HTC Desire HD Service Manual Rev A09
HTC Desire HD Service Manual Rev A09
HTC Desire HD Service Manual Rev A09
Service Manual
DOC-00084777
HTC Proprietary
U
HTC Corporation.
Engineering Mobility
HTC CONFIDENTIAL 1
IS-5344-01-R1
REVISION CONTROL TABLE
Service Manual files and updates are available on the hTc RMAIII Web site. For more information, go to
https://rma.htc.com.tw/rmaiii/home/index.asp
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION CONFIDENTIAL AND PROPRIETARY TO hTc CORPORATION AND SHALL NOT BE
REPRODUCED OR TRANSFERRED TO OTHER DOCUMENTS OR DISCLOSED TO OTHERS OR USED FOR ANY PURPOSE OTHER THAN THAT
FOR WHICH IT WAS OBTAINED WITHOUT THE EXPRESSED WRITTEN CONSENT OF hTc CORPORATION.
HTC CONFIDENTIAL 2
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1. INTRODUCTION ....................................................................................................................................................................4
8. RF ANTENNA SPECIFICATION........................................................................................................................................95
HTC CONFIDENTIAL 3
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1. Introduction
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PBCCH TTFF (95% successful rate): < 20 seconds
Link Adaptation and Incremental Redundancy 2D Location Error (95% successful rate): < 100 m
z USIM/SIM Sensitivity requirement
1.8/3V of UICC 9 GPS for one satellite: up to -142dBm
USIM Application at least according to 3GPP TS 9 GPS for remaining satellite: up to -147dBm
31.102 3GPP TS 25.171 compliance (Requirement for
SIM Application Tool Kit release 96 complete, 98 support of Assisted Global Positioning System)
class 3, and 99 partial 3GPP 34.171 (Terminal conformance specification,
Over the Air (OTA) programming Assisted Global Positioning System)
FDN 3GPP TS 34.108 (Common test environments for
AND User Equipment conformance testing)
Security Pin 1 & 2 control Motion G-sensor
Standalone GPS (Qualcomm based solution) z Tri-Axis Accelerometer
z Internal GPS antenna z Resolution: 3.9 milli-g
z Support NMEA 0183 version 3.0 or above z Assist user interface to perform automatic screen
z Dynamically allocate parallel channel GPS receiver rotation when users rotate the display in browser and
z Acquisition time album applications.
Hot start: 8 seconds, average TTFF (open sky & z Support camera application to record the orientation
static condition) of photos
Warm start: 60 seconds, average TTFF (open sky & z Together with the light sensor to support auto screen
static condition) on/off when user move device leave/close to ear
Cold start: 75 seconds, average TTFF (open sky & Digital Compass
static condition) z Compass resolution: ± 1 degree (displays degrees
z Update rate: once/1sec (default) and cardinal points)
z GPS Accuracy z 2D/3D (2/3 channel) sensor
Position: < 15 meters, 95% successful rate z Within ± 5 degrees accuracy
Velocity: 0.05 meter/sec steady state z ± 1200 μT Magnetic flux measuring range
A-GPS (Qualcomm Based solution) z Support auto map orientation alignment
z Support UE-Based & UE-Assisted A-GPS Proximity sensor
z E911 Location Information (for device shipped to US) Ambient Light Sensor
z OMA SUPL v1.0 compliance (v2.0 if available) FM Radio
SUPL-RRLP z Tuning range: 87.5-108 MHz
WAP push initiated SUPL z FM sensitivity: 8uV @ (S+N)/N=26 dB
z Standard 3GPP A-GPS compliance z Auto channel search
3GPP TS 44.031 (RRLP 5.12) z Support 3.5mm in antenna usage
3GPP TS 25.305 (GSM & UMTS) Digital Camera
z Performance requirement z 8 MP Color CMOS with auto focus
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z 2x LED flash Light 9 GOEP (generic object exchange profile)
z One bi-colors (Green & Amber) LED for notifications 9 PBAP (Phone Book Access Profile)
Surround sound effect of Dolby and SRS (for 9 WPA authentication – WEP, WPA, PSK,
16-bits with 8KHz, 11KHz, 22KHz, 44.1KHz authenticated and encrypted utilizing TLS
