DRV10983 12-To 24-V, Three-Phase, Sensorless BLDC Motor Driver
DRV10983 12-To 24-V, Three-Phase, Sensorless BLDC Motor Driver
DRV10983 12-To 24-V, Three-Phase, Sensorless BLDC Motor Driver
DRV10983, DRV10983Z
SLVSCP6H – JULY 2014 – REVISED JUNE 2020
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DRV10983, DRV10983Z
SLVSCP6H – JULY 2014 – REVISED JUNE 2020 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.5 Register Maps ......................................................... 42
2 Applications ........................................................... 1 9 Application and Implementation ........................ 48
3 Description ............................................................. 1 9.1 Application Information............................................ 48
4 Revision History..................................................... 2 9.2 Typical Application .................................................. 48
5 Description (continued)......................................... 5 10 Power Supply Recommendations ..................... 50
6 Pin Configuration and Functions ......................... 5 11 Layout................................................................... 50
11.1 Layout Guidelines ................................................. 50
7 Specifications......................................................... 6
11.2 Layout Example .................................................... 51
7.1 Absolute Maximum Ratings ...................................... 6
7.2 ESD Ratings.............................................................. 6 12 Device and Documentation Support ................. 52
7.3 Recommended Operating Conditions....................... 7 12.1 Device Support .................................................... 52
7.4 Thermal Information .................................................. 7 12.2 Documentation Support ........................................ 52
7.5 Electrical Characteristics........................................... 8 12.3 Trademarks ........................................................... 52
7.6 Typical Characteristics ............................................ 11 12.4 Electrostatic Discharge Caution ............................ 52
12.5 Receiving Notification of Documentation Updates 52
8 Detailed Description ............................................ 12
12.6 Community Resources.......................................... 52
8.1 Overview ................................................................. 12
12.7 Glossary ................................................................ 52
8.2 Functional Block Diagram ....................................... 13
8.3 Feature Description................................................. 14 13 Mechanical, Packaging, and Orderable
8.4 Device Functional Modes........................................ 17
Information ........................................................... 52
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Added timing information for entering and exiting sleep mode and standby mode ............................................................... 9
• Added BEMF COMPARATOR hysteresis specification ....................................................................................................... 10
• Updated Start the Motor Under Different Initial Conditions figure ........................................................................................ 21
• Changed the default value for register address 0x27 from 0xFC to 0xF4 in the Default EEPROM Value table ................. 43
• Deleted the "TI recommends..." sentence from the description for address 0x27, bit 3 ...................................................... 46
• Added constraints to recommended external inductor ......................................................................................................... 49
• Added the DRV10983Z part number to the data sheet header and to the Device Information table .................................... 1
• Added DRV10983Z part number ............................................................................................................................................ 7
• Corrected the link to the DRV10983 and DRV10975 Tuning Guide .................................................................................... 17
• Added text to the PWM Output section ................................................................................................................................ 37
• Changed Figure 37............................................................................................................................................................... 38
• Changed "FGOLSet[1:0]" to "FGOLsel[1:0]" in Register Map address 0x2B....................................................................... 42
• Added recommended minimum dead time to SysOpt7 register........................................................................................... 47
• Added External Components table ...................................................................................................................................... 49
• Changed the link to the DRV10983 and DRV10975 Tuning Guide ..................................................................................... 49
• Changed the layout example................................................................................................................................................ 51
5 Description (continued)
An I2C interface allows the user to reprogram specific motor parameters in registers and program the EEPROM
to help optimize the performance for a given application. The DRV10983 device is available in a thermally
efficient HTSSOP, 24-pin package with an exposed thermal pad. The operating temperature is specified from
–40°C to 125°C.
VCP 1 24 VCC
CPP 2 23 VCC
CPN 3 22 W
SW 4 21 W
SWGND 5 20 V
VREG 6 19 V
Thermal pad (GND)
V1P8 7 18 U
GND 8 17 U
V3P3 9 16 PGND
SCL 10 15 PGND
SDA 11 14 DIR
FG 12 13 SPEED
Not to scale
Pin Functions
PIN
TYPE (1) DESCRIPTION
NAME NO.
CPN 3 P Charge pump pin 1, use a ceramic capacitor between CPN and CPP.
CPP 2 P Charge pump pin 2, use a ceramic capacitor between CPN and CPP.
DIR 14 I Direction
FG 12 O FG signal output.
