2020 r2 Capabilities PDF

• Full Support ▲ Limited Capability ▪ Requires more than 1 product
/ CONTENT
STRUCTURES
Geometric Idealization.....................................................................................3 High Frequency Electromagnetics....................................................25 Electromagnetics ........................................................................................... 42 Materials Selection & Related Tools ..........................................57
Modeling Capabilities...................................................................................... 4 Power and Signal Integrity Board Simulation Multiphysics ........................................................................................................ 42 Data Library for Industry ................................................................. 58
Materials...................................................................................................................... 4 Capabilities ........................................................................................................... 28 Design & Concept Modeling ................................................................. 43 Teaching Resources ........................................................................... 59
Composite Materials..........................................................................................5 Rlcg Parasitic Extraction..............................................................................29 3D Printing ........................................................................................................... 43
Structural Solver Capabilities ....................................................................5 Electronics Cooling ........................................................................................ 30 Reverse Engineering ................................................................................... 43
Cable Modeling ...................................................................................................31
PLATFORM
Topology Optimization................................................................................... 6 Interfaces And Add-Ons ........................................................................... 43
optiSLang.................................................................................................. 60
Multi Analysis...........................................................................................................7 HPC For Electronics ........................................................................................31 Materials Data for Designers and Simulation ......................... 43
Minerva....................................................................................................... 60
Vibrations....................................................................................................................7
Nonlinear Transient Dynamics................................................................. 8 Systems Modeling - Electronics Products ADDITIVE SOLUTIONS
Explicit Dynamics................................................................................................ 8 System Modeling for Power Electronics .......................................32 Additive Prep ..........................................................................................44
Durability.................................................................................................................... 9 System Modeling for RF/Microwave .................................................32 Topology and Latice Optimization ..........................................44
Wave Hydrodynamics..................................................................................... 9 System Modeling for SI/PI .........................................................................33 Geometry and STL File Handling .............................................. 45
Thermal...................................................................................................................... 10 Platform Technologies .................................................................................33 Workbench Additive .......................................................................... 45
Additional Physics............................................................................................. 10 Electro-Thermal Interaction ................................................................... 34 Additive Print ..........................................................................................46
Optimization...........................................................................................................11 Materials Database For Electronics .................................................. 34 Additive Science ................................................................................... 47
Miscellaneous And Usability.......................................................................11 Miscellaneous ..................................................................................................... 34 Granta MI- Additive ............................................................................ 47
HPC – Structures.................................................................................................12
SYSTEMS & EMBEDDED SOFTWARE OPTICAL
FLUIDS System Simulation, Validation and Digital Twins ..................35 Ansys Products Embeded .............................................................48
General Solver Capabilities ........................................................................13 Functional Safety Analysis ........................................................................35 General Solver Capabilities ............................................................48
Single Phase, Non-Reacting Flows..................................................... 14 Cybersecurity Analysis .................................................................................36 Photometry / Radiometry ..............................................................48
Heat Transfer......................................................................................................... 14 Model-Based Systems Engineering .................................................36 Human Vision ......................................................................................... 49
Particles Flows (Multiphase)......................................................................15 Embedded Control Software .................................................................37 Wavelength Range ............................................................................. 49
Free Surface Flows (Multiphase)............................................................15 Man-Made Interface Software ...............................................................38 Optical Design ....................................................................................... 49
Dispersed Multiphase Flows (Multiphase)....................................16 AV Perception Software Testing ..........................................................38 Optical Sensors ...................................................................................... 50
Reacting Flows.....................................................................................................17 Head-Up Display .................................................................................. 50
Turbomachinery..................................................................................................18 VREXPERIENCE HPC – Speos ............................................................................................. 50
In-Flight Icing........................................................................................................18 Human Vision ......................................................................................................38 Simulation Preparation .....................................................................51
Optimization..........................................................................................................19 Headlamp Simulation ..................................................................................39 Post Processing .......................................................................................51
High Rheology Material.............................................................................. 20 System Simulation ..........................................................................................39 Optimization ............................................................................................52
HPC – Fluids.......................................................................................................... 20 Context Simulation .........................................................................................39
Pre And Post Processing..............................................................................21 Rendering Engine ..........................................................................................40 Optical Measurement Device
Multiphysics ...........................................................................................................21 VR .................................................................................................................................40 Included ......................................................................................................53
Fluid-Structure Interaction.........................................................................21 Solver .........................................................................................................................40 Measurement Capability .................................................................53
Electro-Thermal Interaction......................................................................21 Acoustics & Sound Quality .......................................................................40 Use Cases ................................................................................................... 54
Other Coupled Interactions......................................................................22 Geometry .................................................................................................................41 Post Processing ..................................................................................... 54
Ease of Use and Productivity...................................................................22
GEOMETRY.......................................................................................41 MATERIALS
ELECTRONICS Materials Data Management ........................................................55
Low Frequency Electromagnetics......................................................23
DESIGN TOOLS Materials Data Analysis .................................................................... 56
Magnetic Transient .........................................................................................23 Workflow Management .................................................................. 56
Structural................................................................................................................ 42
Advanced Magnetic Modeling.............................................................. 23 Integration with CAD, CAE, PLM ............................................... 56
Fluid............................................................................................................................ 42
Concept Design Solution for Electrical Machine .................. 24 Restricted Substances .......................................................................57
Thermal.................................................................................................................... 42
© 2020 ANSYS, Inc. All Rights Reserved.
• Full Support ▲ Limited Capability ▪ Requires more than 1 product

MECHANICAL MECHANICAL MECHANICAL
/ STRUCTURES ENTERPRISE PREMIUM PRO AUTODYN LS-DYNA
GEOMETRIC IDEALIZATION
Spring • • ▲ • •
Mass • • • • •
Damper • • • •
Spar • • •
Beam • • • • •
Pipe/Elbow • • •
Shell - Thin • • • • •
Layered Shell - Thin (Composite) • • • •
Shell - Thick (Solid Shell) • • •
Layered Shell - Thick (Solid Shell) (Composite) • • •
2D Plane / Axisymmetric • • • • •
1 = ANSYS nCode DesignLife Products
3D Solids • • • • • 2 = ANSYS Fluent
• •
3 = ANSYS DesignXplorer
Layered 3D Solids (Composite)
4 = ANSYS SpaceClaim
Infinite Domain • • • • • 5 = ANSYS Customization Suite (ACS)

6 = ANSYS HPC, ANSYS HPC Pack or ANSYS HPC Workgroup
2.5D • • 7 = ANSYS GRANTA Materials Data for Simulation

8 = ANSYS Additive Suite
Reinforced • • • • 9 = ANSYS Composite Cure Simulation
Coupled Field ROM Element Technology • DMP = Distributed-memory parallel

SMP = Shared-memory parallel
Substructuring / Matrix • MAPDL = Mechanical APDL
Explicit = Autodyn
RBD = Rigid Body Dynamics
Aqwa = Aqwa
• Full Support ▲ Limited Capability ▪ Requires more than 1 product 3

MODELING CAPABILITIES
Contact - Linear • • • • •
Contact - Nonlinear • • • • •
Joints • • • • •
Spot Welds • • • • •
Element Birth and Death • •
Gasket Elements •
Rezoning and Adaptive Remeshing • • •
Inverse Analysis •
MATERIALS
Basic Linear Materials (Linear, Anisotropic,

Temperature Dependent) • • • • •
Basic Nonlinear Materials (Hyper, Plasticity, Rate
Independent,Isotropic, Concrete) • • ▲ • •
Advanced Nonlinear Materials (Rate dependent,
Anisotropic, Damage Models,Geomechanics Materials,
Multiphysics)
• • • 1 = ANSYS nCode DesignLife Products
2 = ANSYS Fluent
Field Dependent • • • 3 = ANSYS DesignXplorer

Reactive Materials • 5 = ANSYS Customization Suite (ACS)

