Features Description
Features Description
Features Description
3A Monolithic Buck-Boost
Supercapacitor Charger and
Balancer with Accurate Input Current Limit
FEATURES DESCRIPTION
n ±2% Accurate Average Input Current Limit The LTC®3128 is a highly efficient, buck-boost DC/DC
Programmable Up to 3A supercapacitor charger. It operates efficiently from input
n Programmable Maximum Capacitor Voltage Limit voltages above, below or equal to the output voltage. The
n Active Charge Balancing for Fast Charging of LTC3128 incorporates accurate programmable average
Unmatched Capacitors input current limit, active charge balancing and program-
n Charges Single or Stacked Capacitors mable maximum capacitor voltage. This combination of
n V Range: 1.73V to 5.5V features makes the LTC3128 ideal for safely charging and
IN
n V
OUT Range: 1.8V to 5.5V protecting large capacitors in backup power systems. The
n <2µA Quiescent Current from V
OUT When Charged input current limit and maximum capacitor voltage are each
n Output Disconnect in Shutdown: <1µA I Shutdown programmed using a single resistor. Average input current
Q
n Power-Good Comparator is accurately controlled over a 0.5A to 3A programmable
n Power Failure Indicator range while the individual maximum capacitor voltage can
n Thermally Enhanced 20-Lead (4mm × 5mm × 0.75mm) be set from 1.8V to 3.0V.
QFN and 24-Lead TSSOP Packages
Other features of the LTC3128 include <2µA quiescent
APPLICATIONS current from VOUT in Burst Mode®operation, accurate
power-good and power failure indicators, and thermal
n Supercapacitor Based Backup Power overload protection. The LTC3128 is offered in low profile,
n Memory Backup thermally enhanced 20-Lead 4mm × 5mm × 0.75mm QFN
n Servers, RAID, RF Systems and 24-Lead TSSOP packages.
n Industrial, Communications, Computing L, LT, LTC, LTM, Burst Mode, Linear Technology and the Linear logo are registered trademarks
and PowerPath is a trademark of Linear Technology Corporation. All other trademarks are the
property of their respective owners.
TYPICAL APPLICATION
Wide VIN (3A Programmed Input Current) to 4.2V
3.3µH Stacked Output Capacitors Charging Waveform
3128 TA01b
3128 TA01 2 SECONDS/DIV
C1: Murata DMF3Z5R5H474M3DTA0
3128f
PIN CONFIGURATION
TOP VIEW
TOP VIEW
SW1 1 24 SW2
SW1
SW2
SW2
GND 2 23 SW2
NC
20 19 18 17 GND 3 22 NC
VIN 11 14 PFI
GND 12 13 PFO
UFD PACKAGE
20-LEAD (4mm × 5mm) PLASTIC QFN
FE PACKAGE
TJMAX = 125°C, θJA = 43°C/W 24-LEAD PLASTIC TSSOP
EXPOSED PAD (PIN 21) IS GND, MUST BE SOLDERED TO PCB (NOTE 5) TJMAX = 125°C, θJA = 38°C/W
EXPOSED PAD (PIN 25) SHOULD BE SOLDERED TO PCB (NOTE 5)
ORDER INFORMATION
LEAD FREE FINISH TAPE AND REEL PART MARKING PACKAGE DESCRIPTION TEMPERATURE RANGE
LTC3128EUFD#PBF LTC3128EUFD#TRPBF 3128 20-Lead (4mm × 5mm) Plastic QFN –40°C to 125°C
LTC3128IUFD#PBF LTC3128IUFD#TRPBF 3128 20-Lead (4mm × 5mm) Plastic QFN –40°C to 125°C
LTC3128EFE#PBF LTC3128EFE#TRPBF LTC3128FE 24-Lead Plastic TSSOP –40°C to 125°C
LTC3128IFE#PBF LTC3128IFE#TRPBF LTC3128FE 24-Lead Plastic TSSOP –40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
3128f
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Note 1. Stresses beyond those listed under Absolute Maximum Ratings Note 3. Current measurements are made when the output is not switching.
may cause permanent damage to the device. Exposure to any Absolute Note 4. This IC includes overtemperature protection that is intended
Maximum Rating condition for extended periods may affect device to protect the device during momentary overload conditions. Junction
reliability and lifetime. temperature will exceed 125°C when overtemperature protection is active.
