TMP451
TMP451
TMP451
TMP451
SBOS686A – JUNE 2013 – REVISED DECEMBER 2014
TMP451 ±1°C Remote and Local Temperature Sensor With η-Factor and Offset Correction,
Series-Resistance Cancellation, and Programmable Digital Filter
1 Features 3 Description
1• ±1°C Accuracy for Local and Remote Diode The TMP451 device is a high-accuracy, low-power
Sensors remote temperature sensor monitor with a built-in
local temperature sensor. The remote temperature
• 0.0625°C Resolution for Local and Remote sensors are typically low-cost discrete NPN or PNP
Channels transistors, or substrate thermal transistors or diodes
• 1.7-V to 3.6-V Supply and Logic Voltage Range that are integral parts of microprocessors,
• 27-µA Operating Current, 3-µA Shutdown Current microcontrollers, or FPGAs. The temperature is
represented as a 12-bit digital code for both the local
• Series Resistance Cancellation and remote sensors, giving a resolution of 0.0625°C.
• η-Factor and Offset Correction The temperature accuracy is ±1°C (maximum) in the
• Programmable Digital Filter typical operating range for the local and the remote
temperature sensors. The two-wire serial interface
• Diode Fault Detection
accepts the SMBus communication protocol.
• Two-Wire and SMBus™ Serial Interface
Advanced features such as series resistance
• 8-Lead WSON (WDFN) Package
cancellation, programmable nonideality factor (η-
factor), programmable offset, programmable
2 Applications temperature limits, and a programmable digital filter
• Processor and FPGA Temperature Monitoring are combined to provide a robust thermal monitoring
solution with improved accuracy and noise immunity.
• Smart Phones and Tablets
• Servers, Desktops, and Notebooks The TMP451 device is ideal for high-accuracy
temperature measurements in multiple locations and
• Telecom Equipment and Storage Area Networks
in a variety of automotive subsystems. The device is
(SANs) specified for operation over a supply voltage range of
1.7 V to 3.6 V and a temperature range of –40°C to
125°C.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
TMP451 WSON (8) 2.00 mm × 2.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
1.7 V to 3.6 V 1.7 V to 3.6 V
V+
Processor or
ASIC 2 8
D+ SCL
Built-in Thermal 3 7
D SDA
Transistor/Diode SMBus
TMP451 Controller
4
THERM
5
GND
ALERT / THERM2
6
Overtemperature Shutdown
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMP451
SBOS686A – JUNE 2013 – REVISED DECEMBER 2014 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.3 Feature Description................................................... 8
2 Applications ........................................................... 1 7.4 Device Functional Modes........................................ 12
3 Description ............................................................. 1 7.5 Programming........................................................... 12
7.6 Register Map........................................................... 16
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3 8 Application and Implementation ........................ 29
8.1 Application Information............................................ 29
6 Specifications......................................................... 3
8.2 Typical Application ................................................. 29
6.1 Absolute Maximum Ratings ...................................... 3
6.2 ESD Ratings.............................................................. 3 9 Power Supply Recommendations...................... 32
6.3 Recommended Operating Conditions....................... 4 10 Layout................................................................... 32
6.4 Thermal Information .................................................. 4 10.1 Layout Guidelines ................................................. 32
6.5 Electrical Characteristics........................................... 4 10.2 Layout Example .................................................... 33
6.6 Timing Requirements ............................................... 5 11 Device and Documentation Support ................. 34
6.7 Typical Characteristics .............................................. 6 11.1 Trademarks ........................................................... 34
7 Detailed Description .............................................. 8 11.2 Electrostatic Discharge Caution ............................ 34
7.1 Overview ................................................................... 8 11.3 Glossary ................................................................ 34
7.2 Functional Block Diagram ......................................... 8 12 Mechanical, Packaging, and Orderable
Information ........................................................... 34
4 Revision History
Changes from Original (June 2013) to Revision A Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 3
DQF Package
8-Pin WSON
Top View
V+ 1 8 SCL
D+ 2 7 SDA
D- 3 6 ALERT/THERM2
THERM 4 5 GND
Pin Functions
PIN
TYPE DESCRIPTION
NAME NO.
