex-RAN, Open-RAN vBBU • AI Inference and Machine • AI Inference and Machine
•
Outdoor DU of 5G Application • Outdoor DU of 5G Application Learning Learning
•
Multi-Access Edge Computing • Multi-Access Edge Computing • 5G Core and Edge • 5G Core and Edge
•
Redundant Power Supplies
Design
• Front access IO design, 16.9”
• Redundant Power Supplies
(430mm) chassis depth
Design
• 5G Telecom, Flex-RAN, Open-
• Front access IO design, 16.9” • Design with compliance to NEBS- • Design with compliance to NEBS-
Outstanding Features RAN OptimizedRedundant Power
(430mm) chassis depth Level 3 Level 3
Supplies Design
• 5G Telecom, Flex-RAN, Open-RAN
• Front access IO design, 16.9”
Optimized
(430mm) chassis depth
• 5G Telecom, Flex-RAN, Open-RAN
Optimized
Serverboard SUPER ® X13SEW-TF SUPER ® X13SEW-TF SUPER ® X13SEM-TF SUPER ® X13SEM-TF
Chipset Intel® C741 Intel® C741 Intel® C741 Intel® C741
8 DIMM slots 8 DIMM slots
UP to 2TB: DDR5 ECC RDIMM/ UP to 2TB: DDR5 ECC RDIMM/
RDIMM RDIMM
2x PCIe 5.0 x16 FHHL, 1x PCIe 5.0 2x PCIe 5.0 x16 FHHL, 1x PCIe 5.0
Expansion Slots 2 PCIe 5.0 x16 FHFL, PCIe 5.0 x16 LP 2 PCIe 5.0 x16 FHFL, PCIe 5.0 x16 LP
x16 HHHL, 1x PCIe 5.0 x8 HHHL x16 HHHL, 1x PCIe 5.0 x8 HHHL
Onboard Storage
Intel® SATA Intel® SATA Intel® SATA Intel® SATA
Controller
2x 100GbE QSFP28 with Intel® E810- 2x 100GbE QSFP28 with Intel® E810-
CAM2 (optional) CAM2 (optional)
2x 10GbE SFP+ with Intel® X710-BM2 2x 10GbE SFP+ with Intel® X710-BM2
(optional) (optional)
2x 200GbE QSFP56 with Mellanox® 2x 200GbE QSFP56 with Mellanox®
MT28908A0-XCCF-HVM (optional) MT28908A0-XCCF-HVM (optional)
Connectivity 2x 10GbE port(s) 2x 10GbE port(s) 2x 25GbE QSFP28 with Intel® E810-CAM1 2x 25GbE QSFP28 with Intel® E810-CAM1
2x 25GbE QSFP28 with Intel® XXV710 2x 25GbE QSFP28 with Intel® XXV710
2x 40GbE QSFP+ with Intel® XL710-BM2 2x 40GbE QSFP+ with Intel® XL710-BM2
4x 1GbE RJ45 with Intel® i350 (optional) 4x 1GbE RJ45 with Intel® i350 (optional)
VGA/Audio 1 VGA port 1 VGA port 1 VGA port 1 VGA port
Intel® Node Manager; IPMI 2.0; KVM Intel® Node Manager; IPMI 2.0; KVM
with dedicated LAN; NMI; Redfish with dedicated LAN; NMI; Redfish
Management IPMI 2.0 IPMI 2.0
API; SPM; SSM; SUM; SuperDoctor® API; SPM; SSM; SUM; SuperDoctor®
5; Watch Dog 5; Watch Dog
2x 2.5” SATA drive bays; 2x 2.5” SATA drive bays; 2x 2.5” hot-swap NVMe drive bays; 2x 2.5” hot-swap NVMe drive bays;
Drive Bays
Peripheral Bays None None None None
Redundant 800W AC 100-240Vac
Power Supply 800W AC Redundant PSU 600W DC Redundant PSU 2x 600W -48Vdc single output
input, Platinum level
Cooling System 4 heavy duty fan(s) 4 heavy duty fan(s) 4 heavy duty fan(s) 4 heavy duty fan(s)
1U Rackmount 1U Rackmount 2U Rackmount 2U Rackmount
Enclosure: 436.88 x 44.5 x 429.3mm Enclosure: 437 x 43 x 429mm (17.2” x Enclosure: 436.88 x 88.9 x 298.8mm Enclosure: 436.88 x 88.9 x 298.8mm
(17.2” x 1.7” x 16.9”) 1.7” x 16.9”) (17.2” x 3.5” x 11.8”) (17.2” x 3.5” x 11.8”)
Form Factor
Package: 685 x 203 x 609mm (27” x Package: 686 x 203 x 610mm (27” x Package: 490 x 188 x 590mm (19.3” Package: 490 x 188 x 590mm (19.3”
8” x 24”) 8” x 24”) x 7.4” x 23.3”) x 7.4” x 23.3”)

X13 SuperBlade®
8U 6U
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
Enclosure SBE-820 Series SBE-610 Series
• Up to 20 hot-swappable, half-height, single-width blade servers

• Up to 10 hot-swappable, single-width blade servers
• Up to 10 hot-swappable, half-height, double-width blade servers
Processor Blade • Up to 5 hot-swappable, double-width blade servers
• Up to 10 hot-swappable, full-height, single-width blade servers
• Mixed configuration supported
• Mixed configuration supported
LED Indicator • Power LED, Fault LED • Power LED, Fault LED
• SBE-820H only:
• Single 200G HDR InfiniBand switch
Infiniband Switch N/A
• SBE-820C only:
• Single 100G EDR InfiniBand switch
• SBE-820C/H only:
Up to 2 hot-swappable 25G Ethernet switches
Ethernet Switch / • SBE-820J/J2 only: • Up to 4 hot-swappable 25G Ethernet switches, 10G Ethernet
Pass-Thru Module Up to 4 hot-swappable 25G Ethernet switches or pass-thru modules switches or pass-thru modules
• SBE-820L only:
Up to 2 hot-swappable 10G Ethernet switches or pass-thru modules
• Single/Redundant CMM for remote system management with
Chassis software • Up to 2 hot-swappable CMMs for remote system management with
Management
• SBE-820J/J2 only: Up to 2 hot-swappable CMMs for remote system software
Module (CMM)
management with software
• SBE-820C/J/J2/L/H-822:
• SBE-610J/610J2-822:
Up to 8 hot-swappable 2200W Titanium (96% efficiency) power
supplies
supplies
• SBE-820J2-830:
Models • SBE-610J2-830:
Up to 8 hot-swappable 3000W Titanium (96% efficiency)
supplies
• SBE-610J2-830(D):
• SBE-820J2-830(D):
Up to 8 hot-swappable 3000W DC power supplies
Up to 8 hot-swappable 3000W DC power supplies
Rack Unit 8 RU 6 RU
Form Factor 356 x 447 x 813mm (14” x 17.6” x 32”) 267 x 447 x 813mm (10.5” x 17.6” x 32”)

X13 SuperBlade®
8U SuperBlade® X13 Servers 8U SuperBlade® X13 Servers 6U SuperBlade® X13 Servers 6U SuperBlade® X13 Servers
Dual 4th Gen Intel® Xeon® Dual 4th Gen Intel® Xeon® Single 4th Gen Intel® Xeon® Single 4th Gen Intel® Xeon®
Scalable Processors Scalable Processors Scalable Processor Scalable Processor
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SBI-421E-1T3N SBI-421E-5T3N SBI-611E-1T2N SBI-611E-5T2N
Server Nodes/
20 10 10 5
Enclosure
Dual 4th Generation Intel® Xeon® Dual 4th Generation Intel® Xeon® Dual 4th Generation Intel® Xeon® Dual 4th Generation Intel® Xeon®
Processor Support Scalable Processors (Up to 350W Scalable Processors (Up to 350W Scalable Processors (Up to 350W Scalable Processors (Up to 350W
TDP) TDP) TDP) TDP)
Chipset Intel® C741 chipset Intel® C741 chipset Intel® C741 chipset Intel® C741 chipset
Up to 4TB; 16 DDR5 DIMM slots,

System Memory Up to 4TB; 16 DDR5 DIMM slots, Up to 4TB; 16 DDR5 DIMM slots, Up to 4TB; 16 DDR5 DIMM slots,
1DPC speeds up to 4800 MT/s or
(Max.) 1DPC speeds up to 4800 MT/s 1DPC speeds up to 4800 MT/s 1DPC speeds up to 4800 MT/s
2DPC speeds up to 4400 MT/s
1 PCIe 5.0 x16 slot Up to 2 PCIe 5.0 x16 slot

PCIe Expansion OCP 3.0 (PCIe 5.0 x16) OCP 3.0 (PCIe 5.0 x16)
1 PCIe 5.0 x8 slot Up to 2 PCIe 5.0 x8 slot
4 M.2 NVMe with optional

4 M.2 NVMe with optional
Mezzanine Card 2 Hot-swappable U.2 NVMe/ 2 Hot-swappable U.2 NVMe/
Mezzanine Card
1 M.2 NVMe drive SATA3 drive bays SATA3 drive bays
1 M.2 NVMe drive
Storage & RAID 2 Hot-plug U.2 NVMe/SATA3 drive 3 M.2 NVMe drives 3 M.2 NVMe drives
2 Hot-swappable U.2 NVMe/
bays & 1 Hot-plug SATA3 drive 2 E1.S drives 2 E1.S drives
SATA3 and 1 SATA3
bay; RAID 0, 1 (VROC) Intel® PCH 3.0 SATA Controller Intel® PCH 3.0 SATA Controller
Intel® PCH 3.0 SATA Controller
Intel® PCH 3.0 SATA Controller
OCP 3.0 network card with 400G OCP 3.0 network card with 400G
NDR IB and other options NDR IB and other options Standard IB or GbE PCIe cards Standard IB or GbE PCIe cards
Networking Mezzanine options for 200G HDR Mezzanine options for 200G HDR Mezzanine option for Dual 25GbE Mezzanine option for Dual 25GbE
/ 100G EDR IB or Dual 25GbE / 100G EDR IB or Dual 25GbE Dual 25GbE LOM Dual 25GbE LOM
Dual 25GbE LOM Dual 25GbE LOM
Open Industry Standard IPMI 2.0 Open Industry Standard IPMI 2.0 Open Industry Standard IPMI 2.0 Open Industry Standard IPMI 2.0
/ KVM over IP / Redfish API / TPM / KVM over IP / Redfish API / TPM / KVM over IP / Redfish API / TPM / KVM over IP / Redfish API / TPM
Management
2.0 / Signed Firmware / HW Root 2.0 / Signed Firmware / HW Root 2.0 / Signed Firmware / HW Root 2.0 / Signed Firmware / HW Root
of Trust of Trust of Trust of Trust
Fault LED, Network Activity LED, Fault LED, Network Activity LED, Fault LED, Network Activity LED, Fault LED, Network Activity LED,
LED Indicators
Power LED, UID Power LED, UID Power LED, UID Power LED, UID
165 x 44.4 x 597mm 165 x 88.9 x 597mm 248 x 44.4 597mm 248 x 88.9 x 597mm
Form Factor
(6.5” x 1.75” x 23.5”) (6.5” x 3.5” x 23.5”) (9.75” x 1.75” x 23.5”) (9.75” x 3.5” x 23.5”)
SBE-820C/J/L-422
SBE-610J-422/622/822
Enclosure SBE-820H/C/J/L-622/822 SBE-820J2-630/830 SBE-610J2-430/630/830
SBE-610J2-430/630/830
SBE-820J2-630/830

