Samsung Eric-Ve-R r1.0
Samsung Eric-Ve-R r1.0
Samsung Eric-Ve-R r1.0
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D Table of Contents D
Page. 1 COVER
Eric-VE-R Page. 2
Page. 3
Page. 4~6
OPERATION BLOCK DIAGRAM
BOARD INFORMATION
POWER DIAGRAM / SEQUENCE
Page. 7 CLOCK DISTRIBUTION
g
ENE micom Page. 8 CLOCK GENERATOR (SLG8LV631V)
Page. 9 THERMAL MONITOR & FAN CONTROL
CPU : INTEL CEDARVIEW-M
n
Page. 10~12 CEDAR TRAIL PROCESSOR
l
Page. 13~15 TIGERPOINT (NM10 CHIPSET)
Chip Set : INTEL TIGERPOINT-M
u
Page. 16 DEBUG PORT & DEBUG CODE
Page. 17 DDR3 SODIMM
a
Remarks : DC, DDR3 Page. 18 iSSD
s i
C C
Page. 19 CRT CONN.
t
Page. 20 LCD(LVDS) CONN.
Page. 21 HDMI GRAPHIC
Model Name : Eric-VE-R
m n
Page. 22 AUDIO CODEC (ALC269Q-VC-GR)
PCB Part No : BA41-01868A(GCE) Page. 23 HP & MIC(COMBO)
a e
Page. 24 LAN (RTL8105E)
BA41-01869A(GBM) Page. 25 HDD CONNECTOR (SATA)
BA41-01871A(PIOTEC) Page. 26 MINI-CARD (WIRELESS , HSDPA & SSD)
S fid
Page. 27 USB
Page. 28 TPM
Page. 29 MMC CONTROLLER (AU6438)
Dev. Step : PR Page. 30 MICOM (MICOM 3930)
Page. 31 KBD & TOUCHPAD CONN & POWER SLIDE
n
B
Revision : 1.0 Page. 32 LED LOGIC B
Page. 33 FREE FALL SENSOR
o
T.R. Date : 2011.12.12 Page. 34 CPU VRM POWER (VCC_CORE)
Page. 35 CHIPSET POWER (P1.8V & P1.05V)
Page. 36 DDR3 POWER
C
Page. 37 P3.3V_AUX & P5.0V_AUX
Page. 38 CHARGER
Page. 39 iSSD POWER
DRAW CHECK APPROVAL Page. 40 SWITCHED POWER
Page. 41 POWER DISCHARGER
Page. 42 MOUNT HOLE & MULTI_ASSY DESCRIPTION
Qin Wenchao Wu shijiang BC LEE
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
OPERATION BLOCK DIAGRAM
D D
559 uFCBGA Type THERMAL CLOCK
SENSOR GENERATOR
CPU2_THERMDA/DC
CK-505
EMC2112
TFT_LCD LVDS CPU
10.1"
Cedarview-M
g
(N2100//N2600)
VGA 200P
DDR3-SODIMM
800 MHz
n
CRT MAX 2GB
l
P0
u
USB (1)
Page 10~12
a
P2
USB (2)
s i
C C
DMI*4
t
360 BGA PKG TYPE
P3
m n
Camera
HDD SATA1 ICH USB2.0 [P7:0]
a
P4
e
2.5inch Multi-Card
Tigerpoint AU6438 3in1 B’d
S fid
NM10 Chipset
Page 13~15
PCI_ EXP [P4:1] P3
High Definition Audio MINI CARD1
PCI_ EXP1
Wireless LAN
n
HP
COMBO JACK Audio
B
MIC-IN ALC269Q
HD Audio B
RTC
o
P5
Page 22~23
INT. MIC Batt. SATA0
MINI CARD2
SIMM Card
HSDPA/SSD
4P
C 2P
PCI_ EXP3
RJ45
LAN CONTROLLER LAN
SPI LPC Realtek RT8105E Transformer
SPI ROM
ENE Power S/W
MONO SPKR
KB3930
P/S2 (Slide S/W)
A A
SAMSUNG
Space bar
ELECTRONICS
KEYBOARD TOUCHPAD
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
BOARD INFORMATION
EXCEPT AS AUTHORIZED BY SAMSUNG.
KBC3_SUSPWR
P5V_AUX
P3.3V_AUX
T3
T4
T5
n g l
min 0msec after P5V_AUX Active
I2C / SMB Address
Devices
TigerPoint
CK-505M (Clock Generator)
Address
Master
1101 001X
Hex
D2h
Bus
SMBUS Master
Clock, Unused Clock Output Disable
u
SODIMM0 1010 000X A0h -
min 0.5msec after P3.3V_AUX active CPU Thermal Sensor 0111 101X 7Ah Thermal Sensor
P1.5V_AUX
a
T6
s i
C min 5msec after P1.5V_AUX Active C
KBC3_RSMSRST# T7
t
T8
KBC3_PWRBTN# 1RTC Clock = 32usec USB PORT Assign
CHP3_SLP5*
m
T9
n
Port Number ASSIGNED TO Port Number ASSIGNED TO
CHP3_SL3* T10 UHCI_0 1
0 USB Port_P0
NC UHCI_2 5
4 MMC
Mini Card 2(For HSDPA)
a e
UHCI_1 2 USB Port_P2 UHCI_3 6 NC
KBC3_PWRON T11 3msec after CHP3_SLPS3# active 3 Mini Card 1(For WLAN) 7 CAMERA
P5.0V T12
S fid
P3.3V T13 min 0msec after P5V Active
PCI Express Assign
min 0.5msec after P3.3V Active
P1.5V T14
Port Number ASSIGNED TO
P1.5V_PWRGD 1 Mini Card 1(Wireless LAN)
n
2 NC
immediately on P1.5V 3 LOM
B P1.05V T16
4 NC B
o
AUX5_PWRGD
100usec
P1.5V_AUX T18 Voltage Rails
C
KBC3_PWRON_C T19 Power Rail Descriptions
P0.75V
PRTC_BAT 3.3V (can drop to 2.0V min. in G3 state) supply for the RTC well.
VDC Primary DC system power supply (9 to 19V)
VRM3_P1.05V_PWRGD T20 P1.05V(VCCP) VTT for CPU, Calistoga & ICH7-M
P3.3V_MICOM 3.3V always power rail(for Micom)
P1.5V 1.5V switched power rail (off in S3-S5)
CPU_CORE T21 P1.5V_AUX 1.5V power rail for DDR (off in S4-S5)
P0.75V 0.75V power rail for DDR (off in S4-S5)
P5V_AUX 5.0V power rail (off in S4-S5)
VRM3_CPU_PWRGD T23
P3.3V_AUX 3.3V power rail (off in S4-S5)
P5V 5.0V switched power rail (off in S3-S5)
P3.3V 3.3V switched power rail (off in S3-S5)
P1.8V CPU_CORE Core voltage for Atom CPU
P1.8V For display logic of CPU
VRM3_P1.8V_PWRGD 300msec
ALL_SYS_PWRGD T26
A A
130msec
KBC3_PWRGD
SAMSUNG
PLT3_RST# ELECTRONICS
T29
DMI
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG. POWER DIAGRAM Rev 1.0
D
KBC3_SUSPWR KBC3_PWRON D
(KBC3_PWRSW#) (CHP3_SLPS3*) VRM3_P1.05V_PWRGD
AC Adapter N2100/N2600
CPU_CORE N2100/N2600
P1.05V NM10 Chipset
Battery DC VDC
n g l
P1.5V_AUX SODIMM (DDR III)
CALISTOGA
DDR III-Termination
u
P0.75V
s i a
C C
Thermal LVDS
SATA Touchpad
t
P3.3V_MICOM P5.0V CPU_VRM
P5.0V_AUX
MICOM
a m e n P1.5V
CLK generator
Cedarview
Tigerpoint
S fid P3.3V_AUX
PCH
TPM
LAN
P1.8V_VRM
CLK generator Tigerpoint
n
DDR LVDS
B P5.0V_ALW P3.3V Audio PCMCIA B
SSD TPM
o
CPAS_LED FFS
Cedarview
P1.05V_LAN P1.8V
C
P12.0V_ALW
LAN
Rail
State S0 S3 S4 S5
+V*A(LWS)
ON ON ON ON
+V*LAN ON ON S5-S4 S3 S0
+1.5V_AUX ON ON
+0.75V
A +V*AUX
A
ON ON
+V ON
SAMSUNG
ELECTRONICS
+V* (CORE) ON
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG. POWER RAILS ANALYSIS
Rev. 1.0 (060920)
220V
D D
P3.3V_AUX ( TBD A )
P5.0V_AUX ( TBD A )
Adapter Battery
MICOM 3V ( TBD A )
g
CPU CORE P3.3V P3.3V_MICOM
CPU CORE ( TBD A ) 2.2 A CedarView-M TBD A Thermal 0.08 A (TBD) KBC
P1.05V P5.0V 0.08 A (TBD)
P1.05V ( TBD A ) 2.5 A TBD A Sensor
P1.5V ( 4.5 W )
n
P1.5V ( TBD A ) 0.13 A
P1.8V ( TBD A ) P3.3V_MICOM
l
P3.3V ( TBD A ) P3.3V_AUX
P5.0V ( TBD A ) P1.05V P3.3V
TBD A PWR LED
u
P1.5V_AUX ( TBD A ) 3.72 A
P1.8V
P0.75V( TBD A ) 0.14 A
P1.05V
a
P1.5V 0.78 A
P3.3V TBD A
TBD A CLOCK
s
VDC_LED( TBD A )
i
VCC_CRT (TBD A)
C P3.3V P1.5V
TBD A
C
0.16 A
PEX IO (TBD A)
P1.5V_AUX
1.5A
t
RTC_Battery
P3.3V_AUX
P3.3V_MICOM
0.2 A (TBD) KeyBoard 0.142 A (TBD) LAN (RTL8105E)
P1.05V
m
0.955 A TigerPoint
n
P1.5V
P3.3V 1.422A
0.216 A P3.3V
P3.3V_AUX
0.092 A (TBD)
0.1 A (TBD) SD Card
a
P5.0V
e
0.006 A (TBD)
P5.0V_AUX
RTC_Battery 0.010 A (TBD) ( 2.5 W ) P3.3V_MICOM
0.006 mA (TBD) 0.025 A (TBD) SPI
P1.5V_AUX
S fid
1.5A
P3.3V
P5.0V 0.041 A (TBD)
0.035 A (TBD)
HD Audio
P3.3V_WLAN(P3.3V) 2.75 A (TBD) WLAN
n
1.5V_AUX
B 3.1 A (TBD) P5.0V B
P0.75V 1 A (TBD)
DDR-3 1.4 A (TBD) SATA HDD
o
( ~ 5.0 W )
P5.0V FAN
0.16 A (TBD)
C
P3.3V
VDC_LED (VDC) TBD A P5.0V_AUX(ALW)
TBD A
LCD_VDD3.3V(P3.3V_AUX) TBD A
LCD 2 A (TBD) USB(*2)
P5.0V
0.2 A (TBD) Touch Pad
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
POWER SEQUENCE BLOCK DIAGRAM
19-2) ALL_SYS_PWRGD
PAGE 14
18-0) VRM3_CPU_PWRGD CLOCK
1-0) PRTC_BAT RTC
D Battery U500 CHIP PAGE 8
D
2-1) P3.3V_MICOM P5.0V_AUX & P3.3V_AUX 2-0) VDC VDC 19-1) VRM3_P1.8V_PWRGD
4-0) KBC3_SUSPWR 19V/11V
POWER TPS51125 AC/DC
19-2) ALL_SYS_PWRGD 1-1) CHP3_RTCRST#
16-1) KBC3_VRON 18-0) VRM3_CPU_PWRGD
(1) 7-0) AUX5_PWRGD
16-0) VRM3_P1.05V_PWRGD 17-0) CPU_CORE
S/W PAGE 36
CPU VRM
PAGE 31
ISL95837 P1.8V
g
PAGE 33
20-0) KBC3_PWRGD PWROK 19-0) P1.8V
n
3-0) KBC3_PWRSW#
VRMPWRGD
l
LAN_RESET*
22-0) PLT3_RST# 21-0) CPU1_PWRGD 21-0) CPU1_PWRGD
u
14-0) KBC3_RCIN# 22-0) PLT3_RST# 15-1) P1.05V
a
RCIN* 26-0) CPU BIST
11-0) CHP3_SLPS5#/S3#
s i
C C
KBC 10-0) KBC3_PWRBTN#
TigerPoint
23-0) CPU1_CPURST*
t
ENE3930 9-0) KBC3_RSMRST# 14-1) P3.3V
5-1) P3.3V_AUX 14-2) P1.5V 14-2) P1.5V CedarView
m
12-0) KBC3_PWRON
n
22-0) PLT3_RST#
PAGE 13-15
a
16-1) KBC3_VRON
PAGE 30
4-0) KBC3_SUSPWR
Thermal
Monitor
PAGE 9
S fid e
5-0)P5.0V_AUX
5-0)P5.0V_AUX P1.05V
TPS51117
PAGE 34
15-1) P1.05V
16-0) VRM3_P1.05V_PWRGD
PAGE 11-13
n
DDR3 POWER 8-0) P1.5V_AUX 8-0) P1.5V_AUX
5-1) P3.3V_AUX TPS51125 2-1) P5.0V_STB
DDR3
15-2) P0.75V 15-2) P0.75V
B (2) TPS51117
B
8-1) MEM1_VREF 8-1) MEM1_VREF Memory
o
PAGE 36
PAGE 17
PAGE 35
22-0) PLT3_RST#
C
5-0)P5.0V_AUX 14-1) P3.3V MINI PCIE
14-0)P5.0V
12-0) KBC3_PWRON AON6409L 15-1) P1.05V Devices
PAGE 39
PAGE 26
5-1) P3.3V_AUX
14-1) P3.3V
12-0) KBC3_PWRON AON6409L 14-0)P5.0V AUDIO
PAGE 39
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG. CLOCK DISTRIBUTION
CLK0_HCLK0
D 1205-002574 CLK0_HCLK0# D
100 MHz
CLK0_HCLK1
CLK1_MCLK2/2#
100 MHz CLK0_HCLK1#
CLK1_MCH3GPLL CedarView CLK1_MCLK3/3# SODIMM
100 MHz CLK1_MCH3GPLL#
CLK1_DREFSSCLK 400MHz
g
100 MHz CLK1_DREFSSCLK#
CLK1_DREFCLK
n
96 MHz CLK1_DREFCLK#
CLK1_PCIEICH
u l
CLOCK GENERATOR
HDA3_AUD_BCLK
AUDIO CODEC
a
100 MHz CLK1_PCIEICH#
24MHz
s i
C C
33 MHz CLK3_PCLKICH
TigerPoint
t
14.318 MHz CLK3_ICH14 RTC Clock
SLG8LV631V
m n
CLK3_USB48 CLK3_MMC48
AU6438
CK-505M
CLK1_SATA
a e
100 MHz CLK1_SATA#
S fid
CLK1_MINIPCIE
100 MHz CLK1_MINIPCIE# MINI PCIE(WLAN)
33 MHz
o n
CLK3_PCLKMICOM
KBC
KBC5_TCLK TOUCHPAD
B
C
ENE3930 KBC3_SMCLK#
BATTERY
100 MHz CLK1_PCIELOM
100 MHz CLK1_PCIELOM# RTL8105E
A A
33 MHz CLK3_DBGLPC
80 port
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
CLOCK GENERATOR
P1.5V
P3.3V
R1608 BLM18PG181SN1
D D
10000nF-X5R
2.2
10V
10V
B503 B525
6.3V
P3.3V
100nF
100nF
10V
10V
10V
BLM18PG181SN1
10000nF-X5R
P3.3V
6.3V
100nF
100nF
100nF
Place close to B525
C526
C521
10K 1%
C923
10K 1%
10K 1%
10K 1%
Place close to B503
C561
C562
C556
C520
U529
SLG8LV631V
R592
R531
R591
5 23
R583
0.1uF near every power pin
g
VDD_REF_3.3V VDD_CORE_1.5V_1
0.1uF near every power pin
9 45
VDD_33MHZ VDD_CORE_1.5V_2
nostuff
14
VDD_48
n
P1.05V 36
30
PCI_STOP#
42
CHP3_PCISTP#
VDD_SRC_IO_1.05V_1 CPU_STOP# CHP3_CPUSTP#
l
35 53
VDD_SRC_IO_1.05V_2 CPU_0 CLK0_HCLK0
u
BLM18PG181SN1 52
48
CPU_0# CLK0_HCLK0#
VDD_CPU_I_O_1.05V
a
B501 C558 C523 C525 50
10000nF-X5R CPU_1_MCH
49 CLK0_HCLK1
100nF 100nF 100nF
C518 10V 10V 1
CPU_1_MCH# CLK0_HCLK1#
s i
C Place close to B501 6.3V 10V NC_1 C
2 44
NC_2 SRC_1_CPU_ITP
0.1uF near every power pin 13 43
NC_3 SRC_1#_CPU_ITP#
t
54
NC_4
41
3
SRC_2
40
CLK1_MCH3GPLL
Y500 XTAL_OUT SRC_2# CLK1_MCH3GPLL#
m
4
n
14.31818MHz XTAL_IN
38
SRC_3
37 CLK1_MINIPCIE
1 2 7
SRC_3# CLK1_MINIPCIE#
SMB3_DATA_S 8
SDA
34
a
SMB3_CLK_S SCL SRC_4 CLK1_PCIEICH
e
C552 C553 SRC_4#
33
CLK1_PCIEICH#
0.022nF 0.022nF
50V 50V
CLK3_USB48 R597 33 1% 15
USB48_1_FSB SRC_5
32
CLK1_PCIELOM
31
R596 33 1% 17
SRC_5# CLK1_PCIELOM#
CLK3_MMC48
S fid
USB48_2
28
SRC_6
27
SRC_6#
CLK3_ICH14 R590 33 1% 6
REF_FSC
18
DOT_96_SRC_7 CLK1_DREFCLK
CLK3_PCLKMICOM R1611 10 1%
DOT_96#_SRC_7#
19
CLK1_DREFCLK#
R1609 10 1% 10
CLK3_PCLKICH R1610 10 1%
PCI_1F_ITP_EN
20
CLK3_DBGLPC LCD_CLK CLK1_DREFSSCLK
R1607 33 1% 11 21
CLK3_TPMLPC 25MHZ_PCI2_SEL_33MHZ LCD_CLK# CLK1_DREFSSCLK#
n
TPM 26
SATA CLK1_SATA
C973 C974 12 25
VSS_PCI SATA# CLK1_SATA#
10K 1%
10K 1%
10K 1%
0.033nF 0.033nF 16
VSS_48
B 50V 50V 22
VSS_LCD
B
24 47
C975 C976 C977 VSS_SATA CLKREQ_A# R1614
o
39 46 475 1%
0.01nF 0.01nF 0.01nF VSS_SRC CLKREQ_B# R1615 475 1% MIN3_CLKREQ# Control SRC_3
0.5pF 0.5pF 0.5pF 51 29
50V 50V 50V 56
VSS_CPU CLKREQ_C# LOM3_CLKREQ# Control SRC_5
VSS_REF nostuff VRM3_P1.05V_PWRGD
55 0 R570
R599
R573
R598
C
nostuff
nostuff
1205-004451
nostuff nostuff nostuff 4.6V
P3.3V
P3.3V
U500 R524
5 7SZ08 100K nostuff
1 + 1%
VRM3_CPU_PWRGD 4
2
ALL_SYS_PWRGD
VRM3_P1.8V_PWRGD - P5.0V
3
R523
D 3
10K
1% Q505
A CHP3_SLPS3_MN G RHU002N06 A
1 60V
D 3 S SEL_33MHz(to select Pin11)
2 FS_C FS_B HOST CLK
G
Q502
RHU002N06 LOW Pin11 as 25MHz
SAMSUNG
CHP3_SLPS3#
1 60V
0 0 133 MHz ELECTRONICS
S 2 HIGH Pin11 as 33MHz
0 1 166 MHz
1 1 200 MHz
1 0 100 MHz
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D
THERMAL SENSOR & FAN CONTROL D
P5.0V
n g l
P3.3V P3.3V_AUX
u
P3.3V_AUX
a
10K 1%
10K 1%
10K 1%
s i
C C
10K
1%
R759
t
SMSC C109 49.9
SMSC
10000nF-X5R
C704 1%
SMSC 100nF
SMSC 6.3V
R756
R761
R762
R760
SMSC 10V THM3_VDD_3V_MN
C705
m
SMSC
n
SMSC 100nF U6 nostuff
SMSC
SMSC 10V EMC2112-BP-TR
SMSC 1 14
SMSC 16
VDD_3V SMDATA
15 KBC3_THERM_SMDATA P3.3V_AUX
a
SMSC VDD_5V_1 SMCLK KBC3_THERM_SMCLK
e
19
VDD_5V_2 U526
12
ALERT#
8
THM3_ALERT# G709T1UF
SYS_SHDN# THM3_STP#
9
RESET# SHORT520 INSTPAR C927 5
VCC HYST
4
2 10mil width and 10mil spacing. 100nF 3
THM3_STP#
S fid
DN1 OT_N
P3.3V_AUX DP1
3 10V 1
SET GND
2
17
FAN5_VDD 18
FAN_1
4 THM3_THERMDN_MN
FAN_2 DP3_DN2 R979 1209-002034
R758 20 5 THM3_THERMDP_MN 18K 6V
FAN3_FDBACK# TACH DN3_DP2
50V
2 1%
10K
1% 10 2.2nF MMBT3904
ADDR_SEL
THM3_TRIP_SET_MN
C674 1 Q516
6 3
SHDN_SEL
7 11
TRIP_SET CLK
n
13 Temperature : 95c
R757 R755 GND Opposite side of CPU.
