What is New in IPC-7351C

by Tom Hausherr
CEO & Founder of PCB Libraries, Inc.
www.pcblibraries.com
Through-Hole Technology

PCB Libraries Presents:

What is New in IPC-7351C
3-Tier IMD (Inserted Mount Device)
The original IPC-7251 Concept for 3-Tier Pad Stack
Maximum Median Minimum
(Most) (Nominal) (Least)
Joint Characteristics
Density Density Density
Level A Level B Level C
Hole Diameter Factor (over max lead) 0.25 0.20 0.15
Int. & Ext. Annular Ring Excess 0.50 0.35 0.30
(added to hole dia.)
Anti-pad Excess (added to hole dia.) 1.00 0.70 0.50
Courtyard Excess from Component
Body and/or Pads 0.50 0.25 0.12
(which ever is greater)
Courtyard Round-off factor Round up to the nearest even two place decimal,
i.e., 1.00, 1.01, 1.02, 1.03 etc.

PCB Libraries Presents:

What is New in IPC-7351C
3-Tier Pad Stack Concept Proportional Pad Stack

Small Hole
Same Annular Ring

Large
Hole
Proportional
Annular Ring

PCB Libraries Presents:

What is New in IPC-7351C
No 3-Tier Library System
IPC-7351C Proportional Pad Stacks

PCB Libraries Presents:

What is New in IPC-7351C
IPC-7351C Proportional Pad Stacks

PCB Libraries Presents:

What is New in IPC-7351C
Rounded Rectangle Pad Shape

• Most Component Manufacturer’s

Recommended Pad Shape is Rectangle
• IPC-SM-782 and IPC-7351B
Recommended Pad Shape is Oblong
• IPC-7351C – Rounded Rectangle Pad
Corner Radius =
25% Land Width
1 Mil (0.01 mm)
Land Width = Round-off
Shortest Side

Maximum Radius =
10 Mil (0.25 mm)

PCB Libraries Presents:

What is New in IPC-7351C
Surface Mount Component Lead Styles

Ball Grid Array Bump Grid Array Land Grid Array Column Grid Array Pillar Grid Array Flat Lug

Flat Side Convex Side Concave Side Corner Concave Inward L Flat Bottom

Gull Wing Outward L J-Lead End Cap Under Body L No-Lead

PCB Libraries Presents:

What is New in IPC-7351C
Lead Styles and Rounded Rectangle Pads

Under Body “L” End Cap Gull Wing

PQFN D-Shape Corner Concave QFN D-Shape

Sharp Corner pads are not good for RF design

PCB Libraries Presents:
What is New in IPC-7351C
Lead Styles Exempt from Rounded Rectangle Pads

• Ball Grid Array

• Column Grid Array
• Land Grid Array
• Dual Flat No-lead
• Thermal Pads
• Through-hole Square Pads

PCB Libraries Presents:

What is New in IPC-7351C
Guidelines for Drafting Items

• Silkscreen Outline and Polarity Marking

• Assembly Outline and Polarity Marking
• Courtyard Outline
• Land Pattern Origin Marker
• Component Outline
• Terminal Lead Outline

PCB Libraries Presents:

What is New in IPC-7351C
Silkscreen Outline Guidelines
1. No silkscreen outline under the component body; these get covered up
during assembly and don’t provide any useful purpose (waste of good ink)
2. Silkscreen outlines visible after assembly process and provide a functional
use as alignment marking for assembly registration accuracy
3. Silkscreen outlines should be inside placement courtyard
4. Silkscreen outlines should be mapped to the Maximum Component Body
with one exception, the Silkscreen to Pad spacing rule “overrides” the
Component Body Mapping
5. Silkscreen outlines should map the component body and not go around
pads. Excess silkscreen outlines should be avoided to make room for ref
des locations. Silkscreen outlines should perform a “hatch” outline along
the component package body.
6. Pin 1 is identified by extending the silkscreen along Pin 1 length of pads
when component leads extend outward. Bottom only terminals Pin 1 is
identified by a missing line.
PCB Libraries Presents:
What is New in IPC-7351C
3-Tier Silkscreen Outlines
• The recommended guidelines for 3-Tier line widths and
Silkscreen to Pad Gap are illustrated in the pictures below
representing a SOT23-6 component package
• The Silkscreen to Pad Clearance is the same as the Line Width
Least Density Level Nominal Density Level Most Density Level
0.10 mm Line Width 0.12 mm Line Width 0.2 mm Line Width