X13 SuperBlade®
6U SuperBlade® X13 Servers 6U SuperBlade® X13 Servers 6U SuperBlade® X13 Servers 6U SuperBlade® X13 Servers
Single 4th Gen Intel® Xeon® Scalable Dual 4th Gen Intel® Xeon® Scalable Dual 4th Gen Intel® Xeon® Scalable Dual 4th Gen Intel® Xeon® Scalable
Processor Processors Processors Processors
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SBI-611E-1C2N SBI-621E-1T3N SBI-621E-5T3N SBI-621E-1C3N
Server Nodes/
10 10 5 10
Enclosure
Dual 4th Generation Intel® Xeon® Dual 4th Generation Intel® Xeon® Dual 4th Generation Intel® Xeon® Dual 4th Generation Intel® Xeon®
Processor Scalable Processors (Up to 350W Scalable Processors (Up to 350W Scalable Processors (Up to 350W Scalable Processors (Up to 350W
TDP) TDP) TDP) TDP)
Chipset Intel® C741 chipset Intel® C741 chipset Intel® C741 chipset Intel® C741 chipset
Up to 4TB; 16 DDR5 DIMM slots, Up to 4TB; 16 DDR5 DIMM slots,

System Memory Up to 4TB; 16 DDR5 DIMM slots, Up to 4TB; 16 DDR5 DIMM slots,
1DPC speeds up to 4800 MT/s or 1DPC speeds up to 4800 MT/s or
(Max.) 1DPC speeds up to 4800 MT/s 1DPC speeds up to 4800 MT/s
2DPC speeds up to 4400 MT/s 2DPC speeds up to 4400 MT/s
1 PCIe 5.0 x16 slot

PCIe Expansion N/A N/A N/A
1 PCIe 5.0 x8 slot
2 Hot-swappable U.2 NVMe/SAS/

3 Hot-plug U.2 NVMe/SATA drive 3 Hot-plug U.2 NVMe/SATA drive 2 Hot-plug U.2 NVMe/SAS/SATA
SATA3
Storage & RAID bays bays drive bays & 1 Hot-Plug SAS drive
1 M.2 NVMe drive
Intel® PCH 3.0 SATA Controller Intel® PCH 3.0 SATA Controller bay; HW RAID w/ 3108
Broadcom 3108 HW RAID
Standard IB or GbE PCIe cards

Mezzanine option for Dual 25GbE Mezzanine option for Dual 25GbE Mezzanine option for Dual 25GbE
Networking Mezzanine option for Dual 25GbE
Dual 25GbE LOM Dual 25GbE LOM Dual 25GbE LOM
Dual 25GbE LOM
Redundant Chassis Management Redundant Chassis Management Redundant Chassis Management Redundant Chassis Management
Modules, Open Industry Standard Modules, Open Industry Standard Modules, Open Industry Standard Modules, Open Industry Standard
Management IPMI 2.0 / KVM over IP / Redfish IPMI 2.0 / KVM over IP / Redfish IPMI 2.0 / KVM over IP / Redfish IPMI 2.0 / KVM over IP / Redfish
API / TPM 2.0 / Signed Firmware / API / TPM 2.0 / Signed Firmware / API / TPM 2.0 / Signed Firmware / API / TPM 2.0 / Signed Firmware /
HW Root of Trust HW Root of Trust HW Root of Trust HW Root of Trust
Fault LED, Network Activity LED, Fault LED, Network Activity LED, Fault LED, Network Activity LED, Fault LED, Network Activity LED,
LED Indicators
Power LED, UID Power LED, UID Power LED, UID Power LED, UID
248 x 44.4 x 597mm 248 x 44.4 x 597mm 248 x 88.9 x 596.9mm 248 x 44.4 x 597mm
Form Factor
(9.75” x 1.75” x 23.5”) (9.75” x 1.75” x 23.5”) (9.75” x 3.5” x 23.5”) (9.75” x 1.75” x 23.5”)
SBE-610J-422/622/822 SBE-610J-422/622/822 SBE-610J-422/622/822

Enclosure SBE-610J2-430/630/830
SBE-610J2-430/630/830 SBE-610J2-430/630/830 SBE-610J2-430/630/830

X13 GrandTwin™
2U 4-Node Front I/O 2U 4-Node Front I/O
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SYS-211GT-HNTF SYS-211GT-HNC8F
Processor Support Single Socket LGA 4677 (Socket E) supported Single Socket LGA 4677 (Socket E) supported
• HPC • HPC
• Mission Critical Web Applications • Mission Critical Web Applications
• EDA (Electric Design Automation) • EDA (Electric Design Automation)
• Telco Edge Cloud • Telco Edge Cloud
Key Applications
• High-availability Cache Cluster • High-availability Cache Cluster
• Multi-Purpose CDN • Multi-Purpose CDN
• MEC (Multi-Access Edge Computing) • MEC (Multi-Access Edge Computing)
• Cloud Gaming • Cloud Gaming
• Single processor with 16 DIMM
• SAS controller built-in
Outstanding • Front I/O design
• Front I/O design
Features • Four front access hot-swappable node in 2U
• Four front access hot-swappable node in 2U
• Flexible storage selection
• Flexible storage selection
Serverboard SUPER ® X13SET-G SUPER ® X13SET-GC

Expansion Slots 2 PCIe 5.0 x16 AIOM slot(s) 2 PCIe 5.0 x16 AIOM slot(s)
Onboard Storage
Intel® SATA Broadcom® Broadcom® 3808
Controller
Connectivity via AIOM via AIOM
SuperCloud Composer; SuperDoctor® 5 (SD5); Supermicro Diagnostics SuperCloud Composer; SuperDoctor® 5 (SD5); Supermicro Diagnostics
Offline (SDO); Supermicro Intelligent Mgmt (BMC Resources); Offline (SDO); Supermicro Intelligent Mgmt (BMC Resources);
Supermicro IPMI Utilities; Supermicro Power Manager (SPM); Supermicro Supermicro IPMI Utilities; Supermicro Power Manager (SPM); Supermicro
Management
Server Manager (SSM); Supermicro Server Mgmt (Redfish® API); Server Manager (SSM); Supermicro Server Mgmt (Redfish® API);
Supermicro Thin-Agent Service (TAS); Supermicro Update Manager Supermicro Thin-Agent Service (TAS); Supermicro Update Manager
(SUM) (SUM)
4x 2.5” hot-swap NVMe/SATA drive bays; 4x 2.5” NVMe dedicated; 4x 2.5” hot-swap NVMe/SATA/SAS drive bays; 4x 2.5” NVMe dedicated;
Drive Bays Optional RAID support via Intel® PCH Optional RAID support via Broadcom® 3808 AOC
Cooling System 2x 8cm heavy duty fan(s) 2x 8cm heavy duty fan(s)
Enclosure: 449 x 88 x 711.2mm (17.67” x 3.46” x 28”) Enclosure: 449 x 88 x 711.2mm (17.67” x 3.46” x 28”)
Form Factor

X13 GrandTwin™
2U 4-Node Rear I/O 2U 4-Node Rear I/O
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SYS-211GT-HNTR SYS-211GT-HNC8R
Processor Support Single Socket LGA 4677 (Socket E) supported Single Socket LGA 4677 (Socket E) supported
• HPC • HPC
• Mission Critical Web Applications • Mission Critical Web Applications
• EDA (Electric Design Automation) • EDA (Electric Design Automation)
• Telco Edge Cloud • Telco Edge Cloud
Key Applications
• High-availability Cache Cluster • High-availability Cache Cluster
• Multi-Purpose CDN • Multi-Purpose CDN
• MEC (Multi-Access Edge Computing) • MEC (Multi-Access Edge Computing)
• Cloud Gaming • Cloud Gaming
• SAS controller built-in
Outstanding Features • Four front access hot-swappable node in 2U
• Four front access hot-swappable node in 2U
• 6x NVMe/SATA drives per node
• 6x NVMe/SAS/SATA drives per node
Serverboard SUPER ® X13SET-G SUPER ® X13SET-GC

Expansion Slots 2 PCIe 5.0 x16 AIOM slot(s) 2 PCIe 5.0 x16 AIOM slot(s)
Onboard Storage
Intel® SATA Broadcom® Broadcom® 3808
Controller
SuperCloud Composer; SuperDoctor® 5 (SD5); Supermicro Diagnostics SuperCloud Composer; SuperDoctor® 5 (SD5); Supermicro Diagnostics
Offline (SDO); Supermicro Intelligent Mgmt (BMC Resources); Supermicro Offline (SDO); Supermicro Intelligent Mgmt (BMC Resources); Supermicro
Management IPMI Utilities; Supermicro Power Manager (SPM); Supermicro Server IPMI Utilities; Supermicro Power Manager (SPM); Supermicro Server
Manager (SSM); Supermicro Server Mgmt (Redfish® API); Supermicro Manager (SSM); Supermicro Server Mgmt (Redfish® API); Supermicro
Thin-Agent Service (TAS); Supermicro Update Manager (SUM) Thin-Agent Service (TAS); Supermicro Update Manager (SUM)
6x 2.5” hot-swap NVMe/SATA drive bays; 6x 2.5” NVMe dedicated; 6x 2.5” hot-swap NVMe/SATA/SAS drive bays; 6x 2.5” NVMe dedicated;
Drive Bays Optional RAID support via Intel® PCH Optional RAID support via Broadcom® 3808 AOC
Enclosure: 449 x 88 x 711.2mm (17.67” x 3.46” x 28”) Enclosure: 449 x 88 x 711.2mm (17.67” x 3.46” x 28”)
Form Factor

