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    Surface Mounting Process: Mitsubishi Integrated Circuit Packages

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    OscarTech Developer
    The document discusses cleaning processes for surface mounted components. It notes that traditional cleaning solvents like CFCs are being phased out for environmental reasons. Alternative cleaning methods like using different solvents or eliminating cleaning are proposed. Key points for evaluating cleaning processes are outlined, including whether cleaning is necessary based on factors like corrosion and reliability. Methods for selecting fluxes, solvents, and cleaning equipment are also reviewed. The document provides guidance on planning cleaning processes that consider environmental regulations while ensuring product quality and reliability.

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    Surface Mounting Process: Mitsubishi Integrated Circuit Packages

    Uploaded by

    OscarTech Developer
    12 views3 pages
    The document discusses cleaning processes for surface mounted components. It notes that traditional cleaning solvents like CFCs are being phased out for environmental reasons. Alternative cleaning methods like using different solvents or eliminating cleaning are proposed. Key points for evaluating cleaning processes are outlined, including whether cleaning is necessary based on factors like corrosion and reliability. Methods for selecting fluxes, solvents, and cleaning equipment are also reviewed. The document provides guidance on planning cleaning processes that consider environmental regulations while ensuring product quality and reliability.

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    DSA0037401

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    The document discusses cleaning processes for surface mounted components. It notes that traditional cleaning solvents like CFCs are being phased out for environmental reasons. Alternative cleaning methods like using different solvents or eliminating cleaning are proposed. Key points for evaluating cleaning processes are outlined, including whether cleaning is necessary based on factors like corrosion and reliability. Methods for selecting fluxes, solvents, and cleaning equipment are also reviewed. The document provides guidance on planning cleaning processes that consider environmental regulations while ensuring product quality and reliability.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    12 views3 pages

    Surface Mounting Process: Mitsubishi Integrated Circuit Packages

    Uploaded by

    OscarTech Developer
    The document discusses cleaning processes for surface mounted components. It notes that traditional cleaning solvents like CFCs are being phased out for environmental reasons. Alternative cleaning methods like using different solvents or eliminating cleaning are proposed. Key points for evaluating cleaning processes are outlined, including whether cleaning is necessary based on factors like corrosion and reliability. Methods for selecting fluxes, solvents, and cleaning equipment are also reviewed. The document provides guidance on planning cleaning processes that consider environmental regulations while ensuring product quality and reliability.

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    MITSUBISHI INTEGRATED CIRCUIT PACKAGES

    SURFACE MOUNTING PROCESS

    2.6 CLEANING PROCESS


    CFCs (CFC-113), Trichlene, 1.1.1-trichloroethane have conventionally been used to clean flux upon completion of component mounting on
    printed boards. For environmental concerns, however, production and use of these solvents are strictly regulated. Cleaning using an
    alternative is sought. It is also called for to produce ICs without the cleaning process. To introduce cleaning using an alternative solvent or
    to abandon the cleaning process, the points given below should be studied.

    (1) IS CLEANING NECESSARY?


    Study the following points to determine whether flux cleaning is required for printed-wiring boards after component mounting.
    • The influence of flux on products' corrosion-resistance, insulation and migration
    • Product reliability
    • Products' working environment
    • Appearance
    • Reliability of visual inspection
    • In-circuit test necessary/unnecessary
    (2) CLEANING WITH SUBSTANCES OTHER THAN FREON, TRICHLOROETHYLENE AND 1.1.1-TRICHLOROETHANE
    If cleaning is judged required as a result of studying the above, then examine the flux, cleaning fluid, and cleaning method and system, and
    design the specifications of the cleaning process.
    Table 9 outlines these four points.

    Table 9 CLEANING PROCESS PLANNING (EXAMPLE)

    Flux Cleaning solvent Cleaning Method Options Cleaning Equipment Options

    Vapor cleaning
    Ultrasonic clean-
    Organic solvent (single or
    Overall cleaning ing performed/
    Rosin flux azeotrope) Cold cleaning not performed In-line system
    One-side cleaning
    or
    Water plus alkali rosin cleaner Cleaning with rosin cleaner batch system

    Water-soluble Water Cleaning with water only


    flux Water plus neutralizer Cleaning with water and neutralizer

    (Source "The Selection of Washing Process," Fumiaki Ogura)

    The following describes the above four points as well as how to evaluate the cleaning process.

