TD62783,784APG/AFG

TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic

TD62783APG,TD62783AFG,TD62784APG,TD62784AFG
8 ch High-Voltage Source Driver

The TD62783APG/AFG Series are comprised of eight source

current Transistor Array. TD62783APG
These drivers are specifically designed for fluorescent display TD62784APG
applications.
Applications include relay, hammer and lamp drivers.
The suffix (G) appended to the part number represents a Lead
(Pb)-Free product.

Features
• High output voltage: VCC = 50 V (min)
• Output current (single output): IOUT = −500 mA (min) TD62783AFG
• Output clamp diodes TD62784AFG
• Single supply voltage
• Input compatible with various types of logic
• Package type-APG: DIP-18 pin
• Package type-AFG: SOP-18 pin

Type Designation

TD62783APG/AFG TTL, 5V CMOS

Weight
TD62784APG/AFG 6 to 15V PMOS, CMOS
DIP18-P-300-2.54D: 1.47 g (typ.)
SOP18-P-375-1.27: 0.41 g (typ.)
Pin Assignment (top view)

O1 O2 O3 O4 O5 O6 O7 O8 GND
18 17 16 15 14 13 12 11 10

1 2 3 4 5 6 7 8 9
I1 I2 I3 I4 I5 I6 I7 I8 VCC

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Schematics (each driver)

VCC

20 kΩ
10 kΩ
Input

10 kΩ
2.6 kΩ
Output
5 kΩ

n TD62783: n = 1
TD62784: n = 4
GND

Note: The input and output parasitic diodes cannot be used as clamp diodes.

Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Supply voltage VCC 50 V

Output current IOUT −500 mA/ch
VIN (Note 1) 15
Input voltage V
VIN (Note 2) 30
Clamp diode reverse voltage VR 50 V
Clamp diode forward current IF 500 mA
APG 1.47
Power dissipation PD (Note 3) W
AFG 0.96
Operating temperature Topr −40 to 85 °C
Storage temperature Tstg −55 to 150 °C

Note 1: Only TD62783APG/AFG

Note 2: Only TD62784APG/AFG

Note 3: Derated above 25°C in the proportion of 11.7 W/°C (APG type), 7.7 W/°C (AFG type)

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Recommended Operating Conditions (Ta = −40 to 80°C)

Characteristics Symbol Test Condition Min Typ. Max Unit

Supply voltage VCC ⎯ ⎯ ⎯ 50 V

Duty = 10% 8 circuits ⎯ ⎯ −260
Ta = 85°C, Duty = 50% 8 circuits ⎯ ⎯ −59
Output current IOUT Tj = 120°C, mA/ch
Tpw = 25 ms Duty = 10% 8 circuits ⎯ ⎯ −180
AFG
Duty = 50% 8 circuits ⎯ ⎯ −38
TD62783APG/AFG ⎯ ⎯ ⎯ 12
Input voltage VIN V
TD62784APG/AFG ⎯ ⎯ ⎯ 24

Output TD62783APG/AFG VIN (ON) ⎯ 2.0 5.0 15

ON TD62784APG/AFG ⎯ 4.5 12.0 30
Input
V
voltage VIN (OFF) ⎯ ⎯
Output TD62783APG/AFG 0 0.8
OFF TD62784APG/AFG ⎯ 0 ⎯ 2.0

Clamp diode reverse APG ⎯ ⎯ ⎯ 50

VR V
voltage AFG ⎯ ⎯ ⎯ 35
Clamp diode forward current IF ⎯ ⎯ ⎯ 400 mA
APG ⎯ ⎯ ⎯ 0.52
Power dissipation PD W
AFG ⎯ ⎯ ⎯ 0.35

Electrical Characteristics (Ta = 25°C)

Test
Characteristics Symbol Test Condition Min Typ. Max Unit
Circuit
VCC = VCC max VIN = 0.4 V
Output leakage current ICEX 1 ⎯ ⎯ 100 µA
Ta = 25°C
VIN = VIN (ON), IOUT = −350 mA ⎯ ⎯ 2.0
Output saturation voltage VCE (sat) 2 VIN = VIN (ON), IOUT = −225 mA ⎯ ⎯ 1.9 V

