MLX 9014

MLX90614 family
Single and Dual Zone

Infra Red Thermometer in TO-39
Features and Benefits Applications Examples

Small size, low cost High precision non-contact temperature
Easy to integrate measurements;
Factory calibrated in wide temperature range: Thermal Comfort sensor for Mobile Air
-40 to 125 C for sensor temperature and Conditioning control system;
-70 to 380 C for object temperature. Temperature sensing element for residential,
High accuracy of 0.5C over wide temperature commercial and industrial building air
range (0..+50C for both Ta and To) conditioning;
High (medical) accuracy calibration Windshield defogging;
Measurement resolution of 0.02C Automotive blind angle detection;
Single and dual zone versions Industrial temperature control of moving parts;
SMBus compatible digital interface Temperature control in printers and copiers;
Customizable PWM output for continuous Home appliances with temperature control;
reading Healthcare;
Available in 3V and 5V versions Livestock monitoring;
Simple adaptation for 8 to 16V applications Movement detection;
Power saving mode Multiple zone temperature control up to 100
Different package options for applications and sensors can be read via common 2 wires
measurements versatility Thermal relay/alert
Automotive grade Body temperature measurement
Ordering Information
Part No. Temperature Code Package Code - Option Code
MLX90614 E (-40C to 85C) SF (TO-39) -X X X
K (-40C to 125C) (1) (2) (3)
(1) Supply Voltage/ (2) Number of thermopiles: (3) Package options:
Acccuracy A single zone A Standard package
A - 5V B dual zone B Reserved
B - 3V C 35 FOV
C - Reserved
D - 3V medical accuracy
Example:
MLX90614ESF-BAA
1 Functional diagram 2 General Description

MLX90614Axx: Vdd=4.5...5.5V The MLX90614 is an Infra Red thermometer for non
J1 1 MLX90614
SCL U1
contact temperature measurements. Both the IR sensitive
SCL Vz thermopile detector chip and the signal conditioning ASSP
PWM Vss 4
SDA 2 SDA
are integrated in the same TO-39 can.
Vdd Vdd
Thanks to its low noise amplifier, 17-bit ADC and powerful
C1 DSP unit, a high accuracy and resolution of the
3
GND
thermometer is achieved.
CON1 0.1uF
C1 value and type may differ The thermometer comes factory calibrated with a digital
in different applications PWM and SMBus (System Management Bus) output.
for optimum EMC
As a standard, the 10-bit PWM is configured to
MLX90614 connection to SMBus continuously transmit the measured temperature in range
of -20 to 120 C, with an output resolution of 0.14 C and
Figure 1 Typical application schematics the POR default is SMBus.
3901090614 Page 1 of 40 Data Sheet

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General description (continued)

The MLX90614 is built from 2 chips developed and manufactured by Melexis:
The Infra Red thermopile detector MLX81101
The signal conditioning ASSP MLX90302, specially designed to process the output of IR sensor.
The device is available in an industry standard TO-39 package.
Thanks to the low noise amplifier, high resolution 17-bit ADC and powerful DSP unit of MLX90302 high
accuracy and resolution of the thermometer is achieved. The calculated object and ambient temperatures are
available in RAM of MLX90302 with resolution of 0.01 C. They are accessible by 2 wire serial SMBus
compatible protocol (0.02C resolution) or via 10-bit PWM (Pulse Width Modulated) output of the device.
The MLX90614 is factory calibrated in wide temperature ranges: -40 to 125 C for the ambient temperature
and -70 to 382.2 C for the object temperature. The 10-bit PWM is as a standard configured to transmit
continuously the measured object temperature for an object temperature range of -20 to 120 C with an
output resolution of 0.14 C. The PWM can be easily customized for virtually any range desired by the
customer by changing the content of 2 EEPROM cells. This has no effect on the factory calibration of the
device.
The PWM pin can also be configured to act as a thermal relay (input is To), thus allowing for an easy and
cost effective implementation in thermostats or temperature (freezing/boiling) alert applications. The
temperature threshold is user programmable. In an SMBus system this feature can act as a processor
interrupt that can trigger reading all slaves on the bus and to determine the precise condition.
As a standard, the MLX90614 is calibrated for an object emissivity of 1. It can be easily customized by the
customer for any other emissivity in the range 0.1-1.0 without the need of recalibration with a black body.
The thermometer is available in 2 supply voltage options: 5V compatible or 3V (battery) compatible. The 5V
can be easily adopted to operate from a higher supply voltage (8-16V, for example) by use of few external
components (refer to Applications information section for details).
An optical filter (long-wave pass) that cuts off the visible and near infra-red radiant flux is integrated in the
package to provide sunlight immunity.

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3 Table of Contents
1 Functional diagram......................................................................................................................................................................................1
2 General Description ....................................................................................................................................................................................1
General description (continued) .....................................................................................................................................................................2
3 Table of Contents........................................................................................................................................................................................3
4 Glossary of Terms.......................................................................................................................................................................................4
5 Maximum ratings.........................................................................................................................................................................................4
6 Pin definitions and descriptions ..................................................................................................................................................................5
7 Electrical Specifications ..............................................................................................................................................................................6
7.1 MLX90614Axx .....................................................................................................................................................................................6
7.2 MLX90614Bxx , MLX90614Dxx...........................................................................................................................................................8
8 Detailed description...................................................................................................................................................................................10
8.1 Block diagram....................................................................................................................................................................................10
8.2 Signal processing principle................................................................................................................................................................10
8.3 Block description ...............................................................................................................................................................................11
8.3.1 Amplifier .....................................................................................................................................................................................11
8.3.2 Supply regulator and POR .........................................................................................................................................................11
8.3.3 EEPROM....................................................................................................................................................................................11
8.3.4 RAM ...........................................................................................................................................................................................13
8.4 SMBus compatible 2-wire protocol ....................................................................................................................................................13
8.4.1 Functional description ................................................................................................................................................................13
8.4.2 Differences with the standard SMBus specification (reference [1]) ...........................................................................................14
8.4.3 Detailed description....................................................................................................................................................................14
8.4.4 AC specification for SMBus .......................................................................................................................................................15
8.4.5 Bit transfer..................................................................................................................................................................................16
8.4.6 Commands.................................................................................................................................................................................16
8.4.7 Sleep Mode ................................................................................................................................................................................17
8.5 PWM..................................................................................................................................................................................................18
8.5.1 Single PWM format ....................................................................................................................................................................18
8.5.2 Extended PWM format ...............................................................................................................................................................19
8.5.3 Customizing the temperature range for PWM output.................................................................................................................20
8.6 Switching Between PWM and SMBus communication......................................................................................................................21
8.6.1 PWM is enabled .........................................................................................................................................................................21
8.6.2 Request condition ......................................................................................................................................................................21
8.6.3 PWM is disabled ........................................................................................................................................................................21
8.7 Computation of ambient and object temperatures.............................................................................................................................22
8.7.1 Ambient temperature Ta ............................................................................................................................................................22
8.7.2 Object temperature To ...............................................................................................................................................................22
8.7.3 Calculation flow ..........................................................................................................................................................................22
8.8 Thermal relay.....................................................................................................................................................................................24
9 Unique Features........................................................................................................................................................................................25
10 Performance Graphs...............................................................................................................................................................................26
10.1 Temperature accuracy of the MLX90614 ........................................................................................................................................26
10.2 Field Of View (FOV) ........................................................................................................................................................................28
11 Applications Information..........................................................................................................................................................................30
11.1 Use of the MLX90614 thermometer in SMBus configuration ..........................................................................................................30
11.2 Use of multiple MLX90614s in SMBus configuration.......................................................................................................................30
11.3 PWM output operation.....................................................................................................................................................................31
11.4 Thermal alert / thermostat ...............................................................................................................................................................31
11.5 High voltage source operation.........................................................................................................................................................32
12 Application Comments ............................................................................................................................................................................33
13 Standard information regarding manufacturability of Melexis products with different soldering processes............................................35
14 ESD Precautions.....................................................................................................................................................................................35
15 FAQ.........................................................................................................................................................................................................36
16 Package Information ...............................................................................................................................................................................38
16.1 MLX90614XXA ................................................................................................................................................................................38
16.2 MLX90614XXC................................................................................................................................................................................39
17 References..............................................................................................................................................................................................40
18 Disclaimer ...............................................................................................................................................................................................40

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4 Glossary of Terms
PTAT Proportional To Absolute Temperature sensor (package temperature)
PTC Positive Temperature Coefficient sensor (package temperature)
POR Power On Reset
HFO High Frequency Oscillator (RC)
DSP Digital Signal Processing
FIR Finite Impulse Response. Digital filter
IIR Infinite Impulse Response. Digital filter
IR Infra-Red
PWM Pulse With Modulation
DC Duty Cycle (of the PWM) ; Direct Current (for settled conditions specifications)
FOV Field Of View
SDA,SCL Serial DAta, Serial CLock SMBus compatible communication pins
Ta Ambient Temperature measured from the chip (the package temperature)
To Object Temperature, seen from IR sensor
ESD Electro-Static Discharge
EMC Electro-Magnetic Compatibility
TBD To Be Defined
Note: sometimes the MLX90614xxx is referred to as the module.
5 Maximum ratings
Parameter MLX90614ESF-Axx MLX90614ESF-Bxx MLX90614KSF-Axx
MLX90614ESF-Dxx
Supply Voltage, VDD (over voltage) 7V 5V 7V
Supply Voltage, VDD (operating) 5.5 V 3.6V 5.5V
Reverse Voltage 0.4 V
Operating Temperature Range, TA -40+85C -40+125C
Storage Temperature Range, TS -40+125C -40+125C
ESD Sensitivity (AEC Q100 002) 2kV
DC current into SCL/Vz (Vz mode) 2 mA
DC sink current, SDA /PWM pin 25 mA
DC source current, SDA/PWM pin 25 mA
DC clamp current, SDA/PWM pin 25 mA
DC clamp current, SCL pin 25 mA
Table 1: Absolute maximum ratings for MLX90614
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximum-
rated conditions for extended periods may affect device reliability.