Receiver QoS
Headset 9 802.11e
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z MicroSD Card Slot on PDM
Support SD2.0/ SDHC GMS Applications (subject to Google's approval)
z RF Connector for testing z Gmail
Power z Google Maps
z Battery z Google Talk
Removable battery, 1,230 mAh z Market
z Battery life z Search
GSM talk time: 200~430 minutes z Setup Wizard
GSM standby time: 150~390hours z Street View
WCDMA talk time: 100~280 minutes z Sync
WCDMA standby time: 200~500hours z Voice Search (US only)
z AC adaptors z YouTube
AC input: 100 ~ 240V AC, 50/60 Hz Value-added Applications & Enhancement
The device shall be able to detect the AC z Calculator
adapter complied with China adapter z Calendar
standard. z Call History
z DC output: 5V and 1A z Camcorder
Liquid Indicator z Camera
Accessories z Clock
z Quick start guide [Inbox] z Desk Clock
z Standard battery [Inbox] z Reader
z Accessory leaflet [Inbox] (Own Brand only) z Gallery
z AC adapter, TC X250[Inbox] z Facebook
z Micro-USB cable, DC M410[Inbox] z Flash Light
z Audio adapter cable (3.5mm, with pickup button and z FM Radio
mic), HS U350 z FriendStream
z Mono Bluetooth Headset, BH M300 z Home
z Mono Bluetooth Headset, BH M400 z Mail
z Internet z Messages
z Locations z Music
z Micro-SD card z News
z Car charger, CC C200 z PDF Viewer
z Screen protector z Peep
z 8G MicroSD card (Inbox) z People
z Generic car kit (TBD) z Phone
Customer requirements & Compatibility Test: z Power Saver application (In Settings)
Please refer to the accessory compatibility list document z Quick office
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z Quick Lookup Twitter
z HTC Recommends Tip widget
z Search People Weather
z Settings Wi-Fi Hotspot
z Setup Android Module & Enhancement
z SIM Toolkit z Android System
z Stocks z Accessibility
z Teeter z Accounts & sync
z Transfer Data (Data Move In) z AGPS (Default by Google server)
z Videos z Bluetooth Profile - A2DP, AVRCP, FTP, HFP, HSP,
z Voice Recorder OPP, PBAP
z Weather z Codec:
Home – HTC Sense Image encode & decode: JPG
z Navigation Framework Image decode: BMP, GIF, PNG
z Google Widget Audio encode & decode: AMR-NB
z HTC Widget Manager Audio decode: AAC, AAC+, eAAC+, AMR-WB,
Bookmarks MID, MP3, OGG, WAV
Calendar Video encode & decode: H.263, MPEG-4
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z HTC Media Uploader z JRF
z IMF z JPA
z Location Picker
z Lock Screen
z Live Wallpaper
z Media Uploader
z Microsoft Exchange ActiveSync
z USB tethering
z Multi Touch
z Multimedia Framework
z Ringtone Trimmer
z RSS Reader
z Streaming Media Player
z Smart Data Roaming
z Text Selection
z Text-to-speech
z Touch Input Chinese (PinYin, Cangjie, Stroke,
Handwriting)
z Touch Input
z Quick Search Box
z Connect to PC
z VPN
z Wi-Fi Hotspot
z Wi-Fi Settings
Regulatory
z GCF certification [Operator dependent]
z R&TTE: EMC / EMI, Safety SAR
z WiFi Certification
z PTCRB Approval
z BQB (Bluetooth Qualification Body) certification
z USB Certification
z CB certificate / report
z UAELAB
z ICASA
z NAT Test
z FCC approval
z FCC Hearing Aid Compatibility
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1.2 Product Features
Front panel
Proximity Sensor
Back panel
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Left Panel
Bottom Panel
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1.3 Product Tips
To remove the bottom cover
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To install the SIM card
Storage card
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Performing a hard reset
If a normal reset does not solve a system problem, you can perform a hard (full) reset. After a hard reset, the phone is
restored to its default settings—the way it was when you first purchased it and turned it on. You will lose any programs
you installed, data you entered, and settings you customized on your phone, and only Windows Mobile® software
and other pre-installed programs will remain.
