L01 Introduction and ICs 21336

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CSEN605: Digital Systems Design

Lecture 1

Dr. Mohamed Elmahdy


[email protected]

Useful Information

Lecturer: Mohamed Elmahdy, office: C7.312,


[email protected]
TA: Yasmin Mohamed, office: C7-201, [email protected]
Mohamed Lotfy
Webpage: http://met.guc.edu.eg/ (to be checked regularly)
Prerequisite: ELCT 201: Digital Logic Design
Textbook: Digital Design, M. Morris Mano, 4th edition (3rd edition would be
ok also)
Other References:
Introduction to Logic Synthesis using Verilog HDL, Reese & Thornton,
2006.
Digital Fundamentals, T. Floyd, Prentice Hall, 2002.
Other references might be stated in some slides
Development Environment:
Quartus II + Altera Development Board (DE2-115)

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Important Notice
Lectures and Tutorials Are
Complementary
Tutorials Cannot replace lectures
Lectures tend to be more theoretical
Tutorials tend to be more practical
(solving problems, experiments, etc)

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Course Grading
Assignment(3) 5%
Quizzes(3)

10%

Projects

20%

Midterm

25%

Final

40%

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What is a Digital System?


A system is a collection of related components work as a whole to
achieve a goal
A system consists of: inputs, behavior, and outputs

Inputs

Behavior

Outputs

A digital system is a system is which signals are digital (discrete values)

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Motivation
Digital Systems has revolutionized the world:
Mobile phones, Tablets, Computers, Cameras, Automotive, Satellite,
Aircarft, Medicine, Communications, Military, etc
The semiconductor industry has grown from $21 billion in 1985 to
$305 billion in 2013

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Previous Course

Current Course

ELCT201: Digital Logic


Numbering Systems
Boolean Algebra
Simple Combinational, Sequential
Networks (< 50 gates)
All designs were done by hand.

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CSEN605: Digital Systems Design


Complex Combinational and
Sequential networks (up to thousands
of gates)
Emphasis on combined
datapath+Finite state machine
designs for real time applications
Modern CAD tool usage (schematic
entry, simulation, technology
mapping, timing analysis, synthesis)
Logic Synthesis via Verilog-HDL
Modern implementation technologies
such Field Programmable Gate Arrays
(FPGAs)

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What is inside a Digital Device?

In this
course, you
will learn the
design
process of
ICs

IC

PCB

(Integrated Circuit)

(Printed Circuit Board)

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Integrated Circuit (IC)


Integrated Circuit is a microscopic array of transistors, electronic
circuits and components that are diffused or implanted onto the
surface of a single crystal, or chip, of semiconducting material such as
silicon.
Integrated Circuits are usually called ICs and popularly known as a
silicon chip, computer chip or microchip.
Modern Digital Systems use ICs almost exclusively in their design.
An IC is constructed ("fabricated") on a small rectangle (a "die") cut
from a Silicon wafer
Pure silicon is the basis for most integrated circuits. It provides the
base, or substrate for the entire chip and is chemically doped to
provide the N and P regions that make up the integrated circuit
components
ICs are small, reliable, cheap, and consume low power

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ICs Comes in Different Packages

Through hole

Surface mount

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IC Package

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IC Package

The chip inside an IC is usually packaged inside a piece of black plastic


with tiny pins protruding to allow connections to the circuit.
It is often a good idea to solder a cheap chip holder to a PCB and then
press the integrated circuit package into it
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Uses for digital IC Technology Today


Standard Microprocessors
Used in desktop PCs, laptops, tablets, and embedded applications
Memory chips (DRAM, SRAM, etc)
Application Specific ICs (ASICs)
Custom designed to match particular application
Can be optimized for low-power, low-cost, high-performance.
High design cost.
Long time to market.
Field Programmable Logic devices (FPGAs, CPLDs)
Customized to particular application
Short time to market
Low design cost
Relatively high part cost

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IC Classification
By signal type
Digital ICs

Analog ICs

Mixed Signal ICs

E.g. Microprocessors, DSP,


Multiplexers, decoders

E.g.: Sensors, Op-Amps,


voltage regulators

E.g.: ADC, DAC

By Technology
Using Bipolar

Using MOSFETs

E.g. TTL and ECL

E.g.: CMOS & NMOS

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IC Classification by Integration Complexity


SSI (Small Scale Integration): up to 100 components per chip (e.g. basic
gates, flip-flops)

MSI (Medium Scale Integration): from 100 to 3,000 components per chip
(MUX, DEC, ENC)

LSI (Large Scale Integration): from 3,000 to 100,000 components per chip
(e.g. memories)