Fracture Mechanics and Crack Growth • 7 = ANSYS GRANTA Materials Data for Simulation
Material Designer • 9 = ANSYS Composite Cure Simulation
GRANTA Materials Data for Simulation ▪7 ▪7 ▪7 DMP = Distributed-memory parallel

MAPDL = Mechanical APDL
Explicit = Autodyn
Aqwa = Aqwa

COMPOSITE MATERIALS
Material Definitions • • • •
Layers Definitions • ▲ • •
Interface Plies •
Advanced Modeling Features •
Variable Material Data •
Solid Extrusion •
Lay-Up Mapping •
Draping •
Lay-Up Exchange Interfaces •
Advanced Failure Criteria Library •
First-Ply Failure • •
Last-Ply failure • 1 = ANSYS nCode DesignLife Products
Delamination • • • 2 = ANSYS Fluent

Composite Cure Simulation ▪9 4 = ANSYS SpaceClaim

5 = ANSYS Customization Suite (ACS)
STRUCTURAL SOLVER CAPABILITIES 6 = ANSYS HPC, ANSYS HPC Pack or ANSYS HPC Workgroup
7 = ANSYS GRANTA Materials Data for Simulation
Linear Static • • • 8 = ANSYS Additive Suite
9 = ANSYS Composite Cure Simulation
Nonlinear Static • • •
DMP = Distributed-memory parallel
Pre-Stress Effects, Linear Perturbation • • • ▲ ▲ SMP = Shared-memory parallel
Nonlinear Geometry • • • • • Explicit = Autodyn
Aqwa = Aqwa

STRUCTURAL SOLVER CAPABILITIES (CONTINUED)
Buckling - Linear Eigenvalue • • •

Buckling - Nonlinear Post Buckling Behavior • • • •
Buckling - Nonlinear Post Buckling Behavior - Arc Length • •
Steady State Analysis Applied to a Transient Condition •
Advanced Wave Loading •
TOPOLOGY OPTIMIZATION
Structural Optimization • • •
Modal Optimization • • •
Thermal Loads • • •
Inertial Loads • • •
Optimized Design Validation • • •
Manufacturing Constraints • • • 1 = ANSYS nCode DesignLife Products
Stress constraints • • • 2 = ANSYS Fluent

Symmetry • • • 4 = ANSYS SpaceClaim

Lattice Optimization ▪8 6 = ANSYS HPC, ANSYS HPC Pack or ANSYS HPC Workgroup
Overhang/Additive Constraints ▪8 8 = ANSYS Additive Suite

Explicit = Autodyn
Aqwa = Aqwa

MULTI ANALYSIS
Submodeling • • •
Data Mapping • • •
Multiphysics Data Mapping • • ▲
Initial State • • • •
Advanced Multi-Stage 2-D to 3-D Analysis • •
VIBRATIONS
Modal • • •
Modal - Pre-Stressed • • •
Modal - Damped/Unsymmetric • •
Transient - Mode-Superposition • •
Harmonic - Mode-Superposition • •
Harmonic - Full • • 1 = ANSYS nCode DesignLife Products
2 = ANSYS Fluent
Spectrum • • 3 = ANSYS DesignXplorer
Random Vibration • • 5 = ANSYS Customization Suite (ACS)
Mistuning • • 6 = ANSYS HPC, ANSYS HPC Pack or ANSYS HPC Workgroup

Rotordynamics • • 8 = ANSYS Additive Suite

Modal Acoustic •
Harmonic Acoustic • SMP = Shared-memory parallel
Explicit = Autodyn
Aqwa = Aqwa

NONLINEAR TRANSIENT DYNAMICS
Rigid Body Mechanisms • •

Rigid Body Dynamics with CMS L Components
for Flexible Bodies •
Full Transient • • • •
CMS with Substructuring •
EXPLICIT DYNAMICS
FE (Lagrange) Solver • • •
Euler Solvers •
Meshless Solvers • •
Implicit-Explicit Deformations • • •
Implicit-Explicit Material States • •
Fluid-Structure Interaction (FSI) • •
Mass Scaling • • • 1 = ANSYS nCode DesignLife Products
2 = ANSYS Fluent
Natural Fragmentation • • 3 = ANSYS DesignXplorer
Erosion Based on Multiple Criteria • • • 5 = ANSYS Customization Suite (ACS)
De-Zoning • • 7 = ANSYS GRANTA Materials Data for Simulation
Part Activation and Deactivation (Multi Stage Analysis) • 9 = ANSYS Composite Cure Simulation
Remapping in Space • DMP = Distributed-memory parallel
Remapping Solution Methods • SMP = Shared-memory parallel

Explicit = Autodyn
Aqwa = Aqwa

DURABILITY
Stress-Life (SN) • • •
Strain-Life (EN) • • •
Dang Van ▪1 ▪1 ▪1
Safety Factor • • •
Adhesive Bond ▪1 ▪1 ▪1
Crack Growth Linear Fracture Mechanics ▪1 ▪1 ▪1
Seam Weld ▪1 ▪1 ▪1
Spot Weld ▪1 ▪1 ▪1
Thermo-Mechanical Fatigue ▪1 ▪1 ▪1
Vibration Fatigue ▪1 ▪1 ▪1
Virtual Strain Gauge Correlation ▪1 ▪1 ▪1
Python Scripting Customization ▪1 ▪1 ▪1 1 = ANSYS nCode DesignLife Products
2 = ANSYS Fluent
WAVE HYDRODYNAMICS 3 = ANSYS DesignXplorer
Diffraction and Radiation • 5 = ANSYS Customization Suite (ACS)
Frequency & Time Domain Motions Analysis • 7 = ANSYS GRANTA Materials Data for Simulation
Moorings, Joints & Tethers • 9 = ANSYS Composite Cure Simulation
Load Transfer to Structural Analysis • DMP = Distributed-memory parallel

Explicit = Autodyn
Aqwa = Aqwa

THERMAL
Steady State Thermal • • •

Transient Thermal • • •
Conduction • • • • •
Convection • • •
Radiation to Space • • •
Radiation - Surface to Surface • • •
Phase Change • • • • •
Thermal Analysis of Layered Shells and Solids • • •
ADDITIONAL PHYSICS
1-D Thermal-Flow • • •
1-D Coupled-Field Circuits •
1-D Electromechanical Transducer • 1 = ANSYS nCode DesignLife Products
2 = ANSYS Fluent
MEMS ROM • 3 = ANSYS DesignXplorer
Piezoelectric • 5 = ANSYS Customization Suite (ACS)
Piezoresistive • 7 = ANSYS GRANTA Materials Data for Simulation
Electroelastic • 9 = ANSYS Composite Cure Simulation
Electromagnetic • DMP = Distributed-memory parallel
Vibro-Acoustics • SMP = Shared-memory parallel

Electro-Migration • Explicit = Autodyn

Aqwa = Aqwa

ADDITIONAL PHYSICS (CONTINUED)
Diffusion-Pore-Fluid •
Diffusion-Thermal Structural-Electric •
Structural-Thermal-Electric-Magnetic •
1-Way Fluid-Structure Interaction ▪2 ▪2 ▪2
2-Way Fluid-Structure Interaction ▪2
OPTIMIZATION
DesignXplorer Included • • • ▪3 ▪3
Parameters • • • • •
Design Point Studies • • • • •
Correlation Analysis • • • •
Design of Experiments • • • •
Sensitivity Analysis • • • • 1 = ANSYS nCode DesignLife Products
Goal Driven Optimization • • • • 2 = ANSYS Fluent

Six Sigma Analysis • • • • 4 = ANSYS SpaceClaim

MISCELLANEOUS AND USABILITY 6 = ANSYS HPC, ANSYS HPC Pack or ANSYS HPC Workgroup
ANSYS SpaceClaim • ▪4 ▪4 ▪4 ▪4 8 = ANSYS Additive Suite
ANSYS Customization Suite (ACS) • ▪5 ▪5 ▪5 ▪5
• • • • •
Support ACT Extensions
Command Snippet Support • • • MAPDL = Mechanical APDL