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6 Pin definitions and descriptions
2 - PWM/ 1 - SCL/
SDA Vz
3 - VDD 4 - VSS
Top view
Figure 2: Pin description
Pin Name Function

VSS Ground. The metal can is also connected to this pin.
Serial clock input for 2 wire communications protocol. 5.7V zener
SCL / Vz is available at this pin for connection of external bipolar transistor
to MLX90614A to supply the device from external 8 -16V source.
Digital input / output. In normal mode the measured object
temperature is available at this pin Pulse Width Modulated.
PWM / SDA
In SMBus compatible mode automatically configured as open
drain NMOS.
VDD External supply voltage.
Table 2: Pin description MLX90614
Note: for +12V (+8+16V) powered operation refer to the Application information section. For EMC and
isothermal conditions reasons it is highly recommended not to use any electrical connection to the metal can
except by the Vss pin.
With the SCL/Vz and PWM/SDA pins operated in 2-wire interface mode, the input Schmidt trigger function is
automatically enabled.

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7 Electrical Specifications
7.1 MLX90614Axx
All parameters are preliminary for TA = 25 C, VDD =5V (unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Units
Supplies
External supply VDD 4.5 5 5.5 V
Supply current IDD No load 1 2 mA
Supply current No load, erase/write EEPROM

IDDpr 1.5 2.5 mA
(programming) operations
Zener voltage Vz Iz = 75400 uA 5.6 5.75 5.8 V
Iz=70400uA, full temperature

Zener voltage Vz(Ta) 5.15 5.75 6.24 V
range
Power On Reset
Power-up, power-down and
POR level VPOR 2.7 3.0 3.3 V
brown-out
VDD rise time TPOR Ensure POR signal 3 ms
Output valid (result in RAM) Tvalid After POR 0.15 s
Pulse width modulation1
PWM resolution PWMres Data band 10 bit
Factory default, internal oscillator

PWM output period PWMT,def 1.024 ms
factory calibrated
Internal oscillator factory

calibrated, over the entire
PWM period stability dPWMT -4 +4 %
operation range and supply
voltage
Output high Level PWMHI Isource = 2 mA VDD-0.2 V
Output low Level PWMLO Isink = 2 mA VSS+0.2 V

Output drive current IdrivePWM Vout,H = VDD - 0.8V 7 mA
Output sink current IsinkPWM Vout,L = 0.8V 13.5 mA
100 pF capacitive load, full
Output settling time Tset 500 ns
operating Ta range
220 Ohm in series with 47nF load

Output settling time TsetRC on the wire, full Ta operating 20 50 us
range

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SMBus compatible 2-wire interface2

Input high voltage VIH 1.8 2 2.2 V
Input high voltage VIH(Ta,V) Over temperature and supply 1.6 2.4 V
Input low voltage VIL 0.7 1.0 1.3 V
Input low voltage VIL(Ta,V) Over temperature and supply 0.5 1.5 V
SDA pin in open drain mode,
Output low voltage VOL over temperature and supply, 0.2 V
Isink = 2mA
SCL leakage ISCL,leak VSCL=4V, Ta=+85C 30 uA
SDA leakage ISDA,leak VSDA=4V, Ta=+85C 0.3 uA
SCL capacitance CSCL 10 pF
SDA capacitance CSDA 10 pF
Slave address SA Factory default 5Ah hex
SMBus Request tREQ SCL low 1.024 ms
Timeout, low Timeout,L SCL low 30 ms
Timeout, high Timeout,H SCL high 50 us
Acknowledge setup time Tsuac(MD) 8-th SCL falling edge, Master 0.5 1.5 us
Acknowledge hold time Thdac(MD) 9-th SCL falling edge, Master 1.5 2.5 us
Acknowledge setup time Tsuac(SD) 8-th SCL falling edge, Slave 2.5 us
Acknowledge hold time Thdac(SD) 9-th SCL falling edge, Slave 1.5 us
EEPROM
Data retention Ta = +85C 10 years
Erase/write cycles Ta = +25C 100,000 Times
Erase cell time Terase 5 ms
Write cell time Twrite 5 ms
Notes: All the communication and refresh rate timings are given for the nominal calibrated HFO frequency and will vary
with this frequencys variations.
1. All PWM timing specifications are given for single PWM output (factory default for MLX90614xAx). For the extended
PWM output (factory default for the MLX90614xBx) each period has twice the timing specifications (refer to the PWM
detailed description section). With large capacitive load lower PWM frequency is recommended. Thermal relay output
(when configured) has the PWM DC specification and can be programmed as push-pull, or NMOS open drain. PWM is
free-running, power-up factory default is SMBus, refer to 7.6, Switching between PWM and SMBus communication for
details..
2. For SMBus compatible interface on 12V application refer to Application information section. SMBus compatible
interface is described in details in the SMBus detailed description section. Maximum number of MLX90614xxx devices on
one bus is 127, higher pullup currents are recommended for higher number of devices, faster bus data transfer rates, and
increased reactive loading of the bus.
MLX90614xxx is always a slave device on the bus. MLX90614xxx can work in both low-power and high-power SMBus
communication.
All voltages are referred to the Vss (ground) unless otherwise noted.
Power saving mode is not available on the 5V version (MLX90614Axx).

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7.2 MLX90614Bxx , MLX90614Dxx

All parameters are preliminary for TA = 25 C, VDD =3V (unless otherwise specified)
Supplies
External supply VDD 2.4 3 3.6 V
Supply current IDD No load 1 2 mA
Supply current No load, erase/write EEPROM

IDDpr 1.5 2.5 mA
(programming) operations
Power-down supply
Isleep no load 1 2.5 5 uA
current
Power-down supply
Isleep Full temperature range 1 2.5 6 uA
current
Power On Reset
Power-up, power-down and
POR level VPOR 1.6 1.85 2.1 V
brown-out
VDD rise time TPOR Ensure POR signal 1 ms
Output valid Tvalid After POR 0.15 s
Pulse width modulation1
PWM resolution PWMres Data band 10 bit
Factory default, internal oscillator

PWM output period PWMT,def 1.024 ms
factory calibrated
Internal oscillator factory

calibrated, over the entire
PWM period stability dPWMT -4 +4 %
operation range and supply
voltage
Output high Level PWMHI Isource = 2 mA VDD-0.25 V
Output low Level PWMLO Isink = 2 mA VSS+0.25 V

Output drive current IdrivePWM Vout,H = VDD - 0.8V 4.5 mA
Output sink current IsinkPWM Vout,L = 0.8V 11 mA
100 pF capacitive load, full
Output settling time Tset 150 ns
operating Ta range
220 Ohm in series with 47nF

Output settling time TsetRC load on the wire, full Ta operating 500 ns
range

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SMBus compatible 2-wire interface2

Input high voltage VIH 1.6 2 2.4 V
Input high voltage VIH(Ta,V) Over temperature and supply 1.2 2 2.8 V
Input low voltage VIL 0.7 1.0 1.3 V
Input low voltage VIL(Ta,V) Over temperature and supply 0.5 1.0 1.5 V
SDA pin in open drain mode,
Output low voltage VOL over temperature and supply, 0.25 V
Isink = 2mA
SCL leakage ISCL,leak VSCL=3V, Ta=+85C 20 uA
SDA leakage ISDA,leak VSDA=3V, Ta=+85C 0.25 uA
SCL capacitance CSCL 10 pF
SDA capacitance CSDA 10 pF
Slave address SA Factory default 5Ah hex
SMBus Request tREQ SCL low 1.024 ms
Timeout,low Timeout,L SCL low 30 ms
Timeout, high Timeout,H SCL high 50 us
Acknowledge setup Tsuac(MD 8-th SCL falling edge, Master 0.5 1.5 us
ti
Acknowledge hold )Thdac(MD 9-th SCL falling edge, Master 1.5 2.5 us
ti
Acknowledge setup )Tsuac(SD) 8-th SCL falling edge, Slave 2.5 us
ti
Acknowledge hold Thdac(SD 9-th SCL falling edge, Slave 1.5 us
ti )
EEPROM
Data retention Ta = +85C 10 years
Erase cell time Terase 5 ms
Write cell time Twrite 5 ms
Note: refer to MLX90614Axx notes.

