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LTC3128

3A Monolithic Buck-Boost
Supercapacitor Charger and
Balancer with Accurate Input Current Limit
FEATURES DESCRIPTION
n ±2% Accurate Average Input Current Limit The LTC®3128 is a highly efficient, buck-boost DC/DC
Programmable Up to 3A supercapacitor charger. It operates efficiently from input
n Programmable Maximum Capacitor Voltage Limit voltages above, below or equal to the output voltage. The
n Active Charge Balancing for Fast Charging of LTC3128 incorporates accurate programmable average
Unmatched Capacitors input current limit, active charge balancing and program-
n Charges Single or Stacked Capacitors mable maximum capacitor voltage. This combination of
n V Range: 1.73V to 5.5V features makes the LTC3128 ideal for safely charging and
IN
n V
OUT Range: 1.8V to 5.5V protecting large capacitors in backup power systems. The
n <2µA Quiescent Current from V
OUT When Charged input current limit and maximum capacitor voltage are each
n Output Disconnect in Shutdown: <1µA I Shutdown programmed using a single resistor. Average input current
Q
n Power-Good Comparator is accurately controlled over a 0.5A to 3A programmable
n Power Failure Indicator range while the individual maximum capacitor voltage can
n Thermally Enhanced 20-Lead (4mm × 5mm × 0.75mm) be set from 1.8V to 3.0V.
QFN and 24-Lead TSSOP Packages
Other features of the LTC3128 include <2µA quiescent
APPLICATIONS current from VOUT in Burst Mode®operation, accurate
power-good and power failure indicators, and thermal
n Supercapacitor Based Backup Power overload protection. The LTC3128 is offered in low profile,
n Memory Backup thermally enhanced 20-Lead 4mm × 5mm × 0.75mm QFN
n Servers, RAID, RF Systems and 24-Lead TSSOP packages.
n Industrial, Communications, Computing L, LT, LTC, LTM, Burst Mode, Linear Technology and the Linear logo are registered trademarks
and PowerPath is a trademark of Linear Technology Corporation. All other trademarks are the
property of their respective owners.

TYPICAL APPLICATION
Wide VIN (3A Programmed Input Current) to 4.2V
3.3µH Stacked Output Capacitors Charging Waveform

SW1 SW2 VOUT = 4.2V


RSENP VOUTP
1.7V TO 5.5V RSENS VOUTS VOUT
C1a
UP TO 3.0A 1.87M 2.0V/DIV
LTC3128 940mF
VIN C1 MID
MID
RUN C1b 2.0V/DIV
PFI 940mF
FB IIN
PFO
10µF 2.0A/DIV
PGOOD
MAXV PROG
10µF GND ILOAD
2.0A/DIV
127k 470pF 3.57k 301k

3128 TA01b
3128 TA01 2 SECONDS/DIV
C1: Murata DMF3Z5R5H474M3DTA0

3128f

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LTC3128
ABSOLUTE MAXIMUM RATINGS
(Note 1)
VIN, RSENP, VOUTP, MID Voltage................... –0.3V to 6V PROG, MAXV, FB, PFI Voltage...................... –0.3V to 6V
RSENS, VOUTS Voltage.................................. –0.3V to 6V PGOOD, PFO DC Current.........................................15mA
RSENS DC Current.....................................................–4A Operating Junction Temperature Range
SW1, SW2 DC Voltage.................................. –0.3V to 6V (Notes 2, 4)............................................. –40°C to 125°C
SW1, SW2 Pulsed (<100ns) Voltage..............–1.0V to 7V Storage Temperature Range................... –65°C to 150°C
PGOOD, PFO, RUN Voltage........................... –0.3V to 6V Lead Temperature (Soldering, 10 sec)
FE Only.............................................................. 300°C

PIN CONFIGURATION
TOP VIEW
TOP VIEW
SW1 1 24 SW2
SW1
SW2
SW2

GND 2 23 SW2
NC

20 19 18 17 GND 3 22 NC

SW1 1 16 VOUTP SW1 4 21 VOUTP

RSENP 2 15 VOUTP RSENP 5 20 VOUTP


RSENS 3 21 14 VOUTS RSENS 6 25 19 VOUTS
GND GND
RUN 4 13 MID RUN 7 18 MID
PROG 5 12 PGOOD PROG 8 17 PGOOD
NC 6 11 FB NC 9 16 FB
7 8 9 10 NC 10 15 MAXV
VIN
PFO
PFI
MAXV

VIN 11 14 PFI
GND 12 13 PFO
UFD PACKAGE
20-LEAD (4mm × 5mm) PLASTIC QFN
FE PACKAGE
TJMAX = 125°C, θJA = 43°C/W 24-LEAD PLASTIC TSSOP
EXPOSED PAD (PIN 21) IS GND, MUST BE SOLDERED TO PCB (NOTE 5) TJMAX = 125°C, θJA = 38°C/W
EXPOSED PAD (PIN 25) SHOULD BE SOLDERED TO PCB (NOTE 5)

ORDER INFORMATION
LEAD FREE FINISH TAPE AND REEL PART MARKING PACKAGE DESCRIPTION TEMPERATURE RANGE
LTC3128EUFD#PBF LTC3128EUFD#TRPBF 3128 20-Lead (4mm × 5mm) Plastic QFN –40°C to 125°C
LTC3128IUFD#PBF LTC3128IUFD#TRPBF 3128 20-Lead (4mm × 5mm) Plastic QFN –40°C to 125°C
LTC3128EFE#PBF LTC3128EFE#TRPBF LTC3128FE 24-Lead Plastic TSSOP –40°C to 125°C
LTC3128IFE#PBF LTC3128IFE#TRPBF LTC3128FE 24-Lead Plastic TSSOP –40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/

