(HMI-LP-RT30 + R131-A - User Manual) A06 - EN

ASEM Open Automation Systems
USER’S GUIDE
HMI/LP/RT30 (R131/A)
Code 86060322
Version A06
Date 05.07.2017
ii
Revisions
Revisor Date Release

Mori – Fumagalli – Thei 17/10/2013 ES
Thei – Ugoni 23/10/2013
Mori - Ugoni 13/12/2013
22/01/2014 A0
Thei - Ugoni 05/06/2014 A01
Thei – Ugoni – Marchiol - Toso 26/05/2015 A03
Mori – Thei 07/11/2016 A04
Mori – Thei 01/12/2016 A05
Thei - Zamò 04/07/2017 A06
iii
Summary
SECTION 1 ........................................................................................................................................................................................................... 1
1 Preliminary Information ............................................................................................................................................................................. 1
1.1 General notes ....................................................................................................................................................................................2
1.2 Trademarks........................................................................................................................................................................................2
1.3 Instructions on disposal .....................................................................................................................................................................2
1.4 Description of safety symbols.............................................................................................................................................................3
1.5 Qualified Personnel ...........................................................................................................................................................................4
1.6 Basic knowledge required ..................................................................................................................................................................4
1.7 Proper use of the product ..................................................................................................................................................................4
1.8 Purpose of the user’s guide ................................................................................................................................................................4
1.9 The manual is a part of the system .....................................................................................................................................................4
1.10 Figures ...............................................................................................................................................................................................4
1.11 Scope of the operating instructions ....................................................................................................................................................5
1.12 Safety instructions .............................................................................................................................................................................5
1.12.1 Installation according to the instructions ..................................................................................................................................5
1.12.2 Hazardous areas .......................................................................................................................................................................6
1.12.3 Working on the control cabinet.................................................................................................................................................6
1.13 Notes about usage .............................................................................................................................................................................6
1.14 Applicable standard ...........................................................................................................................................................................6
SECTION 2 ........................................................................................................................................................................................................... 7
2 Description ................................................................................................................................................................................................ 7
2.1 Product description............................................................................................................................................................................8
2.2 Key features.......................................................................................................................................................................................8
2.3 Package .............................................................................................................................................................................................9
2.4 Front panels.....................................................................................................................................................................................10
2.4.1 Full aluminium front panel .......................................................................................................................................................... 11
2.4.2 TF front panel.............................................................................................................................................................................. 13
2.4.3 TFC front panel............................................................................................................................................................................ 15
2.4.4 LCD aspect ratio .......................................................................................................................................................................... 16
2.5 Rear view.........................................................................................................................................................................................17
2.6 Side view .........................................................................................................................................................................................19
2.7 Connector view ................................................................................................................................................................................ 20
2.7.1 Labels..........................................................................................................................................................................................21
2.8 Touchscreen .................................................................................................................................................................................... 22
2.9 Putting in operation HMI/LP/RT30 ................................................................................................................................................... 23
2.9.1 Configuration and project creation .............................................................................................................................................. 23
2.9.2 Process management .................................................................................................................................................................. 23
SECTION 3 ......................................................................................................................................................................................................... 25
3 Installation and connection ...................................................................................................................................................................... 25
3.1 Preparation for installation .............................................................................................................................................................. 26
3.1.1 Select the mounting location ....................................................................................................................................................... 26
3.1.2 Portrait Mounting ....................................................................................................................................................................... 26
3.2 Checking the package contents ........................................................................................................................................................ 26
3.3 Checking the operating conditions ................................................................................................................................................... 26
3.4 Mounting position ........................................................................................................................................................................... 27
3.4.1 Damage due to overheating ........................................................................................................................................................ 27
3.5 Checking installation distances......................................................................................................................................................... 28
3.6 Preparing the mounting cut-out ....................................................................................................................................................... 28
3.6.1 Degrees of protection .................................................................................................................................................................. 29
3.6.2 Cut-out measures ........................................................................................................................................................................ 29
3.7 Mounting the device ........................................................................................................................................................................ 30
3.7.1 Position of the mounting clamps ................................................................................................................................................. 30
3.7.1 Tools to tighten the mounting clamps.......................................................................................................................................... 30
3.7.2 Procedure ................................................................................................................................................................................... 31
3.8 Connecting the device ...................................................................................................................................................................... 34
3.8.1 Notes on connection ................................................................................................................................................................... 34
3.8.2 Power supply connection ............................................................................................................................................................ 34
3.8.3 Switching on and testing the device............................................................................................................................................. 35
3.9 Connecting the configuration PC ...................................................................................................................................................... 36
3.9.1 Procedure ................................................................................................................................................................................... 39
SECTION 4 ......................................................................................................................................................................................................... 41
4 Commissioning the device ........................................................................................................................................................................ 41
4.1 Storage ............................................................................................................................................................................................42
4.2 Internal NAND memory.................................................................................................................................................................... 43
4.3 Slot for memory card ....................................................................................................................................................................... 44
4.4 Installation/removal of a memory card ............................................................................................................................................ 44
SECTION 5 ......................................................................................................................................................................................................... 47
5 Commissioning a project .......................................................................................................................................................................... 47
5.1 Premium HMI project....................................................................................................................................................................... 48
5.1.1 Overview .................................................................................................................................................................................... 48
iv
5.1.2 Transfer ......................................................................................................................................................................................48

5.1.3 Configuring the serial port ........................................................................................................................................................... 48
5.1.4 Connecting the serial port ........................................................................................................................................................... 50
5.1.5 Managing the project .................................................................................................................................................................. 50
5.1.6 Stopping the running project ....................................................................................................................................................... 51
5.1.7 Starting the project ..................................................................................................................................................................... 52
5.1.8 Debugging the project ................................................................................................................................................................. 53
5.1.9 Trasfer the project from HMI/LP30 to the configuration PC.......................................................................................................... 55
5.1.10 Backup and restore ................................................................................................................................................................. 56
5.1.11 Updating the operating system ............................................................................................................................................... 56
5.2 Ubiquity project ............................................................................................................................................................................... 57
5.2.1 Connections ................................................................................................................................................................................ 57
5.3 CODESYS Soft PLC project................................................................................................................................................................. 58
5.3.1 LP30 CODESYS Implementation ................................................................................................................................................... 58
5.3.2 Preparing the CODESYS programming environment ..................................................................................................................... 59
5.3.3 Transferring the CODESYS application to the target system.......................................................................................................... 61
5.3.4 I/O Fieldbus ................................................................................................................................................................................ 61
5.3.5 Support for retentive data ........................................................................................................................................................... 62
5.3.6 Use in combination with Premium HMI Runtime ......................................................................................................................... 65
5.3.7 Limitations and Recommendations.............................................................................................................................................. 67
SECTION 6 ......................................................................................................................................................................................................... 69
6 Maintenance and care.............................................................................................................................................................................. 69
6.1 Calibration of the touchscreen ......................................................................................................................................................... 70
6.2 Maintaining & cleaning .................................................................................................................................................................... 71
6.2.1 Procedure ................................................................................................................................................................................... 72
6.2.2 Backup battery replacement (CR2032 3V) .................................................................................................................................... 72
6.3 Recycling and disposal ..................................................................................................................................................................... 75
SECTION 7 ......................................................................................................................................................................................................... 77
7 Technical specifications ............................................................................................................................................................................ 77
7.1 Technical specifications.................................................................................................................................................................... 78
7.2 display characteristics ...................................................................................................................................................................... 81
7.2.1 5.7” display characteristics .......................................................................................................................................................... 81
7.2.2 7.0”W display characteristics ....................................................................................................................................................... 81
7.2.5 10.1”W display characteristics ..................................................................................................................................................... 82
7.2.6 10.4” display characteristics ........................................................................................................................................................ 82
7.2.7 12.1” (SVGA) display characteristics............................................................................................................................................. 83
7.2.8 12.1” (XGA) display characteristics .............................................................................................................................................. 83
7.2.9 12.1”W (WXGA) display characteristics ........................................................................................................................................ 83
7.2.10 15.0” (XGA) display characteristics .......................................................................................................................................... 84
7.2.11 15.6”W (WXGA) display characteristics ................................................................................................................................... 84
7.3 Certificates and approvals ................................................................................................................................................................ 85
7.4 Dimension drawings ........................................................................................................................................................................ 86
7.4.1 5.7” .............................................................................................................................................................................................86
7.4.2 5.7” TF ........................................................................................................................................................................................87
7.4.3 7.0”W .........................................................................................................................................................................................88
7.4.4 7.0”W TF .....................................................................................................................................................................................88
7.4.5 8.4” .............................................................................................................................................................................................89
7.4.6 8.4” TF ........................................................................................................................................................................................89
7.4.7 10.1” W .......................................................................................................................................................................................90
7.4.8 10.1” W TF .................................................................................................................................................................................. 91
7.4.9 10.1” W TFC ................................................................................................................................................................................ 92
7.4.10 10.4” ......................................................................................................................................................................................93
7.4.11 10.4” TF .................................................................................................................................................................................. 93
7.4.12 12.1” ......................................................................................................................................................................................94
7.4.13 12.1” TF .................................................................................................................................................................................. 94
7.4.14 12.1” W .................................................................................................................................................................................. 95
7.4.15 12.1” W TF .............................................................................................................................................................................. 96
7.4.16 12.1” W TFC ............................................................................................................................................................................ 97
7.4.17 15.0” ......................................................................................................................................................................................98
7.4.1 15.0” TF.......................................................................................................................................................................................98
7.4.2 15.6” W .......................................................................................................................................................................................99
7.4.3 15.6” W TF .................................................................................................................................................................................. 99
7.5 Ports PINOUT ................................................................................................................................................................................. 100
7.5.1 COM1 – DB15M Serial ............................................................................................................................................................... 100
7.5.2 LAN1 – LAN2 ............................................................................................................................................................................. 100
7.5.3 USB1 / USB2.............................................................................................................................................................................. 101
7.6 Technical support & repairs............................................................................................................................................................ 101
v
1
HMI/LP/RT30 User’s guide
SECTION 1
1 Preliminary
Information
2
SECTION 1 – Preliminary Informations
1.1 General notes

a) The information in this manual is subject to change and is in no way
binding upon ASEM S.p.A.
b) ASEM S.p.A. is not responsible for technical errors or other omissions in
the manual, and shall not accept any responsibility deriving from its use.
1.2 Trademarks
a) All brands and product names mentioned in this manual are trademarks
of their respective owners.
1.3 Instructions on disposal
• Il simbolo sul prodotto o sulla confezione indica che il prodotto non