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8 Detailed description
8.1 Block diagram
81101
OPA ADC DSP PWM
STATE MACHINE
Voltage
90302 Regulator
Figure 3: block diagram
8.2 Signal processing principle

The operation of the MLX90614 is controlled by an internal state machine, which controls the measurements
and calculations of the object and ambient temperatures and does the post-processing of the temperatures to
output them through the PWM output or the SMBus compatible interface.
The ASSP supports 2 IR sensors (second one not implemented in the MLX90614xAx).The output of the IR
sensors is amplified by a low noise low offset chopper amplifier with programmable gain, converted by a
Sigma Delta modulator to a single bit stream and fed to a powerful DSP for further processing. The signal is
treated by programmable (by means of EEPROM contend) FIR and IIR low pass filters for further reduction of
the band width of the input signal to achieve the desired noise performance and refresh rate. The output of
the IIR filter is the measurement result and is available in the internal RAM. 3 different cells are available:
One for the on-board temperature sensor (on chip PTAT or PTC) and 2 for the IR sensors.
Based on results of the above measurements, the corresponding ambient temperature Ta and object
temperatures To are calculated. Both calculated temperatures have a resolution of 0.01 C. The data for Ta
and To can be read in two ways: Reading RAM cells dedicated for this purpose via the 2-wire interface
(0.02C resolution, fixed ranges), or through the PWM digital output (10 bit resolution, configurable range).
In the last step of the measurement cycle, the measured Ta and To are rescaled to the desired output
resolution of the PWM) and the recalculated data is loaded in the registers of the PWM state machine, which
creates a constant frequency with a duty cycle representing the measured data.

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8.3 Block description
8.3.1 Amplifier
A low noise low offset amplifier with programmable gain is implemented for amplification of the IR sensor
voltage. With a carefully designed input modulator and balanced input impedance, an offset as low as 0.5V
is achieved.
8.3.2 Supply regulator and POR
The module can operate from 2 different supplies:

VDD= 5V => MLX90614Axx
VDD=3.3V => MLX90614Bxx (battery or regulated supply)
Refer to Applications information section for information about adopting higher voltage supplies.
The Power On Reset (POR) is connected to Vdd supply. The on-chip POR circuit provides an active (high)
level of the POR signal when the Vdd voltage rises above approximately 0.5V and holds the entire
MLX90614xxx in reset until the Vdd is higher than the specified POR threshold VPOR (note that this level is
different for MLX90614Axx and MLX90614Bxx). During the time POR is active, the POR signal is available as
an open drain (active high) at the PWM/SDA pin. After the MLX90614xxx exits the POR condition, the
function programmed in EEPROM takes precedence for that pin.
8.3.3 EEPROM
A limited number of addresses in the EEPROM memory can be changed by the customer. The whole
EEPROM can be read via SMBus interface.
EEPROM (32X16)
Name Address Write acces
Tomax 000h Yes
Tomin 001h Yes
PWMCTRL 002h Yes
Ta range 003h Yes
Emissivity correction coefficient 004h Yes
Config Register1 005h Yes
Melexis reserved 006h No

Melexis reserved 00Dh No
SMBus address 00Eh Yes
Melexis reserved 00Fh Yes
Melexis reserved 010h No

Melexis reserved 018 No
Melexis reserved 019h Yes
Melexis reserved 01Ah No
Melexis reserved 01Bh No
ID number 01Ch No
ID number 01Dh No
ID number 01Eh No
ID number 01Fh No
The addresses Tomax, Tomin and Ta range are for customer dependent object and ambient temperature
ranges. For details see point 8.5.3 below in this document
The address Emissivity contains the object emissivity (factory default 1.0 = 0xFFFF), 16 bit.
Emissivity = dec2hex[ round( 65535 x ) ]
where dec2hex[ round( X ) ] represents decimal to hexadecimal conversion with round-off to nearest value
(not truncation). In this case the physical emissivity values are = 0.11.0.

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The address PWMCTRL consists of control bits for configuring the PWM/SDA pin:
Bit 0 Select the type of 1 - Single PWM, factory default for 0 Extended PWM, factory default
PWM mode: MLX90614xAx for MLX90614xBx
Bit 1 Enable/disable 1 - Enable PWM, disable SMBus 0 - Disable PWM (Enable SMBus),
the PWM: Factory default
Bit 2 Configuration of 1 - Push-Pull, 0 OpenDrain NMOS, factory default
the pin PWM:
Bit 3 Mode selection 1 - ThermoRelay, 0 - PWM, Factory default
Bits[8:4] Extemded PWM Number of repetitions divided by 2 of sensor 1 and 2 in Extended PWM
definition mode. The number of repetitions can vary from 0 to 64 times.
Bits[15:9] PWM clock 2MHz divided by the number written in this place. (128 in case the number is
configuration 0.) A single PWM period consists of 2048 clocks and extended PWM of 4096
clocks for each period (2T in figure 6). The 2 MHz clock is valid for the
nominal HFO frequency.
The address ConfigRegister1 consists of control bits for configuring the analog and digital parts:
Bits[2:0] Configure coefficients of IIR Bit 2 Bit 1 Bit 0 a1 b1
digital filter: 0 x x 0.5 0.5
1 1 1 0.571428571 0.428571428
1 1 0 0.666(6) 0.333(3)
1 0 1 0.8 0.2
1 0 0 1 0 (IIR bypassed)
Bit 3 Configure the type of 1 - PTC, 0 PTAT.
ambient temperature sensor:
Bits[5:4] Configure the type of data Bit 5 Bit 4 Data 1 Data 2
transmitted through PWM: 0 0 Ta IR 1
0 1 Ta IR 2
1 1 IR 1 IR 2
1 0 IR 2 Undefined*
Bit 6 Define the number of IR 1 2 sensors, 0 -1 sensor.
sensors:
Bit 7 Define the sign Ks Factory calibration, do not alter
(Ks=dAlpha/dTobj) :
Bits[10:8] Configure coefficient N of Bit 10 Bit 9 Bit 8 N
FIR digital filter: 0 0 0 8**
0 0 1 16**
0 1 0 32**
0 1 1 64**
1 0 0 128
1 0 1 256
1 1 0 512
1 1 1 1024
Bits[13:11] Configure the gain of Bit 13 Bit 12 Bit 11 Gain
amplifier: 0 0 0 1 (preamplifier bypassed)
0 0 1 3
0 1 0 6
0 1 1 12.5
1 0 0 25
1 0 1 50
1 1 0 100
1 1 1 100
Bit 14 Unused
Bit 15 Define the sign of thermo- 1 - negative, 0 positive.
shock compensation:
Note: The following bits/registers should not be altered (except with special tools contact Melexis for such
tools availability) in order to keep the factory calibration relevant:
Ke [15..0] ; Config Register1 [13..11;7;3] ; addresses 00Fh and 019h.
* not recommended for extended PWM mode
** note recommended values

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8.3.4 RAM
It is not possible to write into the RAM memory. It can only be read and only a limited number of RAM
registers are of interest to the customer.
RAM (32x17)
Name Address Read access

TA 006h Yes
TOBJ1 007h Yes
TOBJ2 008h Yes

Melexis reserved 01Fh Yes
8.4 SMBus compatible 2-wire protocol

The chip supports a 2 wires serial protocol, build with pins PWM/SDA and SCL.
SCL digital input, used as the clock for SMBus compatible communication. This pin has the
auxiliary function for building an external voltage regulator. When the external voltage regulator is
used, the 2-wire protocol is available only if the power supply regulator is overdriven.
PWM/SDA Digital input/output, used for both the PWM output of the measured object
temperature(s) or the digital input/output for the SMBus. The pin can be programmed in EEPROM to
operate as Push/Pull or open drain NMOS (open drain NMOS is factory default). In SMBus mode
SDA is forced to open drain NMOS I/O, push-pull selection bit defines PWM/Thermal relay operation.
8.4.1 Functional description
The SMBus interface is a 2-wire protocol, allowing communication between the Master Device (MD) and one
or more Slave Devices (SD). In the system only one master can be presented at any given time [1]. The
MLX90614 can only be used as a slave device.
Generally, the MD initiates the start of data transfer by selecting a SD through the Slave Address (SA).
The MD has read access to the RAM and EEPROM and write access to 9 EEPROM cells (at addresses
0x20h, 0x21h, 0x22h, 0x23h, 0x24h, 0x25h*, 0x2Eh, 0x2Fh, 0x39h). If the access to the MLX90614 is a read
operation it will respond with 16 data bits and 8 bit PEC only if its own slave address, programmed in internal
EEPROM, is equal to the SA, sent by the master. The SA feature allows connecting up to 127 devices with
only 2 wires, unless the system has some of the specific features described in paragraph 5.2 of reference
[1]. In order to provide access to any device or to assign an address to a SD before it is connected to the bus
system, the communication must start with zero SA followed by low RWB bit. When this command is sent
from the MD, the MLX90614 will always respond and will ignore the internal chip code information.
Special care must be taken not to put two MLX90614 devices with the same SD addresses on the
same bus as MLX90614 does not support ARP[1].
The MD can force the MLX90614 into low consumption mode sleep mode (3V version only).
Read flags like EEBUSY (1 EEPROM is busy with executing the previous write/erase), EE_DEAD (1
there is fatal EEPROM error and this chip is not functional**).
Note*: This address is readable and writable. Bit 3 should not be altered as this will cancel the factory
calibration.
Note**: EEPROM error signaling is implemented in automotive grade parts only.

