Polymer Testing: Test Method
Polymer Testing: Test Method
Polymer Testing: Test Method
Polymer Testing
journal homepage: www.elsevier.com/locate/polytest
Test Method
A R T I C LE I N FO A B S T R A C T
Keywords: Polymer separators for lithium ion batteries are thin, porous membranes of 20–30 μm thickness. At elevated
CTE measurement temperatures, some separators can shrink considerably. To predict the deformation and stresses in the separator
Polymer thin films in battery cells, it is necessary to measure the expansion/shrinkage property of a separator as expressed by the
Thermal expansion/shrinkage coefficient of thermal expansion (CTE). The reported CTE measurement techniques for thin films have their
Dynamic mechanical analyzer (DMA)
limitations. This paper examines the use of a dynamic mechanical analyzer (DMA) for the measurement of the
thermal expansion/shrinkage property of polymer separators. The effect of the dimensional change of the testing
fixture was considered. The influences of the preloading levels and heating rates were investigated. The mea-
surements were carried out for three common types of polymer based separator. The CTE as a function of
temperature was determined from the DMA data. DMA offers continuous measurements in an automatic fashion,
which is an efficient and convenient method to characterize the thermal expansion/shrinkage behavior of thin
polymer films.
1. Introduction surface in an oven with an optical window and using non-contact op-
tical methods such as interferometry [4] or digital image correlation [5]
In lithium ion batteries (LIBs), the separator provides electrical in- to measure the dimensional change. For metal foils, the CTE can be
sulation between opposite electrodes while allowing ionic conductivity. measured using a bi-layer configuration with a substrate of known CTE
The commonly used LIB separators are polymer based, thin, porous [6]. The optical measurement requires special equipment. The bi-layer
membranes of 20–30 μm thickness [1]. configuration is not suitable for polymer thin films because the stiffness
It is known that, with increasing temperatures, polymer separators of these materials are too low to generate needed deformation with
first expand and then start to shrink before final fracture. The amount of commonly used substrates.
shrinkage can be significant for some separators [1]. In a constrained The thin film CTE measurement has also been attempted for a
condition, a larger shrinkage will induce higher stresses in the separator clamped sample. El-Tonsy [7] presented a system that measures the
which may cause earlier failure. As the mechanical integrity of the length change of a clamped polymer film sample under a small hanging
separator is critical to the safety of LIBs, it is desired to predict the weight. This system has some similarity to the thermal mechanical
stresses and strains in the separator under extreme conditions such as analyzer (TMA) and dynamic mechanical analyzer (DMA) commonly
thermal runaway. In such predictions, the coefficient of thermal ex- used in polymer characterization. TMA [1,8] and DMA [9–12] have
pansion (CTE) is one of the required inputs. Because of that, it is critical been used widely in the characterization of battery separators. Baldwin
to have a technique that can measure the thermal expansion/shrinkage et al. [9] characterized the shrinkage of battery separators under iso-
of these films continuously and accurately. thermal conditions using a DMA under tensile mode [9]. These works
The standard methods determine the CTE of a material through indicate the potential of TMA and DMA in thin film CTE measurement.
measuring the volume or lengthwise change of a free standing sample The current study explores this possibility.
[2,3]. These techniques are not suitable for materials in the form of thin This paper presents a systematical investigation on the use of a DMA
films. under tensile mode for the thermal expansion/shrinkage measurement
For thin films, several CTE measurement techniques have been re- of battery separators. Factors such as the calibration procedure, the
ported. A common method is laying an unconstrained sample on a flat influence of the tensile load and the temperature ramp rate were
∗
Corresponding author.
E-mail address: [email protected] (X. Xiao).
https://doi.org/10.1016/j.polymertesting.2018.08.028
Received 17 July 2018; Accepted 26 August 2018
Available online 27 August 2018
0142-9418/ © 2018 Elsevier Ltd. All rights reserved.
S. Yan et al. Polymer Testing 71 (2018) 65–71
Fig. 1. Surface microstructure of Celgard® 2400 [1]. The two in-plane material
directions are referred to as the machine direction (MD) and the transverse
direction (TD).
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Fig. 4. (A) The measured Al sample length change and the predicted sample length expansion. (b) The calibration curve. (c) The measured Cu sample length change
before and after correction, and the predicted length change.
sample used in calibration, and the measured dimensional change 3. Results and discussions
Δlmeasrued by the DMA [16].
3.1. Expansion/shrinkage measurement
Δlcalibration = Δlpredicted − Δlmeasured (1)
3.1.1. Effect of tensile load
The predicted gage length change of the calibration sample is To keep the sample straight during the measurement, a small tensile
computed as load is needed. The load should be as small as possible to avoid the
influence of creep strain. On the other hand, it is difficult to maintain a
Δlpredicted = CTE × l 0 × (T − T0) (2) very small load accurately. The effect of tensile load on the measure-
ment was investigated using Celgard® 2400 at a ramp rate of 3 °C/min.
where l0 is the initial sample length. These measurements were repeated two times at each load level. The
Fig. 4b presents the Δlcalibration for the current CTE measurement set- repeatability of the measurement was very good. The averaged curves
up obtained with the Al samples. The true dimensional change of the are presented in Fig. 5.