Explicit = Autodyn
Aqwa = Aqwa

MISCELLANEOUS AND USABILITY (CONTINUED)
Batch run capability • • • • •

Read/Write 3rd Party Matrix CAE Data • • • •
CDB and 3rd party FE Model Import • • • •
Nastran Bulk File Export • • •
HPC - STRUCTURES
4 (DMP + SMP)
MAPDL 4 for
Default Number of Cores Explicit 4 for RBD 4 (DMP + SMP) 4 (DMP + SMP) 1 1
MAPDL 4 for
AQWA
Parallel Solving on Local PC • • • • •

Parallel Solving on Cluster • • • • •
▪
MAPDL - 6 Ex-
GPU Acceleration plicit - No
RBD - No ▪6 ▪6
AQWA - No
MAPDL - Yes
Parallel Solving with ANSYS Cloud Launched
from Desktop
Explicit - No
RBD - No
MAPDL - Yes
RBD - No
MAPDL - Yes • 1 = ANSYS nCode DesignLife Products
AQWA - No 2 = ANSYS Fluent

Explicit = Autodyn
Aqwa = Aqwa

CFD ENTERPRISE
CFD PREMIUM
CHEMKIN
/ FLUIDS ENTERPRISE
FLUENT CFX FORTE • POLYFLOW FENSAP-ICE
GENERAL SOLVER CAPABILITIES
Comprehensive Inlet and Outlet Conditions • • • • • •

Steady-State Flow • • • • • •
Transient Flow • • • • • •
2-D and 3-D Flow • ▲ ▲ • • ▲
Reduced Order Models (ROM) • •
Time Dependent Boundary Conditions • • • • • •
Customizable Materials Library • • • • • •
GRANTA Materials Data for Simulation •
Fan Model • • •
Periodic Domains • • • • • •
Flow-Driven Solid Motion (6DOF) • • •
Pressure-Based Coupled Solver • • • • • •
Density-Based Coupled Solver • • •
Dynamic/Moving-Deforming Mesh • • • • • •
Overset Mesh •
Immersed-Solid/MST Method for Moving Parts • • •
Automatic On-the-Fly Mesh Generation with Dynamic
Refinement • • •
Dynamic Solution-Adaptive Mesh Refinement • • • ▲ •
Polyhedral Unstructured Solution-Adaptive Mesh
Refinement •

CFD ENTERPRISE
CFD PREMIUM CHEMKIN
/ FLUIDS POLYFLOW FENSAP-ICE ENTERPRISE
FLUENT CFX FORTE
SINGLE PHASE, NON-REACTING FLOWS
Incompressible Flow • • • •
Compressible Flow • • • • •
Porous Media • • •
Non-Newtonian Viscosity • • •
Turbulence - Isotropic • • • • • •
Turbulence - Anisotropic (RSM) • •
Turbulence - Unsteady (LES/SAS/DES) • • •
Turbulence - Laminar/Turbulent Transition • • • •
Flow Pathlines (Massless) • • •
Acoustics (Source Export) • • •
Acoustics (Noise Prediction) • ▲
HEAT TRANSFER
Natural Convection • • • •
Conduction & Conjugate Heat Transfer • • • •
Shell Conduction (Including Multi-Layer Model) •
Internal Radiation - Participating Media • • • • •
Internal Radiation - Transparent Media • • •
External Radiation • • •

CFD ENTERPRISE
CFD PREMIUM CHEMKIN
FLUENT CFX FORTE
HEAT TRANSFER (CONTINUED)
Solar Radiation & Load • •

Simplified Heat Exchanger Model •
Non-Equilibrium Thermal Model •
Prorous Media •
PARTICLES FLOWS (MULTIPHASE)
Coupled Discrete Phase Modeling including

Thin Wall Films • • • • •
Macroscopic Particle Model •
Inert Particle Tracking (With Mass) • •
Liquid Droplet (Incl. Evaporation) • • • • •
Combusting Particles • • • • •
Multicomponent Droplets • • • • •
Discrete Element Model (DEM) • •
Break-Up And Coalescence • • • • •
Erosion • •
FREE SURFACE FLOWS (MULTIPHASE)
Implicit VOF • • •
Explicit VOF • • •
Coupled Level Set/VOF • • •
Complex Multiphase Regime Transitions (AIAD and
GENTOP Model) •

CFD ENTERPRISE
CFD PREMIUM CHEMKIN
/ FLUIDS POLYFLOW FENSAP-ICE
ENTERPRISE
FLUENT CFX FORTE
FREE SURFACE FLOWS (MULTIPHASE) (CONTINUED)
VOF to DPM Spray Model •

Open Channel Flow and Wave • •
Surface Tension • • • •
Phase Change • • • •
Cavitation • • • •
Cavitation Where Multiple Fluids and Non-Condensing
Gases are Present •
DISPERSED MULTIPHASE FLOWS (MULTIPHASE)
Mixture Fraction • •
Eulerian Model including Thin Wall Films • • • •
Boiling Model • • • •
Surface Tension • • • •
Phase Change • • • • •
Drag And Lift • • • • •
Wall Lubrication • • • •
Heat And Mass Transfer • • • • •
Population Balance • • • •
Reactions Between Phases • • • •
Granular Model for Dense Bed of Solids • •
Dense Particulate Coupling (DDPM) • •

CFD ENTERPRISE
CFD PREMIUM CHEMKIN
FLUENT CFX FORTE
REACTING FLOWS
Species Transport • • • • •
Non-Premixed Combustion • • • •
Premixed Combustion • • • •
Partially Premixed Combustion • • • •
Composition PDF Transport • •
Finite Rate Chemistry • • • • •
Pollutants and Soot Modeling • • • •
Sparse Chemistry Solver with Dynamic Cell Clustering
and Dynamic Adaptive Chemistry • • •
Ability to Use Model Fuel Library Mechanisms • • •
Flame-speed from Fuel-Component Library • • •
DPIK Spark-Ignition Model • •
Flame-Propagation Using Level-Set Method (G-Equation) • •
Internal Combustion Engine Specific Solution • • •
0-D/1-D/2-D Reactor Models and Reactor Networks •
Plasma Reactions •
Comprehensive Surface-Kinetics • •
Chemical and Phase Equilibrium • •
Flamelet table generation • •

CFD ENTERPRISE
CFD PREMIUM CHEMKIN
ENTERPRISE
FLUENT CFX FORTE
REACTING FLOWS (CONTINUED)
Flamespeed and Ignition Table Generation •

Reaction Sensitivity, Uncertainty and Path Analysis •
Surrogate Blend Optimizer •
Mechanism Reduction •
Detailed Electrochemistry Model for Li-Ion Batteries •
TURBOMACHINERY
MRF/Frozen-Rotor • •
Sliding-Mesh/Stage • •
Transient Blade Row •
Pitch Change •
Time Transformation •
Fourier Transformation •
Harmonic Analysis •
Blade Flutter Analysis •
Forced Response Analysis •
Flank Milled Blades •
Performance Maps •
IN-FLIGHT ICING
Simulation of Standard Droplets, SLD, and Ice Crystals • •

Inclusion of Vapor / Humidity Effects on Icing • •

CFD ENTERPRISE
CFD PREMIUM CHEMKIN
FLUENT CFX FORTE
IN-FLIGHT ICING (CONTINUED)
Icing Environments of Appendices C, O (SLD), and D (Ice

Crystals) • •
Various Pre-Defined Droplet Size Distributions • •
Simulation of Rime, Glaze, and Mixed Icing • •
Single-and Multi-Shot Icing Simulations with Mesh
Deformation for Prediction of Ice Accretion and
Aerodynamic Performance Degradation
• •
Single-and Multi-Shot Icing Simulations with Automatic
Re-Meshing for Prediction of Ice Accretion and
Aerodynamic Performance Degradation
•
Conjugate Heat Transfer (CHT) for Anti-and De-Icing
Simulations ▪ •
Icing of Rotating Components of All Types: Rotors,
Propellers, and Engines (Fan, Guide Vanes, and Any
Number of Compressor Rows)
▲
Ice Cracking •
Ice Shedding •
OPTIMIZATION
Parameters • • • •
Design Point Studies • • • •
Correlation Analysis • • •
Design of Experiments • • •
Sensitivity Analysis • • • •
Goal Driven Optimization • • •