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8.4.2 Differences with the standard SMBus specification (reference [1])
There are eleven command protocols for standard SMBus interface. The MLX90614 supports only two of
them. Not supported commands are:
Quick Command
Byte commands - Sent Byte, Receive Byte, Write Byte and Read Byte
Process Call
Block commands Block Write and Write-Block Read Process Call
Supported commands are:
Read Word
Write Word
8.4.3 Detailed description
The PWM/SDA pin of MLX90614 can operate also as PWM output, depending on the EEPROM settings. If
PWM is enabled, after POR the PWM/SDA pin is directly configured as PWM output. The PWM mode can be
avoided and the pin can be restored to its Data function by a special command. That is why hereafter both
modes are treated separately.
8.4.3.1 Bus Protocol
1 7 1 1 8 1 1
S Slave Address Wr A Data Byte A P
S Start Condition
Sr Repeated Start Condition
Rd Read (bit value of 1)
Wr Write (bit value of 0)
A Acknowledge (this bit can be 0 for ACK and 1 for NACK)
S Stop Condition
PEC Packet Error Code
Master-to-Slave
Slave-to-Master
Figure 4: SMBus packet element key
After every 8 bits received by the SD an ACK/NACK takes place. When a MD initiates communication, it first
sends the address of the slave and only the SD which recognizes the address will ACK, the rest will remain
silent. In case the SD NACKs one of the bytes, the MD should stop the communication and repeat the
message. A NACK could be received after the PEC. This means that there is an error in the received
message and the MD should try sending the message again. The PEC calculation includes all bits except the
START, REPEATED START, STOP, ACK, and NACK bits. The PEC is a CRC-8 with polynomial
X8+X2+X1+1. The Most Significant Bit of every byte is transferred first.

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8.4.3.1.1 Read Word (depending on the command RAM or EEPROM)
1 7 1 1 8 1 1 7 1 1
S Slave Address Wr A Command A Sr Slave Address Rd A ..
8 1 8 1 8 1 1
.. Data Byte Low A Data Byte High A PEC A P
Figure 5: SMBus read word format
8.4.3.1.2 Write Word (depending on the command RAM or EEPROM)
1 7 1 1 8 1
S Slave Address Wr A Command A ..
8 1 8 1 8 1 1
.. Data Byte Low A Data Byte High A PEC A P
Figure 6: SMBus write word format
8.4.4 AC specification for SMBus
8.4.4.1 Timing
The MLX90614 meets all the timing specifications of the SMBus [1]. The maximum frequency of the
MLX90614 SMBus is 100 KHz and the minimum is 10 KHz.
The specific timings in MLX90614s SMBus are:
SMBus Request (tREQ ) is the time that the SCL should be forced low in order to switch MLX90614 from PWM
mode to SMBus mode;
Timeout L is the maximum allowed time for SCL to be low. After this time the MLX90614 will reset its
communication block and will be ready for new communication;
Timeout H is the maximum time for which it is allowed for SCL to be high during communication. After this
time MLX90614 will reset its communication block assuming that the bus is idle (according to the SMBus
specification).
Tsuac(SD) is the time after the eighth falling edge of SCL that MLX90614 will force PWM/SDA low to
acknowledge the last received byte.
Thdac(SD) is the time after the ninth falling edge of SCL that MLX90614 will release the PWM/SDA (so the
MD can continue with the communication).
Tsuac(MD) is the time after the eighth falling edge of SCL that MLX90614 will release PWM/SDA (so that the
MD can acknowledge the last received byte).
Thdac(MD) is the time after the ninth falling edge of SCL that MLX90614 will take control of the PWM/SDA
(so it can continue with the next byte to transmit).

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The indexes MD and SD for the latest timings are used MD when the master device is making
acknowledge; SD when the slave device is making acknowledge-. For other timings see [1].
Tsuac Thdac
Timeout,L Timeout,H
SCL
PWM/SDA
Figure 7: SMBus timing
8.4.5 Bit transfer
Sampling Changing
data data
SCL
PWM/SDA
Figure 8: Bit transfer on SMBus
The data on PWM/SDA must be changed when SCL is low (min 300ns after the falling edge of SCL). The
data is fetched by both MD and SDs on the rising edge of the SCL.
8.4.6 Commands
RAM and EEPROM can be read both with 32x16 sizes. If the RAM is read, the data are divided by two, due
to a sign bit in RAM (for example, TOBJ1 - RAM address 0x07h will sweep between 0x27ADh to 0x7FFF as the
object temperature rises from -70.01C to +382.19C). The MSB read from RAM is an error flag (active high)
for the linearized temperatures (TOBJ1, TOBJ2 and Ta). The MSB for the raw data (e.g. IR sensor1 data) is a sign
bit (sign and magnitude format). A write of 0x0000 must be done prior to writing in EEPROM in order to erase
the EEPROM cell content. Refer to EEPROM detailed description for factory calibration EEPROM locations
that need to be kept unaltered.
Opcode Command
000x xxxx* RAM Access
001x xxxx* EEPROM Access
1111_0000** Read Flags
1111_1111 Enter SLEEP mode
Note*: The xxxxx represent the 5 LSBits of the memory map address to be read/written.
Note**: Behaves like read command. The MLX90614 returns PEC after 16 bits data of which only 4 are
meaningful and if the MD wants it, it can stop the communication after the first byte. The difference between
read and read flags is that the latter does not have a repeated start bit.
Flags read are:
Data[15] EEBUSY the previous write/erase EEPROM access is still in progress. High active.
Data[14] Unused
Data[13] - EE_DEAD EEPROM double error has occurred. High active.
Data[12] INIT POR initialization routine is still ongoing. Low active.
Data[11] not implemented.
Data[10..0] all zeros.
Flags read is a diagnostic feature. The MLX90614 can be used regardless of these flags.

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8.4.7 Sleep Mode
The MLX90614 can enter in Sleep Mode via the command Enter SLEEP mode sent via the SMBus
interface. This mode is not available for the 5V supply version. To limit the current consumption to 2.5uA
(typical), the SCL pin should be kept low during sleep. MLX90614 goes back into power-up default mode (via
POR reset) by setting SCL pin high and then PWM/SDA pin low for at least tDDq=80ms. If EEPROM is
configured for PWM (EN_PWM is high), the PWM interface will be selected after awakening and if
PWM control [2], PPODB is 1 the MLX90614 will output a PWM pulse train with push-pull output.
8.4.7.1 Enter Sleep Mode
Sleep Stop Sleep

command condition
SCL
PWM/SDA
Stop
Figure 9: Enter sleep
8.4.7.2 Exit from Sleep Mode
Sleep Awake Normal
SCL
PWM/SDA
tDDq
Figure 10: Exit Sleep Mode

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8.5 PWM
The MLX90614 can be read via PWM or SMBus compatible interface. Selection of PWM output is done in
EEPROM configuration (factory default is SMBus). PWM output has two programmable formats, single and
dual data transmission, providing single wire reading of two temperatures (dual zone object or object and
ambient). The PWM period is derived from the on-chip oscillator and is programmable.
Config Register[5:4] PWM1 data PWM2 data Tmin,1 Tmax,1 Tmin,2 Tmax,2
00 Ta Tobj1 Tarange,L Tarange,H Tomin Tomax
01 Ta Tobj2 Tarange,L Tarange,H Tomin Tomax
11 Tobj1 Tobj2 Tomin Tomax Tomin Tomax
10* Tobj2 Undefined Tomin Tomax N.A. N.A.
Note: Serial data functions (2-wire / PWM) are multiplexed with a thermal relay function (described in the
Thermal relay section).
* not recommended for extended PWM format operation
T T T T
t1 t2 t3
Single PWM output format (4 periods)
2T, data 1 transmission 2T, data 2 transmission

t1 t3 t4
t2 t5
Extended PWM output format
Start buffer Data band Error signaling band End buffer
Figure 11: PWM timing
8.5.1 Single PWM format
In single PWM output mode the settings for PWM1 data only are used. The temperature reading can be
calculated from the signal timing as:
2t
Tout = 2 * (Tmax Tmin) + Tmin ,
T
where Tmin and Tmax are the corresponding rescale coefficients in EEPROM for the selected temperature
output (Ta, object temperature range is valid for both Tobj1 and Tobj2 as specified in the previous table) and
T is the PWM period. Tout is Tobj1, Tobj2 or Ta according to Config Register [5:4] settings.