VLSI (Very Large Scale Integration): from 100,000 to 1,000,000


components per chip (e.g. DSPs, Microprocessors)

ULSI (Ultra Large Scale Integration): more than 1 million of electronic


components per chip (e.g. Microprocessors)

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IC Examples

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Implementation of Simple Digital Circuit


How to implement the function z=ab+c using standard components
(ICs)?
SN7400

SN7432

5V

c
a
b

z
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Integrated Circuit (IC)


Advantages:

Disadvantages:
Cannot be modified
Cannot be repaired

Low cost
High reliability
Low power requirements
High processing speed
Less weight
Less space

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Transistors

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Two states: ON and OFF

ON
1

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OFF
0

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n-Type MOSFET (NMOS) Transistor


MOSFET = Metal Oxide Semiconductor Field Effect Transistor
n-type
when Gate has positive voltage,
short circuit between #1 (Drain or D)
and #2 (Source or S)
(switch closed)
when Gate has zero voltage,
open circuit between #1 and #2
Gate = 1
(switch open)

Gate = 0
Terminal #2 must be
connected to GND (0V).
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n-Type MOSFET (NMOS) Transistor

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p-type MOS (PMOS) Transistor


p-type is complementary to n-type
when Gate has positive voltage,
open circuit between #1 (S) and #2 (D)
(switch open)
when Gate has zero voltage,
short circuit between #1 and #2
(switch closed)

Gate = 1

Gate = 0
Terminal #1 must be
connected to +5V.
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CMOS Circuit
Complementary MOS
Uses both n-type and p-type MOS transistors
p-type
Attached to Vdd (+) voltage
Pulls output voltage UP when input is zero
n-type
Attached to GND
Pulls output voltage DOWN when input is one
For all inputs, make sure that output is either connected to GND or to +,
but not both!

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Inverter (NOT Gate)

Truth table

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In

Out

0
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NOR Gate

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OR Gate
A

Add inverter to NOR.

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NAND Gate (AND-NOT)

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AND Gate

Add inverter to NAND.

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CMOS Logic Levels


Logic Levels for typical CMOS circuits

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IC Fabrication
Semiconductor Fabrication Plant (commonly called a Fab/Foundry)
is a factory where ICs are manufactured.
Establishing a Fab costs billions of dollars.

A Fab is 1000 times cleaner than a hospital operating room (since


even a single speck can ruin a microcircuit, which has features much
smaller than dust. )
Fabless manufacturing: is the design and sale of hardware
microchips while outsourcing the fabrication to a specialized Fab (e.g.
Nvidia and AMD).

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How does a Fab look like?

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How Microchips are made ?


ICs are typically created on larger
circular sheets of silicon called wafers
A wafer is typically 100-300 mm in
diameter, and about 1 mm thick
A large silicon circuit is about 1cm long
The wafer passes through several
processing steps: thermal, chemical,
cleaning, etc
Each IC is tested before and after
packaging

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Silicon wafers

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Robert Noyce, 1927-1990

Nicknamed Mayor of Silicon Valley

Cofounded Fairchild Semiconductor in


1957

Cofounded Intel in 1968

Co-invented the integrated circuit

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Gordon Moore, 1929

Cofounded Intel in 1968 with Robert


Noyce.

Moores Law:

In 1965, Gordon Moore noted


that the number of transistors
on a computer chip doubles
every 18 to 24 months.
He made a prediction that
semiconductor technology will
double its effectiveness every
18 months.

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Moores Law

The prediction has


proven to be accurate,
in part because the law
is now used in the
semiconductor industry
to guide long-term
planning and to set
targets for research and
development.

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Transistor Gate Length

*Nature 479, 310316 (17 November 2011) doi:10.1038/nature10676

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Past vs Present
Intel 4004, 1971

VS

Six core
Intel Core i7 Ivy Bridge

2300 transistors
1.86 billion transistors

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Videos

Assignment: Watch these videos:


How microchips are made:
https://www.youtube.com/watch?v=F2KcZGwntgg
Zoom into a microchip:
https://www.youtube.com/watch?v=Knd-U-avG0c
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Important
Your task for this week is to revise all the fundamentals of Logic
Design:
Combinational and sequential logic
Logic gates, registers, decoders, encoders, multiplexers, adders,
flip-flops
Basically, everything
Some revision assignments will be posted on the MET website.

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References
Digital Fundamentals, 6th Edition, Thomas L. Floyd, Prentice Hall,
2002
Digital Design, M. Morris Mano, 4rd Edition

The Semiconductor Industry Association (SIA),


http://www.semiconductors.org/
CSEN605:Digital Systems Design Course, Spring 2011, GUC
CSEN605:Digital Systems Design Course, Winter 2014, GUC

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