Datasheet Intel Core 2 Duo

Intel® Core™2 Duo Processor E8000Δ
and E7000Δ Series

Datasheet
June 2009
Document Number: 318732-006

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Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel Core™2 Duo processor E8000 and E7000 series may contain design defects or errors known as errata which may cause the product to deviate
from published specifications.
ΔIntel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different
processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in
clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular
feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/
processor_number for details.
ΦIntel® 64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel 64. Processor
will not operate (including 32-bit operation) without an Intel 64-enabled BIOS. Performance will vary depending on your hardware and software
configurations. See http://developer.intel.com/technology/intel64/ for more information including details on which processors support Intel 64 or consult
with your system vendor for more information.
Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check
with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.
Intel® Virtualization Technology requires a computer system with a processor, chipset, BIOS, virtual machine monitor (VMM) and for some uses, certain
platform software enabled for it. Functionality, performance or other benefit will vary depending on hardware and software configurations and may
require a BIOS update. Software applications may not be compatible with all operating systems. Please check with your application vendor.
See the Processor Spec Finder or contact your Intel representative for more information.
No computer system can provide absolute security under all conditions. Intel® Trusted Execution Technology (Intel® TXT) requires a computer system
with Intel® Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code Modules and an Intel TXT-compatible
measured launched environment (MLE). The MLE could consist of a virtual machine monitor, an OS or an application. In addition, Intel TXT requires the
system to contain a TPM v1.2, as defined by the Trusted Computing Group and specific software for some uses. For more information, see here
Not all specified units of this processor support Thermal Monitor 2, Enhanced HALT State and Enhanced Intel SpeedStep® Technology. See the Processor
Spec Finder at http://processorfinder.intel.com or contact your Intel representative for more information.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel, Pentium, Intel Core, Intel SpeedStep, and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2008–2009, Intel Corporation. All rights reserved.
2 Datasheet
Contents
1 Introduction .............................................................................................................. 9
1.1 Terminology ..................................................................................................... 10
1.1.1 Processor Terminology Definitions ............................................................ 10
1.2 References ....................................................................................................... 12
2 Electrical Specifications ........................................................................................... 13
2.1 Power and Ground Lands.................................................................................... 13
2.2 Decoupling Guidelines ........................................................................................ 13
2.2.1 VCC Decoupling ..................................................................................... 13
2.2.2 VTT Decoupling ...................................................................................... 13
2.2.3 FSB Decoupling...................................................................................... 14
2.3 Voltage Identification ......................................................................................... 14
2.4 Reserved, Unused, and TESTHI Signals ................................................................ 16
2.5 Power Segment Identifier (PSID)......................................................................... 16
2.6 Voltage and Current Specification ........................................................................ 17
2.6.1 Absolute Maximum and Minimum Ratings .................................................. 17
2.6.2 DC Voltage and Current Specification ........................................................ 18
2.6.3 VCC Overshoot ...................................................................................... 23
2.6.4 Die Voltage Validation ............................................................................. 24
2.7 Signaling Specifications...................................................................................... 24
2.7.1 FSB Signal Groups.................................................................................. 25
2.7.2 CMOS and Open Drain Signals ................................................................. 26
2.7.3 Processor DC Specifications ..................................................................... 27
2.7.3.1 Platform Environment Control Interface (PECI) DC Specifications..... 29
2.7.3.2 GTL+ Front Side Bus Specifications ............................................. 30
2.8 Clock Specifications ........................................................................................... 31
2.8.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 31
2.8.2 FSB Frequency Select Signals (BSEL[2:0])................................................. 32
2.8.3 Phase Lock Loop (PLL) and Filter .............................................................. 32
2.8.4 BCLK[1:0] Specifications ......................................................................... 32
3 Package Mechanical Specifications .......................................................................... 35
3.1 Package Mechanical Drawing............................................................................... 35
3.2 Processor Component Keep-Out Zones ................................................................. 39
3.3 Package Loading Specifications ........................................................................... 39
3.4 Package Handling Guidelines............................................................................... 39
3.5 Package Insertion Specifications.......................................................................... 40
3.6 Processor Mass Specification ............................................................................... 40
3.7 Processor Materials............................................................................................ 40
3.8 Processor Markings............................................................................................ 40
3.9 Processor Land Coordinates ................................................................................ 41
4 Land Listing and Signal Descriptions ....................................................................... 43
4.1 Processor Land Assignments ............................................................................... 43
4.2 Alphabetical Signals Reference ............................................................................ 66
5 Thermal Specifications and Design Considerations .................................................. 77
5.1 Processor Thermal Specifications ......................................................................... 77
5.1.1 Thermal Specifications ............................................................................ 77
5.1.2 Thermal Metrology ................................................................................. 81
5.2 Processor Thermal Features ................................................................................ 81
5.2.1 Thermal Monitor..................................................................................... 81
5.2.2 Thermal Monitor 2 .................................................................................. 82
5.2.3 On-Demand Mode .................................................................................. 83
5.2.4 PROCHOT# Signal .................................................................................. 84
5.2.5 THERMTRIP# Signal ............................................................................... 84
5.3 Platform Environment Control Interface (PECI) ...................................................... 85
5.3.1 Introduction .......................................................................................... 85
5.3.1.1 TCONTROL and TCC activation on PECI-Based Systems.................. 85
5.3.2 PECI Specifications ................................................................................. 86
5.3.2.1 PECI Device Address ................................................................. 86
Datasheet 3
5.3.2.2 PECI Command Support .............................................................86
5.3.2.3 PECI Fault Handling Requirements ...............................................86
5.3.2.4 PECI GetTemp0() Error Code Support ..........................................86
6 Features ..................................................................................................................87
6.1 Power-On Configuration Options ..........................................................................87
6.2 Clock Control and Low Power States .....................................................................87
6.2.1 Normal State .........................................................................................88
6.2.2 HALT and Extended HALT Powerdown States ..............................................88
6.2.2.1 HALT Powerdown State ..............................................................88
6.2.2.2 Extended HALT Powerdown State ................................................89
6.2.3 Stop Grant and Extended Stop Grant States ...............................................89
6.2.3.1 Stop-Grant State.......................................................................89
6.2.3.2 Extended Stop Grant State .........................................................90
6.2.4 Extended HALT Snoop State, HALT Snoop State, Extended
Stop Grant Snoop State, and Stop Grant Snoop State..................................90
6.2.4.1 HALT Snoop State, Stop Grant Snoop State ..................................90
6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State.......90
6.2.5 Sleep State ............................................................................................90
6.2.6 Deep Sleep State....................................................................................91
6.2.7 Deeper Sleep State .................................................................................91
6.2.8 Enhanced Intel SpeedStep® Technology ....................................................92
6.3 Processor Power Status Indicator (PSI) Signal .......................................................92
7 Boxed Processor Specifications................................................................................93
7.1 Introduction ......................................................................................................93
7.2 Mechanical Specifications ....................................................................................94
7.2.1 Boxed Processor Cooling Solution Dimensions.............................................94
7.2.2 Boxed Processor Fan Heatsink Weight .......................................................95
7.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....95
7.3 Electrical Requirements ......................................................................................95
7.3.1 Fan Heatsink Power Supply ......................................................................95
7.4 Thermal Specifications........................................................................................97
7.4.1 Boxed Processor Cooling Requirements......................................................97
7.4.2 Variable Speed Fan .................................................................................99
8 Debug Tools Specifications .................................................................................... 101
8.1 Logic Analyzer Interface (LAI) ........................................................................... 101
8.1.1 Mechanical Considerations ..................................................................... 101
8.1.2 Electrical Considerations ........................................................................ 101
4 Datasheet
Figures
1 Intel® Core™2 Duo Processor E8000 Series VCC Static and Transient Tolerance................ 21
2 Intel® Core™2 Duo Processor E7000 Series VCC Static and Transient Tolerance................ 23
3 VCC Overshoot Example Waveform ............................................................................. 24
4 Differential Clock Waveform ...................................................................................... 34
5 Measurement Points for Differential Clock Waveforms ................................................... 34
6 Processor Package Assembly Sketch ........................................................................... 35
7 Processor Package Drawing Sheet 1 of 3 ..................................................................... 36
10 Processor Top-Side Markings Example ........................................................................ 40
11 Processor Land Coordinates and Quadrants, Top View ................................................... 41
12 land-out Diagram (Top View – Left Side) ..................................................................... 44
13 land-out Diagram (Top View – Right Side) ................................................................... 45
14 Intel® Core™2 Duo Processor E8000 Series Thermal Profile ........................................... 79
15 Intel® Core™2 Duo Processor E7000 Series Thermal Profile ........................................... 80
16 Case Temperature (TC) Measurement Location ............................................................ 81
17 Thermal Monitor 2 Frequency and Voltage Ordering ...................................................... 83
18 Conceptual Fan Control Diagram on PECI-Based Platforms............................................. 85
19 Processor Low Power State Machine ........................................................................... 88
20 Mechanical Representation of the Boxed Processor ....................................................... 93
21 Space Requirements for the Boxed Processor (Side View).............................................. 94
22 Space Requirements for the Boxed Processor (Top View)............................................... 94
23 Overall View Space Requirements for the Boxed Processor............................................. 95
24 Boxed Processor Fan Heatsink Power Cable Connector Description .................................. 96
25 Baseboard Power Header Placement Relative to Processor Socket ................................... 97
26 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ................... 98
27 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view) ................... 98
28 Boxed Processor Fan Heatsink Set Points..................................................................... 99
Datasheet 5
Tables
1 References ..............................................................................................................12
2 Voltage Identification Definition ..................................................................................15
3 Absolute Maximum and Minimum Ratings ....................................................................17
4 Voltage and Current Specifications..............................................................................18
5 Intel® Core™2 Duo Processor E8000 Series VCC Static and Transient Tolerance ................20
6 Intel® Core™2 Duo Processor E7000 Series VCC Static and Transient Tolerance ................22
7 VCC Overshoot Specifications......................................................................................23
8 FSB Signal Groups ....................................................................................................25
9 Signal Characteristics................................................................................................26
10 Signal Reference Voltages .........................................................................................26
11 GTL+ Signal Group DC Specifications ..........................................................................27
12 Open Drain and TAP Output Signal Group DC Specifications ...........................................27
13 CMOS Signal Group DC Specifications..........................................................................28
14 PECI DC Electrical Limits ...........................................................................................29
15 GTL+ Bus Voltage Definitions .....................................................................................30
16 Core Frequency to FSB Multiplier Configuration.............................................................31
17 BSEL[2:0] Frequency Table for BCLK[1:0] ...................................................................32
18 Front Side Bus Differential BCLK Specifications .............................................................32
19 FSB Differential Clock Specifications (1333 MHz FSB) ....................................................33
20 FSB Differential Clock Specifications (1066 MHz FSB) ....................................................33
21 Processor Loading Specifications.................................................................................39
22 Package Handling Guidelines......................................................................................39
23 Processor Materials ...................................................................................................40
24 Alphabetical Land Assignments...................................................................................46
25 Numerical Land Assignment .......................................................................................56
26 Signal Description.....................................................................................................66
27 Processor Thermal Specifications ................................................................................78
28 Intel® Core™2 Duo Processor E8000 Series Thermal Profile ...........................................79
29 Intel® Core™2 Duo Processor E7000 Series Thermal Profile ...........................................80
30 GetTemp0() Error Codes ...........................................................................................86
31 Power-On Configuration Option Signals .......................................................................87
32 Fan Heatsink Power and Signal Specifications ...............................................................96
33 Fan Heatsink Power and Signal Specifications ............................................................. 100
6 Datasheet
Intel® Core™2 Duo Processor E8000
and E7000 Series Features
• Available at 3.33 GHz, 3.16 GHz, 3.00 GHz, • Advance Dynamic Execution
2.83 GHz, and 2.66 GHz for the Intel • Very deep out-of-order execution
Core™2 Duo processor E8000 series
• Enhanced branch prediction
• Available at 3.06 GHz, 2.93 GHz, 2.80 GHz, • Optimized for 32-bit applications running on
2.66 GHz, and 2.53 GHz for the Intel advanced 32-bit operating systems
Core™2 Duo processor E7000 series
• Intel® Advanced Smart Cache
• Enhanced Intel Speedstep® Technology
• 6 MB Level 2 cache (Intel Core™2 Duo
• Supports Intel® 64Φ architecture processor E8000 series only)
• Supports Intel® Virtualization Technology • 3 MB Level 2 cache (Intel Core™2 Duo
(Intel® VT) (Intel Core™2 Duo processors processor E7000 series only)
E8600, E8500, E8400, E8300, E8200 and
E7600 only) • Intel® Advanced Digital Media Boost
• Enhanced floating point and multimedia unit
• Supports Intel® Trusted Execution
for enhanced video, audio, encryption, and
Technology (Intel® TXT) (Intel Core™2 Duo
3D performance
processors E8600, E8500, E8400, E8300,
and E8200 only) • Power Management capabilities
• Supports Execute Disable Bit capability • System Management mode
• Multiple low-power states
• FSB frequency at 1333 MHz
• 8-way cache associativity provides improved
• FSB frequency at 1066 MHz (Intel Core™2 cache hit rate on load/store operations
Duo processor E7000 series only)
• 775-land Package
• Binary compatible with applications running
on previous members of the Intel
microprocessor line
The Intel® Core™2 Duo processor E8000 and E7000 series are based on the Enhanced Intel® Core™
microarchitecture. The Enhanced Intel® Core™ microarchitecture combines the performance across
applications and usages where end-users can truly appreciate and experience the performance. These
applications include Internet audio and streaming video, image processing, video content creation,
speech, 3D, CAD, games, multimedia, and multitasking user environments.
Intel® 64Φ architecture enables the processor to execute operating systems and applications written
to take advantage of the Intel 64 architecture. The processor, supporting Enhanced Intel Speedstep®
technology, allows tradeoffs to be made between performance and power consumption.
The Intel Core™2 Duo processor E8000 and E7000 series also includes the Execute Disable Bit
capability. This feature, combined with a supported operating system, allows memory to be marked
as executable or non-executable.
Virtualization Technology provides silicon-based functionality that works together with compatible
Virtual Machine Monitor (VMM) software to improve on software-only solutions.
The Intel® Trusted Execution Technology (Intel TXT) is a key element in Intel's safer computing
initiative that defines a set of hardware enhancements that interoperate with an Intel TXT enabled
operating system to help protect against software-based attacks. It creates a hardware foundation
that builds on Intel's Virtualization Technology to help protect the confidentiality and integrity of data
stored/created on the client PC.
Datasheet 7
Revision History
Revision
Description Revision Date
Number
-001 • Initial release January 2008
• Added Intel® Core™2 Duo processor E8300 and E7200

-002 • Updated VID information. Updated Table 2-1. April 2008
• Added the PSI# signal
• Added Intel® Core™2 Duo processor E8600 and E7300
-003 August 2008
• Updated FSB termination voltage in Table 2-3.
-004 • Added Intel® Core™2 Duo processor E7400 October 2008
-005 • Added Intel® Core™2 Duo processor E7500 January 2009
-006 • Added Intel® Core™2 Duo processor E7600 June 2009
§§
8 Datasheet
Introduction
1 Introduction
The Intel® Core™2 Duo processor E8000 and E7000 series is based on the Enhanced
Intel® Core™ microarchitecture. The Intel Enhanced Core™ microarchitecture combines
the performance of previous generation Desktop products with the power efficiencies of
a low-power microarchitecture to enable smaller, quieter systems. The Intel® Core™2
Duo processor E8000 and E7000 series are 64-bit processors that maintain
compatibility with IA-32 software.
Note: In this document, the Intel® Core™2 Duo processor E8000 and E7000 series may be
referred to as "the processor."
Note: In this document, unless otherwise specified, the Intel® Core™2 Duo processor E8000
series refers to the Intel® Core™2 Duo processors E8600, E8500, E8400, E8300,
E8200, and E8190.
Note: In this document, unless otherwise specified, the Intel® Core™2 Duo processor E7000
series refers to the Intel® Core™2 Duo processors E7600, E7500, E7400, E7300 and
E7200.
The processors use Flip-Chip Land Grid Array (FC-LGA8) package technology, and plugs
into a 775-land surface mount, Land Grid Array (LGA) socket, referred to as the
LGA775 socket.
The processors are based on 45 nm process technology. The processors feature the
Intel Advanced Smart Cache, a shared multi-core optimized cache that significantly
reduces latency to frequently used data. The Intel Core™2 Duo processor E8000 series
features a 1333 MHz front side bus (FSB) and 6 MB of L2 cache. The Intel Core™2 Duo
processor E7000 series features a 1333 MHz and 1066 MHz front side bus (FSB) and
3 MB of L2 cache. The processors support all the existing Streaming SIMD Extensions 2
(SSE2), Streaming SIMD Extensions 3 (SSE3), Supplemental Streaming SIMD
Extension 3 (SSSE3), and the Streaming SIMD Extensions 4.1 (SSE4.1). The
processors support several Advanced Technologies: Execute Disable Bit, Intel 64
architecture, and Enhanced Intel SpeedStep® Technology. The Intel Core™2 Duo
processor E8600, E8500, E8400, E8300, and E8200 support Intel Trusted Execution
Technology (Intel TXT) and Intel Virtualization Technology (Intel VT). The Intel Core™2
Duo processor E7600 supports Intel Virtualization Technology (Intel VT).
The processor's front side bus (FSB) use a split-transaction, deferred reply protocol.
The FSB uses Source-Synchronous Transfer of address and data to improve
performance by transferring data four times per bus clock (4X data transfer rate).
Along with the 4X data bus, the address bus can deliver addresses two times per bus
clock and is referred to as a "double-clocked" or 2X address bus. Working together, the
4X data bus and 2X address bus provide a data bus bandwidth of up to 10.7 GB/s.
Intel has enabled support components for the processor including heatsink, heatsink
retention mechanism, and socket. Manufacturability is a high priority; hence,
mechanical assembly may be completed from the top of the baseboard and should not
require any special tooling.
Datasheet 9
Introduction
1.1 Terminology
A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in
the active state when driven to a low level. For example, when RESET# is low, a reset
has been requested. Conversely, when NMI is high, a nonmaskable interrupt has
occurred. In the case of signals where the name does not imply an active state but
describes part of a binary sequence (such as address or data), the ‘#’ symbol implies
that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and
D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).
“Front Side Bus” refers to the interface between the processor and system core logic
(a.k.a. the chipset components). The FSB is a multiprocessing interface to processors,
memory, and I/O.
1.1.1 Processor Terminology Definitions

Commonly used terms are explained here for clarification:
• Intel® Core™2 Duo processor E8000 series — Dual core processor in the FC-
LGA8 package with a 6 MB L2 cache.
• Intel® Core™2 Duo processor E7000 series — Dual core processor in the FC-
LGA8 package with a 3 MB L2 cache.
• Processor — For this document, the term processor is the generic form of the
Intel® Core™2 Duo processor E8000 series and Intel® Core™2 Duo processor
E7000 series.
• Voltage Regulator Design Guide — For this document “Voltage Regulator Design
Guide” may be used in place of:
— Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design
Guidelines For Desktop LGA775 Socket
• Enhanced Intel® Core™ microarchitecture — A new foundation for Intel®
architecture-based desktop, mobile and mainstream server multi-core processors.
For additional information refer to: http://www.intel.com/technology/architecture/
coremicro/
• Keep-out zone — The area on or near the processor that system design can not
use.
• Processor core — Processor die with integrated L2 cache.
• LGA775 socket — The processors mate with the system board through a surface
mount, 775-land, LGA socket.
• Integrated heat spreader (IHS) —A component of the processor package used
to enhance the thermal performance of the package. Component thermal solutions
interface with the processor at the IHS surface.
• Retention mechanism (RM) — Since the LGA775 socket does not include any
mechanical features for heatsink attach, a retention mechanism is required.
Component thermal solutions should attach to the processor using a retention
mechanism that is independent of the socket.
• FSB (Front Side Bus) — The electrical interface that connects the processor to
the chipset. Also referred to as the processor system bus or the system bus. All
memory and I/O transactions as well as interrupt messages pass between the
processor and chipset over the FSB.
10 Datasheet
Introduction
• Storage conditions — Refers to a non-operational state. The processor may be

installed in a platform, in a tray, or loose. Processors may be sealed in packaging or
exposed to free air. Under these conditions, processor lands should not be
connected to any supply voltages, have any I/Os biased, or receive any clocks.
Upon exposure to “free air”(i.e., unsealed packaging or a device removed from
packaging material) the processor must be handled in accordance with moisture
sensitivity labeling (MSL) as indicated on the packaging material.
• Functional operation — Refers to normal operating conditions in which all
processor specifications, including DC, AC, system bus, signal quality, mechanical
and thermal are satisfied.
• Execute Disable Bit — Execute Disable Bit allows memory to be marked as
executable or non-executable, when combined with a supporting operating system.
If code attempts to run in non-executable memory the processor raises an error to
the operating system. This feature can prevent some classes of viruses or worms
that exploit buffer over run vulnerabilities and can thus help improve the overall
security of the system. See the Intel® Architecture Software Developer's Manual
for more detailed information.
• Intel® 64 Architecture— An enhancement to Intel's IA-32 architecture, allowing
the processor to execute operating systems and applications written to take
advantage of the Intel 64 architecture. Further details on Intel 64 architecture and
programming model can be found in the Intel Extended Memory 64 Technology
Software Developer Guide at http://developer.intel.com/technology/
64bitextensions/.
• Enhanced Intel SpeedStep® Technology — Enhanced Intel SpeedStep
Technology allows trade-offs to be made between performance and power
consumptions, based on processor utilization. This may lower average power
consumption (in conjunction with OS support).
• Intel® Virtualization Technology (Intel® VT) — A set of hardware
enhancements to Intel server and client platforms that can improve virtualization
solutions. Intel VT will provide a foundation for widely-deployed virtualization
solutions and enables more robust hardware assisted virtualization solutions. More
information can be found at: http://www.intel.com/technology/virtualization/
• Intel® Trusted Execution Technology (Intel® TXT) — A key element in Intel's
safer computing initiative which defines a set of hardware enhancements that
interoperate with an Intel TXT enabled OS to help protect against software-based
attacks. Intel TXT creates a hardware foundation that builds on Intel's
Virtualization Technology (Intel VT) to help protect the confidentiality and integrity
of data stored/created on the client PC.
• Platform Environment Control Interface (PECI) — A proprietary one-wire bus
interface that provides a communication channel between the processor and
chipset components to external monitoring devices.
Datasheet 11
Introduction
1.2 References
Material and concepts available in the following documents may be beneficial when
reading this document.
Table 1. References
Document Location
www.intel.com/design/
Intel® Core™2 Duo Processor E8000 and E7000 Series Specification
processor/specupdt/
Update
318733.htm
Intel® Core™2 Duo Processor E8000 and E7000 Series and Intel® www.intel.com/design/
Pentium Dual-Core Processor E6000 and E5000 Series Thermal and processor/designex/
Mechanical Design Guidelines 318734.htm
http://www.intel.com/
Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design
design/processor/
Guidelines For Desktop LGA775 Socket
applnots/313214.htm
http://intel.com/design/
LGA775 Socket Mechanical Design Guide Pentium4/guides/
302666.htm
Intel® 64 and IA-32 Intel Architecture Software Developer's Manuals
Volume 1: Basic Architecture
Volume 2A: Instruction Set Reference, A-M
http://www.intel.com/
Volume 2B: Instruction Set Reference, N-Z products/processor/
manuals/
Volume 3A: System Programming Guide, Part 1
Volume 3B: System Programming Guide, Part 2
12 Datasheet
Electrical Specifications
2 Electrical Specifications
This chapter describes the electrical characteristics of the processor interfaces and
signals. DC electrical characteristics are provided.
2.1 Power and Ground Lands

