Classification of Nanomaterials
Classification of Nanomaterials
Classification of Nanomaterials
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Historical Perspective
A R T I C L E I N F O A B S T R A C T
Keywords: Nanotechnology is one of the emerging fields of the 21st Century. Many new devices and patentable technology
Nanotechnology is based on nanomaterials (NMs). One of the dominant factors in the use of nanomaterials and their applications
Nanomaterials in various fields is the synthesis and growth mechanism of nanostructures and nanomaterials. A nanostructured
Synthesis
material may have been a good candidate in one application but could be more useful in a different application if
Top-down
Bottom-up
synthesized by a different mechanism and technique. Similarly, the structure and morphology of a nanomaterial
also depend upon the method of growth and synthesis. For example, it is easy to grow and synthesize amorphous
nanostructured thin film using the plasma magnetron sputtering technique, but it may be difficult to obtain a
similar structure using the thermal evaporation process due to the nature of the technique itself. In this study, the
Top-down and Bottom-up methods and techniques of synthesizing nanostructured materials are reviewed,
compared, and analyzed. Both approaches are critically analyzed, and the influencing factors on the synthesis of
different nanomaterials, the advantages, and disadvantages of each technique are reported. This review also
provides a step-by-step analysis of the choice of method for the synthesis of namomaterials for specific
applications.
* Corresponding authors.
E-mail addresses: [email protected] (M. Ikram), [email protected] (Q. Khan), [email protected] (M. Maqbool).
https://doi.org/10.1016/j.cis.2021.102597
Received in revised form 7 December 2021;
Available online 29 December 2021
0001-8686/© 2021 Elsevier B.V. All rights reserved.
N. Abid et al. Advances in Colloid and Interface Science 300 (2022) 102597
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2.2.3. Graphene (GR) ingredients for metal nanostructures. Metal ions are converted to metal
GR is an allotrope of carbon, in 2D planar surface, it is a carbon-based NPs using reducing agents. These have a large surface area and a good
hexagonal. ability to adsorb small molecules. Commonly employed in a variety of
honeycomb structure. A 2D sheet is about 1–2 nm thick. scientific, environmental, and other fields [11–13].
2.3. Metal-based NMs A nanocomposite is a polyphase solid substance with one, two, or all
dimensions less than 100 nm. Considered as materials of the 21st cen
Metal-based NMs are synthesized from metals to nm sizes using tury due to their high performance with unique design possibilities and
destructive or constructive. exceptional property combinations. In contrast to traditional compos
processes. Divalent and trivalent metal ions are the beginning ites, NCs have a high surface-to-volume ratio [11,15].
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3.1. Chemical properties Transformation of bulk material into small nano-sized particles is
done using this approach. Although top-down approaches are simple to
NMs composition and Chemical structure have an important role to use, they are ineffective for manufacturing irregularly shaped and
provide the desired function. Chemical properties such as surface en extremely small particles. The difficulty in obtaining proper particle size
ergy, chemical potential, oxidation process, and catalysis have a great and shape is the main downside of this approach.
impact on the composition of NMs.
4.2. Bottom-up approach
4. Synthesis of NMs with various approaches and methods • Compression in particle size.
• Growth of particle size.
Methods for synthesizing NMs are classified as top-down and • Change in particle structure.
bottom-up approaches. • Agglomeration.
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▪ Planetary milling 4.2.1.3. Disadvantages. Some of the disadvantages of the milling pro
▪ Smaller than a conventional ball mill and is commonly used in cess are also provided here [30,50].
laboratories for research. Comprised of two or more jars that
rotate around their axes including supporting plate’s symmetry • The majority of ball milling treatments are destructive, destroying or
line moves in the opposite direction of grinding jar. Super disordering crystal structure and introducing a large number of
imposed rotational movements are applied to grinding balls. flaws.
Milling medium (balls) inside vials move due to Coriolis effect, • Inconvenience and hefty weight.
combined field of centrifugal forces, shear and compressive • Grinding uses a lot of energy because of wear on balls and wall
forces to powder charge. Just a little amount of powder is armor, friction, and material heating, among other things.
required, the most commonly utilized technique for mechanical • During work, there is a lot of contamination and noise.
alloying.