deve essere considerato come un normale rifiuto domestico, ma deve
essere portato nel punto di raccolta appropriato per il riciclaggio di ap-
parecchiature elettriche ed elettroniche. Provvedendo a smaltire questo
prodotto in modo appropriato, si contribuisce a evitare potenziali conse-
guenze negative per l’ambiente e la salute, che potrebbero derivare da
uno smaltimento inadeguato del prodotto. Per informazioni più detta-
IT gliate sul riciclaggio di questo prodotto, contattare l’ufficio comunale, il
servizio locale di smaltimento rifiuti o il fornitore da cui è stato acquista-
to il prodotto.
• The symbol on the product or in its packaging indicates that this

product may not be treated as household waste. Instead it shall be
handed over the applicable collection point for the recycling of electrical
and electronic equipment. By ensuring this product is disposed of cor-
rectly, you will help prevent potential negative consequences for the en-
vironment and human health, which could otherwise be caused by inap-
EN propriate waste handling of this product. For more detailed information
about recycling of this product, please contact your local city office, your
household waste disposal service or the supplier where you purchased
the product.
• Le symbole sur le produit ou son emballage indique que ce produit

ne peut être traitè comme décher ménager. It doit être remis au point
de collecte dèdié à cet effect (collect et recyclage du matèriel èlectrique
et èlectronique). En procèdant à la mise à la casse règlementaire de
l’appareil, nous prèservons l’environnement et notre sécurité, s’assurant
ainsi que les dèchets seront traitès dans des conditions appropriées.
FR Pour obtenir plus de dètails sur le recyclage de ce produit, veuillez
prendre contact avec les services de votre commune ou le distributeur
où vous avez effectué l’achat.
3
DE
• Das Symbol auf dem Produkt oder seiner Verpackung weist darauf
hin, dass dieses Produkt nicht als normaler Haushaltsabfall zu behandeln
ist, sondern an einem Sammelpunkt für das Recycling von elektrischen
und elektronischen Geräten abgegeben werden muss. Durch ihren Bei-
trag zum korrekten Entsorgen dieses Produkts schützen Sie die Umwelt
und die Gesundheit Ihrer Mitmenschen. Umwelt und Gesundheit
werden durch falsches Entsorgen gefährdet. Weitere Informationen über
das Recycling dieses Produkts erhalten Sie von Ihrem Rathaus, Ihrer Mül-
labfuhr oder den Distributoren, in dem Sie das Produkt gekauft haben.
ES
• El simbolo en el producto o en su embalaje indica que este produc-
to no se puede tratar como desperdicios normales del hogar. Este pro-
ducto se debe entregar al punto de recolección de equipos eléctricos y
electrónicos para reciclaje. Al asegurarse de que este producto se dese-
che correctamente, usted ayudará a evitar posibles consequencias nega-
tivas para el ambiente y la salud pública, lo qual podria ocurrir si este
producto no se manípula de forma adecuada. Para obtener informació-
nes mas detalladas sobre el reciclaje de este producto, póngase en con-
tacto con la adMinistraciòn de su ciudad, con su servicio de desechos del
hogar o con el surtidor donde comprò el producto.
PT
• simbolo no produto ou na embalagem indica que este producto não

pode ser tratado como lixo doméstico. Em vez disso, deve ser entre-
gueado ao centro de recolha selectiva para a reciclagem de equipamen-
to electrico e electronico. Ao garantir uma eliminação adequada deste
produto, ira ajudar a evitar eventuais consequencjas negativas para o
meio ambiente e para a saude publica, que, de outra forma, poderiam
ser provocadas por un tratamento incorrecto do produto. Para obtener
informações mais detalhadas sobre a reciclagem deste produto, contac-
te os serviços municipalizados locais, o centro de recolha selectiva da
sua area de residência ou no distribuidor onde adquirir ou produto.
1.4 Description of safety symbols
This symbol indicates a danger to life or health of personnel.

Danger
This symbol indicates a danger to the hardware and / or the en-

vironment.
Attention
This symbol indicates an additional information meant to provide

a better understanding.
Note
4
1.5 Qualified Personnel

a) HMI/LP/RT30 may be operated only by personnel qualified for the spe-
cific task in accordance with the relevant documentation for the specific
task, in particular its warning notices and safety instructions.
b) Qualified personnel are those who, based on their training and experi-
ence, are able to identify risks and avoid potential hazards when working
with these systems.
1.6 Basic knowledge required

a) To understand operating instructions a general knowledge of automa-
tion technology is needed.
b) Knowledge of personal computers and the Microsoft operating system is
required to understand this user’s guide.
1.7 Proper use of the product

a) ASEM products may only be used for the applications described in the
catalogue and in the technical documentation.
b) If products and components from other manufacturers are used, these
must be approved by Asem.
c) Proper transport, assembly, installation, storage, commissioning, opera-
tion and maintenance are required to ensure that the product operates
safely.
d) The indicated environmental conditions must be observed.
e) The information in this user’s manual must be observed.
1.8 Purpose of the user’s guide

a) This user’s manual contains information based on the requirements de-
fined by DIN EN 62079 for mechanical engineering documentation.
b) These operating instructions are intended for:
1. Users.
2. Commissioning engineers.
3. Maintenance personnel.
c) Pay attention at the information in the chapter "Safety instructions".
d) More information such as operating instructions, examples and refer-
ence information, are available in the online help of Premium HMI 3
software and Ubiquity software.
1.9 The manual is a part of the system

a) This user’s guide belongs to HMI/LP/RT30 and is also required for com-
missioning.
b) Keep all supplied documentation for the entire service life of
HMI/LP/RT30.
1.10 Figures
a) This manual contains illustrations of the described devices.
b) Some details of the illustrations may differ from the device provided.
5
1.11 Scope of the operating instructions

c) The operating instructions apply to the HMI/LP/RT30 family devices in
conjunction with the Premium HMI 3 software, LP30 family and RT30
family.
The devices are the following:
5.7”
7.0” W
8.4”
HMI30 10.1” W
LP30 10.4”
RT30 12.1”
12.1” W
15.0”
15.6” W
5.7”
7.0” W
8.4”
HMI30-TF 10.1” W
LP30-TF 10.4”
RT30-TF 12.1”
12.1” W
15.0”
15.6” W
7.0” W
HMI30-TFC
10.1” W
LP30-TFC
12.1” W
RT30-TFC
15.6” W
1.12 Safety instructions
1.12.1 Installation according to the instructions

• Commissioning the device is prohibited until it has been absolutely en-
sured that the system in which the device is to be installed complies with
all the applicable EU and international regulation.
6
1.12.2 Hazardous areas

• For use of HMI/LP/RT30 in hazardous areas in zone II 3 G D (zone 2/22),
please read carefully the ATEX User Guide cod.86060139, included in
printed copy into the package or downloadable from the company web
site www.asem.it.
• Do not use HMI/LP/RT30 in other hazardous areas not defined in the
ATEX User’s Guide.
1.12.3 Working on the control cabinet

• Open equipment
The device is open equipment. This means that the HMI/LP/RT30 may
only be integrated in housings or cabinets, where it can be operated
from the front panel.
The cabinet in which HMI/LP/RT30 is installed may only be accessed with
a key or tool and only by trained and authorized personnel.
• Dangerous voltage
Opening the cabinet may expose high voltage parts. Before opening the
cabinet always disconnect the power.
1.13 Notes about usage

• HMI/LP/RT30 is approved for indoor use only.
• HMI/LP/RT30 may be damaged if operated outdoors.
1.14 Applicable standard

Please refer to section 8 for details about the relevant standards.
7
SECTION 2
2 Description
8
SECTION 2 - Description
2.1 Product description
The HMI30 family is the HMI solution with RISC architecture that allows running
Premium HMI3 and Ubiquity software platforms.
The LP30 family is the HMI & Control solution that integrates the Premium HMI
visualization software and the CODESYS Soft PLC Runtime (from 3S Software
GmbH) integrating in one single product both the visualization and the process
control part. .
RT30 family includes only the operating system.
Based on ARM Cortex A8 processor and Microsoft Windows Embedded Com-

pact 7 (C7P) operating system, HMI30/LP30 are available in BASIC or ADVANCED
version according to Premium HMI runtime installed. The CODESYS license type
is of one unique type and enables all the features at ones except for the Soft
Motion which is not supported.
The systems can have standard (HMI30/LP30) or true flat (HMI30-TF/LP30-TF)
front frame.
2.2 Key features
KEY FEATURES HMI30 LP30 RT30

O.S. Microsoft Windows Embedded
Compact 7 (C7P) installed on flash X X X
memory.
Asem Premium HMI Runtime X X -
Asem Ubiquity Runtime X X Option
CODESYS Soft PLC Runtime V3.x
- X -
Soft Motion NOT supported
CPU ARM CORTEX A8 architecture X X X
Multiple mass memories support:
• NAND: write security memory used
to store O.S. and HMI executables
• eMMC: fast access memory used X X X
for some applications (e.g.
CoDeSys) and user data
• SD (socket): removable memory
Frontal IP 66 X X X
Micro UPS Option X Option
9
2.3 Package
HMI/LP/RT30 package consists of:
HMI/LP/RT30 system HMI LP RT
User’s guide CD X X X
n.10 Clamps with grub
screw (depending of the X X X
LCD size)
n.1 hex key 1.5mm X X X
n.1 Power supply plug X X X
CODESYS software CD - X -
ATEX user’s guide Printed copy x x x

10
2.4 Front panels

The system is available with three different kinds of frontal panel:
• Full aluminium.
• Aluminium with True Flat technology. (TF)
• Aluminium with True Flat technology and Single touch. (TFC)
Figure 1
Full aluminium front panel detail
Figure 2
TF front panel detail
Figure 3
TFC front panel detail
11
2.4.1 Full aluminium front panel

HMI/LP/RT30 (full aluminium front panel) is available in the following sizes:
• 5.7”
• 7.0” W
• 8.4”
• 10.1” W
• 10.4”
• 12.1”
• 12.1” W
• 15.0”
Figure 4
Full aluminium front panel detail • 15.6” W
(in the figure is shown as an example a
15.0" display)
4 3
1 Full aluminium front panel

2 Touchscreen display
3 IP66 protected USB
4 On/Off/Standby/UPS LED
• The full aluminium front panel has a “step” between the front panel
and the touchscreen.
Figure 5
Front panel “Step” detail
Step
Table 1
Full aluminium features
Features
Index of protection IP66
Back Seal type EPDM
Metal housing EN AW-5754, H22 EN 485-1
12
Figure 6
Construction detail.
1
1 Back seal
2 Touchscreen
3 Metal housing
13
2.4.2 TF front panel

