LNK304 PDF
LNK304 PDF
LNK304 PDF
LinkSwitch-TN Family
Applications
Appliances and timers
LED drivers and industrial controls
Description
LinkSwitch-TN is specifically designed to replace all linear and
capacitor-fed (cap dropper) non-isolated power supplies in the
under 360 mA output current range at equal system cost while
offering much higher performance and energy efficiency.
FB
D
+
Wide Range
HV DC Input
BP
S
+
DC
Output
LinkSwitch-TN
PI-3492-111903
CCM
85-265 VAC
MDCM2
CCM3
80 mA
63 mA
80 mA
63 mA
LNK304P/G/D 120 mA
170 mA
120 mA 170 mA
LNK305P/G/D 175 mA
280 mA
175 mA 280 mA
LNK306P/G/D 225 mA
360 mA
225 mA 360 mA
LNK302/304-306
BYPASS
(BP)
DRAIN
(D)
REGULATOR
5.8 V
BYPASS PIN
UNDER-VOLTAGE
5.8 V
4.85 V
CURRENT LIMIT
COMPARATOR
6.3 V
VI
LIMIT
JITTER
CLOCK
DCMAX
THERMAL
SHUTDOWN
OSCILLATOR
FEEDBACK
(FB)
1.65 V -VT
S
Q
LEADING
EDGE
BLANKING
SOURCE
(S)
PI-3904-020805
DRAIN
(D)
BYPASS
(BP)
REGULATOR
5.8 V
FAULT
PRESENT
AUTORESTART
COUNTER
CLOCK
RESET
5.8 V
4.85 V
BYPASS PIN
UNDER-VOLTAGE
CURRENT LIMIT
COMPARATOR
6.3 V
+
-
VI
LIMIT
JITTER
CLOCK
DCMAX
OSCILLATOR
FEEDBACK
(FB)
THERMAL
SHUTDOWN
1.65 V -VT
S
Q
LEADING
EDGE
BLANKING
SOURCE
(S)
PI-2367-021105
2-2
2
Rev. H 12/06
LNK302/304-306
P Package (DIP-8B)
G Package (SMD-8B)
S
BP
FB
4
3a
D Package (SO-8C)
BP
FB
3b
PI-3491-120706
LinkSwitch-TN Functional
Description
LinkSwitch-TN combines a high voltage power MOSFET switch
with a power supply controller in one device. Unlike conventional
PWM (pulse width modulator) controllers, LinkSwitch-TN uses
a simple ON/OFF control to regulate the output voltage. The
LinkSwitch-TN controller consists of an oscillator, feedback
(sense and logic) circuit, 5.8 V regulator, BYPASS pin undervoltage circuit, over-temperature protection, frequency jittering,
current limit circuit, leading edge blanking and a 700 V power
MOSFET. The LinkSwitch-TN incorporates additional circuitry
for auto-restart.
Oscillator
The typical oscillator frequency is internally set to an average
of 66 kHz. Two signals are generated from the oscillator: the
maximum duty cycle signal (DCMAX) and the clock signal that
indicates the beginning of each cycle.
LNK302/304-306
PI-3660-081303
600
500
VDRAIN
400
300
200
100
0
68 kHz
64 kHz
20
Time (s)
Applications Example
A 1.44 W Universal Input Buck Converter
The circuit shown in Figure 5 is a typical implementation of a
R1
13.0 k
1%
RF1
8.2
2W
85-265
VAC
L2
1 mH
D3
1N4007
D4
1N4007
FB
D
C4
4.7 F
400 V
C5
4.7 F
400 V
BP
C1
100 nF
R3
2.05 k
1%
LinkSwitch-TN
LNK304
C3
10 F
35 V
L1
1 mH
280 mA
D1
UF4005
D2
1N4005GP
12 V,
120 mA
C2
100 F
16 V
R4
3.3 k
RTN
Figure 5. Universal Input, 12 V, 120 mA Constant Voltage Power Supply Using LinkSwitch-TN.
