R1224N SERIES

PWM/VFM step-down DC/DC Controller

NO.EA-096-181004

OUTLINE
The R1224N Series are CMOS-based PWM step-down DC/DC Converter controllers with low supply current.
Each of these ICs consists of an oscillator, a PWM control circuit, a reference voltage unit, an error amplifier, a
phase compensation circuit, a soft-start circuit, a protection circuit, a PWM/VFM alternative circuit, a chip enable
circuit, resistors for output voltage detect, and input voltage detect circuit. A low ripple, high efficiency step-down
DC/DC converter can be easily composed of this IC with only several external components, or a power-transistor,
an inductor, a diode and capacitors. Output Voltage is fixed or can be adjusted with external resistors (Adjustable
types are without PWM/VFM alternative circuit).
With a PWM/VFM alternative circuit, when the load current is small, the operation is automatically switching
into the VFM oscillator from PWM oscillator. Therefore, the efficiency at small load current is improved. Several
types of the R1224Nxxx, which are without a PWM/VFM alternative circuit, are also available.
If the term of maximum duty cycle keeps on a certain time, the embedded protection circuit works. The
protection circuit is Reset-type protection circuit, and it works to restart the operation with soft-start and repeat
this operation until maximum duty cycle condition is released. When the cause of large load current or something
else is removed, the operation is automatically released and returns to normal operation. Further, built-in UVLO
function works when the input voltage is equal or less than UVLO threshold, it makes this IC be standby and
suppresses the consumption current and avoid an unstable operation.

FEATURES
• Supply Current ................................................................ Typ. 20µA (R1224Nxx2E/F/M/L, R1224N102M)
Typ. 30µA (R1224Nxx2G, R1224N102G)
Typ. 40µA (R1224Nxx2H, R1224N102H)
• Standby Current .............................................................. Typ. 0µA
• Input Voltage Range ....................................................... 2.3V to 18.5V
• Output Voltage Range..................................................... 1.2V to 6.0V (0.1V steps; R1224Nxx2x)
1.0V to VIN (R1224N102x)
• Output Voltage Accuracy................................................. ±2.0%
• Oscillator Frequency ....................................................... Typ. 180kHz (R1224Nxx2L/M, R1224N102M)
Typ. 300kHz (R1224Nxx2E/G, R1224N102G)
Typ. 500kHz (R1224Nxx2F/H, R1224N102H)
• Efficiency ......................................................................... Typ. 90%
• Low Temperature-Drift Coefficient of Output Voltage ..... Typ. ±100ppm/°C
• Package .......................................................................... SOT-23-5
• Built-in Soft-start Function............................................... Typ. 10ms
• Built-in Current Limit Circuit

APPLICATIONS
• Power source for hand-held communication equipment, cameras, video instruments such as VCRs,
camcorders.
• Power source for battery-powered equipment.
• Power source for household electrical appliances.

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BLOCK DIAGRAM

Fixed Output Voltage Type

OSC
VIN 5 3 VOUT

EXT 4 Amp
Vref

PWM/VFM
CONTROL Soft Start

Protection
Chip Enable 1 CE

Vref
UVLO

2
GND

Adjustable Output Voltage Type

OSC
VIN 5 3 VFB

EXT 4 Amp
Vref

Soft Start

Protection
Chip Enable 1 CE

Vref
UVLO

2
GND

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SELECTION GUIDE
The output voltage, the oscillator frequency, the modulation method and the output voltage adjustment for the
ICs can be selected at the user’s request.

Product Name Package Quantity per Reel Pb Free Halogen Free

R1224Nxx2∗-TR-FE SOT-23-5 3,000 pcs Yes Yes

xx : The output voltage can be designated in the range from 1.2V(12) to 6.0V(60) in 0.1V steps.
(For externally adjustable output voltage type, feedback voltage of 1.0V(10).)

