TPS65161

www.ti.com SLVS617 – APRIL 2006

BIAS POWER SUPPLY FOR TV AND MONITOR TFT LCD PANELS

FEATURES • Gate Drive Signal to Drive External MOSFET
• 8-V to 14-V Input Voltage Range • Internal and Adjustable Soft Start
• VS Output Voltage Range up to 19 V • Short-Circuit Protection
• 1% Accurate Boost Converter With 2.8-A • Overvoltage Protection
Switch Current • Thermal Shutdown
• 1.5% accurate 2.3-A Step-Down Converter • Available in TSSOP-28 Package
• 500-kHz/750-kHz Fixed Switching Frequency
• Negative Charge Pump Driver for VGL APPLICATIONS
• Positive Charge Pump Driver for VGH • TFT LCD Displays for Monitor and LCD TV
• Adjustable Sequencing for VGL, VGH

DESCRIPTION
The TPS65161 offers a compact power supply solution to provide all four voltages required by thin-film transistor
(TFT) LCD panel. With its high current capabilities, the device is ideal for large screen monitor panels and LCD
TV applications.

TYPICAL APPLICATION

L1 D1 Vs
10 μH SL22 18 V/1.3 A
Vin
12 V
C1
2 * 22 μF C4 R1
C3 TPS65161 C2
4 22 pF 825 kΩ
1 μF 8 3 * 22 μF
SUP SW
12 5
FREQ SW
20 1 C15 R2
VINB FB 56 kΩ
21 3 470 nF
VINB OS
22 23 D4
C16 AVIN GND
1 μF 16 27
EN1 GD GD D5
VGL C6 9 10 C5 0.47 μF VGH
−5 V/50 mA D2 0.47 μF EN2 DRP 32 V/50 mA
11 14
DRN FBP
13 17 R5
FBN Boot C13
D3 24 18 560 kΩ 0.47 μF
R3 REF SWB
C7 6 19
0.47 μF 620 kΩ PGND NC
7 15
PGND FBB
28 2 R6
SS COMP Cb 22 kΩ
R4 25 26
DLY1 DLY2 100 nF
150 kΩ
L2 Vlogic
C17 3.3 V/2.3 A
C9 C10 C11 22 nF 15 μH
C8 10 nF
220 nF 22 nF 10 nF

D6 R7 C14 C12
SL22 2 kΩ 10 nF 2 * 22 μF

R8
1.2 kΩ

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Copyright © 2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPS65161
www.ti.com
SLVS617 – APRIL 2006

DESCRIPTION (CONTINUED)
Compared to the TPS65160 and TPS65160A the device offers a higher output current for the step down
converter and allows to connect the positive charge pump supply (SUP) always to the output. Therefore in most
applications a simple charge pump doubler can generates VGH reducing external component count. The device
can be powered directly from a 12-V input voltage generating the bias voltages VGH and VGL, as well as the
source voltage VS and logic voltage for the LCD panels. The device consists of a boost converter to provide the
source voltage VS and a step-down converter to provide the logic voltage for the system. A positive and a
negative charge-pump driver provide adjustable regulated output voltages VGL and VGH to bias the TFT. Both
boost and step-down converters, as well as the charge-pump driver, operate with a fixed switching frequency of
500 kHz or 750 kHz, selectable by the FREQ pin. The TPS65161 includes adjustable power-on sequencing. The
device includes safety features like overvoltage protection of the boost converter and short-circuit protection of
the buck converter, as well as thermal shutdown. Additionally, the device incorporates a gate drive signal to
control an isolation MOSFET switch in series with VS or VGH. See the application circuits at the end of this data
sheet.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.

(1)
ORDERING INFORMATION
TA UVLO OVERVOLTAGE ORDERING PACKAGE (2) PACKAGE
(typ) PROTECTION MARKING
Vs (typ)
–40°C to 85°C 6V 20 V TPS65161PWP TSSOP28 (PWP) TPS65161

(1)For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web
site at www.ti.com.
(2) The PWP package is available taped and reeled. Add R-suffix to the device type (TPS65161PWPR) to order the device taped and
reeled. The TPS65161PWPR package has quantities of 2000 devices per reel. Without suffix, the TPS65161PWP is shipped in tubes
with 50 devices per tube.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted) (3)
UNIT
Voltages on pin VIN (4) –0.3 V to 16.5 V
Voltages on pin EN1, EN2, FREQ (2) –0.3 V to 15 V
Voltage on pin SW (2) 25 V
Voltage on pin SWB (2) 20 V
Voltages on pin OS, SUP, GD (2) 25 V
Continuous power dissipation See Dissipation Rating Table
TA Operating junction temperature –40°C to 150°C
Tstg Storage temperature range –65°C to 150°C
Temperature (soldering, 10 s) 260°C

(3) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(4) All voltage values are with respect to network ground terminal.

DISSIPATION RATINGS
TA ≤ 25°C TA = 70°C TA = 85°C
PACKAGE RTHJA
POWER RATING POWER RATING POWER RATING
28-Pin TSSOP 28°C/W (PowerPAD (5) soldered) 3.57 W 1.96 W 1.42 W

(5) See Texas Instruments application report SLMA002 regarding thermal characteristics of the PowerPAD package.

2 Submit Documentation Feedback

 TPS65161
www.ti.com
SLVS617 – APRIL 2006

RECOMMENDED OPERATING CONDITIONS

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VS Output voltage range of the main boost converter (6) 19 V
Input capacitor at VINB 2x22 µF
CIN
Input capacitor AVIN 1 µF
Inductor boost converter (7) 10
L µH
Inductor buck converter (2) 15
VLOGIC Output voltage range of the step-down converter VLOGIC 1.8 5.0 V
Output capacitor boost converter 3x22
CO µF
Output capacitor buck converter 2x22
TA Operating ambient temperature –40 85 °C
TJ Operating junction temperature –40 125 °C

(6) The maximum output voltage is limited by the overvoltage protection threshold and not be the maximum switch voltage rating.
(7) See application section for further information.

