Esp32 Wrover
Esp32 Wrover
Esp32 Wrover
Datasheet
Version 1.5
Espressif Systems
About This Guide
This document provides the specifications for the ESP32-WROVER/ESP32-WROVER-I modules.
Revision History
For revision history of this document, please refer to the last page.
Certification
Download certificates for Espressif products from here.
1 Overview 1
2 Pin Definitions 3
2.1 Pin Layout 3
2.2 Pin Description 4
2.3 Strapping Pins 5
3 Functional Description 7
3.1 CPU and Internal Memory 7
3.2 External Flash and SRAM 7
3.3 Crystal Oscillators 7
3.4 RTC and Low-Power Management 8
5 Electrical Characteristics 10
5.1 Absolute Maximum Ratings 10
5.2 Wi-Fi Radio 10
5.3 BLE Radio 11
5.3.1 Receiver 11
5.3.2 Transmitter 11
5.4 Reflow Profile 12
6 Schematics 13
7 Peripheral Schematics 14
8 Dimensions 15
10Learning Resources 17
10.1 Must-Read Documents 17
10.2 Must-Have Resources 17
Revision History 18
List of Tables
1 ESP32-WROVER Specifications 1
2 Pin Definitions 4
3 Strapping Pins 5
4 Power Consumption by Power Modes 8
5 Absolute Maximum Ratings 10
6 Wi-Fi Radio Characteristics 10
7 Receiver Characteristics — BLE 11
8 Transmitter Characteristics — BLE 11
List of Figures
1 ESP32-WROVER Pin Layout 3
2 Reflow Profile 12
3 ESP32-WROVER Schematics 13
4 ESP32-WROVER Peripheral Schematics 14
5 ESP32-WROVER Dimensions 15
6 ESP32-WROVER-I Dimensions 15
7 ESP32-WROVER-I U.FL Connector Dimensions 16
1. OVERVIEW
1. Overview
ESP32-WROVER is a powerful, generic WiFi-BT-BLE MCU module that targets a wide variety of applications,
ranging from low-power sensor networks to the most demanding tasks, such as voice encoding, music streaming
and MP3 decoding.
At the core of this module is the ESP32-D0WDQ6 chip*, same as ESP-WROOM-32 module. Compared to ESP-
WROOM-32, ESP32-WROVER has an additional SPI Pseudo static RAM (PSRAM) of 32 Mbits. As such, ESP32-
WROVER features both 4 MB external SPI flash and 4 MB external PSRAM.
The ESP32-WROVER module has a PCB antenna, while the ESP32-WROVER-I uses an IPEX antenna. For diem-
snions of the IPEX connector, please see Chapter 9. The information in this datasheet is applicable to both of
the two modules.
The chip embedded is designed to be scalable and adaptive. There are two CPU cores that can be individually
controlled, and the clock frequency is adjustable from 80 MHz to 240 MHz. The user may also power off the CPU
and make use of the low-power co-processor to constantly monitor the peripherals for changes or crossing of
thresholds. ESP32 integrates a rich set of peripherals, ranging from capacitive touch sensors, Hall sensors, SD
card interface, Ethernet, high-speed SPI, UART, I2S and I2C.
Note:
* For details on the part number of the ESP32 series, please refer to the document ESP32 Datasheet.
The integration of Bluetooth, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted,
and that the module is future proof: using Wi-Fi allows a large physical range and direct connection to the internet
through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast
low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable
for battery powered and wearable electronics applications. ESP32 supports a data rate of up to 150 Mbps,
and 20.5 dBm output power at the antenna to ensure the widest physical range. As such the chip does offer
industry-leading specifications and the best performance for electronic integration, range, power consumption,
and connectivity.
The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in as
well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that developers can continually upgrade
their products even after their release.