∗ : The oscillator frequency, the modulation method and the output voltage adjustment are options as
follows.
PWM/VFM Output voltage
Code Oscillator frequency
alternative circuit adjustment
E 300kHz Yes No
F 500kHz Yes No
G 300kHz No Yes
H 500kHz No Yes
L 180kHz Yes No
M 180kHz No Yes

PIN CONFIGURATION
• SOT-23-5
5 4

(mark side)

1 2 3

PIN DESCRIPTION
Pin No Symbol Pin Description
1 CE Chip Enable Pin ("H" Active)
2 GND Ground Pin
3 VOUT (VFB) Pin for Monitoring Output Voltage (Feedback Voltage)
4 EXT External Transistor Drive Pin (CMOS Output)
5 VIN Power Supply Pin

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ABSOLUTE MAXIMUM RATINGS GND=0V

Symbol Item Rating Unit

VIN VIN Supply Voltage −0.3 to 20 V
VEXT EXT Pin Output Voltage −0.3 to VIN+0.3 V
VCE CE Pin Input Voltage −0.3 to VIN+0.3 V
VOUT/VFB VOUT/VFB Pin Input Voltage −0.3 to VIN+0.3 V
IEXT EXT Pin Inductor Drive Output Current ± 50 mA
PD ∗ 420 mW
Power Dissipation (SOT-23-5)
Topt Operating Temperature Range −40 to 85 °C
Tstg Storage Temperature Range −55 to 125 °C
∗) For Power Dissipation, please refer to PACKAGE INFORMATION.

ABSOLUTE MAXIMUM RATINGS

Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the
permanent damages and may degrade the life time and safety for both device and system using the device
in the field. he functional operation at or over these absolute maximum ratings is not assured.

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ELECTRICAL CHARACTERISTICS
• R1224Nxx2x (x=E/F/G/H/L/M) except R1224N102x Topt=25°C

Symbol Item Conditions Min. Typ. Max. Unit

VIN Operating Input Voltage 2.3 18.5 V
VIN=VCE=VSET+1.5V, IOUT=−100mA VSET VSET
VOUT Step-down Output Voltage VSET V
When VSET≤1.5V, VIN=VCE=3.0V ×0.98 ×1.02
∆VOUT/ Step-down Output Voltage
−40°C≤Topt≤85°C ±100 ppm/°C
∆Topt Temperature Coefficient

VIN=VCE=VSET+1.5V, IOUT=−100mA
L/M Version
fosc Oscillator Frequency 144 180 216 kHz
E/G Version
240 300 360
F/H Version
400 500 600
∆fosc/ Oscillator Frequency
−40°C≤Topt≤85°C ±0.2 %/°C
∆Topt Temperature Coefficient
VIN=VCE=VOUT=18.5V
E/F/L/M Version 20 50
IDD1 Supply Current 1 µA
G version 30 60
H version 40 80
Istandby Standby Current VIN=18.5V, VCE=0V, VOUT=0V 0 0.5 µA
VIN=8V, VEXT=7.9V, VOUT=8V,
IEXTH EXT "H" Output Current −17 −10 mA
VCE=8V
VIN=8V, VEXT=0.1V, VOUT=0V,
IEXTL EXT "L" Output Current 20 30 mA
VCE=8V
ICEH CE "H" Input Current VIN=VCE=VOUT=18.5V 0 0.5 µA
ICEL CE "L" Input Current VIN=VOUT=18.5V, VCE=0V −0.5 0 µA
VCEH CE "H" Input Voltage VIN=8V, IOUT=−10mA 1.5 V
VCEL CE "L" Input Voltage VIN=8V, IOUT=−10mA 0.3 V
Oscillator Maximum
Maxduty 100 %
Duty Cycle
VFMdty VFM Duty Cycle E/F/L Version 35 %
VUVLO1 UVLO Voltage VIN=VCE=2.5V to 1.5V, VOUT=0V 1.8 2.0 2.2 V
VUVLO1
VUVLO2 UVLO Release Voltage VIN=VCE=1.5V to 2.5V, VOUT=0V 2.3 V
+0.1
VIN=VSET+1.5V, IOUT=−10mA
tstart Delay Time by Soft-Start function 5 10 20 ms
VCE=0V→VSET+1.5V
VIN=VCE=VSET+1.5V
tprot Delay Time for protection circuit 5 15 30 ms
VOUT=VSET+1.5V→0V

RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS)

All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the
recommended operating conditions, even if when they are used over such conditions by momentary
electronic noise or surge. And the semiconductor devices may receive serious damage when they continue
to operate over the recommended operating conditions.

