SM50TxxAY, SM50TxxCAY

Datasheet

Automotive 5000 W TVS in SMC

Features

• AEC-Q101 qualified
• Peak pulse power:
– 5000 W (10/1000 μs)
– up to 48 kW (8/20 μs)
• Stand-off voltage range from 5 V to 100 V
• Unidirectional and bidirectional types
• Low leakage current: 0.2 µA at 25 °C
• Operating Tj max: 175 °C
• JEDEC registered package outline
• Resin meets UL94, V0
• Lead finishing: matte tin plating

Complies with the following standards

Product status link • UL94, V0

• J-STD-020 MSL level 1
SM50T6V8AY, SM50T6V8CAY,
SM50T7V0AY, SM50T7V0CAY, • J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026
SM50T7V5AY, SM50T7V5CAY, • JESD-201 class 2 whisker test
SM50T10AY, SM50T10CAY,
SM50T12AY, SM50T12CAY, • IPC7531 footprint and JEDEC registered package outline
SM50T13AY, SM50T13CAY, • IEC 61000-4-4 level 4:
SM50T14AY, SM50T14CAY, – 4kV
SM50T15AY, SM50T15CAY,
SM50T16AY, SM50T16CAY, • IEC 61000-4-2, C = 150 pF, R = 330 Ω exceeds level 4:
SM50T18AY, SM50T18CAY, – 30 kV (air discharge)
SM50T19AY, SM50T19CAY,
SM50T21AY, SM50T21CAY, – 30 kV (contact discharge)
SM50T23AY, SM50T23CAY, • ISO 10605, C = 330 pF, R = 330 Ω:
SM50T26AY, SM50T26CAY, – 30 kV (air discharge)
SM50T27AY, SM50T27CAY,
SM50T28AY, SM50T28CAY, – 30 kV (contact discharge)
SM50T30AY, SM50T30CAY, • ISO 7637-2 (not applicable to parts with VRM lower than battery voltage):
SM50T33AY, SM50T33CAY,
SM50T35AY, SM50T35CAY, – Pulse 1: VS = -150 V
SM50T36AY, SM50T36CAY, – Pulse 2a: VS = +112 V
SM50T39AY, SM50T39CAY,
SM50T42AY, SM50T42CAY, – Pulse 3a: VS = -220 V
SM50T47AY, SM50T47CAY, – Pulse3b: VS = +150 V
SM50T56AY, SM50T56CAY,
SM50T68AY, SM50T68CAY,
SM50T75AY, SM50T75CAY, Description
SM50T82AY, SM50T82CAY,
SM50T100AY, SM50T100CAY,
SM50T117AY, SM50T117CAY The SM50TY series are designed to protect sensitive automotive circuits against
surges defined in ISO 7637-2 and against electrostatic discharges according to
ISO 10605.
SM50TY is suitable for e-breaker and help to comply with ISO 10750.
The Planar technology makes it compatible with high-end circuits where low leakage
current and high junction temperature are required to provide long term reliability and
stability.

DS13895 - Rev 1 - November 2022 www.st.com

For further information contact your local STMicroelectronics sales office.
 SM50TxxAY, SM50TxxCAY
Characteristics

1 Characteristics

Table 1. Absolute maximum ratings (Tamb = 25 °C)

Symbol Parameter Value Unit

IEC 61000-4-2 (C = 150 pF, R = 330 Ω)

Contact discharge 30
Air discharge 30
VPP Peak pulse voltage kV
ISO10605 (C = 330 pF, R = 330 Ω)
Contact discharge 30
Air discharge 30
PPP Peak pulse power dissipation Tj initial = Tamb 5000 W

Tstg Storage temperature range -65 to +175 °C

Tj Operating junction temperature range -55 to +175 °C

TL Maximum lead temperature for soldering during 10 s 260 °C

Figure 1. Electrical characteristics - parameter definitions

Figure 2. Pulse definition for electrical characteristics

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Characteristics

Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified)

10 / 1000 µs 8 / 20µs
IRM max at VRM VBR at IR (1) αT
VCL(2)(3) IPP(4) RD VCL(2)(3) IPP(4) RD
Type
25 °C 85°C Min. Typ. Max. Max. Max. Max. Max. Max.

