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TPS61040, TPS61041
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TPS6104x Low-Power DC-DC Boost Converter in SOT-23 and WSON Packages

1 Features 3 Description
•
1 1.8-V to 6-V Input Voltage Range The TPS6104x is a high-frequency boost converter
dedicated for small to medium LCD bias supply and
• Adjustable Output Voltage Range up to 28 V white LED backlight supplies. The device is ideal to
• 400-mA (TPS61040) and 250-mA (TPS61041) generate output voltages up to 28 V from a dual-cell
Internal Switch Current NiMH/NiCd or a single-cell Li-Ion battery. The part
• Up to 1-MHz Switching Frequency can also be used to generate standard 3.3-V or 5-V
to 12-V power conversions.
• 28-μA Typical No-Load Quiescent Current
• 1-μA Typical Shutdown Current The TPS6104x operates with a switching frequency
up to 1 MHz. This frequency allows the use of small
• Internal Soft Start external components using ceramic as well as
• Available in SOT23-5, TSOT23-5, tantalum output capacitors. Together with the thin
and 2-mm × 2-mm × 0.8-mm WSON Packages WSON package, the TPS6104x gives a very small
overall solution size. The TPS61040 device has an
2 Applications internal 400-mA switch current limit, while the
TPS61041 device has a 250-mA switch current limit,
• LCD Bias Supply offering lower output voltage ripple and allows the
• White-LED Supply for LCD Backlights use of a smaller form factor inductor for lower power
• Digital Still Camera applications. The low quiescent current (typically 28
μA) together with an optimized control scheme,
• PDAs, Organizers, and Handheld PCs
allows device operation at very high efficiencies over
• Cellular Phones the entire load current range.
• Internet Audio Players
• Standard 3.3-V or 5-V to 12-V Conversion Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
SOT-23 (5) 2.90 mm × 1.60 mm
TPS61040 SOT (5) 2.90 mm ×1.60 mm
WSON (6) 2.00 mm × 2.00 mm
SOT-23 (5) 2.90 mm ×1.60 mm
TPS61041
WSON (6) 2.00 mm × 2.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.

Typical Application Schematic

Efficiency vs Output Current
L1 90

10 mH D1 88
VO = 18 V
VI = 5 V
VIN VOUT
86
1.8 V to 6 V VIN to 28 V
84
CFF VI = 3.6 V
Efficiency − %

5 V 1 R1 82
IN SW
CO 80
3 1 mF 78
VI = 2.4 V
FB
CIN 76
4.7 mF 4 2
EN GND R2 74

72

70
0.1 1 10 100
IO − Output Current − mA
Copyright © 2016, Texas Instruments Incorporated

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
1 Features .................................................................. 1 8 Application and Implementation ........................ 11
2 Applications ........................................................... 1 8.1 Application Information............................................ 11
3 Description ............................................................. 1 8.2 Typical Application .................................................. 11
4 Revision History..................................................... 2 8.3 System Examples ................................................... 16
5 Pin Configuration and Functions ......................... 3 9 Power Supply Recommendations...................... 19
6 Specifications......................................................... 4 10 Layout................................................................... 19
6.1 Absolute Maximum Ratings ...................................... 4 10.1 Layout Guidelines ................................................. 19
6.2 ESD Ratings.............................................................. 4 10.2 Layout Example .................................................... 19
6.3 Recommended Operating Conditions....................... 4 11 Device and Documentation Support ................. 20
6.4 Thermal Information .................................................. 4 11.1 Third-Party Products Disclaimer ........................... 20
6.5 Electrical Characteristics........................................... 5 11.2 Related Links ........................................................ 20
6.6 Typical Characteristics .............................................. 6 11.3 Community Resources.......................................... 20
7 Detailed Description .............................................. 9 11.4 Trademarks ........................................................... 20
7.1 Overview ................................................................... 9 11.5 Electrostatic Discharge Caution ............................ 20
7.2 Functional Block Diagram ......................................... 9 11.6 Glossary ................................................................ 20
7.3 Feature Description................................................... 9 12 Mechanical, Packaging, and Orderable
7.4 Device Functional Modes........................................ 10 Information ........................................................... 20

4 Revision History
Changes from Revision H (October 2015) to Revision I Page

• Changed CIN from: 4.7 mF To: 4.7 µF and CO From: 1 mF To: 1 µF in the Typical Application Schematic.......................... 1

Changes from Revision G (December 2014) to Revision H Page

• Added 500 µs/div label to X-axis of Figure 15. ................................................................................................................... 15

Changes from Revision F (December 2010) to Revision G Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1

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5 Pin Configuration and Functions

DDC Package, DBV Package

5 Pins
Top View

SW 1 5 VIN

GND 2

FB 3 4 EN

DRV Package
6 Pins
Top View

GND 1 6 SW

VIN 2 5 NC

EN 3 4 FB

Pin Functions
PIN
DDC, I/O DESCRIPTION
NAME DRV NO.
DBV NO.
This is the enable pin of the device. Pulling this pin to ground forces the device into shutdown
EN 4 3 I mode reducing the supply current to less than 1 μA. This pin should not be left floating and needs
to be terminated.
This is the feedback pin of the device. Connect this pin to the external voltage divider to program
FB 3 4 I
the desired output voltage.
GND 2 1 – Ground
NC – 5 – No connection
Connect the inductor and the Schottky diode to this pin. This is the switch pin and is connected to
SW 1 6 I
the drain of the internal power MOSFET.
VIN 5 2 I Supply voltage pin

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6 Specifications
6.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
(2)
Supply voltages on pin VIN –0.3 7 V
(2)
Voltages on pins EN, FB –0.3 VIN + 0.3 V
(2)
Switch voltage on pin SW 30 30 V
Operating junction temperature, TJ –40 150 °C
Storage temperature, Tstg –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.