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Table 1
Synthesis of NMs by ball milling technique.
Nanomaterials Milling model Milling medium Ball size Powder to ball rpm Time Particle Ref.
ratio size
Graphite oxide (GO) NPs Planetary model Stainless steel and 5 mm – 600 rpm 6 h, 16 h, 24 h, with 10 min – [51]
(2018) zirconia balls break
Bornite Cu5FeS4 NPs High energy Steel balls 6–10 – 1000 5,10,30,60,120 min 10–40 nm [52]
(2018) model mm rpm
ZnO NPs High energy – – 1:100 10–30 nm [53]
(2021) model
ϒ-MgH2 Stainless steel balls 10 mm 1:12 750 rpm 10 h,50 h,72 h [54]
(2019)
CuO- Biochar Planetary – – 1:50 400 rpm 9h 13.8 nm [55]
NCs (2020) model
GR Oxide (GO) NPs Planetary model Stainless steel jar – 1:20 300 rpm 12 h 40 nm [56]
(2020)
magnetite-maghemite Planetary model Steel 3 mm – 200 rpm 24 h, 100 h 10–15 nm [57]
NPs (2018)
Table 2
Synthesis of NMs by thermal evaporation technique.
Nanomaterials Substrate Target Synthesis conditions Particle size Ref.
Tin sulfide (SnS) thin ZnO: Al, glass/ITO, Tin sulfide substrate temperature 400 ◦ C, evaporation time 40 min, chamber Film thickness ~ 720 nm [60]
films and glass/CdS pressure 9 × 10–6 Torr, source and substrate distance 20-cm
(2017)
Zn2GeO4 nano- Au coated Si Zn and Ge Temperature 950 ◦ C, evaporation time 30 min, the distance between thickness 10 nm [63]
crystals powders source and substrate ~10 cm.
(2019)
Ga2O3 thin film quartz Ga2O3 powder source and substrates distance 20 cm, heating current 200 A with a Film thickness 350 nm [61]
(2018) vapor pressure of 3 10–4 Pa.
Cu2InO4 thin film Si Copper and Oxygen flow at 60 standard cubic centimeters (sccm) in a tube furnace _ [64]
(2019) Indium with a pressure of 0.2 × 10− 2 Torr.
MoS2 nanostructures Si pure MoO3 and S A gap of 18 cm was established between two alumina boats. Furnace The thickness of MoS2 [59]
(2018) powders heated to 625 ◦ C at a rate of 15 ◦ C/min for 10 min. flakes is 0.7 nm.
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Table 3
Synthesis of NMs by laser ablation technique.
Nanomaterials Laser light source Ablation duration Pulse width Wavelength Frequency Target Particle size Fluence Ref.
(min) (nm) (Hz) material (nm) (J/cm2)
Carbon based Nd: YAG Laser 10 6 ns 532 10 Graphite 200 0.4 [76]
NMs
TiO2 and ZnO Nd: YAG laser 30 2.0 ms 1064 5 Zn and Ti 5–65 – [72]
plates
TiO2 Nd: YAG 5 10 ns 1064 and 532 10 titanium rod 1 to 40 45.9 and [77]
27.6
ZnO Nd: YAG 30 7 ns 1064 10 zinc 18 12.7 [69]
Carbon based NPs Nd: YAG 5 ms 1064 2 Graphite 80 to 130 [78]
_ _
SnO Nd: YAG 15 0.5 ms or 2.0 1064 3 Sn/Zn 30–60 [73]
and ZnO NPs. ms _
CdO NPs Nd: YAG 10 7 ns 1064 10 Cd sheet 24 _ [79]
Ag NPs Femtosecond 15 40 fs 1000 silver 13 to 18 _ [80]
laser _
ZnO NPs Nd: YAG 3 7 ns 1064 20 Zn target 18–26 _ [81]
Iron Oxide MNPs Nd: YAG 5 7 ns 1064 20 Fe target 2–80 150 [82]
attained at <0.67 Pa, low pressure will maintain by using a vacuum ions attack a nonconducting target which leads to charge a surface. Ion
pump [83]. Different components of the sputtering system include: 1) current would die off. Therefore, dc-sputtering is restricted to con
evacuated chamber 2), sputtering source 3), gas supply 4), electrode 5), ducting materials like metals or doped semiconductors [87]. Oxygen
substrate holder [84]. A systematic diagram of the procedure is shown in and nitrogen are used as reactive gases, when one of them is added into
Fig. 9. the sputtering chamber, this gas will provide a reaction with the target
In the process of sputtering, NMs are deposited on a substrate’s surface and sputtered atom, thus form a chemical compound thin film on
surface by ejecting particles with the attack of high-energy ions. The the substrate. This type of sputtering is named reactive sputtering [88].
