Se 95

SE95
Ultra high accuracy digital temperature sensor and thermal

watchdog
Rev. 07 2 September 2009
Product data sheet
1. General description
The SE95 is a temperature-to-digital converter using an on-chip band gap temperature
sensor and Sigma Delta analog-to-digital conversion technique. The device is also a
thermal detector providing an overtemperature detection output.
The SE95 contains a number of data registers accessed by a controller via the 2-wire
serial I2C-bus interface:
Configuration register (Conf) to store the device settings such as sampling rate,
device operation mode, OS operation mode, OS polarity, and OS fault queue
Temperature register (Temp) to store the digital Temp reading

Set-point registers (Tos and Thyst) to store programmable overtemperature shutdown
and hysteresis limits
Identification register (ID) to store manufacturer numbers

The device includes an open-drain output (pin OS) which becomes active when the
temperature exceeds the programmed limits. There are three selectable logic address
pins (pins A2 to A0) so that eight devices can be connected on the same bus without
address conflict.
The SE95 can be configured for different operation conditions. It can be set in normal
mode to periodically monitor the ambient temperature, or in shutdown mode to minimize
power consumption. The OS output operates in either of two selectable modes: OS
comparator mode and OS interrupt mode. Its active state can be selected as either HIGH
or LOW. The fault queue that defines the number of consecutive faults in order to activate
the OS output is programmable as well as the set-point limits.
The temperature register always stores a 13-bit twos complement data giving a
temperature resolution of 0.03125 C. This high temperature resolution is particularly
useful in applications of measuring precisely the thermal drift or runaway. For normal
operation and compatibility with the LM75A, only the 11 MSBs are read, with a resolution
of 0.125 C to provide the accuracies specified. To be compatible with the LM75, read only
the 9 MSBs.
The device is powered-up in normal operation mode with the OS in comparator mode,
temperature threshold of 80 C and hysteresis of 75 C, so that it can be used as a
stand-alone thermostat with those pre-defined temperature set points. The conversion
rate is programmable, with a default of 10 conversions/s.
SE95
NXP Semiconductors
Ultra high accuracy digital temperature sensor and thermal watchdog
2. Features
n
n
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n
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n
Pin-for-pin replacement for industry standard LM75/LM75A

Specification of a single part over supply voltage from 2.8 V to 5.5 V
Small 8-pin package types: SO8 and TSSOP8 (MSOP8)
I2C-bus interface to 400 kHz with up to 8 devices on the same bus
Supply voltage from 2.8 V to 5.5 V
Temperature range from 55 C to +125 C
13-bit ADC that offers a temperature resolution of 0.03125 C
Temperature accuracy of 1 C from 25 C to +100 C
Programmable temperature threshold and hysteresis set points
Supply current of 7.0 A in shutdown mode for power conservation
Stand-alone operation as thermostat at power-up
ESD protection exceeds 1000 V for Human Body Model (HBM) per JESD22-A114 and
150 V for Machine Model (MM) per JESD22-A115
n Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
3. Applications
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System thermal management

Personal computers
Electronics equipment
Industrial controllers
4. Ordering information
Table 1.
Ordering information
Type
number
Package
Temperature range
Name
Description
SE95D
55 C to +125 C
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
SE95DP
55 C to +125 C
TSSOP8
plastic thin shrink small outline package; 8 leads;

body width 3 mm
SOT505-1
SE95U
55 C to +125 C
wafer
SE95_7
Product data sheet
Version
NXP B.V. 2009. All rights reserved.
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SE95
NXP Semiconductors
5. Block diagram
ADC CONTROL AND OTP CONTROL
SE95
OTP
8
VCC
Conf
BIAS
Temp
bit
stream
BAND GAP
SIGMA DELTA
MODULATOR
Tos
DECIMATION
FILTER
INTERRUPTION
LOGIC
Thyst
OSCILLATOR
REGISTER
BANK
POR
OS
I2C-BUS INTERFACE LOGIC

5
A2
Fig 1.
6
A1
7
A0
SCL
SDA
GND
002aae892
Block diagram of SE95
6. Pinning information
6.1 Pinning
SDA
VCC
SCL
A0
OS
GND
SDA
VCC
SCL
A0
A1
OS
A2
GND
SE95D
SE95DP
Pin configuration for SO8
A1
A2
002aac536
002aac537
Fig 2.
Fig 3.
Pin configuration for TSSOP8
6.2 Pin description