2. Pin Definitions
Keepout Zone
1 GND GND 38
2 VDD33 IO23 37
3 EN IO22 36
4 SENSOR_VP TXD0 35
5 SENSOR_VN RXD0 34
6 IO34 IO21 33
7 IO35 39:GND NC 32
8 IO32 IO19 31
9 IO33 IO18 30
10 IO25 IO5 29
11 IO26 NC 28
12 IO27 NC 27
13 IO14 IO4 26
14 IO12 IO0 25
15 GND IO2 24
16 IO13 IO15 23
17 SD2 SD1 22
18 SD3 SD0 21
19 CMD CLK 20
• MTDI
• GPIO0
• GPIO2
• MTDO
• GPIO5
Software can read the value of these five bits from the register ”GPIO_STRAPPING”.
During the chip’s system reset (power-on reset, RTC watchdog reset and brownout reset), the latches of the
strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip is powered
down or shut down. The strapping bits configure the device boot mode, the operating voltage of VDD_SDIO and
other system initial settings.
Each strapping pin is connected with its internal pull-up/pull-down during the chip reset. Consequently, if a strap-
ping pin is unconnected or the connected external circuit is high-impendence, the internal weak pull-up/pull-down
will determine the default input level of the strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or apply the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32.
After reset, the strapping pins work as the normal functions pins.
Note:
• Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing
of SDIO Slave” after booting.
• The MTDI is internally pulled high in the module, as the flash and SRAM in ESP32-WROVER only support a power
voltage of 1.8V (output by VDD_SDIO).
3. Functional Description
This chapter describes the modules and functions integrated in ESP32-WROVER.
• 520 kB (8 kB RTC FAST Memory included) of on-chip SRAM for data and instruction.
– 8 kB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is
accessed by the main CPU during RTC Boot from the Deep-sleep mode.
• 8 kB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor during
the Deep-sleep mode.
• 1 kbit of eFuse, of which 320 bits are used for the system (MAC address and chip configuration) and the
remaining 704 bits are reserved for customer applications, including Flash-Encryption and Chip-ID.
ESP32 can access the external QSPI flash and SRAM through high-speed caches.
• Up to 16 MB of external flash are memory-mapped onto the CPU code space, supporting 8, 16 and 32-bit
access. Code execution is supported.
• Up to 8 MB of external flash/SRAM are memory-mapped onto the CPU data space, supporting 8, 16 and
32-bit access. Data-read is supported on the flash and SRAM. Data-write is supported on the SRAM.
ESP32-WROVER integrates 4 MB of external SPI flash. The 4-MB SPI flash can be memory-mapped onto the
CPU code space, supporting 8, 16 and 32-bit access. Code execution is supported.
In addition to the 4 MB SPI flash, ESP32-WROVER also integrates 4 MB PSRAM for more memory space.
• Power modes
– Active mode: The chip radio is powered on. The chip can receive, transmit, or listen.
– Modem-sleep mode: The CPU is operational and the clock is configurable. The Wi-Fi/Bluetooth base-
band and radio are disabled.
– Light-sleep mode: The CPU is paused. The RTC memory and RTC peripherals, as well as the ULP
co-processor are running. Any wake-up events (MAC, host, RTC timer, or external interrupts) will wake
up the chip.
– Deep-sleep mode: Only the RTC memory and RTC peripherals are powered on. Wi-Fi and Bluetooth
connection data are stored in the RTC memory. The ULP co-processor can work.
– Hibernation mode: The internal 8-MHz oscillator and ULP co-processor are disabled. The RTC recovery
memory is powered down. Only one RTC timer on the slow clock and some RTC GPIOs are active.
The RTC timer or the RTC GPIOs can wake up the chip from the Hibernation mode.
The power consumption varies with different power modes/sleep patterns and work statuses of functional modules.
Please see Table 4 for details.
Note:
• When Wi-Fi is enabled, the chip switches between Active and Modem-sleep mode. Therefore, power consumption
changes accordingly.
• In Modem-sleep mode, the CPU frequency changes automatically. The frequency depends on the CPU load and
the peripherals used.
• During Deep-sleep, when the ULP co-processor is powered on, peripherals such as GPIO and I2C are able to
work.