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• R1224N102x (x=G/H/M) Topt=25°C

Symbol Item Conditions Min. Typ. Max. Unit

VIN Operating Input Voltage 2.3 18.5 V
VFB Feedback Voltage VIN=VCE=3.0V, IOUT=−100mA 0.98 1.00 1.02 V
∆VFB/ Feedback Voltage
−40°C≤Topt≤85°C ±100 ppm/°C
∆Topt Temperature Coefficient
VIN=VCE=2.5V, IOUT=−100mA
M Version 144 180 216
fosc Oscillator Frequency kHz
G Version 240 300 360
H Version 400 500 600
∆fosc/ Oscillator Frequency
−40°C≤Topt≤85°C ±0.2 %/°C
∆Topt Temperature Coefficient
VIN=VCE=VFB=18.5V
M Version 20 50
IDD1 Supply Current 1 µA
G Version 30 60
H Version 40 80
Istandby Standby Current VIN=18.5V, VCE=0V, VFB=0V 0 0.5 µA
VIN=8V, VEXT=7.9V, VFB=8V,
IEXTH EXT "H" Output Current −17 −10 mA
VCE=8V
VIN=8V, VEXT=0.1V, VFB=0V,
IEXTL EXT "L" Output Current 20 30 mA
VCE=8V
ICEH CE "H" Input Current VIN=VCE=VFB=18.5V 0 0.5 µA
ICEL CE "L" Input Current VIN=VFB=18.5V, VCE=0V −0.5 0 µA
VCEH CE "H" Input Voltage VIN=8V, IOUT=−10mA 1.5 V
VCEL CE "L" Input Voltage VIN=8V, IOUT=−10mA 0.3 V
Maxduty Oscillator Maximum Duty Cycle 100 %
VUVLO1 UVLO Voltage VIN=VCE=2.5V to 1.5V, VFB=0V 1.8 2.0 2.2 V
VUVLO1
VUVLO2 UVLO Release Voltage VIN=VCE=1.5V to 2.5V, VFB=0V 2.3 V
+0.1
VIN=2.5V, IOUT=−10mA
tstart Delay Time by Soft-Start function 5 10 20 ms
VCE=0V→2.5V
VIN=VCE=2.5V
tprot Delay Time for protection circuit 5 15 30 ms
VFB=2.5V→0V

RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS)

All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the
recommended operating conditions, even if when they are used over such conditions by momentary
electronic noise or surge. And the semiconductor devices may receive serious damage when they continue
to operate over the recommended operating conditions.

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TYPICAL APPLICATION AND APPLICATION HINTS

(1) Fixed Output Voltage Type (R1224Nxx2E/F/G/H/L/M except xx=10)
L

PMOS
C1
4
R1
5 VIN EXT VOUT 3
R1224N C3
1 CE GND SD
C2 LOAD
2

CE CONTROL

PMOS: uPA1914 (Renesas) L : CR105NP-270MC (Sumida, 27µH)

SD1 : CMS06 (TOSHIBA) C3 : 47µF (Tantalum Type)
C1 : 10µF (Ceramic Type) C2 : 0.1µF (Ceramic Type)
R1 : 10Ω

(2) Adjustable Output Type (R1224N102G/H/M) Example: Output Voltage=3.2V

L

PMOS C4
C1 R4
4
R1 R3
5 VIN EXT VFB 3
R1224N C3
1 CE GND SD R2
C2 LOAD
2

CE CONTROL

PMOS: uPA1914 (Renesas) L : CR105NP-270MC (Sumida, 27µH)

SD1 : CMS06 (TOSHIBA) C3 : 47µF (Tantalum Type)
C1 : 10µF (Ceramic Type) C2 : 0.1µF (Ceramic Type) C4: 1000pF (Ceramic Type)
R1 : 10Ω, R2=22kΩ, R3=2.7kΩ, R4=33kΩ

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When you use these ICs, consider the following issues;

⋅As shown in the block diagram, a parasitic diode is formed in each terminal, each of these diodes is not formed
for load current, therefore do not use it in such a way. When you control the CE pin by another power supply, do
not make its “H” level more than the voltage level of VIN pin.

⋅Set external components as close as possible to the IC and minimize the connection between the components
and the IC. In particular, a capacitor should be connected to VIN pin with the minimum connection. Make sufficient
ground and reinforce supplying. A large switching current could flow through the connection of power supply, an
inductor and the connection of VIN. If the impedance of the connection of power supply is high, the voltage level
of power supply of the IC fluctuates with the switching current. This may cause unstable operation of the IC.

