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SEMICONDUCTOR TECHNICAL DATA by MPX200/D



 
 


 
The MPX200 series device is a silicon piezoresistive pressure sensors provide a very 0 to 200 kPa (0 – 29 psi)
accurate and linear voltage output — directly proportional to the applied pressure. This 60 mV FULL SCALE SPAN
standard, low cost, uncompensated sensor permits manufacturers to design and add (TYPICAL)
their own external temperature compensating and signal conditioning networks.
Compensation techniques are simplified because of the predictability of Motorola’s single
element strain gauge design.
Features
• Low Cost
• Patented Silicon Shear Stress Strain Gauge
• ± 0.25% (Max) Linearity
• Full Scale Span 60 mV (Typ) BASIC CHIP
• Easy to Use Chip Carrier Package Options CARRIER ELEMENT
CASE 344–15, STYLE 1
• Ratiometric to Supply Voltage
• Absolute, Differential and Gauge Options
Application Examples
• Pump/Motor Controllers
• Robotics
• Level Indicators
• Medical Diagnostics
• Pressure Switching
• Barometers DIFFERENTIAL
PORT OPTION
• Altimeters
CASE 344C–01, STYLE 1
Figure 1 illustrates a schematic of the internal circuitry on the stand–alone pressure
sensor chip. NOTE: Pin 1 is the notched pin.
PIN 3 + VS
PIN NUMBER
PIN 2
+ Vout 1 Gnd 3 VS
X–ducer 2 +Vout 4 –Vout

PIN 4
– Vout

PIN 1

Figure 1. Uncompensated Pressure Sensor Schematic

VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE

The differential voltage output of the X–ducer is directly proportional to the differential
pressure applied.
The absolute sensor has a built–in reference vacuum. The output voltage will decrease
as vacuum, relative to ambient, is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor increases with increasing
pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly,
output voltage increases as increasing vacuum is applied to the vacuum (P2) side
relative to the pressure (P1) side.
Senseon and X–ducer are trademarks of Motorola, Inc.
REV 7

Motorola Sensor Device Data 1

 Motorola, Inc. 1997

 
MAXIMUM RATINGS
Rating Symbol Value Unit
Overpressure(8) (P1 > P2) Pmax 400 kPa
Burst Pressure(8) (P1 > P2) Pburst 2000 kPa
Storage Temperature Tstg – 40 to +125 °C
Operating Temperature TA – 40 to +125 °C

OPERATING CHARACTERISTICS (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic Symbol Min Typ Max Unit
Pressure Range(1) POP 0 — 200 kPa
Supply Voltage(2) VS — 3.0 6.0 Vdc
Supply Current Io — 6.0 — mAdc
Full Scale Span(3) VFSS 45 60 90 mV
Offset(4) Voff 0 20 35 mV
Sensitivity ∆V/∆P — 0.3 — mV/kPa
Linearity(5) — – 0.25 — 0.25 %VFSS
Pressure Hysteresis(5) (0 to 200 kPa) — — ± 0.1 — %VFSS
Temperature Hysteresis(5) (– 40°C to +125°C) — — ± 0.5 — %VFSS
Temperature Coefficient of Full Scale Span(5) TCVFSS – 0.22 — – 0.16 %VFSS/°C
Temperature Coefficient of Offset(5) TCVoff — ±15 — µV/°C
Temperature Coefficient of Resistance(5) TCR 0.21 — 0.27 %Zin/°C
Input Impedance Zin 400 — 550 Ω
Output Impedance Zout 750 — 1800 Ω
Response Time(6) (10% to 90%) tR — 1.0 — ms
Warm–Up — — 20 — ms
Offset Stability(9) — — ± 0.5 — %VFSS

MECHANICAL CHARACTERISTICS
Characteristic Symbol Min Typ Max Unit
Weight (Basic Element Case 344–15) — — 2.0 — Grams
Common Mode Line Pressure(7) — — — 690 kPa
NOTES:
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self–heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
• Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
• TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
• TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
to 25°C.
• TCR: Zin deviation with minimum rated pressure applied, over the temperature range of – 40°C to +125°C,
relative to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Common mode pressures beyond specified may result in leakage at the case–to–lead interface.
8. Exposure beyond these limits may cause permanent damage or degradation to the device.
9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

2 Motorola Sensor Device Data

 
 