ELECTRICAL CHARACTERISTICS
VIN = 12 V, SUP = VIN, EN1 = EN2 = VIN, VS = 15 V, VLOGIC = 3.3 V, TA = –40°C to 85°C, typical values are at TA = 25°C
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
VIN Input voltage range 8 14 V
VGH = 2 x VS, 0.2 2
Quiescent current into AVIN Boost converter not
switching
IQIN mA
VGH = 2 x VS, 0.2 0.5
Quiescent current into VINB Buck converter not
switching
Shutdown current into AVIN EN1 = EN2 = GND 0.1 2
ISD µA
Shutdown current into VINB EN1 = EN2 = GND 0.1 2
Shutdown current into SUP EN1 = EN2 = GND 0.1 4 µA
ISUP
Quiescent current into SUP VGH = 2 x VS 0.2 2 mA
VUVLO Undervoltage lockout threshold VIN falling 6 6.4 V
VREF Reference voltage 1.203 1.213 1.223 V
Thermal shutdown Temperature rising 155 °C
Thermal shutdown hysteresis 5 °C
LOGIC SIGNALS EN1, EN2, FREQ
VIH High-level input voltage EN1, EN2 2.0 V
VIL Low-level input voltage EN1, EN2 0.8 V
VIH High-level input voltage FREQ 1.7 V
VIL Low-level input voltage FREQ 0.4 V
EN1 = EN2 = FREQ = 0.01 0.1 µA
II Input leakage current
GND or VIN
CONTROL AND SOFT START DLY1, DLY2, SS
IDLY1 Delay1 charge current 3.3 4.8 6.2 µA
IDLY2 Delay2 charge current VTHRESHOLD = 1.213 V 3.3 4.8 6.2 µA
ISS SS charge current 6 9 12 µA
INTERNAL OSCILLATOR
FREQ = high 600 750 900
fOSC Oscillator frequency kHz
FREQ = low 400 500 600

Submit Documentation Feedback 3

TPS65161
www.ti.com
SLVS617 – APRIL 2006

ELECTRICAL CHARACTERISTICS (continued)

VIN = 12 V, SUP = VIN, EN1 = EN2 = VIN, VS = 15 V, VLOGIC = 3.3 V, TA = –40°C to 85°C, typical values are at TA = 25°C
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
BOOST CONVERTER (VS)
VS Output voltage range (8) 19 V
VFB Feedback regulation voltage 1.136 1.146 1.156 V
IFB Feedback input bias current 10 100 nA
N-MOSFET on-resistance (Q1) ISW = 500 mA 100 185 mΩ
rDS(ON)
P-MOSFET on-resistance (Q2) ISW = 200 mA 10 16 Ω
IMAX Maximum P-MOSFET peak switch current 1 A
ILIM N-MOSFET switch current limit (Q1) 2.8 3.5 4.2 A
Ileak Switch leakage current VSW = 15 V 1 10 µA
Vovp Overvoltage protection VOUT rising 19.5 20 21 V
10.6 V ≤ Vin ≤ 11.6 V 0.0008 %/V
Line regulation
at 1 mA
Load regulation 0.03 %/A
GATE DRIVE (GD)
VGD Gate drive threshold (9) VFB rising Vs-12% Vs-8% Vs-4% V
VOL GD output low voltage I(sink) = 500 µA 0.3 V
GD output leakage current VGD = 20 V 0.05 1 µA
STEP-DOWN CONVERTER (VLOGIC)
VLOGIC Output voltage range 1.8 5 V
VFBB Feedback regulation voltage 1.195 1.213 1.231 V
IFBB Feedback input bias current 10 100 nA
rDS(ON) N-MOSFET on-resistance (Q1) ISW = 500 mA 175 300 mΩ
ILIM N-MOSFET switch current limit (Q1) 2.5 3.2 3.9 A
Ileak Switch leakage current VSW = 0 V 1 10 µA
10.6 V ≤ VIN≤ 11.6 V 0.0018 %/V
Line regulation
at 1 mA
Load regulation 0.037 %/A

(8) The maximum output voltage is limited by the overvoltage protection threshold and not be the maximum switch voltage rating.
(9) The GD signal is latched low when the main boost converter output VS is within regulation. The GD signal is reset when the input
voltage or enable of the boost converter is cycled low.

4 Submit Documentation Feedback

 TPS65161
www.ti.com
SLVS617 – APRIL 2006

ELECTRICAL CHARACTERISTICS (continued)

VIN = 12 V, SUP = VIN, EN1 = EN2 = VIN, VS = 15 V, VLOGIC = 3.3 V, TA = –40°C to 85°C, typical values are at TA = 25°C
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
NEGATIVE CHARGE-PUMP VGL
VGL Output voltage range –2 V
VFBN Feedback regulation voltage –36 0 36 mV
IFBN Feedback input bias current 10 100 nA
rDS(ON) Q4 P-Channel switch rDS(ON) IOUT = 20 mA 4.4 Ω
IDRN = 50 mA, 130 190
VFBN = VFBNnominal –5%
VDropN Current sink voltage drop (10) mV
IDRN = 100 mA, 270 420
VFBN = VFBNnominal –5%
POSITIVE CHARGE-PUMP OUTPUT VGH
VFBP Feedback regulation voltage 1.187 1.213 1.238 V
IFBP Feedback input bias current 10 100 nA
rDS(ON) Q3 N-Channel switch rDS(ON) IOUT = 20 mA 1.1 Ω
IDRP = 50 mA, 400 680
Current source voltage drop VFBP = VFBPnominal –5%
VDropP mV
(Vsup – VDRP) (3) IDRP = 100 mA, 850 1600
VFBP = VFBPnominal –5%

(10) The maximum charge-pump output current is typically half the drive current of the internal current source or current sink.

FB 1 28 SS

COMP 2 27 GD

OS 3 26 DLY2

SW 4 25 DLY1
Thermal PAD (see Note)

SW 5 24 REF

PGND 6 23 GND

PGND 7 22 AVIN

SUP 8 21 VINB

EN2 9 20 VINB

DRP 10 19 NC

DRN 11 18 SWB

FREQ 12 17 BOOT

FBN 13 16 EN1

FBP 14 15 FBB

NOTE: The thermally enhanced PowerPAD™ is connected to PGND.

