Smart Sensor Systems

by Gary W. Hunter, Joseph R. Stetter, Peter J. Hesketh, Chung-Chiun Liu

ensors and sensor systems are

vital to our awareness of our
surroundings and provide safety,
security, and surveillance, as well as
enable monitoring of our health and
environment. A transformative advance
in the field of sensor technology
has been the development of smart
sensor systems. The definition of a
smart sensor may vary, but typically
at a minimum a smart sensor is the
combination of a sensing element with
processing capabilities provided by a
microprocessor. That is, smart sensors are
basic sensing elements with embedded
intelligence. The sensor signal is fed to
the microprocessor, which processes the
data and provides an informative output
to an external user. A more expansive
view of a smart sensor system, which is
used in this article, is illustrated in Fig. 1:
a complete self-contained sensor system
that includes the capabilities for logging,
processing with a model of sensor
response and other data, self-contained
power, and an ability to transmit or
display informative data to an outside
user. The fundamental idea of a smart
sensor is that the integration of silicon
microprocessors with sensor technology
can not only provide interpretive
power and customized outputs, but also
significantly improve sensor system
performance and capabilities.
The smart sensor possesses several
functional layers: signal detection
from
discrete
sensing
elements,
signal processing, data validation and
interpretation, and signal transmission
and display. Multiple sensors can
be included in a single smart sensor
system whose operating properties,
such as bias voltage or temperature,
can be set by the microprocessor. The
sensor elements interface to signal

control and conditioning stages that

will provide both excitation and signal
data logging and conditioning. The
data acquisition layer will convert the
signal from analog to digital and acquire
additional parameters of interest to
provide compensation when needed for
thermal drift, long term drift, etc. The
embedded intelligence will continuously
monitor the discrete sensor elements,
validate the engineering data being
provided, and periodically verify sensor
calibration and health. The processed
data becomes information and can then
be transmitted to external users. The
user can choose the complexity of the
data transmitted: from a single reading
to a complete download of the sensor
systems parameters.
One major implication of smart
sensor systems is that important data can
be provided to the user with increased
reliability and integrity. Intelligent
features can be included at the sensor
level including but not limited to: selfcalibration,
self-health
assessment,
self-healing,
and
compensated
measurements (auto zero, calibration,
temperature, pressure, relative humidity
correction). The capability of the smart
sensor to perform internal processing
allows the system not only to provide the
user processed data, but also the ability of
the sensor to be self-aware and to assess
its own health or status and assess even
the validity of the processed data. The
smart sensor system can optimize the
performance of the individual sensors
and lead to a better understanding
of the data, the measurement, and
ultimately, the environment in which
the measurement is made. Overall, the
presence of the microprocessor-sensor
combination allows the design of a core
system that is adaptable to a changing

Processed
Sensor
Information
to User

Analog-Digital-Analog
Signal Processing

Communications
Communication
Electrical/Optical

Power

SENSORS

Physical/Chemical Stimulus

Smart Sensor System

User
Commands
for Sensor
Operation

Fig. 1. A smart sensor system as presented herein. The core of a stand-alone smart sensor system
includes sensors, power, communication, and signal processing.
The Electrochemical Society Interface Winter 2010

environment in a given application or

that can be modified to meet the needs
of a wide range of different applications.
A second major implication of smart
sensors is the development of a new
generation of smart sensors that can be
networked through the communication
interface to have the capability of
individual network self-identification
and
communication
allowing
reprogramming of the smart sensor
system as necessary. Further, the output
from a number of sensors within a given
region can be correlated not only to
verify the data from individual sensors,
but also to provide a better situational
awareness.
Such
communication
can be between a single smart sensor
and communication hub or between
individual smart sensors themselves.
These types of capabilities will provide
for a more reliable and robust system
because they are capable of networking
among themselves to provide the end
user with coordinated data that is
based on redundant sensory inputs.
Further, information can be shared in
a more rapid, reliable, and efficient
manner with on-board communications
capability in place.
A driving goal in the development
of smart sensor systems is the
implementation of systems in a
nonintrusive manner so that the
information is provided to the user
wherever and whenever needed, as well
as in whatever form is needed for the
application. In effect, the objective of
smart sensor research is the development
of sensor systems to tell the user what
they need to know in order to make
sound decisions. While this article is not
a complete survey of all the activities
in the development of smart sensor
systems, it is a brief sampling of some of
the enabling smart sensor technologies,
two
examples
of
smart
sensor
systems, and a discussion of potential
ramifications of this technology.