2-4
4
Rev. H 12/06
PI-3757-112103
LNK302/304-306
LinkSwitch-TN
RF1
D3
L2
FB
D2
R1
BP
AC
INPUT
C4
C5
C1
R3
L1
C3
C2
DC
OUTPUT
D1
D4
PI-3750-121106
Figure 6a. Recommended Printed Circuit Layout for LinkSwitch-TN in a Buck Converter Configuration using P or G Package.
D3
RF1
L2
FB
BP
AC
INPUT
C4
LinkSwitch-TN
L1
S
D1
C3
C5
C1
R3
D2
C2
R1
DC
OUTPUT
D4
PI-4546-011807
Figure 6b. Recommended Printed Circuit Layout for LinkSwitch-TN in a Buck Converter Configuration using D Package
to Bottom Side of the Board.
LNK302/304-306
TOPOLOGY
High-Side
Buck
Direct
Feedback
FB
BP
S
KEY FEATURES
LinkSwitch-TN
VIN
VO
PI-3751-121003
High-Side
Buck
Optocoupler
Feedback
BP
FB
D
LinkSwitch-TN
VO
VIN
PI-3752-121003
Low-Side
Buck
Optocoupler
Feedback
+
LinkSwitch-TN
VO
VIN
BP
FB
D
Low-Side
Buck
Constant
Current LED
Driver
PI-3753-111903
IO
LinkSwitch-TN
VF +
VIN
BP
R=
High-Side
Buck Boost
Direct
Feedback
FB
VF PI-3754-112103
IO
BP
S
LinkSwitch-TN
VIN
VO
+
PI-3755-121003
300
RSENSE =
2 k
FB
BP
RSENSE
2V
IO
IO
LinkSwitch-TN
VIN
FB
High-Side
Buck Boost
Constant
Current LED
Driver
10 F
50 V
100 nF
PI-3779-120803
2-6
6
Rev. H 12/06
LNK302/304-306
TOPOLOGY
Low-Side
Buck Boost
Optocoupler
Feedback
KEY FEATURES
+
LinkSwitch-TN
VO
VIN
BP
S
FB
D
+
PI-3756-111903
Feedback Diode D2
Diode D2 can be a low-cost slow diode such as the 1N400X
series, however it should be specified as a glass passivated type
to guarantee a specified reverse recovery time. To a first order,
the forward drops of D1 and D2 should match.
Inductor L1
Choose any standard off-the-shelf inductor that meets the
design requirements. A drum or dog bone I core
inductor is recommended with a single ferrite element due to
its low cost and very low audible noise properties. The typical
inductance value and RMS current rating can be obtained from
the LinkSwitch-TN design spreadsheet available within the
PI Expert design suite from Power Integrations. Choose L1
greater than or equal to the typical calculated inductance with
RMS current rating greater than or equal to calculated RMS
inductor current.
Capacitor C2
The primary function of capacitor C2 is to smooth the inductor
current. The actual output ripple voltage is a function of this
capacitors ESR. To a first order, the ESR of this capacitor
should not exceed the rated ripple voltage divided by the typical
current limit of the chosen LinkSwitch-TN.
Feedback Resistors R1 and R3
The values of the resistors in the resistor divider formed by
R1 and R3 are selected to maintain 1.65 V at the FB pin. It is
recommended that R3 be chosen as a standard 1% resistor of
2 k. This ensures good noise immunity by biasing the feedback
network with a current of approximately 0.8 mA.
Feedback Capacitor C3
Capacitor C3 can be a low cost general purpose capacitor. It
provides a sample and hold function, charging to the output
voltage during the off time of LinkSwitch-TN. Its value should
be 10 F to 22 F; smaller values cause poorer regulation at
light load conditions.