0 1.5K THERMAL_PAD
21 confirmed by thermal charger
B 1% (2010.10.04) B
1209-001887
Rset (kohm) = 0.0012T2 - 0.9308T + 96.147
o
nostuff
C
P3.3V P5.0V
10K
1%
U525 C925 C926
GMT G765P71U 4700nF-X5R 100nF
R976
P5.0V P3.3V GMT 7 10 10V 10V
GMT X2 VCC
6 1
GMT SMSC
GMT
3
CLK FOUT
2
FAN5_VDD
GMT ADD0 FG FAN3_FDBACK#
GMT 8 4
GMT KBC3_THERM_SMCLK 9
SCL ALERT#
5
THM3_ALERT#
R781 KBC3_THERM_SMDATA SDA GND
Line Width = 20 mil R977 10K
10K 1% J12 R978 1209-002035
1% HDR-4P-1R-SMD 0 6V
STD nostuff
FAN5_VDD 1
2
FAN3_FDBACK# 3
4
5
A 6
MNT1 A
C108 MNT2
10000nF-X5R
6.3V
3711-007615
Angle Type SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
0-1005
SMT2
N9 R7
g
CLK1_MCH3GPLL N8
DMI_REFCLKP RSVD_TP_R7
R8 P1.5V
CLK1_MCH3GPLL# DMI_REFCLKN RSVD_TP_R8
T2 T1 R106 7.5K
DMI_REF1P5 DMI_RCOMP
1%
C103 P1.8V PCH_DMIREF1P5_MN
1000nF-X5R
n
L26 B18
6.3V RSVD_L26 SMI# CPU1_SMI# P1.05V
nostuff R101 220 1/16W L27
RSVD_L27 NMI_LINT1
C22
CPU1_NMI
ICH
nostuff R99 220 1/16W K28 C18
RSVD_K28 RSVD_C18 CPU1_A20M#
l
K25 D22
RSVD_K25 STPCLK# CPU1_STPCLK#
R102 R100 J28 nostuff
RSVD_J28
u
2.2K 2.2K K26 nostuff
RSVD_K26 R731 R77
K27
RSVD_K27 56 56
a
H27
RSVD_H27 1% 1%
K30
RSVD_K30
L29
s i
C L30
RSVD_L29
C21 C
RSVD_L30 DPRSTP# CPU1_DPRSTP#
K29 B21
RSVD_K29 DPLSLP# CPU1_DPSLP#
t
J31 B22
RSVD_J31 CPUSLP# CPU1_CPUSLP#
H30
RSVD_H30
A23
INIT#
D20 CPU1_INIT#
INTR_LINT0 CPU1_INTR P1.05V
m n
K24 B20
K23
HV_GPIO_RCOMP THERMTRIP#
L11
CPU1_THRMTRIP#
MV_GPIO_RCOMP RSVD_L11
R79
a
P1.8V
e
R728 R747 100
49.9 49.9 C20 1%
1% 1%
PBE# CPU1_FERR#
A19
PROCHOT# VRM1_PROCHOT#
D23
S fid
PWRGOOD CPU1_PWRGD nostuff
G30
RESET#
E30 PLT3_RST#
DBR_N
R97 R98
51 51
H29
PRDY#
G29
PREQ#
CPU
J19
HPLL_REFCLK_P
K19 CLK0_HCLK0 P1.05V
HPLL_REFCLK_N CLK0_HCLK0#
n
P1.05V E19
RSVD_E19
F19
RSVD_F19
B R734 R732 B
75 110
o
1% 1%
R729 51 C25 B16
TCLK SVID_ALERT# VRM1_SVID_ALERT#
R71 51 C24
TDI SVID_CLK
D18
VRM1_SVID_CLK
R70 51 B25 C16
TDO SVID_DATA VRM1_SVID_DATA
R72 51 D24
TMS
R74 51 B24
C
TRST#
R5
RSVD_R5
R6
RSVD_R6
W25
RSVD_W25
W26 K21
RSVD_W26 RSVD_K21
N24 L22
RSVD_N24 RSVD_L22
N25 L24
RSVD_N25 RSVD_L24
0298843400
M500 M501
HEAD HEAD
DIA DIA
LENGTH LENGTH
BA61-01090A BA61-01090A
A A
DRAW DATE TITLE
CHECK
Qin wenchao
DEV. STEP
11/16/2010
Eric-VE-R SAMSUNG
ELECTRONICS
Wu shijiang PR CPU
APPROVAL REV PART NO.
VGA
AJ22 AD27 H22 A13 R88 680 5%
g
DDR3_MA_15 DDR3_DQ_15
AD29 CHP3_HPD_HDMI# DDI0_HPD CRT_IREF
DDR3_DQ_16
AH10 AE29 10V 100nF C662 G2 E29
DDI
MEM1_AWE# AJ10
DDR3_WE# DDR3_DQ_17
AJ30 HDMI CHP3_TX2P_HDMI 10V 100nF C661 G3
DDI0_TXP_0 CRT_DDC_DATA
E27 CRT3_DDCDATA
MEM1_ACAS# AJ11
DDR3_CAS# DDR3_DQ_18
AK29 HDMI
CHP3_TX2N_HDMI 10V 100nF C658 F3
DDI0_TXN_0 CRT_DDC_CLK CRT3_DDCCLK
MEM1_ARAS# DDR3_RAS# DDR3_DQ_19 CHP3_TX1P_HDMI DDI0_TXP_1
n
AD28 HDMI 10V 100nF C657 F2 F17
AK12
DDR3_DQ_20
AD30 HDMI CHP3_TX1N_HDMI 10V 100nF C663 D4
DDI0_TXN_1 DPL_REFSSCCLKP
E17
CLK1_DREFSSCLK nostuff
MEM1_ABS0 AH13
DDR3_BS_0 DDR3_DQ_21
AG30 HDMI
CHP3_TX0P_HDMI 10V 100nF C664 C3
DDI0_TXP_2 DPL_REFSSCCLKN CLK1_DREFSSCLK# nostuff
MEM1_ABS1 DDR3_BS_1 DDR3_DQ_22 CHP3_TX0N_HDMI DDI0_TXN_2
l
AK22 AJ29 HDMI 10V 100nF C656 B7 B9 R738 0
MEM1_ABS2 DDR3_BS_2 DDR3_DQ_23 CHP3_TXCP_HDMI DDI0_TXP_3 DPL_REFCLKP CLK1_DREFCLK
DDR3_DQ_24
AE24 HDMI
CHP3_TXCN_HDMI
10V 100nF C639 A7
DDI0_TXN_3 DPL_REFCLKN
A9 R737 0
CLK1_DREFCLK#
u
AH12 AG24 HDMI
DDR3_CS#_0 DDR3_DQ_25 P3.3V
AH8 AD22 H15 delete before PR GB
DDR3_CS#_1 DDR3_DQ_26 P3.3V nostuff RSVD_TP_H15
a
AK11 AC21 nostuff J15
MEM1_CS2# AK8
DDR3_CS#_2 DDR3_DQ_27
AG27
RSVD_TP_J15
F28 R66 2.2K
MEM1_CS3# DDR3_CS#_3 DDR3_DQ_28 LVDS_CTRL_CLK R103 R104
AG25 R957 2.2K F25 E24 R73 2.2K
s i
C DDR3_DQ_29 DDI1_DDC_SCL LVDS_CTRL_DATA 0 0 C
AH23
DDR3_CKE_0 DDR3_DQ_30
AG21 R708 2.2K G27
DDI1_DDC_SDA
AJ24 AE21 G24
DDR3_CKE_1 DDR3_DQ_31 LVDS_DDC_CLK LCD3_EDID_CLK Y2
t
AK24 AD13 D10 H24
MEM1_CKE2 AH24
DDR3_CKE_2 DDR3_DQ_32
AD11
DDI1_AUXP LVDS_DDC_DATA LCD3_EDID_DATA
MEM1_CKE3 DDR3_CKE_3 DDR3_DQ_33 R726 R727 C10 DDI1_AUXN R736 27MHz
2
AG8 0 0 E10
DDR3_DQ_34 LVDS_IBG
AK10 AG7 D26 F10
DDR3_ODT_0 DDR3_DQ_35 DDI1_HPD LVDS_VBG 2.37K 1%
m
AK7 AG13 C84 C83
n
AL9
DDR3_ODT_1 DDR3_DQ_36
AE13 E11 H2 0.018nF R93
MEM1_ODT2 DDR3_ODT_2 DDR3_DQ_37 DDI1_TXP_0 LVDS_VREFH 1M 1% 0.018nF
AJ7 AD10 R1598 F11 DDI1_TXN_0 H3 50V 50V
MEM1_ODT3 DDR3_ODT_3 DDR3_DQ_38
AF8 P1.5V J11
LVDS_VREFL
DDR3_DQ_39 0 DDI1_TXP_1
AG15 AH2 H11 G10 LCD1_ADATA0
LVDS
a
DDR3_CK_0 DDR3_DQ_40 DDI1_TXN_1 LVDS_TXP0
e
AF15 AG3 HDMI F13 H10
AF17
DDR3_CK#_0 DDR3_DQ_41
AD2 E13
DDI1_TXP_2 LVDS_TXN0
F8 LCD1_ADATA0#
DDR3_CK_1 DDR3_DQ_42 R1633 DDI1_TXN_2 LVDS_TXP1 LCD1_ADATA1
P1.5V P1.5V_AUX AG17 AD3 0 J13 E8
AD17
DDR3_CK#_1 DDR3_DQ_43
AH4 K13
DDI1_TXP_3 LVDS_TXN1
H7
LCD1_ADATA1#
NON_DEEP CLK1_MCLK2 AC17
DDR3_CK_2 DDR3_DQ_44
AK3
DDI1_TXN_3 LVDS_TXP2
H8
LCD1_ADATA2
DEEPSUS
S fid
CLK1_MCLK2# DDR3_CK#_2 DDR3_DQ_45 LVDS_TXN2 LCD1_ADATA2#
R892 AC15 AE2 R1634 C650 J17 G5
CLK1_MCLK3 AD15
DDR3_CK_3 DDR3_DQ_46
AD4 NON_HDMI 1000nF-X5R H17
RSVD_TP_J17 LVDS_TXP3
G6
1K CLK1_MCLK3# DDR3_CK#_3 DDR3_DQ_47 0 RSVD_TP_H17 LVDS_TXN3
1% 1% AD7 6.3V
1K DDR3_DQ_48
R766 AD6 E15 H4 LCD1_ACLK
DDR3_DQ_49 BREF18V LVDS_CLKP
MCP1_DRAMRST_DRIVE# AK25
DDR3_DRAMRST# DDR3_DQ_50
AA6 R735 F15
BREFREXT LVDS_CLKN
J4
LCD1_ACLK#
DDR3_DQ_51
AB5 R1666 7.5K
AJ27 AE8 91 1% 1% H21
DDR3_VREF DDR3_DQ_52 HDA3_AUD_BCLK AZIL_BCLK
AL28 AE5 C643 R1667 91 1% F22 G22
1% C875 DDR3_VREF_NCTF DDR3_DQ_53
AB9 HDA3_AUD_SYNC
0.022nF
AZIL_SYNC PANEL_BKLTCTL
E25 LCD3_BRIT
LCD3_BKLTEN
IHDA
1K 100nF DDR3_DQ_54 PANEL_BKLTEN
n
R765 AC19 AA8 50V R1658 33 1% E22 F29
10V CLK0_HCLK1 AB19
DDR3_REFP DDR3_DQ_55
AB2 HDA3_AUD_SDI1 R1668 91 1% F21
AZIL_SDI PANEL_VDDEN LCD3_VDDEN
CLK0_HCLK1# DDR3_REFN DDR3_DQ_56
AB4
HDA3_AUD_SDO AZIL_SDO
DDR3_DQ_57
B DDR3_DQ_58
W4 for EMI
HDA3_AUD_RST#
R1665 91 1% E21
AZIL_RST# B
AA5 V3
VRM1_DDR_PWRGD DDR3_DRAM_PWROK DDR3_DQ_59
o 2.2K
2.2K
2.2K
2.2K
121 W7 AC2 0298843400
KBC3_PWRGD 1%
DDR3_VCCA_PWROK DDR3_DQ_60
AB3
HDMI
DDR3_DQ_61 HDMI
R748 R749 AJ26
DDR3_ODTPU DDR3_DQ_62
Y2 HDMI
AJ25 W1 HDMI
100 DDR3_CMDPU DDR3_DQ_63 HDMI
1% AK27
DDR3_DQPU MEM1_ADQS(7:0)
R1654
R1655
R1656
R1657
AA30
C
1% 1% DDR3_DQS_0 NON_HDMI
R768 C708 AB11 RSVD_TP_AB11 DDR3_DQS_1
AB24 NON_HDMI
274
R746 R767 10nF AB13 AF30 NON_HDMI
22.6 33 RSVD_TP_AB13 DDR3_DQS_2
1% 25V AF19 AE22 NON_HDMI
AG19
RSVD_TP_AF19 DDR3_DQS_3
AG10
CRT3_BLUE
nostuff
RSVD_TP_AG19 DDR3_DQS_4
AF4
CRT3_GREEN
DDR3_DQS_5
AB6
CRT3_RED
0.012nF
0.012nF
0.012nF
150
DDR3_DQS_6
1%
150
1%
Y3
150
50V
50V
50V
1%
DDR3_DQS_7
MEM1_ADM(7:0) DDR3 MEM1_ADQS#(7:0) nostuff
Y28 AA31 nostuff
DDR3_DM_0 DDR3_DQS#_0 nostuff
AB26 AB25
C79
C82
C85
DDR3_DM_1 DDR3_DQS#_1
R90
R92
R94
AE30 AF29
DDR3_DM_2 DDR3_DQS#_2
AB21 AF22
DDR3_DM_3 DDR3_DQS#_3
AG11 AF10
DDR3_DM_4 DDR3_DQS#_4
AG2 AF3
DDR3_DM_5 DDR3_DQS#_5
AB8 AB7
P1.5V_AUX P1.5V DDR3_DM_6 DDR3_DQS#_6
AA3 AA2
DDR3_DM_7 DDR3_DQS#_7
0298843400
DDR
W9 R26 6.3V 6.3V 6.3V 6.3V AC11 M29
g
DEEPSUS C876 C877 C691 VCCACKDDR_2 VCC_CPU_11
R27 AC13
VSS_22 VSS_112
M4
DEEPSUS 1000nF-X5R 1000nF-X5R 1000nF-X5R VCC_CPU_12 to reduce EE noise VSS_23 VSS_113
W11 T19 nostuff AC22 N10
6.3V 6.3V 6.3V VCCADLLDDR_1 VCC_CPU_13 VSS_24 VSS_114
C715 W13 T21 nostuff AC28 N14
100nF
C716 VCCADLLDDR_2 VCC_CPU_14
T29 AC4
VSS_25 VSS_115
N19
R891R890 R895R894 VCC_CPU_15 VSS_26 VSS_116
CPU
n
0 0 0 0 10V 10V AJ6 T30 AD19 N21
VCCCKDDR_1 VCC_CPU_16 VSS_27 VSS_117
AK6 T31 AD21 N22
2200nF-X5R VCCCKDDR_2 VCC_CPU_17 P1.5V P1.5V_AUX VSS_28 VSS_118
NON_DEEP U22 AD24 N23
VCC_CPU_18 VSS_29 VSS_119
l
NON_DEEP AH14 U23 AD26 N26
V_SM_1 VCC_CPU_19 VSS_30 VSS_120
AH19 U24 AD5 N27
C711 C706 C712 C709 C713 C714 C710 V_SM_2 VCC_CPU_20 C859 VSS_31 VSS_121
u
AK23 U25 100nF 10V AD8 N28
1000nF-X5R 1000nF-X5R 1000nF-X5R 2200nF-X5R 2200nF-X5R 2200nF-X5R 2200nF-X5R V_SM_3 VCC_CPU_21 DEEPSUS VSS_32 VSS_122
AK5 U26 AE1 N4
6.3V 6.3V 6.3V V_SM_4 VCC_CPU_22 C860 100nF 10V VSS_33 VSS_123
a
10V 10V 10V 10V AL11 U27 AE10 N7
V_SM_5 VCC_CPU_23 DEEPSUS VSS_34 VSS_124
AL16 V18 AE11 P14
GND
P1.05V V_SM_6 VCC_CPU_24 C861 100nF 10V VSS_35 VSS_125
AL21 V19 AE15 P16
s i
C AG31
V_SM_7 VCC_CPU_25
V21
DEEPSUS
AE17
VSS_36 VSS_126
P4 C
V_SM_8 VCC_CPU_26 VSS_37 VSS_127
C879 L512 P1.5V VCC_CPU_27
V28 AE19
VSS_38 VSS_128
T14
P1.05V 10uH
t
B5 V29 AE3 T18
1000nF-X5R VCCADP_1 VCC_CPU_28 VSS_39 VSS_129
C6 V30 AE31 T3
6.3V VCCADP_2 VCC_CPU_29 VSS_40 VSS_130
C675 C676 D6 AF11 U5
nostuff
nostuff C649 C647 VCCADP_3 GFX_CORE AF13
VSS_41 VSS_131
U6
10000nF-X5R 1000nF-X5R 10000nF-X5R VSS_42 VSS_132
m
6.3V K17 AF21 U9
n
6.3V 6.3V VCCADP0_SFR VSS_43 VSS_133
6.3V L18 N11 AF24 V2
P1.05V VCCADP1_SFR VCC_GFX_1 VSS_44 VSS_134
1000nF-X5R N13 C687 C653 C695 C696 AF28 W10
L19
VCC_GFX_2
P11
C626 AF7
VSS_45 VSS_135
W14
VCCAGPIO_LV VCC_GFX_3 6.3V 6.3V 6.3V 6.3V 22000nF-X5R VSS_46 VSS_136
L16 P13 AG22 W19
a
20%
C878 P1.5V VCCAGPIO_REF VCC_GFX_4 1000nF-X7R 1000nF-X7R 1000nF-X7R 1000nF-X7R VSS_47 VSS_137
e
N18 R10 6.3V AG5 W2
1000nF-X5R
6.3V
P1.8V P3.3V_PRIME
BLM18PG181SN1 D30
VCCAGPIO_DIO
POWER VCC_GFX_5
VCC_GFX_6
R9 AH26
VSS_48
VSS_49
VSS_138
VSS_139
W21
T11 AH28 W22
VCCAGPIO_1 VCC_GFX_7 VSS_50 VSS_140
P1.8V B515 D31
VCCAGPIO_2 VCC_GFX_8
T13 AH6
VSS_51 VSS_141
W23
C652 C651 B13 U10 AH9 W24
S fid
1000nF-X5R 1000nF-X5R C75 VCC_GFX_9
V11 AJ2
VSS_52 VSS_142
W27
6.3V 6.3V 2200nF-X5R 6.3V VCCADAC VCC_GFX_10 VSS_53 VSS_143
C659 10000nF-X5R V13 AJ3 W30
P1.8VB516 1000nF-X5R
C667 H5 VCC_GFX_11 P1.05V VSS_54 VSS_144
10V 6.3V AK13 W5
VCCALVDS VSS_55 VSS_145
BLM18PG181SN1 J1 B4 AK19 W6
VCCDLVDS VCCADMI_1 VSS_56 VSS_146
C5 C666 AK28 Y4
VCCADMI_2 VSS_57 VSS_147
DMI
A4 P1.5V AK9
P1.05V VCCADMI_3 6.3V VSS_58
L21 K4 AL13
C654 VCCDIO VCCADMI_PLLSFR 1000nF-X7R
AL19
VSS_59
A27
4700nF-X5R
P3.3V_PRIME P1.05V VSS_60 VSS_148
10V R1649 0 B29
VCCAZILAON_1 VCCFHV_1
V16 C889 AL23
VSS_61 VSS_149
A29
n
A30 T16 1000nF-X7R AL25 A3
C881 C73 VCCAZILAON_2 VCCFHV_2 6.3V AL7
VSS_62 VSS_150
AH1
1000nF-X5R 2200nF-X5R HDMI VSS_63 VSS_151
10V R1650 AA18 V14 B10 AJ1
6.3V VCCSFRMPL VCCFHV_3 VSS_64 VSS_152
B 0 AA11
VCCDMPL
B14
VSS_65 VSS_153
AJ31 B
M28 B19 AK1
PLL
o
B27 M30 B23 AK2
P1.5V C29
VCCPLLCPU0 VSS_CPUSENSE CPU1_VSSSENSE C12
VSS_67 VSS_155
AK30
VCCPLLCPU1_1 VSS_68 VSS_156
B30 U8 C26 AK31
VCCPLLCPU1_2 VCC_GFXSENSE
U7
GFX1_VCCSENSE P1.8V C30
VSS_69 VSS_157
AL2
C880 C689 VSS_GFXSENSE GFX1_VSSSENSE VSS_70 VSS_158
B26 C7 AL29
1000nF-X5R 10000nF-X5R VCCAHPLL VSS_71 VSS_159
N16 D19 AL3
C
6.3V 6.3V VCCTHRM_1 VSS_72 VSS_160
K2 C665 D28 AL30
P1.05V VCCTHRM_2 VSS_73 VSS_161
D8 AL5
6.3V VSS_74 VSS_162
0298843400 D9 B2
1000nF-X7R VSS_75 VSS_163
E2 B3
C694 E5
VSS_76 VSS_164
B31
2200nF-X5R VSS_77 VSS_165
E7 C1
VSS_78 VSS_166
10V F24 C2
VSS_79 VSS_167
F4 C31
P1.05V VSS_80 VSS_168
G1 E1
VSS_81 VSS_169
G11
VSS_82
C644 C668 G13
C888 C648 C645 C646 G15
VSS_83
L14
10000nF-X5R 10000nF-X5R 10000nF-X5R 1000nF-X5R 1000nF-X5R 1000nF-X5R VSS_84 VSS_CDVDET
6.3V 6.3V 6.3V G17 D13
6.3V 6.3V 6.3V VSS_85 VSSA_CRTDAC
G19
VSS_86
G21
VSS_87
G31
VSS_88
G8
VSS_89
H13
VSS_90
0298843400
A A
DESIGN DATE TITLE
CHECK
Qin wenchao
DEV. STEP
11/16/2010
Eric-VE-R SAMSUNG
ELECTRONICS
Wu shijiang PR CPU
APPROVAL REV PART NO.