CFD ENTERPRISE
CFD PREMIUM CHEMKIN
ENTERPRISE
FLUENT CFX FORTE
OPTIMIZATION (CONTINUED)
Six Sigma Analysis • • •

Adjoint Solver for Shape Optimization •
Adjoint Solver Supports Rotating Reference Frames
& Conjugate Heat Transfer •
Multi-Objective-Constrained Optimization •
Mesh Morphing (RBF Morph) ▪
HIGH RHEOLOGY MATERIAL
Viscoelasticity •
Specialty Extrusion Models •
Specialty Blow Molding Models •
Specialty Fiber Spinning Models •
HPC - FLUIDS
Parallel Solving On Local PC Option • • • • • •

Parallel Solving Over Network Option • • • • •
Parallel Solving Over Cloud Launched from Desktop •
GPU Support • •
Parallel mesh generation •

CFD ENTERPRISE
CFD PREMIUM CHEMKIN
FLUENT CFX FORTE
PRE AND POST PROCESSING
Photo Realistic Rendering • • • • • •

SpaceClaim Direct Modeler • • • • • •
Compare Multiple Runs, Datasets, Physics, Graphs in a
Single Window • • • • • •
MULTIPHYSICS
Advanced, Automated Data Exchange • • • •

Accurate Data Interpolation Between Dissimilar Meshes • • •
Drag-n-Drop Multiphysics • • •
Direct Coupling Between Physics • •
Collaborative Workflows • •
Fully Managed Co-Simulation • •
Flexible Solver Coupling Options • • •
FLUID-STRUCTURE INTERACTION
Force Induced Motion/Deformation ▪ ▪ •

Fluid Thermal Deformation ▪ ▪
Intrinsic FSI •
ELECTRO-THERMAL INTERACTION
Convection Cooled Electronics • •

Conduction Cooled Electronics • •
High Frequency Thermal Management • •
Electromechanical Thermal Management • •

CFD ENTERPRISE
CFD PREMIUM CHEMKIN
ENTERPRISE
FLUENT CFX FORTE
OTHER COUPLED INTERACTIONS
Aero-Vibro Acoustics •
Acoustics-Structural • •
Fluid Magnetohydrodynamics • •
EASE OF USE AND PRODUCTIVITY
Support ACT Simulation Apps •

Mosaic-Enabled Meshing Technology •
Task-Based Workflow - Watertight Geometries •
Task-Based Workflow - Fault Tolerant Geometries •
Directly Enter Expressions • •
Parallel Solving with ANSYS Cloud
Launched from Desktop •

Electronics Electronics Electronics Electronics Electronics Electronics Electronics
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LOW FREQUENCY ELECTROMAGNETICS
Electrostatics • • (2D Only) •

AC Conduction • • (2D Only) •
DC Conduction • • (2D Only) •
Magnetostatics • • (2D Only) •
Adaptive Field Mesh • • (2D Only) •
AC Harmonic Magnetic • • (2D Only) •
Electric Transient • • (2D Only) •
MAGNETIC TRANSIENT
Translational Motion • • (2D Only) •

Fully Automatic Symmetrical Mesh Generation • • (2D Only) •
Rotational Motion • • (2D Only) •
Non-Cylindrical Motion • • (2D Only) •
Advanced Embedded Circuit Coupling • • •
Circuit Coupling with Adaptive Time Stepping • • •
Direct and Iterative Matrix Solvers • • •
ADVANCED MAGNETIC MODELING
Vector Hysteresis Modeling • • •

Hysteresis Modeling for Anisotropic Material • • •
Frequency Dependent Reduced Order Models • • •

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ADVANCED MAGNETIC MODELING (CONTINUED)
Equivalent Model Extraction

(Linear-Motion, Rotational-Motion, No- Motion) • • •
Functional Magnetization Direction • • •
Magnetization/De- Magnetization Modeling • • •
Manufacturing Dependent Core L Loss Models • • •
Noise – Vibration Modeling ▪ ▪ ▪
Temperature De- Magnetization Modeling • • •
Core Loss Computation • • •
Lamination Modeling • • •
Magnetostriction and Magnetoelastic Modeling • • •
Hardware in the Loop Modeling • • •
Integrated Motor Synthesis and Design Kit • • • •
Integrated Planar Magnetics Synthesis and Design Kit • • •
Litz Wire Modeling • • •
CONCEPT DESIGN SOLUTION FOR ELECTRICAL MACHINE
Template-Based Magnetic Topologies •

Template-Based Cooling Topologies •
Magnetic 2D FEA with Analytical Solution •
Thermal 2D FEA with Analytical Solution •

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CONCEPT DESIGN SOLUTION FOR ELECTRICAL MACHINE (CONTINUED)
3D Thermal and Fluid Network •

Temperature Dependent Duty-Cycle Analysis •
Manufacturing Effects Due to Winding Impregnation
and Housing Interfaces •
Linear Structural 2D FEA •
Electrothermal Reduced Order Model (FMU) •
HIGH FREQUENCY ELECTROMAGNETICS
Fully Automated Adaptive Mesh Refinement • •

Multi-Frequency Broadband Adaptive Meshing • •
Frequency Domain Finite Element (FEM) Analysis • •
Frequency Domain Integral Equation (MoM) Analysis • •
Time Domain FEM Analysis • •
FEM Eigenmode Analysis • •
MoM Characteristic Mode Analysis • •
Physical Optics (PO) Analysis • •
Shooting and Bouncing Ray+ (SBR+) Analysis • •
Physical Theory of Diffraction (PTD) Correction for SBR • •
Uniform Theory of Diffraction (UTD) Correction for SBR • •
Visual Ray Tracing for SBR+ Analysis • •
SBR+ Creeping Wave Correction for RCS of Curved Obects • •

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HIGH FREQUENCY ELECTROMAGNETICS (CONTINUED)
Range Doppler Plots for Radar Scenario Analyses •

Accelerated Doppler Processing (ADP) for SBR+ Range
Doppler Analyses •
Domain Decomposition Method (DDM) for Frequency
Domain FEM Analysis • •
Hybrid Finite Element/ Integral Equation Analysis • •
UI Coupled Finite Element and/or IE with SBR+ Analysis • •
Modal Wave Port Excitation • •
Terminal Wave Port Excitations • •
Lumped, Voltage and Current Excitations • •
Circuit Port Excitations • •
Parametric Antenna Excitations for SBR+ • •
Floquet Excitations • •
Incident Wave Excitation • •
Magnetic Ferrite Bias Excitation • •
Perfect Electric and Magnetic Boundary • •
Finite Conductivity Boundary • •
Lumped RLC Boundary • •
Symmetry Boundary • •
Periodic Boundary • •

MAXWELL
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Premium
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Frequency Dependant Materials • •

Spatial XYZ Material Properties Via Dataset • •
Higher and Mixed Order Elements • •
Curvilinear Element Mesh Correction • •
S,Y,Z Matrix Results • •
E, H, J, P Field Results • •
Direct and Iterative Matrix Solvers • •
Antenna Parameter Calculation • •
Infinite and Finite Antenna Array Calculations • •
Radar Cross Section Calculation • •
FSS, EBG and Metamaterial Calculation • •
Specific Absorption Rate Calculation • •
EMI/EMC Calculation • •
System Level EMI and RFI Analysis • • •
Linear Circuit Analysis with EM Dynamic link • •
Integrated Antenna Synthesis and Design Kit • •
5G SAR Standards Toolkit • •
Power Density and CDF • •
Radar Prep/Post Simulation Wizards • •
3D Component Libraries with User Controled Parametrics • •
3D Component with Encryption Creation • •

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3D Component with Encryption Utilization • •

