LAN8720A/LAN8720AI: Small Footprint RMII 10/100 Ethernet Transceiver With HP Auto-MDIX Support
LAN8720A/LAN8720AI: Small Footprint RMII 10/100 Ethernet Transceiver With HP Auto-MDIX Support
LAN8720A/LAN8720AI: Small Footprint RMII 10/100 Ethernet Transceiver With HP Auto-MDIX Support
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for cur-
rent devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the
revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are
using.
BYTE 8-bits
FIFO First In First Out buffer; often used for elasticity buffer
10/100 LAN8720A/
RMII MDI
Ethernet Transformer RJ45
LAN8720Ai
MAC
Mode LED
Crystal or
Clock
Oscillator
MODE[0:2]
Mode Control HP Auto-MDIX
Auto- 100M TX 100M TXP/TXN
nRST Negotiation Logic Transmitter
Reset Control
RXP/RXN
RMIISEL Transmitter
SMI Management 10M TX 10M
Logic Transmitter MDIX
TXD[0:1] Control
Control
TXEN
XTAL1/CLKIN
PLL XTAL2
RXD[0:1]
RMII Logic
VDD1A 19 12 MDIO
TXP 21 10 RXER/PHYAD0
VSS
RXN 22 9 VDDIO
RXP 23 8 RXD0/MODE0
RBIAS 24 7 RXD1/MODE1
Note 2-1 When a lower case “n” is used at the beginning of the signal name, it indicates that the signal is
active low. For example, nRST indicates that the reset signal is active low.
Note 2-2 The buffer type for each signal is indicated in the BUFFER TYPE column. A description of the buffer
types is provided in Section 2.2.
Buffer
Num Pins Name Symbol Description
Type
1 Transmit TXD0 VIS The MAC transmits data to the transceiver using
Data 0 this signal.
1 Transmit TXD1 VIS The MAC transmits data to the transceiver using
Data 1 this signal.
1 Receive RXD0 VO8 Bit 0 of the 2 data bits that are sent by the trans-
Data 0 ceiver on the receive path.
PHY Operat- MODE0 VIS Combined with MODE1 and MODE2, this config-
ing Mode 0 (PU) uration strap sets the default PHY mode.
Configuration
Strap See Note 2-3 for more information on configura-
tion straps.
Note: Refer to Section 3.7.2, "MODE[2:0]:
Mode Configuration," on page 30 for
additional details.
1 Receive RXD1 VO8 Bit 1 of the 2 data bits that are sent by the trans-
Data 1 ceiver on the receive path.
PHY Operat- MODE1 VIS Combined with MODE0 and MODE2, this config-
ing Mode 1 (PU) uration strap sets the default PHY mode.
Configuration
Strap See Note 2-3 for more information on configura-
tion straps.
Note: Refer to Section 3.7.2, "MODE[2:0]:
Mode Configuration," on page 30 for
additional details.
1 Receive Error RXER VO8 This signal is asserted to indicate that an error
was detected somewhere in the frame presently
being transferred from the transceiver.
PHY Address PHYAD0 VIS This configuration strap sets the transceiver’s SMI
0 (PD) address.
Configuration
Strap See Note 2-3 for more information on configura-
tion straps.
Note: Refer to Section 3.7.1, "PHYAD[0]: PHY
Address Configuration," on page 26 for
additional information.
Buffer
Num Pins Name Symbol Description
Type
1 Carrier Sense CRS_DV VO8 This signal is asserted to indicate the receive
/ Receive medium is non-idle. When a 10BASE-T packet is
Data Valid received, CRS_DV is asserted, but RXD[1:0] is
held low until the SFD byte (10101011) is
received.
Note: Per the RMII standard, transmitted data is
not looped back onto the receive data
pins in 10BASE-T half-duplex mode.
PHY Operat- MODE2 VIS Combined with MODE0 and MODE1, this config-
ing Mode 2 (PU) uration strap sets the default PHY mode.
Configuration
Strap See Note 2-3 for more information on configura-
tion straps.
Note: Refer to Section 3.7.2, "MODE[2:0]:
Mode Configuration," on page 27 for
additional details.
Note 2-3 Configuration strap values are latched on power-on reset and system reset. Configuration straps are
identified by an underlined symbol name. Signals that function as configuration straps must be
augmented with an external resistor when connected to a load. Refer to Section 3.7, "Configuration
Straps," on page 29 for additional information.
BUFFER
NUM PINS NAME SYMBOL TYPE DESCRIPTION
LED 1 LED1 O12 Link activity LED Indication. This pin is driven
active when a valid link is detected and blinks
when activity is detected.
Note: Refer to Section 3.8.1, "LEDs," on
page 32 for additional LED information.
BUFFER
NUM PINS NAME SYMBOL TYPE DESCRIPTION
LED 2 LED2 O12 Link Speed LED Indication. This pin is driven
active when the operating speed is 100Mbps. It is
inactive when the operating speed is 10Mbps or
during line isolation.