The processor has VCC (power), VTT, and VSS (ground) inputs for on-chip power
distribution. All power lands must be connected to VCC, while all VSS lands must be
connected to a system ground plane. The processor VCC lands must be supplied the
voltage determined by the Voltage IDentification (VID) lands.
The signals denoted as VTT provide termination for the front side bus and power to the
I/O buffers. A separate supply must be implemented for these lands, that meets the
VTT specifications outlined in Table 4.
2.2 Decoupling Guidelines

Due to its large number of transistors and high internal clock speeds, the processor is
capable of generating large current swings. This may cause voltages on power planes
to sag below their minimum specified values if bulk decoupling is not adequate. Larger
bulk storage (CBULK), such as electrolytic or aluminum-polymer capacitors, supply
current during longer lasting changes in current demand by the component, such as
coming out of an idle condition. Similarly, they act as a storage well for current when
entering an idle condition from a running condition. The motherboard must be designed
to ensure that the voltage provided to the processor remains within the specifications
listed in Table 4. Failure to do so can result in timing violations or reduced lifetime of
the component.
2.2.1 VCC Decoupling

VCC regulator solutions need to provide sufficient decoupling capacitance to satisfy the
processor voltage specifications. This includes bulk capacitance with low effective series
resistance (ESR) to keep the voltage rail within specifications during large swings in
load current. In addition, ceramic decoupling capacitors are required to filter high
frequency content generated by the front side bus and processor activity. Consult the
Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For
Desktop LGA775 Socket for further information. Contact your Intel field representative
for additional information.
2.2.2 VTT Decoupling

Decoupling must be provided on the motherboard. Decoupling solutions must be sized
to meet the expected load. To ensure compliance with the specifications, various
factors associated with the power delivery solution must be considered including
regulator type, power plane and trace sizing, and component placement. A
conservative decoupling solution would consist of a combination of low ESR bulk
capacitors and high frequency ceramic capacitors.
Datasheet 13
2.2.3 FSB Decoupling

The processor integrates signal termination on the die. In addition, some of the high
frequency capacitance required for the FSB is included on the processor package.
However, additional high frequency capacitance must be added to the motherboard to
properly decouple the return currents from the front side bus. Bulk decoupling must
also be provided by the motherboard for proper [A]GTL+ bus operation.
2.3 Voltage Identification

The Voltage Identification (VID) specification for the processor is defined by the Voltage
Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop
LGA775 Socket. The voltage set by the VID signals is the reference VR output voltage
to be delivered to the processor VCC lands (see Chapter 2.6.3 for VCC overshoot
specifications). Refer to Table 13 for the DC specifications for these signals. Voltages
for each processor frequency is provided in Table 4.
Note: To support the Deeper Sleep State the platform must use a VRD 11.1 compliant
solution. The Deeper Sleep State also requires additional platform support.
Individual processor VID values may be calibrated during manufacturing such that two
devices at the same core speed may have different default VID settings. This is
reflected by the VID Range values provided in Table 4. Refer to the Intel® Core™2 Duo
Processor E8000 and E7000 Series Specification Update for further details on specific
valid core frequency and VID values of the processor. Note that this differs from the
VID employed by the processor during a power management event (Thermal Monitor 2,
Enhanced Intel SpeedStep® technology, or Extended HALT State).
The processor uses eight voltage identification signals, VID[7:0], to support automatic
selection of power supply voltages. Table 2 specifies the voltage level corresponding to
the state of VID[7:0]. A ‘1’ in this table refers to a high voltage level and a ‘0’ refers to
a low voltage level. If the processor socket is empty (VID[7:0] = 11111110), or the
voltage regulation circuit cannot supply the voltage that is requested, it must disable
itself.
The processor provides the ability to operate while transitioning to an adjacent VID and
its associated processor core voltage (VCC). This will represent a DC shift in the load
line. It should be noted that a low-to-high or high-to-low voltage state change may
result in as many VID transitions as necessary to reach the target core voltage.
Transitions above the specified VID are not permitted. Table 4 includes VID step sizes
and DC shift ranges. Minimum and maximum voltages must be maintained as shown in
Table 5, Figure 1, Table 6, and Figure 2, as measured across the VCC_SENSE and
VSS_SENSE lands.
The VRM or VRD utilized must be capable of regulating its output to the value defined
by the new VID. DC specifications for dynamic VID transitions are included in Table 4
and Table 5. Refer to the Voltage Regulator Design Guide for further details.
14 Datasheet
Table 2. Voltage Identification Definition

VID VID VID VID VID VID VID VID VID VID VID VID VID VID VID VID
Voltage Voltage
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
0 0 0 0 0 0 0 0 OFF 0 1 0 1 1 1 0 0 1.0375
0 0 0 0 0 0 1 0 1.6 0 1 0 1 1 1 1 0 1.025
0 0 0 0 0 1 0 0 1.5875 0 1 1 0 0 0 0 0 1.0125
0 0 0 0 0 1 1 0 1.575 0 1 1 0 0 0 1 0 1
0 0 0 0 1 0 0 0 1.5625 0 1 1 0 0 1 0 0 0.9875
0 0 0 0 1 0 1 0 1.55 0 1 1 0 0 1 1 0 0.975
0 0 0 0 1 1 0 0 1.5375 0 1 1 0 1 0 0 0 0.9625
0 0 0 0 1 1 1 0 1.525 0 1 1 0 1 0 1 0 0.95
0 0 0 1 0 0 0 0 1.5125 0 1 1 0 1 1 0 0 0.9375
0 0 0 1 0 0 1 0 1.5 0 1 1 0 1 1 1 0 0.925
0 0 0 1 0 1 0 0 1.4875 0 1 1 1 0 0 0 0 0.9125
0 0 0 1 0 1 1 0 1.475 0 1 1 1 0 0 1 0 0.9
0 0 0 1 1 0 0 0 1.4625 0 1 1 1 0 1 0 0 0.8875
0 0 0 1 1 0 1 0 1.45 0 1 1 1 0 1 1 0 0.875
0 0 0 1 1 1 0 0 1.4375 0 1 1 1 1 0 0 0 0.8625
0 0 0 1 1 1 1 0 1.425 0 1 1 1 1 0 1 0 0.85
0 0 1 0 0 0 0 0 1.4125 0 1 1 1 1 1 0 0 0.8375
0 0 1 0 0 0 1 0 1.4 0 1 1 1 1 1 1 0 0.825
0 0 1 0 0 1 0 0 1.3875 1 0 0 0 0 0 0 0 0.8125
0 0 1 0 0 1 1 0 1.375 1 0 0 0 0 0 1 0 0.8
0 0 1 0 1 0 0 0 1.3625 1 0 0 0 0 1 0 0 0.7875
0 0 1 0 1 0 1 0 1.35 1 0 0 0 0 1 1 0 0.775
0 0 1 0 1 1 0 0 1.3375 1 0 0 0 1 0 0 0 0.7625
0 0 1 0 1 1 1 0 1.325 1 0 0 0 1 0 1 0 0.75
0 0 1 1 0 0 0 0 1.3125 1 0 0 0 1 1 0 0 0.7375
0 0 1 1 0 0 1 0 1.3 1 0 0 0 1 1 1 0 0.725
0 0 1 1 0 1 0 0 1.2875 1 0 0 1 0 0 0 0 0.7125
0 0 1 1 0 1 1 0 1.275 1 0 0 1 0 0 1 0 0.7
0 0 1 1 1 0 0 0 1.2625 1 0 0 1 0 1 0 0 0.6875
0 0 1 1 1 0 1 0 1.25 1 0 0 1 0 1 1 0 0.675
0 0 1 1 1 1 0 0 1.2375 1 0 0 1 1 0 0 0 0.6625
0 0 1 1 1 1 1 0 1.225 1 0 0 1 1 0 1 0 0.65
0 1 0 0 0 0 0 0 1.2125 1 0 0 1 1 1 0 0 0.6375
0 1 0 0 0 0 1 0 1.2 1 0 0 1 1 1 1 0 0.625
0 1 0 0 0 1 0 0 1.1875 1 0 1 0 0 0 0 0 0.6125
0 1 0 0 0 1 1 0 1.175 1 0 1 0 0 0 1 0 0.6
0 1 0 0 1 0 0 0 1.1625 1 0 1 0 0 1 0 0 0.5875
0 1 0 0 1 0 1 0 1.15 1 0 1 0 0 1 1 0 0.575
0 1 0 0 1 1 0 0 1.1375 1 0 1 0 1 0 0 0 0.5625
0 1 0 0 1 1 1 0 1.125 1 0 1 0 1 0 1 0 0.55
0 1 0 1 0 0 0 0 1.1125 1 0 1 0 1 1 0 0 0.5375
0 1 0 1 0 0 1 0 1.1 1 0 1 0 1 1 1 0 0.525
0 1 0 1 0 1 0 0 1.0875 1 0 1 1 0 0 0 0 0.5125
0 1 0 1 0 1 1 0 1.075 1 0 1 1 0 0 1 0 0.5
0 1 0 1 1 0 0 0 1.0625 1 1 1 1 1 1 1 0 OFF
0 1 0 1 1 0 1 0 1.05
Datasheet 15
2.4 Reserved, Unused, and TESTHI Signals

All RESERVED lands must remain unconnected. Connection of these lands to VCC, VSS,
VTT, or to any other signal (including each other) can result in component malfunction
or incompatibility with future processors. See Chapter 4 for a land listing of the
processor and the location of all RESERVED lands.
In a system level design, on-die termination has been included by the processor to
allow signals to be terminated within the processor silicon. Most unused GTL+ inputs
should be left as no connects as GTL+ termination is provided on the processor silicon.
However, see Table 8 for details on GTL+ signals that do not include on-die termination.
Unused active high inputs, should be connected through a resistor to ground (VSS).
Unused outputs can be left unconnected, however this may interfere with some TAP
functions, complicate debug probing, and prevent boundary scan testing. A resistor
must be used when tying bidirectional signals to power or ground. When tying any
signal to power or ground, a resistor will also allow for system testability. Resistor
values should be within ± 20% of the impedance of the motherboard trace for front
side bus signals. For unused GTL+ input or I/O signals, use pull-up resistors of the
same value as the on-die termination resistors (RTT). For details see Table 15.
TAP and CMOS signals do not include on-die termination. Inputs and utilized outputs
must be terminated on the motherboard. Unused outputs may be terminated on the
motherboard or left unconnected. Note that leaving unused outputs unterminated may
interfere with some TAP functions, complicate debug probing, and prevent boundary
scan testing.
All TESTHI[12,10:0] lands should be individually connected to VTT using a pull-up

resistor which matches the nominal trace impedance.
The TESTHI signals may use individual pull-up resistors or be grouped together as
detailed below. A matched resistor must be used for each group:
• TESTHI[1:0]
• TESTHI[7:2]
• TESTHI8/FC42 – cannot be grouped with other TESTHI signals
• TESTHI10 – cannot be grouped with other TESTHI signals
Terminating multiple TESTHI pins together with a single pull-up resistor is not
recommended for designs supporting boundary scan for proper Boundary Scan testing
of the TESTHI signals. For optimum noise margin, all pull-up resistor values used for
TESTHI[12,10:0] lands should have a resistance value within ± 20% of the impedance
of the board transmission line traces. For example, if the nominal trace impedance is
50 Ω, then a value between 40 Ω and 60 Ω should be used.
2.5 Power Segment Identifier (PSID)

Power Segment Identifier (PSID) is a mechanism to prevent booting under mismatched
power requirement situations. The PSID mechanism enables BIOS to detect if the
processor in use requires more power than the platform voltage regulator (VR) is
capable of supplying. For example, a 130 W TDP processor installed in a board with a
65 W or 95 W TDP capable VR may draw too much power and cause a potential VR
issue.
16 Datasheet
2.6 Voltage and Current Specification

2.6.1 Absolute Maximum and Minimum Ratings
Table 3 specifies absolute maximum and minimum ratings only and lie outside the
functional limits of the processor. Within functional operation limits, functionality and
long-term reliability can be expected.
At conditions outside functional operation condition limits, but within absolute

maximum and minimum ratings, neither functionality nor long-term reliability can be
expected. If a device is returned to conditions within functional operation limits after
having been subjected to conditions outside these limits, but within the absolute
maximum and minimum ratings, the device may be functional, but with its lifetime
degraded depending on exposure to conditions exceeding the functional operation
condition limits.
At conditions exceeding absolute maximum and minimum ratings, neither functionality

nor long-term reliability can be expected. Moreover, if a device is subjected to these
conditions for any length of time then, when returned to conditions within the
functional operating condition limits, it will either not function, or its reliability will be
severely degraded.
Although the processor contains protective circuitry to resist damage from static
electric discharge, precautions should always be taken to avoid high static voltages or
electric fields.
Table 3. Absolute Maximum and Minimum Ratings
Symbol Parameter Min Max Unit Notes1, 2
VCC Core voltage with respect to VSS –0.3 1.45 V -

FSB termination voltage with
VTT –0.3 1.45 V -
respect to VSS
See See
TCASE Processor case temperature °C -
Section 5 Section 5
TSTORAGE Processor storage temperature –40 85 °C 3, 4, 5
NOTES:
1. For functional operation, all processor electrical, signal quality, mechanical and thermal
specifications must be satisfied.
2. Excessive overshoot or undershoot on any signal will likely result in permanent damage to
the processor.
3. Storage temperature is applicable to storage conditions only. In this scenario, the
processor must not receive a clock, and no lands can be connected to a voltage bias.
Storage within these limits will not affect the long-term reliability of the device. For
functional operation, refer to the processor case temperature specifications.
4. This rating applies to the processor and does not include any tray or packaging.
5. Failure to adhere to this specification can affect the long term reliability of the processor.
Datasheet 17
2.6.2 DC Voltage and Current Specification
Table 4. Voltage and Current Specifications
Symbol Parameter Min Typ Max Unit Notes2, 10
VID Range VID 0.8500 — 1.3625 V 1

Processor Number VCC for
(6 MB Cache): 775_VR_CONFIG_06:
E8600 3.33 GHz
E8500 3.16 GHz
Refer to Table 5, Figure 1
E8400 3 GHz
E8300 2.83 GHz
E8200 2.66 GHz
Core VCC E8190 2.66 GHz V 3, 4, 5
E7600 3.06 GHz
E7500 2.93 GHz Refer to Table 6, Figure 2
E7400 2.80 GHz
E7300 2.66 GHz
E7200 2.53 GHz
VCC_BOOT Default VCC voltage for initial power up — 1.10 — V
VCCPLL PLL VCC - 5% 1.50 + 5% V
Product Number ICC for
E8600 3.33 GHz 75
E8500 3.16 GHz 75
— — A 6
E8400 3 GHz 75
E8300 2.83 GHz 75
E8200 2.66 GHz 75
ICC E8190 2.66 GHz 75
E7600 3.06 GHz 75
E7500 2.93 GHz — — 75 A
E7400 2.80 GHz 75
E7300 2.66 GHz 75
E7200 2.53 GHz 75
FSB termination on Intel 3 series

1.045 1.1 1.155
voltage Chipset family boards
VTT V 7, 8
(DC + AC on Intel 4 series
specifications) 1.14 1.2 1.26
Chipset family boards
VTT_OUT_LEFT
DC Current that may be drawn from
and
VTT_OUT_LEFT and VTT_OUT_RIGHT per — — 580 mA
VTT_OUT_RIGHT
land
ICC
18 Datasheet
Table 4. Voltage and Current Specifications
Symbol Parameter Min Typ Max Unit Notes2, 10
ICC for VTT supply before VCC stable 4.5

ITT — — A 9
ICC for VTT supply after VCC stable 4.6
ICC_VCCPLL ICC for PLL land — — 130 mA
ICC_GTLREF ICC for GTLREF — — 200 µA
NOTES:
1. Each processor is programmed with a maximum valid voltage identification value (VID),
which is set at manufacturing and can not be altered. Individual maximum VID values are
calibrated during manufacturing such that two processors at the same frequency may have
different settings within the VID range. Note that this differs from the VID employed by the
processor during a power management event (Thermal Monitor 2, Enhanced Intel
SpeedStep® technology, or Extended HALT State).
2. Unless otherwise noted, all specifications in this table are based on estimates and
simulations or empirical data. These specifications will be updated with characterized data
from silicon measurements at a later date.
3. These voltages are targets only. A variable voltage source should exist on systems in the
event that a different voltage is required. See Section 2.3 and Table 2 for more
information.
4. The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE
lands at the socket with a 100 MHz bandwidth oscilloscope, 1.5 pF maximum probe
capacitance, and 1 MΩ minimum impedance. The maximum length of ground wire on the
probe should be less than 5 mm. Ensure external noise from the system is not coupled into
the oscilloscope probe.
5. Refer to Table 5, Figure 1, Table 6, and Figure 2 for the minimum, typical, and maximum
VCC allowed for a given current. The processor should not be subjected to any VCC and ICC
combination wherein VCC exceeds VCC_MAX for a given current.
6. ICC_MAX specification is based on VCC_MAX loadline. Refer to Figure 1 for details.
7. VTT must be provided using a separate voltage source and not be connected to VCC. This
specification is measured at the land.
8. Baseboard bandwidth is limited to 20 MHz.
9. This is the maximum total current drawn from the VTT plane by only the processor. This
specification does not include the current coming from on-board termination (RTT),
through the signal line. Refer to the Voltage Regulator Design Guide to determine the total
ITT drawn by the system. This parameter is based on design characterization and is not
tested.
10. Adherence to the voltage specifications for the processor are required to ensure reliable
processor operation.
Datasheet 19
Table 5. Intel® Core™2 Duo Processor E8000 Series VCC Static and Transient
Tolerance
Voltage Deviation from VID Setting (V)1, 2, 3, 4
ICC (A) Maximum Voltage Typical Voltage Minimum Voltage
1.40 mΩ 1.48 mΩ 1.55 mΩ
0 0.000 -0.019 -0.038
5 -0.007 -0.026 -0.046
10 -0.014 -0.034 -0.054
15 -0.021 -0.041 -0.061
20 -0.028 -0.049 -0.069
25 -0.035 -0.056 -0.077
30 -0.042 -0.063 -0.085
35 -0.049 -0.071 -0.092
40 -0.056 -0.078 -0.100
45 -0.063 -0.085 -0.108
50 -0.070 -0.093 -0.116
55 -0.077 -0.100 -0.123
60 -0.084 -0.108 -0.131
65 -0.091 -0.115 -0.139
70 -0.098 -0.122 -0.147
75 -0.105 -0.130 -0.154
NOTES:
1. The loadline specification includes both static and transient limits except for overshoot
allowed as shown in Section 2.6.3.
2. This table is intended to aid in reading discrete points on Figure 1.
3. The loadlines specify voltage limits at the die measured at the VCC_SENSE and
VSS_SENSE lands. Voltage regulation feedback for voltage regulator circuits must be taken
from processor VCC and VSS lands. Refer to the Voltage Regulator Design Guide for socket
loadline guidelines and VR implementation details.
4. Adherence to this loadline specification is required to ensure reliable processor operation.
20 Datasheet
Figure 1. Intel® Core™2 Duo Processor E8000 Series VCC Static and Transient
Tolerance
Icc [A]
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75
VID - 0.000
VID - 0.013
VID - 0.025 Vcc Maximum
VID - 0.038
VID - 0.050
VID - 0.063
VID - 0.075 Vcc Typical

Vcc [V]
VID - 0.088
VID - 0.100
Vcc Minimum
VID - 0.113
VID - 0.125
VID - 0.138
VID - 0.150
VID - 0.163
NOTES:
1. The loadline specification includes both static and transient limits except for overshoot
allowed as shown in Section 2.6.3.
2. This loadline specification shows the deviation from the VID set point.
3. The loadlines specify voltage limits at the die measured at the VCC_SENSE and
VSS_SENSE lands. Voltage regulation feedback for voltage regulator circuits must be taken
from processor VCC and VSS lands. Refer to the Voltage Regulator Design Guide for socket
loadline guidelines and VR implementation details.
Datasheet 21
Table 6. Intel® Core™2 Duo Processor E7000 Series VCC Static and Transient
Tolerance
Voltage Deviation from VID Setting (V)1, 2, 3, 4
ICC (A)
Maximum Voltage Typical Voltage Minimum Voltage
1.65 mΩ 1.73 mΩ 1.80 mΩ
0 0.000 -0.019 -0.038

5 -0.008 -0.028 -0.047
10 -0.017 -0.036 -0.056
15 -0.025 -0.045 -0.065
20 -0.033 -0.054 -0.074
25 -0.041 -0.062 -0.083
30 -0.050 -0.071 -0.092
35 -0.058 -0.079 -0.101
40 -0.066 -0.088 -0.110
45 -0.074 -0.097 -0.119
50 -0.083 -0.105 -0.128
55 -0.091 -0.114 -0.137
60 -0.099 -0.123 -0.146
65 -0.107 -0.131 -0.155
70 -0.116 -0.140 -0.164
75 -0.124 -0.148 -0.173
NOTES:
1. The loadline specification includes both static and transient limits except for overshoot allowed as shown in
Section 2.6.3.
2. This table is intended to aid in reading discrete points on Figure 1.
3. The loadlines specify voltage limits at the die measured at the VCC_SENSE and VSS_SENSE lands. Voltage
regulation feedback for voltage regulator circuits must be taken from processor VCC and VSS lands. Refer
to the Voltage Regulator Design Guide for socket loadline guidelines and VR implementation details.
4. Adherence to this loadline specification is required to ensure reliable processor operation.
22 Datasheet
Figure 2. Intel® Core™2 Duo Processor E7000 Series VCC Static and Transient
Tolerance
Icc [A]
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75
VID - 0.000
VID - 0.013
VID - 0.025
Vcc Maximum
VID - 0.038
VID - 0.050
VID - 0.063
VID - 0.075
VID - 0.088 Vcc Typical

Vcc [V]
VID - 0.100
VID - 0.113
VID - 0.125 Vcc Minimum
VID - 0.138
VID - 0.150
VID - 0.163
VID - 0.175
VID - 0.188
NOTES:
1. The loadline specification includes both static and transient limits except for overshoot allowed as shown in
Section 2.6.3.
2. This loadline specification shows the deviation from the VID set point.
3. The loadlines specify voltage limits at the die measured at the VCC_SENSE and VSS_SENSE lands. Voltage
regulation feedback for voltage regulator circuits must be taken from processor VCC and VSS lands. Refer
to the Voltage Regulator Design Guide for socket loadline guidelines and VR implementation details.
2.6.3 VCC Overshoot