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LTC3128
ELECTRICAL
The CHARACTERISTICS l denotes specifications that apply over the specified operating
junction temperature range, otherwise specifications are at TA = 25°C. (Note 2) VIN = 3.3V, VOUT = 4.8V, unless otherwise noted.
PARAMETER CONDITIONS MIN TYP MAX UNITS
Input Operating Range l 1.73 5.5 V
Programmed Output Voltage Range l 1.8 5. 5 V
FB Voltage l 0.565 0.580 0.590 V
FB Voltage Hysteresis 8.5 mV
FB Input Current FB > 0.590V 0.5 2 nA
Switching Frequency While Charging l 1.00 1.20 1.40 MHz
Power Good Rising Threshold Voltage Measured as a % of FB Voltage l 94.50 96.75 99.00 %FB
Power Good Hysteresis Measured as a % of FB Voltage 3.6 %
Power Good Voltage Low IPGOOD = 5mA 200 mV
Power Good Leakage Current PGOOD = 5.5V 0.1 1 µA
PFI Falling Threshold l 0.565 0.580 0.590 V
PFI Hysteresis Current VPFI < 0.565V 0.2 µA
PFI Input Current VPFI > 0.590V 0.5 2 nA
PFO Voltage Low IPFO = 5mA 200 mV
PFO Leakage Current PFO = 5.5V 0.1 1 µA
Maximum Capacitor Voltage – Rising RMAXV = 125k, –40°C to 125°C (Note 7) l 2.350 2.500 2.650 V
RMAXV = 125k, 0°C to 85°C (Notes 6, 7) l 2.400 2.500 2.600 V
RMAXV = 113k, –40°C to 125°C (Note 7) l 2.150 2.260 2.380 V
RMAXV = 113k, 0°C to 85°C (Notes 6, 7) l 2.170 2.260 2.350 V
Maximum Capacitor Voltage Hysteresis 120 200 mV
MAXV Pin Current 20 µA
VIN Quiescent Current – Sleep VRUN = 3.3V, VFB > 0.590V 14 µA
VOUT Quiescent Current – Sleep VRUN = 3.3V, Not Balancing, VFB > 0.590V 1.9 µA
VRUN = 3.3V, Balancing, VFB > 0.590V 100 µA
VIN Quiescent Current – Shutdown VRUN = 0V, Not Including SW Leakage 0.6 1 µA
VOUT Quiescent Current – Shutdown VRUN = 0V, Not Including SW Leakage 0.4 1 µA
VOUT Quiescent Current – Shutdown VRUN = 0V, VIN = 0V, Not Including SW Leakage 0.4 1 µA
VIN Quiescent Current – Active VRUN = 3.3V (Note 3) 600 µA
VIN Quiescent Current – UVLO VRUN = 1.5V, VIN = 1.5V, Not Including SW Leakage 25 µA
VOUT Quiescent Current – UVLO VRUN = 1.5V, VIN = 1.5V, Not Including SW Leakage 1 2 µA
Input Current Limit RPROG = 22.1k (Notes 3, 7) 489 497 504 mA
RPROG = 22.1k (Notes 3, 7) l 475 497 515 mA
RPROG = 11k (Notes 3, 7) 985 1000 1015 mA
RPROG = 11k (Notes 3, 7) l 958 1000 1035 mA
RPROG = 5.49k (Notes 3, 7) 1973 2003 2033 mA
RPROG = 5.49k (Notes 3, 7) l 1923 2003 2075 mA
RPROG = 3.57k (Notes 3, 7) 3034 3081 3127 mA
RPROG = 3.57k (Notes 3, 7) l 2951 3081 3185 mA

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LTC3128
ELECTRICAL CHARACTERISTICS
The l denotes specifications that apply over the specified operating
junction temperature range, otherwise specifications are at TA = 25°C. (Note 2) VIN = 3.3V, VOUT = 4.8V, unless otherwise noted.
PARAMETER CONDITIONS MIN TYP MAX UNITS
PROG Pin Gain Measured at IIN = 1A (Note 3) 52.7 µA/A
Internal Sense Resistor Value (Note 6) 50 mΩ
Peak Inductor Current Limit (Note 3) l 5.50 6.5 9.00 A
Linear Inductor Current Limit (Note 3) l 4.00 5.0 6.85 A
N-Channel MOSFET Leakage Switches B and C and E 0.1 5 µA
P-Channel MOSFET Leakage Switches A and D 0.1 5 µA
Switch F 0.1 10 µA
N-Channel MOSFET On-Resistance Switch B 70 mΩ
Switch C 80 mΩ
Switch E (VOUT = 0V) 95 mΩ
P-Channel MOSFET On-Resistance Switch A 45 mΩ
Switch D 40 mΩ
Switch F 300 mΩ
MID Leakage Current VMID = 0V, VIN = 3.3V, VSW1 = 3.3V 0.1 10 µA
MID Pin Regulation VOUT = 4.8V l 2.304 2.400 2.496 V
Active Charge Balancer Enable Threshold |VOUT/2-VMID| 60 118 mV
Active Charge Balancer Hysteresis 60 mV
Active Charge Balancer Peak Current (Note 3) 400 mA
Active Charge Balancer Valley Current (Note 3) 50 mA
RUN Input High Threshold Voltage l 1.2 V
RUN Input Low Threshold Voltage l 0.3 V
RUN Input Current RUN = 5.5V 0.01 1 µA

Note 1. Stresses beyond those listed under Absolute Maximum Ratings Note 3. Current measurements are made when the output is not switching.
may cause permanent damage to the device. Exposure to any Absolute Note 4. This IC includes overtemperature protection that is intended
Maximum Rating condition for extended periods may affect device to protect the device during momentary overload conditions. Junction
reliability and lifetime. temperature will exceed 125°C when overtemperature protection is active.
Note 2. The LTC3128 is tested under pulsed load conditions such that TJ ≈ Continuous operation above the specified maximum operating junction
TA. The LTC3128E is guaranteed to meet specifications from 0°C to 85°C temperature may result in device degradation or failure.
junction temperature. Specifications over the –40°C to 125°C operating Note 5. Failure to solder the exposed backside of the package to the PC
junction temperature range are assured by design, characterization and board ground plane will result in a thermal resistance much higher than
correlation with statistical process controls. The LTC3128I is guaranteed 43°C/W in the QFN and 38°C/W in the TSSOP.
over the full –40°C to 125°C operating junction temperature range. Note 6. Guaranteed by design. Not tested.
The junction temperature (TJ) is calculated from the ambient temperature Note 7. Accuracy of this specification is directly related to the accuracy of
(TA) and power dissipation (PD) according to the formula: TJ = TA + (PD the resistor used to program the parameter.
• θJA°C/W), where θJA is the package thermal impedance. Note that the
maximum ambient temperature consistent with these specifications is
determined by specific operating conditions in conjunction with board
layout, the rated package thermal resistance and other environmental
factors.

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LTC3128
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, unless otherwise noted.

Efficiency vs VOUT (0.5A IIN) Efficiency vs VOUT (1.0A IIN) Efficiency vs VOUT (2.0A IIN)
100 100 100
90
90 90
80
80 70
80
EFFICIENCY (%)

EFFICIENCY (%)

EFFICIENCY (%)
60
70
70 50
60
40
60
VIN = 1.7V 50 VIN = 1.7V 30
VIN = 2.4V VIN = 2.4V VIN = 2.4V
20 VIN = 3.3V
50 VIN = 3.3V VIN = 3.3V
40 VIN = 4.2V
VIN = 4.2V VIN = 4.2V 10
VIN = 5.0V VIN = 5.0V VIN = 5.0V
40 30 0
0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
VOUT (V) VOUT (V) VOUT (V)
3128 G01 3128 G02 3128 G03

Average Input Current Limit VOUT vs Charge Time, COUT = 1F,


Efficiency vs VOUT (3.0A IIN) vs Temperature (Normalized) RESR = 20mΩ, IIN = 0.5A
90 1.0 5.5
NORMALIZED AVERAGE INPUT CURRENT (%)

80 5.0
0.5 4.5
70
4.0
60 0
EFFICIENCY (%)

VOUT (V) 3.5


50 3.0
–0.5
40 2.5
2.0
30 –1.0
1.5 VIN = 1.7V
20 VIN = 2.4V VIN = 2.4V
VIN = 3.3V –1.5 1.0 VIN = 3.3V
10 VIN = 4.2V VIN = 4.2V
0.5
VIN = 5.0V VIN = 5.0V
0 –2.0 0
0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 –45 –25 –5 15 35 55 75 95 115 0 2 4 6 8 10 12 14 16 18 20 22 24
VOUT (V) TEMPERATURE (°C) TIME (s)
3128 G04 3128 G05 3128 G21