Table 2.
Pin description
Symbol
Pin
Description
SDA
I2C-bus serial bidirectional data line digital I/O; open-drain
SCL
I2C-bus serial clock digital input
OS
overtemperature shutdown output; open-drain
GND
ground; to be connected to the system ground
A2
user-defined address bit 2 digital input
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Table 2.
Pin description continued
Symbol
Pin
Description
A1
A0
VCC
supply voltage
7. Functional description
7.1 General operation
The SE95 uses the on-chip band gap sensor to measure the device temperature with a
resolution of 0.03125 C and stores the 13-bit twos complement digital data, resulting
from 13-bit analog to digital conversion, into register Temp. Register Temp can be read at
any time by a controller on the I2C-bus. Reading temperature data does not affect the
conversion in progress during the read operation.
The device can be set to operate in either mode: normal or shutdown mode. In normal
operation mode, by default, the temperature-to-digital conversion is executed every
100 ms and register Temp is updated at the end of each conversion. In shutdown mode,
the device becomes idle, data conversion is disabled and register Temp holds the latest
result; however, the device I2C-bus interface is still active and register write/read operation
can be performed. The device operation mode is controlled by programming bit
SHUTDOWN of register Conf. The temperature conversion is initiated when the device is
powered up or returned to normal mode from shutdown mode.
In addition, at the end of each conversion in normal mode, the temperature data (or Temp)
in register Temp is automatically compared with the overtemperature shutdown threshold
data (or Tos) stored in register Tos, and the hysteresis data (or Thyst) stored in register
Thyst, in order to set the state of the device OS output accordingly. The registers Tos and
Thyst are write/read capable, and both operate with 9-bit twos complement digital data.
To match with this 9-bit operation, register Temp uses only the 9 MSB bits of its 13-bit data
for the comparison.
The device temperature conversion rate is programmable and can be chosen to be one of
the four values: 0.125, 1.0, 10, and 30 conversions/s. The default conversion rate is
10 conversions/s. Furthermore, the conversion rate is selected by programming bits
RATEVAL[1:0] of register Conf as shown in Table 6. Note that the average supply current
as well as the device power consumption increase with the conversion rate.
The way that the OS output responds to the comparison operation depends upon the OS
operation mode selected by configuration bit OS_COMP_INT, and the user-defined fault
queue defined by configuration bits OS_F_QUE[1:0].
In OS comparator mode, the OS output behaves like a thermostat. It becomes active
when the temperature exceeds Tos, and is reset when the temperature drops below Thyst.
Reading the device registers or putting the device into shutdown mode does not change
the state of the OS output. The OS output in this case can be used to control cooling fans
or thermal switches.
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In OS interrupt mode, the OS output is used for thermal interruption. When the device is
powered-up, the OS output is first activated only when Temp exceeds Tos; then it remains
active indefinitely until being reset by a read of any register. Once the OS output has been
activated by crossing Tos and then reset, it can be activated again only when Temp drops
below Thyst; then again, it remains active indefinitely until being reset by a read of any
register. The OS interrupt operation would be continued in this sequence: Tos trip, reset,
Thyst trip, reset, Tos trip, reset, Thyst trip, reset, and etc. Putting the device into shutdown
mode also resets the OS output.
In both cases, comparator mode and interrupt mode, the OS output is activated only if a
number of consecutive faults, defined by the device fault queue, has been met. The fault
queue is programmable and stored in bits OS_F_QUE[1:0], of register Conf. Also, the OS
output active state is selectable as HIGH or LOW by setting accordingly the bit OS_POL
of register Conf.
At power-up, the device is put into normal operation mode, register Tos is set to 80 C,
register Thyst is set to 75 C, OS active state is selected LOW and the fault queue is equal
to 1. The data reading of register Temp is not available until the first conversion is
completed in about 33 ms.
The OS response to the temperature is illustrated in Figure 4.
Tos
Thyst
reading temperature limits

OS RESET
OS ACTIVE
OS output in comparator mode
OS RESET
(1)
(1)
(1)
OS ACTIVE
OS output in interrupt mode
001aad623
(1) OS is reset by either reading register or putting the device in shutdown mode. Assumed that the
fault queue is met at each Tos and Thyst crossing point.
Fig 4.
OS response to temperature
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7.2 OS output and polarity