6.2 ESD Ratings

VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000
V(ESD) Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD22- ±750 V
C101 (2)

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±XXX V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±YYY V may actually have higher performance.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VIN Input voltage range 1.8 6 V
VOUT Output voltage range 28 V
L Inductor (1) 2.2 10 μH
f Switching frequency (1) 1 MHz
(1)
CIN Input capacitor 4.7 μF
(1)
COUT Output capacitor 1 μF
TA Operating ambient temperature –40 85 °C
TJ Operating junction temperature –40 125 °C

(1) See application section for further information.

6.4 Thermal Information

TPS61040 TPS61041
THERMAL METRIC (1) DBV DDC DRV DBV DRV UNIT
5 PINS 5 PINS 6 PINS 5 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 205.2 214.7 83.0 205.2 83.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 118.3 38.5 57.1 118.3 57.1 °C/W
RθJB Junction-to-board thermal resistance 34.8 35.4 52.9 34.8 52.9 °C/W
ψJT Junction-to-top characterization parameter 12.2 0.4 2.4 12.2 2.4 °C/W
ψJB Junction-to-board characterization parameter 33.9 34.8 53.4 33.9 53.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — — 26.9 — 26.9 °C/W

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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6.5 Electrical Characteristics

VIN = 2.4 V, EN = VIN, TA = –40°C to 85°C, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
VIN Input voltage range 1.8 6 V
IQ Operating quiescent current IOUT = 0 mA, not switching, VFB = 1.3 V 28 50 μA
ISD Shutdown current EN = GND 0.1 1 μA
VUVLO Undervoltage lockout threshold 1.5 1.7 V
ENABLE
VIH EN high level input voltage 1.3 V
VIL EN low level input voltage 0.4 V
II EN input leakage current EN = GND or VIN 0.1 1 μA
POWER SWITCH AND CURRENT LIMIT
Vsw Maximum switch voltage 30 V
toff Minimum off time 250 400 550 ns
ton Maximum on time 4 6 7.5 μs
RDS(on) MOSFET on-resistance VIN = 2.4 V; ISW = 200 mA; TPS61040 600 1000 mΩ
RDS(on) MOSFET on-resistance VIN = 2.4 V; ISW = 200 mA; TPS61041 750 1250 mΩ
MOSFET leakage current VSW = 28 V 1 10 μA
ILIM MOSFET current limit TPS61040 350 400 450 mA
ILIM MOSFET current limit TPS61041 215 250 285 mA
OUTPUT
VOUT Adjustable output voltage range VIN 28 V
Vref Internal voltage reference 1.233 V
IFB Feedback input bias current VFB = 1.3 V 1 μA
VFB Feedback trip point voltage 1.8 V ≤ VIN ≤ 6 V 1.208 1.233 1.258 V
(1) 1.8 V ≤ VIN ≤ 6 V; VOUT = 18 V; Iload = 10 mA;
Line regulation 0.05 %/V
CFF = not connected
(1)
Load regulation VIN = 2.4 V; VOUT = 18 V; 0 mA ≤ IOUT ≤ 30 mA 0.15 %/mA

(1) The line and load regulation depend on the external component selection. See the application section for further information.

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6.6 Typical Characteristics

Table 1. Table of Graphs
FIGURE
Figure 1,
vs Load current Figure 2,
η Efficiency Figure 3
vs Input voltage Figure 4
IQ Quiescent current vs Input voltage and temperature Figure 5
VFB Feedback voltage vs Temperature Figure 6
ISW Switch current limit vs Temperature Figure 7
vs Supply voltage, TPS61041 Figure 8
ICL Switch current limit
vs Supply voltage, TPS61040 Figure 9
vs Temperature Figure 10
RDS(on) RDS(on)
vs Supply voltage Figure 11
Line transient response Figure 13
Load transient response Figure 14
Start-up behavior Figure 15

90 90
VO = 18 V L = 10 µH
88 VI = 5 V 88 VO = 18 V

86 86 TPS61040

84 VI = 3.6 V 84
TPS61041
Efficiency − %

Efficiency − %

82 82

80 80
VI = 2.4 V
78 78

76 76

74 74

72 72

70 70
0.1 1 10 100 0.1 1 10 100
IO − Output Current − mA IL − Load Current − mA

Figure 1. Efficiency vs Output Current Figure 2. Efficiency vs Load Current

90 90
VO = 18 V L = 10 µH
88 88 VO = 18 V
IO = 10 mA
86 L = 10 µH 86
IO = 5 mA
84 84
L = 3.3 µH
Efficiency − %

