Docu31797 - VNXe3100 Hardware Information Guide
Docu31797 - VNXe3100 Hardware Information Guide
Docu31797 - VNXe3100 Hardware Information Guide
VNXe3100™
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Preface
Chapter 1 Overview
VNXe3100 platform..................................................................................... 11
Front view ............................................................................................. 12
Rear view .............................................................................................. 12
Hardware features................................................................................. 13
System component description ................................................................... 14
Disk processor enclosure ...................................................................... 14
Front view ............................................................................................. 16
Rear view .............................................................................................. 17
Cache Protection Module ...................................................................... 35
Disk-array enclosure ............................................................................. 36
Specifications ............................................................................................. 52
As part of an effort to improve its product lines, EMC periodically releases revisions of its
software and hardware. Therefore, some functions described in this document might not
be supported by all versions of the software or hardware currently in use. The product
release notes provide the most up-to-date information on product features.
Contact your EMC representative if a product does not function properly or does not
function as described in this document.
Note: This document was accurate at publication time. New versions of this document
might be released on the EMC online support website. Check the EMC online support
website to ensure that you are using the latest version of this document.
Note: The 2U 25, (2.5-inch) disk drive DAE is only supported when you have VNXe
Operating Environment (OE) software version 2.3.x and above installed.
In a dual SP configuration, a 2U, 12 drive (3.5-inch) DPE and DAE can support up to seven
2U, 12 drive (3.5-inch) DAEs, thus supporting a maximum of 96 disk drives. In a dual SP
configuration, a 2U, 12 drive (3.5-inch) DPE with a 2U, 25 drive (2.5-inch) DAE and a 2U,
12 drive (3.5-inch) DAE, the configuration can support up to three 2U, 25 drive (2.5-inch)
DAEs and one 2U, 12 drive (3.5-inch) DAE, thus supporting a maximum of 99 disk drives.
In a single SP configuration, a 2U, 12 drive (3.5-inch) DPE and DAE can support a
maximum of three 2U, 12 drive (3.5-inch) DAEs or 48 disk drives. In a single SP
configuration, a 2U, 12 drive (3.5-inch) DPE with a 2U, 25 drive (2.5-inch) DAE and a 2U,
12 drive (3.5-inch) DAE, thus supporting a maximum 49 disk drives.
IMPORTANT
In a dual SP system, when calculating the number of drives for your VNXe3100 platform,
the DPE is included in the total drive slot quantity of from 96 to 99 drives in a dual SP
system. If the total drive slot quantity exceeds from 96 to 99, you will not be able to add
another DAE.
In a single SP system, when calculating the number of drives for your VNXe3100 platform,
the DPE is included in the total drive slot quantity of from 48 to 49 drives in a single SP
system. If the total drive slot quantity exceeds from 48 to 49, you will not be able to add
another DAE.
The “Disk-array enclosure” section on page 36 provides details about the number of DAEs
supported in a VNXe3100 platform.
Revision history
The following table presents the revision history of this document:
Title Description
“VNXe3100 platform” on Describes and shows the front and rear views of a typical
page 11 VNXe3100.
“Disk processor enclosure” on Describes and illustrates the front and rear views of a DPE and
page 14 the components that comprise the DPE.
“Cache Protection Module” on Describes and illustrates the Cache Protection Module.
page 35
“Disk-array enclosure” on Describes and illustrates the two types of DAEs available for the
page 36 VNXe3100.
Audience
This document is designed for personnel who install, configure, and maintain the
VNXe3100. To use this hardware publication, you should be familiar with digital storage
and networking equipment. Within the document an overview of the architecture,
features, and components of the VNXe3100 platform are presented. The specific aspects
of the VNXe3100 platform and its major components include the front and rear LED
indicators and the connectors on the DPE and the DAE.
Related documentation
The following EMC publication provides additional information:
◆ EMC VNXe3100 System Installation Guide
This guide is available online at www.emc.com/vnxesupport. On this page, click
Documentation. On the page that appears, under VNXe Series, click VNXe3100. On the
next page that appears, under Content type, click Manuals and Guides. On the right side
of the page that appears, a list of all the VNXe3100 product guides will appear. Select the
guide you are interested in from this list.
DANGER indicates a hazardous situation which, if not avoided, will result in death or
serious injury.
WARNING indicates a hazardous situation which, if not avoided, could result in death or
serious injury.
CAUTION, used with the safety alert symbol, indicates a hazardous situation which, if not
avoided, could result in minor or moderate injury.
NOTICE is used to address practices not related to personal injury.
IMPORTANT
An important notice contains information essential to software or hardware operation.
Typographical conventions
EMC uses the following type style conventions in this document:
Normal Used in running (nonprocedural) text for:
• Names of interface elements (such as names of windows, dialog boxes,
buttons, fields, and menus)
• Names of resources, attributes, pools, Boolean expressions, buttons,
DQL statements, keywords, clauses, environment variables, functions,
utilities
• URLs, pathnames, filenames, directory names, computer names,
filenames, links, groups, service keys, file systems, notifications
Bold Used in running (nonprocedural) text for:
• Names of commands, daemons, options, programs, processes,
services, applications, utilities, kernels, notifications, system calls,
man pages
Used in procedures for:
• Names of interface elements (such as names of windows, dialog boxes,
buttons, fields, and menus)
• What user specifically selects, clicks, presses, or types
Italic Used in all text (including procedures) for:
• Full titles of publications referenced in text
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Your comments
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The VNXe Series provides an integrated storage platform for small and medium
businesses as well as remote offices and departments in larger enterprise businesses.
Providing significant advancements in efficiency and simplicity, the VNXe Series facilitates
complete storage consolidation with advanced file and block functionality as well as a
simple, application-driven approach to managing shared storage.
Supporting high availability through the use of redundant components—power supplies,
fans, storage processors—as well as dynamic failover and failback, the VNXe Series also
supports the ability to upgrade system software or hardware while the VNXe platform is
running1.