Mutlipaction Solver • •
Accelerated Doppler Processing (ADP) for SBR+
Range-Doppler Analysis •
POWER AND SIGNAL INTEGRITY BOARD SIMULATION CAPABILITIES
Electronics Desktop 3D Layout GUI • • • •

ECAD Translation (Altium, Cadence, Mentor, Pulsonix,
& Zuken) • • • • •
MCAD (.sat) Generation from ECAD • • •
Lead Frame Editor • • •
DC Voltage, Current and Power Analysis for PKG/PCB • •
DC Joule Heating with Ansys Icepak • • • •
Passive Excitation Plane Resonance Analysis • •
Driven Excitation Plane Resonance Analysis • •
Automated Decoupling Analysis • •
Capacitor Loop Inductance Analysis • •
AC SYZ Analysis - PI, SI, & EMI • •
Dynamically Linked Electromagnetic Field Solvers • •
Chip, Package, PCB Analysis (CPM) • • •
Near-Field EMI Analysis • •
Far-Field EMI Analysis • •
EMI/EMC Full Board Scan •

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ICEPAK
POWER AND SIGNAL INTEGRITY BOARD SIMULATION CAPABILITIES (CONTINUED)
Characteristic Impedance (Zo) L PKG/PCB Scan • •

Full PCB/PKG Cross-Talk Scanning • •
TDR Analysis • • • • •
Transient IBIS Circuit Analysis • • •
Signal Net Analyzer •
SerDes IBIS-AMI Circuit Analysis • •
Macro-Modeling (Network Data Explorer) • • • • •
Steady State AC (LNA) Analysis • •
Virtual Compliance - DDRx, GDDRx, & LPDDRx • •
SPISIM Com and USB-C Compliance •
SPISIM IBIS AMI Generation •
Synopsys HSPICE Integration • •
Cadence PSPICE Support • •
Electromagnetically Circuit Driven Field Solvers • • •
RLCG PARASITIC EXTRACTION
DCRL, ACRL & CG Solver • • •

IC Packaging RLCG IBIS Extraction for Signals & Power • •
Touchpanel RLCG Unit Cell Extraction • •
Adaptive Meshing for Accurate Extraction • • •
Bus Bar RLCG Extraction • • • •
Power Inverter & Converter Component Extraction • •
3D Component Library • •

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ICEPAK
RLCG PARASITIC EXTRACTION (CONTINUED)
Reduced RLCG Matrix Operations • •

SPICE Equivalent Modeling Export • • •
DCRL & ACRL Joule Heating Analysis with Icepak • •
Macro-Modeling (Network Data Explorer) • •
2D Cable Modeling Toolkit • •
ELECTRONICS COOLING
Multi-Mode Heat Transfer • •

Steady-State and Transient • •
CFD Analysis • •
Turbulent Heat Transfer • •
Multiple-Fluid Analysis • •
Species Transport • •
Solar Loading • •
Reduced Order Flow and Thermal • •
Joule Heating Analysis ▪ ▪ ▪ ▪ • •
Thermo-Electric Cooler Modeling • •
Thermostat Modeling • •
Package Characterization • •
Data Center Modeling • •

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CABLE MODELING
Finite Difference Time Domain Analysis •

Multi-Conductor Transmission Line Analysis • • • • • • • •
Two-Way Coupling FDTD and Transmission Line Solver ▲ ▲ •
Twisted Conductors •
Seam Impedance •
Cable Junctions •
Braided Shield Support •
Pin Voltage, Current Density, Plane Wave Excitations • • •
Multi-Conductor and Multi-Shield Support •
Uses SpaceClaim Design Modeler UI •
Thin Surface and Thin Wire Algorithms •
HPC FOR ELECTRONICS
GPU Support ▪ ▪
HPC Accelerated Frequency Sweeps • • •
HPC Distributed Hybrid Solving •
HPC Enabled Domain Decomposition Method • •
HPC Time Decomposition Method • •
HPC Enabled Multi-port Excitation Acceleration •
HPC Acceleration for DCRL, ACRL and CG •
HPC Enabled Parallel Processing • • • • •

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ICEPAK
SYSTEMS MODELING - ELECTRONICS PRODUCTS
SYSTEM MODELING FOR POWER ELECTRONICS
Circuit Simulation • • • • • • •
Block Diagram Simulation • • • • • • •
State Machine Simulation • • • • • • •
VHDL-AMS Simulation • • • • • • •
Integrated Graphical Modeling Environment • • • • • • •
Power Electronics Component Libraries • • • • • • •
Reduced Order Modeling • • • • • • •
Power Electronic Device and Module Characterization • • • • • • •
Co-Simulation with Low Frequency Electromagnetics • • •
Co-Simulation with MathWorks Simulink • • • • • • •
SYSTEM MODELING FOR RF/MICROWAVE
Radio Frequency Interference (RFI) System Solver • • •

Electromagnetic Interference System Solver • • •
RF Link Budget Analysis • • •
RF Co-Site and Antenna Coexistence Analysis • • •
Automated Diagnostics for Rapid Root-Cause Analysis • • •
RF Component Library • • •
Wireless Propagation Models • • •
Multi-Fidelity Parametric Radio Models • • •

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SYSTEM MODELING FOR SI/PI
SerDes Channel Modeling - IBIS-AMI, QuickEye and VerifEye ▲ • •

Multi-Drop & Parallel Bus Modeling - IBIS, HSPICE, Spectre,
PSPICE, and Nexxim Transient ▲ • •
Network Data Exploration • • • • •
TDR analysis • • •
Steady State AC (LNA) Analysis • • •
Virtual Compliance - DDRx, GDDRx, & LPDDRx • • •
MULTIPHYSICS
PLATFORM TECHNOLOGIES
Advanced, Automated Data Exchange • • • • • •

Drag-n-Drop Multiphysics • • • • • •
Direct Coupling Between Physics • • • • • •
Collaborative Workflows • • • • • •
Fully Managed Co-Simulation • • • • • •
Flexible Solver Coupling Options • • • • • •

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ELECTRO-THERMAL INTERACTION
Convection Cooled Electronics • • •

Conduction Cooled Electronics • • •
High Frequency Thermal Management • • • •
Electromechanical Thermal Management • • • •
MATERIALS DATABASE FOR ELECTRONICS
GRANTA Materials Data for Simulation ▪ ▪ ▪ ▪ ▪

MISCELLANEOUS
Integrated Windows HPC Support • • • • •

Integrated IBM Spectrum LSF Support • • • • •
Customizable 3rd Party Scheduler Support • • • • •
Support ACT Extensions ▲ ▲ ▲ ▲ ▲ ▲
Parallel Solving with Ansys Cloud Launched from Desktop • • • • •

MEDINI VRXPERIENCE VRXEPERIENCE
TWIN MEDINI SCADE SCADE SCADE SCADE VRXEPERIENCE VRXEPERIENCE
/ SYSTEMS & EMBEDDED SOFTWARE BUILDER ANALYZE ANALYZE FOR
CYBERSECURITY ARCHITECT SUITE DISPLAY VISION FOR
AV/ADAS HMI PERCEIVED
QUALITY SOUND
SYSTEM SIMULATION, VALIDATION AND DIGITAL TWINS
Integrated Graphical Modeling Environment •

Standard Modeling Languages and Exchange Formats •
Multi-domain Systems Modeler •
Extensive 0D Application-Specific Libraries •
3rd Party (1D) Tool Integrations •
3D ROM •
Embedded Software Integration •
Multi-Domain System Simulation •
Rapid HMI Prototyping •
System Optimization •
XIL Integration •
IIoT Connectivity •
Digital Twin Runtime Deployment •
FUNCTIONAL SAFETY ANALYSIS
Safety Concept Modelling •

Model Based Safety Analysis •
Reliability Prediction and Analysis •
Traceability and Validation Teamwork •
Integration into Engineering Environment •

MEDINI VRXPERIENCE
TWIN MEDINI SCADE SCADE SCADE SCADE VRXEPERIENCE VRXEPERIENCE VRXEPERIENCE
QUALITY SOUND
FUNCTIONAL SAFETY ANALYSIS (CONTINUED)
Customization and Process Adaption •