Figure 7
HMI/LP/RT30-TF (aluminium front panel with true flat technology) is available in
TF panel. the following sizes:
15.0" display) • 5.7”
• 7.0” W
• 8.4”
• 10.1” W
• 10.4”
• 12.1”
• 12.1” W
• 15.0”
• 15.6” W
Figure 8 2
TF front panel “No Step” detail
4 3
1 Aluminium front panel with top polyester film

2 Touchscreen display
3 IP66 protected USB
• The front panel with true flat technology has no “step” between the
front panel and the touchscreen, therefore it can be easily cleaned.
The polyester top-film covers the resistive touchscreen up to the alu-
minium border.
NO Step
14
Features
Table 2 Index of protection IP66
TF features Seal type EPDM
Front laminate Polyester
Metal housing EN AW-5754, H22 EN 485-1
Figure 9
1 Back seal
2 Metal housing
3 Touchscreen
4 Front laminate
15
2.4.3 TFC front panel

HMI/LP/RT30-TFC (aluminum and glass front panel with true flat technology
with single touch touchscreen) is available in the following sizes:
• 7.0” W
• 10.1” W
• 12.1” W
• 15.6” W
Figure 10
TFC front panel.
15.6" W display)
1
1 Aluminum and tempered glass TrueFlat

2 Projective capacitive multitouch
The front panels with true flat technology contain a Projective capacitive multi-
touch touchscreen that is handled by a USB controller within the system.
Figure 11
TFC front panel “No step” detail
Table 3
TFC features NO Step
Features
Index of protection IP66K
Seal type EPDM
Front laminate Glass
Metal housing Aluminium alloy 5754
16
4
3
Figure 12
1 Back seal
2 Metal housing
3 Touchscreen
4 Cover glass
2.4.4 LCD aspect ratio

There are different LCD aspect ratios depending of the frontal panel sizes:
Panel size Aspect ratio

5.7” 4:3
7.0” W 15 : 9
8.4” 4:3
10.1” W 16 : 10
Table 4
10.4” 4:3
LCD aspect ratio
12.1” 4:3
12.1” W 16 : 10
15.0” 4:3
15.6” W 16 : 9
17
2.5 Rear view
Figure 13 2
HMI/LP/RT30 5.7” rear view
1
1 Aeration holes
2 Mounting seal
Note: rear panels may be different

depending on display size.
Figure 14
2
1
Note: the user manual refers to

HMI/LP/RT/RT 5.7” version. Other versions
will be discussed only when necessary.
7.0”
1 Aeration holes
2 Mounting seal
18
Figure 15
1 Aeration holes
2 Mounting seal
19
2.6 Side view
1
1
1
2
Figure 16
HMI/LP/RT30 5.7” side view 2
1 Aeration holes
2 Recess for fixing clamps
1 1
Figure 17 2
HMI/LP/RT30 5.7” side view 2
2
1
1 Aeration holes
2 Recess for fixing clamps
20
2.7 Connector view

9 8 7 6 5
Figure 18
HMI/LP/RT30 5.7” connectors
1 2 3 4
1 Power DC input 6 LAN1 (100 Mbps) Fieldbus

2 USB2 (2.0) 7 LAN2 (10/100 Mbps)
Ubiquity
3 Reset button 8 Power on LED
4 SD card slot 9 USB1 (2.0)
5 COM 1 (RS232/422/485 MPI)
For detailed description refer to section 8.

21
2.7.1 Labels
On the rear panel are present the following labels:
• Connectors label
• CE label
• ATEX label (please refer to ATEX User Guide code 86060139).
Figure 19
HMI/LP/RT30 connectors label detail
5
2
3 6
4 7
Figure 20
HMI/LP/RT30 label detail
1 Model
2 Code bar
3 Serial number
4 Electrical information
5 UL marking
6 CE marking
7 Disposal
Figure 21
Example of ATEX label
For details on the marking, please refer to ATEX User Guide code 86060139
22
2.8 Touchscreen
Size Touchscreen Panel technology

5.7” The touchscreen is installed from the back of the
4 - wire
7.0” W front panel. There is a step between the front
8.4” 5 - wire panel and the touchscreen.
10.1” W 5 – wire The user touches directly the touchscreen.
Standard 10.4”
12.1” 5 – wire
12.1” W
15.0” 5 – wire
15.6” W 5 – wire
5.7” The touchscreen is fully planar with the alumini-
4 – wire
7.0” W um front panel. No step. The touchscreen is cov-
Table 5 8.4” 5 – wire ered by an overlay film (polyester) which is glued
Touchscreen 10.1” W 5 – wire to the touchscreen with an optically clear adhe-
True Flat 10.4” 5 – wire sive (OCA) for improved optical performance
12.1” 5 – wire
12.1” W 5 – wire
15.0” 5 – wire
15.6” W 5 – wire
7.0” W The touchscreen is fully planar with the alumini-
10.1” W P-CAP um front panel. No step. The touchscreen is cov-
TFC 12.1” W projected ered by an overlay film (polyester) which is glued
15.6” W capacitive to the touchscreen with an optically clear adhe-
sive (OCA) for improved optical performance
23
2.9 Putting in operation HMI/LP/RT30

To put in operation HMI/LP/RT30 the followings two phases must be done:
● Configuration and creation of the project of HMI/LP/RT30.

● Process management.
2.9.1 Configuration and project creation
During the configuration phase, you create the user interfaces for operation
and monitoring of the technical process by using a PC on which is installed Pre-
mium HMI development environment. Configuration also includes:
• Creating the project.

• Saving the project.
• Testing the project.
• Simulating the project.
After compiling the configuration, you load the project into the HMI/LP/RT30
device.
Figure 22
Configuration and project creation
2.9.2 Process management
Process management is a two-way communication between HMI device and

PLC.
Figure 23
Process management
24
25
SECTION 3
3 Installation and
connection
26
SECTION 3 – Installation and connection
3.1 Preparation for installation
3.1.1 Select the mounting location
Points to observe when selecting the mounting location:

a) Position HMI/LP/RT30 to avoid exposure to direct sunlight.
b) Position HMI/LP/RT30 such that it is ergonomically accessible for the op-
erator.
c) Choose a suitable mounting height.
d) Ensure that the Aeration holes are not covered.
e) For installation in ATEX II 3 G D zone (zone 2/22), please follow the in-
structions included in ATEX User Guide code 86060139.
3.1.2 Portrait Mounting

• HMI/LP/RT30 can be mounted in portrait mode; the display can be ro-
tate according to the mounting position using the dedicated utility from
Note: the panel control panel.
please refer to paragraph 2.3 Package. • From the Start menu, select "Settings" and then "Control Panel"; the dis-
play rotation utility is available from "Freescale Display Driver".
Remarque: • Double click on the icon to get the window from where you can select
Veuillez vous reporter au paragraphe 2.3.
the desired orientation.
• The selection is immediately applied and does not require to be saved in
the registry.
3.2 Checking the package contents
• Check the package content for visible signs of transport damage and for
completeness.
• In the case of damaged parts, contact your ASEM representative. Do not
install parts damaged during shipment.
3.3 Checking the operating conditions

• Read carefully the standards, approvals, EMC parameters and technical
specifications for operation of the HMI device. This information is availa-
ble in the following sections:
o Certificates and approvals (see section 8).
o Electromagnetic compatibility (see section 8).
• Check the mechanical and climatic ambient conditions for operation of
the HMI device: Ambient conditions (see section 8).
• Follow the instructions for local use of the HMI device: Notes about us-
age.
• Adhere to the permissible rated voltage and the associated tolerance
range:
o 24V
o Range: 18÷36 VDC
27
3.4 Mounting position

The HMI device is suitable for installation in:
• Mounting cabinets
• Control cabinets
• Switchboards
• Consoles
3.4.1 Damage due to overheating

• The operative temperature must be between 0° and 50°C.
• All HMI systems are designed for vertical mounting position.
• An inclined installation reduces the thermal convection by the HMI de-
vice and the maximum permissible ambient temperature for operation.
Please contact ASEM for details.
• The HMI device may otherwise be damaged and its certifications and
Note: warranty will be void.
For installation in control cabinets and, in
particular, in closed containers, make sure
the recommended ambient temperature is
maintained.
For further details please refer to section
8.1 Technical specifications.
Remarque:
Pour l'installation dans des armoires de
commande et en particulier dans des récip-
ients fermés, s'assurer que la température
ambiante recommandée est maintenue.
Pour plus de détails, voir la section 8.1 Ca-
ractéristiques techniques.
Figure 24
Mounting position
28
3.5 Checking installation distances

To ensure adequate Aeration it is necessary leaving the following open spaces
around the system:
• X direction 15 mm (min.) for each side.

• Y direction 50 mm (min.) for each side.
• Z direction 100 mm (min.).
Figure 25
Z
Installation distances X
3.6 Preparing the mounting cut-out

In order to ensure a proper mounting of the system, the material of the mounting
cut-out must be sufficiently stable.
To obtain the degree of protection described below, the material of the mounting
panel must not deform due to the use of clamps on the operator panel.
29
3.6.1 Degrees of protection

The degrees of protection of the system are guaranteed only if the following con-
ditions are satisfied:
• Material thickness at the mounting cut-out for IP66 protection: 2mm to 6
mm.
• Deviations of the plane of the mounting cut-out limits: ≤ 0.5 mm.
This condition must be satisfied even when the HMI/LP/RT30 is installed.
• Allowed surface roughness in the area of the seal: ≤ 120 microns (Rz 120).
3.6.2 Cut-out measures
Figure 26
cut-out
HMI LP
RT30 CUT OUT "A" CUT OUT "B"
Weight
LCD TFT A B C D A B C D H F
(Kg)
5,7" 175 145 164 134 - - - - 5 40 0,9
7"W 215 155 204 144 204 147,6 197 140,5 5 40 1,2
8,4" 255 190 243 179 - - - - 5 48,5 1,4
10,1"W 293 201,5 285 193,5 - - - - 5 48,5 1,6
10,4" 295 230 283 219 - - - - 5 48,5 1,8
12,1" 325 260 313 249 - - - - 5 48,5 2,1
12,1"W 321 222,5 313 215 - - - - 5 48,5 2,0
15" 390 305 378 294 - - - - 6 48,5 3,3
15,6"W 420 265 410 255 - - - - 6 48,5 3,3
HMI LP
RT30-TF CUT OUT "A" CUT OUT "B"
Figure 27
Weight
HMI/LP/RT/RT30 cut-out LCD TFT A B C D A B C D H F
(Kg)
5,7" 175 145 164 134 - - - - 5 40 0,9
7"W 215 155 204 144 204 147,6 197 140,5 5 40 1,2
8,4" 255 190 243 179 - - - - 5 48,5 1,4
10,1"W 293 201,5 285 193,5 - - - - 5 48,5 1,6
10,4" 295 230 283 219 - - - - 5 48,5 1,8
12,1" 325 260 313 249 - - - - 5 48,5 2,1
12,1"W 321 222,5 313 215 - - - - 5 48,5 2,0
15" 390 305 378 294 - - - - 6 48,5 3,3
15,6"W 420 265 410 255 - - - - 6 48,5 3,3
HMI LP
RT30-
TFM CUT OUT "A" CUT OUT "B"
Weight
LCD TFT A B C D A B C D H F
(Kg)
7"W - - - - 204 147,6 197 140,5 4 40 1,2
10,1"W 293 201,5 285 193,5 - - - - 5 48,4 1,6
12,1"W 331 222,5 313 215 - - - - 5 48,4 2,0
15,6"W 433 267 410 255 - - - - 6 48,4 3,3
30
3.7 Mounting the device
3.7.1 Position of the mounting clamps
• To obtain the declared degree of frontal protection for the system, it is nec-
essary to respect the positions of the clamps shown below.
• The table below shows the number and the position of the clamps for each
HMI/LP/RT30 size.
Note: System Clamp Quantity Clamp position

