OSI Floortek Anti-Static Vinyl Installation Methodology

ANTI-STATIC VINYL
INSTALLATION
GUIDE
FLOORTEK | HUAJING
ESD Vinyl Tile 600x600x3mm

INSTALLATION
1. Materials, Equipment & Tools

• ESD Vinyl Tile: physical properties and appearance
dimensions should meet standard NF EN 13 415 -NF EN 1081 or
standard NF EN 61-340-4-1 or ASTM F 150 NF PA 99. The
resistance value of conductive tile should be 2.5×104 -
1.0×106Ω, the resistance value of the static dissipat ive tile
should be 1.0×106-1.0×109 Ω.
• Conductive Adhesive: should be water-soluble glue, the
resistance value should be less than the resistance value of
vinyl tile, the bonding strength should be greater than
3×106N/M2.
• Welding Rod: should use uniform color, uniform outer
diameter and flexible material.
• Copper Strip: the thickness should be not less than 0.025mm,
the width should be 12mm or 15mm.
• The ESD vinyl tile should be stored in a ventilated and dry
warehouse away from acids, alkalis and other corros ive
substances. It should be lightly loaded and unloaded. It is
strictly forbidden to hit hard, and to be exposed to outdoor
sun and rain.
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• Installation equipment (including tools): slotting machine,
plastic welding torch, rubber boring head, cutter, ruler,
brush, waxing machine, etc. Its specifications, performance
and technical indicators should meet the construction
process requirements.
• Installation Preparation
(1) Learn design and construction drawings and survey the
construction site.
(2) Formulate construction plan, draw the grounding system
diagram and ground grid layout.
(3) Prepare materials, equipment and tools according to the
construction process requirements.
(4) When the area is larger than 200 square meters,
demonstration laying should be carr ied out before the
formal
installation.
2. Installation Site Requirement

• Temperature of the installation site should be between 10
and 35 °C; the relative temperature and humidity should not
exceed 75%; the ventilation should be good, other
construction projects should have basically ended.
• When base ground is cement or terrazzo:
(1) Ground should be clean, and the paint, adhesive and
other residues on the ground should be cleaned up.
(2) Ground should be level, check with a 2 meter ruler, the
clearance should be less than 2mm. If there are irregularities
or cracks, they must be filled.
(3) Ground should be dry, it should be waterproofed first.
(4) The surface layer should be hard and sand -free, and the
mortar strength is recommended to use self -leveling
concrete above the medium strength type.
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• When the ground is already installed with wood floor, tile,
plastic, etc, the original floor should be removed, and the
residual adhesive on the ground should be completely
removed. The newly poured ground should wait for the 28d
curing period before proceeding to the next construction of
the process.
• Equip the installation site with artificial lighting devices.
• Determine the outlet for earthing. When the area is within
100m2, the outlet should be no less than one. For every
100m2 increase of the area, add 1 -2 outlet for earthing.
• Ground should be thoroughly cleaned before construction.
No scum, dust or other dirt should be left on the ground.
GROUND PREPARATION
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3. Installation Process
1. Drawing Lines: drawing the baseline and lines for the layout
of copper strip. The copper strips are arranged along the
medians of each tile and encircled around the edge of the
room. Normally copper strip grid is 0.6×0.6m.
2. Laying Copper Strip: copper strip should be laid based on
the lines drawn. The cross-section of copper strip should be
at the center of vinyl tile. The strip shall be laid flat, and the
line connected to outlet for e arthing should be left long
enough.
LAYING COPPER STRIP
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3. Applying Conductive Adhesive: adhesive should be applied on
the ground and coated strip. The coating should be uniform and
comprehensive, adhesive should be dried naturally after
applying.
APPLYING CONDUCTIVE ADHESIVE
Page 5
4. Laying Vinyl Tile: when adhesive is dried to the point where it is
not sticky, start laying. Follow the baseline and lay the ESD
flooring. There should be a 1 -2mm gap between 2 tiles, and the
width of gap should be the same. Use a rubber h ammer to hit
tile surface. Check the edge to ensure that the sticking is firm.
Apply non-standard vinyl tile to the edge .
LAYING VINYL TILE
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5. Leading Outlet for Earthing: when the laying arrives earthing
place, lead cooper strip out and connect to grounding
terminal by soldering or crimping method.
6. Opening V-shaped Groove: after lay all tiles successfully,

workers should open the groove with a slotting machine
along the seam of vinyl tiles. The groove li ne should be
straight and uniform, and the groove width is preferably
3±0.2mm.
7. Laying Welding Rod: apply plastic welding gun to the

groove, to hot-weld rod to the tiles. The welding excess is
flattened with knife, but the surface of the tile must not be
scratched.
LAYING WELDING ROD
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8. Surface Cleaning: after completing the laying, clean the floor and
apply wax protection (if necessary )
ELECTRONIC RESISTANCE TEST
CLEAN
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The method is based on our long -standing experience and
extensive testing. However, the actual application of the product
should follow the conditions of actual application and the method
used. These are uncontrollable factors .
ESD Tiles Installation Structure
Page 9

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ANTI-STATIC VINYL

ESD Vinyl Tile 600x600x3mm

1. Materials, Equipment & Tools

2. Installation Site Requirement

LAYING COPPER STRIP

APPLYING CONDUCTIVE ADHESIVE

LAYING VINYL TILE

6. Opening V-shaped Groove: after lay all tiles successfully,

7. Laying Welding Rod: apply plastic welding gun to the

LAYING WELDING ROD

ELECTRONIC RESISTANCE TEST

ESD Tiles Installation Structure

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