Arlon 38N

Arlon 38N ®
Electronic Substrates
No-Flow Polyimide Prepreg
• Low Temperature Cure

• High Tg – Thermally Stable
• Reduced Z Direction Expansion
• No-Flow in Relief Areas
MATERIALS FOR ELECTRONICS

General Introduction
No-flow polyimide prepreg fills a need in three areas:
1. Bonding rigid-flexible printed wiring board (RFPWB) layers together and bonding rigid (0.005"/0.127mm
polyimide) caps to flexible layers.
Acrylic adhesive used to bond flexible layers together has a high coefficient of thermal expansion. This
freuently causes plated through hole failures during thermal cycling (cracked barrels, lifted pads and pull
away). Epoxy prepreg used to bond caps in place likewise has a relatively high expansion above its 125°C Tg
contributing to PTH failures. Arlon's 38N no-flow has expansion characteristics similar to HI-3003 polyimide
laminate which eliminates or greatly reduces the probability of PTH failures.
2. Bonding polyimide (0.005"/0.127mm unclad) insulators to polyimide PWB's.
Insulators frequently contain clearance areas (cutouts) which must remain free of resin flow. Epoxy or acrylic
prepreg will not withstand the thermal cycling requirements and may delaminate. 38N no-flow thermal
properties match those of the polyimide PWB.
3. Bonding heat sinks to polyimide PWB's.
Epoxy or acrylic prepregs may not withstand the thermal excursions required and result in failed bonds. As in
the case of bonding insulators to PWB's, 38N no-flow has thermal performance equivalent to conventional
polyimide.
Arlon's No-Flow Polyimide Prepreg is ideally suited for those applications which require:
1. Reduction in Z-axis expansion as compared to epoxy and acrylic systems.
2. Improvement in thermal stability over epoxy or acrylic.
3. Non-flowing into clearance/relief areas. [Clearance/relief areas are 1) clearances in an outer layer of material
that provide access to the layer under it, usually for component mounting and 2) the demarcation line between
rigid and flex portions (the section where the rigid polyimide cap steps down to the flexible layer) of rigid-flex
PWB's.]
Arlon 38N prepreg is made with a proprietary modified bismaleimide resin system. This system is curable at low
temperature (350 to 380°F/176-193°C) and attains a Tg of 200°C, or above. It has maximum resistance to flow
during lamination and offers:
1. Compatibility with most rigid flex and bonding processes.
2. Low Z-axis expansion.
3. Resistance to high temperatures.
Mechanical and electrical properties meet the requirements of MIL-S-13949H.

Arlon 38N prepreg is available as:
38N8060 60% Resin Content on 1080 Scaled Flow 3.0 Mils (0.076mm)
38N0666 66% Resin Content on 106 Scaled Flow 2.0 Mils (0.051mm)
MIL-S-13949H 4” x 4” (10cm x 10cm) flow is < 3.0%.
Process Guidelines
Because of varying storage conditions that exist, it is recommended that 38N prepreg be dried at 29" (736mm) Hg
for 12 to 24 hours. This step is the same as for standard polyimide prepreg.
38N No-Flow prepreg is very process tolerant. It laminates well with either a cold platen press start or with a hot
start. Vacuum or vacuum assist lamination is recommended for the removal of moisture and air. No-Flow products
do not flow out air voids as well as standard prepregs, and the vacuum will help assure a void free final product.
Use of a silicone rubber pad or other hydraulic material to balance pressure over the board area is also suggested
in many flex-rigid applications.
Lamination cycle:
1. Vacuum draw down the package for 60 minutes at < 29" (736mm) Hg prior to loading in the press. Maintain
the vacuum beyond the set point of the resin, i.e., above 320°F (160°C).
2. Use a platen temperature in the range of 360° to 380°F (182-193°C).
3. Control the heat rise to about 15° to 20°F per minute between 200° and 300°F (93° and 149°C).
4. Use a pressure of 180 to 350 PSI (12.6 to 24 kg/sq.cm) depending on panel size and complexity. Following
are recommended pressures relative to panel size to use as starting points:
Panel Size Panel Size

In Cm PSI kg/sq. cm
9 x 12 22 x 30 180 13
12 x 12 30 x 30 200 14
12 x 18 30 x 30 250 18
16 x 18 40 x 46 290 20
18 x 24 46 x 61 330 23
24 x 24 61 x 61 350 24
5. Cure time is 90 to 120 minutes at temperature.
The subsequent processing should be the same as those normally used for RFPWB's.