The processor can tolerate short transient overshoot events where VCC exceeds the VID
voltage when transitioning from a high to low current load condition. This overshoot
cannot exceed VID + VOS_MAX (VOS_MAX is the maximum allowable overshoot voltage).
The time duration of the overshoot event must not exceed TOS_MAX (TOS_MAX is the
maximum allowable time duration above VID). These specifications apply to the
processor die voltage as measured across the VCC_SENSE and VSS_SENSE lands.
Table 7. VCC Overshoot Specifications
Symbol Parameter Min Max Unit Figure Notes
Magnitude of VCC overshoot above 1

VOS_MAX — 50 mV 3
VID
Time duration of VCC overshoot above 1
TOS_MAX — 25 µs 3
VID
NOTES:
1. Adherence to these specifications is required to ensure reliable processor operation.
Datasheet 23
Figure 3. VCC Overshoot Example Waveform
Example Overshoot Waveform

VOS
VID + 0.050
Voltage [V]
VID - 0.000
TOS
0 5 10 15 20 25
Time [us]
TOS: Overshoot time above VID

VOS: Overshoot above VID
NOTES:
1. VOS is measured overshoot voltage.
2. TOS is measured time duration above VID.
2.6.4 Die Voltage Validation

Overshoot events on processor must meet the specifications in Table 7 when measured
across the VCC_SENSE and VSS_SENSE lands. Overshoot events that are < 10 ns in
duration may be ignored. These measurements of processor die level overshoot must
be taken with a bandwidth limited oscilloscope set to a greater than or equal to
100 MHz bandwidth limit.
2.7 Signaling Specifications

Most processor Front Side Bus signals use Gunning Transceiver Logic (GTL+) signaling
technology. This technology provides improved noise margins and reduced ringing
through low voltage swings and controlled edge rates. Platforms implement a
termination voltage level for GTL+ signals defined as VTT. Because platforms implement
separate power planes for each processor (and chipset), separate VCC and VTT supplies
are necessary. This configuration allows for improved noise tolerance as processor
frequency increases. Speed enhancements to data and address busses have caused
signal integrity considerations and platform design methods to become even more
critical than with previous processor families.
The GTL+ inputs require a reference voltage (GTLREF) which is used by the receivers to
determine if a signal is a logical 0 or a logical 1. GTLREF must be generated on the
motherboard (see Table 15 for GTLREF specifications). Termination resistors (RTT) for
GTL+ signals are provided on the processor silicon and are terminated to VTT. Intel
chipsets will also provide on-die termination, thus eliminating the need to terminate the
bus on the motherboard for most GTL+ signals.
24 Datasheet
2.7.1 FSB Signal Groups

The front side bus signals have been combined into groups by buffer type. GTL+ input
signals have differential input buffers, which use GTLREF[1:0] as a reference level. In
this document, the term “GTL+ Input” refers to the GTL+ input group as well as the
GTL+ I/O group when receiving. Similarly, “GTL+ Output” refers to the GTL+ output
group as well as the GTL+ I/O group when driving.
With the implementation of a source synchronous data bus comes the need to specify
two sets of timing parameters. One set is for common clock signals which are
dependent upon the rising edge of BCLK0 (ADS#, HIT#, HITM#, etc.) and the second
set is for the source synchronous signals which are relative to their respective strobe
lines (data and address) as well as the rising edge of BCLK0. Asychronous signals are
still present (A20M#, IGNNE#, etc.) and can become active at any time during the
clock cycle. Table 8 identifies which signals are common clock, source synchronous,
and asynchronous.
Table 8. FSB Signal Groups
Signal Group Type Signals1
GTL+ Common Synchronous to

BPRI#, DEFER#, RESET#, RS[2:0]#, TRDY#
Clock Input BCLK[1:0]
GTL+ Common Synchronous to ADS#, BNR#, BPM[5:0]#, BR0#3, DBSY#, DRDY#,
Clock I/O BCLK[1:0] HIT#, HITM#, LOCK#
Signals Associated Strobe

3
REQ[4:0]#, A[16:3]# ADSTB0#
GTL+ Source Synchronous to A[35:17]#3 ADSTB1#
Synchronous I/O assoc. strobe D[15:0]#, DBI0# DSTBP0#, DSTBN0#
D[31:16]#, DBI1# DSTBP1#, DSTBN1#
Synchronous to
GTL+ Strobes ADSTB[1:0]#, DSTBP[3:0]#, DSTBN[3:0]#
BCLK[1:0]
A20M#, DPRSTP#. DPSLP#, IGNNE#, INIT#, LINT0/
CMOS INTR, LINT1/NMI, SMI#3, STPCLK#, PWRGOOD, SLP#,
TCK, TDI, TMS, TRST#, BSEL[2:0], VID[7:0], PSI#
Open Drain Output FERR#/PBE#, IERR#, THERMTRIP#, TDO
Open Drain Input/
PROCHOT#4
Output
FSB Clock Clock BCLK[1:0], ITP_CLK[1:0]2
VCC, VTT, VCCA, VCCIOPLL, VCCPLL, VSS, VSSA,
GTLREF[1:0], COMP[8,3:0], RESERVED,
TESTHI[12,10:0], VCC_SENSE,
Power/Other
VCC_MB_REGULATION, VSS_SENSE,
VSS_MB_REGULATION, DBR#2, VTT_OUT_LEFT,
VTT_OUT_RIGHT, VTT_SEL, FCx, PECI, MSID[1:0]
NOTES:
1. Refer to Section 4.2 for signal descriptions.
2. In processor systems where no debug port is implemented on the system board, these
signals are used to support a debug port interposer. In systems with the debug port
implemented on the system board, these signals are no connects.
Datasheet 25
3. The value of these signals during the active-to-inactive edge of RESET# defines the
processor configuration options. See Section 6.1 for details.
4. PROCHOT# signal type is open drain output and CMOS input.
.
Table 9. Signal Characteristics
Signals with RTT Signals with No RTT
A20M#, BCLK[1:0], BPM[5:0]#, BSEL[2:0],

A[35:3]#, ADS#, ADSTB[1:0]#, BNR#, BPRI#, COMP[8,3:0], FERR#/PBE#, IERR#, IGNNE#,
D[63:0]#, DBI[3:0]#, DBSY#, DEFER#, INIT#, ITP_CLK[1:0], LINT0/INTR, LINT1/
DRDY#, DSTBN[3:0]#, DSTBP[3:0]#, HIT#, NMI, MSID[1:0], PWRGOOD, RESET#, SMI#,
HITM#, LOCK#, PROCHOT#, REQ[4:0]#, STPCLK#, TDO, TESTHI[12,10:0],
RS[2:0]#, TRDY# THERMTRIP#, VID[7:0], GTLREF[1:0], TCK,
TDI, TMS, TRST#, VTT_SEL
Open Drain Signals1
THERMTRIP#, FERR#/PBE#, IERR#, BPM[5:0]#,

BR0#, TDO, FCx
NOTES:
1. Signals that do not have RTT, nor are actively driven to their high-voltage level.
Table 10. Signal Reference Voltages
GTLREF VTT/2
BPM[5:0]#, RESET#, BNR#, HIT#, HITM#, BR0#,

A20M#, LINT0/INTR, LINT1/NMI,
A[35:0]#, ADS#, ADSTB[1:0]#, BPRI#, D[63:0]#,
IGNNE#, INIT#, PROCHOT#,
DBI[3:0]#, DBSY#, DEFER#, DRDY#, DSTBN[3:0]#,
PWRGOOD1, SMI#, STPCLK#, TCK1,
DSTBP[3:0]#, LOCK#, REQ[4:0]#, RS[2:0]#,
TDI1, TMS1, TRST#1
TRDY#
NOTE:
1. See Table 12 for more information.
2.7.2 CMOS and Open Drain Signals

Legacy input signals such as A20M#, IGNNE#, INIT#, SMI#, and STPCLK# use CMOS
input buffers. All of the CMOS and Open Drain signals are required to be asserted/de-
asserted for at least eight BCLKs in order for the processor to recognize the proper
signal state. See Section 2.7.3 for the DC specifications. See Section 6.2 for additional
timing requirements for entering and leaving the low power states.
26 Datasheet
2.7.3 Processor DC Specifications

The processor DC specifications in this section are defined at the processor core (pads)
unless otherwise stated. All specifications apply to all frequencies and cache sizes
unless otherwise stated.
Table 11. GTL+ Signal Group DC Specifications
Symbol Parameter Min Max Unit Notes1
VIL Input Low Voltage -0.10 GTLREF – 0.10 V 2, 5

VIH Input High Voltage GTLREF + 0.10 VTT + 0.10 V 3, 4, 5
VOH Output High Voltage VTT – 0.10 VTT V 4, 5
VTT_MAX /
IOL Output Low Current N/A A -
[(RTT_MIN) + (2 * RON_MIN)]
Input Leakage
ILI N/A ± 100 µA 6
Current
Output Leakage
ILO N/A ± 100 µA 7
Current
RON Buffer On Resistance 7.49 9.16 Ω
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. VIL is defined as the voltage range at a receiving agent that will be interpreted as a logical
low value.
3. VIH is defined as the voltage range at a receiving agent that will be interpreted as a logical
high value.
4. VIH and VOH may experience excursions above VTT.
5. The VTT referred to in these specifications is the instantaneous VTT.
6. Leakage to VSS with land held at VTT.
7. Leakage to VTT with land held at 300 mV.
Table 12. Open Drain and TAP Output Signal Group DC Specifications
Symbol Parameter Min Max Unit Notes1
VOL Output Low Voltage 0 0.20 V -

IOL Output Low Current 16 50 mA 2
ILO Output Leakage Current N/A ± 200 µA 3
NOTES:
2. Measured at VTT * 0.2 V.
3. For Vin between 0 and VOH.
Datasheet 27
Table 13. CMOS Signal Group DC Specifications
Symb
Parameter Min Max Unit Notes1
ol
VIL Input Low Voltage -0.10 VTT * 0.30 V 3, 6

VIH Input High Voltage VTT * 0.70 VTT + 0.10 V 4, 5, 6
VOL Output Low Voltage -0.10 VTT * 0.10 V 6
VOH Output High Voltage 0.90 * VTT VTT + 0.10 V 2, 5, 6
IOL Output Low Current VTT * 0.10 / 67 VTT * 0.10 / 27 A 6, 7
IOH Output Low Current VTT * 0.10 / 67 VTT * 0.10 / 27 A 6, 7
ILI Input Leakage Current N/A ± 100 µA 8
ILO Output Leakage Current N/A ± 100 µA 9
NOTES:
2. All outputs are open drain.
3. VIL is defined as the voltage range at a receiving agent that will be interpreted as a logical
low value.
4. VIH is defined as the voltage range at a receiving agent that will be interpreted as a logical
high value.
5. VIH and VOH may experience excursions above VTT.
6. The VTT referred to in these specifications refers to instantaneous VTT.
7. IOL is measured at 0.10 * VTT. IOH is measured at 0.90 * VTT.
8. Leakage to VSS with land held at VTT.
9. Leakage to VTT with land held at 300 mV.
28 Datasheet
2.7.3.1 Platform Environment Control Interface (PECI) DC Specifications

PECI is an Intel proprietary one-wire interface that provides a communication channel
between Intel processors, chipsets, and external thermal monitoring devices. The
processor contains Digital Thermal Sensors (DTS) distributed throughout die. These
sensors are implemented as analog-to-digital converters calibrated at the factory for
reasonable accuracy to provide a digital representation of relative processor
temperature. PECI provides an interface to relay the highest DTS temperature within a
die to external management devices for thermal/fan speed control. More detailed
information may be found in the Platform Environment Control Interface (PECI)
Specification.
Table 14. PECI DC Electrical Limits
Symbol Definition and Conditions Min Max Units Notes1
Vin Input Voltage Range -0.15 VTT V

2
Vhysteresis Hysteresis 0.1 * VTT — V
Vn Negative-edge threshold voltage 0.275 * VTT 0.500 * VTT V
Vp Positive-edge threshold voltage 0.550 * VTT 0.725 * VTT V
High level output source
Isource -6.0 N/A mA
(VOH = 0.75 * VTT)
Low level output sink
Isink 0.5 1.0 mA
(VOL = 0.25 * VTT)
3
Ileak+ High impedance state leakage to VTT N/A 50 µA
Ileak- High impedance leakage to GND N/A 10 µA 3
Cbus Bus capacitance per node N/A 10 pF 4
Signal noise immunity above 300
Vnoise 0.1 * VTT — Vp-p
MHz
NOTES:
1. VTT supplies the PECI interface. PECI behavior does not affect VTT min/max specifications. Refer to Table 4 for
VTT specifications.
2. The leakage specification applies to powered devices on the PECI bus.
3. The input buffers use a Schmitt-triggered input design for improved noise immunity.
4. One node is counted for each client and one node for the system host. Extended trace lengths might appear
as additional nodes.
.
Datasheet 29
2.7.3.2 GTL+ Front Side Bus Specifications

In most cases, termination resistors are not required as these are integrated into the
processor silicon. See Table 9 for details on which GTL+ signals do not include on-die
termination.
Valid high and low levels are determined by the input buffers by comparing with a
reference voltage called GTLREF. Table 15 lists the GTLREF specifications. The GTL+
reference voltage (GTLREF) should be generated on the system board using high
precision voltage divider circuits.
Table 15. GTL+ Bus Voltage Definitions
Symbol Parameter Min Typ Max Units Notes1
GTLREF pull up on Intel

GTLREF_PU 3 Series Chipset family 57.6 * 0.99 57.6 57.6 * 1.01 Ω 2
boards
GTLREF pull down on
GTLREF_PD Intel 3 Series Chipset 100 * 0.99 100 100 * 1.01 Ω 2
family boards
RTT Termination Resistance 45 50 55 Ω 3
COMP[3:0] COMP Resistance 49.40 49.90 50.40 Ω 4
COMP8 COMP Resistance 24.65 24.90 25.15 Ω 4
NOTES:
2. GTLREF is to be generated from VTT by a voltage divider of 1% resistors. If an Adjustable
GTLREF circuit is used on the board (for Quad-Core processors compatibility), the two
GTLREF lands connected to the Adjustable GTLREF circuit require the following:
GTLREF_PU = 50 Ω, GTLREF_PD = 100 Ω.
3. RTT is the on-die termination resistance measured at VTT/3 of the GTL+ output driver.
4. COMP resistance must be provided on the system board with 1% resistors. COMP[3:0] and
COMP8 resistors are to VSS.
30 Datasheet
2.8 Clock Specifications

2.8.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking
BCLK[1:0] directly controls the FSB interface speed as well as the core frequency of the
processor. As in previous generation processors, the processor core frequency is a
multiple of the BCLK[1:0] frequency. The processor bus ratio multiplier will be set at its
default ratio during manufacturing. The processor supports Half Ratios between 7.5
and 13.5, refer to Table 16 for the processor supported ratios.
The processor uses a differential clocking implementation. For more information on the
processor clocking, contact your Intel field representative.
Table 16. Core Frequency to FSB Multiplier Configuration

Multiplication of
Core Frequency Core Frequency
System Core
(266 MHz BCLK/1066 MHz (333 MHz BCLK/ Notes1, 2
Frequency to FSB FSB) 1333 MHz FSB)
Frequency
1/6 1.60 GHz 2 GHz -
1/7 1.86 GHz 2.33 GHz -
1/7.5 2 GHz 2.50 GHz -
1/8 2.13 GHz 2.66 GHz -
1/8.5 2.26 GHz 2.83 GHz -
1/9 2.40 GHz 3 GHz -
1/9.5 2.53 GHz 3.16 GHz -
1/10 2.66 GHz 3.33 GHz -
1/10.5 2.80 GHz 3.50 GHz -
1/11 2.93 GHz 3.66 GHz -
1/11.5 3.06 GHz 3.83 GHz -
1/12 3.20 GHz 4 GHz -
1/12.5 3.33 GHz 4.16 GHz -
1/13 3.46 GHz 4.33 GHz -
1/13.5 3.60GHz 4.50 GHz -
1/14 3.73 GHz 4.66 GHz -
1/15 4 GHz 5 GHz -
NOTES:
1. Individual processors operate only at or below the rated frequency.
2. Listed frequencies are not necessarily committed production frequencies.
Datasheet 31
2.8.2 FSB Frequency Select Signals (BSEL[2:0])

The BSEL[2:0] signals are used to select the frequency of the processor input clock
(BCLK[1:0]). Table 17 defines the possible combinations of the signals and the
frequency associated with each combination. The required frequency is determined by
the processor, chipset, and clock synthesizer. All agents must operate at the same
frequency.
The Intel® Core™2 Duo processor E7000 series operates at a 1333 MHz FSB and
1066 MHz FSB frequency (selected by a 333 MHz BCLK[1:0] or 266 MHz BCLK[1:0]
frequency). The Intel® Core™2 Duo processor E8000 series operates at a 1333 MHz
FSB frequency (selected by a 333 MHz BCLK[1:0] frequency). Individual processors will
only operate at their specified FSB frequency.
For more information about these signals, refer to Section 4.2.
Table 17. BSEL[2:0] Frequency Table for BCLK[1:0]

BSEL2 BSEL1 BSEL0 FSB Frequency
L L L 266 MHz
L L H Reserved
L H H Reserved
L H L Reserved
H H L Reserved
H H H Reserved
H L H Reserved
H L L 333 MHz
2.8.3 Phase Lock Loop (PLL) and Filter

An on-die PLL filter solution will be implemented on the processor. The VCCPLL input is
used for the PLL. Refer to Table 4 for DC specifications.
2.8.4 BCLK[1:0] Specifications
Table 18. Front Side Bus Differential BCLK Specifications
Symbol Parameter Min Typ Max Unit Figure Notes1
VL Input Low Voltage -0.30 N/A N/A V 4

VH Input High Voltage N/A N/A 1.15 V 4
VCROSS(abs) Absolute Crossing Point 0.300 N/A 0.550 V 4 2
ΔVCROSS Range of Crossing Points N/A N/A 0.140 V 4 -
VOS Overshoot N/A N/A 1.4 V 4 3
VUS Undershoot -0.300 N/A N/A V 4 3
VSWING Differential Output Swing 0.300 N/A N/A V 5 4
NOTES:
2. Crossing voltage is defined as the instantaneous voltage value when the rising edge of
BCLK0 equals the falling edge of BCLK1.
3. “Steady state” voltage, not including overshoot or undershoot.
32 Datasheet
4. Overshoot is defined as the absolute value of the maximum voltage. Undershoot is defined
as the absolute value of the minimum voltage.
5. Measurement taken from differential waveform.
Table 19. FSB Differential Clock Specifications (1333 MHz FSB)
T# Parameter Min Nom Max Unit Figure Notes1
BCLK[1:0] Frequency 331.633 — 333.367 MHz - 6

T1: BCLK[1:0] Period 2.99970 — 3.01538 ns 4 2
T2: BCLK[1:0] Period Stability — — 150 ps 4 3
T5: BCLK[1:0] Rise and Fall Slew
2.5 — 8 V/ns 5 4
Rate
Slew Rate Matching N/A N/A 20 % 5
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor core
frequencies based on a 333 MHz BCLK[1:0].
2. The period specified here is the average period. A given period may vary from this
specification as governed by the period stability specification (T2). The Min period
specification is based on -300 PPM deviation from a 3 ns period. The Max period
specification is based on the summation of +300 PPM deviation from a 3 ns period and a
+0.5% maximum variance due to spread spectrum clocking.
3. In this context, period stability is defined as the worst case timing difference between
successive crossover voltages. In other words, the largest absolute difference between
adjacent clock periods must be less than the period stability.
4. Slew rate is measured through the VSWING voltage range centered about differential zero.
Measurement taken from differential waveform.
5. Matching applies to rising edge rate for Clock and falling edge rate for Clock#. It is
measured using a ±75 mV window centered on the average cross point where Clock rising
meets Clock# falling. The median cross point is used to calculate the voltage thresholds
the oscilloscope is to use for the edge rate calculations.
6. Duty Cycle (High time/Period) must be between 40 and 60%
Table 20. FSB Differential Clock Specifications (1066 MHz FSB)

T# Parameter Min Nom Max Unit Figure Notes1
BCLK[1:0] Frequency 265.307 — 266.693 MHz - 6
T1: BCLK[1:0] Period 3.74963 — 3.76922 ns 4 2
T2: BCLK[1:0] Period Stability — — 150 ps 4 3
T5: BCLK[1:0] Rise and Fall Slew Rate 2.5 — 8 V/ns 5 4

Slew Rate Matching N/A N/A 20 % - 5
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor core
frequencies based on a 266 MHz BCLK[1:0].
2. The period specified here is the average period. A given period may vary from this
specification as governed by the period stability specification (T2). The Min period
specification is based on -300 PPM deviation from a 3.75 ns period. The Max period
specification is based on the summation of +300 PPM deviation from a 3.75 ns period and
a +0.5% maximum variance due to spread spectrum clocking.
3. In this context, period stability is defined as the worst case timing difference between
successive crossover voltages. In other words, the largest absolute difference between
adjacent clock periods must be less than the period stability.
4. Slew rate is measured through the VSWING voltage range centered about differential zero.
Measurement taken from differential waveform.
Datasheet 33
5. Matching applies to rising edge rate for Clock and falling edge rate for Clock#. It is
measured using a ±75 mV window centered on the average cross point where Clock rising
meets Clock# falling. The median cross point is used to calculate the voltage thresholds
the oscilloscope is to use for the edge rate calculations.
6. Duty Cycle (High time/Period) must be between 40 and 60%
Figure 4. Differential Clock Waveform
Tph
Overshoot
BCLK1 VH
Rising Edge
Ringback
Ringback
Threshold V CROSS (ABS) V CROSS (ABS) Margin
Region
Falling Edge
Ringback
BCLK0
VL
Undershoot
Tpl
Tp
Tp = T1: BCLK[1:0] period

T2: BCLK[1:0] period stability (not shown)
Tph = T3: BCLK[1:0] pulse high time
Tpl = T4: BCLK[1:0] pulse low time
T5: BCLK[1:0] rise time through the threshold region
T6: BCLK[1:0] fall time through the threshold region
Figure 5. Measurement Points for Differential Clock Waveforms
Slew_rise Slew _fall
+150 mV +150mV
0.0V V_swing 0.0V
-150 mV -150mV
Diff
T5 = BCLK[1:0] rise and fall time through the swing region
§§
34 Datasheet
Package Mechanical Specifications
3 Package Mechanical
Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA8) package that
interfaces with the motherboard using an LGA775 socket. The package consists of a
processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS)
is attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink. Figure 6 shows a sketch of
the processor package components and how they are assembled together. Refer to the
LGA775 Socket Mechanical Design Guide for complete details on the LGA775 socket.
The package components shown in Figure 6 include the following:

• Integrated Heat Spreader (IHS)
• Thermal Interface Material (TIM)
• Processor core (die)
• Package substrate
• Capacitors
Figure 6. Processor Package Assembly Sketch
Core (die) TIM

IHS
Substrate
Capacitors
LGA775 Socket
System Board
Processor_Pkg_Assembly_775
NOTE:
1. Socket and motherboard are included for reference and are not part of processor package.
3.1 Package Mechanical Drawing