µA µA V V V V mA V A mΩ V A mΩ 10-4/°C

SM50T6V8AY/CAY 20 50 5.0 6.4 6.74 7.1 10 9.2 544 3.86 14.4 2136 3.59 5.7
SM50T7V0AY/CAY 20 50 6.0 6.7 7.05 7.4 10 10.3 486 5.97 14.7 2042 3.75 5.9
SM50T7V5AY/CAY 20 50 6.5 7.2 7.58 8 10 11.2 447 7.16 15.2 1986 3.84 6.1
SM50T10AY/CAY 20 50 8.5 9.4 9.9 10.4 1 14.4 348 11.5 18.6 1710 5.09 7.3
SM50T12AY/CAY 0.2 1 10 11.1 11.7 12.3 1 17 295 15.9 21.7 1505 6.64 7.8
SM50T13AY/CAY 0.2 1 11 12.3 13 13.7 1 18 275 15.6 24.2 1387 8.07 8.1
SM50T14AY/CAY 0.2 1 12 13.3 14 14.7 1 19.9 252 20.6 25.3 1309 8.63 8.3
SM50T15AY/CAY 0.2 1 13 14.4 15.2 16 1 21.5 233 23.6 27.2 1227 9.78 8.4
SM50T16AY/CAY 0.2 1 14 15.7 16.5 17.3 1 23.1 216 26.9 29 1151 10.9 8.6
SM50T18AY/CAY 0.2 1 15 16.7 17.6 18.5 1 24.4 205 28.8 32.5 1095 13.6 8.8
SM50T19AY/CAY 0.2 1 16 17.9 18.8 19.8 1 26 192 32.3 34.2 1040 14.8 9.0
SM50T21AY/CAY 0.2 1 18 20 21.1 22.2 1 29.2 171 40.9 39.3 950 19.2 9.2
SM50T23AY/CAY 0.2 1 20 22.2 23.4 24.6 1 32.4 155 50.3 42.8 876 22.1 9.4
SM50T26AY/CAY 0.2 1 22 24.4 25.7 27 1 35.5 141 60.3 48.3 815 27.7 9.6
SM50T27AY/CAY 0.2 1 23 25.7 27 28.4 1 37.8 135 69.6 49.2 784 28.3 9.6
SM50T28AY/CAY 0.2 1 24 26.7 28.1 29.5 1 38.9 129 72.9 50 760 28.8 9.6
SM50T30AY/CAY 0.2 1 26 28.9 30.4 31.9 1 42.1 119 85.7 53.5 715 32.3 9.7
SM50T33AY/CAY 0.2 1 28 31.1 32.7 34.3 1 45.4 110 100.9 59 675 39.0 9.8
SM50T35AY/CAY 0.2 1 30 33.2 35 36.8 1 48.4 103 112.6 64.3 640 45.8 9.9
SM50T36AY/CAY 0.2 1 31 34.2 36 37.8 1 50.2 100 124 65 626 46.3 9.9
SM50T39AY/CAY 0.2 1 33 36.7 38.6 40.5 1 53.3 94 136 69.7 593 52.4 10.0
SM50T42AY/CAY 0.2 1 36 40 42.1 44.2 1 58.1 86 162 76 550 61.6 10.0
SM50T47AY/CAY 0.2 1 40 44.4 46.7 49 1 64.5 78 199 84 511 73.0 10.1
SM50T56AY/CAY 0.2 1 48 53.2 56 58.8 1 77.4 65 286 100 444 99.1 10.3
SM50T68AY/CAY 0.2 1 58 64.6 68 71.4 1 93.6 53 419 121 381 139 10.4
SM50T75AY/CAY 0.2 1 64 71.1 74.8 78.6 1 103 47 447 133 353 164 10.4
SM50T82AY/CAY 0.2 1 70 77.9 82 86.1 1 113 42 640 146 345 186 10.5
SM50T100AY/CAY 0.2 1 85 95 100 105 1 137 32 1000 178 265 294 10.6
SM50T117AY/CAY 0.2 1 100 111 117 123 1 179 28 2000 212 227 419 10.7

1. To calculate VBR versus Tj : VBR at Tj = VBR at 25 °C x (1 + αT x (Tj - 25))

2. To calculate VCL versus Tj : VCL at Tj = VCL at 25 °C x (1 + αT x (Tj - 25))
3. To calculate VCL max versus IPPappli: VCLmax = VBRmax + RD x IPPappli
4. Surge capability given for both directions for unidirectional and bidirectional devices

DS13895 - Rev 1 page 3/15

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Characteristics (curves)