The VNXe3100 platform is one of three models that make up the VNXe Series. This
platform is ideal for businesses with physical server infrastructures, as well as those
making the move to server virtualization to drive consolidation and greater efficiency. The
VNXe3100 platform also shares a comprehensive set of features including exceptional
capacity utilization, data protection and availability solutions, and advanced support
capabilities. Figure 1 shows an example of the VNXe3100 platform with a front bezel.
VNX-000098
VNXe3100 platform
The VNXe3100 platform is available in two versions:
◆ A 2U DPE with a single storage processor (SP A) and a Cache Protection Module
◆ A 2U DPE with two storage processors (SP A and B)
This section shows an example of the front and rear views of a VNXe3100 platform with a
single SP and Cache Protection Module as well as a dual SP version.
Overview 11
Overview
Note: A fully configured dual SP VNXe3100 platform includes up to seven DAEs supporting
a maximum of from 96 to 99 disk drives depending on the type and mix of the DAEs used
(for configuration information, see “DPE and DAE configuration rules” on page 37).
Front view
Figure 2 shows an example of the front view of the VNXe3100 platform having a 2U, 12
(3.5-inch) disk drive DPE.
SAS 450 GB 15K RPM SAS 450 GB 15K RPM SAS 450 GB 15K RPM SAS 450 GB 15K RPM
SAS 450 GB 15K RPM SAS 450 GB 15K RPM SAS 450 GB 15K RPM SAS 450 GB 15K RPM
VNX-000080
Figure 2 Example of a VNXe3100 platform with a 2U, 12 (3.5-inch) disk drive DPE (front view)
Rear view
Looking from left to right, Figure 3 shows an example of the rear view of a VNXe3100
platform having a 2U DPE with a Cache Protection Module and a single storage processor
(SP A), respectively.
1 1
e0 e1 e2 e3
2 3 1 GBE
1 GbE
1 6Gb SAS
0 6Gb SAS
1
0 1
X4
VNX-000088
Figure 3 Example of a VNXe3100 2U DPE with a Cache Protection Module and a single SP,
respectively (rear view)
Looking from left to right, Figure 4 shows an example of the rear view of a VNXe3100
platform having a 2U DPE with two storage processors (SP B and A), respectively.
1 1
e0 e1 e2 e3 e0 e1 e2 e3
2 3 1 GBE
2 3 1 GBE
1 GbE
1 GbE
0 1 0 1
X4 X4
VNX-000084
Hardware features
Contained in a 2U platform architecture, the VNXe3100 platform weighs approximately
60.5 lb (26.4 kg). It measures 3.5 inches high x 17.5 inches wide x 19.75 inches deep
(8.89 cm x 44.45 cm x 50.16 cm). Between the front and rear of the enclosure, a midplane
distributes power and signals to all the enclosure components. The VNXe3100 platform
2U DPE SPs and the power supply modules plug directly into the midplane connections.
Note: The previously mentioned dimensions are approximate and do not include a rack or
cabinet enclosure.
“Specifications” on page 52 provides the physical, environmental, and power details that
make up the VNXe3100 platform.
Configured for AC-input power, the VNXe3100 platform includes the following hardware
features:
◆ One 2U DPE:
• On the front of the 2U DPE, two types of disk drives are supported in one type of
disk drive carrier; a 2U, 12 (3.5-inch) disk drive carrier. The disk drives supported
are Serial attached-SCSI (SAS) and near-line SAS (NL-SAS). For more information
about the supported disk drives for the VNXe3100, refer to the EMC® VNXe™
Series Storage Systems Disk and OE Matrix document.
• On the rear of the 2U DPE, a single SP (SP A) with a hot-swappable 1-GB Cache
Protection Module or a dual SP (A and B) is supported; each SP consists of:
– A CPU module with an Intel Xeon Dual Core 1.73-GHz processor with two
Double Data Rate Three (DDR3) synchronous dynamic RAM (SDRAM) slots
supporting 4 GB of memory per SP; an optional 8-GB memory upgrade for a
dual SP configurations is available
Note: The SDRAM or memory modules reside on the SP printed circuit board
(motherboard) within the SP. To replace or upgrade a memory module, you
must first remove the SP from the DPE, and then remove the top cover on the SP
to gain access to the SP components. The Replacing a VNXe3100 Memory
Module document provides more information.
– One four-port 1-Gb/s copper Ethernet I/O personality module
Note: A two-port 10-Gb/s copper Ethernet I/O personality module is available
as an upgrade. However, this I/O personality module is only supported in a
dual SP configuration.
– Two 1-GbE iSCSI (host IP connect) ports
– Two integrated four lane 6-Gb/s SAS x4 ports (labeled 6GB 0 x4 and 1 x4);
supported speeds are 1.5, 3, and 6 Gb/s
Note: 6GB SAS port 1 x4 is not used at this time.
– One RS-232/EIA 232 serial (up to 115 K baud) service laptop (micro DB-9) port
– One RS-232/EIA 232 serial standby power supply (SPS) management (micro
DB-9) port
– One 10/100/1000 LAN management (RJ-45) port
VNXe3100 platform 13
Overview
Note: The 2U 25, (2.5-inch) disk drive DAE is only supported when you have VNXe
Operating Environment (OE) software version 2.3.x and above installed.
Note: In the following sections, the illustrations and corresponding tables describe these
individual components. These descriptions are for illustrative purposes only.
IMPORTANT
In a dual SP system, when calculating the number of drives for your VNXe3100 platform,
the DPE is included in the total drive slot quantity of from 96 to 99 drives. If the total drive
slot quantity exceeds from 96 to 99, you will not be able to add another DAE.
In a single SP system, when calculating the number of drives for your VNXe3100 platform,
the DPE is included in the total drive slot quantity of from 48 to 49 drives. If the total drive
slot quantity exceeds from 48 to 49, you will not be able to add another DAE.