The package mechanical drawings are shown in Figure 7 and Figure 8. The drawings
include dimensions necessary to design a thermal solution for the processor. These
dimensions include:
• Package reference with tolerances (total height, length, width, etc.)
• IHS parallelism and tilt
• Land dimensions
• Top-side and back-side component keep-out dimensions
• Reference datums
• All drawing dimensions are in mm [in].
• Guidelines on potential IHS flatness variation with socket load plate actuation and
installation of the cooling solution is available in the processor Thermal and
Mechanical Design Guidelines.
Datasheet 35
Figure 7. Processor Package Drawing Sheet 1 of 3
36 Datasheet
Datasheet 37
38 Datasheet
3.2 Processor Component Keep-Out Zones

The processor may contain components on the substrate that define component keep-
out zone requirements. A thermal and mechanical solution design must not intrude into
the required keep-out zones. Decoupling capacitors are typically mounted to either the
topside or land-side of the package substrate. See Figure 7 and Figure 8 for keep-out
zones. The location and quantity of package capacitors may change due to
manufacturing efficiencies but will remain within the component keep-in.
3.3 Package Loading Specifications

Table 21 provides dynamic and static load specifications for the processor package.
These mechanical maximum load limits should not be exceeded during heatsink
assembly, shipping conditions, or standard use condition. Also, any mechanical system
or component testing should not exceed the maximum limits. The processor package
substrate should not be used as a mechanical reference or load-bearing surface for
thermal and mechanical solution. The minimum loading specification must be
maintained by any thermal and mechanical solutions.
.
Table 21. Processor Loading Specifications
Parameter Minimum Maximum Notes
Static 80 N [17 lbf] 311 N [70 lbf] 1, 2, 3

Dynamic - 756 N [170 lbf] 1, 3, 4
NOTES:
1. These specifications apply to uniform compressive loading in a direction normal to the
processor IHS.
2. This is the maximum force that can be applied by a heatsink retention clip. The clip must
also provide the minimum specified load on the processor package.
3. These specifications are based on limited testing for design characterization. Loading limits
are for the package only and do not include the limits of the processor socket.
4. Dynamic loading is defined as an 11 ms duration average load superimposed on the static
load requirement.
3.4 Package Handling Guidelines

Table 22 includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
Table 22. Package Handling Guidelines
Parameter Maximum Recommended Notes
Shear 311 N [70 lbf] 1, 4

Tensile 111 N [25 lbf] 2, 4
Torque 3.95 N-m [35 lbf-in] 3, 4
NOTES:
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top
surface.
2. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the
IHS surface.
3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal
to the IHS top surface.
4. These guidelines are based on limited testing for design characterization.
Datasheet 39
3.5 Package Insertion Specifications

The processor can be inserted into and removed from a LGA775 socket 15 times. The
socket should meet the LGA775 requirements detailed in the LGA775 Socket
Mechanical Design Guide.
3.6 Processor Mass Specification

The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all
the components that are included in the package.
3.7 Processor Materials

Table 23 lists some of the package components and associated materials.
Table 23. Processor Materials
Component Material
Integrated Heat Spreader

Nickel Plated Copper
(IHS)
Substrate Fiber Reinforced Resin
Substrate Lands Gold Plated Copper
3.8 Processor Markings

Figure 10 shows the top-side markings on the processor. This diagram is to aid in the
identification of the processor.
Figure 10. Processor Top-Side Markings Example
INTEL M ©'06 E8500

Intel® Core®2 Duo
SLxxx [COO]
3.16GHZ/6M/1333/06
[FPO] e4
ATPO
S/N
40 Datasheet
3.9 Processor Land Coordinates

Figure 11 shows the top view of the processor land coordinates. The coordinates are
referred to throughout the document to identify processor lands.
.
Figure 11. Processor Land Coordinates and Quadrants, Top View
VCC / VSS
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
AN AN
AM AM
AL AL
AK AK
AJ AJ
AH AH
AG AG
AF AF
AE AE
AD AD
AC AC
AB AB
AA AA
Y Y
W W Address/
V
U
Socket 775 V
U
Common Clock/
T
R
Quadrants T
R
Async
P
N
Top View P
N
M M
L L
K K
J J
H H
G G
F F
E E
D D
C C
B B
A A
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
VTT / Clocks Data
Datasheet 41
42 Datasheet
Land Listing and Signal Descriptions
4 Land Listing and Signal

Descriptions
This chapter provides the processor land assignment and signal descriptions.
4.1 Processor Land Assignments

This section contains the land listings for the processor. The land-out footprint is shown
in Figure 12 and Figure 13. These figures represent the land-out arranged by land
number and they show the physical location of each signal on the package land array
(top view). Table 24 lists the processor lands ordered alphabetically by land (signal)
name. Table 25 lists the processor lands ordered numerically by land number.
Datasheet 43
Figure 12. land-out Diagram (Top View – Left Side)

30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15
AN
VCC VCC VSS VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC
AM VCC VCC VSS VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC
AL VCC VCC VSS VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC
AK VSS VSS VSS VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC
AJ VSS VSS VSS VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC
AH VCC VCC VCC VCC VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC
AG VCC VCC VCC VCC VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC
AF VSS VSS VSS VSS VSS VSS VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC
AE VSS VSS VSS VSS VSS VSS VSS VCC VCC VCC VSS VCC VCC VSS VSS VCC
AD VCC VCC VCC VCC VCC VCC VCC VCC
AC VCC VCC VCC VCC VCC VCC VCC VCC
AB VSS VSS VSS VSS VSS VSS VSS VSS
AA VSS VSS VSS VSS VSS VSS VSS VSS
Y VCC VCC VCC VCC VCC VCC VCC VCC
W VCC VCC VCC VCC VCC VCC VCC VCC
V VSS VSS VSS VSS VSS VSS VSS VSS
U VCC VCC VCC VCC VCC VCC VCC VCC
T VCC VCC VCC VCC VCC VCC VCC VCC
R VSS VSS VSS VSS VSS VSS VSS VSS
P VSS VSS VSS VSS VSS VSS VSS VSS
N VCC VCC VCC VCC VCC VCC VCC VCC
M VCC VCC VCC VCC VCC VCC VCC VCC
L VSS VSS VSS VSS VSS VSS VSS VSS
K VCC VCC VCC VCC VCC VCC VCC VCC
J
VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC FC34 FC31 VCC
H
BSEL1 FC15 VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS FC33 FC32
G BSEL2 BSEL0 BCLK1 TESTHI4 TESTHI5 TESTHI3 TESTHI6 RESET# D47# D44# DSTBN2# DSTBP2# D35# D36# D32# D31#
F RSVD BCLK0 VTT_SEL TESTHI0 TESTHI2 TESTHI7 RSVD VSS D43# D41# VSS D38# D37# VSS D30#
E FC26 VSS VSS VSS VSS FC10 RSVD D45# D42# VSS D40# D39# VSS D34# D33#
D VTT VTT VTT VTT VTT VTT VSS VCCPLL D46# VSS D48# DBI2# VSS D49# RSVD VSS
VCCIO
C VTT VTT VTT VTT VTT VTT VSS VSS D58# DBI3# VSS D54# DSTBP3# VSS D51#
PLL
B VTT VTT VTT VTT VTT VTT VSS VSSA D63# D59# VSS D60# D57# VSS D55# D53#
A VTT VTT VTT VTT VTT VTT FC23 VCCA D62# VSS RSVD D61# VSS D56# DSTBN3# VSS
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15
44 Datasheet
Figure 13. land-out Diagram (Top View – Right Side)

14 13 12 11 10 9 8 7 6 5 4 3 2 1
VID_SEL VSS_MB_RE VCC_MB_ VSS_ VCC_

VCC VSS VCC VCC VSS VCC VCC VSS VSS AN
ECT GULATION REGULATION SENSE SENSE
VCC VSS VCC VCC VSS VCC VCC VID7 FC40 VID6 VSS VID2 VID0 VSS AM
VCC VSS VCC VCC VSS VCC VCC VSS VID3 VID1 VID5 VRDSEL PROCHOT# FC25 AL
VCC VSS VCC VCC VSS VCC VCC VSS FC8 VSS VID4 ITP_CLK0 VSS FC24 AK
VCC VSS VCC VCC VSS VCC VCC VSS A35# A34# VSS ITP_CLK1 BPM0# BPM1# AJ
VCC VSS VCC VCC VSS VCC VCC VSS VSS A33# A32# VSS RSVD VSS AH
VCC VSS VCC VCC VSS VCC VCC VSS A29# A31# A30# BPM5# BPM3# TRST# AG
VCC VSS VCC VCC VSS VCC VCC VSS VSS A27# A28# VSS BPM4# TDO AF
VCC VSS VCC VCC VSS VCC SKTOCC# VSS RSVD VSS RSVD FC18 VSS TCK AE
VCC VSS A22# ADSTB1# VSS FC36 BPM2# TDI AD
VCC VSS VSS A25# RSVD VSS DBR# TMS AC
VCC VSS A17# A24# A26# FC37 IERR# VSS AB
VTT_OUT_
VCC VSS VSS A23# A21# VSS FC39 AA
RIGHT
FC0/
VCC VSS A19# VSS A20# PSII# VSS Y
BOOTSELECT
TESTHI12/
VCC VSS A18# A16# VSS TESTHI1 MSID0 W
FC44
VCC VSS VSS A14# A15# VSS RSVD MSID1 V
VCC VSS A10# A12# A13# FC30 FC29 FC28 U
VCC VSS VSS A9# A11# VSS DPRSTP# COMP1 T
FERR#/
VCC VSS ADSTB0# VSS A8# VSS COMP3 R
PBE#
VCC VSS A4# RSVD VSS INIT# SMI# DPSLP# P
VCC VSS VSS RSVD RSVD VSS IGNNE# PWRGOOD N
VCC VSS REQ2# A5# A7# STPCLK# THERMTRIP# VSS M
VCC VSS VSS A3# A6# VSS SLP# LINT1 L
VCC VSS REQ3# VSS REQ0# A20M# VSS LINT0 K
VTT_OUT_
VCC VCC VCC VCC VCC VCC VCC VSS REQ4# REQ1# VSS FC22 FC3 J
LEFT
H
VSS VSS VSS VSS VSS VSS VSS VSS VSS TESTHI10 FC35 VSS GTLREF1 GTLREF0
TESTHI9/ TESTHI8/
D29# D27# DSTBN1# DBI1# FC38 D16# BPRI# DEFER# RSVD PECI COMP2 FC27 G
FC43 FC42
D28# VSS D24# D23# VSS D18# D17# VSS FC21 RS1# VSS BR0# FC5 F
VSS D26# DSTBP1# VSS D21# D19# VSS RSVD RSVD FC20 HITM# TRDY# VSS E
RSVD D25# VSS D15# D22# VSS D12# D20# VSS VSS HIT# VSS ADS# RSVD D
C
D52# VSS D14# D11# VSS FC41 DSTBN0# VSS D3# D1# VSS LOCK# BNR# DRDY#
VSS COMP8 D13# VSS D10# DSTBP0# VSS D6# D5# VSS D0# RS0# DBSY# VSS B
D50# COMP0 VSS D9# D8# VSS DBI0# D7# VSS D4# D2# RS2# VSS A
14 13 12 11 10 9 8 7 6 5 4 3 2 1
Datasheet 45
Table 24. Alphabetical Land Table 24. Alphabetical Land

Assignments Assignments
Land Signal Buffer Land Signal Buffer
Land Name Direction Land Name Direction
# Type # Type
A3# L5 Source Synch Input/Output BNR# C2 Common Clock Input/Output
A4# P6 Source Synch Input/Output BPM0# AJ2 Common Clock Input/Output
A5# M5 Source Synch Input/Output BPM1# AJ1 Common Clock Input/Output
A6# L4 Source Synch Input/Output BPM2# AD2 Common Clock Input/Output
A7# M4 Source Synch Input/Output BPM3# AG2 Common Clock Input/Output
A8# R4 Source Synch Input/Output BPM4# AF2 Common Clock Input/Output
A9# T5 Source Synch Input/Output BPM5# AG3 Common Clock Input/Output
A10# U6 Source Synch Input/Output BPRI# G8 Common Clock Input
A11# T4 Source Synch Input/Output BR0# F3 Common Clock Input/Output
A12# U5 Source Synch Input/Output BSEL0 G29 Asynch CMOS Output
A13# U4 Source Synch Input/Output BSEL1 H30 Asynch CMOS Output
A14# V5 Source Synch Input/Output BSEL2 G30 Asynch CMOS Output
A15# V4 Source Synch Input/Output COMP0 A13 Power/Other Input
A16# W5 Source Synch Input/Output COMP1 T1 Power/Other Input
A17# AB6 Source Synch Input/Output COMP2 G2 Power/Other Input
A18# W6 Source Synch Input/Output COMP3 R1 Power/Other Input
A19# Y6 Source Synch Input/Output COMP8 B13 Power/Other Input
A20# Y4 Source Synch Input/Output D0# B4 Source Synch Input/Output
A21# AA4 Source Synch Input/Output D1# C5 Source Synch Input/Output
A22# AD6 Source Synch Input/Output D2# A4 Source Synch Input/Output
A23# AA5 Source Synch Input/Output D3# C6 Source Synch Input/Output
A24# AB5 Source Synch Input/Output D4# A5 Source Synch Input/Output
A25# AC5 Source Synch Input/Output D5# B6 Source Synch Input/Output
A26# AB4 Source Synch Input/Output D6# B7 Source Synch Input/Output
A27# AF5 Source Synch Input/Output D7# A7 Source Synch Input/Output
A28# AF4 Source Synch Input/Output D8# A10 Source Synch Input/Output
A29# AG6 Source Synch Input/Output D9# A11 Source Synch Input/Output
A30# AG4 Source Synch Input/Output D10# B10 Source Synch Input/Output
A31# AG5 Source Synch Input/Output D11# C11 Source Synch Input/Output
A32# AH4 Source Synch Input/Output D12# D8 Source Synch Input/Output
A33# AH5 Source Synch Input/Output D13# B12 Source Synch Input/Output
A34# AJ5 Source Synch Input/Output D14# C12 Source Synch Input/Output
A35# AJ6 Source Synch Input/Output D15# D11 Source Synch Input/Output
A20M# K3 Asynch CMOS Input D16# G9 Source Synch Input/Output
ADS# D2 Common Clock Input/Output D17# F8 Source Synch Input/Output
ADSTB0# R6 Source Synch Input/Output D18# F9 Source Synch Input/Output
ADSTB1# AD5 Source Synch Input/Output D19# E9 Source Synch Input/Output
BCLK0 F28 Clock Input D20# D7 Source Synch Input/Output
BCLK1 G28 Clock Input D21# E10 Source Synch Input/Output
46 Datasheet

# Type # Type
D22# D10 Source Synch Input/Output D61# A19 Source Synch Input/Output
D23# F11 Source Synch Input/Output D62# A22 Source Synch Input/Output
D24# F12 Source Synch Input/Output D63# B22 Source Synch Input/Output
D25# D13 Source Synch Input/Output DBI0# A8 Source Synch Input/Output
D26# E13 Source Synch Input/Output DBI1# G11 Source Synch Input/Output
D27# G13 Source Synch Input/Output DBI2# D19 Source Synch Input/Output
D28# F14 Source Synch Input/Output DBI3# C20 Source Synch Input/Output
D29# G14 Source Synch Input/Output DBR# AC2 Power/Other Output
D30# F15 Source Synch Input/Output DBSY# B2 Common Clock Input/Output
D31# G15 Source Synch Input/Output DEFER# G7 Common Clock Input
D32# G16 Source Synch Input/Output DPRSTP# T2 Asynch CMOS Input
D33# E15 Source Synch Input/Output DPSLP# P1 Asynch CMOS Input
D34# E16 Source Synch Input/Output DRDY# C1 Common Clock Input/Output
D35# G18 Source Synch Input/Output DSTBN0# C8 Source Synch Input/Output
D36# G17 Source Synch Input/Output DSTBN1# G12 Source Synch Input/Output
D37# F17 Source Synch Input/Output DSTBN2# G20 Source Synch Input/Output
D38# F18 Source Synch Input/Output DSTBN3# A16 Source Synch Input/Output
D39# E18 Source Synch Input/Output DSTBP0# B9 Source Synch Input/Output
D40# E19 Source Synch Input/Output DSTBP1# E12 Source Synch Input/Output
D41# F20 Source Synch Input/Output DSTBP2# G19 Source Synch Input/Output
D42# E21 Source Synch Input/Output DSTBP3# C17 Source Synch Input/Output
D43# F21 Source Synch Input/Output FC0/

Y1 Power/Other
BOOTSELECT
D44# G21 Source Synch Input/Output
FC3 J2 Power/Other
D45# E22 Source Synch Input/Output
FC5 F2 Power/Other
D46# D22 Source Synch Input/Output
FC8 AK6 Power/Other
D47# G22 Source Synch Input/Output
FC10 E24 Power/Other
FC15 H29 Power/Other
FC18 AE3 Power/Other
D50# A14 Source Synch Input/Output
FC20 E5 Power/Other
D51# C15 Source Synch Input/Output
FC21 F6 Power/Other
FC22 J3 Power/Other
D53# B15 Source Synch Input/Output
FC23 A24 Power/Other
FC24 AK1 Power/Other
FC25 AL1 Power/Other
D56# A17 Source Synch Input/Output
FC26 E29 Power/Other
FC27 G1 Power/Other
FC28 U1 Power/Other
FC29 U2 Power/Other
FC30 U3 Power/Other
Datasheet 47

# Type # Type
FC31 J16 Power/Other RESERVED AE6
FC32 H15 Power/Other RESERVED AH2
FC33 H16 Power/Other RESERVED D1
FC34 J17 Power/Other RESERVED D14
FC35 H4 Power/Other RESERVED D16
FC36 AD3 Power/Other RESERVED E23
FC37 AB3 Power/Other RESERVED E6
FC38 G10 Power/Other RESERVED E7
FC39 AA2 Power/Other RESERVED F23
FC40 AM6 Power/Other RESERVED F29
FC41 C9 Power/Other RESERVED G6
FERR#/PBE# R3 Asynch CMOS Output RESERVED N4
GTLREF0 H1 Power/Other Input RESERVED N5
GTLREF1 H2 Power/Other Input RESERVED P5
HIT# D4 Common Clock Input/Output RESET# G23 Common Clock Input
HITM# E4 Common Clock Input/Output RS0# B3 Common Clock Input
IERR# AB2 Asynch CMOS Output RS1# F5 Common Clock Input
IGNNE# N2 Asynch CMOS Input RS2# A3 Common Clock Input
INIT# P3 Asynch CMOS Input SKTOCC# AE8 Power/Other Output
ITP_CLK0 AK3 TAP Input SLP# L2 Asynch CMOS Input
ITP_CLK1 AJ3 TAP Input SMI# P2 Asynch CMOS Input
LINT0 K1 Asynch CMOS Input STPCLK# M3 Asynch CMOS Input
LINT1 L1 Asynch CMOS Input TCK AE1 TAP Input
LOCK# C3 Common Clock Input/Output TDI AD1 TAP Input
MSID0 W1 Power/Other Output TDO AF1 TAP Output
MSID1 V1 Power/Other Output TESTHI0 F26 Power/Other Input
PECI G5 Power/Other Input/Output TESTHI1 W3 Power/Other Input
PROCHOT# AL2 Asynch CMOS Input/Output TESTHI10 H5 Power/Other Input
PSI# Y3 Asynch CMOS Output TESTHI12/

W2 Power/Other Input
FC44
PWRGOOD N1 Power/Other Input
TESTHI2 F25 Power/Other Input
REQ0# K4 Source Synch Input/Output
TESTHI3 G25 Power/Other Input
REQ1# J5 Source Synch Input/Output
REQ2# M6 Source Synch Input/Output
REQ3# K6 Source Synch Input/Output
REQ4# J6 Source Synch Input/Output
TESTHI7 F24 Power/Other Input
RESERVED V2
TESTHI8/FC42 G3 Power/Other Input
RESERVED A20
TESTHI9/FC43 G4 Power/Other Input
RESERVED AC4
THERMTRIP# M2 Asynch CMOS Output
RESERVED AE4
TMS AC1 TAP Input
48 Datasheet

# Type # Type
TRDY# E3 Common Clock Input VCC AF22 Power/Other
TRST# AG1 TAP Input VCC AF8 Power/Other
VCC AA8 Power/Other VCC AF9 Power/Other
VCC AB8 Power/Other VCC AG11 Power/Other
VCC AC23 Power/Other VCC AG12 Power/Other
VCC AD23 Power/Other VCC AG27 Power/Other
VCC AD29 Power/Other VCC AH11 Power/Other
VCC AE11 Power/Other VCC AH15 Power/Other
VCC AF11 Power/Other VCC AH30 Power/Other
VCC AF15 Power/Other VCC AJ11 Power/Other
Datasheet 49

# Type # Type
VCC AJ18 Power/Other VCC AM19 Power/Other
VCC AK11 Power/Other VCC AM9 Power/Other
VCC AK12 Power/Other VCC AN11 Power/Other
VCC AL11 Power/Other VCC AN30 Power/Other
VCC AL15 Power/Other VCC J10 Power/Other
VCC AM11 Power/Other VCC J23 Power/Other
50 Datasheet

# Type # Type
VCC J28 Power/Other VCC T27 Power/Other
VCC K23 Power/Other VCC U23 Power/Other
VCC L8 Power/Other VCC V8 Power/Other
VCC M23 Power/Other VCC W23 Power/Other
VCC N23 Power/Other VCC Y23 Power/Other
VCC P8 Power/Other VCC_MB_

AN5 Power/Other Output
REGULATION
VCC R8 Power/Other
VCC_SENSE AN3 Power/Other Output
VCC T23 Power/Other
VCCA A23 Power/Other
VCC T24 Power/Other
VCCIOPLL C23 Power/Other
VCC T25 Power/Other
VCCPLL D23 Power/Other
VCC T26 Power/Other
VID_SELECT AN7 Power/Other Output
Datasheet 51

# Type # Type
VID0 AM2 Asynch CMOS Output VSS AB26 Power/Other
VID1 AL5 Asynch CMOS Output VSS AB27 Power/Other
VID2 AM3 Asynch CMOS Output VSS AB28 Power/Other
VID4 AK4 Asynch CMOS Output VSS AB30 Power/Other
VID6 AM5 Asynch CMOS Output VSS AC3 Power/Other
VID7 AM7 Asynch CMOS Output VSS AC6 Power/Other
VRDSEL AL3 Power/Other VSS AC7 Power/Other
VSS B1 Power/Other VSS AD4 Power/Other
VSS B11 Power/Other VSS AD7 Power/Other
VSS B14 Power/Other VSS AE10 Power/Other
VSS A12 Power/Other VSS AE24 Power/Other
VSS AA23 Power/Other VSS AE5 Power/Other
VSS AA24 Power/Other VSS AE7 Power/Other
VSS AA25 Power/Other VSS AF10 Power/Other
VSS AB1 Power/Other VSS AF27 Power/Other
52 Datasheet