Submit Documentation Feedback 5

TPS65161
www.ti.com
SLVS617 – APRIL 2006

TERMINAL FUNCTIONS
TERMINAL
I/O DESCRIPTION
NAME NO.
This is the supply pin of the positive charge pump driver and can be connected to the input supply Vin or the
SUP 8 I output of the main boost converter Vs. This depends mainly on the desired output voltage VGH and numbers of
charge pump stages.
Frequency adjust pin. This pin allows setting the switching frequency with a logic level to 500 kHz = low and
FREQ 12 I
750 kHz = high.
Analog input voltage of the device. This is the input for the analog circuits of the device and should be bypassed
AVIN 22 I
with a 1-µF ceramic capacitor for good filtering.
VINB 20, 21 I Power input voltage pin for the buck converter.
This is the enable pin of the buck converter and negative charge pump. When this pin is pulled high, the buck
EN1 16 I converter starts up, and after a delay time set by DLY1, the negative charge pump comes up. This pin must be
terminated and not be left floating. A logic high enables the device and a logic low shuts down the device.
The boost converter starts only with EN1 = high, after the step-down converter is enabled. EN2 is the enable pin
of the boost converter and positive charge pump. When this pin is pulled high, the boost converter and positive
EN2 9 I charge pump starts up after the buck converter is within regulation and a delay time set by DLY2 has passed by.
This pin must be terminated and not be left floating. A logic high enables the device and a logic low shuts down
the device.
DRN 11 O Drive pin of the negative charge pump.
FBN 13 I Feedback pin of negative charge pump.
REF 24 O Internal reference output typically 1.213 V
PGND 6, 7 Power ground
This pin allows setting the soft-start time for the main boost converter VS. Typically a 22-nF capacitor needs to be
SS 28 O
connected to this pin to set the soft-start time.
Connecting a capacitor from this pin to GND allows the setting of the delay time between VLOGIC (step-down
DLY1 25 O
converter output high) to VGL during start-up.
Connecting a capacitor from this pin to GND allows the setting of the delay time between VLOGIC (step-down
DLY2 26 O
converter output high) to VS Boost converter and positive charge-pump VGH during start-up.
This is the compensation pin for the main boost converter. A small capacitor and, if required, a resistor is
COMP 2
connected to this pin.
FBB 15 I Feedback pin of the buck converter
SWB 18 O Switch pin of the buck converter
NC 19 Not connected
N-channel MOSFET gate drive voltage for the buck converter. Connect a capacitor from the switch node SWB to
BOOT 17 I
this pin.
FBP 14 I Feedback pin of positive charge pump.
DRP 10 O Drive pin of the positive charge pump.
This is the gate drive pin which can be used to control an external MOSFET switch to provide input to output
isolation of VS or VGH. See the circuit diagrams at the end of this data sheet. GD is an open-drain output and is
GD 27
latched low as soon as the boost converter is within 8% of its nominal regulated output voltage. GD goes high
impedance when the EN2 input voltage is cycled low.
GND 23 Analog ground
Output sense pin. The OS pin is connected to the internal rectifier switch and overvoltage protection comparator.
This pin needs to be connected to the output of the boost converter and cannot be connected to any other voltage
OS 3 I
rail. Connect a 470-nF capacitor from OS pin to GND to avoid noise coupling into this pin. The PCB trace of the
OS pin needs to be wide because it conducts high current.
FB 1 I Feedback of the main boost converter generating Vsource (VS).
SW 4, 5 I Switch pin of the boost converter generating Vsource (VS).
PowerPAD The PowerPAD needs to be connected and soldered to power ground (PGND).

6 Submit Documentation Feedback

 TPS65161
www.ti.com
SLVS617 – APRIL 2006

TYPICAL CHARACTERISTICS

TABLE OF GRAPHS
FIGURE
MAIN BOOST CONVERTER (Vs)
η Efficiency main boost converter Vs vs Load current VS =15 V,VIN = 12 V 1
rDS(ON) N-channel main switch Q1 vs Input voltage and temperature 2
Soft-start boost converter CSS = 22 nF 3
PWM operation at full-load current 4
PWM operation at light-load current 5
Load transient response 6
STEP-DOWN CONVERTER (Vlogic)
η Efficiency main boost converter VS vs Load current VLOGIC = 3.3 V,VIN = 12 V 7
rDS(ON) N-channel main switch Q1 8
PWM operation - continuous mode 9
PWM operation - discontinuous mode 10
Soft start 11
Load transient response 12
SYSTEM PERFORMANCE
fosc Oscillation frequency vs Input voltage and temperature 13
Power-up sequencing EN2 connected to VIN 14
Power-up sequencing EN2 enabled separately 15

BOOST CONVERTER EFFICIENCY BOOST CONVERTER

vs rDS(ON) - N-CHANNEL SWITCH
OUTPUT CURRENT vs
TEMPERATURE
100 0.16
VI = 8 V,
90 VI = 12 V,
0.14
VI = 14 V
80
rDS(on) − N-Channel Switch − Ω

0.12
70
0.1
Efficiency − %

60

50 0.08

40
0.06
30
VI = 12 V, 0.04
20 VO = 15 V,
L = 10 H
0.02
10

0 0
0 0.5 1 1.5 2 −40 −20 0 20 40 60 80 100 120 140
IO − Output Current − A TA − Temperature −
C

Figure 1. Figure 2.

Submit Documentation Feedback 7

TPS65161
www.ti.com
SLVS617 – APRIL 2006

SOFT-START PWM OPERATION BOOST CONVERTER

BOOST CONVERTER CONTINUOUS MODE

VI = 12 V, VI = 12 V,
VO = 15 V/ 1.2 A, VO = 15 V/1.5 A
C(SS) = 22 nF

VSW
10 V/div

VO
50 mV/div
VS
5 V/div

II I(Inductor)
1 A/div 1 A/div

2 ms/div 1
s/div

Figure 3. Figure 4.

PWM OPERATION BOOST CONVERTER LOAD TRANSIENT RESPONSE BOOST CONVERTER

CONTINUOUS MODE: LIGHT LOAD

VI = 12 V , VI = 12 V, VS = 15 V,
CO = 3*22
F,
VO = 10 V/10 mA C(comp) = 22 nF,
L = 6.8
H,
FREQ= High

VSW VS
10 V/div 200 mV/div
VO
50 mV/div

IL I(Inductor)
500 mA/div 1 A/div

1 µs/div 100
s/div

Figure 5. Figure 6.

8 Submit Documentation Feedback

 TPS65161
www.ti.com
SLVS617 – APRIL 2006

EFFICIENCY STEP-DOWN CONVERTER STEP-DOWN CONVERTER

vs rDS(ON) - N-CHANNEL SWITCH
LOAD CURRENT vs
TEMPERATURE
90 0.25
VI = 8 V,
80 VI = 12 V,
VI = 14 V
0.2

DS(on) − N-Channel Switch − Ω

70

60
Efficiency − %

0.15
50

40
0.1
30

20
VI = 12 V, 0.05

r
10 VO = 3.3 V,
L = 15
H
0 0
0 0.5 1 1.5 2 −40 −20 0 20 40 60 80 100 120 140
IO − Output Current − A TA − Temperature −
C

Figure 7. Figure 8.