X13 BigTwin®
2U 2-Node 2U 2-Node
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SYS-621BT-DNTR SYS-621BT-DNC8R
Processor Support Dual Socket LGA 4677 (Socket E) supported Dual Socket LGA 4677 (Socket E) supported
• Back-up & Recovery • Back-up & Recovery
Key Applications • Scale-Out Object Storage • Scale-Out Object Storage
• Hyperconverged Infrastructure • Hyperconverged Infrastructure
• Tool-less support for swapping AOC cards • Tool-less support for swapping AOC cards
• Supports Liquid Cooling up to 350W TDP • Supports Liquid Cooling up to 350W TDP
Outstanding • Supports 2x PCIe 5.0 NVMe and 4x PCIe 4.0 NVMe/SATA per node • Supports 2x PCIe 5.0 NVMe and 4x PCIe 4.0 NVMe/SAS per node (Drive
Features (Drive Bays) Bays)
• Optional TPM 1.2 or 2.0 module • Optional TPM 1.2 or 2.0 module
• HW Boot Controller for NVMe M.2 drives • HW Boot Controller for NVMe M.2 drives
Serverboard SUPER ® X13DET-B SUPER ® X13DET-B

2 M.2 (22x110mm) slot(s) for boot drive or caching 2 M.2 (22x110mm) slot(s) for boot drive or caching
Expansion Slots PCIe 5.0 x16 LP slot PCIe 5.0 x16 LP slot
2 PCIe x8 LP slot(s) 2 PCIe x8 LP slot(s)
Onboard Storage
Intel® SATA Broadcom® 3808
Controller
VGA/Audio 1 onboard VGA port 1 onboard VGA port
Intel® Node Manager; IPMI 2.0; KVM with dedicated LAN; SPM; SSM; Intel® Node Manager; IPMI 2.0; KVM with dedicated LAN; SPM; SSM;
Management SUM; Supemicro Out of Band (OOB) License; SuperCloud Composer; SUM; Supemicro Out of Band (OOB) License; SuperCloud Composer;
6x 3.5” hot-swap NVMe/SATA drive bays; 6x 3.5” hot-swap NVMe/SAS drive bays;
RAID support via Intel® PCH HBA support via SAS3808 Adapter
Drive Bays
1U 2200W Redundant Power Supply Titanium with C14 inlet, 45(W) X 1U 2200W Redundant Power Supply Titanium with C14 inlet, 45(W) X
Power Supply
40(H) X 480(L) 40(H) X 480(L)
Cooling System 4x 14.9K RPM Heavy Duty 8cm Fan(s) 4x 14.9K RPM Heavy Duty 8cm Fan(s)
Enclosure: 449 x 88 x 774mm (17.68” x 3.47” x 30.5”) Enclosure: 449 x 88 x 774mm (17.68” x 3.47” x 30.5”)
Form Factor

X13 BigTwin®
2U 2-Node 2U 2-Node
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SYS-221BT-DNC8R SYS-221BT-DNTR
• Big Data Analytics and AI
• All-Flash Object Storage
• Scale Out All-Flash NVMe Storage
Key Applications • All-Flash Storage Area Network
• Diskless HPC Clusters
• All-Flash Hyperconverged Infrastructure
• High-Performance File System
Outstanding • Supports 2x PCIe 5.0 NVMe and 10x PCIe 4.0 NVMe/SAS per node • Supports 2x PCIe 5.0 NVMe and 10x PCIe 4.0 NVMe/SATA per node
Features (Drive Bays) (Drive Bays)

Expansion Slots PCIe 5.0 x16 LP slot PCIe 5.0 x16 LP slot
2 PCIe x8 LP slot(s) 2 PCIe x8 LP slot(s)
Onboard Storage
Broadcom® 3816 Intel® SATA
Controller
VGA/Audio 1 onboard VGA port 1 I/O module VGA port
12x 2.5” hot-swap NVMe/SAS drive bays; 12x 2.5” hot-swap NVMe/SATA drive bays;
Drive Bays Optional HBA support via SAS3816 AOC RAID support via Intel® PCH
Power Supply
40(H) X 480(L) 40(H) X 480(L)
Form Factor

X13 BigTwin®
2U 4-Node 2U 4-Node
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SYS-621BT-HNC8R SYS-621BT-HNTR
• Container Storage • Scale-Out File Server
Key Applications • Scale-Out File Storage • Container Storage
• Hyperconverged Infrastructure • Hyperconverged Infrastructure
Outstanding • Supports 2x PCIe 5.0 NVMe and 1x PCIe 4.0 NVMe/SAS per node (Drive • Supports 2x PCIe 5.0 NVMe and 1x PCIe 4.0 NVMe/SATA per node
Features Bays) (Drive Bays)

Expansion Slots
2 PCIe 5.0 x16 LP slot(s) 2 PCIe 5.0 x16 LP slot(s)
Onboard Storage
Broadcom® 3808 Intel® SATA
Controller
VGA/Audio 1 I/O module VGA port 1 onboard VGA port
3x 3.5” hot-swap NVMe/SAS drive bays; 3x 3.5” hot-swap NVMe/SATA drive bays;
HBA support via SAS3808 Adapter RAID support via Intel® PCH
Drive Bays
Power Supply
40(H) X 480(L) 40(H) X 480(L)
Form Factor

X13 BigTwin®
2U 4-Node 2U 4-Node
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SYS-221BT-HNC8R SYS-221BT-HNC9R
• All-Flash Hyperconverged Infrastructure • High-Density Storage RAID Array
Key Applications • Diskless HPC Clusters • Virtualized Big Data Analytics
• Container-as-a-Service; Application Accelerator • Mission Critical HPC
Outstanding • Supports 2x PCIe 5.0 NVMe and 4x PCIe 4.0 NVMe/SAS per node (Drive • Supports 2x PCIe 5.0 NVMe and 4x PCIe 4.0 NVMe/SAS per node (Drive
Features Bays) Bays)

Expansion Slots
2 PCIe 5.0 x16 LP slot(s) PCIe 5.0 x16 LP slot
Onboard Storage
Broadcom® 3808 Broadcom® 3908
Controller
VGA/Audio 1 onboard VGA port 1 onboard VGA port
6x 2.5” hot-swap NVMe/SAS drive bays; 6x 2.5” hot-swap NVMe/SAS drive bays;
Drive Bays HBA support via SAS3808 Adapter Optional RAID support via Broadcom® 3908 AOC
Power Supply
40(H) X 480(L) 40(H) X 480(L)
Cooling System 4x 16K RPM Counter Rotating 8cm Fan(s) 4x 16K RPM Counter Rotating 8cm Fan(s)
Form Factor

X13 BigTwin® 2U 4-Node
2U 4-Node (Coming Soon All NVMe Gen 5)
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SYS-221BT-HNTR SYS-221BT-HNR
• Diskless HPC Clusters • Diskless HPC Clusters
• High-Performance File System • High-Performance File System
Key Applications
• Container-as-a-Service; Application Accelerator • Container-as-a-Service; Application Accelerator
• All-Flash NVMe Hyperconverged Infrastructure • All-Flash NVMe Hyperconverged Infrastructure
• Tool-less support for swapping AOC cards
• Tool-less support for swapping AOC cards
• Supports Liquid Cooling up to 350W TDP
• Supports Liquid Cooling up to 350W TDP
Outstanding • Supports 2x PCIe 5.0 NVMe and 4x PCIe 4.0 NVMe/SATA per node
• Optional TPM 1.2 or 2.0 module
Features (Drive Bays)
• HW Boot Controller for NVMe M.2 drives
• Optional TPM 1.2 or 2.0 module
• All NVMe PCIe 5.0 Flash
• HW Boot Controller for NVMe M.2 drives

Expansion Slots
2 PCIe 5.0 x16 LP slot(s) 2 PCIe 5.0 x16 LP slot(s)
Onboard Storage
Intel® SATA
Controller
VGA/Audio 1 I/O module VGA port 1 onboard VGA port
6x 2.5” hot-swap NVMe/SATA drive bays;
6x 2.5” hot-swap NVMe drive bays;
Drive Bays RAID support via Intel® PCH
Power Supply
40(H) X 480(L) 40(H) X 480(L)
Cooling System 4x 16K RPM Counter Rotating 8cm Fan(s) 4x 16K RPM Counter Rotating 8cm Fan(s)
Form Factor

X13 FatTwin®
4U8N 4U4N
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SYS-F511E2-RT SYS-F521E3-RTB
Processor Support Single Socket LGA-4677 (Socket E) supported Single Socket LGA-4677 (Socket E) supported
• Hyperscale / Hyperconverged • Hyperscale / Hyperconverged
• Telco Data Center and ETSI certified • Telco Data Center and ETSI certified
Key Applications
• Data Center Enterprise Applications • Data Center Enterprise Applications
• HPC and Big Data • HPC and Big Data
• Shared power architecture for best efficiency • Shared power architecture for best efficiency
• Redundant cooling and power configurations for high availability • Redundant cooling and power configurations for high availability
Outstanding
• Optimized designs for storage and compute density • Optimized designs for storage and compute density
Features
• HDD hot-swap capability • HDD hot-swap capability
• 16 DIMMs Up to 4TB DDR5 • 16 DIMMs Up to 4TB DDR5
Serverboard SUPER ® X13SEFR-A SUPER ® X13SEFR-A
16 DIMM slots
System Memory 16 DIMM slots
UP to 4TB: 16x 256GB DRAM
(Max.) UP to 4TB: 16x 256GB DRAM
M.2 slot(s) AIOM slot(s)
Expansion Slots PCIe 5.0 x16 LP slot(s) M.2 slot(s)
2 AIOM slot(s) PCIe 5.0 x16 LP slot(s)
Onboard Storage
Controller
Connectivity 1x 1GbE RJ45 (BMC) port(s) via AIOM 1x 1GbE RJ45 (BMC) port(s) via AIOM
VGA/Audio 1 VGA port, Aspeed AST2600 BMC 1 VGA port, Aspeed AST2600 BMC
Intel® Node Manager; IPMI 2.0; KVM with dedicated LAN; SPM; SSM; SUM; Intel® Node Manager; IPMI 2.0; KVM with dedicated LAN; SPM; SSM; SUM;
Management
8x 3.5” hot-swap NVMe/SATA/SAS drive bays; 8x 2.5” NVMe hybrid;
6x 2.5” hot-swap NVMe/SATA/SAS drive bays; 6x 2.5” NVMe hybrid;
8x 2.5” 7mm drive bays
Drive Bays 6x 2.5” 7mm drive bays
Enclosure: 448 x 177 x 737mm (17.63” x 6.96” x 29”) Enclosure: 448 x 177 x 737mm (17.63” x 6.96” x 29”)
Form Factor
Package: (28.3” x 15” x 42.4”) Package: (28.3” x 15” x 42”)