• When the system works in the ULP sensor-monitored pattern, the ULP co-processor works with the ULP sensor
periodically; ADC works with a duty cycle of 1%, so the power consumption is 100 µA.
Note:
External connections can be made to any GPIO except for GPIOs in the range 6-11, 16, or 17. GPIOs 6-11 are connected
to the module’s integrated SPI flash and PSRAM. GPIOs 16 and 17 are connected to the module’s integrated PSRAM.
For details, please see Chapter 6 Schematics.
5. Electrical Characteristics
Note:
The specifications in this chapter have been tested under the following general condition: VDD = 3.3V, TA = 27°C, unless
otherwise specified.
1. VIO is the power supply for a specific pad. More details can be found in the ESP32 Datasheet, Appendix IO_MUX. For
example, the power supply for SD_CLK is the VDD_SDIO.
∗
For the module that uses an IPEX antenna, the output impedance is 50Ω.
5.3.2 Transmitter
Peak Temp.
235 ~ 250℃
250
Preheating zone Reflow zone Cooling zone
150 ~ 200℃ 60 ~ 120s !217℃ 60 ~ 90s -1 ~ -5℃/s
217
200
Soldering time
> 30s
Ramp-up zone
1 ~ 3℃/s
100
50
25
Time (sec.)
0
0 50 100 150 200 250
6. SCHEMATICS
6. Schematics
GND
ESP32 Module:
with 1.8V Flash & SRAM GND GND
3
U1
GND
GND XOUT
The BLUE netname means 1.8V.
C1 C2 J1 J5 J28
1 GND 1 1
XIN
22pF/6.3V(10%) 22pF/6.3V(10%)
VDD33 CON1 CON1 CON1
D1
2
ESD3.3V88D-LCDN GND GND
C3 J3 J37 J2
1 VDD33 1 GPIO13 1 GPIO23
GND
100pF/6.3V(10%) GND
R1 20K(5%) 40MHz+/-10ppm CON1 CON1 CON1
VDD33
GND GPIO21
C6 C5 U0TXD J6 J10 J4
C9 U0RXD 1 CHIP_PU 1 SHD/SD2 1 GPIO22
10nF/6.3V(10%) 3.3nF/6.3V(10%) GPIO22
0.1uF/6.3V(10%) GPIO19 CON1 CON1 CON1
VDD33 GND
GND C4 J13
J8 J7
49
48
47
46
45
44
43
42
41
40
39
38
37
VDD33 1 SENSOR_VP 1 SWP/SD3 1 U0TXD
IPEX C13 C12 C11 C10 0.1uF/6.3V(10%)
1 R14 0R(5%)/NC
GND
CAP1
CAP2
VDDA
XTAL_P
XTAL_N
VDDA
GPIO21
U0TXD
U0RXD
GPIO22
GPIO19
VDD3P3_CPU
CON1 CON1 CON1
10uF/6.3V(10%) 10uF/6.3V(10%) 1uF/10V(20%) 0.1uF/6.3V(10%)
J39 GND
2
J11 J16 J9
GND GND GND GND 1 SENSOR_VN 1 SCS/CMD 1 U0RXD
GND
ANT1 1 36 GPIO23 CON1 CON1 CON1
1 R15 0R(5%) C14 4.7pF±0.25pF 2 VDDA GPIO23 35 GPIO18
2 3 LNA_IN GPIO18 34 GPIO5 J14 J19 J12
13
VDD3P3_RTC
J20 J25 J18
1 GPIO32 1 SDI/SD1 1 GPIO19
32K_XN
GPIO25
GPIO26
GPIO27
GPIO2
GPIO0
GPIO4
MTMS
MTDO
MTCK
C18 C24 CON1 CON1 CON1
MTDI
1uF/10V(20%) 2K(5%)
U2 ESP32-D0WDQ6 J23 J38 J21
13
14
15
16
17
18
19
20
21
22
23
24
1 GPIO33 1 GPIO15 1 GPIO18
GND GND VDD33
CON1 CON1 CON1
SCK/CLK R12 0R(5%) FLASH_CLK C19
GPIO33
GPIO25
GPIO26
GPIO27
GPIO14
GPIO12
GPIO13
GPIO15
CON1 CON1
VDD_SDIO VDD_SDIO VDD_SDIO
J31 J30
1 GPIO27 1
ESP32-WROVER Datasheet V1.5
R10
8
U3 CON1 CON1
SCS/CMD 1 5 SDI/SD1 10K(5%)
VCC
/CS DI VDD33
U4
FLASH_CLK 6 2 SDO/SD0 GPIO16 1 8 J33 J32