STEP-DOWN CONVERTER STEP-DOWN CONVERTER

PWM OPERATION PWM OPERATION
CONTINUOUS MODE DISCONTINUOUS MODE

VI = 12 V,
VO = 3.3 V/45 mA

VSW
VSW
5 V/div
5 V/div
VO
VO 20 mV/div
20 mV/div

I(Inductor)
I(Inductor) VI = 12 V, 100 mA/div
1 A/div VO = 3.3 V/1.5 A

500 ns/div
500 ns/div
Figure 9. Figure 10.

Submit Documentation Feedback 9

TPS65161
www.ti.com
SLVS617 – APRIL 2006

SOFT-START LOAD TRANSIENT RESPONSE

STEP-DOWN CONVERTER STEP-DOWN CONVERTER

VI = 12 V,
VO = 3.3 V/1.2 A

VO1
100 mV/div

VI = 12 V, V(logic) = 3.3 V,
CO = 2*22
F, FREQ = High

VO
1 V/div

IO
I(Inductor) 270 mA to 1.3 A
1 A/div

50
s/div
200
s/div

Figure 11. Figure 12.

SWITCHING FREQUENCY POWER-UP SEQUENCING

vs EN2 CONNECTED TO VIN
TEMPERATURE
740
VI = 8 V,
735 VI = 12 V,
VI = 14 V
730 V Logic
Switching Frequency − kHz

2 V/div
725 VGL
5 V/div
720

715

710
VS
705 5 V/div
VGH
700
10 V/div

695
−50 0 50 100 150
TA − Temperature −
C 2 ms/div

Figure 13. Figure 14.

10 Submit Documentation Feedback

 TPS65161
www.ti.com
SLVS617 – APRIL 2006

POWER-UP SEQUENCING
EN2 ENABLED SEPARATELY

V Logic
2 V/div

VS
5 V/div

VGH
5 V/div
EN2
2 V/div

1 ms/div
Figure 15.

Submit Documentation Feedback 11

TPS65161
www.ti.com
SLVS617 – APRIL 2006

BLOCK DIAGRAM
AVIN FREQ SW SW

SS Q2
Bias

D
S
GND 500 kHz/ OS
Vref=1.213 V Clock Current Limit
750 kHz
Thermal DLY1 and
Oscillator
AVIN Shutdown Soft Start
DLY2 OS
Sequencing
Overvoltage
Comparator
IDLY

Vref SS

Control Logic Vref

SS AVIN
D PGND
Q1
COMP S

GM Amplifier
PGND
Sawtooth Comparator
FB Generator
Positive SUP SUP
VFB OS Charge Pump
1.154 V

I DRVP
GM Amplifier
Low Gain
Current
Control DRVP
VFB Vref
Soft Start
1.154 1.2 13 V Q3

VINB
AVIN Negative
Charge Pump FBP
VINB Step-Down
Current
Converter
Control
Regulator
DRVN
N Soft Start BOOT
8V
I DRVN

Q3
D
S

SWB

NC
Control Logic
FBN Current Limit

Ref

Error Amplifier FBB

IDLY

Vref

DLY1 Vref
DLY1 Compensation
Clock/2 and
Soft Start Sawtooth
IDLY

0.9 V
Vref Generator
Logic
DLY2 Clock/4 Clock
DLY2
0.6 V
Reference
Output
GD Clock
D Vref
VREF
S Clock Select During Short Circuit 1.2 13 V
and Soft Start

EN1 EN2

12 Submit Documentation Feedback

 TPS65161
www.ti.com
SLVS617 – APRIL 2006

DETAILED DESCRIPTION

Boost Converter
The main boost converter operates in pulse-width modulation (PWM) and at a fixed switching frequency of
500 kHz or 750 kHz set by the FREQ pin. The converter uses an unique fast response, voltage-mode controller
scheme with input voltage feedforward. This achieves excellent line and load regulation (0.03%-A load
regulation typical) and allows the use of small external components. To add higher flexibility to the selection of
external component values, the device uses external loop compensation. Although the boost converter looks like
a nonsynchronous boost converter topology operating in discontinuous conduction mode at light load, the
TPS65161 maintains continuous conduction even at light-load currents. This is achieved with a novel
architecture using an external Schottky diode with an integrated MOSFET in parallel connected between SW
and OS. See the Functional Block Diagram. The intention of this MOSFET is to allow the current to go negative
that occurs at light-load conditions. For this purpose, a small integrated P-Channel MOSFET with typically 10-Ω
rds(on) is sufficient. When the inductor current is positive, the external Schottky diode with the lower forward
voltage conducts the current. This causes the converter to operate with a fixed frequency in continuous
conduction mode over the entire load current range. This avoids the ringing on the switch pin as seen with
standard nonsynchronous boost converter and allows a simpler compensation for the boost converter.

Soft Start (Boost Converter)

The main boost converter has an adjustable soft start to prevent high inrush current during start-up. The
soft-start time is set by the external capacitor connected to the SS pin. The capacitor connected to the SS pin is
charged with a constant current that increases the voltage on the SS pin. The internal current limit is
proportional to the voltage on the soft-start pin. When the threshold voltage of the internal soft-start comparator
is reached, the full current limit is released. The larger the soft-start capacitor value, the longer the soft-start
time.

Overvoltage Protection of the Boost Converter

The main boost converter has an overvoltage protection to protect the main switch Q2 at pin (SW) in case the
feedback (FB) pin is floating or shorted to GND. In such an event, the output voltage rises and is monitored with
the overvoltage protection comparator over the OS pin. See the functional block diagram. As soon as the
comparator trips at typically 23 V, TPS65161, the boost converter turns the N-Channel MOSFET switch off. The
output voltage falls below the overvoltage threshold and the converter continues to operate.

Frequency Select Pin (FREQ)

The frequency select pin (FREQ) allows setting the switching frequency of the entire device to 500 kHz (FREQ =
low) or 750 kHz (FREQ = high). A lower switching frequency gives a higher efficiency with a slightly reduced
load transient regulation.

Thermal Shutdown
A thermal shutdown is implemented to prevent damage caused by excessive heat and power dissipation.
Typically, the thermal shutdown threshold is 155°C.