X13 CloudDC
High Density Cloud Storage High Density Cloud Storage
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SYS-621C-TN12R SYS-521C-NR
Processor Support Dual Socket LGA-4677 (Socket E) supported Single Socket LGA 4677 (Socket E) supported
TDP up to 350W; 4 UPI TDP up to 350W
• CDN, Edge Nodes • Database/Storage
• DNS & Gateway Servers, Firewall Application • AI inferencing, ML training
Key Applications • Cloud Computing, Compact Server • Network Appliance
• Data Center Optimized, Value IaaS • Data Center Optimized
• Web Server, Firewall Application • Cloud Computing
• Up to 12x NVMe/SATA/SAS hybrid tool-less drive bays
• Optional hot-swappable 2.5” rear drive bays
• Flexible expansion with up to 2x PCIe 5.0 x16 and 4x PCIe 5.0 x8
(convertible to 2x PCIe 5.0 x16) slots
• Dual sockets up to 350W TDP • Support powerful double-width GPUs
Outstanding Features • Dual NVMe M.2 (2280) • Flexible Configurations. Support 6 PCIe 5.0 expansion slots + 2x AIOM
• Dual FHFLDW PCIe 4.0 GPU support slots in 2U
• Dual AIOM with NCSI (OCP 3.0 NIC)
• Compact server with tool-less drive trays
• Balanced architecture in compact chassis (25.6”)
• 3.5” tool-less drive trays also support 2.5” drives
Serverboard SUPER ® X13DDW-A SUPER ® X13SEDW-F
System Memory (Max.)
UP to 4TB: 16x 256GB DRAM UP to 4TB: 16x 256GB DRAM
Slot 1: PCIe 4.0 x8 FHHL (optional x16 by merging slot 2) Slot 1: PCIe 5.0 x8 FHFL (optional x16 by merging slot 2)
Slot 2: PCIe 4.0 x8 FHHL Slot 2: PCIe 5.0 x8 FHFL
Slot 3: PCIe 4.0 x16 FHHL Slot 3: PCIe 5.0 x16 FHHL
Slot 4: PCIe 4.0 x8 FHHL Slot 4: PCIe 5.0 x8 FHFL
Expansion Slots
Slot 5: PCIe 4.0 x8 FHHL (optional x16 by merging slot 4) Slot 5: PCIe 5.0 x8 FHFL (optional x16 by merging slot 4)
Slot 6: PCIe 4.0 x16 FHHL Slot 6: PCIe 5.0 x16 FHHL
Slot A1: PCIe 4.0 x16 OCP 3.0 Mezzanine NIC Slot A1: PCIe 5.0 x16 OCP 3.0 AIOM NIC
Slot A2: PCIe 4.0 x16 OCP 3.0 Mezzanine NIC Slot A2: dummy AIOM slot
Onboard Storage
Controller Intel® SATA Intel® SATA
with Via Advanced IO Module, AIOM (OCP 3.0 NIC, refer to AIOM Network
Connectivity via AIOM
Card(s) under Optional Parts List for NIC options) via AIOM
VGA/Audio 1 VGA port 1 onboard VGA port
Intel® Node Manager; IPMI 2.0; KVM with dedicated LAN; NMI; Redfish Intel® Node Manager; IPMI2.0; KVM with dedicated LAN; NMI; Redfish API;
Management
API; SCC; SPM; SSM; SUM; SuperDoctor® 5; Watch Dog SPM; SSM; SUM
12x 3.5” hot-swap NVMe/SATA/SAS hybrid drive bays;
12x 3.5” NVMe/SATA/SAS drive bays; 2x 3.5” NVMe hybrid;
Optional RAID support via RAID controller AOC
Drive Bays

Cooling System 3x 8cm heavy duty fan(s) 3x (8cm x 8cm x 3.8cm) heavy duty fan(s)
Form Factor

X13 CloudDC
Compact Cloud Compute Compact Cloud Compute
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SYS-121C-TN10R SYS-111C-NR
Processor Support Dual Socket LGA-4677 (Socket E) supported Single Socket LGA 4677 (Socket E) supported
TDP up to 270W; 4 UPI TDP up to 350W
• HPC
• CDN, Edge Nodes
• Virtualization
• DNS & Gateway Servers, Firewall Application
• Storage Headnode
Key Applications • Cloud Computing, Compact Server
• Data Center Optimized
• Data Center Optimized, Value IaaS
• Cloud Computing
• Web Server, Firewall Application
• CDN, Edge Nodes
• Up to 10x NVMe/SATA/SAS hybrid tool-less drive bays
• Dual sockets up to 270W TDP
• Max 10x PCIe 5.0 NVMe drives supported in 1U Form Factor
• Dual NVMe M.2 (2280)
Outstanding Features • Flexible Configurations. Support 2x 16 PCIe 5.0 expansion slots + 2x
AIOM slots in 1U
Serverboard SUPER ® X13DDW-A SUPER ® X13SEDW-F
System Memory (Max.)
UP to 4TB: 16x 256GB DRAM UP to 4TB: 16x 256GB DRAM
Slot 1: PCIe 5.0 x16 FHHL
Slot 2: PCIe 5.0 x16 FHHL
Expansion Slots 2 PCIe 5.0 x16 FHHL slot(s)
Slot A1: PCIe 5.0 x16 OCP 3.0 AIOM NIC
Slot A2: PCIe 5.0 x16 OCP 3.0 AIOM NIC
Onboard Storage
Controller Intel® SATA Intel® SATA
with Via Advanced IO Module, AIOM (OCP 3.0 NIC, refer to AIOM Network
Connectivity via AIOM
Card(s) under Optional Parts List for NIC options) via AIOM
VGA/Audio 1 VGA port 1 onboard VGA port
Intel® Node Manager; IPMI 2.0; KVM with dedicated LAN; NMI; Redfish Intel® Node Manager; IPMI2.0; KVM with dedicated LAN; NMI; Redfish API;
Management
API; SCC; SPM; SSM; SUM; SuperDoctor® 5; Watch Dog SPM; SSM; SUM
10x 2.5” NVMe/SATA/SAS drive bays; 10x 2.5” NVMe hybrid;
Drive Bays Optional RAID support via RAID controller AOC

Power Supply Redundant 860W Platinum level (94%) Redundant 860W Platinum level (94%)
Cooling System 6x 4cm heavy duty fan(s) 6x (4cm x 4cm x 5.6cm) heavy duty fan(s)
Form Factor
Package: 605 x 197 x 822mm (23.8” x 7.8” x 32.4”) Package: 602 x 195.6 x 807.7mm (23.7” x 7.7” x 31.8”)

X13 CloudDC
General Purpose Balanced Compact Storage Optimized
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SYS-121C-TN2R SYS-611C-TN4R
TDP up to 270W; 4 UPI TDP up to 270W; 4 UPI
• CDN, Edge Nodes • CDN, Edge Nodes
• DNS & Gateway Servers, Firewall Application • DNS & Gateway Servers, Firewall Application
Key Applications • Cloud Computing, Compact Server • Cloud Computing, Compact Server
• Data Center Optimized, Value IaaS • Data Center Optimized, Value IaaS
• Web Server, Firewall Application • Web Server, Firewall Application
• Up to 4x SATA/SAS/NVMe tool-less drive bays
• Up to 8x SATA/SAS w/ 2x NVME tool-less drive bays
• Optional fixed 2.5” 7 mm drive bays
• Optional DVD ROM support
• Dual NVMe M.2 (2280)
Outstanding Features • Dual NVMe M.2 (2280)
• 3.5” tool-less drive trays also support 2.5” drives
Serverboard SUPER ® X13DDW-A SUPER ® X13DDW-A
Expansion Slots 2 PCIe 5.0 x16 FHHL slot(s) 2 PCIe 5.0 x16 FHHL slot(s)
Onboard Storage
Intel® SATA
Controller
with Via Advanced IO Module, AIOM (OCP 3.0 NIC, refer to AIOM Network with Via Advanced IO Module, AIOM (OCP 3.0 NIC, refer to AIOM Network
Connectivity
Card(s) under Optional Parts List for NIC options) via AIOM Card(s) under Optional Parts List for NIC options) via AIOM
Intel® Node Manager; IPMI 2.0; KVM with dedicated LAN; NMI; Redfish Intel® Node Manager; IPMI 2.0; KVM with dedicated LAN; NMI; Redfish
Management
API; SCC; SPM; SSM; SUM; SuperDoctor® 5; Watch Dog API; SCC; SPM; SSM; SUM; SuperDoctor® 5; Watch Dog
Optional RAID support via RAID controller AOC
Peripheral Bays 1x DVD-ROM (optional) 2x 2.5” (optional)

Power Supply Redundant 860W Platinum level (94%) Redundant 860W Platinum level (94%)
Form Factor