Note 2. The LTC3128 is tested under pulsed load conditions such that TJ ≈ Continuous operation above the specified maximum operating junction
TA. The LTC3128E is guaranteed to meet specifications from 0°C to 85°C temperature may result in device degradation or failure.
junction temperature. Specifications over the –40°C to 125°C operating Note 5. Failure to solder the exposed backside of the package to the PC
junction temperature range are assured by design, characterization and board ground plane will result in a thermal resistance much higher than
correlation with statistical process controls. The LTC3128I is guaranteed 43°C/W in the QFN and 38°C/W in the TSSOP.
over the full –40°C to 125°C operating junction temperature range. Note 6. Guaranteed by design. Not tested.
The junction temperature (TJ) is calculated from the ambient temperature Note 7. Accuracy of this specification is directly related to the accuracy of
(TA) and power dissipation (PD) according to the formula: TJ = TA + (PD the resistor used to program the parameter.
• θJA°C/W), where θJA is the package thermal impedance. Note that the
maximum ambient temperature consistent with these specifications is
determined by specific operating conditions in conjunction with board
layout, the rated package thermal resistance and other environmental
factors.
3128f
Efficiency vs VOUT (0.5A IIN) Efficiency vs VOUT (1.0A IIN) Efficiency vs VOUT (2.0A IIN)
100 100 100
90
90 90
80
80 70
80
EFFICIENCY (%)
EFFICIENCY (%)
EFFICIENCY (%)
60
70
70 50
60
40
60
VIN = 1.7V 50 VIN = 1.7V 30
VIN = 2.4V VIN = 2.4V VIN = 2.4V
20 VIN = 3.3V
50 VIN = 3.3V VIN = 3.3V
40 VIN = 4.2V
VIN = 4.2V VIN = 4.2V 10
VIN = 5.0V VIN = 5.0V VIN = 5.0V
40 30 0
0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
VOUT (V) VOUT (V) VOUT (V)
3128 G01 3128 G02 3128 G03
80 5.0
0.5 4.5
70
4.0
60 0
EFFICIENCY (%)
VOUT vs Charge Time, COUT = 1F, VOUT vs Charge Time, COUT = 1F, VOUT vs Charge Time, COUT = 1F,
RESR = 20mΩ, IIN = 1.0A RESR = 20mΩ, IIN = 2.0A RESR = 20mΩ, IIN = 3.0A
5.5 5.5 5.5
5.0 5.0 5.0
4.5 4.5 4.5
4.0 4.0 4.0
3.5 3.5 3.5
VOUT (V)
VOUT (V)
VOUT (V)
3128f
Maximum Programmable IIN VIN Quiescent Current vs VIN VIN Quiescent Current
vs VIN (Burst Mode Operation Sleep) vs VIN (Input UVLO)
3.25 13.6 40.0
13.4 35.0
3.00
13.2
30.0
VOUT Quiescent Current vs VOUT Feedback Voltage vs Temperature PFI Voltage vs Temperature
(Burst Mode Operation Sleep) (Normalized) (Normalized)
1.8 0.00 0.05
NORMALIZED FEEDBACK VOLTAGE (%)
1.7 0.00
0.05
0.10
1.5 –0.10
1.2 –0.25
0.25
1.1 –0.30
0.30
1.0 –0.35
80 80
–0.05
70 70
–0.10
60 60
RESISTANCE (Ω)
RESISTANCE (Ω)
50 –0.15 50
40 –0.20 40
30 30
–0.25
20 20
–0.30
10 10
0 –0.35 0
1.7 2.1 2.5 2.9 3.3 3.7 4.1 4.5 4.9 5.3 –45 –25 –5 15 35 55 75 95 115 1.7 2.1 2.5 2.9 3.3 3.7 4.1 4.5 4.9 5.3
VIN (V) TEMPERATURE (°C) VIN (V)
3128 G12 3128 G13 3128 G14
3128f
0.8 6
0.6
5
MAXIMUM
–0.2 MINIMUM
2 (0°C TO 85°C)
–0.4
1
–0.6
–0.8 0
–45 –25 –5 15 35 55 75 95 115 2.7 3.1 3.5 8.9 4.3 4.7 5.1 5.5
TEMPERATURE (°C) VOUT (V)
3128 G15 3128 G16
VOUT IIN
2V/DIV 2A/DIV
VMID
2V/DIV
RUN VOUT
5V/DIV 2V/DIV
VMID
IIN 5V/DIV
0.5A/DIV
3128f
SW1 (Pins 1, 19/Pins 1, 4): Switch pin where internal MAXV (Pin 10/Pin 15): Sets the maximum capacitor
switches A and B are connected. Connect an inductor voltage across each capacitor. Connect a resistor from
from SW1 to SW2. MAXV to GND. See below for component value selection.
If charging only a single capacitor, tie this pin to ground.