Interrupt or SMBus alert output. Can be configured as a second THERM output. Open-drain; requires
ALERT/THERM2 6 Digital output
pullup resistor to voltage between 1.7 V and 3.6 V.
D– 3 Analog input Negative connection to remote temperature sensor.
D+ 2 Analog input Positive connection to remote temperature sensor.
GND 5 Ground Supply ground connection.
Serial clock line for SMBus. Input; requires pullup resistor to voltage between 1.7 V and 3.6 V if driven
SCL 8 Digital input
by open-drain output.
Bidirectional digital
SDA 7 Serial data line for SMBus. Open-drain; requires pullup resistor to voltage between 1.7 V and 3.6 V.
input-output
Thermal shutdown or fan-control pin. Open-drain; requires pullup resistor to voltage between 1.7 V and
THERM 4 Digital output
3.6 V.
V+ 1 Power supply Positive supply voltage, 1.7 V to 3.6 V.
6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range, unless otherwise noted. (1)
MIN MAX UNIT
Power supply V+ –0.3 3.6 V
THERM, ALERT/THERM2, SDA and SCL only –0.3 3.6 V
Input voltage D+ only –0.3 (V+) + 0.3 V
D– only –0.3 0.3 V
Input current 10 mA
Operating temperature –55 127 °C
Junction temperature (TJmax) 150 °C
Tstg Storage temperature –60 150 °C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(1) Tested with less than 5-Ω effective series resistance and 100-pF differential input capacitance.
t(LOW)
tR tF t(HDSTA)
SCL
SDA
t(BUF)
P S S P
2 2
Mean Mean
1.5 Mean - 4σ 1.5 Mean - 4σ
Mean + 4σ Mean + 4σ
1 1
0.5 0.5
0 0
-0.5 -0.5
-1 -1
-1.5 -1.5
-2 -2
-50 0 50 100 150 -50 0 50 100 150
Ambient Temperature (°C) C001 Ambient Temperature (°C) C002
Figure 2. Local Temperature Error vs Temperature Figure 3. Remote Temperature Error vs Temperature
20 2
10 1.5
5HPRWH7HPSHUDWXUH(UURUÛ&
5HPRWH7HPSHUDWXUH(UURUÛ&
0 1
-10 0.5
-20 0
-30 -0.5
-40 -1
D+ to GND
-50 -1.5
D+ to V+
-60 -2
1 10 100 0 500 1000 1500 2000 2500 3000
Leakage Resistance (M
) C003 Series Resistance (
) C004
Figure 4. Remote Temperature Error vs Leakage Resistance Figure 5. Remote Temperature Error vs Series Resistance
0 90
20 mV p-p
80 50 mV p-p
5HPRWH7HPSHUDWXUH(UURUÛ&
-5 70 100 mV p-p
60
-10 50
40
-15 30
20
-20 10
0
-25 -10
0 5 10 15 20 0 200 400 600 800 1000
Differential Capacitance (nF) C005 Noise Frequency (MHz) C006
Figure 6. Remote Temperature Error vs differential Figure 7. Remote Temperature Error vs Remote Channel
Capacitance Noise Frequency
160
300
140
250
120
ISD (A)
200
IQ (A)
100
150 80
60
100
40
50
20
0 0
0.01 0.1 1 10 100 1 10 100 1000 10000
Conversion Rate (Hz) C007 Clock Frequency (kHz) C008
2.5
165
2
160
ISD (A)
IQ (A)
1.5
155
1
150
0.5
145 0
1.5 2 2.5 3 3.5 4 1.5 2 2.5 3 3.5 4
Supply Voltage (V) C009 Supply Voltage (V) C010
Figure 10. Quiescent Current vs Supply Voltage Figure 11. Shutdown Quiescent Current
(At Default Conversion Rate of 16 Conversions per Second) vs Supply Voltage
7 Detailed Description
7.1 Overview
The TMP451 device is a digital temperature sensor that combines a local temperature measurement channel
and a remote-junction temperature measurement channel in a single DFN-8 package. The device is two-wire-
and SMBus-interface compatible, and is specified over a temperature range of –40°C to 125°C. The TMP451
device also contains multiple registers for programming and holding configuration settings, temperature limits,
and temperature measurement results.