For use on a flat surface of a Type 1 and 4x
INDOOR Enclosure.
Remarque:
5.7”
Pour une utilisation sur une surface plane 7
7.0”
d'un boîtier de type 1 et 4x INTÉRIEUR.
8.4” 8
Table 6
Position of the mounting clamps
10.1”
10.4”
12.1” 10
15.0”
15.6”
3.7.1 Tools to tighten the mounting clamps

• 1.5 mm hexagonal key.
31
3.7.2 Procedure
1. Insert HMI/LP/RT30 into the mounting cut-out from the front.
Figure 28
Installation
Figure 29
Installation
32
Figure 30
Installation
2. Insert the fixing clamps into the housings of the device.
Figure 31
Installation
Figure 32
Installation
33
3. Tighten the fixing clamps with a 1.5 mm hex key.
Note:
Value of tightening torque: 0.2 Nm.
Remarque:
Valeur du couple de serrage: 0,2 Nm.
Figure 33
Installation
4. Repeat steps 2 and 3 for all mounting clamps.

5. Check the seal seat.
34
3.8 Connecting the device
3.8.1 Notes on connection

• HMI/LP/RT30 must be installed in accordance with the indications contained
in this operating instructions.
• These devices are intended to be connected to a “Secondary Circuit Over-
voltage Category II”
3.8.2 Power supply connection

The device may only be connected to a 24V (maximum permissible oper-
ating voltage range 18V to 36V) power supply which satisfies the requirements of
safe extra low voltage (SELV) in accordance with IEC/EN/DIN EN/UL60950-1.
The power supply has to fulfil the requirements NEC Class2 or LPS in accordance
with IEC/EN/DIN EN/UL60950-1
Connect the device with a copper conductor cable cross-section of 0.75 – 1.5
2
mm (AWG18 to AWG16 suitable at least 75C°).
• Remove the three poles connector from the system.

• Connect the positive wire to the positive terminal of the three pole connect-
or.
• Connect the negative wire to the negative terminal of the three pole con-
nector
• Connect the earth ground wire to the ground terminal of the three pole con-
Attention: the system must be nector
powered with a voltage of 24V (18V÷36V).
(also refer to the label on the back of the system)
Attention: le système doit être alimenté
avec une tension de 24V (18V ÷ 36V)
Figure 34
Power supply connection detail
Earth Ground
- (0V)
+ (24V)
35
Figure 35
3.8.3 Switching on and testing the device
• Connect the power supply cable to the system.

• Switch On the power supply.
• The power supply LED becames green (red if LP30 or with MicroUPS installed
and subsequently green).
Figure 36
• The system begins boostrap.

36
3.9 Connecting the configuration PC
You can connect the configuration PC to HMI/LP30 in several ways:

1) By using a Ethernet cross cable connected by one end to the configura-
tion PC and on the other end to one of two Ethernet ports of HMI/LP30.
2) By connecting HMI/LP30 to a Ethernet switch on which the configuration
PC and HMI/LP30 are both connected
3) By connecting HMI/LP30 and the configuration PC to the office LAN
Please note that HMI/LP30 comes with DHCP service enabled. It means that in
case of the point 3 above it is enough to connect HMI/LP30 in LAN and the DHCP
server of the LAN will assign automatically an IP address to HMI/LP30.
In case there is not a DHCP server available, you must assign a static IP address to
HMI/LP30 compatible with the IP address of the configuration PC.
For Example if the PC has IP address 172.17.17.20 you must configure for exam-
ple HMI/LP/RT30 with the IP address 172.17.17.182. To configure the IPC address
in the panel you must:
• Click on the start Button, select “Settings” -> “Network and Dial-up Con-
nections”
Figure 37
Connecting the configuration PC
• According to the Ethernet port you want to configure choose the port to
configure according to the table:
LAN port on HMI/LP30 LAN Connection in control panel

Table 7
Connecting the configuration PC LAN1 General purpose
LAN2 Ubiquity
• For instance if you need to configure LAN1 double click on FEC1, Click on
“Specify an IP address” and write the IP address and default Gateway
like in the figure below
37
Figure 38
• Click on Ok to save the settings.

• Click on the “Start” button and select “Settings” -> “Control Panel”
Figure 39
38
• Then double click on “Registry Saver”
Figure 40
• Click on the “Save” button and confirm clicking on “Ok”. This operation
will save your setting in a permanent way.
Figure 41
39
3.9.1 Procedure
After the connection between HMI/LP/RT30 and the configuration PC, to transfer
the project into HMI/LP/RT30 you must:
• Start Premium HMI Developing tool.
• Load the project to transfer.
• Click on the transfer icon (see picture below).
Figure 42
The following window will appear:
Figure 43
Attention: please transfer the pro-

ject into the MMC Memory or into the SD
card. This allows you not to lose its content
when HMI/LP/RT30 will be switched off.
To transfer the project into the MMC
Memory, you must specify MMC Memory
(like in the example of the picture above).
Attention: veuillez transférer le projet dans

la mémoire MMC ou dans la carte SD. Cela
vous permet de ne pas perdre son contenu • Select TCP in the upper left list.
lorsque HMI / LP / RT30 est éteint.
Pour transférer le projet dans la mémoire • Write the IP address of HMI/LP/RT30
MMC, vous devez spécifier la mémoire • Choose where to download the project into HMI/LP/RT30 specifying the
MMC (comme dans l'exemple ci-dessus). “Upload Device Path”.
• To transfer the project to HMI/LP/RT30 click on the button “Upload Pro-
ject!”.
There is another possibility to transfer the project to the panel. It is by using an
USB key.
• Copy from the configuration PC to the USB Key the folder in which is
stored the HMI/LP/RT30 project.
• Insert the USB Key into HMI/LP/RT30
• Copy the project folder from the USB Key to the MMC memory.
40
Note: the name of the memory card are according to the following table:
Name used by Windows Note

Memory
Explorer
NAND NAND Flash Internal memory used to store the operat-
Table 8
ing system. It is a read only memory.
Procedure
MMC MMC Memory Memory to store data and executables.
Read and Write memory.
SD SD Memory Removable Memory. Read and Write
memory.
USB Key Hard Disk USB key inserted into a USB port of
HMI/LP/RT30.
In the picture below an example of file Explorer on HMI/LP/RT30.
Figure 44
41
SECTION 4
4 Commissioning the
device
42
SECTION 4 – Commissioning the device
4.1 Storage
HMI/LP/RT30 comes as standard with 2 memories: a NAND Flash and a e-MMC

memory. The purpose of the NAND memory is to store the boot loader (used
during the start-up of HMI/LP/RT30), the operating system and all the executa-
ble needed to HMI/LP/RT30. Writing to the NAND memory can be switched ON
and OFF by means of a special program in order to protect the integrity of the
date stored into the NAND memory.
The eMMC memory can be used to store other data, like process data or other
executable. It is not possible to disable writing into eMMC. You can always read
and write the eMMC memory. The purpose of this memory is to store data pro-
duced during the running of the machine or plant supervised by HMI/LP/RT30.
The eMMC memory is formatted using the “Datalight Reliance Nitro” file sys-
tem specifically designed to improve the mass memory management ensuring
reliability and robustness under the most diverse use conditions including in-
trinsic security of the write operations even in case of a power failure.
The Windows CE Control Panel includes the utilities to manage the storage de-
vices.
To manage the eMMC use ONLY the “Reliance Volume Manager" utility.
Figure 45
Commissioning the device
Note: in case of needs please contact the technical support for any assistance
about the use of the volume manager utility.
Note: The “Datalight Reliance Nitro” fiel system has been introduced starting
from OS image version 17. Systems with older versions can be upgraded using
the ASEM System Manager (ASM) utility. ASM and related documentation can
be found on the corporate web site under the “HMI software” section.
The NAND Flash is formatted using the exFAT file system. To manage the NAND
memory use ONLY the default Windows CE Storage Manager.
43
4.2 Internal NAND memory

The NAND memory, as default is read only. In this way is protected from losses
of data, but the NAND memory can be made writable.
To make the NAND memory writable you must go into the Windows folder of
HMI/LP/RT30 and click on MakeNANDWritable (see picture below). In this way
you can store some exe you want to keep safe. After the operation you can
make the NAND memory read only as before.
To make the NAND memory read only you must go into the Windows folder of
HMI/LP/RT30 and click on MakeNANDReadOnly (see picture below)
44
4.3 Slot for memory card
HMI/LP/RT30 can optionally accommodate an SD/SDHC card slot V. 2.0 (push-

push type).
Figure 46
Slot for memory card
Slot for memory card memory card (example)
4.4 Installation/removal of a memory card

Attention: potential data loss
Do not remove the memory card while da-
ta is being accessed. • Insert the memory card into the slot as indicated in the figure. Pay atten-
Data on the memory card is lost if you at- tion to the beveled edge.
tempt to remove it while HMI/LP/RT30 is
accessing its data.
Attention: Perte potentielle de données

Ne retirez pas la carte mémoire pendant
l'accès aux données.
Les données sur la carte mémoire sont
perdues si vous tentez de le supprimer lor-
sque HMI / LP / RT30 accède à ses don-
nées.
Figure 47 Beveled edge

Attention: removing the system • Push the card all the way.
memory card while the project is running.
If you remove memory card while a project
is running, the project may stop.
Attention: retirer la carte mémoire du sys-

tème pendant que le projet est en cours
d'exécution. Si vous retirez une carte mé-
moire pendant qu'un projet est en cours
d'exécution, le projet peut s'arrêter.
Figure 48
45
Figure 49
• Push the card previously inserted.
Figure 50
• Extract the memory card from the slot.
Figure 51
46
47
SECTION 5
5 Commissioning a
project
48
SECTION 5 – Commissioning a project
5.1 Premium HMI project
5.1.1 Overview
Configuration phase
A project includes screen, alarms, variables used to represent the real plant of
machine. The configuration phase is the creation of the project according to the
user needs and interaction between the humans and the machine.
Transferring the project to HMI/LP30

