4-1 Handbook-1 PDF

GURU NANAK INSTITUTIONS TECHNICAL CAMPUS
(Autonomous)
(Permanently Affiliated to JNTUH, Approved by AICTE) (NAAC A+ & NBA Accredited)
Khanapur, Ibrahimpatnam, Hyderabad – 501 506.
STUDENT HAND BOOK

for
IV Year B.Tech. (I-Semester)
DEPARTMENT OF ELECTRONICS & COMMUNICATION ENGINEERING

SCHOOL OF ENGINEERING AND TECHNOLOGY
AY: 2019-2020
CONTENTS
Sl. No. Particulars Page

COLLEGE INFORMATION No.
Management 3
I Vision & Mission 4
II Quality Policy 4
III Goals 4
IV General Information 4
V Central Facilities 8
VI GNI Highlights 10
VII Guidelines, Rules & Regulations of campus 25
VIII Training & Placement 35
IX Library 36
X Student Activities 37
XI Contact Information 41
XII Committees 42
XIII Class Mentors List 43
XIV Academic Calendar 44
DEPARTMENT INFORMATION
I Vision, Mission & Quality Policy 45
II About the Department 46
III PEO’s, PO’s and Mapping of PEO’s & PO’s 47
Subject Information includes:
 Syllabus
 Consolidated Unit Wise Lesson Plan
 BTL Question Bank
 Answers for PART-A
 Objective Questions
IV 1) Microwave Engineering 46
2) Optical communications 63
3) Embedded system design 111
4) Radar system 133
5) VLSI Design 163
6) VLSI & E-CAD Lab 190
7) Microwave engineering Lab 191
V R&D / Projects / Consultancy 192
GNITC(Autonomous)-IV Year –I Sem- -Hand Book | 2019-20

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TIME TABLE
(To be filled by the student with graphite pencil only)
I II III IV V VI VII
Day /
Period 09:20- 10:15 12:45- 01:30- 02:20- 03:10-
11:05-11:55
10:15 11:05 01:35 02:20 03:10 04:00
Mon
Tue
12:45 To 01:30
BREAK
Wed
Thurs
Fri
Sat

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MANAGEMENT
President,
Guru Nanak Educational Society,
Sardar Tavinder Singh Kohli
Chairman,
Guru Nanak Institutions.
Vice Chairman,
Sardar Gagandeep Singh Kohli
Guru Nanak Institutions
Managing Director,
Dr. Harvinder Singh Saini
Guru Nanak Institutions
Sardar Tavinder Singh Kohli-Chairman (Right) & Dr. H. S. Saini-Managing Director

Sardar Gagandeep Singh Kohli-Vice-Chairman (Left)
FUNCTIONAL HEADS
NAME DESIGNATION
Dr.M.Ramalinga Reddy Director

Prof. P.Parthasaradhy Associate Director-I
Prof. R.K.Singh Associate Director-II
Dr. Rishi Sayal Associate Director –III
Dr. K. Chanthirasekaran Dean Academics
Dr. S. V. Ranganayakulu Dean R&D and FD
Dr. D.Srinivas Reddy Dean(SW) & Controller of Exams
Dr. Pamela Chawla Dean ECE & Dean Foreign Affairs

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I. VISION & MISSION
Vision:
To be a world-class educational and research institution in the service of humanity by
promoting high quality education in Engineering, Management and Pharmacy
Mission:
M1: Develop the faculty to reach the international standards.
M2: Maintain high academic standards and teaching quality that promotes the analytical
thinking and independent judgment.
M3: Promote research, innovation and product development by collaboration with reputed
foreign Universities.
M4: Offer collaborative industry program in emerging areas and spirit of enterprise.
M5: Improve employability potential through soft skills and technical skills
II. QUALITY POLICY

GNITC is committed to provide quality education through dedicated and talented faculty, world
class infrastructure, labs and updated research center to the students.
III. GOALS
 To evolve as an autonomous (Deemed University) institution offering viable programmes of
relevance for the upliftment of rural students and populace.
 To undertake Nationally and Internationally acknowledged Research and Development
works in all disciplines by forging alliances with research organizations, government
entities, industries and alumni.
 GNITC has taken strategic steps to ensure a gradual enhancement of all infrastructural
facilities to make the campus even more advanced to simply put it; it will soon resemble a
foreign university on this side of the globe.
 To achieve the status as provider of Quality Education and Excellent Research Center on par
with IISCs and IITs.
IV GENERAL INFORMATION
A. Location
Guru Nanak Institutions Technical Campus is located in the outskirts of Hyderabad, on
Nagarjuna Sagar highway, near Ibrahimpatnam. The campus is located on a sprawling and lush
green campus with a congenial atmosphere for learning. The premises are spread over 50 acres
of scenic land. The open spaces, lawns and gardens supplement to elevate the grandeur of the
environment and provide calm and peaceful atmosphere conducive for academic pursuits.
B. Promoter Society
Guru Nanak Institutions Technical Campus is one of the campuses of Guru Nanak Institutions
sponsored by Guru Nanak Educational Society, which have been founded to educate, enrich
and empower the youth who in turn will play a decisive role in shaping the destiny of the
nation. The endeavor at the Institution stretches beyond just offering degrees to the building of
character and personality of the young professionals transforming them into complete
professionals equipped with technological competence and social consciousness.
More Than a Decade of Academic Excellence
In a short span of twelve years, GNI has achieved many impressive milestones that are worth
mentioning. GNI emphatically states, academic excellence is a direct result of serious
commitment to uncompromising quality. Adding a new professional college year on year, GNI

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scaled to new heights purely based on collective efforts and team work. At GNI the
management and the faculty share the same vision which says ‘Excellence in Education”.
GURU NANAK INSTITUTIONS

HYDERABAD:
 Guru Nanak Institutions Technical Campus
School of Engineering and Technology
(NBA Accredited & NAAC A+ Accredited)
School of Management {Guru Nanak Institute of PG Studies (MBA)}
School of Pharmacy (Guru Nanak Institute of Pharmacy)
 Guru Nanak Institute of Technology
 Panineeya Hospital, Institute of Dental Sciences & Research Centre
 Guru Nanak Business School
 Guru Nanak School of Management
NAGPUR:
 Guru Nanak Institute of Engineering & Technology
 Guru Nanak Institute of Engineering & Management
 The Edify School, DRS Education
ROORKEE:
 Hermes College of Engineering & Management
 Hermes Business School
Global Academic Partners:

 DEAKIN UNIVERSITY AUSTRALIA
 UNIVERSITY OF HUDDERSFIELD
 NORTHERN ARIZONA UNIVERSITY
 NEWCASTLE UNIVERSITY
 PITSBURG STATE UNIVERSITY
 VALPARAISO UNIVERSITY
 SOUTHERN ILLINOIS UNIVERSITY, EDWARDSVILLE
 BINGHAMTON UNIVERSITY
 NEW YORK INSTITUTE OF TECHNOLOGY
 FEDERATION UNIVERSITY OF AUSTRALIA
GNI is now MICROSOFT certified Gold Partner.
C. Growth of the Institution:

Guru Nanak Engineering College was established in the year 2001 with the sole objective of
providing a perfect platform to students in the field of Technology and Management to invent
applications for their academic and overall personality development. Within a span of 12 years,
GNEC has come a long way to become one of the Premiere Engineering Colleges in the state
with an overall intake of more than 2500 students in various Undergraduate and Post Graduate
Courses including B.Tech.,M.Tech., M.B.A. and M.C.A. GNEC is an NBA, NAAC A+
accredited and ISO 9001 certified institution with state-of-the-art laboratories, highly qualified
and dedicated teaching professionals and a sprawling lush green campus with a congenial
atmosphere for learning. As part of expansion of GNI, Guru Nanak Institute of Postgraduate
Studies in Management Studies and Guru Nanak Institute of PG studies in Computer

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Applications was started in 2005, Guru Nanak Institute of Pharmacy was started in 2006 and
Guru Nanak Institute of Engineering & Technology was started in 2010.
In the year 2013 a new gem was mounted in the crown of Guru Nanak Institutions. Five
colleges of GNI main campus Guru Nanak Engineering College, Guru Nanak Institute of
Engineering & Technology, Guru Nanak Institute of Pharmacy, GNIPG – MBA and GNIPG –
MCA were integrated to a Technical Campus in the name of “Guru Nanak Institutions
Technical Campus”.
In the year 2016, GNITC has become an Autonomous Institution which is one step towards the
University Status in coming years. With such landmark achievements already in place, GNI is
poised to go farther and higher in its endeavors – dedicated completely to the cause of quality
education – a mission that GNI practices every day.
The campus has a rich tradition of soaring high with academic excellence and overall personal
growth of the students. This is achieved by providing to them excellent academic environment,
state-of-the-art infrastructure and dedicated and highly qualified faculty members with decades
of teaching and industrial experience. Currently, ours is the only accredited private institute
in Telangana with NAAC A + by National Assessment and Accreditation Council.
Guru Nanak Institute of Technology was established in the year 1999 with the sole objective
of providing a perfect platform to the students in the field of Technology and Management
applications for their academic and overall personality development. GNIT has become one of
the Premiere Engineering Colleges in the state with an overall intake of 732 students in various
Undergraduate and Post Graduate Courses including B. Tech., M. Tech and M.B.A.
Courses @ GNITC
UG COURSES PG COURSES
B. Tech. CSE M.Tech(CSE)
B. Tech. ECE
B. Tech. IT
B. Tech. EEE
B. Tech. Mechanical M.Tech(TE)
B Tech. Civil
B. Tech. Aeronautical
MBA (Specializations: HR, Finance and Marketing)
B.Pharmacy
M.Pharmacy (Pharmaceutics)
Pharma D
HIGHLIGHTS:
Guru Nanak Institutions Technical Campus has been granted Autonomous status by
University Grants Commission, India and Conferred by Jawaharlal Nehru Technological
University Hyderabad.

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• High Academic Results and 80 % placements.
• Largest number of PhD Qualified and Research minded faculty.
• Andhra Pradesh’s (prior to bifurcation of state) first campus to become Microsoft Gold
Partner for Corporate Internships and Placements
• Tie-ups with Global Universities for Student exchange programmes, Scholarships and
Higher studies
• Established Centers of Excellence:
o Computational Civil Engineering
o Embedded Systems in collaboration with Texas Instruments
o 3D Printing
• Established Centers for Expertise:
o Non-destructive Testing and Evaluation
o Acoustic Emission
o Geomatics
o Mobile Application Development
• Established Innovation Centers:
o Robotics and Industrial Controls
o Solar Application Development
o SAE BAHA
o Big Data
• Incubation Centers:
o Entrepreneurship Incubation Center
o Engineering Incubation Centre
Awards and Achievements
1. The only private Institution in the State, to be accredited with NAAC A + by

National Assessment and Accreditation Council.
2. Most of the offered courses are NBA accredited
3. A multifaceted institution having tie-ups with Global Universities
4. Industry based Training with 13 Centers of Excellence
5. Recognized as “Quality Professional Institution of the Year, Telangana” and was
conferred with “Certificate of Excellence Award” at the Global Quality Awards
6. Received the “Award for Educational Excellence” at the Indo-Global Education
Summit
7. Awarded “The Excellent Campus Recruitment in the State” at the National
Education Summit & Award supported by Department of MNRE, GOI,
Department of MSME – GOI, AICTE, Association of Indian Universities, JNTUA
D. Future Plans
GNI with its progressive views and visionary zeal has plans for continuous and sustained
growth, and to gain the numerous statuses in all aspects. Having a huge campus with the state-
of-the-art facilities, the institute is trying to get Deemed University status for which the process
is under progress. The campus is also planning to collaborate with MNCs and reputed
Universities within India and abroad to facilitate the students to get acquainted with the latest
trends in their respective engineering fields.

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V. CENTRAL FACILITIES
1. Buildings
GNI Campus consists of various departments which are established in spacious well
built blocks. Each block with well-ventilated classrooms, staff rooms, labs, libraries,
drinking water, toilets facility, other amenities and also equipped with Wi-Fi facility.
2. Internet Facility
Apart from the internet facility, 1200 systems are connected to the Central server.
Students can access the facility at all working hours and after hours as part of their
research and practical work and for seminars & conferences that will be held from time
to time. It provides access to e-books, study materials, previous question papers,
teaching schedules, internal marks, attendance reports, daily circulars etc. Through the
college Local Area Network (LAN), the internet facility with 20Mbps connection is
available to students 24X7.
3. Open-Air Auditorium
A huge open-air auditorium with a capacity of over 2500 has been constructed in the
campus to enable the conduct of all types of meetings, seminars, cultural activities and
all other celebrations like Annual Day, Orientation Programmes etc.
4. Air –Cooled Auditorium
An Air - Cooled Auditorium is available in the campus that can comfortably seat 600
students – this is the ideal seating for holding seminars, workshops, interactive sessions,
National and International Conferences and various other events.
5. Bank
To provide an easy access to deposit and withdraw of money, there is an exclusive bank
counter in the campus. Students who have the accounts with respective bank are given
ATM cards. Additionally, the bank also extends student loans that can be obtained by
the parents of the students for the education of their children. The ATM is available on
campus.
6. Sports
Students are encouraged to engage in physical education for their all-round
development. They are encouraged to participate in inter-college competitions and also
offer themselves for selection to the University team. Cricket, Volley ball and Foot ball
grounds along with a spacious Student Activity Center for indoor sporting facilities are
provided. An annual Sports day is conducted and prizes are awarded to teams and
individuals who prove their mettle.
7. Canteen
College Canteen “Refuel” provides delicious and hygienic food at affordable prices.
South Indian, North Indian and Chinese food, both vegetarian and non-vegetarian items
are available.
8. Drinking Water
Water treatment plant is erected in the campus to cater to the drinking water needs of the
students and staff. Purified drinking water is supplied to all the departments / blocks
through water coolers made available in each building.
9. Hostel
The hostel is the second home for the students who come from far off places. All hostel
rooms furnished with modern furniture to provide comfort for students. Facilities
available at the hostel:

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 Sports room
 Internet center
 24hrs. Internet in the rooms
 Solar water heating system
 Entertainment room
 Gym and Indoor sports
 Drinking water treatment plant
 Two generators for power backup and security arrangements
 A separate library
 Separate Mess for Boys and Girls
Girls Hostel
Exclusive girls’ Hostel with lady warden and separate mess with total security is
available in the campus. Wi-Fi, internet centre and separate library is available in the
hostel.
10. Transport - College Buses
College has its own fleet of 60 buses plying from all corners of the twin cities. They are
comfortable, safe and fast. Please visit: www.gniindia.org for bus routes. Students can
deposit fee with the accounts department for availing the bus facility. A number of
APSRTC buses are also available to reach the college well in time. APSRTC will issue
Bus passes after the commencement of the class work.
11. Medical Facilities

College has a tie-up with a medical practitioner, who is available in the college. First
Aid kits with emergency medicines are made available in all the departments. Full time
nursing assistant is available in the campus.
12. Seminar Halls

College has dedicated and well-furnished seminar halls, where activities like Student
Seminars, Group Discussions, and Mock Interviews etc are conducted.
13. Gymnasium
The college has a modern Gym with the latest equipment for fitness enthusiasts to flex
their muscles and get in shape – body, mind and soul together.
14. Guest House
Modern Guest house with excellent class furniture is constructed to provide the
accommodation for Trainers, Expert Faculty, Visiting Faculty, Foreign University
Professors, Parents and VIPs.
15. Faculty Quarters

Well furnished Two Bed Room, Single Bed Room and Bachelor rooms for faculty have
been constructed inside the campus. This will be much useful for research scholars and
faculty those who love to live in pollution free with greenery.
VI. GNI HIGHLIGHTS
(A) Earn While Learn Scheme:
Earn While Learn is a unique programme which would enable students to work closely
with various departments of the organization thus developing their skills apart from earning
through the same. Earn While Learn would enable students to attain managerial skills,
administrative skills, leadership skills, communication skills (written and oral) etc. thus being a
better individual.

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Eligibility:
 Students should be a resident of GNI hostel (can be relaxed for meritorious students)
 Student should be having all clear subjects at B Tech II level and should be in B Tech/
B. Pharma (III/IV year). M Tech (non faculty)/ M Pharma/MBA/MCA students of all
semesters are eligible for scheme. Students need to maintain minimum 75% attendance.
Job Description:
Under the scheme the students could be engaged by Guru Nanak Institutions for jobs in the
following areas:
a) Laboratories, b) Library, c) Offices
In the labs/workshops the students can be engaged for making them responsible for handling the
equipment/machinery, upkeep etc. In the library jobs they can be used to do cataloguing,
arrangement and display of books, repair of damaged books, issue and return of books etc. In
the offices they can be used for jobs like preparation of statements, maintenance of service
records, compilation of data, preparation of bills, store inventory, student’s attendance, hostel
records, sending of letters to parents, making calls to parents, escorting delegates for various
events, participating in various education fair etc. Since the students are having knowledge of
computer, skill can be utilized in a positive way and increasing efficiency. The above job
descriptions are only illustrative and not exhaustive.
Rules and Regulations:

 Equal opportunity to all students is given at GNI.
 A student can work maximum up to 10 hours a week, provided allowed by higher
authorities in special cases. However students can work up to 30 hours a week in
Summer/Winter breaks.
 Student will register (on Performa available) for this scheme at department of Training,
Placement and Industrial relations.
 Opportunity will be given at first come first serve basis.
 Maximum 20 UG and 15 PG will be provided work/experience.
 Student can earn maximum of Rs 500 in a day.
 Scope of work and duration would be decided by the reporting officer who is deputing
the student for the job.
 Training /discussion period will also be included.
Compensation Rate:
FOR UG STUDENTS: Rs 75 per hour
FOR PG STUDENTS: Rs 100 per hour
Experience:
Students will be given certificate of work experience a ‘Teaching Associate’ or ‘Admin
Associate’ after completion of 100 hour of work
(B) Innovation Centre
Guru Nanak Institutions Technical Campus has established the Innovation Centre exclusively for
Research, trainings and consultancy in multidisciplinary Engineering and Sciences. The main
objective of establishing centre is to provide exposure and participation to faculty and students
to the research activities through Centers of Excellence enabling them to teach and learn from a

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higher platform, acquisition of new knowledge, create specialized product development and
testing laboratories with leading edge technologies.
13 centers of excellence are established in the campus to promote the research,

consultancy and trainings
1. Adobe Creative Technology Academy
2. Internet of Things
3. Robotics & Industrial Applications
4. Big Data
5. Mobile Computing
6. Software Development
7. VLSI and Embedded Systems
8. Non-Destructive Evaluation
9. BAJA SAE
10. 3D Printing
11. Geomatics
12. Computational Civil Engineering
13. Solar Applications
1.Adobe Creative Technology Academy
GNI PARTNERS WITH ADOBE TO OFFER ADD-ON

SPECIALIZATION IN UI/UX
Adobe,a $ 107 Bn (Rs. 7 Lakh Crore) company, world's third 3rd biggest software giant is
opening a 10,000 people facility at Hyderabad and an Artificial Intelligence Lab. As IT industry
is re-skilling, there will be a large number of jobs in the area of UI & UX (User Interface and
User Experience) for fresh graduates in the span of next 4-5 years. While automation is taking
away jobs in certain areas, UI/UX is one of the few key skill areas where the number of jobs are
increasing. Keeping this in mind, GNI is the leading education institutes in India to sign an
agreement with Adobe to setup One-of-its-Kind Center offering internships, courses, mini-
projects and major-projects to B. Tech. students as an Add-on specialization to the B. Tech
Degree. The add-on will make them highly employable in the new areas like UI & UX. The
UI/UX skills are in great demand with highest pay packages in the industry. Only a couple of
top institutions across India are offering few subjects where the demand is very high.

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Adobe,a $ 107 Bn (Rs. 7 Lakh Crore) company, world's third 3rd biggest software giant is
opening a 10,000 people facility at Hyderabad and an Artificial Intelligence Lab. As IT industry
is re-skilling, there will be a large number of jobs in the area of UI & UX (User Interface and
User Experience) for fresh graduates in the span of next 4-5 years. While automation is taking
away jobs in certain areas, UI/UX is one of the few key skill areas where the number of jobs are
increasing. Keeping this in mind, GNI is the leading education institutes in India to sign an
agreement with Adobe to setup One-of-its-Kind Center offering internships, courses, mini-
projects and major-projects to B. Tech. students as an Add-on specialization to the B. Tech
Degree. The add-on will make them highly employable in the new areas like UI & UX. The
UI/UX skills are in great demand with highest pay packages in the industry. Only a couple of
top institutions across India are offering few subjects where the demand is very high.
GNI aims to transform ‘Fresh Graduates’ into ‘Skilled Engineers’.
2.Internet of Things
Internet of Things is among the newest technology in the industrial and development sector. It
has created a huge wave and influenced the manner we communicate and share the information.
The IoT technology connects devices to each other, and to the people who use it in their daily
life. Leading Industries have transformed their development towards Internet of Things;
therefore, companies are in search of professionals who have strong fundamental knowledge in
the concepts of Internet of Things. With specialization in this field, the young and talented
graduates can develop lucrative IT careers.
Internet of Things (IoT) has already transformed the way the world works. Just take a look at
the way things are becoming smart and autonomous – most of the IoT devices don’t need
human intervention anymore - they can self-maintain, self-propel and self-drive. A car is
becoming smart enough to avoid sudden mishaps. The cameras on the road are intelligent
enough to take pictures of any casualty and inform the emergency team, or the police. All this is
possible because of sensors, microcontrollers, and network security embedded in IoT objects.
This is why IoT is seen as the next big thing in technology, which will transform the
employment landscape in the IT industry.

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Between 2014 and 2017, the demand for IoT talent has accelerated by 300%. With IoT fast
approaching, Gartner predicted that by 2020 there would be more than 50 billion devices
connected to the Internet of Things. These are the professionals who keep an eagle eye on the
execution part of the project. Their job roles vary from development to marketing. They
collaborate with development teams to take care of
business requirements and implementations.
3.Robotics & Industrial Applications
500 plus students have successfully completed their mini and major projects.
The technology of Robotics deals with building automated machines that replace humans in
dangerous environments or manufacturing processes, or resemble humans in appearance,
behavior, and/or cognition. Guru Nanak Institutions has established robotics center of
excellence with focus on pneumatics, electronics and mechanical section. This center consists of
connectors and fittings with respect to the entities like union straight, different diameter and
elbow to list out few.
The preparation includes training on robots, sensors, micro controllers with separate guidance
for mechanical and non-mechanical engineers. It covers modules on Hacksaw aluminum
sections, design of chassis, grippers. For non-mechanical engineers, design of micro controllers
with different sensors and design of motor drivers are offered. The exercise includes practical
exposure to manufacturing, assembling and control of robots through software (pneumatic
simulation and Google sketch up. Around 10 faculties are involved in training the students.
Some of the innovative and creative projects developed by our students include:
 Intelligent fire fighting robot

 Pneumatic powered robotic crane
 Miniaturized Mars rover
 Collision avoidance robot
 Wireless surveillance robot
 Pick and place robot

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Big-Data (Analytics) & Mobile Computing
4.BIG-DATA (ANALYTICS)
BIG DATA center of excellence has been established with Big data appliances with multicore
SDMOS, DB SERVER, WEB SERVER and 30 client machines for training aspects. Students
are taught advanced oncepts of BIG DATA like Hadoop Distributed File System and
MapReduce framework. They get a hands on experience on setting up a Hadoop Cluster,
programming and Data Loading Techniques using Sqoop and Flume OOZIE and NoSql.
Few of the projects which have been executed by our students for various industrial
sectors include:
 Data analysis on customer complaints
 Criminal data set analysis
 Log analysis
 Social network data set analysis
 Weather Dashboard
5.MOBILE COMPUTING

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Mobile computing center of excellence has been established with mobile application life
management tool suite and app development emulators for OEM’s through Samsung, Nokia,
Google, Motorola. The 7-week training program includes installation of node.js, apache, SDK
by hard core industry experts from Nokia, Samsung. The training involves discussions related to
the pros and cons of different frameworks. High importance is given to app development. At the
end of the training program, students will be able to implement, test and launch the application
as their final project. Around 6 faculties are involved in training the students.
Some of the innovative projects done by our students include numerous mobile apps along
with number of gaming apps. Few worth mentioning as real time apps are:
 Daily expense app

 Device tracking
 Component converter
 Traffic signal app
6.Software Development
JAVA is one of the most used programming languages in IT and software companies
worldwide. The training of Advance JAVA course introduces students to web Applications. JEE
6, JAVA servlets, JAVA platform and programming skills. JAVA is everywhere on phones,
embedded technology, robotics, and applets. Due to the huge requirement and growing demand
for responsive web application development, JAVA professionals are in demand. Our training is
specially designed to let students become expert creators for network and web applications. A
trained student can join the industry as an Advance JAVA Developer, Advance JAVA
programmer, or an Advance JAVA Consultant.
Numerous Java based projects handle different domains such as

cloud computing data mining
 network security
 networking
 mobile computing
 software engineering
 Image Processing
 Grid Computing
 Multimedia
 J2EE
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This 78-hours course is designed for current developers who wish to upgrade to the latest Java
8.
Few of the projects on which students are trained/guided by experts from industry on
various domains:
 Cloud Computing
 Networking
 Data Mining
 Network Security
 Software Engineering
.NET is in other words the future of web technology. Our training course focuses on
introduction to .NET, ADO.NET and ASP.NET. Students are being trained in Web Application
using ASP .NET,Web services, Data Binding, State Management, IIS6 and IIS7 authorization.
Few of the projects implemented by our students are IEEE research based which are further
extended to innovative ideas.
7.VLSI & Embedded Systems

The trainings in Embedded System technologies are related to Electronics, Electrical, Computer
and Mechanical fields. They offer set of tools to deal with the Design and Manufacturing issues
at commercial & industrial level.
Our training includes introduction to:

 Embedded systems
 LCD,
 7 segment displays
 LEDs
 Bluetooth technologies
 GSM and RFID modules
 Exposure to VSP software
 LCD interfacing, programming
 micro controllers,
 Installation of required software
650 plus students have successfully completed their mini and major projects. Around 20
faculties are involved in training the students.

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A hands on experience is provided on building up a research project kit for understanding the
implementation.
Following are few of the innovative and research projects designed and developed by our
students as part of major project:
 Smart energy saving system for roads

 PC/LAPTOP based wireless security system with appliance control
 Smart automated system for house using Bluetooth
 Smart Energy Management System
8.Non-Destructive Evaluation
This center was established to study the quality assurance of aero space and nuclear engineering
materials. Basic NDT methods such as magnetic particle inspection, liquid penetrant test,
visible inspection and ultra sonic flaw detector are installed to study the various defects of metal
materials. This center is supported by department of atomic energy under Nuclear Fusion
programme and AICTE under RPS programme.
Non Destructive Testing- Training

CNDE offers training to the students to get exposure in Non destructive testing and evaluation.
The course curriculum for design and development of real time projects consists of the
following methods:
 Liquid Particle Inspection
 Visual Particle Inspection
 Magnetic Particle Inspection
 Ultrasonic Flaw Detector
 Acoustic Emission setup
Rs 29.55 Lakh & Rs 17 Lakh Research Grants have been funded by BRFST under DAE under
Nuclear Fusion Programme and AICTE respectively.

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9.Baja SAE
BAJA SAE India is a National Level Inter-collegiate event where the objective is to provide
graduate students with a challenging project that helps them acquire design experience, hands-
on manufacturing skills and in-depth technical knowledge. The objective of the competition is
to build an All Terrain Vehicle which is supposed to compete in a series of off-road
competitions. The judges are veteran automotive engineers from GM, Cummins and John
Deere; putting students face-to- face with some of the most experienced people in the industry.
It provides an appropriate forum to gain unparalleled real world experience.
GNI established centre for developing vehicles to be part of BAJA SAE and other national
level inter college events. In this project students learn and gain experience in designing,
machining, fabricating and financing real time reliable vehicle and also communicating
with vendors, suppliers and sponsors. SAE India Baja gives an exposure to various
automotive items.
Project Offered
 Designing and Fabrication of All Terrain Vehicle
Student Centric Training Methodology

Two faculties provide guidance to the students. Twenty-four Mechanical Engineering students
associated with Team Wraith Racing completed this powerful training module. For four years
the team has been participating in the event SAE BAJA sponsored and hosted by automotive
giants such as Mahindra and Mahindra, Chevrolet.
10.3D Printing & Geomatics
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3D PRINTING
Centre of Excellence for 3D – Printing has been established in Guru Nanak Institutions in the
year 2013. 3D printing also known as Additive Manufacturing (AM) and Rapid Prototyping
(RP). 3D - printing realizes complex objects in layers directly from their CAD definitions. Two
higher end Fused Deposition Technology (FDT) printers installed in the center. These printers
consist of exceptional smart key features, such as dual extrusion, multi-material support, Wi-Fi
and ETHERNET, auto power lost recovery, touch screen, and leveling free.
Typical Applications of 3D Printers @ GNI

 Automobile, aircraft component design, manufacturing and assembly
 Consumer durable
 Special purpose machinery design
 Electrical and electronic equipment design
 Accessory design and manufacturing for fashion designers
 Shoe making
 Pattern making for casting
 Toy making
 Statue making and sculpting
 Furniture making
 Defence equipment design and manufacturing
11. GEOMATICS
350 plus students have successfully completed their mini and major projects and around 8
GNI has established this center with an aim to train the students in the field of Remote Sensing,
GIS & Surveying. The students are being trained with the Arc-GIS software in the center. The
training covers wide applications on remote sensing, preparation of geo database and work on
Google earth, geo referencing.
Few of the real time projects where students have shown their skills are:
 Identification of accident zones in Hyderabad Between L B Nagar to Himayat Nagar
Slum free city
 planning using RS
 GIS Intelligent transport system

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 GIS Proposal of new water retaining structures for Ranga Reddy district
 RS and GIS Surveying & Mapping of GNI by total station ArcGIS
12. Computational Civil Engineering
This center of excellence consists with 24 BENTLEY’s Academic Perpetual offering Solution.
GNITC is the first institute to place entire range of products provided by Bentley Inc. USA. The
list of softwares include Structural solutions like STAAD Pro, 3D CAD design, MXROAD
(Transportation solutions), 3D IMAGING & MAPPING Solutions, BUILDING
INFORMATION MODELING solutions and WATER & WASTE WATER solutions.
These applications are useful for construction organizations. The students are trained on these
applications from second year to final year (i.e., all semesters) to enhance their computational
knowledge in the Civil Engineering and improve their employment opportunities.
They learn extensively on 2D and 3D frame modeling, geometric tools, analysis and design of
circular dooms and 3D frames. Design of duplex building the students have been able to get
trained on the STAAD Pro software and work on real time projects like:
 Design of a residential building
 Design of a public building
 Design analysis of earth quake resistant commercial building
 Design of model school building
 Design of shopping malls & shopping complexes
13.Solar Applications & DECODE IT-Park

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SOLAR APPLICATIONS
Guru Nanak Institutions has established solar power center of excellence with focus on
awareness of green power, to excel in research area of solar power and generate various
research applications as major projects for 4th year students.
Students are trained on a simulation machine on the following aspects:

 Parameters effecting the generation of solar power
 Designing the solar generating plant
 Working of charge controllers like MPPT & PWM
 Knowledge regarding the conversion from DC-DC to DC-AC at different levels
 Usage of above parameters as knowledge base in fabrication of solar based projects.
Students are able to work on research projects like:

 Automated control of home appliances by solar power
 Solar water pumping system
 Design and development of low cost solar energy system for rural area
 Solar power based bicycle
 Design of solar panel energy measurement system
DECODE IT-PARK
Decode IT-Park inaugurated by Honorable K. T. Rama Rao

Minister of Information Technology, Government of Telangana Centre.
Digital Engineering Center for Offshore and Domestic Enterprise (DECODE) IT Park
India's First IT Park Within an Institute Campus Providing Part Time Employment to
Current Students & Full Time Employment to Passed out Engineers.
 A full fledged IT park where companies employ and train students.

 Fix the employability skills problem & technical skills problem.
 Students can attend interviews with multiple companies.
 Students can join a different company in a new academic year.
 Once employed students should complete employment formalities.
 Students will be paid industry salary and will be given employment certificates.

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(C) Entrepreneur Development Cell:
The GNI-EDC functions as a regular department and the communication network processes via
[email protected]
 Gifteria- www.gifteria.co android app at play store GIFTERIA
 Flush Farmers- in Association with agricultural and Marketing department of Telangana
State
 Enlighten- a portal for Student Learning Engineering Course via ONLINE LECTURE
VIDEOS of GNI experts
 MEDICAL STORE under Pradhan Mantri Bhartiya Jan Aushadhi Kendra being charged
by BPPI for GNI campus and common public
 GNI ‘s Institutional DATABASE Startup for List of colleges and Universities under
AICTE and UGC for 40,000 Links
 Blue Planet Herbs in association with HERITAGE for Promoting Green Wheat grass for
health benefits
Currently, Entrepreneurship is the buzzword. Globally every country attracts creative

and edgy entrepreneurs to develop business communities, to boost innovation and overall
growth of the economy.
We at GNI, actively encourage students to take up tasks of courage and build on break
through ideas as they have several start up ideas. We are proud of the following creative
talents that have emerged.
Fire Breathing Racers
This is a team of Mechanical Engineering students of GNITC is striving in designing and

fabricating GO-KART Vehicle competing in International Series of Karting (ISK). An event is
initiated by Mean Metal Motors for under graduates from across the world to build and race
their own Go-Karts.
Team Super Ignite
This fabulous team has proven to be a challenging and successful platform for the Mechanical
Students of GNIT towards designing and fabricating various automobiles. The team takes part
in various design challenges organized by different organizations across the globe.

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Flush Farmers T-Hub
It is a venture firm started by the team of Electronics and Communication Engineering students
of GNI. The Android Application of Flush Farmers is inaugurated by Honorable Minister, Shri
Thanneeru Harish Rao, Cabinet Minister for Irrigation, Telangana State, India.
Gifteria
Gifteria is the first student venture into Make in India initiative in Booming technology
solutions. The venture aims to meet the exponential growing demands of online store for variety
gifts for every occasion. The team strives for launching all new GIFTERIA APP & WEB
PORTAL with advanced features.
“ LEARNING IS A TREASURE THAT WILL FOLLOW ITS OWNER EVERY WHERE.

GNI IMPARTS THAT TREASURE ”.
(D) IUCEE activities of the Campus:
GNITC is conducting webinars, interaction with professors from universities of USA

universities as part of IUCEE collaboration-
IUCEE Student chapter leaders
Chapter secretary GauravBaid, TY, CSE

Joint Secretary AbhilashKulkarni, TY, IT
Internal Affairs Officer ChandanDadwar, TY, IT
Finance Officer Rahul Reddy, TY, CSE
IUCEE Student chapter leaders (Guru Nanak Institute of Technology)
Chapter secretary ChanchalGanrai, CSE 3rd Year

Joint Secretary L.Manish, IT 2nd Year
Internal Affairs Officer Kirandevikar, CSE 2nd Year
Finance Officer B.Alekhya, IT 2nd Year
(E) Industry Institute Partnership (IIP) programmes
1. Oracle Work Force Development Programme
Oracle Corporations Work Force Development Program (WDP) is a unique programme which
is utilized to address the skill shortage challenge in the global Information Technology Industry.
Oracle is providing training to faculty and students at low cost so that they are able to enhance
their skill sets. The students after undergoing this programme are more employable and become
tech savvy. The faculties on the other end learn new technologies and keep abreast with the
growing scenario.
1.1 The modules conducted by Oracle include:
 Oracle9i: Program with PL/SQL 1.1

 Introduction to Oracle9i: SQL 1.1
 Data Warehousing Fundamentals 1.0
 Data warehouse Database Design
 Oracle9i Database Administration Fundamentals I, 2.0
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 Oracle 9i Database Administration Fundamentals II, 2.0
 Oracle9i Forms Developer: Build Internet Applications
 Oracle9iAS: Discoverers for End Users 4.0
 Oracle9i Database Performance Tuning 2.1 etc.
(F) Microsoft Faculty Connect Summer School

This is a unique programme which is launched by Microsoft to help the academicians build
upon their knowledge on the new technology front. This is of significance importance as it
presents an opportunity for faculty members to build bridges with industry as well as network
with their peers. In addition, Faculty will be able to gain recognition from their peers as they get
invited to attend this exclusive Symposium which is planned to be held annually.
Topics Include:
Cloud Computing, Windows Phone, Windows 8, .NET, Developer Tools, Lync, SharePoint,
Office 365, Xbox 360+Kinect technology, Accessibility etc.
(G) Infosys Campus Connect Programme:

Campus Connect is an Infosys sponsored industry-academia collaboration program to align
engineering student competencies with industry needs. Infosys, in this Campus Connect
program, shares with academia its mature technology training methods, courseware, student
project samples and other such learning resources that have been developed, practiced and
perfected over the last 15 years. Campus Connect helps the students in applying their learning to
practical situations, with special emphasis on teamwork, project management, cross functional
networking and effective communication.
(H) Guru Nanak Institutions tie up with Skill Matters

GNITC has tied up with Skill Matters for the development of its students. After these trainings
the students are more employable and this has been seen from the excellent track record of
placements for 2012 batch. Guru Nanak Institutions runs exclusive Center of Excellence with
Skill Matters which provides all the resources to its students to be more employable and more
effective in the turbulent times of economic turmoil and growth.
VII. GUIDELINES, RULES AND REGULATIONS OF THE CAMPUS
A. General:
1. Dress Code
Students should be dressed in a presentable manner. T-Shirts with round neck are not
allowed. Students have to follow the department dress code on Monday, Tuesday and
Wednesday.
2. Ragging and Indiscipline
Ragging is strictly banned / prohibited on campus. Any student who found guilty would
be dealt with severe punishments. All senior students of this college have been warned
about ragging, a written undertaking has been taken from all senior students. There is
zero tolerance for ragging. Students are advised to be aware of students of other
colleges. Students who misbehave with staff or other students will also be dealt with
severely. Students involving in indecent acts like smoking, consuming liquor and
involving in fights may be suspended up to one semester /academic year. Separate buses
will be provided for first year students.
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3. College Timings
The College starts at 09:20 a.m. and ends at 04:10 p.m. with a 50 minutes break for the
First year / Third year students at 12;00 noon. andSecond year / Fourth year students at
12.50 p.m. Students should reach the college well before the time and must be in the
class by 09:20 a.m. Students should not move outside without permission when the class
work is in progress.
4. Bonafide Certificates
The Academic branch will issue bonafide certificates for bus passes and other purposes
to the college students.
5 Bus Passes
Administrative officer will attest APSRTC bus pass applications. College bus Id-cards
will be issued by the transport in-charge.
6. Notices/Notice Boards
Students are expected to see the College notice boards, Department notice board and
Lab notice board regularly. The Main notice board is placed near the Administration
Building.
7. Original Certificates
The Original certificates of each student have to be deposited with the college and the
same will be returned after the completion of the course.
8. Memorandum of Marks
The memorandum of marks of a particular year / semester will be issued once they are
received from the University by the Examination branch at the respective Department
offices.
9. Intimation of Change of Address
Students are asked to intimate the change in Address / Phone number immediately, if
any, to the academic branch through their Class Mentor or HOD.
10. Wearing ID cards
Wearing ID cards is mandatory for all the students as long as they are in the college
premises. They will not be allowed to attend the classes and labs or write the
examinations without the identity cards.
11. Obtaining Gate Passes
Students found bunking classes or leaving the college without prior permission will not be
permitted to attend the classes the next day, till proper explanation is given by the
student and the parent / guardian to the concerned Head of the Department.
12. Ban on Usage of Mobile Phones
No student shall use the cell phone during instruction periods in the college campus. If
any student is found violating this rule, a stern disciplinary action will be taken. All
students are permitted to carry a simple mobile without any special features like camera,
MP3 or FM.
13. Absenteeism
No student shall absent from the class without prior permission of the HOD. If a student
is absent for three days continuously without reason/prior permission, disciplinary action
will be taken. The Student must submit leave application in advance to the HOD, if
he/she wants to go on leave for a day on some valid reason.
14. Electronic Items for Music and Entertainment
No musical gadgets shall be allowed in the college campus. If any student found using
such items, the items would be seized and severe disciplinary action will be initiated.
15. Discipline in Buses
The students must commute in the allocated buses. In case of emergency they will be
permitted to change route, with the permission of the concerned authority/bus in- charge.