Note: Refer to Section 3.8.1, "LEDs," on
page 32 for additional LED information.
BUFFER
Num PINs NAME SYMBOL DESCRIPTION
TYPE
BUFFER
Num PINs NAME SYMBOL DESCRIPTION
TYPE
BUFFER
Num PINs NAME SYMBOL DESCRIPTION
TYPE
BUFFER
Num PINs NAME SYMBOL DESCRIPTION
TYPE
1 Interrupt Out- nINT VOD8 Active low interrupt output. Place an external
put (PU) resistor pull-up to VDDIO.
Note: Refer to Section 3.6, "Interrupt
Management," on page 24 for additional
details on device interrupts.
Note: Refer to Section 3.8.1.2, "nINTSEL and
LED2 Polarity Selection," on page 32 for
details on how the nINTSEL configuration
strap is used to determine the function of
this pin.
Reference REFCLKO VO8 This optional 50MHz clock output is derived from
Clock Output the 25MHz crystal oscillator. REFCLKO is select-
able via the nINTSEL configuration strap.
Note: Refer Section 3.7.4.2, "REF_CLK Out
Mode," on page 29 for additional details.
Note: Refer to Section 3.8.1.2, "nINTSEL and
LED2 Polarity Selection," on page 32 for
details on how the nINTSEL configuration
strap is used to determine the function of
this pin.
BUFFER
Num PINs NAME SYMBOL DESCRIPTION
TYPE
BUFFER
Num PINs NAME SYMBOL DESCRIPTION
TYPE
1 +3.3V Chan- VDD2A P +3.3V Analog Port Power to Channel 2 and the
nel 2 Analog internal regulator.
Port Power
Refer to the LAN8720A/LAN8720Ai reference
schematic for connection information.
1 VDD2A 13 MDC
2 LED2/nINTSEL 14 nINT/REFCLKO
3 LED1/REGOFF 15 nRST
4 XTAL2 16 TXEN
5 XTAL1/CLKIN 17 TXD0
6 VDDCR 18 TXD1
7 RXD1/MODE1 19 VDD1A
8 RXD0/MODE0 20 TXN
9 VDDIO 21 TXP
10 RXER/PHYAD0 22 RXN
11 CRS_DV/MODE2 23 RXP
12 MDIO 24 RBIAS
IS Schmitt-triggered input
VO8 Variable voltage output with 8mA sink and 8mA source
PU 50uA (typical) internal pull-up. Unless otherwise noted in the pin description, internal pull-
ups are always enabled.
Note: Internal pull-up resistors prevent unconnected inputs from floating. Do not rely on
internal resistors to drive signals external to the device. When connected to a load
that must be pulled high, an external resistor must be added.
PD 50uA (typical) internal pull-down. Unless otherwise noted in the pin description, internal pull-
downs are always enabled.
Note: Internal pull-down resistors prevent unconnected inputs from floating. Do not rely
on internal resistors to drive signals external to the device. When connected to a
load that must be pulled low, an external resistor must be added.
AI Analog input
P Power pin
Note 2-5 The digital signals are not 5V tolerant. Refer to Section 5.1, "Absolute Maximum Ratings*," on
page 54 for additional buffer information.
Note 2-6 Sink and source capabilities are dependent on the VDDIO voltage. Refer to Section 5.1, "Absolute
Maximum Ratings*," on page 54 for additional information.
3.1 Transceiver
3.1.1 100BASE-TX TRANSMIT
The 100BASE-TX transmit data path is shown in Figure 3-1. Each major block is explained in the following subsections.
PLL
NRZI MLT-3 Tx
125 Mbps Serial NRZI MLT-3
Converter Converter Driver
11000 J First nibble of SSD, translated to “0101” Sent for rising TXEN
following IDLE, else RXER
01101 T First nibble of ESD, causes de-assertion Sent for falling TXEN
of CRS if followed by /R/, else assertion
of RXER
00111 R Second nibble of ESD, causes deasser- Sent for falling TXEN
tion of CRS if following /T/, else assertion
of RXER
3.1.1.3 Scrambling
Repeated data patterns (especially the IDLE code-group) can have power spectral densities with large narrow-band
peaks. Scrambling the data helps eliminate these peaks and spread the signal power more uniformly over the entire
channel bandwidth. This uniform spectral density is required by FCC regulations to prevent excessive EMI from being
radiated by the physical wiring.
The seed for the scrambler is generated from the transceiver address, PHYAD, ensuring that in multiple-transceiver
applications, such as repeaters or switches, each transceiver will have its own scrambler sequence.
The scrambler also performs the Parallel In Serial Out conversion (PISO) of the data.
PLL
DSP: Timing
NRZI NRZI MLT-3 MLT-3
recovery, Equalizer
Converter Converter
and BLW Correction
6 bit Data
3.1.2.2 Equalizer, Baseline Wander Correction and Clock and Data Recovery
The 6 bits from the ADC are fed into the DSP block. The equalizer in the DSP section compensates for phase and ampli-
tude distortion caused by the physical channel consisting of magnetics, connectors, and CAT- 5 cable. The equalizer
can restore the signal for any good-quality CAT-5 cable between 1m and 150m.