V+
TMP451
SCL
Serial Interface Control Logic
SDA
16 x I 6xI I
ALERT/THERM2
D+
ADC
D-
Internal THERM
BJT
GND
Both local and remote temperature data use two bytes for data storage. The high byte stores the temperature
with 1°C resolution. The second or low byte stores the decimal fraction value of the temperature and allows a
higher measurement resolution, as shown in Table 2. The measurement resolution for both the local and the
remote channels is 0.0625°C.
Table 2. Decimal Fraction Temperature Data Format (Local and Remote Temperature Low Bytes)
TEMPERATURE REGISTER LOW BYTE VALUE
(0.0625°C RESOLUTION) (1)
TEMP
(°C) STANDARD AND EXTENDED BINARY HEX
0 0000 0000 00
0.0625 0001 0000 10
0.1250 0010 0000 20
0.1875 0011 0000 30
0.2500 0100 0000 40
0.3125 0101 0000 50
0.3750 0110 0000 60
0.4375 0111 0000 70
0.5000 1000 0000 80
0.5625 1001 0000 90
0.6250 1010 0000 A0
0.6875 1011 0000 B0
0.7500 1100 0000 C0
0.8125 1101 0000 D0
0.8750 1110 0000 E0
0.9385 1111 0000 F0
7.3.4 Filtering
Remote junction temperature sensors are usually implemented in a noisy environment. Noise is most often
created by fast digital signals, and it can corrupt measurements. The TMP451 device has a built-in, 65-kHz filter
on the inputs of D+ and D– to minimize the effects of noise. However, a bypass capacitor placed differentially
across the inputs of the remote temperature sensor is recommended to make the application more robust against
unwanted coupled signals. For this capacitor, select a value of between 100 pF and 1 nF. Some applications
attain better overall accuracy with additional series resistance; however, this increased accuracy is application-
specific. When series resistance is added, the total value should not be greater than 1 kΩ. If filtering is required,
suggested component values are 100 pF and 50 Ω on each input; exact values are application-specific.
Additionally, a digital filter is available for the remote temperature measurements to further reduce the effect of
noise. This filter is programmable and has two levels when enabled. Level 1 performs a moving average of four
consecutive samples. Level 2 performs a moving average of eight consecutive samples. The value stored in the
remote temperature result register is the output of the digital filter, and the ALERT and THERM limits are
compared to it. This provides additional immunity to noise and spikes on the ALERT and THERM outputs. The
filter responses are shown in Figure 12. The filter can be enabled or disabled by programming the desired levels
in the digital filter register. The digital filter is disabled by default and on POR.
Impulse Response Step response
100 100
90 90
80 80
Temperature (°C)
Temperature (°C)
70 70
Disabled Disabled
60 60 Level1
Level2
50 50
40 40
Level1
30 Level2 30
20 20
10 10
0 0
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
Samples Samples
150 150
140 140
130 130
120 120
Temperature (°C)
Temperature (°C)
90 90
High Temperature Limit THERM2 Limit
80 80
THERM2 Limit - Hysteresis
70 70
Measured
Measured
Temperature 60
60 Temperature
50 50
Time Time
ALERT output
serviced by master
THERM2
ALERT
THERM THERM
Figure 13. ALERT and THERM Interrupt Operation Figure 14. THERM and THERM2 Interrupt
Operation
The hysteresis value is stored in the THERM hysteresis register. The value of the CONAL[2:0] bits in the
consecutive ALERT register determines the number of limit violations before the ALERT pin is tripped. The
default value is 000b and corresponds to one violation, 001b programs two consecutive violations, 011b
programs three consecutive violations, and 111b programs four consecutive violations. This provides additional
filtering for the ALERT pin state.
7.5 Programming
7.5.1 Serial Interface
The TMP451 device operates only as a slave device on either the two-wire bus or the SMBus. Connections to
either bus are made using the open-drain I/O lines, SDA and SCL. The SDA and SCL pins feature integrated
spike suppression filters and Schmitt triggers to minimize the effects of input spikes and bus noise. The TMP451
device supports the transmission protocol for fast (1 kHz to 400 kHz) and high-speed (1 kHz to 2.5 MHz) modes.
All data bytes are transmitted MSB first.