VOUT vs Charge Time, COUT = 1F, VOUT vs Charge Time, COUT = 1F, VOUT vs Charge Time, COUT = 1F,
RESR = 20mΩ, IIN = 1.0A RESR = 20mΩ, IIN = 2.0A RESR = 20mΩ, IIN = 3.0A
5.5 5.5 5.5
5.0 5.0 5.0
4.5 4.5 4.5
4.0 4.0 4.0
3.5 3.5 3.5
VOUT (V)

VOUT (V)

VOUT (V)

3.0 3.0 3.0


2.5 2.5 2.5
2.0 2.0 2.0
1.5 VIN = 1.7V 1.5 1.5
VIN = 2.4V VIN = 2.4V VIN = 2.4V
1.0 VIN = 3.3V 1.0 VIN = 3.3V 1.0 VIN = 3.3V
0.5 VIN = 4.2V 0.5 VIN = 4.2V 0.5 VIN = 4.2V
VIN = 5.0V VIN = 5.0V VIN = 5.0V
0 0 0
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
TIME (s) TIME (s) TIME (s)
3128 G22 3128 G23 3128 G24

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LTC3128
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, unless otherwise noted.

Maximum Programmable IIN VIN Quiescent Current vs VIN VIN Quiescent Current
vs VIN (Burst Mode Operation Sleep) vs VIN (Input UVLO)
3.25 13.6 40.0
13.4 35.0
3.00
13.2
30.0

INPUT CURRENT (µA)

INPUT CURRENT (µA)


13.0
2.75
12.8 25.0
IIN (A)

2.5 12.6 20.0


12.4 15.0
2.25
12.2
10.0
12.0
2.00
11.8 5.00

1.75 11.6 0.00


1.7 2.1 2.5 2.9 3.3 3.7 4.1 4.5 4.9 5.3 1.7 2.1 2.5 2.9 3.3 3.7 4.1 4.5 4.9 5.3 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
VIN (V) VIN (V) VIN (V)
3128 G06 3128 G07 3128 G08

VOUT Quiescent Current vs VOUT Feedback Voltage vs Temperature PFI Voltage vs Temperature
(Burst Mode Operation Sleep) (Normalized) (Normalized)
1.8 0.00 0.05
NORMALIZED FEEDBACK VOLTAGE (%)

1.7 0.00
0.05

NORMALIZED PFI VOLTAGE (%)


1.6 –0.05
OUTPUT CURRENT (µA)

0.10
1.5 –0.10

1.4 0.15 –0.15

1.3 0.20 –0.20

1.2 –0.25
0.25
1.1 –0.30
0.30
1.0 –0.35

0.9 0.35 –0.40


1.8 2.2 2.6 3.0 3.4 3.8 4.2 4.6 5.0 5.4 –45 –25 –5 15 35 55 75 95 115 –45 –25 –5 15 35 55 75 95 115
VOUT (V) TEMPERATURE (°C) TEMPERATURE (°C)
3128 G09 3128 G10 3128 G11

PGOOD Threshold vs Temperature PGOOD Pull Down Resistance


PFO Pull Down Resistance vs VIN (Normalized) vs VIN
90 0.00 90
NORMALIZED PGOOD THRESHOLD (%)

80 80
–0.05
70 70
–0.10
60 60
RESISTANCE (Ω)

RESISTANCE (Ω)

50 –0.15 50

40 –0.20 40

30 30
–0.25
20 20
–0.30
10 10

0 –0.35 0
1.7 2.1 2.5 2.9 3.3 3.7 4.1 4.5 4.9 5.3 –45 –25 –5 15 35 55 75 95 115 1.7 2.1 2.5 2.9 3.3 3.7 4.1 4.5 4.9 5.3
VIN (V) TEMPERATURE (°C) VIN (V)
3128 G12 3128 G13 3128 G14

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LTC3128
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, unless otherwise noted.

Minimum and Maximum


Maximum Capacitor Voltage Programmed Capacitor Voltage
vs Temperature (Normalized) vs Programmed VOUT
NORMALIZED MAXIMUM CAPACITOR VOLTAGE (%)

0.8 6

0.6
5
MAXIMUM

PROGRAMMED MAXV (V)


0.4
4
2.0 MINIMUM
(–40°C TO 125°C)
0 3

–0.2 MINIMUM
2 (0°C TO 85°C)
–0.4
1
–0.6

–0.8 0
–45 –25 –5 15 35 55 75 95 115 2.7 3.1 3.5 8.9 4.3 4.7 5.1 5.5
TEMPERATURE (°C) VOUT (V)
3128 G15 3128 G16

Startup Waveform Startup Waveform


1.0A Input Current Limit 3.0A Input Current Limit

VOUT IIN
2V/DIV 2A/DIV
VMID
2V/DIV
RUN VOUT
5V/DIV 2V/DIV

VMID
IIN 5V/DIV
0.5A/DIV

3128 G17 3128 G18


5.00s/DIV 5.00s/DIV

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LTC3128
PIN FUNCTIONS (QFN/TSSOP)

SW1 (Pins 1, 19/Pins 1, 4): Switch pin where internal MAXV (Pin 10/Pin 15): Sets the maximum capacitor
switches A and B are connected. Connect an inductor voltage across each capacitor. Connect a resistor from
from SW1 to SW2. MAXV to GND. See below for component value selection.
If charging only a single capacitor, tie this pin to ground.
RSENP (Pin 2/Pin 5): Sense Resistor Power Output.
Connect other loads in the system to this pin. A 10µF or RMAXV (kΩ) = 50 • VMAXV(V)
greater ceramic capacitor should be placed as close to FB (Pin 11/Pin 16): Output Voltage Feedback Pin. Connect
RSENP and GND as possible. resistor divider tap here. The output voltage can be adjusted
RSENS (Pin 3/Pin 6): Sense Resistor Signal Input. This from 1.8V to 5.5V. The feedback reference voltage is 0.58V.
pin should be connected to RSENP through as short and VOUT (V) = 0.58 • (1+R2/R1)
wide a trace as possible.
PGOOD (Pin 12/Pin 17): Power Good Indicator. This is an
RUN (Pin 4/Pin 7): Logic-Controlled Shutdown Input. open-drain output that pulls low when VOUT is less than
RUN ≥ 1.2V: Normal Operation 96.75% of the programmed voltage.
RUN ≤ 0.3V: Shutdown
MID (Pin 13/Pin 18): Output for the active charger balancer.
PROG (Pin 5/Pin 8): Sets the average input current limit This pin should be tied to the junction of the two output
threshold. Connect a resistor and capacitor from PROG to capacitors. If charging only a single output capacitor, tie
GND. See below for component value selection. this pin to ground as shown in the applications section.
RPROG (kΩ) = 11/ILIMIT (A) VOUTS (Pin 14/Pin 19): Output Sense Input. This pin should
CPROG (pF) = 1600/(RPROG (kΩ)) be connected to the VOUT capacitor through as short a
trace as possible.
NC (Pins 6, 20/Pins 9, 10, 22): Not Connected. These
pins should be tied to ground. VOUTP (Pins 15,16/Pins 20, 21): Output of the Synchro-
nous Rectifier. Connect the output filter capacitor from
VIN (Pin 7/Pin 11): Input Supply Pin. Internal VCC for the
IC and high current input to the internal sense resistor. this pin to GND. See the applications information section
A 10µF or greater ceramic capacitor should be placed as for capacitor recommendations.
close to VIN and GND as possible. SW2 (Pins 17,18/Pins 23, 24): Switch pin where internal
PFO (Pin 8/Pin 13): Power Fail Output. This is an open- switches C and D are connected. Connect inductor from
drain output that sinks current when the supply being SW1 to SW2.
monitored is less than the programmed threshold voltage. GND (Exposed Pad Pin 21/Pins 2, 3, 12 Exposed Pad
PFI (Pin 9/Pin 14): Power Fail Input. Connect resistor Pin 25): IC and Power Ground. The exposed pad must
divider tap from supply to be monitored here. See below be soldered to the PCB ground plane through a good
for component selection. electrical and thermal connection.