# Type # Type
VSS AF30 Power/Other VSS AK2 Power/Other
VSS AG10 Power/Other VSS AK24 Power/Other
VSS AG7 Power/Other VSS AL10 Power/Other
VSS AH1 Power/Other VSS AL13 Power/Other
VSS AH6 Power/Other VSS AM1 Power/Other
VSS AH7 Power/Other VSS AM10 Power/Other
VSS AJ10 Power/Other VSS AM13 Power/Other
VSS AJ29 Power/Other VSS AN1 Power/Other
VSS AK10 Power/Other VSS AN17 Power/Other
Datasheet 53

# Type # Type
VSS AN24 Power/Other VSS H12 Power/Other
VSS C10 Power/Other VSS H17 Power/Other
VSS D12 Power/Other VSS H25 Power/Other
VSS E11 Power/Other VSS J4 Power/Other
VSS E14 Power/Other VSS J7 Power/Other
VSS E17 Power/Other VSS K2 Power/Other
VSS E25 Power/Other VSS L23 Power/Other
VSS F10 Power/Other VSS L28 Power/Other
VSS F7 Power/Other VSS M1 Power/Other
VSS H10 Power/Other VSS M7 Power/Other
VSS H11 Power/Other VSS N3 Power/Other
54 Datasheet

# Type # Type
VSS N6 Power/Other VSS W7 Power/Other
VSS N7 Power/Other VSS Y2 Power/Other
VSS P23 Power/Other VSS Y5 Power/Other
VSS P24 Power/Other VSS Y7 Power/Other
VSS P25 Power/Other VSS_MB_

REGULATION
VSS P26 Power/Other
VSS_SENSE AN4 Power/Other Output
VSS P27 Power/Other
VSSA B23 Power/Other
VSS P28 Power/Other
VTT B25 Power/Other
VSS P29 Power/Other
VTT B26 Power/Other
VSS P30 Power/Other
VTT B27 Power/Other
VSS P4 Power/Other
VTT B28 Power/Other
VSS P7 Power/Other
VTT B29 Power/Other
VSS R2 Power/Other
VTT B30 Power/Other
VSS R23 Power/Other
VTT A25 Power/Other
VSS R24 Power/Other
VTT A26 Power/Other
VSS R25 Power/Other
VTT A27 Power/Other
VSS R26 Power/Other
VTT A28 Power/Other
VSS R27 Power/Other
VTT A29 Power/Other
VSS R28 Power/Other
VTT A30 Power/Other
VSS R29 Power/Other
VTT C25 Power/Other
VSS R30 Power/Other
VTT C26 Power/Other
VSS R5 Power/Other
VTT C27 Power/Other
VSS R7 Power/Other
VTT C28 Power/Other
VSS T3 Power/Other
VTT C29 Power/Other
VSS T6 Power/Other
VTT C30 Power/Other
VSS T7 Power/Other
VTT D25 Power/Other
VSS U7 Power/Other
VTT D26 Power/Other
VSS V23 Power/Other
VTT D27 Power/Other
VSS V24 Power/Other
VTT D28 Power/Other
VSS V25 Power/Other
VTT D29 Power/Other
VSS V26 Power/Other
VTT D30 Power/Other
VSS V27 Power/Other
VTT_OUT_LEFT J1 Power/Other Output
VSS V28 Power/Other
VTT_OUT_RIG
VSS V29 Power/Other AA1 Power/Other Output
HT
VSS V3 Power/Other VTT_SEL F27 Power/Other Output
VSS V30 Power/Other
VSS V6 Power/Other
VSS V7 Power/Other
VSS W4 Power/Other
Datasheet 55
Table 25. Numerical Land Table 25. Numerical Land

Assignment Assignment
Signal Buffer Signal Buffer
Land # Land Name Direction Land # Land Name Direction
Type Type
A2 VSS Power/Other B11 VSS Power/Other
A3 RS2# Common Clock Input B12 D13# Source Synch Input/Output
A4 D02# Source Synch Input/Output B13 COMP8 Power/Other Input
A5 D04# Source Synch Input/Output B14 VSS Power/Other
A6 VSS Power/Other B15 D53# Source Synch Input/Output
A7 D07# Source Synch Input/Output B16 D55# Source Synch Input/Output
A8 DBI0# Source Synch Input/Output B17 VSS Power/Other
A10 D08# Source Synch Input/Output B19 D60# Source Synch Input/Output
A11 D09# Source Synch Input/Output B20 VSS Power/Other
A13 COMP0 Power/Other Input B22 D63# Source Synch Input/Output
A14 D50# Source Synch Input/Output B23 VSSA Power/Other
A15 VSS Power/Other B24 VSS Power/Other
A16 DSTBN3# Source Synch Input/Output B25 VTT Power/Other
A17 D56# Source Synch Input/Output B26 VTT Power/Other
A18 VSS Power/Other B27 VTT Power/Other
A19 D61# Source Synch Input/Output B28 VTT Power/Other
A20 RESERVED B29 VTT Power/Other
A21 VSS Power/Other B30 VTT Power/Other
A22 D62# Source Synch Input/Output C1 DRDY# Common Clock Input/Output
A23 VCCA Power/Other C2 BNR# Common Clock Input/Output
A24 FC23 Power/Other C3 LOCK# Common Clock Input/Output
A25 VTT Power/Other C4 VSS Power/Other
A26 VTT Power/Other C5 D01# Source Synch Input/Output
A27 VTT Power/Other C6 D03# Source Synch Input/Output
A28 VTT Power/Other C7 VSS Power/Other
A29 VTT Power/Other C8 DSTBN0# Source Synch Input/Output
A30 VTT Power/Other C9 FC41 Power/Other
B1 VSS Power/Other C10 VSS Power/Other
B2 DBSY# Common Clock Input/Output C11 D11# Source Synch Input/Output
B3 RS0# Common Clock Input C12 D14# Source Synch Input/Output
B4 D00# Source Synch Input/Output C13 VSS Power/Other
B5 VSS Power/Other C14 D52# Source Synch Input/Output
B6 D05# Source Synch Input/Output C15 D51# Source Synch Input/Output
B8 VSS Power/Other C17 DSTBP3# Source Synch Input/Output
B9 DSTBP0# Source Synch Input/Output C18 D54# Source Synch Input/Output
56 Datasheet

Type Type
C20 DBI3# Source Synch Input/Output D29 VTT Power/Other
C21 D58# Source Synch Input/Output D30 VTT Power/Other
C22 VSS Power/Other E2 VSS Power/Other
C23 VCCIOPLL Power/Other E3 TRDY# Common Clock Input
C24 VSS Power/Other E4 HITM# Common Clock Input/Output
C25 VTT Power/Other E5 FC20 Power/Other
C26 VTT Power/Other E6 RESERVED
C27 VTT Power/Other E7 RESERVED
C28 VTT Power/Other E8 VSS Power/Other
C29 VTT Power/Other E9 D19# Source Synch Input/Output
C30 VTT Power/Other E10 D21# Source Synch Input/Output
D1 RESERVED E11 VSS Power/Other
D2 ADS# Common Clock Input/Output E12 DSTBP1# Source Synch Input/Output
D3 VSS Power/Other E13 D26# Source Synch Input/Output
D4 HIT# Common Clock Input/Output E14 VSS Power/Other
D7 D20# Source Synch Input/Output E17 VSS Power/Other
D8 D12# Source Synch Input/Output E18 D39# Source Synch Input/Output
D11 D15# Source Synch Input/Output E21 D42# Source Synch Input/Output
D13 D25# Source Synch Input/Output E23 RESERVED
D14 RESERVED E24 FC10 Power/Other
D15 VSS Power/Other E25 VSS Power/Other
D16 RESERVED E26 VSS Power/Other
D18 VSS Power/Other E28 VSS Power/Other
D19 DBI2# Source Synch Input/Output E29 FC26 Power/Other
D20 D48# Source Synch Input/Output F2 FC5 Power/Other
D21 VSS Power/Other F3 BR0# Common Clock Input/Output
D22 D46# Source Synch Input/Output F4 VSS Power/Other
D23 VCCPLL Power/Other F5 RS1# Common Clock Input
D24 VSS Power/Other F6 FC21 Power/Other
D25 VTT Power/Other F7 VSS Power/Other
D26 VTT Power/Other F8 D17# Source Synch Input/Output
D27 VTT Power/Other F9 D18# Source Synch Input/Output
D28 VTT Power/Other F10 VSS Power/Other
Datasheet 57

Type Type
F11 D23# Source Synch Input/Output G20 DSTBN2# Source Synch Input/Output
F12 D24# Source Synch Input/Output G21 D44# Source Synch Input/Output
F13 VSS Power/Other G22 D47# Source Synch Input/Output
F14 D28# Source Synch Input/Output G23 RESET# Common Clock Input
F15 D30# Source Synch Input/Output G24 TESTHI6 Power/Other Input
F16 VSS Power/Other G25 TESTHI3 Power/Other Input
F19 VSS Power/Other G28 BCLK1 Clock Input
F20 D41# Source Synch Input/Output G29 BSEL0 Asynch CMOS Output
F21 D43# Source Synch Input/Output G30 BSEL2 Asynch CMOS Output
F22 VSS Power/Other H1 GTLREF0 Power/Other Input
F23 RESERVED H2 GTLREF1 Power/Other Input
F24 TESTHI7 Power/Other Input H3 VSS Power/Other
F25 TESTHI2 Power/Other Input H4 FC35 Power/Other
F26 TESTHI0 Power/Other Input H5 TESTHI10 Power/Other Input
F27 VTT_SEL Power/Other Output H6 VSS Power/Other
F28 BCLK0 Clock Input H7 VSS Power/Other
F29 RESERVED H8 VSS Power/Other
G1 FC27 Power/Other H9 VSS Power/Other
G2 COMP2 Power/Other Input H10 VSS Power/Other
TESTHI8/ H11 VSS Power/Other

G3 Power/Other Input
FC42
H12 VSS Power/Other
TESTHI9/
G4 Power/Other Input H13 VSS Power/Other
FC43
G5 PECI Power/Other Input/Output H14 VSS Power/Other
G6 RESERVED H15 FC32 Power/Other
G7 DEFER# Common Clock Input H16 FC33 Power/Other
G8 BPRI# Common Clock Input H17 VSS Power/Other
G9 D16# Source Synch Input/Output H18 VSS Power/Other
G10 FC38 Power/Other H19 VSS Power/Other
G11 DBI1# Source Synch Input/Output H20 VSS Power/Other
G12 DSTBN1# Source Synch Input/Output H21 VSS Power/Other
G19 DSTBP2# Source Synch Input/Output H28 VSS Power/Other
58 Datasheet

Type Type
H29 FC15 Power/Other K8 VCC Power/Other
H30 BSEL1 Asynch CMOS Output K23 VCC Power/Other
VTT_OUT_LE K24 VCC Power/Other

J1 Power/Other Output
FT
K25 VCC Power/Other
J2 FC3 Power/Other
K26 VCC Power/Other
J3 FC22 Power/Other
K27 VCC Power/Other
J4 VSS Power/Other
K28 VCC Power/Other
J5 REQ1# Source Synch Input/Output
K29 VCC Power/Other
J6 REQ4# Source Synch Input/Output
K30 VCC Power/Other
J7 VSS Power/Other
L1 LINT1 Asynch CMOS Input
J8 VCC Power/Other
L2 SLP# Asynch CMOS Input
J9 VCC Power/Other
L3 VSS Power/Other
J10 VCC Power/Other
L4 A06# Source Synch Input/Output
J11 VCC Power/Other
L5 A03# Source Synch Input/Output
J12 VCC Power/Other
L6 VSS Power/Other
J13 VCC Power/Other
L7 VSS Power/Other
J14 VCC Power/Other
L8 VCC Power/Other
J15 VCC Power/Other
L23 VSS Power/Other
J16 FC31 Power/Other
L24 VSS Power/Other
J17 FC34 Power/Other
L25 VSS Power/Other
J18 VCC Power/Other
L26 VSS Power/Other
J19 VCC Power/Other
L27 VSS Power/Other
J20 VCC Power/Other
L28 VSS Power/Other
J21 VCC Power/Other
L29 VSS Power/Other
J22 VCC Power/Other
L30 VSS Power/Other
J23 VCC Power/Other
M1 VSS Power/Other
J24 VCC Power/Other
THERMTRIP
M2 Asynch CMOS Output
J25 VCC Power/Other #
J26 VCC Power/Other M3 STPCLK# Asynch CMOS Input
J27 VCC Power/Other M4 A07# Source Synch Input/Output
J28 VCC Power/Other M5 A05# Source Synch Input/Output
J29 VCC Power/Other M6 REQ2# Source Synch Input/Output
J30 VCC Power/Other M7 VSS Power/Other
K1 LINT0 Asynch CMOS Input M8 VCC Power/Other
K2 VSS Power/Other M23 VCC Power/Other
K3 A20M# Asynch CMOS Input M24 VCC Power/Other
K4 REQ0# Source Synch Input/Output M25 VCC Power/Other
K6 REQ3# Source Synch Input/Output M27 VCC Power/Other
Datasheet 59

Type Type
M29 VCC Power/Other R6 ADSTB0# Source Synch Input/Output
M30 VCC Power/Other R7 VSS Power/Other
N1 PWRGOOD Power/Other Input R8 VCC Power/Other
N2 IGNNE# Asynch CMOS Input R23 VSS Power/Other
N3 VSS Power/Other R24 VSS Power/Other
N4 RESERVED R25 VSS Power/Other
N5 RESERVED R26 VSS Power/Other
N8 VCC Power/Other R29 VSS Power/Other
N23 VCC Power/Other R30 VSS Power/Other
N24 VCC Power/Other T1 COMP1 Power/Other Input
N25 VCC Power/Other T2 DPRSTP# Asynch CMOS Input
N26 VCC Power/Other T3 VSS Power/Other
N27 VCC Power/Other T4 A11# Source Synch Input/Output
N28 VCC Power/Other T5 A09# Source Synch Input/Output
P1 DPSLP# Asynch CMOS Input T8 VCC Power/Other
P2 SMI# Asynch CMOS Input T23 VCC Power/Other
P3 INIT# Asynch CMOS Input T24 VCC Power/Other
P4 VSS Power/Other T25 VCC Power/Other
P5 RESERVED T26 VCC Power/Other
P6 A04# Source Synch Input/Output T27 VCC Power/Other
P8 VCC Power/Other T29 VCC Power/Other
P24 VSS Power/Other U1 FC28 Power/Other
P27 VSS Power/Other U4 A13# Source Synch Input/Output
P30 VSS Power/Other U7 VSS Power/Other
R1 COMP3 Power/Other Input U8 VCC Power/Other
R2 VSS Power/Other U23 VCC Power/Other
R3 FERR#/PBE# Asynch CMOS Output U24 VCC Power/Other
R4 A08# Source Synch Input/Output U25 VCC Power/Other
R5 VSS Power/Other U26 VCC Power/Other
60 Datasheet

Type Type
U27 VCC Power/Other Y3 PSI# Asynch CMOS Output
U28 VCC Power/Other Y4 A20# Source Synch Input/Output
U29 VCC Power/Other Y5 VSS Power/Other
U30 VCC Power/Other Y6 A19# Source Synch Input/Output
V1 MSID1 Power/Other Output Y7 VSS Power/Other
V2 RESERVED Y8 VCC Power/Other
V3 VSS Power/Other Y23 VCC Power/Other
V4 A15# Source Synch Input/Output Y24 VCC Power/Other
V5 A14# Source Synch Input/Output Y25 VCC Power/Other
V8 VCC Power/Other Y28 VCC Power/Other
V25 VSS Power/Other VTT_OUT_RI

AA1 Power/Other Output
GHT
V26 VSS Power/Other
AA2 FC39 Power/Other
V27 VSS Power/Other
AA3 VSS Power/Other
V28 VSS Power/Other
AA4 A21# Source Synch Input/Output
V29 VSS Power/Other
AA5 A23# Source Synch Input/Output
V30 VSS Power/Other
AA6 VSS Power/Other
W1 MSID0 Power/Other Output
AA7 VSS Power/Other
TESTHI12/
W2 Power/Other Input
FC44 AA8 VCC Power/Other
W3 TESTHI1 Power/Other Input AA23 VSS Power/Other
W4 VSS Power/Other AA24 VSS Power/Other
W5 A16# Source Synch Input/Output AA25 VSS Power/Other
W6 A18# Source Synch Input/Output AA26 VSS Power/Other
W7 VSS Power/Other AA27 VSS Power/Other
W8 VCC Power/Other AA28 VSS Power/Other
W25 VCC Power/Other AB1 VSS Power/Other
W26 VCC Power/Other AB2 IERR# Asynch CMOS Output
W27 VCC Power/Other AB3 FC37 Power/Other
W28 VCC Power/Other AB4 A26# Source Synch Input/Output
FC0/ AB7 VSS Power/Other

Y1 Power/Other
BOOTSELECT
AB8 VCC Power/Other
Y2 VSS Power/Other
AB23 VSS Power/Other
Datasheet 61

Type Type
AB24 VSS Power/Other AE1 TCK TAP Input
AB25 VSS Power/Other AE2 VSS Power/Other
AB26 VSS Power/Other AE3 FC18 Power/Other
AB27 VSS Power/Other AE4 RESERVED
AB29 VSS Power/Other AE6 RESERVED
AC1 TMS TAP Input AE8 SKTOCC# Power/Other Output
AC2 DBR# Power/Other Output AE9 VCC Power/Other
AC3 VSS Power/Other AE10 VSS Power/Other
AC4 RESERVED AE11 VCC Power/Other
AC5 A25# Source Synch Input/Output AE12 VCC Power/Other
AC6 VSS Power/Other AE13 VSS Power/Other
AC7 VSS Power/Other AE14 VCC Power/Other
AC8 VCC Power/Other AE15 VCC Power/Other
AC23 VCC Power/Other AE16 VSS Power/Other
AD1 TDI TAP Input AE24 VSS Power/Other
AD2 BPM2# Common Clock Input/Output AE25 VSS Power/Other
AD3 FC36 Power/Other AE26 VSS Power/Other
AD4 VSS Power/Other AE27 VSS Power/Other
AD5 ADSTB1# Source Synch Input/Output AE28 VSS Power/Other
AD6 A22# Source Synch Input/Output AE29 VSS Power/Other
AD7 VSS Power/Other AE30 VSS Power/Other
AD8 VCC Power/Other AF1 TDO TAP Output
AD23 VCC Power/Other AF2 BPM4# Common Clock Input/Output
AD24 VCC Power/Other AF3 VSS Power/Other
AD25 VCC Power/Other AF4 A28# Source Synch Input/Output
AD26 VCC Power/Other AF5 A27# Source Synch Input/Output
AD29 VCC Power/Other AF8 VCC Power/Other
AD30 VCC Power/Other AF9 VCC Power/Other
62 Datasheet

Type Type
AF10 VSS Power/Other AG19 VCC Power/Other
AF11 VCC Power/Other AG20 VSS Power/Other
AF12 VCC Power/Other AG21 VCC Power/Other
AF22 VCC Power/Other AH1 VSS Power/Other
AF23 VSS Power/Other AH2 RESERVED
AF24 VSS Power/Other AH3 VSS Power/Other
AF25 VSS Power/Other AH4 A32# Source Synch Input/Output
AF26 VSS Power/Other AH5 A33# Source Synch Input/Output
AF29 VSS Power/Other AH8 VCC Power/Other
AF30 VSS Power/Other AH9 VCC Power/Other
AG1 TRST# TAP Input AH10 VSS Power/Other
AG2 BPM3# Common Clock Input/Output AH11 VCC Power/Other
AG3 BPM5# Common Clock Input/Output AH12 VCC Power/Other
AG4 A30# Source Synch Input/Output AH13 VSS Power/Other
AG5 A31# Source Synch Input/Output AH14 VCC Power/Other
AG6 A29# Source Synch Input/Output AH15 VCC Power/Other
AG7 VSS Power/Other AH16 VSS Power/Other
AG8 VCC Power/Other AH17 VSS Power/Other
AG9 VCC Power/Other AH18 VCC Power/Other
AG10 VSS Power/Other AH19 VCC Power/Other
Datasheet 63

Type Type
AH28 VCC Power/Other AK7 VSS Power/Other
AH29 VCC Power/Other AK8 VCC Power/Other
AH30 VCC Power/Other AK9 VCC Power/Other
AJ1 BPM1# Common Clock Input/Output AK10 VSS Power/Other
AJ2 BPM0# Common Clock Input/Output AK11 VCC Power/Other
AJ3 ITP_CLK1 TAP Input AK12 VCC Power/Other
AJ4 VSS Power/Other AK13 VSS Power/Other
AJ5 A34# Source Synch Input/Output AK14 VCC Power/Other
AJ6 A35# Source Synch Input/Output AK15 VCC Power/Other
AJ8 VCC Power/Other AK17 VSS Power/Other
AJ9 VCC Power/Other AK18 VCC Power/Other
AJ10 VSS Power/Other AK19 VCC Power/Other
AJ12 VCC Power/Other AK21 VCC Power/Other
AJ22 VCC Power/Other AL1 FC25 Power/Other
AJ23 VSS Power/Other AL2 PROCHOT# Asynch CMOS Input/Output
AJ24 VSS Power/Other AL3 VRDSEL Power/Other
AJ25 VCC Power/Other AL4 VID5 Asynch CMOS Output
AJ26 VCC Power/Other AL5 VID1 Asynch CMOS Output
AJ27 VSS Power/Other AL6 VID3 Asynch CMOS Output
AJ28 VSS Power/Other AL7 VSS Power/Other
AJ29 VSS Power/Other AL8 VCC Power/Other
AJ30 VSS Power/Other AL9 VCC Power/Other
AK1 FC24 Power/Other AL10 VSS Power/Other
AK2 VSS Power/Other AL11 VCC Power/Other
AK3 ITP_CLK0 TAP Input AL12 VCC Power/Other
AK4 VID4 Asynch CMOS Output AL13 VSS Power/Other
AK5 VSS Power/Other AL14 VCC Power/Other
AK6 FC8 Power/Other AL15 VCC Power/Other
64 Datasheet

Type Type
AL16 VSS Power/Other AM25 VCC Power/Other
AL18 VCC Power/Other AM27 VSS Power/Other
AL19 VCC Power/Other AM28 VSS Power/Other
AL21 VCC Power/Other AM30 VCC Power/Other
AL22 VCC Power/Other AN1 VSS Power/Other
AL23 VSS Power/Other AN2 VSS Power/Other
AL24 VSS Power/Other AN3 VCC_SENSE Power/Other Output
AL25 VCC Power/Other AN4 VSS_SENSE Power/Other Output
AL26 VCC Power/Other VCC_MB_