RSENP (Pin 2/Pin 5): Sense Resistor Power Output.
Connect other loads in the system to this pin. A 10µF or RMAXV (kΩ) = 50 • VMAXV(V)
greater ceramic capacitor should be placed as close to FB (Pin 11/Pin 16): Output Voltage Feedback Pin. Connect
RSENP and GND as possible. resistor divider tap here. The output voltage can be adjusted
RSENS (Pin 3/Pin 6): Sense Resistor Signal Input. This from 1.8V to 5.5V. The feedback reference voltage is 0.58V.
pin should be connected to RSENP through as short and VOUT (V) = 0.58 • (1+R2/R1)
wide a trace as possible.
PGOOD (Pin 12/Pin 17): Power Good Indicator. This is an
RUN (Pin 4/Pin 7): Logic-Controlled Shutdown Input. open-drain output that pulls low when VOUT is less than
RUN ≥ 1.2V: Normal Operation 96.75% of the programmed voltage.
RUN ≤ 0.3V: Shutdown
MID (Pin 13/Pin 18): Output for the active charger balancer.
PROG (Pin 5/Pin 8): Sets the average input current limit This pin should be tied to the junction of the two output
threshold. Connect a resistor and capacitor from PROG to capacitors. If charging only a single output capacitor, tie
GND. See below for component value selection. this pin to ground as shown in the applications section.
RPROG (kΩ) = 11/ILIMIT (A) VOUTS (Pin 14/Pin 19): Output Sense Input. This pin should
CPROG (pF) = 1600/(RPROG (kΩ)) be connected to the VOUT capacitor through as short a
trace as possible.
NC (Pins 6, 20/Pins 9, 10, 22): Not Connected. These
pins should be tied to ground. VOUTP (Pins 15,16/Pins 20, 21): Output of the Synchro-
nous Rectifier. Connect the output filter capacitor from
VIN (Pin 7/Pin 11): Input Supply Pin. Internal VCC for the
IC and high current input to the internal sense resistor. this pin to GND. See the applications information section
A 10µF or greater ceramic capacitor should be placed as for capacitor recommendations.
close to VIN and GND as possible. SW2 (Pins 17,18/Pins 23, 24): Switch pin where internal
PFO (Pin 8/Pin 13): Power Fail Output. This is an open- switches C and D are connected. Connect inductor from
drain output that sinks current when the supply being SW1 to SW2.
monitored is less than the programmed threshold voltage. GND (Exposed Pad Pin 21/Pins 2, 3, 12 Exposed Pad
PFI (Pin 9/Pin 14): Power Fail Input. Connect resistor Pin 25): IC and Power Ground. The exposed pad must
divider tap from supply to be monitored here. See below be soldered to the PCB ground plane through a good
for component selection. electrical and thermal connection.
3128f
RSENS
D
VIN VOUTP
A
E VOUTS
B C
PROG
+
–
BALANCER
+ LOGIC
R4 – LOGIC R2
6.5A PEAK ZERO
AMP AMP
RUN
ILINEAR F
– AMP
SW1
MID
– 5A + – 0.58V
FB
+ +
PFI
0.58V + 0.56V
–
20µA
MAXV
0.2µA
–
PFO
+ + VOUT
– A=1
+ –
R3 0.58V – MID R1
+ +
A=1
PGOOD –
–
FB
+
0.56V
GND
3128 BD
3128f
3128f
3128f
3128f
Multilayer ceramic chip capacitors (MLCC) typically have due to the ESR, and keep the droop less than 1% of the
exceptional ESR performance. MLCCs combined with a programmed output voltage. When the charging current
tight board layout and an unbroken ground plane will yield is reduced to zero, the output voltage ESR component
very good performance and low EMI emissions. There are is eliminated. The maximum recommended ESR for the
several types of ceramic capacitors available, each having recommended 1% droop on VOUT is calculated by:
considerably different characteristics. For example, X7R VOUT 2
and X7S ceramic capacitors have the best voltage and (RESR1 +RESR2 )(Ω) ≅
(20• VIN •ILIM • η)
temperature stability. X5R ceramic capacitors have higher
packing density but poorer performance over their rated Where RESR1, RESR2 are the ESR of each capacitor, VIN is
voltage and temperature ranges. Y5V ceramic capacitors the input voltage to the charger, ILIM is the programmed
are not recommended because of their extreme non-linear input current in amps, η is the fractional efficiency of the
characteristic of capacitance versus voltage and poor charger at 20% of the programmed input current, and
temperature stability. VOUT is the programmed output of the charger. If the ESR
of the capacitors is larger than this calculated value, some
chattering in and out of sleep at the end of charge may
OUTPUT CAPACITOR SELECTION
be observed. Figure 3 shows the voltage droop on VOUT
The LTC3128 is designed to charge supercapacitors with a caused when charging stops.
minimum total output capacitance value greater that 2mF.