VPFI(FALLING) (V) = 0.58 • (1+R4/R3)


VPFIHYST (V) = R4 • 0.2µA

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LTC3128
BLOCK DIAGRAM
RSENP SW1 SW2

RSENS
D

VIN VOUTP
A
E VOUTS
B C
PROG
+

BALANCER
+ LOGIC
R4 – LOGIC R2
6.5A PEAK ZERO
AMP AMP
RUN
ILINEAR F
– AMP
SW1
MID

– 5A + – 0.58V
FB
+ +
PFI
0.58V + 0.56V


20µA
MAXV
0.2µA

PFO
+ + VOUT
– A=1
+ –
R3 0.58V – MID R1
+ +
A=1
PGOOD –

FB
+
0.56V

GND

3128 BD

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LTC3128
OPERATION
The LTC3128 is an average input current controlled buck- As the input voltage decreases further, switch pair CD
boost DC/DC charger offered in both a thermally enhanced is pulse width modulated to obtain the desired output
4mm × 5mm 20-lead QFN package and a thermally en- voltage. At this point, the converter is operating solely in
hanced 24-lead TSSOP package. The buck-boost charger boost mode. When VOUT is below 1.5V typical, switch D
utilizes a proprietary switching algorithm which allows its and E are modulated. This helps to improve efficiency at
output to be regulated above, below, or equal to the input low VOUT voltages.
voltage. The low RDS(ON), low gate charge synchronous This switching algorithm provides a seamless transition
switches provide high efficiency conversion to minimize
between operating modes and eliminates discontinuities
the charging time of storage elements.
in average inductor current, inductor current ripple, and
Charger Operation loop transfer function throughout all operational modes.
These advantages result in increased efficiency and stabil-
The LTC3128 uses fixed frequency, average input current ity in comparison to the traditional 4-switch buck-boost
PWM control when charging the output capacitor(s). A converter.
proprietary switching algorithm allows the charger to
switch between buck and boost modes without discontinu- Error Amplifier And Compensation
ity in inductor current or loop characteristics. The switch
The LTC3128 utilizes two control loops. The hysteretic
topology for the buck-boost charger is shown in Figure 1.
voltage loop determines whether the output is in regulation
Two switches (D and E) connect SW2 to VOUT to provide
or not, and commands the LTC3128 into a low quiescent
high efficiency over the entire output voltage range.
current sleep state when VOUT reaches its programmed
level. The voltage loop is also equipped with a proportional
L
gain control that reduces the charging current as VOUT
VIN A SW1 SW2 D VOUT approaches regulation. This helps prevent chattering into
and out of sleep because of the large charging currents
and possibly high equivalent series resistance (ESR) ca-
B C
pacitors. The current loop is internally compensated and
E
forces the input current to the programmed input current
LTC3128 limit. When the LTC3128 is not sleeping or balancing, it
operates at a fixed 1.2MHz frequency.
3128 F01

Figure 1. Buck-Boost Switch Topology


Current Limit Operation
The LTC3128 uses a continuous switching algorithm where The LTC3128 has three current limit circuits. The primary
both SW1 and SW2 will switch regardless of the input current limit is an accurate average input current limit circuit
or output. When the input voltage is significantly greater that measures the input current drawn from the source by
than the output voltage, the buck-boost converter oper- the LTC3128 and the other loads tied to the RSENS pin via
ates in buck mode. Each cycle, switches B and C turn on an internal 50mΩ sense resistor. The LTC3128, when not
for a minimum of 5% of the entire switching cycle. For sleeping, will always try to limit the input current passing
the remainder of the switching cycle, switch D (switch D through the sense resistor. Any current drawn externally
and E when VOUT <1.5V typically) turns on continuously, from RSENS will result in a corresponding decrease in the
switch C remains off, and switches A and B are pulse charging current supplied by the LTC3128. If the load tied
width modulated to produce the required duty cycle to to RSENS draws more than the programmed amount, the
support the output regulation voltage. As the input volt- LTC3128 will reduce the charging current to zero, although
age decreases or as the output voltage increases, switch it cannot limit the current draw from external sources. The
A remains on for a larger portion of the switching cycle.
3128f

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LTC3128
OPERATION
input current limit is set by placing a resistor, RPROG, from dissipated in the package. The current limit will continue
PROG to GND. This resistor and the CPROG capacitor value to be reduced to approximately 30% of the programmed
can be calculated using the following formula: limit just before thermal shutdown. The current limit will
RPROG (kΩ) = 11/ILIMIT (A) return to its full value when the die temperature drops
below 135°C. See the PCB Layout Considerations section
CPROG (pF) ≈ 1600/(RPROG (kΩ) ) in the Applications Information portion of the data sheet
Where ILIMIT is the average input current limit in amps. for additional thermal considerations.
A secondary linear current limit, limits the maximum aver- Undervoltage Lockout
age inductor current to 5.0A typically. If the peak inductor
current reaches 6.5A (typical) switches A and C are im- If the input supply voltage drops below 1.60V (typical),
mediately turned off, and switches B and D are turned on. the LTC3128 will be disabled and all power devices will
The linear and peak current limits are fixed and therefore be turned off. The LTC3128 will resume operation when
are not affected by the value of RPROG. VIN rises above 1.73V.