“Disk-array enclosure” on page 36 provides details about the available DAEs for the
VNXe3100 platform.
2. In a single SP configuration, the VNXe3100 platform can support up to three DAEs or a maximum
of 49 disk drives.
◆ Midplane
◆ Storage processor (SP)
◆ Power supply module
◆ Cache Protection Module (single SP configuration only)
◆ EMI shielding
Drive carrier
Disk drive carriers are plastic assemblies that provide smooth, reliable contact with the
enclosure slot guides and midplane connectors. Each carrier has a handle with a latch and
spring clips. The latch holds the disk drive in place to ensure proper connection with the
midplane. The “Front view” section on page 16 shows the disk drive ready LEDs that are
integrated into the chassis that the carrier is in. These LEDs primarily show the disk drive
readiness as well as activity.
Disk drives
You can visually distinguish between drive types by their different latch and handle
mechanisms and by the type, capacity, and speed labels on each drive. You can add or
remove a disk drive while the DPE is powered up, but you should exercise special care
when removing drives while they are in use. Disk drives are extremely sensitive electronic
components. For more information about the supported disk drives for the VNXe3100,
refer to the EMC® VNXe™ Series Storage Systems Disk and OE Matrix document.
Midplane
A midplane separates the front-facing disk drives from the rear-facing SPs. It distributes
power and signals to all components in the enclosure. SPs and disk drives plug directly
into the midplane.
Storage processor
The storage processor (SP) is the intelligent component of the disk processor enclosure
(DPE). Basically, it acts as the control center. Each SP includes status LEDs, an I/O
personality module, LAN ports, and so on. Two latches on the SP lock it into place to
ensure proper connection. The “SP” section on page 19 provides more information about
the location and description of the connectors and LEDs.
In the event of a power failure, the backup battery in the Cache Protection Module
provides the power necessary to write the entire contents of the mirrored cache memory to
non-volatile storage or Flash memory in the Cache Protection Module. The “Cache
Protection Module” section on page 35 provides move information about the location and
description of the connectors and LEDs.
EMI shielding
EMI compliance requires a properly installed electromagnetic interference (EMI) shield in
front of the DPE disk drives. The VNXe3100 platform requires a front bezel that has a
locking latch and integrated EMI shield. You must remove the bezel/shield to remove and
install disk drives.
Front view
On the front of the VNXe3100 platform, the 2U, 12 (3.5-inch) disk drive DPE carrier
includes the following:
◆ 3.5-inch 6-Gb/s SAS or 6-Gb/s NL-SAS disk drives (hot-swappable)3
◆ Status LEDs
Note: In the following sections, the illustrations and corresponding tables describe these
individual components. These descriptions are for illustrative purposes only.
Figure 5 shows the location of these disk drives and the status LEDs.
1 2
SAS 450 GB 15K RPM SAS 450 GB 15K RPM SAS 450 GB 15K RPM SAS 450 GB 15K RPM
SAS 450 GB 15K RPM SAS 450 GB 15K RPM SAS 450 GB 15K RPM SAS 450 GB 15K RPM
3 VNX-000090
3. You can add or remove a disk drive while the DPE is powered up, but you should exercise special
care when removing drives while they are in use. Disk drives are extremely sensitive electronic
components.
Table 1 describes the VNXe3100 platform 2U DPE and the disk drive status LEDs.
Table 1 VNXe3100 platform 2U, 12 (3.5-inch) DPE and disk drive LEDs
Rear view
On the rear, the VNXe3100 platform includes one of two versions of the following
hardware components:
◆ One 2U DPE with a single storage processor (SP A):
• One SP
• Two power supply modules
• One Cache Protection Module; 1 GB
◆ One 2U DPE with two storage processors (SP A and B):
• Two SPs
• Two power supply modules
Note: In the following sections, the illustrations and corresponding tables describe these
individual components. These descriptions are for illustrative purposes only.
Figure 6 shows an example of the rear view of a 2U DPE with a Cache Protection Module
and a single storage processor (SP A), respectively.
1 2
1 1
e0 e1 e2 e3
2 3 1 GBE
1 GbE
1 6Gb SAS
0 6Gb SAS
1
0 1
X4
4 3 VNX-000086
2 Power supply module (for a closer view, 4 Cache Protection Module (for a closer
see Figure 9 on page 21) view, see Figure 23 on page 35)
Figure 6 Example of a VNXe3100 platform 2U DPE with a Cache Protection Module and a single SP,
respectively (rear view)
Figure 7 shows an example of the rear view of a 2U DPE with two storage processors (SP B
and SP A), respectively.
1 2
1 1
e0 e1 e2 e3 e0 e1 e2 e3
2 3 1 GBE
2 3 1 GBE
1 GbE
1 GbE
0 1 0 1
X4 X4
3 VNX-000085
Figure 7 Example of a VNXe3100 platform 2U DPE with two SPs (rear view)
SP
Viewing from the rear of the DPE, each SP (B and A), respectively, consists of connectors,
status LEDs, latch handles, and so on.
◆ AC power supply module:
• Power in (recessed) connector (plug)
• Power supply status LEDs (power on and fault)
• Power supply latch handle
◆ SP B and A:
• USB
• Two 1-GbE iSCSI (host IP connect) ports
• Two 6-Gb/s SAS x4 ports (labeled 6Gb SAS 0 x4 and 1 x4)
Note: The RJ-45 LAN connector with a wrench symbol is not used at this time.
• Two (micro DB-9) RS-232/EIA connectors (labeled with a battery symbol and a
wrench symbol)
Note: The DB-9 connector with a battery symbol is not used at this time.
• SP status LEDs
• RS-232/EIA
• SP latch handles (top of SP left and right)
Figure 8 on page 20 shows the location of these SP components.