1.1 Characteristics (curves)

Figure 3. Maximum peak power dissipation versus initial Figure 4. Maximum peak pulse power versus exponential
junction temperature pulse duration
PPP (W) PPP (kW)
6000 1000

10/1000 µs Tj initial = 25 °C

5000

VBR < 36V 100 VRM > 30 V

4000

VRM ≤ 30 V
3000 10
VBR ≥ 36V

2000

1
1000

Tj (°C) t p (ms)
0
0.1
0 25 50 75 100 125 150 175 200
0.001 0.01 0.1 1 10 100

Figure 5. Maximum peak pulse current versus clamping

Figure 6. Dynamic resistance versus pulse duration
voltage
RD(Ω)
100
Ipp (A)
10000

8/20 µs

10/1000 µs 10
1000

1
100

SM50T117AY/CAY
0.1
10 SM50T82AY/CAY
SM50T42AY/CAY
SM50T117AY/CAY
SM50T42AY/CAY

SM50T82AY/CAY
SM50T6V8AY/CAY

0.01
1
SM50T6V8AY/CAY

tp (ms)
VCL(V) 0.001
0.1
0.01 0.1 1 10 100
1 10 100 1000

Figure 7. Junction capacitance versus reverse applied Figure 8. Junction capacitance versus applied voltage
voltage (unidirectional type) (bidirectional type)
C(nF) C(nF)
100 100
f = 1 MHz
f = 1 MHz
Vosc = 30 mV RMS
Vosc = 30 mV RMS
Tj = 25 ° C
Tj = 25 ° C

SM50T6V8AY
10 10 SM50T6V8CAY

1 SM50T42AY 1 SM50T42CAY

SM50T82AY SM50T82CAY

SM50T117AY SM50T117CAY
VR (V) VR (V)
0.1 0.1
1 10 100 1000 1 10 100 1000

DS13895 - Rev 1 page 4/15

 SM50TxxAY, SM50TxxCAY
Characteristics (curves)

Figure 10. Peak forward voltage drop versus peak forward

Figure 9. Leakage current versus junction temperature
current
I R (nA)
10000 I F (A)
VR=VRM 100

VRM < 10V single pulse

1000

10 Tj = 175 °C
VRM ≥ 10V
100

Tj = 25 °C
1
10 Tj = 150 °C

Tj (°C)
V F (V)
1 0.1
25 50 75 100 125 150 175
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8

Figure 11. Thermal impedance junction to ambient versus Figure 12. Thermal resistance junction to ambient versus
pulse duration copper area under each lead
Rth(j-a) (°C/W)
Zth(j-a) (°C/W) 120
1000
Single pulse
Single pulse on recommended footprint. Epoxy printed circuit board FR4, 70 µm Cu thickness
Epoxy printed circuit board FR4, 70 µm Cu thickness
100

100
80

60

10 40

20

t p (s)
1 SCu (cm²)
0.1 1 10 100 1000 0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5

Figure 13. ISO7637-2 pulse 1 response (VS = -150 V) with Figure 14. ISO7637-2 pulse 2a response (VS = 112 V) with
12 V battery 12 V battery

DS13895 - Rev 1 page 5/15

 SM50TxxAY, SM50TxxCAY
Characteristics (curves)

Figure 15. ISO7637-2 pulse 3a response (VS = -220 V) with Figure 16. ISO7637-2 pulse 3b response (VS = 150 V) with
12 V battery 12 V battery

Figure 18. Load dump capability

Figure 17. ISO7637-2 pulse 5b definition
(Us* = f(Ri) pulse 5b, Us = 87 V, tp = 150 ms)

Figure 19. Load dump capability

Figure 20. ISO16750-2 test B definition
(Us* = f(Ri) pulse 5b, Us = 87 V, tp = 400 ms)

DS13895 - Rev 1 page 6/15

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Characteristics (curves)

Figure 21. Load dump capability Figure 22. Load dump capability
(Us* = f(Ri) test B, Us = 87 V, tp = 150 ms) (Us* = f(Ri) test B, Us = 87 V, tp = 400 ms)

DS13895 - Rev 1 page 7/15

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Package information

2 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.