Power Failure Indicator


Zero Current Comparator
The LTC3128 includes a power failure indicator comparator.
The zero current comparator monitors the inductor current
Referring to the Block Diagram, the non-inverting input
to the output and shuts off all power switches when this
of the comparator is internally connected to a 0.58V
current reduces to approximately 30mA. This prevents
reference and the inverting input is connected to the PFI
the inductor current from reversing in polarity, improving
pin. An external resistive divider can be placed from the
efficiency at light loads.
supply being monitored to ground to program the thresh-
Shutdown old voltage. When the voltage at PFI drops below 0.58V,
the open-drain N-channel MOSFET on PFO will turn on,
Shutdown of the LTC3128 is accomplished by pulling the pulling the pin low. The N-channel MOSFET is forced off
RUN pin below 0.3V and IC operation is enabled by pull- when the LTC3128 is in shutdown. When PFI drops below
ing the RUN pin above 1.2V. Note that RUN can be driven 0.58V, a hysteresis current of 0.2µA will turn on, sinking
above VIN or VOUT, as long as it is limited to less than the current into the PFI pin providing hysteresis. Once the PFI
absolute maximum rating. pin rises above 0.58V plus the programmed hysteresis,
the open-drain N-channel MOSFET on PFO will turn off.
Thermal Shutdown
The power failure indicator voltage and hysteresis can be
If the die temperature exceeds 165°C (typical) the LTC3128 calculated as follows:
will be disabled. All power devices will be turned off and
VPFI(FALLING) (V) = 0.58 • (1 + R4/R3)
both switch nodes will be pulled low. The LTC3128 will
restart (if enabled) when the die temperature drops to VPFIHYST (V) = R4 • 0.2µA
approximately 155°C.
Power-Good Indicator
Thermal Regulator The LTC3128 includes a power-good indicator comparator.
To help prevent the part from going into thermal shut-down The non-inverting input of the comparator is connected to
when charging very large capacitors at high current, the the FB pin and the inverting input is internally connected
LTC3128 is equipped with a thermal regulator. If the die to a 0.56V reference. When the voltage at FB drops below
temperature exceeds 135°C (typical) the average current approximately 0.54V, the open-drain N-channel MOSFET
limit is lowered to help reduce the amount of power being on PGOOD will turn on, pulling the pin low. The N-channel
MOSFET is forced off when the LTC3128 is in shutdown.

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For more information www.linear.com/LTC3128 11


LTC3128
OPERATION
Maximum Capacitor Voltage Comparator of the capacitors by insuring one-half of the programmed
The LTC3128 monitors the voltage across each capacitor output voltage is across each capacitor and eliminates the
of the stacked output capacitors. If a capacitor exceeds need for lossy balancing resistors or shunt regulators.
the programmed maximum capacitor voltage, the LTC3128 The active charge balancer is enabled once the voltage on
will stop charging the output stack and begin balancing the MID pin exceeds approximately 1.2V. The LTC3128 will
the voltage on the two capacitors. If the capacitors cannot try to balance the stack only if VOUT has reached regula-
be balanced and the fault condition still persists, charging tion, or if one of the capacitor voltages has exceeded the
will be halted until the output capacitors self discharge so maximum programmed value. This ensures that the output
that a fault condition no longer exists. This condition can stack is charged as quickly as possible while protecting
exist if there is a shorted or damaged output capacitor. The each capacitor from being overcharged. The balancer is
maximum capacitor voltage is programmed by placing a hysteretic and is enabled once the two capacitors are
single resistor from MAXV to GND. The RMAXV resistor 60mV out of balance. Once the balancer has equalized the
should be placed close to the MAXV pin to minimize the voltage across each capacitor, it is disabled.
pin capacitance. The typical resistor value can be calculated
The active charge balancer operates by using the induc-
using the following formula: tor connected between SW1 and SW2 to efficiently move
RMAXV (kΩ) = 50 • VMAXV (V) charge between the two output capacitors. The charge
Where VMAXV is the maximum allowable voltage across a is moved through a switch that connects the MID pin to
capacitor. With the calculated RMAXV value, the observed SW1 internally. Connecting the MID pin to SW1 allows the
VMAXV can vary as much as ±6%. The maximum capacitor LTC3128 to either boost charge from the bottom capaci-
voltage comparator is not enabled until VOUT is greater tor to the top, or buck charge from the top capacitor by
than approximately 1.5V. If the MAXV pin is tied to ground, modulating switches C and D.
both the maximum capacitor voltage comparator and If VMID is 60mV greater than VOUT – VMID switches C and
the active charge balancer are disabled. The MAXV pin F are turned on until the inductor current reaches 400mA.
should be tied to ground if only a single output capaci- Switch C is then turned off and switch D is turned on until
tor is being charged and no balancing is required. When the inductor current reaches 50mA. This switching cycle
using a single capacitor, the maximum capacitor voltage continues until VMID = VOUT – VMID.
is programmed using the FB pin. The voltage loop will
If VOUT – VMID is 60mV greater than VMID, switches D and
prevent overvoltaging of the output capacitor, and the F are turned on until the inductor current reaches –400mA.
MID pin should be grounded. Please refer to the Typical Switch D is then turned off and switch C is turned on until
Applications section for an example. the inductor current reaches –50mA. The switching cycle
continues until VMID = VOUT – VMID.
Active Charge Balancer
The frequency that the balancer will operate at is dependent
The LTC3128 includes an active charge balancer for the
on the inductor value (L) and can be calculated by:
stacked output capacitors. The balancer efficiently moves
charge from the overcharged capacitor to the undercharged VOUT
capacitor until the two capacitors are determined to be fbalancer (MHz) ≈
1.6 •L (µH)
balanced. This helps to ensure the long term reliability

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LTC3128
APPLICATIONS INFORMATION
A typical LTC3128 application circuit is shown on the front less. The peak-to-peak inductor current ripple for buck and
page of this data sheet. The external component selection boost mode can be calculated from the following formulas,
is determined by the desired output voltage, input cur- where L is the inductance in micro Henries:
rent limit, maximum capacitor voltage, and VOUT ripple VOUT (VIN − VOUT )
requirements for each particular application. However, ∆I L,P−P,BUCK (A) =
basic guidelines and considerations for the design process VIN • L • 1.2
are provided in this section.
VIN (VOUT − VIN )
∆I L,P−P,BOOST (A) =
Output Voltage Programming VOUT • L • 1.2

The output voltage is set by a resistive divider according
The 1.2MHz switching frequency allows the LTC3128 to
to the formula:
utilize small surface mount inductors. Inductor values
VOUT (V) = 0.58V • (1 + R2/R1) between 2.2µH and 4.7µH are recommended. These val-
The external divider is connected to the output as shown ues provide low ripple in the inductor current, but will not
in Figure 2. The LTC3128 buck-boost charger utilizes input adversely affect the stability of the LTC3128. An inductor
current mode control, and the output divider resistance value that is too small or large will limit the stable input
does not play a role in system stability. Large resistor voltage range for a given VOUT.
values can be used to minimize output leakage. The pro- High frequency ferrite core inductor materials reduce
grammed maximum capacitor voltage affects the maximum frequency dependent power losses compared to cheaper
output voltage that can be programmed. This maximum powdered iron types, improving efficiency. The inductor
programmed output voltage can be calculated by: should have low DC resistance (approximately 20mΩ or
VOUT(MAX) = 2 • (VMAXV – 440mV) (–40°C to 125°C) less) to reduce the I2R power losses, and must be able
to support the peak inductor current without saturating.
VOUT(MAX) = 2 • (VMAXV – 385mV) (0°C to 85°C) Molded chokes and chip inductors usually do not have
1.8V ≤ VOUT ≤ 5.25V
enough core area to support the maximum peak inductor
currents of up to 9.0A seen on the LTC3128. The inductor
R2 current can still reach currents greater than 5A even at low
FB programmed input currents due to high voltage step-down
LTC3128 R1 ratios at start-up. See Table 1 and the reference schematics
GND
for suggested components and suppliers.
3128 F02