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If any student behavior is objectionable to the staff/ other students then suitable
disciplinary action will be taken. No student is permitted to travel without bus ID.
16. Late Comers

No student shall come late to the class. In case late to the class, the student may be
permitted to attend the class with the permission of the respective Department Head. If
the student is a regular late comer, appropriate disciplinary action will be taken.
17. Interaction with seniors
To curb the practice of ragging on the pretext of interaction, the junior students are
instructed not to meet the seniors and engage in any sort of conversation. The students
are instructed not to spend their time with the seniors even if they are known or related
to them.
18. Leave / Sick Leave
The student must intimate to the concerned HOD, the reason for being absent and
submit the medical certificate on the following day, if the absence is on medical
grounds. Disciplinary action will be initiated if any student is absent without any
intimation to the Class teacher/ HOD for more than three days.
19. Assignments / Lab Records Submission
The students are supposed to submit their Lab records and Assignments given by the
concerned faculty and get them corrected and graded in time. Late submission is not
accepted.
B. Attendance:
Attendance Requirements
 A student shall be eligible to appear for University examinations if he/she acquires a
minimum of 75% of attendance in aggregate of all the subjects.
 A student will not be promoted to the next semester unless he/she satisfies the
attendance requirement. They may seek re-admission for the corresponding class
when offered next.
 Students whose shortage of attendance is not condoned are not eligible to take their
end examinations of that class and their registration shall stand cancelled.
C. Ragging:
Students should not involve in ragging. Ragging is uncivilized besides being an offence.
 Ragging is prohibited as per Act 26 of A.P. Legislative Assembly -1997.
 Ragging entails heavy fine and / or imprisonment.
 Ragging invokes suspension and dismissal from the college
 Outsiders are prohibited from entering the college and hostel without permission.
 Girl students must be in their hostel rooms by 6:00pm.
 Suspended students are debarred from entering the campus except when required to
attend enquiry and to submit an explanation.
 Whenever any student complains of ragging, that complaint shall be enquired into or
an enquiry will be made into the same forthwith and if the complaint is found true,
the student or students complained against shall be suspended for a period as may be
deemed necessary.

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 Students have to give an undertaking to the college that he/she will not indulge in
ragging.
 Student’s parent/guardian will also give an undertaking that he / she will see to it
that to the best of his / her son / daughter / ward will not indulge in ragging and also
comply with all the guidelines, rules and regulations concerning prevention of
ragging.
 All students should carry identity cards with them both inside and outside the
college.
 Two tiered Anti Ragging Committee has been constituted with a) HODs as
members and Principal as Chairman (High Power Committee) and b) Faculty, Staff
and senior students as members.
PROHIBITION OF RAGGING
 Ragging within or outside any Educational Institution is prohibited.
 Ragging means doing an act which causes or is likely to cause insult or annoyance or
fear or apprehension or threat or intimidation or outrange of modesty or injury to a
student.
S.N
Nature of Ragging Punishment
o.
Teasing, embarrassing and Imprisonment upto 6 months or fine up
1
humiliating to Rs.1,000/-
Assaulting or using criminal force or Imprisonment upto 1 Year or fine up up

2
criminal intimidation Rs.2000/- or both.
Wrongly restraining or confining or Imprisonment up to 2 years or fine up to

3
causing hurt Rs.5000/- or both.
Causing grievous hurt kidnapping
Imprisonment up to 5 years and fine up
4 or raping or committing unnatural
to Rs.10,000/-
offence
Imprisonment up to 10 years and fine up
5 Causing death or abetting suicide
to Rs.50,000/-
Note:
 A student convicted of any of the above offences will be dismissed from the college.
 A student imprisoned for more than six months for any of the above offences will not be
admitted in any other college.
 If a student commits suicide due to or in consequence of ragging, the person who
commits such ragging shall be deemed to have abetted such suicide.
 The full text of Act 26 is placed in the college library.

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D. Examinations:
Students are advised to refer the syllabus book given by the university to be aware of the
rules and regulations.
E. Malpractice:
Students should not indulge in any malpractice in the Internal/External examinations.
Malpractice cases are dealt as per the rules / guidelines as mentioned below by the JNT
University. A malpractice prevention committee consist the Principal, Head of the
Department of the concerned branch (to which malpractice student belongs), Officer In-
charge of Examinations and subject Teacher.
F. DSA activities
The department regularly organizes technical quiz, seminar, group discussions etc. as part of
promote curricular and extracurricular activities.

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DISCIPLINARY ACTION FOR MALPRACTICES/IMPROPER CONDUCT IN
EXAMINATIONS
Nature of Malpractices/Improper conduct Punishment
If the candidate:
1. Possesses or keeps accessible in examination hall, Expulsion from the examination hall and
(a) any paper, note book, programmable calculators, cancellation of the performance in that subject
Cell phones, pager, palm computers or any other only.
form of material concerned with or related to the
subject of the examination (theory or practical) in
which he is appearing but has not made use of
(material shall include any marks on the body of
the candidate which can be used as an aid in the
subject of the examination)
Gives assistance or guidance or receives it from Expulsion from the examination hall and
(b) any other candidate orally or by any other body cancellation of the performance in that subject
language methods or communicates through cell only of all the candidates involved. In case of
phones with any candidate or persons in or outside an outsider, he will be handed over to the
the exam hall in respect of any matter. police and a case is registered against him.
2. Has copied in the examination hall from any paper, Expulsion from the examination hall and
book, programmable calculators, palm computers cancellation of the performance in that subject
or any other form of material relevant to the subject and all other subjects the candidate has already
of the examination (theory or practical) in which appeared including practical examinations and
the candidate is appearing. project work and shall not be permitted to
appear for the remaining examinations of the
subjects of that Semester/year. The Hall Ticket
of the candidate is to be cancelled and sent to
the University.
3. Impersonates any other candidate in connection The candidate who has impersonated shall be
with the examination. expelled from examination hall. The candidate
is also debarred and forfeits the seat. The
performance of the original candidate, who has
been impersonated, shall be cancelled in all the
subjects of the examination (including
practicals and project work) already appeared
and shall not be allowed to appear for
examinations of the remaining subjects of that
semester/year. The candidate is also debarred
for two consecutive semesters from class work
and all University examinations. The
continuation of the course by the candidate is
subject to the academic regulations in
connection with forfeiture of seat. If the
imposter is an outsider, he will be handed over
to the police and a case is registered against
him.
4. Smuggles in the Answer book or additional sheet or Expulsion from the examination hall and
takes out or arranges to send out the question paper cancellation of performance in that subject and
during the examination or answer book or all the other subjects the candidate has already
additional sheet, during or after the examination. appeared including practical examinations and
project work and shall not be permitted for the
remaining examinations of the subjects of that
for two consecutive semesters from class work
29
connection with forfeiture of seat.
5. Uses objectionable, abusive or offensive language Cancellation of the performance in that
in the answer paper or in letters to the examiners or subject.
writes to the examiner requesting him to award
pass marks.
6. Refuses to obey the orders of the Chief In case of students of the college, they shall be
Superintendent/Assistant Superintendent / any expelled from examination halls and
officer on duty or misbehaves or creates cancellation of their performance in that
disturbance of any kind in and around the subject and all other subjects the candidate(s)
examination hall or organizes a walk out or has (have) already appeared and shall not be
instigates others to walk out, or threatens the permitted to appear for the remaining
officer-in charge or any person on duty in or examinations of the subjects of that
outside the examination hall of any injury to his semester/year. The candidates also are
person or to any of his relations whether by words, debarred and forfeit their seats. In case of
either spoken or written or by signs or by visible outsiders, they will be handed over to the
representation, assaults the officer-in-charge, or any police and a police case is registered against
person on duty in or outside the examination hall or them.
any of his relations, or indulges in any other act of
misconduct or mischief which result in damage to
or destruction of property in the examination hall or
any part of the College campus or engages in any
other act which in the opinion of the officer on duty
amounts to use of unfair means or misconduct or
has the tendency to disrupt the orderly conduct of
the examination.
7. Leaves the exam hall taking away answer script or Expulsion from the examination hall and
intentionally tears of the script or any part thereof cancellation of performance in that subject and
inside or outside the examination hall. all the other subjects the candidate has already
appeared including practical examinations and
for 2 consecutive semesters from class work
connection with forfeiture of seat.
8. Possess any lethal weapon or firearm in the Expulsion from the examination hall and
examination hall. cancellation of the performance in that subject
and all other subjects the candidate has already
and forfeits the seat.
9. If student of the college, who is not a candidate for Student of the colleges expulsion from the
the particular examination or any person not examination hall and cancellation of the
connected with the college indulges in any performance in that subject and all other
malpractice or improper conduct mentioned in subjects the candidate has already appeared
clause 6 to 8. including practical examinations and project
work and shall not be permitted for the

30
and forfeits the seat.
Person(s) who do not belong to the College
will be handed over to police and a police case
will be registered against them.
10. Comes in a drunken condition to the examination Expulsion from the examination hall and
hall. cancellation of the performance in that subject
and all other subjects the candidate has already
semester/year.
11. Copying detected on the basis of internal evidence, Cancellation of the performance in that subject
such as, during valuation or special scrutiny. and all other subjects the candidate has
project work of that semester/year
examinations.
12. If any malpractice is detected which is not covered

in the above clauses 1 to 11 shall be reported to the
University for further action to award suitable
punishment.

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Malpractices Identified by Squad or Special Invigilators
1. Punishments to the candidates as per the above guidelines.

2. Punishment for institutions (if the squad reports that the college is also involved in
encouraging malpractices)
(i) A show cause notice will be issued to the college.
(ii) Impose a suitable fine on the college.
(iii) Shifting the examination centre from the college to another college for a specific
period of not less than one year.
G. Computer Labs
 Students should leave their footwear outside before entering into the computer lab.
 Students should not enter the computer lab with the personal belongings, like bags etc
 Students should maintain silence and cleanliness in the computer lab.
H. Laboratories:
Procedures for Laboratories
Computer Programming Lab:

 Lab can be used in free time / lunch hours by taking prior permission from the lab in-
charge.
 Lab records need to be submitted on or before the date of submission.
 Students are not supposed to use pen drives/data cards.
 Use of computer network is encouraged.
English Language Communication Skills Lab:
 Advanced equipment in the lab for the use of student community. Students need to
maintain a proper decorum in the computer lab. Students must use the computer & head
phones with care. Any damage caused is punishable.
 Students must carry their observation books with completed exercises (activities) while
entering the lab.
 Students are supposed to occupy the machines allotted to them and the allocation is
displayed on the lab notice board.
 Students must be active in responding to the questions and to practice the exercises.
Engineering Drawing:
 All the students are required to bring drawing instruments including drawing sheets to
every class without fail. Borrowing is not allowed.
 The students are required to bring the Drawing records regularly to the class, as the
submission is on weekly basis.
 The number of problems in assignment sheet are designed in such a way that student
should complete all the problems and submit on the same day.
 All the students are required to keep a piece of paper while fixing the Drafter to the
drawing board.
 The students are required to bring the observation books to the Drawing hall.
 The students are required to occupy the seats in drawing hall according to the roll
numbers.
 In case of any problem while drawing, students are supposed to raise the hands, so that
faculty will come and clarify the doubts instead of moving around the Drawing Hall.

32
MISCELLANEOUS
 Students are expected to be punctual and regular to the lab classes and follow the lab
dress code.
 Students are expected to carry out all the experiments prescribed by the University.
 They will not be permitted to attend the end practical examinations unless they carry out
the minimum number of experiments prescribed by the University.
 They should attend the lab fully prepared, with clear concept of the theory underlying
the experiment and other experimental details with a pre-plan on how to carry out the
experiment, after consulting the lab manual.
 Observation notebooks should be neatly maintained.
 Experiments must be recorded only in the books approved by the departments / college.
 Observation notebook should be compulsorily shown to the teacher in charge of the lab
and got signed by the teacher at the end of the experiment.
 Records must be submitted as per the schedule prescribed by the teacher in charge of the
lab.
 Records must be got certified before appearing for the end examinations.
 Student should not move from one table to another.
 Student should handover the equipment to the technician in good condition before
leaving the lab.
 Students should maintain utmost cleanliness in the lab.
 Breakages / damages of equipment should be reported immediately to the lab in- charge.
 Students are advised to clear all dues to the lab before taking end practical examinations
to avoid complications at a later date.
 Laboratory session marks will be awarded on the basis of continuous evaluation.
 They should clear the work bench soon after the experiment is over.
 Waste material, if any, should not be strewn on the floor of the laboratory. Students
should use the waste material baskets kept for the purpose.
 Experiments should be carried out following all the instructions meticulously and
observing all the precautions to avoid personal injuries and damage to equipment.
I. Undertaking from Students and Parents:
Students and their parents / guardians should execute an undertaking in the prescribed
format that they shall abide by all the rules and regulations of the college. Even before
executing an undertaking, a student who has taken admission in this Institute shall be
deemed to have agreed to the rules and regulations of the Institute as given in this
handbook and also that may be framed from time to time.
J. Letters to Parents:
Parents will be communicated of the performance of their son / daughter / ward in
attendance and examinations through letters from time to time. The parents are also
contacted by HOD/ Class Mentor as and when required. The parents are expected to
keep in touch with the Class Mentor/HOD and monitor the academic progress of their
ward. In case of poor academic performance and/or attendance, the student and the
parent/guardian should promptly respond to and comply with the reports and
suggestions for improvement as and when informed.
K. Hostel:
Rules of Admission
 Students who join the hostel should pay the prescribed admission fee and caution
deposit at the time of admission.
 Admission shall be made only after clearing all the dues to the college and previous dues
(if any) to the hostel.
 Separate Identity Card will be issued to every hosteller.

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 Suspension/dismissal of a hosteller from the college will automatically result in his/her
suspension/ dismissal from the hostel.
Rules of Discipline
 Every inmate should return to the hostel by 5 P.M.
 Inmates can avail the college library facility after 6 P.M. from Monday to Saturday by
taking prior permission from the warden.
 Inmates are not allowed to leave the hostel. However, in exceptional circumstances they
may take permission from the warden if they need to go outside. Leaving the hostel
without the written permission of the warden shall be considered a violation of hostel
rules and will be dealt with a firm hand.
 All inmates must carry their college identity cards whenever they leave the hostel
premises. They will be permitted to enter the hostel only on production of the identity
card at hostel main gate.
 Parents/guardians of inmates will be allowed to visit their son / daughter / ward between
5 and 6 P.M. on all college working days and between 1 P.M. and 6 P.M on Sundays
and other college holidays. Visitors will be allowed to meet the inmates after making
required entries in the visitors register.
 No inmate will be permitted to go out with parents or local guardians without prior and
proper authorization from the warden. Any request for permission from parents to take
their son / daughter / ward out during college working hours will not be entertained.
 No inmate will be permitted to go home except during vacation with the permission of
Associate Director.
 Hostellers’ parents and first degree blood relatives who need to stay with them overnight
should first take the consent of their roommates and then the written permission of the
warden/ AD well in advance.
 Hostellers are not allowed to stay in the hostel rooms during the college timings.
 Collective gatherings of any kind are prohibited within the hostel premises.
 Hostlers should not indulge in any act or activity that is unacceptable and detrimental for
the smooth and proper running of the hostel.
 The hostel premises and buildings should be kept clean.
 Hostellers shall be held responsible for any damage caused to hostel property and the
loss to the property shall be recovered from them.
 Hostellers are prohibited from using any electronic or power consuming appliances
without permission fro
 m the warden.
VIII. TRAINING & PLACEMENT
Counseling and Career Guidance

Placement Cell encourages students to opt for higher education programs like MBA, M.Tech,
MS in India and abroad, by giving proper guidance. It also conducts and organizes career
counseling sessions, training programs, mock tests etc.
Placement Cell conducts career counseling to all students from First to Final years and
maintains their individual records. It also provides feedback to the parents about students’
aspirations and achievements. Students can contact Placement Officer for guidance.
Pre-Placement Training
GNITC Placement cell organizes pre-placement training to the students in the areas of
enhancing personality, communication skills, resume preparation, aptitude tests, group
discussion, Interview etc.

34
The college gives a lot of importance to the industry institute interaction. To achieve this, the
college organizes industrial fairs, seminars, research projects and also organizes field trips for
the benefit of the students. This initiative encourages students and also offers them a firsthand
learning experience. Placement cell is actively working and interacting with corporate
organizations to understand and analyze the skill sets required in different sectors to bridge the
gap between industrial recruitments and academics.
1 Mr.Vinay Chopra Head, Training & Placement

2 Mr.Srikanth Training and Placement Officer
IX. LIBRARY
The library has 57,600 volumes of books and 13,150 of titles. The Campus has subscribed 225
IEEE Journals/magazines and 187 Indian Journals/magazines. Reference books are also
provided in the library. Also, large number of E-Books, NPTEL and SONET CDs are available
for all subjects.
Rules & Regulations for the Central Library & Information Centre are as follows
 Student should compulsorily carry their identity cards to the Library.
 Students should enter their roll number and sign in the Gate register before entering the
Library.
 Printed matter and personal belongings such as books, bags, or any other materials
should not be carried into the Library. They should be kept on the Property Counters
provided at the entrance of the Library; if they are carried inside the Library, they will
be confiscated and treated as library property.
 Strict silence should be maintained inside the library.
 Cell phones are not allowed into the library.
 Students shall not misplace books from their positions in the racks.
 No books will be issued without producing Identity Cards.
 The student can barrow the books for a period of 14 days, failure to return the books
within the time will attract penalty as mentioned bellow:
 For first 7 days @ 1.00/- per day
 For the next 3 weeks @ 2.00/-per day
 After 4 weeks, card will be cancelled for one semester.
 The Librarian, at his discretion, may not reissue until some days the returned book to
the same student.
 Books will not be issued or renewed for the same student if there is a demand for the
book.
 Number of books to be lent – 03 per Student.
 Students must check the physical condition of the books before borrowing. The last
borrower will be held responsible for any damage or mutilation noticed at the time of
return of books.
 Borrowed books are not permitted to be taken inside the library unless they are to be
returned.
 If the borrowed book is damaged or lost, the student shall be liable. He/she shall
replace the book or pay double the value of the book immediately, along with the fine
payable.
 Reference books and periodicals are not issued.
 The Librarian may take appropriate action on any student under intimation to the
Principal, if found misbehaving in the library.

35
 The infringement of the Library rules shall make the student forfeit the privileges of
membership of the Library, in addition to the action taken as per the disciplinary rules
of the college.
Book Bank Scheme
The scheme runs on the premise that each student requires at least one textbook for each
subject throughout his/her 4 years of study. Many students buy the books from the market,
which is an expensive proposition.
The scheme involves taking reasonable discounted amount towards (for B.Tech.
students only) at the time of admission in I year, which is non refundable
Working of the Scheme
The Campus Director, Associate Director, Department Heads and faculty have carefully
chosen the best books for the maximum benefit of the students. The books thus purchased are
put in the library and issued to each student (one set) for a period of one year / semester. At the
end of the year/semester the student has to return all the books. Then next year / semester
textbooks will be issued.
Benefits to Students
a) The system of one-time payment ensures availability of best text books for each subject
throughout his/her four years of study.
b) Books are handed over to him at his/her college only.
c) The presence of textbook for all time under his possession will improve his performance
in internal and external examinations.
d) No need to spend time and money in buying books from market at higher prices and
with difficulties.
Digital Library
Digital Library consists of e-text books, ppts, lectures of IIT professors. This facility is
much useful for both students and faculty members
X. STUDENT ACTIVITIES
Fresher’s Day
The college organizes Fresher’s Day where the II year students welcome Freshers. The
Principal and Department Heads will grace the occasion. Second Year students will organize
cultural events and conduct competitions for freshers.
Annual Day
Annual Day is celebrated in a grand manner. Chief Guest is invited from Industry, R &
D Institutions or reputed Universities. Principal/Director presents the annual report of the
college for the academic year.
IGNITE (Technical Fest)
Apart from paper presentations the college has conducted other events such as Auto- Expo,
Model Presentation, Photo Shot, Treasure Hunt, and Riddle Solving and so on. This year the
college is proud to have Cultural Fest by renowned international singers and dancers. The flash
mob by our students was a big success in Hyderabad.
Felicitations
Academic prizes are given for department wise toppers in semester exams and to the
students who have secured more than 80% in Examinations. Prizes are distributed to the
winners in different activities like sports, cultural, games, circular, and co-circular events.
Sports Events

36
Outdoor events like Cricket, Foot ball, Volley ball for boys & Throw ball, Tennikoit for
girls are held. Indoor events like Chess, Table Tennis, and Caroms at College level may be held
once in every month and also for Annual Day.
Cultural Events
Competitions like Painting, T-Shirt Painting, Quiz, Rangoli and Mehendi are conducted.
Literary Events
Competitions like Essay writing, Elocution, Debate, Group discussion, Quiz, Dumb
Charades are conducted
Extra-Curricular Events
Events like painting, flower-arrangement, card-board arrangement, vegetable carving,
classroom decoration etc., are held as part of Annual Day celebrations.
Work Shops & Student Paper Presentation Contests
The College has also been very active in organizing Workshops, Student Paper Contests
like Techno Fest, and Project exhibitions like Innovations.
Student Seminars
Students are encouraged to prepare and present seminars in subjects in the scheduled
hours given in the Time Table by using LCD Projector and PowerPoint presentations.
Symposium
College organizes Symposia to encourage, inspire and challenge students by inviting
eminent personalities like renowned Academicians, Researchers, Scientists, CEOs, and
important Government Officials and Politicians.
Training
Industry-academia interaction has made our education being more industry specific, guided and
structured by different industries. The placement cell conducts short term value added courses
(like J2EE, GIS, .Net, Testing tools, embedded systems etc.) in the vacation for interested
students.
Industrial and Study Tours
Local industrial visits are arranged for II and III Year students. Outstation Industrial
tours will be permitted for final years only during the semester break.
Guest Lectures
Eminent personalities from Research, Industry and Academics are invited to enrich the
knowledge of the students with latest technology.
Professional Societies / Student Chapters
 Today’s industry and other organizations providing career opportunities look for the
following capabilities in students
 Latest knowledge in their respective fields and knowledge about related fields
 Communication skills, interactive skills and professional acquaintances
 Technical writing skills
 There are a couple of societies related to each discipline / branch where students can
become members to achieve above capabilities. These societies organize lectures,
seminars, workshops, and conferences for students and professionals. These societies
publish magazines and journals with latest knowledge, which they send to the students at
their addresses as a part of membership package. These publications are monthly /
quarterly / half-yearly and annual. It is beneficial for students to become members of
these societies.

37
S.
Branch Name of the Institution
No.
1.Computer Society of India (CSI)
2. Indian Society for Technical Education (ISTE)
1 CSE 3. Institute of Electrical and Electronics Engineers (IEEE)
4. Institution of Engineers India (IE)
1.Computer Society of India (CSI)
2 IT
3. Institute of Electrical and Electronics Engineers (IEEE)
1. Institute of Electronics and Telecommunication Engineers (IETE)
2.Indian Society for Technical Education (ISTE)
3 ECE
3.Institute of Electrical and Electronics Engineers (IEEE)
4.Institution of Engineers India (IE)
1. Institution of Engineers (IE)
4 EEE 2. Indian Society for Technical Education (ISTE)
1. Institution of Engineers (IE)
5 ME 3. Society of Automobile Engineering (SAE)
4. Mechanical Engineering Association (MEA)
6. AE 2. Aeronautical Society of India (ASI)
2. Civil Engineering Students Association (CESA)
7. CE
3. Help In Time Association (HITA)
1. Acoustical Society of India – Hyderabad Chapter (ASI-H)
8. H&S
2. Andhra Pradesh Society for Mathematical Sciences(APSMS)
9 Pharmacy Indian Pharmaceutical Association (Student Forum)
NSS:
NSS Unit was started at this college on 02.09.2002 under the approval of JNTU.
Programmes being conducted are
 Blood Donation Camp
 Aids Awareness Camp
 Village Survey
 Free Medical Camp
 Hygiene & Cleanliness Awareness Program in nearby villages etc.
 Save Water and Trees
 Tree Plantation
Alumni Association:
College maintains a database of all students’ recruitments, higher studies abroad and in Indian
Universities through regular interaction over E mail, Social Networking and Group mailing etc.
The college conducts an alumni meet in even semester every year.

38
XI. CONTACT INFORMATION
Contact Information:
Website Address : http://www.gniindia.org
E-mail : [email protected]
Phone Number : 08414 or 958414 – 202120/21
For any administrative problems and information, please contact:

General Manager (Admn) Col. Rajesh ( Retd) 8096611000
Asst. Manager (Admin) Mr. V.K.Chary 8096609815
Asst. Administrative Officer Mr. J.VenkataSwamy 8886094170
Boys Hostel Warden Mr. L B Ray 8096609838
Girls Hostel Warden Mrs.Satyavani 8096971767
GNITC (please disturb only if urgent)

Designation Name Mobile No.
Director Dr. M. Ramalinga Reddy 8497900081
Associate Director Prof. P. Parthasarathy 8096175678
Associate Director Prof. R.K.Singh 8096185678
Associate Director Dr.RishiSayal 8096609846
Dean (R&D) Dr. S.V. Renga Nayakalu 8096609824
Dean Academics Dr. K. Chanthirasekaran 8498055718
Dean Students’ Welfare Dr. Srinivas Reddy 8498056997
Dean (ME) & HOD, ME 1 Dr. Shangaranarayanan 8096609816
HOD,ME-2 Dr. A. Raj kumar 9948849578
H.O.D, H&S Dr.G. Anjaneyulu 8497900082
HOD, Civil Engineering Prof. Vijaya Lakshmi 8497900083
HOD, CSE Dr. J. Rajeshwar 9948442288
HOD-CSE-2 Mr.Devashekar 9704084121
S.P.Yadav 8096609843
HOD - ECE
Prof. S. Maheswara Reddy 8096609842
HOD, EEE Dr.P.V.Kishore 8096609840
HOD, IT Dr. Thariq Hussain 8096215678
Dean- ECE & Dean- Foreign
Dr. Pamela Chawla 8096609840
Affairs

39
XII. COMMITTEES
Various Committees have been constituted to streamline the administration of the entire
institution. These committees, in consultation with the Principal, plan and execute various
programs for the smooth functioning and the general development of the institution. Committee
members are drawn from both the teacher and student community. Student members are
nominated by the respective Department Heads based on academic record of the students. The
following committees have been constituted for the ongoing academic year:
COMMITTEE
1 Anti-Ragging Committee 2 Discipline Committee 3 Academic Audit

Committee
4 Library Committee 5 Transport Committee 6 Canteen Committee
7 Sports Committee 8 NSS cell 9 EDC Cell
Grievance
Women’s Empowerment Professional Active
10 11 12 &Students
Committee Committee
Redressal Committee
Staff Grievance redressal Internal Quality
13 14 15 Sports Committee
Committee Assurance Committee
Entrepreneurship
Career Guidance
16 Library Committee 17 18 Development
Committee
Committee

40
XIII. MENTORS
Name of the Phone

S.No Year Section Email Id
Mentor Number
1 D. Naresh 9885248584
1 [email protected]
2 Md.Anees 8179288173
3 G Santhosh Kumar 9704132133
2 [email protected]
4 C.Narasimulu 9849825884
5 N.Ramya Teja 8978399446
3 [email protected]
6 K.Krishna Kumar 9985565141
7 II A.V.Rameswar Rao 9603905552
4 [email protected]
8 K.Nadiya 9100949866
9 L.Shiva 9666761578
5 [email protected]
10 J.Sravanthi 9966767921
11 B.Anitha 8374659596
6 [email protected]
12 M.Nagamani 9553689594
13 K.Shashidar 9949384014
1 [email protected]
14 C.Sailaja 9949489883
15 Dr.Harpreeth Kaur 8427009807
2 [email protected]
16 Simerpreet Kaur 9000072769
17 NVS Murthy 9701196375
3 [email protected]
18 Dr. Kushboo Pachori 7661081018
19 III Ramyasree 9491052851
4 Srinivas Nanda/ 9014762142/ [email protected]
20
T Arun Prasad 9949146105
21 O.Ravinder 7386911366
5 [email protected]
22 U.Shivanna 7382106357
23 S.Swetha 9603234508
6 [email protected]
24 T.Janardhan Rao 9848853342
25 B.Aruna 9966485866
1 [email protected]
26 Abhi.K.V 7675044488
27 P.Sharvya 9963114183
2 [email protected]
28 G.Kiranmayee 9133262017
29 K.Raju 8187822300
3 [email protected]
30 V.Rajesh 9908221715
IV Shaik Noor
31 7729843784
4 Mahammad [email protected]
32 A.Vinisha 8885768980
33 K.Srinivas 9000618498
5 [email protected]
34 Sai Babu 9581578068
35 S.Aparna 7416116679
6 [email protected]
36 Gopinath 9640640086

41
XIV. GNI ACADEMIC CALENDER

42
DEPARTMENT INFORMATION
(Syllabus, PEOs, POs, CEOs, COs, Teaching Schedules & Assignments Etc)
I. Vision, Mission & Quality Policy
The Vision of the Electronics and Communication Engineering Department is:
To be a premier Department of Electronics & Communication Engineering in the

region.
The Mission of the Electronics and Communication Engineering Department is:

1. Nurture young individuals into knowledgeable, skillful and ethical professionals in their
pursuit of Electronics and Communication Engineering.
2. Nurture the faculty and expose them to world-class infrastructure.
3. Sustain high performance by excellence in teaching, research and innovations.
4. Extensive partnerships and collaborations with Foreign Universities for technology up
gradation.
5. Develop Industry-Interaction for innovation and product development.
The Quality policy of the Electronics and Communication Engineering Department is:
We, at GNITC are committed to ensure high standards to educate enrich and excel, in imparting
professional education, by top quality – faculty who endeavor to mould the students into quality
professionals through teamwork innovation and research.
II. ABOUT DEPARTMENT

ECE Department of GNITC is flagship academic organ staffed by experienced, highly qualified
and dedicated faculty team. This Department focuses on imparting quality education so that the
pass-outs are competent and readily employable. There are constant efforts in this department to
mould the students to fit into global competitive scenario.
Besides focusing on robust fundamentals of the ECE, this department also endeavors to train the
students in communication and soft skills by a strict insistence on seminar presentations right
from the first year. More than 85% of eligible students are placed into various organizations
during the academic year 2018-19. The Department conducts short term advanced courses in the
fields of LAB View, MATLAB, and VHDL & Verilog, also in latest topics.
The Department excels in VLSI and Embedded Systems, Microwave Engineering and Signal
Processing and therefore undertakes research and consultancy in these areas. The Department
conducted International Conferences entitled, ICIECE-2012, ICIECE-2013, ICIECE-2014,
ICIECE-2015, ICIECE-2016, ICIECE-2017 and ICIECE-2018.
The Dept. is also equipped with excellent infrastructure and state-of-the-art equipment to explore
technological advancements in the relevant fields. The Department has sufficient labs equipped
and software required. The Department is strengthening the Embedded Systems Lab leading to
projects and consultancy.

43
HIGHLIGHTS:
 Teaching methodology involves technical case studies, creative exercises, online assignments
& descriptive tests.
 E-Class rooms
 Industry focused knowledge is imparted by R & D and Industry peer members.
 Digital Library
 Tie up with MNC companies and Foreign Universities.
 State-of-art laboratories, sophisticated equipment and advanced software.
 Library is equipped with National and International Journals, 50000 volumes and more than
7500 titles of books, NPTEL, SONET CDs and internet lab for students and staff.
 IEEE Online Journals and IEL Online journals through AICTE INDEST CONSORTIUM.
 Wi-Fi campus with 12 Mbps bandwidth.
 Oracle, Microsoft Development Suite, Microsoft Academic License for Microsoft Software
Products, MAT LAB, PSPICE, VHDL, TINAPRO and DSP softwares are available.
 State of art English Language Lab and 800 computers connected with dedicated high-end
servers.
 Scholarship and free books for meritorious students.
 Book Bank Scheme facility to the students.
 A new and unique Laptop lab with latest configuration. Most of the classrooms are fixed
with LCDs and screens.
 All major Professional Societies Student Chapters like ISTE, SAE, CSI, IETE and IEEE etc.
FACULTY
The faculty in the Department consists of Senior and well experienced Professors, Associate
Professors and Assistant Professors with Ph. D. / M. Tech qualifications. An experienced
System Administrator and well-qualified Lab staff support the conduct of Laboratories
III. PEO’s, PO’s, MAPPING

PROGRAM ME EDUCATIONAL OBJECTIVES:
We, at GNITC are committed to ensure higher standards to educate, enrich & excel in imparting
professional education by top quality faculty members, endeavor to mould the students into
quality professionals through teamwork and research orientation.
PEO1. Graduates shall have the ability to apply knowledge across the disciplines and in emerging
areas of Electronics and Communications Engineering for higher studies, research, employability and
handle the realistic problems.
PEO2. Graduates shall have good communication skills, possess ethical conduct, sense of
responsibility to serve the society, and protect the environment.
PEO3. Graduates shall have strong foundation in academic excellence, soft skills, managerial skills,
leadership qualities and understand the need for lifelong learning for a successful professional career.

44
PROGRAMME OUTCOMES
The following list of program outcomes describes what graduates are expected to know and be
able to do at the time of graduation. Graduates at graduation will have:
1. An ability to apply knowledge of Mathematics, Science and Engineering.

2. An ability to design and conduct experiments, as well as to analyze and interpret data.
3. An ability to design a system, component, or process to meet desired needs within realistic
constraints such as economic, environmental, social, political, ethical, health and safety,
manufacturability, and sustainability.
4. An ability to function on multidisciplinary teams.
5. An ability to identify, formulate and solve Engineering problems.
6. An understanding of professional and ethical responsibility.
7. An ability to communicate effectively.
8. The broad education necessary to understand the impact of Engineering solutions in a global,
economic, environmental and societal context.
9. A need for recognition and an ability to engage in life-long learning.
10.Knowledge of contemporary issues.
11.An ability to use the techniques, skills, and modern engineering tools necessary for Engineering
practice.
12.An in depth ability to use a combination of software, hardware and experimental techniques practiced
in Circuits, Physical Electronics, Communication, Networks, Systems and Programming.
MAPPING of PEO’s and PO’s:
Programme Progrmme Outcomes

Educational Objectives 1 2 3 4 5 6 7 8 9 10 11 12
PEO 1 √ √ √ √
PEO 2 √ √ √ √ √ √
PEO 3 √ √ √ √ √ √ √ √ √ √

45
1.(EC00741) MICROWAVE ENGINEERING
SYLLABUS COPY :
UNIT I: MICROWAVE TRANSMISSION LINES -I: Introduction, Microwave Spectrum and Bands,
Applications of Microwaves. Rectangular Waveguides-Solution of Wave equations in rectangular coordinates,
TE/TM mode analysis, Expressions for Fields, Characteristic Equation and Cutoff Frequencies, Filter
Characteristics, Dominant and Degenerate Modes, Sketches of TE and TM mode fields in the cross-section, Mode
Characteristics Phase and Group Velocities, Wave lengths and Impedance Relations, Illustrative Problems.
RECTANGULAR GUIDES: Power Transmission and Power losses, Impossibility of TEM Mode, Micro strip
Lines- Introduction, Z0 relations, Effective dielectric constant, Losses, Q factor.
UNIT II: CAVITY RESONATORS: Introduction, rectangular cavities, dominant modes and resonant
frequencies, Q Factor and Coupling coefficients, Illustrative problems.
WAVE GUIDE COMPONENTS AND APPLICATIONS: Coupling Mechanisms: Probe, Loop, Aperture types,
Waveguide Discontinuities-Waveguide windows, tuning screws and posts, matched loads. Waveguide Attenuators
– Different types, Resistive card and Rotary Vane Attenuators; Waveguide phase Shifters- Types, Dielectric and
Rotary Vane phase shifters, Waveguide Multiport Junctions: E plane and H plane Tees, Magic Tee, hybrid Ring:
Directional Coupler- 2 hole, Bethe hole types, Illustrative Problems.
Ferrites- Composition and characteristics, Faraday rotation, Ferrite Components- Gyrator, Isolator, Circulator.
UNIT III: MICROWAVE TUBES: Limitations and Losses of conventional tubes at microwave frequencies.
Microwave tubes: O type and M type classifications. O type tube: 2 Cavity Klystrons Structure Reentrant Cavities,
Velocity Modulation Process and Applegate Diagram, Bunching Process and Small Signal Theory Expressions for
O/P Power and Efficiency. Reflex Klystrons –Structure, velocity modulation and Applegate diagram, Mathematical
Theory of Bunching, Power Output, Efficiency, Oscillating modes and O/P characteristics, effect of repeller
voltage on power O/P, Illustrative problems.
Helix TWT: Significance, Types and Characteristics of slow wave structures; structure of TWT and amplification
process, suppression of oscillations gain consideration.
UNIT IV: M-TYPE TUBES: Introduction, cross filed effects, Magnetrons- Different types, Cylindrical Travelling
wave magnetron- Hull cut-off and Hartree conditions, Modes of resonance and PI- Mode operation, separation of
PI- Mode, O/P characteristics, Illustrative problems.
MICROWAVE SOLID STATE DEVICES: Introduction, Classification, Applications, TEDs, Introduction, Gunn
Diode Principle, RWH Theory, Characteristics, Basic Modes of Operation, Gunn Oscillation modes, LSA mode,
Introduction to Avalanche Transit Time Devices, IMPATT and TRAPATT Diodes Principle of Operation and
Characteristics.
UNITV : MICROWAVE MEASUREMENTS: Scattering Matrix- significance, formulation and properties, S

Matrix calculations for -2 Port junctions, E Plane and H plane Tees, Magic Tee, Circulator and Isolator, Illustrative
Problems. Description of Microwave
Bench Different Blocks and their features, Precautions; Microwave Power Measurement Bolometer Method.
Measurement of Attenuation, Frequency, VSWR, Cavity Q. Impedance Measurement.
Text Books :
1. Microwave Devices and Circuits – Samuel Y. Liao, PHI, 3rd Edition,1994.
2. Microwave Principles – Herbert J. Reich, J.G. Skalnik, P.F. Ordung and H.L.
Krauss, CBS Publishers and Distributors, New Delhi, 2004.
References :
1. Microwave Engineering – Annapurna Das, Sisir K. Das, TMH publications
2. Microwave Engineering – David M. Pozar Wiley Publications
3. Foundations for Microwave Engineering – R.E. Collin, IEEE Press, John Wiley,
2nd Edition, 2002.
Microwave and Radar Engineering – M. Kulkarni, Umesh Publications, 1998.