Warning! Your phone will be set back to factory default settings. Make sure that any additional installed programs
and important data on your phone have been backed up before you perform a hard reset.
Important! If Encrypt files when placed on a storage card is enabled, back up all files from the storage card before
using Clear Storage, hard reset, or updating the operating system. Otherwise, you will no longer be able to access the
encrypted files on the storage card. Use HTC Sync to transfer files between your storage card and computer. After the
procedure, copy your files back to the storage card.
1. With the phone turned off, press and hold the Volume down key, then press Power key shortly and release
it. You will then see this message on the screen.
2. Release the Volume down key to FACTORY RESET.
3. Press the Power key to select FACTORY RESET.
4. Press Volume up to perform hard reset.
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Enter bootloader mode
With the phone turned off, press and hold Volume down key, then press Power key, the device will enter
bootloader mode.
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Image CRC Checksum verification
1. With the phone turned off, press and hold the Volume Down button, and then briefly press the Power
button to enter the bootloader mode.
2. Follow the instruction on the screen to select Image CRC.
3. Compare the Image CRC checksum result with ImageCRC.txt file from RMA III website
https://rma.htc.com.tw/rmaiii/home/index.asp to check whether the device has been hacked or not.
Note: The checksum of photo is for reference only. Please download the text file with Image
CRC.txt from SDO for the checksum comparison between device and file
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2. Device Disassembling and Assembling Procedure
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2.2 Disassembling procedure
Tools needed for Assembling and
Disassembling the device:
1. Torx screw-driver T5
2. Phillips screw-driver# 00
3. Opening tool (P/N: RTT-00006)
4. Cleaning cloth
5. Plastic tweezers
6. ESD wrist strap.
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Remove the battery.
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Insert the disassembly tool of GPS
cover by following the direction.
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Remove the volume key from the
housing carefully.
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Remove the Mylar from the SIM FPC
board.
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Remove the coaxial cable frame from
the chassis.
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Disconnect the receiver cable from the
upper board.
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Remove the PCB cover from the upper
board.
1. Hold the upper board by
left hand and use the
right hand to hold the
camera disassembly
fixture
2. Insert the disassembly
fixture into the camera
Note socket and press down
fully
3. Disassemble the camera
by using thumb and
medius and must hold the
bottom side of the fixture
4. Remove the camera with
vertical direction
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Disconnect the flash light cable from the
upper board.
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Remove the black Mylar from the upper
board.
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Disconnect Bluetooth and GPS coaxial
cable from the main board.
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Put the LCM+TW with bezel into an
oven for 10 minutes at 60 degree
Celsius.
Temperature and time:
Note 60℃ for 10 minutes
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Use the opening tool to cut the adhesive
double side tape by following direction.
P/N: 76H05683-00M
P/N: 76H06187-00M
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Stick the 2 Mylar tapes on the left and
right sides of chassis.
P/N: 76H06226-00M
76H06227-00M
P/N: 73H00363-00M
P/N: 76H06067-00M
P/N: 76H06186-00M
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Connect the upper board into the main
board.
P/N: 76H06046-00M
P/N: 76H06045-00M
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Connect Bluetooth and GPS coaxial
cables onto the main board.
P/N: 73H00365-00M
(Bluetooth)
P/N: 72H03746-00M*2
Torque: 0.8+/-0.1kgf-cm2
P/N: 76H05599-00M
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Connect the LCD FPC cable into the
main board.
P/N: 83H00348-00
P/N: 76H06048-00M
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Connect the flash light cable into the
upper board.
P/N: 73H00363-00M
P/N: 54H00365-00M
Stick the Mylar onto the camera module.
P/N: 76H06204-00M
P/N: 72H03737-00M
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Attach the PCB cover onto the upper
board.