⋅Protection circuit may work if the maximum duty cycle continue for the time defined in the electrical characteristics.
Once after stopping the output voltage, output will restart with soft-start operation. If the difference between input
voltage and output voltage is small, the protection circuit may work.

⋅Use capacitors with a capacity of 22µF or more for VOUT pin, and with good high frequency characteristics such
as tantalum capacitors. We recommend you to use output capacitors with an allowable voltage at least twice as
much as setting output voltage. This is because there may be a case where a spike-shaped high voltage is
generated by an inductor when an external transistor is on and off.

⋅Choose an inductor that has sufficiently small D.C. resistance and large allowable current and is hard to reach
magnetic saturation. And if the value of inductance of an inductor is extremely small, the ILX may exceed the
absolute maximum rating at the maximum loading.
Use an inductor with appropriate inductance.

⋅Use a diode of a Schottky type with high switching speed, and also pay attention to its current capacity.

⋅Do not use this IC under the condition with VIN voltage at equal or less than minimum operating voltage.

⋅When the threshold level of an external power MOSFET is rather low and the drive-ability of voltage supplier is
small, if the output pin is short circuit, input voltage may be equal or less than UVLO detector threshold. In this
case, the devise is reset with UVLO function that is different from the reset-protection function caused by
maximum duty cycle.

⋅With the PWM/VFM alternative circuit, when the on duty cycle of switching is 35% or less, the R1224N alters
from PWM mode to VFM mode (Pulse skip mode). The purpose of this circuit is raising the efficiency with a light
load by skipping the frequency and suppressing the consumption current. However, the ratio of output voltage
against input voltage is 35% or less, (ex. VIN>8.6V and VOUT=3.0V) even if the large current may be loaded, the
IC keeps its VFM mode. As a result, frequency might be decreased, and oscillation waveform might be unstable.
These phenomena are the typical characteristics of the IC with PWM/VFM alternative circuit.

⋅If the input voltage is equal or more than 6V, R1 and C2 in the typical application are necessary as a VIN filter to
prevent unstable operation.

The performance of power source circuits using these ICs extremely depends upon the peripheral circuits.
Pay attention in the selection of the peripheral circuits. In particular, design the peripheral circuits in a way that
the values such as voltage, current, and power of each component, PCB patterns and the IC do not exceed their
respected rated values.

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How to Adjust Output Voltage and about Phase Compensation

As for Adjustable Output type, feedback pin (VFB) voltage is controlled to maintain 1.0V.
Output Voltage, VOUT is as following equation:

VOUT: R2+R4=VFB: R2
VOUT=VFB×(R2+R4)/R2

Thus, with changing the value of R2 and R4, output voltage can be set in the specified range.
In the DC/DC converter, with the load current and external components such as L and C, phase might be behind
180 degree. In this case, the phase margin of the system will be less and stability will be worse. To prevent this,
phase margin should be secured with proceeding the phase. A pole is formed with external components L and
C3.

Fpole ~ 1/2π L × C3

A zero (signal back to zero) is formed with R4 and C4.

≅Fzero~1/(2π×R4×C4)

For example, if L=27µH, C3=47µF, the cut off frequency of the pole is approximately 4.5kHz.
To make the cut off frequency of the pole as much as 4.5kHz, set R4=33kΩ and C4=1000pF.
If VOUT is set at 2.5V, R2=22kΩ is appropriate.
R3 prevents feedback of the noise to VFB pin, about 2.7kΩ is appropriate value.

PMOS C4
C1 R4
4
R1 R3
5 VIN EXT VFB 3
R1224N C3
1 CE GND SD R2
C2 LOAD
2

CE CONTROL

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OPERATION of step-down DC/DC converter and Output Current

The step-down DC/DC converter charges energy in the inductor when Lx transistor is ON, and discharges the
energy from the inductor when Lx transistor is OFF and controls with less energy loss, so that a lower output
voltage than the input voltage is obtained. The operation will be explained with reference to the following
diagrams:
<Basic Circuits> <Current through L>
i1 IL ILmax
IOUT
VIN Lx Tr L VOUT ILmin
topen

SD i2
CL
ton toff
GND
T=1/fosc

Step 1: Lx Tr. turns on and current IL (=i1) flows, and energy is charged into CL. At this moment, IL increases
from ILmin. (=0) to reach ILmax. in proportion to the on-time period (ton) of Lx Tr.
Step 2: When Lx Tr. turns off, Schottky diode (SD) turns on in order that L maintains IL at ILmax, and current IL
(=i2) flows.
Step 3: IL decreases gradually and reaches ILmin. after a time period of topen, and SD turns off, provided that
in the continuous mode, next cycle starts before IL becomes to 0 because toff time is not enough. In this
case, IL value is from this ILmin (>0).