REGULATION
AL27 VSS Power/Other
VSS_MB_
AL28 VSS Power/Other AN6 Power/Other Output
REGULATION
AL29 VCC Power/Other AN7 VID_SELECT Power/Other Output
AL30 VCC Power/Other AN8 VCC Power/Other
AM1 VSS Power/Other AN9 VCC Power/Other
AM10 VSS Power/Other AN10 VSS Power/Other
AM11 VCC Power/Other AN11 VCC Power/Other
AM2 VID0 Asynch CMOS Output AN20 VSS Power/Other
AM3 VID2 Asynch CMOS Output AN21 VCC Power/Other
AM4 VSS Power/Other AN22 VCC Power/Other
AM5 VID6 Asynch CMOS Output AN23 VSS Power/Other
AM6 FC40 Power/Other AN24 VSS Power/Other
AM7 VID7 Asynch CMOS Output AN25 VCC Power/Other
AM9 VCC Power/Other AN27 VSS Power/Other
AM23 VSS Power/Other
AM24 VSS Power/Other
Datasheet 65
4.2 Alphabetical Signals Reference
Table 26. Signal Description (Sheet 1 of 10)
Name Type Description
A[35:3]# (Address) define a 236-byte physical memory address

space. In sub-phase 1 of the address phase, these signals transmit
the address of a transaction. In sub-phase 2, these signals transmit
transaction type information. These signals must connect the
Input/ appropriate pins/lands of all agents on the processor FSB.
A[35:3]#
Output A[35:3]# are source synchronous signals and are latched into the
receiving buffers by ADSTB[1:0]#.
On the active-to-inactive transition of RESET#, the processor
samples a subset of the A[35:3]# signals to determine power-on
configuration. See Section 6.1 for more details.
If A20M# (Address-20 Mask) is asserted, the processor masks
physical address bit 20 (A20#) before looking up a line in any
internal cache and before driving a read/write transaction on the
bus. Asserting A20M# emulates the 8086 processor's address
wrap-around at the 1-MB boundary. Assertion of A20M# is only
A20M# Input
supported in real mode.
A20M# is an asynchronous signal. However, to ensure recognition
of this signal following an Input/Output write instruction, it must be
valid along with the TRDY# assertion of the corresponding Input/
Output Write bus transaction.
ADS# (Address Strobe) is asserted to indicate the validity of the
transaction address on the A[35:3]# and REQ[4:0]# signals. All
Input/
ADS# bus agents observe the ADS# activation to begin protocol checking,
Output
address decode, internal snoop, or deferred reply ID match
operations associated with the new transaction.
Address strobes are used to latch A[35:3]# and REQ[4:0]# on
their rising and falling edges. Strobes are associated with signals as
shown below.
Input/
ADSTB[1:0]# Signals Associated Strobe
Output
REQ[4:0]#, A[16:3]# ADSTB0#
A[35:17]# ADSTB1#
The differential pair BCLK (Bus Clock) determines the FSB

frequency. All processor FSB agents must receive these signals to
BCLK[1:0] Input drive their outputs and latch their inputs.
All external timing parameters are specified with respect to the
rising edge of BCLK0 crossing VCROSS.
BNR# (Block Next Request) is used to assert a bus stall by any bus
Input/
BNR# agent unable to accept new bus transactions. During a bus stall,
Output
the current bus owner cannot issue any new transactions.
66 Datasheet
BPM[5:0]# (Breakpoint Monitor) are breakpoint and performance

monitor signals. They are outputs from the processor which
indicate the status of breakpoints and programmable counters used
for monitoring processor performance. BPM[5:0]# should connect
the appropriate pins/lands of all processor FSB agents.
BPM4# provides PRDY# (Probe Ready) functionality for the TAP
Input/ port. PRDY# is a processor output used by debug tools to
BPM[5:0]#
Output
determine processor debug readiness.
BPM5# provides PREQ# (Probe Request) functionality for the TAP
port. PREQ# is used by debug tools to request debug operation of
the processor.
These signals do not have on-die termination. Refer to
Section 2.6.2 for termination requirements.
BPRI# (Bus Priority Request) is used to arbitrate for ownership of
the processor FSB. It must connect the appropriate pins/lands of all
processor FSB agents. Observing BPRI# active (as asserted by the
priority agent) causes all other agents to stop issuing new
BPRI# Input
requests, unless such requests are part of an ongoing locked
operation. The priority agent keeps BPRI# asserted until all of its
requests are completed, then releases the bus by de-asserting
BPRI#.
BR0# drives the BREQ0# signal in the system and is used by the
processor to request the bus. During power-on configuration this
Input/ signal is sampled to determine the agent ID = 0.
BR0#
Output
This signal does not have on-die termination and must be
terminated.
The BCLK[1:0] frequency select signals BSEL[2:0] are used to
select the processor input clock frequency. Table 17 defines the
possible combinations of the signals and the frequency associated
with each combination. The required frequency is determined by
BSEL[2:0] Output
the processor, chipset, and clock synthesizer. All agents must
operate at the same frequency. For more information about these
signals, including termination recommendations refer to
Section 2.8.2.
COMP[3:0], COMP[3:0] and COMP8 must be terminated to VSS on the system
Analog
COMP8 board using precision resistors.
Datasheet 67
D[63:0]# (Data) are the data signals. These signals provide a 64-
bit data path between the processor FSB agents, and must connect
the appropriate pins/lands on all such agents. The data driver
asserts DRDY# to indicate a valid data transfer.
D[63:0]# are quad-pumped signals and will, thus, be driven four
times in a common clock period. D[63:0]# are latched off the
falling edge of both DSTBP[3:0]# and DSTBN[3:0]#. Each group of
16 data signals correspond to a pair of one DSTBP# and one
DSTBN#. The following table shows the grouping of data signals to
data strobes and DBI#.
Input/ Quad-Pumped Signal Groups

D[63:0]#
Output
Data Group DSTBN#/DSTBP# DBI#
D[15:0]# 0 0
D[31:16]# 1 1
D[47:32]# 2 2
D[63:48]# 3 3
Furthermore, the DBI# signals determine the polarity of the data

signals. Each group of 16 data signals corresponds to one DBI#
signal. When the DBI# signal is active, the corresponding data
group is inverted and therefore sampled active high.
DBI[3:0]# (Data Bus Inversion) are source synchronous and
indicate the polarity of the D[63:0]# signals.The DBI[3:0]# signals
are activated when the data on the data bus is inverted. If more
than half the data bits, within a 16-bit group, would have been
asserted electrically low, the bus agent may invert the data bus
signals for that particular sub-phase for that 16-bit group.
DBI[3:0] Assignment To Data Bus
Input/
DBI[3:0]#
Output Bus Signal Data Bus Signals
DBI3# D[63:48]#
DBI2# D[47:32]#
DBI1# D[31:16]#
DBI0# D[15:0]#
DBR# (Debug Reset) is used only in processor systems where no

debug port is implemented on the system board. DBR# is used by a
DBR# Output debug port interposer so that an in-target probe can drive system
reset. If a debug port is implemented in the system, DBR# is a no
connect in the system. DBR# is not a processor signal.
DBSY# (Data Bus Busy) is asserted by the agent responsible for
driving data on the processor FSB to indicate that the data bus is in
Input/
DBSY# use. The data bus is released after DBSY# is de-asserted. This
Output
signal must connect the appropriate pins/lands on all processor FSB
agents.
68 Datasheet
DEFER# is asserted by an agent to indicate that a transaction

cannot be ensured in-order completion. Assertion of DEFER# is
DEFER# Input normally the responsibility of the addressed memory or input/
output agent. This signal must connect the appropriate pins/lands
of all processor FSB agents.
DPRSTP#, when asserted on the platform, causes the processor to
transition from the Deep Sleep State to the Deeper Sleep state. To
return to the Deep Sleep State, DPRSTP# must be de-asserted. Use
of the DPRSTP# pin, and corresponding low power state, requires
DPRSTP# Input
chipset support and may not be available on all platforms.
NOTE: Some processors may not have the Deeper Sleep State
enabled, refer to the Specification Update for specific sku
and stepping guidance.
DPSLP#, when asserted on the platform, causes the processor to
transition from the Sleep State to the Deep Sleep state. To return
to the Sleep State, DPSLP# must be de-asserted. Use of the
DPSLP# pin, and corresponding low power state, requires chipset
DPSLP# Input
support and may not be available on all platforms.
NOTE: Some processors may not have the Deep Sleep State
enabled, refer to the Specification Update for specific
processor and stepping guidance.
DRDY# (Data Ready) is asserted by the data driver on each data
transfer, indicating valid data on the data bus. In a multi-common
Input/
DRDY# clock data transfer, DRDY# may be de-asserted to insert idle
Output
clocks. This signal must connect the appropriate pins/lands of all
processor FSB agents.
DSTBN[3:0]# are the data strobes used to latch in D[63:0]#.
Input/ D[15:0]#, DBI0# DSTBN0#

DSTBN[3:0]#
Output D[31:16]#, DBI1# DSTBN1#
D[47:32]#, DBI2# DSTBN2#
D[63:48]#, DBI3# DSTBN3#
DSTBP[3:0]# are the data strobes used to latch in D[63:0]#.
Input/ D[15:0]#, DBI0# DSTBP0#

DSTBP[3:0]#
Output D[31:16]#, DBI1# DSTBP1#
D[47:32]#, DBI2# DSTBP2#
D[63:48]#, DBI3# DSTBP3#
FC0/BOOTSELECT is not used by the processor. When this land is

FC0/BOOTSELECT Other tied to VSS previous processors based on the Intel NetBurst®
microarchitecture should be disabled and prevented from booting.
FC signals are signals that are available for compatibility with other
FCx Other
processors.
Datasheet 69
FERR#/PBE# (floating point error/pending break event) is a

multiplexed signal and its meaning is qualified by STPCLK#. When
STPCLK# is not asserted, FERR#/PBE# indicates a floating-point
error and will be asserted when the processor detects an unmasked
floating-point error. When STPCLK# is not asserted, FERR#/PBE# is
similar to the ERROR# signal on the Intel 387 coprocessor, and is
included for compatibility with systems using MS-DOS*-type
floating-point error reporting. When STPCLK# is asserted, an
FERR#/PBE# Output
assertion of FERR#/PBE# indicates that the processor has a
pending break event waiting for service. The assertion of FERR#/
PBE# indicates that the processor should be returned to the Normal
state. For additional information on the pending break event
functionality, including the identification of support of the feature
and enable/disable information, refer to volume 3 of the Intel
Architecture Software Developer's Manual and the Intel Processor
Identification and the CPUID Instruction application note.
GTLREF[1:0] determine the signal reference level for GTL+ input
GTLREF[1:0] Input signals. GTLREF is used by the GTL+ receivers to determine if a
signal is a logical 0 or logical 1.
Input/
HIT# Output HIT# (Snoop Hit) and HITM# (Hit Modified) convey transaction
snoop operation results. Any FSB agent may assert both HIT# and
HITM# together to indicate that it requires a snoop stall, which can
HITM# Input/ be continued by reasserting HIT# and HITM# together.
Output
IERR# (Internal Error) is asserted by a processor as the result of
an internal error. Assertion of IERR# is usually accompanied by a
SHUTDOWN transaction on the processor FSB. This transaction
may optionally be converted to an external error signal (e.g., NMI)
IERR# Output
by system core logic. The processor will keep IERR# asserted until
the assertion of RESET#.
This signal does not have on-die termination. Refer to Section 2.6.2
for termination requirements.
IGNNE# (Ignore Numeric Error) is asserted to the processor to
ignore a numeric error and continue to execute noncontrol floating-
point instructions. If IGNNE# is de-asserted, the processor
generates an exception on a noncontrol floating-point instruction if
a previous floating-point instruction caused an error. IGNNE# has
IGNNE# Input no effect when the NE bit in control register 0 (CR0) is set.
IGNNE# is an asynchronous signal. However, to ensure recognition
of this signal following an Input/Output write instruction, it must be
valid along with the TRDY# assertion of the corresponding Input/
Output Write bus transaction.
INIT# (Initialization), when asserted, resets integer registers inside
the processor without affecting its internal caches or floating-point
registers. The processor then begins execution at the power-on
Reset vector configured during power-on configuration. The
INIT# Input processor continues to handle snoop requests during INIT#
assertion. INIT# is an asynchronous signal and must connect the
appropriate pins/lands of all processor FSB agents.
If INIT# is sampled active on the active to inactive transition of
RESET#, then the processor executes its Built-in Self-Test (BIST).
70 Datasheet
ITP_CLK[1:0] are copies of BCLK that are used only in processor

systems where no debug port is implemented on the system board.
ITP_CLK[1:0] are used as BCLK[1:0] references for a debug port
ITP_CLK[1:0] Input
implemented on an interposer. If a debug port is implemented in
the system, ITP_CLK[1:0] are no connects in the system. These are
not processor signals.
LINT[1:0] (Local APIC Interrupt) must connect the appropriate
pins/lands of all APIC Bus agents. When the APIC is disabled, the
LINT0 signal becomes INTR, a maskable interrupt request signal,
and LINT1 becomes NMI, a nonmaskable interrupt. INTR and NMI
are backward compatible with the signals of those names on the
LINT[1:0] Input Pentium processor. Both signals are asynchronous.
Both of these signals must be software configured using BIOS
programming of the APIC register space to be used either as NMI/
INTR or LINT[1:0]. Because the APIC is enabled by default after
Reset, operation of these signals as LINT[1:0] is the default
configuration.
LOCK# indicates to the system that a transaction must occur
atomically. This signal must connect the appropriate pins/lands of
all processor FSB agents. For a locked sequence of transactions,
LOCK# is asserted from the beginning of the first transaction to the
Input/ end of the last transaction.
LOCK#
Output When the priority agent asserts BPRI# to arbitrate for ownership of
the processor FSB, it will wait until it observes LOCK# de-asserted.
This enables symmetric agents to retain ownership of the processor
FSB throughout the bus locked operation and ensure the atomicity
of lock.
On the processor these signals are connected on the package to
VSS. As an alternative to MSID, Intel has implemented the Power
MSID[1:0] Output Segment Identifier (PSID) to report the maximum Thermal Design
Power of the processor. Refer to Section 2.5 for additional
information regarding PSID.
Input/ PECI is a proprietary one-wire bus interface. See Chapter 5.3 for
PECI
Output details.
As an output, PROCHOT# (Processor Hot) will go active when the
processor temperature monitoring sensor detects that the
processor has reached its maximum safe operating temperature.
Input/ This indicates that the processor Thermal Control Circuit (TCC) has
PROCHOT#
Output been activated, if enabled. As an input, assertion of PROCHOT# by
the system will activate the TCC, if enabled. The TCC will remain
active until the system de-asserts PROCHOT#. See Section 5.2.4
for more details.
Processor Power Status Indicator Signal. This signal may be
asserted when the processor is in the Deeper Sleep State. PSI# can
PSI# Output
be used to improve load efficiency of the voltage regulator,
resulting in platform power savings.
Datasheet 71
PWRGOOD (Power Good) is a processor input. The processor

requires this signal to be a clean indication that the clocks and
power supplies are stable and within their specifications. ‘Clean’
implies that the signal will remain low (capable of sinking leakage
current), without glitches, from the time that the power supplies
are turned on until they come within specification. The signal must
PWRGOOD Input
then transition monotonically to a high state. PWRGOOD can be
driven inactive at any time, but clocks and power must again be
stable before a subsequent rising edge of PWRGOOD.
The PWRGOOD signal must be supplied to the processor; it is used
to protect internal circuits against voltage sequencing issues. It
should be driven high throughout boundary scan operation.
REQ[4:0]# (Request Command) must connect the appropriate
Input/ pins/lands of all processor FSB agents. They are asserted by the
REQ[4:0]#
Output current bus owner to define the currently active transaction type.
These signals are source synchronous to ADSTB0#.
Asserting the RESET# signal resets the processor to a known state
and invalidates its internal caches without writing back any of their
contents. For a power-on Reset, RESET# must stay active for at
least one millisecond after VCC and BCLK have reached their proper
specifications. On observing active RESET#, all FSB agents will de-
assert their outputs within two clocks. RESET# must not be kept
RESET# Input asserted for more than 10 ms while PWRGOOD is asserted.
A number of bus signals are sampled at the active-to-inactive
transition of RESET# for power-on configuration. These
configuration options are described in the Section 6.1.
This signal does not have on-die termination and must be
terminated on the system board.
All RESERVED lands must remain unconnected. Connection of these
lands to VCC, VSS, VTT, or to any other signal (including each other)
RESERVED
can result in component malfunction or incompatibility with future
processors.
RS[2:0]# (Response Status) are driven by the response agent (the
agent responsible for completion of the current transaction), and
RS[2:0]# Input
must connect the appropriate pins/lands of all processor FSB
agents.
SKTOCC# (Socket Occupied) will be pulled to ground by the
SKTOCC# Output processor. System board designers may use this signal to
determine if the processor is present.
72 Datasheet
SLP# (Sleep), when asserted in Extended Stop Grant or Stop Grant

state, causes the processor to enter the Sleep state. In the Sleep
state, the processor stops providing internal clock signals to all
units, leaving only the Phase-Locked Loop (PLL) still operating.
Processors in this state will not recognize snoops or interrupts. The
processor will recognize only assertion of the RESET# signal, de-
assertion of SLP#, and removal of the BCLK input while in Sleep
state. If SLP# is de-asserted, the processor exits Sleep state and
SLP# Input returns to Extended Stop Grant or Stop Grant state, restarting its
internal clock signals to the bus and processor core units. If
DPSLP# is asserted while in the Sleep state, the processor will exit
the Sleep state and transition to the Deep Sleep state. Use of the
SLP# pin, and corresponding low power state, requires chipset
support and may not be available on all platforms.
NOTE: Some processors may not have the Sleep State enabled,
refer to the Specification Update for specific processor and
stepping guidance.
SMI# (System Management Interrupt) is asserted asynchronously
by system logic. On accepting a System Management Interrupt, the
processor saves the current state and enter System Management
SMI# Input Mode (SMM). An SMI Acknowledge transaction is issued, and the
processor begins program execution from the SMM handler.
If SMI# is asserted during the de-assertion of RESET#, the
processor will tri-state its outputs.
STPCLK# (Stop Clock), when asserted, causes the processor to
enter a low power Stop-Grant state. The processor issues a Stop-
Grant Acknowledge transaction, and stops providing internal clock
signals to all processor core units except the FSB and APIC units.
STPCLK# Input The processor continues to snoop bus transactions and service
interrupts while in Stop-Grant state. When STPCLK# is de-
asserted, the processor restarts its internal clock to all units and
resumes execution. The assertion of STPCLK# has no effect on the
bus clock; STPCLK# is an asynchronous input.
TCK (Test Clock) provides the clock input for the processor Test Bus
TCK Input
(also known as the Test Access Port).
TDI (Test Data In) transfers serial test data into the processor. TDI
TDI Input
provides the serial input needed for JTAG specification support.
TDO (Test Data Out) transfers serial test data out of the processor.
TDO Output TDO provides the serial output needed for JTAG specification
support.
The TESTHI[12,10:0] lands must be connected to the processor’s
appropriate power source (refer to VTT_OUT_LEFT and
TESTHI[12,10:0] Input
VTT_OUT_RIGHT signal description) through a resistor for proper
processor operation. See Section 2.4 for more details.
Datasheet 73
In the event of a catastrophic cooling failure, the processor will

automatically shut down when the silicon has reached a
temperature approximately 20 °C above the maximum TC.
Assertion of THERMTRIP# (Thermal Trip) indicates the processor
junction temperature has reached a level beyond where permanent
silicon damage may occur. Upon assertion of THERMTRIP#, the
processor will shut off its internal clocks (thus, halting program
execution) in an attempt to reduce the processor junction
temperature. To protect the processor, its core voltage (VCC) must
be removed following the assertion of THERMTRIP#. Driving of the
THERMTRIP# Output
THERMTRIP# signal is enabled within 10 μs of the assertion of
PWRGOOD (provided VTT and VCC are asserted) and is disabled on
de-assertion of PWRGOOD (if VTT or VCC are not valid, THERMTRIP#
may also be disabled). Once activated, THERMTRIP# remains
latched until PWRGOOD, VTT or VCC is de-asserted. While the de-
assertion of the PWRGOOD, VTT or VCC signal will de-assert
THERMTRIP#, if the processor’s junction temperature remains at or
above the trip level, THERMTRIP# will again be asserted within
10 μs of the assertion of PWRGOOD (provided VTT and VCC are
valid).
TMS (Test Mode Select) is a JTAG specification support signal used
TMS Input
by debug tools.
TRDY# (Target Ready) is asserted by the target to indicate that it is
TRDY# Input ready to receive a write or implicit writeback data transfer. TRDY#
must connect the appropriate pins/lands of all FSB agents.
TRST# (Test Reset) resets the Test Access Port (TAP) logic. TRST#
TRST# Input
must be driven low during power on Reset.
VCC are the power pins for the processor. The voltage supplied to
VCC Input
these pins is determined by the VID[7:0] pins.
VCCA provides isolated power for internal PLLs on previous
VCCA Input generation processors. It may be left as a No-Connect on boards
supporting the processor.
VCCIOPLL provides isolated power for internal processor FSB PLLs
VCCIOPLL Input on previous generation processors. It may be left as a No-Connect
on boards supporting the processor.
VCCPLL Input VCCPLL provides isolated power for internal processor FSB PLLs.
VCC_SENSE is an isolated low impedance connection to processor
VCC_SENSE Output core power (VCC). It can be used to sense or measure voltage near
the silicon with little noise.
This land is provided as a voltage regulator feedback sense point
VCC_MB_ for VCC. It is connected internally in the processor package to the
Output
REGULATION sense point land U27 as described in the Voltage Regulator Design
Guide.
74 Datasheet
The VID (Voltage ID) signals are used to support automatic

selection of power supply voltages (VCC). Refer to the Voltage
Regulator Design Guide for more information. The voltage supply
for these signals must be valid before the VR can supply VCC to the
VID[7:0] Output processor. Conversely, the VR output must be disabled until the
voltage supply for the VID signals becomes valid. The VID signals
are needed to support the processor voltage specification
variations. See Table 2 for definitions of these signals. The VR must
supply the voltage that is requested by the signals, or disable itself.
This land is tied high on the processor package and is used by the
VID_SELECT Output VR to choose the proper VID table. Refer to the Voltage Regulator
Design Guide for more information.
This input should be left as a no connect in order for the processor
VRDSEL Input to boot. The processor will not boot on legacy platforms where this
land is connected to VSS.
VSS are the ground pins for the processor and should be connected
VSS Input
to the system ground plane.
VSSA provides isolated ground for internal PLLs on previous
VSSA Input generation processors. It may be left as a No-Connect on boards
supporting the processor.
VSS_SENSE is an isolated low impedance connection to processor
VSS_SENSE Output core VSS. It can be used to sense or measure ground near the
silicon with little noise.
This land is provided as a voltage regulator feedback sense point
VSS_MB_ for VSS. It is connected internally in the processor package to the
Output
REGULATION sense point land V27 as described in the Voltage Regulator Design
Guide.
VTT Miscellaneous voltage supply.
VTT_OUT_LEFT The VTT_OUT_LEFT and VTT_OUT_RIGHT signals are included to
Output provide a voltage supply for some signals that require termination
VTT_OUT_RIGHT to VTT on the motherboard.
The VTT_SEL signal is used to select the correct VTT voltage level
VTT_SEL Output for the processor. This land is connected internally in the package
to VSS.
75 Datasheet
76 Datasheet
Thermal Specifications and Design Considerations
5 Thermal Specifications and