Input Capacitor Selection


Figure 2. Setting the Buck-Boost Output Voltage The style and value of capacitors used with the LTC3128
determine input voltage ripple. It is required that a low
Inductor Selection equivalent series resistance (ESR) multilayer ceramic
capacitor of at least 10µF be used to bypass the VIN,
To achieve high efficiency, a low DCR inductor should be RSENS and RSENP pins.
utilized for the buck-boost charger. The inductor must have
a saturation rating greater than the worst case average The value of the capacitor on VIN directly controls the
inductor current plus half the ripple current. This is due amount of input ripple for a given input current pulse,
to the fact that during start-up or high step down ratios, such as during a bucking switching cycle. Increasing the
the inductor current will be at the linear current limit value of this capacitor will reduce the input ripple.
(4.0A minimum) even if the programmed input current is

3128f

For more information www.linear.com/LTC3128 13


LTC3128
APPLICATIONS INFORMATION
Table 1: Recommended Inductors
VENDOR VALUE DCR MAX DC CURRENT SIZE (mm) W × L × H
(µH) (mΩ) (A)
Coilcraft
XAL5030-222ME 2.2 13.2 9.2 5.0 × 5.0 × 3.0
XAL5030-332ME 3.3 21.2 8.7 5.0 × 5.0 × 3.0
XAL6030-332ME 3.3 19.9 12.2 6.0 × 6.0 × 3.0
XAL6060-472ME 4.7 13.1 10.5 6.0 × 6.0 × 6.0
Coiltronics
HC8-2R6-R 2.6 11.4 10.2 10.9 × 10.9 × 4.0
HC8-3R5-R 3.5 16.5 8.5 10.9 × 10.9 × 4.0
HC7-3R9-R 3.9 7.9 10.4 13.0 × 13.8 × 5.5
HC7-4R7-R 4.7 9 9.2 13.0 × 13.8 × 5.5
Sumida
CDRH10D68RT125NP-2R2NC 2.2 7.1 10.5 10.2 × 10.2 × 6.8
CDRH10D38DHPNP-3R3PC 3.3 13.5 9.25 10.0 × 10.0 × 3.8
CDRH127/HPNP-4R7RC 4.7 18.8 10.8 12.5 × 12.5 × 8.0
TDK
VLF12060T-2R7N100 2.7 5.3 10 11.7 × 12.0 × 6.0
VLF12060T-3R9N9R0 3.9 7 9 11.7 × 12.0 × 6.0
Würth Elektronik
744311220 2.2 11.4 9 6.9 × 7.0 × 3.8
744325420 4.2 7.1 11 10.2 × 10.5 × 4.7

Multilayer ceramic chip capacitors (MLCC) typically have due to the ESR, and keep the droop less than 1% of the
exceptional ESR performance. MLCCs combined with a programmed output voltage. When the charging current
tight board layout and an unbroken ground plane will yield is reduced to zero, the output voltage ESR component
very good performance and low EMI emissions. There are is eliminated. The maximum recommended ESR for the
several types of ceramic capacitors available, each having recommended 1% droop on VOUT is calculated by:
considerably different characteristics. For example, X7R VOUT 2
and X7S ceramic capacitors have the best voltage and (RESR1 +RESR2 )(Ω) ≅
(20• VIN •ILIM • η)
temperature stability. X5R ceramic capacitors have higher
packing density but poorer performance over their rated Where RESR1, RESR2 are the ESR of each capacitor, VIN is
voltage and temperature ranges. Y5V ceramic capacitors the input voltage to the charger, ILIM is the programmed
are not recommended because of their extreme non-linear input current in amps, η is the fractional efficiency of the
characteristic of capacitance versus voltage and poor charger at 20% of the programmed input current, and
temperature stability. VOUT is the programmed output of the charger. If the ESR
of the capacitors is larger than this calculated value, some
chattering in and out of sleep at the end of charge may
OUTPUT CAPACITOR SELECTION
be observed. Figure 3 shows the voltage droop on VOUT
The LTC3128 is designed to charge supercapacitors with a caused when charging stops.
minimum total output capacitance value greater that 2mF.
The LTC3128 is stable with a total output capacitance
In general, lower capacitance capacitors have higher ESRs.
value greater than 2mF, or 4mF for each stacked capacitor.
To prevent modulation in and out of sleep due to the volt-
age step caused by capacitor ESR, the LTC3128 reduces Supercapacitors are much larger physically than ceramic
charge current in the last 5% of the VOUT charge cycle. At or tantalum capacitors, and therefore usually cannot be
the end of the charging cycle immediately before sleep, placed close to the charger. To minimize layout contribution
the input current is reduced to 20% of the programmed to capacitor ESR, the trace width connecting the capacitors
value. Also of importance is to try and minimize the droop to each other and the IC should be as large as possible. The
MID pin trace is not as critical, as it only carries 200mA
3128f

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LTC3128
APPLICATIONS INFORMATION
Where ISTANDBY is the continuous load current on the output
IIN
500mV/DIV
in amps, IPULSE is the pulsed load current in addition to
ISTANDBY in amps, ILIM is the programmed average cur-
rent in amps, η is the LTC3128 converter efficiency, D is
VOUT
10mV/DIV
the load pulse’s duty cycle, and T is the period of the load
pulse in seconds. When selecting output supercapacitors
for large pulsed loads, the magnitude and duration of the
pulsed current, together with the droop voltage specifica-
tion, determine the choice of the output capacitor. Both
3128 F03
1ms/DIV

the ESR and the charge stored in the capacitors each cycle
Figure 3. VOUT Voltage Droop at End of Charging
contribute to the output voltage droop. The droop due to
the pulsed load and ESR is calculated by:
of average current during balancing, but the VOUT trace
can carry more than 6A of current. It is recommended that VDROOP,LOAD (V) =
local decoupling capacitors be placed from VOUT to MID
and from MID to ground, as close to the IC as possible.   VIN •ILIM • η 
IPULSE –  –ISTANDBY   •D• T
Multilayer ceramic capacitors are an excellent choice for   VOUT 
output decoupling as they have extremely low ESR and COUT,TOTAL (F)
are available in small footprints. While a 10µF decoupling
capacitor is sufficient for most applications, larger values VDROOP,ESR (V) =
may be used without limitation.
If using a single output capacitor, where balancing is not   VIN •ILIM • η 
required, the MAXV and the MID pin should be tied to IPULSE –  –ISTANDBY  
  VOUT 
ground, this prevents the LTC3128 from trying to balance.
The hysteretic voltage loop of the LTC3128 will protect the • (RESR1 +RESR2 )
output capacitor, by regulating it to the voltage programmed
by the FB pin. Where ISTANDBY is the continuous load current on the
output in amps, IPULSE is the pulsed load current in addi-
Pulsed Output Loads tion to ISTANDBY in amps, ILIM is the programmed average
A large output capacitance can be used to help with pulsed current in amps, D is the load pulse’s duty cycle, and T is
load applications by reducing the amount of current re- the period of the load pulse in seconds.
quired by the LTC3128. The maximum load for a given The total output voltage droop is given by:
pulsed load duty cycle and the minimum capacitance can
VDROOP (V) = VDROOP,LOAD + VDROOP,ESR
be calculated by:
VIN •ILIM • η Low ESR and high capacitance are critical to maintaining
ILOAD(MAX)(A) =
D• VOUT low output droop. Table 2 and the Typical Applications
schematics show supercapacitors that work well with
COUT(MIN)(F) = the LTC3128.