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The different time intervals t1-t3 have the following functions:
t1: Start buffer. During this time the signal is always high. t1 = 0.125*T (T is the PWM period, refer to fig. 11).
t2: Valid Data Output Band, 0 to 1/2T. PWM output data resolution is 10 bit.
t3: Error band information for fatal error in EEPROM (double error detected, not correctable). t3 = 0.25 * T.
Therefore a PWM pulse train with a duty cycle of 0.875 will indicate a fatal error in EEPROM (for single PWM
format).
Example:
Tobj1 => Config Reg[5:4] = 11b
Tomin = 0C => Tomin [EEPROM] = 100 * (tomin + 273.15) = 6AB3h
Tomax = +50C => Tomax [EEPROM] = 100 * (tomax + 273.15) = 7E3Bh
Captured PWM high duration is 0.495*T => t2=(0.495 0.125)*T=0.370*T =>
measured object temperature = 2X0.370* (50C -0C)+0C = +37.0C.
8.5.2 Extended PWM format
The PWM format for extended PWM is shown in Figure 11. Note that with bits DUAL[5:1]>00h each period
will be outputted 2N+1 times, where N is the decimal value of the number written in DUAL[5:1] (DUAL[5:1]
=PWM control & clock [8:4] ), like shown on Figure 12.
2N+1=3 times Data1 2N+1=3 times Data2 New Data 1
Figure 12: Extended PWM format with DUAL[5:1] = 01h (2 repetitions for each data)
The temperature transmitted in Data 1 field can be calculated using the following equation:
2t
Tout1 = 2 * (Tmax1 Tmin1 ) + Tmin1
T
For Data 2 field the equation is:
2t
Tout 2 = 5 * (Tmax2 Tmin2 ) + Tmin2
T
Where Tmin1, Tmax1, Tmin2 and Tmax2 are given in Table 9, t2=thigh1-t1, and t5=thigh2-t4.
Time bands are: t1=0.125*T, t3=0.25*T and t4=1.125*T. As shown in Figure 11, in extended PWM format the
period is twice the period for the single PWM format. All equations provided herein are given for the single
PWM period T. The EEPROM Error band signaling will be 43.75% duty cycle for Data1 and 93.75% for
Data2.
Note: EEPROM error signaling is implemented in automotive grade parts only.
Example:
Configuration: Ta : Tobj1 @ Data1 : Data2 => Config Reg[5:4] = 00b,
Tamin = -5C => Tarange, L [EEPROM] = 100*(Tamin+38.2)/64 = 34h,
Tamax = +105C => Tarange,H [EEPROM] = 100*(Tamax+38.2)/64 = E0h,
Tarange [EEPROM]=E034h
Tomin = 0C => Tomin [EEPROM] = 100 * (Tomin + 273.15) = 6AB3h
Tomax = +50C => Tomax [EEPROM] = 100 * (Tomax + 273.15) = 7E3Bh
Captured high durations are 0.13068*(2T) and 0.7475*(2T), where 2T is each captured PWM period. Time band t4 is
provided for reliable determination between Data1 and Data2 data fields. Thus Data1 is represented by 0.13068*(2T) and
Data2 by 0.7475*(2T), and the temperatures can be calculated as follows:
t2/T=(thigh1/T)-0.125=0.13636 => Ta=+25.0C,
t5/T=( thigh2/T)-1.125=0.370 => Tobj1=+37.0C.

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8.5.3 Customizing the temperature range for PWM output
The calculated ambient and object temperatures are stored in RAM with a resolution of 0.01 C (16 bit). The
PWM operates with a 10-bit word so the transmitted temperature is rescaled in order to fit in the desired
range.
For this goal 2 cells in EEPROM are foreseen to store the desired range for To (Tomin and Tomax) and one for
Ta (Tarange: the 8MSB are foreseen for Tamax and the 8LSB for Tamin).
Thus the output range for To can be programmed with an accuracy of 0.01 C, while the corresponding Ta
range can be programmed with an accuracy of 2.56 C.
The object data for PWM is rescaled according to the following equation:
TRAM TMIN EEPROM TMAX EEPROM TMIN EEPROM
TPWMobj = , K PWM obj =
K PWM obj 1023
The TRAM is the linearized Tobj, 16-bit (0000FFFFh, 0000 for -273.15C and FFFFh for +382.2C) and the
result is a 10-bit word, in which 000h corresponds to ToMIN[C], 3FFh corresponds to ToMAX[C] and 1LSB
ToMAX ToMIN
corresponds to [C]
1023
TMIN EEPORM = TMIN 100 LSB
TMAX EEPORM = TMAX 100 LSB
The ambient data for PWM is rescaled according to the following equation:
TRAM TMIN EEPROM TMAX EEPROM TMIN EEPROM
TPWMambient = , K PWM ambient =
K PWMambient 1023
The result is a 10-bit word, where 000h corresponds to -38.2 C (lowest Ta that can be read via PWM), 3FFh
TMAX TMIN
corresponds to 125 C (highest Ta that can be read via PWM) and 1LSB corresponds to [C]
1023
TMIN EEPORM = [TMIN ( 38.2)]
100
LSB
64
TMAX EEPORM = [TMAX ( 38.2)]
100
LSB
64

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8.6 Switching Between PWM and SMBus communication
8.6.1 PWM is enabled
The diagram below illustrates the way of switching to SMBus if PWM is enabled (factory programmed POR
default for MLX90614 is SMBus, PWM disabled). Note that the SCL pin needs to be kept high in order to use
PWM.
tREQ
SCL
PWM/SDA
Start Stop
PWM SMBus
Figure 13: Switching from PWM mode to SMBus
8.6.2 Request condition
tREQ
SCL
SMBus Request
Figure 14: Request (switch to SMBus) condition
If PWM is enabled, the MLX90614s SMBus Request condition is needed to disable PWM and reconfigure
PWM/SDA pin before starting SMBus communication. Once PWM is disabled, it can be only enabled by
switching the supply Off-On or exit from Sleep Mode. The MLX90614s SMBus request condition requires
forcing LOW the SCL pin for period longer than the request time (tREQ). The SDA line value is ignored in this
case.
8.6.3 PWM is disabled
If PWM is disabled by means of EEPROM the PWM/SDA pin is directly used for the SMBus purposes after
POR. Request condition should not be sent in this case.

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8.7 Computation of ambient and object temperatures

The IR sensor consists of serial connected thermo-couples with cold junctions placed at thick chip substrate
and hot junctions, placed over thin membrane. The IR radiation absorbed from the membrane heats (or
cools) it. The thermopile output signal is:
Vir (Ta, To ) = A.(To 4 Ta 4 ) ,
Where To is the object temperature absolute (Kelvin) temperature, Ta is the sensor die absolute (Kelvin)
temperature, and A is the overall sensitivity.
An on board temperature sensor is needed to measure the chip temperature. After measurement of the
output of both sensors, the corresponding ambient and object temperatures can be calculated. These
calculations are done by the internal DSP, which produces digital outputs, linearly proportional to measured
temperatures.
8.7.1 Ambient temperature Ta
The Sensor die temperature is measured with a PTC or a PTAT element. All the sensors conditioning and
data processing is handled on-chip and the linearized sensor die temperature Ta is made available in
memory.
The resolution of the calculated temperature is 0.02 C. The sensor is factory calibrated for the full automotive
range (-40 to 125 C). In RAM cell 006h, 2DE4h corresponds to -38.2 C (linearization output lower limit) and
4DC4h (19908d) corresponds to 125 C. The conversions from RAM contend to real Ta is easy using the
following relation:
Ta[ K ] = Tareg 0.02 , or 0.02 K / LSB.
8.7.2 Object temperature To
The result has a resolution of 0.02 C and is available in RAM. To is derived from RAM as:
To[ K ] = Toreg 0.02 , or 0.02 K / LSB.
8.7.3 Calculation flow
The measurement, calculation and linearization are held by core, which executes a program form ROM.
After POR the chip is initialized with calibration data from EEPROM. During this phase the number of IR
sensors is selected and it is decided which temperature sensor will be used. Measurements, compensation
and linearization routines run in a closed loop afterwards.
Processing ambient temperature includes:

Offset measurement with fixed length FIR filter
Additional filtering with fixed length IIR filter. The result is stored into RAM as TOS
Temperature sensor measurement using programmable length FIR *.
Offset compensation
Additional processing with programmable length IIR **. The result is stored into RAM as TD.
Calculation of the ambient temperature. The result is stored into RAM as TA
Processing of the object temperature consists of three parts. The first one is common for both IR sensors, the
third part can be skipped if only one IR sensor is used.
IR offset:
Offset measurement with a fixed length FIR
Additional filtering with a fixed length IIR. The result is stored into RAM as IROS.