If the DC content of the signal is such that the low-frequency components fall below the low frequency pole of the iso-
lation transformer, then the droop characteristics of the transformer will become significant and Baseline Wander (BLW)
on the received signal will result. To prevent corruption of the received data, the transceiver corrects for BLW and can
receive the ANSI X3.263-1995 FDDI TP-PMD defined “killer packet” with no bit errors.
The 100M PLL generates multiple phases of the 125MHz clock. A multiplexer, controlled by the timing unit of the DSP,
selects the optimum phase for sampling the data. This is used as the received recovered clock. This clock is used to
extract the serial data from the received signal.
3.1.2.4 Descrambling
The descrambler performs an inverse function to the scrambler in the transmitter and also performs the Serial In Parallel
Out (SIPO) conversion of the data.
During reception of IDLE (/I/) symbols. the descrambler synchronizes its descrambler key to the incoming stream. Once
synchronization is achieved, the descrambler locks on this key and is able to descramble incoming data.
3.1.2.5 Alignment
The de-scrambled signal is then aligned into 5-bit code-groups by recognizing the /J/K/ Start-of-Stream Delimiter (SSD)
pair at the start of a packet. Once the code-word alignment is determined, it is stored and utilized until the next start of
frame.
FIGURE 3-3: RELATIONSHIP BETWEEN RECEIVED DATA AND SPECIFIC MII SIGNALS
CLEAR-TEXT J K 5 5 5 D data data data data T R Idle
RX_CLK
RX_DV
3.2 Auto-negotiation
The purpose of the auto-negotiation function is to automatically configure the transceiver to the optimum link parameters
based on the capabilities of its link partner. Auto-negotiation is a mechanism for exchanging configuration information
between two link-partners and automatically selecting the highest performance mode of operation supported by both
sides. Auto-negotiation is fully defined in clause 28 of the IEEE 802.3 specification.
Once auto-negotiation has completed, information about the resolved link can be passed back to the controller via the
Serial Management Interface (SMI). The results of the negotiation process are reflected in the Speed Indication bits of
the PHY Special Control/Status Register, as well as in the Auto Negotiation Link Partner Ability Register. The auto-nego-
tiation protocol is a purely physical layer activity and proceeds independently of the MAC controller.
The advertised capabilities of the transceiver are stored in the Auto Negotiation Advertisement Register. The default
advertised by the transceiver is determined by user-defined on-chip signal options.
The following blocks are activated during an Auto-negotiation session:
• Auto-negotiation (digital)
• 100M ADC (analog)
• 100M PLL (analog)
• 100M equalizer/BLW/clock recovery (DSP)
• 10M SQUELCH (analog)
• 10M PLL (analog)
• 10M Transmitter (analog)
When enabled, auto-negotiation is started by the occurrence of one of the following events:
• Hardware reset
• Software reset
• Power-down reset
• Link status down
• Setting the Restart Auto-Negotiate bit of the Basic Control Register
On detection of one of these events, the transceiver begins auto-negotiation by transmitting bursts of Fast Link Pulses
(FLP), which are bursts of link pulses from the 10M transmitter. They are shaped as Normal Link Pulses and can pass
uncorrupted down CAT-3 or CAT-5 cable. A Fast Link Pulse Burst consists of up to 33 pulses. The 17 odd-numbered
pulses, which are always present, frame the FLP burst. The 16 even-numbered pulses, which may be present or absent,
contain the data word being transmitted. Presence of a data pulse represents a “1”, while absence represents a “0”.
The data transmitted by an FLP burst is known as a “Link Code Word.” These are defined fully in IEEE 802.3 clause 28.
In summary, the transceiver advertises 802.3 compliance in its selector field (the first 5 bits of the Link Code Word). It
advertises its technology ability according to the bits set in the Auto Negotiation Advertisement Register.
There are 4 possible matches of the technology abilities. In the order of priority these are:
• 100M Full Duplex (Highest Priority)
• 100M Half Duplex
• 10M Full Duplex
• 10M Half Duplex (Lowest Priority)
If the full capabilities of the transceiver are advertised (100M, Full Duplex), and if the link partner is capable of 10M and
100M, then auto-negotiation selects 100M as the highest performance mode. If the link partner is capable of half and
full duplex modes, then auto-negotiation selects full duplex as the highest performance operation.
Read Cycle
MDC ...
MDIO 32 1's 0 1 1 0 A4 A3 A2 A1 A0 R4 R3 R2 R1 R0 D15 D14 ... D1 D0
Start of OP Turn
Preamble PHY Address Register Address Data
Frame Code Around
Write Cycle
MDC ...