DMI
T19 K1 AA12 AC9 25V SSD
T18
DMI2RXN USBP4N
K2 USB3_MMC- Y10
RSVD_10 SATA1TXP SAT1_SSD_TXP
U23
DMI2RXP USBP4P
L2
USB3_MMC+ AD15
RSVD_11
SATA
U24
DMI2TXN USBP5N
L3
USB3_MINIPCIE2- W10
RSVD_12
V21
DMI2TXP USBP5P
M6
USB3_MINIPCIE2+ V12
RSVD_13
DMI3RXN USBP6N RSVD_14
V20 M5 AE21
DMI3RXP USBP6P RSVD_15
USB
V24 N1 AE18
V23
DMI3TXN USBP7N
N2
USB3_CAMERA- AD19
RSVD_16
DMI3TXP USBP7P USB3_CAMERA+ U12
RSVD_17 P3.3V
RSVD_18
AD4
g
D4 AC17
SATA_CLKN
AC4
CLK1_SATA#
K21
OC0#
C5 AB13
RSVD_19 SATA_CLKP CLK1_SATA
PEX1_MINIRXN1 PERN1 OC1# RSVD_20 R709
K22 D3 P3.3V_DEEP AC13 AD11 R75 24.9 1%
10K
PEX1_MINIRXP1 C69 100nF 10V J23
PERP1 OC2#
D2 1K R646 AB15
RSVD_21 SATARBIAS#
AC11 1%
PEX1_MINITXN1 PETN1 OC3# RSVD_22 SATARBIAS
C68 J24 E5 1% Y14 AD25
n
100nF 10V
PEX1_MINITXP1 M18
PETP1 OC4#
E6
RSVD_23 SATALED#
PERN2 OC5#_GPIO29
M19 C2 AB16
PERP2 OC6#_GPIO30 RSVD_24
l
K24
PETN2 OC7#_GPIO31
C3 1K R648 AE24
RSVD_25
K25 1% AE23 P1.05V
PETP2 RSVD_26
u
L23
PEX1_LAN_RXN3 L24
PERN3
PEX1_LAN_RXP3 PERP3 R647
C65
a
100nF 10V L22 G2 22.6 AA14 U16
PCI-E
PEX1_LAN_TXN3 PETN3 USBRBIAS RSVD_27 A20GATE KBC3_A20G R85
C63 100nF 10V M21 G3 1% V14 Y20 1K
PEX1_LAN_TXP3 P17
PETP3 USBRBIAS# P3.3V RSVD_28 A20M#
Y21
CPU1_A20M# 1%
s i
C P18
PERN4 CPUSLP#
Y18
CPU1_CPUSLP# C
PERP4 IGNNE#
N25 AD16 AD21
PETN4 RSVD_29 INIT3_3V#
t
N24 AB11 AC25
HOST
PETP4
F4 AB10
RSVD_30 INIT#
AB24 CPU1_INIT#
CLK48 CLK3_USB48 HSDPA RSVD_31 INTR CPU1_INTR
P1.5V Y22
24.9 R51 FERR# CPU1_FERR#
H24 R935 10K 1%
AD23 T17
DMI_ZCOMP GPIO36 NMI CPU1_NMI
m
1% J22 AC21
KBC3_RCIN#
n
DMI_IRCOMP RCIN#
AA16
W23
SERIRQ
AA21 CHP3_SERIRQ
10K
CLK1_PCIEICH# W24
DMI_CLKN SMI#
V18
CPU1_SMI#
CLK1_PCIEICH DMI_CLKP STPCLK#
AA20 CPU1_STPCLK#
a
THERMTRIP# CPU1_THRMTRIP#
e
A5 B22 NON_HSDPA
1%
PAR AD0
10K R661 1% B15
DEVSEL# AD1
D18 0904-002558
J12 C17
R908
CLK3_PCLKICH A23
PCICLK AD2
C18 P3.3V
PCIRST# AD3
10K R653 1% B7 B17
S fid
nostuff IRDY# AD4
10K R665 1% C22
PME# AD5
C19
P3.3V 10K R659 1% B11 B18 R37 10K 1%
SERR# AD6 KBC3_A20G
10K R39 1% F14
STOP# AD7
B19
KBC3_RCIN# R87 10K 1%
10K R655 1% A8 D16 R17 10K 1%
PLOCK# AD8 CHP3_WLAN_PWRON
10K R657 1% A10
TRDY# PCI AD9
D15
CHP3_WLAN_RST# R34 10K 1%
10K R658 1% D10 A13 R652 10K 1%
10K R662 1% A16
PERR# AD10
E14 FFS3_INT
FRAME# AD11
H14
AD12
GPIO48/17-BIOS Flash Strap-0/1 AD13
L14
n
x0-SPI, 0x-PCI, xx-LPC J14
AD14 P1.05V
A18 E10
GNT1# AD15
E16 C11
P3.3V GNT2# AD16 R684
B AD17
E12
CPU1_FERR#
56 1% B
10K R23 1% G16 B9 R50 56 1%
REQ1# AD18 CPU1_THRMTRIP#
o
10K R664 1% A20
REQ2# AD19
B13
L12
R660 AD20
R656 B8
10K R42 AD21 P1.05V
10K nostuff 1K 1%G14 A3
1% nostuff GPIO48_STRAP1# AD22
1% R649 1K 1% A2
GPIO17_STRAP2# AD23
B5
C15 A6 R48 1K 1%
C
C9
GPIO22 AD24
G12 CPU1_A20M# R49 1K 1% nostuff
KBC3_RUNSCI# GPIO1 AD25 CPU1_CPUSLP#
H12 R970 1K 1% nostuff
AD26
C8 CPU1_INIT# R971 1K 1% nostuff
P3.3V AD27 CPU1_INTR
AD28
D9
CPU1_NMI R45 1K 1% nostuff
10K R650 1% B2 C7 R972 1K 1% nostuff
PIRQA# AD29 CPU1_SMI#
10K R654 1% D7 C1 R44 1K 1% nostuff
10K
10K B3 B1
PIRQC# AD31
10K R18 1% H10
PIRQD#
nostuff 10K R15 1% E8
PIRQE#_GPIO2
D6
R909
FFS3_INT H8
PIRQF#_GPIO3
H16
CHP3_WLAN_RST# F8
PIRQG#_GPIO4 C_BE0#
M15
CHP3_WLAN_PWRON PIRQH#_GPIO5 C_BE1#
C13
C_BE2#
D11 L16
STRAP0# C_BE3#
10K R35 1% K9
RSVD_1
10K R38 1% M13
RSVD_2
0904-002558
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
Tigerpoint (2/3) P3.3V
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS P3.3V
EXCEPT AS AUTHORIZED BY SAMSUNG.
nostuff
R40 10K 1%
U508-3 5
U517
1 7SZ08
+
CG82NM10 3/5 PLT3_RST_ORG# 4
PLT3_RST#
AA5 T15 2
D LPC3_LAD(3:0) V6
LDRQ1#_GPIO23 BM_BUSY#_GPIO0
W16
CHP3_SERDBG
C782
-
C781
D
LAD0_FWH0 GPIO6 CHP3_RFOFF_WLAN# nostuff 3 R814
AA6 W14 0.15nF 100K 0.1nF nostuff
LAD1_FWH1 GPIO7 CHP3_RFOFF_HSDPA# P3.3V
LPC
Y5 K18 50V 1% 50V
LAD2_FWH2 GPIO8 P3.3V_DEEP
W8 H19
Y8
LAD3_FWH3 GPIO9
M17
CHP3_RFOFF_WBT#
Y4
LDRQ0# GPIO10
A24 KBC3_EXTSMI# SMT508 0-1005 EMI request (10/30)
LPC3_LFRAME# LFRAME# GPIO12 CHP3_INTELBT_OFF# R26 nostuff
C23 1K
GPIO13 KBC3_WAKESCI# LCD PID0
P6 P5 R641 10K 1% 1%
HDA3_AUD_BCLK U2
HDA_BIT_CLK GPIO14
E24
HDA3_AUD_RST# W2
HDA_RST# GPIO15
AB20 P3.3V_AUX
HDA3_AUD_SDI0 HDA_SDIN0 DPRSLPVR
AUDIO
V2 Y16 R22 10 nostuff R27
HDA3_AUD_SDI1 P8
HDA_SDIN1 STP_PCI#
AB19 R19 10 nostuff
CHP3_PCISTP# P3.3V_DEEP
HDA_SDIN2 STP_CPU# CHP3_CPUSTP# 4.7K nostuff nostuff nostuff
C618 AA1 R3 1% R1638
0.022nF
HDA3_AUD_SDO Y1
HDA_SDOUT GPIO24
C24 R668 1K 1%
CHP3_DBGSTRP P3.3V_DEEP
10K
g
HDA3_AUD_SYNC HDA_SYNC GPIO25
D19 R663 LCD PID1 TPM
50V AA3 10K 1% 1% R41 10K 1%
CLK3_ICH14 CLKT4 GPIO26
D20
CHP3_MFGMODE#
U3
GPIO27
F22 P3.3V BIOS detect TPM 1%
CHP3_DBGSTRP
EE_CS GPIO28
EPROM
for EMI AE2 AC19 10K
EE_DIN CLKRUN# PCI3_CLKRUN# R1636 R962
T6 U14 R945
n
10K 100K
MISC
EE_DOUT GPIO33 CHP3_MFGMODE# NON_TPM
V3 AC1 R1718 1% 1%
EE_SHCLK GPIO34
AC23 10K
GPIO38 CHP3_BOARDID0 INTMIC
l
T4 AC24 1%
P7
LAN_CLK GPIO39 CHP3_BOARDID1
LANR_STSYNC
u
B23 AB22 R1719
AA2
LAN_RST# CPUPWRGD_GPIO49 CPU1_PWRGD
LAN_RXD0 10K NON_INTMIC
LAN
a
C628 AD1 AB17 1%
AC2
LAN_RXD1 THRM#
V16 R78 0 5% THM3_ALERT#
0.007nF LAN_RXD2 VRMPWRGD ALL_SYS_PWRGD
0.032768MHz
W3 AC18
s i
C T7
LAN_TXD0 MCH_SYNC#
E21
MCH3_ICHSYNC#
R36 10K 1%
C
LAN_TXD1 PWRBTN# KBC3_PWRBTN# P3.3V_DEEP KBC3_PWRGD
2
Y503
t
G22 R1622 0
C627 W4
SUS_STAT#_LPCPD#
D22 CHP3_SUSSTAT# R1623 0 CHP3_SUSCLK_TPM
3
RTC
V5 G18
T5
RTCX2 SYS_RESET#
G23
ITP3_DBRRESET#
CHP3_RTCRST# RTCRST# PLTRSTB
C25 R669
PLT3_RST_ORG#
m
1K 1%
n
WAKE# P3.3V
E20 T8 R968 1M 1%
SMB3_ALERT# H18
SMBALERT#_GPIO11 INTRUDER#
U10
SMB3_CLK E23
SMBCLK PWROK
AC3
KBC3_PWRGD
SMB3_DATA SMBDATA RSMRST# KBC3_RSMRST#
SMB
H21 AD3 R704 330K
a
SMB3_LINKALERT# SMLALERT# INTVRMEN
e
F25 J16 5%
CHP3_SMLINK0 F24
SMLINK0 SPKR AUD3_SPKR R89 R83
CHP3_SMLINK1 SMLINK1
H20
FFS 10K 10K
SLP_S3# CHP3_SLPS3# 1% 1%
R2 E25 BIOS detect FFS
T1
SPI_MISO SLP_S4#
F21 CHP3_SLPS4# P3.3V_DEEP nostuff
CHP3_SLPS5# CHP3_BOARDID1
S fid
SPI_MOSI SLP_S5#
M8
P9
SPI_CS#
B25 R667 10K 1% CHP3_BOARDID0
SPI
R24 10K 1%
SMB3_ALERT#
n
R46 10K 1% FFS
SMB3_CLK
SMB3_DATA R666 10K 1% FFS
B B
R685 10K 1%
CHP3_RI# P3.3V_MICOM PRTC_BAT
o
R47 10K 1%
ITP3_DBRRESET#
P3.3V_DEEP
nostuff P3.3V C742
nostuff
R1643 10K 1% P3.3V RTC Battery 1000nF-X5R
1
C
R1644 10K 1% PRTC_COIN
D523
BAT54C
BA39-00660A
3
for leakage
FFS
P3.3V_AUX FFS R616 R617 R782
J501
2
2.2K 2.2K 20K
HDR-2P-1R-SMD
G
R670 10K 1% 1%
1
KBC3_WAKESCI# RHU002N06
R43 10K 1% P3.3V Q510 STD
KBC3_EXTSMI# 10K 1% R783 1K CHP3_RTCRST#
D
SMB3_CLK SMB3_CLK_S 1
1%
2
3
R1599 nostuff 2
3
P3.3V MNT1 C743 CMOS
G
4
1
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
Tigerpoint (3/3)
D U508-5 D
CG82NM10
A1
VSS_0
5/5 VSS_1
A25
B6
VSS_2
B10
P3.3V VSS_3
B16
nostuff
VSS_4
B20
VSS_5
B24
C968 VSS_6
E18
22000nF-X5R
P5.0V P3.3V_DEEP VSS_7
20% F16
P5.0V_AUX P5.0V_DEEP VSS_8
6.3V G4
VSS_9
G8
g
VSS_10
3 3 H1
1 2 1 2 VSS_11
R21 R645 R913 H4
VSS_12
100 10 10 H5
BAT54A BAT54A DEEPSUS VSS_13
1% NON_DEEP K4
D522 D506 VSS_14
K8
n
VSS_15
K11
U508-4 C24 VSS_16
1000nF-X5R
C609 VSS_17
K19
l
100nF
Intel default : 0 ohm (option : bead) K20
CG82NM10 6.3V
10V
VSS_18
VSS_19
L4
u
F12 M7
VCC5REF nostuff VSS_20
4/5 R32 0 P1.5V
VSS_21
M11
a
F5 N3
VCC5REF_SUS VSS_22
N12
VSS_23
Y6 N13
s i
C VCCSATAPLL PRTC_BAT C54
C51 SHORT3 VSS_24
N14
C
10000nF-X5R INSTPAR VSS_25
AE3 100nF N23
VCCRTC 6.3V VSS_26
t
10V P11
VSS_27
VCCDMIPLL
Y25 SHORT4 C629 C630 VSS_28
P13
INSTPAR
P1.5V 100nF 10nF P19
VSS_29
F6 10V 25V R14
VCCUSBPLL VSS_30
m
R22
PI recommend : keep these components
n
VSS_31
C81 C80 VSS_32
T2
W18 T22
POWER
10nF 4700nF-X5R
V_CPU_IO VSS_33
25V 10V V1
Intel default : 0 ohm (option : bead) VSS_34
V7
a
nostuff VSS_35
e
M9 V8
VCC1_5_1 P1.5V VSS_36
M20 V19
VCC1_5_2 VSS_37
N22 V22
VCC1_5_3 VSS_38
AA8 V25
VCC1_5_4 C58 C55 C77 C64 C62 VSS_39
W12
S fid
6.3V 6.3V VSS_40
6.3V 100nF 100nF W22
1000nF-X5R 1000nF-X5R 10000nF-X5R VSS_41
J10 10V 10V Y2
VCC1_05_1 VSS_42
K17 Y24
VCC1_05_2 P1.05V VSS_43
P15 AB4
VCC1_05_3 VSS_44
V10 AB6
VCC1_05_4 VSS_45
AB7
C60 C61 C59 VSS_46
AB8
6.3V 6.3V VSS_47
F10 6.3V AC8
VCC3_3_1 10000nF-X5R 1000nF-X5R 1000nF-X5R VSS_48
G10 AD2
VCC3_3_2 P3.3V_PRIME VSS_49
n
H25 AD10
VCC3_3_3 VSS_50
R10 AD20
VCC3_3_4 VSS_51
T9 AD24
VCC3_3_5 VSS_52
B VCC3_3_6
AD13
C26 C25 C56 C78 C66 VSS_53
AE1 B
C57 C67 VSS_54
AE10
o
6.3V 6.3V 6.3V 100nF 100nF 6.3V 6.3V AE25
1000nF-X5R 1000nF-X5R 1000nF-X5R 1000nF-X5R 1000nF-X5R VSS_55
F1 10V 10V
VCCSUS3_3_1
F18
VCCSUS3_3_2 P3.3V_DEEP nostuff nostuff
K7 G24
VCCSUS3_3_3 VSS_56
N4 AE13
VCCSUS3_3_4 VSS_57
F2
C
C52 C27 C53 C610 VSS_58
0904-002558
100nF 6.3V 6.3V 6.3V
1000nF-X5R 1000nF-X5R 10000nF-X5R
10V AE16
RSVD_33
0904-002558
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
80H DECODER CONNECTOR AND DEBUG CODE
AMI Aptio 4.x Status Codes
ACPI/ASL Status Codes
D D
01
02
System is entering S1 sleep state
System is entering S2 sleep state
DXE Status Codes
03 System is entering S3 sleep state
04 System is entering S4 sleep state Progress Codes
05 System is entering S5 sleep state
10 System is waking up from the S1 sleep state 60 DXE Core is started
20 System is waking up from the S1 sleep state 61 NVRAM initialization
30 System is waking up from the S1 sleep state 62 Installation fo the South Bridge Runtime Services
40 System is waking up from the S1 sleep state 63 CPU DXE initialization is started