Efficiency − %

82 82

80 80

78 78

76 76

74 74

72 72

70 70
0.1 1 10 100 1 2 3 4 5 6
IL − Load Current − mA VI − Input Voltage − V

Figure 3. Efficiency vs Load Current Figure 4. Efficiency vs Input Voltage

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40 1.24

TA = 85°C
35
1.238

VFB − Feedback Voltage − V

30 TA = 27°C
Quiescent Current − µA

25
1.236
TA = −40°C
20 VCC = 2.4 V

1.234
15

10
1.232
5

0 1.23
1.8 2.4 3 3.6 4.2 4.8 5.4 6 −40 −20 0 20 40 60 80 100 120
VI − Input Voltage − V TA − Temperature − °C

Figure 5. TPS61040 Quiescent Current vs Input Voltage Figure 6. Feedback Voltage vs Free-Air Temperature
430 260

410 TPS61040 258

I(SW) − Switch Current Limit − mA

390 256

I(CL) − Current Limit − mA

370 254
TA = 27°C
350 252

330 250

310 248

290 246

270 244
TPS61041
250 242

230 240
−40 −30 −20 −10 0 10 20 30 40 50 60 70 80 90 1.8 2.4 3 3.6 4.2 4.8 5.4 6
TA − Temperature − °C VCC − Supply Voltage − V

Figure 7. TPS6104x Switch Current Limit vs Free-Air Figure 8. TPS61041 Current Limit vs Supply Voltage
Temperature
420 1200
rDS(on) − Static Drain-Source On-State Resistance − mΩ

415
1000
410 TPS61041
I(CL) − Current Limit − mA

800
405
TA = 27°C
400 600 TPS61040

395
400
390

200
385

380 0
1.8 2.4 3 3.6 4.2 4.8 5.4 6 −40 −30 −20 −10 0 10 20 30 40 50 60 70 80 90
VCC − Supply Voltage − V TA − Temperature − °C

Figure 9. TPS61040 Current Limit vs Supply Voltage Figure 10. TPS6104x Static Drain-Source On-State
Resistance vs Free-Air Temperature

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1000

rDS(on) − Static Drain-Source On-State Resistance − mΩ

900

800
TPS61041
700

600

500 TPS61040

400

300

200

100

0
1.8 2.4 3 3.6 4.2 4.8 5.4 6
VCC − Supply Voltage − V

Figure 11. TPS6104x Static Drain-Source On-State Resistance vs Supply Voltage

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7 Detailed Description

7.1 Overview
The TPS6104x is a high-frequency boost converter dedicated for small to medium LCD bias supply and white
LED backlight supplies. The device is ideal to generate output voltages up to 28 V from a dual-cell NiMH/NiCd or
a single cell device Li-Ion battery.

7.2 Functional Block Diagram

SW

Under Voltage
VIN Lockout
Bias Supply
400 ns Min
Off T ime

Error Comparator
FB - S
Power MOSFET
+
RS Latch Gate N-Channel
Logic Driver
VREF = 1.233 V
R

Current Limit

6 ms Max + RSENSE
EN On Time _

Soft
Start

GND
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7.3 Feature Description

7.3.1 Peak Current Control
The internal switch turns on until the inductor current reaches the typical dc current limit (ILIM) of 400 mA
(TPS61040) or 250 mA (TPS61041). Due to the internal propagation delay of typical 100 ns, the actual current
exceeds the dc current limit threshold by a small amount. The typical peak current limit can be calculated:
V
I I IN 100 ns
peak(typ) = LIM + L ×
V
I = 400 mA + IN × 100 ns for the TPS61040-Q1
peak(typ) L
V
I 250 mA + IN × 100 ns for the TPS61041-Q1
peak(typ) = L (1)
The higher the input voltage and the lower the inductor value, the greater the peak.
By selecting the TPS6104x, it is possible to tailor the design to the specific application current limit requirements.
A lower current limit supports applications requiring lower output power and allows the use of an inductor with a
lower current rating and a smaller form factor. A lower current limit usually has a lower output voltage ripple as
well.

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Feature Description (continued)

7.3.2 Soft Start
All inductive step-up converters exhibit high inrush current during start-up if no special precaution is made. This
can cause voltage drops at the input rail during start up and may result in an unwanted or early system shut
down.
I LIM
The TPS6104x limits this inrush current by increasing the current limit in two steps starting from 4 for 256
I LIM
cycles to 2 for the next 256 cycles, and then full current limit (see Figure 15).

7.3.3 Enable
Pulling the enable (EN) to ground shuts down the device reducing the shutdown current to 1 μA (typical).
Because there is a conductive path from the input to the output through the inductor and Schottky diode, the
output voltage is equal to the input voltage during shutdown. The enable pin needs to be terminated and should
not be left floating. Using a small external transistor disconnects the input from the output during shutdown as
shown in Figure 17.

7.3.4 Undervoltage Lockout

An undervoltage lockout prevents misoperation of the device at input voltages below typical 1.5 V. When the
input voltage is below the undervoltage threshold, the main switch is turned off.