Programming (continued)
7.5.1.1 Bus Overview
The TMP451 device is SMBus interface compatible. In SMBus protocol, the device that initiates the transfer is
called a master, and the devices controlled by the master are slaves. The bus must be controlled by a master
device that generates the serial clock (SCL), controls the bus access, and generates the START and STOP
conditions.
To address a specific device, a START condition is initiated. A START condition is indicated by pulling the data
line (SDA) from a high-to-low logic level while SCL is high. All slaves on the bus shift in the slave address byte,
with the last bit indicating whether a read or write operation is intended. During the ninth clock pulse, the slave
being addressed responds to the master by generating an acknowledge bit and pulling SDA low.
Data transfer is then initiated and sent over eight clock pulses followed by an acknowledge bit. During data
transfer SDA must remain stable while SCL is high, because any change in SDA while SCL is high is interpreted
as a control signal.
After all data have been transferred, the master generates a STOP condition. A STOP condition is indicated by
pulling SDA from low to high, while SCL is high.
SCL ¼
SDA 1 0 0 1 1 0 0(1) R/W P7 P6 P5 P4 P3 P2 P1 P0 ¼
Start By ACK By ACK By
Master Device Device
1 9
SCL
(Continued)
SDA
D7 D6 D5 D4 D3 D2 D1 D0
(Continued)
ACK By Stop By
Device Master
Programming (continued)
1 9 1 9
SCL ¼
1 9 1 9
SCL ¼
(Continued)
SDA
1 0 0 1 1 0 0(1) R/W D7 D6 D5 D4 D3 D2 D1 D0 ¼
(Continued)
Start By ACK By From NACK By
Master Device Device Master(2)
Frame 3 Two-Wire Slave Address Byte Frame 4 Data Byte 1 Read Register
Programming (continued)
7.5.1.5 Time-out Function
If the SMBus time-out function is enabled, the TMP451 device resets the serial interface if either SCL or SDA are
held low for 25 ms (typical) between a START and STOP condition. If the TMP451 device is holding the bus low,
the device releases the bus and waits for a START condition. To avoid activating the time-out function,
maintaining a communication speed of at least 1 kHz for the SCL operating frequency is necessary. The SMBTO
bit (bit 7) of the consecutive ALERT register controls the time-out enable. Setting the SMBTO bit to a value of 0
(default) disables the time-out. Setting the SMBTO bit to a value of 1 enables the function.
Pointer Register
Status Register
Manufacturer ID Register
7.6.1.3 Local Temperature High Byte Register (offset: Read = 00h; Write = N/A) [reset = 00h]
7.6.1.4 Remote Temperature High Byte Register (offset: Read = 01h; Write = N/A) [reset = 00h]
7.6.1.5 Status Register (offset: Read = 02h; Write = N/A) [reset = N/A]
(1) These flags stay high until the status register is read or they are reset by a POR when pin 6 is configured as ALERT. Only bit 2 (OPEN)
stays high until the status register is read or it is reset by a POR when pin 6 is configured as THERM2.
The status register reports the state of the temperature ADC, the temperature limit comparators, and the
connection to the remote sensor. Table 6 lists the status register bits. The status register is read-only, and is
read by accessing pointer address 02h.
The LHIGH and LLOW bits indicate a local sensor overtemperature or undertemperature event, respectively. The
RHIGH and RLOW bits indicate a remote sensor overtemperature or undertemperature event, respectively. The
OPEN bit indicates an open-circuit condition on the remote sensor. When pin 6 is configured as the ALERT
output, the five flags are NORed together. If any of the five flags are high, the ALERT interrupt latch is set and
the ALERT output goes low. Reading the status register clears the five flags, provided that the condition that
caused the setting of the flags is not present anymore (that is, the value of the corresponding result register is
within the limits, or the remote sensor is connected properly and functional). The ALERT interrupt latch (and the
ALERT pin correspondingly) is not reset by reading the status register. The reset is done by the master reading
the temperature sensor device address to service the interrupt, and only if the flags have been reset and the
condition that caused them to be set is not present.
