DataSheet GS1117A Rev1.1
DataSheet GS1117A Rev1.1
DataSheet GS1117A Rev1.1
Block Diagram
IN
+
-
THERMAL
LIMIT
GS1117A
ADJ OUT
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Packages & Pin Assignments
TO-252 SOT-223 SOT-89
Ordering Information
GS1117A GS1117AR
TO-252 SOT-223 SOT-89 TO-252 SOT-223 SOT-89 Output
GS1117AD GS1117AX GS1117AY GS1117ARD GS1117ARX GS1117ARY ADJ
GS1117AD12 GS1117AX12 GS1117AY12 GS1117ARD12 GS1117ARX12 GS1117ARY12 1.2V
GS1117AD15 GS1117AX15 GS1117AY15 GS1117ARD15 GS1117ARX15 GS1117ARY15 1.5V
GS1117AD18 GS1117AX18 GS1117AY18 GS1117ARD18 GS1117ARX18 GS1117ARY18 1.8V
GS1117AD25 GS1117AX25 GS1117AY25 GS1117ARD25 GS1117ARX25 GS1117ARY25 2.5V
GS1117AD33 GS1117AX33 GS1117AY33 GS1117ARD33 GS1117ARX33 GS1117ARY33 3.3V
GS1117AD50 GS1117AX50 GS1117AY50 GS1117ARD50 GS1117ARX50 GS1117ARY50 5.0V
*GS1117AXF or GS1117ARXF, X means package type and F means Lead Free part.
*For other voltages, please contact factory.
*Adjustable Version does not need Voltage Code.
GS1117A
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Marking Information
GS1117A
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Electrical Characteristics
IOUT=0mA,and TJ=+25 ºC unless otherwise specified.
Parameter Device Conditions MIN TYP MAX Unit
VIN =2.75V, ILOAD =10mA 1.238 1.250 1.262
Reference
GS1117A-Adj *VIN =2.7V to 12V, V
Voltage (Note) 1.225 1.250 1.275
ILOAD =10mA to 1A
VIN =3.7V 1.176 1.200 1.224 V
GS1117A-1.2
*VIN =3.0V, ILOAD =10mA to 1A 1.140 1.200 1.248 V
VIN =4.0V 1.485 1.500 1.515 V
GS1117A-1.5
*VIN =3.0V, ILOAD =10mA to 1A 1.476 1.500 1.524 V
VIN =4.3V 1.782 1.800 1.818 V
GS1117A-1.8
Output *VIN =3.3V, ILOAD =10mA to 1A 1.771 1.800 1.829 V
Voltage
VIN =5.0V 2.475 2.500 2.525 V
GS1117A-2.5
*VIN =4.0V, ILOAD =10mA to 1A 2.460 2.500 2.540 V
VIN =5.8V 3.267 3.300 3.333 V
GS1117A-3.3
*VIN =4.8V, ILOAD =10mA to 1A 3.247 3.300 3.353 V
VIN =7.5V 4.950 5.000 5.050 V
GS1117A-5.0
*VIN =6.5V, ILOAD =10mA to 1A 4.900 5.000 5.100 V
Line GS1117A-1.2 *ILOAD =10mA, 3.0V ≤ VIN ≤ 12V 10 15 mV
Regulation
*ILOAD =10mA,
(Note1) All 0.04 0.2 %
(1.5V+VOUT) ≤ VIN ≤ 12V
Load GS1117A-1.2 VIN=3.0V, 0 ≤ IOUT ≤ 1A 8 20 mV
Regulation
*VIN = VOUT+1.5V,
(Note1) All 0.2 0.4 %
ILOAD =10mA to 1A
Minimum
GS1117A-Adj *VIN =5V, VADJ =0V 3 7 mA
Load Current
Ground Pin *VIN = VOUT+1.5V,
GS1117A-XX 7 13 mA
Current ILOAD =10mA to 1A
Adjust Pin
GS1117A-Adj *VIN =2.65V to 12V, ILOAD =10mA 55 90 μA
Current
Current Limit All *VIN- VOUT=1.5V 1 A
Ripple
Rejection All VIN = VOUT+1.5V, 60 72 dB
(Note 2)
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Typical Performance Characteristics
Minimum Operating Current
(Adjustable Device) Short-Circuit Current
Minmum Operating Current(mA)
12 1.25
0 10 15 20
5 0 10 15
5
Input/Output differential(V) Input/Output Diffierential
△ILOAD=1A 90 fRIPPLE=120Hz
0.05
Ripple Rejection(dB)
80
0 70
VRIPPLE≦3VP-P
60
-0.05 50 fRIPPLE=20Hz
40
-0.10 VOUT=5V
30
CADJ=25μF
-0.15 20 COUT=25μF
10
-0.20 0
-50 -25 0 25 50 75 100 125 0 0.25 0.5 0.75 1.0
Temperature(℃) Output Current(A)
Typical Applications
10uF
IGND
Tant
IADJ
R2
EN
232
VOUT=VREF (1+R2/R1)+IADJR2
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Application Hints
The GS1117A series of adjustable and fixed regulators are easy to use and are protected against short circuit and
thermal overloads. Thermal protection circuitry will shut-down the regulator should the junction temperature exceed
165℃ at the sense point.