Typical Properties
(0.0063”/0.16mm 2 Ply 1080 Laminate)
Property Required Typical
Peel strength at elevated temperature-lbs./in(N/mm) 5.0 min. (0.88) Av. 8.0 (1.22)
Peel strength after process solutions-lbs./in(N/mm) 5.0 min. (0.88) Av. 8.0 (1.22)
Volume Resistivity after moisture res. 6.0E4 Av. 8.2E7
Surface Resistivity after moisture res. 1.0E4 Av. 4.4E6
Volume Resistivity at elevated temperature 6.0E4 Av. 4.7E9
Surface Resistivity at elevated temperature 6.0E4 Av. 1.2E9
Electrical strength-volts/mil (kV/mm) 750 min. (29.6) Av. 1600 (7.9)
Permitivity at 1 GHz 4.8 min. Av. 4.25
Loss Tangent Factor at 1 MHz 0.026 max. Av. 0.010
Arc Resistant-seconds 120 min. Av. 124
Other Properties
Thermal Conductivity BTU-in/HR/FT2/ºF (watts/m/k) 2.3 (0.33)
Tensile Strength (PSI/MPa min.) 32,000 (220)

ASTM D 412, M.A.D.C.
Elongation Min/Max. % 4-6

ASTM D 412
Continuous Use Temperature (ºC) -65/200
Typical Physical Properties

Flexural Strength at Ambient, ksi (MPa) 60(400)
Fexural modulus at Ambient, ksi (MPa) 2347 (16,200)
Poisson’s Ratio 0.17
Tg 210ºC
CTE 50-250ºC 65ppm/ºC
Moisture abstorption (%) <1%
Solder Float 550ºF (5 min.) pass
Data is believed to be accurate but values are average and not guaranteed. All sales of these products are governed by the terms and conditions under which they are sold.
Determination of the suitability of any of these materials for a particular application is the sole responsibility of the user.
The information and data contained herein are believed reliable, but all recommendations or suggestions are made without guarantee. You should thoroughly and independently test materials for any
planned applications and determine satisfactory performance before commercialization. Furthermore, no suggestion for use, or material supplied shall be construed as a
recommendation or inducement to violate any law or infringe any patent.
1100 Governor Lea Road, Bear, DE 19701 • Telephone: (302) 834-2100, (800) 635-9333 • Fax: (302) 834-2574
Arlon is an
9433 Hyssop Drive, Rancho Cucamonga, CA 91730 • Telephone: (909) 987-9533 • Fax: (909) 987-8541 ISO 9002
37 Rue Collange, 92300 LeVallois, Perret, France • Telephone: (33) 1-427-02642 • Fax: (33) 1-427-02798 Registered
44 Wilby Avenue, Little Lever, Bolton, Lancashire, BL31QE, U.K. • Telephone: (44) 120-457-6068 • Fax: (44) 120-479-6463 Company
Website: www.arlonmed.com
1218-R2 Copyright ©1998 Arlon Materials for Electronics Printed in U.S.A.

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Arlon 38N ®

No-Flow Polyimide Prepreg

• Low Temperature Cure

MATERIALS FOR ELECTRONICS

2. Bonding polyimide (0.005"/0.127mm unclad) insulators to polyimide PWB's.

3. Bonding heat sinks to polyimide PWB's.

1. Reduction in Z-axis expansion as compared to epoxy and acrylic systems.

2. Improvement in thermal stability over epoxy or acrylic.

1. Compatibility with most rigid flex and bonding processes.

2. Low Z-axis expansion.

3. Resistance to high temperatures.

Mechanical and electrical properties meet the requirements of MIL-S-13949H.

MATERIALS FOR ELECTRONICS

MIL-S-13949H 4” x 4” (10cm x 10cm) flow is < 3.0%.

2. Use a platen temperature in the range of 360° to 380°F (182-193°C).

Panel Size Panel Size

5. Cure time is 90 to 120 minutes at temperature.

MATERIALS FOR ELECTRONICS

Tensile Strength (PSI/MPa min.) 32,000 (220)

Elongation Min/Max. % 4-6

Typical Physical Properties

MATERIALS FOR ELECTRONICS

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