AC System has transitioned into ACPI mode(PIC) 64 CPU DXE initialization(CPU moudle specific)
AA System has transitioned into ACPI mode(ACPI) 65 CPU DXE initialization(CPU moudle specific)
66 CPU DXE initialization(CPU moudle specific)
67 CPU DXE initialization(CPU moudle specific)
68 PCI host bridge initialization
g
PEI Status Codes 69 North Bridge DXE initialization is started
6A North Bridge DXE SMM initialization is started
6B North Bridge DXE initialization(North Bridge module specific)
Progress Codes 6C North Bridge DXE initialization(North Bridge module specific)
10 PEI Core is started 6D North Bridge DXE initialization(North Bridge module specific)
n
11 Pre-memory CPU initialization is started 6E North Bridge DXE initialization(North Bridge module specific)
12 Pre-memory CPU initialization(CPU module specific) 6F North Bridge DXE initialization(North Bridge module specific)
13 Pre-memory CPU initialization(CPU module specific) 70 South Bridge DXE initialization is started
l
14 Pre-memory CPU initialization(CPU module specific) 71 South Bridge DXE SMM initialization is started
15 Pre-memory North Bridge initialization is started 72 South Bridge devices initialization
u
16 Pre-memory North Bridge initialization(North Bridge module specific) 73 South Bridge DXE initialization(South Bridge module specific)
17 Pre-memory North Bridge initialization(North Bridge module specific) 74 South Bridge DXE initialization(South Bridge module specific)
a
18 Pre-memory Bridge initialization(North Bridge module specific) 75 South Bridge DXE initialization(South Bridge module specific)
19 Pre-memory South Bridge initialization is started 76 South Bridge DXE initialization(South Bridge module specific)
s i
C 1A Pre-memory South Bridge initialization (South Bridge module specific) 77 South Bridge DXE initialization(South Bridge module specific) C
1B Pre-memory South Bridge initialization (South Bridge module specific) 78 ACPI module initialization
1C Pre-memory South Bridge initialization (South Bridge module specific) 79 CSM initialization
t
1D-2A OEM pre -memory initialization codes 7A-7F Reserved for future AMI DEX codes
2B Memory initialization.Serial Presence Detect (SPD) data reading 80-8F OEM DEX initialization codes
2C Memory initialization.Memoryl presence Detection 90 Boot Device Selection (BDS) phase is started
2D Memory initialization. Programming memory timing information 91 Driver connecting is started
m n
2E Memory initialization. Configuring memory 92 PCI Bus initialization is started
2F Memory initialization.(other) 93 PCI Bus Hot Plug Controller Initialization
30 Reserved for ASL (see ASL Statue Codes section below) 94 PCI Bus Enumeration
31 Memory Installed 95 PCI Bus Request Resources
a
32 CPU post-memory initialization is started 96 PCI Bus Assign Resources
e
33 CPU post-memory initialization. Cache initialization 97 Console Output devices connect
34 CPU post-memory initialization. Application Processor(s) (AP) intialization 98 Console Input devices connect
35 CPU post-memory initialization. Boot Strap Processor(BSP) selection 99 Super IO Initialization
36 CPU post-memory initialization.Syetem Management Mode (SMM) intialization 9A USB initialization is started
S fid
37 Post-Memory North Bridge initialization is started 9B USB Reset
38 Post-Memory North Bridge initialization (North Bridge module specific) 9C USB Detect
39 Post-Memory North Bridge initialization (North Bridge module specific) 9D USB Enable
3A Post-Memory North Bridge initialization (North Bridge module specific) 9E-9F Reserved for future AMI codes
3B Post-Memory South Bridge initialization is started A0 IDE initialization is started
3C Post-Memory South Bridge initialization (South Bridge module specific) A1 IDE Reset
3D Post-Memory South Bridge initialization (South Bridge module specific) A2 IDE Detect
3E Post-Memory South Bridge initialization (South Bridge module specific) A3 IDE Enable
3F-4E OEM post memory initialization codes A4 SCSI Initialization is started
4F DXE IPL is started A5 SCSI Reset
n
A6 SCSI Detect
PEI Error Codes A7 SCSI Enable
B 50 Memory initialization error.Invalid memory type or incompatible memory speed. A8 Setup Verifing Password B
51 Memory initialization error.SPD reading has failed A9 Start of Setup P3.3V
52 Memory initialization error.Invalid memory size or memory modules do not match AA Reserved for ASL (see ASL Status Codes section below)
o
53 Memory initialization error.No useable memory detected AB Setup Input Wait J15
54 Unspecified memory initialization error AC Reserved for ASL (see ASL Statue Codes section below) HDR-10P-1R-SMD
55 Memory not installed AD Readay To Boot event STD
56 Invalid CPU type or Speed AE Legacy Boot Event
57 CPU mismatch AF Exit Boot Services event
1
C
58 CPU self test failed or possible CPU cache error B0 Runtime Set Virtual Address MAP Begin CHP3_SERDBG 2
59 CPU micro-code is not found or micro-code update is failed B1 Runtime Set Virtual MAP End PLT3_RST# 3
5A Internal CPU error B2 Legacy Option ROM Initialization CLK3_DBGLPC 4
5B reset PPI is not available B3 System Reset LPC3_LFRAME# 5
5C-5F Reserved for future AMI error codes B4 USB Hot Plug LPC3_LAD(3) 6
LPC3_LAD(2) 7
S3 Resume Progress Codes B5 PCI Bus Hot Plug LPC3_LAD(1) 8
E8 S3 Resume Failed in PEI B6 Clean-up of NVRAM LPC3_LAD(0) 9
E9 S3 Resume PPI not Found B7 Configuration Reset (reset of NVRAM settings) 10
EA S3 Resume Boot Script Error B8-BF Reserved for future AMI codes 11 MNT1
EB S3 OS Wake Error C0-CF OEM BDS initialization codes 12
MNT2
EC-EF Reserved for future AMI error codes DXE Error Codes
Recovery Progress Codes D0 CPU initialization error 3711-007616
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY. DDR SO-DIMM #0 P3.3V_AUX P1.5V_AUX
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG. Height : 4 mm (REVERSED)
DEEPSUS
R829 R826
DEEPSUS 1K 1K
1% 1% DEEPSUS
3
2
MCP1_DRAMRST_DRIVE# MCP1_DRAMRST#
D
S
D R828 Q532 D
1
G
100K BSS138
MEM1_ADQ(63:0) 1% 50V
KBC3_DRAMRST_GATE
C804
47nF
50V
DDR1-1
DDR3-SODIMM-204P-RVS
R827 0
MEM1_AMA(15:0)
1/2
0 98 5 0
A0 DQ0
1 97 7 1
A1 DQ1 NON_DEEP
2 96 15 2
g
A2 DQ2
3 95 17 3
A3 DQ3
4 92 4 4
A4 DQ4 P1.5V_AUX
5 91 6 5
A5 DQ5
6 90 16 6
A6 DQ6
7 86 18 7 DDR1-2
n
A7 DQ7
8 89 21 8
DDR3-SODIMM-204P-RVS
A8 DQ8
9 85 23 9
A9 DQ9 2/2
l
10 107 33 10
A10_AP DQ10
11 84 35 11 75 31
A11 DQ11 VDD1 VSS11
u
12 83 22 12 76 32
A12_BC# DQ12 VDD2 VSS12
13 119 24 13 81 37
A13 DQ13 VDD3 VSS13
a
14 80 34 14 82 38
A14 DQ14 VDD4 VSS14 P1.5V_AUX
15 78 36 15 87 43
A15 DQ15 VDD5 VSS15
39 16 88 44
s i
C 109
DQ16
41 17 93
VDD6 VSS16
48
C
MEM1_ABS0 108
BA0 DQ17
51 18 94
VDD7 VSS17
49
MEM1_ABS1 BA1 DQ18 VDD8 VSS18
t
79 53 19 99 54
MEM1_ABS2 BA2 DQ19
40 20 100
VDD9 VSS19
55
DQ20 VDD10 VSS20 R824
114 42 21 P0.75V 105 60 1K
MEM1_CS2# 121
S0# DQ21
50 22 106
VDD11 VSS21
61 1%
MEM1_CS3# S1# DQ22 VDD12 VSS22
m
52 23 111 65
MEM1_VREF
n
DQ23 P3.3V VDD13 VSS23
101 57 24 112 66
CLK1_MCLK2 103
CK0 DQ24
59 25 117
VDD14 VSS24
71
CLK1_MCLK2# 102
CK0# DQ25
67 26 118
VDD15 VSS25
72 SHORT512 INSTPAR
CLK1_MCLK3 CK1 DQ26 C838 C837 VDD16 VSS26 R825 MEM1_VREF_DQ0
104 69 27 123 127 1K
a
CLK1_MCLK3# CK1# DQ27 C826 1000nF-X5R 1000nF-X5R VDD17 VSS27
e
MEM1_CKE2 73
CKE0 DQ28
56 28
100nF C827 6.3V 6.3V 124
VDD18 VSS28
128 1% C803
74 58 29 2200nF-X5R 133 100nF
MEM1_CKE3 CKE1 DQ29
68 30
10V 10V 203
VSS29
134 25V
DQ30 VTT1 VSS30
115 70 31 204 138
MEM1_ACAS# 110
CAS# DQ31
129 32
nostuff VTT2 VSS31
139
MEM1_ARAS#
S fid
P3.3V RAS# DQ32 VSS32
113 131 33 199 144
MEM1_AWE# WE# DQ33
141 34
VDDSPD VSS33
145
DQ34 VSS34
197 143 35 1 150 Place one cap close to every 2 pull-up resistors terminated to P0.75V
201
SA0 DQ35
130 36
MEM1_VREF_DQ0 126
VREFDQ VSS35
151
SA1 DQ36
132 37
C801 C802 VREFCA VSS36
155
DQ37 100nF 2200nF-X5R VSS37
202 140 38 156
SMB3_CLK_S 200
SCL DQ38
142 39
10V 10V 77
VSS38
161
SMB3_DATA_S SDA DQ39
147 40 122
NC1 VSS39
162
DQ40 NC2 VSS40
116 149 41 167
MEM1_ODT2 ODT0 DQ41 VSS41
n
120 157 42 168
MEM1_ODT3 ODT1 DQ42
159 43 2
VSS42
172
MEM1_ADM(7:0) 0 11
DQ43
146 44
MEM1_VREF 3
VSS1 VSS43
173
DM0 DQ44 VSS2 VSS44
B 1 28
DM1 DQ45
148 45 C834 C154 8
VSS3 VSS45
178 B
SA0 0 0 2 46 158 46 100nF 2200nF-X5R 9 179
DM2 DQ46 VSS4 VSS46
o
SA1 0 1 3 63 160 47 10V 10V 13 184
DM3 DQ47 VSS5 VSS47
4 136 163 48 14 185
DM4 DQ48 VSS6 VSS48
SPD ADD 0xA0 0xA2 5 153 165 49 19 189
DM5 DQ49 VSS7 VSS49
6 170 175 50 20 190
DM6 DQ50 VSS8 VSS50
7 187 177 51 25 195
MNT1
MNT2
TS ADD 0x30 0x32 DM7 DQ51 VSS9 VSS51
164 52 26 196
C
MEM1_ADQS(7:0) 0 12
DQ52
166 53
VSS10 VSS52
DQS0 DQ53
1 29 174 54
DQS1 DQ54
205
206
2 47 176 55
DQS2 DQ55
3 64 181 56 3709-001654
DQS3 DQ56
4 137 183 57
DQS4 DQ57
5 154 191 58
DQS5 DQ58
6 171 193 59
DQS6 DQ59
7 188 180 60
DQS7 DQ60
182 61
MEM1_ADQS#(7:0) DQ61 P1.5V_AUX
0 10
DQS#0 DQ62
192 62 Place near SO-DIMM0
1 27 194 63
DQS#1 DQ63
2 45
DQS#2
3 62 125
DQS#3 TEST
4 135
DQS#4 EC502 C833 C836 C745 C744 C828 C835 C830 C832 C831 C829
5 152 198 220uF
DQS#5 EVENT#
6 169 2.5V
DQS#6 10000nF-X5R 10000nF-X5R 10000nF-X5R 10000nF-X5R 10000nF-X5R 10000nF-X5R 100nF 100nF 100nF 100nF
7 186 30 nostuff
DQS#7 RESET# MCP1_DRAMRST# 6.3V 6.3V 6.3V 6.3V 6.3V 10V 10V 10V 10V
3709-001654
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
iSSD
EXCEPT AS AUTHORIZED BY SAMSUNG.