The OS output is an open-drain output and its state represents results of the device
watchdog operation as described in Section 7.1. In order to observe this output state, an
external pull-up resistor is needed. The resistor should be as large as possible, up to
200 k, to minimize the Temp reading error due to internal heating by the high OS sinking
current.
The OS output active state can be selected as HIGH or LOW by programming bit
OS_POL of register Conf: setting bit OS_POL to logic 1 selects OS active HIGH and
setting to logic 0 sets OS active LOW. At power-up, bit OS_POL is equal to logic 0 and the
OS active state is LOW.
7.3 OS comparator and interrupt modes

As described in Section 7.1, the OS output responds to the result of the comparison
between register Temp data and the programmed limits, in registers Tos and Thyst, in
different ways depending on the selected OS mode: OS comparator or OS interrupt. The
OS mode is selected by programming bit OS_COMP_INT of register Conf: setting bit
OS_COMP_INT to logic 1 selects the OS interrupt mode, and setting to logic 0 selects the
OS comparator mode. At power-up, bit OS_COMP_INT is equal to logic 0 and the OS
comparator is selected.
The main difference between the two modes is that in OS comparator mode, the OS
output becomes active when Temp has exceeded Tos and reset when Temp has dropped
below Thyst, reading a register or putting the device into shutdown mode does not change
the state of the OS output; while in OS interrupt mode, once it has been activated either
by exceeding Tos or dropping below Thyst, the OS output will remain active indefinitely until
reading a register or putting the device into shutdown mode occurs, then the OS output is
reset.
Temperature limits Tos and Thyst must be selected so that Tos > Thyst. Otherwise, the OS
output state will be undefined.
7.4 OS fault queue

Fault queue is defined as the number of faults that must occur consecutively to activate
the OS output. It is provided to avoid false tripping due to noise. Because faults are
determined at the end of data conversions, fault queue is also defined as the number of
consecutive conversions returning a temperature trip. The value of fault queue is
selectable by programming the two bits OS_F_QUE[1:0] in register Conf. Notice that the
programmed data and the fault queue value are not the same. Table 3 shows the
one-to-one relationship between them. At power-up, fault queue data = 00 and fault queue
value = 1.
Table 3.
Fault queue table
Fault queue data
Fault queue value
OS_F_QUE[1]
OS_F_QUE[0]
Decimal
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7.5 Shutdown mode

The device operation mode is selected by programming bit SHUTDOWN of register Conf.
Setting bit SHUTDOWN to logic 1 will put the device into shutdown mode. Resetting bit
SHUTDOWN to logic 0 will return the device to normal mode.
In shutdown mode, the device draws a small current of approximately 7.5 A and the
power dissipation is minimized; the temperature conversion stops, but the I2C-bus
interface remains active and register write/read operation can be performed. If the OS
output is in comparator mode, then it remains unchanged. In interrupt mode, the OS
output is reset.
7.6 Power-up default and power-on reset

The SE95 always powers-up in its default state with:
Normal operation mode

OS comparator mode
Tos = 80 C
Thyst = 75 C
OS output active state is LOW
Pointer value is logic 0
When the power supply voltage is dropped below the device power-on reset level of
approximately 1.9 V (POR) and then rises up again, the device will be reset to its default
condition as listed above.
8. I2C-bus serial interface

The SE95 can be connected to a compatible 2-wire serial interface I2C-bus as a slave
device under the control of a controller or master device, using two device terminals, SCL
and SDA. The controller must provide the SCL clock signal and write/read data to and
from the device through the SDA terminal. Note that if the I2C-bus common pull-up
resistors have not been installed as required for I2C-bus, then an external pull-up resistor,
approximately 10 k, is needed for each of these two terminals. The bus communication
protocols are described in Section 8.7 Protocols for writing and reading the registers.
8.1 Slave address

The SE95 slave address on the I2C-bus is partially defined by the logic applied to the
device address pins A2, A1 and A0. Each pin is typically connected either to GND for
logic 0, or to VCC for logic 1. These pins represent the three LSB bits of the device 7-bit
address. The other four MSB bits of the address data are preset to 1001 by hard wiring
inside the SE95. Table 4 shows the device's complete address and indicates that up to
8 devices can be connected to the same bus without address conflict. Because the input
pins SCL, SDA and A2 to A0, are not internally biased, it is important that they should not
be left floating in any application.
0Ch is a reserved address for SMBus Alert Response Address (ARA). This is an optional
command from the SMBus specification to allow SMBus devices to respond to an SMBus
master with their slave device if they are generating an interrupt. The SE95 will send a
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false alert if the address 0Ch is sent and cannot be active on the I2C-bus if this address is
used. Consider using the SE98 since it supports SMBus ARA as well as time-out features
and provides 1 C accuracy.
Table 4.
Address table
MSB
LSB
A2
A1
A0
8.2 Register list