VIN = VIN (ON), IOUT = −100 mA ⎯ ⎯ 1.8

VIN = 2.4 V ⎯ 36 52
TD62783APG/AFG
VIN = 3.85 V ⎯ 180 260
Input current IIN (ON) 3 µA
VIN = 5 V ⎯ 92 130
TD62784APG/AFG
VIN = 12 V ⎯ 790 1130
TD62783APG/AFG VCE = 2.0 V ⎯ ⎯ 2.0
VIN (ON)
TD62784APG/AFG IOUT = −350 mA ⎯ ⎯ 4.5
Input voltage 4 V
TD62783APG/AFG 0.8 ⎯ ⎯
VIN (OFF) IOUT = −500 µA
TD62784APG/AFG 2.0 ⎯ ⎯
Supply current ICC (ON) 3 VIN = VIN (ON), VCC = 50 V ⎯ ⎯ 2.5 mA/ch
Clamp diode reverse current IR 5 VR = 50 V ⎯ ⎯ 50 µA
Clamp diode forward voltage VF 6 IF = 350 mA ⎯ ⎯ 2.0 V
VCC = VCC max RL = 125 Ω
Turn-ON delay tON 7 ⎯ 0.15 ⎯ µs
CL = 15 pF, RL = 88 Ω
VCC = VCC max RL = 125 Ω
Turn-OFF delay tOFF 7 ⎯ 1.8 ⎯ µs
CL = 15 pF, RL = 88 Ω

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Test Circuit

1. ICEX 2. VCE (sat) 3. IIN (ON), ICC

VCC VCC VCC

VCE (sat) IIN (ON)

VIN VIN IOUT VIN

ICEX

4. VIN (ON), VIN (OFF) 5. IR 6. VF

VCC VCC Open

VCE

VIN (ON), VIN (OFF) IOUT IR VR VF IF

7. tON, tOFF
VIH
Input VCC
Input 50% 50%
0
Pulse 50 µs
generator tON tOFF
RL CL
(Note 1) VIN VOH
(Note 2)
Output 50% 50%
VOL

Note 1: Pulse Width 50 µs, Duty Cycle 10%

Output Impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns

Note 2: CL includes probe and jig capacitance.

Precautions for Using

This IC does not integrate protection circuits such as overcurrent and overvoltage protectors.
Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that
excess current or voltage will not be applied to the IC.
Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to
short-circuit between outputs, air contamination fault, or fault by improper grounding.

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IOUT – VIN IOUT – VIN

500 500
TA62783APG/AFG TA62784APG/AFG
Ta = 25°C typ. Ta = 25°C
400 400
(mA)

(mA)
Output current IOUT

Output current IOUT

300 300

200 200

100 100

0 0
0 0.4 0.8 1.2 1.6 2.0 0 1 2 3 4 5

Input voltage VIN (V) Input voltage VIN (V)

IIN – VIN IIN – VIN

1.6 3.2

TA62783APG/AFG TA62784APG/AFG
Ta = 25°C typ. Ta = 25°C typ.
(mA)

(mA)

1.2 2.4
IIN

IIN

0.8 1.6
Input current

Input current

0.4 0.8

0 0
0 4 8 12 16 0 8 16 24 32

Input voltage VIN (V) Input voltage VIN (V)

IOUT – VCE (sat) IF – VF

0.6 0.6
Ta = 25°C
Ta = 25°C typ.
|VCC − VEE| > 5 V
(A)
(A)

IF

0.4 0.4
IOUT

Diode forward current

Output current

0.2 0.2

0 0
0 0.8 1.6 2.4 3.2 0 0.4 0.8 1.2 1.6

Output saturation voltage VCE (sat) (V) Diode forward voltage VF (V)

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PD – Ta
2.0

(1) Type-APG free air

(2) Type-AFG free air
PD (W)

1.5

(1)
Power dissipation

1.0

(2)

0.5

0
0 500 100 150 200

Ambient temperature Ta (°C)

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Package Dimensions

Weight: 1.47 g (typ.)

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Package Dimensions

Weight: 0.41 g (typ.)

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Notes on Contents
1. Schematics
The schematics may be simplified or some parts of them may be omitted for explanatory purposes.

2. Absolute Maximum Ratings

The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must
not be exceeded during operation, even for an instant.
If any of these ratings are exceeded during operation, the electrical characteristics of the device may be
irreparably altered and the reliability and lifetime of the device can no longer be guaranteed.
Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation
in other equipment. Applications using the device should be designed so that no absolute maximum rating
will ever be exceeded under any operating conditions.
Before using, creating and/or producing designs, refer to and comply with the precautions and conditions
set forth in this document.

3. Recommended Operating Conditions

The values of the conditions are applied within the range of the operating temperature and not guaranteed.

4. AC Characteristics
AC characteristics that mean turn-on and turn-off time are targeted design values and not guaranteed.

5. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially in the phase of mass production design.
In furnishing these examples of application circuits, Toshiba does not grant the use of any industrial
property rights.

6. Graphics Characteristics
Graphics characteristics are reference ones and not guaranteed.

Handling of the IC
Ensure that the product is installed correctly to prevent breakdown, damage and/or degradation in the product or
equipment.

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