CLK DO CS# VDD 1 GPIO14 1 GPIO4
SDO/SD0 2 7 SHD/SD2
GND
10K(5%)
ESP-PSRAM32
J35 J34
1 GPIO12 1 GPIO0
GND GND
CON1 CON1
7. Peripheral Schematics
VDD33
U1
39 VDD33
GND 1 P_GND 38 GND
2 GND1 GND3 37 GPIO23 JP1
EN 3 3V3 IO23 36 GPIO22 1
GPI36 SENSOR_VP 4 EN IO22 35 TXD0 2 1
R1 GPI39 SENSOR_VN 5 SENSOR_VP TXD0 34 RXD0 3 2
C1 C2 GPI34 6 SENSOR_VN RXD0 33 GPIO21 4 3
GPI35 7 IO34 IO21 32 NC3 4
IO35 NC
22uF/25V(10%)
0.1uF/50V(10%)
GPIO12 14 25 GPIO0
GND 15 IO12 IO0 24 GPIO2
GPIO13 16 GND2 IO2 23 GPIO15
SD2 17 IO13 IO15 22 SD1
SD2 SD1
1
2
SD3 18 21 SD0 GND
CMD 19 SD3 SD0 20 CLK
1
2
CMD CLK
GND GND
ESP32_WROVER
JP2
Boot Option
Reset Button
JP3
SW1
1 GPIO14 MTMS
R2 0R(5%) EN 1 2 GPIO12 MTDI
2 3 GPIO13 MTCK
C4 0.1uF/50V(10%) 3 4 GPIO15 MTDO
4
JTAG
GND
Note:
• Soldering Pad 39 to the Ground of the base board is not necessary for a satisfactory thermal performance. If users
do want to solder it, they need to ensure that the correct quantity of soldering paste is applied.
• When ESP32 is powered on and off repeatedly by switching the power rails, and there is a large capacitor on
the VDD33 rail, a discharge circuit can be added to the VDD33 rail. Please find details in Chapter Peripheral
Schematics, in ESP-WROOM-32 Datasheet.
• When battery is used as the power supply for ESP32 series of chips and modules, a supply voltage supervisor
is recommended to avoid boot failure due to low voltage. Users are recommended to pull CHIP_PU low if the
power supply for ESP32 is below 2.3V. For the reset circuit, please refer to Figure ESP-WROOM-32 Peripheral
Schematics, in ESP-WROOM-32 Datasheet.
8. Dimensions
唀渀洀愀爀欀攀搀
唀渀洀愀爀欀攀搀
Unit: mm
• ESP32 Datasheet
This document provides an introduction to the specifications of the ESP32 hardware, including overview, pin
definitions, functional description, peripheral interface, electrical characteristics, etc.
• ESP32 BBS
This is an Engineer-to-Engineer (E2E) Community for ESP32 where you can post questions, share knowledge,
explore ideas, and help solve problems with fellow engineers.
• ESP32 GitHub
ESP32 development projects are freely distributed under Espressif’s MIT license on GitHub. It is established
to help developers get started with ESP32 and foster innovation and the growth of general knowledge about
the hardware and software surrounding ESP32 devices.
• ESP32 Tools
This is a webpage where users can download ESP32 Flash Download Tools and the zip file ”ESP32 Certifi-
cation and Test”.
• ESP-IDF
This webpage links users to the official IoT development framework for ESP32.
• ESP32 Resources
This webpage provides the links to all available ESP32 documents, SDK and tools. �����������
Revision History