Pin compatible with older three terminal adjustable regulators, these devices offer the advantage of a lower
dropout voltage, more precise reference tolerance and improved reference stability with temperature.
Stability
The circuit design used in the GS1117A series requires the use of an output capacitor as part of the device
frequency compensation. The addition of 22μF solid tantalum on the output will ensure stability for all operating
conditions.
When the adjustment terminal is bypassed with a capacitor to improve the ripple rejection, the requirement for an
output capacitor increases. The value of 22μF tantalum covers all cases of bypassing the adjustment terminal.
Without bypassing the adjustment terminal smaller capacitors can be used with equally good results.
To further improve stability and transient response of these devices larger values of output capacitor can be used.
Protection Diodes
Unlike older regulators, the GS1117A family does not need any protection diodes between the adjustment pin
and the output and from the output to the input to prevent over-stressing the die. Internal resistors are limiting the
internal current paths on the GS1117A adjustment pin, therefore even with capacitors on the adjustment pin no
protection diode is needed to ensure device safety under short-circuit conditions.
Diodes between the input and output are not usually needed.
Microsecond surge currents of 50A to 100A can be handled by the internal diode between the input and output
pins of the device. In normal operations it is difficult to get those values of surge currents even with the use of large
output capacitances. If high value output capacitors are used, such as 1000μF to 5000μF and the input pin is
instantaneously shorted to ground, damage can occur. A diode from output to input is recommended, when a
crowbar circuit at the input of the GS1117A is used (Figure 6).
D1
GS1117A
R1
Cin ADJ
Cout
22uF
Cadj
EN10uF R2
Figure 6.
Output Voltage
The GS1117A series develops a 1.25V reference voltage between the output and the adjust terminal. Placing a
resistor between these two terminals causes a constant current to flow through R1 and down through R2 to set the
overall output voltage. This current is normally the specified minimum load current of 10mA. Because IADJ is very
small and constant it represents a small error and it can usually be ignored.
Vin IN OUT Vout
GS1117A
Vref R1
1.25V
Cin ADJ
Cout
GS1117A
IADJ
EN 50uA R2
VOUT=VREF(1+R2/R1)+IADJR2
Figure 7.
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Application Hints (Continues)
Load Regulation
True remote load sensing it is not possible to provide, because the GS1117A is a three terminal device. The
resistance of the wire connecting the regulator to the load will limit the load regulation. The data sheet
specification for load regulation is measured at the bottom of the package. Negative side sensing is a true Kelvin
connection, with the bottom of the output divider returned to the negative side of the load.
The best load regulation is obtained when the top of the resistor divider R1 is connected directly to the case not
to the load. If R1 were connected to the load, the effective resistance between the regulator and the load would be:
RP • ( R2+R1 ) / R1 , RP = Parasitic Line Resistance
Connected as shown, Rp is not multiplied by the divider ratio
RP
Parasitic Line Resistance
Vin IN OUT
GS1117A
R1
ADJ
RL
EN R2
*CONNECT R1 TO CASE
*CONNERT R2 TO LOAD
Figure 8.
In the case of fixed voltage devices the top of R1 is connected Kelvin internally, and the ground pin can be used for
negative side sensing.
Thermal Considerations
The GS1117A series have internal power and thermal limiting circuitry designed to protect the device under
overload conditions. However maximum junction temperature ratings of 125℃ should not be exceeded under
continuous normal load conditions.