In the case of PWM control system, the output voltage is maintained by controlling the on-time period (ton), with
the oscillator frequency (fosc) being maintained constant.

Discontinuous Conduction Mode and Continuous Conduction Mode

The maximum value (ILmax) and the minimum value (ILmin) current which flow through the inductor is the
same as those when Lx Tr. is ON and when it is OFF.
The difference between ILmax and ILmin, which is represented by ∆I;

∆I=ILmax-ILmin=VOUT×topen/L=(VIN-VOUT)×ton/L ................................... Equation 1

wherein, T=1/fosc=ton+toff
duty (%)=ton/T×100=ton×fosc×100
topen <
= toff

In Equation 1, VOUT×topen/L and (VIN-VOUT)×ton/L are respectively shown the change of the current at ON, and
the change of the current at OFF.
When the output current (IOUT) is relatively small, topen<toff as illustrated in the above diagram. In this case, the
energy is charged in the inductor during the time period of ton and is discharged in its entirely during the time
period of toff, therefore ILmin becomes to zero (ILmin=0). When Iout is gradually increased, eventually, topen
becomes to toff (topen=toff), and when IOUT is further increased, ILmin becomes larger than zero (ILmin>0). The
former mode is referred to as the discontinuous mode and the latter mode is referred to as continuous mode.

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In the continuous mode, when Equation 1 is solved for ton and assumed that the solution is tonc,

tonc=T×VOUT/VIN ..................................................................................... Equation 2

When ton<tonc, the mode is the discontinuous mode, and when ton=tonc, the mode is the continuous mode.

OUTPUT CURRENT AND SELECTION OF EXTERNAL COMPONENTS

When Lx Tr. is ON:

(Wherein, Ripple Current P-P value is described as IRP, ON resistance of Lx Tr. is described as Rp the direct
current of the inductor is described as RL.)

VIN=VOUT+(Rp+RL)×IOUT+L×IRP/ton .................................................Equation 3

When Lx Tr. is OFF:

L×IRP/toff=VF+VOUT+RL×IOUT ............................................................ Equation 4

Put Equation 4 to Equation 3 and solve for ON duty, ton/(toff+ton)=DON,

DON=(VOUT+VF+RL×IOUT)/(VIN+VF−Rp×IOUT) ......................................Equation 5

Ripple Current is as follows;

IRP=(VIN−VOUT−Rp×IOUT−RL×IOUT)×DON/f/L ........................................Equation 6

Wherein, peak current that flows through L, Lx Tr., and SD is as follows;

ILmax=IOUT+IRP/2 ............................................................................ Equation 7

Consider ILmax, condition of input and output and select external components.

 The above explanation is directed to the calculation in an ideal case in continuous mode.

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External Components
1. Inductor
Select an inductor that peak current does not exceed ILmax. If larger current than allowable current flows,
magnetic saturation occurs and make transform efficiency worse.
When the load current is definite, the smaller value of L, the larger the ripple current.
Provided that the allowable current is large in that case and DC current is small, therefore, for large output
current, efficiency is better than using an inductor with a large value of L and vice versa.

2. Diode
Use a diode with low VF (Schottky type is recommended.) and high switching speed.
Reverse voltage rating should be more than VIN and current rating should be equal or more than ILmax.

3. Capacitors
As for CIN, use a capacitor with low ESR (Equivalent Series Resistance) and a capacity of at least 10µF for
stable operation.
COUT can reduce ripple of Output Voltage, therefore 47µF or more value of tantalum type capacitor is
recommended.

4. Lx Transistor
Pch Power MOSFET is required for this IC.
Its breakdown voltage between gate and source should be a few V higher than Input Voltage.
In the case of Input Voltage is low, to turn on MOSFET completely, to use a MOSFET with low threshold
voltage is effective.
If a large load current is necessary for your application and important, choose a MOSFET with low ON
resistance for good efficiency.
If a small load current is mainly necessary for your application, choose a MOSFET with low gate capacity for
good efficiency.
Maximum continuous drain current of MOSFET should be larger than peak current, ILmax.