2-7
7
Rev. H 12/06
LNK302/304-306
Pre-load Resistor R4
In high-side, direct feedback designs where the minimum load
is <3 mA, a pre-load resistor is required to maintain output
regulation. This ensures sufficient inductor energy to pull the
inductor side of the feedback capacitor C3 to input return via
D2. The value of R4 should be selected to give a minimum
output load of 3 mA.
In designs with an optocoupler the Zener or reference bias
current provides a 1 mA to 2 mA minimum load, preventing
pulse bunching and increased output ripple at zero load.
LinkSwitch-TN Layout Considerations
In the buck or buck-boost converter configuration, since the
SOURCE pins in LinkSwitch-TN are switching nodes, the copper
area connected to SOURCE should be minimized to minimize
EMI within the thermal constraints of the design.
In the boost configuration, since the SOURCE pins are tied
to DC return, the copper area connected to SOURCE can be
maximized to improve heatsinking.
The loop formed between the LinkSwitch-TN, inductor (L1),
freewheeling diode (D1), and output capacitor (C2) should
be kept as small as possible. The BYPASS pin capacitor
C1 (Figure 6) should be located physically close to the
SOURCE (S) and BYPASS (BP) pins. To minimize direct
coupling from switching nodes, the LinkSwitch-TN should be
placed away from AC input lines. It may be advantageous to
place capacitors C4 and C5 in-between LinkSwitch-TN and the
AC input. The second rectifier diode D4 is optional, but may
be included for better EMI performance and higher line surge
withstand capability.
2-8
8
Rev. H 12/06
LNK302/304-306
ABSOLUTE MAXIMUM RATINGS(1,5)
DRAIN Voltage .................................................. -0.3 V to 700 V
Peak DRAIN Current (LNK302).................200 mA (375 mA)(2)
Peak DRAIN Current (LNK304).................400 mA (750 mA)(2)
Peak DRAIN Current (LNK305).................800 mA (1500 mA)(2)
Peak DRAIN Current (LNK306).................1400 mA (2600 mA)(2)
FEEDBACK Voltage .........................................-0.3 V to 9 V
FEEDBACK Current.............................................100 mA
BYPASS Voltage ..........................................-0.3 V to 9 V
Storage Temperature .......................................... -65 C to 150 C
Operating Junction Temperature(3) ..................... -40 C to 150 C
Lead Temperature(4) ........................................................260 C
Notes:
1. All voltages referenced to SOURCE, TA = 25 C.
2. The higher peak DRAIN current is allowed if the DRAIN
to SOURCE voltage does not exceed 400 V.
3. Normally limited by internal circuitry.
4. 1/16 in. from case for 5 seconds.
5. Maximum ratings specified may be applied, one at a time,
without causing permanent damage to the product.
Exposure to Absolute Maximum Rating conditions for
extended periods of time may affect product reliability.
THERMAL IMPEDANCE
Thermal Impedance: P or G Package:
(JA) ........................... 70 C/W(3); 60 C/W(4)
(JC)(1) ............................................... 11 C/W
D Package:
(JA) ..................... .... 100 C/W(3); 80 C/W(4)
(JC)(2) ............................................... 30 C/W
Notes:
1. Measured on pin 2 (SOURCE) close to plastic interface.
2. Measured on pin 8 (SOURCE) close to plastic interface.
3. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610 g/m2) copper clad.