LINEARITY proportional to the pressure applied to the device. This de-
Linearity refers to how well a transducer’s output follows vice uses a unique transverse voltage diffused semiconduc-
the equation: Vout = Voff + sensitivity x P over the operating tor strain gauge which is sensitive to stresses produced in a
pressure range (see Figure 2). There are two basic methods thin silicon diaphragm by the applied pressure.
for calculating nonlinearity: (1) end point straight line fit or (2) Because this strain gauge is an integral part of the silicon
a least squares best line fit. While a least squares fit gives diaphragm, there are no temperature effects due to differ-
the “best case” linearity error (lower numerical value), the
ences in the thermal expansion of the strain gauge and the
calculations required are burdensome.
diaphragm, as are often encountered in bonded strain gauge
Conversely, an end point fit will give the “worse case” error
(often more desirable in error budget calculations) and the pressure sensors. However, the properties of the strain
calculations are more straightforward for the user. Motorola’s gauge itself are temperature dependent, requiring that the
specified pressure sensor linearities are based on the end device be temperature compensated if it is to be used over
point straight line method measured at the midrange an extensive temperature range.
pressure. Temperature compensation and offset calibration can be
TEMPERATURE COMPENSATION achieved rather simply with additional resistive components
Figure 3 shows the typical output characteristics of the or by designing your system using the MPX2200 series
MPX200 series over temperature. The output is directly pro- sensors.
portional to the pressure and is essentially a straight line. Several approaches to external temperature compensa-
The X–ducer piezoresistive pressure sensor element is a tion over both – 40 to +125°C and 0 to + 80°C ranges are
semiconductor device which gives an electrical output signal presented in Motorola Applications Note AN840.

70
LINEARITY
60 70

VS = 3.0 Vdc – 40°C

50 60 +25°C SPAN
P1 > P2
OUTPUT (mVdc)

ACTUAL RANGE
50
OUTPUT (mVdc)
40 +125°C (TYP)
SPAN
40
(VFSS)
30
30
20 THEORETICAL
20
OFFSET
10 OFFSET 10 (TYP)
(VOFF) 0
0 0 4.0 8.0 12 16 20 24 28 30
0 MAX POP PSI 20 40 60 80 100 120 140 160 180 200
kPa PRESSURE DIFFERENTIAL
PRESSURE (kPA)

Figure 2. Linearity Specification Comparison Figure 3. Output versus Pressure Differential

SILICONE GEL DIFFERENTIAL/GAUGE SILICONE GEL ABSOLUTE

DIE COAT DIE STAINLESS STEEL STAINLESS STEEL
DIE COAT

ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ
METAL COVER DIE METAL COVER
P1 P1

ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ
EPOXY EPOXY
WIRE BOND CASE WIRE BOND CASE

ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ
LEAD FRAME ÉÉÉÉÉÉÉÉÉÉÉ
DIFFERENTIAL/GAUGE ELEMENT
DIE
BOND
LEAD FRAME ÉÉÉÉÉÉÉÉÉÉÉ ABSOLUTE ELEMENT
DIE
BOND
P2 P2

Figure 4. Cross–Sectional Diagrams (Not to Scale)

Figure 4 illustrates the absolute sensing configuration characteristics and internal reliability and qualification tests
(right) and the differential or gauge configuration in the basic are based on use of dry air as the pressure media. Media
chip carrier (Case 344–15). A silicone gel isolates the die other than dry air may have adverse effects on sensor perfor-
surface and wire bond from the environment, while allowing mance and long term reliability. Contact the factory for in-
the pressure signal to be transmitted to the silicon dia- formation regarding media compatibility in your application.
phragm. The MPX200 series pressure sensor operating

Motorola Sensor Device Data 3


 
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Motorola designates the two sides of the pressure sensor tial pressure applied, P1 > P2. The absolute sensor is de-
as the Pressure (P1) side and the Vacuum (P2) side. The signed for vacuum applied to P1 side.
Pressure (P1) side is the side containing the silicone gel The Pressure (P1) side may be identified by using the
which isolates the die from the environment. The differential table below:
or gauge sensor is designed to operate with positive differen-

Part Number Case Type Pressure (P1) Side Identifier

MPX200A, MPX200D 344–15C Stainless Steel Cap
MPX200DP 344C–01 Side with Part Marking
MPX200AP, MPX200GP 344B–01 Side with Port Attached
MPX200GVP 344D–01 Stainless Steel Cap
MPX200AS, MPX200GS 344E–01 Side with Port Attached
MPX200GSX 344F–01 Side with Port Attached
MPX200GVSX 344G–01 Stainless Steel Cap

ORDERING INFORMATION
MPX200 series pressure sensors are available in absolute, differential and gauge configurations. Devices are available in the
basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose
pressure connections.