Smart Sensor
System Components
The components of a smart sensor
system as depicted in Fig. 1 include
sensors, power, communication, and
signal processing typically provided by
a microprocessor. The description of
advances in microprocessor technology
is beyond the scope of this article, but
recent advances are enabling sensor
systems to function remotely on very
little power. There are many examples
of technology advancements in sensors,
power, and communications that can
enable future smart sensor systems. The
ideal goal is to have a self contained
29

Hunter, et al.
(continued from previous page)
smart sensor system that is cost-effective,
reliable, self-monitoring, reconfigurable,
and can operate indefinitely. Simply
put, just as microfabrication approaches
are enabling the revolution in
microprocessor technology and MEMS
sensor elements,1 microfabrication and
nanotechnology will play a notable
role in the development of smart sensor
systems.2 Below are examples of several
potentially enabling technologies for
smart sensor systems.

Low Powered Sensor Elements

Microfabrication
methods
make
it possible to build very small and
low power sensors. One example of
microfabricated sensors that could be
integrated into a smart sensor system
is a sensor based on a microhotplate.
Microfabricated hotplates offer a lower
power platform for high temperature
metal oxide conductometric sensors.
Femtomolar isothermal desorption has
been carried out by Shirke et al.3 with
heating rates up to 106 oC/s and minimal
power consumption due to the small
thermal mass of the microhotplates.
An ultra-low power bridge built with
polysilicon surface micromachining is
shown in Fig. 2. This sensor2 responds
to ambient gas changes in nanoseconds
having a measured transient response
time-constant of 12 s in helium.
With constant voltage operation, the
temperature of the bridge, and hence
electrical resistance, is a function of the
thermal conductivity of the surrounding
gas ambient. For a 50 m length,

1 m wide bridge, a sensitivity of 2.05

mohms/ppm for helium and 0.71ohms/
ppm for methane at 3.6 V operation has
been demonstrated. The microfabricated
sensor elements in Fig. 2 have extremely
low power consumption, on the order
of 4 mW continuous and, <4 W when
operated on a duty cycle to read every
millisecond. In principle, this would
allow the operation of this sensor for
months to years using a single small
battery.2 The microfabrication processing
is compatible with CMOS processes
and therefore makes integration of
the electronic interface for the sensor
feasible on a single substrate.
Many sensors will require multichip
solutions, however, in order to achieve
optimal sensing and processing. While
approaches may vary for other sensor
types, sensor elements that provide data
with minimal power consumption can
enable long lived smart sensor systems.

Power: Battery or
Energy Harvesting
A smart sensor system will require
energy to support and operate all
components including the sensors
themselves. If the sensor elements and
communication system both have low
power designs and are compatible,
the total energy for the system is
correspondingly low. This can enable
lower installation costs and more
convenient deployment options. Small
scale energy systems for the smart sensor
applications will generally consider
batteries and energy harvesting options,
whatever is most suitable for the
specific applications. Both primary and
rechargeable (or secondary) batteries

will be important for our further

advancement of the smart sensor
system. Specifically, it is suggested that
the Li-ion, Li-polymer, and metal-air
rechargeable batteries can be appropriate
energy sources for smart sensor systems.
For example, Li-ion and Li-polymer
rechargeable batteries have an open
circuit potential of approximately 3.6
V, and an energy density of 160 and
130-200 Wh/kg (watt-hour/kilogram),
respectively, which will be sufficient
for the needs of many smart sensor
systems.4
Energy harvesting is a process by
which energy can be derived from
an external source, captured, and
stored. Piezoelectric crystals or fibers,
thermoelectric generators, solar cells,
electrostatic, and magnetic energy
capture devices can be considered5
for local power needs. A piezoelectric
energy system will produce a small
voltage when it is physically deformed.
This deformation can be caused by
mechanical vibration that may be
generated by the proper mounting and
the placement of the smart sensor system
in an appropriate (e.g., mechanically
vibrating) operating environment.6
Thermoelectric generators consisting
of the junctions of two dissimilar
materials produce a small voltage in
the presence of a thermal gradient.
Typical performance of 100-200 uV/C
per junction is achievable. Depending
on the location of the smart sensor and
its power requirement, small energy
harvesting systems can derive sufficient
energy from its surroundings to provide
either total or backup power for a
smart sensor application. These are two
examples that small energy sources can
be used for supporting a smart sensor
system.