1 2 3 4 5
18
e0 e1 e2 e3
2 3 1 GBE
1 GbE
1 6Gb SAS
0 6Gb SAS
0 1
X4
13
14 10
17
15 12 9 8
16 7
11 VNX-000082
4 Power supply latch handle (top, middle) 13 1. Shows an example of a four-port 1-Gb/s
copper Ethernet I/O personality module
(labeled e0, e1, e2, and e3)2
5 Power supply module status LEDs 14 Service LAN (RJ-45) port (labeled with a
wrench symbol); not used at this time
6 SP latch handle (middle, left and right) 15 Management LAN (RJ-45) port (labeled
with a network management symbol)
7 Two 1-GbE iSCSI (host IP connect) ports 16 RS-232/EIA (micro DB-9) connector
(labeled 2 and 3) (labeled with a battery symbol); not used
at this time
8 NMI3 (password reset) push button 17 Two 6-Gb/s SAS ports (labeled 6Gb SAS
0 x4 and 1 x4); 1 x4 is not used
Fault LED
Power supply in Power on LED Fan fault LED
VNX-000083
Figure 9 AC power supply/cooling module power in (recessed) connector (plug) and status LEDs
SP
Figure 10 on page 23 shows an example of the VNXe3100 platform SP. The SP has an Intel
Xeon dual core 1.73-GHz processor with two Double Data Rate Three (DDR3) synchronous
dynamic RAM (SDRAM) slots supporting 4 GB of memory per processor or optional 8 GB
per processor.
The SP connectors, LEDs, and other components are:
• USB
• Two 1-GbE iSCSI (host IP connect) ports
• Two 6-Gb/s SAS x4 ports (labeled 6Gb SAS 0 x4 and 1 x4)
Note: The RJ-45 LAN connector with a wrench symbol is not used at this time.
• Two (micro DB-9) RS-232/EIA connectors (labeled with a battery symbol and a
wrench symbol)
Note: The DB-9 connector with a battery symbol is not used at this time.
• SP status LEDs
• RS-232/EIA
• SP latch handles (top of SP left and right)
2 4
1 3 5
e0 e1 e2 e3
2 3 1 GBE
1 GbE
1 6Gb SAS
0 6Gb SAS
0 1
X4
12 11 9 7
10
8 6
VNX-000099
5 SP latch handle (middle, left and right) 11 RS-232/EIA (micro DB-9) connector
(labeled with a battery symbol); not used
at this time
6 Two 1-GbE iSCSI (host IP connect) ports 12 Two 6-Gb/s SAS ports (labeled 6Gb SAS
(labeled 2 and 3) 0 x4 and 1 x4); port 1 x4 is not used at this
time
1. CRU fault LED lights amber when an internal CRU is faulted.
2. The SP fault status LED (amber or blue), flashes at different rates, depending on the current status of the SP.
In a normal, operational state, it will be off.
Table 3 describes the SP status LEDs. The locations in Table 3 are shown in Figure 10 on
page 23.
Table 3 SP LEDs
Note: When the SP Fault/status LED starts blinking four times a second and the SP does not
appear to be functioning, a cache-dirty condition has occurred. The LED indicates that the SP is
waiting for the peer SP to boot to resolve the cache-dirty automatically.
An SP in this state can wait up to one hour for its peer SP to resolve the cache-dirty condition.
When the condition is resolved, the SP continues its boot normally. If the condition is not resolved
automatically, the SP will reboot into service mode. In most circumstances, no manual
intervention is required, and the wait is much less than 1 hour.
When the SP performs a reboot or shutdown sequence, it might have system cache stored in
memory, which can lead to the cache-dirty condition.
◆ One four-port 1-Gb/s copper Ethernet I/O personality module (for front-end
connectivity)
◆ One RS-232/EIA 232 (micro DB-9) to standby power supply (SPS) connector
6-Gb/s SAS ports — The VNXe3100 platform SP has two 6-Gb/s SAS ports (labeled 6GB
SAS 0 x4 and 6GB SAS 1 x4) on the rear of each SP (A and B). These ports provide an
interface for SAS and NL-SAS drives on the DAE. This port is a 26-circuit SAS small
form-factor 8088 (SFF-8088) specification connector (socket or receptacle) using an
SFF-8088 specification mini-SAS 26-circuit cable (plug) with a pull tab.
Figure 11 shows an example of the port connector (socket) and cable connector (plug)
with pull tab.
Pin A1 A13
B1 B13
VNX-000094
Note: Each SAS cable is keyed with an in (or one black circle, ) and out (or one black
diamond, ) connection to prevent incorrect cabling.
Table 4 lists the 6-Gb/s SAS port pin signals used on the connector.
A1 GND B1 GND
A2 Rx 0+ B2 Tx 0+
A3 Rx 0- B3 Tx 0-
A4 GND B4 GND
A5 Rx 1+ B5 Tx 1+
A6 Rx 1- B6 Tx 1-
A7 GND B7 GND
A8 Rx 2+ B8 Tx 2+
A9 Rx 2- B9 Tx 2-
A11 Rx 3+ B11 Tx 3+
A12 Rx 3- B12 Tx 3-
SP 6-Gb/s SAS port LEDs — Figure 12 shows an example of the SP 6-Gb/s SAS ports
(labeled 6-Gb SAS 0 x4 and 1 x4) LEDs (blue) below the bottom connector. These LEDs
indicate the link/activity of the 0 x4 and 1 x4 6-Gb/s SAS ports.
1 6Gb SAS
0 6Gb SAS
0 1
x4
VNX-000089
Note: Each SAS port is keyed with an out (or two black diamonds, ) connection to
prevent incorrect cabling. For information about the SAS cable, see the note under
Figure 11 on page 26.