46
Consolidated Unit Wise Lesson Plan
Book 1 Microwave Devices and Circuits – Samuel Y. Liao, PHI, 3rd Edition,1994.
Microwave Principles – Herbert J. Reich, J.G. Skalnik, P.F. Ordung and H.L. Krauss, CBS
Book 2
Publishers and Distributors, New Delhi, 2004.
Book 3 Microwave Engineering – Annapurna Das, Sisir K. Das, TMH publications
Book 4 Microwave Engineering – David M. Pozar Wiley Publications

Reference Books
Foundations for Microwave Engineering – R.E. Collin, IEEE Press, John Wiley, 2nd Edition,
Book 5 2002.
Book 6 Microwave and Radar Engineering – M. Kulkarni, Umesh Publications, 1998.
Chapters No of
Unit Topic
BOOKS Classes
I MICROWAVE TRANSMISSION LINES – I 1,2,3 14
CAVITY RESONATORS, WAVEGUIDE

II COMPONENTS AND APPLICATIONS 4,5 10
III MICROWAVE TUBES , HELIX TWTS 6,7 14
M-TYPE TUBES, MICROWAVE SOLID STATE

IV DEVICES 7,8 10
V
MICROWAVE MEASUREMENTS 9 7
Contact classes for syllabus coverage 55

Tutorial Classes 10
Special Descriptive Tests 02
Lectures beyond syllabus 03
Remedial /NPTEL Classes 04
Total Classes 74

47
Question Bank with Blooms Taxonomy Level (BTL)
Subject Name with code :MWE (EC0741) Class : IV/ECE/ISEM
Name of the Faculty Member :RAJESH/RAJA RAO/GOPINATH Academic Year :
2019-20 (I semester)
Blooms Taxonomy Levels (BTL)
1. Remembering
2. Understanding
3. Applying
4. Analyzing
5. Evaluating
6. Creating
Sl.No. Questions BTL Course
(Select Questions from University question Bank and mention level Outcome
year in bracket or you may give own standard question with (Please (Please
(new) in bracket) mention mention
L1 or L2 CO1 or
or etc...) CO2
etc…)
Part - A
Unit - I
1 Define dominate and degenerative modes of Waveguide. L1 CO 1

March’17(R13)
2 Calculate the group and phase velocities for angle of incidence L5 CO 1
of 33 degree?Dec’16(R13)
3 Explain how the excitation of modes done in rectangular L2,L5 CO 1
waveguides? Dec’16(R13)
4 Mention the applications of wave guide(Nov/Dec 2017)R13 L3 CO 1
5 Write a short notes on power transmission and power losses in L1 CO 1

rectangular wave guide(Nov/Dec 2017)R13
6 Why TEM mode is not possible in rectangular waveguide? L2,L4 CO 1
(Nov/Dec 2018)R15
7 A rectangular wave guide has the following values l = 2.54cm , L5 CO 1
b= 1.27cm and thickness=0.00127cm then calculate the cut off
frequency? (Nov/Dec 2018)R15
8 Which is the dominant mode in circular waveguide? L1
March’17(R13)
Unit-2
1 What is post and what is the application of it? March’17(R13) L3 CO 2
2 Write the equation of Q factor of Microstrip Line? L1,L5 CO 2

March’17(R13)

48
3 What is Q factor? Dec’16(R13) L1 CO 2
4 Write short notes on waveguide irises? Dec’16(R13) L3,L1 CO 2
5 list out various functions of various wave guide components L1 CO 2

and their applications(Nov/Dec 2017)R13
6 explain any one application of magic tee(Nov/Dec 2017)R13 L3 CO 2
7 What magic is associated with Magic Tee? (Nov/Dec L2 CO 2

2018)R15
8 A 20 dB coupler has directivity of 30 dB then what is L5 CO 2

isolation? (Nov/Dec 2018)R15
UNIT-3
1 Compare O-type and M-type tubes. March’17(R13)? L2 CO 3
2 What are the limitations of conventional tubes at microwave L2,L4 CO 3

frequencies? Dec’16(R13) March’17(R13)?
3 What is the principle of working of backward wave oscillator? L2,L6 CO 3
Dec’16(R13)
4 classify micro wave tubes(Nov/Dec 2017)R13 L4 CO 3
5 differentiate two cavity and reflex klystron(Nov/Dec 2017)R13 L4 CO 3
6 What is slow wave structure? (Nov/Dec 2018)R15 L1 CO 3
7 How oscillations are prevented in a travelling wave tube? L2,L4 CO 3

(Nov/Dec 2018)R15
UNIT-4
1 How pi-mode is separated in Magnetron? March’17(R13 L2 CO 4
2 How LSA mode of Gunn diode is used to produce oscillations? L2,L4 CO 4

March’17(R13)
3 What are the disadvantages of strapping? Dec’16(R13) L1,L2 CO 4
4 A magnetron has a cathode radius of 2.5mm and anode radius L5 CO 4

of 5mm what is the cutoff potential if 0.27Wb/meter square
magnetic field is applied? Dec’16(R13)
5 Explain RWH theory(Nov/Dec 2017)R13 L2,L4 CO 4
6 Mention the application of TED’s(Nov/Dec 2017 L1,L4 CO 4

49
7 Write down the different types of magnetrons? (Nov/Dec L1 CO 4
2018)R15
8 What are the Hull cot off and Hartree conditions? (Nov/Dec L5 CO 4
2018)R15
UNIT-5
1 Why S-parameters are needed in Microwave frequencies? L1,L2 CO 5

March’17(R13) Dec’16(R13)
2 Why an isolator is needed in Microwave bench? March’17(R13) L4 CO 5
3 What is Q of a cavity resonator? Dec’16(R13) L5 CO 5
4 Explain the significance of scattering matrix(Nov/Dec L1,L4 CO 5

2017)R13
5 What is the need for isolator in MW measure ment where it is L2 CO 5
placed(Nov/Dec 2017)R13
6 Define scattering matrix? (Nov/Dec 2018)R15 L1 CO 5
7 What is VSWR meter and how will you determine VSWR? L1,L5 CO 5
(Nov/Dec 2018)R15
PART-B
UNIT-1
1 A wave of frequency of 6GHz is propagated in a parallel plane L5,L6 CO 1

waveguide separated b 3cm. Calculate cut off wavelength fo
dominant mode, wavelength in waveguide, goup and phase
velocities, characteristic wave impedance Dec’16(R13)
2 Enumerate the basic advantage,disadvantages and applications L1,L4 CO 1
of microwave engineering march’16(R09)
3 Derive the expression march’16(R09) L2,L5 CO 1
4 Design a rectangular waveguide so that cut off frequency for L5 CO 1

TE10 mode is 14 GHz and cutoff frequency for TM11 mode is
3 GHz. ) may/june’15(R09)
5 explain why TEM mode does not exit in circular wave L2,L4 CO 1
guide(Nov/Dec 2017)R13
6 what is the significane of Q in resonant circuits. Derive a L2,L4 CO 1
general expression Q for a series resonator circuit.what
happens to Q when circuit is loaded(Nov/Dec 2017)R13
7 Show that TM 01 and TM10 modes are not exit in rectangular L5 CO 1
wave guide(Nov/Dec 2017)R13
8 A rectangular wave guide with dimensions of 8*4cm operates L5 CO 1
in the TM mode at 10ghz.determine the characteristic wave
impedance (Nov/Dec 2017)R13
9 Explain the wave impedance of a rectangular wave guide and L1,L2 CO 1
derive the expression for it for TE,TM, TEM modes?
(Nov/Dec 2018)R15

50
10 A rectangular wave guide has the following values a = 5.1 cm , L5,L6 CO 1
b= 2.4 cm.
i. calculate the cut off frequency of dominant mode?
ii. Calculate the lowest frequency and determine the
mode closest to the dominant mode? (Nov/Dec
2018)R15
11 Derive the characteristic impedance of a microstrip line? L5 CO 1
(Nov/Dec 2018)R15
12 Determine the impedance of rectangular waveguide in TE and L4,L5 CO 1
TM modes. March’17(R13)
UNIT-2
1 For a directional coupler , incident power is 550mW. Calculate L5 CO 2

the power in the main and auxillay arm. The coupling factor is
30 dB. Dec’16(R13)
2 Explain any two methods of directional coupler. L1,L2 CO 2
March’16(09)
3 Explain different types of microwave T junctions. L4 CO 2
March’16(09)
4 Explain the action of isolator, gyrator and circulator using L2,L4 CO 2
ferrites. Mention applicatons.draw suitable diagrams.
March’16(09)
5 Explain the working of dielectric phase shifter with neat L2,L4 CO 2
diagram may/june 15(R09)
6 what is a cavity resonator .discuss the applications cavity L1,L4 CO 2
resonator(Nov/Dec 2017)R13
7 derive the expression for Q factor of cavity resonator(Nov/Dec L5 CO 2
2017)R13
8 write a short notes on i)wave guide phase shifter L2 CO 2
ii)hybrid ring(Nov/Dec 2017)R13
9 Incident power to a directional coupler is 80 watts. The L5,L6 CO 2
directional coupler has coupling factor of 20 dB. Directivity of
30 dB and insertion loss of 0.5 dB. Find the out put power at i.
main arm ii. coupled and iii. Isolated ports(Nov/Dec
2018)R15
10 Explain faraday rotation with a neat diagram. Explain the L1,L2 CO 2
working principle of ferrite isolator? (Nov/Dec 2018)R15
11 Explain the functionality of rotary wane attenuator? (Nov/Dec L3 CO 2
2018)R15
12 A 30 dB directional coupler is used to sample incident and L5,L6 CO 2
reflected power in a wave guide. The value of VSWR is 2, and
the coupler sampling power =4.5mW. What is the value of
reflected power? (Nov/Dec 2018)R15
UNIT-3
1 A microstrip line is made of a copper conductor has 0.362mm L5,L6 CO 3

width on a G-10 fiber glass-epoxy board which is 0.30mm in
height. The relative dielectric constant r of the board material
measured at 30GHz is 5.2. The microstrip line of 0.028mm
thickness is used for 15GHz. Assume the conductivity of
51
copper is 5.96x107 mho/cm. Determine the parameters given
below: June’15(R13)
i) Characteristic impedance Zo of the microstrip line.
ii) Surface resistivity Rs of the copper conductor.
iii) Conductor attenuation constant αc
iv) Quality factor Qc
2 What are the limitations of conventional tubes at microwave L1,L2 CO 3
frequencies? Explain how these limitations can be overcome?
June’15(R13)
3 A reflex klystron having an accelerated field of 300V oscillates L5 CO 3
at a frequency of 10 GHz with a retarding field of 500V. If its
cavity is returned to 9 GHz, what should be the new value of
the retarding field for oscillations in the same mode to take
place? June’15(R13)
4 What are slow wave structures? Explain how a helical TWT L1,L2 CO 3
achieves amplification. June’15(R13)
5 Draw the mode curves of reflex klystron and derive the L1 CO 3
relation ship between mode number and repeller in reflex
klytron(Nov/Dec 2017)R13
6 In a two cavity reflex klystron are input power =10mw,voltage L5,L6 CO 3
gain=20 db,r of input cavity=25kΩ,Rsh of out put
cavity=35kΩ,load resistance=40KΩ. INPUT voltage and
output voltageand power to load(Nov/Dec 2017)R13
7 Explain the significance of slow wave wave structure in the L1,L2 CO 3
amplification process.
List out then major difference between TWT and
klystron(Nov/Dec 2017)R13
8 Explain how amplification takes place in helix TWT(Nov/Dec L4 CO 3
2017)R13
9 Explain the electronic and mechanical tuning of reflex L2,L4 CO 3
klystron? (Nov/Dec 2018)R15
10 A TWT operates under following parameters: Beam voltage: L5 CO 3
vo=3 KV, beam current Io= 200mA , characteristic imp of
helix = 10, circuit length N= 50mand frequency f= 10 G Hz.
Determine i. Gain parameter ii. Output power gain iii. All
four propagation constants? (Nov/Dec 2018)R15
11 Explain how a helical TWT achieve amplification? (Nov/Dec L2,L4 CO 3
2018)R15
12 An O-type TWT operates at 2 GHz. The slow wave structure L5 CO 3
has a pitch angle of 4.40 and attenuation constant of 2 Np/m.
Determine the propagation constant of the TWT? (Nov/Dec
2018)R15
UNIT-4
1 What is meant by avalanche transit time devices ?explain the L1,L4 CO 4
operation ,construction and applications of TRAPATT
2 What are slow wave structures ?explain how a helical TWT L4 CO 4
achieves amplification. May/june’15(R09)
3 a circular magnetron has the following parameters :cathode L5 CO 4
radius is 2mm and anode radius is 4mm.detemone the hull cut-
off voltage if the magnetic flux density is 0.3wb/m2 and cut-off
magnetic flux density if v0=15v. May/june’15(R09)
52
4 what are avalanche transit time devices ?explain the schematic L2,L4 CO 4
and working of TRAPATT diode .use necessary voltage and
current wave forms .indicate typical values of power output
and efficiency. May/june’15(R09)
5 Explain how amplification takes place in helix TWT(Nov/Dec L2,L4 CO 4
2017)R13
6 List and explain different types of magnetrons(Nov/Dec L4 CO 4
2017)R13
7 With a neat sketch explain the structure and principle of L2,L4 CO 4
operation of TWT amplifier(Nov/Dec 2017)R13
8 How is bunching achived in a cavity magnetron L2 CO 4
.explain(Nov/Dec 2017)R13
9 A magnetron operates with following parameters: Vo=25kv, L5 CO 4
Io=1.25A, Bo=0.4 wb/m2, diameter of the cathode= 8cm,
radius of vane dge to center = 8cm. Find the cyclotron
frequency and cutoff voltage? (Nov/Dec 2018)R15
10 Explain the construction of Gunn diode using RWH theory? L1,L4 CO 4
(Nov/Dec 2018)R15
11 Differentiate between TEDs and transistors? (Nov/Dec L4 CO 4
2018)R15
12 Explain the pi mode operation of magnetron? (Nov/Dec L1,L4 CO 4
2018)R15
UNIT-5
1 Calculate the SWR of a transmission system operating at L5 CO 5

8GHz .TE10 mode is propagating through the waveguide of
dimensions 3.5 and 2.1cm respectively, the distance between 2
successive minima is 1mm? May/June’15(R09)
2 Explain the RF substitution method of measurement of L2,L3 CO 5
attenuation
3 Draw the structure of magic tee and write its characteristics L1,L2 CO 5
and also derive its S-matrix.Dec’14(09) March’17(R13)
4 Explain how a slot section is used to measure the frequency of L1,L4 CO 5
a given microwave signal.
March’17(R13)
5 Give the measurement procedure for measuring Q factor of L5,L2 CO 5
resonant cavity(Nov/Dec 2017)R13
6 Define VSWR .describe the methods for measuring high and L2,L1 CO 5
low VSWR(Nov/Dec 2017)R13
7 Explain the procure for measuring VSWR(Nov/Dec 2017)R13 L1,L2 CO 5
8 Explain the procedure for measuring attenuation with a L2 CO 5

diagram(Nov/Dec 2017)R13
9 Find the S matrix of Isolator? (Nov/Dec 2018)R15 L5,L6 CO 5
10 For the given scattering parameters for a two port network L5,L6 CO 5
calculate the equivalent impedance parameters if the
characteristic impedance is 50Ω.
S11=0.4+j0.7 S12= S21= J0.6 S22= 0.3-J0.8(Nov/Dec
2018)R15

53
11 Calculate the SWR of a transmission system operating at 8 G L5 CO 5
Hz. Assume TE10 wave transmission inside a waveguide of
dimensions a= 3.5 cm b= 2.1 cm. The distance measured
between twice minimum power points is 1mm on a slotted
line? (Nov/Dec 2018)R15
12 Explain how low power is measured using Bolometer L1,L2 CO 5
technique? (Nov/Dec 2018)R15
SOLUTIONS
PART A
UNIT I
Sol-1) Dominant Mode: In a waveguide that can support more than one propagation
mode, the mode that propagates with the minimum degradation, i.e. , the mode with the
lowest cutoff frequency. Dominant mode for rectangular waveguides is TE10 and TE11
for circular waveguides.
Degenerative mode: In a waveguide when two or more modes have the same cut off
frequency then they are said to be degenerate modes. In a rectangular waveguide the
TEmn and TMmn with m ≠ 0 and n ≠ 0 are degenerate modes.
Sol-2) Dominant mode in circular waveguide is TE11
Sol-3) Phase velocity for angle of incidence at 33 is given by ω/β.Similarly group

velocity is given by dω/dβ.
Sol-4) Excitation of modes in a rectangular waveguides is done with the help of

microwave tubes. The examples of microwave tubes are Reflex klystron, two cavity
klystron , TWT, magnetron.
Sol-5) Applications of waveguides:
1)It supports transmission of EM waves with less amount of losses.
2) These components have lower insertion loss.

54
Sol-6) The power transmitted through a waveguide and the power loss in the guide can
be calculated by means of complex pointing theorem
Ptr= ʃ1/2 (E*H). Ds
Losses in a waveguide can be due to attenuation below cut-off freq. At freq

below the cut off frequency (f<fc), the propagation constant will have only the
attenuation term which is given by
α= 54.6/λc 1 − 2
UNIT II
Sol-1) Posts in waveguides consist of an aperture or break in the waveguide through

which the electromagnetic waves can pass. The bounded plane through which the wave
passes is the definition of the port. Applications – All microwave passive components
e.g directional coupler, isolator etc.
Sol-2) Quality factor of a microstrip line is given as
Qu = ω
Overall quality factor is given as = + +
Where Qc , Qd and Qr are conductor, dielectric and radiation losses.

п п
Qc= , Qd=
Sol-3) Qu= ω
Sol-4)waveguide irises: Any suspectance appearing across the guide, causing mismatch
needs to be cancelled by introducing another suspectance of the same magnitude but of
opposite nature. For this purpose waveguide irises are used. They are inductive,
capacitive , parallel resonant, series resonant wavegide irises
Sol-5) Microwave components are important part of a microwave system, which help in
the desired transmission of microwave signal. They are Rectangular waveguides,
circular waveguides, cavity resonators, waveguide junctions(E,H,EH), posts and screws,
directional couplers, ferrite devices(gyrator, isolator, circulator), phase shifters,
attenuators.

55
Sol-6) Application of Magic Tee:
1) Measurement of impedance
2) It acts a mixer.
3) It acts a duplexer.
UNIT III
Sol-1,4) Microwave tubes are classified as O-type tubes and M-type tubes.
O-type tubes:
1. These are linear beam tubes, i.e. the magnetic field is in parallel with the d.c. electric
field.
2. In these tubes, electrtons receive potential energy from the d.c. beam voltage before
they arrive in the microwave interaction region this energy is converted into their kinetic
energy. e.g. Klyston, Helix TWT and BWA, BWO etc.
M-type tubes:
1. These are cross field devices i.e. the d.c. magnetic field and the d.c. electric field are
perpendicular to each other.
2. In these tubes, the electrons emitted by the cathode are accelerated by the electric
field and gain velocity but the greater their velocity, the more their path is bent by the
magnetic field.
e.g. magnetron, FWCFA, Dematron, Gyrotrons etc.
Sol-2)There are six limitations as below. 1. Inter electrode capacitances. 2. Lead

inductances. 3. Transit time. 4. RF loses effect. 5. Gain bandwidth limitations. 6.
Radiations losses.
Sol-3) principle of backward wave oscillator: these are broad band devices in which
interaction space is extended and the electron beam exchanges energy with the RF wave
over the full length of the tube.
Sol-5) Two cavity Klystron: two cavities are present, frequency of operation upto 100
GHz, theoretical efficiency 58%, used as radar transmitters
Reflex klystron: Single cavity is present, frequency of operation upto 200 GHz,
theoretical efficiency 23%, used as radar receivers.
UNIT IV
Sol-1
Pi mode ( n=4)

56
For an eight- cavity magnetron, the n=4 mode is the pi-mode and has the electric- field
pattern in interaction space (the space between cathode and anode where electrons and
fields interact) is shown in above figure.
Sol-2
A mode of operation of a Gunn diode in which the frequency of operation is set by a
resonant circuit to be much higher than the transit-time frequency so that domains have
insufficient time to form while the field is above threshold and, as a result, the sample is
maintained in the negative conductance state during a large fraction of the voltage cycle.
Abbreviated as LSA mode.
Sol-3) disadvantages of strapping: it helps in achieving only dominant modes. It also
causes power loss because of which efficiency comes down
Sol-4) r= 2.5mm , R=5mm, B=0.27 Wb/m2
V=B/R-r =4.86 V
Sol-5) RWH theory: Gunn effect can be explained on the basis of two valley theory of
Ridley Watkins-Hilsum (RWH) theory or the transferred electron mechanism. It
involves the operation of bulk n-type GaAs devices , transferring of electrons from
lower conduction valley to upper conduction valley.
Sol-6) Applications of TED: Amplification, detection, down conversion,up conversion,
modulation, switching, limiting, power generation, phase shifting etc
.
UNIT V
Sol-1,4) At high microwave frequencies, it is difficult to implement short circuit and

open circuit for the AC signals over the broad bandwidth. To overcome this problem, S
parameters are used at microwave range. These S parameters are defined in terms of
incident and reflected travelling waves.
Sol-2,5) An isolator is a two-port device that transmits microwave or radio frequency
power in one direction only. It is used to shield equipment on its input side, from the
effects of conditions on its output side; for example, to prevent a microwave source
being detuned by a mismatched load.
Sol-3) quality factor of cavity resonator:
Q= 1/2Δ
2Δ is the half power bandwidth.

57
OBJECTIVE TYPE QUESTIONS:-
UNIT – 1
l.Fill in the blanks
1.For TE mn , ______is dominant mode and for TM mn mode ____is dominant mode.
2.The maximum power that is handled by a ferrite component is limited by ______.
3.Generally, the wave guide is not preferable below _____ frequency.
4._______ losses depends on thickness , dielectric constant and geometry of the substrate.
5.The amount of rotation of a plane of polarization when passing through ferrite is dependent on
_____.
6.When microwave signals follow the curvature of the earth ,this is known as _______.
7. The ohmic loss in microstrip line is due to _____.
8. For ______ purpose, wave guide tapers are preferred to transformers because of ease of
fabrication.
9. The characteristic impedence of microstrip line for w/h >>1 is ___.
10. When the electromagnetic waves are reflected at an angle from a wall, their wavelength
along the wall is greater than _____ of propagation.
ll. Multiple choice
1. A joint discontinuity is ____ at higher frequencies.
(a). Increases (b).Decreases
(c). constant (d). Non linear
2. The maximum use of microwave is in ______

(a). Impedance matching (b). Load regulation
(c). Communication (d). Signaling process
3. To reduce losses at higher frequencies , waveguides are plated with _______
(a). Iron (b). Copper
(c). Silver (d). Gold
4. ______ theorem is used for determining the power transmitted through rectangular
waveguide
(a). Scalar (b). Complex pointing
(c). Small signal (d). None of the above
5. The EM waves in a waveguide are _____
(a). Refracted (b).Transmitted
(c). Diffracted (d).Reflected
6. The microwave frequency ranges from to
(a). 30-300khz (b). 0.3-3mhz
(c).300mhz-300ghz (d).30-300mhz
7. The intersections between electric and magnetic lines in a waveguide are to each other
(a). Perpendicular (b). Parallel
(c). Circular (d). Straight
8. The degenerate mode are the higher order modes that have the same ____frequency
(a). Angular (b). Finite
(c). Over (d). Cut off
9. By increasing the frequency , waveguide dimensions are ___
(a). Decreases (b). Increases
(c). Constant (d). None of the above
10. When a wave travelling in air enters into a waveguide,
(a). The phase velocity is drecreased

58
(b). The group velocity is decreased
(c). The group velocity is increased
(d). The phase velocity is increased
UNIT -2
1. Cavity resonator is a piece of waveguide closed of at ____ with metallic planes.
2. A _____ port microwave circulator is a combination of two 3db side hole directional
couplers and a rectangular waveguide with two non reciprocal phase shifters.
3. The phase shift of a gyrator is _____.
4. At curie temperature ,ferrite materials loose their ____ properties.
5. If a dielectric is inserted into a dielectric phase shifter , lambda value _____.
6. To achieve ossilations in cavity resonators, the distance between its conducing wall is a
multiple of ____.
7. Two port device is used to separate generator and ____.
8. The point where dielectric is inserted into an air filled guide of a dielectric phase shifter has
_____.
9. The separation between the screws of a triple screw tuner is ______.
10. When a cavity resonator is matched to ____ the coupling coefficient is 1 .
ll.Multiple choice
1. The tapering at both ends of dielectric slab in phase shifters is used to ____.
(a). Increase reflection (b). Reduce reflection
(c). Generate reflection (d). None of the above
2. In reflecto meter _____ device is used
(a). Directional coupler (b). Gravity coupler
(c). Bidrectional coupler (d). Other coulpler
3. _____ is used to join various waveguide components
(a). Flange (b). Tuning screws
(c). Isolator (d). Circulator
4. _____ is the average power that flows through a rectangular waveguide
(a). 1/4neta(b). [[Eo^2[ab[1-fc/f]^2]^1/2]/4neta
(c). Eo^2 ab /4neta (d). 4neta/[1-fc/f]^2
5. The biggest advantage of two hole directional coulpler is _____
(a). Hgh gain (b). Accuracy
(c). High swr (d). High resistivity
6. Series junction is also known as ____
(a). H-plane tee (b). Magic tee
(c). Eplane tee (d). EH plane tee
7. The pads that are used in attenuator contan metallic film coated on a ____
(a). Copper plate (b). Silver plate
(c). Glass plate (d). Goldplate
8. To achieve ossilatons in cavity resonators , the distance between its conducting wall is a
multiple of ____
(a). lambda/4 (b). 1/lambda
(c). lambda/2 (d). lambda/3
9. Clculalate the resonant frequency for the dominant mode of an air filled cavity of a
rectangular cavity resonator having dimensions a=5cm,b=2cm,d=15cm
(a).3.162ghz (b).162.3ghz
(c).zero (d). 3.33ghz
10. A rectangular cavity resonator has dimensions of a=5cms,d=15cms then the resonant
frequency of dominant mode for an air filled cavity
(a).18.24ghz (b).8.24ghz

59
(c).3.162ghz (d).3.182 ghz
UNIT – 3
1. In conventional tubes the reactance of the inter electrode increases with the _____ in its
capacitance.
2. The gain bandwidth product of the conventional tube is ____ of the frequency.
3. In a ____, an electron passing through the gap whose voltage is zero.
4. In a two cavity klystron amplifier , the cavity which is nearer to the cathode is called _____.
5. In a two cavity klystron oscillator , the center of bunch leaves the bunch when its alternating
voltage is -____.
6. In a helix TWT , as the electron passes across the gap,___ and ____ takes place .
7. The velocity of a wave can be reduced by using ___ structures.
8. In TWT , field travels along with ____.
9.The m type tubes are also called ____ tubes.
10. The magnetron is a self contained ___.
ll.Multiple choice
1. The reactance of conventional tube increases with increase in its ___
(a). Lead inductance (b). resistivity
(c). Impedance (d). Conductance
2. Bunching affect occurs in ____ type of microwave tube
2. (a). m-type (b).o-type
(c).l-type (d).m-type
3. An electron in m type micro wave tube travels in ______path
(a)flat (b)linear
(c)non linear (d)curved
4.klystron amplifier operates on the principle of ___________and ________-modulation.
(a).current,velocity (b)wavelength,current
(c)velocity,wavelength (d)velocity,current
5.Thecondition,where all the cavities used in the klystron are tuned to equal frequency is
called_________
(a) Asynchronous tuning (b)synchronous tuning
(c)non linear tuning (d)linear tuning
6.klystron amplifier can be converted into ___________by applying suitable feed back signal as
input to it
(a) inverter (b)wave tube
(c)oscillator (d)reflector
7.the ___________is a cavity velocity modulator tube
(a)reflex klystron (b)twystron
(c)helix TWT (d) amplifier
8.The time required by the electrons to move towards the reflector electrode and return back to
grid gap is called as ___________
(a)reflection time (b)receiving time
(c)resistive time (d)transmission time
9.in a two cavity klystrolamplifies,separation between buncher grid and catcher grid is called as
_________
(a)active space (b) transmitting space
(c)drift space (d)reflecting space
10.The ___________modes of reflects klystron gives large power output
(a)higher (b)TE
(c)lower (d)TM
UNIT – 4

60
1.______ devices employ negative resistance characteristics for their operation.
2. _____ is an example of non linear resistance type microwave device.
3. TED’s operate with ____ electrons whose energy is very much greater than thermal energy.
4. Two modes of negative resistant device are ____&___.
5. ____ is defined in the region where the product of frequency , time , length is above 10cm
square seconds.
6. In GUNN oscillation mode, the product of doping multiplied by length is greater than_____.
7. IMPATT is an abbreviation form of _____.
8. Using silicon diode in IMPATT diode , frequencies are as high as _____.
9. BARITT diodes have low noise figures of about ___ db.
10. In ___ diodes , the bandwidth is relatively narrow with low output power.
ll. Multiple choice
1. ___ type of magnetron are used at the frequency less than 500 mhz
(a). Positive resistance (b). Electriacal
(c). Impedence (d). Negative resistance
2. When magnetron is working in pi-mode , the electrons which are used to transfer the energy
to RF field are called,
(a).Negative resistance (b).Backward electrons
(c).forward electrons (d). None of the above
3. Inmagnetron, the phenomenon of varying resonant frequency by varying its anode voltage is
called ____
(a).Frequecy pushing (b). Frequency pulling
(c). Amplitude pushing (d). Amplitude pushing
4. The TWT is __ device
(a). m-type (b).o-type
(c). EM (d). Electrical
5. The gain of TWT is proportional to ____ of slow wave structure
(a). width (b). height
(c).length (d). perimeter
6. The slow wave structure is ___
(a). Unidirectional (b). Bidirectioanal
(c). both a &b (d). None of the above
7. The motion of electrons in the helix TWT can be analysed in terms of ____.
(a). Electric field (b). Magnetic field
(c). Electro magnetic field (d). None of the above
8. The travelling wave tube gain parameter , c is given by
(a). (IoZo/4Vo)^2 (b).(IoZo/4Vo)^1/2
(c). (IoZo/4Vo)^3 (d).(IoZo/4Vo)^1/3
9. In a magnetron the magnetic filed used to return the electrons back to the cathode is called
(c). Normal electric field (d). Critical electric field
10. The cyclotron frequency type magnetron is used for the frequencies
(a). Greater than 100mhz (b). Less than 100mhz
(c). Greater than 100 hz (d). Less than 100 h
UNIT – 5
1. The matrix which defines relationship between incident and reflected waves at both input
and output ports is ___.
2. S-matrix for E-plane tee is ___.
3. S-matrix for isolator is _____.
4. S-matrix for circulator is ____

61
5. In case of S-matrix summation(i=1 to n)S ik.Sij* = ____.where k not equals to j.
6. In low VSWR measurement, the value of VSWR is ___.
7. The expression for VSWR for s>10 is ____.
8.In transmission method of a Q cavity measurement , the output signal is measured as a
function of ____ resonant curve.
9. The expression for attenuation in db is ____.
10. In wave meter method , the expression for frequency is ____.
ll.Multiple choice
1. In the GUNN oscillation mode devices are ___
(a). Stable (b). Unstable
(c). Extremely stable (d). None of the above
2. The elements of a scaterring matrix Sij is defined as
(a). bi/aj=output wave at jth port to incident wave at jth port
(b). bi/ai=output wave at ith port to incident wave at jth port
(c). bj/ai=output wave at jth port to incident wave at ith port
(d). bi/aj=output wave at ith port to incident wave at jth port
3. A circuit is termed as lossless if
(a).[I]*[I]*=[S] (b).[S][S]=[I]
(C).[S][S]*=[I] (d). [S]*[S]*=[I]
4. S-matrix for h-plane Tee is
(a). Matrix(0 0 1,1 0 0, 0 1 0)
(b).Matrix(1/2 ½ 1/0.414, ½ ½ -1/0.414,1/0.414 -1/0.414 0)
(c).Matrix (jp 0 0, 0 jp 0, 0 0 jp)
(d).Matrix(1/2 -½ 1/0.414,- ½ ½ 1/0.414,1/0.414 1/0.414 0)
5. ___ setup is used for measuring any parameter in microwaves
(a). Microwave bench (b).VSWR
(c).Bolometer (d).Cavity
6. The crystal detector in the probe of slotted line is to detect ______
(a). Demodulated (b).Carry
(c). Modulated (d). Message
7. The detector reading in microwave bench may have an error due to variations in ____&___
(a). Amplitude,time period (b). Frequency,power
(c). Time period,Freq (d). None of the above
8. Bolometer is also known as
(a).Square law device (b).Impedance device
(c).Attenuated device (d). Oscillator
9. VSWR is the ratio of ____&____
(a). Max & min current (b). Max & min amplitude
(c). Max & min voltage (d). None of the above
10. Which of the following is an application for varactordiode
(a). Harmonic generation
(b). Active filter
(c).Microwave frequency multiplicaition
(d). All of the above

62
2. OPTICAL COMMUNICATIONS (EC0752)
Syllabus:
Overview of Optical Fiber Communication: - Historical development, The general

system, Advantages of Optical Fiber Communications, Optical Fiber Wave Guides-
Introduction, Ray Theory Transmission, Total Internal Reflection, Acceptance Angle,
Numerical Aperture, Skew Rays, Cylindrical Fibers- Modes, Vnumber, Mode Coupling,
Unit – I Step Index Fibers, Graded Index Fibers.
Single Mode Fibers- Cut Off Wavelength, Mode Field Diameter, Effective Refractive
Index, Fiber Materials Glass, Halide, Active Glass, Chalgenide Glass, Plastic Optical
Fibers.
Signal Distortion in Optical Fibers: Attenuation, Absorption, Scattering and Bending
Losses, Core and Cladding Losses, Information Capacity Determination, Group Delay,
Unit – II Types of Dispersion - Material Dispersion, Wave-Guide Dispersion, Polarization Mode
Dispersion, Intermodal Dispersion, Pulse Broadening, Optical Fiber Connectors-
Connector Types, Single Mode Fiber Connectors, Connector Return Loss
Fiber Splicing: Splicing Techniques, Splicing Single Mode Fibers, Fiber Alignment and
Joint Loss- Multimode Fiber Joints, Single Mode Fiber Joints.
Optical Sources- LEDs, Structures, Materials, Quantum Efficiency, Power, Modulation,

Power Bandwidth Product, Injection Laser Diodes- Modes, Threshold Conditions, External
Unit –III
Quantum Efficiency, Laser Diode Rate Equations, Resonant Frequencies, Reliability of
LED & ILD.
Source to Fiber Power Launching: - Output Patterns, Power Coupling, Power

Launching, Equilibrium Numerical Aperture, Laser Diode to Fiber Coupling.
Optical Detectors: Physical Principles of PIN and APD, Detector Response Time,
Temperature Effect on Avalanche Gain, Comparison of Photo Detectors, Optical Receiver
Unit – IV Operation- Fundamental Receiver Operation, Digital Signal Transmission, Error Sources,
Receiver Configuration, Digital Receiver Performance, Probability of Error, Quantum
Limit, Analog Receivers.
Optical System Design: Considerations, Component Choice, Multiplexing, Point-to-
Point Links, System Considerations, Link Power Budget with Examples, Overall Fiber
Unit – V Dispersion in Multi-Mode and Single Mode Fibers, Rise Time Budget with Examples.
Transmission Distance, Line Coding in Optical Links, WDM, Necessity, Principles, Types
of WDM, Measurement of Attenuation and Dispersion, Eye Pattern.
Text Books (to be acquired by the Students)
1. Optical Fiber Communications – Gerd Keiser, TMH, 4th Edition, 2008.
2. Optical Fiber Communications – John M. Senior, Pearson Education, 3rd Edition, 2009.
Reference Books
1. Fiber Optic Communications – D.K. Mynbaev
2. Text Book on Optical Fibre Communication and its Applications – S.C.Gupta
3. Fiber Optic Communication Systems – Govind P. Agarwal
4. Introduction to Fiber Optics by Donald J.Sterling Jr. – Cengage learning
5. Optical Communication Systems – John Gowar

63
CONSOLIDATED UNIT WISE LESSON PLAN
Subject OPTICAL COMMUNICATIONS (EC075A)

Faculty Md. Shoukath Ali / Sandeep Patil / B. Sridhar
Book 1 Optical Fiber Communications – Gerd Keiser, TMH, 4th Edition, 2008.
Book 2 Optical Fiber Communications – John M. Senior, Pearson Education, 3rd Edition, 2009.
Reference Books
Book 3 Fiber Optic Communications – D.K. Mynbaev
Book 4 Text Book on Optical Fibre Communication and its Applications – S.C.Gupta
Book 5 Fiber Optic Communication Systems – Govind P. Agarwal
Chapters No of
Unit Topic
Book 1 Book 2 Book 3 Book 4 Book 5 Classes
Overview of Optical
I Fiber Communication; 1,2,3 1,2 2 1,2 16
Single Mode Fibers
Signal Distortion in
II 5 3,5 3,4 3 12
Optical Fibers
Fiber Splicing;
Optical Sources;
III 6,7 6,7 7 5,6 7 15
Source to Fiber Power
Launching
IV Optical Detectors 8 8 10
V Optical System Design 10 10 10

Lectures beyond syllabus & Remedial classes/NPTEL Classes 05
Total No. of classes 70

64
Academic Year : 2019-2020

Subject Name with code : Optical Communications (EC0752)
Class : IV B,Tech I -Semester
Name of the Faculty Member(s) : Md. Shoukath Ali, Sandeep Patil

L1. Remembering
L2. Understanding
L3. Applying
L4. Analyzing
L5. Evaluating
L6. Creating
Course
BTL
Outcome
level
(Please
(Please
Sl.No. Questions mention
mention
CO1 or
L1 or L2
CO2
or etc...)
etc…)
Unit - I
Part – A (2 Marks )
1 Define and explain mode coupling [R13-Feb 2019] L1 CO1
2 Write a short note on Halide Glass fiber. [R13-Feb 2019] L1 CO1
Explain the terms : (i) Cut off wave length (ii) Mode field
3 L1 CO1
diameter [R13-Nov 2018]
What are the requirements of optical fiber? Explain glass and
4 L2 CO1
plastic materials in detail. [R13-Nov 2018]
A light ray is incident from medium-1 to medium-2, if the
refractive indices of medium-1 and medium -2 are 1.5 and 1.36
5 L3 CO1
respectively then determine the angle of refraction for an angle
of incidence of 300. [R13-Nov 2018]
What are the mechanical properties of optical fibers? Explain.
6 L2 CO1
[R13-Nov 2018]
Explain the following terms : (i) Meridional rays (ii) Skew rays
7 L1 CO1
[R13-Nov 2018]
Mention the four advantages of OFC. [R13-Feb 2018]
8
Part – B (5 Marks )
a) Write about the historical development of optical fiber
1 communication. L1 CO2
b) Explain briefly about Skew rays [R13-Feb 2019]
2 a) Explain about the light guidance in a optical fiber with L2, L5 CO2

65
figures and explain the total internal reflection and numerical
aperture with diagrams.
b) What is normalized frequency? A step index fiber in air has a

numerical aperture of 0.16, core refractive index 1.45, and core
diameter 60 micro meters. Assume that wavelength is 0.1
micrometer. Determine normalized frequency for fiber.
[R13-Nov 2018]
a) For a multimode step index optical fiber of glass core of
refractive index 1.5 and quartz cladding of refractive index 1.46
, determine:
(i) critical angle (ii) Acceptance angle (iii) Numerical
3 aperture L2, L5 CO2
b) Explain the basic principal of Optical Fiber. Compare

Optical Fiber with Coaxial cable as a communication channel.
[R13-Nov 2018]
a) State the probable basic requirements of an optical
communication system.
4 L1, L2 CO2
b) Enlist the major design considerations in an optical system.
[R13-Nov 2018]
a) Explain electromagnetic mode theory in optical fiber in
detail.
5 L2 CO2
b) Explain the importance of cladding in optical fiber
communication. Justify the statement: “Light travels faster in
cladding than core”. [R13-Nov 2018]
a) Compare the fiber structure and NA in step index and graded
index fibers.
b) The refractive index of the core of step index fiber is 1.46

6 L3,L4 CO2
and the relative refractive index difference between core and
cladding of the fiber is 2%.
Estimate (i) Numerical Aperture (ii) Critical angle at the core
cladding interface within the fiber. [R13-Nov 2018]
Unit – II
1 Write a short note on chromatic dispersion. [R13-Feb 2019] L2 CO2
2 Explain scattering losses in optical fibers. [R13-Nov 2018] L2 CO2
Explain the requirements of a good connector design.
3 L3 CO2
[R13-Nov 2018]
Explain in detail intrinsic absorption losses and extrinsic
4 L2 CO2
absorption losses. [R13-Nov 2018]
Write about micro bending and macro bending losses
5 L2 CO2
[R13-Feb 2018]
What are the requirements of good connectors?
6 L3 CO2
[R13-Nov-2018]
Define the Model noise and Model partition noise.
7 L1 CO2
[R13-Nov-2018]
Explain the terms: (i) Group velocity (ii) Phase velocity
8 L1,L2 CO2
[R13-Nov 2018]
66
a) Write a short note on Scattering Losses.
1 L1, L2 CO2
b) Discuss briefly about Polarization-Mode dispersion.
[R13-Feb 2019]
a) Write a note on single-mode fiber connectors.
2 L1, L2 CO2
b) Discuss briefly about Time-Domain Intermodal
Dispersion measurements. [R13-Feb 2019]
a) Explain the different types of methods to minimize signal
distortion in optical fibers.
b) How does material dispersion occur in an optical fiber?