MDIO 32 1's 0 1 0 1 A4 A3 A2 A1 A0 R4 R3 R2 R1 R0 D15 D14 ... D1 D0
Start of OP Turn
Preamble PHY Address Register Address Data
Frame Code Around
Data To Phy
30.5 29.5 Remote Fault 1.4 Remote Fault Rising 1.4 Falling 1.4, or
Detected Reading register 1 or
Reading register 29
30.4 29.4 Link Down 1.2 Link Status Falling 1.2 Reading register 1 or
Reading register 29
30.2 29.2 Parallel Detection 6.4 Parallel Detec- Rising 6.4 Falling 6.4 or
Fault tion Fault Reading register 6, or
Reading register 29
or
Re-Auto Negotiate or
Link down
30.1 29.1 Auto-Negotiation 6.1 Page Received Rising 6.1 Falling of 6.1 or
Page Received Reading register 6, or
Reading register 29
Re-Auto Negotiate, or
Link Down.
Note 3-1 If the mask bit is enabled and nINT has been de-asserted while ENERGYON is still high, nINT will
assert for 256 ms, approximately one second after ENERGYON goes low when the Cable is
unplugged. To prevent an unexpected assertion of nINT, the ENERGYON interrupt mask should
always be cleared as part of the ENERGYON interrupt service routine.
Note: The ENERGYON bit in the Mode Control/Status Register is defaulted to a ‘1’ at the start of the signal acqui-
sition process, therefore the INT7 bit in the Interrupt Mask Register will also read as a ‘1’ at power-up. If no
signal is present, then both ENERGYON and INT7 will clear within a few milliseconds.
Bit to
Event to Condition to
Mask Interrupt Source Flag Interrupt Source Clear
Assert nINT De-Assert
nINT
30.7 29.7 ENERGYON 17.1 ENERGYON Rising 17.1 17.1 low 29.7
30.6 29.6 Auto-Negotiation 1.5 Auto-Negotiate Rising 1.5 1.5 low 29.6
complete Complete
30.5 29.5 Remote Fault 1.4 Remote Fault Rising 1.4 1.4 low 29.5
Detected
30.4 29.4 Link Down 1.2 Link Status Falling 1.2 1.2 high 29.4
30.3 29.3 Auto-Negotiation 5.14 Acknowledge Rising 5.14 5.14 low 29.3
LP Acknowledge
30.2 29.2 Parallel Detec- 6.4 Parallel Detec- Rising 6.4 6.4 low 29.2
tion Fault tion Fault
30.1 29.1 Auto-Negotiation 6.1 Page Received Rising 6.1 6.1 low 29.1
Page Received
Note: The ENERGYON bit in the Mode Control/Status Register is defaulted to a ‘1’ at the start of the signal acqui-
sition process, therefore the INT7 bit in the Interrupt Mask Register will also read as a ‘1’ at power-up. If no
signal is present, then both ENERGYON and INT7 will clear within a few milliseconds.
[13,12,10,8] [8,7,6,5]
110 Power Down mode. In this mode the transceiver will N/A N/A
wake-up in Power-Down mode. The transceiver
cannot be used when the MODE[2:0] bits are set to
this mode. To exit this mode, the MODE bits in Reg-
ister 18.7:5(see Section 4.2.9, "Special Modes Reg-
ister," on page 50) must be configured to some
other value and a soft reset must be issued.
The MODE[2:0] hardware configuration pins are multiplexed with other signals as shown in Table 3-5.
MODE[0] RXD0/MODE0
MODE[1] RXD1/MODE1
MODE[2] CRS_DV/MODE2
The RMII REF_CLK is a continuous clock that provides the timing reference for CRS_DV, RXD[1:0], TXEN, TXD[1:0]
and RXER. The device uses REF_CLK as the network clock such that no buffering is required on the transmit data path.
However, on the receive data path, the receiver recovers the clock from the incoming data stream. The device uses
elasticity buffering to accommodate for differences between the recovered clock and the local REF_CLK.
In REF_CLK In Mode, the 50MHz REF_CLK is driven on the XTAL1/CLKIN pin. This is the traditional system configu-
ration when using RMII, and is described in Section 3.7.4.1. When configured for REF_CLK Out Mode, the device gen-
erates the 50MHz RMII REF_CLK and the nINT interrupt is not available. REF_CLK Out Mode allows a low-cost 25MHz
crystal to be used as the reference for REF_CLK. This configuration may result in reduced system cost and is described
in Section 3.7.4.2.
LAN8720A/LAN8720Ai
10/100 PHY
24-QFN
MAC RMII RMII
MDIO
MDC
Accepts external nINT
50MHz clock
Mag RJ45
TXD[1:0] TXP
2 TXN
TXEN
RXD[1:0] RXP
RXN
2
CRS_DV
RXER
REF_CLK
All RMII signals are
XTAL1/CLKIN synchronous to the supplied
LED[2:1] clock
2
XTAL2
nRST
Interface
50MHz
Reference
Clock
REFCLKO
XTAL1/CLKIN
LED[2:1]
25MHz
2
XTAL2
nRST
Interface
In some system architectures, a 25MHz clock source is available. The device can be used to generate the REF_CLK
to the MAC as shown in FIGURE 3-9:. It is important to note that in this specific example, only a 25MHz clock can be
used (clock cannot be 50MHz). Similar to the 25MHz crystal mode, the nINT function is disabled.