SSD3_VDD_CTRL
G10
G13
G14
D13
N14
H13
D14
H14
P14
P13
E10
E13
E14
B10
F10
F13
F14
L14
L13
N4
K5
K6
K7
P2
P1
E7
E8
E9
B5
A6
K8
K9
F2
J5
P3.3V
P3.3V 3.3V: For P5, VCCQ=1.8V & VDDC=1.2V nostuff
VDDC1
VDDC2
VDDC3
VDDC4
VDDC_CTRL
VSS10
VSS12
VSS13
VSS14
VSS15
VSS16
VCC1
VCC2
VCC3
VCC4
VCC5
VCC6
VCC7
VCC8
FCEN2
VSS17
VSS18
VSS19
VSS23
VCC14
VSS20
VSS22
VSS21
FCEN0
VCC9
VCC10
DNU7
DNU8
DNU9
GND : For P4, VCCQ=2.0V &VDDC=1.0V C693 100nF M12
TP0 VCC12
K14
10V B9 K13
B8
FCEN0_M VCC13 C886
R942 DNU1 10000nF-X5R
10K nostuff P2.0V_1.8V_ISSD J14
DNU33 6.3V
1% J13
DNU34
K10
g
SSD3_VDD_CTRL J10
VCCQ3
C14
VCCQ2 DNU10
R702 C707 H10
VCCQ1 DNU11
B11
mSATA SSD 2200nF-X5R B12
0 DNU12
module 10V C13 N3
VSS9 DNU13
SATA B14 M2
n
VSS8 DNU14
signal Mini Card Conn. B13 P4
VSS7 DNU15
Chipset On Board A14 N6 ISSD
VSS6 FCEN2_M
l
iSSD A13 N5 ISSD
P3.3V VSS5 DNU2 ISSD
J1 P3
SATA_VSS3 DNU16 ISSD
u
B509 P5 ISSD
DNU5 ISSD
BLM18PG181SN1
P2.0V_ISSD P2.0V_1.8V_ISSD U511 ISSD
a
Placement
H2 M13 ISSD
SATA_VCC2 DNU17
C915
G2
SATA_VCC1 SDIS4BH-008G DNU18
M14 ISSD
R689 0 P10 ISSD
s i
C 100nF
A5
DNU19
N11 ISSD C
1/10W
25V VSS4 BA59-03190A DNU20 ISSD
P1.8V B1 P8 ISSD
VSS3 DNU21
t
N9 ISSD
DNU22 ISSD
R722 0 R703 0 H1 P6
SAT1_SSD_RXP SATA_TXP DNU23 ISSD
SAT1_SSD_RXN R956 0 G1
SATA_TXN DNU24
N13 ISSD
nostuff 1/10W N12 ISSD
DNU25 ISSD
m
F1 P9
n
SATA_VSS2 DNU26 ISSD
C1 N10 ISSD
SATA_VSS1 DNU27
N7 ISSD
DNU28 ISSD
R705 0 E1 P12
SAT1_SSD_TXN R706 0 D1
SATA_RXN DNU29
P11
ISSD
ISSD
a
P1.0V_1.2V_ISSD SAT1_SSD_TXP SATA_RXP DNU30
e
P7 ISSD
DNU31 ISSD
E2 N8
B510 BLM18PG181SN1 SATA_VDDC2 DNU32 ISSD
D2 ISSD
P1.0V_ISSD P1.0V_1.2V_ISSD SATA_VDDC1
MAG40 ISSD
C909 C917 A2
GND_40
MAG39 ISSD
S fid
100nF VSS2 GND_39 ISSD
R690 0 1000nF-X5R
25V
C2
VSS29 GND_38
MAG38 ISSD
25V MAG37 ISSD
1/10W GND_37 ISSD
A4 MAG36
DNU4 GND_36
A3 MAG35
R969 XTAL_OUT GND_35
B4 MAG34
1M XTAL_IN GND_34
MAG33
1% Y502 GND_33
A1 MAG32
25MHz P1.0V_1.2V_ISSD VSS1 GND_32
MAG31
GND_31
B521 B2 MAG30
DNU3 GND_30
n
1 2 BLM18PG181SN1 MAG29
GND_29
2801-004547 E5 MAG28
PLL_DVDD GND_28
C897 C896 C910 C918 F5
PLL_AVDD GND_27
MAG27
B 0.015nF 0.015nF
1000nF-X5R 100nF
E6
PLL_DVSS GND_26
MAG26 B
50V 50V G5 MAG25
25V 25V PLL_AVSS GND_25
o
MAG24
GND_24
MAG23
GND_23
MAG22
GND_22
PWR_RESETN
MAG21
P1.0V_1.2V_ISSD GND_21
MAG20
JTAG_TMS
JTAG_CLK
GND_20
JTAG_DO
B522 MAG19
JTAG_DI
GND_10
GND_11
GND_12
GND_13
GND_14
GND_15
GND_16
C
GND_19
BG_VIN
GND_1
GND_2
GND_3
GND_4
GND_5
GND_6
GND_7
GND_8
GND_9
DNU36
DNU35
DNU39
VCC11
MAG18
VSS27
VSS26
VSS25
VSS24
VSS28
BLM18PG181SN1
DNU6
GND_18
DAS
MAG17
PD1
GND_17
C701
C911 100nF M1
N1
N2
L1
L2
K2
J2
B6
K1
A7
H5
A12
A10
A11
A8
B7
B3
A9
MAG1
MAG2
MAG3
MAG4
MAG5
MAG6
MAG7
MAG8
MAG9
MAG10
MAG11
MAG12
MAG13
MAG14
MAG15
MAG16
1000nF-X5R
25V
25V
P3.3V
C885
10000nF-X5R R939
6.3V 10K
1%
P3.3V
A R940 10K 1%
A
R941 10K 1%
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
CRT
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D D
VCC_CRT P5.0V
nostuff
D507 VCC_CRT P5.0V_DISPLAY
MMBD4148
3 1
C783
100nF SHORT519
U513
10V R1005-SHORT
SN74AHCT1G125DCKR
5
2 + 4 R774 33 1%
CRT3_HSYNC OE*
- CRT5_HSYNC
g
3
1
VCC_CRT
u n al
s i
C C784
C
U518 100nF P5.0V_DISPLAY
SN74AHCT1G125DCKR
t
10V
5
CRT3_VSYNC 2 +
-
4 R817 33 1%
CRT5_VSYNC
OE*
3
m
1
a e n CRT CONNECTOR
B4
BLM18PG181SN1
C17
100nF
S fid
P3.3V P3.3V VCC_CRT 10V J8
DSUB-15-3R-F
L500 82nH 1
CRT3_RED 6
R815 R816
G
11
1
CRT3_DDCDATA CRT5_DDCDATA
1%
12
2
1%
1%
L3 82nH 3
Q531 CRT3_BLUE
0.022nF 50V
0.022nF 50V
0.022nF 50V
n
8
150
150
150
RHU002N06 13
4
B C544 C13 C16 9 B
0.022nF 0.022nF 0.022nF 14
o
50V 50V 50V 5 16
R560
C545
R13
C21
C11
10 17
R8
P3.3V P3.3V VCC_CRT 15
C
G
1
2.2K 2.2K
CRT5_DDCDATA
R1606
S
Q530 CRT5_HSYNC
CRT5_VSYNC
0
RHU002N06
CHP3_SERDBG
PGB1010603NR
PGB1010603NR
0.033nF
0.033nF
2
0.27nF
0.27nF
50V
50V
50V
50V
nostuff For serial debug port
1
C12
C19
C18
C20
1000V
1000V
D5
D7
nostuff
nostuff
Intel SR : HSYNC/VSYNC - 33 pF
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
P3.3V
R1602
5
1%
1K
1 +
D KBC3_BKLTON D
LCD_VDD3.3V P3.3V VDC_LED 2 4 LCD3_BKLTON
LCD3_BKLTEN -
3 U505
R520 R522 7SZ08
BLM18PG181SN1
100K 100K
1% 1%
P5.0V
C3
1000nF-X5R
C5
100nF
6.3V
B523
10V
C511 C510
100nF 100nF
g
10V 10V
n
P3.3V
l
J4
SOCK-30P-2R-SMD
u
1 2
2.2K
2.2K
3 4 LCD3_BKLTON
a
LCD3_BRIT 5 6
7 8
s i
C 9 10 C
11 12 P5.0V_STB P3.3V_AUX LCD_VDD3.3V
R519
R518
13 14
t
15 16 Q504
LCD1_ACLK 17 18 LCD1_ADATA2 AO3415AL
LCD1_ACLK# 19 20 LCD1_ADATA2# R505
3
2
LCD1_ADATA1 21 22 LCD1_ADATA0 200K
D
S
m
1%
LCD1_ADATA1# LCD1_ADATA0#
n
23 24
1
G
25 26 LCD3_EDID_CLK R1605
C509 10 C512
27 28 LCD3_EDID_DATA R521 68nF 1% 100nF
29 30 200K 1%
31 16V
a
MNT1
e
32
MNT2 D 3
FILT3 Q553
EXC24CE900U 3710-003343 R1601 10K 1% G RHU002N06
1 4 1 60V
USB3_CAMERA-
S fid
D 3 S
USB3_CAMERA+ 2
Q501 C969
2 3 R506 10K G RHU002N06 10nF
LCD3_VDDEN 1% 25V
1
S 2
R504
100K
1%
o n VDC
Q508
AO3409L
VDC_LED
B
3
2
D
S
1
G
R562
C
C583 C582 C912 C906
470K 100nF 100nF 100nF
1% 25V 25V 25V
1000nF-X5R
25V
R564
300K
1%
LCD_VDD3.3V
D 3
Q509
R561 10K G RHU002N06
1% 1
S 2
LCD3_BKLTON R563 10K
1%
nostuff
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D
HDMI Graphic D
g
FOR HDMI VERIFICATION TEST
P3.3V P3.3V B514
ACM2012H-900-2P
n
Q22 1 4
CHP3_TX2P_HDMI
R823 RHU002N06
1
G
l
2.2K 60V
CHP3_TX2N_HDMI
u
2 3
D
CHP3_HDMI_CLK CHP5_HDMI_CLK B513
3
ACM2012H-900-2P
a
1 4
CHP3_TX1P_HDMI
s i
C C
2 3 CHP3_TX1N_HDMI
B511
t
ACM2012H-900-2P
1 4
CHP3_TX0P_HDMI
P3.3V P3.3V
m
CHP3_TX0N_HDMI
n
Q21 2 3
HDMI
B512
HDMI
R822 RHU002N06 ACM2012H-900-2P
G
1 4
1
a
HDMI
e
S
HDMI
HDMI
J502 2 3
CHP3_TXCN_HDMI
HDMI HDMI-19P-FEMALE
S fid
HDMI
HDMI
1
TMDS_DATA2
2
HDMI TMDS_DATA2_SHIELD
3
HDMI TMDS_DATA2#
4
HDMI TMDS_DATA1
5
HDMI TMDS_DATA1_SHIELD
6
HDMI TMDS_DATA1#
7
HDMI TMDS_DATA0 P5.0V_DISPLAY P5.0V
HDMI
8 nostuff
TMDS_DATA0_SHIELD
9 nostuff
HDMI TMDS_DATA0# P5.0V_D_MN
n
10
HDMI TMDS_CLOCK F1
R107 619 1% 11 R779 2.2K 5%
HDMI CHP3_TX2P_HDMI TMDS_CLOCK_SHIELD AP2331
HDMI CHP3_TX2N_HDMI R109 619 1%
TMDS_CLOCK#
12 R778 2.2K 5%
B HDMI CHP3_TX1P_HDMI
R108 619 1%
CEC
13 B6 BLM18PG181SN1 1
GND IN
3 B
R110 619 1% 14 B7 BLM18PG181SN1 2
HDMI CHP3_TX1N_HDMI RESERVED OUT
o
R113 619 1% 15 CHP5_HDMI_CLK_B_MN C991
HDMI CHP3_TX0P_HDMI R111 619 1%
SCL
16 CHP5_HDMI_DATA_B_MN CHP5_HDMI_CLK 100nF
HDMI CHP3_TX0N_HDMI SDA CHP5_HDMI_DATA
HDMI CHP3_TXCP_HDMI R112 619 1%
DDC_GROUND
17 10V
R127 619 1% P3.3V 20 18
CHP3_TXCN_HDMI 21
MNT1 5V_POWER
19
MNT2 HOT_PLUG_DETECT P3.3V
50V
50V
C
CHP3_TX_HDMI_PD_Q_MN
R888 1%
10K
3701-001758 C739
PGB1010603NR
PGB1010603NR
C740 0.01nF
C741 0.01nF
3 D
100nF
Q14 10V
C738
RHU002N06 G
100nF
1 10%
CHP3_HPD_HDMI#
0.5pF
10V
2
S
0.5pF
2
D531
D532
1000V
1000V
D 3
nostuff
Q539
nostuff nostuff G RHU002N06
1
1 60V
nostuff S
nostuff 2
R889
100K
1%
A A
DESIGN DATE TITLE
CHECK
Qin wenchao
DEV. STEP
9/23/2008
Eric-VE-R SAMSUNG
ELECTRONICS
Wu shijiang PR GRAPHICS_IF
APPROVAL REV PART NO.
Audio Codec
Codec Pin9 Setting
S/B with Low Voltage IO S/B without Low Voltage IO
Pin9 : 1.5V Pin9 : 3.3V
D D
P3.3V
D11
MMBD4148
75V
AUD3_SPKR_D_MN C116 C733 C734 Audio Codec should be soldered by
AUD3_SPKR
C732 10%
1000nF-X5R 6.3V 1 3 R122 15K 1% AUD3_SPKR_R_MN 10000nF-X5R
10V
100nF
10V
100nF
10V
ALC269Q-VB2-GR that is new.
AUD3_SPKR_C_MN U8
C120 ALC269Q-VC-GR J13
R775 R123 AUDIO_SPK_OUT_L-_MN
g
4.7nF STD
10K 4.7K 1 44 AUDIO_SPK_OUT_L+_MN HDR-4P-1R-SMD
25V DVDD SPK_OUT_R-
1% 1% 9 45
DVDD_IO SPK_OUT_R+ EXCML16A270u B519
AUDIO_SPK_OUT_L-_B_MN 1
nostuff 2
41 EXCML16A270u B520
SPK_OUT_L- 3
R1659 33 1% 5 40
n
HDA3_AUD_SDO R1660 33 1% 6
SDATA_OUT SPK_OUT_L+ AUDIO_SPK_OUT_L+_B_MN
5
4
HDA3_AUD_BCLK BCLK MNT1
HDA3_AUD_SDI0 R777 33 1% AUDIO_SDATA_IN_MN 8
SDATA_IN HPOUT_L_A
32
AUD5_HP_O_LEFT C787 C785 6
MNT2
l
G_AUD R1661 33 1% 10 33 1nF 1nF
HDA3_AUD_SYNC SYNC HPOUT_R_A AUD5_HP_O_RIGHT
HDA3_AUD_RST# R1662 33 1% 11
RESET#
50V 50V
3711-007615
P3.3V C131
u
35 AUDIO_CBN_MN 2200nF-X5R
CBN
C118 1000nF-X5R 6.3V 12 36 AUDIO_CBP_MN 10V
HDA3_AUD_RST# PCBEEP CBP
a
AUDIO_BEEP_MN AUDIO_CPVEE_MN
R776 2
GPIO0_DMIC_DATA CPVEE
34 C132 2200nF-X5R AUDIO_MIC1_R_B_C_MN
3 10V
s i
2
C 100K GPIO1_DMIC_CLK C
1% C146 R131
BAT54A
t
D513
MIC1_L_B
48 AUD5_MIC1_VREFO_L
SPDIFO
30
C145
1
AUDIO_JDREF_MN
G_AUD
MIC1_VREFO_R
R820 20K 1% 19
JDREF MIC1_VREFO_L
31 R130 4.7K 1%
m n
R133 39.2K 1% 13 17 AUD5_MIC2_RIGHT_C_MN C1023 1000nF-X5R 6.3V
KBC3_SPKMUTE# AUD5_SENS_HP# 18
SENSE_A MIC2_R_F
16 AUD5_MIC2_LEFT_C_MN C1024 1000nF-X5R 6.3V
AUD5_MIC2_INT
SENSE_B MIC2_L_F INTMIC
47 29 INTMIC
a
P5.0V_AUD AUD5_COMBOJACK_MIC_SENS EAPD_MIC_GPIO MIC2_VREFO AUD5_MIC2_VREF
e
BLM18PG181SN1P5.0V_AUD_MN 39 24
PVDD1 LINE1_R_C
46 23
PVDD2 LINE1_L_C G_AUD
B12 42 15
S fid
C791 PVSS1 LINE2_R_E
43 14
100nF C115 C128 C793 C114 PVSS2 LINE2_L_E
10V 10000nF-X5R 10000nF-X5R 100nF
C127 100nF 7 20
10V 10V
10V 10V DVSS MONO_OUT
10000nF-X5R P4.75V_AUD 25 27 AUDIO_VREF_MN
10V AVDD1 VREF
38 AUDIO_CPVREF_MN
AVDD2
28
C972 C135 LDO_CAP
C797 C795 26
10000nF-X5R10000nF-X5R
100nF 100nF 37
AVSS1
49 C133 C796 C134 C136
10V 10V AVSS2 THERMAL 10000nF-X5R 1000nF-X5R
n
10V 10V 100nF 100nF
10V
10V
6.3V 10V
1205-004291
5.5V
B B
o
G_AUD
G_AUD
G_AUD
C129
P5.0V_AUD
10000nF-X5R
10V
nostuff nostuff
C792
100nF
10V
2nd Vendor : 1203-003344
1
2
3
(MIC5252-4.75BM5)
B13
BLM18PG181SN1
IN
GND
U528
G916-475T1UF
OUT
EN BYPASS
1203-005579
6V
5
4
P4.75V_AUD
C130
C794
100nF
10V
nostuff
C SHORT516
SHORT505
INSTPAR
INSTPAR
G_AUD
G_AUD
SHORT511
SHORT509
RGND_SHORT
INSTPAR
INSTPAR
SHORT506
SHORT507
G_AUD
INSTPAR
INSTPAR
RGND_SHORT
nostuff 1000nF-X5R
A nostuff
6.3V A
G_AUD G_AUD
G_AUD SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D D
HP & MIC
n g l
Combo Jack
u a
R950 22K 1% J512
AUD5_COMBOJACK_MIC_SENS
R947 JACK-PHONE-5P
56.2 1% B506 BLM18PG181SN1 4
s i
AUD5_MIC1_INT
B507 BLM18PG181SN1 2
AUD5_HP_O_RIGHT
t
5
AUD5_SENS_HP
B508 BLM18PG181SN1 1
AUD5_HP_O_LEFT 3
R948
PGB1010603NR
PGB1010603NR
56.2
50V
50V
C 1% 3722-003474 C
m n
0.1nF
2
0.1nF
0.1nF
0.1nF
50V
50V
D516
D517
1000V
1000V
R680 R936 R679 G_AUD
1
C682
C902
C684
C685
e
1K 1K 22K
C905
10000nF-X5R
1% 1% 6.3V
1%
nostuff nostuff
P5.0V_AUD
AUD5_SENS_HP#
S fid
Q545
RHU002N06
60V
3
2
D
S
G
1
R959
47K
1/16W
R951
100K
AUD5_SENS_HP
G_AUD G_AUD
n
C882
1000nF-X5R
6.3V
C922
1nF
50V
o
G_AUD
B G_AUD C660 10nF 25V B
C151 10nF 25V
C
C198 10nF 25V
G_AUD
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D Realtek RTL8105E D
P3.3V_AUX P3.3V_AUX
g
10K
10K nostuff
1%
1%
n
U1
R565
R567
RTL8105E-VC-GR 3722-002841
l
25
PLT3_RST# 28
PERST#
10
MNT2
PEX3_WAKE# WAKE# MNT1
u
19 LT500 9
CLK1_PCIELOM 20
REFCLKP NS0013LF
CLK1_PCIELOM# REFCLKN TRD1+
C513
a
100nF 10V 22 4 LAN3_MDI1P 1 16 1
PEX1_LAN_RXP3 C514 100nF 10V 23
PCIE_TXP RXP
5 LAN3_MDI1N 3
RD+ RX+
14 2
TRD1-
PEX1_LAN_RXN3 17
PCIE_TXN RXN
1 LAN3_MDI0P 2
RDCT RXCT
15 3
TRD2+
s i
C PEX1_LAN_TXP3 18
PCIE_RXP TXP
2 LAN3_MDI0N 4
RD- RX-
13 4
TRD3+ C
PEX1_LAN_TXN3 PCIE_RXN TXN
5
NC_1 NC_4
12 5
TRD3-
NC_2 NC_3 TRD2-
t
16 7 10 6
LOM3_CLKREQ# CLKREQ#
6
TD+ TX+
11 7
TRD4+
TDCT TXCT TRD4-
40 8 9 8
LED0 P3.3V TD- TX-
37 JACK-LAN-8P
LED1_EESK
m
14 31 J504
n
NC_8 LED3_EEDO
15
NC_9
30 R628 10K 1% R569
P3.3V_AUX EECS
32 R627 10K 1% P3.3V_AUX 1K
EEDI
1%
a e
C508
75
75
75
75
42
AVDD33_1
47 R566
AVDD33_2
48 15K
P3.3V_AUX AVDD33_3
C585 C584 12 33 1%
100nF
S fid
NC_7 ENSWREG
0 R1716
R1715
R1714
R1713
100nF 100nF
10V 10V 27 26
DVDD33_1 ISOLATEB
C587 39
DVDD33_2
10V
100nF 43
10V
XTAL1
P1.05V_LAN 44
GTAC1206M201T
R1635
XTAL2
VA1
13
DVDD10_1 P3.3V_AUX
29 nostuff
P1.05V_LAN DVDD10_2
41 C4
NC_10
C586 C588 C548 R14
n
38 10K 1nF
GPO
100nF 100nF 100nF 3 1% 3KV
AVDD10_1
10V 10V 10V 45 46 R626 2.49K
B C550 AVDD10_2 RSET
B
1000nF-X5R
C549 1%
100nF 6
6.3V NC_1
o
10V 7
P1.05V_LAN NC_2
21 8
EVDD10_1 NC_3
L501 9
NC_4 Y1 NON_SURGE SURGE
2.2uH 10
NC_5 25MHz
36 11
V1.0_OUT NC_6 R1713 75ohm 0ohm
C
C591 C589 34
ADVV33_REG1
1 2 R1714
100nF 4700nF-X5R 35 R1715 2007-001167 2007-000070
ADVV33_REG2
10V 10V 24 C23 C22
P3.3V_AUX GND
49 0.015nF 0.015nF
R1716
Place nearby THERMAL 50V 50V
Pin36 0ohm 75ohm
1205-004066 R1635
3.3V 2007-000070 2007-001167
Place crystal within 0.75inches from LAN chip. VA1 nostuff 4715-001142
C551 C590
100nF 4700nF-X5R
10V 10V
Place nearby
Pin34/Pin35
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D D
n g l
SATA HDD CONN
s u ti a JHDD1
HDR-12P-1R-SMD
STD
1
C
m
SAT0_HDD_TXP
n
2
SAT0_HDD_TXN 3
4
P5.0V SAT0_HDD_RXN 5
a
SAT0_HDD_RXP 6
e
7
8
C670 C700 C883 9
100nF 10000nF-X5R 10000nF-X5R
C671 C669 10
100nF 100nF
S fid
10V 6.3V 6.3V
10V 10V
11
12
nostuff
3711-007688
o n For EMI
B
C P3.3V
C673
1nF
50V
C672
1nF
50V
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
WLAN, 5.2mm P3.3V_WLAN P3.3V_WLAN
Mini PCI Express Card
50.95 mm
48.05 mm
C507 C516
10000nF-X5R
C506 C531 10000nF-X5R
C515 R510 0 Top
P3.3V_WLAN 100nF 100nF 100nF
6.3V 6.3V nostuff
D Pin 1 D
nostuff
3
2
R507 nostuff
R512
D
S
10K nostuff
200K
nostuff 1% 1% C505
1
Q506
R526
G
Odd Pins : Top side
R530
51.1K
J506 nostuff 220nF
1%
AO3415AL Even Pins : Bottom Side
1%
MINICARD-52P nostuff 10V -20V
SMT500 1 2 nostuff C504
WAKE* P3.3V_1 nostuff
R509
3 4 100nF 100K
0-1005 RSVD_1 GND_1 nostuff nostuff 3
5 6 D 10V 1%
CHP3_RFOFF_WBT# RSVD_2 P1.5V_1
10K
7 8 Q503
MIN3_CLKREQ# 9
CLKREQ* SIM_VCC_C1
10 R534 G RHU002N06
11
GND_2 SIM_DATAIO_C7
12 CHP3_WLAN_PWRON 60V
CLK1_MINIPCIE# REFCLK- SIM_CLK_C3 10K 1% 1
13 14 R533 S 2
CLK1_MINIPCIE 15
REFCLK+ SIM_RESET_C2
16
GND_3 SIM_VPP_C6 100K
1%
g
17 18
SIM_RSVD_C8 GND_4
19 20
21
SIM_RSVD_C4 W_DISABLE*
22
CHP3_RFOFF_WLAN#
23
GND_5 PERST*
24 R527 220 PLT3_WLAN_RST# P3.3V
PEX1_MINIRXN1 25
PERN0RXP0(mSATA) P3.3V_AUX
26
n
PEX1_MINIRXP1 27
PERP0 RXN0(mSATA) GND_6
28
GND_7 P1.5V_2 nostuff U504
29 30
GND_8 SMB_CLK 5 7SZ08
l
31 32 1 +
PEX1_MINITXN1 33
PETN0 TXN0(mSATA) SMB_DATA
34
PLT3_RST# 4
PEX1_MINITXP1 PETP0 TXP0(mSATA) GND_9 PLT3_WLAN_RST#
u
35 36 2
USB3_MINIPCIE1- CHP3_WLAN_RST#
1%
1%
GND_10 USB_D-
100
100
-
37 38
RSVD_11 USB_D+ USB3_MINIPCIE1+ 3
a
39 40
RSVD_12 GND_11
nostuff 41 42
RSVD_13 LED_WWAN*
nostuff 43 44
R508
R525
s i
C 45
RSVD_14 LED_WLAN*
46
C
47
RSVD_15 LED_WPAN*
48 R545 0 PEM for Half length card
RSVD_16 P1.5V_3
t
49 50 M503
RSVD_17 GND_12 HEAD
51 52
CHP3_INTELBT_OFF# RSVD_18 P3.3V_2 DIA
53 LENGTH
MNT1 BA61-01102A
m
54
n
MNT2
3709-001470
a e
Near to Mini card Connector
P3.3V
SIM CARD CONN.