You can transfer a project to HMI/LP30 as follows:
● Transfer from the configuring PC by using an Ethernet connection
● Copy the Project by using a USB key
Process control phase

After the project is transferred, HMI/LP30 is ready to communicate to one or
more PLC and to visualize the screens according to the configured project.
ATTENTION: if you need to communicate with a device connected to the serial
port you must configure the serial port. See chapter 5.3.
Commissioning and re-commissioning

When you switch on the first time HMI/LP30, there is no project inside. At first
you need to transfer a project into HMI/LP30.
After you download a project you can retransfer another project or another
version of the same project without any special operation, also while the pro-
ject is running on HMI/LP30.
5.1.2 Transfer
HMI/LP30 is always ready for accepting the download of a project, even when a
project is running. In this way, if HMI/LP30 is connected by means of Ethernet
to the configuration PC, you are able to download a new project or a new ver-
sion of the same project even without stopping the project. (see Chap. 3.10.1)
5.1.3 Configuring the serial port

If your project need to communicate with a device connected to the serial port,
you need to configure the serial port according to the type of serial connection
you use for your communication. The following types of communications are
supported by the serial port of HMI/LP30:
• RS 232
• RS 422
• RS 485
HMI/LP30 comes as default with the serial port set as RS 232. If you want to
change the type of serial communication you must do the following:
49
Go in control panel
Figure 52
Configuring the serial port
Double click on “Serial Port Configuration”
Figure 53
Choose the type of serial communication
Figure 54
50
And confirm by pressing the “Apply” button. A warning message will raise, ad-
vising to store that new configuration is active and saved a permanent way.
Figure 55
This applet can be used just to check which serial communication mode
is active; in this case it is enough to push the “red cross” on the high right
side of the panel (fig 54).
Please note that MPI mode cannot be selected: when this protocol will
be used by HMI software all required settings will be applied automati-
cally.
5.1.4 Connecting the serial port

A unique DB15 male connector hosts all serial protocols (please check par. 7.4
for pin-out details) so it is necessary to adapt this connection to plant needs;
ASEM can supply connector adapters as optional parts but user can adapt DB15
connector by himself.
For further details please contact ASEM
5.1.5 Managing the project
HMI/LP30 has powerful tools to manage a running project. With the same mask
used to transfer the project (see below) you can also:
1. Stop the HMI/LP30 project from the configuration PC
2. Start the HMI/LP30 project from the configuration PC
3. Debug the project from the configuration PC
4. Transfer the project from HMI/LP30 to the configuration PC.
51
5.1.6 Stopping the running project
Figure 56
Stopping the running project
To stop a project running in HMI/LP30 you must:

5. Select TCP in the upper left list
6. Write the IP address of HMI/LP30
7. Click on the button “Stop Device Project!”
You will see the project in HMI/LP30 stopping (see below)
Figure 57
Stopping the running project
52
5.1.7 Starting the project
Figure 58
Starting the project
To start a project in HMI/LP30 by using the configuration PC you must:

10. Click on the button “Start Device Project”
You will see the HMI/LP30 project starting (see below).
Figure 59
Starting the project
If there isn’t a project in HMI/LP30 you will have an error

53
5.1.8 Debugging the project
You can debug the project in HMI/LP30 by connecting with the configuration
PC.
In order to be able to use the debugging functionality you must prepare your
project as follows:
1. Select “Networking” in the project explorer window of Premium HMI

2. Enable the property “Debugger” in the Properties window of Premium
HMI
Figure 60
Debugging the project
Transfer the project to HMI/LP30 and make it running.

NOTE: Be sure that the project is running otherwise you cannot debug the pro-
ject
To debug the project running in HMI/LP30 from the configuration PC you must:

Click on the button “Attach To Process…”

54
Figure 61
Debug the project
The following window will appear
Figure 62
Debug the project
Write the IP address of HMI/LP30 and click on the “OK” button. A new windows
asking for user and password will appear
Figure 63
Debug the project
55
In case the project is not protected, just click on the “OK” button, otherwise in-
sert the name and password of a project user that has the rights to change the
project.
You will see that a debug session will start in Premium HMI on the configuration
PC. Now you are able to:
• See the project screens and navigate between them. Please note that
you can see different screen from those seen on HMI/LP30 and that
your debugging is not affecting the normal running of HMI/LP30 pro-
ject
• See and change the value of the variables
• Put breakpoint and debug Visual Basic scripts running in the project
5.1.9 Trasfer the project from HMI/LP30 to the

configuration PC
This option allows you to transfer the project from HMI/LP30 to the configura-
tion PC in order to check or change and hence transfer again into HMI/LP30.
Hint: It is always suggested to protect the project with a password in order to

don’t allow changes to the project by not authorized users.
Be sure that the project is not running on HMI/LP30, run Premium HMI on the
configuration PC, click on the “File” menu and select “Open Device Project…”
Figure 64
Debug the project

3. Write the path on which you want to store the project on your configu-
ration PC
4. Click on the button “Get Project from Device!”
56
Figure 65
Debug the project
After the transfer of the project you will see the project explorer containing the
project resources in Premium HMI and you will able to check, test and change
the resources of the project
5.1.10 Backup and restore
HMI/LP30 has tools to backup and restore the contents of its internal memory
in order to manage the project and the operating system of HMI/LP30. For
more information please contact the support center of ASEM.
5.1.11 Updating the operating system
Please contact the support center of ASEM.

57
5.2 Ubiquity project
Figure 66 The HMI/LPxx systems are featuring Ubiquity Runtime preloaded and precon-
Ubiquity implementation figured. The Ubiquity Getting Started guide is available for download from the
web site at the following address: http://www.asem.it/en/products/industrial-
automation/remote-assistance/ubiquity/setup-downloads/.
5.2.1 Connections
Figure 67
Ubiquity implementation
The LAN2 (Eth2/WAN) network interface must be used for the Internet connec-
tivity.
The LAN1 (Eth1/LAN) interface must be used for the connection to the automa-
Figure 68 tion network or fieldbus. The two interfaces cannot be swapped.
Ubiquity implementation The Ubiquity setup for HMIxx devices provides that the VPN is by default con-
figured to be done with LAN1.
The Ubiquity setup for LPxx devices provides the installation by default of the
Ubiquity VPN virtual network adapter. The VPN is by default configured to be
done with this adapter without any interference with the physical interface
LAN1 which is normally used by CODESYS for the automation network or the
fieldbus.
58
5.3 CODESYS Soft PLC project

This chapter is valid only for LP30 systems which are coming with CODESYS
Runtime pre-installed directly from production.
5.3.1 LP30 CODESYS Implementation

The CODESYS Runtime runs as a thread with “real time” priority.
Figure 69
CODESYS implementation The execution model is based on the “task” concept; the program execution re-
quires the definition of tasks and the assignment of priority and execution cycle
according to the following figure (see below in this manual about how to con-
figure CODESYS for use with LP30 system).
Each task is executed at the specified time interval and according to the as-
signed priority. Only when all the CODESYS activities are over, the CPU time
goes to the other processes, as they are assigned to an inferior priority.
Note: Each task cycle time must be properly assigned according to the gen-
eral performances required by the Soft PLC itself, by the Premium HMI Runtime,
by the Ubiquity Runtime and by any other application or process running in the
system. A too short task cycle time may introduce an undesired slowdown in
the general reaction of the system. If this is the case, the task cycle time should
be properly increased until you reach the proper balancing between perfor-
mances and reactivity of the whole system.
59
5.3.2 Preparing the CODESYS programming environment

The CODESYS programming environment must be properly configured in order
to support the code compiler for LP30 systems.
You need CODESYS v3.5.3.50 or above installed on the PC.
CODESYS installation can be found in the CODESYS companion CD included in
the box, together with LP30 systems.
The CODESYS programming environment configuration is simply done by in-

stalling the LP30 device description files.
The description file can be found in the CODESYS companion CD in the following
location:
..\CODESYS_3.5\Device_Description_Files\WinCE\arm
The file is called “LP30.devdesc.xml”
To install the device description file, from the CODESYS programing software
click “Tool\Device Repository” and then “Install” as shown in the following fig-
ure.
Figure 70
CODESYS implementation
Select the file type “Device description Files” and locate the “LP30.devdesc.xml”
This will install the support for ASEM LP30 systems as shown in the following
figure.
60
Figure 71
Create now a new project and insert the LP30 as new Device as shown in the
following figure.
Figure 72
61
5.3.3 Transferring the CODESYS application to the target

system
To transfer a valid CODESYS Application to the Target system, follow these
steps:
- Ensure the LP30 device is connected to the same sub network of the PC
where you have running the CODESYS programming tool (same net-
work mask, e.g. “192.168.1.xx”)
- Double click on the device icon from the CODESYS project tree; the
right part of the workspace will show the “Communication settings”
tab contents
- Select the Gateway and click on the button “Scan network” button
- The box will be populated with the list of available CODESY Runtime
- Click on the one you want to connect too and click then on the “Set ac-
tive path” button
- Click On-line\Login to start the communication
-
Figure 73
5.3.4 I/O Fieldbus

The CODESYS implementation for ASEM LP30 systems supports the following
I/O fieldbuses:
- EtherCAT with NO DC support (distributed clock) on LAN1
- Modbus TCP on LAN1
- Modbus RTU
To insert the I/O master right click on the LP30 device icon on the project tree,
select “Add Device” and select from the “Vendor” list box “3S Smart Software
Solutions GmbH”. The list will be populated with the available master devices.
Select the one required by your application in between:
- EtherCAT Master
- Modbus COM (for Modbus based I/O both serial and TCP)
LP30 systems are featuring two Ethernet interfaces.