GND 8 — Digital and analog ground
PGND 15, 16 — Power ground
SCL 10 I I2C clock signal
SDA 11 I/O I2C data signal
SPEED 13 I Speed control signal for PWM or analog input speed command
SW 4 O Step-down regulator switching node output
SWGND 5 P Step-down regulator ground
U 17, 18 O Motor U phase
V 19, 20 O Motor V phase
Internal 1.8-V digital core voltage. V1P8 capacitor must connect to GND. This is an output, but not
V1P8 7 P
specified to drive external loads.
7 Specifications
7.1 Absolute Maximum Ratings
over operating ambient temperature (unless otherwise noted) (1)
MIN MAX UNIT
VCC –0.3 30
SPEED –0.3 4
Input voltage (2) PGND –0.3 0.3 V
SCL, SDA –0.3 4
DIR –0.3 4
U, V, W –1 30
SW –1 30
VREG –0.3 7
FG –0.3 4
(2)
Output voltage VCP –0.3 V(VCC) + 6 V
CPN –0.3 30
CPP –0.3 V(VCC) + 6
V3P3 –0.3 4
V1P8 –0.3 2.5
Maximum junction temperature, TJ_MAX –40 150 °C
Storage temperature, Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the network ground terminal (GND) unless otherwise noted.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
0.008 5.2
0.004 5
0.002 4.9
IVCC VREG
0 4.8
0 10 20 30 0 10 20 30
Power Supply D001
Power Supply D002
Figure 1. Supply Current vs Power Supply Figure 2. Step-down Regulator Output vs Power Supply
(VregSel = 0)
3.5
Switching Regulator Output
3.4
3.3
3.2
VREG
3.1
0 10 20 30
Power Supply D004
8 Detailed Description
8.1 Overview
The DRV10983 is a three-phase sensorless motor driver with integrated power MOSFETs, which provide drive
current capability up to 2 A continuous. The device is specifically designed for low-noise, low external component
count, 12- to 24-V motor drive applications. The device is configurable through a simple I2C interface to
accommodate different motor parameters and spin-up profiles for different customer applications.
A 180° sensorless control scheme provides continuous sinusoidal output voltages to the motor phases to enable
ultra-quiet motor operation by keeping the electrically induced torque ripple small.
The DRV10983 features extensive protection and fault detect mechanisms to ensure reliable operation. Voltage
surge protection prevents the input Vcc capacitor from overcharging, which is typical during motor deceleration.
The devices provides phase to phase overcurrent protection without the need for an external current sense
resistor. Rotor lock detect is available through several methods. These methods can be configured with register
settings to ensure reliable operation. The device provides additional protection for undervoltage lockout (UVLO)
and for thermal shutdown.
The commutation control algorithm continuously measures the motor phase current and periodically measures
the VCC supply voltage. The device uses this information for BEMF estimation, and the information is also
provided through the I2C register interface for debug and diagnostic use in the system, if desired.
A buck step-down regulator efficiently steps down the supply voltage. The output of this regulator provides power
for the internal circuits and can also be used to provide power for an external circuit such as a microcontroller. If
providing power for an external circuit is not necessary (and to reduce system cost), configure the buck step-
down regulator as a linear regulator by replacing the inductor with resistor.
TI designed the interfacing to the DRV10983 to be flexible. In addition to the I2C interface, the system can use
the discrete FG pin, DIR pin, and SPEED pin. SPEED is the speed command input pin. It controls the output
voltage amplitude. DIR is the direction control input pin. FG is the speed indicator output, which shows the
frequency of the motor commutation.
EEPROM is integrated in the DRV10983 as memory for the motor parameter and operation settings. EEPROM
data transfers to the register after power on and exit from sleep mode.
The DRV10983 device can also operate in register mode. If the system includes a microcontroller communicating
through the I2C interface, the device can dynamically update the motor parameter and operation settings by
writing to the registers. In this configuration, the EEPROM data is bypassed by the register settings.
SDA
I2C Register EEPROM
Communication
SCL
SW
VREG 3.3-/5-V Step- FG
Down Regulator
SWGND VCC
VCP
V3P3 3.3-V LDO Charge
Pump CPP
V1P8 CPN
1.8-V LDO
GND VCC
VCP
Oscillator
Pre - U
Bandgap Driver
U PGND
V/I Logic
V sensor ADC VCC
W Core
VCP
Pre - V
SPEED PWM and Analog Driver
Speed Control
DIR PGND
Lock VCC
VCP
Over Current
Pre - W
Driver
Thermal
GND PGND
UVLO
NOTE
The DRV10983Z step-down regulator only operates in linear mode (using an external
resistor) and with a Zener diode as described in the Typical Application section. The
DRV10983Z device does not support buck mode (using an external inductor) as shown in
Figure 4.