PCB Libraries Presents:

What is New in IPC-7351C
Silkscreen Outline Pkg. Body Hatching
• The Maximum Component Body tolerance is the starting place for
mapping a silkscreen outline inside edge
• Silkscreen should only be applied to edges of the plastic component
package or hatched (corner cropping) larger component packages like
BGA, CGA and LGA packages
• It is not recommended to map silkscreen outlines to land pattern pads
Quad Flat Package Pull-back Quad Flat No-lead Ball Grid Array
QFP PQFN BGA

PCB Libraries Presents:

What is New in IPC-7351C
Silkscreen Polarity Marking

Gull Wing & J-Lead, Bottom Only & Chip

Gull Wing & J-Lead Polarity Bottom Only Polarity
Absence of Silkscreen

2-pin Component Polarity 2-pin Component Non-polarity

PCB Libraries Presents:

What is New in IPC-7351C
Silkscreen Visible After Assembly
Quad Flat No-lead (QFN) Ball Grid Array (BGA) Quad Flat Pack (QFP)

SOT23

Axial Resistor

PCB Libraries Presents:

What is New in IPC-7351C
Assembly Outline & Polarity Guidelines
Non-polarized Chip, Polarized Chip, SOD,
Crystal, Molded Body LED, SOT. Molded Body
0.10 mm
Line Width
1.00 mm
Small Outline Package Plastic Leaded Chip Carrier
SOP, SON, QFN, QFP PLCC, LCC, 4-sided Chip Array

1.00 mm

1.00 mm

PCB Libraries Presents:

What is New in IPC-7351C
IPC-7351B Rectangular Courtyards

PCB Libraries Presents:

What is New in IPC-7351C
IPC-7351C Contour Courtyard Outlines
The recommended courtyard outline line widths are 0.05 mm or 0.01 mm

PCB Libraries Presents:

What is New in IPC-7351C
Component Body & Terminal Outlines
• The Nominal Component Body and Terminal Lead Outlines
• Output to CAD tool on a mechanical layer

PCB Libraries Presents:

What is New in IPC-7351C
3-Tier Silkscreen Reference Designators
• Silkscreen reference designators are normally placed inside the
courtyard during library construction and typically located on the
land pattern origin. After part placement has been approved, the
silkscreen ref des are relocated outside the component body so
they are visible after assembly.
• The ref des line width is normally 10% of the text height
• In the past, we made all silkscreen reference designators 1.50 mm
height. Fabrication technology has improved it’s time to support a
3-Tier reference designator option
• New recommendations for the 3-Tier ref des

REFDES
– Least Density Level: 1.00 mm Height
– Nominal Density Level: 1.20 mm Height
– Most Density Level: 1.50 mm Height

PCB Libraries Presents:

What is New in IPC-7351C
Assembly Reference Designators
• The default assembly Ref Des height is 2.00 mm
• For miniature components the text height must be scalable to fit
• The default rotation of the assembly reference designator is
associated with the component body length

0.6 x 0.3 1.0 x 0.5 1.6 x 0.8 2.0 x 1.2

0201 0402 0603 0805
REFDES REFDES
Ref Des Height
REFDES REFDES
Ref Des Height
0.50 mm 0.70 mm Ref Des Height
Ref Des Height
1.00 mm
0.12 mm

These Chip assembly Ref Des are scaled down to fit inside assembly outlines

PCB Libraries Presents:

What is New in IPC-7351C
Land Pattern Origin Guidelines
• The land pattern origin is typically located at the center of gravity of the
component, but sometimes this is difficult to calculate with irregular
shaped components, so Pin 1 is used in these cases. Also Pin 1 in most
through-hole connectors.
• The centroid origin marking in the picture below is an unfilled 0.50 mm
diameter circle with a 0.05 line width with a 0.70 crosshair for cursor
alignment.