X13 All-Flash EDSFF X13 Hyper-E
2U Hyper-E 2U Hyper-E
1U High-performance All-Flash Optimized for 5G and Telco Optimized for 5G and Telco
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SSG-121E-NES24R SYS-221HE-FTNR SYS-221HE-FTNRD
4th Gen Intel® Xeon® Scalable processors 4th Gen Intel® Xeon® Scalable processors 4th Gen Intel® Xeon® Scalable processors
Processor Support Dual Socket LGA-4677 (Socket E) supported Dual Socket LGA-4677 (Socket E) supported Dual Socket LGA-4677 (Socket E) supported
TDP up to 270W; 4 UPI TDP up to 350W; 4 UPI TDP up to 350W; 4 UPI
• In-Memory Computing • Cloud Computing • Cloud Computing
• Software-defined Storage • Network Function Virtualization • Network Function Virtualization
Key Applications • NVMe Over Fabrics Solution • AI Inference and Machine Learning • AI Inference and Machine Learning
• Private & Hybrid Cloud • Telecom Micro Data Center • Telecom Micro Data Center
• Data Intensive HPC • 5G Core and Edge • 5G Core and Edge
• Two PCIe 5.0 x16 slots & two AIOM connectors
(OCP 3.0 SFF compliant)
• Supports 32 DIMMs with 2DPC, up to 12TB memory
capacity with 16 DIMMs of 256Gb 3DS RDIMM/
RDIMM DDR5 ECC memory and 16 DIMMs of 512Gb • Tool-less system design for east maintenance • Tool-less system design for east maintenance
Intel® Optane PMem 300 Series • Storage configurations up to 6x 2.5” hot-swap • Storage configurations up to 6x 2.5” hot-swap
Outstanding Features • Redundant Titanium 2000W Power Supplies NVMe/SATA drive bays NVMe/SATA drive bays
• Dual Socket E (LGA-4677) 4th Generation Intel® • Flexible networking options with 2 AIOM • Flexible networking options with 2 AIOM
Xeon® Scalable processors. Up to 270W TDP. networking slots (OCP NIC 3.0 compatible) networking slots (OCP NIC 3.0 compatible)
• Composable Infrastructure Platform
• 24x hot-swap E1.S (9.5mm or 15mm) NVMe drive
bays
Serverboard SUPER ® X13DSF-A SUPER ® X13DEM SUPER ® X13DEM
Chipset Intel® C741 Intel® C741 Intel® C741
System Memory 32 DIMM slots 32 DIMM slots 32 DIMM slots
(Max.) UP to 8TB: 32x 256GB DRAM UP to 8TB: 32x 256GB DRAM UP to 8TB: 32x 256GB DRAM
Configurable PCIe slot options up to 8 SW PCIe Configurable PCIe slot options up to 8 SW PCIe
2 PCIe 5.0 x16 AIOM slot(s)
Expansion Slots 5.0 x8 (6 FHFL+ 2 FHHL) or 4 DW PCIe 5.0 x16 (3 5.0 x8 (6 FHFL+ 2 FHHL) or 4 DW PCIe 5.0 x16 (3
2 PCIe 5.0 x16 FH slot(s)
FHFL + FHHL) FHFL + FHHL)
Onboard Storage
Intel® SATA Intel® SATA Intel® SATA
Controller
2x 100GbE QSFP28 with Broadcom® BCM57508 2x 100GbE QSFP28 with Broadcom® BCM57508
2x 100GbE QSFP28 with Intel® E810-CAM2 2x 100GbE QSFP28 with Intel® E810-CAM2
2x 100GbE QSFP28 with Mellanox® CX-6 DX 2x 100GbE QSFP28 with Mellanox® CX-6 DX
Connectivity via AIOM (optional) (optional)
2x 25GbE SFP28 with Broadcom® BCM57414 2x 25GbE SFP28 with Broadcom® BCM57414
4x 10GbE RJ45 with Intel® X550 (optional) 4x 10GbE RJ45 with Intel® X550 (optional)
4x 10GbE SFP+ with Intel® X710-BM2 (optional) via 4x 10GbE SFP+ with Intel® X710-BM2 (optional) via
AIOM AIOM
VGA/Audio 1 VGA port 1 VGA port 1 VGA port
Intel® Node Manager; IPMI 2.0; KVM with Intel® Node Manager; IPMI 2.0; KVM with
Management IPMI 2.0; NMI; SUM; SuperDoctor® 5; Watch Dog dedicated LAN; NMI; Redfish API; SPM; SSM; dedicated LAN; NMI; Redfish API; SPM; SSM;
SUM; SuperDoctor® 5; Watch Dog SUM; SuperDoctor® 5; Watch Dog
24x 2.5” hot-swap NVMe drive bays;
6x 2.5” hot-swap NVMe/SATA drive bays; 6x 2.5” 6x 2.5” hot-swap NVMe/SATA drive bays; 6x 2.5”
,24x 2.5” hot-swap NVMe drive bays;
NVMe hybrid; NVMe hybrid;
Drive Bays 24x E1.S Hot-swap NVMe (9.5mm or 15mm) drive
Optional RAID support via RAID Controller AOC Optional RAID support via RAID Controller AOC
slots
Peripheral Bays None None None

Power Supply 2000W Redundant Power Supplies with PMBus Redundant 2000W Titanium level (96%) 2x 1300W -48Vdc single output
Cooling System 8x 4cm heavy duty fan(s) 6 heavy duty fan(s) 6 heavy duty fan(s)
1U Rackmount
Enclosure: 438.4 x 43.6 x 773.25mm (17.2” x 1.7”
Enclosure: 436.88 x 88.9 x 574mm (17.2” x 3.5” Enclosure: 436.88 x 88.9 x 574mm (17.2” x 3.5”
x 30.4”)
Form Factor x 22.6”) x 22.6”)
Package: 604.774 x 199.898 x 1029.97mm (23.81”
x 7.87” x 40.55”)

2U Hyper
X13 Hyper 2U Hyper
Optimized for Storage Performance Optimized for Storage Performance
(Liquid Cooling options)
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SYS-221H-TNR SYS-221H-TN24R
• Software-defined Storage • Software-defined Storage
• Virtualization • Virtualization
Key Applications • Enterprise Server • Enterprise Server
• Cloud Computing • Cloud Computing
• AI Inference and Machine Learning • AI Inference and Machine Learning
• Tool-less system design for easy maintenance
• Storage configurations up to 16x 2.5” hot-swap NVMe/SATA/SAS drive
Outstanding Features • Flexible networking options with AIOM/OCP NIC 3.0 support
bays
• 24x 2.5” hot-swap NVMe/SATA/SAS drive bays
• Flexible networking options with AIOM/OCP NIC 3.0 support
Serverboard SUPER ® X13DEM SUPER ® X13DEM

Configurable PCIe slot options up to 8 PCIe 5.0 x8 or 4 PCIe 5.0 x16 FH, Configurable PCIe slot options up to 8 PCIe 5.0 x8 or 4 PCIe 5.0 x16 FH,
Expansion Slots
10.5”L 10.5”L
Onboard Storage
Controller
2x 100GbE QSFP28 with Broadcom® BCM57508 (optional) 2x 100GbE QSFP28 with Broadcom® BCM57508 (optional)
2x 10GbE SFP+ with Intel® X710-BM2 (optional) 2x 10GbE SFP+ with Intel® X710-BM2 (optional)
2x 1GbE RJ45 with Intel® i350-AM2 (optional) 2x 1GbE RJ45 with Intel® i350-AM2 (optional)
Connectivity
4x 10GbE RJ45/SFP+ with Intel® X710-TM4 (optional) 4x 10GbE RJ45/SFP+ with Intel® X710-TM4 (optional)
4x 10GbE SFP+ with Intel® XL710-BM1 (optional) 4x 10GbE SFP+ with Intel® XL710-BM1 (optional)
4x 1GbE RJ45 or 4x 1GbE SFP with Intel® i350-AM4 (optional) 4x 1GbE RJ45 or 4x 1GbE SFP with Intel® i350-AM4 (optional)
4x 25GbE RJ45/SFP28 with Mellanox® CX-4 Lx EN Intel® X550-AT2 4x 25GbE RJ45/SFP28 with Mellanox® CX-4 Lx EN Intel® X550-AT2
(optional) via AIOM (optional) via AIOM
Management
API; SPM; SSM; SUM; SuperDoctor® 5; Watch Dog API; SPM; SSM; SUM; SuperDoctor® 5; Watch Dog
8x 2.5” hot-swap NVMe/SATA/SAS drive bays; 24x 2.5” hot-swap NVMe/SATA/SAS drive bays;
Drive Bays Optional RAID support via RAID Controller AOC Optional RAID support via RAID Controller AOC
Enclosure: 437 x 88.9 x 760mm (17.2” x 3.5” x 29.9”) Enclosure: 437 x 88.9 x 760mm (17.2” x 3.5” x 29.9”)
Form Factor

2U Hyper
X13 Hyper 1U Hyper
Optimized for Storage Capacity Compute & Storage Powerhouse
Liquid Cooling Options
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SYS-621H-TN12R SYS-121H-TNR
• Software-defined Storage • Software-defined Storage
Key Applications • Enterprise Server • Enterprise Server
• AI Inference and Machine Learning • AI Inference and Machine Learning
• Storage configurations up to 12x 2.5” hot-swap NVMe/SATA/SAS drive
Outstanding Features • Flexible networking options with AIOM/OCP NIC 3.0 support
bays
• 12x 3.5”/2.5” hot-swap NVMe/SATA/SAS drive bays
• Flexible networking options with AIOM/OCP NIC 3.0 support
Serverboard SUPER ® X13DEM SUPER ® X13DEM

Configurable PCIe slot options up to 8 PCIe 5.0 x8 or 4 PCIe 5.0 x16 FH,
Expansion Slots 2 PCIe 5.0 x16 FH, 10.5”L and 1 PCIe 5.0 x16, FH, 6.6”L
10.5”L
Onboard Storage
Controller
2x 100GbE QSFP28 with Broadcom® BCM57508 (optional) 2x 100GbE QSFP28 with Broadcom® BCM57508 (optional)
2x 10GbE SFP+ with Intel® X710-BM2 (optional) 2x 10GbE SFP+ with Intel® X710-BM2 (optional)
2x 1GbE RJ45 with Intel® i350-AM2 (optional) 2x 1GbE RJ45 with Intel® i350-AM2 (optional)
Connectivity
4x 10GbE RJ45/SFP+ with Intel® X710-TM4 (optional) 4x 10GbE RJ45/SFP+ with Intel® X710-TM4 (optional)
4x 10GbE SFP+ with Intel® XL710-BM1 (optional) 4x 10GbE SFP+ with Intel® XL710-BM1 (optional)
4x 1GbE RJ45 or 4x 1GbE SFP with Intel® i350-AM4 (optional) 4x 1GbE RJ45 or 4x 1GbE SFP with Intel® i350-AM4 (optional)
4x 25GbE RJ45/SFP28 with Mellanox® CX-4 Lx EN Intel® X550-AT2 4x 25GbE RJ45/SFP28 with Mellanox® CX-4 Lx EN Intel® X550-AT2
(optional) via AIOM (optional) via AIOM
Management
API; SPM; SSM; SUM; SuperDoctor® 5; Watch Dog API; SPM; SSM; SUM; SuperDoctor® 5; Watch Dog
12x 3.5” hot-swap NVMe/SATA/SAS drive bays;
8x 2.5” hot-swap NVMe/SATA/SAS drive bays;
Optional RAID support via RAID Controller AOC
Drive Bays Optional RAID support via RAID Controller AOC
Enclosure: 437 x 88.9 x 803mm (17.2” x 3.5” x 31.6”) Enclosure: 437 x 43 x 747mm (17.2” x 1.7” x 29.4”)
Form Factor

X13 UP WIO
1U UP WIO 1U UP WIO 2U UP WIO
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SYS-511E-WR SYS-111E-WR SYS-521E-WR
Processor Support Single Socket LGA 4677 (Socket E) supported Single Socket LGA 4677 (Socket E) supported Single Socket LGA 4677 (Socket E) supported
TDP up to 300W TDP up to 300W TDP up to 300W
• Entry GPU server
• Value IaaS • Entry GPU server
• Database/Storage
Key Applications • Entry GPU server • Database/Storage
• Network Appliance
• Data Center Optimized • Data Center Optimized
• Data Center Optimized
• Up to 4 expansion slots with optional riser
• Maximum I/O. Support 3 x16 expansion slots card
• Maximum I/O. Support 3 x16 expansion slots
Outstanding in 1U form factor
in 1U form factor. • Max 4x hybrid PCIe 5.0 NVMe drives
Features • Max 10x PCIe 5.0 NVMe drives supported in
• Cost optimized 1U X13 solution supported at front
1U Form Factor
• Flexible I/O expansion
Serverboard SUPER ® X13SEW-F SUPER ® X13SEW-F SUPER ® X13SEW-F
System Memory 8 DIMM slots 8 DIMM slots 8 DIMM slots