ANSYS Product Integration •
Reporting and Documentation •
Safety of Intended Functionality Analysis •
CYBERSECURITY ANALYSIS
Analysis Context Establishment and Asset Identification •

Threat Identification •
Attack Trees and Attack Collections •
Threat Assessment and Treatment •
Requirement Analysis and Management •
Rich Traceability •
Teamwork and Integrated Task Management •
Reporting and Customization •
MODEL-BASED SYSTEMS ENGINEERING
Model-Based System Design ▲ ▲

Functional Decomposition ▲ ▲
Architecture Decomposition • •
Allocation Of Functions To Components • •
Model Checks • •
Model Diff/Merge • •
System / Software Bi-Directional Sync • •
Model Sharing And IP Protection • •

MEDINI VRXPERIENCE
QUALITY SOUND
MODEL-BASED SYSTEMS ENGINEERING (CONTINUED)
Model-Based Interface Control Document Production • •

Configurable For Industry Standards (IMA, AUTOSAR, Etc.) • •
Product Configuration for Automotive Developers • •
EMBEDDED CONTROL SOFTWARE
Data Flow and State Machine Design and Simulation
Capabilities •
Extensive Set of Libraries Delivered as Design Examples •
Simulation Capabilities •
Record and Playback Scenarios •
Plant Model Co-Simulation Including FMI •
Coverage Analysis for Requirements Based Tests •
Formal Verification •
Timing and Stack Optimization •
Worst Case Execution Time Estimates on Target •
Verification of Stack Space Requirements •
Certified Code Generation for DO-178C, EN 50128, ISO
26262, IEC 61508 •
Certification Kits for DO-178C, EN50128, ISO 26262,
IEC 61508 •

MEDINI VRXPERIENCE
QUALITY SOUND
MAN-MADE INTERFACE SOFTWARE
Model-Based Prototyping And Specification Of MMIs •

Support Of OpenGL, OpenGL SC and OpenGL ES •
Font Management •
Optimization Of Graphical Specifications •
Plant Model Co-Simulation Including FMI •
Automatic Generation of iOS and Android Projects •
Certified Code Generation For DO-178C, EN 50128,
ISO 26262, IEC 61508 •
Certification Kits for DO-178C, EN50128, ISO 26262,
IEC 61508 •
Solutions for ARINC 661 •
Testing Capabilities •
AV PERCEPTION SOFTWARE TESTING
Perception Software Robustness Testing •

Triggering Conditions Identification •
Automatic Safety Report Generation •
VRXPERIENCE
HUMAN VISION
Glare Simulation •

MEDINI VRXPERIENCE
QUALITY SOUND
HEADLAMP SIMULATION
Virtual Measurement •
Lamp Control • ▲ ▲
IIHS Test •
SYSTEM SIMULATION
Ground-Truth Sensor •
Camera Sensor • ▲ ▲
LiDAR Sensor •
Radar Sensor •
Virtual Display Prototype •
Display software in the Loop (SCADE) •
HUD • •
Advanced Lighting Component •
CONTEXT SIMULATION
Basic Driving Scenario • ▲ ▲

Advanced Driving Scenario ▪ ▪
Advanced Vehicle Dynamic ▪ ▪
Environement Creation ▪ • •
Trigger & Animation • •
MiL/SiL Connectivity • •
HiL Connectivity •
Virtual Display & Actuators Interaction •

MEDINI VRXPERIENCE
QUALITY SOUND
VRXPERIENCE (CONTINUED)
RENDERING ENGINE
Real-Time Physics-Based Lighting • • •

Advanced Raytraced Lighting • •
Full Physics GPU Lighting •
VR
HMD • •
CAVE, Powerwall • •
Finger Tracking •
SOLVER
Tolerance Variation Engine •

ACOUSTICS & SOUND QUALITY
Analyze, Listen & Modify •

Psychoacoustics, Automatic Detection and Separation,
Play 3D Sound •
Engine Sound Design and Engine Sound Enhancement •
Active Sound Design for Electric Vehicles •
3D Sound for Listening Room and VR •
Interactive Sound for Driving Simulator •
Measure Sound Perception with Listening Test •
Listen to Ansys Mechanical, Fluent, LSDyna
and Motion Simulations •
Generate, Filter and Mix Acoustic Measurements
and CAE Simulations •

DESIGN
/ GEOMETRY MODELER SPACECLAIM
Direct Modeling Technology •

Feature Based Modeling Technology •
Open Data from All Major CAD Systems • •
Export Data to Neutral File Formats • •
Modify Imported Geometry • •
Defeaturing and Simplification Tools • •
Model Repair • •
Add Parameters for Design Exploration • •
Extract Mid-Surfaces/Shells and Beams • •
Extract Volumes & Create Inner Fluid Domains • •
Extract Outer Air Enclosures • •
Shared Topology for Conformal Meshing • •
Booleans and Slicing • •
Create Weld Bodies • •
Boundary Condition Mapping • •
Scripting • •
Sketching and Editing Tools • •
3D Comparison Tools •
Repair and Edit Faceted Data •
Icepak Integration • •
Reverse Engineering Faceted Data •

/ DESIGN TOOLS DISCOVERY
STRUCTURAL
Static Structural Analysis •

Modal Analysis •
Pre-Stressed Modal Analysis ▪
Point Masses •
Nonlinear Contact & Joints ▪
Pre-Tension Bolts ▪
Large Deformation ▪
Topology Optimization •
FLUID
Steady-state Flow •
Transient Flow •
Incompressible Flow •
Compressible Flow ▲
THERMAL
Steady-state Thermal •
Transient Thermal •
Conduction •
Convection •
ELECTROMAGNETICS
DC Conduction •
MULTIPHYSICS
Thermal-Stress •
Thermal-Electric •
Thermal-Electric-Stress •

/ DESIGN TOOLS DISCOVERY
DESIGN & CONCEPT MODELING
Concept Modeling or Detail Design •

Part/Assembly Creation or Import •
Large Assembly Import •
Geometric Parameterization •
3D PRINTING
Import, Repair, Edit Faceted Data •

Shelling and Infills •
Thickness Detection •
REVERSE ENGINEERING
Autosurface of Scanned Data •

Build Solid/Surfaces on Scanned Data •
INTERFACES AND ADD-ONS
Transfer to Mechanical •
Transfer to Fluent •
Algoryx Momentum ▪
MATERIALS DATA FOR DESIGNERS AND SIMULATION
Materials Data for Simulation •

ADDITIVE ADDITIVE ADDITIVE MECHANICAL
/ ADDITIVE SOLUTIONS PREP PRINT SUITE* ENTERPRISE
ADDITIVE PREP
Define Build Envelope • ▪ •

Multiple Parts • ▪ •
Optimize Part Orientation Based Upon Distortion
Tendency, Build Time, & Supports • ▪ •
Support Region Detection and Manual Modification • • •
Create Multiple Support Types in One Region • • •
Control of Support Parameters • • •
Multiple Support Types • • •
Angled Supports • ▪ •
Perforations, Tooth Patterns, Intrusion, Sizing and
Distribution of Support Walls • ▪ •
Automatic Support Generation • • •
Export of STL and SpaceClaim files • • •
Export of Additive Manufacturing Equipment
(OEM) Build Files • • •
Cost Estimation • • •
Layer/Scan Vector Visualization • • •
TOPOLOGY AND LATICE OPTIMIZATION
Structural Optimization •
Modal Optimization •
Thermal Loads •
Inertial Loads •

TOPOLOGY AND LATICE OPTIMIZATION (CONTINUED)
Optimized Design Validation •

Manufacturing Constraints •
Stress Constraints •
Symmetry •
Lattice Optimization • ▪
Overhang / Additive Constraints • ▪
GEOMETRY AND STL FILE HANDLING
SpaceClaim Direct Modeler • • •