VREG VREG
VCC VCC
IC SW IC SW
47 µH 39 Ω
3.3 V/5 V 10 µF Load 3.3 V/5 V 10 µF
SWGND SWGND
Step-Down Regulator With External Inductor (Buck Step-Down Regulator With External Resistor (Linear
Mode) Mode)
8.3.2.4 Lock
When the motor is blocked or stopped by an external force, the lock protection is triggered, and the device stops
driving the motor immediately. After the lock release time tLOCK_OFF, the DRV10983 resumes driving the motor
again. If the lock condition is still present, it enters the next lock protection cycle until the lock condition is
removed. With this lock protection, the motor and device does not get overheated or damaged due to the motor
being locked (see Lock Detect and Fault Handling).
During lock condition, the MtrLck Status bit (address 0x10, bit 4) is set. To further diagnose, check the register
FaultCode.
PWM_
DCO
Output
VCC X Motor
Amplitude
Figure 5. Multiplexing the Speed Command to the Output Amplitude Applied to the Motor
The output voltage amplitude applied to the motor is accomplished through sine wave modulation so that the
phase-to-phase voltage is sinusoidal.
PWM Output
Average Value
U-V U
V-W V
W-U W
Sinusoidal voltage from phase to phase Sinusoidal voltage with third order harmonics
from phase to GND
The output amplitude is determined by the magnitude of VCC and the PWM duty cycle output (PWM_DCO). The
PWM_DCO represents the peak duty cycle that is applied in one electrical cycle. The maximum amplitude is
reached when PWM_DCO is at 100%. The peak output amplitude is VCC. When the PWM_DCO is at 50%, the
peak amplitude is VCC / 2 (see Figure 8).
VCC
100% PWM DCO
VCC / 2
50% PWM DC0
Speed pin in DRV10983 (Standby version) and DRV10983Z (sleep version) should be in known state (pulled
high or low) when the speed is controlled via I2C.
Note that using the analog speed command, a higher voltage is required to exit from the sleep condition than the
standby condition. The I2C speed command cannot take the device out of the sleep condition because I2C
communication is disabled during the sleep condition.
Phase U
RPH_CT
RPH_CT RPH_CT
Center
Tap
Phase V Phase W
Figure 9. Wye-Connected Motor Phase Resistance
For a delta-connected motor, the motor phase resistance refers to the equivalent phase to center tap in the wye
configuration, which is represented as RY. RPH_CT = RY (see Figure 10).
For both the delta-connected motor and the wye-connected motor, calculating the equivalent RPH_CT is easy by
measuring the resistance between two phase terminals (RPH_PH), and then dividing this value by two as shown
inEquation 1.
RPH_CT = ½RPH_PH (1)
Phase U
RY
RPH_PH RPH_PH
RY RY
Center
Tap
The motor phase resistance (RPH_CT) must be converted to a 7-bit digital register value Rm[6:0] to program the
motor phase resistance value. The digital register value can be determined as follows:
1. Convert the motor phase resistance (RPH_CT) to a digital value where the LSB is weighted to represent 9.67
mΩ: Rmdig = RPH_CT / 0.00967.
2. Encode the digital value such that Rmdig = Rm[3:0] << Rm[6:4].
The maximum resistor value, RPH_CT, that can be programmed for the DRV10983 is 18.5 Ω, which represents
Rmdig = 1920 and an encoded Rm[6:0] value of 0x7Fh. The minimum resistor the DRV10983 supports is
0.029 Ω, RPH_CT, which represents Rmdig = 3.
For convenience, the encoded value of Kt[6:0] may also be obtained from Table 3.
IPD
Stationary
Align and Go
Wait
Reverse drive
Power on
DIR pin N
change ISDen
ISD
Y N Speed <
Forward
ISDThr
N
Y
Y Speed >
RvsDrThr N
BrkEn
N Y
N Brake
RvsDrEn
Motor Resynchronization
Y
IPDEn
Time > Y
BrkDoneThr N
Y
N
Align
RvsDr Accelerate
IPD
N Speed >
Op2CIsThr
ClosedLoop Y
Power-On State This is the initial power-on state of the motor start sequencer (MSS). The MSS starts in this
state on initial power-up or whenever the DRV10983 comes out of either standby or sleep modes.