The SE95 contains 7 data registers. The registers can be 1 byte or 2 bytes wide, and are
defined in Table 5. The registers are accessed by the value in the content of the pointer
register during I2C-bus communication. The types of registers are: read only, read/write,
and reserved for manufacturer use. Note that when reading a two-byte register, the host
must provide enough clock pulses as required by the I2C-bus protocol (see Section 8.7)
for the device to completely return both data bytes. Otherwise the device may hold the
SDA line in LOW state, resulting in a bus hang condition.
Table 5.
Register table
Register
name
Pointer
value
R/W
POR
state
Description
Conf
01h
R/W
00h
configuration register: contains a single 8-bit data byte;

to set an operating condition
Temp
00h
read
only
N/A
temperature register: contains two 8-bit data bytes; to

store the measured Temp
Tos
03h
R/W
5000h
overtemperature shutdown threshold register: contains

two 8-bit data bytes; to store the overtemperature
shutdown limit; default Tos = 80 C
Thyst
02h
R/W
4B00h
hysteresis register: contains two 8-bit data bytes; to

store the hysteresis limit; bit 7 to bit 0 are also used in
OTP (One Time Programmable) test mode to supply
OTP write data; default Thyst = 75 C
ID
05h
read
only
A1h
identification register: contains a single 8-bit data byte

for the manufacturer ID code
Reserved
04h
N/A
N/A
reserved
Reserved
06h
N/A
N/A
reserved
8.3 Register pointer

The register pointer or pointer byte is an 8-bit data byte that is equivalent to the register
command in the I2C-bus definitions and is used to identify the device register to be
accessed for a write or read operation. Its values are listed as pointer values in Table 5.
For the device register I2C-bus communication, the pointer byte may or may not need to
be included within the command as illustrated in the I2C-bus protocol figures in
Section 8.7.
The command statements for writing data to a register must always include the pointer
byte; while the command statements for reading data from a register may or may not
include it. To read a register that is different from the one that has been recently read, the
pointer byte must be included. However, to re-read a register that has been recently read,
the pointer byte may not have to be included in the reading.
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At power-up, the pointer value is preset to logic 0 for register Temp; users can then read
the temperature without specifying the pointer byte.
8.4 Configuration register

The Configuration (Conf) register is a read/write register and contains an 8-bit
non-complement data byte that is used to configure the device for different operating
conditions. Table 6 shows the bit assignments of this register.
Table 6.
Conf register
Legend: * = default value.
Bit
Symbol
Access
Value
Description
0*
reserved for manufacturers use
reserved
R/W
6 and 5
RATEVAL[1:0]
R/W
4 and 3
OS_F_QUE[1:0]
OS_POL
sets the conversion rate

00*
10 conversion/s
01
0.125 conversion/s
10
1 conversion/s
11
30 conversion/s
R/W
OS fault queue programming

00*
queue value = 1
01
queue value = 2
10
queue value = 4
11
queue value = 6
R/W
OS_COMP_INT
OS polarity selection
0*
OS active LOW
OS active HIGH
R/W
OS operation mode selection

0*
SHUTDOWN
R/W
OS comparator
OS interrupt
operation mode
0*
normal
shutdown
8.5 Temperature register

