Tutorial - Chapter 1: Basic Concepts: Wednesday 05/02/2020 Venue: K303

Download as pdf or txt
Download as pdf or txt
You are on page 1of 2

EAT TRANSFER A414

Tutorial – Chapter 1: Basic concepts


Wednesday 05/02/2020 Venue: K303

{Online quiz will remain open until 14h00 on Wed 12/02/2019}

TASK
Read the Module Framework and make sure you understand what is expected of you for this
module. Take careful not of ECSA ELO go / no-go assessments and what is required of you to
successfully complete the module.

Question 1
What property of a surface makes it particularly convenient for use in heat transfer analysis
and why? Motivate your answer through reference to the first law of thermodynamics.

Question 2

a) What are the basic mechanisms of heat transfer?


b) What is the underlying commonality between all of the mechanisms?
c) How does each mechanism work (i.e. what is physically happening that allows energy to
move from one location to another by virtue of each mechanism)?
d) Based on your explanations above, identify (along with suitable motivations) in which of
the following media (or lack thereof) each mechanism can occur:
 Solids; liquids; gases; vacuum

Note: consider radiation to be a surface phenomenon.

Question 3
A wall (thermal conductivity k = 0.69 W/mK) with dimensions 4 m x 7 m x 0.3 m has an external
surface that is 15 °C hotter than the internal surface.

a) In what direction is heat transfer taking place?


b) What is the rate of heat transfer through the wall?
c) What is the heat flux through the wall?
d) Assume that the heat flux through the wall remains constant. What would happen to the
temperature difference across the wall if the convection heat transfer coefficient on the
internal surface of the wall was suddenly increased?

Question 4
An electronic ciruit board (18 cm long, 12 cm high, 0.3 cm thick and k = 16 W/mK) contains 80
microchips on its front side. Each chip dissipates 0.06 W of thermal energy that must be
rejected from the back side of board to ambient air.

a) What is the temperature difference across the board (i.e. Tfront – Tback)?
b) Calculate the convection heat transfer coefficient if Tback is measured to be 50 °C and the
ambient temperature is 20 °C.
c) You need to keep the temperature difference across the board unchanged but want to
change to more efficient microchips (<0.06 W dissipation). How would the circuit board
need to change?

Question 5
An 1.4 m long electrical wire (d = 0.2 cm) is exposed to ambient air at 20 °C. Resistive heating
results in heat generation within the wire. The wire surface temperature, voltage drop and
current are measured to be 240 °C, 110 V and 3 A respectively.

a) What is the value of the combined (radiation plus convection) heat transfer coefficient
between the wire and the air?
b) Assuming the convection heat transfer coefficient is 158.52 W/m2K, what is the radiation
emissivity of the wire surface?
c) What would the effect of coating the wire in electrical insulation be on the wire surface
temperature? Motivate your answer.

Question 6
A space craft is exposed to a solar radiation heat flux of 1500 W/m2. The craft’s surface
emissivity (ε) and solar absorptivity (αsol) are 0.8 and 0.6 respectively. Assume the surface is
completely thermally insulated from the interior of the craft and that the thermodynamic
temperature of “space” is 0 K.

a) Calculate the surface temperature at thermal equilibrium.


b) The captain is worried about the high temperature of the external surface of the space
craft and decides to accelerate the craft in an attempt to cool it down. Is this an effective
strategy? Motivate your answer.
c) Consider the energy balance on the space craft surface and recommend a strategy for
cooling the surface.

Question 7
A spherical tank (d = 4 m) contains saturated liquid nitrogen at -196 °C (1 atm). The tank is
placed in ambient air at 20 °C and a valve is opened allowing the evaporating nitrogen to
escape the tank (assume no mechanical energy losses over the valve). Determine the rate of
evaporation (in kg/s) if the overall heat transfer coefficient between the air and nitrogen is
25 W/m2K.

Latent heat of vaporization of liquid nitrogen hfg = 198 kJ/kg, density ρ = 810 kg/m3.

You might also like