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    Disipador de Calor y Thermal Resistance

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    jhony morales
    Thermal resistance is a measure of how difficult it is for heat to flow from one point to another. It can be used to calculate the temperature increase from heat generation to ambient air. For a component dissipating power, its thermal resistance circuit usually has two points - from the internal junction to the external case, and from the case to ambient air. These resistances combine additively to give the total thermal resistance. Choosing a heat sink to replace the case-ambient portion can lower the total resistance and keep component temperatures within safe limits.

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    Disipador de Calor y Thermal Resistance

    Uploaded by

    jhony morales
    37 views4 pages
    Thermal resistance is a measure of how difficult it is for heat to flow from one point to another. It can be used to calculate the temperature increase from heat generation to ambient air. For a component dissipating power, its thermal resistance circuit usually has two points - from the internal junction to the external case, and from the case to ambient air. These resistances combine additively to give the total thermal resistance. Choosing a heat sink to replace the case-ambient portion can lower the total resistance and keep component temperatures within safe limits.

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    Disipador de calor y Thermal Resistance

    Original Title

    Disipador de calor y Thermal Resistance

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    Thermal resistance is a measure of how difficult it is for heat to flow from one point to another. It can be used to calculate the temperature increase from heat generation to ambient air. For a component dissipating power, its thermal resistance circuit usually has two points - from the internal junction to the external case, and from the case to ambient air. These resistances combine additively to give the total thermal resistance. Choosing a heat sink to replace the case-ambient portion can lower the total resistance and keep component temperatures within safe limits.

    Copyright:

    © All Rights Reserved
    Download as DOCX, PDF, TXT or read online from Scribd
    Download as docx, pdf, or txt
    37 views4 pages

    Disipador de Calor y Thermal Resistance

    Uploaded by

    jhony morales
    Thermal resistance is a measure of how difficult it is for heat to flow from one point to another. It can be used to calculate the temperature increase from heat generation to ambient air. For a component dissipating power, its thermal resistance circuit usually has two points - from the internal junction to the external case, and from the case to ambient air. These resistances combine additively to give the total thermal resistance. Choosing a heat sink to replace the case-ambient portion can lower the total resistance and keep component temperatures within safe limits.

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    © All Rights Reserved
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    Thermal Resistance

     
    In many applications, components as transistors, voltage regulators and audio amplifiers
    get hot because of electric power. In those cases, we need to apply a heat dissipator, in
    order to facilitate the heat to flow to the air, keeping the components temperature into
    safe limits.

    The thing is: how do we choose the heat dissipator's size that is best suited for our
    requirements? The dissipator's ability to dissipate heat to the ambient depends on many
    physical and geometrical factors, and its determination is very complex. However, for
    our needs, the whole phenomena can be represented by one single parameter: the
    thermal resistance.
    Let's suppose we have a semiconductor device like a regulator or a transistor, and we
    know the amount of  power that the component is dissipating, for example 10 Watts.
    This power is generated inside the device,
    becoming heat, which flows from this point to
    the sorrounding air. This course can be divided
    into two steps:

    1.-  From the heat generation focus, called


    "junction", to the component's outside surface
    or "case".

    2.- From case to air.

    Heat will flow easier or more difficult


    depending on the
    course's thermal resistance, which is inverse to the ability to conduct heat. The relation
    between power and temperature on a step from a point "a" to a point "b", characterized
    by its thermal resistance, can be expressed and represented as follows:
     

    Where is the thermal resistance from


    point a to point b.
    It indicates how many centigrades the
    temperature on point "a" will rise up over
    point "b" for each Watt of power
    dissipated. Its unit is ºC/Watt.
    Now, as we said before, our model has two thermal resistances in series, so its
    equivalent thermic circuit would look like this: 

    As in electrical circuits, values of thermal resistances in series can be added to find the
    total thermal resistance, so the circuit can be reducet to the next:

    Where

    is the total thermal resistance from 


    junction to ambient. And the
    ecuation for this thermal circuit is:

    Then for a given device, which we know the power dissipation, thermal resistance and
    ambient temperature, we can easily calculate the temperature reached by the junction.
    For doing that, we need to isolate the junction temperature from the preceeding
    ecuation:
    Thermal resistance values are characteristic of each component, and we can find them
    on the component datasheet.

    Design Example

    Let's refer to our regulator circuit on Chapter Four,  where a LM7812 1 Amper regulator
    develops a power of 3.43 Watts. Looking into the datasheet's. Looking for into the
    datasheet's small print, we will find the thermal resistance specifications:

    The most used package is TO-220 (shown on Chapter Four), so:

        and            total resistance:

    This means that the chip temperature will rise 54 º C  above ambient temperature for
    each watt dissipated by the regulator. For ambient temperature, we must choose the
    worst case, for example 45ºC (into the cabinet or box). Then junction temperature can
    reach:

    Ops! It seems too high temperature. Let's take a look into "Absolute Maximum Ratings"
    section to find out how much can it resist.

    This chip can only resist 150ºC, with 230ºC it will burn out. Definitively it needs a heat
    dissipator. Typical commercial values are 10ºC/W, 5ºC/W, 1ºC/W, 0.5ºC/W .... . Let's
    see what happens with a 10ºC/W heat dissipator. We can consider that the heat
    dissipator replaces the case-ambient segment, so the thermal model  becomes:
    We can consider that the heat
    dissipator replaces the case-
    ambient segment, so the
    thermal model  becomes --->

           

    Which means that the junction will rise 14ºC above ambient temperature, for each Watt,
    Then, the maximum temperature reached by the junction with a 10ºC/W heat dissipator
    is:

    Much better. Besides, at 150ºC the regulator will burn out, but there are some
    characteristics that get worse when reaching near 125ºC. So 93ºC is pretty safe.

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