  VIN •ILIM • η   D• t
IPULSE –  –I STANDBY   •
 VOUT   VDROOP

3128f

For more information www.linear.com/LTC3128 15


LTC3128
APPLICATIONS INFORMATION
Table 2: Recommended Supercapacitors and Ultracapacitors
VENDOR VALUE ESR VOLTAGE TEMPERATURE SIZE (mm) W × L × H
(F) (mΩ) (A) RANGE (C)
Murata Electronics
DMF3R5R5L334M3DTA0 0.33 60 4.2 (5.5 Peak) –30 to 70 14.0 × 21.0 × 2.5
DMF3Z5R5H474M3DTA0 0.47 40 4.2 (5.5 Peak) –30 to 70 14.0 × 21.0 × 3.2
Tecate
TPL-10/10X30F 10 85 2.7 –40 to 65 10.0 × 10.0 × 30.0
TPL-25/16X26F 25 42 2.7 –40 to 65 16.0 × 16.0 × 26.0
TPL-100/22X45F 100 15 2.7 –40 to 65 22.0 × 22.0 × 45.0
TPLE-25/16X26F 25 42 2.3 –40 to 85 16.0 × 16.0 × 26.0
TPLE-100/22X45F 100 15 2.3 –40 to 85 22.0 × 22.0 × 45.0
TPLS-400/35X60F 400 12 2.7 –40 to 65 35.0 × 35.0 × 60.0
AVX
BZ015A503Z_B 0.05 160 5.5 –20 to 70 28.0 × 17.0 × 4.1
BZ015A104Z_B 0.1 80 5.5 –20 to 70 28.0 × 17.0 × 6.7
CAP-XX
HS206F 0.6 70 5.5 –40 to 85 39.0 × 17.0 × 2.5
HS230 1.2 50 5.5 –40 to 85 39.0 × 17.0 × 3.8
Cooper Bussmann
A1635-2R5475-R 4.7 25 2.5 –25 to 70 16.0 × 16.0 × 35.0
M1325-2R5905-R 9 20 2.5 –40 to 60 13.0 × 13.0 × 26.0
HV1860-2R7107-R 100 10 2.7 –40 to 65 18.0 × 18.0 × 60.0
Illinois Capacitor
506DER2R5SLZ 50 30 2.5 –40 to 70 18.0 × 18.0 × 60.0
357DER2R5SEZ 100 12 2.5 –40 to 70 35.0 × 35.0 × 60.0
Maxwell
BCAP0005 5 170 2.7 –40 to 65 10.0 × 10.0 × 20.0
BCAP0100T01 100 15 2.7 –40 to 65 22.0 × 22.0 × 45.0
Taiyo Yuden
PAS2026FR2R5504 0.5 55 2.5 –25 to 60 26.0 × 20.0 × 0.9
PAS0815LS2R5105 1 70 2.5 –25 to 70 8.0 × 8.0 × 15.0
LIC2540R3R8207 200 50 2.2 to 3.8 –25 to 70 25.0 × 25.0 × 40.0

Maximum Capacitor Voltage & Balancing tors continuously monitor the output stack. If a capacitor
The service lifetime of a supercapacitor is determined exceeds the programmed maximum capacitor voltage,
by its rated voltage, rated temperature, rated lifetime, the LTC3128 immediately stops charging the stack. If a
actual operating voltage, and operating temperature. To capacitor exceeds its maximum voltage and the MID pin is
extend the life of a supercapacitor the operating voltage greater than 1.2V, the LTC3128 will balance the voltage of
and temperature should be reduced from the maximum the capacitors, otherwise the part will halt charging until
ratings. The websites for Illinois Capacitor1 and Maxwell2 the maximum capacitor voltage violation clears, typically
provide the means to determine their capacitor lifetime. by an external load or leakage. The LTC3128 will start
balancing the stacked output capacitors if the output is in
Using the suggested derated voltage for each capacitor regulation and the two capacitors are more than 60mV out
will improve lifetime. The LTC3128 will keep each capacitor of balance, or any time a maximum voltage event occurs.
voltage at VOUT/2 once the output has reached regulation.
To prevent an overvoltage on one of the output capacitors How well the output capacitors are matched will determine
during charging, the maximum capacitor voltage compara- the likelihood of triggering a maximum capacitor voltage
fault during charging. The maximum capacitor voltage can
Note 1: http://www.illinoiscapacitor.com/tech-center/life-calculators.aspx only force the LTC3128 to stop charging and, depending
Note 2: http://www.maxwell.com/products/ultracapacitors/docs/ on other conditions, attempt to balance the capacitors.
APPLICATIONNOTE1012839_1.PDF
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16 For more information www.linear.com/LTC3128


LTC3128
APPLICATIONS INFORMATION
The LTC3128 has minimal current draw from VOUT, es- evaluation board layout shown is 20°C/W. If thinner copper,
pecially when the cells are in balance (typically < 2µA). less copper area, or fewer vias are used then this number
Care should be taken to limit sources of current that may will increase. The following items provide guidelines for
pull VOUT above it’s programmed regulation value, as layout of the LTC3128:
there is no way for the LTC3128 to maintain regulation 1. Use solid ground plane under the whole circuit (no
in this situation. If there is potential for external leakage other traces underneath)
to overvoltage the supercapacitors, measures should be
taken to protect them. 2. Place all decoupling capacitors close to LTC3128 (that
ensures low parasitic inductances)
PCB Layout Considerations 3. Use 2 to 3 local ground vias next to the GND pad of
each decoupling capacitor.
The LTC3128 switches large currents at high frequen-
cies. Special care should be given to the PCB layout to 4. Place the maximum number of GND vias under the
ensure stable, noise free operation. Due to the high input exposed pad of LTC3128 (for low thermal resistance)
and output power of the LTC3128 a four layer PCB with 5. Place a local GND via next to each component that is
significant copper and ground planes is strongly recom- connected to ground.
mended. Otherwise the thermal regulator may start to
6. Keep FB and MAXV nodes short (place the voltage
reduce the programmed input current at a lower ambient
divider resistors close to the pins)
temperature, and may not be able to prevent the device
from entering thermal shutdown. The LTC3128 is equipped with a thermal regulator that is
designed to help protect the LTC3128 from damage due
The LTC3128 evaluation board shows a recommended
to overheating. The thermal regulator will try to prevent
layout and part placement. Figures 4 through 9 show the
the die temperature from exceeding 135°C by reducing
part placements and routing, a LTC3128 evaluation board
the input current limit, but if it cannot, the LTC3128 will
is available on the Linear Technology website. The layout
eventually enter thermal shutdown at 165°C. When the
of the PCB and the amount of copper used directly effects
junction temperature of the LTC3128 drops back below
the θJA of the LTC3128. The θJA of the LTC3128 on the
135°C the input current limit will no longer be affected.