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Gain measurement with fixed length FIR filter
Offset compensation
Additional gain filtering with fixed length IIR, storing the result into RAM as IRG.
Gain compensation calculation, the result is stored into RAM as KG
Object temperature:
IR1 sensor:
IR sensor measurement with programmable length FIR filter *.
Offset compensation
Gain compensation
Filtering with programmable length IIR filter**, storing the result into RAM as IR1D.
Calculation of the object temperature. The result is available in RAM as TOBJ1.
IR2 sensor:
IR sensor measurement with programmable length FIR filter *.
Offset compensation
Gain compensation
Filtering with programmable length IIR filter**, storing the result into RAM as IR2D
Calculation of the object temperature. The result is available in RAM as TOBJ2.
PWM calculation:
Recalculate the data for PWM with 10 bit resolution
Load data into PWM module
Note*: The measurements with programmable filter length for FIR filter use the same EEPROM cells for N.
Note**: The IIR filter with programmable filter length uses the same EEPROM cells for L.
1 2
Initialization 3
TA Offset meas IR Offset meas IR1 meas IR2 meas

OSTa= meas(NTos) OSIR= meas(NIRos) IR1D= meas(NIR) IR2D= meas(NIR)
filtering filtering Offset comp Offset comp
TOS= IIR(LTos,OSTa) IROS= IIR(LIRos,OSIR) IR1Dcomp= IR1D- IROS IR2Dcomp= IR2D- IROS
TA meas Gain drift Gain comp Gain comp
TDATA= meas(NTa) IRGm= meas(NIRg) IR1Dg= IR1Dcomp*KG IR2Dg= IR2Dcomp*KG
Offset comp Offset comp filtering filtering
TDATAcomp= TDATA-TOS IRGcomp= IRGm- IROS IR1D= IIR(LIR,IR1Dg) IR2D= IIR(LIR,IR2Dg)
TOBJ1
TOBJ2
filtering filtering
TOBJ1 calculation TOBJ2 calculation
TD= IIR(LTa,TDATAcomp) IRG= IIR(LG,IRGcomp)
IR offset
TA calculation KG calculation
PWM calculation
TA
1 2 3 Load PWM registers
Figure 15: Software flow

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8.8 Thermal relay

The MLX90614 can be configured to behave as a thermo relay with programmable threshold and hysteresis
on the PWM/SDA pin. The input for the comparator unit of the relay is the object temperature from sensor 1
The output of the MLX90614 is NOT a relay driver but a logical output which should be connected to a
relay driver if necessary.
In order to configure the MLX90614 to work as thermal relay two conditions must be met:
o Set bit TRPWMB high at address 002h in EEPROM
o Enable PWM output i.e. EN_PWM is set high
The PWM/SDA pin can be programmed as a push-pull or open drain NMOS (via bit PPODB in EEPROM
PWMCTRL), which can trigger an external device. The temperature threshold data is determined by
EEPROM at address 021h (Tomin) and the hysteresis at address 020h (Tomax).
The logical state of the PWM/SDA pin is as follows:
PWM/SDA pin is high if Tobj 1 threshold + hysteresis
PWM/SDA pin is low if Tobj 1 threshold hysteresis
hysteresis hysteresis
threshold T
Figure 16: Thermal relay : PWM pin versus Tobj
The MLX90614 preserves its normal operation when configured as a thermal relay (PWM configuration and
specification applies as a general rule also for the thermal relay) and therefore it can be read using the
SMBus (entering the SMBus mode from both PWM and thermal relay configuration is the same).
For example, the MLX90614 can generate a wake-up alert for a system upon reaching a certain temperature
and then be read as a thermometer. A reset condition (enter-and exit Sleep, for example) will be needed in
order to return to the thermal relay configuration.
Example: threshold 5 C => (5 + 273.15)*100 = 27815 = 6CA7h

hysteresis is 1C => 1 * 100 = 100 = 64h
PWM/SDA pin will be low at object temperature below 4 C
PWM/SDA pin will be high at object temperature higher that 6 C

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9 Unique Features
The MLX90614 is a ready-to use low-cost non contact thermometer provided from Melexis with output data
linearly dependent on the object temperature with high accuracy and extended resolution.
It supports versatile customization to a very wide range of temperatures, power supplies and refresh rates.
The user can program the internal object emissivity correction for objects with a low emissivity. An embedded
error checking and correction mechanism provides high memory reliability.
The sensors are housed in an industry standard TO39 package for both single- and dual-zone IR
thermometers. The thermometer is available in automotive grade and can use two different packages for
wider applications coverage.
The low power consumption and sleep mode make the thermometer ideally suited for handheld mobile
applications.
The digital sensor interface can be either a power-up-and-measure PWM or an enhanced access SMBus
compatible protocol. Systems with more than 100 devices can be built with only two signal lines. Dual zone
non contact temperature measurements are available via a single line (extended PWM).
A built-in thermal relay function further extends the easy implementation of wide variety of freezing/boiling
prevention and alert systems, as well as thermostats (no MCU is needed).

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10 Performance Graphs
10.1 Temperature accuracy of the MLX90614
380
To,oC
4 oC
300
240
4 oC 3 oC
180
4 oC 3 oC 2 oC 2 oC 2 oC
120
60
2 oC 1 oC 0.5 oC 1 oC 2 oC
-40
-70
-40 -20 0 50 100 125

Ta,oC
Figure 17: Preliminary accuracy of MLX90614 (Ta,To)
All accuracy specifications apply under settled isothermal conditions only.

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A version of the MLX90614 with accuracy suited for medical applications is available. The accuracy in the
range Ta 10C - 40C and To 32C - 42C is shown in diagram below. The accuracy for the rest of the
temperature ranges is the same as in previous diagram. Medical accuracy specification is only available for
the MLX90614DAA version.
45
To,oC
42
0.2 oC
39
0.3 oC 0.1 oC 0.3 oC
36
0.2 oC
32
30
10 20 30 40
Ta,oC
Figure 18: Preliminary accuracy of MLX90614DAA (Ta,To) for medical applications.

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10.2 Field Of View (FOV)

Field of view is determined at 50% thermopile signal and with respect to the sensor main axis.
Parameter MLX90614xAA MLX90614xBA MLX90614xAC
Peak zone 1 0 -25 0
Width zone 1 90 70 35
Peak zone 2 -25

Not applicable Not applicable
Width zone 2 70
1.00
0.75
0.50
0.25
Angle, Deg
0.00
-80 -60 -40 -20 0 20 40 60 80
Figure 19: FOV of MLX90614xAA

1.00
0.75
0.50
0.25
Angle, Deg
0.00
-80 -60 -40 -20 0 20 40 60 80
Figure 20: FOV of MLX90614xBA

Figure 21: identification of zone 1&2 relative to alignment tab.

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1.00
0.75
0.50
0.25
Angle, Deg
0.00
-80 -60 -40 -20 0 20 40 60 80
Figure 21: FOV of MLX90614xAC

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11 Applications Information
11.1 Use of the MLX90614 thermometer in SMBus configuration
+3.3V
R1 R2 U1 MCU
2
Vdd
PWM
SDA SDA
SMBus
SCL 1
Vdd Vz SCL
3
Vss GND
C1 U2 MLX90614Bxx
4
0.1uF
Figure 22: MLX90614 SMBus connection

Connection of the MLX90614 to SMBus with 3.3V power supply. The MLX90614 has diode clamps SDA/SCL
to Vdd so it is necessary to provide MLX90614 with power in order not to load the SMBus lines.
11.2 Use of multiple MLX90614s in SMBus configuration
+3.3V
I1 I2
R1 R2 U1 MCU
2 Ipu1 Ipu2 Vdd

PW M
SDA SDA
SMBus
SCL 1
Vdd Vz SCL
3
Current source or resistor
Vss pull-ups of the bus GND
C1 U1 MLX90614Bxx
4
0.1uF
C3
2 Cbus1
PW M
SDA
SCL 1
Vdd Vz
3
Cbus2
C2 U1 Vss C4
4 MLX90614Bxx
0.1uF
SDA SCL
Figure 23: Use of multiple MLX90614 devices in SMBus network

The MLX90614 supports a 7-bit slave address in EEPROM, thus allowing up to 127 devices to be read via
two common wires. With the MLX90614BBx this results in 254 object temperatures measured remotely and
an additional 127 ambient temperatures which are also available. Current source pull-ups may be preferred
with higher capacitive loading on the bus (C3 and C4 represent the lines parasitics), while simple resistive
pull-ups provide the obvious low cost advantage.