S fid
C770
10000nF-X5R
C769 C772
mSATA SSD, 4.0mm P3.3V P3.3V
6.3V
100nF 100nF
J6
P3.3V SSD_HSDPA SSD_HSDPA SSD_HSDPA EDGE-SIM-8P-MNT
C1 C5
SIM3_C1VCC C2
C1 C5
C6
J513 SIM3_C2RST C2 C6 SIM3_C6VPP
n
C3 C7
EDGE-MINIPCI-E-52P SIM3_C3CLK C3 C7 SIM3_C7DATA
R930
1 2 10K HSDPA C4 1
WAKE* P3.3V_1 CD_U MNT1
B 3 4 1% C8 2 B
1
5 6 nostuff
RSVD_2 P1.5V_1
o
C870 0.01nF 0.5pF
1
9 10 nostuff 3709-001478
11
GND_2 SIM_DATAIO_C7
12
SIM3_C7DATA C872
2
13
REFCLK- SIM_CLK_C3
14
SIM3_C3CLK HSDPA 0.01nF
0.5pF
REFCLK+ SIM_RESET_C2 SIM3_C2RST
6.3V
50V
50V
15 16 50V
PGB1010603NR
D520
PGB1010603NR
D521
2
2
GND_3 SIM_VPP_C6 SIM3_C6VPP HSDPA
C PGB1010603NR
D518
PGB1010603NR
D519
17 18
SIM_RSVD_C8 GND_4
19 20 R931 0 HSDPA
21
SIM_RSVD_C4 W_DISABLE*
22 R932 0 HSDPA CHP3_RFOFF_HSDPA# Mini PCI Express Card
23
GND_5 PERST*
24
PLT3_RST#
SAT1_SSD_RXP PERN0RXP0(mSATA) P3.3V_AUX 30.00 mm
25 26 R723 0
SAT1_SSD_RXN 27
PERP0 RXN0(mSATA) GND_6
28 SSD KBC3_PWRON HSDPA HSDPA
GND_7 P1.5V_2
29 30 HSDPA
GND_8 SMB_CLK
31 32
50.95 mm
48.05 mm
SAT1_SSD_TXN 33
PETN0 TXN0(mSATA) SMB_DATA
34 Top
SAT1_SSD_TXP 35
PETP0 TXP0(mSATA) GND_9
36
P3.3V 37
GND_10 USB_D-
38
USB3_MINIPCIE2-
RSVD_11 USB_D+ USB3_MINIPCIE2+ Pin 1
39 40
RSVD_12 GND_11
41 42
RSVD_13 LED_WWAN*
43 44 Odd Pins : Top side
RSVD_14 LED_WLAN*
45 46 Even Pins : Bottom Side
RSVD_15 LED_WPAN*
47 48
RSVD_16 P1.5V_3
49 50
RSVD_17 GND_12
51 52
RSVD_18 P3.3V_2 M502 M5
53 HEAD HEAD
A MNT1
54 DIA DIA A
MNT2 LENGTH LENGTH
BA61-01090A BA61-01090A
SSD_HSDPA
3709-001498
FULL_HSDPA
SAMSUNG
HALF_HSDPA
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS P5.0V_ALW
EXCEPT AS AUTHORIZED BY SAMSUNG.
100nF
C852 10V
g
J514
R1669 0 JACK-USB-4P-RVS
1
PWR
2
n
DATA-
3
DATA+
4
GND
l
USB3_P0- 2 3 5
MNT1
u
nostuff 6
MNT2
7
USB3_P0+ MNT3
a
1 4 8
MNT4
EXC24CE900U
FILT1
s i
C 3722-002002 C
R1670 0
t
R1671 0
J10
JACK-USB-4P-RVS
m n
1
PWR
2
USB3_P2- 2 3 3
DATA-
DATA+
nostuff 4
a
GND
e
USB3_P2+ 1 4 5
MNT1
EXC24CE900U 6
MNT2
FILT2 7
MNT3
8
S fid
MNT4
R1672 0
3722-002002
o n B
C
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D D
TPM 1.2(Option.)
n g l
u
P3.3V P3.3V_AUX
a
R1621
s i
C R1624 R1628 C
10K 4.7K
1% 1% nostuff
t
U530
SLB9635TT1.2-SP00074 P3.3V
LPC3_LAD(3:0)
0
0 26 5
1 23
LAD0 3VSB
10
CLOSE TO THE CHIP
LAD1 3V_1
m
2 20 19
n
LAD2 3V_2
3 17
LAD3 3V_3
24 C980 C981 C979
21 100nF 100nF1000nF-X5R
CLK3_TPMLPC 22
LCLK
12 10V 10V 25V
LPC3_LFRAME# 16
LFRAME* VBAT nostuff
a
PLT3_RST# LRESET*
e
28 3 nostuff
LPCPD* VNC
27 1 R1619 0 TPM_SMDATA_R_MN
CHP3_SERIRQ SERIRQ GPIO1_SMDATA SMB3_DATA
GPIO2_SMCLK
2 R1620 0 TPM_SMCLK_R_MN
SMB3_CLK
9
BADDR_TESTBI_GPIO4
15
PCI3_CLKRUN#
S fid
P3.3V_BADDR_TESTBI_R_MN CLKRUN*_GPIO5
8
SMT509
TESTBI
6
0-1005
GPIO6
4 7
GND1 PP_GPIO3
11
GND2 TPM_XTAL_IN_R_MN
18 13
25
GND3 XTAL_IN
14
CHP3_SUSCLK_TPM
GND4 XTAL_OUT
R1625 10M
0904-002579
TPM_XTAL_OUT_R_MN C978
Y504
n
0.1nF
nostuff 0.032768MHz 50V
nostuff 1 4
B nostuff B
nostuff 2 3
o
nostuff
C982 C983
0.01nF 0.01nF
C
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D MMC(AU6438) D
g
P3.3V_MCD
n
P3.3V
l
C777 C776 40mil pattern
2200nF-X5R 100nF
nostuff
u
10V 10V
P3.3V C780
U512 J515
a
100nF
10V 2200nF-X5R EDGE-SD-11P
U516 10V 4
s i
C nostuff R813 VDD C
22.6 AU6438
1% 1 4 2
CLK3_MMC48 EXT48IN VD33P P3.3V P3.3V_MCD MCD3_SDCMD CMD
t
2 7 5
PLT3_RST# R812 680 3
CHIPRESET VS33P
8 MCD3_SDCLK CLK
REXT VDD
C779 USB3_MMC+ 5
DP CF_V33
9
MCD3_SDDAT0 R805 49.9 1% 7
DATA0
nostuff 100nF 6 10 R803 49.9 1% 8
USB3_MMC- DM V33 MCD3_SDDAT1 DATA1
R811
m
10V 14 28 49.9 1% 9
MCD3_SDDAT2
n
R808 XDCIS GPON7 C730 C731 DATA2
22.6 1% 21 24 R810 49.9 1% 1
MCD3_SDCLK 27
CONTROL0 DATA0
25 MCD3_SDDAT0 4700nF-X5R 4700nF-X5R MCD3_SDDAT3 CD_DATA3
10V 10V
MCD3_SDWP 19
CONTROL1 DATA1
16
MCD3_SDDAT1 10
MCD3_SDCMD 26
CONTROL2 DATA2
17 MCD3_SDDAT2 MCD3_SDCD# 11
CD
a
MCD3_SDCD# CONTROL3 DATA3 MCD3_SDDAT3 MCD3_SDWP WP
e
11 18
CONTROL4 DATA4
12 20 3
CONTROL5 DATA5 VSS1
13 22 6
C778 15
CONTROL6 DATA6
23
VSS2
0.022nF CONTROL7 DATA7
29 12
S fid
50V GND MNT1
13
MNT2
14
MNT3
0904-002705 15
MNT4
3709-001713
Place on top-side
C
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
10K
D U503 P3.3V_MICOM D
KB3930QF_B1 R607
3 22 U502
R543
CHP3_SERIRQ SERIRQ VCC_2 10K
P3.3V_MICOM 4 33 W25Q16BVSSIG
LPC3_LFRAME# LFRAME# VCC_3 C533 C573 C535 C575 C576 1%
1%
12 9 KBC3_SPI_CS# 1 8
CLK3_PCLKMICOM 38
PCICLK VCC_1
111
100nF 100nF 100nF 100nF 10000nF-X5R
2
CS# VCC
7
LPC3_LAD(3:0) PCI3_CLKRUN# GPIO1D_CLKRUN# VCC_5 10V 10V 10V 10V 6.3V KBC3_SPI_MISO IO_1 IO_4 P3.3V_MICOM_HOLD#_R_MN
0 10 96 3 6
1 8
LAD0 VCC_4
125 R608 0 nostuff 4
IO_2 CLK
5
KBC3_SPI_CLK
2 7
LAD1 VCC_6
67
GND IO_3 KBC3_SPI_MOSI
R620 LAD2 AVCC
47K 3 5 1107-001916 R1603
LAD3 BLM18PG181SN1
B500 33
37 63 1%
2
ECRST# GPI38_AD0
64 CHP3_SLPS3#
KBC3_RCIN# GPIO01_KBRST# GPI39_AD1 CHP3_SLPS4#
20 65 C970
g
C577 KBC3_RUNSCI# 1
GPIO0E_SCI# GPI3A_AD2
66
CHP3_SLPS5# 0.022nF
100nF KBC3_A20G 13
GPIO00_GA20 GPI3B_AD3
68
CHP3_SUSSTAT# P3.3V 50V
PLT3_RST#
10V GPIO05_PCIRST# GPO3C_DA0
70
KBC3_SPKMUTE#
21
GPO3D_DA1
71 KBC3_CHGEN
KBC3_LED_POWER# 23
GPIO0F_PWM1 GPO3E_DA2
72
KBC3_CHG4.3V
n
25
GPIO10_PWM2 GPO3F_DA3 KBC3_CHG4.2V
GPIO11_PWM3 R546
26 10K
GPIO12_FANPWM1
l
C574 27
GPIO13_FANPWM2 GPIO40_CIR_RX
73 LID3_SWITCH# 1%
0.1nF 28 74
GPIO14_FANFB1 GPIO41_CIR_TX
u
50V 29 75 R547 0
GPIO15_FANFB2 GPI42_AD4
76 ALL_SYS_PWRGD
GPI43_AD5 ADT3_ICM
a
32 77
34
GPIO18 GPIO44_SCL1
78 KBC3_SMCLK#
KBC3_USBCHG 36
GPIO19_PWM4 GPIO45_SDA1
79
KBC3_SMDATA#
s i
C GPIO1A_NUMLED# GPIO46_SCL2
80
KBC3_THERM_SMCLK C
GPIO47_SDA2 KBC3_THERM_SMDATA
KBC5_KSO(0:15) P5.0V
t
0 39
GPIO20_KSO0_TP_TEST
1 40
GPIO21_KSO1_TP_PLL
2 41 97
GPIO22_KSO2_TP_ANA GPXIOA00_SDICS#
3 42 98
GPIO23_KSO3_TP_ISP GPXIOA01_SDICLK
R536
m
4 43 99 10K 1%
KBC5_TCLK
n
GPIO24_KSO4 GPXIOA02_SDIMOSI
5 44 100 R540 10K 1%
6 45
GPIO25_KSO5 GPXIOA03
101 KBC5_TDATA
7 46
GPIO26_KSO6 GPXIOA04
102
KBC3_SUSPWR
8 47
GPIO27_KSO7 GPXIOA05
103 KBC3_DEEPSUS
a
GPIO28_KSO8 GPXIOA06
e
9 48 104
GPIO29_KSO9 GPXIOA07 KBC3_CHG3CELL
10 49 105 R542 10
11 50
GPIO2A_KSO10 GPXIOA08
106
KBC3_PWRON_C
12 51
GPIO2B_KSO11 GPXIOA09
107
KBC3_VRON_D P3.3V_MICOM
13 52
GPIO2C_KSO12 GPXIOA10
108 KBC3_DRAMRST_GATE
KBC3_PRECHG
S fid
GPIO2D_KSO13 GPXIOA11 P3.3V_MICOM
14 53
GPIO2E_KSO14
15 54 109 R539
81
GPIO2F_KSO15 GPXIOD0_SDIMISO
110
KBC3_PWRSW#
KBC3_EXTSMI# GPIO48_KSO16 GPXIOD1 ADT3_SEL# 300K
82 112 1% R515 4.7K 1%
KBC3_WAKESCI# GPIO49_KSO17 GPXIOD2 PEX3_WAKE# KBC3_SMDATA#
KBC5_KSI(0:7) GPXIOD3
114
KBC3_BATDET# KBC3_SMCLK# R516 4.7K 1%
0 55 115
GPIO30_KSI0 GPXIOD4
1 56 116 C534 R619 10K 1%
GPIO31_KSI1 GPXIOD5 PLT3_RST# KBC3_TX
2 57 117 10nF R618 10K 1%
3 58
GPIO32_KSI2 GPXIOD6
118 C532 25V KBC3_RX
GPIO33_KSI3 GPXIOD7
R514
n
4 59 0.1nF 10K 1%
KBC5_KSI4_MN GPIO34_KSI4 KBC3_LED_ACIN#
5 60 50V R513 10K 1%
KBC5_KSI5_MN
6 61
GPIO35_KSI5 KBC3_LED_CHARGE#
KBC5_KSI6_MN GPIO36_KSI6
B KBC5_KSI7_MN
7 62
GPIO37_KSI7 SPICS#
128 KBC3_SPI_CS# B
120
MOSI KBC3_SPI_MOSI
o
119
MISO
126 KBC3_SPI_MISO
SPICLK
83
GPIO4A_PSCLK1_P80_CLK
84
GPIO4B_PSDAT1_P80_DAT
85 90
KBC3_LED_ACIN# GPIO4C_PSCLK2 GPIO52_E51CS#
86 SMT504 0-1005 R1647
C
KBC3_LED_CHARGE# 87
GPIO4D_PSDAT2
30
KBC5_TCLK GPIO4E_PSCLK3 GPIO16_E51TXD KBC3_TX 33
88 R883 1%
31 4.7K 1%
KBC5_TDATA GPIO4F_PSDAT3 GPIO17_E51RXD KBC3_RX
89
KBC3_SPI_CLK
GPIO50
6 C971
KBC3_USBPWRON# GPIO04
0.033nF P3.3V_AUX
75V MMBD4148
D503 3 1 14 122 50V
KBC3_BKLTON 15
GPIO07_I_CLK_8051 XCLKI
123 R538 10K 1%
KBC3_VRON GPIO08_I_CLK_PERI XCLKO CHP3_SUSCLK PEX3_WAKE#
SMT503
0-1005 16
KBC3_PWRON 17
GPIO0A_RLC_RX2
GPIO0B_ESB_CLK
18 124
GPIO0C_ESB_DAT V18R
19 BLM18PG181SN1
KBC3_PWRGD GPIO0D_RLC_TX2
69 B504 P5.0V
91
AGND
11 C572 C571
KBC5_LED_CTRL 92
GPIO53_E51TMR1_CAPSLED# GND_1
24
100nF 4700nF-X5R
KBC3_CAPSLED# GPIO54_E51TMR0_WDT_LED# GND_2 10V 6.3V
93 35 1% 10K R541
KBC3_RSMRST# GPIO55_E51INT0_SCROLED# GND_3 KBC5_LED_CTRL
KBC3_LOWPWR# 95
GPIO56_E51INT1 GND_4
94
KBC3_CAPSLED# 1% 10K R544
121 113
KBC3_PWRBTN# GPIO57_XCLK32K GND_5
A 127 TP2001 A
GPIO59_TEST_CLK
1
MODE0
BA09-00029A 2
KBC3_TX TX
KBC3_RX
3
4
RX SAMSUNG
GND
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG. Micom Glue Logic
D D
KEYBOARD TOUCHPAD
P5.0V
J500 C702
KBC5_KSO(0:15) FPC-KBD-25P 100nF
10V
g
1 J11
2 CONN-6P-FPC
3
4 1
5 KBC5_TCLK 2
n
6 KBC5_TDATA 3
7 T_R_BUTTON# 4
8 5
l
9 T_L_BUTTON# 7
6
10 MNT1
u
8
11 MNT2
12
C722 C726 C703 C725
a
nostuff 0.1nF 0.1nF 0.1nF 0.1nF
13 nostuff 50V 50V 50V 50V 3708-002892
14 nostuff
s i
C KBC5_KSI(0:7) 15 nostuff C
16
17
t
18
19
20
21
m n
22
23
24
25
26
a
MNT1
e
27
MNT2
3708-002166
VA4
1
2
SW501
SW-TACT-4P
3
4
3404-001311
n
AVR-M1005C080MTADB
nostuff
B R126 B
U514 20K
o
APX9132AITRG 1%
1
C126 SUPPLY
2
P3.3V_MICOM 1000nF-X5R
3
OUTPUT LID3_SWITCH#
nostuff
6.3V GND
1009-001048
C
D515
BAV99LT1
SW500
1
SW-TACT-4P
2 1 1 3
3
T_L_BUTTON#
2
2 4
VA3 3404-001311
3
AVR-M1005C080MTADB
nostuff
4
KBC3_PWRSW#
8 7 6 5
MNT1
MNT2
MNT3
MNT4
SW2
SSS-12LG-V-T/R
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
P3.3V P3.3V_MICOM
KBC3_CAPSLED#
LED500
LTST-C193TBKT-AC
1
n g
R851 475
l
1%
KBC3_LED_ACIN#
KBC3_LED_CHARGE#
LED503
LTST-C195KGJRKT
3
4
G
R
1
2
1% 200
1% 1K
R855
R854
s u ti a P3.3V_AUX
C
m n
2 1 475 R856
KBC3_LED_POWER#
LED504
a
LTST-C193TBKT-AC
S fid e
B
o n B
C
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D D
n g l
P3.3V
C924
10000nF-X5R
C728
u
100nF
6.3V
10V
a
P3.3V
s i
C C
16
15
14
t
GND_4
RESERVED_2
VDD
U524
LIS331DL
m
1 13
n
VDD_IO GND_3
2 12
NC_1 GND_2
3 11
4
NC_2 INT1
10
FFS3_INT
SMB3_CLK_S
SDA_SDI_SDO
SCL_SPC RESERVED_1
5 9
a
GND_1 INT2
e SDO
CS
S fid
P3.3V
6
7
8
1209-001876
3.6V
R802 10K 1%
FFS
R801 10K 1% FFS
SMB3_DATA_S FFS
FFS
FFS
o n B
C
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL Near CTRL IC (ISL95837) CPU VRM ( Ceder trail M [IMVP-7] )
PROPRIETARY INFORMATION THAT IS P1.05V
SAMSUNG ELECTRONICS CO’S PROPERTY. P5.0V
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS R633 1
EXCEPT AS AUTHORIZED BY SAMSUNG. VDC
R578 C560 R588 R589
499 54.9 110
1% 1000nF-X5R 1% 1% U507
25V ISL95837HRZ-T C599
3 19 1000nF-X5R VDC C993
VRM1_SVID_DATA G_CPU SDA VDD 1000nF-X5R SHORT2
4 25V INSTPAR
VRM1_SVID_ALERT# 5
ALERT# CPUVR_VDD_MN nostuff 25V
D nostuff VRM1_SVID_CLK SCLK D
8 20 G_CPU
TH500 VRM1_PROCHOT# VR_HOT# VIN C43
NTCG104QH474G VCCP