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TIMING CHART
VOUT Set Output Voltage
VIN UVLO Voltage

Input Voltage UVLO Reset

Rising Time

VOUT Set Output Voltage

CE
Protection Circuit Delay Time

VOUT Set Output

Voltage
EXT

Reset Protection

VOUT Set Output

Voltage
VOUT
Stable Stable Stable
Operation Operation Operation

Soft Start Soft Start Soft Start Soft Start

The timing chart shown above describes the changing process of input voltage rising, stable operating,
operating with large current, stable operating, input voltage falling, input voltage recovering, and stable operating.
First, until when the input voltage (VIN) reaches UVLO voltage, the circuit inside keeps the condition of pre-
standby.
Second, after VIN becomes beyond the UVLO threshold, soft-start operation starts, when the soft-start operation
finishes, the operation becomes stable.
If too large current flows through the circuit because of short or other reasons, EXT signal ignores that during
the delay time of protection circuit. (The current value depends on the circuit.)
After the delay time passes, reset protection works, or EXT signal will be “H”, then output will turn off, then soft-
start operation starts. After the soft-start operation, EXT signal will be “L”, but if the large current is still flowing,
after the delay time of protection circuit passes, reset protection circuit will work again, the operation will be
continuously repeated unless the cause of large current flowing is not removed.
Once the cause of the large current flowing is removed, within the delay time, the operation will be back to the
stable one.
If the timing for release the large current is in the protection process, the operation will be back to the normal
one after the soft-start operation.
If the VIN becomes lower than the set VOUT, that situation is same as large current condition, so protection circuit
may be ready to work, therefore, after the delay time of protection circuit, EXT will be “H”.
Further, if the VIN is lower than UVLO voltage, the circuit inside will be stopped by UVLO function.
After that, if VIN rises, until when the VIN reaches UVLO voltage, the circuit inside keeps the condition of spre-
standby.
Then after VIN becomes beyond the UVLO threshold, soft-start operation starts, when the soft-start operation
finishes, the operation becomes stable.

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TEST CIRCUITS
Output Voltage, Oscillator Frequency, CE “H” Input Voltage, CE “L” Input Voltage, Soft-start time
L1 PMOS

4
Oscilloscope
D1 EXT VIN 5

2 GND R1224N C2
3 V OUT
(VFB)
CE 1
V C1

Supply Current 1 Standby Current

VIN 5 A VIN 5 A

2 GND R1224N 2 GND R1224N

3 V OUT
(VFB)
CE 1 3 V OUT
(VFB)
CE 1

EXT “H” Output Current EXT “L” Output Current

4 EXT VIN 5 4 EXT VIN 5

A 2 GND R1224N A 2 GND R1224N

3 V OUT
(VFB)
CE 1 3 V OUT
(VFB)
CE 1

CE “H” Input Current, CE “L” Input Current Output Delay Time for Protection Circuit

VIN 5 4 EXT VIN 5

Oscilloscope
2 GND R1224N 2 GND R1224N

3 V OUT
(VFB)
CE 1 A 3 V OUT
(VFB)
CE 1 C2

PMOS : HAT1044M (Hitachi) L : CD104NP-270MC (Sumida, 27µH)

SD1 : RB491D (Rohm)
C1 : 47µF (Tantalum Type) C2 : 47µF (Tantalum Type)

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TYPICAL CHARACTERISTICS
1)Output Voltage vs. Output Current (*Note)
R1224N182E L=10µH R1224N182F L=10µH

R1224N182G L=10µH R1224N182H L=10µH

R1224N182L L=27µH R1224N182M L=27µH

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R1224N332E L=10µH R1224N332F L=10µH

R1224N332G L=10µH R1224N332G (VIN=10V)

R1224N332G (VIN=16V) R1224N332H L=10µH

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R1224N332L L=27µH R1224N332M L=27µH

R1224N332M (VIN=5V) R1224N332M (VIN=10V)

R1224N332M (VIN=18V) R1224N502E L=10µH

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R1224N502F L=10µH R1224N502G L=10µH

R1224N502G (VIN=10V) R1224N502G (VIN=16V)