(Max.) UP to 2TB: 8x 256GB DRAM UP to 2TB: 8x 256GB DRAM UP to 2TB: 8x 256GB DRAM
Slot 1: PCIe 5.0 x16 FHFL
Slot 1: PCIe 5.0 x16 FHFL Slot 1: PCIe 5.0 x16 FHFL
Slot 3: PCIe 5.0 x16 FHFL
Expansion Slots Slot 2: PCIe 5.0 x16 FHFL Slot 2: PCIe 5.0 x16 FHFL
Slot 5: PCIe 5.0 x8 LP
Slot 3: PCIe 5.0 x8 (in x16) LP Slot 3: PCIe 5.0 x8 (in x16) LP
Slot 6: PCIe 5.0 x8 LP
Onboard Storage
Controller
2x 1GbE RJ45 port(s) with Intel® Ethernet 2x 1GbE RJ45 port(s) with Intel® Ethernet 2x 1GbE RJ45 port(s) with Intel® Ethernet
Connectivity
Controller i210 Controller i210 Controller i210
VGA/Audio 1 onboard VGA port 1 onboard VGA port 1 onboard VGA port
Intel® Node Manager; IPMI2.0; KVM with Intel® Node Manager; IPMI2.0; KVM with Intel® Node Manager; IPMI2.0; KVM with
Management
dedicated LAN; NMI; Redfish API; SPM; SSM; SUM dedicated LAN; NMI; Redfish API; SPM; SSM; SUM dedicated LAN; NMI; Redfish API; SPM; SSM; SUM
8x 3.5” NVMe/SATA/SAS drive bays; 4x 3.5”
4x 3.5” SATA/SAS drive bays; 10x 2.5” NVMe/SATA/SAS drive bays; 10x 2.5”
NVMe hybrid;
Drive Bays NVMe hybrid;
Peripheral Bays 2x 2.5” None 2x 2.5”
Power Supply Redundant 860W Platinum level (94%) Redundant 860W Platinum level (94%) Redundant 920W platinum level
Cooling System 5x (4cm x 4cm x 5.6cm) heavy duty fan(s) 5x (4cm x 4cm x 5.6cm) heavy duty fan(s) 3x (8cm x 8cm x 3.8cm) heavy duty fan(s)
1U Rackmount
Enclosure: 437 x 43 x 597mm (17.2” x 1.7” x 23.5”)
Form Factor Package: 596.9 x 215.9 x 855.98mm (23.5” x 8.5” Package: 673.1 x 279.4 x 863.6mm (26.5” x 11”
Package: 609.6 x 203.2 x 812.8mm (24” x 8” x 32”)
x 33.7”) x 34”)

X13 MP Systems
2U 4-way Compute-optimized 2U 4-way Storage-optimized 6U 8-way GPU-optimized
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL SYS-241H-TNRTTP SYS-241E-TNRTTP SYS-681E-TR
Processor Support Quad Socket LGA-4677 (Socket E) supported Quad Socket LGA-4677 (Socket E) supported Octa Socket LGA-4677 (Socket E) supported
TDP up to 350W; 3 UPI up to 16GT/s TDP up to 250W; 3 UPI up to 16GT/s TDP up to 350W; 4 UPI up to 16GT/s
• SAP HANA • SAP HANA
• HCI • HCI
• Scale -up HPC
• In-Memory Database • In-Memory Database
• Research Lab/National Lab
Key Applications • Scientific Virtualization • Scientific Virtualization
• Virtualization, ERP, CRM
• ERP, CRM • ERP, CRM
• In-Memory Database
• Business Intelligence • Business Intelligence
• Artificial Intelligence (AI) • Artificial Intelligence (AI)
• up to 12 PCIe expansion provides scalability • up to 8 PCIe expansion provides scalability as
as business grows business grows • up to 26 PCIe expansion provides scalability
as business grows
Outstanding Features • Support up to 2 double-width GPU/FPGA to • Support up to 2 double-width GPU/FPGA to
accelerate AI workloads accelerate AI workloads • Support up to 12 double-width GPU/FPGA to
accelerate AI workloads
• Compute Optimized 4-Way Server • Storage Optimized 4-Way Server
Serverboard SUPER ® X13QEH+ SUPER ® X13QEH+ SUPER ® X13OEI-CPU
64 DIMM slots 64 DIMM slots 128 DIMM slots
System Memory UP to 16TB: 64x 256GB DRAM UP to 16TB: 64x 256GB DRAM UP to 32TB: 128x 256GB DRAM
(Max.) UP to 24TB: 32x 256GB DRAM and 32x 512GB UP to 24TB: 32x 256GB DRAM and 32x 512GB UP to 48TB: 64x 512GB Intel® Optane™ Persistent
Intel® Optane™ Persistent Memory Intel® Optane™ Persistent Memory Memory and 64x 256GB DRAM
2 PCIe 5.0 x8 FHFL slot(s)
2 PCIe 5.0 x16 FHFL slot(s) 2 PCIe 5.0 x8 FHFL slot(s)
2 PCIe 5.0 x16 FHHL slot(s) 2 PCIe 5.0 x16 FHFL slot(s) 12 PCIe 5.0 x16 FHFL slot(s)
2 PCIe 4.0/5 x8 LP optional slot(s) 2 PCIe 5.0 x16 FHHL slot(s) 12 PCIe 5.0 x16 FHFL optional slot(s)
Expansion Slots 2 PCIe 4.0/5 x16 LP optional slot(s) PCIe 5.0 x16 AIOM slot(s) 2 PCIe 5.0 x16 LP internal optional slot(s)
PCIe 5.0 x16 AIOM slot(s) PCIe 5.0 x8 (x16 slot) AIOM slot(s) 2 M.2 SATA3/NVMe3 slot(s)
PCIe 5.0 x8 (x16 slot) AIOM slot(s) 2 M.2 SATA3/NVMe3 slot(s)
2 M.2 SATA3/NVMe3 slot(s)
Onboard Storage
Controller
Connectivity via AIOM via AIOM 1x 1GbE RJ45 port(s)
VGA/Audio 1 VGA port(s), 1 DisplayPort(s) 1 VGA port(s), 1 DisplayPort(s) 1 VGA port(s), 1 DisplayPort(s)
Intel® Node Manager; IPMI 2.0; NMI; SPM; SSM; Intel® Node Manager; IPMI 2.0; NMI; SPM; SSM; Intel® Node Manager; IPMI 2.0; NMI; SPM; SSM;
Management
SUM; SuperDoctor® 5; Watch Dog SUM; SuperDoctor® 5; Watch Dog SUM; SuperDoctor® 5; Watch Dog
24x 2.5” hot-swap NVMe/SAS3/SATA3 drive bays; 24x 2.5” hot-swap NVMe/SAS3/SATA3 drive bays;
8x 2.5” hot-swap NVMe/SAS3/SATA3 drive bays;
24x 2.5” NVMe hybrid; 24x 2.5” NVMe hybrid;
Optional RAID support via RAID controller AOC Optional RAID support via RAID controller AOC
Peripheral Bays None None None

Power Supply Redundant 2700W Titanium level (96%) Redundant 1600W Titanium level (96%) Redundant 2600W Titanium level (96%)
Cooling System 3x 8cm and 2x 6cm heavy duty fan(s) 6x 6cm heavy duty fan(s) 10x 8cm heavy duty fan(s)
2U Rackmount 2U Rackmount 6U Rackmount
Enclosure: 438.4 x 87.9 x 812.9mm (17.3” x 3.5” Enclosure: 438.4 x 87.9 x 849.3mm (17.3” x 3.5” Enclosure: 449 x 265 x 841mm (17.68” x 10.4” x
x 32”) x 33.4”) 33.1”)
Form Factor
Package: 672 x 250 x 1100mm (26.5” x 9.75” x Package: 672 x 250 x 1100mm (26.5” x 9.75” x Package: 720 x 922 x 1080mm (28.34” x 36.3” x
43.5”) 43.5”) 42.5”)