Design Considerations
5.1 Processor Thermal Specifications
The processor requires a thermal solution to maintain temperatures within the
operating limits as set forth in Section 5.1.1. Any attempt to operate the processor
outside these operating limits may result in permanent damage to the processor and
potentially other components within the system. As processor technology changes,
thermal management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is key to reliable, long-term system
operation.
A complete thermal solution includes both component and system level thermal
management features. Component level thermal solutions can include active or passive
heatsinks attached to the processor Integrated Heat Spreader (IHS). Typical system
level thermal solutions may consist of system fans combined with ducting and venting.
For more information on designing a component level thermal solution, refer to the
appropriate Thermal and Mechanical Design Guidelines (see Section 1.2).
Note: The boxed processor will ship with a component thermal solution. Refer to Chapter 7
for details on the boxed processor.
5.1.1 Thermal Specifications

To allow for the optimal operation and long-term reliability of Intel processor-based
systems, the system/processor thermal solution should be designed such that the
processor remains within the minimum and maximum case temperature (TC)
specifications when operating at or below the Thermal Design Power (TDP) value listed
per frequency in Table 27. Thermal solutions not designed to provide this level of
thermal capability may affect the long-term reliability of the processor and system. For
more details on thermal solution design, refer to the appropriate Thermal and
Mechanical Design Guidelines (see Section 1.2).
The processor uses a methodology for managing processor temperatures which is

intended to support acoustic noise reduction through fan speed control. Selection of the
appropriate fan speed is based on the relative temperature data reported by the
processor’s Platform Environment Control Interface (PECI) bus as described in
Section 5.3. If the value reported using PECI is less than TCONTROL, then the case
temperature is permitted to exceed the Thermal Profile. If the value reported using
PECI is greater than or equal to TCONTROL, then the processor case temperature must
remain at or below the temperature as specified by the thermal profile. The
temperature reported over PECI is always a negative value and represents a delta
below the onset of thermal control circuit (TCC) activation, as indicated by PROCHOT#
(see Section 5.2). Systems that implement fan speed control must be designed to take
these conditions in to account. Systems that do not alter the fan speed only need to
ensure the case temperature meets the thermal profile specifications.
To determine a processor's case temperature specification based on the thermal profile,

it is necessary to accurately measure processor power dissipation. Intel has developed
a methodology for accurate power measurement that correlates to Intel test
temperature and voltage conditions. Refer to the appropriate Thermal and Mechanical
Design Guidelines (see Section 1.2) for the details of this methodology.
Datasheet 77
The case temperature is defined at the geometric top center of the processor. Analysis
indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
Table 27 instead of the maximum processor power consumption. The Thermal Monitor
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, refer to Section 5.2. In all cases the Thermal Monitor or
Thermal Monitor 2 feature must be enabled for the processor to remain within
specification.
Table 27. Processor Thermal Specifications
Thermal Extended Deeper

Core 775_VR_
Processor Design HALT Sleep Minimum Maximum
Frequency CONFIG_06 Notes
Number Power Power Power TC (°C) TC (°C)
(GHz) Guidance5
(W)3,4 (W)1 (W)2
E8600 3.33 65.0 8 6 5

E8500 3.16 65.0 8 6 5 See
775_VR_
E8400 3 65.0 8 6 5 Table 28
CONFIG_06
E8300 2.83 65.0 8 6 5 and
(65 W)
E8200 2.66 65.0 8 6 5 Figure 14
E8190 2.66 65.0 8 6 5
E7600 3.06 GHz 65.0 8 6 5
See
E7500 2.93 65.0 8 6 775_VR_CONFIG 5
Table 29
E7400 2.80 65.0 8 6 _06 5
(65 W) and
E7300 2.66 65.0 8 6 5
Figure 15
E7200 2.53 65.0 8 6 5
NOTES:
1. Specification is at 36 °C TC and minimum voltage loadline. Specification is ensured by
design characterization and not 100% tested.
2. Specification is at 34 °C TC and minimum voltage loadline. Specification is ensured by
design characterization and not 100% tested.
3. Thermal Design Power (TDP) should be used for processor thermal solution design targets.
The TDP is not the maximum power that the processor can dissipate.
4. This table shows the maximum TDP for a given frequency range. Individual processors
may have a lower TDP. Therefore, the maximum TC will vary depending on the TDP of the
individual processor. Refer to thermal profile figure and associated table for the allowed
combinations of power and TC.
5. 775_VR_CONFIG_06 guidelines provide a design target for meeting future thermal
requirements.
78 Datasheet
Table 28. Intel® Core™2 Duo Processor E8000 Series Thermal Profile
Power Maximum Tc Power Maximum Tc Power Maximum Tc

(W) (°C) (W) (°C) (W) (°C)
0 45.1 24 55.2 48 65.3

2 45.9 26 56.0 50 66.1
4 46.8 28 56.9 52 66.9
6 47.6 30 57.7 54 67.8
8 48.5 32 58.5 56 68.6
10 49.3 34 59.4 58 69.5
12 50.1 36 60.2 60 70.3
14 51.0 38 61.1 62 71.1
16 51.8 40 61.9 64 72.0
18 52.7 42 62.7 65 72.4
20 53.5 44 63.6
22 54.3 46 64.4
Figure 14. Intel® Core™2 Duo Processor E8000 Series Thermal Profile
72.0
68.0
64.0
y = 0.42x + 45.1
60.0
Tcase (C)
56.0
52.0
48.0
44.0
0 10 20 30 40 50 60
Power (W)
Datasheet 79
Table 29. Intel® Core™2 Duo Processor E7000 Series Thermal Profile
Maximum Tc Maximum Tc Maximum Tc
Power (W) Power Power
(°C) (°C) (°C)
0 44.9 24 55.7 48 66.5
2 45.8 26 56.6 50 67.4
4 46.7 28 57.5 52 68.3
6 47.6 30 58.4 54 69.2
8 48.5 32 59.3 56 70.1
10 49.4 34 60.2 58 71.0
12 50.3 36 61.1 60 71.9
14 51.2 38 62.0 62 72.8
16 52.1 40 62.9 64 73.7
18 53.0 42 63.8 65 74.1
20 53.9 44 64.7
22 54.8 46 65.6
Figure 15. Intel® Core™2 Duo Processor E7000 Series Thermal Profile
72.0
68.0
64.0
y = 0.45x + 44.9
Tcase (C)
60.0
56.0
52.0
48.0
44.0
0 10 20 30 40 50 60
Power (W)
80 Datasheet
5.1.2 Thermal Metrology

The maximum and minimum case temperatures (TC) for the processor is specified in
Table 27. This temperature specification is meant to help ensure proper operation of
the processor. Figure 16 illustrates where Intel recommends TC thermal measurements
should be made. For detailed guidelines on temperature measurement methodology,
refer to the appropriate Thermal and Mechanical Design Guidelines (see Section 1.2).
Figure 16. Case Temperature (TC) Measurement Location
Measure TC at this point

(geometric center of the package)
37.5 mm
37.5 mm
5.2 Processor Thermal Features

5.2.1 Thermal Monitor
The Thermal Monitor feature helps control the processor temperature by activating the
thermal control circuit (TCC) when the processor silicon reaches its maximum operating
temperature. The TCC reduces processor power consumption by modulating (starting
and stopping) the internal processor core clocks. The Thermal Monitor feature must
be enabled for the processor to be operating within specifications. The
temperature at which Thermal Monitor activates the thermal control circuit is not user
configurable and is not software visible. Bus traffic is snooped in the normal manner,
and interrupt requests are latched (and serviced during the time that the clocks are on)
while the TCC is active.
When the Thermal Monitor feature is enabled, and a high temperature situation exists
(i.e., TCC is active), the clocks will be modulated by alternately turning the clocks off
and on at a duty cycle specific to the processor (typically 30–50%). Clocks often will
not be off for more than 3.0 microseconds when the TCC is active. Cycle times are
processor speed dependent and will decrease as processor core frequencies increase. A
small amount of hysteresis has been included to prevent rapid active/inactive
transitions of the TCC when the processor temperature is near its maximum operating
temperature. Once the temperature has dropped below the maximum operating
temperature, and the hysteresis timer has expired, the TCC goes inactive and clock
modulation ceases.
With a properly designed and characterized thermal solution, it is anticipated that the
TCC would only be activated for very short periods of time when running the most
power intensive applications. The processor performance impact due to these brief
Datasheet 81
periods of TCC activation is expected to be so minor that it would be immeasurable. An

under-designed thermal solution that is not able to prevent excessive activation of the
TCC in the anticipated ambient environment may cause a noticeable performance loss,
and in some cases may result in a TC that exceeds the specified maximum temperature
and may affect the long-term reliability of the processor. In addition, a thermal solution
that is significantly under-designed may not be capable of cooling the processor even
when the TCC is active continuously. Refer to the appropriate Thermal and Mechanical
Design Guidelines (see Section 1.2) for information on designing a thermal solution.
The duty cycle for the TCC, when activated by the Thermal Monitor, is factory
configured and cannot be modified. The Thermal Monitor does not require any
additional hardware, software drivers, or interrupt handling routines.
5.2.2 Thermal Monitor 2

The processor also supports an additional power reduction capability known as Thermal
Monitor 2. This mechanism provides an efficient means for limiting the processor
temperature by reducing the power consumption within the processor.
When Thermal Monitor 2 is enabled, and a high temperature situation is detected, the
Thermal Control Circuit (TCC) will be activated. The TCC causes the processor to adjust
its operating frequency (using the bus multiplier) and input voltage (using the VID
signals). This combination of reduced frequency and VID results in a reduction to the
processor power consumption.
A processor enabled for Thermal Monitor 2 includes two operating points, each
consisting of a specific operating frequency and voltage. The first operating point
represents the normal operating condition for the processor. Under this condition, the
core-frequency-to-FSB multiple used by the processor is that contained in the
CLK_GEYSIII_STAT MSR and the VID is that specified in Table 4. These parameters
represent normal system operation.
The second operating point consists of both a lower operating frequency and voltage.
When the TCC is activated, the processor automatically transitions to the new
frequency. This transition occurs very rapidly (on the order of 5 μs). During the
frequency transition, the processor is unable to service any bus requests, and
consequently, all bus traffic is blocked. Edge-triggered interrupts will be latched and
kept pending until the processor resumes operation at the new frequency.
Once the new operating frequency is engaged, the processor will transition to the new
core operating voltage by issuing a new VID code to the voltage regulator. The voltage
regulator must support dynamic VID steps in order to support Thermal Monitor 2.
During the voltage change, it will be necessary to transition through multiple VID codes
to reach the target operating voltage. Each step will likely be one VID table entry (see
Table 4). The processor continues to execute instructions during the voltage transition.
Operation at the lower voltage reduces the power consumption of the processor.
A small amount of hysteresis has been included to prevent rapid active/inactive

transitions of the TCC when the processor temperature is near its maximum operating
temperature. Once the temperature has dropped below the maximum operating
temperature, and the hysteresis timer has expired, the operating frequency and
voltage transition back to the normal system operating point. Transition of the VID code
will occur first, in order to ensure proper operation once the processor reaches its
normal operating frequency. Refer to Figure 17 for an illustration of this ordering.
82 Datasheet
Figure 17. Thermal Monitor 2 Frequency and Voltage Ordering
TTM2 Temperature
fMAX
fTM2
Frequency
VID
VIDTM2
VID
PROCHOT#
The PROCHOT# signal is asserted when a high temperature situation is detected,

regardless of whether Thermal Monitor or Thermal Monitor 2 is enabled.
It should be noted that the Thermal Monitor 2 TCC cannot be activated using the on-
demand mode. The Thermal Monitor TCC, however, can be activated through the use of
the on-demand mode.
5.2.3 On-Demand Mode

The processor provides an auxiliary mechanism that allows system software to force
the processor to reduce its power consumption. This mechanism is referred to as “On-
Demand” mode and is distinct from the Thermal Monitor feature. On-Demand mode is
intended as a means to reduce system level power consumption. Systems using the
processor must not rely on software usage of this mechanism to limit the processor
temperature.
If bit 4 of the ACPI P_CNT Control Register (located in the processor

IA32_THERM_CONTROL MSR) is written to a '1', the processor will immediately reduce
its power consumption using modulation (starting and stopping) of the internal core
clock, independent of the processor temperature. When using On-Demand mode, the
duty cycle of the clock modulation is programmable using bits 3:1 of the same ACPI
P_CNT Control Register. In On-Demand mode, the duty cycle can be programmed from
12.5% on/87.5% off, to 87.5% on/12.5% off in 12.5% increments. On-Demand mode
may be used in conjunction with the Thermal Monitor. If the system tries to enable On-
Demand mode at the same time the TCC is engaged, the factory configured duty cycle
of the TCC will override the duty cycle selected by the On-Demand mode.
Datasheet 83
5.2.4 PROCHOT# Signal

An external signal, PROCHOT# (processor hot), is asserted when the processor core
temperature has reached its maximum operating temperature. If the Thermal Monitor
is enabled (note that the Thermal Monitor must be enabled for the processor to be
operating within specification), the TCC will be active when PROCHOT# is asserted. The
processor can be configured to generate an interrupt upon the assertion or de-
assertion of PROCHOT#.
PROCHOT# is a bi-directional signal. As an output, PROCHOT# (Processor Hot) will go

active when the processor temperature monitoring sensor detects that one or both
cores has reached its maximum safe operating temperature. This indicates that the
processor Thermal Control Circuit (TCC) has been activated, if enabled. As an input,
assertion of PROCHOT# by the system will activate the TCC, if enabled, for both cores.
The TCC will remain active until the system de-asserts PROCHOT#.
Note: PROCHOT# will not be asserted (as an output) or observed (as an input) when the
processor is in the Stop Grant, Sleep, Deep Sleep, and Deeper Sleep low-power states,
hence the thermal solution must be designed to ensure the processor remains within
specification. If the processor enters one of the above low-power states with
PROCHOT# already asserted, PROCHOT# will remain asserted until the processor exits
the low-power state and the processor DTS temperature drops below the thermal trip
point.
PROCHOT# allows for some protection of various components from over-temperature

situations. The PROCHOT# signal is bi-directional in that it can either signal when the
processor (either core) has reached its maximum operating temperature or be driven
from an external source to activate the TCC. The ability to activate the TCC using
PROCHOT# can provide a means for thermal protection of system components.
Bi-directional PROCHOT# can allow VR thermal designs to target maximum sustained

current instead of maximum current. Systems should still provide proper cooling for the
VR, and rely on bi-directional PROCHOT# only as a backup in case of system cooling
failure. The system thermal design should allow the power delivery circuitry to operate
within its temperature specification even while the processor is operating at its Thermal
Design Power. With a properly designed and characterized thermal solution, it is
anticipated that bi-directional PROCHOT# would only be asserted for very short periods
of time when running the most power intensive applications. An under-designed
thermal solution that is not able to prevent excessive assertion of PROCHOT# in the
anticipated ambient environment may cause a noticeable performance loss. Refer to
the Voltage Regulator Design Guide for details on implementing the bi-directional
PROCHOT# feature.
5.2.5 THERMTRIP# Signal

Regardless of whether or not Thermal Monitor or Thermal Monitor 2 is enabled, in the
event of a catastrophic cooling failure, the processor will automatically shut down when
the silicon has reached an elevated temperature (refer to the THERMTRIP# definition in
Table 26). At this point, the FSB signal THERMTRIP# will go active and stay active as
described in Table 26. THERMTRIP# activation is independent of processor activity and
does not generate any bus cycles. If THERMTRIP# is asserted, processor core voltage
(VCC) must be removed within the timeframe defined in Table 11.
84 Datasheet
5.3 Platform Environment Control Interface (PECI)

5.3.1 Introduction
PECI offers an interface for thermal monitoring of Intel processor and chipset
components. It uses a single wire, thus alleviating routing congestion issues. PECI uses
CRC checking on the host side to ensure reliable transfers between the host and client
devices. Also, data transfer speeds across the PECI interface are negotiable within a
wide range (2 Kbps to 2 Mbps). The PECI interface on the processor is disabled by
default and must be enabled through BIOS. More information can be found in the
Platform Environment Control Interface (PECI) Specification.
5.3.1.1 TCONTROL and TCC activation on PECI-Based Systems

Fan speed control solutions based on PECI utilize a TCONTROL value stored in the
processor IA32_TEMPERATURE_TARGET MSR. The TCONTROL MSR uses the same offset
temperature format as PECI though it contains no sign bit. Thermal management
devices should infer the TCONTROL value as negative. Thermal management algorithms
should utilize the relative temperature value delivered over PECI in conjunction with the
TCONTROL MSR value to control or optimize fan speeds. Figure 18 shows a conceptual
fan control diagram using PECI temperatures.
The relative temperature value reported over PECI represents the delta below the onset
of thermal control circuit (TCC) activation as indicated by PROCHOT# assertions. As the
temperature approaches TCC activation, the PECI value approaches zero. TCC activates
at a PECI count of zero.
Figure 18. Conceptual Fan Control Diagram on PECI-Based Platforms
Datasheet 85
5.3.2 PECI Specifications

5.3.2.1 PECI Device Address
The PECI register resides at address 30h.
5.3.2.2 PECI Command Support

PECI command support is covered in detail in the Platform Environment Control
Interface Specification. Refer to this document for details on supported PECI command
function and codes.
5.3.2.3 PECI Fault Handling Requirements

PECI is largely a fault tolerant interface, including noise immunity and error checking
improvements over other comparable industry standard interfaces. The PECI client is
as reliable as the device that it is embedded in, and thus given operating conditions
that fall under the specification, the PECI will always respond to requests and the
protocol itself can be relied upon to detect any transmission failures. There are,
however, certain scenarios where the PECI is know to be unresponsive.
Prior to a power-on RESET# and during RESET# assertion, PECI is not assured to
provide reliable thermal data. System designs should implement a default power-on
condition that ensures proper processor operation during the time frame when reliable
data is not available using PECI.
To protect platforms from potential operational or safety issues due to an abnormal

condition on PECI, the Host controller should take action to protect the system from
possible damage. It is recommended that the PECI host controller take appropriate
action to protect the client processor device if valid temperature readings have not
been obtained in response to three consecutive GetTemp()s or for a one second time
interval. The host controller may also implement an alert to software in the event of a
critical or continuous fault condition.
5.3.2.4 PECI GetTemp0() Error Code Support

The error codes supported for the processor GetTemp() command are listed in
Table 30:
Table 30. GetTemp0() Error Codes
Error Code Description
8000h General sensor error

Sensor is operational, but has detected a temperature below its operational
8002h
range (underflow)
§§
86 Datasheet
Features
6 Features
6.1 Power-On Configuration Options
Several configuration options can be configured by hardware. The processor samples
the hardware configuration at reset, on the active-to-inactive transition of RESET#. For
specifications on these options, refer to Table 31.
The sampled information configures the processor for subsequent operation. These
configuration options cannot be changed except by another reset. All resets reconfigure
the processor; for configuration purposes, the processor does not distinguish between
a "warm" reset and a "power-on" reset.
Table 31. Power-On Configuration Option Signals
Configuration Option Signal1,2
Output tristate SMI#

Execute BIST A3#
Disable dynamic bus parking A25#
Symmetric agent arbitration ID BR0#
RESERVED A[24:4]#, A[35:26]#
NOTE:
1. Asserting this signal during RESET# will select the corresponding option.
2. Address signals not identified in this table as configuration options should not be asserted
during RESET#.
3. Disabling of any of the cores within the processors must be handled by configuring the
EXT_CONFIG Model Specific Register (MSR). This MSR will allow for the disabling of a
single core per die within the processor package.
6.2 Clock Control and Low Power States

The processor allows the use of AutoHALT and Stop-Grant states to reduce power
consumption by stopping the clock to internal sections of the processor, depending on
each particular state. See Figure 19 for a visual representation of the processor low
power states.
Datasheet 87
Features
Figure 19. Processor Low Power State Machine
HALT or MWAIT Instruction and

HALT Bus Cycle Generated Extended HALT or HALT
Normal State INIT#, INTR, NMI, SMI#, RESET#, State
- Normal Execution FSB interrupts - BCLK running
- Snoops and interrupts
allowed
Snoop Snoop
Event Event
STPCLK# STPCLK# Occurs Serviced
Asserted De-asserted
STPCLK#
STPCLK# De-asserted
Asserted
Extended HALT Snoop or

HALT Snoop State
- BCLK running
- Service Snoops to caches
Stop Grant State Snoop Event Occurs

- BCLK running Extended Stop Grant or
- Snoops and interrupts Stop Grant Snoop State
Snoop Event Serviced - BCLK running
allowed
- Service Snoops to caches
SLP# SLP#
Asserted De-asserted
DPSLP# DPRSTP#
Asserted Asserted Deeper Sleep State
Sleep State Deep Sleep State
- BCLK running - BCLK can be stopped
- BCLK can be stopped
- No Snoops or - No Snoops or
- No Snoops or
interrupts allowed interrupts allowed
interrupts allowed
- PECI unavailable in DPSLP# - PECI unavailable in
- PECI unavailable in DPRSTP#
this state De-asserted this state
this state De-asserted
6.2.1 Normal State

This is the normal operating state for the processor.
6.2.2 HALT and Extended HALT Powerdown States

The processor supports the HALT or Extended HALT powerdown state. The Extended
HALT powerdown state must be configured and enabled using the BIOS for the
processor to remain within specification.
The Extended HALT state is a lower power state as compared to the Stop Grant State.
If Extended HALT is not enabled, the default powerdown state entered will be HALT.
Refer to the sections below for details about the HALT and Extended HALT states.
6.2.2.1 HALT Powerdown State

HALT is a low power state entered when all the processor cores have executed the HALT
or MWAIT instructions. When one of the processor cores executes the HALT instruction,
that processor core is halted, however, the other processor continues normal operation.
The halted core will transition to the Normal state upon the occurrence of SMI#, INIT#,
or LINT[1:0] (NMI, INTR). RESET# will cause the processor to immediately initialize
itself.
88 Datasheet
Features
The return from a System Management Interrupt (SMI) handler can be to either
Normal Mode or the HALT powerdown state. See the Intel Architecture Software
Developer's Manual, Volume 3B: System Programming Guide, Part 2 for more
information.
The system can generate a STPCLK# while the processor is in the HALT powerdown
state. When the system de-asserts the STPCLK# interrupt, the processor will return
execution to the HALT state.
While in HALT powerdown state, the processor will process bus snoops.
6.2.2.2 Extended HALT Powerdown State

Extended HALT is a low power state entered when all processor cores have executed
the HALT or MWAIT instructions and Extended HALT has been enabled using the BIOS.
When one of the processor cores executes the HALT instruction, that logical processor
is halted; however, the other processor continues normal operation. The Extended
HALT powerdown state must be enabled using the BIOS for the processor to remain
within its specification.
The processor will automatically transition to a lower frequency and voltage operating
point before entering the Extended HALT state. Note that the processor FSB frequency
is not altered; only the internal core frequency is changed. When entering the low
power state, the processor will first switch to the lower bus ratio and then transition to
the lower VID.
While in Extended HALT state, the processor will process bus snoops.
The processor exits the Extended HALT state when a break event occurs. When the
processor exits the Extended HALT state, it will resume operation at the lower
frequency, transition the VID to the original value, and then change the bus ratio back
to the original value.
6.2.3 Stop Grant and Extended Stop Grant States