R1224N502H L=10µH R1224N502L L=27µH

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R1224N502M L=27µH

*Note: Typical characteristics 1) are obtained with using

the following components;
PMOS : IRF7406 (IR)
L : CDRH127-100MC (Sumida: 10µH)
SD : RB083L-20 (Rohm)
C1 : 25SC47 (Sanyo/OS-con: 47µF/25V)×2
C2 : 0.1µF (Ceramic Type)
C3 : 10SA220 (Sanyo/OS-con: 220µF/10V)
R1 : 10Ω

2) Efficiency vs. Output Current (*Note)

R1224N182F (VIN=3.3V) CDRH127-10µH R1224N182F (VIN=5.0V) CDRH127-10µH

R1224N182G (VIN=3.3V) CDRH127-10µH R1224N182G (VIN=5.0V) CDRH127-10µH

19
 R1224N
NO.EA-096-181004

R1224N182G (VIN=12V) CDRH127-10µH R1224N182H (VIN=3.3V) CDRH127-10µH

R1224N182H (VIN=5.0V) CDRH127-10µH R1224N182H (VIN=12V) CDRH127-10µH

R1224N182L (VIN=3.3V) CDRH127-27µH R1224N182L (VIN=5.0V) CDRH127-27µH

20
 R1224N
NO.EA-096-181004

R1224N182M (VIN=3.3V) CDRH127-27µH R1224N182M (VIN=5.0V) CDRH127-27µH

R1224N182M (VIN=12V) CDRH127-27µH R1224N332E (VIN=7.0V) CDRH127-10µH

R1224N332E (VIN=4.8V) CDRH127-10µH R1224N332F (VIN=7.0V) CDRH127-10µH

21
 R1224N
NO.EA-096-181004

R1224N332F (VIN=4.8V) CDRH127-10µH R1224N332G (VIN=12V) CDRH127-10µH

R1224N332G (VIN=4.8V) CDRH127-10µH R1224N332G (VIN=10V)

R1224N332G (VIN=16V) R1224N332G (VIN=15V) CDRH127-10µH

22
 R1224N
NO.EA-096-181004

R1224N332H (VIN=12V) CDRH127-10µH R1224N332H (VIN=4.8V) CDRH127-10µH

R1224N332H (VIN=15V) CDRH127-10µH R1224N332L (VIN=7.0V) CDRH127-27µH

R1224N332L (VIN=4.8V) CDRH127-27µH R1224N332M (VIN=12V) CDRH127-27µH

23
 R1224N
NO.EA-096-181004

R1224N332M (VIN=4.8V) CDRH127-27µH R1224N332M (VIN=5V)

R1224N332M (VIN=10V) R1224N332M (VIN=18V)

R1224N332M (VIN=15V) CDRH127-27µH R1224N502E (VIN=6.5V) CDRH127-10µH

24
 R1224N
NO.EA-096-181004

R1224N502E (VIN=10V) CDRH127-10µH R1224N502F (VIN=6.5V) CDRH127-10µH

R1224N502F (VIN=10V) CDRH127-10µH R1224N502G (VIN=10V)

R1224N502G (VIN=16V) R1224N502G (VIN=6.5V) CDRH127-10µH

25
 R1224N
NO.EA-096-181004

R1224N502G (VIN=12V) CDRH127-10µH R1224N502G (VIN=15V) CDRH127-10µH

R1224N502H (VIN=6.5V) CDRH127-10µH R1224N502H (VIN=12V) CDRH127-10µH

R1224N502H (VIN=15V) CDRH127-10µH R1224N502L (VIN=6.5V) CDRH127-27µH

26
 R1224N
NO.EA-096-181004

R1224N502L (VIN=10V) CDRH127-27µH R1224N502M (VIN=6.5V) CDRH127-27µH

R1224N502M (VIN=12V) CDRH127-27µH R1224N502M (VIN=15V) CDRH127-27µH

*Note: Typical characteristics 2) are obtained with using the following components;
PMOS : IRF7406 (IR)
L : CDRH127-100MC (Sumida: 10µH) C2 : 0.1µF (Ceramic Type)
SD : RB083L-20 (Rohm) C3 : 10SA220 (Sanyo/OS-con: 220µF/10V)
C1 : 25SC47 (Sanyo/OS-con: 47µF/25V)×2 R1 : 10Ω