Four-port 1-Gb/s copper Ethernet I/O personality module — Figure 13 on page 28 shows
the VNXe3100 platform SP optional four-port 1-Gb/s copper Ethernet (RJ-45) personality
module. These ports are labeled e0, e1, e2, and e3 and are used for front-end
connectivity. These ports support speeds of 10-, 100-, and 1000-Mb/s Ethernet
transmission rates over copper wiring.
The four-port 1-Gb/s copper Ethernet (RJ-45) ports on the four-port 1-Gb/s Ethernet I/O
personality module are LAN ports not WAN ports. LAN ports contain safety extra-low
voltage (SELV) circuits, and WAN ports contain telephone-network voltage (TNV) circuits.
Some LAN and WAN ports both use RJ-45 connectors. Use caution when connecting
cables. To avoid electric shock, do not connect TNV circuits to SELV circuits.
e0 e1 e2 e3
1 GbE
VNX-000092
Link LED Activity LED
Figure 13 1-Gb/s copper Ethernet I/O personality module (RJ-45) port LEDs
Table 6 describes the SP optional 1-Gb/s copper Ethernet I/O personality module (RJ-45)
fault and port LEDs.
Table 6 1-Gb/s copper Ethernet I/O personality module (RJ-45) fault and port LEDs
— Off No activity
IMPORTANT
The ports shown in Figure 13 are LAN ports. A symbol depicting a telephone handset with
a line through it indicates that you should not connect WAN type RJ-45 telephone
connectors to these ports.
To access the Ethernet ports, connect a Category 5, 5E, or 6 unshielded twisted-pair (UTP)
cable to the RJ-45 connectors on the back of the SP 1-Gb/s copper Ethernet personality
module, as described in Table 7.
Type Description
The two-port 10-Gb/s copper Ethernet (RJ-45) ports on the two-port 10-Gb/s copper
Ethernet I/O personality module are LAN ports not WAN ports. LAN ports contain safety
extra-low voltage (SELV) circuits, and WAN ports contain telephone-network voltage (TNV)
circuits. Some LAN and WAN ports both use RJ-45 connectors. Use caution when
connecting cables. To avoid electric shock, do not connect TNV circuits to SELV
circuits.Figure 14 shows an example of the VNXe3150 platform SP optional two-port
10-Gb/s copper Ethernet personality module. The ports are labeled e0 and e1 and are
used for front-end connectivity. These ports support speeds up to 10-Gb/s Ethernet
transmission rates over copper wiring.
e0 e1
10 GbE BaseT
VNXe-000124
Activity LED Link LED
Table 8 describes the SP optional 10-Gb/s copper Ethernet personality module fault and
port LEDs.
Table 8 10-Gb/s copper Ethernet personality module fault and port LEDs
— Off No activity
IMPORTANT
The ports shown in Figure 14 are LAN ports. A symbol depicting a telephone handset with
a line through it indicates that you should not connect WAN type RJ-45 telephone
connectors to these ports.
To access the Ethernet ports, connect a Category 6 unshielded twisted-pair (UTP) cable to
the RJ-45 connectors on the back of the SP 1-Gb/s copper Ethernet personality module, as
described in Table 7 on page 28.
IMPORTANT
The ports shown in Figure 15 are 1-Gb/s iSCSI ports. A symbol depicting a telephone
handset with a line through it indicates that you should not connect WAN type RJ-45
telephone connectors to these ports.
The VNXe3100 platform SP comes with two integrated 1-Gb/s iSCSI ports (labeled 2 and 3
1 GBE). These ports provide an interface for connecting 1-Gb/s iSCSI protocol for host IP
connect.
Figure 15 shows an example of the SP 1 Gb/s iSCSI (RJ-45) host IP connect ports.
VNX-000076
1-Gb/s iSCSI host IP connect (RJ-45) port LEDs — Figure 16 shows the SP 1-Gb/s iSCSI
host IP connect (RJ-45) port LEDs—a green LED to the left of the connector and a bi-color
(green/amber) LED to the right of the connector—that indicate the link/activity and speed
of the ports, respectively.
1 2
VNX-000096
Table 9 describes the link/activity and connection speed associated with the SP 1-GB/s
iSCSI host IP connect (RJ-45) port LEDs.
The SP Ethernet (RJ-45) ports are LAN ports not WAN ports. LAN ports contain safety
extra-low voltage (SELV) circuits, and WAN ports contain telephone-network voltage (TNV)
circuits. Some LAN and WAN ports both use RJ-45 connectors. Use caution when
connecting cables. To avoid electric shock, do not connect TNV circuits to SELV circuits.
The VNXe3100 platform SP comes with two integrated dual-port Ethernet ports (labeled
with a network management symbol and a wrench symbol, respectively). These ports
provide an interface for connecting to the public LAN and a service laptop computer,
respectively. The ports are 8-pin MDI RJ-45 type ports for either IEEE 802.3 10Base-T (10
Mb/s), IEEE 802.3u 100Base-TX (100 Mb/s), or 1000Base-T (1000 Mb/s) Ethernet
connections.
Figure 17 shows an example of the SP network management and service laptop Ethernet
(RJ-45) ports.
VNX-000095
IMPORTANT
The ports shown in Figure 17 are LAN ports. A symbol depicting a telephone handset with
a line through it indicates that you should not connect WAN type RJ-45 telephone
connectors to these ports.
Type Description
Network management and service laptop Ethernet (RJ-45) port and connector
(adapter) — Figure 18 shows an example of the Ethernet (RJ-45) cable connector and port.
87654321
VNX-000097
Figure 18 Network management and service laptop Ethernet (RJ-45) connector (adapter) and port
Table 11 lists the SP network management and service laptop Ethernet (RJ-45) pin signals
used on the connector.
Table 11 Network management and service laptop Ethernet port and connector pinout
Network management and service laptop Ethernet (RJ-45) port LEDs — Figure 19 shows
the SP network management and service laptop Ethernet (RJ-45) port LEDs—a green LED to
the left of the connector and a bi-color (green/amber) LED to the right of the
connector—that indicate the link/activity and speed of the Ethernet ports, respectively.