The Temperature (Temp) register holds the digital result of temperature measurement or
monitor at the end of each analog to digital conversion. This register is read only and
contains two 8-bit data bytes consisting of one Most Significant Byte (MSByte) and one
Least Significant Byte (LSByte). However, only 13 bits of those two bytes are used to store
the Temp data in twos complement format with the resolution of 0.03125 C. Table 7
shows the bit arrangement of the Temp data in the data bytes.
Table 7.
Temp register
MSByte
7
LSByte
5
D15 D14 D13 D12 D11 D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
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When reading register Temp, all 16 bits of the two data bytes (MSByte and LSByte) must
be collected and then the twos complement data value according to the desired resolution
must be selected for the temperature calculation. Table 8 shows the example for 11-bit
twos complement data value, Table 9 shows the example for 13-bit twos complement
data value.
Table 8.
Example 11-bit twos complement Temp register
MSByte
LSByte
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
Table 9.
Example 13-bit twos complement register
MSByte
7
LSByte
5
D12 D11 D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
When converting into the temperature the proper resolution must be used as listed in
Table 10 using either one of these two formulae:
1. If the Temp data MSB = 0, then: Temp (C) = +(Temp data) value resolution
2. If the Temp data MSB = 1, then: Temp (C) = (twos complement Temp data) value
resolution
Table 10.
Temp data and Temp value resolution
Data resolution
Value resolution
8 bit
1.0 C
9 bit
0.5 C
10 bit
0.25 C
11 bit
0.125 C
12 bit
0.0625 C
13 bit
0.03125 C
Table 11 shows some examples of the results for the 11-bit calculations.
Table 11.
Temp register value
11-bit binary
(twos complement)
Hexadecimal value
Decimal value
011 1111 1000
3F8
1016
+127.000 C
011 1111 0111
3F7
1015
+126.875 C
011 1111 0001
3F1
1009
+126.125 C
011 1110 1000
3E8
1000
+125.000 C
000 1100 1000
0C8
200
+25.000 C
000 0000 0001
001
+0.125 C
000 0000 0000
000
0.000 C
111 1111 1111
7FF
0.125 C
111 0011 1000
738
200
25.000 C
110 0100 1001
649
439
54.875 C
110 0100 1000
648
440
55.000 C
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Value
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Obviously, for 9-bit Temp data application in replacing the industry standard LM75, just
use only 9 MSB bits of the two bytes and disregard 7 LSB of the LSByte. The 9-bit Temp
data with 0.5 C resolution of the SE95 is defined exactly in the same way as for the
standard LM75 and it is here similar to the Tos and Thyst registers.
8.6 Overtemperature shutdown threshold and hysteresis registers

These two registers, are write/read registers, and also called set-point registers. They are
used to store the user-defined temperature limits, called overtemperature shutdown
threshold (Tos) and hysteresis temperature (Thyst), for the device watchdog operation. At
the end of each conversion the Temp data will be compared with the data stored in these
two registers in order to set the state of the device OS output; see Section 7.1.
Each of the set-point registers contains two 8-bit data bytes consisting of one MSByte and
one LSByte the same as register Temp. However, only 9 bits of the two bytes are used to
store the set-point data in twos complement format with the resolution of 0.5 C. Table 12
and Table 13 show the bit arrangement of the Tos data and Thyst data in the data bytes.
Notice that because only 9-bit data are used in the set-point registers, the device uses
only the 9 MSB of the Temp data for data comparison.
Table 12.
Tos register
MSByte
LSByte
D8
D7
D6
D5
D4
D3
D2
D1
D0
Table 13.
Thyst register
MSByte
LSByte
D8
D7
D6
D5
D4
D3
D2
D1
D0
When a set-point register is read, all 16 bits are provided to the bus and must be collected
by the controller to complete the bus operation. However, only the 9 most significant bits
should be used and the 7 LSB of the LSByte are equal to zero and should be ignored.
Table 14 shows examples of the limit data and value.
Table 14.
Tos and Thyst register
11-bit binary
(twos complement)
Hexadecimal value
Decimal value
Value
0 1111 1010
0FA
250
125.0 C
0 0011 0010
032
50
25.0 C
0 0000 0001
001
0.5 C
0 0000 0000
000
0.0 C
1 1111 1111
1FF
0.5 C
1 1100 1110
1CE
50
25.0 C
1 1001 0010
192
110
55.0 C
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8.7 Protocols for writing and reading the registers