The interface that must be used for I/O fieldbus is the one denominated
“LAN1”.
Note: At the moment of transferring the PLC application to the target system,
CODESYS will ask to which interface the I/O must be attached. You must specify
the MAC address of the “LAN1” interface as shown in the following figure.
62
Figure 74
Note: current implementation if affected by a jitter of about +/- 2ms when

working with I/O over Ethernet interface.
Note: the Ethernet interface assigned to an I/O Ethernet master (Ethercat or

Modbus TCP) is exclusively dedicated to the I/O and must not be used for any
other purpose (no programming, no Premium HMI protocol)
5.3.5 Support for retentive data
LP30 systems are equipped with a Micro UPS specifically designed to support
the data memory retention.
In CODESYS the retentive variables can retain their value throughout the usual
program run period. They are declared as “Retain Variables” or even more
stringent as “Persistent Variables”. For each case a separate memory area is
used.
Please check the CODESYS manual for any additional detail about retentive da-
ta.
The use of the retentive areas does not require any specific configuration ex-
cept for declaring the variable in the proper area according to the CODESYS
programming manual.
To get operational and status information from the micro UPS you may insert
into the CODESYS project the specific micro UPS device driver.
On the project tree click on the device node and then with the right mouse click
select “Add Device”.
From the list of available devices check under the “Miscellaneous” category as
shown in the following figure.
63
Figure 75
Include then the device called “IoDrvUPS” as shown in the following figures.
Figure 76
The “IoDrvUPS” device exposes some status variables. To access them just open
the IoDrvUPS properties.
In particular, please note the “chargeLevel” is an enumerated data type with 3
values: low, half, full.
The status variable can be used in the PLC project and in the HMI application to
properly adapt the application behavior to the charge level.
Note: to start the backup procedure the super capacitors must be fully charged.
Memories are not saved for any intermediate charging status.
Figure 77
64
At the moment of a power failure (when the voltage is below the threshold for
more than 50ms) the UPS triggers an event and the system will switch off the
display and the USB device connected in order to save energy, and will follow a
four step sequence to save data:
1. The panel display and the USB ports are turned off
2. All running IEC tasks are terminated so the retentive areas are con-
sistent
3. The system starts flushing the retentive memory areas to a file which is
saved on disk
4. The CODESYS Runtime is terminated
The panel continues to run until the Micro UPS is able to provide power to LP30
Note: to start the backup procedure the super capacitors must be fully charged.
Note: The available retentive memory size is of 64KB for the RETAIN memory
type and 64KB for the PERSISTENT memory type.
Note: If the power supply returns before the energy inside the Micro UPS is fin-
ished, and actually LP30 has not been switched off, the following operations are
carried on:
- The display is switched on
- The USB ports are powered
- CODESYS Runtime behavior can be selected in between 3 possible
models:
1) CODESYS Runtime does not start and no message is returned.
2) CODESYS Runtime does not start and returns a warning mes-
sage.
3) CODESYS Runtime restarts normally (default option).
The CODESYS restart behavior can be configured directly by the user by means
of the CODESYS launcher manager program.
The CODESYS launcher manager is an application stored in the
"\MMCMemory\CoDeSys3" folder as shown in the following figure.
Figure 78
To start it, simply double click on the file name.

65
The CODESYS launcher manager interface is shown in the following figure.
Figure 79
The parameter "Wait for CDS start" is the time the launcher waits before start-
ing the CODESYS Runtime.
"Restart timeout" is the time the launcher waits before restarting CODESYS.
5.3.6 Use in combination with Premium HMI Runtime
Premium HMI Runtime can be of course configured to communicate with the

CODESYS Runtime.
The LP30 CODESYS implementation includes the CODESYS Gateway which is
then used as communication interface.
The Premium HMI project must be configured to communicate with a generic
CODESYS controller inserting in the “Real Time DB” resource the driver called
“CODESYS” as shown in the following figure.
Figure 80
The protocol uses a socket to communicate with the CODESYS Runtime through
the Gateway component.
The Station must be configured to connect to “localhost”. The Device name is
the one shown by the CODESYS programming system when connected on-line
with the LP30 device from the “Communication settings” window as shown in
the following figure.
Figure 81
The Premium HMI Station Properties will result as following.

66
Figure 82
The tags can be imported as normally supported with any other CODESYS based
controller. The import can be done both from XML file and directly from the PLC
in on-line mode.
For additional information about importing tags, please consult the CODESYS
on-line manual accessible from the Premium HMI Studio software.
The CODESYS Runtime running on a LP30 device can be reached also from a
panel which has been configured to belong to the same sub network.
When having on the same sub network more than one LP30 system, you need
to assign to them different name.
The CODESYS Runtime name used to identify the host system is specified in a
file called “codesyscontrol.cfg” which can be found in the CODESYS Runtime in-
stallation folder on the panel disk. The node name is in the following section:
[SysTarget]
NodeName="LP30"
Note: In case the CODESYS PLC is using Ethernet based I/O, the Premium HMI
project must not be configured to use Ethernet protocols. The “LAN” interface
is exclusively dedicated to the I/O, while the “WAN” interface is dedicated to
the Internet connection for Ubiquity and cannot be used as protocol port.
Note: The Premium HMI project can be configured to communicate with more
than one controller (for instance: on-board CODESYS and external controllers in
configurations not subject to the previous restriction); in these cases the system
can act as a gateway and transfer data through the different channels. For fur-
ther information about this feature consult the Premium HMI on-line manual
searching for “Variable Commands” and then “Move Value”.
67
5.3.7 Limitations and Recommendations
In order to get the best balancing between functionalities and performances we

strongly suggest to follow some guidelines when designing the applications for
CODESYS and Premium HMI.
- The PLC cycle time must be greater or equal than 10ms; the average jit-
ter has been measured around +/- 2ms
- In general the CPU time reserved to CODESYS shall not be greater than
25%; this is calculated using the real time required by the PLC Runtime
to complete the cycle and the time left free for all the other processes
Note: the maximum CPU time usable for the CODESYS application is fixed from
a system parameter; in case the PLC program gets more than 25% of the CPU
time, the CODESYS Runtime will be stopped. The user shall then properly
change the PLC task timing in order to respect the limitation.
- The CODESYS application shall use only one at a time of the 3 I/O
fieldbus available
- The maximum number of bytes exchanged between Premium HMI
Runtime and CODESYS Runtime shall not be greater than 1024
- The sampling time specified for data acquisition shall not be less than
15sec
- The scripting shall be carefully used in order to leave enough time to
the other tasks to run without impacting too much with the general
reaction of the overall system
- If the project has been configured to use the Web Client, you should
consider that when an external client is connect you may experience a
slowdown of the page change performance of the Premium HMI
Runtime
- The “S7-MPI COMx” communication protocol from Premium HMI is not
supported
68
69
SECTION 6
6 Maintenance and care

70
SECTION 6 – Maintenance and care
6.1 Calibration of the touchscreen
HMI/LP/RT30 is designed to don’t require touchscreen calibration, but in some

cases, like update of the operating system, you must recalibrate the touch
screen.
To calibrate the touch screen:
• Go in control panel.
Figure 83
Calibration of the touchscreen
• Open the “Stylus” application.
Figure 84
The following window will appear.

71
Figure 85
• Click on the “Recalibrate” button and follow the instructions.
6.2 Maintaining & cleaning
HMI/LP/RT30 is designed for maintenance-free operation except for the replac-

ing of the battery backup when necessary. It is recommended to clean the
touchscreen with a damp cleaning cloth and a display cleaning solution.
Note: clean the front panel of the system with a soft damp cloth only.
Remarque: nettoyez le panneau avant du système uniquement avec un chiffon
doux humide.
Attention: Do not use detergents, solvents, cleaners or objects that

could scratch the surface.
Attention: Ne pas utiliser de détergents, solvants, nettoyants ou objets suscep-
tibles de rayer la surface.
Attention: switch off the power before any cleaning operation.

Attention: coupez l'alimentation avant toute opération de nettoyage.
Attention: in case of installation in hazardous areas in zone II 3 G D (zone

2/22), please refer to ATEX User Guide code 86060139.
Attention: en cas d'installation en zone dangereuse dans la zone II 3 G D (zone
2/22), se référer au code du guide d'utilisation ATEX 86060139.
72
6.2.1 Procedure
Proceed as follows:
a) Switch off the HMI device or lock the touch screen.
b) Spray the cleaning solution onto a cleaning cloth.
c) Do not spray directly onto the display.
d) Clean the display from the screen edge inwards.
6.2.2 Backup battery replacement (CR2032 3V)

• Remove the two screws as indicated in figure.
Figure 86
Backup battery replacement
• Remove the two columns as indicated in figure.
Figure 87
73
For 8.4 model please refer to the following images.
• Remove the two columns as indicated in figure.

Figure 88
• Remove the two screws as indicated in figure.
Figure 89
Figure 90
74
• Locate the battery position.
Figure 91
• Remove the battery and replace it with one of the same model (CR2032
3V).
Figure 92
75
Figure 93
Figure 94
Backup battery detail
6.3 Recycling and disposal
HMI/LP/RT30 can be recycled due to the use of materials with low environmen-
tal impact. Contact a certified disposal service company for environmentally
sound recycling and disposal of your old devices.
76
77
SECTION 7
7 Technical
specifications
78
SECTION 8 - Technical specifications
7.1 Technical specifications

Hardware characteristics
Case Panel mount
HMI30 Aluminum ▪ ASEM logo sticker
LP30
RT30
Aluminum TrueFlat ▪ Polycarbonate Pantone
Front panel HMI30-TF
Cool Grey 4C color ▪ ASEM logo serigraph print-
LP30-TF
ed
HMI30-TFC Aluminum and tempered glass TrueFlat
LP30-TFC
Frontal protection IP66, Enclosure type 4X (Indoor use only)
HMI30 4/5 wires resistive technology
4/5 wires resistive technology ▪ overlaminated
Touchscreen HMI30-TF
with OCA (Optical Clear Adhesive)
HMI30-TFC projective capacitive touch-screen
Operating System Microsoft Windows Embedded Compact 7 Pro license with Datalight
Reliance Nitro file system ▪ Microsoft olographic sticker
HMI30 Premium HMI 4 WinCE BASIC / AD-
HMI
LP30 VANCED runtime license
HMI30 Remote ASEM UBIQUITY WinCE PRO runtime
Table 9 LP30 assistance license with ASEM sticker
Hardware characteristics HMI30 ASEM System Manager ▪ Back-
Software
LP30 Utility up&Restore, Screensaver, Antialiasing
RT30
SoftPLC CODESYS SP v3.x for
LP30 Control WinCE/ARM runtime ▪ license with 3S
sticker
Motherboard Model All-in-one, ASEM R131/A
RTC Hardware with battery backup
Buzzer Yes
CPU Processor ARM Cortex A8 - Freescale i.MX535 - 1 GHz
Memory bus 400MHz
Graphic Controller GPU with integrated LCD controller
RAM memory Type / Size / 1GB / DDR3-800 / Soldered onboard
Socket
Rear access serial 1 x RS-232/422/485 (DB15M) MPI protocol compatible up to
interfaces 187,5Kbit/s
Rear access inter- LAN1 Ethernet 100Mbps (RJ45) with Link/Activity leds
faces LAN2 Ethernet 10/100Mbps (RJ45) with Link/Activity leds
USB interfaces 2 x USB 2.0 (TYPE-A, host port, single channel software switch off)
Mass storage Internal / not NAND-FLASH:
removable 256 MB (Read Only) for Operating System and
runtime.
eMMC:
4 GB PseudoSLC, 8 bit (for data and user program)
External ac- SD/SDHC card slot V. 2.0 (push-push type)
cess / remov-
able
Battery Type Coin (CR2032 3V) removable
Lifetime 3 years
Buttons, LEDs and Reset buttons System
keys LEDs Power / Removable Storage activity
79
Electrical characteristics
Type Integrated on board, auto ranging
Input voltage 18÷36 VDC with 3 poles connector
Power supply
Anti-inversion polarity, over-voltage, fuse soldered
Protections
on the board
500ms of back up time after 7 years of life at an av-
erage temperature of 45°C
Optional Micro UPS
First load: 30”
Table 10 Rearm time: 15”
Electrical characteristics [email protected]”
13.0W@7,0”W
13.5W@8,4”
13.0W@10,1”W
Power consumption
15.5W @10,4”
(Max.) with USB
19.5W @12.1” (SVGA)
ports loaded
23.0W @12.1” (XGA)
19.5W @12.1”W (WXGA)
21.5W @15,0”
23.0W @15,6”
These devices are intended to be connected to a “Secondary Circuit Overvoltage Category II”
Table 11
Environmental characteristics
Environmental characteristics
Operation 0° ÷ +50°C
Temperature
Storage -20° ÷ +60°C
Humidity Operation/Storage 80% (non-condensing)
Premium HMI runtimes differences BASIC ADVANCED