REFCLKO
25MHz
XTAL1/CLKIN
LED[2:1] Clock
2
XTAL2
nRST
Interface
10K
~270 ohms ~270 ohms
LED1/REGOFF
Note: Refer to Section 3.7.4, "REGOFF: Internal +1.2V Regulator Configuration," on page 32 for additional infor-
mation on the REGOFF configuration strap.
nINTSEL = 1 nINTSEL = 0
LED output = Active Low LED output = Active High
VDD2A
LED2/nINTSEL
10K
LED2/nINTSEL
Note: Refer to Section 3.7.5, "nINTSEL: nINT/TXER/TXD4 Configuration," on page 32 for additional information
on the nINTSEL configuration strap.
3.8.5 RESETS
The device provides two forms of reset: Hardware and Software. The device registers are reset by both Hardware and
Software resets. Select register bits, indicated as “NASR” in the register definitions, are not cleared by a Software reset.
The registers are not reset by the power-down modes described in Section 3.8.3.
Note: For the first 16us after coming out of reset, the RMII interface will run at 2.5 MHz. After this time, it will switch
to 25 MHz if auto-negotiation is enabled.
TXD TX
10/100 X CAT-5
Ethernet XFMR
RXD RX
MAC X
Digital Analog
SMSC
Ethernet Transceiver
Far-end system
TXD TX
10/100 X CAT-5 Link
Ethernet XFMR
MAC
RXD
X
RX Partner
Digital Analog
SMSC
Ethernet Transceiver
1
TXD TX 2
10/100 3
4
Ethernet XFMR 5
RXD RX
MAC 6
7
Digital Analog 8
LAN8720A/LAN8720Ai
10/100 PHY
24-QFN
RMII RMII
MDIO
MDC
nINT
Mag RJ45
TXP
TXN
TXD[1:0]
2 RXP
TXEN
RXN
RXD[1:0]
2
RXER
XTAL1/CLKIN
LED[2:1]
25MHz
2
XTAL2
nRST
Interface
LAN8720A/LAN8720Ai
24-QFN Power
Supply
3.3V
Ch.2 3.3V
Core Logic
Circuitry
VDDDIO VDD1A
VDDIO Ch.1 3.3V
Supply
Circuitry
1.8 - 3.3V CBYPASS
CF CBYPASS
RBIAS
LED1/
REGOFF VSS 12.1k
~270 Ohm
LAN8720A/LAN8720Ai
24-QFN Power
Supply
3.3V
Ch.2 3.3V
Core Logic
Circuitry
VDDDIO VDD1A
VDDIO Ch.1 3.3V
Supply
Circuitry
1.8 - 3.3V CBYPASS
CF CBYPASS
RBIAS
LED1/
REGOFF VSS 12.1k
~270 Ohm
10k
Ferrite
LAN8720A/LAN8720Ai bead
Power 49.9 Ohm Resistors
24-QFN Supply
3.3V
VDD2A
CBYPASS
VDD1A
CBYPASS Magnetics
RJ45
TXP 1
2
75 3
4
5
6
TXN 7
8
RXP
75
RXN
1000 pF
3 kV
CBYPASS
VDD2A
CBYPASS
VDD1A
CBYPASS Magnetics
RJ45
TXP 1
2
75 3
4
5
6
TXN 7
8
RXP
75
RXN
1000 pF
3 kV
CBYPASS
WO Write only: If a register or bit is write-only, reads will return unspecified data.
WC Write One to Clear: writing a one clears the value. Writing a zero has no effect
RC Read to Clear: Contents is cleared after the read. Writes have no effect.
SC Self-Clearing: Contents are self-cleared after the being set. Writes of zero have no
effect. Contents can be read.
SS Self-Setting: Contents are self-setting after being cleared. Writes of one have no
effect. Contents can be read.
RO/LH Read Only, Latch High: Bits with this attribute will stay high until the bit is read. After it
is read, the bit will either remain high if the high condition remains, or will go low if the
high condition has been removed. If the bit has not been read, the bit will remain high
regardless of a change to the high condition. This mode is used in some Ethernet PHY
registers.
NASR Not Affected by Software Reset. The state of NASR bits do not change on assertion
of a software reset.
RESERVED Reserved Field: Reserved fields must be written with zeros to ensure future compati-
bility. The value of reserved bits is not guaranteed on a read.
Many of these register bit notations can be combined. Some examples of this are shown below:
• R/W: Can be written. Will return current setting on a read.
• R/WAC: Will return current setting on a read. Writing anything clears the bit.
Register Index
Register Name Group
(Decimal)
14 Loopback R/W 0b
0 = normal operation
1 = loopback mode
10 Isolate R/W 0b
0 = normal operation
1 = electrical isolation of PHY from the RMII
7:0 RESERVED RO —
Note 4-1 The default value of this bit is determined by the MODE[2:0] configuration straps. Refer to
Section 3.7.2, MODE[2:0]: Mode Configuration for additional information.