    2.6.1 FLUX SELECTION


    Soldering flux can be divided into rosin-base flux and water-soluble flux.
    The rosin-base flux is more widely used. Flux residues do not absorb moisture nor is corrosive, therefore the cleaning process is not
    required. Halogen, such as chlorine, a major activator, remains in a large amount on the boards after soldering. Possible problems that may
    occur when cleaning is insufficient should be studied thoroughly.
    Water-soluble flux is relatively new, but it is widely used in the U.S. because of the following features. (It is used mainly in flow soldering.
    Application to surface mounting is not common.)
    • After cleaning, the appearance of products is superior, compared with when rosin flux is used.
    • Excellent solderability.
    • Can be cleaned off with water, which is harmless and inexpensive.
    While water-soluble flux has a number of merits, their residues are highly corrosive and should be cleaned completely. Even an additional
    process is required to check the cleanliness after the cleaning process.

    Mar.’98
    MITSUBISHI INTEGRATED CIRCUIT PACKAGES

    SURFACE MOUNTING PROCESS

    2.6.2 CLEANING SOLVENT SELECTION


    Cleaning agents should be selected according to flux residues. Different cleaning agents are used depending on the type of flux, as given
    below:
    For rosin flux
    • Replacing Freon : HCFC225, etc., under development to replace Freon 113.
    • Terpene solvent : Consists of elements extracted from orange peel.
    (Cleaning with water is necessary.)
    • Petroleum solvent : Mixture of petroleum solvent and surface active agent.
    • Alcohol solvent : Isopropyl alcohol(IPA), ethanol, methanol, etc.
    • Alkali solvent : Mixture of organic alkali and surface active agent.
    For water-soluble flux
    • Water
    • Water plus alkali neutralizer

    (1)Rosin flux cleaning solvent


    When selecting rosin flux cleaning solvent, the following points should be considered:
    • Ionic residue cleanability
    • Nonionic residue cleanability
    Kauri-butanol value
    Boiling point
    Suitability with the resin of components and boards
    • Stability and safety
    • Waste-water treatment (for terpene solvent or alkali rosin cleaner)

    (2) Water-soluble flux cleaning agent


    To clean water-soluble flux, soft water and deionized water are recommended.
    Hard water is not recommended because it includes a large amount of calcium, magnesium and iron ions. They produce insoluble salt in the
    water. The salt may turn into scales, and deposit on the heating elements in the cleaning chamber or clog spray nozzles.
    In case of water cleaning, neutralizing fluid may be used as an assistant. However, such fluid often includes surface-active agents. For
    possible effects of surface-active agents, consult their manufacturer.

    2.6.3 SELECTION OF CLEANING METHOD AND EQUIPMENT


    (1) CLEANING WITH ORGANIC SOLUTION
    The major cleaning methods are listed below:
    • Steam cleaning
    • Dipping cleaning
    • Shower cleaning
    These are usually combined in the process. If ultrasonic waves are also used in dip washing, it should be ensured in advance that
    components do not suffer damage. (For ceramic hollow package type such as glass sealed package, do not use ultrasonic waves because
    wire disconnection may occur.) Be sure that printed circuit boards and components will not come in direct contact with the piezo electric
    transducer.
    When terpene solution or alkali solution is used for cleaning, water is often used for rinsing after the above solvents cleaning. Be sure to use
    suitable water and study the quality of waste water carefully.
    When alcohol, terpene or petroleum solution is used, explosion-proof measures should be performed to prevent flash ignition.

    (2) CLEANING WITH WATER


    If water is used for cleaning, products are showered first, then drained and dried. Be sure to study cleaning conditions carefully, such as
    spray nozzle pressure and nozzle angle, as well as drying conditions. Waste water should be treated according to related regional and
    national regulations.

    Mar.’98
    MITSUBISHI INTEGRATED CIRCUIT PACKAGES

    SURFACE MOUNTING PROCESS

    2.6.4 EVALUATION
    (1) EVALUATION OF CLEANLINESS
    For cleanliness evaluation, the following methods are used:

    Cleanliness evaluation
    • Visual inspection
    • Contact angle and wet index
    • Measurement by extracting and concentrating the contamination
    • Optical method
    • Molecular spectroscopic method etc.

    (2) EVALUATION CLEANLINESS (NO WASHING PROCESS)


    To abolish the washing process, flux should be studied carefully to conduct the tests listed below:
    • Corrosion test : (Effect on copper mirror)
    • Chlovides and bromides test: (Silver chromate paper test, etc.)
    • Insulation test: (High-temperature high-humidity bias test, etc)
    • Resistivity of water extract
    • Test using product actually used
    (Product reliability test)
    (Component reliability test)
    The criteria for these tests are considered to differ depending on the required reliability level and product specifications. Establish the
    criteria after careful investigation.

    Mar.’98

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