26 C72 6.8uF C992 C1031 C1032
C602 C614 C596 2 3 4 9 1nF 25V 1000nF-X5R1000nF-X5R1000nF-X5R
CPUVR_NTC_RR Near CPUVRM highside FET 100nF D1 D2 D3 D4 G_CPU
1 2 CPUVR_NTC_MN 9 1000nF-X5R 100nF 50V 25V 25V 25V
NTC 25V 25V
25V
Q512
R585 AON6912ALS CPU_CORE
10K nostuff R637 10K 1%
UGATE
22 PNS_CPUVR_TG1_MN G1
30V L5
1% G_CPU 1
1.5uH
TH1 S1_D2
PCMC063T-1R5MN nostuff nostuff nostuff
NTCG104QH474G 23 PNS_CPUVR_PHASE1_MN 10
CPUVR_NTCG_RR 1 2 Near IGFX highside FET PHASE
35
10
10
CPUVR_NTCG_MN
NTCG
6.3V
21 PNS_CPUVR_BST1_MN
20%
C44
22000nF-X5R 6.3V
22000nF-X5R 6.3V
20%
20%
100nF
BOOT
50V
P3.3V P3.3V
1nF
G_CPU R636 1 220nF EC4
10V
TH2
R695
R694
G2
R643
g
25V 330uF
22000nF-X5R
10K nostuff 8 NTCG163JF103HT
1% R638 10K 1% 24 ANS_CPUVR_BG1_MN S1 S2 S3 2V
LGATE 5 6 7 1 2 AL
C102
C616
C101
R580 R593
C95
C96
C86
2402-001306
1.91K 1.91K 1nF C615 0.006ohm
1% 1% 50V
n
1nF
7 50V to reduce EE noise
G_CPU VRM3_CPU_PWRGD CPUVR_PGOODG_MN2
PGOOD
nostuff PGOODG nostuff
l
R586 10K 1% 6
KBC3_VRON VR_ON
VRM3_P1.05V_PWRGD R63
u
CPUVR_VRON_MN
RDROOP R58410K 1% 2.49K
1%
nostuff
a
nostuff CPUVR_FB_MN
R629 R961 nostuff R574 12
FB
RNTCS
CPU_CORE
s i
C 121 750 249K C
1% R630 1% 1% C600
nostuff 80.6K
R634
750 0.1nF
C554 C601 R579
t
C593 1% 1% C555 50V R62
R743 nostuff 1nF 8.2K
100 2.2nF 2.2nF 0.22nF 3.24K
50V CPUVR_COMP_MN
1% R64
1% 50V 50V 50V 11 29
COMP NC_7 6.19K
CPU1_VCCSENSE CPUVR_VW_MN 10
VW 1%
RSUM
m
16
CPU1_VSSSENSE
n
RTN
G_CPU R577 150K 150K 1%
NC_6
28
R744 C592 C595 1% RP
nostuff R595 30
nostuff 100 0.33nF 10nF NC_8
1% 50V 25V
a
G_CPU CPUVR_VWG_MN G_CPU
e
1
VWG
CPUVR_COMPG_MN 40 27
COMPG NC_5
C563 R594 39
G_CPU G_CPU FBG
1nF 8.2K R600
GFX_CORE 50V 0.1nF R604
S fid
50V C566 R605 R606 100
0.22nF 475 1K 1%
nostuff
R698 nostuff C567 50V 1% 1%
nostuff C564 R601 nostuff C568
G_CPU
1K 4.7nF 100K
25V 475 1% 1% 1nF
GFX1_VCCSENSE 50V
38
GFX1_VSSSENSE RTNG
RDROOPG
nostuff R697
nostuff C607 C606
n
1K
0.33nF 10nF
50V 25V VDC
B B
o
G_CPU G_CPU
C
GFX_CORE
Q7
SIZ300DT
G1 PNS_IGFXVR_TG_MN 33
L6 1 UGATEG
30V
1.0uH S1_D2
PCMB042T-1R0MHG
10 PNS_IGFXVR_PHASE2_MN 32 C597 C598
PHASEG
PNS_IGFXVR_BST_RC_MN
R640 47nF 2.2nF
EC2 C604 220nF 1 34 R635 R946 50V 50V
R28 R29 BOOTG 2.4K 221
330uF 10 10 G2 10V PNS_IGFXVR_BST_MN
1% RI
Cn
2.5V 1% 1% 8 CPUVR_ISUMP_MN 1%
S3 S2 S1 ANS_IGFXVR_BG_MN 31 18
7 6 5 LGATEG ISUMP
PNS_IGFXVR_PHASE_RC_MN nostuff
R65
3.24K
C45 C46 C594
1% 1nF 1nF 100nF
50V 50V 17 CPUVR_ISUMN_MN 25V
ISUMN
C608
100nF
NC_1
13 SAMSUNG
25V ELECTRONICS
41
GND
G_CPU
1203-006763
5V
G_CPU
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG. Chipset Power ( P1.8V & P1.05V )
D VDC D
FOR EMI
P5.0V_AUX
C33 C31 C32
C30 1000nF 1000nF 1000nF
1nF
50V 50V 50V
U506 50V
TPS51117RGYR
PNS_P1.05V_TG_MN
10 13
V5DRV DRVH
2 P1.05V_TON_MN
TON 5 6
C14 R624 C578 D1
R7 4700nF-X5R
g
2.2 100nF D2
301 10V 25V R623 P1.05V (4A)
PNS_P1.05V_BST_MN Q546-2
1% 14 249K G
AP4232BGM-HF
VBST
1% 4 S
3 7.6V L4
P3.3V 10ohm@RT8209 PNS_P1.05V_BST_RC_MN
P1.05V_VCC_MN 4 3.3uH
V5FILT
12 PNS_P1.05V_PHASE_MN
n
C6 LL
1000nF-X5R Adapter : 221KHz R1642 R1641MS-RH7040S-L72
R548 nostuff 7 8 10 10 2703-000339 EC1
6.3V Battery : 257KHz
l
D1
R925 47K D2 SHORT5 SHORT6 220uF
10K 1/16W Q546-1 INSTPAR INSTPAR C70 2.5V
u
1% 9 ANS_P1.05V_BG_MN G 100nF AD
G_P1.05V DRVL AP4232BGM-HF 2409-001159
RdsOn : 10.4mohmMAX 2 S
1 7.6V C986 10V
0.035ohm, B2
a
C15 1nF
VRM3_P1.05V_PWRGD nostuff 1nF 50V
C867 6
s
50V
i
C R549 nostuff PGOOD C
47nF 100K 8
PGND
50V 1%
t
nostuff P1.05V_EN_RRRD_MN D6
MMBD4148 P1.05V_EN_MN
R10 20K 3 1 G_P1.05V 1 3 P1.05V_VOUT_MN
KBC3_PWRON EN_PSV VOUT SHORT1
m
1% 75V P1.05V_FB_RRC_MN
INSTPAR
n
P1.05V_OCSET_MN
11 nostuff
TRIP
R625 43.2K
R9 15K 1% 1% C537 C536
P1.5V_PWRGD C579 R556 R554
R622 7 4.7K 0.1nF 80.6K 100nF
a
10nF GND
e
16V 11.8K 1% 50V 1% 10V
1% 15 5 3 D R557 G_P1.05V
THERMAL VFB P1.05V_FB_MN
nostuff
Q507 80.6K
P1.05V_FB_RQ_MN
G_P1.05V RHU002N06 1%
G_P1.05V
1203-005536 VREF:0.75V R552 R553 R555 G
KBC3_LOWPWR#
5.5V 60V 1
12.1K 680K 200K P1.05V_FB_RQ_RCQ_MN
S fid
1% 1% 1% 2 S C538
OCP : [email protected] 100nF
10V
n
P1.8V_FB1_RRC_MN nostuff
B P3.3V_AUX C753 B
R790 R788 Q523
U515 REF: 0.827V 20K 0.1nF 150K RHU002N06
o
TPS54319RTER 1% 50V 1%
1 6 P1.8V_FB1_MN
LV :1.72V / NOR : 1.803V 3 D60V R789
VIN1 VSENSE 80.6K
2
P1.8V_FB1_RQ_MN
VIN2 1%
16 C720 R794 R791 R792 G
VIN3 KBC3_LOWPWR#
C751 6.3V C752 nostuff 100nF 20K 200K 80.6K 1
100nF 1% 1% 1% S C754 P1.8V_FB1_RQ_RCQ_MN
C
10000nF-X5R 10V 2
P3.3V 10V
R769 13 100nF
SHORT500 P1.8V
BOOT 10V
100K PNS_P1.8V_BST_MN INSTPAR
1% L503
G_P1.8V G_P1.8V G_P1.8V G_P1.8V
R926 1.5uH
PNS_P1.8V_PHASE_MN
2.2K 10
PH1
11 CMI-SSP5L20FH-1R5M
PH2 nostuff
14 12 2703-003919 EC501
VRM3_P1.8V_PWRGD PWRGD PH3
C717 C718 C719
22000nF-X5R 22000nF-X5R 220uF
C866 100nF 20% 20% 2.5V
nostuff 100nF 10V 6.3V 6.3V
R787 10K 1% 10V P1.8V_EN1_MN 15
VRM3_CPU_PWRGD EN
C750 3
P1.8V_COMP_MN GND_1
100nF 7 4
COMP GND_2
25V
R786 10K P1.8V_RT_CLK_MN 8
KBC3_VRON_D 1% RT_CLK
PAD
P1.8V_RT_CLK_RR_MN
4 3 2
COM-22C-015(1996.6.5) REV. 3 D:/users/ecad06/EE3/Eric-VE-R/PR/Eric-VE-R-PR
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
C928 VDC
D16 4700nF-X5R
P5.0V_STB BAT54C FOR EMI 25V
30V
1 2
nostuff C809
3 C759 4700nF-X5R
1nF
25V
U519 50V
TPS51117RGYR
10 13 PNS_DDR2VR_TG_MN
V5DRV DRVH
2 DDR2VR_TON_MN
TON
C811 D
g
C808 5
4700nF-X5R R836 100nF
R143 10V 2.2 25V nostuff Q26 P1.5V_AUX
14 PNS_DDR2VR_BST_MN R837
301 VBST 249K
G AON7410
1% PNS_DDR2VR_BST_RC_MN 1% R137 4 30V L7
4
n
10ohm@RT8209 DDR2VR_VCC_MN
10K S1 S2 S3 2.2uH
V5FILT 1 2 3
12 PNS_DDR2VR_PHASE_MN 1%
C840 LL
1000nF-X5R PCMC063T-2R2MN
l
D 2703-003191
SHORT9
INSTPAR
6.3V 5
SHORT8 EC5
u
R144 Q27 INSTPAR C112 330uF
R915
100K 9 ANS_DDR2VR_BG_MN G AON7410 100nF 2.5V
G_DDR DRVL
a
1% 4 30V 10V
2409-001195
0
C141 S1 S2 S3 0.035ohm, B2
VRM1_DDR_PWRGD 1nF 1 2 3
s i
C nostuff nostuff C
nostuff R145 6 50V
nostuff PGOOD
nostuff
C868 nostuff
43.2K PGND
8
t
1nF 1%
R857 1K 50V
KBC3_SUSPWR 1%
R858 G_DDR
m
1K 1 3 DDR2VR_VOUT_MN
AUX5_PWRGD
n
EN_PSV VOUT
1% DDR2VR_EN_MN DDR2VR_FB_RRC_MN
11
DDR2VR_TRIP_MN
TRIP nostuff nostuff
C841 C839
R860 R859
a
100nF
e
C807 R839 R838 7
GND 15K 0.1nF 200K 10V
1nF 30K 20K 1% 50V 1% nostuff
50V 1% 1% 15 5 DDR2VR_FB_MN
SHORT11
THERMAL VFB
INSTPAR
DDR2VR_FB_RQ_MN
G_DDR
1203-005536 R863 R862 R861
S fid
5.5V 20K 100K 100K
1% 1% 1%
OCP : [email protected]
3 D
R864
Q536 80.6K
G 1%
RHU002N06 KBC3_LOWPWR#
60V 1
S C842 G_DDR
G_DDR G_DDR G_DDR G_DDR G_DDR
2
n
DDR2VR_FB_RQ_RCQ_MN 100nF
10V
B B
G_DDR G_DDR G_DDR G_DDR
o
P1.5V_AUX U3 P5.0V_AUX
APL5336KAITRG
1 6
VIN VCNTL
7
C94 NC_2
5
R117
C
10000nF-X5R NC_1
8 P0.75V C93
6.3V 100K NC_3 1000nF-X5R
1% 6.3V
DDR3VR_VREF_P0.7V_MN 3 4
VREF VOUT
R116 C111
100K 10nF
1% 25V 2 9
C92
P5.0V_AUX GND PAD 10000nF-X5R
6.3V
1203-006083
7V
R115
D 3
100K
1% Q16
DDR3VR_P5.0V_ALW_VREF_RQ_MN G RHU002N06
1 60V
D 3 S 2
Q15
R114 30K 1% G RHU002N06
KBC3_PWRON_C 60V
1
DRR3VR_KBC3_PWRON_P0.75V_RCQ_MN
S 2
A A
C110
10nF
16V
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
P3.3V_AUX & P5.0V_ALW VDC
VDC nostuff
R843
VDC 300K
1%
nostuff [email protected] , [email protected] VDC
THM3_STP# C929
D R840 nostuff 4700nF-X5R D
C931 C930 EC500 C760 3.3 R842 C820 25V
4700nF-X5R 4700nF-X5R 4700nF-X5R 100nF 100K 1000nF-X5R nostuff
nostuff 1%
25V 25V 25V 25V 6.3V
C818 R844 C764
U521 680K C767
100nF 4700nF-X5R
TPS51125RGER 1% 1nF
25V 25V
5
D SYSVR_VIN_MN 16 13 1.19V ~ 1.7V 7 8 50V
VIN EN0 D1
D2
Q23 NOSTUFF@RT8209 P3.3V_AUX (4A)
P5.0V_ALW Q547-1
AON7410 G PNS_SYSVR_TG_P5.0V_ALW_MN 21 10 PNS_SYSVR_TG_P3.3V_AUX_MN G
AP4232BGM-HF
30V
DRVH1 DRVH2 G_P3.3V S
L8 4 2 1 7.6V L9
4.7uH S3 S2 S1 3.3uH
3 2 1 PNS_SYSVR_PHASE_P5.0V_ALW_MN 20 11 PNS_SYSVR_PHASE_P3.3V_AUX_MN 5 6
LL1 LL2 D1
PCMC063T-4R7MN R867 R140 C144 MS-RH7040S-L72
g
D2
EC6 D 2703-000339
5 PNS_SYSVR_BST_P5.0V_ALW_RC_MN PNS_SYSVR_BST_P3.3V_AUX_RC_MN Q547-2
C113 220uF C814 100nF PNS_SYSVR_BST_P5.0V_ALW_MN 22
VBST1 VBST2
9 PNS_SYSVR_BST_P3.3V_AUX_MN G
R845
AP4232BGM-HF R841 SHORT503 C727 EC8
100nF 6.3V Q24 25V 4 S
10 10 220uF
3.3 3.3 100nF 3 7.6V INSTPAR 100nF
10V 2409-001194 SHORT501 AON7410 G ANS_SYSVR_BG_P5.0V_ALW_MN 19 12 ANS_SYSVR_BG_P3.3V_AUX_MN 25V 6.3V
0.025OHM B2
INSTPAR 30V
DRVL1 DRVL2 10V 0.025OHM B2
n
4 PNS_SYSVR_PHASE_P3.3V_AUX_RC_MN
S3 S2 S1
C821 C819 SHORT504
1nF 1nF INSTPAR
3 2 1
SHORT502 50V
l
50V
INSTPAR
u
C143
100nF
SYSVR_VO1_P5.0V_ALW_MN 24 7 SYSVR_VO2_P3.3V_AUX_MN
1
VO1 VO2
25V
a
D17
BAV99LT1
70V
SYSVR_VFB1_P5.0V_ALW_RRC_MN SYSVR_VFB2_P3.3V_AUX_RRC_MN
Set : 5.090V
3
C153
C148 C903
s i
C C149 R148 R154 R155 100nF
Q30 C
100nF 0.1nF 30K 15K 0.1nF 200K 10V
10V 1% Set : 5.0V 1% 50V 1% nostuff RHU002N06
2
nostuff 50V
P12.0V_ALW
t
nostuff 2 5 nostuff 60V
G_P3.3V SYSVR_VFB1_P5.0V_ALW_MN
VFB1 VFB2 SYSVR_VFB2_P3.3V_AUX_MN
G_P3.3V 3 D
R156
R149 R150 R153 R151 80.6K 1%
10K 20K 30K 100K
R152 G
1% 330K KBC3_LOWPWR#
m
nostuff 1% 1% 1% 1
n
P2.0V_REF 5%
C142 2 S C152
1000nF-X5R 100nF
25V 18 3 10V
G_P3.3V G_P3.3V VCLK VREF G_P3.3V G_P3.3V
a e
C150
220nF G_P3.3V G_P3.3V
P5.0V_STB 10V
S fid
P5.0V_STB G_P3.3V
Q538 R868
100K 17
RHU002N06 VREG5
1%
AUX5_PWRGD 23 8
C816 C817 C844
R158 PGOOD VREG3 22000nF-X5R 10000nF-X5R 10000nF-X5R
D 3 C843
100K R875 R874 20% 6.3V 6.3V
1% 470K 120K 10nF SYSVR_ENTRIP2_MN 6 P2.0V_REF P3.3V_MICOM 6.3V
ENTRIP2
SYSVR_ENTRIP2_RQQ_MN G 1% 1% 25V
nostuff
1
Q31 D 3
RHU002N06
60V S 2 R871 R873
n
10 10
R157 G
G_P3.3V G_P3.3V G_P3.3V
KBC3_SUSPWR 10KSYSVR_KBC3_ALWS_ON_RQ_MN 1 60V 4 SYSVR_TONSEL_MN nostuff
1% OCP Valley : 5A@26mohm TONSEL
B S 2 B
R872 Ch1 / Ch2 Fsw
nostuff
o
G_P3.3V RT8205A : P2.0V_REF : 300KHz / 375KHz
0
SYSVR_ENTRIP1_MN 1 TPS51125: P3.3V_MICOM: 300KHz / 375KHz
G_P3.3V ENTRIP1
CHARGEABLE USB P2.0V_REF: 245KHz / 305KHz
P2.0V_REF
G_P3.3V
C
Q537
RHU002N06 15
PGND SKIPSEL
14 SYSVR_SKIPSEL_MN R138 10
EP
1203-005332 R139 P2.0V_REF : DEM Mode
3
25
D (PWM Only)
R869 R870 0 GND : Fixed Mode
150K 200K
R865 10 G 1% 1% nostuff
60V nostuff
1
S G_P3.3V
2
G_P3.3V
P5.0V_STB G_P3.3V G_P3.3V
SYSVR_ENTRIP1_RQQ_RD_MN
30V
R146 10K
3
G
A D18 60V nostuff G_P3.3V A
BAT54C 1% 1 nostuff
R147 S 2 nostuff
nostuff
2
470K nostuff
KBC3_SUSPWR
1% SAMSUNG
ELECTRONICS
G_P3.3V G_P3.3V
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
CHARGER & POWER MANAGEMENT
EXCEPT AS AUTHORIZED BY SAMSUNG.