P/N: 71H03477-00M
P/N: 72H04182-00M
Torque: 1.0+/-0.1kgf-cm2
P/N: 36H00838-00M
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Connect the receiver cable into the
upper board.
P/N: 76H06052-00M
P/N: 36H00848-00M
P/N: 76H06577-00M
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Put the vibrator into the chassis by
following the sequence
P/N: 36H00840-00M
P/N: 72H04695-00M
P/N: 76H06180-00M
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Stick the LCD FPC Mylar onto the main
board.
P/N: 76H06053-00M
P/N: 76H06366-00M
P/N: 76H06143-00M
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Attach the PCB cover onto the main
board.
P/N: 74H01967-00M
P/N: 72H04777-00M*3
Torque: 1.0+/-0.1kgf-cm2
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Attach the housing.
P/N: 74H01815-00M
P/N: 76H06146-00M
P/N: 77H00988-00M
P/N: 72H04864-00M
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Fasten 5 screws onto the housing at the
location indicated with Torx screw-driver
T5.
P/N: 72H04712-00M *4
P/N: 72H02986-01M *1
Torque: 1.2+/-0.1kgf-cm2
P/N: 37H00364-00M
P/N: 35H00141-xxM
P/N: 37H00341-00M
The assembly procedure is done. You may perform the function test or the
following process.
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2.4 Repair or assembly tips
Disassembly notice for LCM+TW module:
Once disassemble LCM+TW module, need to follow the direction to separate the LCM from
Tip the chassis. Prevent to damage the LCM FPC during disassembly process.
Tip Notice the assembly sequence of LCM FPC and SIM FPC board.
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2.5 Unit label location explanation
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3. ROM Re-flash Procedure
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Compare with the device version
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3.2 ROM upgrade thru RUU (Re-flash Upgrade Utility)
Connect device to PC
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Download ROM Image from SDO
RUU - 1
RUU - 2
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RUU - 3
RUU - 4
RUU - 5
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RUU - 6
RUU - 7
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3.3 Rom Image upgrade thru SD card
Download ROM Image from SDO
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SD Upgrade – 1
SD Upgrade – 2
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4. DIAGNOSTIC PROGRAM
Test item list
# Feature Name Bootloader Diag. OS mode test Option
1 Display V
2 Touch Panel V
3 Button V
4 Backlight V
5 LED V
6 Speaker Play V
7 Receiver Play V
8 Headset Play V
9 Int-Rec Int-Play V
10 Ext-Rec Ext-Play V
11 Vibrator V
12 Storage Card V
13 WIFI V
14 Bluetooth V
15 GPS V
16 G-Sensor V
17 Compass V
18 FM Radio V
19 Stylus Sensor NA NA NA
20 Main Camera V
21 2nd Camera NA NA NA
22 Auto Focus V
23 Charger V
24 ActiveSync NA NA NA
25 HTC Sync V
26 Cap-Sensor NA NA NA
27 Noise suppression NA NA NA
28 Proximity Sensor V
29 WiMAX NA NA NA
30 RF(2G/3G/CDMA..) V
31 Draw Line NA NA NA
32 QWERTY Keyboard NA NA NA
33 Headset Button V
34 Mega SIM NA NA NA
35 Zoom Bar NA NA NA
36 Slide NA NA NA
37 Checksum V
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38 Battery rundown V
39 Light sensor V
40 RAM V
41 Flash light V
42 Optical Joystick NA NA NA
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Test Procedure
How to select test item: Using navigation button -"Up" or "Down" to select the test items
How to execute the test program: Press “Action” button to start each of test items.
Diagnostic
Download the latest Diagnostic from RMAIII system
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LCD Test -2 (WHITE/BLACK pattern)
TP Test
Flashlight Test
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SD Test
Vibrator Test
Backlight Test
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Key Test
LED Test
ROMCHKSUM Test
I. Press volume key to select ROM
checksum Test on Function test menu.
II. The Rom Checksum will be displayed on
the screen.
III. Press power key to exit and return to
Function test menu.