The processor supports the Stop Grant and Extended Stop Grant states. The Extended
Stop Grant state is a feature that must be configured and enabled using the BIOS.
Refer to the sections below for details about the Stop Grant and Extended Stop Grant
states.
6.2.3.1 Stop-Grant State

When the STPCLK# signal is asserted, the Stop Grant state of the processor is entered
20 bus clocks after the response phase of the processor-issued Stop Grant
Acknowledge special bus cycle.
Since the GTL+ signals receive power from the FSB, these signals should not be driven
(allowing the level to return to VTT) for minimum power drawn by the termination
resistors in this state. In addition, all other input signals on the FSB should be driven to
the inactive state.
RESET# will cause the processor to immediately initialize itself, but the processor will
stay in Stop-Grant state. A transition back to the Normal state will occur with the de-
assertion of the STPCLK# signal.
A transition to the Grant Snoop state will occur when the processor detects a snoop on
the FSB (see Section 6.2.4).
While in the Stop-Grant State, SMI#, INIT# and LINT[1:0] will be latched by the
processor, and only serviced when the processor returns to the Normal State. Only one
occurrence of each event will be recognized upon return to the Normal state.
Datasheet 89
Features
While in Stop-Grant state, the processor will process a FSB snoop.
6.2.3.2 Extended Stop Grant State

Extended Stop Grant is a low power state entered when the STPCLK# signal is asserted
and Extended Stop Grant has been enabled using the BIOS.
The processor will automatically transition to a lower frequency and voltage operating
point before entering the Extended Stop Grant state. When entering the low power
state, the processor will first switch to the lower bus ratio and then transition to the
lower VID.
The processor exits the Extended Stop Grant state when a break event occurs. When
the processor exits the Extended Stop Grant state, it will resume operation at the lower
frequency, transition the VID to the original value, and then change the bus ratio back
to the original value.
6.2.4 Extended HALT Snoop State, HALT Snoop State, Extended

Stop Grant Snoop State, and Stop Grant Snoop State
The Extended HALT Snoop State is used in conjunction with the Extended HALT state. If
Extended HALT state is not enabled in the BIOS, the default Snoop State entered will
be the HALT Snoop State. Refer to the sections below for details on HALT Snoop State,
Stop Grant Snoop State, Extended HALT Snoop State, Extended Stop Grant Snoop
State.
6.2.4.1 HALT Snoop State, Stop Grant Snoop State

The processor will respond to snoop transactions on the FSB while in Stop-Grant state
or in HALT powerdown state. During a snoop transaction, the processor enters the HALT
Snoop State:Stop Grant Snoop state. The processor will stay in this state until the
snoop on the FSB has been serviced (whether by the processor or another agent on the
FSB). After the snoop is serviced, the processor will return to the Stop Grant state or
HALT powerdown state, as appropriate.
6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State
The processor will remain in the lower bus ratio and VID operating point of the
Extended HALT state or Extended Stop Grant state.
While in the Extended HALT Snoop State or Extended Stop Grant Snoop State, snoops
are handled the same way as in the HALT Snoop State or Stop Grant Snoop State. After
the snoop is serviced the processor will return to the Extended HALT state or Extended
Stop Grant state.
6.2.5 Sleep State

The Sleep state is a low power state in which the processor maintains its context,
maintains the phase-locked loop (PLL), and stops all internal clocks. The Sleep state is
entered through assertion of the SLP# signal while in the Extended Stop Grant or Stop
Grant state. The SLP# pin should only be asserted when the processor is in the
Extended Stop Grant or Stop Grant state. SLP# assertions while the processor is not in
these states is out of specification and may result in unapproved operation.
In the Sleep state, the processor is incapable of responding to snoop transactions or

latching interrupt signals. No transitions or assertions of signals (with the exception of
SLP#, DPSLP# or RESET#) are allowed on the FSB while the processor is in Sleep
state. Snoop events that occur while in Sleep state or during a transition into or out of
90 Datasheet
Features
Sleep state will cause unpredictable behavior. Any transition on an input signal before
the processor has returned to the Stop-Grant state will result in unpredictable
behavior.If RESET# is driven active while the processor is in the Sleep state, and held
active as specified in the RESET# pin specification, then the processor will reset itself,
ignoring the transition through the Stop-Grant state.
If RESET# is driven active while the processor is in the Sleep state, the SLP# and
STPCLK# signals should be de-asserted immediately after RESET# is asserted to
ensure the processor correctly executes the Reset sequence.
While in the Sleep state, the processor is capable of entering an even lower power
state, the Deep Sleep state, by asserting the DPSLP# pin (See Section Section 6.2.6).
While the processor is in the Sleep state, the SLP# pin must be de-asserted if another
asynchronous FSB event needs to occur. PECI is not available and will not respond
while in the Sleep State. Refer to the appropriate Thermal and Mechanical Design
Guidelines (see Section 1.2) for guidance on how to ensure PECI thermal data is
available when the Sleep State is enabled.
6.2.6 Deep Sleep State

The Deep Sleep state is entered through assertion of the DPSLP# pin while in the Sleep
state. BCLK may be stopped during the Deep Sleep state for additional platform level
power savings. BCLK stop/restart timings on appropriate chipset-based platforms with
the CK505 clock chip are as follows:
• Deep Sleep entry: the system clock chip may stop/tristate BCLK within two BCLKs
of DPSLP# assertion. It is permissible to leave BCLK running during Deep Sleep.
• Deep Sleep exit: the system clock chip must drive BCLK to differential DC levels
within 2-3 ns of DPSLP# de-assertion and start toggling BCLK within 10 BCLK
periods.
To re-enter the Sleep state, the DPSLP# pin must be de-asserted. BCLK can be
restarted after DPSLP# de-assertion as described above. A period of 15 microseconds
(to allow for PLL stabilization) must occur before the processor can be considered to be
in the Sleep state. Once in the Sleep state, the SLP# pin must be de-asserted to re-
enter the Stop-Grant state.
While in the Deep Sleep state the processor is incapable of responding to snoop
transactions or latching interrupt signals. No transitions of signals are allowed on the
FSB while the processor is in the Deep Sleep state. When the processor is in the Deep
Sleep state it will not respond to interrupts or snoop transactions. Any transition on an
input signal before the processor has returned to the Stop-Grant state will result in
unpredictable behavior. PECI is not available and will not respond while in the Deep
Sleep State. Refer to the appropriate Thermal and Mechanical Design Guidelines (see
Section 1.2) for guidance on how to ensure PECI thermal data is available when the
Deep Sleep State is enabled.
6.2.7 Deeper Sleep State

The Deeper Sleep state is similar to the Deep Sleep state but the core voltage is
reduced to a lower level. The Deeper Sleep state is entered through assertion of the
DPRSTP# pin while in the Deep Sleep state. Exit from Deeper Sleep is initiated by
DPRSTP# de-assertion. PECI is not available and will not respond while in the Deeper
Sleep State. Refer to the appropriate Thermal and Mechanical Design Guidelines (see
Section 1.2) for guidance on how to ensure PECI thermal data is available when the
Deeper Sleep State is enabled.
Datasheet 91
Features
In response to entering Deeper Sleep, the processor drives the VID code corresponding
to the Deeper Sleep core voltage on the VID pins. Unlike typical Dynamic VID changes
(where the steps are single VID steps) the processor will perform a VID jump on the
order of 100 mV. To support the Deeper Sleep State the platform must use a VRD 11.1
compliant solution.
6.2.8 Enhanced Intel SpeedStep® Technology

The processor supports Enhanced Intel SpeedStep Technology. This technology enables
the processor to switch between frequency and voltage points, which may result in
platform power savings. To support this technology, the system must support dynamic
VID transitions. Switching between voltage/frequency states is software controlled.
Enhanced Intel SpeedStep Technology is a technology that creates processor

performance states (P states). P states are power consumption and capability states
within the Normal state as shown in Figure 19. Enhanced Intel SpeedStep Technology
enables real-time dynamic switching between frequency and voltage points. It alters
the performance of the processor by changing the bus to core frequency ratio and
voltage. This allows the processor to run at different core frequencies and voltages to
best serve the performance and power requirements of the processor and system. Note
that the front side bus is not altered; only the internal core frequency is changed. In
order to run at reduced power consumption, the voltage is altered in step with the bus
ratio.
The following are key features of Enhanced Intel SpeedStep Technology:

• Voltage/Frequency selection is software controlled by writing to processor MSR's
(Model Specific Registers), thus eliminating chipset dependency.
— If the target frequency is higher than the current frequency, Vcc is incriminated
in steps (+12.5 mV) by placing a new value on the VID signals after which the
processor shifts to the new frequency. Note that the top frequency for the
processor can not be exceeded.
— If the target frequency is lower than the current frequency, the processor shifts
to the new frequency and Vcc is then decremented in steps (-12.5 mV) by
changing the target VID through the VID signals.
6.3 Processor Power Status Indicator (PSI) Signal

The processor incorporates the PSI# signal that is asserted when the processor is in a
reduced power consumption state. PSI# can be used to improve efficiency of the
voltage regulator, resulting in platform power savings.
PSI# may be asserted only when the processor is in the Deeper Sleep state.
92 Datasheet
Boxed Processor Specifications
7 Boxed Processor Specifications

7.1 Introduction
The processor will also be offered as an Intel boxed processor. Intel boxed processors
are intended for system integrators who build systems from baseboards and standard
components. The boxed processor will be supplied with a cooling solution. This chapter
documents baseboard and system requirements for the cooling solution that will be
supplied with the boxed processor. This chapter is particularly important for OEMs that
manufacture baseboards for system integrators.
Note: Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and
inches [in brackets]. Figure 20 shows a mechanical representation of a boxed
processor.
Note: Drawings in this section reflect only the specifications on the Intel boxed processor
product. These dimensions should not be used as a generic keep-out zone for all
cooling solutions. It is the system designers’ responsibility to consider their proprietary
cooling solution when designing to the required keep-out zone on their system
platforms and chassis. Refer to the appropriate Thermal and Mechanical Design
Guidelines (see Section 1.2) for further guidance. Contact your local Intel Sales
Representative for this document.
Figure 20. Mechanical Representation of the Boxed Processor
NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.
Datasheet 93
7.2 Mechanical Specifications

7.2.1 Boxed Processor Cooling Solution Dimensions
This section documents the mechanical specifications of the boxed processor. The
boxed processor will be shipped with an unattached fan heatsink. Figure 20 shows a
mechanical representation of the boxed processor.
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper
cooling. The physical space requirements and dimensions for the boxed processor with
assembled fan heatsink are shown in Figure 21 (Side View), and Figure 22 (Top View).
The airspace requirements for the boxed processor fan heatsink must also be
incorporated into new baseboard and system designs. Airspace requirements are
shown in Figure 26 and Figure 27. Note that some figures have centerlines shown
(marked with alphabetic designations) to clarify relative dimensioning.
Figure 21. Space Requirements for the Boxed Processor (Side View)
95.0
[3.74]
81.3
[3.2]
10.0 25.0
[0.39] [0.98]
B d P Sid Vi
Figure 22. Space Requirements for the Boxed Processor (Top View)
95.0
[3.74]
95.0
[3.74]
NOTES:
1. Diagram does not show the attached hardware for the clip design and is provided only as a
mechanical representation.
94 Datasheet
Figure 23. Overall View Space Requirements for the Boxed Processor
7.2.2 Boxed Processor Fan Heatsink Weight

The boxed processor fan heatsink will not weigh more than 450 grams. See Chapter 5
and the appropriate Thermal and Mechanical Design Guidelines (see Section 1.2) for
details on the processor weight and heatsink requirements.
7.2.3 Boxed Processor Retention Mechanism and Heatsink

Attach Clip Assembly
The boxed processor thermal solution requires a heatsink attach clip assembly, to
secure the processor and fan heatsink in the baseboard socket. The boxed processor
will ship with the heatsink attach clip assembly.
7.3 Electrical Requirements

7.3.1 Fan Heatsink Power Supply
The boxed processor's fan heatsink requires a +12 V power supply. A fan power cable
will be shipped with the boxed processor to draw power from a power header on the
baseboard. The power cable connector and pinout are shown in Figure 24. Baseboards
must provide a matched power header to support the boxed processor. Table 32
contains specifications for the input and output signals at the fan heatsink connector.
The fan heatsink outputs a SENSE signal, which is an open- collector output that pulses
at a rate of 2 pulses per fan revolution. A baseboard pull-up resistor provides VOH to
match the system board-mounted fan speed monitor requirements, if applicable. Use of
the SENSE signal is optional. If the SENSE signal is not used, pin 3 of the connector
should be tied to GND.
The fan heatsink receives a PWM signal from the motherboard from the 4th pin of the
connector labeled as CONTROL.
Datasheet 95
The boxed processor's fanheat sink requires a constant +12 V supplied to pin 2 and
does not support variable voltage control or 3-pin PWM control.
The power header on the baseboard must be positioned to allow the fan heatsink power
cable to reach it. The power header identification and location should be documented in
the platform documentation, or on the system board itself. Figure 25 shows the
location of the fan power connector relative to the processor socket. The baseboard
power header should be positioned within 110 mm [4.33 inches] from the center of the
processor socket.
Figure 24. Boxed Processor Fan Heatsink Power Cable Connector Description
Pin Signal Straight square pin, 4-pin terminal housing with

1 GND polarizing ribs and friction locking ramp.
2 +12 V
0.100" pitch, 0.025" square pin width.
3 SENSE
4 CONTROL Match with straight pin, friction lock header on
mainboard.
1 2 3 4
Table 32. Fan Heatsink Power and Signal Specifications
Description Min Typ Max Unit Notes
+12 V: 12 volt fan power supply 11.4 12 12.6 V -

IC:
• Maximum fan steady-state current draw — 1.2 — A
• Average fan steady-state current draw — 0.5 — A
-
• Maximum fan start-up current draw — 2.2 — A
• Fan start-up current draw maximum — 1.0 — Second
duration
pulses per
1
SENSE: SENSE frequency — 2 — fan
revolution
2, 3
CONTROL 21 25 28 kHz
NOTES:
1. Baseboard should pull this pin up to 5 V with a resistor.
2. Open drain type, pulse width modulated.
3. Fan will have pull-up resistor for this signal to maximum of 5.25 V.
96 Datasheet
Figure 25. Baseboard Power Header Placement Relative to Processor Socket
R110
[4.33]
B
7.4 Thermal Specifications

This section describes the cooling requirements of the fan heatsink solution used by the
boxed processor.
7.4.1 Boxed Processor Cooling Requirements

The boxed processor may be directly cooled with a fan heatsink. However, meeting the
processor's temperature specification is also a function of the thermal design of the
entire system, and ultimately the responsibility of the system integrator. The processor
temperature specification is provided in Chapter 5. The boxed processor fan heatsink is
able to keep the processor temperature within the specifications (see Table 27) in
chassis that provide good thermal management. For the boxed processor fan heatsink
to operate properly, it is critical that the airflow provided to the fan heatsink is
unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the fan
heatsink. Airspace is required around the fan to ensure that the airflow through the fan
heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling
efficiency and decreases fan life. Figure 26 and Figure 27 illustrate an acceptable
airspace clearance for the fan heatsink. The air temperature entering the fan should be
kept below 38 ºC. Again, meeting the processor's temperature specification is the
responsibility of the system integrator.
Datasheet 97
Figure 26. Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view)
Figure 27. Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view)
98 Datasheet
7.4.2 Variable Speed Fan

If the boxed processor fan heatsink 4-pin connector is connected to a 3-pin
motherboard header it will operate as follows:
The boxed processor fan will operate at different speeds over a short range of
internal chassis temperatures. This allows the processor fan to operate at a lower
speed and noise level, while internal chassis temperatures are low. If internal
chassis temperature increases beyond a lower set point, the fan speed will rise
linearly with the internal temperature until the higher set point is reached. At that
point, the fan speed is at its maximum. As fan speed increases, so does fan noise
levels. Systems should be designed to provide adequate air around the boxed
processor fan heatsink that remains cooler then lower set point. These set points,
represented in Figure 28 and Table 33, can vary by a few degrees from fan heatsink
to fan heatsink. The internal chassis temperature should be kept below 38 ºC.
Meeting the processor's temperature specification (see Chapter 5) is the
responsibility of the system integrator.
The motherboard must supply a constant +12 V to the processor's power header to
ensure proper operation of the variable speed fan for the boxed processor. Refer to
Table 32 for the specific requirements.
Figure 28. Boxed Processor Fan Heatsink Set Points
Higher Set Point

Highest Noise Level
Increasing Fan
Speed & Noise
Lower Set Point

Lowest Noise Level
X Y Z
Internal Chassis Temperature (Degrees C)
Datasheet 99
Table 33. Fan Heatsink Power and Signal Specifications
Boxed Processor
Fan Heatsink Set Boxed Processor Fan Speed Notes
Point (°C)
When the internal chassis temperature is below or equal to

this set point, the fan operates at its lowest speed. 1
X ≤ 30
Recommended maximum internal chassis temperature for
nominal operating environment.
When the internal chassis temperature is at this point, the fan
operates between its lowest and highest speeds.
Y = 35 -
Recommended maximum internal chassis temperature for
worst-case operating environment.
When the internal chassis temperature is above or equal to
Z ≥ 38 -
this set point, the fan operates at its highest speed.
NOTES:
1. Set point variance is approximately ± 1 °C from fan heatsink to fan heatsink.
If the boxed processor fan heatsink 4-pin connector is connected to a 4-pin

motherboard header and the motherboard is designed with a fan speed controller with
PWM output (CONTROL see Table 32) and remote thermal diode measurement
capability the boxed processor will operate as follows:
As processor power has increased the required thermal solutions have generated
increasingly more noise. Intel has added an option to the boxed processor that allows
system integrators to have a quieter system in the most common usage.
The 4th wire PWM solution provides better control over chassis acoustics. This is
achieved by more accurate measurement of processor die temperature through the
processor's Digital Thermal Sensors (DTS) and PECI. Fan RPM is modulated through the
use of an ASIC located on the motherboard that sends out a PWM control signal to the
4th pin of the connector labeled as CONTROL. The fan speed is based on actual
processor temperature instead of internal ambient chassis temperatures.
If the new 4-pin active fan heat sink solution is connected to an older 3-pin baseboard
processor fan header, it will default back to a thermistor controlled mode, allowing
compatibility with existing 3-pin baseboard designs. Under thermistor controlled mode,
the fan RPM is automatically varied based on the Tinlet temperature measured by a
thermistor located at the fan inlet.
For more details on specific motherboard requirements for 4-wire based fan speed
control, refer to the appropriate Thermal and Mechanical Design Guidelines (see
Section 1.2).
100 Datasheet
Debug Tools Specifications
8 Debug Tools Specifications

8.1 Logic Analyzer Interface (LAI)
Intel is working with two logic analyzer vendors to provide logic analyzer interfaces
(LAIs) for use in debugging Intel Core™2 Duo processor E8000 and E7000 series
systems. Tektronix and Agilent should be contacted to get specific information about
their logic analyzer interfaces. The following information is general in nature. Specific
information must be obtained from the logic analyzer vendor.
Due to the complexity of Intel Core™2 Duo processor E8000 and E7000 series systems,
the LAI is critical in providing the ability to probe and capture FSB signals. There are
two sets of considerations to keep in mind when designing an Intel Core™2 Duo
processor E8000 and E7000 series system that can make use of an LAI: mechanical
and electrical.
8.1.1 Mechanical Considerations

The LAI is installed between the processor socket and the processor. The LAI lands plug
into the processor socket, while the processor lands plug into a socket on the LAI.
Cabling that is part of the LAI egresses the system to allow an electrical connection
between the processor and a logic analyzer. The maximum volume occupied by the LAI,
known as the keepout volume, as well as the cable egress restrictions, should be
obtained from the logic analyzer vendor. System designers must make sure that the
keepout volume remains unobstructed inside the system. Note that it is possible that
the keepout volume reserved for the LAI may differ from the space normally occupied
by the processor heatsink. If this is the case, the logic analyzer vendor will provide a
cooling solution as part of the LAI.
8.1.2 Electrical Considerations

The LAI will also affect the electrical performance of the FSB; therefore, it is critical to
obtain electrical load models from each of the logic analyzers to be able to run system
level simulations to prove that their tool will work in the system. Contact the logic
analyzer vendor for electrical specifications and load models for the LAI solution it
provides.
Datasheet 101
Debug Tools Specifications
102 Datasheet

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Intel® Core™2 Duo Processor E8000Δ

and E7000Δ Series

Document Number: 318732-006

-001 • Initial release January 2008

• Added Intel® Core™2 Duo processor E8300 and E7200

-005 • Added Intel® Core™2 Duo processor E7500 January 2009

-006 • Added Intel® Core™2 Duo processor E7600 June 2009

1.1.1 Processor Terminology Definitions

• Storage conditions — Refers to a non-operational state. The processor may be

2.1 Power and Ground Lands

2.2 Decoupling Guidelines

2.2.1 VCC Decoupling

2.2.2 VTT Decoupling

2.2.3 FSB Decoupling

2.3 Voltage Identification

Table 2. Voltage Identification Definition

2.4 Reserved, Unused, and TESTHI Signals

All TESTHI[12,10:0] lands should be individually connected to VTT using a pull-up

2.5 Power Segment Identifier (PSID)

2.6 Voltage and Current Specification

At conditions outside functional operation condition limits, but within absolute

At conditions exceeding absolute maximum and minimum ratings, neither functionality

Table 3. Absolute Maximum and Minimum Ratings

Symbol Parameter Min Max Unit Notes1, 2

VCC Core voltage with respect to VSS –0.3 1.45 V -

2.6.2 DC Voltage and Current Specification

Table 4. Voltage and Current Specifications

Symbol Parameter Min Typ Max Unit Notes2, 10

VID Range VID 0.8500 — 1.3625 V 1

FSB termination on Intel 3 series

Table 4. Voltage and Current Specifications

Symbol Parameter Min Typ Max Unit Notes2, 10

ICC for VTT supply before VCC stable 4.5

VID - 0.025 Vcc Maximum

VID - 0.075 Vcc Typical

0 0.000 -0.019 -0.038

VID - 0.088 Vcc Typical

VID - 0.125 Vcc Minimum

2.6.3 VCC Overshoot

Table 7. VCC Overshoot Specifications

Symbol Parameter Min Max Unit Figure Notes

Magnitude of VCC overshoot above 1

Figure 3. VCC Overshoot Example Waveform

Example Overshoot Waveform

TOS: Overshoot time above VID

2.6.4 Die Voltage Validation

2.7 Signaling Specifications

2.7.1 FSB Signal Groups

GTL+ Common Synchronous to

Signals Associated Strobe

Table 9. Signal Characteristics

Signals with RTT Signals with No RTT

A20M#, BCLK[1:0], BPM[5:0]#, BSEL[2:0],

Open Drain Signals1

THERMTRIP#, FERR#/PBE#, IERR#, BPM[5:0]#,

Table 10. Signal Reference Voltages