1 2
VNX-000096
Figure 19 Network management and service laptop Ethernet (RJ-45) port LEDs
Table 12 describes the link/activity and connection speed associated with the SP network
management and service laptop Ethernet (RJ-45) port LEDs.
Table 12 Network management and service laptop Ethernet (RJ-45) port LEDs
Serial RS-232/EIA 232 (micro DB-9) socket connector for service laptop
The back of the VNXe3100 platform SP includes a standard serial Electronics Industries
Association (EIA) RS-232 interface (micro DB-9) connector (labeled with a symbol
depicting a wrench on the upper left) to connect to a PC or service laptop computer. This
serial connector (port) allows you to access the SP locally by connecting a terminal—either
a PC running terminal-emulation software or an ASCII terminal—to the port.
Notice the orientation of the pins shown in Figure 20.
Pin 1 5
6 9
VNX-000079
Figure 20 Serial RS-232/EIA 232 (micro DB-9) connector (socket) for service laptop
Table 13 lists the SP serial RS-232/EIA 232 (micro DB-9) pin signals used on the
connector.
1 CD Carrier detect
5 GND Ground
9 RI Ring indicator
VNX-000093
Figure 21 Example of null modem RS-232/EIA 232 (micro DB-9 to serial DB-9) cable
Serial RS-232/EIA 232 (micro DB-9) socket connector for SPS management
The back of the VNXe3100 platform SP includes a second standard serial RS-232/EIA 232
interface (micro DB-9) socket connector (labeled with a symbol depicting a battery on the
bottom, left) to connect to the SPS management port (RJ-12). Notice the orientation of the
pins shown in Figure 22.
Pin 1 5
6 9
VNX-000078
Table 14 lists the SP serial RS-232/EIA 232 (micro DB-9) pin signals used on the
connector.
1 CD Carrier detect
5 GND Ground
9 RI Ring indicator
Power LED
VNX-000077
— Off No fault
Disk-array enclosure
Lifting the DAE and installing it to or removing it from a rack is a two-person job. If
needed, use an appropriate lifting device (mechanical lift). A fully loaded 2U, 12
(3.5-inch) DAE or 2U, 25 (2.5-inch) DAE weighs approximately 52 lb (23.6 kg) or 45 lb
(20.5 kg), respectively.
The VNXe3100 platform supports two types of disk-array enclosures (DAEs) across a
6-Gb/s SAS bus. The DAEs used in the VNXe3100 platform are the:
◆ 2U, 12 (3.5-inch) disk drive DAE
◆ 2U, 25 (2.5-inch) disk drive DAE
Note: The 2U 25, (2.5-inch) disk drive DAE is only supported when you have software
VNXe Operating Environment (OE) version 2.3.x and above installed.
In a dual SP system, when the 2U, 12 (3.5-inch) disk drive DAE is used with a 2U, 12
(3.5-inch) disk drive DPE, the VNXe3100 platform supports up to seven 2U, 12 (3.5-inch)
disk drive DAEs or a maximum of 96 (3.5-inch) disk drives.4
In a dual SP system, when the 2U, 25 (2.5-inch) disk drive DAE is used with a 2U, 12
(3.5-inch) disk drive DPE, the VNXe3100 platform supports up to three 2U, 25 (2.5-inch)
disk drive DAEs and one 2U, 12 (3.5-inch) disk drive DAE or a maximum of 99 disk drives.5
4. In a single SP configuration, the VNXe3100 platform can support up to three 2U, 12 (3.5-inch) disk
drive DAEs or a maximum of 48 disk drives.
5. In a single SP configuration, the VNXe3100 platform can support up to one 2U, 25 (2.5-inch) disk
drive DAEs and one 2U, 12 (3.5-inch) disk drive DAEs or a maximum of 49 disk drives.
IMPORTANT
When calculating the number of drives for your VNXe3100 platform, the 2U DPE is
included in the total drive slot quantity of from 96 to 99 drives in a dual SP system. If the
total drive slot quantity exceeds from 96 to 99, you will not be able to add another DAE.
When calculating the number of drives for your VNXe3100 platform, the 2U DPE is
included in the total drive slot quantity of from 48 to 49 drives in a single SP system. If the
total drive slot quantity exceeds from 48 to 49, you will not be able to add another 2U DAE.
12 12 12 12 12 12 12 12 96
12 12 12 12 12 12 25 X 97
12 12 12 12 12 25 12 X 97
12 12 12 12 25 25 X X 98
12 12 12 12 25 12 12 X 97
12 12 12 25 25 12 X X 98
12 12 25 25 25 X X X 99
12 25 25 25 12 X X X 99
12 12 12 12 X X X X 48
12 12 25 X X X X X 49
12 25 12 X X X X X 49
DAE description
Each DAE consists of the following components:
◆ Drive carrier
◆ Disk drives
◆ Midplane
◆ Link control cards (LCCs)
◆ Power supply/cooling modules
◆ EMI shielding
Drive carrier
Disk drive carriers are plastic assemblies that provide smooth, reliable contact with the
enclosure slot guides and midplane connectors. Each carrier has a handle with a latch and
spring clips. The latch holds the disk drive in place to ensure proper connection with the
midplane. Figure 24 on page 39 shows the disk drive ready LEDs that are integrated into
the chassis that the carrier is in. These LEDs primarily show the disk drive readiness as
well as activity.
Disk drives
You can visually distinguish between drive types by their different latch and handle
mechanisms and by the type, capacity, and speed labels on each drive. You can add or
remove a disk drive while the DAE is powered up, but you should exercise special care
when removing drives while they are in use. Disk drives are extremely sensitive electronic
components. For more information about the supported disk drives for the VNXe3100,
refer to the EMC® VNXe™ Series Storage Systems Disk and OE Matrix document.