ISDen Judgment After power on, the DRV10983 MSS enters the ISDen Judgment where it checks to see if the
Initial Speed Detect (ISD) function is enabled (ISDen = 1). If ISD is disabled, the MSS proceeds
directly to the BrkEn Judgment. If ISD is enabled, the motor start sequence advances to the ISD
state.
ISD State The MSS determines the initial condition of the motor (see ISD).
Speed<ISDThr Judgment If the motor speed is lower than the threshold defined by ISDThr[1:0], then the motor
is considered to be stationary and the MSS proceeds to the BrkEn judgment. If the speed is greater
than the threshold defined by ISDThr[1:0], the start sequence proceeds to the Forward judgment.
Forward Judgment The MSS determines whether the motor is spinning in the forward or the reverse direction.
If the motor is spinning in the forward direction, the DRV10983 executes the resynchronization (see
Motor Resynchronization) process by transitioning directly into the ClosedLoop state. If the motor is
spinning in the reverse direction, the MSS proceeds to the Speed>RvsDrThr.
Speed>RvsDrThr Judgment The motor start sequencer checks to see if the reverse speed is greater than the
threshold defined by RvsDrThr[2:0]. If it is, then the MSS returns to the ISD state to allow the motor
to decelerate. This prevents the DRV10983 from attempting to reverse drive or brake a motor that
is spinning too quickly. If the reverse speed of the motor is less than the threshold defined by
RvsDrThr[2:0], then the MSS advances to the RvsDrEn judgment.
RvsDrEn Judgment The MSS checks to see if the reverse drive function is enabled (RvsDrEn = 1). If it is, the
MSS transitions into the RvsDr state. If the reverse drive function is not enabled, the MSS
8.4.3.1 ISD
The ISD function is used to identify the initial condition of the motor. If the function is disabled, the DRV10983
does not perform the initial speed detect function and treats the motor as if it is stationary.
Phase-to-phase comparators are used to detect the zero crossings of the BEMF voltage of the motor while it is
coasting (motor phase outputs are in high-impedance state). Figure 13 shows the configuration of the
comparators.
60 degrees
±
V
+
U
+
W ±
If the UW comparator output is lagging the UV comparator by 60°, the motor is spinning forward. If the UW
comparator output is leading the UV comparator by 60°, the motor is spinning in reverse.
The motor speed is determined by measuring the time between two rising edges of either of the comparators.
If neither of the comparator outputs toggle for a given amount of time, the condition is defined as stationary. The
amount of time can be programmed by setting the register bits ISDThr[1:0].
Closed loop
Op2ClsThr
Open loop
Time
RevDrThr
Reverse Drive
Coasting
Reverse drive is suitable for applications where the load condition is light at low speed and relatively constant
and where the reverse speed is low (that is, a fan motor with little friction). For other load conditions, the motor
brake function provides a method for helping force a motor which is spinning in the reverse direction to stop
spinning before a normal start-up sequence.
8.4.3.5.1 Align
The DRV10983 aligns a motor by injecting dc current through a particular phase pattern which is current flowing
into phase V, flowing out from phase W for a certain time (configured by AlignTime[2:0]). The current magnitude
is determined by OpenLCurr[1:0]. The motor should be aligned at the known position.
24 Submit Documentation Feedback Copyright © 2014–2020, Texas Instruments Incorporated
The time of align affects the start-up timing (see Start-Up Timing). A bigger inertial motor requires longer align
time.
IPDclk U N V
Clock
S
W
Drive
VW WV UV VU WU UW
IPDCurrThr
Current
S1 S3 S5 S1 S3 S5
U1 M U1 M
S2 S4 S6 S2 S4 S6
S1 S3 S5 S1 S3 S5
U1 M U1 M
S2 S4 S6 S2 S4 S6
U N V U N V U N V U N V
S S S S
W W W W
Û DGYDQFH Û advance Û DGYDQFH Û DGYDQFH
Figure 18. IPD Advance Angle
Speed
Speed =
2 Close loop
A1 ´ t + 0.5 A2 ´ t
Op2ClsThr
Select the first order and second order acceleration coefficient to allow the motor to reliably accelerate from zero
velocity up to the closed loop threshold in the shortest time possible. Using a slow acceleration coefficient during
the first order accelerate stage can help improve reliability in applications where it is difficult to accurately
initialize the motor with either align or IPD.