3 L2,L3 CO2
Obtain the expression for group delay τmat resulting from the
material dispersion and from this, deduce the relation for the
pulses spread σmat in terms of material dispersion Dmat ( λ).
[R13-Nov 2018]
a) Explain the losses in end separator connecting different
fibers when joining two fibers.
4 L2 CO2
b) Write a short note on different types of fiber connectors?
[R13-Nov 2018]
a) For a 30 km long fiber attenuation 0.8 db/km at 1300 nm. If a
200 μW is launched into the fiber, find the output power.
5 L5,L3 CO2
b) Differentiate between graded index and step index also
define birefringence and V number. [R13-Nov 2018]
a) Explain in detail the transmission losses due to absorption
mechanism in an optical fiber with necessary equations and
prove that this loss is a function of wavelength using graphical
6 analysis. L4 CO2
b) Derive the equation for intermodal dispersion.

[R13-Nov 2018]
a) Explain Butt joint connectors with neat circuit diagrams.
7 L3,L4 CO2
b) Explain the connector return losses in optical fibers.
[R13-Nov 2018]
a) Explain core and cladding losses. Explain losses due to
bending.
8 L2,L5 CO2
b) An optical signal at a specific wavelength has lost 55% of its
power after traversing 3.5 Km of fiber. What is the attenuation
in dB/km of this fiber? [R13-Nov 2018]
a) Explain the procedure of installing fiber connectors in optical
fibers.
9 b) A step index fiber has a core refractive index of 1.5 and a L2,L5 CO2
core diameter of 50μm.Esimate the insertion loss at the joint
due o the lateral misalignment assuming a uniform distribution
of power between all guided modes when: (i) There is a small
67
air gap at the joint (ii) the joint s considered index matched.
[R13-Nov 2018]
a) Explain group delay and mode delay factor with reference to
single mode fibers showing the relevant graph.
10 L3 CO2
b) Explain how the attenuation does and dispersion is measured
in optical communication. [R13-Nov 2018]
a) Explain the scattering and bending losses in optical fibers.
11 b) Give an account of cut off wavelength for single mode and L2,L4 CO2
multi mode fibers and discuss its dependence on fiber length.
[R13-Nov 2018]
a) Describe the connector return loss in an optical fiber.
12 L2 CO2
b) Explain the following briefly (i) Single mode fiber joint (ii)
Multimode fiber joint. [R13-Nov 2018]
Unit – III
Define fiber splicing? Explain fusion splicing of optical fiber.
1 L2 CO3
[R13-Feb 2019]
2 Define spontaneous emission. [R13-Feb 2019] L1 CO3
What is the difference between fusion splicing and mechanical
3 L2 CO3
splicing? [R13-Nov 2018]
What is the importance of double hetero junction in LED
4 L2 CO3
structures? [R13-Nov 2018]
5 What is called equilibrium numerical aperture?[R13-Nov 2018] L2 CO3
What is meant by splicing? What are the advantages of
6 L1 CO3
splicing? [R13-Nov 2018]
What are the different types of light source materials?
7 L1 CO3
[R13-Nov 2018]
“The optical power launched into a fiber does not depend on
8 the wavelength of the source but only on its brightness”. L3 CO3
Explain. [R13-Nov 2018]
Explain population inversion mechanism in optical fibers.
9 L2 CO3
[R13-Nov 2018]
Calculate the optical power coupled into the fiber by an optical
source with a bias current of 20mA and a forward voltage of
10 L5 CO3
1.5V.Assume an internal efficiency of the source as 2% and the
coupling efficiency of 30%. [R13-Nov 2018]
Explain (i) V-grove splicing and (ii) elastic tube techniques for
11 L2 CO3
fiber splicing. [R13-Nov 2018]
A GaAs laser operating at 850nm and has a length of 500μm.
12 refractive index n=3.7.Calculate frequency and wave length. L5 CO3
[R13-Nov 2018]
Derive the relation for the optical power launched from a
13 surface emitting LED into a graded index fiber. L3 CO3
[R13-Nov 2018]
14 Differentiate the splicer and connector[R13-Feb 2018] L2 CO3

68
Discuss the concept of spontaneous emission in LED
15 L2 CO3
[R13-Feb 2018]
Write a brief notes on equilibrium numerical aperture
16 L2 CO3
[R13-Feb 2018]
a) Draw and explain V-groove and Elastic-tube fiber splicing
technique.
1 L2 CO3
b) Explain internal and external quantum efficiency.
[R13-Feb 2019]
a) Write a note on external quantum efficiency.
2 L3 CO3
b) Explain briefly about laser diode –to-fiber coupling.
[R13-Feb 2019]
a) Derive the expressions for quantum efficiency and LED
power.
b) The Radiative and non radiative recombination life times of

3 minority carriers in the active region of a double heterojunction L4,L5 CO3
LED are 60 sec and 90 sec respectively. Determine the total
carrier recombination life time and optical power generated
internally if the peak emission wave length is 870 nm and the
drive current is 40 mA. [R13-Nov 2018]
a) Derive an expression for power coupled power from an LED
into a relatively smaller step index fiber with equal numerical
aperture.
4 L4,L3 CO3
b) Discuss the dependence of equilibrium numerical aperture
and power coupling from a source into a fiber.
[R13-Nov 2018]
a) What are the different types of alignments in optical fibers?
5 L2 CO3
b) Compare multi mode fiber joints and single mode fiber
joints? [R13-Nov 2018]
a) Derive the equation for the power launched from LED
Source in to a Graded Index fiber.
6 L4,L3 CO3
b) Differentiate between power coupled to step index fiber and
graded index fiber? [new]
a) A Laser diode has lateral ∅ =0°and transverse ∅ =90° half
power beam widths of 2θ=60°and 30° respectively what are
transverse and lateral power distribution coefficients for this
device?
7 L5,L3 CO3
b) Derive the equation of power coupling from LED source to
step index fiber: (i) when source radius is less than fiber radius
(ii) when source radius is greater than the fiber radius.
[R13-Nov 2018]
a) Draw the light output versus current curve and explain the
8 operation of LASER. L2 CO3

69
b) Explain the semiconductor injection laser diode resonating
mode. [R13-Nov 2018]
a) Sketch and explain the fabry-petrot resonator cavity of a
laser diode.
9 b) A GaAs laser operating at 850 nm and 450μm length and L2,L5 CO3
refractive index η =3.5. What are the frequency and wavelength
spacing? If the half power point, λ-λo=2.5nm, what is the
spectral width σ of the gain? [R13-Nov 2018]
a) Draw the structure of edge emitting LEDs and explain.
10 L3 CO3
b) Draw and explain the output patterns of source to fiber
power launching of LED. [R13-Nov 2018]
Unit - IV
1 Write a short note on error source. [R13-Feb 2019] L2 CO4
What are the line coding techniques in optical communication?
2 L1 CO4
[R13-Nov 2018]
3 Give the advantages of Pindiode. [R13-Nov-2017] L2 CO4
Define Internal-Quantum efficiency. And what is the quantum
4 L1 CO4
efficiency of photo detector. [R13-Nov-2017]
What are the different error sources in fiber optical receiver?
5 L2 CO4
[R13-Nov-2017]
6 Explain quantum Limit. [R13-Mar-2017] L2 CO4
a) Explain briefly about analog receivers.
1 b) Explain the fundamental receiver operation in optical fiber L2 CO4
communication. [R13-Feb 2019]
a) Explain the different types of photo detector used in optical
system and explain structure and operating principle of any one
in detail.
b) An LED with a circular emitting area of radius 20 μm has a
lambertian emission pattern with 100 w/cm2 .sr. axial radiance
2 at 100 mA drive current. How much optical power can be L3,L5 CO4
coupled in to a step index fiber having a 100 μm core diameter
and numerical aperture of 0.22? How much optical power can
be coupled from this source in to a 50 μm core diameter graded
index fiber having α = 2.0 n1=1.48 and Δ=0.01?
[R13-Nov 2018]
a) Calculate the optical power coupled into the fiber by an
optical source with a bias current of 20mA and a forward
voltage of 1.5V.Assume an internal efficiency of the source as
2% and the coupling efficiency of 30%.
3 L5,L3 CO4
b) Estimate the losses encountered while coupling power from
a source to a fiber due to mismatch in their numerical apertures
and surface areas. [R13-Nov 2018]
a) With a schematic diagram explain the working of optical
receiver.
4 L3,L2 CO4
b) Discuss the possible sources of noise in optical receivers.
[R13-Nov 2018]
70
a) What is known as quantum limit? A digital fiber optic
link operating at 850 nm requires a maximum BER of
10*9. Find the minimum incidental optical power Po to
5 achieve this BER at a data rate of 10 Mb/s for a simple L5,L3 CO4
binary level signaling scheme. (ry: 1), [1/r : B/2].
b) Explain NRZ and RZ line codes in optical link with an
example. [R13-Nov-2018]
Unit - V
1 What is WDM? [R13-Nov 2018] L1 CO5
Briefly explain TDM, FDM, WDM and SDM used in optical
2 L2 CO5
communication system. [R13-Nov 2018]
Write short notes on multiplexing in fiber optic receivers.
3 L2 CO5
[R13-Nov 2018]
4 What is WDM and explain its significance [R13-Feb 2018] L2 CO5
Explain briefly about link power budget analysis.
5 L3 CO5
[R13-Nov-2017]
6 Write short notes on WDM. [R13-Mar-2017] L2 CO5
a) Discuss briefly about Rise-Time budget.
b) A continuous 12 km long optical fiber link has a loss of 1.5
dB/km: (i) What is the minimum optical power level that must
1 L3,L5 CO5
be launched into the fiber to maintain an optical level of 0.3 μW
at the receiving end? (ii) What is the required input power if the
fiber has a loss of 2.5 dB/km? [R13-Nov 2018]
a) Discuss key system features of WDM. Draw diagram of a
typical WDM link containing various components and explain
2 it in brief. L3 CO5
b) Describe graphical representation of link loss budget with a
set of assumed values. [R13-Nov 2018]
a) Discuss all the criteria to select the set of components
sufficing design of a fiber fiber optical link.
3 L3,L2 CO5
b) What are the differences in specifications, selection of
components, performance merit parameters of digital and
analog fiber optic receiver [R13-Nov 2018]
a) Discuss the system criteria for design of a point-to-point
fiber optic link.
4 b) Design of an optical fiber link for transmitting 15 Mb/Sec of L2,L5 CO5
data for a distance of 4 Km with BER of 10-9.
[R13-Nov 2018]
a) Explain the significance of power budget and system margin.
b) Following are the parameters of a point-to-point optical link:

(i) Optical power launched: + 5dBm (ii) sensitivity of detector :
-30dBm (iii) Source/detector connector loss : 1dB (iv) Length
5 L3,L5 CO5
of optical cable : 55km (v) Cable attenuation : 0.3 dB/km (vi)
Jumper cable loss : 2.5 dB (vii) Connector loss at each fiber
joint : 1dB Assume two jumper cables and two cable joints.
Compute the power margin of the line.
[R13-Nov 2018]
71
Part-A : Answers
UNIT-1
1. Define and explain mode coupling. [R13-Feb 2019]

Answer: mode coupling: In an electromagnetic waveguide, the exchange of power among
modes. In a multimode optical fiber, mode coupling reaches statistical
equilibrium, i.e. , equilibrium mode distribution, after the equilibrium length has been
traversed.
2. Write a short note on Halide Glass fiber. [R13-Feb 2019]

Answer: Halide glasses are made from compounds containing fluorine and various metals such
as zirconium, barium, thorium, lanthanum and lutetium. Conventional glasses, by comparison,
are somewhat dull, being made from silicon dioxide, the same material as in sand. The potential
advantage of halide glasses is that, at least in theory, they are much clearer than conventional
silicon-based glasses. That means light can travel farther through such glass, which would make
halide glass ideal for use in fiber optic communications systems, in which pulses of light are
sent through hair-thin glass fiber lines.
3. Explain the terms : (i) Cut off wave length (ii) Mode field diameter[R13-Nov 2018]
Answer: The CUTOFF WAVELENGTH of a single mode fiber is the wavelength above which
the fiber propagates only the fundamental mode. Below cut-off, the fiber will transmit more
than one mode. An optical fiber that is single-moded at a particular wavelength may have two
or more modes at wavelengths lower than the cutoff wavelength. The effective cutoff
wavelength of a fiber is dependent on the length of fiber and its deployment and the longer the
fiber, the lower the effective cutoff wavelength. Or the smaller the bend radius of a loop of the
fiber is, the lower the effective cutoff wavelength will be. If a fiber is bent in a loop, the cutoff
is lowered. The cutoff wavelength of a fiber is reduced when it is cabled
the mode field diameter (MFD) is an expression of distribution of the irradiance, i.e., the
optical power per unit area, across the end face of a single-mode fiber. For a Gaussian intensity
(i.e., power density, W/m2) distribution in a single-mode optical fiber, the mode field diameter
is that at which the electric and magnetic field strengths are reduced to 1/e of their maximum
values, i.e., the diameter at which power density is reduced to 1/e2 of the maximum power
density, because the power density is proportional to the square of the field strength.
4. What are the requirements of optical fiber? Explain glass and plastic materials in
detail. [R13-Nov 2018]
Answer: Optical fiber consists of a core and a cladding layer, selected for total internal
reflection due to the difference in the refractive index between the two. In practical fibers, the
cladding is usually coated with a layer of acrylate polymer or polyimide. This coating protects
the fiber from damage but does not contribute to its optical waveguide properties. Individual
coated fibers (or fibers formed into ribbons or bundles) then have a tough resin buffer layer or
core tube(s) extruded around them to form the cable core. Several layers of protective sheathing,
depending on the application, are added to form the cable. Rigid fiber assemblies sometimes put
light-absorbing ("dark") glass between the fibers, to prevent light that leaks out of one fiber
from entering another. This reduces cross-talk between the fibers, or reduces flare in fiber
bundle imaging applications.
The material based classification results to the following types: 1. Plastic made fibres. 2. Glass
made fibres. The plastic made fibres are obtained from polymers of transparent to light,
flexibility and interaction less to light etc,. For example poly methyl metha acrylate (PMMA),
72
polyethylene (PE), polystyrene (PS) are used as core materials. Glass made fibre is also
fabricated from flexible glass as core with suitable drawing technique in presence of impurities.
Therefore, the above types of optical fibres are limited to some application
5. A light ray is incident from medium-1 to medium-2, if the refractive indices of

medium-1 and medium -2 are 1.5 and 1.36 respectively then determine the angle of
refraction for an angle of incidence of 300. [R13-Nov 2018]
Answer:
n1 sin θ1 = n2 sin θ2, θ2 =33.96 degrees
6. What are the mechanical properties of optical fibers? Explain. [R13-Nov 2018]
Answer: An optical fiber is made of 3 concentric layers (see Figure 3):
Core: This central section, made of silica or doped silica, is the light transmitting region of the
fiber. ƒ
Cladding: This is the first layer around the core. It is also made of silica, but not the same
composition as the core. This creates an optical waveguide which confines the light in the core
by total internal reflection at the core-cladding interface. ƒ
Coating: The coating is the first non-optical layer around the cladding. The coating typically
consists of one or more layers of polymer that protect the silica structure against physical or
environmental damage. The coating is stripped off when the fiber is connectorized or fusion
spliced.
Buffer (not pictured): The buffer is an important feature of the fiber. It is 900 microns and
helps protect the fiber from breaking during installation and termination and is located outside
of the coating. The light is "guided" down (see Figure 4) the core of the fiber by the optical
"cladding" which has a lower refractive index (the ratio of the velocity of light in a vacuum to
its velocity in a specified medium) that traps light in the core through "total internal reflection."
7. Explain the following terms : (i) Meridional rays (ii) Skew rays [R13-Nov 2018]
Meridional Rays The guiding condition is simple to see for meridional rays (rays in planes
passing through the fiber axis), as illustrated in Fig. . These rays intersect the fiber axis and
reflect in the same plane without changing their angle of incidence, as if they were in a planar
waveguide. Meridional rays are guided if their angle 8 with the fiber axis is smaller than the
complement of the critical angle GC = VT/~ - 8, = cos-l&/n,). Since rrr = n2, 8, is usually small
and the guided rays are approximately paraxial. Meridional plane Figure The trajectory of a
meridional ray lies in a plane passing through the fiber axis. The ray is guided if 8 < aC = cos-
‘(n,/n,).

73
Skewed Rays An arbitrary ray is identified by its plane of incidence, a plane parallel to the fiber
axis and passing through the ray, and by the angle with that axis, as illustrated in Fig. . The
plane of incidence intersects the core-cladding cylindrical boundary at an angle C#I with the
normal to the boundary and lies at a distance R from the fiber axis. The ray is identified by its
angle 8 with the fiber axis and by the angle 4 of its plane. When 4 # 0 (R f 0) the ray is said to
be skewed. For meridional rays C$ = 0 and R = 0. A skewed ray reflects repeatedly into planes
that make the same angle 4 with the core-cladding boundary, and follows a helical trajectory
confined within a cylindrical shell of radii R and a, as illustrated in Fig. . The projection of the
trajectory onto the transverse (x-y) plane is a regular polygon, not necessarily closed. It can be
shown that the condition for a skewed ray to always undergo total internal reflection is that its
angle 0 with the z axis be smaller than aC. Numerical Aperture A ray incident from air into the
fiber becomes a guided ray if upon refraction into
8. Mention the four advantages of OFC. [R13-Feb 2018]

Answer:
Greater Bandwidth & Faster Speed—Optical fiber cable supports extremely high bandwidth
and speed. The amount of information that can be transmitted per unit of optical fiber cable is
its most significant advantage.
Cheap—Several miles of optical fiber cable can be made cheaper than equivalent lengths of
copper wire. With numerous vendors swarm to compete for the market share, optical cable
price would sure to drop.
Thinner and Light-weighted—Optical fiber is thinner, and can be drawn to smaller diameters
than copper wire. They are of smaller size and light weight than a comparable copper wire
cable, offering a better fit for places where space is a concern.
Higher carrying capacity—Because optical fibers are much thinner than copper wires, more
fibers can be bundled into a given-diameter cable. This allows more phone lines to go over the
same cable or more channels to come through the cable into your cable TV box.
Less signal degradation—The loss of signal in optical fiber is less than that in copper wire.
Light signals—Unlike electrical signals transmitted in copper wires, light signals from one
fiber do not interfere with those of other fibers in the same fiber cable. This means clearer
phone conversations or TV reception.
Long Lifespan—Optical fibers usually have a longer life cycle for over 100 years.

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9. Mention the four advantages of OFC.
Limited Application—Fiber optic cable can only be used on ground, and it cannot leave the
ground or work with the mobile communication.
Low Power—Light emitting sources are limited to low power. Although high power emitters
are available to improve power supply, it would add extra cost.
Fragility—Optical fiber is rather fragile and more vulnerable to damage compared to copper
wires. You’d better not to twist or bend fiber optic cables.
Distance—The distance between the transmitter and receiver should keep short or repeaters are
needed to boost the signal.
10. What are the parameters of fiber cable ?

Answer: Parameters of optical fibres The parameters of optical fibres are:  Radius of the core
 Numerical Aperture  Acceptance angle
UNIT-2
1. Write a short note on chromatic dispersion. [R13-Feb 2019]

Answer : Chromatic dispersion is the term given to the phenomenon by which
different spectralcomponents of a pulse travel at different velocities. To understand the effect
of chromatic dispersion, we must understand the significance of the propagation constant β.
We will restrict our discussion to single mode fiber since in the case of multimode fiber, the
effects of intermodal dispersion usually overshadow those of chromatic dispersion. So the
propagation constant β in our discussions will be that associated with the fundamental mode of
the fiber.
2. Explain scattering losses in optical fibers. [R13-Nov 2018]

Answer: Scattering losses in glass arise from microscopic variations in the material density,
from compositional fluctuations and from structural inhomogeneties or defects occurring during
fiber manufacture.
3. Explain the requirements of a good connector design. [R13-Nov

2018]
Answer: Low coupling losses: The connector assembly must maintain stringent alignment
tolerances to assure low mating losses. ...
Interchangeability: ...
Ease of assembly: ...
Low environment sensitivity: ...
Low cost and reliable construction: ...
High strength: ...
Ease of connection:
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4. Explain in detail intrinsic absorption losses and extrinsic absorption losses.
[R13-Nov 2018]
Answer: Intrinsic absorption losses correspond to absorption by fused silica (material used to
make fibers) whereas extrinsic absorption is related to losses caused by impurities within
silica.
5. Write about micro bending and macro bending losses [R13-Feb 2018]
Answer:
A microbend is a fiber imperfection. Microbends cause an increase in cable loss. This loss can
result in an excessively large loss in excess of 100 dB/km in some cases. A major cause of this
loss occurs during cable manufacture. It is related to axial distortions that invariably occur
during cabling when the fiber is pressed against a surface that is not perfectly smooth.
Microbend-induced loss is a function of mode-field diameter, cable design, and cable
construction. Losses due to microbend-induced attenuation consistently decrease with mode-
field diameter.
A macrobend refers to the specified minimum bending radius. The cable manufacturer should
specify the minimum bending radius. When fiber is on reels, of course it is bent around the reel.
When it is installed, particularly in buildings, fiber cable must be bent around corners. The
installer must not exceed the specified minimum bending radius by making a still sharper bend
than the specification calls for.
6. What are the requirements of good connectors? [R13-Nov-2018]

Answer: Interchangeability: ...
Ease of assembly: ...
Low environment sensitivity: ...
Low cost and reliable construction: ...
High strength: ...
Ease of connection:
7. Define the Model noise and Model partition noise. [R13-Nov-2018]

Answer:
schematic of an optical PHY with the signal path going from left to right, showing the
transmitter (TX) laser diode driver (LDD) electronics and its associated noise output sTX.
Multiplicative scale factors appear in the boxes and additive noise terms are represented by the
circles for the laser diode (LD), fiber optics (FO), photodetector (PD), and receiver electronics
(RX). The end result is presented as a voltage to the input of the digital decision circuit (DDC)

76
8. Explain the terms: (i) Group velocity (ii) Phase velocity [R13-Nov 2018]
Answer: the velocity with which the overall envelope shape of the wave's amplitudes—
known as the modulation or envelope of the wave—propagates through space. The group
velocity vg is defined by the equation: where ω is the

wave's angular frequency (usually expressed in radians per second), and k is the angular
wavenumber (usually expressed in radians per meter). The phase velocity is: vp = ω/k.
.The function ω(k), which gives ω as a function of k, is known as the dispersion relation.
9. What are the conditions fro total internal reflection?

Answer: a) Light should travel from denser medium to rarer medium.
b) The angle of incidence should be greater than the critical angle of the
denser medium.
10. What is fiber birefringence?

Answer: Imperfections in the fiber are common such as asymmetrical lateral stress, non
circular imperfect variations of refractive index profile. These imperfections break the circular
symmetry of ideal fiber and mode propagate with different phase velocity and the difference
between their refractive index is called fiber birefringence. B=ko(ny-nx)
UNIT-3
1. Define fiber splicing? Explain fusion splicing of optical fiber. [R13-Feb 2019]
Answer: splicing involves joining two fiber optic cables together. The other, more common,
method of joining fibers is called termination or connectorization. Fiber splicing typically
results in lower light loss and back reflection than termination making it the preferred method
when the cable runs are too long for a single length of fiber or when joining two different types
of cable together, such as a 48-fiber cable to four 12-fiber cables. Splicing is also used to restore
fiber optic cables when a buried cable is accidentally severed.There are two methods of fiber
optic splicing, fusion splicing & mechanical splicing
In fusion splicing a machine is used to precisely align the two fiber ends then the glass ends are
"fused" or "welded" together using some type of heat or electric arc. This produces a continuous
connection between the fibers enabling very low loss light transmission. (Typical loss: 0.1 dB)

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2. Define spontaneous emission. [R13-Feb 2019] [R13-Feb
Feb 2018]
Answer: Spontaneous emission is the process in which a quantum mechanical system (such as
an atom, molecule or subatomic particle) transitions from an excited energy state to a lower
energy state (e.g., its ground state) and emits a quantised amount of energy in the form of a
photon.
3. What is the difference between fusion splicing and mechanical splicing? [R13-Nov[R13
2018]
Answer: When compared to mechanical splicing, fusion splicing is fast becoming the
preferred
ed option for fiber termination. By using a fusion splicer – a machine that precisely
aligns two fiber ends before “fusing” or “welding” them together using an electric arc –
the installer can ensure an excellent connection. Fusion splicing can be performed
performe as a
single fusion (fusing just one fiber at a time) or as a mass fusion (fusing 12 fibers in a
single operation). Mechanical splicing doesn’t
doesn’t permanently join two fibers together;
instead, it precisely “holds” them together, enabling light to pass from one fiber to the
other.
4. What is the importance of double hetero junction in LED structures? [R13-Nov

[R13 2018]
Answer:
 It offers higher efficiency with low to high radiance compare to single homojuction (p-
(p
n+) LED type.
 Emitting wavelength of GaAs/AlGaAs based DH LEDs range approx. between 0.8 to
0.9 µm. InP/InGaAsP based LEDs are used for long wavelength radiation between
0.93 to 1.65 µm due to minimum signal attenuation.
 Both n-region and p-region
region are made out of wide bandgap materials (Eg > h*V).
Hence there is no absorption in these regions. They form optical windows.
 n-region and p-region
region can be highly doped.
 Injected electrons and holes are confined in a very narrow active region (i.e. quantum
well) where, the n * p product is extremely high. Hence radiative recombination rate
(R) is also high.
5. What is called equilibrium numerical aperture? [R13-Nov 2018] [R13-Feb

[R13 2018]
Answer: In multimode fibers, the term equilibrium numerical aperture is sometimes used.
This refers to thenumerical aperture with respect to the extreme exit angle of a ray emerging
from a fiber in whichequilibrium mode distribution has been established.
GNITC(Autonomous)-IV
GNITC(Autonomous) Year –I Sem- -Hand Book | 2019-20
2019
78
6. What is meant by splicing? What are the advantages of splicing? [R13-Nov 2018]
Answer: Fiber optic splicing is an important method of joining two fiber optic
cables together. It is a preferred solution when an available fiber cable is not sufficiently long
for the required run. Besides, fiber optic splicing is designed to restore fiber optic cables. In
case they are accidentally broken. Nowadays, fiber optic splicing is widely deployed in
telecommunications, LAN (Local Area Network) and networking projects. Typically, we can
undertaken fiber optic splices two ways: fusion splices and mechanical splices. This paper
firstly illustrates the specific process of fusion splicing method and mechanical splicing
method.
7. What are the different types of light source materials? [R13-Nov 2018]
Answer: Optical transmitter coverts electrical input signal into corresponding optical signal.
The optical signal is then launched into the fiber. Optical source is the major component in an
optical transmitter. Popularly used optical transmitters are Light Emitting Diode (LED) and
semiconductor Laser Diodes (LD).
8. “The optical power launched into a fiber does not depend on the wavelength of the
source but only on its brightness”. Explain. [R13-Nov 2018]
Answer: Radiance: It is the optical power radiated into a unit solid angle per unit emitting
surface area and is generally specified in terms of watts per square centimeter per steradian.
Optical power launched into fiber is dependent only on radiance (brightness) of source. It does
not depends on the wavelength of the source.
. Considering the expressions for optical power coupled power into the fiber it can be concluded
that the power coupled is mainly decided by – source radius, radiance, fiber and numerical
aperture

79
9. Explain population inversion mechanism in optical fibers. [R13-Nov 2018]
Answer:
10. Differentiate the splicer and connector [R13-Feb 2018]

Answer: splice is a permanent joint. Whereas connector is a temporary joint
once splice is connected, u cannot remove it, but in connectors
u can change connectors
UNIT-4
1. Write a short note on error source. [R13-Feb 2019]
Ans: Error Sources:

Errors arise from various noise and disturbances associated with the signal detection
system which is shown in the following figure.
Fig: Noise sources and disturbances in the optical pulse detection mechanism.
The term noise is used to describe unwanted components of an electric signal that tend to
disturb the transmission and processing of the signal in a physical system. The noise
sources can be either external or the system (for example atmospheric noise, equipment
generated noise) or internal to the system.

80
2. What are the line coding techniques in optical communication? [R13-Nov 2018]
Ans: Line Coding:

 In Optical Fiber Communication, Signal Encoding uses a set of rules for
arranging the signal symbols in a particular pattern. This process is called
Channel or line coding.
 Method of converting binary sequence into digital signal.
 Goal is to transmit binary data
Types of Line Coding
There are 3 basic types of line coding, that is used for optical fiber
transmission links:
i) NRZ (Non-Return-to-Zero) Format
ii) RZ (Return Zero) Format
iii)PE (Phase Encoded) Format
3. Give the advantages of Pin diode. [R13-Nov-2017]

Ans: PIN diode is used in a variety of different application from low to high radio frequency.
PIN diode are very good for RF switching, and photo diode. So now check it out
advantages and disadvantages of PIN diode to know more details about PIN diode.
Advantages of PIN diode :
 Low noise
 Low dark current
 Low bias voltage
 Higher reverse voltages to be tolerated
 High speed response
 Low junction capacitance
 Large depletion region
Disadvantages of PIN diode :

 Less sensitivity
 No internal gain
 Small area
 Slow response time
 High reverse recovery time due to power loss are significant
4. Define Internal-Quantum efficiency. And what is the quantum efficiency of photo

detector. [R13-Nov-2017]
Ans: Internal Quantum Efficiency (IQE): is the ratio of the number of charge carriers
collected by the solar cell to the number of photons of a given energy that shine on the solar
cell from outside and are absorbed by the cell.
Definition: The quantum efficiency is defined as fraction of incident photons which
are absorbed by photoconductor and generated electrons which are collected at the
detector terminal.
In other words, Quantum efficiency is defined as fraction of incident photons which
contribuite to photocurrent. It is related to responsivity as per following equation.
Q.E. = 1240 * (Rλ/λ) ;
Where, Rλ = Responsivity in A/W and
λ = Wavelength in nm

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5. What are the different error sources in fiber optical receiver? [R13-Nov-2017]
Ans: Error Sources:

Errors arise from various noise and disturbances associated with the signal detection system
which is shown in the following figure.
Fig: Noise sources and disturbances in the optical pulse detection mechanism.
The term noise is used to describe unwanted components of an electric signal that tend to
disturb the transmission and processing of the signal in a physical system. The noise
sources can be either external or the system (for example atmospheric noise, equipment
generated noise) or internal to the system.
6. Explain quantum Limit. [R13-Mar-2017]
Ans: QUANTUM LIMIT:
Consider an ideal photodetector which has unity quantum efficiency and which produces no dark
current,that is no electron hole pairs are generated in the absence of an optical pulse. With this
condition it is possible to find the minimum received optical power required for a specific bit error
rate performance in a digital system. This minimum received power level is known as the quantum
limit, since all system parameters are assumed ideal and the performance is only limited by the
photodetection statistics.
Assume that an optical pulse of energy E falls on the photo detector in a time interval τ. This can
only be interpreted by the receiver as a 0 pulse if no electron hole pairs are generated with the pulse
present. The probability that n=0 electrons are emitted in a time interval τ is
Thus for a given error probability Pr(0), we can find the minimum energy E required at a specific
wavelength λ.

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UNIT- 5
1. What is WDM? [R13-Nov 2018]
Ans: WDM is wavelength division multiplexing. The optical beam consists of different wavelengths
and several channel information is transmitted over a single channel.
 At the transmitting end, a multiplexer is needed to combine several optical outputs into a
serial spectrum of closely spaced wavelength signals and couple them onto a single fiber.
 At the receiving end, a demultiplexer is required to separate the optical signals into
appropriate detection channels for signal processing.
2. Briefly explain TDM, FDM, WDM and SDM used in optical communication system.
[R13-Nov 2018]
FDM vs TDM vs WDM
WDM is a transmission
TDM is a transmission
FDM is a transmission technique that modulates
technique that allows
technique in which numerous data streams,
multiple users to send
multiple data signals are optical carrier signals of
signals over a common
combined for simultaneous varying wavelengths into
channel by allocating
transmission via a shared a single light beams
fixed time slot for each
communication medium. through a single optical
user.
fiber.
Functionality
FDM divides the
TDM allocates a fixed WDM combines multiple
bandwidth into smaller
time slot for each user light beams from several
frequency ranges
to send signals through channels and combine
antransmitsser transmit
a common channel. them to a single light
data simultaneously
User gets the entire beam and sends through a
through a common channel
bandwidth within that fiber optic strand similar
within their frequency
time slot. to FDM.
range.
Stands for
FDM stands for Frequency TDM stands for Time WDM stands for Wave
Division Multiplexing. Division Multiplexing. Length Multiplexing.
Type of Signals
TDM uses digital and WDM uses optical
FDM uses analog signals.
analog signals. signals.
3. Write short notes on multiplexing in fiber optic receivers. [R13-Nov 2018]

Ans: Optical Multiplexing:
 Optical multiplexer and de-multiplexer are required to multiplex and de-multiplex
various wavelengths onto a single fiber link.
 Each specific I/O will be used for a single wavelength.
 One optical filter system can act as both multiplexer and de-multiplexer

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There are different techniques in multiplexing light signals onto a single optical fiber
link.
 Optical Multiplexing Techniques
 Optical Time Division Multiplexing (OTDM)
 Separating wavelengths in time
 Wavelength division multiplexing (WDM)
 Each channel is assigned a unique carrier frequency
 Channel spacing of about 50GHz
 Coarse Wavelength Division Multiplexing (CWDM)
 Dense Wavelength Division Multiplexing
 Uses a much narrower channel spacing, therefore, many more
wavelengths are supported.
 Code Division Multiplexing
 Also used in microwave transmission.
 Spectrum of each wavelength is assigned a unique spreading code.
 Channels overlap both in time and frequency domains but the code guide
each wavelength.
4. What is WDM and explain its significance [R13-Feb

[R13 2018]
Ans: The WDM is the short form of Wavelength Division Multiplexing. This optical
multiplexing uses different frequencies at different wavelengths to transmit data
separately over multiple channels.
The WDM assigns unique frequencies of light having certain bandwidth to different
optical signals. The multiplexed wavelengths are transmitted over single fiber. At the
demultiplexer end, these signals are selected using tuner of desired bandwidth.
bandwid
Advantages of WDM
 Full duplex transmission is possible.
 Easier to reconfigure.
 Optical components are similar and more reliable.
 It provides higher bandwidth.
 This could be the best approach as it is simple to implement.
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84
 High security
Disadvantages of WDM
 Signals cannot be very close.
 Light wave carrying WDM are limited to 2-point circuit.
 Scalability is a concern as OLT (Optical Line Termination) has to have transmitter
array with one transmitter for each ONU (Optical Network Unit). Adding a new ONU
could be problem unless transmitters were provisioned in advance. Each ONU must
have a wavelength specific laser.
 Cost of system increases with addition of optical components.
 (WDM in PON:) Inefficiency in BW utilization, difficulty in wavelength tuning,
difficulty in cascaded topology
5. Explain briefly about link power budget analysis. [R13-Nov-2017]
Ans: Power budget refers to the amount of loss a data link can tolerate while maintaining
proper operation. In other words, it defines the amount of optical power available for
successful transmitting signal over a distance of optical fiber. Power budget is the
difference between the minimum (worst case) transmitter output power and the
maximum (worst case) receiver input required. The calculations should always
assume the worst-case values, in order to ensure the availability of adequate power
for the link, which means the actual value will always be higher than this. Optical
power budget is measured by dB, which can be calculated by subtracting the
minimum receiver sensitivity from the minimum transmit power:
PB (dB) = PTX (dBm) – PRX (dBm)
The purpose of power budgeting is to ensure that the optical power from
the transmission side to receiver is adequate under all circumstances. As data centers
migrate to 40G, 100G and possible 400G in the near future, link performance
becomes increasingly essential. Link failures would stir up a sequence of problems
like system downtime, which equates to accelerated costs, frustrated users,
deteriorated performance and increased the total cost. While with appropriate power
budgeting, a high-performance link can be achieved for better network reliability,
more flexible cabling and simplified regular maintenance, which is beneficial in the
long run.

85
6. Write short notes on WDM. [R13-Mar-2017]
Ans: The WDM is the short form of Wavelength Division Multiplexing. This optical
multiplexing uses different frequencies at different wavelengths to transmit data
separately over multiple channels.
The WDM assigns unique frequencies of light having certain bandwidth to different
optical signals. The multiplexed wavelengths are transmitted over single fiber. At the
demultiplexer end, these signals are selected using tuner of desired bandwidth.
Advantages of WDM
 Full duplex transmission is possible.
 Easier to reconfigure.
 Optical components are similar and more reliable.
 It provides higher bandwidth.
 This could be the best approach as it is simple to implement.
 High security
MULTIPLE CHOICE QUESTIONS:

UNIT-1
1. In fiber optics, the signal source is ______waves.
a. Light
b. Radio
c. Infrared
d. Very low-frequency
2. In an optical fiber, the inner core is ___________ the cladding.

a. Denser than
b. Less dense than
c. The same density as
d. Another name for
3. When the angle of incidence is __________ the critical angle, the light beam bends along the
interface.
a. More than
b. Less than
c. Equal to
d. None of the above

86
4. When a beam of light travels through media of two different densities, if the angle of
incidence is greater than the critical angle, _____occurs.
a. Reflection
b. Refraction
c. Incidence
d. Criticism
5. Optical fibers, unlike wire media, are highly resistant to

a. High-frequency transmission
b. Low-frequency transmission
c. Electromagnetic interference
d. Refraction
6. Acceptance angle is defined as the _______ angle of incidence at the end face of an optical
fiber, for which the ray can be propagated in the optical fiber is.
a. Maximum
b. minimum
c. Either a or b
d. none of the above
7. The core diameter of single mode step index fiber is about:
a. 60 to 70 µm b. 8 to 10 µm c. 100 to 250 µm d. 50 to 200 µm
8. In multimode graded index fiber, light rays travel _______ in different parts of the fiber.
a. at different speeds
b. with same speed
c. both a and b
d. none of the above
9. What makes optical fibers immune to EMI?