RealTime DB (max, byte) 1.024 8.192
Table 12 Alarms (max) 1.024 4.096
Premium HMI runtimes differences Recipes / Data Logger (ODBC) Max 2 Unlimited
Communication drivers Max 2 Max 4
Alarm notification (SMS, E-Mail) ●
SMS notification via SMPP protocol SMS using Internet gateway
Web Clients Max 4 clients connected
Premium HMI Mobile ●
ASEM UBIQUITY PRO main features

Control Center application to access the service with intuitive and ergonomic user inter-
face for a comprehensive machine park manageme.
Control Center SDK to interface with 3rd part applications.
PROXY server support.
Internet sharing with LAN devices.
Table 13 Interactive tool: remote desktop (RDP sessions on Windows Server and multiple monitor),
ASEM UBIQUITY PRO main features file transfer, task manager, chat, screenshots.
Optimized VPN with access limited to the remote device with Ubiquity Runtime.
Optimized VPN with entire access to the complete remote device sub-network and serial
passthrough.
Multiple connections to a single Runtime with individual VPN per each Control Center cli-
ent.
Connection log accessible from Runtime device.
Log and audit of last 10 days connections activities also exportable from Runtime side.
High level of security with exclusive use of encrypted connections and certificates.
Integrated VPN Firewall.
Support for Runtime update with automatic services restart.
80
ASM (ASEM System Manager). Control Panel utilities

Complete system cloning or selective backup and restore of the installed
Backup&Restore
softwares
Antialiasing Softens the characters matrix
Screensaver Display brightness control or display switch off after an inactivity period
Touch Buzzer Enable touch sound-feedback
Table 14 eMMC Usage Check the eMMC memory usage and evaluate the expected endurance
ASM Control Panel utilities Kiosk Mode Hide the O.S. explorer interface and run PHMI runtime in 'kiosk' mode
Language Set- Easy installation of not european languages characters in HMI applica-
tings tions
Scrollbar Allows to change the size of the scroll bars
System reboot Reboot the system without switching off the power supply
81
7.2 display characteristics

Table 15
5.7” display characteristics 7.2.1 5.7” display characteristics
5.7” display characteristics
Dimensions 5.7” (4:3)
Technology TFT active matrix
Display area 115.2 (W) x 86.4 (H) mm
Resolution 640 x 480 pixels
Display color 256 K colors
Pixel Pitch 0.18 (W) x 0.18 (H) mm
Luminance 500 cd/m2 (Note 1)
Horizontal viewing angle 70°+70°◦
(left + right)
Vertical viewing angle 45°+55°
(up + down)
Contrast ratio 250:1
Response time (Rise) 50 ms (Typ.)
Backlight LED
LED life time (Note 2) 40.000h @ default (Note 3) and max Tamb
Table 16
7.0” W display characteristics
7.2.2 7.0”W display characteristics
7” display characteristics
Dimensions 7.0”W (15:9)
Display color 16.7 M colors
(left + right)
Vertical viewing angle 70°+60°◦
(up + down)
Contrast ratio 400:1 (Typ.)
Table 17 Response time (Rise / Fail) 5 ms (Typ.) / 11 ms (Typ.)
8.4” display characteristics Backlight LED
LED life time (Note 2) 40.000h @ default (Note 3) and max Tamb
7.2.3 8.4” display characteristics

Display color 16.2 M colors
(left + right)
(up + down)
Response time (Rise + Fail) 8 ms (Typ.)
Backlight LED
LED life (Note 2) 50.000h @ default (Note 3) and max Tamb
82

Table 18 Display color 16.2 M colors
10.1”W display characteristics Pixel Pitch 0.213 (W) x 0.213 (H) mm
(left + right)
(up + down)
Backlight LED
7.2.5 10.1”W display characteristics

Table 19 Display area 216.96 (W) x 135.6 (H) mm
10.4” display characteristics Resolution 1280 x 800 pixels
Display color 16.7M colors
(left + right)
Vertical viewing angle 85°+85°◦◦
(up + down)
Backlight LED

Table 20 Dimensions 10.4” (4:3)
12.1” display characteristics Technology TFT active matrix
(left + right)
Vertical viewing angle 70°+70°◦◦
(up + down)
Response time (Rise / Fail) 5 ms (Typ.) / 11 ms (Typ.)
Backlight LED
83
7.2.7 12.1” (SVGA) display characteristics

Table 21 Pixel Pitch 0.3075 (W) x 0.03075 (H) mm
12.1” (SVGA) display characteristics Luminance 450 cd/m2 (Note 1)
Horizontal viewing angle 80°+80°
(left + right)
Vertical viewing angle 65°+75°
(up + down)
Backlight LED
7.2.8 12.1” (XGA) display characteristics

Table 22 Luminance 600 cd/m2 (Note 1)
12.1” (XGA) display characteristics Horizontal viewing angle 80°+80°◦
(left + right)
(up + down)
Backlight LED
7.2.9 12.1”W (WXGA) display characteristics

Dimensions 12.1”W (16:10)
Table 23 Pixel Pitch 0.240 (W) x 0.240 (H) mm
12.1”W display characteristics Luminance 400 cd/m2 (Note 1)
(left + right)
(up + down)
Backlight LED
84
7.2.10 15.0” (XGA) display characteristics

Table 24 (left + right)
15.0” display characteristics Vertical viewing angle 70°+70°◦
(up + down)
Backlight LED
7.2.11 15.6”W (WXGA) display characteristics

Table 25 Horizontal viewing angle 85°+85°◦
15.6”W display characteristics (left + right)
(up + down)
Backlight LED
Note1:
At maximum (100%) brightness setting.
Note 2:
After the LED life time, the backlight luminance may be reduced up to the 50% of
the initial value.
Note 3:
The default backlight value is set at 80% of the maximum brightness by the oper-
ating system.
Note that the user can modify the backlight brightness, using the related operat-
ing system mask.
At 25°C, the above-indicated LED life is also guaranteed at 100% backlight bright-
ness; instead, at higher ambient temperature and 100% backlight brightness, LED
life time will decrease.
85
7.3 Certificates and approvals

Warranty & approvals
Emission Conforms to:
EN 55022 Information technology equipment – Radio
disturbance characteristics
EN 61000-3-2 Limits for harmonic current emissions
EN 61000-3-3 Limitation of voltage fluctuation flicker
EMC Directive 2014/30/EU ex 2004/108/EC
Immunity Conforms to:
EN 55024 Information technology equipment – Im-
munity characteristics
EN 61000-6-2 Electromagnetic compatibility (EMC) -
Part 6-2: Generic standards - Immunity for industrial
environments
EMC Directive 2014/30/EU ex 2004/108/EC
Safety Conforms to:
EN 60950-1 – Information technology equipment –
Safety
Conforms to:
EN 50581:2012 - Technical documentation for the assessment of
electrical and electronic products with respect to the restriction of
hazardous substances
RoHs Directive 2011/65/EU
Conforms to:
EN 60079-0 Explosive atmospheres – Part 0: Equip-
ment - General requirements
HMI30
RT30
ment dust ignition protection by enclosure "t"
LP30
Table 26 Atex Directive 2014/34/EU ex 94/9/EC
Certificates & approvals II 3 D Ex tc IIIC T 70°C Dc X
0°C≤Ta≤50°C
Conforms to:
EN 60079-11:2012 Explosive atmospheres - Part 11:
Equipment protection by intrinsic safety “i”
HMI30TF EN 60079-15 Explosive atmospheres – Part 15: Equip-
RT30TF ment protection by type of protection "n"
LP30TF EN 60079-31 Explosive atmospheres – Part 31: Equip-
ment dust ignition protection by enclosure "t"
Atex Directive 2014/34/EU ex 94/9/EC
II 3 G Ex ic nA IIC T6 Gc X
II 3 D Ex tc IIIC T 70°C Dc X
0°C≤Ta≤50°C
Conforms to:
HMI30TFC ment protection by type of protection "n"
RT30TFC EN 60079-31 Explosive atmospheres – Part 31: Equip-
LP30TFC ment dust ignition protection by enclosure "t"
Atex Directive 2014/34/EU ex 94/9/EC
II 3 G Ex nA IIC T6 Gc X
II 3 D Ex tc IIIC T 70°C Dc X
0°C≤Ta≤50°C
Industrial Control Equipment, UL508
Process Control Equipment Industrial Products, CAN/CSA
C22.2 No. 142-M1987
86
7.4 Dimension drawings
7.4.1 5.7”
Figure 95
5.7”
87
7.4.2 5.7” TF
Figure 96
5.7” TF
88
7.4.3 7.0”W
Figure 97
7.0”W
7.4.4 7.0”W TF
Figure 98
7.0”W TF
89
7.4.5 8.4”
Figure 99
8.4”
7.4.6 8.4” TF
Figure 100
8.4” TF
90
7.4.7 10.1” W
Figure 101
10.1” W
91
7.4.8 10.1” W TF
Figure 102
10.1” W TF
92
7.4.9 10.1” W TFC
Figure 103
10.1” W TFC
93
7.4.10 10.4”
Figure 104
10.4”
7.4.11 10.4” TF
Figure 105
10.4” TF
94
7.4.12 12.1”
Figure 106
12.1”
7.4.13 12.1” TF
Figure 107
12.1” TF
95
7.4.14 12.1” W
Figure 108
12.1” W
96
7.4.15 12.1” W TF
Figure 109
12.1” W TF
97
7.4.16 12.1” W TFC
Figure 110
12.1” W TFC
98
7.4.17 15.0”
Figure 111
15.0”
7.4.1 15.0” TF
Figure 112
15.0” TF
99
7.4.2 15.6” W
Figure 113
15.6” W
7.4.3 15.6” W TF
Figure 114
15.6” W TF
100
7.5 Ports PINOUT
7.5.1 COM1 – DB15M Serial
PIN Signal I/O