Figure 4. LTC3128 Evaluation Board Top Side Silkscreen Figure 5. LTC3128 Evaluation Board Top Metal
3128f

For more information www.linear.com/LTC3128 17


LTC3128
APPLICATIONS INFORMATION

Figure 6. LTC3128 Evaluation Board Layer 2 Metal Figure 7. LTC3128 Evaluation Board Layer 3 Metal

Figure 8. LTC3128 Evaluation Board Back Side Metal Figure 9. LTC3128 Evaluation Board Back Side Silkscreen

3128f

18 For more information www.linear.com/LTC3128


LTC3128
TYPICAL APPLICATIONS

USB 3.0 (900mA Programmed Input Current) Powered, 4.8V Backup Supply
3.3µH

VOUT = 4.8V
SW1 SW2 MAXV = 2.85V
USB 3.0 RSENP VOUTP TO LOAD
4.5V TO 5.5V RSENS VOUTS
900mA 10µF 2.21M 300F
LTC3128
VIN
MID
RUN
10µF
PFI
PFO
10µF FB
PGOOD
MAXV PROG
10µF GND 130pF 300F
142k 12.4k 301k

3128 TA02

VOUT
1V/DIV

MID
1V/DIV

IIN
500mA/DIV

3128 TA02b
200 SECONDS/DIV

3128f

For more information www.linear.com/LTC3128 19


LTC3128
TYPICAL APPLICATIONS

5.0V to 3.3V Converter with Power Ride-Through

ENA
GND LTC4413
ENB STAT
INB OUTB

4.7µH 1.8V TO 5.5V INPUT


BUCK-BOOST CONVERTER
CONTROL CIRCUIT
SW1 SW2
3.3µH VOUT = 3.3V
INA OUTA
VIN VOUT TO LOAD
VIN SW1 SW2 316k 33pF
VOUT = 5.0V LTC3127
5.0V RSENP VOUTP
3.0A RSENS VOUTS FB
10µF 2.32M 200F
VIN LTC3128 SHDN 182k
RUN MID MODE
10µF PROG VC
PFI
10µF SGND PGND
PFO FB 22µF
10µF 0.1µF 47k
PGOOD PROG ×2
MAXV 470pF 200F 47µF
GND

147k 3.57k 301k 60.4k 3300pF

3128 TA04

THIS CIRCUIT WILL PROVIDE THE 3.3V OUTPUT WHILE SUPERCAPACITORS ARE DISCHARGING FROM 5V DOWN TO 1.8V.
THE LARGE DELTA FROM 5V DOWN TO 1.8V ALLOWS 87% OF STORED ENERGY IN THE SUPERCAPACITORS TO BE UTILIZED

VOUT
5.0V/DIV
LTC3128
VOUT
5.0V/DIV
LTC3127
VOUT
2.0V/DIV

LTC3128
IIN
2.0A/DIV

3128 TA04b
200 SECONDS/DIV

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20 For more information www.linear.com/LTC3128


LTC3128
TYPICAL APPLICATIONS

Supercapacitor Backup with Secondary Converters (3A Programmed Input Current)

TO MAIN SYSTEM LOADS,


3A MAXIMUM
3.3µH

SW1 SW2 VOUT = 4.8V


Li-Ion RSENP VOUTP TO LOAD
2.8V TO 4.2V RSENS VOUTS
3.0A 10µF 2.21M 400F
LTC3128
VIN
MID
RUN
2.0M 10µF
PFI
FB
µP PFO
PGOOD PROG 301k
10µF 499k MAXV
GND 470pF 400F
10µF 142k 3.57k

3128 TA03

THIS SUPERCAPACITOR BACKUP CIRCUIT WILL DRAW ONLY THE CURRENT THAT IS LEFT
OVER FROM THE 3A OF INPUT CURRENT CONSUMED BY MAIN LOADS IN THE SYSTEM

3128f

For more information www.linear.com/LTC3128 21


LTC3128
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

UFD Package
20-Lead Plastic QFN (4mm × 5mm)
(Reference LTC DWG # 05-08-1711 Rev B)

0.70 ±0.05

2.65 ±0.05
4.50 ±0.05 1.50 REF
3.10 ±0.05
3.65 ±0.05

PACKAGE OUTLINE

0.25 ±0.05
0.50 BSC
2.50 REF
4.10 ±0.05
5.50 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED PIN 1 NOTCH
R = 0.20 OR
0.75 ±0.05 1.50 REF C = 0.35
4.00 ±0.10 R = 0.05 TYP
(2 SIDES) 19 20

0.40 ±0.10
PIN 1
TOP MARK
(NOTE 6)
1
2

5.00 ±0.10
2.50 REF
(2 SIDES)

3.65 ±0.10

2.65 ±0.10

(UFD20) QFN 0506 REV B

0.200 REF R = 0.115 0.25 ±0.05


0.00 – 0.05 TYP 0.50 BSC
BOTTOM VIEW—EXPOSED PAD

NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE

3128f

22 For more information www.linear.com/LTC3128


LTC3128
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

FE Package
24-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1771 Rev B)
Exposed Pad Variation AA

7.70 – 7.90*
3.25 (.303 – .311)
(.128) 3.25
(.128)
24 23 22 21 20 19 18 17 16 15 14 13

6.60 ±0.10
2.74
4.50 ±0.10 (.108)
6.40
SEE NOTE 4 2.74 (.252)
(.108) BSC
0.45 ±0.05

1.05 ±0.10

0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT 1 2 3 4 5 6 7 8 9 10 11 12
1.20
4.30 – 4.50* (.047)
(.169 – .177) 0.25 MAX
REF
0° – 8°

0.65
0.09 – 0.20 0.50 – 0.75 (.0256) 0.05 – 0.15
(.0035 – .0079) (.020 – .030) BSC (.002 – .006)
0.195 – 0.30
FE24 (AA) TSSOP REV B 0910
(.0077 – .0118)
TYP
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS 4. RECOMMENDED MINIMUM PCB METAL SIZE
MILLIMETERS FOR EXPOSED PAD ATTACHMENT
2. DIMENSIONS ARE IN
(INCHES) *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
3. DRAWING NOT TO SCALE SHALL NOT EXCEED 0.150mm (.006") PER SIDE

3128f

23
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
For more
tion that the interconnection information
of its circuits www.linear.com/LTC3128
as described herein will not infringe on existing patent rights.
LTC3128
TYPICAL APPLICATION
Single Output Capacitor Application (1.5A Programmed Input Current)
3.3µH

SW1 SW2 VOUT = 2.5V


VIN RSENP VOUTP TO LOAD
1.8V TO 5.5V RSENS VOUTS 10µF
1.5A LTC3128 1.0M
VIN
RUN MID 100F
PFI
FB
10µF PFO
PGOOD
MAXV PROG
10µF GND
7.32k 220pF 301k

3128 TA01

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Current Limit
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Charge Current, Auto Cell Balancing, 20µA Quiescent Current, Shutdown Current < 2µA.
Low Profile 12-Pin 3mm × 3mm DFN or a 12-Lead MSOP Packages
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Programmable Input Current Limit VOUT = 1.8V to 5.25V, IQ = 35μA, DFN Package
LTC3125 1.2A IOUT, 1.6MHz, Synchronous Boost 94% Efficiency, VIN: 1.8V to 5.5V, VOUT(MAX) = 5.25V, IQ = 15µA, ISD < 1µA, 2mm × 3mm
DC/DC Converter With Adjustable Input DFN-8 Package
Current Limit

3128f

24 Linear Technology Corporation


LT 0314 • PRINTED IN USA

1630 McCarthy Blvd., Milpitas, CA 95035-7417


For more information www.linear.com/LTC3128
(408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com/LTC3128  LINEAR TECHNOLOGY CORPORATION 2014

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