Midplane
A midplane separates the front-facing disk drives from the rear-facing LCCs and power
supply/cooling modules. It distributes power and signals to all components in the
enclosure. LCCs, power supply/cooling modules, and disk drives plug directly into the
midplane.
LCCs
An LCC supports, controls, and monitors the DAE, and is the primary interconnect
management element. Each LCC includes connectors for input and expansion to
downstream devices. Figure 29 on page 44 shows an enclosure address (EA) indicator
that is located on each LCC. Figure 29 on page 44 shows an example of an LCC bus (loop)
identification indicator.
Figure 26 on page 42 shows the three status LEDs on the power supply/cooling module.
The enclosure cooling system consists of dual-blower modules in each power
supply/cooling module.
EMI shielding
EMI compliance requires a properly installed electromagnetic interference (EMI) shield in
front of the DAE disk drives. The VNXe3100 platform requires a front bezel that has a
locking latch and integrated EMI shield. You must remove the bezel/shield to remove and
install disk drives.
1 2
SAS 450 GB 15K RPM SAS 450 GB 15K RPM SAS 450 GB 15K RPM SAS 450 GB 15K RPM
SAS 450 GB 15K RPM SAS 450 GB 15K RPM SAS 450 GB 15K RPM SAS 450 GB 15K RPM
3 VNX-000090
6. You can add or remove a disk drive while the DAE is powered up, but you should exercise special
care when removing drives while they are in use. Disk drives are extremely sensitive electronic
components.
Table 18 describes the DAE and the 3.5-inch disk drive status LEDs
Rear view
On the rear, viewing from top to bottom, a 2U, 12 (3.5-inch) DAE includes the following
hardware components (Figure 25 on page 41):
◆ Two power supply/cooling modules
◆ Two 6-Gb/s SAS LCCs (A and B)
Note: If the target drive is not in the LCC’s enclosure, the switch passes the input signal
directly to the output port.
Looking from left to right, Figure 25 shows an example of the rear view of a 2U, 12
(3.5-inch) disk drive DAE.
1 2 3 4 5
LCC B LCC A
1 1
X4 X4 # X4 X4 #
11 10 9 7 6
8 VNX-000091
1 LCC B AC power supply power in (recessed 7 LCC B fault LED (on, amber)
plug)
3 LCC B power supply fault LED (on, amber) 9 LCC B loop bus ID
4 LCC B power supply fan fault LED (on, 10 LCC B SAS connector (input); labeled with
amber) a double circle (or dot) symbol .
5 LCC B right latch handle 11 LCC B SAS connector (output); labeled
with a double diamond symbol .
6 LCC B power LED (on, green)
1. The DAE enclosure ID is sometimes referred to as the enclosure address (EA).
Figure 25 DAE with two LCCs and two power supply/cooling modules (rear view)
Note: On the rear of the DAE, looking from left to right, Figure 25 shows LCC B and LCC A,
respectively.
Each LCC independently monitors the environmental status of the entire enclosure, using
a microcomputer-controlled monitor program. The monitor communicates the status to
the storage processor, which polls disk enclosure status. LCC firmware also controls the
SAS PHYs (physical links) and the disk-drive status LEDs.
Figure 25 shows the location of the enclosure ID indicator7 on each LCC. Each LCC also
includes a bus (back-end port) identification indicator. The SP initializes the bus ID when
the operating system is loaded.
Fault LED
Power supply in Power on LED Fan fault LED
VNX-000083
Figure 26 Example of a DAE AC power supply/cooling module power in (recessed) connector (plug)
and status LEDs
The power supply/cooling modules are located above the LCCs. The units integrate
independent power supply and blower cooling assemblies into a single module.
Each power supply is an auto-ranging, power-factor-corrected, multi-output, offline
converter with its own line cord. Each supply supports a fully configured DAE and shares
load currents with the other supply. The drives and LCCs have individual soft-start
switches that protect the disk drives and LCCs if they are installed while the disk enclosure
is powered up.
Note: Each line cord should be plugged into a different AC power distribution unit (PDU)
for high availability (the VNXe3100 Installation Guide provides more information).
6-Gb/s SAS x4 ports — The 2U, DAE LCC supports two 6-Gb/s SAS x4 ports (labeled 6GB
SAS x4) on the rear of each LCC (A and B). This port is a 26-circuit SAS small form-factor
8088 (SFF-8088) specification connector (socket or receptacle) using an SFF-8088
specification mini-SAS 26-circuit cable (plug) with a pull tab.
Figure 27 shows an example of the port connector (socket) and cable connector (plug)
with pull tab.
Pin A1 A13
B1 B13
VNX-000094
Note: Each SAS cable is keyed with an in (or one black circle, ) and out (or one black
diamond, ) connection to prevent incorrect cabling.
Table 20 lists the DAE LCC 6-Gb/s SAS port pin signals used on the connector.
A1 GND B1 GND
A2 Rx 0+ B2 Tx 0+
A3 Rx 0- B3 Tx 0-
A4 GND B4 GND
A5 Rx 1+ B5 Tx 1+
A6 Rx 1- B6 Tx 1-
A7 GND B7 GND
A8 Rx 2+ B8 Tx 2+
A9 Rx 2- B9 Tx 2-
A11 Rx 3+ B11 Tx 3+
A12 Rx 3- B12 Tx 3-
6-Gb/s SAS port LEDs and port direction (input or output) — Figure 28 shows the LCC
6-Gb/s SAS port LED—a bi-color (blue/green) LED below the connector, either left or
right—that indicates the link of the SAS port. Figure 28 also shows a double black circle
(or dot) symbol (for input) or a double black diamond symbol (for output).
x4 x4
VNX-000087
x4 x4 #
Note: The 2U 25, (2.5-inch) disk drive DAE is only supported when you have VNXe
Operating Environment (OE) software version 2.3.x and above installed.