Wireless Communication

Fig. 2. Scanning electron micrograph of an array of four microfabricated polysilicon gas sensors,
with 50 x1 micron (m) bridge dimensions, designed at KWJ Inc. and built at Georgia Institute of
Technology.
30

The smart sensor system will require

an electrical interface that will transmit
the sensor outputs to an external data
collection, recording or acquisition
system. Ideally, this interface does not
require wiring and can be accomplished
by wireless telemetric methods. A
practical telemetry system that can be
integrated with the smart sensor must
be relatively small and have all the
required performance functions. The
advancement of micro-electronic design
and fabrication processing, namely the
MEMS technology, provides a technical
approach for wireless communication
system development. As an example,
a multi-channel wireless telemetric
microsystem that can be integrated with
the smart sensor system is described in
Fig. 3.7
In this telemetry system, four input
channels plus a calibration channel are
designed to ensure the telemetry system
is not malfunctioning. This system has
a package size of approximately 1 cm x
1 cm x 0.5 cm (including a small watch
battery) with a total weight of 1.0 gram.
The Electrochemical Society Interface Winter 2010

Fig. 3. ASIC (Application-Specific Integrated Circuit) chip for the wireless multi-channel telemetric microsystem.7

To achieve the specifications of small

size, a monolithic integrated circuit
(IC) chip is fabricated. This IC chip is
a low power BiCMOS signal processor
chip, 2 mm x 2 mm in size. This signal
processor chip can also amplify, filter,
and time-division multiplex the signals
that are in turn transmitted via an RF
link contained within the package to
an external radio receiver. The receiver
drives a demodulator (external) to
reconstruct the individual signals
for display or analysis by waveform
acquisition software. The system
also incorporates a Hall-effect sensor
providing remote on-off capability
for the conservation of power, and it
also can be used to support interactive
procedures. This example illustrates
the needs and the required capability
of a wireless multi-channel telemetry
system, which can be integrated with
a smart sensor system. Ultra low power
wireless systems are also being designed
for interface to biological systems for
the purpose of sensory data acquisition
and transmission.8

Smart Sensor System Examples

A typical smart sensor contains much
more than just a sensing element, it is
a complete functioning system. The
sensor has an analog circuit for power
management, control, and interface to
The Electrochemical Society Interface Winter 2010

the digital world. In the digital world,

sensor inputs can be processed to reduce
noise, integrated with other sensory
inputs for compensation, redundancy,
and reliability improvements, and then
interfaced to output requirements that
range from simple digital displays of
sensor outputs to wirelessly transmitted
and stored data that feed-back to sensors
or feed-forward to appropriate system
controls. The evolutionary development
of a smart sensor system is exemplified in

Fig. 4, in which larger components built

with discrete electronic components
are used to emulate all the desired
smart sensor features. In Phase II, the
functions are integrated into smaller,
smarter, and more complex integrated
systems. One of the enabling features
about smart sensor systems is that by
using microprocessing techniques this
increased complexity can be achieved
with less expense than that of larger,
hand assembled systems.

PHASE II integrated Smart

Sensor Chip - power in
and compensated signal
out is foundation for
commercial products
PHASE I Sensor Chip and
discrete components
interfaced to a PC
demonstrates feasibility
Fig. 4. Evolution of smart sensors from larger size discrete components to smaller integrated sensory
systems.
31

Hunter, et al.
(continued from previous page)
An example of a family of smart
sensor systems is shown in Fig. 5. This
family of pocket size gas detectors9 can
measure species including hydrogen,
hydrogen sulfide, carbon monoxide,
and ozone with selectivity, and operate
on a single watch battery for a year or
more. These systems are specifically
designed to be low-cost, low-power,
and have a long battery life. Included
within the systems are loud alarms
(visual LED, 85 dB beeper, and vibrating
function), a digital display, as well as
computed features such as temperature
compensated signals, time-weighted
average dosimetry, data/event logging,
and a wireless data download capability
in a package weighing less than one
ounce. Being able to provide all of this
capability in a single package is only
possible through the integration of
sensor and microprocessor technology
and the limiting factor on battery life
is typically how often the alarms are
enabled, i.e., the sensing for these target
analytes takes only micro-watts of
power.
A second example of a smart sensor
system is the Lick and Stick leak
sensor system.9 This is a multifunctional
system with a microsensor array
fabricated by microfabrication (MEMS)
based technology designed to detect
hazardous conditions due to fuel leaks.
The complete system has three sensors,
signal conditioning electronics, power,
data storage, calibration tables, built-in
self-test, telemetry, and an option for
self-power in the surface area comparable
to a postage stamp. The approach is to
be able to place sensors in a vehicle,
like postage stamps, where they are
needed without rewiring or drawing
power from the vehicle. The electronics
can be programmed to provide the

user with certain information required

on a regular basis, but much further
diagnostic information when needed. A
prototype model of the Lick and Stick
leak detection sensor system is shown
in Fig. 6a. The ability to have one Lick
and Stick sensor system send data by
telemetry, as well as have several Lick
and Stick sensor systems sending data
to a central processing hub, has been
demonstrated. Figure 6b shows the
operation of the electronics with the
three sensor system simultaneously with
data sent telemetrically. Smart sensors
systems using this Lick and Stick
system as a core have been adapted to
applications as broad as fire detection,
breath monitoring, environmental
monitoring, and operation on rocket
engine test stands.10