Select the open-to-closed loop threshold to allow the motor to accelerate to a speed that generates sufficient
BEMF for closed loop control. This is determined by the velocity constant of the motor based on the relationship
described in Equation 2.
BEMF = Kt × speed (Hz) (2)
where
• ILimit is configured by OpenLCurr[1:0]
• Rm is configured by Rm[6:0]
• Speed is variable based open-loop acceleration profile of the motor
• Kt is configured by Kt[6:0] (3)
Rm
Start driving with fast current ramp Start driving with slow current ramp
Analog Input
VANA-ZS VANA-FS
Speed
Command Maximum
Speed
Command
PWM duty
0 100%
Figure 24. PWM Mode Speed Command
Write to
SpeedCtrl2
SpdCtrl[8]
Write to
SpeedCtrl1
Buffer of
SpdCtrl[8] SpdCtrl [7:0]
Speed Command
y%
Speed command
input x%
y%
Speed command
after closed loop
accelerate buffer x%
Closed loop
accelerate settings
The DRV10983 has two options for adjusting the motor commutate advance time. When CtrlAdvMd = 0, mode 0
is selected. When CtrlAdvMd = 1, mode 1 is selected.
Mode 0: tadv is maintained to be a fixed time relative to the estimated BEMF zero cross as determined by
Equation 4.
tadv = tSETTING (4)
Mode 1: tadv is maintained to be a variable time relative to the estimated BEMF zero cross as determined by
Equation 5.
tadv = tSETTING × (U-BEMF)/U.
where
• U is the phase voltage amplitude
• BEMF is phase BEMF amplitude (5)
tSETTING (in µs) is determined by the configuration of the TCtrlAdv [6:4] and TCtrlAdv [3:0] bits as defined in
Equation 6. For convenience, the available tSETTING values are provided in Table 5.
tSETTING = 2.5 µs × [TCtrlAdv[3:0]] << TCtrlAdv[6:4] (6)
ILIMIT
VU_LIMIT M BEMF = Kt ´ Speed
LockEn (0, 1, 2, 3, 4, 5)
Speed Abnormal
Open-Loop Stuck
Register
Status[4]
Closed-Loop Stuck
Reset
Register:
Set
FaultCode [5:0]
+
DigitalCore
–
DAC
Rm
I BEMF1 = VU – I × Rm
VU M
BEMF2 = Kt × Speed
Kt_high
Ktc
Kt
Kt_low
Lock detect
DRV10983 M
IMIN = 0
VU M BEMF
The mechanical AVS function can operate in one of two modes, which can be configured by the register bit
AVSMMd:
AVSMMd = 0 – AVS mode is always active to prevent the applied voltage from being less than the BEMF
voltage.
AVSMMd = 1 – AVS mode becomes active when VCC reaches 24 V. The motor acts as a generator and
returns energy into the power supply until VCC reaches 24 V. This mode can be used to enable faster
deceleration of the motor in applications where returning energy to the power supply is allowed.
Motor phase
driving voltage
FGOLsel = 00
FGOLsel = 01
Motor phase
driving voltage
FGOLsel = 10
MotorSpeed[15:8] MotorSpeed[7:0]
Read
MotorSpeed[15:8] MotorSpeed
Buffer[7:0]
Read
MotorSpeed[7:0]
2
I C send out motor speed.
MotorPeriod2 = 0xFF;
tELE_PERIOD = 512 (0x01FF) × 10 = 5120 µs
The motor electrical period and motor speed satisfies the condition of Equation 10.
