Polyfuse: A Seminar Report On
Polyfuse: A Seminar Report On
Polyfuse: A Seminar Report On
com
A Seminar
Report On
Polyfuse
Submitted in partial fulfillment of the requirement for the award of degree
of Bachelor of Technology in ECE
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CONTENTS
1. INTRODUCTION
2. THE BASICS
3. PRINCIPLE OF OPERATION
4. OPERATING PARAMETERS
5. DESIGN CONSIDERATIONS
6. DESIGN CRITERIA
9. APPLICATIONS
10. CONCLUSION
11. REFERENCE
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INTRODUCTION
Polyfuses is a new standard for circuit protection .It is re-settable by itself. Many
manufactures also call it as Polyswitch or Multifuse. Polyfuses are not fuses but Polymeric
Positive temperature Coefficient Thermistors (PPTC).
Resistors are rarely an acceptable solution because the high power resistors
required are expensive .One shot fuses can be used but they might fatigue and they must be
replaced after a fault event. Another good solution available is the resettable Ceramic
Positive Temperature Coefficient (CPTC) device. This technology is not widely used
because of its high resistance and power dissipation characteristics. These devices are also
relatively large and vulnerable to cracking as result of shock and vibration.
The preferred solution is the PPTC device, which has a very low resistance in normal
operation and high resistance when exposed to fault. Electrical shorts and electrically
overloaded circuits can cause over current and over temperature damage.
Like traditional fuses, PPTC devices limit the flow of dangerously high current
during fault condition. Unlike traditional fuses, PPTC devices reset after the fault is cleared
and the power to the circuit is removed. Because a PPTC device does not usually have to be
replaced after it trips and because it is small enough to be mounted directly into a motor or
on a circuit board, it can be located inside electronic modules, junction boxes and power
distribution centers.
THE BASICS
Technically Polyfuses are not fuses but Polymeric Positive Temperature Coefficient
Thermistors. For thermistors characterized as positive temperature coefficient, the device
resistance increases with temperature. The PPTC circuit protection devices are formed from
thin sheets of conductive semi-crystalline plastic polymers with electrodes attached
to either side. The conductive plastic is basically a non-conductive crystalline
polymer loaded with a highly conductive carbon to make it conductive. The electrodes
ensure the distribution of power through the circuit.
Polyfuses are usually packaged in radial, axial, surface mount, chip or washer form.
These are available in voltage ratings of 30 to 250 volts and current ratings of 20 mA to
100A.
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PRINCIPLE OF OPERATION
Figure 1
The principle of operation and increase in resistance in shown in the Fig.1. The
increase in resistance protects the equipment in the circuit by reducing the amount of current
that can flow under the fault condition to a low steady state level. The device will remain in
its latched (high resistance state)until the fault is cleared, providing continuous protection to
the circuit. At this time the conductive polymer particles cool and recrystallises restoring the
PPTC to a low resistance state within few seconds. The circuit and the affected equipment
return to the normal operating condition.
Thus a polyfuse acts like a self-resetting solid-state circuit breaker, which makes it
suitable for providing low cost over current protection. The resistance of polyfuse at room
temperature is in the order of few ohms and increases rapidly above 110 C.
OPERATING PARAMETERS FOR POLYFUSES
1. Initial Resistance: The resistance of the device as received from the factory
2. Operating Voltage: The maximum voltage a device can withstand without damage at
rated current
3. Holding Current: Safe current through the device.
4. Trip Current: The current at which the interrupts the current
5. Time to Trip: The time it takes for the device to trip at a given temperature and
current
6. Tripped State: Transition from low resistance state to high resistance state due to an
overload
7. Leakage Current: A small value of stray current flowing through the device after it
has switched to high resistance mode.
8. Trip Cycle: The number of trip cycles the device sustains without failure.
9. Trip Endurance: The duration of time the device sustains its maximum rated voltage
in the tripped state without failure.
10. Power Dissipation: Power dissipated by the device in the tripped state.
11. Thermal Duration: Influence of ambient temperature.
12. Hysteresis: The period between the actual beginning of the signaling of the device to
trip and the actual tripping of the device.
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DESIGN CONSIDERATIONS FOR PPTC DEVICES.
Some of the critical parameters to consider when designing PPTC devices into
a circuit include device hold current and trip current, the effect of ambient conditions on
device performance; device reset time, leakage current in the tripped state and the automatic
or manual reset conditions.
1. Hold and Trip Current: The Fig.2 below illustrates the hold and trip current
behavior of the PPTC devices as a function of temperature.
igure 2
Region A shows the combination of current and temperature at which the PPTC
device will trip and protect the circuit. Region B shows the combination of current and
temperature at which the device will allow normal operation of the circuit. In Region C it is
possible for the device to either trip or o remain in low resistance state depending on the
individual device resistance and its environment.
Because PPTC devices can be thermally activated, any change in the
temperature around the device could affect the performance of the device. As temperature
around a PPTC device increases, less energy is required to trip the device and thus its hold
current (I hold) decreases. The heat transfer environment can accurately define hold current.
It can be affected by the design choices such as:
1. Placing the device in proximity to a heat generating source such as a power field
effect transistor (FET), a resistor or a transformer resulting in reduced hold current,
power dissipation and time to trip.
2. Increasing the size of the traces or leads that are in electrical contact with the
device resulting in increased heat transfer and greater hold current, slower time to
trip and greater power dissipation
3. Attaching the device to a long pair of wires before connecting to the circuit board,
increasing the lead length of the device which results in reduced heat transfer and
lowered hold current, power dissipation and time to trip.