sputtering process is used for surface coating, thin layer deposition, and Furthermore, plasma ions behave as a neutralized electric charged
surface etching application [13,85]. Glow discharge sources are working when they strike with the target and then return to process as an atom. If
by applying an electric potential between the electrode in a gas phase in the insulator is used as target material, then due to the process of
a low-pressure environment. As electrons accelerated and collide with a neutralization positive charges are appeared on the target spot. This
gas atom, such ionized gas is called plasma. These plasma ions are the positive charge may reach a level at which energetic ions are repelled
simplest source for sputtering [86]. and it will end the sputtering process. In this situation by reversing the
In the direct current (DC) sputtering process, a negative voltage is polarity process can continue and attract a maximum electron from
applied in presence of Ar-ions toward the target and set material free, in plasma to eliminate the surface charge. Periodic reversal of polarity is
this result secondary electrons are produced. Further ionization of gas is done automatically by applying a radio-frequency (RF) voltage on the
caused due to these secondary electrons. Under an electric field, positive target. Thus, this type of sputtering is called RF sputtering [89]. The
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4.2.4.1. Influencing factor. Factors affecting the sputtering process are 4.3.1.1. Mechanism. Reactant gases are first delivered toward the
given below [13,91,95,96]. reactor. These reactant gases just either proceed through homogeneous
reactions in the gas phase to create intermediate reactants and by-
• Annealing duration, Temperature, and thickness of layer are products of gases, or they diffuse directly on the substrate via bound
different parameter which determines size and shapes of NPs. ary layer in both conditions, intermediate reactants and reactant gases
• The angle of target and substrate. adsorb and diffuse onto the heated substrate surface. Evaporation of
• Mass and energy of bombarding particle. growing species for transport to a substrate where they assemble and
• Ar+ ions presence in vacuum system. grow through a carrier gas. Consequent heterogeneous reactions at the
• Substrate temperature to reduce dopant redistribution. gas-solid interface lead to continued thin-film production, as well as
generation of reaction by-products, via coalescence, growth, and
4.2.4.2. Advantages. The sputtering process has several advantages nucleation. Eventually, unwanted gaseous products and undissolved
over others. Some of them are listed below [97,98]. species desorb from the reaction zone’s surface and are removed.
Whenever the temperature is sufficiently enough or more energy is
• Sputtering techniques can work at low temperatures. supplied, such as in form of plasma, gas-phase processes occur.
• It can coat large areas more uniformly. Furthermore, if deposition reaction is dependent on substrate surface
• The sputtering deposition target provides a stable, long-lived catalysis, as with specific metal surface catalytic growth, a heteroge
vaporization source. neous reaction is required [110–113]. Fig. 11 shows a schematic dia
• Elements, alloys, and compounds can all be sputtered and deposited. gram of the procedure.
4.2.4.3. Disadvantages. Some of the shortcomings and disadvantages of • Cooling system to room temperature.
the sputtering process are listed here [98,99]. • Introducing a constant flow of carrier gas at a particular pressure.
• Heat up substrates to suitable substrate temperature.
• Sputtering rates are low compared to thermal evaporation. • Heating source to suitable temperature (beginning of growth).
• Most of the energy is converted into heat when incident on target, • Chilling source to heating rate (ending of growth).
which must be removed. • Cooling at room temperature.
• Low purity.
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Table 4
Synthesis of NMs by using sputtering technique.
Nanomaterials Target material/ Substrate Sputtering Method Sputtering gas Pressure/Temperature/Duration Particle Size Ref.