A. They transmit signals in as light rather than electric current.
B. They are too small for magnetic fields to introduce current in them.
C. Magnetic fields cannot penetrate the glass of the fiber.
D. They are readily shielded by outer conductors in cable.
10. Which of the following is not a reason to use fiber-optic cables for point to point data
Transmission?
A. Need to assure data security.
B. Avoidance of ground loops.
C. Data-transfer rates too low to use metal cables.
D. Elimination of spark hazards.
11. In the telecommunications industry, the most commonly used fiber(s) are
A. 50 and 62.5 micron
B. 452.5 micron
C. 10 micron
D. 150 micron
87
12. Which is an advantage of optical communication links over using transmission lines or
Waveguides?
A. Small size B. Extremely wide bandwidths
C. Immunity to electromagnetic interference (EMI) D. All the above
13. The optical spectrum ranges from about to about

A) 25nm (UV) to 150μm (Far IR) B) 50nm (UV) to 100μm (Far IR)
C) 75nm (UV) to 100μm (Far IR) D) 10nm (UV) to 200μm (Far IR)
14. The relationship between the energy E and the frequency v of a photon is given by
A) E = 2hv B) E = h / v C) E = hv D) E = h 2 v
15. Which of the following is correct

A) only step index fibers but not graded index fibers can be divided into single mode and multi
mode classes.
B) step index fibers and graded index fibers can be divided into single mode and multi
mode classes.
C) only graded index fibers but not step index fibers and can be divided into single
mode and multi mode classes.
D) none of the above
16. The refractive index of the core is uniform throughout and undergoes an abrupt
change at the cladding boundary. This is called
A) step-index fiber B) Graded-index fiber
C) multi-mode fiber D) single-mode fiber
17. In a Graded index Fibre

A) Core has a Refractive index that decrease with increasing radial distance from fiber axis
(B) Core has a refractive index that increase with increasing radial distance from the fiber axis
(C) No variation
(D) None
18. In single-mode fibers, we have

(A) Waves with different frequencies, but of the same mode
(B) waves with same frequencies, but of the same mode
(C) Waves with different frequencies, but of different mode
(D) Waves with same frequencies, but of the different mode
19. Light may be propagated along a fiber-optic cable in which of the following
modes?
(A) Multimode step index (B) single-mode step index
(C) Multimode graded index (D) all of the above
20. The ratio is known as _ _ , where n, n 1 are refractive index
a. Incidence coefficient
b. Reflection coefficient
c. Zero coefficient d. Transmission coefficient

88
21. A Ga As optical source with a refractive index of 3.6 is coupled to a Silica Fiber
that has a refractive index of 1.48. If the Fiber end and the source are in close physical
contact, then the Fresnel reflection at interface is _ _
a. 2 b. 0.2 c. 0.5 d. 0.174
22. The emission pattern for a lambertion source __ _ relation ship

a. B ((θ,φ) = B 0 cosθ
b. B (θ,φ ) = B0 sinθ
c. B(θ,φ)=B0 tanθ
d. B (θ,φ) =B0 secθ
23. The freshed reflection or the reflectively at the Fiber - core end Face is _ _
a.
b.
c.
d.
24. The phase of the driven Fiber always _ _ behind the phase of the driving
Fiber
a. Leads 900 b. Lags 90 0 c. Inphase d. Lags 1800
25. A common fabrication method for an N XN splitter is to fuse together the cores of __ single
mode Fibers over length of a few millimeters
a. (N-1) b. (N+2) c. (N-2) d. N
26. The following method is used for manufacturing optical fiber

a. oxidation b. Chemical Vapor deposition
c. outside vapor deposition d. chemical deposition
27. Temperature used in fabrication of the fiber optic is

a. 1400 °C ~ 1600 °C b. 140 °C ~ 160 °C c. 400 °C ~ 600 °C d.40 °C ~ 60 °C
28. Dopants used for manufacturing Core material is

a. GeO2 b. B2O3 c. FlO3 d. CuO3
29. Dopants used for manufacturing Cladding material is

a. GeO2 b. B2O3 c. K2O3 d. CuO3
30. Adding _______ doping material to silica, increases the refractive index
89
a. GeO2 b. B2O3 c. FlO3 d. CuO3
31. Adding _______ doping material to silica, decreases the refractive index
a. GeO2 b. B2O3 c. K2O3 d. CuO3
1 A 11 A 21 D 31 B
2 B 12 D 22 A
3 A 13 B 23 D
4 A 14 B 24 B
5 C 15 D 25 D
6 A 16 A 26. B
7 B 17 A 27 A
8 A 18 A 28 A
9 A 19 D 29 B
10 C 20 B 30 A
UNIT-2
1. Light is confined with the core of a simple optical fiber by

A. refraction.
B. total internal reflection at the outer edge of the cladding.
C. total internal reflection at the core cladding boundary.
D. reflection from the fiber's plastic coating.
2. The type of light source and fiber chosen for FDDI networks are:
A. single-mode fiber and 1550-nm lasers.
B. single-mode fiber and 1300-nm lasers.
C. multi-mode fiber and 1300-nm lasers.
D. multi-mode fiber and 1300-nm LEDs.
3. Which of the following is NOT true about digital signals used in fiber optic transmissions?
A. It's more compatible with people.
B. It's much simpler to design a circuit to detect the signal level.
C. There's less distortion in the signals as it goes through a system.
D. Isn't difficult to differentiate the on from off state even if the signal is not reproduced exactly.
4. The most common light used in fiber-optic links is

A. Infrared B. Red C. Violet D. Ultraviolet
5. The abrupt change in refractive index from core to cladding of fiber-optic cable is called the
A. Total internal reflection B. Numerical aperture
B. Dispersion D. Step index
6. Which of the following considerations is important when deciding between using a diode
laser or an LED?
A. Response time B. Power levels
C. Temperature sensitivity D. Failure characteristics

90
7. Rayleigh scattering in glass is the same phenomenon that scatters light from the sun in
the atmosphere, thereby giving rise to a
A) blue sky B) red sky C) dark black sky D) none of the above
8. In order for a light ray to propagate along a fiber-optic cable, what must be the relationship
between the angle of incidence and the critical angle?
(A) θi < θc (B) θi > θc (C) θi = θc (D)none
9. The amount of optical power emitted from a source that can be coupled in to Fiber is
usually given by ___
a. Normal efficiency b. Coupling efficiency
c. Process of coupling d. Fly lead
10. is the optical power radiated in to a unit solid angle per unit emitting surface
area
a. Radiance b. incidence c. Reflection d..Transmission
11. Surface emitting L E D'S are characterized by lambertian output pattern, which means
the source is equally bright when viewed from any ____
a. Direction b. Glass c. Y, Z direction d. Incidence
12. The function of __ __ is to magnify the emitting area of the source to

match exactly the core area of the Fiber end Face
a. Micro lens b. Mirror c. Operator d. Fiber
13. _ _ Can be reduced by having an index - matching material between the

source and the Fiber end
a. Output power
b.Power loss in decibels
c Power in watts
d. Power loss in watts
14. The optical power launched in to a Fiber depend up on the __ _ of the

source
a. Wave length b. Brightness c. Incidence d. Reflection
15. The radiated power per mode, is given as __ _
a. Bo
2
b. Bo λ
c. B 2 λ 20
d. B λ 0
16. Two identically sized sources operating at different wave lengths but having identical
radiances will launch _ __ amounts of optical power into the same Fiber
a. Different
b. Equal
c. Decreasing
d. Increasing

91
17. The degree of mode coupling occurring in a Fiber is primarily a function of
a. Core -cladding index difference
b. Coupling
c. Fiber
d. Wave length
18. If the emitting area of the source is smaller than the core area , a miniature lens may be
placed between the source and the Fiber to improve the _ _ _
a. coupling
b. Fiber quality
c. Wave length
d. Power coupling efficiency
19. _ _ is most efficient lensing method

a. Lens
b. Mirror
c. Non imaging micro scope
d. Microscope
20. _ _ Separation occurs when the Fibers have the same axis but
have a gap between their end Faces
a. Lateral
b. Angular
c. Longitudinal
d. Circular
21. Fiber -to -Fiber coupling loss (LF) given in terms of Fiber -to -Fiber coupling efficiency (nF)
is _ __
a. LF = -1ologn F
b. LF = -20 log nF
c. LF = nF
d. L = 10 nr
F
22. ________ offset reduces the common -core area of the two Fiber end Faces
a. Axial b. Lateral c. Longitudinal d. Angular
23. A light source is often supplied with a short Fiber _ __ attached to it in

order to
Facilitate coupling the source to a system Fiber
a. Fly lead b. Cut c. Squashed d. Convex mirror
24. The best coupling efficiency is achieved by _ _ method

a. L E D b. lens c. Direct – Butt d. Microscopic

92
25. The Fiber to Fiber coupling efficiency is the ratio of common mode volume to _ __
a. Number of modes in the emitting Fiber

b. Area
c. Fiber
d. Fiber cladding
26. The optical power in concentrated at __ of the Fiber core

a. Outer
b. Inner diameter
c. External to Fiber
d. Near the center
27. _ losses result from mechanical mis-alignments because the

radiation core of the emitting Fiber does not match the acceptance cone of the receiving
Fiber
a. Absorption b. Convection c. Radiation d. Conduction
28. _ _ misalignment results when the two axes Form an angle so that the
Fiber end Faces are no longer parallel
a. Lateral b. Angular c. Longitudinal d. Axial
29. The most common misalignment which causes the greatest power loss is _
a. Lateral b. Angular c. Longitudinal d. Axial
30. In_ Fiber, different launch conditions can yield different loss values
a. Single mode b. Multi mode c. Photo detector d. Madrel wrap
31. In insertion -loss method the launch and detector coupling are made through ___
a. Points b. Joints c. Couplers d. Separation
32. In insertion -loss method, _ _ _ is the sum of the loss of the

cabled Fiber and
the connector between the launch connector and the cable
a. Measurement b. Attenuation c. Wave length d. Frequency
33. In cut -back technique, if the spot size is small and its numerical aperture is less than that
of the Fiber core, the optical power is concentrated in the _ _ of the core
a. Side b. Surface c. Center d. Distribution
34. Greater transmission distances are possible when a _________ is missing is used in
conjunction with an avalanche photo diode
a. Pin photo diode b. Transistor c. Laser diode d. spectral
35. Silicon photo diodes are used in the region of

A) 300 to 900 nm B) 1800 to 1900 nm C) 800 to 900 nm D) 550nm to 1300nm

93
36. In optical communication system, the light detector is:
a. Avalanche Photo Diode (APD)

b. Positive Intrinsic Negative (PIN) diode
c. phototransistor
d. Either a or b
37. The pin photo diode consists of p and n regions separated by a very _ _ doped intrinsic region
a. Electron b. Lightly n c. Lightly p d. Lightly n&p
38. In pin photo diode the time it takes for an electron or hole to recombine is known as_____
a. Life time b. Life c. Carrier life time d. Depletion time
39. A silicon avalanche photo diode has a Quantum efficiency of 65% at a wave length at
900nm . Suppose 0.5 µw of optical power produces a multiplied photo current of calculate the
multiplication M
a. 10 b. 20 c. 33 d. 43
40. In a 100ns pulse, 6x10 6 photons at a wave length of 1300 nm fall on an InGaAS
photo detector. on the average, 5.4x10 6 electron - hole pairs are generated calculate
Quantum efficiency a. 10% b. 60% c. 50% d. 90%
41. The carrier multiplication mechanics in Avalanche- photodiodes is known as __ _

a. High energy level b. Impact Ionization c. Thermal breakdown d. Circuit breakdown
42. The average number of electron -hole pairs created by a carrier per unit distance travelled
is called as _
a. Ionization rate b. Thermal rate c. Break down d. Multiplication rate
43. _ is the number of the electron - hole carrier pairs generated per incident
photon of energy
a. Quantum efficiency b. electron efficiency c. Rise time d. Speed
44. The performance of a photo diode is often characterized by the _ _

a. Depletion layer b. Quantum layer c. Responsivity d. Incident
45. The __ of a photo detector in an optical fiber communication system is

Describable in terms of minimum detectable optical power
a. efficiency b. output power c. sensitivity d. selectivity

94
46. noise arises from the statistical nature the production and collection of photo
electrons when an signal is incident on a photo detector.
a. Quantum b. Dark current c. Fluctuations d. Leakage current
47. The bulk dark current is directly proportional to the __

a. surface area b. power c. current d. quantum
48. The Band width of InGaAS pin photodiode is _ _

a. 10-20 GHZ b. 6-20 GHZ c. 1-2 GHZ d. 0 to 25 GHZ
49. The Band width of Germanium avalanche photodiode is __

a. 3-100 GHZ b. 2-10 GHZ c. 3-80GHZ d. 50-250 GHZ
50. The rise time for silicon pin photodiodes is _ _

a. 2-3 ns b. 0.5-1 ns c. 10-30 ns d. 50-100 ns
51. The normal wave length range of silicon pin photodiode is

a. 100-300 nm b. 300 nm c. 400-1100 nm d. 600-8000 nm
52. Normally for larger links _______ based photo diodes are used
a. Si b. Ge c. In Ga AS d. Si Ge
53. Normal cut off wavelength of silicon semiconductor is _

a. 1.06 µm b. 2µm c. 1.5µm d. 3.2µm
54. Senses the luminescent power Falling up on it and converts the variation of this
optical power into a correspondingly varying electric current
a. Photo detector b. Multipliers c. Diodes d. Transistors
55. _______ Consists a photo cathode and an electron multiplier packaged in a vacuum tube
a. Photo multiplier b. Multipliers c. Diodes d. Transistors
56 . Pyro electric photo detectors involve the conversion of ________to heat

a. Electrons b. Charges c. Photons d. Atoms
57. is used almost exclusively for Fiber optic systems because of its small size,
suitable material high sensitivity and fast response time
a. Electrons b. Pyroelectric c. Multipliers d. Photo diode
58. In Pin - photo detector, the process that general Free electron - hole pairs are called as
a. Diffusion b. Photo carriers c. Electrons d. Ions
59. The units of band gap energy (E g)of the material is _ _

a. Volts b. Amperes c. Watts d. Electron volts
60. __ internally multiply the primary signal photo current before it enters the input
circuitry of the following amplifier
a. Pin photo diode b. Avalanche photo diode c. Diode d. Transistor

95
61. The phenomenon of impact ionization to gaining high energy which is accelerated by the
high electric field is _
a. Ionization b. Avalanche effect c. Thermal effect d. Break down effect
62. The multiplication (M) for all carriers generated in the photo diode is defined as __ _
a.
b.
c. Mm
d.
63. The power signal-to-noise ratio at the output of an optical receiver is defined by
64. In Fiber optic communication systems, the photo diode is generally required to detect
a. good optical signals b. very weak optical signals
c. high signals d. photons
65. The photo detector should have _ to generate a large signal power
a. low efficiency b. current c. high power d. high quantum efficiency
66. The photo detector and amplifier noises should be kept as _ _ _ as possible
a. high b. low c. constant d. infinite
67. The quantum noise current has a mean square value in a bandwidth B which is proportional to
the average value of the
a. voltage b. power c. photo current d. leakage current

96
68. The noise is the current of the continuous to flow through the bias circuit of the
device when no light is incident on the photodiode
a. quantum b. photodiode dark current
c. fluctuation d. leakage current
69. Longer links usually required operation in the ________ wave length region
a. 300 nm b. 400 nm c. 1300 nm d. 20, 000 nm
70. The normal wave length range of silicon pin photodiode is

a. 100-300 m b. 300 nm c. 400-1100 nm d. 600-8000 nm
71. The wave length range of Germanium avalanche photodiode is _____
a. 800-1650 nm b. 300-800 nm c. 400-1100 nm d. 500-600 nm
72. The Dark current of Germanium pin photodiode is _ _
a. 300-1000 nA b. 50-500 nA c. 0-10 nA d. 300-2000 nA
73. For _ applications, Si devices operating around 850 nm provide inexpensive solutions
for most links
a. long distance b. short distance c. less gain d. less voltage
74. __ converts the optical energy from the fiber in to an electrical signal
a. conductor b. electrons c. photo transistor d. photo detector
1 B 16 A 31 B 46 D 61 B
2 D 17 D 32 C 47 A 62 B
3 A 18 C 33 C 48 C 63 B
4 A 19 C 34 C 49 B 64 B
5 A 20 A 35 D 50 B 65 D
6 A 21 A 36 B 51 C 66 B
7 A 22 A 37 C 52 C 67 C
8 B 23 C 38 D 53 A 68 B
9 A 24 A 39 D 54 A 69 C
10 A 25 D 40 B 55 A 70 C
11 A 26 C 41 A 56 C 71 A
12 B 27 B 41 A 57 D 72 B
13 B 28 D 43 C 58 B 73 B
14 B 29 B 44 C 59 D 74 D
15 B 30 B 45 A 60 B

97
UNIT-3
1. The largest contributor to fiber attenuation is

(A) Absorption (B) Scattering (C) Bending losses (D) Microbends
2. Fiber-optic connections suffer high loss due to

A. Air gaps
B. Axial misalignment
C. Angular misalignment
D. All the above
3. The dispersion in fiber optics is termed

A. Model B. Chromatic C. Polarization D. All the above
4. The dispersion of light in fiber-optic cable caused by a portion of the light energy traveling in
the cladding is called
A. Modal dispersion B. Material dispersion C. Waveguide dispersion D. Cable
dispersion
5. Which is not an important characteristic of a light detector?

A. Responsivity B. Dark current C. Response speed D. Power consumption
6. Calculate the optical power 100 km from a 0.5 mW source on a single-mode fiber that has
0.10 dB per km loss.
A. 50nW B. 5mW C. 5µW D. 50µW
7. A technique that is used to minimize the pulse dispersion effect is to

A. Use a higher frequency light source B. Use plastic cladding
B. Minimize the core diameter D. All the above
8. The loss (attenuation) of signal in optical fiber is due to

A. Scattering B. Absorption C. Bending D. All the above
9. are not confined to a single plane, but instead tend to follow a helical-type
path along the fiber.
A) Bound rays B) Skew rays C) Meridional rays D) Leaky rays
10. Signal distortion in an Optical Fibre is due to

A) Attenuation (B) Scattering and bending losses
(C) Absorption (D) Core and cladding
11. If the dispersion is high

(A) Bit rate will be high (B) Bit rate will be low (C) Bit rate is unaffected (D) None of the
above
12. Material dispersion (D) in optical fibre is

(A) (-λ/c)×(d²n/dλ²) (B) (-λc / dλ²)×(d²n/c) (C) (-d²n λ /c)×( λ /dλ²) (D) (-
λ)×(d²n/dλ²)

98
13. For pulse dispersion the Fiber transfer function must not roll off to less than __ _
of its low frequency value for frequencies up to half the desired bit rate
a. 1 b. 0.5 c. 3 d. 4
14. For pulse dispersion, the r.m.s width of the Fiber impulse response must be less than
_ of the pulse spacing
a. Half b. 3 c. One Quarter d. 1
15. _ _ produce pulse broadening of light wave signals in optical

Fiber, there by limiting the information - carrying capacity
a. Attenuation b. Dispersion c. Insertion d. Cut-back
16. In multimode Fibers __ _ _ arises from the Fact that each mode in
an optical pulse travels a slightly different distance and thus arrives at the Fiber end at
slightly off set times
a. Inter modal dispersion b. Intra modal dispersion
c. Chromatic dispersion d. Polarization
17. _ _ sterms from the variation in the propagation speed of the individual
wave length Components of an optical signal
a. Chromatic dispersion b. Intermodal dispersion
c. Intra modal dispersion d. Polarization
18. _ _ __dispersion arises from the splitting of a polarized signal

into orthogonal polarization modes, each of which has a different propagation speed
a. chromatic b. Intermodal c. Polarization d. Intra modal dispersion
19. The transfer function of a Fiber optic cable is of importance because it contains __
information of the system
a. Gain b. Band width c. Output pattern d. Input pattern
20. Chromatic dispersion is the primary dispersive mechanism is _ _ Fibers

a. Single-mode b. Multi-mode c. Co-axial d. Light
21. _ is the resulting difference in propagation times between the two

orthogonal polarization modes at a given wave length will result in pulse spreading
a. Chromatic dispersion b. Polarization - mode dispersion
c. Phase - shift method d. Dispersion method
22. _ _occurs when light enters a medium that has a different index of
refraction
Fresnel reflection b. Dispersion c. Trace d. Scattering

99
23. The Pseudorandom binary sequence pattern length is of the form _
a. 2N b. (2*N) c. (2 N-1) d. (1-2N )
24. the optical signal that gets coupled from the light source to the fiber becomes attenuated
and as it propagates along the fiber wave guide
a. simplified b. binary format c. distorted d. linear
25. The system parameters involved in deciding between the use of an LED and a laser
diode are signal dispersion data rate, __ _ and _ __
a. transmission distance, cost b. distance , power
c. power, Fiber thickness d. losses, speed
26. The __ limit depends on material and modal dispersion

a. dispersion b. power c. loss d. pulse
27. The _ loss refers to the loss for a particular port - to - port path
a. Excess b. Splitting c. Insertion d. Coupler
28. _ wave length division components include tunable optical filters, tunable sources
,and optical amplifiers
a. Passive b. Real c. Active d. Inductance
29. For large optical incident on a pin photodiode, the _ noise associated
with the signal detection process dominates
a. quantum b. bit rate c. thermal d. band width
30. When an avalanche photodiode is employed at low signal levels and with low values of
gain M. the _ term dominates
a. quantum b. circuit noise c. thermal d. bit-rat
31. For a given set of operating conditions in avalanche photo diode, the optimum value of
the avalanche gain, the signal to noise ratio is __ _
a. small b. maximum c. zero d. infinite
32. For low signal levels an __ __Photodiode yields a higher signal to noise
ratio
a. Pin b. Avalanche c. Piezoelectric d. Multipliers

100
1 B 11 B 21 B 31 B
2 D 12 A 22 A 32 B
3 D 13 B 23 C
4 C 14 C 24 C
5 C 15 B 25 A
6 D 16 B 26 B
7 C 17 A 27 C
8 D 18 C 28 C
9 B 19 B 29 A
10 C 20 A 30 B
UNIT-4:
1. What method allows large number of independent, selectable channels to exist on a single
fiber?
A. Frequency Division Multiplexing.
B. Time Division Multiplexing.
C. Analog Modulation.
D. Phase Modulation.
2. A measure of the amount of optical power emitted from a source

that can be coupled into fiber is usually given by the coupling efficiency defined as
A. η =PF / 2PS B. η =2PF/ PS C. η =PF / PS D. η =PS/ PF
3. Most of the fiber optic systems use a __ _ signal

a. Analog b. Two-level binary digital
c. Discrete d. Non-periodic
4. the transmitted signal is a two-level binary data stream consisting of either a 0 or a 1 in a

time slot of duration T b and this time slot is referred as _ _
a. duration b. bit period c. Quantum d. Data line
5. A decision circuit compares the signal in each time slot with a certain reference voltage
known as the __ level
a. zero b. infinite c. unknown d. threshold
6. The error rate depends on __ at the receiver

a. Signal b. Noise c. Signal to noise ratio d. Type
7. To compute the bit error rate at the receiver we have to known the _ _ _ of the signal at
the equalizer output
a. type b. probability distribution c. noise d. count

101
8. The is widely used to specify receiver performance since it is related to the signal-to-
noise ratio required to achieve a specific bit-error rate
a. error probability b. φ-parameter c. variance d. noise
9. The signal-to-noise ratio at which the transition occur is called the _ __

a. Threshold level b. Inching effect c. Biasing point d. Link level
10. _ noise arises when the light from a coherent laser is coupled in to a
multimode fiber
a. thermal b. modal c. mode-partition d. chirping
11. IF p F and Pn respect the output powers of the far and near ends of the Fiber, the
average loss
α in decibels per kilometer is given by __ _ _
12. To increase the end-to end fidelity of an optical transmission line, can be used
if the bit-error rate is limited by optical noise and dispersion
a. forward error correction b. Slew rate c. Systems d. Signal-to-noise
13. The optical power received at the photo detector depends on the amount of light coupled in
to the fiber and the occurring in the fiber
a. losses b. output c. budget d. link
14. A _ __ analysis is a convenient method for determining the dispersion limitation of an

optical fiber link
a. loss b. Power c. Rise-time budget d. Pulse
15. The achievable transmission distances are those that fall below the __ _ and to the left
of the dispersion line
a. dispersion b. Attenuation limit curve c. Pulse d. Material limit
16. _ _ receiver is simpler more stable with changes in temperature, less

expensive
a. avalanche photodiode b. piezoelectric c. Pin photo diode d. Photo
transistor
17. The simplest transmission link is a point-to -point line that has a transmitter on one end and
__ on the other
a. point b. Receiver c. System d. Bandwidth
18. If the transmission distance is long, we may operate in _ _ region

a. 500-600 nm b. 1300-1550 nm c. 200-300 nm d. 600-800 nm
19. The transmitted optical power in the amplitude modulation form is ______
a. P(t)=Pt[1+s(t)] b. P(t)=P t[1+ms(t)] c. P(t) = Ptms(t) d. P(t)=0
20. For low optical power levels __ photo diode is very useful
a. PIN b. Avalanche c. Pyro-electric d. Photo transistor

102
21. Modal noise is not a problem for links operating below _______
a. 10 Mb/s b. 0.1 Mb/s c. 0.003 Mb/s d. 100 Mb/s
22. For a Analog receiver, the performance fidelity is measured in terms of a __
__ ratio
a. Noise b. Signal-to-Noise c. Frequency d. Source
23. Two analyses are usually carried out to ensure that the derived system performance can be
met by using link power budget and the _ _
a. bit-error rate
b. system rise time budget analysis
c. receiver
d. band width
24. Photomultipliers consisting of a photocathode and an electron multiplier packaged in a

vacuum tube are capable of and ________
A. very high gain, very high noise. B. very low gain, very low noise
C. very high gain, very low noise D. very high gain, very high noise
25. typical error rates for optical fiber telecommunication systems range from ___ to
a. 103 to 10 5 b. 10 -9 to 10 -12
c. 10-6 to 108 d. 10 -9 to 10-25
26. For unbiased data with equal probability of 1 and 0 occurrences, a=b=_ in error
probability
a. 1 b. 0.6 c. 0 d. 0.5
27. The ratio of number of errors occurring over a time interval by the number of pulses(Nt)
transmitted during this interval is __
a. Bit-error rate b. Pulses c. Count d. Efficiency
28. If a signal S is the Gaussian probability distribution function_ _ is usd to

measure the width of the probability distribution
a. variance b. standard deviation c. Mean d. Parabolic
29. The low impedance pre-amplifier do not provide a _ _ receiver sensitivity

a. low b. high c. zero d. equal
30. Signal to Noise ratio is defined as the ratio of the mean-square signal current to the
a. Noise b. Interference c. Mean-Square noise current d. Impulse
current
31. Analog technique is to use amplitude modulation of the _ _

a. source b. receiver c. noise d. power

103
32. __ is the ratio of variation in current about the bias point to the input
drive current
a. modulation index b. noise-signal c. power relation d. signal current
33. In order not to introduce distortion in to the optical signal, the modulation must be
confined to the _ region
a. Bias b. Linear c. Nonlinear d. Power
34. In analog receivers, the signal of the photo diode output current and inversely proportional
to the _ of the circuit
a. thermal noise b. source c. impulse d. frequency
35. The individual frequency signals can be extracted from the combined frequency division
multiplexing signal by appropriate _ at the receiver terminal
a. time sharing b. electrical filtering c. bands d. energy levels
36. _ _ multiplexing technique requires an increase in the number of opticl

components required within a particular system and therefore has not been widely used
a. frequency division b. time division c. pulse division d. space division
37. The dominant design criteria for a specific application using either digital or analog
transmission techniques are __ and _ _
a. transmission distance, rate of information transfer b. distance delay
c. delay, non periodic d. peridic, non periodic
38. In order to maximize the information transfer over an optical fiber communication link it
is usual to _ _- several signals on to a single fiber
a. de multiplex b. multiplex c. grouped d. tied
39. Digital pulse modulation schemes may be extended to multi channel operation by _ _
multiplexing
a. Time division b. Pulse c. Source d. Signal receiver
40. In _ multiplexing the optical channel band width is divided in to a non

over lapping bands and each signal is arrigned one of these bands of frequencies
a. Time division b. Pulse division c. Frequency division d. Signal
41. The separation and extration of the multiplexes signals (ie wave length separation) is
performed with __ _
a. Optical filters b. Suppressors c. dividers d. Multi channel
42. Multiplexing technique which does not involve the application of several message signls
on to single fiber is known as multiplexing
a. source b. signal c. power d. space division

104
43. In _ multiplexing each signal channel is carried on a separate fiber with in
a fiber bundle
a. frequency division b. space division c. time division d. multi channel
44. The good optical isolation offered by fiber means the cross coupling between channels
can be made _ _ _
a. zero b. infinite c. negligible d. to increase
1 A 11 A 21 D 31 A 41 A
2 A 12 A 22 B 32 A 42 D
3 B 13 A 23 B 33 B 43 B
4 B 14 C 24 C 34 A 44 C
5 D 15 B 25 B 35 B
6 C 16 C 26 D 36 D
7 B 17 B 27 A 37 A
8 B 18 B 28 B 38 B
9 A 19 B 29 B 39 A
10 C 20 B 30 C 40 C
UNIT-5
1. Which of the following describes a technique to achieve fault tolerance in optical networks
with
minimum costs?
A. Bypassing active elements.
B. Avoid the usage of star couplers.
C. Duplication of system properties.
D. Topological reconfiguration.
2. What are the advantages of using parallel optical fiber interconnections within board-to-board
or
frame-to-frame connections in computer systems?
A. No bandwidth limit.
B. Space saving.
C. Avoids electrical crosstalk.
D. All of the above.
3. Which of the following is NOT a reason to use flexible optical circuits?

A. Low loss distribution.
B. Protection of fiber.
C. Small size.
D. Compact and bend easily.
4. Which of the following communications systems typically use fiber optic

backbones?
(A) Telephones (B) CATV, Cell Phones (C) Internet (D) All of the above

105
5.Which of the following is not a reason to use fiber-optic cables for point to point
data transmission?
(A) Need to assure data security. (B) Avoidance of ground
loops.
(C) Data-transfer rates too low to use metal cables. (D) Elimination of spark hazards
6. Which of the following involve the conversion of photons to heat?

A. Photoconductors B. Piezoelectric photo detectors C. Phototransistors D.
photodiodes
7. Steady-state equilibrium-mode distributions are typically achieved by the

method.
A. mandrel-wrap B. insertion-loss C. Cutback D. none
8. For short distance applications ……….. devices operate around 850nm and provide
relatively
inexpensive solutions for most links
A. Ge B. Si C. InGaAs D. None
9. A less accurate but nondestructive method is the method, which is useful for cables
with connectors on them.
A. mandrel-wrap B. insertion-loss C. Cutback D. none
10. Optical power level at the fiber output starts to as the modulation frequency is increased.
A. increase B. decrease C. both A & B D. none
11. The equalizer in Receiver configuration is a _ __ shaping filter

a. linear frequency b. voltage c. current d. heat
12. The primary photo current generated by the photodiode is a _ _ poisson's

process resulting from the random arrival of photons at the detector
a. constant b. time varying c. instant d. fixed time
13. The input noise current source arises from the _ _ of the amplifier input resistance
a. quantum b. speak noise c. thermal noise d. wave noise
14. The equalizer in Receiver configuration is used to mitigate the effects of and inter
symbol interference
a. voltage b. Current c. signal distortion d. Source
15. In some cases, __ _ may be used to correct the electric frequency

response of the photo detector and the amplifier
a. equalizer b. transmitter c. photo detector d. amplifier
16. The high impedance pre amplifier produces a large input __ _ time constant
a. R b. C c. RC d.

106
17. The link loss expressed in decibels are __ _
a. loss=10log
b. loss=10 log
c. loss=
d. loss=
18. _ uses a set of rules for arranging the signal symbols in a particular
pattern
a. single mode links b. encoding c. decoding d. signal encoding
19. The technology of combining a number of wave lengths on to the same Fiber is known as_
multiplexing
a. Wave length division b. Pulse division c. Frequency division d. Time
division
20. Wave length division multiplexing is same as __ _ multiplexing
a. Pulse division b. Frequency division c. Pulse division d. Time division
21. Wave length division must be properly spaced to avoid _

a. Noise b. Thermal c. Quantum d. Inter channel Interference
22. The application of wave length division multiplexing is __ of existing

point -to - point Fiber optic transmission links
a. Capacity upgrade b. Interference c. Wavelength d. Capacity decrease
23. is that each optical channel can carry any transmission Format
a. Pulse division b. Frequency division c. Wave length division d. Quantum
24. Wave length division multiplexing is essentially frequency division multiplexing at __

frequencies
a. Low b. High c. Optical carrier d. channel
25. To prevent spurious signals from entering a receiving channel, the de-multiplexer must
exhibit _ spectral operation
a. Broader b. Zero c. Infinite d. Narrow
26. _ _ components can be fabricated by means of planar optical

wave guides using material such as lithium nitrate
a. Active b. Passive c. Lumped d. Distributed

107
27. _ _ measures the degree of isolation between the input at one port
and the optical power back in to the other input port
a. Splitting b. Insertion c. Coupler d. Cross talk
28. _ is define as the ratio of the input to the total output power, in a 2X2
coupler
a. Noise b. Quantum c. Excess loss d. Heat loss
29. Most passive wave length division multiplexing devices are variations of a
_
concept
a. Normal b. Star – coupler c. Wind - coupler d. Delta –
coupler
30. The cross talk optical power equation is given as __

a.
bc
31. Any size star coupler can be made, in principle, provided that all Fibers can be heated
uniformly during the _ _ process
a. Heating b. Coupler c. Coupler- Fabrication d. Gain
32. For a NXM coupler, the coupler has __ inputs and _

outputs
a. N, M b. (N-1),(M-1) c. (N+1),(M+1) d. (N-1)(M+1)
33. _ devices makes the tapers very gradual, so that only a

negligible fraction of the incoming optical power is reflected back in to either of the
input ports
a. Directional couplers b. Tapered coupler c. Fused coupler d.
Reverse coupler
34. The attenuation of the cable in decibels by insertion loss method is _ _
a.
c.

108
35. _ _ of optical power in a Fiber wave guide is a result of
absorption processes, scattering mechanisms and wave guide effects
a. Dispersion b. Attenuation c. Line loading d. Single mode fibers
36. Measuring the optical power transmitted through a long and a short length of the
same fiber using identical input couplings method is known as _ _
a. Attenuation b. Cut back technique c. Coding d. Analyzer
37. The _ _ is a destructive method requiring access to both ends of the

Fiber
a. Attenuation technique b. Cut back technique c. Connectors d. Optical system
38. _ in an optical fiber system arises from noise in the receiver and pulse
distortion in the optical fiber
a. noise b. pattern c. timing jitter d. accuracy
39. Which of the following describes a technique to achieve fault tolerance in optical networks
with
minimum costs?
A. Bypassing active elements.
B. Avoid the usage of star couplers.
C. Duplication of system properties.
D. Topological reconfiguration.
40. __ __ provides a larger gain factor and a broader band width

a. transmitter b. receiver c. source d. optical pre amplifier
41. An _ _ consists of a photo detector, an amplifier and signal processing

circuitry
a. optical source b. transmitter c. optical receiver d. energy device
42. Optical amplifier is placed a head of the photo diode to __ the optical
signal level before photo detection
a. boost b. lessen c. zero level d. introduce noise in
43. Optical amplifier is placed such that __ _ degradation caused by

thermal noise in the receiver electronics can be suppressed
a. gain b. signal c. signal to noise ratio d. input
44. Passive devices operate completely in the optical domain to __ _____ _ and _
light streams
a. Split, combine b. Split, uncombined c. Zero, one d. Light, dark

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1 D 11 A 21 D 31 C 41 C
2 D 12 B 22 A 32 A 42 A
3 C 13 C 23 C 33 A 43 C
4 D 14 C 24 C 34 A 44 A
5 C 15 A 25 D 35 B 45
6 B 16 C 26 B 36 B 46
7 A 17 B 27 D 37 B 47
8 B 18 D 28 C 38 C 48
9 B 19 A 29 B 39 D 49
10 B 20 B 30 A 40 D 50

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3. EMBEDDED SYSTEMS DESIGN (EC0755)
SYLLABUS:-
UNIT -I
Introduction to Embedded Systems: Definition of Embedded System, Embedded Systems Vs
General Computing Systems, History of Embedded Systems, Classification, Major Application
Areas, Purpose of Embedded Systems, Characteristics and Quality Attributes of Embedded
Systems.
UNIT -II
Typical Embedded System: Core of the Embedded System: General Purpose and Domain
Specific Processors, ASICs, PLDs,Commercial Off-The-Shelf Components (COTS), Memory:
ROM, RAM, Memory according to the type of Interface, Memory Shadowing, Memory
selection for Embedded Systems, Sensors and Actuators, Communication Interface: Onboard
and External Communication Interfaces.
UNIT -III
Embedded Firmware: Reset Circuit, Brown-out Protection Circuit, Oscillator Unit, Real
Time Clock, Watchdog Timer, Embedded Firmware Design Approaches and Development
Languages.
UNIT -IV
RTOS Based Embedded System Design: Operating System Basics, Types of Operating
Systems, Tasks, Process and Threads, Multiprocessing and Multitasking, Task Scheduling.
UNIT -V
Task Communication: Shared Memory, Message Passing, Remote Procedure Call and
Sockets, Task Synchronization: Task Communication/Synchronization Issues, Task
Synchronization Techniques, Device Drivers, How to Choose an RTOS.
TEXT BOOKS:
1. Introduction to Embedded Systems - Shibu K.V, Mc Graw Hill.
REFERENCE BOOKS:
1. Embedded Systems - Raj Kamal, TMH.
2. Embedded System Design - Frank Vahid, Tony Givargis, John Wiley.
3. Embedded Systems – Lyla, Pearson, 2013
4. An Embedded Software Primer - David E. Simon, Pearson Education.