VCHG=12.597V@2600Cell
VDC_ADPT VDC
VCHG=13.05V@2950Cell
AO4807L
AO4807L
Q563-2
Q563-1
ICHG=2.56A FOR 5200mAh & 4000mAh VDC_CHG
R1684
0.033
3 30V
1 30V
B529 Q562
D JACK-DC-POWER-3P-MNT D
1W
1%
D2
D2
AP4435GM
8
HU-1M2012-121JT
PNS_CHGVR_DCJACK_MN PNS_CHGVR_DCJACK_QB_MN ANS_CHGVR_VDC_ADPT_RQ_MN
1 1 8
D1 5
D1 7
POWER S1 D1
S
3 2 7
GND_2 S2 D2
C1001 C994 C999 3 6
2
G
G
R1681 R1693 C1011 C1012 S3 D3
GND_1
2 100nF 10nF 100K 1000nF-X5R 300K R1697 R1698 4700nF-X5R 4700nF-X5R
C1006 4
G D4
5 C1029 C1030
C1000 25V 25V 1% 25V 1% 2.2 22 25V 25V
1nF place near Q562 1nF 1nF
4 100nF 50V -30V 50V 50V
MNT1
5 25V nostuff nostuff CHGVR_DCJACK_RCQ_MN
MNT2
CHGVR_SGATE_RRQ_MN
6 P3.3V_MICOM C1004 100nF 25V place near Q562
MNT3 R1680 R1696
7 nostuff 100K 43.2K
MNT4
1% 1%
3722-002997 R1675
J1 3 D
10K BGATE
EMI Q558 1%
g
RHU002N06
KBC3_PRECHG KBC3_CHG3CELL OPERATION 60V
G
1 CHGVR_P3.3V_MICOM_RQ_MN
C1003 C1002 2 S
0 0 2.56A 100nF 100nF
n
25V 25V
0 1 1.37A ADT3_SEL#
1 0 0.48A
u l
D 3
KBC3_CHG4.3V KBC3_CHG4.2V OPERATION Q565 To enhance
AO3409L
a
G
0 0 4.35V -30V DMB performance (060310)
1 S
2 D1 5 6 HU-1M2012-121JT
s i
C 1 0 4.3V C
R1706
D2
B530
Q564-2
0.02
AP4232BGM-HF L513
G ANS_CHGVR_VDC_CHG_BJ_MN
0 1 4.2V
1W
1%
t
4 S
3 8.2uH
CHGVR_PHASE_RL_MN 7
6
25V Q564-1 10 10
BGATE VDC_ADPT VDC D1 7 8 R1709 R1708 HU-1M2012-121JT 5
R1711 470K
25V
100nF
25V
25V
25V
25V
D2
B531 4
m
C1005 R1699 R1700
n
nostuff 3
G
AP4232BGM-HF 22 22 2
C1007
C1009
C1010
C1013
C1008
2 S
R1694 R1691 R1692 1
47nF
1
50V
CHGVR_CSIP_MN PNS_CHGVR_PHASE_RC_MN
300K 300K 300K
1% 1% 1% G_CHG C1019 C1017
CHGVR_BAT3_DETECT#_CBJ_MN
2
a e
CHGVR_BAT3_SMDATA#_CBJ_MN
1nF 1nF J2
C1016
BAT54A
[email protected] 50V 50V BATT-CONN-7P
4700nF-X5R
4700nF-X5R
4700nF-X5R
4700nF-X5R
100nF
D533
C996
3
3711-007285
30V
R1695 R1689
1%
30K 10nF 27.4K
1% 25V 1% U531
1
S fid
CHGVR_BAT3_SMCLK#_CBJ_MN
1000nF-X5R
C998
ISL6255AHRZ-T
25V
C1015
G_CHG SGATE BGATE
25
100nF
CHGVR_DCIN_MN
DCIN BAT3_DETECT#
1000nF-X5R
25V
(1.26V) CHGVR_ACSET_MN 27
ACSET
C934
P2.39V_VREF CHGVR_DCSET_MN 28 0.1nF
DCSET
C997
3.3
R1707
PNS_CHGVR_BST_RC_MN
25V
15 PNS_CHGVR_TG_MN BLM18PG181SN1
G_CHG
UGATE
n
R1687 CHGVR_VDDP_MN 13 16 PNS_CHGVR_PHASE_MN
VDDP PHASE
200K [email protected]
1% 5.1 R1701 CHGVR_VDD_MN 26
VDD LGATE
12 ANS_CHGVR_BG_MN
1% 11 C932 BAT3_SMDATA#
[email protected] PGND P2.39V_VREF
B CHGVR_CHLIM_MN 7
CHLIM
0.1nF B
CHGVR_VADJ_MN 9 21 CHGVR_CSOP_MN 50V B528
VADJ CSOP
o
R1705 R1703 R1683 CHGVR_ACLIM_MN 8 22 CHGVR_CSON_MN BLM18PG181SN1
ACLIM CSON
150K 20K 100K CHGVR_ICM_MN 5
ICM
1% 1% 1% 6
P2.39V_VREF VREF BAT3_SMCLK#
CHGVR_CHLIM_RQ_MN EN
1 CHGVR_EN_MN C933
0.1nF
3 [email protected] P3.3V_MICOM
D CHGVR_ICOMP_MN 3 2 50V
C
G_CHG Q557 [email protected] ICOMP CELLS
4 10
R1679
CHGVR_VCOMP_MN
CHGVR_KBC3_CHGBIT1_RQ_MN VCOMP GND
10K G 1% RHU002N06 R1704
P2.39V_VREF
1%
60V
1K
1 150K 23 29
KBC3_PRECHG R1674 ACPRN THERM
BAV99LT1
BAV99LT1
BAV99LT1
1% C1014 C995 24 CELLS Cells N/B
2
S 2 R1710 DCPRN KBC3_CHGEN
100 6.8nF 10nF
CHGVR_VCOMP_RC_MN
VDD 4
1% 50V 25V C1018
D529
D528
D530
R1686 1203-005849
D 3 25V 1nF
3
70V
70V
70V
G_CHG
24.3K R1685 GND 3
Q561 1% 47K R1673 50V
CHGVR_KBC3_CHGBIT0_RQ_MN
10K 1% RHU002N06 1% C1020 Float
1
G 10K 2
1 60V 100nF 1%
KBC3_CHG3CELL R1678 S 10V G_CHG
2 R1690 R1682 R1688
27.4K 100K 200K
1% 1% 1% G_CHG G_CHG
G_CHG G_CHG G_CHG G_CHG
G_CHG P3.3V_MICOM R1572 100 1%
D 3 BAT3_SMDATA# KBC3_SMDATA#
CHGVR_KBC3_CHG4.2V_RQ_MN Q559 G_CHG R1573 100 1%
RHU002N06 BAT3_SMCLK# KBC3_SMCLK#
KBC3_CHG4.2V R1676 10K 1%
G
ADT3_ICM R1702
60V R1574 100 1%
1 20K BAT3_DETECT# KBC3_BATDET#
S 2 1%
A A
ADT3_SEL#
SHORT521 (ACTIVE LOW)
CHGVR_KBC3_CHG4.3V_RQ_MN
G_CHG D 3
Q560 INSTPAR SAMSUNG
R1677 10K 1% G RHU002N06 ELECTRONICS
KBC3_CHG4.3V 60V
1
S 2
G_CHG
G_CHG
4 3 2 1
COM-22C-015(1996.6.5) REV. 3 D:/users/ecad06/EE3/Eric-VE-R/PR/Eric-VE-R-PR
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D D
Load Switch Control (P3.3V_DEEP)
g
AO6409L
P3.3V C895
R897 0 4700nF-X5R P2.0V_ISSD
Q543
DEEPSUS
D1 D2 D3 D4
R898 0 10V
1 2 5 6
DEEPSUS
DEEPSUS R899 0 R700 10K U522
1% RT9179GB
4
n
DEEPSUS
S
NON_DEEP
DEEPSUS 1 5
NON_DEEP IN OUT
R963 100K 1% 3
3
G
DEEPSUS KBC3_PWRON EN
l
NON_DEEP
DEEPSUS R902 C862 ISSD 2
GND ADJ
4 R949 R960
DEEPSUS 100K 100nF ISSD 22K 17.4K C898
R903
nostuff
u
1% 10V ISSD C692 1203-005591 1% 1%
20K
10000nF-X5R
1%
ISSD 100nF 5.5V
P2.0V_MSATA_ADJ_MN 6.3V
a
ISSD 10V
KBC3_DEEPSUS_INV# ISSD C921 R958 R720
C858 ISSD 1nF
s i
C 30K 47K C
2200nF-X5R 50V 1% 1/16W
R901
D 3 10V
10K
1%
t
Q542 nostuff
G RHU002N06 P12_18
KBC3_DEEPSUS P12_18
140-C4
S 2
Power P1.0V
C857 P3.3V C904
m
R716 R713
n
0.1nF U523 10K 0.1nF 47K
50V TPS54319RTER 1% 50V 1/16W nostuff
1 6 P1.0V_ISSD_FB_MN nostuff
VIN1 VSENSE
2
a
VIN2
e
16 R714 R715 R712
C901 C874 VIN3
C913
100nF
10000nF-X5R 100nF 47K 47K 300K
25V
1/16W 1/16W 1%
6.3V 10V
P3.3V 13 P12_18
P1.0V_ISSD
nostuff BOOT P12_18
nostuff
S fid
PNS_P1.0V_ISSD_BST_MN
G_P1.0V G_P1.0V G_P1.0V
R966 PNS_P1.0V_ISSD_PHASE_MN
100K 10
P3.3V PH1
1% 11
PH2 L511
14 12
PWRGD PH3 1.5uH C873 C899 C900
R964 100K 1% CMI-SSP5L20FH-1R5M 100nF 10000nF-X5R 10000nF-X5R
2703-003919 10V 6.3V 6.3V nostuff
n
3
nostuff GND_1
C729 P1.0V_ISSD_COMP_MN 7
COMP GND_2
4
B 10nF B
P5.0V_DEEP ISSD 25V P1.0V_ISSD_RT_CLK_MN
8
P5.0V_AUX RT_CLK
o
ISSD
AO6409L
ISSD
P1.0V_ISSD_VR_COMP_RC_MN
P1.0V_ISSD_RT_CLK_RR_MN
P1.0V_ISSD_SS_MN
PAD
DEEPSUS ISSD R710 R965 9 5
ISSD
SS AGND
Q555
DEEPSUS
ISSD G_P1.0V
4.7K 100K SHORT517
D1 D2 D3 D4
1% 1%
1 2 5 6
17
ISSD C919 1203-006544
DEEPSUS ISSD 1nF 6V
4
R711
C
ISSD
S
DEEPSUS
ISSD
C920 80.6K 50V
2.2nF 1%
3
G
DEEPSUS ISSD
DEEPSUS R1640 C987 ISSD 50V
100nF ISSD
R1639
DEEPSUS
100K ISSD
1% 10V
20K
1%
C985
2200nF-X5R
R1637
D 3 10V
10K
1%
Q554
G RHU002N06
KBC3_DEEPSUS
140-C4
S 2
C984
0.1nF
50V
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D D
Load Switch Control (P5.0V) Load Switch Control (P3.3V) Load Switch Control (P1.5V)
P12.0V_ALW P1.5V_AUX P1.5V
g
P5.0V_ALW P5.0V P5.0V_AUD
P3.3V
D1 D2 D3 D4
Q533
1 2 5 6
AO6409L P3.3V_AUX P3.3V
Q519
D1 D2 D3 D4
4 Q528
1 2 5 6
SHORT513 AO6409L AO6402AL
S
n
INSTPAR R832
C806 1 4
3
4
100K
G
D1 S
S
R834 100nF SHORT515 1% 2
D2
l
INSTPAR 5
3
10V
G
100K P1.5V_PWRGD R785 R784 D3
1% R807 C775 470K 100K 6
D4 G
3
SHORT514 3
u
R833 100K 100nF D 1% 1% C746 C747
KBC3_PWRON_RCQ1_RRQ_MN
INSTPAR 1% 10V Q522 100nF 4700nF-X5R
R806 RHU002N06
a
KBC3_PWRON_RCQ1_RRQ_RCQ_MN G 10V 10V
10K 60V KBC3_PWRON_INV#
1% KBC3_PWRON_RCQ2_RRQ_MN 1
KBC3_PWRON_RRQ3_RQQ_RCCQQ_MN
s i
2 S
C KBC3_PWRON_RCQ1_MN D 3 C756 20K KBC3_PWRON_RCQ2_RRQ_RCQ_MN
C773 C
2200nF-X5R 1% 2200nF-X5R
R835 Q534 D 3
10V 10V
t
G RHU002N06 D 3 Q520
KBC3_PWRON 40-A4 RHU002N06
10K 1 KBC3_PWRON_RCQ2_MN Q529 KBC3_PWRON_INV#
G
m
1% S Q521 25V 50V
2
n
C774 R910 30K G
0.1nF KBC3_PWRON 1%
nostuff
1
EMI Request (10/30)
50V C805 S 2
R830 10K 100nF
a
nostuff KBC3_PWRON_C 1%
e
10V
nostuff
D1 D2 D3 D4
1 2 5 6
AO6409L
n
-20V
4
P3.3V_AUX P3.3V_PRIME
S
C757 nostuff
D1 D2 D3 D4
B Q10 B
3
1 2 5 6
G
R797 nostuff
nostuff R847
AO6409L 100K
10nF nostuff R846
nostuff 30K 3
o
1% 25V nostuff
4
SWITCHVR_P5.0V_ALW_RRCQ_P5.0V_AUX_MN 100nF
G
3
100nF nostuff
12V
100K SWITCHVR_KBC3_SUSPWR_RCQ_P5.0V_AUX_MN 1% 50V
1% 10V G
C
R67 KBC3_SUSPWR Q525 C771 C823
1
1
4700nF-X5R 4700nF-X5R
R795
KBC3_PWRON_RCQ4_RRQ_MN
10K
S 2 RHU002N06
60V
25V 25V
KBC3_PWRON_RCQ4_RRQ_RCQ_MN
20K C74 1%
1% 2200nF-X5R
10V ZD500
1% D 3 BZX84C12L
10K KBC3_PWRON_RCQ4_MN Q513
R944 G RHU002N06
VRM3_CPU_PWRGD
1
nostuff S 2
C617
R677 10K 100nF
KBC3_VRON_D 10V
1%
P5.0V_ALW P5.0V_AUX
R798 0
R799 0
A A
For Non-CHARGEABLE USB
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D PWR Discharger D
n g l
P3.3V P5.0V P1.5V P1.05V P3.3V_PRIME
u
P5.0V_STB P1.8V nostuff
a
nostuff nostuff
nostuff
s i
C C
R142 R763 R105 R927 R118 R764 R69
100K 10 10 10 10 10 10
t
1%
P1.05V_RQ_MN
m n
D 3 D 3 D 3 D 3 D 3 D 3 D 3
KBC3_PWRON_RQ_MN Q28 Q517 Q17 Q518 Q11
R160 10K G RHU002N06 G RHU002N06 G G G RHU002N06 G RHU002N06 G RHU002N06
a
KBC3_PWRON
e
1 1 1 1 1 1 1 60V
1%
S 2 S 2 Q13 S
2 S 2 S 2 S 2 S 2
RHU002N06 Q544
nostuff nostuff
RHU002N06
S fid
n
P3.3V_DEEP
B B
P0.75V
nostuff
nostuff
nostuff
R1646
22
C o D 3
R900
22
Q540
R1645
D 3 G RHU002N06 nostuff
10K
KBC3_PWRON_INV#
1%
A A
SAMSUNG
ELECTRONICS
4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL MT501 MT512 MT500
PROPRIETARY INFORMATION THAT IS RMNT-25-70-1P RMNT-25-70-1P RMNT-25-70-1P
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS Top + Bottom M/B
EXCEPT AS AUTHORIZED BY SAMSUNG.
(Bottom side) KBD +
Top
n g l
R881 3.3
5%
u
Dummy (LED side)
s i a
C C
SMT4
G_AUD
0-1005
m n t
FOR EMI
a
S fid e Multi_assy
HDMI
NON_HDMI
DEEPSUS
NON_DEEP
FFS
Multi_assy Description
Description
for sku with HDMI
for sku without HDMI
for sku with deep S3 function
for sku without deep S3 function
for sku with free fall sensor
n
NON_FFS for sku without free fall sensor
HSDPA for sku with HSDPA
B NON_HSDPA for sku without HSDPA
B
o
FULL_HSDPA for full HSDPA screw
HALF_HSDPA for half HSDPA screw
TPM for BIOS detect there is TPM
NON_TPM for BIOS detect there is no TPM
C
SSD for sku with in-card SSD
ISSD for sku with onboard SSD
SSD_HSDPA for the connector that SSD & HSDPA common use
P12_18 for P5 SSD surport
SMSC for sku with SMSC thermal sensor
GMT for sku with GMT thermal sensor
INTMIC for BIOS detect there is internal MIC
NON_INTMIC for BIOS detect there is no internal MIC
HDD for sku with HDD
SSD for sku with SSD
A A
SAMSUNG
ELECTRONICS
4 3 2 1
www.s-manuals.com