− 7
CuO Copper/ Copper Reactive magnetron Ar/O2 = 40/10 7.4 × 10 Torr/24 h ~9 nm [100]
(2016) cold finger
− 2
Cu Copper/ Silicon DC Sputtering Ar 20sccm 2 × 10 Torr/7,15 and 30 s 37.8 nm 25.4 nm 19.6 nm [101]
(2017) Oxide
Pt Pt/ Polyethylene glycol Matrix Ar 30 ◦ C/30 min 0.9 ± 0.3 to 1.4 ± 0.3 nm [102]
(2018) Sputtering
Pd Pd/ Mesoporous silica Sputtering deposition Ar 2 × 10− 7 mbar/ 9 nm at 7.5 min, 15 nm at 12 min [103]
(2018) 0.5–12 min
Fe3O4 Fe/ Si DC Sputtering Ar and O2 4 × 10− 3 mbar 50 nm and [104]
(2017) 150 nm thick film
− 4
Fe Fe/ Si-SiO2 Gas flow sputtering Ar 490sccm 4 × 10 Pa 20–25 nm [105]
(2020)
8
ZrO2 Zirconium/ Copper cold finger Reactive magnetron Ar/O2 = 40/10 7.6 × 10− Torr/60 h 2 nm to 8 nm [106]
(2018)
Table 5
Synthesis of NMs by CVD technique.
Nanomaterials Catalyst Substrate Precursor Temperature Time Target Particle size Ref.
(min)
• When heating and cooling, use a high carrier gas pressure and only in Table 5.
introduce the required procedure pressure while the source is at the
right temperature. 4.3.2. Influencing factors
The formation of NMs may be adjusted by adjusting CVD parameters.
The synthesis of several NMs using the CVD method is demonstrated At moderate pressure, processes take place, similarly operate at mild
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pressure (1 Torr) or ultrahigh vacuum (100 Torr). In regards to coating temperature difference should be kept between the upper and lower
uniformity, pressure has a significant impact on the quality of products portion of the chamber. After it, ions are transferred toward the low-
and deposition rate. Gas flow state, substrate and physical characteris temperature region, and seed crystals are deposited at the cooler end,
tics of vapor, deposition time, precursor nature, catalysts, temperature to collect the desired crystal.
[500]. Most conventional CVD technique is carried out at extreme Step 3: After centrifuge, washed and then dried sample at different
temperatures, usually about 1000 ◦ C; however, CVD at a moderate temperatures to acquire final product.
temperature (about 300 ◦ C) is used while substrate can’t sustain high Crystal morphology under hydrothermal conditions is closely related
temperatures [110,114]. to growth conditions. The mechanism of crystal growth was predicted by
morphology study. To control the morphology of prepared material,
4.3.3. Advantages either low pressure or high-pressure state can be used depending mainly
The CVD method has several advantages over other methods of on the vapor pressure of the main reaction composition. Hydrothermal
nanostructures growth and fabrication. A list of those advantages is synthesis is used for important solids preparations such as luminescence
given below [107,115,116]. phosphors, superionic conductors, and microporous crystals. It is also a
route to unique condensed material, including thin films, nm particles,
• It has the finest degree of control. and gels [23,89,124–129]. The hydrothermal mechanism is shown in
• Allows for large-scale fabrication of 2D NMswith purity, good crystal Fig. 12.
quality, and few substrate flaws.
• Material production is dense and pure. 4.3.6. Influencing factor
• Controlling process parameters allows regulating crystal structure, Various factors can affect the synthesis and fabrication of nano
surface morphology, and orientations of nanostructures. structured material using hydrothermal technique [130]. Those factors
• The synthesis procedure is repeatable. are listed below.
• Material adherence and homogeneity on the substrate are excellent
enables for complicated shaped coatings. • High temperature and pressure.
• Produces extremely hard, robust, homogeneous, and pure • Reaction time.
nanostructures. • Solvent type.
• The growth rate can be easily regulated.
• The classical CVD approach has a reasonable processing cost. 4.3.7. Advantages
Several advantages, the hydrothermal technique may have over
4.3.4. Disadvantages othrr parallel techniques, are listed below [23,131].
The CVD method has several advantages over other methods used for
the same applications. However, there are some disadvantages also • Precise control of size NPs.
associated with the CVD method. Those disadvantages are listed below • Low melting point, high vapor pressure, and tendency toward py
[107,115,116]. rolysis will be obtained.