111
CONSOLIDATED UNIT WISE LESSON PLAN:-
Faculty: Dr.S.J. Sugumar,V.Bhagyaraju, Noor Ahmed, V.Saibabu

No of
Unit Topic Chapters
Classes
Introduction to
Reference Book
I Embedded Chapter 1 13
1
Systems
Typical Embedded
II Text Book-1 Chapter 3 12
System
Embedded
Firmware: Text Book-1 Chapter 4 to 8 11
III
RTOS Based
Reference Book
IV Embedded System Chapter 8 09
1
Design:
Task Reference Book
V Chapter 7 09
Communication 1
Tutorial classes 16
Lectures beyond syllabus 03
Remedial classes/NPTEL Classes 02
Total No. of classes 76

112
Subject Name with code : EC0755
Class : IV/I sem/ECE Academic Year :
st
2019-20 (I semester)
Name of the Faculty Member : Dr. S. J Sugumar, Mr. V.Bhagya Raju, Mr. V. Saibabu,
Shaik Noor Mohammad

7. Remembering
8. Understanding
9. Applying
10. Analyzing
11. Evaluating
12. Creating
level Outcome
Part - A
Unit - I
1. What is time to prototype.(Nov/Dec 2018 –R15) L1 CO1
2. What is the difference between system and embedded system. L1,L2 CO1
(Nov/Dec 2018 –R15)
3. Give few examples of embedded systems (April/May 2018-R13) L1 CO1
( May/June-2019-R15)
4. Give some major applications of embedded systems (April/May L1 CO1
2018-R13)
5. Define Embedded system (Mar 2017-R13) L1 CO1
6. List out the difference between an embedded system and a L1,L2 CO1
general purpose computer (Mar 2017-R13) ( May/June-2019-
R15)
7. Define time to market. (Nov 2016-R13) L1 CO1
8. What is the quality attribute portability in embedded system L1 CO1
design. (Nov 2016-R13)
Unit- II
1. What is memory shadowing? What is its advantage? (Nov/Dec L1 CO2

2018 –R15)
2. What are the uses of ASIC in designing embedded system? L1, L2 CO2
(Nov/Dec 2018 –R15)
3. Write the advantages of PLDs (April/May 2018-R13) L1 CO2
4. Explain briefly about memory shadowing (April/May 2018-R13) L2 CO2
5. Explain the concept of Memory shadowing (Mar 2017-R13) L2 CO2
6. Write a short note on COTS (Mar 2017-R13) L1 CO2
7. What is actuator? (Nov 2016-R13) L1 CO2
8. What is the role of ASIC in embedded system design? (Nov L1,L2 CO2
2016-R13)
9. Define Microcontroller? ( May/June-2019-R15) L1 CO2
10. Differentiate between general purpose processor and application L2 CO2
specific instruction processor. ( May/June-2019-R15)
Unit-III

113
1. What is assembly level programming? (Nov/Dec 2018 –R15) L1 CO3
2. Explain the need of a watchdog timer? (Nov/Dec 2018 –R15) L2,L3 CO3
3. List the types control algorithms design exists in embedded L1 CO3
firmware development (April/May 2018-R13) ( May/June-
2019-R15)
4. What are the circuits essentials for proper functioning of L1 CO3
processor/controller of the embedded system design
(April/May 2018-R13)
5. What is the use of reset circuit in an embedded system?(Mar L1, L2 CO3
2017-R13) ( May/June-2019-R15)
6. Briefly explain Brown –out protection circuit (Mar 2017-R13) L2,L3 CO3
7. What are the merits and drawbacks of recursion (Nov 2016-R13) L1, L2 CO3
8. What is the role of reset circuit in embedded system (Nov 2016- L1, L2 CO3
R13)
Unit-IV
1. Why is thread creation faster than process creation? (Nov/Dec L1 CO4

2018 –R15)
2. Which operating system is suitable for embedded system design? L1, L2 CO4
Explain. (Nov/Dec 2018 –R15)
3. What is operating system? What are its primary functions? L1 CO4
(April/May 2018-R13) ( May/June-2019-R15)
4. What is the use of RTOS in embedded system design? L1 CO4
5. What is the use of RTOS in embedded system design (Mar 2017- L1 CO4
R13)
6. Discuss briefly about task scheduling (Mar 2017-R13) L2 CO4
7. What is task control block(TCB) (Nov 2016-R13) L1 CO4
Unit-V
1. What is priority inversion? (Nov/Dec 2018 –R15) L1 CO5

2. Give the features of RTOS? (Nov/Dec 2018 –R15)(May/June- L1 CO5
2019-R15)
3. Define Coffman conditions. (April/May 2018-R13) L1 CO5
4. Discuss the issues in task synchronization briefly. (April/May L2 CO5
2018-R13)
5. What are the considerations to choose an RTOS (Mar 2017-R13) L1 CO5
6. Discuss the issues in task synchronization briefly (Mar 2017- L2 CO5
R13)
7. How multiple threads of a process co operate (Nov 2016-R13) L1 CO5
8. Define Coffman conditions (Nov 2016-R13) L1 CO5
9. What is meant by IPC.( May/June-2019-R15) L1 CO5
10. What is meant by concurrency of task execution in real time L1 CO5
system (May/June-2019-R15).
Part - B
Unit - I
1. What is an embedded system? Explain the different applications L1, CO1
of embedded systems(Nov/Dec 2018 –R15) L2,L3
2. Explain the quality attributes in the embedded system L2 CO1
development context? What is the different quality attributes to

114
be considered in an embedded system design.(Nov/Dec 2018)
3. What is the difference between little endian and big endian L1, L2 CO1
processors? Give an example of each. (Nov/Dec 2018)
4. Discuss the characteristics and quality attributes of embedded L2, CO1
systems.(April/May 2018)
5. Compare the embedded system and general purpose computing L2 CO1
system in detail.(April/May 2018)
6. What is the difference between microprocessor and L1, L2 CO1
microcontroller? Explain the microprocessors and controllers in
embedded system. (April/May 2018) May/June-2019-R15
7. Describe the characteristics of an embedded system in detail. L1 CO1
(Nov 2017-R13)
8. Explain in detail the classification of embedded system. (Mar L1, L2 CO1
2017-R13) May/June-2019-R15
9. Explain the quality portability and reliability in embedded system L2 CO1
design context (Mar 2017-R13)
10. Define an embedded system? Explain the characteristics of L1, L2 CO1
embedded system. (Nov 2016-R13)
11. Explain the various purposes of embedded system in details with L1, L2 CO1
examples. (Nov 2016-R13) May/June-2019-R15
Unit - II
1. Explain the different on board communication interfaces in L2 CO2

brief.(Nov/Dec 2018)( May/June-2019-R15)
2. What is sensor and explain its role in embedded system. L1, L2 CO2
(April/May 2018)
3. What is the role of reset and brown out protection circuit in L1, L2 CO2
embedded system? (April/May 2018)
4. What are the different types of memories used in embedded L1, L2 CO2
system design? Explain each with examples. (Mar 2017-R13,
Nov 15-R09)
5. Explain the different factors that need to be considered in the L2 CO2
selection of memory of embedded system. (Nov 2016-R13)
6. Explain the difference between I2C and SPI communication L2 CO2
interface. (Nov 2016-R13)
7. Explain the different communication buses used in automotive L2 CO2
applications. (Nov 2016-R13)
8. Explain the role of sensors in embedded system design (Nov L2 CO2
2015-R13)
9. Explain the different communication interfaces with respect to L2 CO2
embedded systems (Nov 2015-R13)
Unit-III
1. Explain the advantages of assembly language based embedded L2 CO3

firmware development.(Nov/Dec 2018)
2. Explain the different embedded design firmware approaches. L2 CO3
.(April/May 2018)
3. Explain different thread binding models for user and kernel L2 CO3
services. .(April/May 2018)
4. Describe the purpose of a real time Clock in an embedded L1, L2 CO3

115
system, explain in detail (Mar 2017-R13) May/June-2019-R15
5. Explain the function of watchdog timer in an embedded system? L2 CO3
(Mar 2017-R13) May/June-2019-R15
6. What is the need of embedded firm ware? Briefly explain the L1, L2 CO3
embedded firm ware development languages. (Mar 2017-R13)
7. Explain different sections of memory segment allotted to an L2 CO3
application by the memory manager. (Nov 2016-R13)
8. Explain the difference between “pointer to constant data” and L2 CO3
“constant pointer to data” in embedded C programming. Explain
the syntax for both. (Nov 2016-R13)
Unit-IV
1. Explain the various factors to be considered for selection of L2,L5 CO4

scheduling criteria.(Nov/Dec 2018)
2. Explain all activities involved in context switching.(Nov/Dec L2 CO4
2018)
3. What is a process? With neat representation explain the process L1,L2 CO4
states and state transition (Mar 2017-R13) May/June-2019-R15
4. Explain the different thread binding models for user and kernel L2 CO4
level threads? (Mar 2017-R13)
5. Explain starvation the process scheduling context. Explain how L2,L5 CO4
starvation can be effectively tackled. (Nov 2016-R13)
6. What is the difference between a general purpose kernel and real L2 CO4
time kernel? Give an example for both. (Nov 2016-R13)
7. Explain different multi tasking models in operating system L2 CO4
context. (Nov 2016-R13) May/June-2019-R15
Unit-V
1. What is inter process communication (IPC)? Give an overview of L1, L2 CO5

different IPC mechanisms adopted by various operating
systems.(Nov/Dec 2018)
2. Explain the different functional and non functional requirements L2 CO5
that need to be evaluated in the selection of RTOS. (Nov/Dec
2018)
3. Write the basic design principles when using an RTOS to design L1 CO5
a simple RTOS.(April/May 2018)
4. Explain in detail, the task communication synchronization issues L2,L5 CO5
encountered in inter process communication. .(April/May 2018)
5. Explain message passing technique for inter process L2,L5 CO5
communication in detail (Mar 2017-R13) May/June-2019-R15
6. Explain the concept of shared memory in task L2 CO5
communication(Mar 2017-R13) May/June-2019-R15
7. What is a device driver? Explain the role of device driver in an L1, L2 CO5
embedded OS? (Mar 2017-R13)
8. Explain in detail the different task communication L2,L5 CO5
synchronization issues encountered in inter process
communication. (Nov 2016-R13)
9. Explain the architecture of device driver, with neat sketch and L2 CO5
give the applications of device drivers. (Nov 2016-R13)
May/June-2019-R15

116
PART – A ANSWERS:-
Unit – I
1. What is time to prototype.(November/December 2018 –R15)
Ans.) Time to market is the time elapsed between the conceptualization of a product and the
time at which the product is ready for selling (for commercial product) or use (for non
commercial product).
2. What is the difference between system and embedded system.(November/December

2018 –R15)
Ans.)The difference between an embedded system and a general purpose computer system is
one of purpose, and to a much lesser extent, design. While a general purpose system can be used
for many things, an embedded system is only meant for one purpose.
3. Give few examples of embedded systems (April/May 2018-R13)
Ans.)Some examples of embedded systems are MP3 players, mobile phones, video game
consoles, digital cameras, DVD players, and GPS. Household appliances, such as microwave
ovens, washing machines and dishwashers, include embedded systems to provide flexibility and
efficiency.
4. Give some major applications of embedded systems (April/May 2018-R13)
Embedded-system based projects are capable of doing multitasks, and are also capable of
interfacing with the other networks and devices. Applications of embedded systems are
applicable in areas like space, communication, transportation, robotic systems, home
appliances, etc.
5. Define Embedded system (Mar 2017-R13)

Ans.) An embedded system is an electronic or electro mechanical system designed to perform a
specific function and is a combination of both hardware and software.
6. List out the difference between an embedded system and a general purpose computer
(Mar 2017-R13)
Ans.)
GENERAL PURPOSE COMPUTER EMBEDDED SYSTEM
1)A system which is a combination of generic 1)A system which is a combination of special purpose
hardware hardware and embedded operating system for executing a
And a general purpose operating system for specific set of applications.
executing a variety of applications. 2) Application specific requirements like Power
2) Performance is the key deciding factor in the requirements, memory usage etc. are the key deciding
selection of the system. Always ‘ faster is better’ factors.
3) Response requirements are not time critical. 3) For certain category of embedded systems like machine
critical systems, the Response time requirement is highly
critical.
7. Define time to market. (Nov 2016-R13)

117
Ans.) Time to market is the time elapsed between the conceptualization of a product and the time
at which the product is ready for selling (for commercial product) or use (for non commercial
product).
8. What is the quality attribute portability in embedded system design? (Nov 2016-R13)
Ans.) An Embedded product is said to be portable if the product is capable of functioning as such
in various environments, target processors or controllers and embedded operating systems. The
ease with which an embedded product can be ported on to a new platform is a direct measure of the
network required. A standard embedded product should always be flexible and portable.
Unit- II
9. What is memory shadowing? What is its advantage? (November/December 2018 –R15)
Ans.) Shadowing of memory is a technique adopted to solve the execution speed problem in
processor based system. In computer systems and video systems there will be a configuration
holding ROM called basic input output configuration ROM or simply BIOS. In personal
computer system BIOS stores the hardware configuration information like the address assigned
for various serial ports and other non plug and play devices.
Usually it is read and the system is configured according to it during system boot up and it is
time consuming. Now the manufacturers included A RAM behind the logical layers of BIOS as
its same address as a shadow to the BIOS and the first step that5 happens during the boot up is
copying the BIOS to the shadowed RAM and write protecting the RAM and then disabling the
BIOS reading.
10. What are the uses of ASIC in designing embedded system? (November/December 2018
–R15)
Ans.) An application-specific integrated circuit (ASIC) is an integrated circuit (IC) customized

for a particular use, rather than intended for general-purpose use. For example, a chip designed
to run in a digital voice recorder or a high-efficiency bitcoin miner is an ASIC. Application-
specific standard products (ASSPs) are intermediate between ASICs and industry standard
integrated circuits
11. Write the advantages of PLDs (April/May 2018-R13)
Ans.) PLDs offer customers much more flexibility during the design cycle because design
iterations are simply a matter of changing the programming file, and the results of design
changes can be seen immediately in working parts.
PLDs do not require long lead times for prototypes or production parts - the PLDs are already
on a distributor's shelf and ready for shipment.
PLDs do not require customers to pay for large NRE costs and purchase expensive mask sets -
PLD suppliers incur those costs when they design their programmable devices and are able to
amortize those costs over the multi-year lifespan of a given line of PLDs.
PLDs allow customers to order just the number of parts they need, when they need them,
allowing them to control inventory. Customers who use fixed logic devices often end up with
excess inventory which must be scrapped, or if demand for their product surges, they may be
caught short of parts and face production delays.
12. Explain briefly about memory shadowing (April/May 2018-R13)

118
Ans.) Explained in Question no 9.
13. Explain the concept of Memory shadowing (Mar 2017-R13)

Ans.) Explained in Question no 9.
14. Write a short note on COTS (Mar 2017-R13)

Ans.) COTS products are designed in such a way to provide easy integration and interoperability
with existing system components. The typical examples of COTS hardware unit are
1) High frequency Microwave Electronics (2 to 200 GHz)
2) High Bandwidth Analog to Digital converter
3) Devices and components for operation at very high temperatures.
4) Electro Optic IR Imaging arrays.
5) UV/IR Detectors
The major advantage of using COTS is that they are readily available in the market, are cheap and
a developer can cut down his/her development time to a great extent.
15. What is actuator? (Nov 2016-R13)

Ans.) Actuator is a form of transducer device (mechanical/ Electrical) which converts signals to
corresponding physical action (motion). It acts as an output device.
16. What is the role of ASIC in embedded system design? (Nov 2016-R13)
Ans.) ASIC is a micro chip designed to perform a specific or unique application. It integrates
several functions into a single chip and there by reduces the system development cost.
ASIC’s can be prefabricated for a special application or it can be custom fabricated by using the
components form a reusable ‘building block’ library of components for a customer application.
Unit-III
17. What is assembly level programming? (November/December 2018 –R15)
Ans.) An assembly language is the most basic programming language available for any
processor. With assembly language, a programmer works only with operations that are
implemented directly on the physical CPU.Assembly languages generally lack high-level
conveniences such as variables and functions, and they are not portable between various
families of processors. They have the same structures and set of commands as machine
language, but allow a programmer to use names instead of numbers. This language is still useful
for programmers when speed is necessary or when they need to carry out an operation that is
not possible in high-level languages.
18. Explain the need of a watchdog timer? (November/December 2018 –R15)
Ans.) A watchdog timer (sometimes called a computer operating properly or COP timer,
or simply a watchdog) is an electronic timer that is used to detect and recover from
computer malfunctions. During normal operation, the computer regularly resets the
watchdog timer to prevent it from elapsing, or "timing out". If, due to a hardware fault or
program error, the computer fails to reset the watchdog, the timer will elapse and generate
a timeout signal. The timeout signal is used to initiate corrective action or actions. The
corrective actions typically include placing the computer system in a safe state and
restoring normal system operation. Watchdog timers are commonly found in embedded
systems and other computer-controlled equipment where humans cannot easily access the
equipment or would be unable to react to faults in a timely manner.
119
19. List the types control algorithms design exists in embedded firmware development
Ans.) The following are the steps that are required for designing control algorithms in
embedded system which and be often written in low level or high level languages.
 Understand system development process as a life cycle

 Take Requirements and formulate a problem statement.
 Learn that an algorithm is a formal way to describe a solution
 Define an algorithm with pseudo code or visually as a flowchart
 Translate flowchart to code
 Test in simulator (Test → Write code → Test → Write code … cycle)
 Run on real board
20. What are the circuits essentials for proper functioning of processor/controller of the
embedded system design (April/May 2018-R13)
Ans.) The embedded system’s components are basically divided into two parts:
Embedded Systems Hardware Components

1.Power Supply
2 Processor
3 Memory
4 Timers-Counters
5 Communication Ports
6 Input and Output
7 Application Specific Circuits
Embedded Systems Software Components

1 Assembler
2 Emulator
3 Debugger
4 Compiler
21. What is the use of reset circuit in an embedded system?(Mar 2017-R13)

Ans.)

120
Ans.) The Reset circuit is essential to ensure that the device is not operating at a voltage level
where the device is not guaranteed to operate during system power on.
The reset signal brings the internal registers and the different hardware systems of the controller to
a known state and start the firmware execution from the reset vector. The reset signal can be either
active high or active low.
Since the processor operation is synchronized to a clock signal, the reset pulse should be wide
enough to give time for the clock oscillator to stabilize before the internal reset state starts.
The reset signal to the processor can be applied at power on through an external passive reset
circuit consisting of capacitor and resistor.
22. Briefly explain Brown –out protection circuit (Mar 2017-R13)

Ans.)
Ans.) Brown-Out Protection circuit Prevents the controller from unexpected program execution
behavior when the supply voltage to the controller falls below a specified voltage. It is very
essential for battery powered devices since there are greater chances for the battery voltage to drop
below the required threshold.
A Brown-out protection circuit holds the controller in reset state, when the operating voltage falls
below the threshold, until it rises above the threshold voltage.
23. What are the merits and drawbacks of recursion (Nov 2016-R13)
Ans.) A function which calls itself repeatedly is called a recursive function.

Using recursive function a complex problem is split into its simplest form.
Merits:
1) Recursive code is very expressive compare to iterative code.

121
2) Most appropriate for certain operations like permutations, search trees, sorting etc.
Demerits:
1) Debugging of recursive functions are not so easy compared to iterative code debugging.
2) It is slow in operation due to call stack overheads. It involves a lot of stack operations like
variation storage and retrieval, return address storage and retrieval etc.
24. What is the role of reset circuit in embedded system (Nov 2016-R13)
Ans.) The Reset circuit is essential to ensure that the device is not operating at a voltage level
where the device is not guaranteed to operate during system power on.
The reset signal brings the internal registers and the different hardware systems of the controller to
a known state and start the firmware execution from the reset vector. The reset signal can be either
active high or active low.
Since the processor operation is synchronized to a clock signal, the reset pulse should be wide
enough to give time for the clock oscillator to stabilize before the internal reset state starts.
The reset signal to the processor can be applied at power on through an external passive reset
circuit consisting of capacitor and resistor.
Unit – IV
25. Why is thread creation faster than process creation? (November/December 2018 –R15)
Ans.) Creating a new process can be expensive. It takes time. (A call into the operating
system is needed, and if the process creation triggers process rescheduling activities, the
operating system's context-switching mechanism will become involved.) It takes memory.
(The entire process must be replicated.) Add to this the cost of interprocess communication
and synchronization of shared data, which also may involve calls into the operating system
kernel, and threads, provides an attractive alternative.
Threads can be created without replicating an entire process. Furthermore, some, if not all,
of the work of creating a thread is done in user space rather than kernel space. When
processes synchronize, they usually have to issue system calls, a relatively expensive
operation that involves trapping into the kernel. But threads can synchronize by simply
monitoring a variable - in other words, staying within the user address space of the program.

122
26. Which operating system is suitable for embedded system design? Explain.
(November/December 2018 –R15)
Ans.) On desktop computers, the selection of an operating system (OS) is largely a matter of
taste - Windows vs Apple vs Linux. There is relatively little choice. For an embedded system,
the matter is much more complex. The large number of options available reflects the wide
diversity of embedded applications.
27. What is operating system? What are its primary functions? (April/May 2018-R13)
Ans.) The operating system acts as a bridge between user application and the underlying
system resources through a set of system functionalities and services. A normal computing
system is a collection of different I/O subsystems, working and storage memory. The
primary functions of the operating system are
1. Memory management
2. Process Management
3. Time management
4. File Management
5. I/O management
28. What is the use of RTOS in embedded system design? (April/May 2018-R13)
Ans.) An embedded system is a special computer system that is designed to perform

dedicated functions with real-time computing constraints. It contains software, memory, and
a processor that may be 8051micro-controller memory ROM or Pentium-IV processor
memory RAM. It also contains different types of inputs and outputs.Inputs are in the form
of probes and sensors, buttons, control knobs and communication signals. Outputs are
changes made to the physical world, communication signals, and displays. A real-time
embedded system is the main subcategory of embedded systems that focuses on timely task
execution. For instance, smart home security systems, ATM machines, and air conditioners
are embedded systems and an airplane’s flight control system is a real-time embedded
system where time is a core factor.
29. What is the use of RTOS in embedded system design (Mar 2017-R13)
Ans.) Explained in question no 28
30. Discuss briefly about task scheduling (Mar 2017-R13)
Ans.) Determining which task/ Process is to be executed at a given point of time is known as task/
Process scheduling. Task scheduling forms the basis of multitasking. The scheduling polices are
implemented in an algorithm and it is run by the kernel as a service. The kernel service/application
which implements the scheduling algorithm is known as scheduler. The process scheduling
decision may take place when a process switches its state to
1. Ready state from ‘running’ state
2. Blocked/wait state from running state
3. Ready state from blocked/wait state
4. Completed state

123
31. What is task control block(TCB) (Nov 2016-R13)
Ans.) A TCB is used for holding the information corresponding to a task containing the following
set of information.
1. Task id
2. Task state
3. Task type
4. Task priority
5. Task content points
6. Task memory pointer
7. Task system resource pointer
8. other parameters
32. What is an operating system? What are its primary functions (Nov 2016-R13)
Ans.) Explained in question no 27.
Unit – V
33. What is priority inversion? (November/December 2018 –R15)
Ans.) Priority inversion is a operating system scenario in which a higher priority process is
preempted by a lower priority process. This implies the inversion of the priorities of the two
processes.
Some of the problems that occur due to priority inversion are given as follows:
1. A system malfunction may occur if a high priority process is not provided the required
resources.
2. Priority inversion may also lead to implementation of corrective measures. These may
include the resetting of the entire system.
3. The performance of the system can be reduces due to priority inversion. This may
happen because it is imperative for higher priority tasks to execute promptly.
4. System responsiveness decreases as high priority tasks may have strict time constraints
or real time response guarantees.
5. Sometimes there is no harm caused by priority inversion as the late execution of the high
priority process is not noticed by the system.
Some of the solutions to handle priority inversion are given as follows:
1. Priority Ceiling All of the resources are assigned a priority that is equal to the highest
priority of any task that may attempt to claim them. This helps in avoiding priority
inversion.
2. Disabling Interrupts There are only two priorities in this case i.e. interrupts disabled
and preemptible. So priority inversion is impossible as there is no third option.
3. Priority Inheritance This solution temporarily elevates the priority of the low priority
task that is executing to the highest priority task that needs the resource. This means that
medium priority tasks cannot intervene and lead to priority inversion.
4. No blocking Priority inversion can be avoided by avoiding blocking as the low priority
task blocks the high priority task.
5. Random boosting The priority of the ready tasks can be randomly boosted until they
exit the critical section.
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34. Give the features of RTOS? (November/December 2018 –R15)
Ans.) The features of RTOS are given as follows:
 Predictability: A system must execute actions within a known time frame and produce known
results. Such results are determined by the procedures or operations taking place. The
determination is by targets set during production or procedural planning.
 Performance: real-time operating systems are designed to make work easier. Every system
must solve a problem or reduce the workload. As such, the developer should provide a system
that is easily assimilated with existing software and hardware as well as aligned to the goals of
the organization.
 Manageability: This means a system whose veracity or bulkiness is manageable. The
software and hardware required to operate the RTOS must be of reasonable size. Technicians
should also be easy to find and orient. The idea is to reduce the cost of implementation.
 Scalability: The needs of any production or event environment change with time. This means
that a system may require an upgrade or downgrade. Such provisions must be made during
design and installation of any RTOS.
35. Define Coffman conditions. (April/May 2018-R13)

Ans.) Coffman (1971) identified four conditions that must hold simultaneously for there to
be a deadlock.Coffman conditions are given by
1. Mutual Exclusion Condition
The resources involved are non-shareable.
Explanation: At least one resource (thread) must be held in a non-shareable mode, that is,
only one process at a time claims exclusive control of the resource. If another process
requests that resource, the requesting process must be delayed until the resource has been
released.
2. Hold and Wait Condition

Requesting process hold already, resources while waiting for requested resources.
Explanation: There must exist a process that is holding a resource already allocated to it
while waiting for additional resource that are currently being held by other processes.
3. No-Preemptive Condition
Resources already allocated to a process cannot be preempted.
Explanation: Resources cannot be removed from the processes are used to completion or
released voluntarily by the process holding it.
4. Circular Wait Condition

The processes in the system form a circular list or chain where each process in the list is waiting
for a resource held by the next process in the list.
36. Discuss the issues in task synchronization briefly. (April/May 2018-R13)

Ans.) The act of making processes aware of the accesas of shared resources by each process
to avoid conflicts is known as Task/Process synchronization.
The Task Synchronization issues are
1. Racing
2. Dead lock
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3. The dining philosopher’s problem
4. Producer- Consumer/ Bounded Buffer Problem
5. Reader- Writer Problem
6. Priority Inversion
37. What are the considerations to choose an RTOS (Mar 2017-R13)

Ans.) The following are the considerations to choose an RTOS to choose an RTOS
1. Task/Process Management
2. Task/Process scheduling
3. Task/Process synchronization
4. Error/exception handling
5. Memory Management
6. Interrupt handling
7. Time Management
38. Discuss the issues in task synchronization briefly (Mar 2017-R13)
Ans.) Explained in question no 36
39. How multiple threads of a process co operate (Nov 2016-R13)

Ans.) The thread standards deal with the different standards available for thread creation and
management. These standards are utilized by the operating system for thread creation and thread
management. It is a set of thread class libraries. The commonly used thread class libraries available
are
1. POSIX Threads: POSIX stands for portable Operating system Interface. The POSIX.4 standard
deals with Real- Time extensions and POSIX.4 standard deals with thread extensions. POSIX
thread creation and management functions in ‘C’ language.
2. Win 32 Threads: They are separated by various flavours of windows OS. The Win32 API
libraries provide the standard set of win32 thread creation and management functions.
3. JAVA Threads: Threads supported by the java Programming language. The JAVA thread class
‘Thread’ is defined in the package ‘java.lang’. This package needs to be imported for using the
thread creation functions supported by the java thread class
40. Define Coffman conditions (Nov 2016-R13)

Ans.) Explained in Question no 35

UNIT1
1. An embedded system is a
(a) Hardware
(b) Software
*(c) Hardware combined with software
(d) Operating system with multiple kernel.
2. An embedded system hardware can

(a) have FPGA
(b) have Digital Signal Processor
(c) have Microcontroller
*(d) All the above.

126
3. An embedded system has RAM memory
*(a) for storing the variables during program run, stack and IO buffers.
(b) for storing all the instructions and data
(c) for storing the programs from external secondary memory
(d) for fetching instructions and data into cache(s).
4. Embedded system must have an interrupt handling mechanism for executing the interrupt
service routines in case of the interrupts from
(a) physical devices
(b) Software interrupt instructions
(c) Software exceptions
* (d) All the above
6. ____________computers and networks monitor and control the physical processes,
usually with feedback loops
a) Desktop b) Labptop *c) Embedded d) Palmtop
7. Embedded system design is about __________ composition
a) *Component b) module c) port d) section
UNIT2
1) Which of the fallowing is on board interface in the embedded sys context?

a) I2C b) Bluetooth c) SPI d) all
2) What is min number of interface lines required for implementing I2C BUS?
a) 2 b)3 c)4 d)5
3) Which of the following are examples for ASIC?
a) Intel centrino b) Atmel avr c) AMD d) microchip can e) all
4) What is the theoretical maximum data rate supported by GPRS
a) 8Mbps b) 12Mbps c) 100kbps d) 171.2kbps
5) ASIC stands for _______________
6) COTS stand for______________
7) GPRS communication divides the radio channel into_______timeslots
8) _________memory cells are presented in 1Kb RAM
9) ___________is the synchronous serial interface
10) Which of the fallowing memory type is the best suited for development purpose?
a) EEPROM b) FLASH c) UVEPROM d) OTP e) all
UNIT-III
1) The devices that provide the means for a computer to communicate with the user or
other computers are referred to as
a) CPU b) ALU c) I/o d) None of the above
2) The software used to drive microprocessor-based systems is called

A.assembly language
B. Firmware
C. machine language code
D.BASIC interpreter instructions
3) The ________ ensures that only one IC is active at a time to avoid a bus conflict caused
by two ICs writing different data to the same bus.

127
A.control bus
B. control instructions
C. address decoder D. CPU
4) The items that you can physically touch in a computer system are called:
A.Software
B. Firmware
C. Hardware
D.none of the above
5) Single-bit indicators that may be set or cleared to show the results of
logical or arithmetic operations are the:
A.Flags B. Registers
Decisions
C. Monitors D.
UNIT-1V
1.What is operating system?

a) collection of programs that manages hardware resources
b) system service provider to the application programs
c) link to interface the hardware and application programs
*d) all of the mentioned
2. To access the services of operating system, the interface is provided by the

a) system calls *b) API c) library d) assembly instructions
3. Which one of the following is not true?

a) kernel is the program that constitutes the central core of the operating system
b) kernel is the first part of operating system to load into memory during booting
*c) kernel is made of various modules which cannot be loaded in running operating system
d) kernel remains in the memory during the entire computer session
4. In real time operating system

a) all processes have the same priority
*b) a task must be serviced by its deadline period
c) process scheduling can be done only once
d) kernel is not required
5. Hard real time operating system has ___ jitter than a soft real time operating system.
a) less *b) more c) equal d) none of the mentioned
6. For real time operating systems, interrupt latency should be

a) minimal b) maximum *c) zero d) dependent on the scheduling
7. In rate monotonic scheduling

*a) shorter duration job has higher priority b) longer duration job has higher priority
c) priority does not depend on the duration of the job d) none of the mentioned
8. The problem of priority inversion can be solved by

*a) priority inheritance protocol b) priority inversion protocol
c) both (a) and (b) d) none of the mentioned

128
9. Time duration required for scheduling dispatcher to stop one process and start another is
known as
a) process latency *b) dispatch latency c) execution latency d) interrupt latency
10. Time required to synchronous switch from the context of one thread to the context of
another thread is called
a) threads fly-back time b) jitter *c) context switch time d) none of the mentioned
11. Which one of the following is a real time operating system?

a) RTLinux b) VxWorks c) windows CE *d) all of the mentioned
12. VxWorks is centered around

*a) wind microkernel b) linux kernel c) unix kernel d) none of the mentioned
13. Which one of the following is not a real time operating system?
a) VxWorks b) Windows CE c) RTLinux *d) Palm OS
14 Inter process communication :

a) allows processes to communicate and synchronize their actions when using the same address
space.
*b) allows processes to communicate and synchronize their actions without using the same
address space.
c) allows the processes to only synchronize their actions without communication.
d) None of these
15. Message passing system allows processes to :

*a) communicate with one another without resorting to shared data.
b) communicate with one another by resorting to shared data.
c) share data d) name the recipient or sender of the message
16 An IPC facility provides atleast two operations : (choose two)

a) write message b) delete message *c) send message *d) receive message
17 Messages sent by a process :

a) have to be of a fixed size b) have to be a variable size
*c) can be fixed or variable sized d) None of these
18 Which of the following are TRUE for direct communication :(choose two)
a) A communication link can be associated with N number of process(N = max. number of
processes supported by system)
*b) A communication link can be associated with exactly two processes
c) Exactly N/2 links exist between each pair of processes(N = max. number of processes
supported by system)
d) Exactly N link exists between each pair of processes
19 In the non blocking send :

a) the sending process keeps sending until the message is received
*b) the sending process sends the message and resumes operation
c) the sending process keeps sending until it receives a message

129
d) None of these
20 Remote Procedure Calls are used :

a) for communication between two processes remotely different from each other on the same
system b) for communication between two processes on the same system
*c) for communication between two processes on separate systems d) None of these
UNIT-V
1. RPC provides _____ on the client side, a separate one for each remote procedure.
*a) stub b) identifier c) name d) process identifier
2. To resolve the problem of data representation on different systems RPCs define _______
a) machine dependent representation of data b) machine representation of data
*c) machine-independent representation of data d) None of these
3 .A process that is based on IPC mechanism which executes on different systems and can
communicate with other processes using message based communication, is called ________.
a) Local Procedure Call b) Inter Process Communication *c) Remote Procedure Call
d) Remote Machi
4. An un-interruptible unit is known as :

a) single *b) atomic c) static d) None of these
5 .The TestAndSet instruction is executed :

a) after a particular process b) periodically *c) atomically d) None of these
6. Semaphore is a/an _______ to solve the critical section problem.

a) hardware for a system b) special program for a system
*c) integer variable d) None of these
7. The two atomic operations permissible on semaphores are :

*a) wait and signal b) stop and go c) hold and release d) None of the these
8. Spinlocks are :
a) CPU cycles wasting locks over critical sections of programs
b) locks that avoid time wastage in context switches
c) locks that work better on multiprocessor systems *d) All of these
9. The main disadvantage of spinlocks is that :

a) they are not sufficient for many process *b) they require busy waiting
c) they are unreliable sometimes d) they are too complex for programmers
10. The wait operation of the semaphore basically works on the basic _______ system call.
a) stop() *b) block() c) hold() d) wait()

130
11. The signal operation of the semaphore basically works on the basic _______ system call.
*a) continue() b) wakeup() c) getup() d) start()
12. The code that changes the value of the semaphore is :

a) remainder section code b) non – critical section code
*c) critical section code d) None of these
13. What is the reusable resource?

*a) that can be used by one process at a time and is not depleted by that use
b) that can be used by more than one process at a time
c) that can be shared between various threads d) none of the mentioned
14. Which of the following condition is required for deadlock to be possible?

a) mutual exclusion
b) a process may hold allocated resources while awaiting assignment of other resources c) no
resource can be forcibly removed from a process holding it
*d) all of the mentioned
15. The circular wait condition can be prevented by

*a) defining a linear ordering of resource types
b) using thread c) using pipes d) all of the mentioned
16. Which one of the following is the deadlock avoidance algorithm?

*a) banker’s algorithm b) round-robin algorithm c) elevator algorithm
d) karn’s algorithm
17. To avoid deadlock

*a) there must be a fixed number of resources to allocate
b) resource allocation must be done only once c) all deadlocked processes must be aborted d)
inversion technique can be used
18. Preemptive, priority based scheduling guarantees :

*a) hard real time functionality b) soft real time functionality
c) protection of memory d) None of these
19. Interrupt latency refers to the period of time :

a) from the occurance of an event to the arrival of an interrupt
b) from the occurance of an event to the servicing of an interrupt
*c) from arrival of an interrupt to the start of the interrupt service routine
d) None of these
20. Real time systems need to __________ the interrupt latency.

*a) minimize b) maximize c) not bother about d) None of these
21. CPU fetches the instruction from memory according to the value of
*a) program counter b) status register c) instruction register d) program status word
22. Which one of the following is the address generated by CPU?

a) physical address b) absolute address *c) logical address d) none of the mentioned

131
23. Run time mapping from virtual to physical address is done by
*a) memory management unit b) CPU c) PCI d) none of the mentioned
24. Memory management technique in which system stores and retrieves data from secondary
storage for use in main memory is called
a) fragmentation *b) paging c) mapping d) none of the mentioned
25. The address of a page table in memory is pointed by
a) stack pointer *b) page table base register c) page register d) program counter
26. The page table contains
*a) base address of each page in physical memory b) page offset
c) page size d) none of the mentioned
27. Operating System maintains the page table for
*a) each process b) each thread c) each instruction d) each address

132
4. RADAR SYSTEMS (EC0758)
SYLLABUS:
UNIT DETAILS
I Basics Of Radar: Introduction, Maximum Unambiguous Range, Simple form of Radar
Equation, Radar Block Diagram and Operation, Radar Frequencies and Applications.
Prediction of Range Performance, Minimum Detectable Signal, Receiver Noise,
Modified Radar Range Equation, Illustrative Problems.
Radar Equation: SNR, Envelope Detector-False Alarm Time and Probability,
Integration of Radar Pulses, Radar Cross Section of Targets (simple targets - sphere,
cone-sphere), Transmitter Power, PRF and Range Ambiguities, System Losses
(qualitative treatment). Illustrative Problems.
II CW and Frequency Modulated Radar: Doppler Effect, CW Radar – Block Diagram,
Isolation between Transmitter and Receiver, Non-zero IF Receiver, Receiver Bandwidth
Requirements, Applications of CW Radar, Illustrative Problems.
FM-CW Radar, Range and Doppler Measurement, Block Diagram and Characteristics ,
FM-CW altimeter, Multiple Frequency CW Radar..
III MTI and Pulse Doppler Radar: Introduction, Principle, MTI Radar with - Power
Amplifier Transmitter and Power Oscillator Transmitter, Delay Line Cancellers – Filter
Characteristics, Blind Speeds, Double Cancellation, staggered PRFs. Range Gated
Doppler Filters. MTI Radar Parameters, Limitations to MTI Performance, MTI versus
Pulse Doppler Radar.
IV Tracking Radar: Tracking with Radar, Sequential Lobing, Conical Scan, Monopulse
Tracking Radar – Amplitude Comparison Monopulse (one- and two- coordinates), Phase
Comparison Monopulse., Tracking in Range, Acquisition and Scanning Patterns,
Comparison of Trackers.
V Detection of Radar Signals in Noise : Introduction, Matched Filter Receiver –
Response Characteristics and Derivation, Correlation Function and Cross-correlation
Receiver, Efficiency of Non-matched Filters, Matched Filter with Non-white Noise.
Radar Receivers – Noise Figure and Noise Temperature, Displays – types. Duplexers –
Branch type and Balanced type, Circulators as Duplexers. Introduction to Phased Array
Antennas – Basic Concepts, Radiation Pattern, Beam Steering and Beam Width changes,
Applications, Advantages and Limitations.