The RTHRM and LTHRM flags are set when the corresponding temperature exceeds the programmed THERM
limit. They are reset automatically when the temperature returns to within the limits. The THERM output goes low
in the case of overtemperature on either the local or the remote channel, and goes high as soon as the
measurements are within the limits again. The THERM hysteresis register (21h) allows hysteresis to be added so
that the flag resets and the output goes high when the temperature returns to or goes below the limit value minus
the hysteresis value.
When pin 6 is configured as THERM2, only the high limits matter. The LHIGH and RHIGH flags are set if the
respective temperatures exceed the limit values, and the pin goes low to indicate the event. The LLOW and
RLOW flags have no effect on THERM2, and the output behaves the same way when configured as THERM.
7.6.1.6 Configuration Register (offset: Read = 03h; Write = 09h) [reset = 00h]
MASK1 of the configuration register masks the ALERT output. If MASK1 is 0 (default), the ALERT output is
enabled. If MASK1 is set to 1, the ALERT output is disabled. This configuration applies only if the value of
ALERT/THERM2 bit is 0 (that is, pin 6 is configured as the ALERT output). If pin 6 is configured as the THERM2
output, the value of the MASK1 bit has no effect.
The shutdown bit, SD, enables or disables the temperature-measurement circuitry. If SD = 0 (default), the
TMP451 device converts continuously at the rate set in the conversion rate register. When SD is set to 1, the
TMP451 device stops converting when the current conversion sequence is complete and enters a shutdown
mode. When SD is set to 0 again, the TMP451 resumes continuous conversions. When SD = 1, a single
conversion can be started by writing to the one-shot start register. See the One-shot Mode section for more
information.
ALERT/THERM2 (bit 5) sets the configuration of pin 6. If the ALERT/THERM2 bit is 0 (default), then pin 6 is
configured as the ALERT output; if it is set to 1, then pin 6 is configured as the THERM2 output.
The temperature range is set by configuring RANGE (bit 2) of the configuration register. Setting this bit low
(default) configures the TMP451 device for the standard measurement range (0°C to 127°C); temperature
conversions are stored in the standard binary format. Setting bit 2 high configures the TMP451 device for the
extended measurement range (–64°C to 191°C); temperature conversions are stored in the extended binary
format (see Table 1).
20 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated
The remaining bits of the configuration register are reserved and must always be set to 0. The power-on reset
value for this register is 00h.
7.6.1.7 Conversion Rate Register (offset: Read = 04h; Write = 0Ah) [reset = 08h]
The conversion rate register (read address 04h, write address 0Ah) controls the rate at which temperature
conversions are performed. This register adjusts the idle time between conversions but not the conversion time
itself, thereby allowing the TMP451 power dissipation to be balanced with the temperature register update rate.
Table 9 lists the conversion rate options and corresponding time between conversions. The default value of the
register is 08h, which gives a default rate of 16 conversions per second.
7.6.1.8 Local Temperature High Limit Register (offset: Read = 05h; Write = 0Bh) [reset = 55h]
7.6.1.9 Local Temperature Low Limit Register (offset: Read = 06h; Write = 0Ch) [reset = 00h]
7.6.1.10 Remote Temperature High Limit High Byte Register (offset: Read = 07h; Write = 0Dh) [reset =
55h]
Table 12. Remote Temperature High Limit High Byte Register Field Descriptions
Bit Field Type Reset Description
7-0 RTHL11 - RTHL4 R/W 55h These bits determine the value of the high byte of the high
temperature limit to which the remote temperature measurement
is compared. The resolution of the LSB in this register is 1°C.
7.6.1.11 Remote Temperature Low Limit High Byte Register (offset: Read = 08h; Write = 0Eh) [reset =
00h]
Table 13. Remote Temperature Low Limit High Byte Register Field Descriptions
Bit Field Type Reset Description
7-0 RTLL11 - RTLL4 R/W 00h These bits determine the value of high byte of the low
temperature limit to which the remote temperature measurement
is compared. The resolution of the LSB in this register is 1°C.