27
 R1224N
NO.EA-096-181004

3) Ripple Voltage vs. Output Current

R1224N182E L=10µH R1224N182F L=10µH

R1224N182G L=10µH R1224N182H L=10µH

R1224N182L L=27µH R1224N182M L=27µH

28
 R1224N
NO.EA-096-181004

R1224N332E L=10µH R1224N332F L=10µH

R1224N332G L=10µH R1224N332H L=10µH

R1224N332L L=27µH R1224N332M L=27µH

29
 R1224N
NO.EA-096-181004

R1224N502E L=10µH R1224N502F L=10µH

R1224N502G L=10µH R1224N502H L=10µH

R1224N502L L=27µH R1224N502M L=27µH

30
 R1224N
NO.EA-096-181004

4) Output Voltage vs. Input Voltage

R1224N182E L=10µH R1224N182F L=10µH

R1224N182G L=10µH R1224N182H L=10µH

R1224N182L L=27µH R1224N182M L=27µH

31
 R1224N
NO.EA-096-181004

R1224N332E L=10µH R1224N332F L=10µH

R1224N332G L=10µH R1224N332H L=10µH

R1224N332L L=27µH R1224N332M L=27µH

32
 R1224N
NO.EA-096-181004

R1224N502E L=10µH R1224N502F L=10µH

R1224N502G L=10µH R1224N502H L=10µH

R1224N502L L=27µH R1224N502M L=27µH

33
 R1224N
NO.EA-096-181004

5) Output Voltage vs. Temperature

R1224N332E R1224N122F

R1224N602L R1224N102G

6) Oscillator Frequency vs. Temperature

R1224N102G R1224N102H

34
 R1224N
NO.EA-096-181004

R1224N102M

7) Supply Current vs. Temperature

R1224N332E R1224N602L

R1224N602F R1224N102G

35
 R1224N
NO.EA-096-181004

R1224N102H R1224N102M

8) Soft-start time vs. Temperature

R1224N102G

9) Delay Time for Protection vs. Temperature

R1224N332E

36
 R1224N
NO.EA-096-181004

10) EXT “H” Output Current vs. Temperature

R1224N332E

11) EXT “L” Output Current vs. Temperature

R1224N332E

12) Load Transient Response

R1224N332G L=10µH VIN=4.8V R1224N332G L=10µH VIN=4.8V

37
 R1224N
NO.EA-096-181004

R1224N332G L=10µH VIN=10V R1224N332G L=10µH VIN=10V

R1224N332H L=10µH VIN=4.8V R1224N332H L=10µH VIN=4.8V

R1224N332H L=10µH VIN=10V R1224N332H L=10µH VIN=10V

38
 R1224N
NO.EA-096-181004

R1224N332M L=27µH VIN=4.8V R1224N332M L=27µH VIN=4.8V

R1224N332M L=27µH VIN=10V R1224N332M L=27µH VIN=10V

12) UVLO Voltage vs. Temperature

R1224N332E

39
 1. The products and the product specifications described in this document are subject to change or discontinuation of
production without notice for reasons such as improvement. Therefore, before deciding to use the products, please
refer to Ricoh sales representatives for the latest information thereon.
2. The materials in this document may not be copied or otherwise reproduced in whole or in part without prior written
consent of Ricoh.
3. Please be sure to take any necessary formalities under relevant laws or regulations before exporting or otherwise
taking out of your country the products or the technical information described herein.
4. The technical information described in this document shows typical characteristics of and example application circuits
for the products. The release of such information is not to be construed as a warranty of or a grant of license under
Ricoh's or any third party's intellectual property rights or any other rights.
5. The products listed in this document are intended and designed for use as general electronic components in standard
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6. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products
are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from
such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy
feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or
damage arising from misuse or inappropriate use of the products.
7. Anti-radiation design is not implemented in the products described in this document.
8. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and
characteristics in the evaluation stage.
9. WLCSP products should be used in light shielded environments. The light exposure can influence functions and
characteristics of the products under operation or storage.
10. There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the
case of recognizing the marking characteristic with AOI, please contact Ricoh sales or our distributor before attempting
to use AOI.
11. Please contact Ricoh sales representatives should you have any questions or comments concerning the products or
the technical information.

Ricoh is committed to reducing the environmental loading materials in electrical devices

with a view to contributing to the protection of human health and the environment.
Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since
Halogen Free April 1, 2012.

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