133
Subject RADAR SYSTEMS
Faculty Dr. R.K. Singh, K.V.Abhi/P.Shravya/K.Raju/A.Vinisha/K.Srinivas/S.Aparna
Introduction to Radar Systems – Merrill I. Skolnik, TMH Special Indian Edition, 2nd Ed.,
Book 1
2007.
Reference Books
Introduction to Radar Systems – Merrill I. Skolnik, THIRD EDITION, Tata McGraw-Hill,
Book 2
2005
Book3 Radar Principles – Peebles, Jr., P.Z., Wiley, New York, 1998.
Chapters
Unit Topic No of Classes
Book 1 Book 2 Book 3
I Introduction Nature of
Radar, 1, 2,4 1,2,3,4 14
Radar Equation
II CW and Frequency
Modulated Radar, FM- 3,4,5,6 14
CW Radar
MTI and Pulse Doppler
III 8 3 07
Radar
IV
Tracking Radar 4 09
V
Detection of Radar
Signals in Noise, Radar 5,11,9 14
Receivers –
Tutorial classes 15
Descriptive Tests 02
Remedial Classes 05
Total Classes 80

134
Academic Year : 2019-2020

Subject Name with code : RADAR SYSTEMS (EC0758)
Class : IVth year Sec-2
Name of the Faculty Member : K.V.Abhi,P.Shravya,K.Raju,A.Vinisha,K.Srinivas,S.Aparna
1. Remembering
2. Understanding
3. Applying
4. Analyzing
5. Evaluating
6. Creating

(Select Questions from University question Bank and mention level Outcome
year in bracket or you may give own standard question with (Please (Please
(new) in bracket) mention mention
L1 or L2 CO1 or
or etc...) CO2
etc…)
Unit - I
1 Describe in brief about pulse repetition frequencies and range L2 CO2
ambiguities.( June-2018 R13)
2 What is maximum unambiguous range? .( May-2019 R15, L1 CO1
May-2018 R13)
3 Define signal to noise ratio? .( May-2018 R13) L1 CO1
4 Describe various radar applications.( May-2019 R15, May- L2 CO2
2017 R13, June-2018 R13)
5 Calculate the range of a target, if the time taken by the signal to L5 CO5
travel and return is 100 micro seconds? ( May-2017 R13)
1 Explain the significance of Radar Cross section in Range L2 CO2
equation? (May-2019 R15)
2 a. Derive an equation for Probability of False Alarm? (May- 2 CO2
2019 R15)
b. Explain how to minimize false alarm? .( May-2018 R13)
3 a. Explain the terms integration loss and radar cross section of 2 CO2
target?
b. Explain about integration of radar pulses in detail? ( June-
2018 R13)
4 With the help of expressions explain radar transmitter power? .( 2 CO2
May-2018 R13)
5 Describe the operation of radar block diagram? .( May-2018 2 CO2
R13, May-2019 R15)
6 What is minimum detectable signal? Calculate minimum 1 CO1
receivable signal in a radar receiver that has IF bandwidth of
1.5 MHz and 9-dB noise figure. ( May-2017 R13)
135
7 Discuss in brief radar range equation and modified radar range 2 CO2
equation. ( May-2017 R13, May-2018 R13, May-2019 R15)
8 Discuss the radar cross section of the targets: Sphere, Flat Plate 2 CO2
and Triangular trihedral. ( May-2017 R13)
9 Write about radar system losses. List the applications of pulse 3 CO3
radar? ( May-2017 R13)
10 Derive the max radar range equation in terms of S/N and define 3 CO3
each parameter ( May-2017 R13)
11 Derive the radar range equation in terms of minimum 3 CO3
detectable signal? [Apr 2014 R09] .( June-2018 R13)
12 What is Maximum Unambiguous Range? How is it related with 4 CO4
pulse repetition rate? [May-2017 R13, Apr 2014 R09]
Unit - II
1 List the characteristics of FM-CW radar? .( June-2018 R13) 1 CO1
2 Give the principle of Doppler effect? .( May-2019 R15, June- 1 CO1
2018 R13,May-2017 R13)
3 Write the applications of CW Radar? .( May-2019 R15, May- 1 CO1
2018 R13)
4 Give the advantages of FM-CW Radar? .( May-2018 R13) 2 CO2
5 Calculate the Doppler frequency of an aircraft moving with a 2 CO2
speed of 550Knots and when the CW radar is working with
λ=8cms. ( May-2017 R13)
1 Write a note on the following CO3
a) FM-CW Altimeter b) CW Radar
What are the Bandwidth requirements for a Receiver. (May- 3
2019 R15)
2 Explain the principle of operation of FM-CW radar with using 2 CO2
side band super heterodyne receiver? .( June-2018 R13)
3 Explain how the various unwanted signals causes errors in FM 2 CO2
altimeter? .( May-2018 R13) .( June-2018 R13)
4 With suitable waveforms discuss frequency time relationships 3 CO3
in FM-CW radar? .( May-2018 R13)
5 Write the merits and demerits of CW radar? .( May-2018 R13) 3 CO3
.( June-2018 R13)
6 Draw the block diagram of FM-CW Radar and Explain its 3 CO3
operation. (May-2019 R15,May-2017 R13, Apr 2014 R09)
7 Discuss the following a) Non-Zero IF receiver b) Isolation 2 CO2
between the transmitter and receiver. ( May-2017 R13) .( May-
2018 R13)
8 Explain the need of isolation between transmitter and receiver 2 CO2
of a radar system ( May-2017 R13)
9 Explain in detail how FMCW radar is used for measurement of 2 CO2
range ( May-2017 R13, June-2018 R13)
10 Discuss all possible errors in the measurement of accuracy of 2 CO2
altitudes using FM radar ( May-2017 R13)
11 List out the applications of CW radar and explain it. [Apr 2014 1 CO1
R09, May-2017 R13]
12 Determine the range and Doppler velocity for FMCW radar if 2 CO2

136
the target is approaching the radar . Given the beat frequency fb
(up)= 15KHz and fb (down)=25KHz for the triangular
modulation , the modulating frequency is 1MHz and Doppler
frequency shift is 1KHz. [Apr 2014 R09]
Unit - III
1 What is need of Delay Line Canceller? (May-2019 R15) 1 CO1
2 What is blind Speed? (May-2019 R15) 1 CO1
3 What is staggered PRF? .( June-2018 R13) 1 CO1
4 What is delay line canceller? .( May-2018 R13) 2 CO2
5 What is butterfly shape on radar receiver.( May-2018 R13) 2 CO2
6 What are the differences between pulse radar and pulse Doppler 1 CO1
radar?( May-2017 R13)
7 Write about MTI radar parameters. ( May-2017 R13) 1 CO1
1 Explain the working principle and function of each block of 2 CO2
Power amplifier transmitter in MTI Radar (May-2019 R15)
2 Explain the function of Pulse Doppler RADAR and how it is 2 CO2
different from simple Pulse Radar? (May-2019 R15, May-2017
R13, June-2018 R13)
3 What is an A-scope display? How it generates Butterfly effect 1 CO1
in MTI Radar System? (May-2019 R15)
4 a. How moving target is distinguished from stationary target? . 4 CO4
b. Differentiate single delay line and double delay line
cancellers? ( June-2018 R13)
5 List and explain MTI radar parameters?.( May-2018 R13, 1 CO1
May-2019 R15, June-2018 R13)
6 What are the factors limits the MTI performance? Explain? .( 1 CO1
May-2018 R13, May-2019 R15)
7 Write short notes on multiple repetition frequencies. Draw and 3 CO3
explain three pulse canceller? ? .( May-2018 R13)
8 Explain blind speed and the methods for reducing the effects of 2 CO2
blind speed. ( May-2017 R13)
9 Explain MTI radar with block diagram. ( May-2017 R13, May- 2 CO2
2018 R13, June-2018 R13)
10 Define the terms: Clutter attenuation, Sub-clutter visibility. ( 1 CO1
May-2017 R13)
11 Explain the working principle of conventional pulse radar with 2 CO2
neat diagram?what is the difference between MTI and pulse
Doppler radar ( May-2017 R13)
12 An MTI radar operates at 6GHz with a PRF of 800PPS. 4 CO4
Calculate the lowest three blind speeds of this radar? [Apr 2014
R09]
Unit - IV
1 Mention the types of Tracking? (May-2019 R15) 1 CO1
2 What is meant by Tracking in Range? (May-2019 R15) 1 CO1
3 Give the principle of operation of conical scan? .( June-2018 2 CO2
R13)
4 Explain about sequential lobbing? .( June-2018 R13) 2 CO2

137
5 List the disadvantages of sequential lobbing? .( May-2018 1 CO1
R13)
6 Define squint Angle.( May-2018 R13) 2 CO2
7 Discuss the sequential lobing tracking antenna mechanism. ( 2 CO2
May-2017 R13)
8 Briefly explain the tracking radar and search radar system. ( 2 CO2
May-2017 R13)
1 Briefly explain the various tracking techniques of Radar? 2 CO2
(May-2019 R15)
2 Explain the working of phase comparison Monopulse Radar? 2 CO2

(May-2019 R15)
3 Discuss about acquisition and scanning parameters.( May-2018 2 CO2

R13
4 In mono pulse radar two antennas are used to produce a phase 4 CO4
difference of 250 between the echo signals. It operates at
afrequency of 1.5Ghz. Find the spacing between antennas if
angle Ɵ=150 .( May-2018 R13)
5 Describe the operation of conical scanning method? .( May- 2 CO2

2018 R13, June-2018 R13)
6 Define tracking in range and explain the split gate tracker 1 CO1
method. ( May-2017 R13)
7 Explain with the help of a block diagram amplitude comparison 2 CO2

monopoles radars for extracting error signals in both elevation
and azimuth. ( May-2017 R13)
8 Explain sequential lobing type of track technique in a tracking 2 CO2

radar system ( May-2017 R13, May-2018 R13, May-2019
R15)
9 Draw and explain the block diagram of amplitude comparison 3 CO3

mono pulse radar ( May-2017 R13, May-2019 R15 )
10 Write the differences between Conical Scan and Monopulse 4 CO4

Tracking radar.(Apr 2014 R09)
11 Describe the operation of Monopulse tracking radar with its 2 CO2
block diagram? (Apr 2014 R09)
12 What are basic differences between a search Radar and 4 CO4
Tracking Radar? Discuss the various scanning techniques and
tracking mechanisms? (Dec 2011 R07, June-2018 R13)
Unit - V

138
1 What is Matched Filter? (May-2019 R15) 1 CO1
2 List the types of RADAR Receivers. (May-2019 R15) 2 CO2
3 Draw the block diagram of cross correlation receiver? .( June- 2 CO2
2018 R13)
4 What are the different types of antennas used in radar? .( June- 1 CO1
2018 R13)
5 What is correlation function? .( May-2018 R13) 1 CO1
6 Define Noise Temperature? .( May-2018 R13) 1 CO1
7 Give Comparison between efficiency of matched and non 2 CO2
matched filters. ( May-2017 R13)
8 Discuss in brief measuring of noise figure. ( May-2017 R13) 1 CO1
1 Explain the designing criteria of a Matched filter Receiver? 2 CO2
(May-2019 R15)
2 Derive the effective noise temperature of N antenna system? 6 CO6
(May-2019 R15)
3 Distinguish serial feeds and parallel feeds? .( June-2018 R13) 4 CO4
4 Discuss matched filter receiver and derive matched filter 4 CO4
characteristics.( June-2018 R13)
5 Write merits and limitations of phased array antennas .( May- 6 CO6
2018 R13) .( June-2018 R13)
6 Explain Balanced type duplexer.( May-2018 R13, May-2019 2 CO2
R15)
7 What is meant by correlation? Explain cross correlation with 2 CO2
the help of neat block diagram. ( May-2017 R13)
8 Explain the principle of branch type duplexer ( May-2017 R13, 3 CO3
May-2019 R15)
9 Explain in detail about Efficient of non matched filters 4 CO4
compared with the matched filter? [Dec 2011 R07] .( May-
2018 R13)
10 A radar receiver is connected to a 30 ohm resistance antenna 4 CO4
that has an equivalent noise resistance of 25 ohm. Calculate the
noise figure of the receiver and the equivalent noise
temperature of the receiver. ( May-2017 R13)
11 Derive the expression for S/N of a matched filter ( May-2017 3 CO3
R13)
12 Write about i) beam steering ii) beam width of phased array 2 CO2
antennas. ( May-2017 R13)

139
PART – A Answers
UNIT-I
1. Describe in brief about pulse repetition frequencies and range ambiguities.( June-
2018 R13)
Ans: The pulse repetition frequency (PRF) is the number of pulses of a repeating
signal in a specific time unit, normally measured in pulses per second. PRF is inversely
proportional to time period ‘T’ which is the property of a pulsed wave.
T=1/PRF
For accurate range determination a pulse must be transmitted and reflected before the
next pulse is transmitted.
Max. Range = C/2PRF
2. What is maximum unambiguous range? .( May-2019 R15, May-2018 R13)

Ans: For accurate range determination a pulse must be transmitted and reflected before
the next pulse is transmitted.
Max. Range = C/2PRF

3. Define signal to noise ratio? .( May-2018 R13)
Ans: SNR is defined as the ratio of signal power to the noise power, often
expressed in decibels. A ratio higher than 1:1 (greater than 0 dB) indicates more
signal than noise.
4. Describe various radar applications.( May-2017)
Ans: Applications of radar:
1. Air Traffic Control
2. Air Navigation
3. Ship Safety
4. Space
5. Remote Sensing
6. Law Enforcement
7. Military
5. Calculate the range of a target, if the time taken by the signal to travel and return
is 100 micro seconds? ( May-2017)
Ans: Range of a Radar=(cTr)/2

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Range of a Radar (in KM)=0.15Tr
Range of a Radar (in nmi)=0.081Tr
Given
Tr=100µs
So R=0.15(100)=15 Km
R=0.081(100)=8.1nmi
UNIT-II
1. List the characteristics of FM-CW radar? .( June-2018 R13)
Ans: FMCW Radar is mainly used in altimeter, navigation Radar, automotive Radar, is
having following characteristics:
 It is having simple architecture

 It’s a mean power system
 Range and speed of target both can be found.
 Range resolution is good
 Range resolution can be changed by changing Bandwidth
 It has rectangular power spectrum.
 It is very difficult to detect.
2. Write about Doppler principle. .( May-2019 R15, June-2018 R13,May-2017 R13)
Ans: It is well known in the fields of optics and acoustics that if either the source of
oscillation or the observer of the oscillation is in motion, an apparent shift in frequency
will result. This is the Doppler Effect and is the basis of CW radar.
3. Write the applications of CW Radar? .( May-2019 R15, May-2018 R13)

Ans:
 Measurement of the relative velocity of a moving target, as in the police speed monitor
or in the rate-of-climb meter for vertical-take-off aircraft.
 Control of traffic lights, regulation of tollbooths, vehicle counting.
 As a sensor in antilock braking systems, and for collision avoidance.
 In railways, as a speedometer to replace the conventional axle-driven tachometer. In
such an application it would be unaffected by errors caused by wheel slip on
accelerating or wheel slide when braking.
 Monitoring the docking speed of large ships.
 Measurement of the velocity of missiles, ammunition, and baseballs.
4. Give the advantages of FM-CW Radar? .( May-2018 R13)

141
Ans:
 FMCW radar is called altimeter. It is used in aircraft to measure height
above the earth.
 It uses low power for transmission. This can be supplied by many solid state
devices such as magnetron, BWO, reflex klystron etc.
 The super-heterodyne based architecture delivers good sensitivity and
stability.
 It offers higher bandwidth compare to CW radar.
5. Calculate the Doppler frequency of an aircraft moving with a speed of 550Knots

and when the CW radar is working with λ=8cms. ( May-2017)
Ans: Given vr=550Knots
λ=8cms
Doppler frequency fd=1.03vr(knots)/ λ(meters)
Fd=(1.03(550))/0.08=7081.25hz
UNIT-III
1. What is need of Delay Line Canceller? (May-2019 R15)

Ans: The delay line is mainly used in Delay line canceller in order to introduce
a delay of pulse repetition time. Delay line canceller is a filter, which eliminates the DC
components of echo signals received from stationary targets.
2. What is blind Speed? (May-2019 R15)

Ans: The blind speed is a radial speed of the airplane at which the phase shifting of the
echo-signal has the value ±n. · 360° between two pulse periods.
3. What is staggered PRF? .( June-2018 R13)

Ans: Staggered PRF is a transmission process where the time between interrogations
from radar changes slightly, in a patterned and readily-discernible repeating manner.
4. What is delay line canceller? .( May-2018 R13)

Ans: Delay line canceller is a filter, which eliminates the DC components of echo
signals received from stationary targets.
5. What is butterfly shape on radar receiver.( May-2018 R13)

6. Ans: The superposition of successive A-Scope sweeps produces “Butterfly effect”.
Butterfly shape on Radar Receiver indicates moving targets are Present.
7. What are the differences between pulse radar and pulse Doppler radar? ( May-
2017)
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Ans: The physical principle of both these radars are the same but they differ in their
mode of operation.On the other hand the pulse doppler radar operates on high pulse
repetition. frequency thus causing unambiguous doppler measurements (no blind
speeds) but ambiguous range measurements (second-time-around echoes).
8. Write about MTI radar parameters. ( May-2017)

Ans: Parameters of MTI radar:
1. Probability of Detection (Pd)

2. Target Location Accuracy
3. Target Range Resolution (High Range Resolution or HRR)
4. Minimum Detectable Velocity MDV
5. Area Search Rate
6. Stand-off Distance
7. Coverage Area Size (breadth and depth)
8. Coverage Area Revisit Rate
UNIT-IV
1. Mention the types of Tracking? (May-2019 R15)

Ans:
 Continuous Tracking Radar
 Track While Scan Radar
2. What is meant by Tracking in Range? (May-2019 R15)

Ans: Range tracking is the process of continuously measuring the delay between the
transmission of an RF pulse and the echo signal returned from a target. ... Therange-
tracking circuitry is also used for acquiring a desired target.
3. Give the principle of operation of conical scan? .( June-2018 R13)

Ans: Conical scanning addresses this problem by "moving" the radar beam slightly off
center from the antenna's midline, and then rotating it. ... The antenna control system is
arranged to move the antenna in azimuth and elevation such that a constant return is
obtained from the aircraft being tracked.
4. Explain about sequential lobbing? ( June-2018 R13)

Ans: Sequential Lobing. If the Antenna beams are switched between two patterns
alternately for tracking the target, then it is called sequential lobing. It is also called
sequential switching and lobe switching. Sequential lobing gives the position of the
target with high accuracy.
5. List the disadvantages of sequential lobbing? .( May-2018 R13)

Ans: 1) Angle accuracy can be no better than the size of the antenna beam width.

143
2) Variation in echo strength on a pulse-by-pulse basis changes the signal level thereby
reducing tracking accuracy.
6. Define squint Angle.( May-2018 R13)

Ans: In a phased array or slotted waveguide antenna, squint refers to the angle that the
transmission is offset from the normal of the plane of the antenna.
7. Discuss the sequential lobing tracking antenna mechanism. ( May-2017)

Ans: If the Antenna beams are switched between two patterns alternately
for tracking the target, then it is called sequential lobing. It is also
calledsequential switching and lobe switching. This technique is used to find the
angular error in one coordinate.
8. Briefly explain the tracking radar and search radar system. ( May-2017)
Ans: The Search radar is usually less precise and only distinguishes between targets
that are hundreds of yards or even miles apart. Radar resolution is usually divided into
two categories viz. range resolution and angular resolution
The Tracking radar continuously emits the EM waves in the air and detects the
targeted object when it comes in the path of the waves.
UNIT-V
1. What is Matched Filter? (May-2019 R15)

Ans: The matched filter is the optimal linear filter for maximizing the signal-to-noise
ratio (SNR) in the presence of additive stochastic noise. ... It is so called because impulse
response is matched to input pulse signals. Two-dimensional matched filters are commonly
used in image processing, e.g., to improve SNR for X-ray.
2. List the types of RADAR Receivers. (May-2019 R15)

Ans:
 Super Regenerative Receiver
 Crystal Video Receiver
 Tuned radio Frequency
 Super Heterodyne Receiver
3. Draw the block diagram of cross correlation receiver? .( June-2018 R13)

Ans:

144
4. What are the different types of antennas used in radar? .( June-2018 R13)
Ans: Radar antennas can be slot antennas, vivaldi antennas, horn antennas or
anything else that can send out a beam on the right frequency. And you can use cheap
little antennas to do it. The main types of radars are: Parabolic antenna and slot
antenna.
5. What is correlation function? .( May-2018 R13)

Ans: A correlation function is a function that gives the statistical correlation between
random variables, contingent on the spatial or temporal distance between those
variables. In quantum field theory there are correlation functions over quantum
distributions.
6. Define Noise Temperature? ( May-2018 R13)

Ans: The noise temperature is the temperature of a resistor that has noise power
equal to that of the device or circuit. Specifically, the noise temperature is defined by
T = N/kB, where N is the noise power within bandwidth B, and k = 1.38 × 10 -23J K-1 is
Boltzmann's constant.
7. Give Comparision between efficiency of matched and non matched filters. ( May-
2017)
a. In practice the matched filter cannot always be obtained exactly. It is appropriate,

therefore, to examine the efficiency of non matched filters compared with the
ideal
b. matched filter. The measure of efficiency is taken as the peak signal-to-noise
ratio from the non matched filter divided by the peak signal-to-noise ratio
(2E/No) from the matched filter. Plots the efficiency for a single-tuned (RLC)
resonant filter and a rectangular-shaped filter of half-power bandwidth Bτ when
the input is a rectangular pulse of width τ. The maximum efficiency of the
Efficiency, relative to a matched filter, of a single-tuned resonant filter and a
rectangular shaped filter, when the input signal is a rectangular pulse of width τ.
B = filter bandwidth.

145
c.
8. Discuss in brief measuring of noise figure. ( May-2017)
Ans:
Noise Figure:
The noise figure of a receiver was described as a measure of the noise produced by a practical
receiver as compared with the noise of an ideal receiver. The noise figure Fn of a linear network
may be defined as

UNIT-1
1. Number of antennas used in radar for transmission and reception
(a) 3
(b)1
(C) 2
(d) none
2. Range of L-band in radar is

(a) 1000-2000mhz
(b)1000-2000ghz
(c) 1000-2000khz
(d)all of the above
3. Range of s-band in radar is

(a) 1000-2000mhz
(b) 2000-4000mhz
(c) 1000-2000khz
(d)none of the above

146
4. Range of C-band in radar is
(a) 4000-8000mhz
(b) 1000-2000mhz
(c)1000-2000khz
5. Range of X-band in radar is

(a) 8000-12000mhz
(b) 4000-8000mhz
(c)1000-3000khz
6. In PPI ---------- is displayed in polar coordinates.

(a)range
(b)azimuth
(c) both a & b
(d)none
7. Which of the following is an application of radar

(a) area survelliance
(b)target tracking
(c)ship safety
(d)all of the above
8. Transmitter in radar acts as

(a)amplifier
(b)oscillator
(c)attenuator
9. ---------- in radar protects the receiver from damage caused by the high power of transmitter.
(a)antenna
(b)transmitter
(c)duplexer
(d)none
10.The ratio of the total time that the radar is radiating to the total time it could have radiated is
known as
(a)duty cycle
(b)pulse repetition frequency
(c)both a & b
(d)none
11. A high noise figure in a receiver means----------

a. poor minimum detectable signal
b. good detectable signal

c. receiver bandwidth is reduced
d. high power loss.

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12. Which of the following will be the best scanning system for tracking after a target has been
acquired.
a. conical
b. spiral
c. Helical
d. Nodding
13. Which of the following noise figure.

a. (Si Ni) / (So No)
b. (So No) / (Si Ni)
c. (So / No ) / sqrt. ( Si / Ni)
d. ( Si / Ni) / sqrt .(So / No)
14. The average power of a pulsed radar transmitter is given by

a. The product of peak power of the pulse and the duty cycle
b. Peak power divided by the number of pulses repeated in one second.
c. Peak power divided by the duty cycle
d. Peak power divided by the duty cycle and pulse
15. Which of the following diode is used as detector in radar.

a. gunn diode
b. schotky diode
c. Impact diode
d. varactor diode
16. In case the target cross section is changing the best system for accurate tracking is
a. monopulse
b. lobe switching
c. sequential lobing
d. conical scanning.
17. In a radar in case the return echo arrives after the allocated pulse interval, then
a. it will not be received
b. the receiver will get overloaded

c. it may interfere with the operation of the transmitter
d. the target will appear closer than it really.
18. PPI in a radar system stands for

a. plan position indicator
b. pulse position indicator
c. plan position image
d. prior position identification
19. Which of the following is unlikely to be used as a pulsed device

a. TWT
b. BWO
c. CFA
d. Multicavity klystron
20. Radar detection is limited to line of sight because

148
a. curvature of the earth
b. the waves are not reflected by the ionosphere
c. long wavelengths are used
d. short wavelengths are used
UNIT-2
1. Stagger PRF is used to
a. shift the target velocities to which the MTI system is blind
b. improves the detection of a moving target against cluster background
c. increase the average power transmitted
d. increase the peak power transmitted.
2. COHO stands for

a. coherent output
b. counter housed oscillator
c. coherent local oscillator
d. carrier oscillater and harteley oscillater
3. If the peak transmitted power in a radar system in increased by a factor of 16, the maximum
range will be increased
a. 2 times
b. 4 times
c. 4 times
d. 16 times
4. Which of the following statement is incorrect.The radar cross section of a target?

a. depends on the aspect of a target, if this is non spherical.
b. depends on the frequency used.
c. is equal to the actual cross sectional area for small targets
d. may be reduced by special coating of the target.
5. Which of the following statement is incorrect High PRF will

a. increase the maximum range
b. make target tracking easier to distinguish from noise
c. make the retured echoes easier to distinguish from noise
d. have no effect on the range resolution.
6. Side lobe of an antenna causes

a. reduction in gain of antenna
b. reduction in beam width of antenna
c. ambiguity in direction finding
d. increases directivity
7. A radar which is used for determining the velocity of the moving aircraft along with its
position and range is
a. moving target indicator
b. radar speedometer
c. pulse radar
d. radar range finder
8. Blind speed in MTI radar results in

149
a. restriction in speed of detectable targets
b. blanking to PPI.
c. no change in phase detector output
d. absorption of electromagnetic waves.
9. The quartz delay line in a MTI radar is used to

a. match the signal with echo
b. substract a complete scan from previous scan
c. match the phase of COHO and STALO
d. Match the phase of COHO and output of oscillator
10. Which one of the following applications or advantages of radar beacons is false
a. navigation
b. target identification
c. more accurate tracking of enemy target
d. very significant extension of the maximum range.
11. STALO stands for

a. standard local oscillator
b. stable L-band output
c. stabilized local oscillator
d. saturated and linear oscillator.
12. Large antenna is used in radar because it

a. gives higher gain
b. gives lesser side lobes.
c. increases the bean width
**d. increases band width
13. The range of radar is

a. directly proportional to the gain of the radar antenna
b. directly proportional to the minimum detectable signal by the receiver
c. inversely proportional to the gain of the radar antenna
d. inver4sely proportional the transmitted power.
14. A biostatic radar has

a. one antenna for transmitting as well as for receiving
b. two antennas for receiving the signal.
c. two antennas for transmitting signal
d. transmitting and receiving antennas
15. Blind speed causes target to appear

a. moving uniformly
b. moving irregularly
c. stationary
d. intermittently
16.The drawbacks of zero intermediate frequency receiver can be overcome by using ----------
(positive feedback)
17.-----------(cw tracking illuminator) is well suited for missile defense systems.

150
18.The two factors on which frequency range of propeller modulation depends are ---------
(shaft-rotation speed) and ------------(number of propeller blades).
19.The sign of -----------(Doppler frequency) is used to find the direction of the target.
20.The ----------(multiple frequency cw) radar is used for determining the accurate distance.
UNIT 3
1. Which of the following statement is incorrect? The Doppler Effect is used in
a. MTI system
b. CW radar
c. FM Radar
d. moving target plotting on the PPI
2. A transponder comprises of
a. transmitter only
b. receiver only
c. transmitter and receiver
d. transmitter and receiver and antenna
3. If A be the capture area of receiving antenna of radar then the maximum range will be
Proportional to
a. A
b. A 2
c. 1 / sqrt A
d. sqrt A
4. For high power radars the peak power is limited by

a. breakdown of RF components
b. increased complexity of transmitter circuitry
c. cost aspects
d. max. band width
5. The maximum range of radar depends on

a. pulse frequency
b. pulse duration
c. pulse energy
d. pulse interrals
6. The term rat race in radar is associated with

a. duplexer.
b. receiver bandwidth
c. modulator
d. hybrid ring
7. Most of the aircraft surveillance radars operate in

a. L band
b. c band
c. s band
d. x band.
8. The minimum range of detection by a pulse radar depends on

a. pulse width

151
b. Average transmitter power
c. beam width of the antenna
d. bandwidth of antenna
9. An MTI system eliminates permanent echoes while preserving echoes from a moving target
by
a. decreasing pulse width
b. utilizing the Doppler effect
c. increasing peak transmitted power
d. wide beam width
10. A CW radar cannot give information about

a. a range
b. direction
c. both range and direction
d. range, direction and past track
11. A target is moving with a velocity of 360km/hour radially towards the transmitting
frequency generator of 3 GHz will be
a. 300 KHz
b. 1 KHz
c. 1.5 KHz
d. 2 KHz
12. A duplex is a device which

a. switches an antenna between transmitter and receiver by means of selective filters
b. switches an antenna between transmitter and receiver by means of gas
Switching tubes.
c. neither of the above two d. connect at a time to transmitter or receiver only
13. The minimum receivable signal in a radar receiver who’s IF bandwidth is 1.5 MHz and
which has a noise figure 9 dB will be
a. 4.16 X 10 -10 Watt
b. 4.16 X 10 -12 Watt
c. 4.16 X 10-13 Watt
d. 4.16 X 10 -14- Watt
14. When p is the peak transmitted pulse power. The maximum range of the radar is
proportional to
a. P
b. P1/2
c. P ¼
d. 1/ P 1/4
15. A RADAR SYSTEM OPERATES at 3 cm with a peak pulse power of 500KW. Its
minimum receivable power is 10 -3 W, The capture area of th antenna is 5 m2 and the radar
crosssectional area of the target is 20m 2 . the maximum range of the radar will be
a. 343 Km
b. 44km
c. 686 km
d. 888 km

152
1. One method commonly employed to extract Doppler information in a form suitable
for display on the PPI scope is with a
a. Power Amplifier
b. A-Scope display
c. Delay line canceller
d. Coherent oscillator
21.The characteristic feature of coherent MIT Radar is that the
a. Transmitted signal must be out of phase with reference signal in receiver

b. The transmitted signal must be equal in the magnitude with reference signal
c. The transmitted signal must be coherent with the reference signal in the receiver
d. Transmitted signal must not be equal to reference signal in the receiver
22.In the following which are produce, with time a butterfly effect on the 'A' scope
e. Fixed Targets
f. PPI scope
g. Moving Targets
h. Phase Detector
i.
23.The stalo, coho and the mixer in which they are combined plus any low-level
amplification are called the
j. Transmitter-Oscillator
k. Transmitter-Exciter
l. Receiver-Amplifier
m. Receiver-exciter
24.The Doppler frequency shift produced by a moving target may be used in a pulse radar
to
n. Combine moving targets from desired stationery objects

o. Determine the relative velocity of a target
p. Separate desired moving targets from desired stationery objects
q. Determine the displacement of a target
Unit 4
1. This radar designates targets to the tracking radar by providing the coordinates
where the targets are to be found.
a. TWS radar
b. Sequential radar
c. Acquisition radar
d. CW radar
2.The antenna pattern commonly employed with tracking radar is the

153
a.Symmetrical beam
b.Symmetrical Pencil Beam
c.Asymmetrical Pencil beam
d.Asymmetrical beam
3.One of method of obtaining the direction and magnitude of the angular error in one
coordinate is by alternately switching the antenna beam between two positions. This is
called
e. Lobe switching
f. Asymmetrical switching
g. Symmetrical switching
h. Sequential tracking
i.
4.When the outout from more than one radar are automatically combined to provide
target tracks, the processing is called
j. ADIT
k. IDAT
l. GCA
m. PPI
5. A surveillance radar that provides target tracks is sometimes called a
a. Track acquisition radar

i. Track-while-scan radar
ii. Integrated ADT
iii. ADT
6. Landing radars used for

a. ADT
b. IADT
c. GCA
d. ADIT
7. ADIT stands for

a. Automatic Decode Interlink Track
b. Automatic Decode Integrated Track
c. Automatic Detection and Integrated Track
d. Automatic Demodulation and Interlink Track
8. The difference between the target position and the reference direction is the
a. Lobe error
b. Tracking error
c. Angular error
d. Sequential error
e.
9. When the target is located along the reference direction
a. Lobe error is zero
b. Lobe error is maximum
c. Angular error is maximum
d. Angular error is zero

154
10. GCA stands for
a. General Control of Approach
b. Ground Connection of Approach
c. Ground Control of Approach
d. General Connection of Approach
11. In this technique the RF signals received from two offset antenna beams are
combined so that both the sum and the difference signals are obtained simultaneously
a. Monopulse
b. Pulse to pulse comparison
c. Fixed lobing
d. Sequential lobing
12. The mono pulse antenna must generate a sum pattern with
a. Minimum boresight gain
b. Maximum boresight gain
c. Minimum pulse gain
d. Maximum pulse gain
13. This is used to rotate continuously an offset antenna beam

a. rotating Feed
b. rotational scanning
c. conical scanning
d. nutating feed
14. The process of stretching the pulses before low-pass filtering is called
a. Sampling
b. Quantizing
c. Sample and hold
d. Detecting
15. A conical scan-on-receive-only tracking radar radiates a

a. Scanning transmit beam
b. Scanning non-transmit beam
c. Non scanning receive beam
d. Non scanning transmit beam
16. The angle between the axis of rotation and the axis of the antenna beam is called the
a. Lobe Angle
b. Conical Angle
c. Squint Angle
d. Rotation Angle
17. If the feed maintains the plane of polarization fixed as it rotates it is called a
a. Rotating Feed
b. Fixed feed
c. Nutating Feed
d. Flexible feed
18. When the antenna is an target, the line of sight to the target and the rotation axis

155
coincide, and the conical scan modulation is
a.Maximum
b.Zero
c.Constant
d.Infinity
19. Extracting the modulation imposed on a repetitive train of narrow pulses is called
a. Scanning
b. Conical scanning
c. Box caring
d. Sampling
e.
20. LORO stands for
f. Lobe of radiation only
g. Lobe on radiation only
h. Lobe on receive only
i. Lobe on radar only
Unit 5
1. North filter frequency response function is
a.H(f) = GaS*(f) exp (j2&pift1)
b.
c.
d. H(f) = GaS*(f) exp (-j2πft1)
2. The matched filter may also be specified by

a.
b.
c.
d.
3. Peak signal-to-mean noise ratio of the matched filter

a.

156
d
4. The amplitude spectrum of the matched filter is

a. Obtained by its frequency response
b. Negative of the amplitude spectrum of signal
c. Same as the amplitude spectrum of signal
d. Depends on phase spectrum of signal
5. The noise power per hertz of bandwidth, N0 is equal to
a.
b.
c.
d.
6. A network whose frequency response function maximizes the output peak-single-

to mean noise ratio is called a
a. Envelope Detector
b. Matched Detector
c. Matched Filter
d. Optimum filter
7. If the band width of the receiver passband is wide compared with that occupied
by the signal energy
a. Extraneous noise is introduced
b. Noise is reduced
c. Increases the signal to noise ratio
d. Frequency response is improved
8. If the receiver bandwidth is narrower than the bandwidth occupied by the signal
e. Extraneous noise is introduced
f. Noise energy is reduced
g. Increases the signal-to-noise ratio
h. Frequency response is improved
9. When there is optimum bandwidth
i. Signal to noise ratio is minimum
j. Signal to noise ratio is maximum
k. Noise energy is maximum
l. Noise energy is reduced
10. Phase spectrum of the matched filter is
m. Inversely proportional to frequency
n. Negative of the phase spectrum of signal
o. Same as the phase spectrum of signal
p. Proportional to amplitude
q.
11. The cross correlation function R(t) of two signals y(λ) and s(λ) each of finite
duration is defined as

157
a.
b.
c.
d.
12. The matched filter forms the

a. Cross correlation between transmitted signals
b. Cross correlation between signal corrupted by noise and replica of transmitted signal
c. Correlation between signal corrupted by noise and replica of transmitted signal
d. Cross correlation between received signal corrupted by noise and a replica of the
transmitted signal
13. The output y0(t) matched filter with impulse response h(t) when the input is yin(t) =
s(t)+n(t) is
a.
b.
c.
d.
14. When the input noise is stationary and white the peak signal to mean noise ratio is
b.
c.
d.
15. The maximum ratio of the peak signal power to the mean noise power is
a.
b.
c.
2019
158
d.
16. The Output of the matched filter is

a. Replica of the input signal
b. Proportional to input signal to noise ratio
c. Not a replica of the input signal
d. Not preserving the shape of the input signal
17. The output of the matched filter proportional to

a. Input signal
b. Input signal correlated with a replica of transmitted signal
c. Input signal correlated with a replica of transmitted signal except for time delay t1
d. Input signal cross correlated with a replica of the transmitted signal except for
the time delay t1
18. The auto correlation function of a rectangular pulse of width τ is a
a. Square whose base is of width τ
b. Triangular whose base is of width τ
c. Triangular whose base is of width 2τ
d. Square whose base is of width 2τ
19. If the input signal yin(t) were the same as the signal s(t) for which the
matched filter was designed, the output would be the
a. Correlation function
b.Cross correlation function
c.Auto correlation function
d.Replica of the transmitted signal
20.When the input signal s(t) is a rectangular sine wave pulse the output peak-signal to
mean noise ratio is
a.Same as signal to noise power ratio
b.Twice the signal to noise power ratio
c.Same as average signal to noise power ratio
d.Twice the average signal to noise power ratio
Unit 5
1.The noise figure Fn of a linear network is defined as
a.
b.
c.
.
d.
2. The output noise from two circuits in cascade is N0, the noise figure F0 is
3.
a

159
c.
d.
4. If the receive effective noise temperature is Te, then operating noise temperature is
a. ToFs
b. T0/Fs
c. To/1+Fs
d. To / 1-Fs
5. Effective noise temperature is defined as
a. Te = (Fn-1)T0
b. Te = FnT0
c. Te = Fn-1/T0
d. Te = (Fn+1)T0
6. The noise figure of 'N' networks in cascade may be shown to be
a. F0 = F1+F2+F3+ ...............Fn-1
b.
c.
.
d.
7. It is defined as the effective noise temperature of the receiver system including the
effects of antenna temperature
a. Effective noise temperature
b. Noise figure
c. System noise temperature
d. antenna
ntenna noise temperature
8. The effective noise temperature of receiver consisting of a number of networks

in cascade
a.
b.
c.
d.
9. System noise temperature is given by

a. Ts = Ta + Tf
2019
160
b. Ts =
Ta+Te c. Ts =
Ta - Tf
d. Ts = Ta - Te
10. The expression for noise figure interms of additional noise introduced by
network it self is
b.
c.
d.
11. The noise figure is commonly expressed in

a. Hertzs
b.Decibels
c. Hz/W
d. W/Hz
12. When a long persistence is needed the required phosphor is

a. P7
b.P19
c. P1
d. P39
13. This is universally used as the radar display

a. Raw Video
b. Blip display
c. CRT display
d. Synthetic display
14. Where no persistence is needed as when the frame time is less than the response
time of the eye. This phosphor is commonly used
a. P7
b. P19
c. P1
d. P39
15. It is appropriate for PPI presentations where the frame times are several seconds
a. P19
b. P39
c. P29
d. P7
16. When the display is connected directly to the video output of the receiver
the information displayed is called
a. Raw video
b. Synthetic video

161
c.CRT video
d.Blip video
17. In this type of video, receiver video output is processed by automatic detection
and tracking processor
a. Synthetic Video
b. Raw Video
c. CRT Video
d. Blip Video
18. An intensity modulated rectangular display with azimuth angle indicated by
horizontal coordinate and elevation angle by the vertical coordinate is
a. A Scope
b. B Scope
c. C Scope
d. R Scope
19. This is the device that allows a single antenna to serve both the transmitter and
the receiver
a.Dual Pulse generator
b. Duplexer
c. Multiplexer
d. Demultiplexer
20. This is based on the short-slot Hybrid function

a. Balanced Demodulator
b. Balanced Duplexer
c. Unbalanced Duplexer
d. ATR Tube
21. The power handling capability is greater in the

a. Balanced Duplexer
b. Branch Duplexer
c. ATR Tube
d. Receiver protector

162
5. VLSI Design (EC0742)
SYLLABUS:
UNIT DETAILS
I INTRODUCTION : Introduction to IC Technology – MOS
BASIC ELECTRICAL PROPERTIES :Basic Electrical Properties of MOS and
BiCMOS Circuits: Ids-Vds relationships
II VLSI CIRCUIT DESIGN PROCESSES : VLSI Design Flow, MOS Layers, Stick
Diagrams, Design Rules and Layout, 2 um CMOS Design rules for wires, Contacts and
Transistors Layout Diagrams for NMOS and CMOS Inverters and Gates, Scaling of
MOS circuits.
III GATE LEVEL DESIGN : Logic Gates and Other complex gates, Switch logic,
Alternate gate circuits, Time delays, Driving large Capacitive Loads, Wiring
Capacitances, Fan-in and fan-out, Choice of layers
IV DATA PATH SUBSYSTEM DESIGN: Subsystem Design, Shifters, Adders, ALUs,
Multipliers, Parity generators, Comparators, Zero/One Detectors, Counters
ARRAY SUB SYSTEMS: SRAM, DRAM, ROM, Serial access memories, Content
addressable memory.
V SEMICONDUCTOR INTEGRATED CIRCUIT DESIGN: PLAs, FPGAs, CPLDs,
Standard Cells, Programmable Array Logic, Design Approach, Parameters influencing
low power design.
CMOS TESTING : CMOS Testing, Need for testing, Test Principles, Design Strategies
for test, Chip level Test Techniques, System-level Test Techniques, Layout Design for
improved Testability.