15 100BASE-T4 RO 0b
0 = no T4 ability
1 = T4 able
8 Extended Status RO 0b
0 = no extended status information in register 15
1 = extended status information in register 15
7:6 RESERVED RO —
5 Auto-Negotiate Complete RO 0b
0 = auto-negotiate process not completed
1 = auto-negotiate process completed
3 Auto-Negotiate Ability RO 1b
0 = unable to perform auto-negotiation function
1 = able to perform auto-negotiation function
0 Extended Capabilities RO 1b
0 = does not support extended capabilities registers
1 = supports extended capabilities registers
Note 4-2 The default value of this field will vary dependent on the silicon revision number.
15:14 RESERVED RO —
12 RESERVED RO —
9 RESERVED RO —
7 100BASE-TX R/W 1b
0 = no TX ability
1 = TX able
Note 4-3 The default value of this bit is determined by the MODE[2:0] configuration straps. Refer to
Section 3.7.2, MODE[2:0]: Mode Configuration for additional information.
15 Next Page RO 0b
0 = no next page ability
1 = next page capable
Note: This device does not support next page ability.
14 Acknowledge RO 0b
0 = link code word not yet received
1 = link code word received from partner
13 Remote Fault RO 0b
0 = no remote fault
1 = remote fault detected
12:11 RESERVED RO —
10 Pause Operation RO 0b
0 = No PAUSE supported by partner station
1 = PAUSE supported by partner station
9 100BASE-T4 RO 0b
0 = no T4 ability
1 = T4 able
Note: This device does not support T4 ability.
7 100BASE-TX RO 0b
0 = no TX ability
1 = TX able
5 10BASE-T RO 0b
0 = no 10Mbps ability
1 = 10Mbps able
15:5 RESERVED RO —
15:14 RESERVED RO —
13 EDPWRDOWN R/W 0b
Enable the Energy Detect Power-Down mode:
0 = Energy Detect Power-Down is disabled
1 = Energy Detect Power-Down is enabled
12:10 RESERVED RO —
9 FARLOOPBACK R/W 0b
Enables far loopback mode (for example, all the received packets are sent
back simultaneously (in 100BASE-TX only)). This mode works even if the Iso-
late bit (0.10) is set.
8:7 RESERVED RO —
6 ALTINT R/W 0b
Alternate Interrupt Mode:
0 = Primary interrupt system enabled (Default)
1 = Alternate interrupt system enabled
Refer to Section 3.6, Interrupt Management for additional information.
5:2 RESERVED RO —
1 ENERGYON RO 1b
Indicates whether energy is detected. This bit transitions to “0” if no valid
energy is detected within 256ms. It is reset to “1” by a hardware reset and is
unaffected by a software reset. Refer to Section 3.8.3.2, Energy Detect
Power-Down for additional information.
0 RESERVED R/W 0b
15 RESERVED RO —
14 RESERVED R/W 1b
Write as 1, ignore on read. NASR
13:8 RESERVED RO —
Note 4-4 The default value of this field is determined by the MODE[2:0] configuration straps. Refer to
Section 3.7.2, MODE[2:0]: Mode Configuration for additional information.
Note 4-5 The default value of this field is determined by the PHYAD[0] configuration strap. Refer to
Section 3.7.1, PHYAD[2:0]: PHY Address Configuration for additional information.
15 AMDIXCTRL R/W 0b
HP Auto-MDIX control:
0 = Enable Auto-MDIX
1 = Disable Auto-MDIX (use 27.13 to control channel)
14 RESERVED RO —
13 CH_SELECT R/W 0b
Manual channel select:
0 = MDI (TX transmits, RX receives)
1 = MDIX (TX receives, RX transmits)
12 RESERVED RO —
11 SQEOFF R/W 0b
Disable the SQE test (Heartbeat): NASR
0 = SQE test is enabled
1 = SQE test is disabled
10:5 RESERVED RO —
4 XPOL RO 0b
Polarity state of the 10BASE-T:
0 = Normal polarity
1 = Reversed polarity
3:0 RESERVED RO —
15:8 RESERVED RO —
7 INT7 RO/LH 0b
0 = not source of interrupt
1 = ENERGYON generated
6 INT6 RO/LH 0b
0 = not source of interrupt
1 = Auto-Negotiation complete
5 INT5 RO/LH 0b
0 = not source of interrupt
1 = Remote Fault Detected
4 INT4 RO/LH 0b
0 = not source of interrupt
1 = Link Down (link status negated)
3 INT3 RO/LH 0b
0 = not source of interrupt
1 = Auto-Negotiation LP Acknowledge
2 INT2 RO/LH 0b
0 = not source of interrupt
1 = Parallel Detection Fault
1 INT1 RO/LH 0b
0 = not source of interrupt
1 = Auto-Negotiation Page Received
0 RESERVED RO 0b
15:8 RESERVED RO —
0 RESERVED RO —
15:13 RESERVED RO —
12 Autodone RO 0b
Auto-negotiation done indication:
0 = Auto-negotiation is not done or disabled (or not active)
1 = Auto-negotiation is done
1:0 RESERVED RO —
*Stresses exceeding those listed in this section could cause permanent damage to the device. This is a stress rating
only. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Functional
operation of the device at any condition exceeding those indicated in Section 5.2, "Operating Conditions**", Section 5.1,
"Absolute Maximum Ratings*", or any other applicable section of this specification is not implied. Note, device signals
are NOT 5 volt tolerant unless specified otherwise.