The heat transfer environment of the device can significantly affect the device
performance. In general, by increasing the heat transfer of the device, there is a
corresponding increase in power dissipation, time to trip and hold current. The opposite
occurs if the heat transfer from the device is decreased. Furthermore, changing the thermal
mass around the device changes the time to trip of the device.
If the heat generated is greater than the heat lost to the environment, the device
will increase in temperature resulting in a trip event. The rate of temperature rise and the
total energy required to make a device trip depends on the fault current and heat transfer
environment. Under normal operating conditions the heat generated by the device and the
heat lost to the environment are in balance.
3. Time to Trip
The time to trip of a PPTC device is defined as the time needed from the onset of a
fault current to trip the device. Time to trip depends upon the size of the fault current and the
ambient temperature.
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DESIGN CRITERIA
To select the best device for a specific application, circuit designers should
consider the following design criteria:
1. Choose the appropriate form factor. Select from radial- leaded, surface-mount, or
chip parts. For mounting on circuit boards, a radial-leaded or
This surface mount polyfuse family of polymer of polymer based resettable fuses
provides reliable over current protection for a wide range of products such as computer
motherboards, USB hubs and ports, CD/DVD drives , digital cameras and battery packs.
Each of these polyfuse series features low voltage drops and fast trip times while offering
full resettability. This makes each an ideal choice for protection in datacom and battery
powered applications where momentary surges may occur during interchange of batteries or
plug and play operations.
The SMD0805 with the industry’s smallest footprint, measuring only 2.2mm by
1.5mm, features four hold current ratings from 100mA to 500mA with a current interruption
capability of 40A at rated voltage. Both the SMD1206 and SMD1210 series are optimized
for protection of computer peripherals,PC cards and various port types.
Due to the automatic resetting of the polyfuse, these components are ideal for
applications, where temporary fault conditions (eg: during hot plugging) can occur. The
radial-leaded RLD-USB-series 709 is specifically designed for universal serial bus (USB)
applications with lower resistance, faster trip times and lower voltage drops.
Battery Strap Resettable Fuses
This type profile strap type polyfuse family of resettable fuses provides thermal and
over charge protection for rechargeable battery packs commonly used in portable electronics
such as mobile phones, notebook computers and camcorders.
Both Li-Ion and NiMH pack designs are enhanced with 0.8mm high form factor on
the VTD-719 series. The LTD-717 series is optimized for prismatic packs and exhibits faster
trip times- down to 2.9 sec at five times the fuse’s hold current rating.
The equipment powered by a transformer get over heated due to excessive current
or short circuit. A polyfuse on the secondary side of the transformer will protect the
equipment against overload.
Batteries are constantly charged and discharged over their life cycle. Over charge
results in an increase in the temperature of the electrolyte. This could cause either a fire or an
explosion. Polyfuse can play a vital role in the charging and discharging cycles of batteries.
Applications for Resettable Circuit Protection in Automotive Electronics
The conventional solution groups similar circuits together and protects them all
with a single fuse. The fuse must be sized to carry the sum of the currents drawn by each of
the protected loads; and, to limit risk of damage and fire, the wires feeding from the fuse to
each load must be chosen according to the fuse size selected. This design practice often
results in oversized wires with high current-carrying capability feeding loads that require
relatively low currents. Using heavy-gauge wire also requires use of larger terminals and
connectors, which further increases cost, size, and weight. It also increases harness weight,
and the weight of the automobile, which has an effect on fuel efficiency.
Because PPTC devices reset when a fault condition clears and power is removed
from the circuit, they do not generally require routine replacement or service. Therefore,
such devices can be placed inside doors, in switch assemblies, behind instrument panels, in
electronic modules, and in other inaccessible areas within the vehicle. As shown in Figure 3,
the option of locating circuit-protection devices strategically throughout the vehicle also
allows power to be routed via the most direct and efficient route (rather than through a
central fuse box), which reduces the number of wires in the harness and allows reduction in
their length and weight.
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Figure 3. PPTC devices can be used in distributed electronic system architectures to
help reduce wire size.
Electronic Control Module Protection. As more and more circuitry is packed into
smaller and smaller packages, the width of the copper traces on printed circuit boards
(PCBs) is reduced. Because motorized accessories are generally powered from high-
amperage circuits, these narrow circuit board traces are susceptible to damage from
excessive currents. Printed circuit traces function as wires carrying signals from one point to
another. Depending on the cross-sectional area, the traces can carry only a certain amount of
2
current before the heat generated by I R losses causes them to either melt or become hot
enough to delaminate, resulting in damage to the PCB and mounted components.
Electronic module outputs typically require protection from over current situations
caused by a short circuit or by the high stall current of motors. Module outputs can also be
damaged by failure of some other portion of the system, such as a diode short or loss of a
power ground. Because they are one-use devices and must be replaced in the event of a
transient fault, fuses are not considered an acceptable solution to these potential problems.
Multicomponent circuits used to sense and switch, called smart FETs, are frequently used to
address these situations, but such devices require careful design and consume valuable board
space. They can also be quite costly.
Because the actuator's winding is made with very-small-gauge wire, the high stall
current causes a rapid rise in temperature. Often within seconds, the temperature may rise
sufficiently to permanently damage the enamel varnish used to insulate the wire in the
actuator's winding. With the loss of insulating properties, turn-to-turn short circuits may
develop throughout the winding, rendering the actuator inoperable and creating a potential
for a thermal event (see Figure 4).
Figure 4: To interrupt excessive current, PPTC devices are wired in series with the
actuator windings.
When the current or temperature of a winding rises above a certain value, the PPTC
device latches into a high-resistance state, limiting current to a low level and preventing
damage to the actuator. After the fault and power are removed and the PPTC device cools,
the device resets for normal current flow.
CONCLUSION
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REFERENCES
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