• Produce nanocrystal with high crystallinity
• Material is transferred from deposited substrates for further evalua
tion. Aside from that, the increased production cost is a 4.3.8. Disadvantages
disadvantage. The hydrothermal method of synthesizing nanomaterials have some
• Few precursors are poisonous, flammable, or explosive and few are limitations as compared to other methods. Those limitations are pro
quite costly. vided below [23,125,131].
• Several CVD varieties raise fabrication costs.
• Due to the high deposition temperature of various CVD variations, • Crystal growth information cannot observe directly
there are limitations on used substrates. • Expensive autoclave
• Creates of very poisonous gaseous byproducts.
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Table 6
Syntheses of NMs by using the hydrothermal technique.
Nanomaterials Reducing & Stabilizing Agent Precursor Hydrothermal Synthesis Condition Particle Ref.
Autoclave Size
• Difficult to Control employed precipitants in this approach. Precipitates are then aged to
produce bigger particles, which are then collected via filtration or
Parameters and synthesis conditions of several NMs using the hy centrifugation. To remove contaminants and obtain high purity NPs,
drothermal method are demonstrated in Table 6. additional wash with ethanol, distilled water, or other solvents are
required. To obtain NMs with desired crystal structures and morphol
4.3.9. Co-precipitation method ogies, post-treatment such as annealing, sintering, or calcination is used.
One of the earliest wet chemical processes of NMs synthesis is co- Fig. 13 shows a schematic diagram of the procedure.
precipitation. This is the most basic and extensively used approach for It entails the occurrence of nucleation, growth, coarsening, and
producing a wide range of NMs. Impurities precipitate along with the agglomeration simultaneously. Nucleation is a crucial phase in the
product in this process, although, can be easily separated using different precipitation process, it is the process by which the tiniest elementary
methods such as filtration and washing. The coprecipitation approach particles of a new thermodynamic phase appear. A high concentration of
refers to the use of a precipitation reaction to achieve a consistent nuclei results from fast nucleation., yielding nanocrystals of smaller size,
composition of two or more cations in a homogeneous solution. Through whereas, slow nucleation results in lower concentration and bigger
numerous chemical reactions in solution, this approach has the advan particles. To minimize the surface energy of smaller particles during the
tage of directly producing homogenous NMs with small sizes and size growth phase, they will be absorbed by bigger particles. Coarsening, or
distribution. The solution is combined directly or drop-by-drop with Ostwald ripening, is the name of the process. Agglomeration could also
another solution containing dissolved precipitation agents, like sodium occur to reduce surface energy. Particles may continue to expand
hydroxide, ammonia, and many more for retaining up essential pH. beyond nanoscale if coarsening and agglomeration are not controlled.
Hydroxides, chlorides, carbonates, and oxalates are the most widely To stop growth, some capping or stabilizing chemicals are beneficial.
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Table 7
Synthesis of NMs by co-precipitation technique.
Nanomaterials Precursors pH balance Surfactant added Synthesis conditions Particle size Ref.
NiFe2O4 NPs FeCl3 + NiCl2 NaOH Oleic Stirred 30 min at 80 C, washed, centrifuged, dried
◦
28 nm [144]
(2017) overnight at 80 ◦ C.
ZnO NPs Zn(ac2).2H2O NaOH – Stirred 2 h at 60 ◦ C, centrifuged at 4500 rpm for 2 140 nm [145]
(2018) min, washed, the powder was obtained by drying 6 h
in the oven at 75 ◦ C.
SnO2 NPs SnCl4.5H2O Aquas – Precipitate filtered, washed, and dried at 80 ◦ C for 24 – [146]
(2018) ammonia h, calcined 1 h in the oven at different temperatures
(500 ◦ C, 700 ◦ C, 900 ◦ C).