7.6.1.12 One-shot Start Register (offset: Read = N/A; Write = 0Fh) [reset = N/A]
7.6.1.13 Remote Temperature Low Byte Register (offset: Read = 10h; Write = N/A) [reset = 00h]
7.6.1.14 Remote Temperature Offset High Byte Register (offset: Read = 11h; Write = 11h) [reset = 00h]
Table 16. Remote Temperature Offset High Byte Register Field Descriptions
Bit Field Type Reset Description
7-0 RTOS11 - RTOS4 R/W 00h Remote temperature offset high byte. The value of this register
is added to the value the ADC conversion with the result stored
in the remote temperature register. This register is used to add
or subtract a temperature offset value to the ADC conversion
result in applications requiring calibration. The resolution of the
LSB in this register is 1 °C.
The offset register allows the TMP451 device to store any system offset compensation value that might be
observed from precision calibration. The value in the register is stored in the same format as the temperature
result, and is added to the remote temperature result upon every conversion. Combined with the η-factor
correction, this function allows for very accurate system calibration over the entire temperature range.
7.6.1.15 Remote Temperature Offset Low Byte Register (offset: Read = 12h; Write = 12h) [reset = 00h]
Table 17. Remote Temperature Offset Low Byte Register Field Descriptions
Bit Field Type Reset Description
7-4 RTOS3 - RTOS0 R/W 0h Remote temperature offset low byte. The value of this register is
added to the value the ADC conversion with the result stored in
the remote temperature register. This register is used to add or
subtract a temperature offset value to the ADC conversion result
in applications requiring calibration. The resolution of these four
bits is 0.0625°C.
The offset register allows the TMP451 device to store any system offset compensation value that might be
observed from precision calibration. The value in the register is stored in the same format as the temperature
result, and is added to the remote temperature result upon every conversion. Combined with the η-factor
correction, this function allows for very accurate system calibration over the entire temperature range.
7.6.1.16 Remote Temperature High Limit Low Byte Register (offset: Read = 13h; Write = 13h) [reset =
00h]
Table 18. Remote Temperature High Limit Low Byte Register Field Descriptions
Bit Field Type Reset Description
7-4 RTHL3 - RTHL0 R/W 0h These bits determine the value of the low byte of the high
temperature limit to which the remote temperature measurement
is compared. The resolution of the four bits in this register is
0.0625°C.
7.6.1.17 Remote Temperature Low Limit Low Byte Register (offset: Read = 14h; Write = 14h) [reset =
00h]
Table 19. Remote Temperature Low Limit Low Byte Register Field Descriptions
Bit Field Type Reset Description
7-4 RTLL3 - RTLL0 R/W 0h These bits determine the value of the low byte of the low
temperature limit to which the remote temperature measurement
is compared. The resolution of the four bits in this register is
0.0625°C.
7.6.1.18 Local Temperature Low Byte Register (offset: Read = 15h; Write = N/A) [reset = 00h]
7.6.1.19 Remote Temperature THERM Limit Register (offset: Read = 19h; Write = 19h) [reset = 6C]
7.6.1.20 Local Temperature THERM Limit Register (offset: Read = 20h; Write = 20h) [reset = 55]
7.6.1.21 THERM Hysteresis Register (offset: Read = 21h; Write = 21h) [reset = 0Ah]
7.6.1.22 Consecutive ALERT Register (offset: Read = 22h; Write = 22h) [reset = 01h]
7.6.1.23 η-Factor Correction Register (offset: Read = 23h; Write = 23h) [reset = 00h]
The TMP451 device allows for a different η-factor value to be used for converting remote channel measurements
to temperature. The remote channel uses sequential current excitation to extract a differential VBE voltage
measurement to determine the temperature of the remote transistor. Equation 1 shows this voltage and
temperature.
hkT I
VBE2 - VBE1 = ln 2
q I1
(1)
The value η in Equation 1 is a characteristic of the particular transistor used for the remote channel. The power-
on reset value for the TMP451 device is η = 1.008. The value in the η-factor correction register may be used to
adjust the effective η-factor according to Equation 2 and Equation 3.
§ 1.008 u 2088 ·
eff ¨ ¸
© 2088 NADJUST ¹ (2)
§ 1.008 u 2088 ·
NADJUST ¨ ¸ 2088
© eff ¹ (3)
The η-factor correction value must be stored in twos complement format, yielding an effective data range from
–128 to 127. The η-factor correction value is written to and read from pointer address 23h. The register power-on
reset value is 00h, thus having no effect unless a different value is written to it.