MPX Series
D i T
Device Type O i
Options C
Case Type
T Order Number Device Marking
Basic Element Absolute, Differential Case 344–15 MPX200A MPX200A
MPX200D MPX200D
Ported Elements Differential Case 344C–01 MPX200DP MPX200DP
Absolute, Gauge Case 344B–01 MPX200AP MPX200AP
MPX200GP MPX200GP
Gauge Vacuum Case 344D–01 MPX200GVP MPX200GVP
Absolute, Gauge Stove Pipe Case 344E–01 MPX200AS MPX200A
MPX200GS MPX200D
Gauge Axial Case 344F–01 MPX200ASX MPX200A
MPX200GSX MPX200D
Gauge Vacuum Axial Case 344G–01 MPX200GVSX MPX200D

4 Motorola Sensor Device Data

 
 
PACKAGE DIMENSIONS

NOTES:
C
POSITIVE 1. DIMENSIONING AND TOLERANCING PER ASME
R PRESSURE (P1) Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION –A– IS INCLUSIVE OF THE MOLD
M STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
B –A– INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.595 0.630 15.11 16.00
N B 0.514 0.534 13.06 13.56
PIN 1 1 2 3 4 L C 0.200 0.220 5.08 5.59
D 0.016 0.020 0.41 0.51
–T– F 0.048 0.064 1.22 1.63
SEATING G 0.100 BSC 2.54 BSC
PLANE J 0.014 0.016 0.36 0.40
J POSITIVE G
L 0.695 0.725 17.65 18.42
PRESSURE F M 30_ NOM 30_ NOM
(P1)
D 4 PL N 0.475 0.495 12.07 12.57
0.136 (0.005) M T A M R 0.430 0.450 10.92 11.43

STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. – OUTPUT

CASE 344–15
ISSUE W

NOTES:
SEATING –T– –A– 1. DIMENSIONING AND TOLERANCING PER ANSI
PLANE Y14.5, 1982.
U 2. CONTROLLING DIMENSION: INCH.
R L
H INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 1.145 1.175 29.08 29.85
N PORT #1 B 0.685 0.715 17.40 18.16
POSITIVE –Q– C 0.305 0.325 7.75 8.26
PRESSURE D 0.016 0.020 0.41 0.51
(P1) F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
H 0.182 0.194 4.62 4.93
B J 0.014 0.016 0.36 0.41
K 0.695 0.725 17.65 18.42
1 2 3 4 L 0.290 0.300 7.37 7.62
PIN 1 N 0.420 0.440 10.67 11.18
K
–P– P 0.153 0.159 3.89 4.04
Q 0.153 0.159 3.89 4.04
0.25 (0.010) M T Q S S R 0.230 0.250 5.84 6.35
S 0.220 0.240 5.59 6.10
J F U 0.910 BSC 23.11 BSC
C G
D 4 PL
0.13 (0.005) M T S S Q S
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. – OUTPUT

CASE 344B–01
ISSUE B

Motorola Sensor Device Data 5


 
PACKAGE DIMENSIONS — CONTINUED

–A– NOTES:
V 1. DIMENSIONING AND TOLERANCING PER ANSI
U Y14.5M, 1982.
PORT #1
R W L 2. CONTROLLING DIMENSION: INCH.
H INCHES MILLIMETERS
PORT #2 PORT #1 DIM MIN MAX MIN MAX
PORT #2
VACUUM POSITIVE PRESSURE A 1.145 1.175 29.08 29.85
N (P2) (P1) B 0.685 0.715 17.40 18.16
C 0.405 0.435 10.29 11.05
–Q– D 0.016 0.020 0.41 0.51
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
SEATING B SEATING
H 0.182 0.194 4.62 4.93
PLANE PLANE
J 0.014 0.016 0.36 0.41
1 2 3 4
PIN 1 K 0.695 0.725 17.65 18.42
K L 0.290 0.300 7.37 7.62
–P– N 0.420 0.440 10.67 11.18
–T– –T– 0.25 (0.010) M T Q S S P 0.153 0.159 3.89 4.04
Q 0.153 0.159 3.89 4.04
J F R 0.063 0.083 1.60 2.11
C G S 0.220 0.240 5.59 6.10
U 0.910 BSC 23.11 BSC
D 4 PL V 0.248 0.278 6.30 7.06
0.13 (0.005) M T S S Q S W 0.310 0.330 7.87 8.38

STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. – OUTPUT

CASE 344C–01
ISSUE B

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
–A– Y14.5, 1982.
2. CONTROLLING DIMENSION: INCH.
U
SEATING
–T– PLANE
INCHES MILLIMETERS
L DIM MIN MAX MIN MAX
R PORT #2 H A 1.145 1.175 29.08 29.85
VACUUM POSITIVE B 0.685 0.715 17.40 18.16
(P2) PRESSURE C 0.305 0.325 7.75 8.26
(P1)
D 0.016 0.020 0.41 0.51
N F 0.048 0.064 1.22 1.63
–Q– G 0.100 BSC 2.54 BSC
H 0.182 0.194 4.62 4.93
J 0.014 0.016 0.36 0.41
K 0.695 0.725 17.65 18.42
B L 0.290 0.300 7.37 7.62
N 0.420 0.440 10.67 11.18
P 0.153 0.159 3.89 4.04
1 2 3 4 Q 0.153 0.158 3.89 4.04
K R 0.230 0.250 5.84 6.35
PIN 1 S 0.220 0.240 5.59 6.10
S U 0.910 BSC 23.11 BSC