7.3.5 Thermal Shutdown

An internal thermal shutdown is implemented and turns off the internal MOSFETs when the typical junction
temperature of 168°C is exceeded. The thermal shutdown has a hysteresis of typically 25°C. This data is based
on statistical means and is not tested during the regular mass production of the IC.

7.4 Device Functional Modes

7.4.1 Operation
The TPS6104x operates with an input voltage range of 1.8 V to 6 V and can generate output voltages up to 28
V. The device operates in a pulse-frequency-modulation (PFM) scheme with constant peak current control. This
control scheme maintains high efficiency over the entire load current range, and with a switching frequency up to
1 MHz, the device enables the use of very small external components.
The converter monitors the output voltage, and as soon as the feedback voltage falls below the reference voltage
of typically 1.233 V, the internal switch turns on and the current ramps up. The switch turns off as soon as the
inductor current reaches the internally set peak current of typically 400 mA (TPS61040) or 250 mA (TPS61041).
See Peak Current Control for more information. The second criteria that turns off the switch is the maximum on-
time of 6 μs (typical). This is just to limit the maximum on-time of the converter to cover for extreme conditions.
As the switch is turned off the external Schottky diode is forward biased delivering the current to the output. The
switch remains off for a minimum of 400 ns (typical), or until the feedback voltage drops below the reference
voltage again. Using this PFM peak current control scheme the converter operates in discontinuous conduction
mode (DCM) where the switching frequency depends on the output current, which results in very high efficiency
over the entire load current range. This regulation scheme is inherently stable, allowing a wider selection range
for the inductor and output capacitor.

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8 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

8.1 Application Information

The TPS6104x is designed for output voltages up to 28 V with an input voltage range of 1.8 V to 6 V and a
switch peak current limit of 400 mA (250 mA for the TPS61041). The device operates in a pulse-frequency-
modulation (PFM) scheme with constant peak current control. This control scheme maintains high efficiency over
the entire load current range, and with a switching frequency up to 1 MHz, the device enables the use of very
small external components. The following section provides a step-by-step design approach for configuring the
TPS61040 as a voltage regulating boost converter for LCD bias power supply, as shown in Figure 12.

8.2 Typical Application

The following section provides a step-by-step design approach for configuring the TPS611040 as a voltage
regulating boost converter for LCD bias supply, as shown in Figure 12.
L1
10 μH D1
VIN VOUT
1.8 V to 6 V 18 V
TPS61040
CFF
R1
2.2 MΩ 22 pF
VIN SW
C2
1 μF
FB
C1
4.7 μF L1: Sumida CR32-100
EN GND R2 D1: Motorola MBR0530
160 kΩ C1: Tayo Yuden JMK212BY475MG
C2: Tayo Yuden TMK316BJ105KL

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Figure 12. LCD Bias Supply

8.2.1 Design Requirements

Table 2. Design Parameters

DESIGN PARAMETER EXAMPLE VALUE
Input Voltage 1.8 V to 6 V
Output Voltage 18 V
Output Current 10 mA

8.2.2 Detailed Design Procedure

8.2.2.1 Inductor Selection, Maximum Load Current

Because the PFM peak current control scheme is inherently stable, the inductor value does not affect the stability
of the regulator. The selection of the inductor together with the nominal load current, input and output voltage of
the application determines the switching frequency of the converter. Depending on the application, inductor
values from 2.2 μH to 47 μH are recommended. The maximum inductor value is determined by the maximum on
time of the switch, typically 6 μs. The peak current limit of 400 mA/250 mA (typically) should be reached within
this 6-μs period for proper operation.

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The inductor value determines the maximum switching frequency of the converter. Therefore, select the inductor
value that ensures the maximum switching frequency at the converter maximum load current is not exceeded.
The maximum switching frequency is calculated by the following formula:
VIN(min) ´ (VOUT - VIN )
fS(max) =
IP ´ L ´ VOUT
where
• IP = Peak current as described in Peak Current Control
• L = Selected inductor value
• VIN(min) = The highest switching frequency occurs at the minimum input voltage (2)
If the selected inductor value does not exceed the maximum switching frequency of the converter, the next step
is to calculate the switching frequency at the nominal load current using the following formula:
2 ´ Iload ´ (VOUT - VIN + Vd )
fS (Iload ) =
IP2 ´ L
where
• IP = Peak current as described in Peak Current Control
• L = Selected inductor value
• Iload = Nominal load current
• Vd = Rectifier diode forward voltage (typically 0.3 V) (3)
A smaller inductor value gives a higher converter switching frequency, but lowers the efficiency.
The inductor value has less effect on the maximum available load current and is only of secondary order. The
best way to calculate the maximum available load current under certain operating conditions is to estimate the
expected converter efficiency at the maximum load current. This number can be taken out of the efficiency
graphs shown in Figure 1 through Figure 4. The maximum load current can then be estimated as follows:
I P 2 ´ L ´ fS (m a x)
I lo a d(m a x) = h
2 ´ ( V O U T - VIN )
where
• IP = Peak current as described in Peak Current Control
• L = Selected inductor value
• fSmax = Maximum switching frequency as calculated previously
• η = Expected converter efficiency. Typically 70% to 85% (4)
The maximum load current of the converter is the current at the operation point where the converter starts to
enter the continuous conduction mode. Usually the converter should always operate in discontinuous conduction
mode.
Last, the selected inductor should have a saturation current that meets the maximum peak current of the
converter (as calculated in Peak Current Control). Use the maximum value for ILIM for this calculation.
Another important inductor parameter is the dc resistance. The lower the dc resistance, the higher the efficiency
of the converter. See Table 3 and the typical applications for the inductor selection.