WORKBENCH ADDITIVE
Nonlinear and Temperature Dependent Material

Properties •
Thermo-Mechanical Coupled Strain Solution •
Native Mechanical Environment •
Stress-Based Automatically Generated Supports •
Part Distortion & Residual Stress (As-Built) •
Part Distortion & Residual Stress After Support Removal •
Blade Crash Detection ▲
Identification of High Strain (Crack) Locations •
Layer by Layer Stress & Distortion Visualizations •
Option to Output Only the Last Layer of the Build or Every
Nth Layer •

WORKBENCH ADDITIVE (CONTINUED)
User-Defined Step Option as 1st or Last Sequence Step •

Layered Tetrahedral Meshing •
Post Build Heat Treatment •
Import of STL Supports •
Inherent Strain Isotropic and Anisotropic released •
Strain Scaling Factor for Thermal and Structural Analyses •
STL Files Can Be Exported from STL Supports •
Voxel Mesh Generation •
Wizard to transfer Results from Additive Print to
Workbench Additive •
ADDITIVE PRINT
Nonlinear and Temperature Dependent Material
Properties • •
Uniform Assumed Isotropic Strain • •
Scan Pattern Based Anisotropic Strain • •
Thermal Ratcheting Based Anisotropic Strain • •
Desktop & Cloud Stand-Alone Environments • •
Stress-Based Automatically Generated Supports • •
Part Distortion & Residual Stress (As-Built) • •
Part Distortion & Residual Stress After Support Removal • •
Distortion Compensation • •
Blade Crash Detection • •
Identification of High Strain (Crack) Locations • •

/ ADDITIVE SOLUTIONS PREP PRINT SUITE* ENTERPRISE GRANTA MI
ADDITIVE PRINT (CONTINUED)
Input Strain Hardening Factor • •

Import of STL Supports • •
Subvoxel Material Density Assignment • •
Layer by Layer Stress, Distortion & Blade Crash
Visualizations • •
Build File Readers for Multiple AM Machines • •
Auto Queue Multiple Successive Simulations • •
Additive Print to Workbench Additive Transfer
for Post Processing • •
ADDITIVE SCIENCE
Meltpool Dimensions •
Detailed Thermal History ▲
% Porosity •
Sensor Measurement Predictions ▲
Ability for add User-Defined Materials •
Material Tuning Wizard •
Morphology Prediction •
Microstructure Prediction ▲
GRANTA MI- ADDITIVE
Traceability and Capture of Additive Manufacturing Data •

AM Data Analytics •
Integration with CAD CAE and PLM Systems •
* Additive Suite requires a Mechanical Enterprise license

SPEOS SPEOS SPEOS SPEOS FAR SPEOS OPTICAL
SPEOS SPEOS SPEOS OPTICAL PART OPTICAL HUD DESIGN INFRARED DESIGN
PRO PREMIUM ENTERPRISE
/ OPTICAL DESIGN SENSOR TEST & ANALYSIS EXTENSION OPTIMIZER (1)
PrepPOST PACKAGE ADD-ONS
ANSYS PRODUCTS EMBEDED
Ansys SpaceClaim Direct Modeler • • •

ANSYS SpaceClaim Catia V5 Interface • • •
ANSYS DesignXplorer • • •
ANSYS License Manager • • •
GENERAL SOLVER CAPABILITIES
Monte-Carlo Forward Ray Tracing • • •

Monte-Carlo Backward Ray Tracing • •
Deterministic Simulation ▲ • •
Spectral Propagation • • •
Polarisation propagation • • •
Dispersion • • •
Surface Diffusion • • •
Volumic Diffusion • • •
Ambiant Material • • •
SPEOS Live Preview (GPU Acceleration) •(2) •(2)
Virtual BSDF •(1)
PHOTOMETRY / RADIOMETRY
Intensity • • •
Illuminance • • •
3D Illuminance • • •

PHOTOMETRY / RADIOMETRY (CONTINUED)
Luminance ▲ • •
3D Energy Density • •
360° View - Observer • •
360° View - Immersive • •
HUMAN VISION
Dynamic Adaptation •
Glare Simulation •
High Dynamic Range Screen support •
WAVELENGTH RANGE
Visible (360nm - 830nm) • • •

UV (100nm-360 nm) • •
Near IR (830nm - 2.5µm) • •
Far Infra-Red (2.5µm -100μm) •
OPTICAL DESIGN
Parabolic Surface •(3) • (3) • (3)

TIR Lens • (3) • (3) • (3)
Projection Lens • (3) • (3) • (3)
Optical Lens •
Optical Surface •
Light Guide •

OPTICAL DESIGN (CONTINUED)
Sharp Cut-Off Reflector •

Poly-Ellipsoidal Surface •
Micro Optical Stripes •
Freeform Lens •(2)
Honeycomb Lens •
OPTICAL SENSORS
Field Of View •
Export Sensor Grid as Geometry •
Camera Sensor •
Camera Raw Signal Export •
SPEOS Lens System Importer (ZEMAX OpticStudio) •
LiDAR Sensor •
Camera Sensor Post Processing •
HEAD-UP DISPLAY
HUD Optical Analysis •

HUD Optical Design •
HUD Visualisation •
HPC - SPEOS
Default Number of Cores 4 4 4
Parallel Solving on Local PC • • •

HPC - SPEOS (CONTINUED)
Parallel Solving on Cluster • • •

ANSYS RSM Compatibility • • •
SIMULATION PREPARATION
Source Group •(1) •(1) •(1)

Geometry Group •(1) •(1) •(1)
Local Meshing •(1) •(1) •(1)
3D Textures • •
Polarisation Plate •(1) •(1)
Fluorescent Converter • •
Texture Mapping (Bump, Multi-Layer) • •
Uniform Ambiant Source • • •
HDRI Source • • •
CIE Sky Source • •
Natural Light Source • •
Near Infrared Extended Ambient Source • •
Thermic Source •
Earth Atmosphere Model ▪
POST PROCESSING
Virtual Lighting Controller • •

Photometric Numerical Certification • • •
Colorimetric Analysis • • •

POST PROCESSING (CONTINUED)
Spectral Analysis • •
Light Expert • • •
Layer by Source • •
Layer by Face • •
Layer by Sequence • •
Stray Light Analysis • •
Layer by Polarisation • •
Visibility & Legibility •
Night Vision Goggle •
Script Automation • • •
OPTIMIZATION
Parameters • • •
Design of Experiment • • •
Design Optimisation (1) •
Design Optimisation through ANSYS DesignXplorer (2) • • •
Ansys optiSLang Interface(2) ▪ ▪ ▪
Notes:
(1) Not available for ANSYS SPEOS
(2) Only for ANSYS SPEOS
(3) Not available for SPEOS for CREO Parametric

OMD OMD OMD
/ OPTICAL PRO PREMIUM ENTERPRISE
OPTICAL MEASUREMENT DEVICE
INCLUDED
OMS2 Hardware •
OMS4 Gardware • •
Broadband Visible White Source Addon •
Portable OMD Software •
Laboratory OMD Software • •
Labs Viewers Included Included Included
MEASUREMENT CAPABILITY
BRDF • • •
BTDF • •
Reflective & Transmission spectrum (380-1000nm) • •
Roughness (Unpolished) • •
Volume Absorption • •
Volume Diffusion • •
Wavelength Range 380-725nm RGB - Pectrum - Full
Interpolate Interpolate Acquisition
Max Measurement Time 1min 4hours 32hours
Min Measurement Time 1min 5min 5min
Target Dynamic Range 10^6 10^8 10^8
0.1°
Angular Optical Resolution (FWHM) 0.5° 0.1°
(or 0.5°)
Max Dimension 30cm 2.2m 2.2m

OMD OMD OMD
/ OPTICAL PRO PREMIUM ENTERPRISE
MEASUREMENT CAPABILITY (CONTINUED)
White Led Light Sources •

Laser Light Source • •
USE CASES
Light Modelling & Photometrical Simulations • •

Visual Ergonomics & Style Studies • • •
POST PROCESSING
Interpolation Enhancement Automated Tunable Tunable
Effective Anisotropy Reconstruction from 2 Measures • • •