Note: Do not drive input signals without power supplied to the device.
TABLE 5-1: DEVICE ONLY CURRENT CONSUMPTION AND POWER DISSIPATION (REF_CLK IN
MODE)
Note 5-6 The current at VDDCR is either supplied by the internal regulator from current entering at VDD2A,
or from an external 1.2V supply when the internal regulator is disabled.
Note 5-7 Current measurements do not include power applied to the magnetics or the optional external LEDs.
The Ethernet component current is typically 41mA in 100BASE-TX mode and 100mA in 10BASE-T
mode, independent of the 2.5V or 3.3V supply rail of the transformer.
Note 5-8 Calculated with full flexPWR features activated: VDDIO=1.8V & internal regulator disabled.
TABLE 5-2: DEVICE ONLY CURRENT CONSUMPTION AND POWER DISSIPATION (REF_CLK
OUT MODE)
Note 5-9 The current at VDDCR is either supplied by the internal regulator from current entering at VDD2A,
or from an external 1.2V supply when the internal regulator is disabled.
Note 5-10 Current measurements do not include power applied to the magnetics or the optional external LEDs.
The Ethernet component current is typically 41mA in 100BASE-TX mode and 100mA in 10BASE-T
mode, independent of the 2.5V or 3.3V supply rail of the transformer.
Note 5-11 Calculated with full flexPWR features activated: VDDIO=1.8V & internal regulator disabled.
Note 5-12 This specification applies to all inputs and tri-stated bi-directional pins. Internal pull-down and pull-up
resistors add +/- 50uA per-pin (typical).
Note 5-13 XTAL1/CLKIN can optionally be driven from a 25MHz single-ended clock oscillator.
Neg-Going Threshold VILT 0.64 0.83 1.15 1.41 1.76 V Schmitt trigger
Pos-Going Threshold VIHT 0.81 0.99 1.29 1.65 1.90 V Schmitt trigger
Note 5-14 This specification applies to all inputs and tri-stated bi-directional pins. Internal pull-down and pull-up
resistors add +/- 50uA per-pin (typical).
Peak Differential Output Voltage High VPPH 950 — 1050 mVpk Note 5-12
Peak Differential Output Voltage Low VPPL -950 — -1050 mVpk Note 5-12
Signal Rise and Fall Time TRF 3.0 — 5.0 nS Note 5-12
Note 5-15 Measured at line side of transformer, line replaced by 100 (+/- 1%) resistor.
Note 5-16 Offset from 16nS pulse width at 50% of pulse peak.
Transmitter Peak Differential Output Voltage VOUT 2.2 2.5 2.8 V Note 5-15
Note 5-18 Min/max voltages guaranteed as measured with 100 resistive load.
5.5 AC Specifications
This section details the various AC timing specifications of the device.
Note 5-19 The SMI timing adheres to the IEEE 802.3 specification. Refer to the IEEE 802.3 specification for
additional timing information.
Note 5-20 The RMII timing adheres to the RMII Consortium RMII Specification R1.2.
OUTPUT
25 pF
tpon tpoff
VDDIO
Magnetics
Power
VDD1A,
VDD2A
Note: When the internal regulator is disabled, a power-up sequencing relationship exists between VDDCR and
the 3.3V power supply. For additional information refer to Section 3.7.4, REGOFF: Internal +1.2V Regula-
tor Configuration.
tcss tcsh
Configuration Strap
Pins Input
totaa todad
Configuration Strap
Pins Output Drive
tclkp
tclkh tclkl
REFCLKO
toval toval tohold
RXD[1:0],
RXER
tohold toval
CRS_DV
tsu tihold tsu tihold tihold
TXD[1:0]
tihold tsu
TXEN
toval RXD[1:0], RXER, CRS_DV output valid from ris- — 5.0 ns Note 5-24
ing edge of REFCLKO
tohold RXD[1:0], RXER, CRS_DV output hold from ris- 1.4 — ns Note 5-24
ing edge of REFCLKO
tsu TXD[1:0], TXEN setup time to rising edge of 7.0 — ns Note 5-24
REFCLKO
tihold TXD[1:0], TXEN input hold time after rising edge 2.0 — ns Note 5-24
of REFCLKO
Note 5-24 Timing was designed for system load between 10 pf and 25 pf.