Table 3. Recommended Inductor for Typical LCD Bias Supply (see Figure 23)
DEVICE INDUCTOR VALUE COMPONENT SUPPLIER COMMENTS
10 μH Sumida CR32-100 High efficiency
10 μH Sumida CDRH3D16-100 High efficiency
TPS61040 10 μH Murata LQH4C100K04 High efficiency
4.7 μH Sumida CDRH3D16-4R7 Small solution size
4.7 μH Murata LQH3C4R7M24 Small solution size
High efficiency
TPS61041 10 μH Murata LQH3C100K24
Small solution size

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8.2.2.2 Setting the Output Voltage

The output voltage is calculated as:
V
OUT
+ 1.233 V ǒ1 ) R1
R2
Ǔ
(5)
For battery-powered applications, a high-impedance voltage divider should be used with a typical value for R2 of
≤200 kΩ and a maximum value for R1 of 2.2 MΩ. Smaller values might be used to reduce the noise sensitivity of
the feedback pin.
A feedforward capacitor across the upper feedback resistor R1 is required to provide sufficient overdrive for the
error comparator. Without a feedforward capacitor, or one whose value is too small, the TPS6104x shows double
pulses or a pulse burst instead of single pulses at the switch node (SW), causing higher output voltage ripple. If
this higher output voltage ripple is acceptable, the feedforward capacitor can be left out.
The lower the switching frequency of the converter, the larger the feedforward capacitor value required. A good
starting point is to use a 10-pF feedforward capacitor. As a first estimation, the required value for the feedforward
capacitor at the operation point can also be calculated using the following formula:
C + 1
FF fS
2 p R1
20
where
• R1 = Upper resistor of voltage divider
• fS = Switching frequency of the converter at the nominal load current (See Inductor Selection, Maximum Load
Current for calculating the switching frequency)
• CFF = Choose a value that comes closest to the result of the calculation (6)
The larger the feedforward capacitor the worse the line regulation of the device. Therefore, when concern for line
regulation is paramount, the selected feedforward capacitor should be as small as possible. See the following
section for more information about line and load regulation.

8.2.2.3 Line and Load Regulation

The line regulation of the TPS6104x depends on the voltage ripple on the feedback pin. Usually a 50 mV peak-
to-peak voltage ripple on the feedback pin FB gives good results.
Some applications require a very tight line regulation and can only allow a small change in output voltage over a
certain input voltage range. If no feedforward capacitor CFF is used across the upper resistor of the voltage
feedback divider, the device has the best line regulation. Without the feedforward capacitor the output voltage
ripple is higher because the TPS6104x shows output voltage bursts instead of single pulses on the switch pin
(SW), increasing the output voltage ripple. Increasing the output capacitor value reduces the output voltage
ripple.
If a larger output capacitor value is not an option, a feedforward capacitor CFF can be used as described in the
previous section. The use of a feedforward capacitor increases the amount of voltage ripple present on the
feedback pin (FB). The greater the voltage ripple on the feedback pin (≥50 mV), the worse the line regulation.
There are two ways to improve the line regulation further:
1. Use a smaller inductor value to increase the switching frequency which will lower the output voltage ripple,
as well as the voltage ripple on the feedback pin.
2. Add a small capacitor from the feedback pin (FB) to ground to reduce the voltage ripple on the feedback pin
down to 50 mV again. As a starting point, the same capacitor value as selected for the feedforward capacitor
CFF can be used.

8.2.2.4 Output Capacitor Selection

For best output voltage filtering, a low ESR output capacitor is recommended. Ceramic capacitors have a low
ESR value but tantalum capacitors can be used as well, depending on the application.
Assuming the converter does not show double pulses or pulse bursts on the switch node (SW), the output
voltage ripple can be calculated as:

Copyright © 2002–2016, Texas Instruments Incorporated Submit Documentation Feedback 13

Product Folder Links: TPS61040 TPS61041
TPS61040, TPS61041
SLVS413I – OCTOBER 2002 – REVISED DECEMBER 2016 www.ti.com

I
DV out + out
Cout
ǒ 1 –
I
P
L
fS(Iout) Vout ) Vd–Vin
Ǔ )I
P
ESR

where
• IP = Peak current as described in Peak Current Control
• L = Selected inductor value
• Iout = Nominal load current
• fS (Iout) = Switching frequency at the nominal load current as calculated previously
• Vd = Rectifier diode forward voltage (typically 0.3 V)
• Cout = Selected output capacitor
• ESR = Output capacitor ESR value (7)
See Table 4 and the Typical Application for choosing the output capacitor.

