5 6129845971313492097 PDF
5 6129845971313492097 PDF
5 6129845971313492097 PDF
Drawing No. :
UIPJBTBI.PCT-BDR- E - IIA- 011
1/5
Dani Pamungkas Dani Pamungkas Wansisko Wansisko
ACTION
RE-SUMIT
A
B FINAL
-U KV 150 150
- Um KV 170 170
- U0 KV 87 87
4 Frequency Hz 50 50
5 Number of cores 1 1
6 Conductor
- Material Copper wires with swelling tapes Copper wires with swelling tapes
7 Conductor screen
MANUFACTURER'S SIGNATURE :
TECHNICAL PARTICULAR AND GUARANTEE
8 Insulation
- Maximum electrical stress at conductor screen kV/mm To be mentioned (calculation shall be submitted) 6.21
- Material Super clean cross-linked polyethylene (XLPE) Super clean cross-linked polyethylene (XLPE)
- Nominal thickness mm ≥1 ≥1
- Material Semiconducting tape with swelling property Semiconducting tape with swelling property
BIDDER'S SIGNATURE :
MANUFACTURER'S SIGNATURE :
TECHNICAL PARTICULAR AND GUARANTEE
a) Material Copper wire screen with copper tape binding Copper wire screen with copper tape binding
- Nominal thickness mm To be mentioned (calculation shall be submitted) Thickness Copper tape : 0.1
12 Outer Sheath
13 Complete cable
18. Maximum A.C. resistance cable per core at 20°C ohm/km To be mentioned 0.0201
Insulation resistance per meter of cable per core
19.
minimum at 20°C
Mega ohm To be mentioned 9.4 x 106
BIDDER'S SIGNATURE :
MANUFACTURER'S SIGNATURE :
TECHNICAL PARTICULAR AND GUARANTEE
- Total losses per cable W/m To be mentioned (calculation shall be submitted) 18.559 17.719
a. Java-Bali System kA 40 40
b. Outside Java-Bali System kA 31.5 31.5
28 Voltage drop at rated capacity mV/A/m To be mentioned 0.274
29 Loss angle, maximum To be mentioned 0.001
30 Test Certificates To be mentioned 829.BTND.704A.2011
31 Catalog, drawing and other reference To be mentioned To be submitted
BIDDER'S SIGNATURE :
MANUFACTURER'S SIGNATURE :