tELE_PERIOD (s) × Velocity (Hz) = 1 (10)
U V U V U S V U V U V U V
N
N S
W W
W W W W
Rotor position (°) 0 60 120 180 240 300
Data1 0 43 85 128 171 213
IPD Advance
30 60 90 120
Angle
Data2 22 44 63 85
Register date (Data1 + Data2) mod (256)
spdCmdBuffer PWM_DCO
(1) R/W
(2) Read only
(3) EEPROM
(1) R/W
(2) Read only
Copyright © 2014–2020, Texas Instruments Incorporated Submit Documentation Feedback 43
Product Folder Links: DRV10983
DRV10983, DRV10983Z
SLVSCP6H – JULY 2014 – REVISED JUNE 2020 www.ti.com
(3) EEPROM
44 Submit Documentation Feedback Copyright © 2014–2020, Texas Instruments Incorporated
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI's customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
VCC
10 µF
0.1 µF
1 VCP VCC 24
2 CPP VCC 23
0.1 µF
10 µF 3 CPN W 22
3.3 V or 5 V
4 SW W 21
39 W
5 SWGND V 20
M
6 VREG V 19
1 µF
7 V1P8 U 18
8 GND U 17
1 µF
9 V3P3 PGND 16
10 SCL PGND 15
11 SDA DIR 14
Interface to 12 FG SPEED 13
Microcontroller
Figure 40. Typical Application Schematics for DRV10983 (Top Image) and DRV10983Z (Bottom Image)
48 Submit Documentation Feedback Copyright © 2014–2020, Texas Instruments Incorporated
FG
Phase
current
Phase
voltage
Figure 41. DRV10983 Start-Up Waveform Figure 42. DRV10983 Operation Current Waveform
11 Layout
CVCP(0.1 uF)
VCP VCC
CCPP(0.1 µF)
CPP VCC
CPN W
LSW_VREG(47 µH)
SW W
CVREG(10 µF)
SWGND V
VREG V
CV1P8(1 µF)
V1P8 U
GND U
CV3P3(1 µF)
V3P3 PGND
RSCL(4.75 kW)
SCL PGND
RSDA(4.75 kW)
SDA DIR
RFG(4.75 kW)
FG SPEED
12.3 Trademarks
PowerPAD, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 30-Jun-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
DRV10983PWP ACTIVE HTSSOP PWP 24 60 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 DRV10983
& no Sb/Br)
DRV10983PWPR ACTIVE HTSSOP PWP 24 2000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 DRV10983
& no Sb/Br)
DRV10983ZPWP ACTIVE HTSSOP PWP 24 60 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 DRV10983Z
& no Sb/Br)
DRV10983ZPWPR ACTIVE HTSSOP PWP 24 2000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 125 DRV10983Z
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 30-Jun-2020
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
• Automotive: DRV10983-Q1
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Jun-2020
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Jun-2020
Pack Materials-Page 2
GENERIC PACKAGE VIEW
TM
PWP 24 PowerPAD TSSOP - 1.2 mm max height
4.4 x 7.6, 0.65 mm pitch PLASTIC SMALL OUTLINE
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224742/B
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PACKAGE OUTLINE
PWP0024B SCALE 2.200
PowerPAD TM TSSOP - 1.2 mm max height
PLASTIC SMALL OUTLINE
7.9 2X
7.7 7.15
NOTE 3
12
13
0.30
4.5 24X
B 0.19
4.3
0.1 C A B
(0.15) TYP
SEE DETAIL A
4X (0.2) MAX
2X (0.95) MAX NOTE 5
NOTE 5
EXPOSED
THERMAL PAD
0.25
5.16
4.12 GAGE PLANE 1.2 MAX
0.15
0 -8 0.05
0.75
0.50 DETAIL A
(1) TYPICAL
2.40
1.65
4222709/A 02/2016
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153.
5. Features may not be present and may vary.
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EXAMPLE BOARD LAYOUT
PWP0024B PowerPAD TM TSSOP - 1.2 mm max height
PLASTIC SMALL OUTLINE
(3.4)
NOTE 9 SOLDER MASK
(2.4) DEFINED PAD
24X (1.5) SYMM
SEE DETAILS
1
24
24X (0.45)
(R0.05)
TYP
(1.1) (7.8)
SYMM TYP NOTE 9
(5.16)
22X (0.65)
( 0.2) TYP
VIA
12 13
NOTES: (continued)
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EXAMPLE STENCIL DESIGN
PWP0024B PowerPAD TM TSSOP - 1.2 mm max height
PLASTIC SMALL OUTLINE
(2.4)
BASED ON
24X (1.5) 0.125 THICK
STENCIL
(R0.05) TYP
1
24
24X (0.45)
(5.16)
SYMM BASED ON
0.125 THICK
STENCIL
22X (0.65)
12 13
SYMM
METAL COVERED
BY SOLDER MASK SEE TABLE FOR
DIFFERENT OPENINGS
(5.8) FOR OTHER STENCIL
THICKNESSES
4222709/A 02/2016
NOTES: (continued)
10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
11. Board assembly site may have different recommendations for stencil design.
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