163
Subject VLSI design

Faculty G. Kiranmayee, D. Surendra Rao, B.Aruna.
Text Books
Essentials of VLSI circuits and systems – Kamran Eshraghian, Eshraghian Dougles and A.
Book 1
Pucknell, PHI, 2005 Edition.
Book2 VLSI Design- K.Lal Kishore, V.S.V. Prabhakar, I.K.International, 2009
CMOS VLSI Design – A circuits and systems perspective, Neil H.E. Weste, David Harris,
Book 3
Ayan Banerjee, Pearson, 2009 and Eshraghian, Pearson Education, 1999.
Reference Books
Book 4 CMOS logic circuit design – John P. Uyemura, Springer,2007.
Book 5 Modern VLSI Design – Wayne Wolf, Pearson Education, 3rd Edition, 1997
Book 6 VLSI Design – A.Albert Raj, Latha, PHI, 2008
Book 7 Introduction to VLSI – Mead & Convey, B.S Publications,2010.
Book 8 VLSI Design- M.Micheal Vai,CRC Press, 2009
Chapters No of
Unit Topic
BOOK 1 BOOK 2 BOOK 3 Classes
Introduction to NMOS, PMOS
and CMOS, BICMOS
I 1,2 1,2 1 10
technologies & Basic Electrical
Properties of MOS and Bi-CMOS
circuits
II VLSI Circuit Design Processes 4 3 3 08
III Gate level Design -- 4 5 09
Data Path Subsystem s & Array

IV 5 5,6 5,6 17
subsystems
Semiconductor Integrated Circuit
V 8,9 7,8 8,9 10
Design & CMOS Testing
Total Contact classes for syllabus coverage 54
Tutorial Classes 12
Classes for beyond syllabus 05
Remedial Classes/NPTL 07
Total Number of Classes 80

164
Subject Name with code : VLSI Design (EC0742) Class : IV/I/ECE

Name of the Faculty Member : 1. Mr.D.Surendra Rao
2. Mrs.G.kiranmayee
3. Ms.B.Aruna
Academic Year : 2019-20 (I semester)
1. Remembering 2.Understanding 3.Applying
4. Analyzing 5.Evaluating 6.Creating
BTL level Course

(Please Outcome
Questions mention (Please
Sl.No
L1 or L2 mention
or etc...) CO1 or
CO2 etc…)
Unit - I
Part – A (2 Marks)
1 Define figure of merit of MOS transistor. R13-APR-18 L1 CO1

2 Draw the CMOS inverter circuit. R13-APR-18 L2 CO1
3 What are the advantages of BiCMOS process compare with the L1 CO1
CMOS.R13-MAY-17
4 List the fabrication procedures for IC Technologies. R13-MAY- L1 CO1
17
5 Define threshold voltage of a MOS device. R13-NOV-16 L1 CO1
6 What are pull-ups and write about the resistor pull-up and its L3 CO1
usage. R13-NOV-16
7 Define gm of MOS transistor. R13-MAY-16 L1 CO1
8 Draw transfer characteristics of CMOS inverter R13-MAY-16 L3 CO1
Part – B (5 Marks)
1 Draw and explain the operation of BiCMOS inverter. R13-APR-18 L2 CO1

2 Derive the drain to source current equation for NMOS enhancement L1 CO1
mode transistor. R13-APR-18
3 Discuss the Basic Electrical Properties of MOS and Bi-CMOS L2 CO1
Circuits. R13-MAY-17
4 Derive the expression for estimation of Pull-Up to Pill-Down L1 CO1
ratio of an n-MOS inverter driven by another n-MOS inverter.
R13-MAY-17
5 Derive the relationship between Ids and Vds. R13-MAY-17 L1 CO1
6 Derive the expression for transfer characteristics of CMOS L1 CO1
Inverter. R13-MAY-17
7 Write about Bi-CMOS fabrication in a n-well process with a L6 CO1
diagram. R13-NOV-16
8 Distinguish between Bipolar and CMOS devices technologies in L4 CO1
brief. R13-NOV-16
9 Mention about the Bi-CMOS Inverters and alternative Bi-CMOS L2 CO1
inverters. R13-NOV-16
165
10 Draw the fabrication steps of CMOS transistor and explain its L3 CO1
operation in detail. R13-MAY-16
11 Explain the threshold voltage equation of MOS transistor. R09- L2 CO1
MARCH-17
12 Write the comparison between nMOS and Biploar technologies. L4 CO1
R09-DEC-14
UNIT-2
PART-A(2 Marks)
1 What is meant by synthesis? R13-APR-18 L1 CO2

2 Differentiate Functional simulation and timing simulation. R13-APR- L2 CO2
18
3 Draw the VLSI Design Flow. R13-MAY-17 L3 CO2
4 Draw the stick diagram for two inputs NOR gates. R13-MAY-17 L3/L6 CO2
5 Explain about the contact cuts and approaches. R13-NOV-16 L2 CO2
6 Represent the stick diagram of a NMOS inverter. R13-NOV-16 L3 CO2
7 Define scaling and explain it. R13-MAY-16 L1 CO2
8 Explain difference between stick diagram and layout diagram. L2 CO2
R13-MAY-16
PART-B(5 Marks)
1 Discuss the steps involved in VLSI design flow? R13-APR-18 L2 CO2

2 Draw the stick diagram for the following Boolean expression using L6 CO2
CMOS logic. F=A(B+C). R13-APR-18
3 Explain in detail about the scaling concept in VLSI circuit L2 CO2
Design. R13-MAY-17
4 Draw the Layout Diagrams for NAND Gate using n-MOS. R13- L3 CO2
MAY-17
5 Explain λ-based Design Rules in VLSI circuit Design. R13- L2 CO2
MAY-17
6 Draw the Layout Diagrams for CMOS Inverter R13-MAY-17 L3 CO2
7 Discuss about the stick diagrams and their corresponding mask L2 CO2
layout examples. R13-NOV-16
8 Draw the stick diagram of p-well CMOS inverter and explain the L3 CO2
process. R13-NOV-16
9 Explain about the 2µm CMOS Design rules and discuss with a L2 CO2
layout examples. R13-NOV-16
10 Draw and explain the layout for CMOS 2-input NAND gate. L3/L2 CO2
R13-NOV-16
11 What is the purpose of design rules? What is the purpose of stick L2 CO2
diagram? What are the different approaches for describing the
design rules? Give three approaches for making contacts between
poly silicon and discussion in NMOS circuits. R13-MAY-16
12 List and explain the scaling factors for device parameters briefly. L1/L2 CO2
R09-DEC-14
UNIT-3
PART-A(2 Marks)
1 What is the importance of fan-in fan-out? R13-APR-18 L1 CO3

2 Differentiate rise time and fall time? R13-APR-18 L4 CO3
166
3 What is switch logic? R13-MAY-17 L1 CO3
4 What are the issues involved in driving large capacitive loads in L5 CO3
VLSI circuits. R13-MAY-17
5 Write about clocked CMOS logic and its usage. R13-NOV-16 L1 CO3
6 Explain about the wiring capacitance and its need. R13-NOV-16 L2 CO3
7 Define delay and explain different time delays in gate level L1 CO3
modeling. R13-MAY-16
8 Explain the importance of wiring capacitance of a MOS L2 CO3
transistor. R13-MAY-16
PART-B(5 Marks)
1 Briefly explain the commonly used technique to estimate the L2 CO3

delay time of a MOS inverter. R13-APR-18
2 Implement 4: 1 multiplexer using switch ‘logic R13-APR-18 L6 CO3
3 Explain the following L2 CO3
i.Fan-in
ii.Fan-out
iii. Choice of layers R13-MAY-17
4 Describe the following L2 CO3
i. Pseudo-nMOS logic
ii. Domino Logic R13-MAY-17
5 Discuss about the logics implemented in gate level design and L2 CO3
explain the switch logic implementation for a four way
multiplexer. R13-NOV-16
6 Describe about the methods for driving large capacitive loads. L2 CO3
R13-NOV-16
7 Describe about the choice of fan-in and fan-out selection in gate L3 CO3
level design. R13-NOV-16
8 Draw and explain fan in and fan out characteristics of different L2 CO3
CMOS design technologies.
9 Explain different wiring capacitance used in Gate level design L2 CO3
with example. R13-MAY-16
10 What are the alternate gate circuits available? Explain any one of L1/L2 CO3
item with suitable sketch by taking NAND gate as an example.
R13-MAY-16
11 With suitable diagrams explain some switch logic arrangements? L1 CO3
R09-MARCH-17
12 Discuss the importance of timing delays in design of a system? L2 CO3
R09-JAN-15
UNIT-4
PART-A(2 Marks)
1 Draw the 1-bit SRAM cell. R13-APR-18 L3 CO4

2 What are the various serial access memories? R13-APR-18 L1 CO4
3 Design a 2-bit Parity generator. R13-MAY-17 L6 CO4
4 What is Booth’s algorithm? R13-MAY-17 L1 CO4
5 Mention about SRAM and its usage. R13-NOV-16 L1 CO4
6 Describe about the Serial Access Memories. R13-NOV-16 L4 CO4
7 Explain the difference between EPROM and EEPROM. R13- L4 CO4
MAY-16
167
8 Draw 2-bit comparator. R13-MAY-16 L3 CO4
PART-B(5 Marks)
1 Design a zero detector circuit. R13-APR-18 L6 CO4
2 Design a 4-bit magnitude comparator. R13-APR-18 L6 CO4
3 Draw the schematic and logic diagram for a single bit adder and L6 CO4
explain its operation with truth table. R13-MAY-17
4 With neat circuit diagram, explain the operation of Barrel Shifter. L3 CO4
R13-MAY-17
5 Explain about Serial access memories. R13-MAY-17 L2 CO4
6 Explain about design of an ALU subsystem in brief. R13-MAY- L2 CO4
17
7 Design a shift register with the dynamic latch operated by a two- L6 CO4
phase clock. R13-NOV-16
8 Explain the working principle of Ripple carry adder using L2 CO4
transmission gates. R13-NOV-16
9 Explain about the Wallace tree multiplication and its design L2 CO4
issues. R13-NOV-16
10 Draw the circuit diagram of four transistor DRAM cell with L3 CO4
storage nodes R13-NOV-16
11 Draw the basic circuit diagram of static RAM and explain its L3 CO4
operation. R13-MAY-16
12 Draw the basic block diagram of 4-bit adder and explain its L3 CO4
operation in detail. R13-MAY-16
UNIT-5
PART-A(2 Marks)
1 Implement 2:1 MUX using PAL. R13-APR-18 L6 CO5

2 What is the difference between verification and validation? R13- L4 CO5
APR-18
3 Write the comparison between FPGA and CPLD. R13-MAY-17 L4 CO5
4 What type of faults can be reduced by improving layout design. L2 CO5
R13-MAY-17
5 Explain about the principle of Built in Self Test. R13-NOV-16 L2 CO5
6 Explain about the test principles used for testing. R13-NOV-16 L2 CO5
7 Explain difference between PLA and PAL. R13-MAY-16 L4 CO5
8 Define controllability and observability with respect to testing. L1 CO5
R13-MAY-16
PART-B(5 Marks)
1 Discuss scan design techniques? R13-APR-18 L2 CO5
2 Compare various programmable devices. R13-APR-18 L4 CO5
3 Explain Architecture of FPGA in detail. R13-MAY-17 L2 CO5
4 What are the draw backs of PLAs? How PLAs are used to L2 CO5
implement combinational and sequential logic circuits? R13-
MAY-17
5 Why stuck-at-faults occurs in CMOS circuits? Explain with L2/l5 CO5
suitable logical diagram. R13-MAY-17
6 Why the chip testing is needed? At what levels testing a chip can L5 CO5
occur? R13-MAY-17
7 Explain the detailed logic configurable Block Architecture of L2 CO5

168
FPGA. R13-NOV-16
8 Write a note on the different parameters influencing low power L1 CO5
design. R13-NOV-16
9 Explain the following in detail L2 CO5
i.Chip level Test Techniques.
ii. Testability and practices. R13-NOV-16
10 What is the drawback of serial scan? How to overcome this? L2 CO5

R13-MAY-16
11 What is sequential fault grading? Explain how it is analyzed. L1/l2 CO5
R13-MAY-16
12 Explain about configurable FPGA based I/O blocks. R09- L2 CO5
MARCH-17
13 What is CPLD? Draw its basic structure of CPLD and give its L1/l3 CO5
application. R09-MARCH-17
14 What is the need of Test and Testability in VLSI system design? L4 CO5
R09-MARCH-17
15 Draw and explain the architecture of test access port controller. L2/l3 CO5
R09-MARCH-17
PART-A Answers:
UNIT: 1
1. Define figure of merit of MOS transistor. R13-APR-18
Answer:
Figure of merit is a measure for frequency response and switching performance of a
MOS transistor .
Figure of merit is defined as : ω0 = gm
Cg
where gm is trans conductance. Cg is gate capacitance.
2. Draw the CMOS inverter circuit. R13-APR-18

Answer:

169
3. What are the advantages of BiCMOS process compare with the CMOS.
R13-MAY-17
Answer:
BiCMOS refers to logic family which combines both bipolar and CMOS logic
devices in one single IC. Hence it offers following benefits:
High Speed of operation
High packing density
Low Power Dissipation
As it is combination of bipolar and CMOS technologies it offers following
benefits over conventional CMOS and Bipolar logic families. This is the main
difference between them.
BiCMOS Advantages
Following are the advantages of BiCMOS:
Low power dissipation compare to Bipolar
Improved speed of operation compare to CMOS
Large current drive compare to CMOS
BiCMOS Disadvantages
Following are the disadvantages of BiCMOS:
High Cost
As it requires more number of mask stages, it takes more time to
fabricate.
4. List the fabrication procedures for IC Technologies. R13-MAY-17

The fabrication of integrated circuits consists basically of the following process
steps:
 Lithography
 Etching
 Deposition
 Chemical Mechanical Polishing
 Oxidation
 Ion Implantation
 Diffusion
5. Define threshold voltage of a MOS device. R13-NOV-16

The threshold voltage, also called the gate voltage, commonly abbreviated as Vth or
VGS (th), of a field-effect transistor (FET) is the minimum gate-to-source voltage
differential that is needed to create a conducting path between the source and drain
terminals.
When referring to a junction field-effect transistor (JFET), the threshold voltage is often
called "pinch-off voltage" instead. This is somewhat confusing since "pinch off" applied
to insulated-gate field-effect transistor (IGFET) refers to the channel pinching that leads
to current saturation behaviour under high source–drain bias, even though the current is

170
never off. Unlike "pinch off", the term "threshold voltage" is unambiguous and refers to
the same concept in any field-effect transistor.
6. What are pull-ups and write about the resistor pull-up and its usage. R13-NOV-16
In electronic logic circuits, a pull-up resistor is a resistor used to ensure a known state
for a signal. It is typically used in combination with components such as switches and
transistors, which physically interrupt the connection of subsequent components to
ground. The pull-up resistor then ensures a well-defined voltage (i.e. VCC) across the
latter during interruption.A pull-down resistor works in the same way but is connected to
ground. It holds the logic signal at a low logic level when no other active device is
connected.
7. Define gm of MOS transistor. R13-MAY-16

transconductance is the ratio of the change in drain current to the change in gate voltage
over a defined, arbitrarily small interval on the drain-current-versus-gate-voltage curve.
The symbol for transconductance is gm. The unit is thesiemens, the same unit that is
used for direct-current (DC) conductance.
8. Draw transfer characteristics of CMOS inverter R13-MAY-16
UNIT: 2
1. What is meant by synthesis? R13-APR-18
Answer:
Synthesis is the process of transforming your HDL design into a gate-level netlist, given all the specified
constraints and optimization settings. Logic synthesisis the process of translating and mapping RTL code
written in HDL (such as Verilog or VHDL ) into technology specific gate level representation.
2. Differentiate Functional simulation and timing simulation. R13-APR-18
Functional simulation is an iterative process, which may require multiplesimulations to achieve the
desired end functionality of the design. ... This allows for automated testing and reduces the change of
a functional regression in the design due to seemingly unrelated changes.

171
Timing simulation is the closest emulation to actually downloading a design to a
device. It allows you to check that the implemented design meets all functional
and timing requirements and behaves as you expect in the device.
3. Draw the VLSI
LSI Design Flow. R13
R13-MAY-17
4. Draw the stick diagram for two inputs NOR gates. R13
R13-MAY-17
2019
172
5. Explain about the contact cuts and approaches. R13
R13-NOV-16
6. Represent the stick diagram of a NMOS inverter. R13-NOV-16

R13
7. Define scaling and explain it. R13-MAY-16

VLSI technology is constantly evolving towards smaller line widths
Reduced feature size generally leads to
better / faster performance
More gate / chip
More accurate description of modern technology is ULSI (ultra large scale integration
2019
173
It is important that you understand how the following parameters are effected by scaling
Gate Area
Gate Capacitance per unit area
Gate Capacitance
Charge in Channel
Channel Resistance
Transistor Delay
Maximum Operating Frequency
Transistor Current
Switching Energy
Power Dissipation Per Gate (Static and Dynamic)
Power Dissipation Per Unit Area
Power - Speed Product
8. Explain difference between stick diagram and layout diagram. R13-MAY-16

VLSI design aims to translate circuit concepts onto silicon. • Stick diagrams are a means
of capturing topography and layer information using simple diagrams. • Stick diagrams
convey layer information through color codes (or monochrome encoding).
Integrated circuit layout, also known IC layout, IC mask layout, or mask design, is the
representation of an integrated circuit in terms of planar geometric shapes which
correspond to the patterns of metal, oxide, or semiconductor layers that make up the
components of the integrated circuit.
UNIT: 3
1. What is the importance of fan-in fan-out? R13-APR-18

Answer:
Fan In and Fan Out are characteristics of Digital ICs. Digital ICs are complete functioning logic
networks. Typically, a Digital IC requires only a power supply, I/P (input) and O/P (output). Here
are the definitions of Fan In and Fan Out.

174
2. Differentiate rise time and fall time? R13-APR-18
These times will set things like minimum on / off time, add some duty cycle
distortion / limits. Rise / fall times as a fraction of period are a good indicator
of switching losses. But datasheet attributes are also very dependent on the
conditions, and your power stage may or may not bear much resemblance.
Particularly, "small signal" vs "switching" transistors and applications will
differ particularly in things like saturation & recovery (turnoff) behavior,
and this region is very dependent on bias and temperature (for BJTs),
3. What is switch logic? R13-MAY-17
1) Switch logic is mainly based on pass transistor or transmission gate.
2) It is fast for small arrays and takes no static current from the supply, VDD. Hence
power dissipation of such arrays is small since current only flows on switching.
3) Switch (pass transistor) logic is analogous to logic arrays based on relay contacts,
where in path through each switch is isolated from the logic levels activating the switch.
4. What are the issues involved in driving large capacitive loads in VLSI circuits. R13-
MAY-17
when signals are propagated from the chip to off chip destinations we can face problems
to drive large capacitive loads. Generally off chip capacitances may be several orders
higher than on chip □cg values.
CL ≥ 104 □cg
Where CL denotes offchip load. The capacitances which of this order must be driven
through low resistances, otherwise excessively long delays will occur. Large capacitance
is presented at the input, which in turn slows down the rate of change of voltage at input.
5. Write about clocked CMOS logic and its usage. R13-NOV-16

The clocked CMOS logic is also referred as C2 MOS logic. Figure shows the general
arrangement of a clocked CMOS (C2 MOS) logic. A pull-up p-block and a
complementary n-block pull-down structure represent p and n-transistors respectively
and are used as implement clocked CMOS logic shown in figure. However, the logic in
this case is connected to the output only during the ON period of the clock. Figure
shows a clocked inverter circuit which is also belongs to clocked CMOS logic family.

175
The slower rise times and fall times can be expected due to owing of extra transistors in
series with the output.
Working
• When ø = 1 the circuit acts an inverter , because transistors Q3 and Q4 are ‘ON’ . It is said to
be in the “evaluation mode”. Therefore the output Z changes its previous value.
• When ø = 0 the circuit is in hold mode, because transistors Q3 and Q4 becomes ‘OFF’ . It is
said to be in the “precharge mode”. Therefore the output Z remains its previous value.
6. Explain about the wiring capacitance and its need. R13-NOV-16

The significant sources of capacitance which contribute to the overall wiring capacitance
are as follows
(i)Fringing fields Capacitance due to fringing field effects can be a major component of
the overall capacitance of interconnect wires. For fine line metallization, the value of
fringing field capacitance (Cff) can be of the same order as that of the area capacitance.
Thus , Cff should be taken into account if accurate prediction of performance is needed.
(ii)Interlayer capacitances From the definition of capacitance itself, it can be said that
there exists a capacitance between the layers due to parallel plate effects. This
capacitance will depend upon the layout i.e., where the layers cross or whether one layer
underlies another etc., by the knowledge of these capacitances, the accuracy of circuit
modeling and delay calculations will be improved. It can be readily calculated for
regular structures.

176
(iii) peripheral capacitance
1. The source and drain p-diffusion regions forms junctions with the n-substrate (or n-
well) at well defined and uniform depths.
2. Similarly, the source and drain n-diffusion regions forms junctions with p-substrate
(or p-well) at well defined and uniform depths.
3. Hence, for diffusion regions, each diode thus formed has associated a peripheral (side
wall) capacitance with it.
4. As a whole the peripheral capacitance,Cp will be the order of pF/unit length. So its
value will be greater than Carea of the diffusion region to substrate.
7. Define delay and explain different time delays in gate level modeling. R13-MAY-16
Calculation for time delay
Let us assume y = CL/□cg = f N
Determine the value of f which will minimize the overall delay for a given value of y.
Apply logarithms on both sides in the above equation
ln(y) = ln(f N)
ln (y) = N ln (f)
N= ln(y)/ln(f)
For N even
Total delay = N/2 5fτ
= 2.5 Nfτ (nMOS)
(Or) toal delay = N/2 7fτ
= 3.5Nfτ (CMOS)
From above relations, we can write
Delay α Nfτ
= ln(y)/ln(f) . fτ
It can be shown that total delay is minimized if f assumes the value of e for both CMOS
and nMOS inverters.
Assume f = e -> N = ln(y)/ln(e)
N = ln(y)
Overall delay td Æ N even td = 2.5 eNτ (nMOS)
(or) td = 3.5 eNτ(CMOS)
ÎN odd td = [2.5(N-1) +1] eτ (nMOS)
td = [3.5(N-1) +2] eτ (CMOS) ( for logical transition 0 to 1)
( or) td = [ 2.5(N-1) + 4] eτ (nMOS)
td = [3.5(N-1) +5] eτ (CMOS) (for logical transition 1 to 0)
8. Explain the importance of wiring capacitance of a MOS transistor. R13-MAY-16

Cp increases with reduction in source or drain area. Total diffusion capacitance is Cdiff
= Carea + Cp However, as the n and p-active regions are formed by impure implants at
the surface of the silicon incase of orbit processes, they have negligible depth. Hence Cp
is quite negligible in them. Typical values are given in tabular form

177
Diffusion Typical values
capacitance
5µm 2µm 1.2µm
Area C (C area) 1.0 × 10
10- 2 1.75 × 10-4pF/µm 2 3.75 × 1010-
4pF/µm 4pF/µm
Periphery 8.0 × 10
10- (assuming implanted regions of Negligible
(Cperiph) 4pF/µm negligible depth)
UNIT: 4
1. Draw the 1-bit

bit SRAM cell. R13-APR-18
R13
Answer:
2. What are the various serial access memories? R13-APR-18

Answer:
In computing, sequential access memory (SAM) is a class of data storage devices that
read stored data in a sequence. This is in contrast to random access memory (RAM)
where data can be accessed in any order. Sequential access devices are usually a form of
magnetic storage or optical storage.
storage
While sequential access memory is read in sequence, arbitrary locations can still be
accessed by "seeking" to the requested location. This operation, however, is often
relatively inefficient (see seek time
time, rotational latency).
Magnetic sequential access memory is typically used for secondary storage in general-
purpose computers due to their higher density at lower cost compared to RAM, as well as
resistance to wear and non-volatility
volatility. Magnetic tape is a type of sequential access memory
still in use; historically, drum memory has also been used.
3. Design a 2-bit
bit Parity generator. R13-MAY-17
R13
2019
178
4. What is Booth’s algorithm? R13-MAY-17
Booth's algorithm examines adjacent pairs of bits of the N-bit multiplier Y in

signed two's complement representation, including an implicit bit below the least
significant bit, y−1 = 0. For each bit yi, for i running from 0 to N − 1, the bits yi and yi−1 are
considered. Where these two bits are equal, the product accumulator P is left unchanged.
Where yi = 0 and yi−1 = 1, the multiplicand times 2i is added to P; and where yi = 1
and yi−1 = 0, the multiplicand times 2i is subtracted from P. The final value of P is the
signed product.
The representations of the multiplicand and product are not specified; typically, these
are both also in two's complement representation, like the multiplier, but any number
system that supports addition and subtraction will work as well. As stated here, the order
of the steps is not determined. Typically, it proceeds from LSB to MSB, starting at i = 0;
the multiplication by 2i is then typically replaced by incremental shifting of
the P accumulator to the right between steps; low bits can be shifted out, and subsequent
additions and subtractions can then be done just on the highest N bits of P.
The algorithm is often described as converting strings of 1s in the multiplier to a high-

order +1 and a low-order −1 at the ends of the string. When a string runs through the
MSB, there is no high-order +1, and the net effect is interpretation as a negative of the
appropriate value.
5. Mention about SRAM and its usage. R13-NOV-16
Cell size accounts for most of array size – Reduce cell size at expense of complexity
6T SRAM Cell
– Used in most commercial chips
– Data stored in cross-coupled inverters

179
Read: – Precharge bit, bit_b
– Raise wordline
Precharge both bitlines high Then turn on wordline. One of the two bitlines will be
pulled down by the cell.
Ex: A = 0, A_b = 1
– bit discharges, bit_b stays high
– But A bumps up slightly
Read stability
– A must not flip
– N1 >> N2
Write: –Drive
Drive data onto bit, bit_b
– Raise wordline
Drive one bitline high, the other low. Then turn on wordline. Bitlines overpower cell
with new value.
Ex: A = 0, A_b = 1, bit = 1, bit_b = 0
– Force A_b low, then A rises high
Writability
– Must overpower feedback inverter
– N2 >> P1
6. Describe about the Serial Access Memories. R13-NOV-16

R13
Serial access memories do not use an address
– Serial In Parallel Out (SIPO)
1-bit
bit shift register reads in serial data – After N steps, presents N-bit
bit parallel output
– Parallel In Serial Out (PISO)

Load all N bits in parallel when shift = 0 – Then shift one bit out per cycle
2019
180
– Queues (FIFO, LIFO)
 Queues allow data to be read and written at different rates.
 Read and write each use their own clock, data
 Queue indicates whether it is full or empty
 Build with SRAM and read/write counters (pointers)
First In First Out (FIFO)

– Initialize read and write pointers to first element
– Queue is EMPTY
– On write, increment write pointer
– If write almost catches read, Queue is FULL
– On read, increment read pointer
Last In First Out (LIFO)
– Also called a stack
– Use a single
gle stack pointer for read and write
– On write, pointer is incremented, on read, pointer is decremented.
– Reach last element = Full, reach 1st element = EMPTY
7. Explain the difference between EPROM and EEPROM. R13

R13-MAY-16
BASIS FOR
EPROM EEPROM
COMPARISON
Basic Ultraviolet Light is used to

erase the content of EEPROM contents are erased
2019
181
BASIS FOR
EPROM EEPROM
COMPARISON
EPROM. using electronic signal.
Appearance EPROM has a transparent EEPROM are totally encased in

quartz crystal window at an opaque plastic case.
the top.
Erased and EPROM chip has to be EEPROM chip can be erased and
Reprogrammed removed from the computer reprogrammed in the computer
circuit to erase and circuit to erase and reprogram the
reprogram the computer content of computer BIOS.
BIOS.
Technology EPROM is an older EEPROM is a modern version

technology. over EPROM.
8. Draw 2-bit comparator. R13-MAY-16

182
UNIT: 5.
1. Implement 2:1 MUX using PAL. R13-APR-18

Answer:

183
2. What is the difference between verification and validation? R13-APR-18
Answer:
The distinction between the two terms is largely to do with the role of
specifications. Validation is the process of checking whether the
specification captures the customer's needs, while verification is the
process of checking that the software meets the specification.
3. Write the comparison between FPGA and CPLD. R13-MAY-17
4. What type of faults can be reduced by improving layout design. R13-MAY-17
5. Explain about the principle of Built in Self Test. R13-NOV-16

A built-in self-test (BIST) or built-in test (BIT) is a mechanism that permits a
machine to test itself. Engineers design BISTs to meet requirements such as:
 high reliability
 lower repair cycle times
 or constraints such as:

184
 limited technician accessibility
 cost of testing during manufacture
The main purpose of BIST is to reduce the complexity, and thereby decrease
the cost and reduce reliance upon external (pattern-programmed) test
equipment. BIST reduces cost in two ways:
1. reduces test-cycle duration

2. reduces the complexity of the test/probe setup, by reducing the number of I/O signals
that must be driven/examined under tester control.
Both lead to a reduction in hourly charges for automated test equipment
(ATE) service.
6. Explain about the test principles used for testing. R13-NOV-16
Design for testing or design for testability (DFT) consists of IC design techniques
that add testability features to a hardware product design. The added features
make it easier to develop and apply manufacturing tests to the designed hardware.
The purpose of manufacturing tests is to validate that the product hardware
contains no manufacturing defects that could adversely affect the product's correct
functioning.
Tests are applied at several steps in the hardware manufacturing flow and, for
certain products, may also be used for hardware maintenance in the customer's
environment. The tests are generally driven by test programs that execute
using automatic test equipment (ATE) or, in the case of system maintenance,
inside the assembled system itself. In addition to finding and indicating the
presence of defects (i.e., the test fails), tests may be able to log diagnostic
information about the nature of the encountered test fails. The diagnostic
information can be used to locate the source of the failure.
In other words, the response of vectors (patterns) from a good circuit is compared
with the response of vectors (using the same patterns) from a DUT (device under
test). If the response is the same or matches, the circuit is good. Otherwise, the
circuit is not manufactured as it was intended.
DFT plays an important role in the development of test programs and as an

interface for test application and diagnostics. Automatic test pattern generation, or
ATPG, is much easier if appropriate DFT rules and suggestions have been
implemented.

185
7. Explain difference between PLA and PAL. R13-MAY-16
8. Define controllability and observability with respect to testing. R13-MAY-16
Observability:
ease of observing a node by watching external output pins of the chip
Controllability:
ease of forcing a node to 0 or 1 by driving input pins of the chip
Combinational logic is usually easy to observe and control
Finite state machines can be very difficult, requiring many cycles to enter desired state
(Especially if state transition diagram is not known to the test engineer).
iii. Controlability
iv Stuck-at-fault model R09-JUNE-14
1. Differentiate between PROM, PAL and PAL. R09-DEC-12

186
Multiple choices –SET1
1. The PLA provides a systematic and regular way of implementing multiple output
functions of n variables in [B ]
a. POS form b. SOP form
c. complex form d. Simple form
2. A single time programmable FPGA is the type of [A ]
a. Fuse-based FPGA b. SRAM-FPGA
c. EPROM-FPGA d. Flash based FPGA
3. In the standard cell, all the cells should have [B ]
a. identical heights and widths
b. identical heights and the widths of the cells may vary
c. identical widths and the variable heights
d. variable heights and widths
4. Semi custom design using standard cells enable the designs to use [A ]
a. a functional modules (available in library)
b. a layout automatically generated
c. an interconnections between cells d. Only basic logic functions
5. Programmable array logic provides a convenient way of realizing [C ]
a. combinational networks only b. Sequential networks only
c. both combinational and sequential network
d. not used for realization
6. 2  4 MUX is repeated 500 times in a chip containing 8000 transistors. What is the
regularity?
a) 16 b) 32 c) 64 d) 96 [ D ]
7. What is the resistance of Anti fuse before programming? [B ]
a) 100 M ohm b) 10 Mega ohms c) 1 Meg ohm d) 100 ohm
8. What is the basis for Standard cell or cell based designs available in cell library?[ B ]
a) Standardization at functional level b) Standardization at structural level
c) Standardization at physical level d) Reprogrammable structures
9. Which of the following is ‘Divide and conquer strategy’ in CMOS design? [C ]
a) Hierarchy b) Regularity c) Modularity d) Locality
10. Which of the following is ‘Wires first and modules next’ strategy? [D ]
a) Hierarchy b) Regularity c) Modularity d) Locality
Fill in the blanks
11. Programmable array logic is made up of_____________AND,OR ARRAY___________
12. Logic gates are placed in rows of standard cells are interconnected using___ROUTING
CHANNEL___________
13. Semi custom design using standard cells enable the designers to use ______STANDARD
LIBRARY____________
14. Full custom designs are_____RARELY_____________used at this time.
15. Processing time is least in Sea of Gate due to the______ABSENCE OF ROUTING
CHANNEL_________________
16.Standard cell design provides an area advantage over gate array design at the cost
of______INCREASED DESIGN COMPLEXITY__________________.
17. PAL22V10, here V denotes the____NUMBER OF INPUTS___________
18. PAL has ___FIXED_______ OR array logic and ____PROGRAMMABLE______ AND

array logic
19. _____PAL____________is based on chips with programmable logic structures,
interconnect logic or reprogrammable gate array logic.

187
20. ____UV ERASABLE MEMORIES_____________use floating gate structure interposed
between the regular MOS transistor gate and the channel.
21.Predesigned logic cells are known as _____STANDARD CELLS____
22. Standard cell areas in CBIC are _________FLEXIBLE BLOCKS_________
23. Standard cells can be placed _______ANYWHERE____ on the silicon chip
24. The advantage of changing transistor size in standard cell is _____OPTIMISED SPEED
AND PERFORMANCE_____
25. ____INTERCONNECTIONS__ are programmable in fpgas
SET-2
1. Manufacturing tests are used to verify that [B ]
a. function of a chip as a whole b. every gate operates as expected
c. function in the field d. the clock response of the chip
2. VHDL and Verilog hardware description languages are used for [C ]
a. manufacturing tests b. Functionality test
c. Design testing d. Chip testing
3. Functionality tests seek to verify the [A ]
a. function of a chip as a whole b. Every gate operates as expected
c. function in the field d. The clock response of the chip
4. The two key concepts underlying all considerations for testability are [B ]
a. set and reset b. Controllability and observability
c. initial and final conditions d. Pads and links
5. The faults occur due to thin-oxide shorts or metal-to metal shorts are called [B ]
a. stuck at zero faults b. Short-circuit faults
c. open-circuit faults d. Bridge faults
6. What is the number of input sequences required to test combinational circuit with ‘n’ inputs?
[C ]
n
a) n b) n – 1 c) 2 d) 2 n – 1
7. Which of the following are most often tested by BIST? [A ]
a) Data path b) I/Os c) Control circuits d) Memory
8. What is the testing technique more suited for Data path? [B ]
a) BIST b) Boundary scan c) Parallel scan d) IDDQ
9. Which of the following test procedure uses PRSG (pseudo random signal generator)? [ C
]
a) Boundary scan b) Parallel scan c) BILBO d) IDDQ
10. The principle used in IDDQ testing [C ]
a) N MOS gates draw current in quiescent state
b) P MOS gates draw current in quiescent state
c) C MOS gates do not draw current in quiescent state
d) It is a controllability test
Fill in the blanks
11. Random logic is probably best tested via_____SERIAL SCAN_________________ __
12. Generally memories are tested by __________SELF TEST_____ ____________
13. In the structured testing technique, LSSD means _____LEVEL SENSITIVE SCAN
DESIGN___________________
14.____BRIDGING_____________fault occurs when two unconnected signal lines ate shorted
together.
15. If the normal value has changed from 1 to 0, the fault is known as ____STUCK AT
0________
16. BIST stands for ___BUILT IN SELF TEST_______
17. LFSR used to generate__PSEUDORANDOM_____________ sequence

188
18. The type of a fault should not disturb the functionality of the circuit is__DESIGN
RULES________.
19. Outputs of the flip flops in the state register are shifted out bit by bit using a single
serial output pin of IC in____BOUNDARY SCAN TESTING_______________.
20. TRST signal in boundary scan resets the_____TAP CONTROLLER___________.

21. ______BOUNDARY SCAN TESTING______ is used to test interconnects
22. ___REDUCED ACCESS TIMES,ADDITIONAL SILICON AREA________ are the
disadvantages of BIST

189
(EC0743) VLSI & E-CAD LAB
List of Experiments
Design and implementation of the following CMOS digital/analog circuits using Cadence /
Mentor Graphics / Synopsys /Equivalent CAD tools. The design shall include Gate-level
design, Transistor-level design, Hierarchical design, Verilog HDL/VHDL design, Logic
synthesis, Simulation and verification, Scaling of CMOS Inverter for different technologies,
study of secondary effects ( temperature, power supply and process corners), Circuit
optimization with respect to area, performance and/or power, Layout, Extraction of parasitics
and back annotation, modifications in circuit parameters and layout consumption, DC/transient
analysis, Verification of layouts (DRC, LVS)
E-CAD programs:
Programming can be done using any complier. Down load the programs on FPGA/CPLD
boards and performance testing may be done using pattern generator (32 channels) and logic
analyzer apart from verification by simulation with any of the front end tools.
1. HDL code to realize all the logic gates
2. Design of 2-to-4 decoder
3. Design of 8-to-3 encoder (without and with priority)
4. Design of 8-to-1 multiplexer and 1-to-8 demultiplexer
5. Design of 4 bit binary to gray code converter
6. Design of 4 bit comparator
7. Design of Full adder using 3 modeling styles
8. Design of flip flops: SR, D, JK, T
9. Design of 4-bit binary, BCD counters ( synchronous/ asynchronous reset) or any sequence
counter
10. Finite State Machine Design
VLSI programs:
 Introduction to layout design rules. Layout, physical verification, placement & route for
complex design, static timing analysis, IR drop analysis and crosstalk analysis of the
following:
1. Basic logic gates
2. CMOS inverter
3. CMOS NOR/ NAND gates
4. CMOS XOR and MUX gates
5. Static / Dynamic logic circuit (register cell)
6. Latch
7. Pass transistor
8. Layout of any combinational circuit (complex CMOS logic gate).
9. Analog Circuit simulation (AC analysis) – CS & CD amplifier
Note: Any SIX of the above experiments from each part are to be conducted (Total 12)

190
(EC0744) MICROWAVE ENGINEERING LAB
1. Reflex Klystron Characteristics

2. Gunn Diode Characteristics
3. Directional Coupler Characteristics
4. VSWR Measurement
5. Measurement of Waveguide Parameters
6. Measurement of Impedance of a given Load
7. Measurement of Scattering Parameters of a Magic Tee
8. Measurement of Scattering Parameters of a Circulator
9. Attenuation Measurement
10. Microwave Frequency Measurement
11. Antenna Pattern Measurements.
12. Study of HFSS.
13. Simulation of Radiation Patterns for some Standard Antennas
a) Dipole
b) Rectangular Patch
c) Circular Patch

191
V. R&D / PROJECTS / CONSULTANCY
GNITC has developed a Research Centre at campus to carry out research projects and
technology transfer in the following fields:
1. Robotics and Industrial Controls.
2. Solar Application Development.
3. Machine Vision Lab.
4.Incubation Centre with VLSI and Signal Processing.
5. Solar Application Research.
6. Center for Non-Destructive Evaluation.
1. ROBOTICS AND INDUSTRIAL CONTROL:
The Lab has been established with help of robolab to carry out training and research.
More than 35 faculty and students are already trained and they are actively involved in research.
More than 300 students are members of Robotic Club.
2. SOLAR APPLICATION DEVOLOPMENT:

The lab has been developed to carry out research in the field of Solar Application Research.
3. MACHINE VISION:
Research centre to train faculty in machine vision has been developed. All disciplines
like simulation design and implementation have been brought on one platform. This Lab uses
image based automatic analysis of application such as automatic, process control or robotic
guidance.
4. Incubation Centre:
30 complies have been developed to provide facilities to design a research project by faculty
and students and test their programs. The lab is being used to realize the ideas by the students
and develop similar software.
5. SOLAR APPLICATION RESEARCH:\

The developed centre concentrates on development of PV cell, module development, material
research for development of DSSE and silicon solar cell.
The centre has collaboration with IICT Hyderabad, MS University, Baroda and IIT Bombay.
6. CENTER FOR NON DESTRUCTIVE EVALUATION: It is established for study of

quality assurance of Aero-Space and Nuclear reengineering materials. Basic NDT methods,
such as magnetic partial inspection, liquid penetrate test, visible inspection and ultra sonic flaw
detector are installed to study various defects of metal materials. This centre is sponsored by
Department of Atomic Energy and AICTE under RPS. Non-destructive evaluation is extremely
diverse and multi-disciplinary, involving the fields of Applied Physics, Materials Science and
Engineering, Mechanical Engineering, Structural Engineering, Computer Science, Electrical
Engineering, Electronics, Technologies of Signal Processing and Artificial Intelligence. Centre
for Non-destructive Evaluation has been established in Guru Nanak Institutions Technical
Campus in 2012.

192

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GURU NANAK INSTITUTIONS TECHNICAL CAMPUS

STUDENT HAND BOOK

IV Year B.Tech. (I-Semester)

DEPARTMENT OF ELECTRONICS & COMMUNICATION ENGINEERING

Sl. No. Particulars Page

GNITC(Autonomous)-IV Year –I Sem- -Hand Book | 2019-20

GNITC(Autonomous)-IV Year –I Sem- -Hand Book | 2019-20

Sardar Tavinder Singh Kohli-Chairman (Right) & Dr. H. S. Saini-Managing Director

Dr.M.Ramalinga Reddy Director

GNITC(Autonomous)-IV Year –I Sem- -Hand Book | 2019-20

II. QUALITY POLICY

GNITC(Autonomous)-IV Year –I Sem- -Hand Book | 2019-20

GURU NANAK INSTITUTIONS

Global Academic Partners:

GNI is now MICROSOFT certified Gold Partner.

C. Growth of the Institution:

GNITC(Autonomous)-IV Year –I Sem- -Hand Book | 2019-20

GNITC(Autonomous)-IV Year –I Sem- -Hand Book | 2019-20

Awards and Achievements

1. The only private Institution in the State, to be accredited with NAAC A + by

GNITC(Autonomous)-IV Year –I Sem- -Hand Book | 2019-20

GNITC(Autonomous)-IV Year –I Sem- -Hand Book | 2019-20

11. Medical Facilities

12. Seminar Halls

15. Faculty Quarters

(A) Earn While Learn Scheme:

GNITC(Autonomous)-IV Year –I Sem- -Hand Book | 2019-20

Rules and Regulations:

(B) Innovation Centre

GNITC(Autonomous)-IV Year –I Sem- -Hand Book | 2019-20

13 centers of excellence are established in the campus to promote the research,

1.Adobe Creative Technology Academy

GNI PARTNERS WITH ADOBE TO OFFER ADD-ON

GNITC(Autonomous)-IV Year –I Sem- -Hand Book | 2019-20

GNITC(Autonomous)-IV Year –I Sem- -Hand Book | 2019-20

3.Robotics & Industrial Applications

 Intelligent fire fighting robot

GNITC(Autonomous)-IV Year –I Sem- -Hand Book | 2019-20

GNITC(Autonomous)-IV Year –I Sem- -Hand Book | 2019-20

 Daily expense app

Numerous Java based projects handle different domains such as

7.VLSI & Embedded Systems

Our training includes introduction to:

GNITC(Autonomous)-IV Year –I Sem- -Hand Book | 2019-20

 Smart energy saving system for roads

Non Destructive Testing- Training

GNITC(Autonomous)-IV Year –I Sem- -Hand Book | 2019-20

Student Centric Training Methodology

10.3D Printing & Geomatics

Typical Applications of 3D Printers @ GNI

GNITC(Autonomous)-IV Year –I Sem- -Hand Book | 2019-20

GNITC(Autonomous)-IV Year –I Sem- -Hand Book | 2019-20

Students are trained on a simulation machine on the following aspects:

Students are able to work on research projects like:

Decode IT-Park inaugurated by Honorable K. T. Rama Rao