Table 4. Recommended Input and Output Capacitors

DEVICE CAPACITOR VOLTAGE RATING COMPONENT SUPPLIER (1) COMMENTS
4.7 μF/X5R/0805 6.3 V Tayo Yuden JMK212BY475MG CIN/COUT
10 μF/X5R/0805 6.3 V Tayo Yuden JMK212BJ106MG CIN/COUT
TPS6104x 1 μF/X7R/1206 25 V Tayo Yuden TMK316BJ105KL COUT
1 μF/X5R/1206 35 V Tayo Yuden GMK316BJ105KL COUT
4.7 μF/X5R/1210 25 V Tayo Yuden TMK325BJ475MG COUT

(1) See Third-Party Products disclaimer.

8.2.2.5 Input Capacitor Selection

For good input voltage filtering, low ESR ceramic capacitors are recommended. A 4.7-μF ceramic input capacitor
is sufficient for most of the applications. For better input voltage filtering this value can be increased. See Table 4
and typical applications for input capacitor recommendations.

8.2.2.6 Diode Selection

To achieve high efficiency a Schottky diode should be used. The current rating of the diode should meet the
peak current rating of the converter as it is calculated in Peak Current Control. Use the maximum value for ILIM
for this calculation. See Table 5 and the typical applications for the selection of the Schottky diode.

Table 5. Recommended Schottky Diode for Typical LCD Bias Supply (see Figure 23)
DEVICE REVERSE VOLTAGE COMPONENT SUPPLIER (1) COMMENTS
30 V ON Semiconductor MBR0530
20 V ON Semiconductor MBR0520
TPS6104x
20 V ON Semiconductor MBRM120L High efficiency
30 V Toshiba CRS02

spacer

(1) See Third-Party Products disclaimer.

14 Submit Documentation Feedback Copyright © 2002–2016, Texas Instruments Incorporated

Product Folder Links: TPS61040 TPS61041

 TPS61040, TPS61041
www.ti.com SLVS413I – OCTOBER 2002 – REVISED DECEMBER 2016

8.2.3 Application Curves

VO = 18 V IO = 18 V

VI
2.4 V to 3.4 V

IO
100 mV/div

VO
IO
100 mV/div
1 mA to 10 mA

200 mS/div
200 µS/div

Figure 13. Line Transient Response Figure 14. Load Transient Response

VO = 18 V

VO
5 V/div

EN
1 V/div

II
50 mA/div

500 us/div

Figure 15. Start-Up Behavior

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TPS61040, TPS61041
SLVS413I – OCTOBER 2002 – REVISED DECEMBER 2016 www.ti.com

8.3 System Examples

L1
10 μH D1
VO
18 V
TPS61040
CFF
R1 22 pF
VIN VIN SW 2.2 MΩ
1.8 V to 6 V C2
1 μF
FB
C1
4.7 μF DAC or Analog Voltage
EN GND R2 0 V = 25 V
160 kΩ
1.233 V = 18 V
L1: Sumida CR32-100
D1: Motorola MBR0530
C1: Tayo Yuden JMK212BY475MG
C2: Tayo Yuden GMK316BJ105KL
Copyright © 2016, Texas Instruments Incorporated

Figure 16. LCD Bias Supply With Adjustable Output Voltage

R3
200 k

L1 BC857C
10 μH D1
VIN VOUT
1.8 V to 6 V 18 V / 10 mA
TPS61040 R1 CFF
2.2 MΩ 22 pF
VIN SW
C2 C3
1 μF 0.1 μF
FB (Optional)
C1
4.7 μF R2
EN GND L1: Sumida CR32-100
160 kΩ
D1: Motorola MBR0530
C1: Tayo Yuden JMK212BY475MG
C2: Tayo Yuden TMK316BJ105KL
Copyright © 2016, Texas Instruments Incorporated

Figure 17. LCD Bias Supply With Load Disconnect

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Product Folder Links: TPS61040 TPS61041

 TPS61040, TPS61041
www.ti.com SLVS413I – OCTOBER 2002 – REVISED DECEMBER 2016

System Examples (continued)

D3
V2 = –10 V/15 μA
D2 C4
C3 4.7 μF
1 μF
L1
6.8 μH D1
V1 = 10 V/15 mA
TPS61040
CFF
VIN R1 22 pF
VIN = 2.7 V to 5 V SW
1.5 MΩ C2
1 μF
FB
C1 L1: Murata LQH4C6R8M04
4.7 μF D1, D2, D3: Motorola MBR0530
EN GND R2
210 kΩ C1: Tayo Yuden JMK212BY475MG
C2, C3, C4: Tayo Yuden EMK316BJ105KF

Copyright © 2016, Texas Instruments Incorporated

Figure 18. Positive and Negative Output LCD Bias Supply

L1
6.8 μH D1
VO = 12 V/35 mA
TPS61040
CFF
R1 4.7 pF
VIN 3.3 V VIN SW 1.8 MΩ C2
4.7 μF
FB
C1
10 μF EN L1: Murata LQH4C6R8M04
GND R2
205 kΩ D1: Motorola MBR0530
C1: Tayo Yuden JMK212BJ106MG
C2: Tayo Yuden EMK316BJ475ML

Copyright © 2016, Texas Instruments Incorporated

Figure 19. Standard 3.3-V to 12-V Supply

3.3 μH D1
5 V/45 mA
TPS61040 CFF
R1 3.3 pF
1.8 V to 4 V VIN SW
620 kΩ
C2
FB 4.7 μF
C1
4.7 μF R2
EN GND
200 kΩ L1: Murata LQH4C3R3M04
D1: Motorola MBR0530
C1, C2: Tayo Yuden JMK212BY475MG