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11.3 PWM output operation
Using the PWM output mode of the MLX90614 is very simple, as shown on Figure 24.
J1 1
SCL
Vdd Vz
PWM
PWM Vss
2 SDA
GND U1
Vdd MLX90614
CON1 C1 3
0.1uF
Figure 24: Connection of MLX90614 for PWM output mode

The PWM mode is free-running after POR when configured in EEPROM. The SCL pin must be forced high
(can be shorted to Vdd pin) for PWM mode operation.
A pull-up resistor can be used to preserve the option for SMBus operation while having PWM as a default as
is shown on Figure 25.
R1
J1 10k
Vdd 1
SCL
SCL Vz
PWM
PWM/SDA Vss
2 SDA
GND U1
Vdd MLX90614
CON1 C1 3
0.1uF
Figure 25: PWM output with SMBus available

Again, the PWM mode needs to be written as the POR default in EEPROM. Then for PWM operation the
SCL line can be high impedance, forced high, or even not connected. The pull-up resistor R1 will ensure
there is a high level on the SCL pin and the PWM POR default will be active. SMBus is still available (for
example for further reconfiguration of the MLX90614, or sleep mode power management) as there are pull-
up resistors on the SMBus lines anyway.
PWM can be configured as open drain NMOS or a push-pull output. In the case of open drain external pull-up
will be needed. This allows cheap level conversion to lower logic high voltage. Internal pull-ups present in
many MCUs can also be used.
11.4 Thermal alert / thermostat
+5V +24V
+3.3V R1
- R2 Q1
D1
Alert dev ice
+
MLX90614Axx
R1 R2 U1 MCU
2
Vdd
U1
2 2 PWM
PWM PWM SDA
SDA SDA SDA
SMBus SCL 1
Vdd
SCL 1 SCL 1 3
Vz
Vdd Vz Vdd Vz SCL
3 3
C2 C3 Vss
Vss Vss GND 4 C*
C1 U1 MLX90614Axx
C1 U1 MLX90614Bxx
4 4 U2 10uF 0.1uF
0.1uF 0.1uF
AC line
Figure 26: Thermal alert/thermostat applications of MLX90614

The MLX90614 can be configured in EEPROM to operate as a thermal relay. A non contact freezing or
boiling prevention with 1 mA quiescent current can be built with two components only the MLX90614 and a

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capacitor. The PWM/SDA pin can be programmed as a push-pull or open drain NMOS, which can trigger an
external device, such as a relay (refer to electrical specifications for load capability), buzzer, RF transmitter or
a LED. This feature allows very simple thermostats to be built without the need of any MCU and zero design
overhead required for firmware development. In conjunction with a MCU, this function can operate as a
system alert that wakes up the MCU. Both object temperature and sensor die temperature can also be read
in this configuration.
11.5 High voltage source operation

As a standard, the module MLX90614Axx works with a supply voltage of 5Volt. In addition, thanks to the
integrated internal reference regulator available at pin SCL/Vz, this module can easily be powered from
higher voltage source (like VDD=816V). Only a few external components as depicted in the diagram below
are required to achieve this.
MLX90614Axx: V=8...16V
R1
Q1
C* Q1
+12V +5V
J1 1 MLX90614 R1
SCL U1
V+ Vz
PWM Vss
4
PWM 2 SDA U1
5.7V
GND Vdd
3
CON1 C1
2.2uF Equivalent schematics
Figure 27: 12V regulator implementation

With the second (synthesized Zener diode) function of the SCL/Vz pin used, the 2-wire interface function is
available only if the voltage regulator is overdriven (5V regulated power is forced to Vdd pin).

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12 Application Comments
Significant contamination at the optical input side (sensor filter) might cause unknown additional
filtering/distortion of the optical signal and therefore result in unspecified errors.
IR sensors are inherently susceptible to errors caused by thermal gradients. There are physical reasons for
these phenomena and, in spite of the careful design of the MLX90614xxx, it is recommended not to subject
the MLX90614 to heat transfer and especially transient conditions.
Upon power-up the MLX90614 passes embedded checking and calibration routines. During these routines
the output is not defined and it is recommended to wait for the specified POR time before reading the module.
Very slow power-up may cause the embedded POR circuitry to trigger on inappropriate levels, resulting in
unspecified operation and this is not recommended.
The MLX90614xxx is designed and calibrated to operate as a non contact thermometer in settled
conditions. Using the thermometer in a very different way will result in unknown results.
Capacitive loading on a SMBus can degrade the communication. Some improvement is possible with use
of current sources compared to resistors in pull-up circuitry. Further improvement is possible with specialized
commercially available bus accelerators. With the MLX90614xxx additional improvement is possible by
increasing the pull-up current (decreasing the pull-up resistor values). Input levels for SMBus compatible
mode have higher overall tolerance than the SMBus specification, but the output low level is rather low even
with the high-power SMBus specification for pull-up currents. Another option might be to go for a slower
communication (clock speed), as the MLX90614xxx implements Schmidt triggers on its inputs in SMBus
compatible mode and is therefore not really sensitive to rise time of the bus (it is more likely the rise time to
be an issue than the fall time, as far as the SMBus systems are open drain with pull-up).
For ESD protection there are clamp diodes between the Vss and Vdd and each of the other pins. This
means that the MLX90614 might draw current from a bus in case the SCL and/or SDA is connected and the
Vdd is lower than the bus pull-ups voltage.
In 12V powered systems SMBus usage is constrained because the SCL pin is used for the Zener diode
function. Applications where the supply is higher than 5V should use the PWM output or an external
regulator. Nevertheless, in the 12V powered applications MLX90614 can be programmed (configured and
customized) by forcing the Vdd to 5V externally and running the SMBus communication.
Sleep mode is available in MLX90614Bxx. This mode is entered and exited via the SMBus compatible 2-wire
communication. On the other hand, the extended functionality of the SCL pin yields in increased leakage
current through that pin. As a result, this pin needs to be forced low in power-down mode and the pull-up on
the SCL line needs to be disabled in order to keep the overall power drain in power-down really small.
The PWM pin is not designed for direct drive of inductive loads (such as electro-magnetic relays). Some
drivers need to be implemented for higher load, and auxiliary protection might be necessary even for light but
inductive loading.
It is possible to use the MLX90614xxx in applications, powered directly from the AC line (transformer less). In
such cases it is very important not to forget that the metal package of the sensor is not isolated and
therefore may occur to be connected to that line, too. Melexis can not be responsible for any application like
this and highly recommends not to use the MLX90614xxx in that way.
Power dissipation within the package may affect performance in two ways: by heating the ambient sensitive
element significantly beyond the actual ambient temperature, as well as by causing gradients over the
package that will inherently cause thermal gradient over the cap. Loading the outputs also causes increased

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power dissipation. In case of using the MLX90614Axx internal zener voltage feature, the regulating external
transistor should also not cause heating of the TO39 package.
High capacitive load on a PWM line will result in significant charging currents from the power supply,
bypassing the capacitor and therefore causing EMC, noise, level degradation and power dissipation
problems. A simple option is adding a series resistor between the PWM/SDA pin and the capacitive loaded
line, in which case timing specifications have to be carefully reviewed. For example, with a PWM output that
is set to 1.024 ms and the output format that is 11 bit, the time step is 0.5 s and a settling time of 2 s would
introduce a 4 LSBs error.
Power supply decoupling capacitor is needed as with most integrated circuits. MLX90614 is a mixed-signal
device with sensors, small signal analog part, digital part and I/O circuitry. In order to keep the noise low
power supply switching noise needs to be decoupled. High noise from external circuitry can also affect noise
performance of the device. In many applications a 100nF SMD ceramic capacitor close to the Vdd and Vss
pins would be a good choice. It should be noted that not only the trace to the Vdd pin needs to be short, but
also the one to the Vss pin. Using MLX90614 with short pins improves the effect of the power supply
decoupling.
Severe noise can also be coupled within the package from the SCL (in worst cases also from the SDA) pin.
This issue can be solved by using PWM output. Also the PWM output can pass additional filtering (at lower
PWM frequency settings). With a simple LPF RC network added also increase of the ESD rating is possible.
Check www.melexis.com for most recent application notes about MLX90614.

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13 Standard information regarding manufacturability of Melexis

products with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity
level according to following test methods:
Wave Soldering THDs (Through Hole Devices)
EIA/JEDEC JESD22-B106 and EN60749-15

Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THDs (Through Hole Devices)
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability THDs (Through Hole Devices)
EIA/JEDEC JESD22-B102 and EN60749-21

Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of
the use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality.aspx
The MLX90614 is RoHS compliant
14 ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.