1 2 3
5 4 VNX-000276
2 DAE fault LED (blue), amber if faulted 5 Disk drive ready/activity LED (blue)
Table 22 describes the DAE and the 2.5-inch disk drive status LEDs
Table 22 Example of a 2U, 25 (2.5-inch) DAE and the disk drive LEDs
8. You can add or remove a disk drive while the DAE is powered up, but you should exercise special
care when removing drives while they are in use. Disk drives are extremely sensitive electronic
components.
Table 22 Example of a 2U, 25 (2.5-inch) DAE and the disk drive LEDs (continued)
Rear view
On the rear, a 2U, 25 (2.5-inch) DAE includes the following hardware components
(Figure 31 on page 47):
◆ Two 6-Gb/s SAS LCCs (A and B)
◆ Two power supply/cooling modules
Note: If the target drive is not in the LCC enclosure, the switch passes the input signal
directly to the output port.
Each LCC independently monitors the environmental status of the entire enclosure, using
a microcomputer-controlled monitor program. The monitor communicates the status to
the storage processor, which polls disk enclosure status. LCC firmware also controls the
SAS PHYs and the disk-module status LEDs.
As shown in Figure 31 on page 47, an enclosure ID9 indicator is located on each LCC. Each
LCC also includes a bus (back-end port) identification indicator. The SP initializes the bus
ID when the operating system is loaded.
Figure 31 shows an example of the rear view of a 2U, 25 (2.5-inch) disk drive DAE.
1 2 3 4 5 6 7 8 9 10 11
#
X4
X4
SAS
6 Gb
B
6 Gb
SAS
X4
X4
#
12 VNX-000280
2 LCC B power supply fault LED (on, amber) 8 LCC B power and fault LEDs
4 LCC B SAS connector link LED (on, blue) 10 LCC B management (RJ-12) connector to
SPS (not used)
5 LCC B SAS connector (input); labeled with 11 LCC A power supply latch handle
a double circle (or dot) symbol .
6 LCC B SAS connector (output); labeled 12 LCC A right latch handle
with a double diamond symbol .
Figure 31 DAE with two LCCs and two power supply/cooling modules (rear view)
Note: Figure 25 on page 41, looking from the rear of the DAE, shows LCC B located on the
top and LCC A located on the bottom.
Latch handle
Power supply in
Figure 32 Example of 2U, 25 (2.5-inch) DAE AC power supply/cooling module power in (recessed)
connector (plug) and status LEDs
Table 23 describes the 2U, 25 (2.5-inch) DAE power supply/cooling module LEDs.
The power supply/cooling modules are located to the left and right of the LCCs. The units
integrate independent power supply and dual-blower cooling assemblies into a single
module.
Each power supply is an auto-ranging, power-factor-corrected, multi-output, offline
converter with its own line cord. Each supply supports a fully configured DAE and shares
load currents with the other supply. The drives and LCCs have individual soft-start
switches that protect the disk drives and LCCs if they are installed while the disk enclosure
is powered up. The enclosure cooling system includes two dual-blower modules.
Pin A1 A13
B1 B13
VNX-000094
Note: Each SAS cable is keyed with an in and out connection to prevent incorrect cabling.
Table 24 lists the 2U, DAE 6-Gb/s SAS port pin signals used on the connector.
A1 GND B1 GND
A2 Rx 0+ B2 Tx 0+
A3 Rx 0- B3 Tx 0-
A4 GND B4 GND
A5 Rx 1+ B5 Tx 1+
A6 Rx 1- B6 Tx 1-
A7 GND B7 GND
A8 Rx 2+ B8 Tx 2+
A9 Rx 2- B9 Tx 2-
A11 Rx 3+ B11 Tx 3+
A12 Rx 3- B12 Tx 3-
Latch handle
6 Gb
SAS
X4
X4
Note: The management Ethernet (RJ-12) LCC to SPS port connector is not used in the
VNXe3100 platform.
Figure 35 shows the management port (labeled with two symbols; one depicting a
telephone handset with a line through it and the other depicting a battery). The telephone
handset with a line through it symbol means that you cannot connect telephone type
circuits to this connector (see the following WARNING). This port connects the LCC (A and
B) ports to the SPS (A and B) ports, respectively.
The SPS (RJ-12) port is a LAN port not a WAN port. LAN ports contain safety extra-low
voltage (SELV) circuits, and WAN ports contain telephone-network voltage (TNV) circuits.
An RJ-45 (or TNV-type) looks the same as the RJ-12 except for two very important
differences. An RJ-45 is an 8-wire modular jack. The RJ-12 is a six-wire modular jack. The
RJ-45 plugs and jacks are wider than their RJ-12 counterparts - 7/16" vs 3/8". An RJ-45
plug won't fit into an R-J12 jack. But an RJ-12 plug will fit into an RJ-45 jack. Use caution
when connecting cables. To avoid electric shock, do not attempt to connect TNV circuits
to SELV circuits.
VNX-000106
The cable connecting the LCC to the SPS is an RJ-12 to RJ-12. It has an RJ-12 adapter (LCC
side) on one end and a RJ-12 (SPS side) adapter on the other end.
6 Gb
SAS
X4
X4
#
VNX-000277
Specifications
Table 27 lists the VNXe3100 platform physical specifications, operating environment, and
power requirements.
Parameter Characteristics
Dimensions (approximate)
Height 28 in. (71.12 cm) or 16 NEMA units (U) total; one disk
processor enclosure (DPE, 2U) and seven disk-array enclosures
(2U, 12 [3.5-inch] DAE)
Width 17.5 in. (44.5 cm); mounting bars fit standard 19-inch NEMA
cabinets
Weight 424.5 lb (192.55 kg) total; one DPE and seven 2U, 12 (3.5-inch)
DAEs
Operating environment
AC line current 4.0 A max at 100 VAC, 2.0 A max at 200 VAC1
2.5 A max at 100 VAC, 1.3 A max at 200 VAC2