Tsup8M60Sh: Taiwan Semiconductor

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TSUP8M60SH

Taiwan Semiconductor

8A, 60V Trench Schottky Rectifiers


FEATURES KEY PARAMETERS
● AEC-Q101 qualified PARAMETER VALUE UNIT
● Patented Trench Schottky technology
IF 8 A
● Low power loss, high efficiency
● Ideal for automated placement VRRM 60 V
● Wettable flank IFSM 150 A
● Moisture sensitivity level: level 1, per J-STD-020
TJ MAX 175 °C
● RoHS Compliant
● Halogen-free according to IEC 61249-2-21 Package SMPC4.6U

APPLICATIONS
● Switching mode power supply (SMPS)
● Adapters 3
● Lighting application
● On-board DC/DC converter
● Automotive 1
2
MECHANICAL DATA
● Case: SMPC4.6U
● Molding compound meets UL 94V-0 flammability rating
SMPC4.6U
● Terminal: Matte tin plated leads, solderable per J-STD-002
● Meet JESD 201 class 2 whisker test
● Polarity: As marked
● Weight: 104mg (approximately)

ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)


PARAMETER SYMBOL TSUP8M60SH UNIT
Marking code on the device 8M60
Repetitive peak reverse voltage VRRM 60 V
Reverse voltage, total rms value VR(RMS) 42 V
Forward current IF 8 A
Surge peak forward current single 8.3 ms at TA= 25°C 150
half sine-wave superimposed on IFSM A
rated load 1.0 ms at TA= 25°C 297
Junction temperature TJ -55 to +175 °C
Storage temperature TSTG -55 to +175 °C

1 Version:A2003
TSUP8M60SH
Taiwan Semiconductor

THERMAL PERFORMANCE
PARAMETER SYMBOL TYP UNIT
Junction-to-lead thermal resistance RӨJL 7 °C/W
Junction-to-ambient thermal resistance RӨJA 56 °C/W
Junction-to-case thermal resistance RӨJC 12 °C/W
Thermal Performance Note: Units mounted on PCB (16mm x 16mm Cu pad test board)

ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)


PARAMETER CONDITIONS SYMBOL TYP MAX UNIT
IF = 4.0A, TJ = 25°C 0.53 - V

(1)
IF = 8.0A, TJ = 25°C 0.61 0.64 V
Forward voltage VF
IF = 4.0A, TJ = 125°C 0.44 - V
IF = 8.0A, TJ = 125°C 0.56 0.61 V

(2)
TJ = 25°C - 600 µA
Reverse current @ rated VR IR
TJ = 125°C - 7 mA
Junction capacitance 1 MHz, VR=4.0V CJ 547 - pF
Notes:
1. Pulse test with PW=0.3 ms
2. Pulse test with PW=30 ms

ORDERING INFORMATION
ORDERING CODE PACKAGE PACKING
TSUP8M60SH M3G SMPC4.6U 1,500/7” reel
TSUP8M60SH M2G SMPC4.6U 6,000/13” reel

2 Version:A2003
TSUP8M60SH
Taiwan Semiconductor

CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance

10 10000.0
AVERAGE FORWARD CURRENT (A)

CAPACITANCE (pF)
1000.0
6

4
100.0

2
f=1.0MHz
Vsig=50mVp-p
0 10.0
0 25 50 75 100 125 150 175 1 10 100

LEAD TEMPERATURE (°C) REVERSE VOLTAGE (V)

Fig.3 Typical Reverse Characteristics Fig.4 Typical Forward Characteristics

10
INSTANTANEOUS REVERSE CURRENT (μA)

INSTANTANEOUS FORWARD CURRENT (A)

100000 100

TJ=175°C UF1DLW
10000
1 TJ=175°C

1000 10 TJ=125°C
TJ=125°C TJ=125°C TJ=25°C
0.1
100

(A)
TJ=25°C
10 1
0.01 TJ=-55°C
1 TJ=25°C Pulse width 300μs
Pulse width
1% duty cycle
0.1 0.001
0.1
10 20 30 40 50 60 70 80 90 100 0 0.3
0.1 0.4 0.5 0.4 0.6
0.2 0.3 0.5 0.7 0.8 0.8 0.9
0.6 0.7 0.9 1
1 1.1 1.2

PERCENT OF RATED PEAK REVERSE VOLTAGE (%) FORWARD VOLTAGE (V)

Fig.5 Typical Transient Thermal Impedance


100
TRANSIENT THERMAL IMPEDANCE (°C/W)

10

0.1

0.01

0.001

0.0001
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100
PULSE DURATION (s)

3 Version:A2003
TSUP8M60SH
Taiwan Semiconductor

PACKAGE OUTLINE DIMENSIONS (Unit: Millimeters)

SMPC4.6U

SUGGESTED PAD LAYOUT

MARKING DIAGRAM

P/N = Marking Code


YW = Date Code
F = Factory Code

4 Version:A2003
TSUP8M60SH
Taiwan Semiconductor

Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.

Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability
for application assistance or the design of Purchasers’ products.

Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.

The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.

5 Version:A2003

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