Copyright © 2016, Texas Instruments Incorporated

Figure 20. Dual Battery Cell to 5-V/50-mA Conversion

Efficiency Approximately Equals 84% at VIN = 2.4 V to Vo = 5 V/45 mA

Copyright © 2002–2016, Texas Instruments Incorporated Submit Documentation Feedback 17

Product Folder Links: TPS61040 TPS61041
TPS61040, TPS61041
SLVS413I – OCTOBER 2002 – REVISED DECEMBER 2016 www.ti.com

System Examples (continued)

L1
10 μH D1

VCC = 2.7 V to 6 V D2
VIN SW 24 V
(Optional)
C1
FB
4.7 μF
C2 L1: Murata LQH4C100K04
PWM EN GND 1 μF RS D1: Motorola MBR0530
100 Hz to 500 Hz 82 Ω C1: Tayo Yuden JMK212BY475MG
C2: Tayo Yuden TMK316BJ105KL

Copyright © 2016, Texas Instruments Incorporated

Figure 21. White LED Supply With Adjustable Brightness Control

Using a PWM Signal on the Enable Pin, Efficiency Approximately Equals 86% at V IN = 3 V, ILED = 15 mA

L1 D1
10 μH MBRM120L

VCC = 2.7 V to 6 V D2 C2
VIN SW 24 V 100 nF
(Optional) (See
Note A)
FB
C1
4.7 μF R1
EN GND
120 kΩ
RS
110 Ω
L1: Murata LQH4C3R3M04
D1: Motorola MBR0530
Analog Brightness Control C1: Tayo Yuden JMK212BY475MG
3.3 V @ Led Off R2 C2: Standard Ceramic Capacitor
0 V @Iled = 20 mA 160 kΩ
Copyright © 2016, Texas Instruments Incorporated

A. A smaller output capacitor value for C2 causes a larger LED ripple.

Figure 22. White LED Supply With Adjustable Brightness Control

Using an Analog Signal on the Feedback Pin

18 Submit Documentation Feedback Copyright © 2002–2016, Texas Instruments Incorporated

Product Folder Links: TPS61040 TPS61041

 TPS61040, TPS61041
www.ti.com SLVS413I – OCTOBER 2002 – REVISED DECEMBER 2016

9 Power Supply Recommendations

The device is designed to operate from an input voltage supply range between 1.8 V and 6 V. The output current
of the input power supply must be rated according to the supply voltage, output voltage and output current of
TPS6104x.

10 Layout

10.1 Layout Guidelines

Typical for all switching power supplies, the layout is an important step in the design; especially at high peak
currents and switching frequencies. If the layout is not carefully done, the regulator might show noise problems
and duty cycle jitter.
The input capacitor should be placed as close as possible to the input pin for good input voltage filtering. The
inductor and diode should be placed as close as possible to the switch pin to minimize the noise coupling into
other circuits. Because the feedback pin and network is a high-impedance circuit, the feedback network should
be routed away from the inductor. The feedback pin and feedback network should be shielded with a ground
plane or trace to minimize noise coupling into this circuit.
Wide traces should be used for connections in bold as shown in Figure 23. A star ground connection or ground
plane minimizes ground shifts and noise.

10.2 Layout Example

VOUT VIN

SW 1 5 VIN
TPS61040

GND 2

3 EN
FB 4
GND

Figure 23. Layout Diagram

Copyright © 2002–2016, Texas Instruments Incorporated Submit Documentation Feedback 19

Product Folder Links: TPS61040 TPS61041
TPS61040, TPS61041
SLVS413I – OCTOBER 2002 – REVISED DECEMBER 2016 www.ti.com

11 Device and Documentation Support

11.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.

Table 6. Related Links

TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER SAMPLE & BUY
DOCUMENTS SOFTWARE COMMUNITY
TPS61041 Click here Click here Click here Click here Click here
TPS61040 Click here Click here Click here Click here Click here

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.

11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

20 Submit Documentation Feedback Copyright © 2002–2016, Texas Instruments Incorporated

Product Folder Links: TPS61040 TPS61041

 PACKAGE OPTION ADDENDUM

www.ti.com 24-Aug-2018

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

TPS61040DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 PHOI
& no Sb/Br)
TPS61040DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 PHOI
& no Sb/Br)
TPS61040DDCR ACTIVE SOT-23-THIN DDC 5 3000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 QXK
& no Sb/Br)
TPS61040DDCT ACTIVE SOT-23-THIN DDC 5 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 QXK
& no Sb/Br)
TPS61040DRVR ACTIVE WSON DRV 6 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 CCL
& no Sb/Br)
TPS61040DRVT ACTIVE WSON DRV 6 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 CCL
& no Sb/Br)
TPS61040DRVTG4 ACTIVE WSON DRV 6 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 CCL
& no Sb/Br)
TPS61041DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PHPI
& no Sb/Br)
TPS61041DRVR ACTIVE WSON DRV 6 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 CAW
& no Sb/Br)
TPS61041DRVT ACTIVE WSON DRV 6 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 CAW
& no Sb/Br)
TPS61041DRVTG4 ACTIVE WSON DRV 6 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 CAW
& no Sb/Br)