Fe2O3 NRs FeCl2 NaOH – Heated 3 h at 85◦ , centrifuged, washed, dried at 60 ◦ C Length, [147]
(2017) FeCl3.6H2O+ overnight, calcined 4 h at 600 ◦ C. 110–120 nm
propanol Width,
25–40 nm
Mn3O4 nanograins MnSO4.H2O NaOH Cetyltrimethylammonium Filtered using Whatman filter paper, washed with 600-800 nm [148]
(2018) bromide (CTAB) water and ethanol, dried at 100 ◦ C for 6 h, calcined 2
h at 800 ◦ C.
Cu-doped hematite FeCl3,6H2O+ NaOH – Heated 3 h at 80 ◦ C, centrifuged, washed, dried 3 h at 21 nm [149]
(α-Fe2O3) NPs CuCl2,2H2O 80 ◦ C, calcined 4 h at 700 ◦ C.
(2017)
CoMn2O4 NPs MnSO4.H2O NaOH Cetyltrimethylammonium Stirred 3 h, precipitate washed with ethanol, dried in – [150]
(2020) bromide (CTAB) a hot air oven at 60 ◦ C for 12 h, kept 2 h in a muffle
furnace at 600 ◦ C.
ZnFe2O4 NPs ZnCl2 + FeCl3 NaOH – Heated at 80 ◦ C for 3 h, centrifuged, annealed 24 h at 8.2 nm [151]
(2017) 75 ◦ C, calcined 5 h at 500 ◦ C.
Fe3O4 NPs FeCl3.6H2O + HCl NH4OH Tetramethylammonium Washed, dried 24 h at room temperature. 31.5 nm [152]
(2019) FeCl2.4H2O + HCl hydroxide (TMAOH)
MnFe2O4 NPs (2018) Mn(nO3)2.4H2O + NaOH Stirred 1 h at 70 ◦ C, cooled, washed, sintered 5 h at 36 nm [153]
Fe (NO3)3 600 ◦ C.
Through chemisorption of charged species, capping agents bound to as stirring speed, vibration, light exposure, and glassware cleanliness
particles surface and cause electrostatic repulsion on its surface. Stable impact on quality of NMs produced.
particles will form if repulsive forces are strong enough, otherwise,
coagulation will ensue. It is used for the synthesis of NTs, NRs, and 4.3.9.2. Advantages. Certain benefits to using the coprecipitation
various NPs. Synthesis of various NMs using co-precipitation method approach [10,11,89,139–143].
illustrated in Table 7.
• Easy and quick to prepare
4.3.9.1. Influencing factors. Control of chemical homogeneity and par • Low-temperature, energy-efficient
ticle size is difficult. Recent improvements, such as the use of surfac • Several options for modifying particle surface state and overall ho
tants, have aided in the proper regulation of morphological traits. mogeneity are available.
Furthermore, proper control of experimental parameters such as pH,
reactant and ion concentrations, and temperature is critical because 4.3.9.3. Disadvantages. There are several drawbacks to consider
these factors influence the precipitation process. Working variables such [10,11,89,139–143].
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• If reactants have significantly differing precipitation rates, this due to the separation of water and organic components to produce a gel
approach will not work that disrupts structure. Different drying methods are available: thermal
• Impurities in the product may also precipitate drying gives xerogel, supercritical drying is done to get aerogels and
• It necessitates the employment of numerous chemicals and may freeze-drying is used to obtain cryogel, each has a unique impact on gel
result in the generation of potentially hazardous waste, furthermore, network structure.
most chemically precipitated NPs require stabilizers, as well as a Step 5: Finally, calcination is carried out to get rid of water mole
variety of post-processing procedures to optimize the purity of final cules and residues from the sample. The temperature of calcination is a
products. critical factor in managing material density and pore size.
The process may produce a variety of materials, including thin films,
4.3.10. Sol-gel method NPs, glass, and ceramics. Synthesis of different NMs by sol-gel technique
The most common bottom-up approach is sol-gel for the synthesis of is shown in Table 8.