Step-Down Converter
The nonsynchronous step-down converter operates at a fixed switching frequency using a fast response voltage
mode topology with input voltage feedforward. This topology allows simple internal compensation, and it is
designed to operate with ceramic output capacitors. The converter drives an internal 3.2-A N-channel MOSFET
switch. The MOSFET driver is referenced to the switch pin SWB. The N-channel MOSFET requires a gate drive
voltage higher than the switch pin to turn the N-Channel MOSFET on. This is accomplished by a bootstrap gate
drive circuit running of the step-down converter switch pin. When the switch pin SWB is at ground, the bootstrap
capacitor is charged to 8 V. This way, the N-channel gate drive voltage is typically around 8 V.

Submit Documentation Feedback 13

TPS65161
www.ti.com
SLVS617 – APRIL 2006

DETAILED DESCRIPTION (continued)

Soft Start (Step-Down Converter)
To avoid high inrush current during start-up, an internal soft start is implemented in the TPS65161. When the
step-down converter is enabled over EN1, its reference voltage slowly rises from zero to its power-good
threshold of typically 90% of Vref. When the reference voltage reaches this power-good threshold, the error
amplifier is released to its normal operation at its normal duty cycle. To further limit the inrush current during soft
start, the converter frequency is set to 1/4th of the switching frequency fs and then ½ of fs determined by the
comparator that monitors the feedback voltage. See the internal block diagram. Soft start is typically completed
within 1 ms.

Short-Circuit Protection (Step-Down Converter)

To limit the short-circuit current, the device has a cycle-by-cycle current limit. To avoid the short-circuit current
rising above the internal current limit when the output is shorted to GND, the switching frequency is reduced as
well. This is implemented by two comparators monitoring the feedback voltage. The step-down converter
switching frequency is reduced to ½ of fs when the feedback is below 0.9 V and to 1/4th of the switching
frequency when the feedback voltage is below 0.6 V.

Positive Charge Pump

The positive charge pump provides a regulated output voltage set by the external resistor divider. Figure 16
shows an extract of the positive charge-pump driver circuit. The operation of the charge-pump driver can be
understood best with Figure 16. During the first cycle, Q3 is turned on and the flying capacitor Cfly charges to
the source voltage, Vs. During the next clock cycle, Q3 is turned off and the current source charges the drive
pin, DRP, up to the supply voltage, VSUP. Because the flying capacitor voltage sits on top of the drive pin
voltage, the maximum output voltage is Vsup+Vs. The SUP pin can be connected either to the input voltage Vin
of the TPS65161 or the output voltage of the main boost converter Vs.
SUP = Vin or Vs

Vs
I DRVP

DRP
Current Cfly
VG
VGH
Control
23 V/50 mA
Soft Start
Q3 C13
R5
0.47 µF
FBP

R6

Figure 16. Extract of the Positive Charge-Pump Driver

If higher output voltages are required, another charge-pump stage can be added to the output.
Setting the output voltage:

14 Submit Documentation Feedback

 TPS65161
www.ti.com
SLVS617 – APRIL 2006

DETAILED DESCRIPTION (continued)

V out  1.213
1  R5
R6
 
R5  R6

Vout
V
FB

1  R6

V out
1.213
1 
Negative Charge Pump
The negative charge pump provides a regulated output voltage set by the external resistor divider. The negative
charge pump operates similar to the positive charge pump with the difference that it runs from the input voltage
VIN. The negative charge pump driver inverts the input voltage. The maximum negative output voltage is VGL =
(–VIN)+Vdrop. Vdrop is the voltage drop across the external diodes and internal charge-pump MOSFETs. In
case VGL needs to be lower than –VIN, an additional charge-pump stage needs to be added.
Setting the output voltage:
V out  V
R3   1.213 V
R3
REF R4 R4
|Vout| |Vout|
R3  R4
 R4

V 1.213
REF
The lower feedback resistor value, R4, should be in a range between 40 kΩ to 120 kΩ or the overall feedback
resistance should be within 500 kΩ to 1 MΩ. Smaller values load the reference too heavily, and larger values
may cause stability problems. The negative charge pump requires two external Schottky diodes. The peak
current rating of the Schottky diode has to be twice the load current of the output. For a 20-mA output current,
the dual-Schottky diode BAV99 is a good choice.

Power-On Sequencing (EN1, EN2, DLY1, DLY2)

The TPS65161 has an adjustable power-on sequencing set by the capacitors connected to DLY1 and DLY2 and
controlled by EN1 and EN2. Pulling EN1 high enables the step-down converter and then the negative
charge-pump driver. DLY1 sets the delay time between the step-down converter and negative charge-pump
driver. EN2 enables the boost converter and positive charge-pump driver at the same time. DLY2 sets the delay
time between the step-down converter Vlogic and the boost converter Vs. This is especially useful to adjust the
delay when EN2 is always connected to Vin. If EN2 goes high after the step-down converter is already enabled,
then the delay DLY2 starts when EN2 goes high. See Figure 17 and Figure 18.

EN2

EN1
DLY2

VGH
Vs
V s, VGH Vin Vin
VLogic
Fall Time Depends on Load
Current and Feedback Resistor

VGL
DLY1

GD

Figure 17. Power-On Sequencing With EN2 Always High (EN2=Vin)

Submit Documentation Feedback 15

TPS65161
www.ti.com
SLVS617 – APRIL 2006

DETAILED DESCRIPTION (continued)

EN2

EN1
DLY2
VGH
Vs
Vin Vin
VGH ,Vs

VLogic Fall Time Depends on Load

Current and Feedback Resistor

DLY1 VGL

GD

Figure 18. Power-On Sequencing Using EN1 and EN2

Setting the Delay Times DLY1, DLY2

Connecting an external capacitor to the DLY1 and DLY2 pins sets the delay time. If no delay time is required,
these pins can be left open. To set the delay time, the external capacitor connected to DLY1 and DLY2 is
charged with a constant current source of typically 4.8 µA. The delay time is terminated when the capacitor
voltage has reached the internal reference voltage of Vref = 1.213 V. The external delay capacitor is calculated:
4.8
A
td 4.8
A
td
C   with td  Desired delay time
dly Vref 1.213 V
Example for setting a delay time of 2.3 ms:
4.8
A
2.3 ms
C   9.4 nF  Cdly  10 nF
dly 1.213 V

Gate Drive Pin (GD)

This is an open-drain output that goes low when the boost converter, Vs, is within regulation. The gate drive pin
GD remains low until the input voltage or enable EN2 is cycled to ground.