PCB Libraries Presents:

What is New in IPC-7351C
Snap Grid & Feature Round-off 0.01 mm
Footprint Features in 0.01 mm increments
0.01 0.01 0.01

0.01 0.01 0.01

0.005 for 0.65 pitch

0.01
0.01

Line Widths Corner Radius

0.01 0.01 0.01 0.01
*Japanese 80% rule
PCB Libraries Presents:
What is New in IPC-7351C
3-Tier Local Fiducials
• Local Fiducials have been used only on fine pitch QFP and BGA
Land Patterns
• Fine pitch QFP = Less than 25 mil (0.635 mm) pitch
• Fine pitch BGA = Less than 32 mil (0.8 mm) pitch
• Future Local Fiducial sizes will be:
• Level A (Most) = 40 mil (1.0 mm) with 80 mil (2.0 mm) solder mask & keep-out
• Level B (Nominal) = 30 mil (0.75 mm) with 60 (1.5 mm) solder mask & keep-out
• Level C (Least) = 20 mil (0.5 mm) with 40 mil (1.0 mm) solder mask & keep-out

PCB Libraries Presents:

What is New in IPC-7351C
Zero Component Orientation – Levels A & B
Zero Orientation with Pin 1 in Upper Left Corner Introduced
in 2007 in the IPC-7351A Publication – IPC-7351C “Level A”

Zero Orientation with Pin 1 in Lower Left Corner Introduced

in 2009 in the IEC 61188-7 publication – IPC-7351C “Level B”

PCB Libraries Presents:

What is New in IPC-7351C
EIA & JEDEC
EIA Component Dimensions vs: JEDEC
Dimensional Letters

PCB Libraries Presents:

What is New in IPC-7351C
Land Pattern Naming Convention
Extended Names Eliminate Duplication I
• The original IPC-7351 footprint naming convention does not include Gull
Wing component lead tolerances, Thermal Pad sizes, BGA Ball sizes or
various pin assignments into account. Therefore, the same component with
different tolerances can produce a different land size and spacing with the
same footprint name.
• A footprint name of SOP50P710X120-14N can have version A, B, C, D which
do not indicate the variances in Thermal Tab or Lead Length
• There are 3 component features that affect the footprint name
• Square Thermal Tab Size = SOP50P710X120-14T300
• Rectangle Tab Shape = SOP50P710X120-14T300X500
• Gull Wing Lead Length Tolerance = SOP50P710X120-14L50
• BGA Ball Size = BGA121C50P11X11_600X600X100B23
• For component mfr. recommended footprint drop the environment level
character after the pin qty. - SOP50P710X120-14
PCB Libraries Presents:
What is New in IPC-7351C
Land Pattern Naming Convention
Extended Names Eliminate Duplication II
• The existing IPC-7351 land pattern naming convention does not take into
consideration component package tolerances.
• Package tolerances affect the pad, silkscreen and courtyard sizes
• You can have several packages with the same dimensions but different
tolerances but the IPC-7351 naming convention will name all the parts with
the same land pattern name
• In order to save the IPC-7351 naming convention and eliminate duplicate
land pattern names for parts with different tolerances, we need to add the
component manufacturer abbreviation as a prefix to the IPC-7351 name
• Example: SOP50P710X120-14L50T300X500 will become these names –
• TI-SOP50P710X120-14L50T300X500
• MAXIM-SOP50P710X120-14L50T300X500
• ANALOG-SOP50P710X120-14L50T300X500
PCB Libraries Presents:
What is New in IPC-7351C
Land Pattern Naming Convention
Extended Names Eliminate Duplication III
• Standard Names for Chip packages where 2, 3 or more vendors need to
be multiple sourced and a single land pattern, a standard name needs
to be created to handle all the variations and package tolerances.
• RESC0603 or RES1608 need to be created and documented in the
library Component Information System (CIS) or Part Library
Management system (PLM) and every manufacturer must be listed as a
source for that land pattern and the collective tolerances must be very
close.
• This same concept can be applied to SOP, QFP, SOT23, CAPAE, etc.
• If any component manufacturer’s package dimensions or tolerances
are out of line with the majority of the other packages, it is
recommended you drop than vendor from your approved vendor list
for that package family.