C F
–P– G STYLE 1:
J 0.25 (0.010) M T Q S PIN 1. GROUND
D 4 PL 2. + OUTPUT
0.13 (0.005) M T S S Q S 3. + SUPPLY
4. – OUTPUT

CASE 344D–01
ISSUE B

6 Motorola Sensor Device Data

 
 
PACKAGE DIMENSIONS — CONTINUED

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
PORT #1 C A Y14.5M, 1982.
POSITIVE
PRESSURE BACK SIDE 2. CONTROLLING DIMENSION: INCH.
(P1) VACUUM
(P2) INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.690 0.720 17.53 18.28
B 0.245 0.255 6.22 6.48
–B– V C 0.780 0.820 19.81 20.82
4 3 2 1 D 0.016 0.020 0.41 0.51
F 0.048 0.064 1.22 1.63
PIN 1
G 0.100 BSC 2.54 BSC
J 0.014 0.016 0.36 0.41
K 0.345 0.375 8.76 9.53
K N 0.300 0.310 7.62 7.87
S R 0.178 0.186 4.52 4.72
S 0.220 0.240 5.59 6.10
V 0.182 0.194 4.62 4.93
N J G
STYLE 1:
R F PIN 1. GROUND
D 4 PL 2. + OUTPUT
SEATING 3. + SUPPLY
PLANE –T– 0.13 (0.005) M T B M 4. – OUTPUT

CASE 344E–01
ISSUE B

–T– NOTES:
C 1. DIMENSIONING AND TOLERANCING PER
A ANSI Y14.5M, 1982.
–Q–
E U 2. CONTROLLING DIMENSION: INCH.

INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 1.080 1.120 27.43 28.45
B 0.740 0.760 18.80 19.30
C 0.630 0.650 16.00 16.51
N D 0.016 0.020 0.41 0.51
V B E 0.160 0.180 4.06 4.57
F 0.048 0.064 1.22 1.63
R G 0.100 BSC 2.54 BSC
J 0.014 0.016 0.36 0.41
PORT #1 K 0.220 0.240 5.59 6.10
PIN 1
POSITIVE –P– N 0.070 0.080 1.78 2.03
PRESSURE P 0.150 0.160 3.81 4.06
(P1) 0.25 (0.010) M T Q M 4 3 2 1 Q 0.150 0.160 3.81 4.06
S R 0.440 0.460 11.18 11.68
S 0.695 0.725 17.65 18.42
K U 0.840 0.860 21.34 21.84
V 0.182 0.194 4.62 4.92
J F
G
STYLE 1:
D 4 PL PIN 1. GROUND
0.13 (0.005) M T P S Q S 2. V (+) OUT
3. V SUPPLY
4. V (–) OUT

CASE 344F–01
ISSUE B

Motorola Sensor Device Data 7


 
PACKAGE DIMENSIONS — CONTINUED

NOTES:
–T– 1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
C A 2. CONTROLLING DIMENSION: INCH.
–Q–
E U INCHES MILLIMETERS
DIM MIN MAX MIN MAX
POSITIVE A 1.080 1.120 27.43 28.45
PRESSURE B 0.740 0.760 18.80 19.30
(P1) C 0.630 0.650 16.00 16.51
D 0.016 0.020 0.41 0.51
N E 0.160 0.180 4.06 4.57
V B F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
R J 0.014 0.016 0.36 0.41
K 0.220 0.240 5.59 6.10
PORT #2 PIN 1 N 0.070 0.080 1.78 2.03
VACUUM –P– P 0.150 0.160 3.81 4.06
(P2) Q 0.150 0.160 3.81 4.06
0.25 (0.010) M T Q M 1 2 3 4 R 0.440 0.460 11.18 11.68
S S 0.695 0.725 17.65 18.42
U 0.840 0.860 21.34 21.84
K V 0.182 0.194 4.62 4.92

J F
G STYLE 1:
PIN 1. GROUND
2. V (+) OUT
D 4 PL 3. V SUPPLY
0.13 (0.005) M T P S Q S 4. V (–) OUT

CASE 344G–01
ISSUE B

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
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Opportunity/Affirmative Action Employer.
Mfax is a trademark of Motorola, Inc.
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8 ◊ MPX200/D
Motorola Sensor Device Data