sample Δlcorrected can be determined by the following correction Fig. 5 shows that the load level had a significant effect on the
measurement. For the MD samples (Fig. 5a), the measurements were
Δlcorrected = Δlcalibration + Δlmeasured (3)
performed under three load levels, 0.01 N, 0.02 N and 0.45 N, corre-
The established calibration was verified by testing a Cu foil of 50 μm sponding to stress levels of 0.067 MPa, 0.13 MPa and 3 MPa. At 3 MPa,
thickness with a purtiy of 99.9%. Fig. 4c presents the Δlmeasured for two the sample did not shrink as the creep strain had exceeded the thermal
Cu samples and Δlcorrected calculated using Eq. (3). Then, the engineering strain. Under 0.067 MPa and 0.13 MPa, the measured expansion/
strain was calculated as ε = Δlcorrected/l0. The CTE is defined as a change shrinkage was almost identical, indicating that a stress level of
in strain in response to a change in temperature 0.067 MPa is sufficiently low for the MD samples. For the TD (Fig. 5b),
the measurement was made under 0.007 MPa, 0.014 MPa, 0.067 MPa
dεT and 0.13 MPa. Unlike the MD, the expansion/shrinkage curve and the
CTE = peak/valley values of the TD samples continue to change with the
dT (4)
stress. Finally, a stress level of 0.007 MPa was selected as this corre-
The CTE for the Cu foil determined in this way was 17.1 × 10−6/⁰C, sponds to the minimum force of 0.001 N which the DMA can maintain.
which is within 1.2% of the reported CTE value of 17.3 × 10−6/⁰C for
pure Cu over the range of 20–200 °C [17].
3.1.2. Effect of heating rate
The effect of the temperature ramp rate on the expansion/shrinkage
behavior was investigated using Celgard® 2400 TD samples. The results
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Fig. 5. The measured expansion/shrinkage strain under different stress levels for Celgard® 2400 (a) MD and (b) TD samples.
Fig. 6. The effect of the temperature ramp rate on Celgard® 2400 TD samples. (a) The measured thermal expansion/shrinkage, and (b) TShrink, the temperature when
the sample starts to shrink.
Table 1
Test conditions for MD and TD samples.
Testing conditions MD samples TD samples
are shown in Fig. 6. For 3 °C/min and 5 °C/min, the amount of the
expansion below 120 °C and shrinkage between 140 °C and 160 °C were
about the same. At the two higher rates, however, these amounts de-
creased. This is probably due to the thermal lag between the tem-
perature measured by the thermocouple of the DMA and the sample
[18,19]. A faster temperature ramp rate causes a larger thermal lag
[18]. TShrink, the temperature when the sample starts to shrink, as
marked on Fig. 6a, may be another indication of the thermal lag effect.
As shown in Fig. 6b, TShrink increased sharply when the rate increased
from 3 °C/min to 5 °C/min. Therefore, a 3 °C/min ramp rate was se- Fig. 7. Celgard® 2400 MD samples after isothermal conditioning for 30 min in
lected. Table 1 lists the testing conditions for further investigations. an oven. From left to right: 25 °C, 130 °C, 155 °C, 160 °C, 170 °C and 180 °C.
3.1.3. Comparison with oven isothermal test temperature. The length of the sample before and after was measured
The shrinkage of separators is often measured with an oven iso- with a caliper. The oven tested samples are shown in Fig. 7. The change
thermal test [9,20–23]. In this method, the sample is heated in an oven in the sample length and appearance is noticeable. The sample tested at
to the desired isothermal temperature for a period of 30 min to 1 h. The 170 °C became transparent and curled. At 180 °C, the sample had
dimensions of the sample are measured immediately after it has been melted as it became attached to the glass slide.
removed from the oven. Table 2 compares the shrinkage measured using the isothermal
In this study, oven isothermal tests were performed with Celgard® method and by the DMA. The agreement between the two methods is
2400 MD samples of 55 × 6 mm at 130 °C, 155 °C, 160 °C, 170 °C and rather good except at 180 °C. The glass slide apparently had restricted
180 °C. The sample was placed on a clean and smooth microscope slide the shrinkage of the sample during the isothermal conditioning.
and heated for 30 min in a conventional oven at the desired Comparing the two methods, the isothermal test is relatively simple
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Table 2 Table 3
Celgard® 2400 MD shrinkage strains measured using oven isothermal test and Shrinkage from manufacturer's data sheet measured after being kept at the
DMA temperature ramp test. temperature for 1 h and from DMA measurement at 3 °C/min.
Testing temperature (oC) 130 155 160 170 180 Celgard® 2400 Celgard® 2325 Celgard® Q20S1HX
Fig. 8. Comparison of expansion/shrinkage behaviors of three types of separators, (a) the MD samples, (b) the MD samples from 20 to 80 °C, (c) the MD samples for
small strain range, and (d) the TD samples.
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Table 5
CTE for Celgard® 2400, 2325 and Q20S1HX.
Material Temp (°C) CTE (x10−6/°C)
2400 MD 30–65 44
65–175 − 3.45 × 10−13T7.6262
2400 TD 30–130 1.4 T + 26
130–140 0
140–160 −88 T + 12044
2325 MD 30–60 30
60–175 − 5.1 × 10−13T7.5641
2325 TD 30–120 1.6 T + 25
120–130 0
130–150 −124 T + 16087
Q20S1HX MD 30–160 −1.2 T + 39
160–200 29
Q20S1HX TD 30–110 T-1
110–135 0
135–175 28T-5479
175–185 540T-101850
Fig. 10. Determine the CTE of Celgard® 2400 MD. The shrinkage curve was divided into two segments, curve fitting was performed for each segment, and the slope of
the curve for the segment gave the CTE. (a) The first segment, (b) the second segment, and (c) the combined curve.
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