Labs Viewer & Editor Included Included Included
Theoretical Peak Reconstruction • • •

BRDF Visualisation & Processing • • •

GRANTA GRANTA GRANTA GRANTA PLATFORM
/ MATERIALS MI
ENTERPRISE MI PRO SELECTOR EDUPACK (optiSLang,
Minerva, Cloud)
MATERIALS DATA MANAGEMENT

GRANTA MI Database - 'Gold Source' System to Store
Corporate Materials Information • •
Manage Specialist Materials Data Types • •
Manage Meta-Data and Context for Materials •
Traceability for All Materials Data • •
Access Control • ▲
Version Control •
Multiple Unit System Support • • • •
Admin UI to Setup and Configure Database • •
Template Data Structures for Key Materials Use Cases:
Metals, Composites, AM, Restricted Substances •
Toolbox for Import, Export, Manipulation of Materials Data •
Web App for Fast Upload of Materials Data • •
Browse Materials Data • • • •
Edit and Update Materials Data • • ▲ ▲
Search and Query Materials Data • • • •
Represent Property Data in Interactive Charts • ▲ • •
Comparison Tables and Comparison Charts • ▲ • •
Generate Reports on Selected Materials Records •

/ MATERIALS MI
Minerva, Cloud)
MATERIALS DATA MANAGEMENT (CONTINUED)
Export Data to Excel and Third-Party Software • ▲ • •

Personalize System Homepages and User Profiles •
Configure Web App UI for Specific User Groups •
MATERIALS DATA ANALYSIS
Interactive Plotting of Data: Scatter, Contour, Error Bar,

Surface, Plotyy, Semilogx, Semilogy, Loglog •
Curve Fitting •
Cross-Table Comparisons of Materials Data •
Scripting Toolkit for Python and MATLAB •
WORKFLOW MANAGEMENT
Design and Develop Workflows •

Execute Workflows - Processes, Approvals, Notifications •
INTEGRATION WITH CAD, CAE, PLM
ANSYS • •
Abaqus •
ANSA •
HyperMesh •
Creo •
NX • •
CATIA v5 •

/ MATERIALS MI
Minerva, Cloud)
INTEGRATION WITH CAD, CAE, PLM (CONTINUED)
Windchill •
Teamcenter •
3DEXPERIENCE •
File Export • ▲ • •
RESTRICTED SUBSTANCES
Data structures to Support Restricted Substance

Analytics: Store Specs, Materials, Legislations,
Substances, Parts
•
Report on Restricted Substance Risk for Materials
and Process Portfolio •
Build and Edit Bills of Materials within a Web App •
At-a-Glance Restricted Substance Compliance for a BoM ▲
Run Reports Across Multiple BoMs ▲
Integrate Restricted Substance Reporting with PLM, CAD ▲
MATERIALS SELECTION & RELATED TOOLS
Reference Data for Materials Selection on PC/Laptop • •

Interactive 'Ashby Charts' of Materials Property Space ▲ ▲ • •
Systematic Materials Selection Methodology ▲ •
Filter Materials Based on Property Profile • • • •

/ MATERIALS MI
Minerva, Cloud)
MATERIALS SELECTION & RELATED TOOLS (CONTINUED)

Filter Materials Based on Links to Other Materials /
Processes / Objects ▲ ▲ • •
Materials Substitution & Equivalency - 'Find Similar' •
Performance Index Finder • •
Engineering Solver - Convert Engineering Requirements
to Materials Properties •
Hybrid Synthesizer - Predict Properties of Hybrid Materials • •
Part Cost Estimator • •
Selection Reports & Export of Charts for Presentations • •
Eco Audit for a Product or Conceptual Design • •
Edit a GRANTA Selector Database •
DATA LIBRARY FOR INDUSTRY
MaterialUniverse Generic Data for Selection • •

MI Pro Simulation Data •
JAHM Curve Data for Simulation • •
Metals Data Bundle • •
Polymers Data Bundle • •
Composites Data Bundle • •
Medical Data Bundle •
Aero Data Bundle • •
Additive Data Bundle • •
ESDU MMDH Aero Alloys •
UL Yellow Cards •

/ MATERIALS MI
Minerva, Cloud)
TEACHING RESOURCES
GRANTA EduPack Level 1-3 Teaching Databases •

The Elements Teaching Database •
Materials Science & Engineering Teaching Database •
Sustainability Teaching Database •
Bioengineering Teaching Database •
Architecture Teaching Database •
Lecture Units •
Student Exercises •
Videos •
Micro-Projects •
White Papers •
Case Studies •
Active Learning Toolkits •
Data Booklets •
Sample Project Files •
Phase Diagram Tool •

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Process Integration •
Simulation Workflows & Process Automation •
Design & Data Exploration •
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Design Optimization & Parameter
Identification (Calibration) •
Robust Design & Reliability •
Simulation Process & Data Management •
Hybrid Deployment and Simulations Apps •
Interoperability •
Multiphysics Process Integration & Robust Design •
Integration with Ansys GRANTA MI Materials
Data Management •

2020 r2 Capabilities PDF

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2020 r2 Capabilities PDF

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• Full Support ▲ Limited Capability ▪ Requires more than 1 product

• Full Support ▲ Limited Capability ▪ Requires more than 1 product

Infinite Domain • • • • • 5 = ANSYS Customization Suite (ACS)

2.5D • • 7 = ANSYS GRANTA Materials Data for Simulation

Coupled Field ROM Element Technology • DMP = Distributed-memory parallel

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 3

Basic Linear Materials (Linear, Anisotropic,

Field Dependent • • • 3 = ANSYS DesignXplorer

Reactive Materials • 5 = ANSYS Customization Suite (ACS)

GRANTA Materials Data for Simulation ▪7 ▪7 ▪7 DMP = Distributed-memory parallel

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 4

Delamination • • • 2 = ANSYS Fluent

Composite Cure Simulation ▪9 4 = ANSYS SpaceClaim

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 5

STRUCTURAL SOLVER CAPABILITIES (CONTINUED)

Buckling - Linear Eigenvalue • • •

Stress constraints • • • 2 = ANSYS Fluent

Symmetry • • • 4 = ANSYS SpaceClaim

DMP = Distributed-memory parallel

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 6

Mistuning • • 6 = ANSYS HPC, ANSYS HPC Pack or ANSYS HPC Workgroup

Rotordynamics • • 8 = ANSYS Additive Suite

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 7

NONLINEAR TRANSIENT DYNAMICS

Rigid Body Mechanisms • •

Remapping in Space • DMP = Distributed-memory parallel

Remapping Solution Methods • SMP = Shared-memory parallel

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 8

Load Transfer to Structural Analysis • DMP = Distributed-memory parallel

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 9

Steady State Thermal • • •

Electromagnetic • DMP = Distributed-memory parallel

Vibro-Acoustics • SMP = Shared-memory parallel

Electro-Migration • Explicit = Autodyn

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 10

ADDITIONAL PHYSICS (CONTINUED)

Goal Driven Optimization • • • • 2 = ANSYS Fluent

Six Sigma Analysis • • • • 4 = ANSYS SpaceClaim

Command Snippet Support • • • MAPDL = Mechanical APDL

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 11

MISCELLANEOUS AND USABILITY (CONTINUED)

Batch run capability • • • • •

Parallel Solving on Local PC • • • • •

DMP = Distributed-memory parallel

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 12

GENERAL SOLVER CAPABILITIES

Comprehensive Inlet and Outlet Conditions • • • • • •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 13

SINGLE PHASE, NON-REACTING FLOWS

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 14

HEAT TRANSFER (CONTINUED)

Solar Radiation & Load • •

Coupled Discrete Phase Modeling including

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 15

FREE SURFACE FLOWS (MULTIPHASE) (CONTINUED)

VOF to DPM Spray Model •

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 16

• Full Support ▲ Limited Capability ▪ Requires more than 1 product 17

REACTING FLOWS (CONTINUED)