Careful consideration must be given to all sources of thermal resistance from junction to ambient. For the
surface mount package SOT-223 additional heat sources mounted near the device must be considered. The heat
dissipation capability of the PC board and its copper traces is used as a heat sink for the device. The thermal
resistance from the junction to the tab for the GS1117A is 15 ºC/W. Thermal resistance from tab to ambient can be
as low as 30 ºC/W.
The total thermal resistance from junction to ambient can be as low as 45 ºC/W. This requires a reasonable sized
PC board with at least on layer of copper to spread the heat across the board and couple it into the surrounding air.
Experiments have shown that the heat spreading copper layer does not need to be electrically connected to the
tab of the device. The PC material can be very effective at transmitting heat between the pad area, attached to the
pad of the device, and a ground plane layer either inside or on the opposite side of the board. Although the actual
thermal resistance of the PC material is high, the Length/Area ratio of the thermal resistance between layers is
small. The data in Table 1, was taken using 1/16” FR-4 board with 1 oz. copper foil, and it can be used as a rough
guideline for estimating thermal resistance.
For each application the thermal resistance will be affected by thermal interactions with other components on the
board. To determine the actual value some experimentation will be necessary.
The power dissipation of the GS1117A is equal to:
PD = ( Vin - VOUT ) •( IOUT )
Maximum junction temperature will be equal to:
TJ = TA (MAX) + PD [Thermal Resistance (junction-to-ambient)]
Maximum junction temperature must not exceed 125ºC
GS1117A
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Package Dimension
TO-252 PLASTIC PACKAGE
E A
L3 b2 E1
c1 THERMAL PAD
θ1 E1/2
D1
D H
L4
b1 L5
b c
e
L2
SEATING PLANE
θ L A1
(L1)
Dimensions
Millimeters Inches
SYMBOL
MIN MAX MIN MAX
A 2.18 2.39 .086 .094
A1 - 0.13 - .005
b 0.64 0.89 .025 .035
b1 0.76 1.14 .030 .045
b2 4.95 5.46 .195 .215
C 0.46 0.61 .018 .024
C1 0.46 0.89 .018 .035
D 5.97 6.22 .235 .245
D1 5.21 - .205 -
E 6.35 6.73 .250 .265
E1 4.32 - .170 -
e 2.29 (TYP) .090 (TYP)
H 9.40 10.41 .370 .410
L 1.40 1.78 .055 .070
L1 2.74 (TYP) .108 (TYP)
GS1117A
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SOT-223 PLASTIC PACKAGE
D
b2 A
A2 G
A1
E1 E
b
C
e e1/2
e1
Dimensions
Millimeters Inches
SYMBOL
MIN MAX MIN MAX
A - 1.80 - .071
A1 0.02 0.10 .001 .004
A2 1.55 1.65 .061 .065
b 0.66 0.84 .026 .033
b2 2.90 3.10 .114 .122
c 0.23 0.33 .009 .013
D 6.30 6.70 .248 .264
E 6.70 7.30 .264 .288
E1 3.30 3.70 .130 .146
e 2.30 (TYP) .091 (TYP)
e1 4.60 (TYP) .181 (TYP)
L 0.90 - .035 -
G 0.25 (TYP) .010 (TYP)
θ 0° 8° 0° 8°
GS1117A
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SOT-89 PLASTIC PACKAGE
A
D
C
D1
E E1
H
B1
B
e
e1
Dimensions
Millimeters Inches
SYMBOL
MIN MAX MIN MAX
A 1.40 1.60 .055 .063
B 0.44 0.56 .017 .022
B1 0.36 0.48 .014 .019
C 0.35 0.44 .014 .017
D 4.40 4.60 .173 .181
D1 1.62 1.83 .064 .072
E 2.29 2.60 .090 .102
E1 2.13 2.29 .084 .090
e 1.50 (TYP) .059 (TYP)
e1 3.00 (TYP) .118 (TYP)
H 3.94 4.25 .155 .167
L 0.89 1.20 .035 .047
GS1117A
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NOTICE
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responsibility for the consequences of use of such information nor for any infringement of patents or other rights of
third parties, which may result from its use. No license is granted by implication or otherwise under any patent or
patent rights of Globaltech Semiconductor. Specifications mentioned in this publication are subject to change
without notice. This publication supersedes and replaces all information without express written approval of
Globaltech Semiconductor.
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Version_1.1 Notice