4. Soldered to 1 sq. in. (645 mm2), 2 oz. (610 g/m2) copper clad.
Conditions
Parameter
Symbol
Min
Typ
Max
62
66
70
Units
CONTROL FUNCTIONS
Output
Frequency
Maximum Duty
Cycle
FEEDBACK Pin
Turnoff Threshold
Current
FEEDBACK Pin
Voltage at Turnoff
Threshold
fOSC
TJ = 25 C
Average
Peak-Peak Jitter
kHz
DCMAX
S2 Open
66
69
72
IFB
TJ = 25 C
30
49
68
1.54
1.65
1.76
160
220
LNK302/304
200
260
LNK305
220
280
LNK306
250
310
VFB
IS1
DRAIN Supply
Current
IS2
VFB 2 V
(MOSFET Not Switching)
See Note A
FEEDBACK
Open
(MOSFET
Switching)
See Notes A, B
2-9
9
Rev. H 12/06
LNK302/304-306
Conditions
Parameter
Symbol
Min
Typ
Max
Units
ICH1
VBP = 0 V
TJ = 25 C
LNK302/304
-5.5
-3.3
-1.8
LNK305/306
-7.5
-4.6
-2.5
ICH2
VBP = 4 V
TJ = 25 C
LNK302/304
-3.8
-2.3
-1.0
LNK305/306
-4.5
-3.3
-1.5
mA
BYPASS Pin
Voltage
VBP
5.55
5.8
6.10
BYPASS Pin
Voltage Hysteresis
VBPH
0.8
0.95
1.2
BYPASS Pin
Supply Current
IBPSC
See Note D
68
CIRCUIT PROTECTION
di/dt = 55 mA/s
TJ = 25 C
di/dt = 65 mA/s
TJ = 25 C
Current Limit
TSD
2-10
10
Rev. H 12/06
185
240
257
275
271
308
345
375
401
396
450
504
450
482
515
508
578
647
LNK302/304
280
360
475
LNK305
360
460
610
LNK306
400
500
675
170
215
135
142
LNK305
LNK306
tON(MIN)
Thermal Shutdown
Temperature
165
350
tLEB
145
mA
di/dt = 75 mA/s
TJ = 25 C
di/dt = 95 mA/s
TJ = 25 C
Leading Edge
Blanking Time
146
LNK304
Minimum On Time
136
LNK302
ILIMIT (See
Note E)
126
TJ = 25 C
See Note F
ns
ns
150
LNK302/304-306
Conditions
Parameter
Symbol
Min
Typ
Max
Units
TSHD
See Note G
75
OUTPUT
LNK302
ID = 13 mA
ON-State
Resistance
RDS(ON)
LNK304
ID = 25 mA
LNK305
ID = 35 mA
LNK306
ID = 45 mA
OFF-State Drain
Leakage Current
Breakdown Voltage
Rise Time
Fall Time
IDSS
BVDSS
tR
tF
TJ = 25 C
48
55.2
TJ = 100 C
76
88.4
TJ = 25 C
24
27.6
TJ = 100 C
38
44.2
TJ = 25 C
12
13.8
TJ = 100 C
19
22.1
TJ = 25 C
8.1
TJ = 100 C
11
12.9
LNK302/304
50
LNK305
70
LNK306
90
700
DRAIN Supply
Voltage
tEN
Output Disable
Setup Time
tDST
Auto-Restart
ON-Time
tAR
50
ns
50
ns
Auto-Restart
Duty Cycle
DCAR
See Figure 9
10
0.5
TJ = 25 C
See Note H
50
Output Enable
Delay
LNK302
Not Applicable
LNK304-306
50
LNK302
Not Applicable
LNK304-306
s
s
ms
2-11
11
Rev. H 12/06
LNK302/304-306
NOTES:
A. Total current consumption is the sum of IS1 and IDSS when FEEDBACK pin voltage is 2 V (MOSFET not
switching) and the sum of IS2 and IDSS when FEEDBACK pin is shorted to SOURCE (MOSFET switching).
B Since the output MOSFET is switching, it is difficult to isolate the switching current from the supply current at the
DRAIN. An alternative is to measure the BYPASS pin current at 6 V.
C. See Typical Performance Characteristics section Figure 14 for BYPASS pin start-up charging waveform.
D. This current is only intended to supply an optional optocoupler connected between the BYPASS and FEEDBACK
pins and not any other external circuitry.