X13 DP Serverboards
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL X13DAI-T X13DEI X13DEI-T
Processor Dual Socket LGA-4677 (Socket E) supported, Dual Socket LGA-4677 (Socket E) supported, Dual Socket LGA-4677 (Socket E) supported,
CPU TDP supports Up to 350W TDP CPU TDP supports Up to 350W TDP CPU TDP supports Up to 350W TDP
Form Factor EATX, 12.1” x 13.1” (30.734cm x 33.274cm) EATX, 12.1” x 13.05” (30.74cm x 33.15cm) EATX, 12.1” x 13.05” (30.74cm x 33.15cm)
Memory Capacity & Up to 4TB 3DS ECC RDIMM, DDR5-4800MHz, in Up to 4TB 3DS ECC RDIMM, DDR5-4800MHz, in Up to 4TB 3DS ECC RDIMM, DDR5-4800MHz, in
Slots 16 DIMM slots 16 DIMM slots 16 DIMM slots
1 PCIe 5.0 x8,
2 PCIe 5.0 x8, 2 PCIe 5.0 x8,
5 PCIe 5.0 x16
4 PCIe 5.0 x16 4 PCIe 5.0 x16
2 PCIe 5.0 x4 NVMe
Expansion Slots M.2 Interface: 2 PCIe 4.0 x2 M.2 Interface: 2 PCIe 4.0 x2
M.2 Interface: 2 PCIe 5.0 x4
Form Factor: 2280/22110 Form Factor: 2280/22110
Form Factor: 2280/22110
M.2 Key: M-Key M.2 Key: M-Key
M.2 Key: M-Key
Intel® C741 controller for 8 SATA3 ports; RAID
Intel® C741 controller for 8 SATA3 ports; via Intel® C741 controller for 8 SATA3 ports; via
Onboard RAID N/A; via SlimSAS SlimSAS SlimSAS
Controller Intel® C741 controller for 2 SATA3 ports; RAID
Intel® C741 controller for 2 SATA3 ports; Internal Intel® C741 controller for 2 SATA3 ports; Internal
N/A; Internal Port(s) Port(s) Port(s)
Dual LAN with Broadcom BCM5720 1GBase-T Dual LAN with Broadcom BCM57416 10GBase-T
Onboard LAN Dual LAN with Broadcom BCM57416 10GBase-T
Single LAN with Realtek RTL8211F PHY Single LAN with Realtek RTL8211F PHY
Onboard VGA 1 VGA D-Sub Connector port(s) 1 VGA D-Sub Connector port(s) 1 VGA D-Sub Connector port(s)
1 USB 3.2 Gen2 port(s) (1 via header)
6 USB 3.2 Gen1 port(s) (2 via header; 4 rear) 3 USB 2 port(s) (2 via header; 1 Type A)
USB Ports 8 USB 3.2 Gen1 port(s) (4 rear type A; 2 via
3 USB 2 port(s) (1 Type A; 2 via header) 6 USB 3.2 Gen1 port(s) (2 via header; 4 rear)
header; 2 via header)
TPM Header
2 COM Port(s) (1 header; 1 rear) 2 COM Port(s) (1 header; 1 rear)
2 MCIO PCIe 5.0 x8
Other Onboard I/O TPM header TPM header
Devices 3 MCIO PCIe 5.0 x8 3 MCIO PCIe 5.0 x8
1x Realtek ALC888S 7.1 HD Audio port(s)Realtek
ALC888S 7.1 HD Audio
SuperDoctor® 5, SPM, SUM, SSM, IPMI SuperDoctor® 5, SPM, SUM, SSM, IPMI SuperDoctor® 5, SPM, SUM, SSM, IPMI
(Intelligent Platform Management Interface) (Intelligent Platform Management Interface) (Intelligent Platform Management Interface)
v2.0 with KVM support, Watchdog, v2.0 with KVM support, Watchdog, v2.0 with KVM support, Watchdog,
Manageability
SMCIPMITool, Trusted Platform Module SMCIPMITool, Trusted Platform Module SMCIPMITool, Trusted Platform Module
(TPM), CPU thermal trip support for processor (TPM), CPU thermal trip support for processor (TPM), CPU thermal trip support for processor
protection, Wake-on-LAN protection, Wake-on-LAN protection, Wake-on-LAN
System temperature, PCH temperature, Memory System temperature, PCH temperature, Memory
temperature, CPU temperature, +5V standby, temperature, CPU temperature, +5V standby,
+5V standby, +5V, +3.3V, +12V, +3.3V standby, +5V, +3.3V, +12V, CPU thermal trip support, +5V, +3.3V, +12V, CPU thermal trip support,
PC Health Monitoring
Vmem +3.3V standby, Veore, Vmem, Peripheral +3.3V standby, Veore, Vmem, Peripheral
temperature, Platform Environment Control temperature, Platform Environment Control
Interface (PECI)/(TSI) Interface (PECI)/(TSI)
13x 4-pin fan headers (up to 13 fans)
Fan speed control, Overheat LED indication, 8x 4-pin fan headers (up to 8 fans) 8x 4-pin fan headers (up to 8 fans)
CPU thermal trip support, 13x fans with Fan speed control Fan speed control
Thermal Control tachometer monitoring, Thermal Monitor 2 Overheat LED indication Overheat LED indication
(TM2) support, PECI, Monitoring for CPU and 8x fans with tachometer monitoring 8x fans with tachometer monitoring
chassis environment
Node Manager Support
M.2 NGFF connector UID, Node Manager Support, M.2 NGFF UID, Node Manager Support, M.2 NGFF
Control of power-on for recovery from AC connector, Control of power-on for recovery connector, Control of power-on for recovery
Other Features
power loss from AC power loss, Chassis intrusion detection, from AC power loss, Chassis intrusion detection,
Chassis intrusion detection ACPI power management ACPI power management
ACPI power management
BIOS AMI 32MB AMI UEFI AMI 32MB AMI UEFI AMI 32MB AMI UEFI

X13 UP Serverboards
HPC, All PCIe 5.0 slots HPC, All PCIe 5.0 slots
NEW!
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL X13SEI-F X13SEI-TF
Processor Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to
350W TDP 350W TDP
Form Factor ATX, 12.3” x 10.3” (31.24cm x 26.16cm) ATX, 12.3” x 10.3” (31.24cm x 26.16cm)
Memory Capacity &
Up to 2TB 3DS ECC RDIMM, DDR5-4800MHz, in 8 DIMM slots Up to 2TB 3DS ECC RDIMM, DDR5-4800MHz, in 8 DIMM slots
Slots
2 PCIe 5.0 x16, 2 PCIe 5.0 x16,
3 PCIe 5.0 x8, 3 PCIe 5.0 x8,
2 PCIe 5.0 x8 PCIe5.0 MCIO connector 2 PCIe 5.0 x8 PCIe5.0 MCIO connector
Expansion Slots
M.2 Interface: 2 PCIe 5.0 x4 M.2 Interface: 2 PCIe 5.0 x4
Onboard RAID
Intel® C741 controller for 10 SATA3 (6 Gbps) ports Intel® C741 controller for 10 SATA3 (6 Gbps) ports
Controller
Onboard LAN Dual LAN with 1GbE with Intel® I210 Dual LAN with 10GBase-T with Intel® X550
1 VGA D-Sub Connector port(s) 1 VGA D-Sub Connector port(s)
Onboard VGA
1 Aspeed AST2600 BMC port(s) 1 Aspeed AST2600 BMC port(s)
2 USB 2 port(s) (2 rear) 2 USB 2 port(s) (2 rear)
USB Ports
4 USB 3.2 Gen1 port(s) (2 rear; 1 type A; 1 via header) 4 USB 3.2 Gen1 port(s) (2 rear; 1 type A; 1 via header)
1 COM Port(s) (1 header) 1 COM Port(s) (1 header)
Other Onboard I/O 2 SATA DOM (Disk on Module) power connector support 2 SATA DOM (Disk on Module) power connector support
Devices TPM 2 Header TPM 2 Header
SuperDoctor® 5, SPM, SUM, SSM, IPMICFG, IPMIView for Linux/Windows, SuperDoctor® 5, SPM, SUM, SSM, IPMICFG, IPMIView for Linux/Windows,
Manageability SMCIPMITool, Trusted Platform Module (TPM), Chasis Intrusion SMCIPMITool, Trusted Platform Module (TPM), Chasis Intrusion
Detection Detection
VBAT, System level control, Supports system management utility, VBAT, System level control, Supports system management utility,
PC Health Monitoring Monitors CPU voltages, Chipset Voltage, Chassis intrusion header, 6 -fan Monitors CPU voltages, Chipset Voltage, Chassis intrusion header, 6 -fan
status, +5V standby, +5V, +3.3V, +12V, Memory Voltages status, +5V standby, +5V, +3.3V, +12V, Memory Voltages
7x 4-pin fan headers (up to 7 fans) 7x 4-pin fan headers (up to 7 fans)
Fan speed control Fan speed control
Thermal Control Overheat LED indication Overheat LED indication
7 fans with tachometer status monitoring 7 fans with tachometer status monitoring
WOL, UID, Node Manager Support, M.2 NGFF connector, Control of WOL, UID, Node Manager Support, M.2 NGFF connector, Control of
Other Features power-on for recovery from AC power loss, Chassis intrusion detection, power-on for recovery from AC power loss, Chassis intrusion detection,
ACPI power management ACPI power management
BIOS AMI UEFI AMI UEFI

X13 UP Serverboards
NEW! WIO, 1U/3AOC WIO, 1U/3AOC
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL X13SEW-F X13SEW-TF
350W TDP 350W TDP
Form Factor Proprietary WIO, 8” x 13” (20.32cm x 33.02cm) Proprietary WIO, 8” x 13” (20.32cm x 33.02cm)
Memory Capacity &
Slots
1 PCIe 5.0 x8 Right Riser (in x16) slot, 1 PCIe 5.0 x8 Right Riser (in x16) slot,
1 PCIe 5.0 x32 Left Riser Slot, 1 PCIe 5.0 x32 Left Riser Slot,
5 PCIe 5.0 x8 PCIe5.0 MCIO connector 5 PCIe 5.0 x8 PCIe5.0 MCIO connector
Expansion Slots
Onboard RAID
Controller
1 VGA D-Sub Connector port(s)
Onboard VGA 1 VGA D-Sub Connector port(s)
1 Aspeed AST2600 BMC port(s)
5 USB 2 port(s) (2 via header; 2 rear; 1 Type A) 5 USB 2 port(s) (2 via header; 2 rear; 1 Type A)
USB Ports
4 USB 3.2 Gen1 port(s) (2 via header; 2 rear) 4 USB 3.2 Gen1 port(s) (2 via header; 2 rear)
2 COM Port(s) (1 header; 1 rear) 2 COM Port(s) (1 header; 1 rear)
Detection Detection
Thermal Control 6 fans with tachometer status monitoring 6 fans with tachometer status monitoring
Overheat LED indication Overheat LED indication

X13 UP Serverboards
NEW! HP Embedded SVR HP Embedded SVR
4th Gen
Intel® Xeon®
Scalable
processors
Supported
MODEL X13SEM-F X13SEM-TF
350W TDP 350W TDP
Form Factor microATX, 9.6” x 9.6” (24.38cm x 24.38cm) microATX, 9.6” x 9.6” (24.38cm x 24.38cm)
Memory Capacity &
Slots
2 PCIe 5.0 x16, 2 PCIe 5.0 x16,
1 PCIe 5.0 x8 1 PCIe 5.0 x8
2 PCIe 3.0 x4 NVMe Internal Port(s) 2 PCIe 3.0 x4 NVMe Internal Port(s)
Expansion Slots 8 PCIe 5.0 x4 NVMe Internal Port(s) 8 PCIe 5.0 x4 NVMe Internal Port(s)
Onboard RAID
Controller
1 VGA D-Sub Connector port(s) 1 VGA D-Sub Connector port(s)
Onboard VGA
1 Aspeed AST2600 BMC port(s) 1 Aspeed AST2600 BMC port(s)
6 USB 2 port(s) (2 rear; 4 via header) 6 USB 2 port(s) (2 rear; 4 via header)
USB Ports
5 USB 3.2 Gen1 port(s) (2 via header; 2 rear; 1 type A) 5 USB 3.2 Gen1 port(s) (2 via header; 2 rear; 1 type A)
1 COM Port(s) (1 rear) 1 COM Port(s) (1 rear)
Detection Detection
Thermal Control 5 fans with tachometer status monitoring 5 fans with tachometer status monitoring
Overheat LED indication Overheat LED indication

System Management Software
Leverage Supermicro’s Management Software Suite to Meet
Your IT Infrastructure Challenges
With a comprehensive range of high-end software solutions, Supermicro gives IT administrators the tools to optimize the management of
IT systems and increase the utilization of computing and storage infrastructure. Whether you are looking to manage individual systems,
optimize server lifecycle processes, or streamline operations for an entire data center, Supermicro has the right software to help you
accomplish your goals.
Monitoring Continuity Security
• Obtain valuable insights in your • Maintain system uptime to meet SLAs • Protect your IT infrastructure from
infrastructure • Early symptom detection to prevent external threats
• Monitor the health of servers and critical component failure • Centralized patch and BIOS management
components • Remote management and • Extensive security features
• Get proactive alerts troubleshooting
System Management Software Suite Bundles

Supermicro’s System Management Software Suite consists of a set of specialized applications. These are available in the following bundles.
Suite Bundle Standard Basic Advanced Enterprise