G Sensor Test
Compass Test
Proximity Test
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MPVER Test
SDRAM Test
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OS Mode Test
USB Test
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(3) Download and print the HTC Camera
Test Chart for testing. (DOC-00087536)
https://rma.htc.com.tw/rmaiii/home/index.asp
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FM Radio Test
WLAN Test
I. Press HOME > MENU, and
then touch Settings > Wireless
controls.
II. Select the Wi-Fi check box to
turn Wi-Fi on. The phone will
scan for available wireless
networks.
III. Touch Wi-Fi settings. The
network names and security
settings (Open network or
Secured with WEP) of
detected Wi-Fi networks are
displayed in the Wi-Fi
networks section.
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GPS Test
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4.1 Rewrite Unit S/N to Device via ASP_PC_Agent
The below is procedure guide you how to rewrite unit S/N into the device after changed
the MB for unit repair via ASP_PC_Agent.
PC Environment Requirement:
-. ActiveSync 4.5 or above
- .NET framework 2.0
Download and Install Software from SDO
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Execute ASP_PC_Agent
Account: test
Password: test
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Write Unit S/N
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4.2 Perform HW Calibration
The below is the procedure to calibrate light sensor with a pre-calibrated device treated
as golden sample. Please make sure to re-calibrate a device whenever it has been
disassembled.
Prepare golden sample
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Execute “Get Golden LS ADC” in Diagnostic Mode
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Prepare repaired unit
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V. Follow the instruction on the screen
to reset the device.
VI. Place the repair unit where the
golden sample was in step V
VII. Make sure the lighting condition is
consistent with the golden unit in
step VI.
VIII. Press Power to begin.
IX. Do not move the device.
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P sensor calibration-1
P sensor calibration-2
P sensor calibration-3
P sensor calibration-4
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P sensor calibration-5
P sensor calibration-6
P sensor calibration-7
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5. Power measurement test
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Equipment set up
ACE Type I 0 8 1 0
C
It means, press button A0,B8,C1,D0
D
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Extend bolster
Start testing
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3. Check phone status, turn on “Airplane
mode”
Set the unit to :
* Airplane mode
* Make sure all RF function is off (phone, BT,
Wi-Fi…)
Conclusion:
If current consumption is passed at both of idle and sleep mode, it means M/B is GOOD.
If there is any item FAILED at idle or sleep mode, it means M/B is failed, please replace
M/B for repair.
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6. Cosmetic Inspection Criteria
¾ Class C area => 4 sides and back views of main unit include volume key, SD door and stylus.
¾ Class D area => Socket of battery, inner side of battery cover, Antenna, and battery connector.
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Description
¾ D: Diameter / L: Length / W: Width / N: Number of defects/ S: Distance from dot to dot
¾ Inspecting distance: 30 ± 5cm / Mechanical inspection angle:90 degrees /
¾ LCM inspection angle:90±15 degrees / Inspection time: 5 secs per surface.
¾ Ambient illumination is to be 500-1100 Lux
¾ The inspection condition of Newton ring:
1. Inspection distance: 30cm / Inspection time: 5 sec
2. Ambient illumination is to be 500-1000 Lux (Incandescent lamp)
3. Inspection should be performed under the condition that LCD screen could reflect the mirror
image of lamp.
4. The criteria of Newton ring’s tinges and measure of area must follow up the worst-case sample.
5. The area of Newton ring:
For less than 2.8 inch LCM, the area is smaller than 7*7 square mm
For 2.8 to 7 inch LCM, the area is smaller than 10*10 square mm
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6.2 Display inspection
Inspection Defects Accept Level Level
2 adjacent 0 Minor
LCM QVGA type:
characteristic Total Number ≦ 2; S > 5mm.
inspection Single Minor
Dark Dots VGA type:
Total Number ≦ 4; S > 5mm.
Method:
Visual 2 adjacent 0 Minor
inspection
Dark or Bright lines 0 Minor
Condition: QVGA type:
LCM switch on Total Number ≦ 3;S > 5mm.