Future Applications
Smart sensor systems potentially
represent a new generation of sensing
capability, and self-awareness that
are essential components of future
intelligent systems. Driving intelligence
down to the component level through
the design of smart sensor systems
can and will have a profound impact
on applications such as food safety
and
biological
hazard
detection;
safety hazard detection and warning;
environmental monitoring both locally
and on a global scale; health monitoring
and medical diagnostics;11 and industrial
and aerospace applications. Smart
sensor systems can enable intelligent
systems, which can monitor themselves
and respond to changing conditions
optimizing safety and performance. The
integration of sensors12 and algorithms
can be used for early warning fire
detection13 or any number of sensorbased applications.14 The smart sensor
system approach can achieve distributed
sensor systems feeding information from

Fig. 5. A family of Pocket smart sensor systems measuring a range of individual gases. (Courtesy
KWJ Engineering Inc.15)
32

multiple locations to improve the overall

understanding of system conditions.
This new generation of sensors will
possess embedded intelligence to
provide the end user with critical
data in a more rapid, reliable, robust,
economical and efficient manner with a
seamless interface to applications.
This article has just begun to
scratch the surface of the dimensions
of technology development that are
associated with smart sensor systems.
However, in order to reach the promise of
sensory systems, further advancements
in both micro and nanotechnology, as
well as associated smart sensor software
algorithms, are necessary. A vision of
how nanotechnology including smart
sensor systems can revolutionize a range
of applications has been published.2 We
look forward to new and creative design
in integrated smart sensor systems.

About the Authors

Gary W. Hunter is Lead for Intelligent
System Hardware and the Technical Lead
for the Chemical Species Gas Sensors
Team in the Sensors and Electronics
Branch at NASA Glenn Research Center.
He has been involved with the design,
fabrication, and testing of sensors for
nearly 20 years for a range of applications.
This work has included the use of micro
and nanotechnology as well as the
integration of sensor technology into
smart systems. He has been co-recipient of
two R&D 100 Awards for one of the most
significant inventions/products of the
year, two NASA Turning Goals Into Reality
Awards, and one Nano 50 Award. He may
be reached at [email protected].
Joseph R. Stetter is President and CTO
of KWJ Engineering, Research Professor
in Chemistry at Illinois Institute of
Technology and Oakland University,
and Research Associate in Mechanical
Engineering at Georgia Institute of
Technology. At KWJ Engineering Inc.,
a second start-up company specializing
in chemical and biochemical sensors,
Dr. Stetter continues his interest in
measurement science and applications for
the social good. Sensor and instrument
products designed by Stetter are still in use
throughout the world protecting human
health and the environment. Dr. Stetter
has won several prestigious awards for
his work in sensor research, instrument
development, and technology transfer
including the 2002 Entrepreneur of the
Year award given by TMAC (Technology
Management Association of Chicago),
several IR100 awards, and he has been
elected a Fellow of ECS (2008). He is
the author of more than 200 journal
articles and books, numerous conference
proceedings, holds more than 40 patents,
has edited journals, chaired international
conferences, been a plenary speaker at
conferences, given invited and endowed
lecture series, and is active in professional
societies, including being a past Chair of
The Electrochemical Society Interface Winter 2010

Fellow of the AAAS, ASME, and ECS, and

a member of ASEE, AVS, and IEEE. He is
past Chair of the ECS Sensor Division, has
been involved with the ECS for over 20
years, and currently serves on the Honors
and Awards Committee and the Ways and
Means Committee.
Chung-Chiun Liu is the Wallace R.
Persons Professor of Sensor Technology
and Control and a professor of Chemical
Engineering at Case Western Reserve
University, Cleveland, Ohio. His research
interest focuses on electrochemical,
chemical, and biomedical sensors
and
microfabrication
technologies.
Professor Liu received the Outstanding
Achievement Award from the ECS Sensor
Division in 2008, and he received the
Presidential Award for Excellence in
Science, Mathematics and Engineering
Mentoring (PAESMEM) from the White
House in 2003. He is a Fellow of the Royal
Society of Chemistry, the Electrochemical
Society and the American Institute of
Medical and Biological Engineers.