Covers all core functionality Extends the core functionality Delivers a broad set of tools to Offers an extensive platform to
to effectively set up, manage, and makes system management help administrators improve manage large data centers and
and monitor your Supermicro easier with additional the performance, up-time, coordinate automated lifecycle
Description
systems. These features are features, such as remote BIOS and monitoring of Supermicro management, software-defined
available to all Supermicro management and system systems. infrastructure, and more in a
users. updates. single pane of glass.
• SFT-DCMS-SINGLE +
License • No license required • SFT-OOB-LIC • SFT-DCMS-SINGLE
• SFT-SDDC-SINGLE
• Secure remote console (KVM/ • Remote BMC management • Remote OS deployment • 3rd Party vendor support
HTML5) • Remote BIOS management • Auto-discovery • POD & Rack-level
• System temperature • Out-of-Band systems checks • Power capping management
monitoring • TPM Provisioning • RAID monitoring and • SDI Lifecycle management
• System power thresholds & • Mount/Unmount ISO images configuration • Manage Composable
alerts from Samba/HTTP • HDD monitoring Dissagregated Infrastructure
Key Features* • Component monitoring • Basic Redfish APIs • Advanced Redfish APIs • Zero-touch provisioning for
• Email alerting • CIM management • FW update policy network configuration
• Remote configuration • SysLog • System lock down • Single pane of glass for data
• Offline diagnostics • Crash screen/video capture center deployment
• Crash dump • Rich analytics & telemetry
• License management • User defined role-based
access control
* For detailed information, please check with your Supermicro sales representative or refer to Supermicro website:
https://www.supermicro.com/en/solutions/management-software

World Class Total IT Solutions
Rack Plug and Play
Rack Scale Solutions/ Design/

Production/Validation/
Logistics and Service, The
capacity of 3000 Integrated
Rack Solutions per month,
including up to 1000 Liquid
Cooled Racks per month
Flexible AC Power
(120/208/230/480VAC,
Single/3-phase)
48VDC Power
10/25/40/100/200/400 Gb/s
Network Testing
Environments
Air Cooling/Free Air Cooling/

Liquid Cooling
Turnkey Data Center

Solutions within two weeks
Global Expansion
Providing Greater Economies of Scale and Accelerated Support to
Data Center, Cloud Computing, AI, Enterprise IT, HPC, 5G, Hyperscale,
and Embedded Solutions Customers Worldwide
Worldwide Headquarters
San Jose, California, USA
America APAC
• Supermicro’s Headquarters expansion: Over 1.5 million square Supermicro’s Asia Science and Technology Park is a key
foot Green Computing Park in San Jose, California signals the milestone in the company’s growth as a true global leader
company’s increasing leadership in the IT industry in the development of advanced, power saving computing
• One of the largest high-tech R&D, manufacturing, and business technologies
hubs in Silicon Valley
• East Coast Sales and Service Office
Silicon Valley EMEA

Expanded manufacturing, command center Supermicro’s system integration facility and services in
The Netherlands serves the dynamic, rapidly growing
EMEA market with localized supply and time-to-market
advantages
Supermicro Worldwide
Worldwide Headquarters European Branch Taiwan Office Beijing, China Office Japan Office
Super Micro Computer, Inc. Super Micro Computer, B.V. Super Micro Computer, Inc. Supermicro Technology (Beijing) Co., Ltd Supermicro Japan
980 Rock Avenue, San Jose, CA 95131 USA Het Sterrenbeeld 28, 5215 ML, 3F., No.150, Jian 1st Rd., Zhonghe Dist., Suite 701, Tower D, Jiahua Building, 21F Shibuya Infoss Tower, 20-1,
Tel: +1-408-503-8000 ‘s-Hertogenbosch, The Netherlands New Taipei City 235, Taiwan (R.O.C.) No.9, Shangdi 3rd Street, Sakuragaoka-cho, Shibuya-Ku,Tokyo,
Fax: +1-408-503-8008 Tel: +31-73-640-0390 Tel: +886-2-8226-3990 Haidian District, 100085, 150-0031 Japan
General Info: [email protected] Fax: +31-73-641-6525 Fax: +886-2-8226-3992 Beijing, China Tel: +81-3-5728-5196
Tech Support: [email protected] General Info: [email protected] Support: [email protected] Tel: +86-10-62969165 Fax: +81-3-5728-5197
Webmaster: [email protected] Support: [email protected] E-mail: [email protected] Sales inquiry: [email protected]
Tech Support: [email protected]
U.S. East Coast Office U.K. Sales Office Supermicro Science & Technology Park Shanghai, China Office Korea Office
Super Micro Computer, Inc. Super Micro Computer, B.V. Super Micro Computer, Inc. Super Micro Computer, Inc. Super Micro Computer Holding B.V.
525 Washington Blvd, 20th Floor 77 New Cavendish Street, No.1899, Xingfeng Rd., Bade Dist., Room 702, No 398, North Caoxi Road, #1001, Trade Tower, 511, Yeongdong-daero,
Jersey City, NJ 07310 USA The Harley Building, Taoyuan City 334, Taiwan (R.O.C.) HuiZhi Building, Xuhui District, Gangnam-gu, Seoul, Korea, 06164
General Info: [email protected] London, W1W 6XB, UK Tel: +886-2-8226-3990 Shanghai, China 200030 Tel: +82-2-554-0045
Tel: +31-73-640-0390 Ext. 2800 Fax: +886-3-362-8266 Tel: +86-21-61152558 Fax: +82-2-554-0146
General Info: [email protected] Support: [email protected] Tech Support: +86-21-61152556 Sales Inquiry: [email protected]
Support: [email protected] E-mail: [email protected]
Support: [email protected]

Better
Better Performance
Per Watt and Per Dollar
Faster
First-to-Market Innovation with the
Highest Performance Server Designs
Greener
Reduced Environmental
Impact and Lower TCO
Worldwide Headquarters EMEA Headquarters APAC Headquarters

MKT-0002-01/2023-R86
Super Micro Computer, Inc. Super Micro Computer, B.V. Super Micro Computer, Taiwan Inc.
980 Rock Ave. Het Sterrenbeeld 28, 5215 ML, 3F, No. 150, Jian 1st Rd., Zhonghe Dist.,
San Jose, CA 95131, USA ‘s-Hertogenbosch, The Netherlands New Taipei City 235, Taiwan
Tel: +1-408-503-8000 Tel: +31-73-640-0390 Tel: +886-2-8226-3990
Fax: +1-408-503-8008 Fax: +31-73-641-6525 Fax: +886-2-8226-3991
E-mail: [email protected] E-mail: [email protected] E-mail: [email protected]
w w w. sup e rmic ro. co m

©Super Micro Computer, Inc. Specifications subject to change without notice. All other brands and names are the property of their respective owners. All logos, brand names, campaign statements and
product images contained herein are copyrighted and may not be reprinted and/or reproduced, in whole or in part, without express written permission by Supermicro Corporate Marketing.

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X13 Server Solutions

Supporting 4th Gen Intel® Xeon® Scalable Processors

2 X13 Server Solutions - January 2023

Dual socket 4th Gen Intel® Xeon® Scalable processors

Supports NVIDIA H100, A100, Intel® Ponte Vecchio

Flexible Platform Key Applications

X13 Server Solutions - January 2023 3

Open, Modular, Standards-Based Universal GPU System Key Applications

4 X13 Server Solutions - January 2023

SBE-820J2-830/630 Liquid-Cooled SuperBlade SBE-610J2-830/630

SBI-421E-1T3N SBI-421E-5T3N SBI-621E-1C2N SBI-621E-5T2N SBI-611E-1C2N SBI-611E-5T2N

Resource-Saving Architecture Key Applications

X13 Server Solutions - January 2023 5

SYS-211GT-HNTF (Front View)

2U 4-Node Front I/O GrandTwin™ 2U 4-Node Rear I/O GrandTwin™

SYS-211GT-HNTF SYS-211GT-HNC8F SYS-211GT-HNTR SYS-211GT-HNC8R

6 X13 Server Solutions - January 2023

Highly configurable 2U 4-node and 2U 2U 4-Node BigTwin®

Flexible networking with

SYS-621BT-H Series SYS-221BT-H Series SYS-621BT-D Series SYS-221BT-D Series

Highly Modular Multi-Node Systems with Tool-Less Design Key Applications

X13 Server Solutions - January 2023 7

SYS-F511E2-RT (4U8N) SYS-F521E3-RTB (4U4N)

Innovative Twin Architecture to Maximize Serviceability and Key Applications

8 X13 Server Solutions - January 2023

Up to 3 PCIe 5.0 slots in 1U or 8 PCIe 5.0 slots in 2U

2U Hyper-E 2U Hyper-E 2U Hyper 2U Hyper 1U Hyper

Ultimate Configurability for Enterprise and Telco Applications Key Applications

X13 Server Solutions - January 2023 9

Single and dual socket 4th Gen

2 PCIe 5.0 slots in 1U or 6 PCIe 5.0

SYS-621C-TN12R SYS-521C-NR SYS-121C-TN10R SYS-111C-NR SYS-121C-TN2R SYS-611C-TN4R

10 X13 Server Solutions - January 2023

24x EDSFF (E1.S) NVMe SSD

1U High-performance All-Flash 1U High-capacity All-Flash 2U TCO Optimized All-Flash

SSG-121E-NES24R SSG-121E-NE316R SSG-221E-NE324R

Extreme Density, High-performance All-flash Servers Key Applications

X13 Server Solutions - January 2023 11

2U WIO with 4 PCIe Slots

X13SEW-F (WIO) SYS-521E-WR

1U UP WIO 1U UP WIO 2U UP WIO

SYS-511E-WR SYS-111E-WR SYS-521E-WR

Wide-Ranging Flexibility for any Enterprise Workload Key Applications

12 X13 Server Solutions - January 2023

2U Short-depth (430mm), 3-node system 2U 3-Node SuperEdge

Redundant AC power Redundant DC power

Data Center-Class Performance and Expandability at the Edge Key Applications

X13 Server Solutions - January 2023 13

High-density processing power in compact form

1U UP short-depth server with front I/O 2U UP compact OpenRAN server

14 X13 Server Solutions - January 2023

2U 4-Way Compute-Optimized Hyper

2U 4-way Compute-Optimized Hyper 2U 4-way Storage-Optimized Hyper 6U 8-way GPU-Optimized

SYS-241H-TNRTTP SYS-241E-TNRTTP SYS-681E-TR

Maximum Configurability and Scalability Key Applications

X13 Server Solutions - January 2023 15

MODEL SYS-821GE-TNHR SYS-821GE-FTNHR

Serverboard SUPER ® X13DEG-OAD SUPER ® X13DEG-OAD

Chipset Intel® C741 Intel® C741