Undervoltage Lockout
To avoid misoperation of the device at low input voltages, an undervoltage lockout is included which shuts down
the device at voltages lower than 6 V.

Input Capacitor Selection

For good input voltage filtering, low ESR ceramic capacitors are recommended. The TPS65161 has an analog
input, AVIN, and two input pins for the buck converter VINB. A 1-µF input capacitor should be connected directly
from the AVIN to GND. Two 22-µF ceramic capacitors are connected in parallel from the buck converter input
VINB to GND. For better input voltage filtering, the input capacitor values can be increased. See Table 1 and the
Application Information section for input capacitor recommendations.

16 Submit Documentation Feedback

 TPS65161
www.ti.com
SLVS617 – APRIL 2006

DETAILED DESCRIPTION (continued)

Table 1. Input Capacitor Selection
CAPACITOR VOLTAGE RATING COMPONENT SUPPLIER COMMENTS
22 µF/1210 16 V Taiyo Yuden EMK325BY226MM CIN (VINB)
1 µF/1206 16 V Taiyo Yuden EMK316BJ106KL CIN (AVIN)

Boost Converter Design Procedure

The first step in the design procedure is to verify whether the maximum possible output current of the boost
converter supports the specific application requirements. A simple approach is to use the converter efficiency, by
taking the efficiency numbers from the provided efficiency curves or to use a worst-case assumption for the
expected efficiency, e.g., 80%.

1. Duty Cycle: Vin

D 1
Vout

2. Maximum output current: I Vin

avg  (1  D)
lsw  Vout
2.8 A with lsw  minimum switch current of the TPS65161 (2.8 A).

3. Peak switch current: I

I  Vin
D  out
swpeak 2
ƒs
L 1  D

With
Isw = converter switch current (minimum switch current limit = 2.8 A)
fs = converter switching frequency (typical 500 kHz/750 kHz)
L = Selected inductor value
η = Estimated converter efficiency (use the number from the efficiency curves or 0.8 as an estimation)
The peak switch current is the steady-state peak switch current that the integrated switch, inductor, and external
Schottky diode must be able to handle. The calculation must be done for the minimum input voltage where the
peak switch current is highest.

Inductor Selection (Boost Converter)

The TPS65161 operates typically with a 10-µH inductor. Other possible inductor values are 6.8-µH or 22-µH.
The main parameter for the inductor selection is the saturation current of the inductor, which should be higher
than the peak switch current as previously calculated, with additional margin to cover for heavy load transients.
The alternative, more conservative approach, is to choose the inductor with saturation current at least as high as
the typical switch current limit of 3.5 A. The second important parameter is the inductor DC resistance. Usually,
the lower the DC resistance the higher the efficiency. The efficiency difference between different inductors can
vary between 2% to 10%. Possible inductors are shown in Table 2.

Table 2. Inductor Selection (Boost Converter)

INDUCTOR VALUE COMPONENT SUPPLIER DIMENSIONS in mm Isat/DCR
22 µH Coilcraft MSS1038-103NX 10,2 x 10,2 x 3,6 2.9 A/73 mΩ
22 µH Coilcraft DO3316-103 12,85 x 9,4 x 5,21 3.8 A/38 mΩ
10 µH Sumida CDRH8D43-100 8,3 x 8,3 x 4,5 4.0 A/29 mΩ
10 µH Sumida CDH74-100 7,3 x 8,0 x 5,2 2.75 A/43 mΩ
10 µH Coilcraft MSS1038-103NX 10,2 x 10,2 x 3,6 4.4 A/35 mΩ
6.8 µH Wuerth Elektronik 7447789006 7,3 x 7,3 x 3,2 2.5 A/44 mΩ

Submit Documentation Feedback 17

TPS65161
www.ti.com
SLVS617 – APRIL 2006

Output Capacitor Selection (Boost Converter)

For best output voltage filtering, a low ESR output capacitor is recommended. Ceramic capacitors have a low
ESR value and work best with the TPS65161. Usually, three 22-µF ceramic output capacitors in parallel are
sufficient for most applications. If a lower voltage drop during load transients is required, more output
capacitance can be added. See Table 3 for the selection of the output capacitor.

Table 3. Output Capacitor Selection (Boost Converter)

CAPACITOR VOLTAGE RATING COMPONENT SUPPLIER
22 µF/1812 16 V Taiyo Yuden EMK432BJ226MM

Rectifier Diode Selection (Boost Converter)

To achieve high efficiency, a Schottky diode should be used. The reverse voltage rating should be higher than
the maximum output voltage of the converter. The average rectified forward-current rating needed for the
Schottky diode is calculated as the off-time of the converter times the maximum switch current of the TPS65161:
D  1
Vout
Vin
I avg  (1  D)
lsw  Vin
2.8 A with lsw  minimum switch current of the TPS65161 (2.8 A).
Vout
Usually, a Schottky diode with 2-A maximum average rectified forward-current rating is sufficient for most
applications. Secondly, the Schottky rectifier has to be able to dissipate the power. The dissipated power is the
average rectified forward current times the diode forward voltage.
PD = Iavg x VF = Isw x (1 x D) x VF (with Isw = minimum switch current of the TPS65161 (2.6 A)

Table 4. Rectifier Diode Selection (Boost Converter)

CURRENT RATING Vr Vforward RθJA SIZE COMPONENT SUPPLIER
Iavg
3A 20 V 0.36 at 3 A 46°C/W SMC MBRS320, International Rectifier
2A 20 V 0.44 V at 3 A 75°C/W SMB SL22, Vishay Semiconductor
2A 20 V 0.5 at 2 A 75°C/W SMB SS22, Fairchild Semiconductor

Setting the Output Voltage and Selecting the Feedforward Capacitor (Boost Converter)
The output voltage is set by the external resistor divider and is calculated as:

V out  1.146 V
1  R1
R2

Across the upper resistor, a bypass capacitor is required to achieve a good load transients response and to
have a stable converter loop. Together with R1, the bypass capacitor Cff sets a zero in the control loop.
Depending on the inductor value, the zero frequency needs to be set. For a 6.8-µH or 10-µH inductor, fz = 10
kHz and for a 22-µH inductor, fz = 7 kHz.
Cƒƒ  1  1
2


ƒ z
R1 2


10 kHz
R1

A value coming closest to the calculated value should be used.