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 24-Aug-2018

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF TPS61040, TPS61041 :

• Automotive: TPS61040-Q1, TPS61041-Q1

NOTE: Qualified Version Definitions:

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 8-May-2018

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS61040DBVR SOT-23 DBV 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS61040DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TPS61040DDCR SOT- DDC 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
23-THIN
TPS61040DDCT SOT- DDC 5 250 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
23-THIN
TPS61040DRVR WSON DRV 6 3000 178.0 8.4 2.25 2.25 1.0 4.0 8.0 Q2
TPS61040DRVT WSON DRV 6 250 178.0 8.4 2.25 2.25 1.0 4.0 8.0 Q2
TPS61041DBVR SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS61041DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TPS61041DRVR WSON DRV 6 3000 178.0 8.4 2.25 2.25 1.0 4.0 8.0 Q2
TPS61041DRVR WSON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS61041DRVT WSON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2
TPS61041DRVT WSON DRV 6 250 178.0 8.4 2.25 2.25 1.0 4.0 8.0 Q2

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 8-May-2018

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS61040DBVR SOT-23 DBV 5 3000 203.0 203.0 35.0
TPS61040DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TPS61040DDCR SOT-23-THIN DDC 5 3000 195.0 200.0 45.0
TPS61040DDCT SOT-23-THIN DDC 5 250 195.0 200.0 45.0
TPS61040DRVR WSON DRV 6 3000 205.0 200.0 33.0
TPS61040DRVT WSON DRV 6 250 205.0 200.0 33.0
TPS61041DBVR SOT-23 DBV 5 3000 203.0 203.0 35.0
TPS61041DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TPS61041DRVR WSON DRV 6 3000 205.0 200.0 33.0
TPS61041DRVR WSON DRV 6 3000 203.0 203.0 35.0
TPS61041DRVT WSON DRV 6 250 203.0 203.0 35.0
TPS61041DRVT WSON DRV 6 250 205.0 200.0 33.0

Pack Materials-Page 2
 GENERIC PACKAGE VIEW
DRV 6 WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD

Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.

4206925/F
 PACKAGE OUTLINE
DRV0006A SCALE 5.500
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD

2.1 A
B
1.9

PIN 1 INDEX AREA

2.1
1.9

0.8
0.7 C

SEATING PLANE

0.08 C

(0.2) TYP
1 0.1 0.05
EXPOSED 0.00
THERMAL PAD

3
4

2X
7
1.3 1.6 0.1

6
1
4X 0.65
0.35
6X
PIN 1 ID 0.3 0.25
6X
(OPTIONAL) 0.2 0.1 C A B
0.05 C

4222173/B 04/2018

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

www.ti.com
 EXAMPLE BOARD LAYOUT
DRV0006A WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD

6X (0.45)
(1)
1 7

6X (0.3) 6

SYMM (1.6)
(1.1)

4X (0.65)

4
3

(R0.05) TYP SYMM

( 0.2) VIA
TYP (1.95)

LAND PATTERN EXAMPLE

SCALE:25X

0.07 MAX 0.07 MIN

ALL AROUND ALL AROUND

SOLDER MASK METAL METAL UNDER SOLDER MASK

OPENING SOLDER MASK OPENING
NON SOLDER MASK
DEFINED SOLDER MASK
(PREFERRED) DEFINED

SOLDER MASK DETAILS

4222173/B 04/2018

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown.

www.ti.com
 EXAMPLE STENCIL DESIGN
DRV0006A WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD

SYMM
6X (0.45)
METAL
1 7

6X (0.3) 6

(0.45)
SYMM

4X (0.65)
(0.7)
4
3

(R0.05) TYP
(1)

(1.95)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD #7
88% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:30X

4222173/B 04/2018
NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.

www.ti.com
 PACKAGE OUTLINE
DBV0005A SCALE 4.000
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR

C
3.0
2.6 0.1 C
1.75
B A 1.45 MAX
1.45
PIN 1
INDEX AREA

1 5

2X 0.95
3.05
2.75
1.9 1.9
2

4
3
0.5
5X
0.3
0.15
0.2 C A B (1.1) TYP
0.00

0.25
GAGE PLANE 0.22
TYP
0.08

8
TYP 0.6
0 TYP SEATING PLANE
0.3

4214839/D 11/2018

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.

www.ti.com
 EXAMPLE BOARD LAYOUT
DBV0005A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR

PKG
5X (1.1)
1
5
5X (0.6)

SYMM
(1.9)
2
2X (0.95)

3 4

(R0.05) TYP (2.6)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:15X

SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK

EXPOSED METAL EXPOSED METAL

0.07 MAX 0.07 MIN

ARROUND ARROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)

SOLDER MASK DETAILS

4214839/D 11/2018

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
DBV0005A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR

PKG
5X (1.1)
1
5
5X (0.6)

SYMM
2 (1.9)
2X(0.95)

3 4

(R0.05) TYP
(2.6)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE:15X

4214839/D 11/2018

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.

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