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15 FAQ
When I measure aluminum and plastic parts settled at the same conditions I get significant errors on
aluminum. Why?
Different materials have different emissivity. A typical value for aluminum (roughly polished) is 0.18 and for
plastics values of 0.840.95 are typical. IR thermometers use the radiation flux between the sensitive
element in the sensor and the object of interest, given by the equation
( ) ( )
q = 1 . 1 . T1 . . A1 .Fa b 2 . T2 . . A2 ,
4 4
Where:
1 and 2 are the emissivities of the two objects,
1 is the absorptivity of the sensor (in this case),
is the Stefan-Boltzmann constant,
A1 and A2 are the surface areas involved in the radiation heat transfer,
Fa-b is the shape factor,
T1 and T2 are known temperature of the sensor die (measured with specially integrated and calibrated
element) and the object temperature that we need.
Note that these are all in Kelvin, heat exchange knows only physics.
When a body with low emissivity (such as aluminum) is involved in this heat transfer, the portion of the
radiation incident to the sensor element that really comes from the object of interest decreases and the
reflected environmental IR emissions take place. (This is all for bodies with zero transparency in the IR band.)
The IR thermometer is calibrated to stay within specified accuracy but it has no way to separate the
incoming IR radiation into real object and reflected environmental part. Therefore, measuring objects with low
emissivity is a very sophisticated issue and infra-red measurements of such materials is a specialized field.
What can be done to solve that problem? Look at paintings for example, oil paints are likely to have
emissivity of 0.850.95 but keep in mind that the stability of the paint emissivity has inevitable impact on
measurements.
It is also a good point to keep in mind that not everything that looks black is black also for IR. For example,
even heavily oxidized aluminum has still emissivity as low as 0.30.
How high is enough? Not an easy question but, in all cases the closer you need to get to the real object
temperature the higher the needed emissivity will be, of course.
With the real life emissivity values the environmental IR comes into play via the reflectivity of the object (the
sum of Emissivity, Reflectivity and Absorptivity gives 1.00 for any material). The larger the difference between
environmental and object temperature is at given reflectivity (with an opaque for IR material reflectivity equals
1.00 minus emissivity) the bigger errors it produces.
After I put the MLX90614 in the dashboard I start getting errors larger than specified in spite that the
module was working properly before that. Why?
Any object present in the FOV of the module provides IR signal. It is actually possible to introduce error in the
measurements if the module is attached to the dashboard with an opening that enters the FOV. In that case
portion of the dashboard opening will introduce IR signal in conjunction with constraining the effective FOV
and thus compromising specified accuracy. Relevant opening that takes in account the FOV is a must for
accurate measurements. Note that the basic FOV specification takes 50% of IR signal as threshold (in order
to define the area, where the measurements are relevant), while the entire FOV at lower level is capable of
introducing lateral IR signal under many conditions.
When a hot (cold) air stream hits my MLX90614 some error adds to the measured temperature I read.
What is it?
IR sensors are inherently sensitive to difference in temperatures between the sensitive element and
everything incident to that element. As a matter of fact, this element is not the sensor package, but the sensor
die inside. Therefore, a thermal gradient over the sensor package will inevitably result in additional IR flux

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between the sensor package and the sensor die. This is real optical signal that can not be segregated from
the target IR signal and will add errors to the measured temperature.
Thermal gradients with impact of that kind are likely to appear during transient conditions. The sensor used is
developed with care about sensitivity to this kind of lateral phenomena, but their nature demands some care
when choosing place to use the MLX90614 in order to make them negligible.
I measure human body temperature and I often get measurements that significantly differ from the
+37C I expect.
IR measurements are true surface temperature measurements. In many applications this means that the
actual temperature measured by an IR thermometer will be temperature of the clothing and not the skin
temperature. Emissivity (explained first in this section) is another issue with clothes that has to be considered.
There is also the simple chance that the measured temperature is adequate for example, in a cold winter
human hand can appear at temperatures not too close to the well known +37C.
I consider using MLX90614AAA to measure temperature within car compartment, but I am

embarrassed about the Sun light that may hit the module. Is it a significant issue?
Special care is taken to cut off the visible light spectra as well as the NIR (near IR) before it reaches the
sensitive sensor die. Even more, the glass (in most cases) is not transparent to the IR radiation used by the
MLX90614. Glass has temperature and really high emissivity in most cases it is black for IR of interest.
Overall, Sun behind a window is most likely to introduce relatively small errors. Why is it not completely
eliminated after all? Even visible light partially absorbed in the filter of the sensor has some heating potential
and there is no way that the sensor die will be blind for that heating right in front of it.

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16 Package Information
16.1 MLX90614XXA
The MLX90614 is packaged in an industry standard TO 39 can.
Figure 28: MLX90614XXA package

Note:
1. All dimensions are in mils [mm]
2. A = 3.5 mm

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MLX90614 family
16.2 MLX90614XXC
Figure 29: MLX90614XXC package

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MLX90614 family
17 References
[1] System Management Bus (SMBus) Specification Version 2.0 August 3, 2000
SBS Implementers Forum Copyright . 1994, 1995, 1998, 2000
Duracell, Inc., Energizer Power Systems, Inc., Fujitsu, Ltd., Intel Corporation, Linear Technology
Inc., Maxim Integrated Products, Mitsubishi Electric Semiconductor Company, PowerSmart, Inc.,
Toshiba Battery Co. Ltd., Unitrode Corporation, USAR Systems, Inc.
18 Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its
Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the
information set forth herein or regarding the freedom of the described devices from patent infringement.
Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior
to designing this product into a system, it is necessary to check with Melexis for current information. This
product is intended for use in normal commercial applications. Applications requiring extended temperature
range, unusual environmental requirements, or high reliability applications, such as military, medical life-
support or life-sustaining equipment are specifically not recommended without additional processing by
Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be
liable to recipient or any third party for any damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential
damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical
data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis rendering
of technical or other services.
2006 Melexis NV. All rights reserved.
For the latest version of this document, go to our website at

www.melexis.com
Or for additional information contact Melexis Direct:
Europe, Africa, Asia: America:

Phone: +32 1367 0495 Phone: +1 603 223 2362
E-mail: [email protected] E-mail: [email protected]
ISO/TS 16949 and ISO14001 Certified

Rev 003 03/Oct/2007

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MLX90614 family

Single and Dual Zone

Features and Benefits Applications Examples

1 Functional diagram 2 General Description

3901090614 Page 1 of 40 Data Sheet

General description (continued)

3901090614 Page 2 of 40 Data Sheet

3901090614 Page 3 of 40 Data Sheet

3901090614 Page 4 of 40 Data Sheet

6 Pin definitions and descriptions

Figure 2: Pin description

Pin Name Function

3901090614 Page 5 of 40 Data Sheet

Parameter Symbol Test Conditions Min Typ Max Units

Supply current IDD No load 1 2 mA

Supply current No load, erase/write EEPROM

Zener voltage Vz Iz = 75400 uA 5.6 5.75 5.8 V

Iz=70400uA, full temperature

VDD rise time TPOR Ensure POR signal 3 ms

Output valid (result in RAM) Tvalid After POR 0.15 s

Pulse width modulation1

PWM resolution PWMres Data band 10 bit

Factory default, internal oscillator

Internal oscillator factory

Output high Level PWMHI Isource = 2 mA VDD-0.2 V

Output low Level PWMLO Isink = 2 mA VSS+0.2 V

220 Ohm in series with 47nF load

3901090614 Page 6 of 40 Data Sheet

Parameter Symbol Test Conditions Min Typ Max Units

SMBus compatible 2-wire interface2

Power saving mode is not available on the 5V version (MLX90614Axx).

3901090614 Page 7 of 40 Data Sheet

7.2 MLX90614Bxx , MLX90614Dxx

Parameter Symbol Test Conditions Min Typ Max Units

Supply current IDD No load 1 2 mA

Supply current No load, erase/write EEPROM

VDD rise time TPOR Ensure POR signal 1 ms

Output valid Tvalid After POR 0.15 s

Pulse width modulation1

PWM resolution PWMres Data band 10 bit

Factory default, internal oscillator

Internal oscillator factory

Output high Level PWMHI Isource = 2 mA VDD-0.25 V

Output low Level PWMLO Isink = 2 mA VSS+0.25 V

220 Ohm in series with 47nF

3901090614 Page 8 of 40 Data Sheet

Parameter Symbol Test Conditions Min Typ Max Units

SMBus compatible 2-wire interface2

3901090614 Page 9 of 40 Data Sheet

OPA ADC DSP PWM

Figure 3: block diagram

8.2 Signal processing principle

3901090614 Page 10 of 40 Data Sheet

8.3.2 Supply regulator and POR

The module can operate from 2 different supplies:

3901090614 Page 11 of 40 Data Sheet

3901090614 Page 12 of 40 Data Sheet

8.4 SMBus compatible 2-wire protocol

8.4.1 Functional description