Compensation (COMP) (Boost Converter)

The regulator loop can be compensated by adjusting the external components connected to the COMP pin. The
COMP pin is the output of the internal transconductance error amplifier. A single capacitor connected to this pin
sets the low-frequency gain. Usually, a 22-nF capacitor is sufficient for most of the applications. Adding a series
resistor sets an additional zero and increases the high-frequency gain. The following formula calculates at what
frequency the resistor increases the high-frequency gain.

18 Submit Documentation Feedback

 TPS65161
www.ti.com
SLVS617 – APRIL 2006

ƒz  1
2


Cc
Rc
Lower input voltages require a higher gain and therefore a lower compensation capacitor value.

Step-Down Converter Design Procedure

Setting the Output Voltage

The step-down converter uses an external voltage divider to set the output voltage. The output voltage is
calculated as:

V out  1.213 V
1  R1
R2

with R1 as 1.2 kΩ, and internal reference voltage V(ref)typ = 1.213 V
At load current <1 mA, the device operates in discontinuous conduction mode. When the load current is reduced
to zero, the output voltage rises slightly above the nominal output voltage. At zero load current, the device skips
clock cycles but does not completely stop switching; thus, the output voltage sits slightly higher than the nominal
output voltage. Therefore, the lower feedback resistor is selected to be around 1.2 kΩ to always have around
1-mA minimum load current.

Selecting the Feedforward Capacitor

The feedforward capacitor across the upper feedback resistor divider sets a zero in the converter loop transfer
function. For a 15-µH inductor, fz = 8 kHz and when a 22-µH inductor is used, fz = 17 kHz.
(Example for the 3.3-V output)

Cz  1  1  9.9 nF  10 nF
2

8 kHz
R1 2

8 kHz
2k

Usually a capacitor value closest to the calculated value is selected.

Inductor Selection (Step-Down Converter)

The TPS65161 operates typically with a 15-µH inductor value. For high efficiencies the inductor should have a
low DC resistance to minimize conduction losses. This needs to be considered when selecting the appropriate
inductor. In order to avoid saturation of the inductor, the inductor should be rated at least for the maximum
output current of the converter, plus the inductor ripple current that is calculated as:
1  Vout
I

I  Vout
Vin I  I outmax  L
L L
ƒ Lmax 2

With:
f = Switching frequency (750 kHz, 500 kHz minimal)
L = Inductor value (typically 15 µH)
∆IL= Peak-to-peak inductor ripple current
ILmax = Maximum inductor current
The highest inductor current occurs at maximum Vin. A more conservative approach is to select the inductor
current rating just for the typical switch current of 3.2 A.

Table 5. Inductor Selection (Step-Down Converter)

INDUCTOR VALUE COMPONENT SUPPLIER DIMENSIONS in mm Isat/DCR
15 µH Wuerth 7447789115 7,3 x 7,3 x 3,2 1.75 A/100 mΩ
15 µH Sumida CDRH8D28-150 8,3 x 8,3 x 3,0 1.9 A/53 mΩ
15 µH Sumida CDRH8D38-150 8,3 x 8,3 x 4,0 2.3 A/53 mΩ
15 µH Coilcraft MSS1038-153NX 10,2 x 10,2 x 3,6 2.7 A/50 mΩ

Submit Documentation Feedback 19

TPS65161
www.ti.com
SLVS617 – APRIL 2006

Rectifier Diode Selection (Step-Down Converter)

To achieve high efficiency, a Schottky diode should be used. The reverse voltage rating should be higher than
the maximum output voltage of the step-down converter. The averaged rectified forward current at which the
Schottky diode needs to be rated is calculated as the off-time of the step-down converter times the maximum
switch current of the TPS65161:
D  1
Vout
Vin
I avg  (1  D)
Isw  1  Vout
2.5 A with Isw  minimum switch current of the TPS65161 (2.5 A)
Vin
Usually, a Schottky diode with 1.5-A or 2-A maximum average rectified forward current rating is sufficient for
most applications. Secondly, the Schottky rectifier has to be able to dissipate the power. The dissipated power is
the average rectified forward current times the diode forward voltage.
PD = Iavg x VF = Isw x (1 – D) x VF with Isw = minimum switch current of the TPS65161 (2 A).

Table 6. Rectifier Diode Selection (Step-Down Converter)

CURRENT RATING Vr Vforward RθJA SIZE COMPONENT SUPPLIER
Iavg
3A 20 V 0.36 V at 3 A 46°C/W SMC MBRS320, International Rectifier
2A 20 V 0.44 V at 2 A 75°C/W SMB SL22, Vishay Semiconductor
2A 20 V 0.5 V at 2 A 75°C/W SMB SS22, Fairchild Semiconductor
1.5 A 20 V 0.445 V at 1.0 A 88°C/W SMA SL12, Vishay Semiconductor

Output Capacitor Selection (Step-Down Converter)

The device is designed to work with ceramic output capacitors. When using a 15-µH inductor, two 22-µF
ceramic output capacitors are recommended. More capacitance can be added to improve the load transient
response.

Table 7. Output Selection (Boost Converter)

CAPACITOR VOLTAGE RATING COMPONENT SUPPLIER
22 µF/0805 6.3 V Taiyo Yuden JMK212BJ226MG

Layout Consideration
The PCB layout is an important step in the power supply design. An incorrect layout could cause converter
instability, load regulation problems, noise, and EMI issues. Especially with a switching dc-dc converter at high
load currents, too-thin PCB traces can cause significant voltage spikes. Good grounding becomes important as
well. If possible, a common ground plane to minimize ground shifts between analog (GND) and power ground
(PGND) is recommended. Additionally, the following PCB design layout guidelines are recommended for the
TPS65161:
1. Separate the power supply traces for AVIN and VINB, and use separate bypass capacitors.
2. Use a short and wide trace to connect the OS pin to the output of the boost converter.
3. To minimize noise coupling into the OS pin, use a 470-pF bypass capacitor to GND.
4. Place the rectifier diode of the step down converter as close as possible to the SWB pin.
5. Use short traces for the charge-pump drive pins (DRN, DRP) of VGH and VGL because these traces carry
switching waveforms.
6. Place a 1-µF bypass capacitor from the SUP pin to GND.
7. Place the flying capacitors as close as possible to the DRP and DRN pin, avoiding a high voltage spike at
these pins.
8. Place the Schottky diodes as close as possible to the IC, respective to the flying capacitors connected to the
DRP and DRN.
9. Route the feedback network of the negative charge pump away from the drive pin traces (DRN) of the
negative charge pump. This avoids parasitic coupling into the feedback network of the negative charge

20 Submit Documentation Feedback

 TPS65161
www.ti.com
SLVS617 – APRIL 2006

pump giving good output voltage accuracy and load regulation. To do this, use the FREQ pin and trace to
isolate DRN from FBN.