The LTC3128 is stable with a total output capacitance
In general, lower capacitance capacitors have higher ESRs.
value greater than 2mF, or 4mF for each stacked capacitor.
To prevent modulation in and out of sleep due to the volt-
age step caused by capacitor ESR, the LTC3128 reduces Supercapacitors are much larger physically than ceramic
charge current in the last 5% of the VOUT charge cycle. At or tantalum capacitors, and therefore usually cannot be
the end of the charging cycle immediately before sleep, placed close to the charger. To minimize layout contribution
the input current is reduced to 20% of the programmed to capacitor ESR, the trace width connecting the capacitors
value. Also of importance is to try and minimize the droop to each other and the IC should be as large as possible. The
MID pin trace is not as critical, as it only carries 200mA
3128f
the ESR and the charge stored in the capacitors each cycle
Figure 3. VOUT Voltage Droop at End of Charging
contribute to the output voltage droop. The droop due to
the pulsed load and ESR is calculated by:
of average current during balancing, but the VOUT trace
can carry more than 6A of current. It is recommended that VDROOP,LOAD (V) =
local decoupling capacitors be placed from VOUT to MID
and from MID to ground, as close to the IC as possible. VIN •ILIM • η
IPULSE – –ISTANDBY •D• T
Multilayer ceramic capacitors are an excellent choice for VOUT
output decoupling as they have extremely low ESR and COUT,TOTAL (F)
are available in small footprints. While a 10µF decoupling
capacitor is sufficient for most applications, larger values VDROOP,ESR (V) =
may be used without limitation.
If using a single output capacitor, where balancing is not VIN •ILIM • η
required, the MAXV and the MID pin should be tied to IPULSE – –ISTANDBY
VOUT
ground, this prevents the LTC3128 from trying to balance.
The hysteretic voltage loop of the LTC3128 will protect the • (RESR1 +RESR2 )
output capacitor, by regulating it to the voltage programmed
by the FB pin. Where ISTANDBY is the continuous load current on the
output in amps, IPULSE is the pulsed load current in addi-
Pulsed Output Loads tion to ISTANDBY in amps, ILIM is the programmed average
A large output capacitance can be used to help with pulsed current in amps, D is the load pulse’s duty cycle, and T is
load applications by reducing the amount of current re- the period of the load pulse in seconds.
quired by the LTC3128. The maximum load for a given The total output voltage droop is given by:
pulsed load duty cycle and the minimum capacitance can
VDROOP (V) = VDROOP,LOAD + VDROOP,ESR
be calculated by:
VIN •ILIM • η Low ESR and high capacitance are critical to maintaining
ILOAD(MAX)(A) =
D• VOUT low output droop. Table 2 and the Typical Applications
schematics show supercapacitors that work well with
COUT(MIN)(F) = the LTC3128.
VIN •ILIM • η D• t
IPULSE – –I STANDBY •
VOUT VDROOP
3128f
Maximum Capacitor Voltage & Balancing tors continuously monitor the output stack. If a capacitor
The service lifetime of a supercapacitor is determined exceeds the programmed maximum capacitor voltage,
by its rated voltage, rated temperature, rated lifetime, the LTC3128 immediately stops charging the stack. If a
actual operating voltage, and operating temperature. To capacitor exceeds its maximum voltage and the MID pin is
extend the life of a supercapacitor the operating voltage greater than 1.2V, the LTC3128 will balance the voltage of
and temperature should be reduced from the maximum the capacitors, otherwise the part will halt charging until
ratings. The websites for Illinois Capacitor1 and Maxwell2 the maximum capacitor voltage violation clears, typically
provide the means to determine their capacitor lifetime. by an external load or leakage. The LTC3128 will start
balancing the stacked output capacitors if the output is in
Using the suggested derated voltage for each capacitor regulation and the two capacitors are more than 60mV out
will improve lifetime. The LTC3128 will keep each capacitor of balance, or any time a maximum voltage event occurs.
voltage at VOUT/2 once the output has reached regulation.
To prevent an overvoltage on one of the output capacitors How well the output capacitors are matched will determine
during charging, the maximum capacitor voltage compara- the likelihood of triggering a maximum capacitor voltage
fault during charging. The maximum capacitor voltage can
Note 1: http://www.illinoiscapacitor.com/tech-center/life-calculators.aspx only force the LTC3128 to stop charging and, depending
Note 2: http://www.maxwell.com/products/ultracapacitors/docs/ on other conditions, attempt to balance the capacitors.