7.6.1.24 Digital Filter Control Register (offset: Read = 24h; Write = 24h) [reset = 00h]
7.6.1.25 Manufacturer ID Register (offset: Read = FEh; Write = N/A) [reset = 55]
The TMP451 device allows for the two-wire bus controller to query the device for manufacturer and device IDs to
enable software identification of the device at the particular two-wire bus address. The manufacturer ID is
obtained by reading from pointer address FEh. The TMP451 device reads 55h for the manufacturer code.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
CDIFF(3)
RS(2)
0.1 µF
10 k
10 k
10 k
10 k
(typ) (typ) (typ) (typ)
Diode-connected configuration(1) 1
V+
Series Resistance
RS(2) 2 8
D+ SCL
CDIFF(3)
RS(2) 3 7
D SDA
SMBus
TMP451 Controller
4
THERM
(1)
Transistor-connected configuration
5
GND
ALERT / THERM2
6
Overtemperature Shutdown
(1) Diode-connected configuration provides better settling time. Transistor-connected configuration provides better series resistance
cancellation.
(2) RS (optional) should be < 1 kΩ in most applications. Selection of RS depends on application; see the Filtering section.
(3) CDIFF (optional) should be < 1000 pF in most applications. Selection of CDIFF depends on application; see the Filtering section and
Figure 6.
1
V+
Processor or
ASIC 2 8
DXP SCL
Built-in Thermal 3 7
DXN SDA
Transistor/Diode SMBus
TMP451 Controller
4
THERM
5
GND
ALERT / THERM2
6
Overtemperature Shutdown
Figure 42. TMP451 Basic Connections Using a Processor Built-In Remote Transistor
NOTE
For the equation to be used correctly, actual temperature (°C) must be converted to Kelvin
(K).
h - 1.008
TERR = ´ (273.15 + T(°C))
1.008
where
• TERR = error in the TMP451 device because η ≠ 1.008
• η = ideality factor of remote temperature sensor
• T(°C) = actual temperature
• Degree delta is the same for °C and K. (4)
1 80
Temperature (C)
75
0.5 70
65
0 60
55
-0.5 50
45
-1 40
35
-1.5 30
25
-2 ±1 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
-40 -25 -10 5 20 35 50 65 80 95 110 125 Time (s) C007
Remote Diode Temperature (qC) D001
Figure 44. Temperature Step Response
Figure 43. TMP451 Remote Diode Temperature Drift
(Diode-Connected 2N3906)
10 Layout
V+
D+
Ground or V+ layer
on bottom and/or
top, if possible.
D-
GND
Supply Bypass
Capacitor
1 V+ SCL 8
RS 2 D+ SDA 7
CDIFF
ALERT /
RS 3 D- 6
THERM2
Thermal
Shutdown
4 THERM GND 5
11.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 10-Dec-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
TMP451AIDQFR ACTIVE WSON DQF 8 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 T451
TMP451AIDQFT ACTIVE WSON DQF 8 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 T451
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
• Automotive: TMP451-Q1
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 10-Mar-2021
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 10-Mar-2021
Pack Materials-Page 2
PACKAGE OUTLINE
DQF0008A SCALE 6.000
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
2.1
B A
1.9
2.1
1.9
0.8
0.7 C
SEATING PLANE
0.05
0.00 0.05 C
SYMM (0.2) TYP
4
5
SYMM
2X 1.5
6X 0.5
8
1
0.3
8X
0.2
0.7 0.1 C A B
0.5
0.05
PIN 1 ID
0.6
7X
0.4 4220563/A 03/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
DQF0008A WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
8X (0.25) 1 8
SYMM
6X (0.5)
(R0.05) TYP
4 5
7X (0.7)
(1.7)
0.07 MIN
0.07 MAX ALL AROUND
ALL AROUND
METAL UNDER
METAL EDGE SOLDER MASK
EXPOSED METAL
SOLDER MASK EXPOSED SOLDER MASK
OPENING METAL OPENING
4220563/A 03/2021
NOTES: (continued)
3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
DQF0008A WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(0.8)
8X (0.25) 1 8
SYMM
6X (0.5)
(R0.05) TYP
4 5
SYMM
7X (0.7)
(1.7)
4220563/A 03/2021
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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