tclkp
tclkh tclkl
CLKIN
(REF_CLK)
toval toval tohold
RXD[1:0],
RXER
tohold toval
CRS_DV
tsu tihold tsu tihold tihold
TXD[1:0]
tihold tsu
TXEN
toval RXD[1:0], RXER, CRS_DV output valid from ris- — 14.0 ns Note 5-25
ing edge of CLKIN
tohold RXD[1:0], RXER, CRS_DV output hold from ris- 3.0 — ns Note 5-25
ing edge of CLKIN
tsu TXD[1:0], TXEN setup time to rising edge of 4.0 — ns Note 5-25
CLKIN
tihold TXD[1:0], TXEN input hold time after rising edge 1.5 — ns Note 5-25
of CLKIN
Note 5-25 Timing was designed for system load between 10 pf and 25 pf.
tclkp
tclkh tclkl
MDC
tval tohold
tohold
MDIO
(Data-Out)
tsu tihold
MDIO
(Data-In)
tval MDIO (read from PHY) output valid from rising — 300 ns —
edge of MDC
LAN8720
XTAL2
Y1
XTAL1
C1 C2
LAN8720
XTAL2
RS
Y1
XTAL1
C1 C2
Note 5-31 The maximum allowable values for Frequency Tolerance and Frequency Stability are application
dependent. Since any particular application must meet the IEEE ±50 PPM Total PPM Budget, the
combination of these two values must be approximately ±45 PPM (allowing for aging).
Note 5-32 Frequency Deviation Over Time is also referred to as Aging.
Note 5-33 The total deviation for the Transmitter Clock Frequency is specified by IEEE 802.3u as
±100 PPM.
Note 5-34 The crystal must support 100uW operation to utilize this circuit.
Note 5-35 0oC for extended commercial version, -40oC for industrial version.
Note 5-36 This number includes the pad, the bond wire and the lead frame. PCB capacitance is not included
in this value. The XTAL1/CLKIN pin, XTAL2 pin and PCB capacitance values are required to
accurately calculate the value of the two external load capacitors. The total load capacitance must
be equivalent to what the crystal expects to see in the circuit so that the crystal oscillator will operate
at 25.000 MHz.
LAN8720
10/100 PHY
24-QFN
RMII RMII
MDIO
MDC
nINT
Mag RJ45
TXP
TXN
TXD[1:0]
2 RXP
TXEN
RXN
RXD[1:0]
2
RXER
XTAL1/CLKIN
LED[2:1]
25MHz
2
XTAL2
nRST
Interface
Analog
Supply
3.3V
Power to
magnetics
interface.
LAN8720
6
24-QFN 19
VDDCR VDD1A
1uF CBYPASS
VDDDIO
9 VDDIO
Supply 1
VDD2A
1.8 - 3.3V
CF CBYPASS CBYPASS
R 24
RBIAS
15
nRST
C
VSS 12k
1
VDD2A
CBYPASS
19
VDD1A
CBYPASS Magnetics
RJ45
21
TXP 1
2
75 3
4
5
6
20 7
TXN
8
23
RXP
75
22
RXN
1000 pF
3 kV
CBYPASS
Rev B. (07-15-16) Section 5.1, "Absolute Maxi- Update to Positive voltage on XTAL1/CLKIN, with
mum Ratings*," on page 54 respect to ground.
Table 5-2, “Non-Variable I/O Update to min/max values for the last row, ICLK
Buffer Characteristics,” on Type Buffer (XTAL1 Input) - High Input Level.
page 56
Section 5.2, "Operating Con- Increased VDDCR operational limits from “+1.14V
ditions**," on page 54 to +1.26V” to “+1.08V to +1.32V”
Section 5.6, "Clock Circuit," Added new 100uW crystal specifications and circuit
on page 65 diagram. The section is now split into two subsec-
tions, one for 300uW crystals and the other for
100uW crystals.
Section 6.0, "Package Infor- Added new subsections to include SQFN package
mation," on page 68 information.
Section , "Product Identifica- Updated ordering codes with sawn SQFN package
tion System," on page 77 options.
Rev. 1.4 Section 4.2.2, Basic Status Updated definitions of bits 10:8.
(08-23-12) Register
Rev. 1.3 Table 5-9, “RMII Timing Val- Updated toval maximum value from 10.0ns to 5.0ns.
(04-20-11) ues (REF_CLK Out Mode),”
on page 60
Rev. 1.2 (11-10-10) Section 5.5.5, "RMII Inter- Updated diagrams and tables to include RXER.
face Timing," on page 63
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales
offices are also available to help customers. A listing of sales offices and locations is included in the back of this docu-
ment.
Technical support is available through the web site at: http://microchip.com/support
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be
superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO
REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Micro-
chip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold
harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or
otherwise, under any Microchip intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo,
Kleer, LANCheck, LINK MD, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other
countries.
ClockWorks, The Embedded Control Solutions Company, ETHERSYNCH, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and QUIET-WIRE are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial
Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless
DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their respective companies.
© 2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0780-5
QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
== ISO/TS 16949 == devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.