Minor
All Allowable Dots Defects VGA type:
Total Number ≦ 5;S > 5mm.
The black edge around display area must
Shift and tilt of screen viewed area Minor
be detected by front view.
LCM appearance
inspection 0.03 < W ≦ 0.1 (mm)
Minor
Lint (linear foreign objects) 0.3 < L ≦ 3.0 (mm) N ≦ 5
Method:
Visual
inspection Spots 0.1 < D ≦ 0.3 (mm) N ≦ 4 Minor
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6.3 Main unit inspection
Gap inspection
Description Accept criteria
Can’t stuck up or no click feeling
1. Gap between each key and ME parts It couldn’t allow stuck up at pressing process.
2 The gap between the phone cover and the housing 0mm≦Gap≦ 0.2mm
3 Others, refer to production release spec Others, refer to production release spec
6-2 The gap around the AP key The gap around the AP key≦0.3mm
6-3 The gap between the Front bezel The gap between the Front bezel and housing
and housing (中框) (中框)≦0.2mm
6-4 The gap around the USB connector The gap around the USB connector≦0.3mm
6-5 The gap between the TW and AP The gap between the TW and AP key≦0.3mm
key
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6-6 The gap around the stylus The gap around the stylus≦0.2mm
6-7 The gap between the TW and the The gap between the TW and the
housing housing≦0.3mm
6-8 The gap between the X-tracker and The gap between the X-tracker and front
front bezel bezel≦0.4mm
6-9 The gap between Number key and The gap between Number key and qwerty key
qwerty key with housing with housing≦0.25mm
6-10 The gap between the Jog ball and The gap between the Jog ball and
housing housing≦0.3mm
Step inspection
Description Accept criteria
1. The step between the TW and Chassis -0.2mm≦(Step)≦0mm
The step between the housing and the phone cover Central area:
-0.2mm≦(Step)≦0.2mm
2.
Left & Right sides:
-0.25mm≦(Step)≦0.25mm
3-1 The step between the chassis and the housing -0.1mm≦(Step)≦0.1mm
3-2 The step between the GPS cover and the housing -0.15mm≦(Step)≦0.2mm
Scratch
Description Accept criteria
MI
Exposure of substrate do not accept
Scratch : L≦7mm ,W≦0.25mm ,N≦3, S≧10mm
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Label area don’t care
Class C Exposure of substrate do not accept MI
Scratch : L≦10mm ,W≦0.4mm ,N≦5, S≧5mm
Burr….etc.
Bright mark
L≦2.5mm,W≦0.25mm,N≦3 MI
Class A
L≦3.0mm,W≦0.25mm,N≦4 MI
Class B
Class C L≦3.0mm,W≦0.3mm,N≦5 MI
Lint
MI
Class A L≦3mm , W≦0.2mm ,N≦2, S ≧5 mm
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7. Generic Spare Part List and Photos
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THE PHOTO OF SPL IS GENERIC AND ONLY FOR REFERENCE, THE COLOR AND
APPEARANCE MAY BE DIFFERENT FROM THE SHIPPED PARTS, IF YOU WANT TO
APPLY THOSE PARTS, PLEASE CONTACT YOUR SERVICE ACCOUNT MANAGER FOR
MORE INFORMATION.
Note AS FOR PICTURE, PLEASE REFER TO THE TABLE AS BELOW.
FOR REFURBISHMENT PARTS, THE TABLE IS FOR YOUR REFERENCE. YOU CAN DO
THE REFURBISHMENT ONLY WHEN YOUR SERVICE MODEL IS ALLOWED TO DO THE
REFURBISHMENT.
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7.2 Board Level 2.5 Repairs
Basic Repair Instructions for Component Replacement:
Step 1 Place the solder-proof tape to cover the surrounding area of the components which being replaced.
DO NOT overheat the tape and components to avoid the tape melted and the
CAUTION components damaged
Step 2 Use Heater Gun (HAKO850B, set the temperature between 350°C, Air Speed 3~5) to remove the
components.