PCB Libraries Presents:

What is New in IPC-7351C
Solder Joint Goals for Chip Components < 0603

Maximum (Most) Median (Nominal) Minimum (Least)

Lead Part
Density Level A Density Level B Density Level C
Toe (JT) 0.55 0.35 0.15
Heel (JH) 0.00 0.00 0.00
Side (JS) 0.05 0.00 -0.05
Round-off factor Round off to the nearest two place decimal, i.e., 1.00, 1.01, 1.02, 1.03
Courtyard excess 0.50 0.25 0.12
Rectangular Chip Components Smaller than 1608 (0603) (unit: mm)
Toe (JT) 0402 0.15
Toe (JT) 0201 0.12
Toe (JT) 01005 0.10
Heel (JH) 0.00
Side (JS) 0.00
Round-off factor Round off to the nearest two place decimal, i.e., 1.00, 1.01, 1.02, 1.03
Courtyard excess 0.15

PCB Libraries Presents:

What is New in IPC-7351C
New Solder Joint Goal Recommendations
 1.00 mm pitch = 0.35 mm Toe/Heel 1.00 mm pitch w/0.35 mm Toe/Heel

 0.80 mm pitch = 0.33 mm Toe/Heel

 0.65 mm pitch = 0.31 mm Toe/Heel
 0.50 mm pitch = 0.29 mm Toe/Heel
 0.40 mm pitch = 0.27 mm Toe/Heel
 0.35 mm pitch = 0.25 mm Toe/Heel
0.80 mm pitch w/0.35 mm Toe/Heel 0.65 mm pitch w/0.35 mm Toe/Heel 0.50 mm pitch w/0.35 mm Toe/Heel

0.40 mm pitch w/0.35 mm Toe/Heel 0.35 mm pitch w/0.35 mm Toe/Heel

0.40 mm pitch w/0.27 mm Toe/Heel 0.35 mm pitch w/0.25 mm Toe/Heel

PCB Libraries Presents:

What is New in IPC-7351C
Chapters 8 & 9 – Total Rewrite

• Component Family Description

• 3D Model Picture of Component
• Land Pattern Pictures with Level A & B Rotations
• Solder Joint Goal Tables
• Common Package Sizes and Case Codes
• Relocating all Assembly Related Data to the new
IPC-7070 Component Mounting Issues and
Recommendations

PCB Libraries Presents:

What is New in IPC-7351C
PCB Library Expert

PCB Libraries Presents:

What is New in IPC-7351C
The “Footprint (FP) Designer” Module
• Traditional footprint software only calculates standard parts,
constraining usage to only 50% of the components in the industry.
• PCB Library Expert also creates mfr. recommended footprints for
components with the following characteristics:
– Asymmetrical
– Various sizes of pads
– Different pad shapes

PCB Libraries Presents:

What is New in IPC-7351C
PCB Library Expert CAD Tool Interfaces

Allegro
OrCAD PCB Editor Board Station
OrCAD Layout Expedition
PADS Layout

Altium Designer
P-CAD CADSTAR
CR-5000

Other formats
Eagle Ultiboard in development
Pantheon

PCB Libraries Presents:

What is New in IPC-7351C
 Questions?

[email protected]
www.pcblibraries.com

PCB Libraries Presents:

What is New in IPC-7351C