E. For current limit at other di/dt values, refer to Figure 13.
F. This parameter is guaranteed by design.
G. This parameter is derived from characterization.
H. Auto-restart on time has the same temperature characteristics as the oscillator (inversely proportional to
frequency).
470
5W
470 k
D
S1
FB
S2
BP
50 V
S
50 V
0.1 F
PI-3490-060204
DCMAX
t2
(internal signal)
t1
tP
HV 90%
90%
FB
DRAIN
VOLTAGE
t
D= 1
t2
VDRAIN
tEN
10%
0V
tP =
1
fOSC
PI-3707-112503
PI-2048-033001
2-12
12
Rev. H 12/06
LNK302/304-306
1.0
PI-2680-012301
1.2
Output Frequency
(Normalized to 25 C)
PI-2213-012301
1.0
0.8
0.6
0.4
0.2
0.9
0
-50 -25
25
50
-50
-25
0.8
Normalized di/dt
di/dt = 1
di/dt = 6
0.4
0.2
0
-50
100 125
PI-3710-071204
1.2
1.0
0.8
0.6
LNK302
LNK304
LNK305
LNK306
0.4
0.2
Normalized
di/dt = 1
55 mA/s
65 mA/s
75 mA/s
95 mA/s
Normalized
Current
Limit = 1
136 mA
257 mA
375 mA
482 mA
0
0
50
100
150
Normalized di/dt
Temperature (C)
PI-2240-012301
7
6
5
4
3
2
1
0
400
350
75
1.4
1.0
0.6
50
PI-3709-111203
Current Limit
(Normalized to 25 C)
1.2
25
PI-3661-071404
Breakdown Voltage
(Normalized to 25 C)
1.1
25 C
300
100 C
250
200
150
Scaling Factors:
LNK302 0.5
LNK304 1.0
LNK305 2.0
LNK306 3.4
100
50
0
0.2
0.4
0.6
0.8
Time (ms)
Figure 14. BYPASS Pin Start-up Waveform.
1.0
8 10 12 14 16 18 20
2-13
13
Rev. H 12/06
LNK302/304-306
1000
100
Scaling Factors:
LNK302
0.5
LNK304
1.0
LNK305
2.0
LNK306
3.4
10
1
0
100
200
300
400
500
600
Plastic DIP
Plastic SO-8C
Lead Finish
N
LNK 304 G N - TL
2-14
14
Rev. H 12/06
TL
LNK302/304-306
.240 (6.10)
.260 (6.60)
.367 (9.32)
.387 (9.83)
.125 (3.18)
.145 (3.68)
.057 (1.45)
.068 (1.73)
Notes:
1. Package dimensions conform to JEDEC specification
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
2. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.
3. Dimensions shown do not include mold flash or other
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
4. Pin locations start with Pin 1, and continue counter-clockwise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 6 is omitted.
5. Minimum metal to metal spacing at the package body for
the omitted lead location is .137 inch (3.48 mm).
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
perpendicular to plane T.
.015 (.38)
MINIMUM
.120 (3.05)
.140 (3.56)
.100 (2.54) BSC
.014 (.36)
.022 (.56)
.048 (1.22)
.053 (1.35)
.008 (.20)
.015 (.38)
.300 (7.62) BSC
(NOTE 7)
.300 (7.62)
.390 (9.91)
2-15
15
Rev. H 12/06
LNK302/304-306
SO-8C
4
DETAIL A
5
GAUGE
PLANE
SEATING
PLANE
0-8
C
1.04 (0.041) REF
0.10 (0.004) C D
2X
Pin 1 ID
0.25 (0.010)
BSC
0.40 (0.016)
1.27 (0.050)
0.20 (0.008) C
2X
7X 0.31 - 0.51 (0.012 - 0.020)
0.25 (0.010) M C A-B D
1.25 - 1.65
(0.049 - 0.065)
1.35 (0.053)
1.75 (0.069)
DETAIL A
0.10 (0.004)
0.25 (0.010)
0.10 (0.004) C
7X
SEATING PLANE
C
Reference
Solder Pad
Dimensions
2.00 (0.079)
D07C
2-16
16
Rev. H 12/06
0.17 (0.007)
0.25 (0.010)
1.27 (0.050)
4.90 (0.193)
Notes:
1. JEDEC reference: MS-012.
2. Package outline exclusive of mold flash and metal burr.
3. Package outline inclusive of plating thickness.
4. Datums A and B to be determined at datum plane H.
5. Controlling dimensions are in millimeters. Inch dimensions
are shown in parenthesis. Angles in degrees.
0.60 (0.024)
PI-4526-040207
LNK302/304-306
Notes
2-17
17
Rev. H 12/06
LNK302/304-306
Notes
2-18
18
Rev. H 12/06
LNK302/304-306
Revision Notes
Date
3/03
1/04
1) Added LNK302.
8/04
12/04
3/05
12/06
2-19
19
Rev. H 12/06
LNK302/304-306
The PI logo, TOPSwitch, TinySwitch, LinkSwitch, DPA-Switch, PeakSwitch, Clampless, EcoSmart, E-Shield,
Filterfuse, StackFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their
respective companies. Copyright 2006, Power Integrations, Inc.
GERMANY
Rueckertstrasse 3
D-80336, Munich
Germany
Phone: +49-89-5527-3910
Fax: +49-89-5527-3920
e-mail: [email protected]
JAPAN
Keihin Tatemono 1st Bldg 2-12-20
Shin-Yokohama, Kohoku-ku,
Yokohama-shi, Kanagawa ken,
Japan 222-0033
Phone: +81-45-471-1021
Fax: +81-45-471-3717
e-mail: [email protected]
TAIWAN
5F, No. 318, Nei Hu Rd., Sec. 1
Nei Hu Dist.
Taipei, Taiwan 114, R.O.C.
Phone: +886-2-2659-4570
Fax: +886-2-2659-4550
e-mail: [email protected]
CHINA (SHANGHAI)
Rm 807-808A
Pacheer Commercial Centre,
555 Nanjing Rd. West
Shanghai, P.R.C. 200041
Phone: +86-21-6215-5548
Fax: +86-21-6215-2468
e-mail: [email protected]
INDIA
#1, 14th Main Road
Vasanthanagar
Bangalore-560052 India
Phone: +91-80-41138020
Fax: +91-80-41138023
e-mail: [email protected]
KOREA
RM 602, 6FL
Korea City Air Terminal B/D, 159-6
Samsung-Dong, Kangnam-Gu,
Seoul, 135-728, Korea
Phone: +82-2-2016-6610
Fax: +82-2-2016-6630
e-mail: [email protected]
UNITED KINGDOM
1st Floor, St. Jamess House
East Street, Farnham
Surrey GU9 7TJ
United Kingdom
Phone: +44 (0) 1252-730-140
Fax: +44 (0) 1252-727-689
e-mail: [email protected]
SINGAPORE
51 Newton Road
#15-08/10 Goldhill Plaza
Singapore, 308900
Phone: +65-6358-2160
Fax: +65-6358-2015
e-mail: [email protected]
APPLICATIONS HOTLINE
World Wide +1-408-414-9660
CHINA (SHENZHEN)
Rm 2206-2207, Block A,
Electronics Science & Technology Bldg.
2070 Shennan Zhong Rd.
Shenzhen, Guangdong,
China, 518031
Phone: +86-755-8379-3243
Fax: +86-755-8379-5828
e-mail: [email protected]
2-20
20
Rev. H 12/06
ITALY
Via De Amicis 2
20091 Bresso MI Italy
Phone: +39-028-928-6000
Fax: +39-028-928-6009
e-mail: [email protected]
APPLICATIONS FAX
World Wide +1-408-414-9760