Step 3 Wait till the temperature cool down before removing the solder-proof tape to avoid other components
being removed
Step 4 After the damaged or defective components have been replaced; clear the surroundings for solder
and flux residues.
Notice:
A. Checking the polarity of CON8, and the position can't be shifted.
B. Checking the polarity of SW8、SW7, and it can't be reversed.
C. All the parts of the PCB should be checked if it is missing or not.
D. The OP must to wear antistatic wrist band .Don't put boards together and avoid hitting them.
E. When you solder and repair that the soldering iron ,temperature must be setup 415℃. (The
temperature range is 415℃±5℃),and the solder wire's diameter is 0.4/0.5/0.6mm(SAC 305 (1.1%)
F. Please be noticed to follow below steps for main board repair which is equipped with Golden
Capacitor:
1. When replacing level 2.5 components located around the golden capacitor:
I. The temperature of the hot air blower must be under 400°c
II. When apply the hot air to the part / component, the heating time must be under 20
seconds (including the time of removing and soldering)
III. The temperature of the soldering iron must be under 350°c
IV. When apply the solder tip to the part / component, the heating time must be under 5
seconds
V. The solder tip must not contact with the golden capacitor
2. For BGA replacement: The golden capacitor must be removed before perform pre-heating,
heating, soldering and de-soldering process, and then it must be replaced with a new one
(please refer to 1.c. and 1.d. steps)
3. For main board which failed to pass the function test, the golden capacitor must be replaced
with a new one and must follow below soldering criteria: The temperature of the soldering iron
must be under 350°c When apply the solder tip to the part / component, the heating time must
be under 5 seconds The solder tip must not have a contact with the body of golden capacitor.
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51H40613-XXM PCBA-MAIN BOARD(Side A)
Location P/N Description Q'ty Description
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51H40613-XXM PCBA-MAIN BOARD(Side B)
Location P/N Description Q'ty Description
PAC65 16H00012-01M Gold Cap,0.02F,3.3V 1 Gold cap
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7.3 FRU M/B additional parts location
P/N Description Qty
76H06054-00M Tape, main board-EMC25,conductive tape+mylar 1
76H06047-00M Tape,shielding bottom-EMC22,conductive tape+mylar 1
76H06047-00M
76H06054-00M
Black Mylar is in
top side
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8. RF Antenna Specification
ACE WCDMA Antenna Test Specification
Item Test Name TX Level Uplink / Downlink UA RF CN 1st Downlink cell power note
Camp@ W-CDMA
1 3 9613 / 10563 -60
Band ( 2100 )
2 BS Originate Cell 3 9613 / 10563 -60
Receiver Test
3 Fast Bit Error Rate 3 9613 / 10563 -104
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ACE GSM Antenna Test Specification
Item Test Name TX Level TCH 1st Downlink cell power note
1 Wait_Signal 0 600 -65
2 Power_Class 0 600 -65
PCS 1900 Receiver Test
Fast Bit Error
3 0 512 -104
Rate
Fast Bit Error
4 0 661 -104 ≦ 2.44 %
Rate
Fast Bit Error
5 0 810 -104
Rate
PCS 1900 Transmitter Test
6 TX Power 0 512 -65
7 TX Power 0 661 -65 ≧24 dbm
8 TX Power 0 810 -65
EGSM 900 Receiver Test (For EU SKU)
Fast Bit Error
9 5 975 -104
Rate
Fast Bit Error
10 5 38 -104 ≦ 2.44 %
Rate
Fast Bit Error
11 5 124 -104
Rate
EGSM 900 Transmitter Test (For EU SKU)
12 TX Power 5 975 -65
13 TX Power 5 42 -65 ≧28 dbm
14 TX Power 5 124 -65
DCS 1800 Receiver Test
Fast Bit Error
21 0 512 -104
Rate
Fast Bit Error
22 0 698 -104 ≦2.44 %
Rate
Fast Bit Error
23 0 885 -104
Rate
DCS 1800 Transmitter Test
24 TX Power 0 512 -65
25 TX Power 0 698 -65 ≧26 dbm
26 TX Power 0 885 -65
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