2.1 SMC package information

Figure 23. SMC package outline

E1

A1

C A2

E2 L b

Table 3. SMC package mechanical data

Dimensions

Ref. Millimeters Inches (for reference only)

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008
b 2.90 3.20 0.114 0.126
c 0.15 0.40 0.006 0.016
D 5.55 6.25 0.218 0.246
E 7.75 8.15 0.305 0.321
E1 6.60 7.15 0.260 0.281
E2 4.40 4.70 0.173 0.185
L 0.75 1.50 0.030 0.060

DS13895 - Rev 1 page 8/15

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SMC package information

Figure 24. Footprint recommendation Figure 25. Marking layout

1.54 5.11 1.54

(0.061) (0.201) (0.061)

3.14
(0.124)

8.19
(0.323)
millimeters
(inches)

Figure 26. Package orientation in reel Figure 27. Tape and reel orientation

Figure 28. 13'' reel dimension values (mm) Figure 29. Inner box dimension values (mm)

DS13895 - Rev 1 page 9/15

 SM50TxxAY, SM50TxxCAY
SMC package information

Figure 30. Tape outline

Table 4. Tape dimension values

Dimensions

Ref. Millimeters

Min. Typ. Max.

D0 1.4 1.5 1.6

D1 1.5
F 7.4 7.5 7.6
K0 2.39 2.49 2.59
P0 3.9 4.0 4.1
P1 7.9 8.0 8.1
P2 1.9 2.0 2.1
W 15.7 16 16.3

DS13895 - Rev 1 page 10/15

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Reflow profile

2.2 Reflow profile

Figure 31. ST ECOPACK recommended soldering reflow profile for PCB mounting

Temperature (°C) 240-245 °C

250 -2 °C/s
2 - 3 °C/s

200 60 sec
(90 max) -3 °C/s
150
-6 °C/s
100
0.9 °C/s
50
Time (s)

0 30 60 90 120 150 180 210 240 270 300

Note: Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile
corresponds to the latest IPC/JEDEC J-STD-020.

DS13895 - Rev 1 page 11/15

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Application and design guidelines

3 Application and design guidelines

More information is available in the application note AN2689 “Protection of automotive electronics from electrical
hazards, guidelines for design and component selection”.

DS13895 - Rev 1 page 12/15

 SM50TxxAY, SM50TxxCAY
Ordering information

4 Ordering information

Table 5. Ordering information

Order code Marking Package Weight Base qty. Delivery mode

SM50TxxAY/CAY(1) See Table 6. Marking. SMC 264 mg 2500 Tape and reel

1. Where xx is nominal value of VBR and A or CA indicates unidirectional or bidirectional version.

Table 6. Marking

Order code Marking Order code Marking

SM50T6V8AY EAIY SM50T6V8CAY EAIY

SM50T7V0AY EAKY SM50T7V0CAY EAKY
SM50T7V5AY EALY SM50T7V5CAY EALY
SM50T10AY EAPY SM50T10CAY EAPY
SM50T12AY EASY SM50T12CAY EASY
SM50T13AY EAUY SM50T13CAY EAUY
SM50T14AY EAWY SM50T14CAY EAWY
SM50T15AY EAYY SM50T15CAY EAYY
SM50T16AY EBAY SM50T16CAY EBAY
SM50T18AY EBCY SM50T18CAY EBCY
SM50T19AY EBEY SM50T19CAY EBEY
SM50T21AY EBIY SM50T21CAY EBIY
SM50T23AY EBMY SM50T23CAY EBMY
SM50T26AY EBOY SM50T26CAY EBOY
SM50T27AY EBPY SM50T27CAY EBPY
SM50T28AY EBQY SM50T28CAY EBQY
SM50T30AY EBSY SM50T30CAY EBSY
SM50T33AY EBUY SM50T33CAY EBUY
SM50T35AY EBWY SM50T35CAY EBWY
SM50T36AY EBXY SM50T36CAY EBXY
SM50T39AY EBZY SM50T39CAY EBZY
SM50T42AY ECCY SM50T42CAY ECCY
SM50T47AY ECGY SM50T47CAY ECGY
SM50T56AY ECOY SM50T56CAY ECOY
SM50T68AY ECYY SM50T68CAY ECYY
SM50T75AY EDEY SM50T75CAY EDEY
SM50T82AY EDKY SM50T82CAY EDKY
SM50T100AY EDZY SM50T100CAY EDZY
SM50T117AY EEOY SM50T117CAY EEOY

Note: Marking differentiation between unidirectional and bidirectional devices is done with cathode bar.

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Revision history
Table 7. Document revision history

Date Revision Changes

07-Nov-2022 1 Initial release.

DS13895 - Rev 1 page 14/15

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DS13895 - Rev 1 page 15/15