Submit Documentation Feedback 21

TPS65161
www.ti.com
SLVS617 – APRIL 2006

APPLICATION INFORMATION

L1 D1 Vs
10 μH SL22 15 V/1.5 A
Vin
12 V
C1
2 * 22 μF C4 R1
C3 TPS65161 C2
4 22 pF 680 kΩ
1 μF 8 3 * 22 μF
SUP SW
12 5
FREQ SW
20 1 C15 R2
VINB FB 56 kΩ
21 3 470 nF
VINB OS
22 23 D4
C16 AVIN GND
1 μF 16 27
EN1 GD GD D5
VGL C6 9 10 C5 0.47 μF VGH
−5 V/50 mA D2 0.47 μF EN2 DRP 26 V/50 mA
11 14
DRN FBP
13 17 R5
FBN Boot C13
D3 24 18 909 kΩ 0.47 μF
R3 REF SWB
C7 6 19
0.47 μF 620 kΩ PGND NC
7 15
PGND FBB
28 2 R6
SS COMP Cb 44.2 kΩ
R4 25 26
DLY1 DLY2 100 nF
150 kΩ
L2 Vlogic
C17 3.3 V/2.3 A
C9 C10 C11 22 nF 15 μH
C8 10 nF
220 nF 22 nF 10 nF

D6 R7 C14 C12
SL22 2 kΩ 10 nF 2 * 22 μF

R8
1.2 kΩ

Figure 19. Standard 12-V to 15-V Conversion

L1 D1 Vs
10 μH SL22 18 V/1.3 A
Vin
12 V
C1
2 * 22 μF C4 R1
C3 TPS65161 C2
4 22 pF 825 kΩ
1 μF 8 3 * 22 μF
SUP SW
12 5
FREQ SW
20 1 C15 R2
VINB FB 56 kΩ
21 3 470 nF
VINB OS
22 23 D4
C16 AVIN GND
1 μF 16 27
EN1 GD GD D5
VGL C6 9 10 C5 0.47 μF VGH
−5 V/50 mA D2 0.47 μF EN2 DRP 32 V/50 mA
11 14
DRN FBP
13 17 R5
FBN Boot C13
D3 24 18 560 kΩ 0.47 μF
R3 REF SWB
C7 6 19
0.47 μF 620 kΩ PGND NC
7 15
PGND FBB
28 2 R6
SS COMP Cb 22 kΩ
R4 25 26
DLY1 DLY2 100 nF
150 kΩ
L2 Vlogic
C17 3.3 V/2.3 A
C9 C10 C11 22 nF 15 μH
C8 10 nF
220 nF 22 nF 10 nF

D6 R7 C14 C12
SL22 2 kΩ 10 nF 2 * 22 μF

R8
1.2 kΩ

Figure 20. Standard 12-V to 18-V Conversion

22 Submit Documentation Feedback

 TPS65161
www.ti.com
SLVS617 – APRIL 2006

APPLICATION INFORMATION (continued)

L1 D1 Vs
Vin
12 V 10 µH SL22 SI2343 18 V/1.3 A

C18 R9
C1 C4 R1 220 nF 510 C19
2*22 µF C3 TPS65161 22 pF C2 kΩ
1 µF
1 µF SUP SW 825 kΩ 3* 22 µF
FREQ SW R10
FB C15 R2 100 kΩ
VINB D4
470 nF 56 kΩ
VINB OS GD
C16 AVIN GND C5
1 µF C6 EN1 GD GD 0.47 µF D5
VGL VGH
D2 0.47µF EN2 DRP
–5 V/50 mA 32 V/50 mA
DRN FBP
D3 FBN Boot R5 C13
REF SWB 560 kΩ 0.47 µF
C7 R3
0.47 µF 620 kΩ PGND NC
PGND FBB
R6
SS COMP
R4 Cb 22 kΩ
DLY1 DLY2
150 kΩ 100 nF
C17 L2
C9 22nF 15 µH Vlogic
C8 C10 C11
10 nF 3.3 V/2.3 A
220 nF 22 nF 10 nF
D6 C14
SL22 R7 C12
2 kΩ 10 nF 2*22 µF

R8
1.2 kΩ

Figure 21. Standard 12-V to 18-V Conversion Using an External Isolation MOSFET to Isolate Vs as well
as VGH

Submit Documentation Feedback 23

TPS65161
www.ti.com
SLVS617 – APRIL 2006

APPLICATION INFORMATION (continued)

Vin L1 D1 Vs
12 V 10% 6.9 μH SL22 13.5 V/2 A

C1
2 * 22 μF C4 R1
C3 TPS65161 22 pF 820 kΩ C2
1 μF 8 4 3 * 22 μF
SUP SW
12 5
FREQ SW
20 1 C15 R2
VINB FB
21 3 470 nF 75 kΩ
VINB OS D4
22 23
C16 AVIN GND
1 μF 16 27 VGH
C6 EN1 GD GD D5 23 V/50 mA
VGL 9 10 C5 0.47 μF
−5 V/50 mA D2 0.47 μF EN2 DRP
11 14
DRN FBP
13 17 R5
D3 FBN Boot C13
24 18 1 MΩ
R3 SWB 0.47 μF
C7 620 kΩ 6 REF 19
0.47 μF PGND NC
7 15 R6
PGND FBB
28 2 76 kΩ
COMP
R4 25 SS 26 Cb
DLY1 DLY2 100 nF
150 kΩ
C17 L2 Vlogic
22 nF 15 μH 3.3 V/2.3 A
C8 C9 C10 C11
220 nF 22 nF 10 nF 10 nF
D6 R7 C14
SL22 2 kΩ 10 nF C12
2 * 22 μF

R8
1.2 kΩ

Figure 22. Standard 12-V to 13.5-V Conversion

24 Submit Documentation Feedback

 IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:

Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband
Interface interface.ti.com Digital Control www.ti.com/digitalcontrol
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Security www.ti.com/security
Telephony www.ti.com/telephony
Video & Imaging www.ti.com/video
Wireless www.ti.com/wireless

Mailing Address: Texas Instruments

Post Office Box 655303 Dallas, Texas 75265

Copyright  2006, Texas Instruments Incorporated