(a)

RAW SENSOR SIGNAL (mV)

2500

2000

2000 PPM
1000 PPM

1500

300 PPM

1000

0%

RP-1 Vapor 0%

Hydrogen 0%

500

(b)

References

3000 PPM

Oxygen 21%

100

200

300

400

500

600

700

800

900

1000

TIME (sec)

Fig. 6. A prototype version (a) of a Lick and Stick leak sensor system with sensors combined with
supporting electronics; and (b) response of three sensors to varying hydrocarbon concentrations in
a constant background environment. The sensor signal is sent by telemetry and is the output from
the signal conditioning electronics, which processes the measured sensor current.10 (Courtesy Makel
Engineering, Inc.)

the ECS Sensor Division. His experience

spanning science, technology, and
business are leading to new patented
products in MEMS and he still serves on
technical committees as well as on the
boards of several start up companies. He
may be reached at [email protected].
Peter Hesketh is currently a professor
of Mechanical Engineering at Georgia
Institute of Technology, Member of the
Parker H. Petit Institute for Bioengineering
The Electrochemical Society Interface Winter 2010

and Biosciences, and Director of the

MEMS Group in the School of Mechanical
Engineering. His research interests
include microfabrication of chemical
and biosensors, microvalves, miniature
gas chromatography systems, and
microcantilever sensors. He currently
has active research programs funded by
Sandia National Laboratories and the
National Science Foundation. He has
published over 65 journal papers and
edited 15 books on microsystems. He is a

1. J. Bryzek, S. Roundy, B. Bircumshaw,

C. Chung, K. Castellino, M. Vestel,
and J. R. Stetter, IEEE Circuits &
Devices, March/April, 22, 8 (2006).
2. N a n o t e c h n o l o g y - E n a b l e d
Sensing, Report on the National
Nanotechnology
Initiative
Workshop, Arlington, Virginia,
May 5-7, 2009, available at http://
www.nano.gov/.
3. A. G. Shirke, R. E. Cavicchi, S.
Semancik, R. H. Jackson, B. G.
Frederick, and M. C. Wheeler, J.
Vac. Sci. Techn. A, 25, 514 (2007).
4. D. Linden and T. B. Reddy, Editors.
Handbook of Batteries, 3rd ed.,
McGraw-Hill, New York (2002).
5. L. Mateu and F. Moll, Proc. SPIE
Microtechnologies for the New
Millennium, 5837, 359 (2005).
6. E. Minazara, D. Vasic, F. Costa, and
G. Poulin, Ultrasonics, 44, e699
(2006).
7. C. C. Liu, E. OConnor, and K. P.
Strohl, IEEE Sensor Journal, 6, 187
(2006).
8. B. Otis, C. Moritz, J. Holleman, A.
Mishra, J. Pandey, S. Rai, D. Yeager,
and F. Zhang, Circuit Techniques
for Wireless Brain Interfaces, 31st
Annual International Conference,
IEEE EMBC, p. 3213 (2009).
9. G. W. Hunter, J. Xu, P. G. Neudeck,
D. B. Makel, B. Ward, and C.
C. Liu, Intelligent Chemical
Sensor Systems For In-Space
Safety Applications, 42nd AIAA/
ASME/SAE/ASEE Joint Propulsion
Conference & Exhibit, July 1012, 2006, Sacramento, California,
Tech. Rep. AIAA-06-58419 (2006).

33

Hunter, et al.
(continued from previous page)
10. G. W. Hunter, J. C. Xu, L. Evans, A.
Biaggi-Labiosa, B. J. Ward, S. Rowe,
D. B. Makel, C. C. Liu, P. Dutta,
G. M. Berger, and R. L. Vander
Wal, The Development of Micro/
Nano Chemical Sensor Systems
for Aerospace Applications, SPIE
Newsroom, June, 2010, http://spie.
org/x1004.xml.
11. G. W. Hunter and R. A. Dweik, J.
Breath Res., 2, 037020 (2008).
12. J. R. Stetter, P. J. Hesketh, and G. W.
Hunter, The Electrochemical Society
Interface, 15(1), 66 (2006).
13. N. Ming, J. R. Stetter, and W. J.
Buttner, Sensors & Actuators: B,
130, 889 (2008).
14. J. R. Stetter, in Computational
Methods for Sensor Materials Selection,
M. A. Ryan, A. V. Shevade, C. J.
Taylor, M. L.Homer, M. Blanco,
and J. R. Stetter, Editors, p. 3,
Springer Science+Business Media,
LLC (2009). DOI 10.1007/978-0387-73715-7-1.
15. http://www.detectcarbonmonoxide.
com or www.kwjengineering.com.

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