NMs due to its simplicity. It is a combination of two terms sol and gel. Sol
is a type of colloidal solution made up of solid particles suspended in a 4.3.10.1. Influencing factors. Factors including PH, speed and duration
liquid. The gel is a solid macromolecule that dissolves in a liquid. of stirring, and temperature and time for reaction, greatly affect
The method involves steps: hydrolysis, polycondensation, aging, microstructure, porosity, crystallinity, and densification of the final
drying, and calcination, shown in Fig. 14. product. Solvent and precursor characteristics utilized in the sol-gel
Step 1: Precursor such as metal alkoxide (M-OR) undergoes hydro method have a significant impact on the attributes of products.
lysis with water or alcohol, resulting in the formation of hydroxide so Texture and surface qualities of materials can be controlled very well
lution. If the reaction medium is water, it’s termed an aqueous sol-gel with this procedure. To obtain NPs with correct crystal structure, size,
approach and if the reaction medium is an organic solvent, it is a and crystallinity, heat treatment is essential.
nonaqueous sol-gel method. The General chemical reaction of the hy
drolysis process is described by eq. (1). 4.3.10.2. Advantages. The sol-gel method has numerous advantages,
M − OR + H2 O M − OH + R − OH (1) including [10,11,14,89,139,140,154,155].
Step 3: In this step, within the localized solution, polycondensation 4.3.10.3. Disadvantages.
continues, and the gel network reprecipitates. As a result, the porosity of
colloidal particles reduces and thickness between them increases. Aging • There are some disadvantages to employing this strategy as well
causes gel structure and characteristics to vary significantly. [10,11,14,89,139,140,154,155].
Step 4: Afterwards, the gel is dried. Drying is a difficult procedure
Table 8
Synthesis of NMs by sol-gel technique.
Nanomaterials Precursors pH Synthesis conditions Drying process / Particle size Ref.
balance Gel formed
Fe doped TiO2 Iron (III) chloride 6-hydrate, C12H28O4Ti, – Stirred at 40 ◦ C, refluxed at 120 ◦ C for 6 h, gel Supercritical / 6–11, 22–30, [156]
NPs ethanol, citrate acid, C5H8O2 obtained by heating 14 h at 80 ◦ C, dried at 150 ◦ C for Aerogel 50–100 nm
(2017) 1, annealed 1 h at 400, 600, 800 ◦ C.
Bismuth ferrite Bi (NO)3.5H2O, ethylene glycol, Fe – Stirred 2 h, heated at 60 ◦ C, calcined 4 h at 500 ◦ C. Evaporation / – [157]
NPs (NO)3.9H2O Xerogel
(2018)
Al doped ZnO Zn (CH3COO)2.2H2O, Al (NO3)3, methanol NaOH Stirred 90 min, stirred 60 min after balancing pH, – 20–50 nm [158]
NPs centrifuged 20 min at 10,000 rpm, washed, dried 2 h
(2017) at 60 ◦ C, calcined 2 h at 200 ◦ C.
Cd2V2O7 NPs Cd (NO3)2.4H2O, NH4VO3, citric acid, – Stirred 2 h at 100 ◦ C, evaporation formed gel, dried – 10–20 nm [159]
(2018) in oven at 80 ◦ C, calcined 2 h at different
temperature.
CuO NPs Cu (NO3)2.3H2O, citric acid – Stirred at 90 ◦ C till gel formed, heated at 100 ◦ C, – [160]
(2018) annealed 2 h at different temperature 200, 300, 400,
500, 600 ◦ C.
ZnO NPs ZnAc2,2H2O NaOH Heated at a temperature ranging 0 to 80 ◦ C, the Freezing / 37 nm [161]
(2017) precipitate was centrifuged, washed, dried by Cryogel
lyophilization.
Co3O4 NPs Cobalt acetate, polyvinylpyrrolidone – Stirred 30 min, heated 2 h at 300 ◦ C, annealed 3 h at – 50 nm [162]
(2019) (PVP), triethanol 450 ◦ C.
Cu doped TiO2 Titanium butoxide (C16H36O4Ti), copper – Stirred 2 h at 50 ◦ C, annealed at 400 ◦ C. – – [163]
NPs acetate (Cu (CH3COO)2), HCl, methanol,
(2020) ethanol
MnFe2O4 NPs Mn (NO3)2.4H2O, Fe (NO3)3, citric acid NaOH Heated up to 70 ◦ C, evaporated to form gel, dried to – 45 nm [153]
(2018) get flakes, calcined under nitrogen atmosphere 2 h at
900 ◦ C.
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