APPLICATIONNOTE1012839_1.PDF
3128f
Figure 4. LTC3128 Evaluation Board Top Side Silkscreen Figure 5. LTC3128 Evaluation Board Top Metal
3128f
Figure 6. LTC3128 Evaluation Board Layer 2 Metal Figure 7. LTC3128 Evaluation Board Layer 3 Metal
Figure 8. LTC3128 Evaluation Board Back Side Metal Figure 9. LTC3128 Evaluation Board Back Side Silkscreen
3128f
USB 3.0 (900mA Programmed Input Current) Powered, 4.8V Backup Supply
3.3µH
VOUT = 4.8V
SW1 SW2 MAXV = 2.85V
USB 3.0 RSENP VOUTP TO LOAD
4.5V TO 5.5V RSENS VOUTS
900mA 10µF 2.21M 300F
LTC3128
VIN
MID
RUN
10µF
PFI
PFO
10µF FB
PGOOD
MAXV PROG
10µF GND 130pF 300F
142k 12.4k 301k
3128 TA02
VOUT
1V/DIV
MID
1V/DIV
IIN
500mA/DIV
3128 TA02b
200 SECONDS/DIV
3128f
ENA
GND LTC4413
ENB STAT
INB OUTB
3128 TA04
THIS CIRCUIT WILL PROVIDE THE 3.3V OUTPUT WHILE SUPERCAPACITORS ARE DISCHARGING FROM 5V DOWN TO 1.8V.
THE LARGE DELTA FROM 5V DOWN TO 1.8V ALLOWS 87% OF STORED ENERGY IN THE SUPERCAPACITORS TO BE UTILIZED
VOUT
5.0V/DIV
LTC3128
VOUT
5.0V/DIV
LTC3127
VOUT
2.0V/DIV
LTC3128
IIN
2.0A/DIV
3128 TA04b
200 SECONDS/DIV
3128f
3128 TA03
THIS SUPERCAPACITOR BACKUP CIRCUIT WILL DRAW ONLY THE CURRENT THAT IS LEFT
OVER FROM THE 3A OF INPUT CURRENT CONSUMED BY MAIN LOADS IN THE SYSTEM
3128f
UFD Package
20-Lead Plastic QFN (4mm × 5mm)
(Reference LTC DWG # 05-08-1711 Rev B)
0.70 ±0.05
2.65 ±0.05
4.50 ±0.05 1.50 REF
3.10 ±0.05
3.65 ±0.05
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
2.50 REF
4.10 ±0.05
5.50 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED PIN 1 NOTCH
R = 0.20 OR
0.75 ±0.05 1.50 REF C = 0.35
4.00 ±0.10 R = 0.05 TYP
(2 SIDES) 19 20
0.40 ±0.10
PIN 1
TOP MARK
(NOTE 6)
1
2
5.00 ±0.10
2.50 REF
(2 SIDES)
3.65 ±0.10
2.65 ±0.10
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3128f
FE Package
24-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1771 Rev B)
Exposed Pad Variation AA
7.70 – 7.90*
3.25 (.303 – .311)
(.128) 3.25
(.128)
24 23 22 21 20 19 18 17 16 15 14 13
6.60 ±0.10
2.74
4.50 ±0.10 (.108)
6.40
SEE NOTE 4 2.74 (.252)
(.108) BSC
0.45 ±0.05
1.05 ±0.10
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT 1 2 3 4 5 6 7 8 9 10 11 12
1.20
4.30 – 4.50* (.047)
(.169 – .177) 0.25 MAX
REF
0° – 8°
0.65
0.09 – 0.20 0.50 – 0.75 (.0256) 0.05 – 0.15
(.0035 – .0079) (.020 – .030) BSC (.002 – .006)
0.195 – 0.30
FE24 (AA) TSSOP REV B 0910
(.0077 – .0118)
TYP
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS 4. RECOMMENDED MINIMUM PCB METAL SIZE
MILLIMETERS FOR EXPOSED PAD ATTACHMENT
2. DIMENSIONS ARE IN
(INCHES) *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
3. DRAWING NOT TO SCALE SHALL NOT EXCEED 0.150mm (.006") PER SIDE
3128f
23
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
For more
tion that the interconnection information
of its circuits www.linear.com/LTC3128
as described herein will not infringe on existing patent rights.
LTC3128
TYPICAL APPLICATION
Single Output Capacitor Application (1.5A Programmed Input Current)
3.3µH
3128 TA01
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3128f