1 +5 VDC OUT
2 Transmit Data (RS-232) OUT
3 Receive Data (RS-232) IN
4 Request To Send OUT
5 Clear To Send IN
6 Data Set Ready IN
7 Ground 
8 Data Terminal Ready OUT
9 Carrier Detect IN
10 Transmit Data +/Receive Data + (RS-485/RS-422) I/O
Table 27 11 Transmit Data -/Receive Data - (RS-485/RS-422) I/O
COM1 – DB15M Serial 12 Ring Indication (RS-232) IN
13 Receive Data + (RS-422) IN
14 Receive Data - (RS-422) IN
15 N.C. N.C.
Any polarization or termination resistor is connected to RS422/485 chan-

nel so, if required, it has to be provided by the user into the plant con-
nector.
7.5.2 LAN1 – LAN2
Table 28
LAN1 – LAN2 PIN Signal
1 TX+
2 TX-
3 RX+
4 Shield
5 Shield
6 RX-
7 Shield
8 Shield
101
7.5.3 USB1 / USB2
PIN Signal
Table 29 1 +5 Vcc
USB1 – USB2 2 USB Data -
3 USB Data +
4 GND
7.6 Technical support & repairs
ASEM offers wide-ranging, complete after-sales technical support. The staff who
deal with this handle questions on the entire range of products skilfully, quickly,
and efficiently.
You can phone our staff in the service department, and they will give you com-
plete, prompt advice on how to resolve your problems.
telephone: +39 0432 967435

fax: +39 0432 967480
e-mail: [email protected]
Index of figures
Figure 1 Full aluminium front panel detail ........................................................................................................................ 10
Figure 2 TF front panel detail ............................................................................................................................................ 10
Figure 3 TFC front panel detail.......................................................................................................................................... 10
Figure 4 Full aluminium front panel detail (in the figure is shown as an example a 15.0" display).................................. 11
Figure 5 Front panel “Step” detail .................................................................................................................................... 11
Figure 6 Construction detail. ............................................................................................................................................. 12
Figure 7 TF panel. (in the figure is shown as an example a 15.0" display) ....................................................................... 13
Figure 8 TF front panel “No Step” detail ........................................................................................................................... 13
Figure 9 Construction detail. ............................................................................................................................................. 14
Figure 10 TFC front panel. (in the figure is shown as an example a 15.6" W display) ...................................................... 15
Figure 11 TFC front panel “No step” detail ....................................................................................................................... 15
Figure 12 Construction detail. ........................................................................................................................................... 16
Figure 13 HMI/LP/RT30 5.7” rear view ............................................................................................................................. 17
Figure 16 HMI/LP/RT30 5.7” side view ............................................................................................................................. 19
Figure 17 HMI/LP/RT30 5.7” side view ............................................................................................................................. 19
Figure 18 HMI/LP/RT30 5.7” connectors .......................................................................................................................... 20
Figure 19 HMI/LP/RT30 connectors label detail ............................................................................................................... 21
Figure 20 HMI/LP/RT30 label detail .................................................................................................................................. 21
Figure 21 Example of ATEX label....................................................................................................................................... 21
Figure 22 Configuration and project creation ................................................................................................................... 23
Figure 23 Process management........................................................................................................................................ 23
Figure 24 Mounting position............................................................................................................................................. 27
Figure 25 Installation distances ........................................................................................................................................ 28
Figure 26 cut-out............................................................................................................................................................... 29
Figure 27 HMI/LP/RT/RT30 cut-out .................................................................................................................................. 29
Figure 28 Installation ........................................................................................................................................................ 31
Figure 34 Power supply connection detail ........................................................................................................................ 34
Figure 37 Connecting the configuration PC ...................................................................................................................... 36
Figure 45 Commissioning the device................................................................................................................................. 42
Figure 46 Slot for memory card ........................................................................................................................................ 44
Figure 52 Configuring the serial port ................................................................................................................................ 49
Figure 56 Stopping the running project ............................................................................................................................ 51
Figure 57 Stopping the running project ............................................................................................................................ 51
Figure 58 Starting the project ........................................................................................................................................... 52
Figure 59 Starting the project ........................................................................................................................................... 52
Figure 60 Debugging the project ...................................................................................................................................... 53
Figure 61 Debug the project ............................................................................................................................................. 54
Figure 66 Ubiquity implementation .................................................................................................................................. 57
Figure 69 CODESYS implementation ................................................................................................................................. 58
Figure 83 Calibration of the touchscreen .......................................................................................................................... 70
Figure 86 Backup battery replacement............................................................................................................................. 72
Figure 94 Backup battery detail ........................................................................................................................................ 75
Figure 95 5.7” ................................................................................................................................................................... 86
Figure 96 5.7” TF ............................................................................................................................................................... 87
Figure 97 7.0”W ................................................................................................................................................................ 88
Figure 98 7.0”W TF ........................................................................................................................................................... 88
Figure 99 8.4” ................................................................................................................................................................... 89
Figure 100 8.4” TF ............................................................................................................................................................. 89
Figure 101 10.1” W ........................................................................................................................................................... 90
Figure 102 10.1” W TF ...................................................................................................................................................... 91
Figure 103 10.1” W TFC .................................................................................................................................................... 92
Figure 104 10.4” ............................................................................................................................................................... 93
Figure 105 10.4” TF ........................................................................................................................................................... 93
Figure 106 12.1” ............................................................................................................................................................... 94
Figure 107 12.1” TF ........................................................................................................................................................... 94
Figure 108 12.1” W ........................................................................................................................................................... 95
Figure 109 12.1” W TF ...................................................................................................................................................... 96
Figure 110 12.1” W TFC .................................................................................................................................................... 97
Figure 111 15.0” ............................................................................................................................................................... 98
Figure 112 15.0” TF ........................................................................................................................................................... 98
Figure 113 15.6” W ........................................................................................................................................................... 99
Figure 114 15.6” W TF ...................................................................................................................................................... 99
Index of tables
Table 1 Full aluminium features ....................................................................................................................................... 11
Table 2 TF features ........................................................................................................................................................... 14
Table 3 TFC features ......................................................................................................................................................... 15
Table 4 LCD aspect ratio ................................................................................................................................................... 16
Table 5 Touchscreen ......................................................................................................................................................... 22
Table 6 Position of the mounting clamps.......................................................................................................................... 30
Table 7 Connecting the configuration PC .......................................................................................................................... 36
Table 8 Procedure ............................................................................................................................................................. 40
Table 9 Hardware characteristics ..................................................................................................................................... 78
Table 10 Electrical characteristics ..................................................................................................................................... 79
Table 11 Environmental characteristics ............................................................................................................................ 79
Table 12 Premium HMI runtimes differences ................................................................................................................... 79
Table 13 ASEM UBIQUITY PRO main features .................................................................................................................. 79
Table 14 ASM Control Panel utilities ................................................................................................................................. 80
Table 15 5.7” display characteristics ................................................................................................................................ 81
Table 16 7.0” W display characteristics ............................................................................................................................ 81
Table 17 8.4” display characteristics ................................................................................................................................ 81
Table 18 10.1”W display characteristics ........................................................................................................................... 82
Table 19 10.4” display characteristics .............................................................................................................................. 82
Table 21 12.1” (SVGA) display characteristics .................................................................................................................. 83
Table 22 12.1” (XGA) display characteristics .................................................................................................................... 83
Table 26 Certificates & approvals ..................................................................................................................................... 85
Table 27 COM1 – DB15M Serial ...................................................................................................................................... 100
Table 28 LAN1 – LAN2..................................................................................................................................................... 100
Table 29 USB1 – USB2 ..................................................................................................................................................... 101
ASEM S.p.A.
Via Buia, 4
33011 Artegna (UD) Italy
Tel. +39/0432-9671
Fax. +39/0432-977465
Via Prealpi, 13/A

20034 Giussano (MI) Italy
Tel. +39/0362-859111
Fax. +39/0362-859121
[email protected]
www.asem.it

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5.1.2 Transfer ......................................................................................................................................................................................48

1.1 General notes

1.3 Instructions on disposal

• Il simbolo sul prodotto o sulla confezione indica che il prodotto non

• The symbol on the product or in its packaging indicates that this

• Le symbole sur le produit ou son emballage indique que ce produit

• simbolo no produto ou na embalagem indica que este producto não

1.4 Description of safety symbols

This symbol indicates a danger to life or health of personnel.

This symbol indicates a danger to the hardware and / or the en-

This symbol indicates an additional information meant to provide

1.5 Qualified Personnel

1.6 Basic knowledge required

1.7 Proper use of the product

1.8 Purpose of the user’s guide

1.9 The manual is a part of the system

1.11 Scope of the operating instructions

1.12 Safety instructions

1.12.1 Installation according to the instructions

1.12.2 Hazardous areas

1.12.3 Working on the control cabinet

1.13 Notes about usage

1.14 Applicable standard

2.1 Product description

Based on ARM Cortex A8 processor and Microsoft Windows Embedded Com-

2.2 Key features

KEY FEATURES HMI30 LP30 RT30

HMI/LP/RT30 package consists of:

HMI/LP/RT30 system HMI LP RT

ATEX user’s guide Printed copy x x x

2.4 Front panels

2.4.1 Full aluminium front panel

1 Full aluminium front panel

2.4.2 TF front panel

1 Aluminium front panel with top polyester film

2.4.3 TFC front panel

1 Aluminum and tempered glass TrueFlat

2.4.4 LCD aspect ratio

Panel size Aspect ratio

2.5 Rear view

Note: rear panels may be different

Note: the user manual refers to

2.6 Side view

2.7 Connector view

1 Power DC input 6 LAN1 (100 Mbps) Fieldbus

For detailed description refer to section 8.

Size Touchscreen Panel technology

2.9 Putting in operation HMI/LP/RT30

● Configuration and creation of the project of HMI/LP/RT30.

2.9.1 Configuration and project creation

• Creating the project.

2.9.2 Process management

Process management is a two-way communication between HMI device and

3.1 Preparation for installation

3.1.1 Select the mounting location

Points to observe when selecting the mounting location: