Data and Signal Line Chokes: %Bub4Iffu %Bub4Iffu
Data and Signal Line Chokes: %Bub4Iffu %Bub4Iffu
Data and Signal Line Chokes: %Bub4Iffu %Bub4Iffu
Series/Type: B82792C0
%BUB4IFFU
Date: April 2008
EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information
contained therein without EPCOS' prior express consent is prohibited.
Construction
■ Current-compensated ring core double choke
■ Ferrite core
■ LCP case (UL 94 V-0)
■ Silicone potting
■ Bifilar winding
Features
■ Suitable for reflow soldering
■ RoHS-compatible
Function
Suppression of asymmetrical interference
coupled in on lines, whereas data signals
up to some MHz can pass unaffectedly.
Applications
■ Telecom interfaces
■ ISDN systems
Terminals
■ Base material CuSn6
■ Layer composition Ni, Sn
■ Hot-dipped
Marking
■ Marking on component:
Manufacturer, ordering code, inductance,
date of manufacture (YYWWD)
■ Minimum data on reel:
Manufacturer, ordering code, L value and tolerance,
quantity, date of packing
2.5±0.2
_ 0.051)
3 x 2.5
1.5 min. 1)
0.6 +0.1
1.6
4 5
3 x 2.5±0.1
4 5
9
3 6
2 7
15
1 8 IND0165-V
1 8
11.5 max.
_ 0.05 1)
7.3 max.
0.4 +0.1
2 ...8
Marking
Dimensions in mm
1) Soldering area IND0164-H-E
330 +0
_2
24±0.3
17.1
1.6±0.1
24.4 +2
_0 60 +2
_0
8.1 16±0.1
IND0423-T
IND0419-1-E
Direction of unreeling
Dimensions in mm
LR = 4.7 mH LR = 6.8 mH
IND0166-4 IND0167-5
50 60
B82792C0475N365 dB B82792C0685N365
dB
α α 50
40
40
30
30
20
20
10
10
0 4 0 4
10 10 5 10 6 10 7 10 8 Hz 10 9 10 10 5 10 6 10 7 10 8 Hz 10 9
f f
LR = 10 mH LR = 22 mH
IND0168-7 IND0169-9
60 60
dB B82792C0106N365 dB B82792C0226N365
α 50 α 50
40 40
30 30
20 20
10 10
0 4 0 4
10 10 5 10 6 10 7 10 8 Hz 10 9 10 10 5 10 6 10 7 10 8 Hz 10 9
f f
LR = 33 mH LR = 50 mH
IND0170-T IND0171-U
60 60
dB B82792C0336N365 dB B82792C0506N365
α 50 α 50
40 40
30 30
20 20
10 10
0 4 0 4
10 10 5 10 6 10 7 10 8 Hz 10 9 10 10 5 10 6 10 7 10 8 Hz 10 9
f f
1.0
TR = 60 ˚C
0.8
0.6
0.4
0.2
0
0 20 40 60 80 100 ˚C 140
TA
T4
T3
t2
T2
T1
t1
IND0814-F
T1 T2 T3 T4 t1 t2 t3
°C °C °C °C s s s
150 200 217 250 < 110 < 90 < 30 @ T4 –5 °C
■ Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
– Particular attention should be paid to the derating curves given there.
– The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
■ If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation.
■ The following points must be observed if the components are potted in customer applications:
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
– It is necessary to check whether the potting material used attacks or destroys the wire
insulation, plastics or glue.
– The effect of the potting material can change the high-frequency behaviour of the components.
■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to
breakage of the core.
■ Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
9 03/09