Mni Ision: Ov7950/Ov7451 Cmos Analog NTSC C C With Omnipixel Technology
Mni Ision: Ov7950/Ov7451 Cmos Analog NTSC C C With Omnipixel Technology
Mni Ision: Ov7950/Ov7451 Cmos Analog NTSC C C With Omnipixel Technology
Advanced Information
® Preliminary Datasheet
HSYNC
XCLK2
XCLK1
• Two sets of dynamic overlay controls
OGND
OVDD
DVDD
CVO
NC
NC
NC
NC
applications NC 34 15 SCK
NC 36 13 CS
OV7950/OV7451
Ordering Information NC 37 12 ESI
NC 38 11 FSIN
NC 40 9 OVL2
NC 42 7 PWDN
OV07451-C10A (B&W with microlens, NTSC) CLCC-48
43 44 45 46 47 48 1 2 3 4 5 6
MASTEN
MSDA
MSCL
SIO_D
SIO_C
SGND
SVDD
VREFH
VREFS
DEVDD
NVREF
VRLOW
Functional Description
This section describes the various functions of the OV7950/OV7451. Refer to Figure 2 for the functional block diagram of the
OV7950/OV7451.
DAC
Video
AMP ADC DSP Overlay +CVO
Encoder
Column Sample/Hold
CS
Gain DSP Overlay
Row Image Array
Control Control Control
Select (656 x 492) SCK
SPI
Interface
ESO
ESI
CS0*
CS1*
SIO_C
SIO_D
XCLK1
XCLK2
PWDN
RESET
FSIN
OVL2
OVLEn
VS
Multi-Chip Synchronize The receiver must pull down SIO_D during the
acknowledgement bit time. During the write cycle, the
The OV7950/OV7451 CAMERACHIP provides the OV7950/OV7451 device returns the acknowledgement
multi-chip Synchronize function where one chip works as and, during the read cycle, the master returns the
the master and all others as slave devices. The master acknowledgement, indicating to the slave that the read
chip provides the frame synchronize signal through pin VS cycle can be terminated. Note that the restart feature is
(pin 18). All slave devices then accept the frame not supported here.
synchronize signal through pin FSIN. This mode allows all
devices to synchronize together. Within each byte, the MSB is transferred first. The
read/write control bit is the LSB of the first byte. Standard
SCCB communications require only two pins, SIO_C and
Chip Configuration SIO_D. SIO_D is configured as an open drain for
bidirectional purposes. A HIGH to LOW transition on the
The OV7950/OV7451 CAMERACHIP has been designed SIO_D while SIO_C is HIGH indicates a START condition.
for ease-of-use in many stand-alone applications. Some A LOW to HIGH transition on the SIO_D while SIO_C is
functions like serial interface slave address and NTSC HIGH indicates a STOP condition. Only a master can
selection can be set by connecting appropriate pins high generate START/STOP conditions.
(logic "1") or low (logic "0") through a 10 KΩ resistor. The
OV7950/OV7451 CAMERACHIP also has a serial master Except for these two special conditions, the protocol that
and slave interface for programmable access to all SIO_D remain stable during the HIGH period of the clock,
register functions. SIO_C. Each bit is allowed to change state only when
SIO_C is LOW (see Figure 3 and Figure 4).
Many of the functions and configuration registers in the In the write cycle, the second byte in the SCCB is the
OV7950/OV7451 image sensors are available through the sub-address for selecting the individual on-chip registers,
SCCB interface. The OV7950/OV7451 image sensor and the third byte is the data associated with this register.
operates as a slave device that supports up to 400 kbps Writing to the unimplemented sub-address is ignored.
serial transfer rate using a 7-bit address/data transfer
protocol. In the read cycle, the second byte is the data associated
with the previously stored sub-address. Reading of an
unimplemented sub-address returns unknown.
SCCB Protocol Format
Figure 3 Bit Transfer on the SCCB
In SCCB operation (see Figure 5), the master must
perform the following operations:
• Generate the Start/Stop condition SIO_D
Connect external SCCB slave-compatible storage device 0x00 Sub_add1 - first configuration register address
through the OV7950/OV7451 SCCB master interface so 0x01 Add1_value - first configuration register value
the OV7950/OV7451 can self load the configuration data
0x02 Sub_add2 - second configuration register address
from it. Data stored in the external storage device should
be arranged as follows: 0x03 Add2_value - second configuration register value
. .
. .
. .
A A A
SIO_C
S P
Read content
Bit[7:6]: Opacity2[1:0]
in address
0x00~0x0F
0x22 Bit[5:4]: Resolution2[1:0]
Bit[3]: YUV2 all replaced
Do
addresses
0x00[7] = 1 &
N Stop SPI and 0x23 Bit[7:0]: Y2
0x00[0] = 0 Overlay
?
Y
0x24 Bit[7:0]: U2
Does
0x25 Bit[7:0]: V2
Read content
address
in address
0x00[6] = 1
?
0x10~0x2B 0x26 Bit[7:0]: V2 start[9:2]
Y
0x27 Bit[7:0]: V2 end[9:2]
Overwrite 15 bytes of
internal registers with the
content from addresses
Do
0x28 Bit[7:0]: H2 start[9:2]
addresses I2C Master Start
0x01~0x0F N
0x10[7] = 1 &
0x10[6] = 0
Stop Overlay
0x29 Bit[7:0]: H2 end[9:2]
?
Stop
Y
Bit[7:0]: V2 start[1:0], V2 end[1:0],
Read I2C slave content
one byte for address, 0x2A
one byte for data H2 start[1:0], H2 end[1:0]
0x2B Bit[7:0]: MemLine2[7:0] (unit byte)
Is
N Does
pin OVL2 = 1
Y
N
there no
ACK or does 0x30 ~ 0xXX Bit map 1
? address = FF
& data = FF
Read current line Read current line ? Set2 start address Bit map 2
overlay bit map 1 overlay bit map 2
data data Y ~ 0xXX
Stop I2C
Master
Overlay process Overlay process
Byte[10]
N N
Overlay function can only be enabled when bit[7] = 1 and
Field End? Field End?
bit[6] = 0.
Y Y
Reset address
Reset address to There may be two sets of overlay bitmaps in one EPROM.
the starting address of
to 0x30
overlay bit map 2 Byte [11] ~ Byte [1A] are control bytes for first bitmap.
(refer to addresses
0x21 and 0x20)
Pin Description
26 NC – – No connection
27 NC – – No connection
28 NC – – No connection
29 NC – – No connection
31 RES Analog – Internal reference adjustment pin (connect to ground using a 200Ω resistor)
34 NC – – No connection
35 NC – – No connection
36 NC – – No connection
37 NC – – No connection
38 NC – – No connection
39 NC – – No connection
40 NC – – No connection
41 NC – – No connection
42 NC – – No connection
Electrical Characteristics
a. Exceeding the stresses listed may permanently damage the device. This is a stress rating only and functional operation of the sensor at
these and any other condition above those indicated in this specification is not implied. Exposure to absolute maximum rating conditions
for any extended period may affect reliability.
Supply
Digital Inputs
Serial Input
Load capacitor 33 pF
Parallel resistance 1 MΩ
I/O Pin
Miscellaneous Timing
Timing Specifications
NTSC Timing
HSYNC HSYNC / 2
ANALOG
FIELD 1
START
OF
ANALOG VSYNC
FIELD 2
258 259 260 261 262 263 264 265 266 267 268 269 275 276
GREEN
BLACK
WHITE
CYAN
BLUE
RED
100 IRE
3.58 MHZ
COLOR BURST
(9 CYCLES)
0.449 V
20 IRE
0.357 V BLACK LEVEL
7.5 IRE
0.306 V BLANK LEVEL
20 IRE
0.163 V
40 IRE
0.022 V SYNC LEVEL
Overlay Timing
PWUP
Read 16 System Control Bytes Read 28 Overlay Control Bytes Part II: Read Overlay Bitmap
FromEPROM [0000] ~ [000F] FromEPROM [0010] ~ [002B] From EPROM [0030] ~ [XXXX]
Available when power up. Only available when EPROM check Available in every field, If overlay
successful. function is ON.
In Pa rt II, SCK freq. can be 1/2, 1/3, 1/4 or 1/5 pixel clock freq.
according to overlay resolution (2x2, 3x3, 4x4 or 5x5).
HSYNC
Overlay
312 pixels, 156 overlay bits
HREF
CS
Interface Timing
tF t HIGH tR
tLOW
SIO_C
SIO_D
IN
t BUF
tAA t DH
SIO_D
OUT
tCS
CS
tCSS tCSH
tSU tH
ESO
VALID IN
tV tHO tDIS
ESI
HI-Z HI-Z
spectrum_7950
5.00E+10
4.50E+10
4.00E+10
3.50E+10
Output(mv/w.s)
3.00E+10 R
2.50E+10 G
2.00E+10 B
1.50E+10
1.00E+10
5.00E+09
0.00E+00
395 495 595 695 795 895 995 1095
w av elength
Register Set
Table 7 provides a list and description of the Device Control registers contained in the OV7950/OV7451. The device slave
addresses are 60 for write and 61 for read.
AEC/AGC Control
Bit[7:3]: Reserved
04 AECL 88 RW
Bit[2:1]: AGC Gain Control - high 2 bits
Bit[0]: Exposure control LSB
Common Control 1
Bit[7]: Mirror function
0: Normal image
1: Mirror image
Bit[6]: Vertical flip function
0: Normal image
1: Vertically flip image
08 COM1 10 RW Bit[5]: Reserved
Bit[4]: VS pin output selection
0: Output signal depends on COM7[1] (0x15)
1: Output Odd field indicator
Bit[3]: Gamma function ON/OFF
0: Gamma OFF
1: Gamma ON
Bit[2:0]: Reserved
09 RSVD XX – Reserved
11 RSVD XX – Reserved
Common Control 4
Bit[7]: SRST
0: No change
12 COM4 50 RW 1: Initiates system reset and resets all registers to factory
default values after which the device resumes normal
operation
Bit[6:0]: Reserved
Common Control 6
Bit[7:5]: AGC max gain ceiling
000: 2x
001: 4x
010: 8x
011: 16x
100: 32x
101-111: Not allowed
Bit[4]: Reserved
14 COM6 80 RW
Bit[3:2]: Digital gain ceiling
00: 1x
01: 2x
10: 4x
11: Not allowed
Bit[1]: Reserved
Bit[0]: Exposure freeze ON/OFF
0: OFF
1: ON
Common Control 7
Bit[7:2]: Reserved
Bit[1]: VSYNC output selection
15 COM7 00 RW
0: Field VSYNC
1: Frame VSYNC
Bit[0]: Reserved
Common Control 8
Bit[7]: AEC/AGC algorithm selection
0: Average-based AEC/AGC control
1: Histogram-based AEC/AGC control
16 COM8 40 RW Bit[6]: Auto/Manual digital gain select
0: Auto digital gain
1: Manual digital gain
Bit[5:4]: Manual set digital gain [1:0]
Bit[3:0]: Reserved
Common Control 9
Bit[7]: Reserved
Bit[6]: VSYNC output pattern control
0: VSYNC can start at line start or half line
21 COM9 00 RW
1: VSYNC can only start at line start
Bit[5]: VSYNC output only in field one
Bit[4]: VSYNC output only in field two
Bit[3:0]: Reserved
Monitor
Bit[7:4]: Register monitor control (refer to descriptions of registers
66 MNTR 00 RW COM22 (0xED), COM23 (0xEE), COM24 (0xEF) and
COM25 (0xF0)
Bit[3:0]: Reserved
7C GAM1 0F RW Gamma Curve - 1st segment input end point 0x010 output value
7D GAM2 1F RW Gamma Curve - 2nd segment input end point 0x020 output value
7E GAM3 36 RW Gamma Curve - 3rd segment input end point 0x040 output value
7F GAM4 54 RW Gamma Curve - 4th segment input end point 0x080 output value
80 GAM5 5F RW Gamma Curve - 5th segment input end point 0x0A0 output value
81 GAM6 6A RW Gamma Curve - 6th segment input end point 0x0C0 output value
82 GAM7 74 RW Gamma Curve - 7th segment input end point 0x0E0 output value
83 GAM8 7C RW Gamma Curve - 8th segment input end point 0x100 output value
84 GAM9 84 RW Gamma Curve - 9th segment input end point 0x120 output value
85 GAM10 8C RW Gamma Curve - 10th segment input end point 0x140 output value
86 GAM11 9A RW Gamma Curve - 11th segment input end point 0x180 output value
87 GAM12 A7 RW Gamma Curve - 12th segment input end point 0x1C0 output value
88 GAM13 BF RW Gamma Curve - 13th segment input end point 0x240 output value
89 GAM14 D3 RW Gamma Curve - 14th segment input end point 0x2C0 output value
8A GAM15 E5 RW Gamma Curve - 15th segment input end point 0x340 output value
Brightness Control
A2 BRT 00 RW
• Range [00] to [FF}
V Start
Bit[1:0]: Zone 5
1 2 3 4
Bit[7:6]: Zone 12
Bit[5:4]: Zone 11
D3 ZONE3 FF RW 5 6 7 8
Bit[3:2]: Zone 10
Bit[1:0]: Zone 8
9 10 11 12
Bit[7:6]: Zone 16
Bit[5:4]: Zone 15
D4 ZONE4 FF RW 13 14 15 16
Bit[3:2]: Zone 14
Bit[1:0]: Zone 13
EC RSVD XX – Reserved
NOTE: All other registers are factory-reserved. Please contact OmniVision Technologies for reference register settings.
Package Specifications
The OV7950/OV7451 uses a 48-pin ceramic package (CLCC). Refer to Figure 14 and Table 8 for CLCC information and
Figure 15 for the sensor array center.
.088 – .011
.560 SQ + .012 / - .005 .065 – .007
.030 – .002
.430 SQ – .005 .440 – .005 .06 +.010
-.005
.015 – .002
.040 – .003
.350 SQ – .005 .020 – .002
42 31 31 42
.040 TYP
43 42 31 30 30 43
43 30
.022 – .004
.032
.001 to .005 TYP
MIN
.488
48 48 – .004 0.029 – .001 48
1 1 Glass 1
Die
Pin 1 .037 – .007
Index Image
6 Plane
19
6 19 19 .020 TYP 6
7 18 .012 TYP
REF
7 18 18 7
R .0075 .085 TYP
R .0075
(48 PLCS)
(4 CORNERS)
Package Edge to First Lead Center 1.524 + 0.25 / -0.13 .06 + .010 / - .005
Glass Size 12.40 + 0.10 SQ / 13.00 + 0.10 SQ .488 + .004 SQ / .512 + .004 SQ
A rray C enter
(-127.5 μm, 812.6 μm)
1 S c an Origin
4080 μm
3102 μm
S ens or
A rray
P ac kage C enter
(0,0)
Die
S c an E nd
P ac kage
TOP V IE W
300.0
Z1 Z2 Z3 Z4 Z5 Z6 Z7 end
280.0
260.0
240.0
220.0
200.0
180.0
Temperature ( C )
160.0
140.0
120.0
100.0
80.0
60.0
40.0
20.0
0.0 0.6 1.1 1.6 2.2 2.8 3.3 3.9
0.0
-22 -2 18 38 58 78 98 118 138 158 178 198 218 238 258 278 298 318 338 358 369
Time (sec)
-0.3 -0.1 0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9
Time (min.)
Condition Exposure
Average Ramp-up Rate (30°C to 217°C) Less than 3°C per second
Note:
• All information shown herein is current as of the revision and publication date. Please refer
to the OmniVision web site (http://www.ovt.com) to obtain the current versions of all
documentation.
• OmniVision Technologies, Inc. reserves the right to make changes to their products or to
discontinue any product or service without further notice (It is advisable to obtain current product
documentation prior to placing orders).
• ‘OmniVision’ and ‘OmniPixel’ are trademarks of OmniVision Technologies, Inc. All other trade,
product or service names referenced in this release may be trademarks or registered trademarks of
their respective holders. Third-party brands, names, and trademarks are the property of their
respective owners.
DESCRIPTION OF CHANGES
Initial Release (created using OV7950/OV7451 ver 1.3 (for auto apps) with the following
changes):
• Deleted “for Automotive Applications” from the title.
• Under Ordering Information, changed the part number from OV07950-Q10V and
OV07451-Q10V to OV07950-C10A and OV07451-C10A.
• Changed bullet list under Applications on page 1.
• Changed Figure 1 to show pinout diagram for CLCC package.
• Under Package Specifications on page 24, changed Figure 14 and Table 8 to show CLCC
package drawing and CLCC package dimensions table.
Omni ision TM
DESCRIPTION OF CHANGES
The following changes were made to version 2.3:
• Added Figure 13 (OV7950 Light Response graph) on page 15
• Under Features on page 1, changed second bullet from “Composite video (NTSC)
differential output drive” to “Composite video (NTSC) output”
Omni ision TM
DESCRIPTION OF CHANGES
The following changes were made to version 2.4:
• Under Key Specifications on page 1, changed Power Consumption from “TBD” to
“200 mW”
• Under Key Specifications on page 1, changed S/N Ratio from “TBD” to “48 dB”
• Under Key Specifications on page 1, changed Dynamic Range from “TBD” to “49 dB”
• Under Key Specifications on page 1, changed Dark Current from “TBD” to
“10 mW/s @ 60°C”
• Under Key Specifications on page 1, changed Fixed Pattern Noise from “TBD” to
“0.22% of VPEAK-TO-PEAK”
• In Table 1 on page 7, changed Default value for pin 02 from “TBD” to “–”
• In Table 1 on page 7, changed Default value for pin 03 from “TBD” to “–”
• In Table 1 on page 7, changed Default value for pin 06 from “TBD” to “–”
• In Table 2 on page 9, changed Min and Max for Operating temperature from “TBD” and
“TBD” to “-40°C” and “+85°C”, respectively.
• In Table 2 on page 9, deleted table row for Storage Humidity.
• In Table 3 on page 9, added the table footnote: “Exceeding the stresses listed may
permanently damage the device. This is a stress rating only and functional operation of the
sensor at these and any other condition above those indicated in this specification is not
implied. Exposure to absolute maximum rating conditions for any extended period may
affect reliability.”
• In Table 3 on page 9, changed Typ for Supply current (IDD) from “TBD” to “60”
• In Figure 8 on page 11, changed callout from “1.020 V” to “1.13V”