The communication between the host and the SE95 must follow the rules strictly as
defined by the I2C-bus management. The protocols for SE95 register read/write
operations are illustrated in Figure 5 to Figure 10 together with the following definitions:
1. Before a communication, the I2C-bus must be free or not busy. It means that the SCL
and SDA lines must both be released by all devices on the bus, and they become
HIGH by the bus pull-up resistors.
2. The host must provide SCL clock pulses necessary for the communication. Data is
transferred in a sequence of 9 SCL clock pulses for every 8-bit data byte followed by
1-bit status of the acknowledgement.
3. During data transfer, except the START and STOP signals, the SDA signal must be
stable while the SCL signal is HIGH. It means that the SDA signal can be changed
only during the LOW duration of the SCL line.
4. S: START signal, initiated by the host to start a communication, the SDA goes from
HIGH-to-LOW while the SCL is HIGH.
5. RS: RE-START signal, same as the START signal, to start a read command that
follows a write command.
6. P: STOP signal, generated by the host to stop a communication, the SDA goes from
LOW-to-HIGH while the SCL is HIGH. The bus becomes free thereafter.
7. W: write bit, when the write/read bit is in a write command.
8. R: read bit, when the write/read bit is logic 1 in a read command.
9. A: device acknowledge bit, returned by the SE95. It is logic 0 if the device works
properly and logic 1 if not. The host must release the SDA line during this period in
order to give the device the control on the SDA line.
10. A: master acknowledge bit, not returned by the device, but set by the master or host
in reading 2-byte data. During this clock period, the host must set the SDA line to
LOW in order to notify the device that the first byte has been read for the device to
provide the second byte onto the bus.
11. NA: not-acknowledge bit. During this clock period, both the device and host release
the SDA line at the end of a data transfer, the host is then enabled to generate the
stop signal.
12. In a write protocol, data is sent from the host to the device and the host controls the
SDA line, except during the clock period when the device sends the device
acknowledgement signal to the bus.
13. In a read protocol, data is sent to the bus by the device and the host must release the
SDA line during the time that the device is providing data onto the bus and controlling
the SDA line, except during the clock period when the master sends the master
acknowledgement signal to the bus.
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SCL
SDA
A2 A1 A0 W
device address
START
pointer byte
write
configuration data byte
device
acknowledge
device
acknowledge
Fig 5.
D4 D3 D2 D1 D0 A
device
acknowledge
STOP
001aad624
Write configuration register (1-byte data)
9
(next)
SCL
SDA
A2
A1
A0 W
device address
RS (next)
pointer byte
START
device
acknowledge
1
A2
A1
RE-START
device
acknowledge
write
A0 R
SCL (cont.)
SDA (cont.)
D7 D6 D5 D4 D3 D2 D1 D0 NA
device address
data byte from device

STOP
master not
acknowledged
read
device
acknowledge
Fig 6.
001aad625
Read configuration register including pointer byte (1-byte data)
A2
A1
A0 R
SCL
SDA
device address
START
D7 D6 D5 D4 D3 D2 D1 D0 NA
data byte from device
read
device
acknowledge
Fig 7.
master not
acknowledged
STOP
001aad626
Read configuration register with preset pointer (1-byte data)
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SCL
(next)
SDA
A2
A1
A0
device address
device
acknowledge
3
(next)
device
acknowledge
write
P0
pointer byte
START
P1
SCL (cont.)
SDA (cont.)
D7 D6 D5 D4 D3 D2 D1 D0 A
D7 D6 D5 D4 D3 D2 D1 D0
ms byte data
ls byte data
STOP
device
acknowledge
device
acknowledge
Fig 8.
001aad627
Write Tos or Thyst register (2-byte data)
SCL
SDA
(next)
S
A2 A1 A0 W A
device address
START
P1 P0 A RS (next)
pointer byte
device
acknowledge
5 6 7 8
A2 A1 A0 R
RE-START
device
acknowledge
write
SCL (cont)
SDA (cont)
D7 D6 D5 D4 D3 D2 D1 D0 A4 D7 D6 D5 D4 D3 D2 D1 D0 NA
device address
ms byte from device
device
acknowledge
Fig 9.
ls byte from device
master
acknowledge
read
STOP
master not
acknowledged
001aad628
Read Temp, Tos or Thyst register including pointer byte (2-byte data)
A2 A1 A0 R
SCL
SDA
device address
START
D7 D6 D5 D4 D3 D2 D1 D0 A4 D7 D6 D5 D4 D3 D2 D1 D0 NA
ms byte from device
read
device
acknowledge
master
acknowledge
ls byte from device

master not
acknowledged
STOP
001aad629
Fig 10. Read Temp, Tos or Thyst register with preset pointer (2-byte data)
SE95_7
Product data sheet
14 of 27
SE95
NXP Semiconductors
9. Limiting values
Table 15. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VCC
Conditions
Min
Max
Unit
supply voltage
0.3
+6.0
VI(SCL)
input voltage on pin SCL
0.3
+6.0
VI(SDA)
input voltage on pin SDA
0.3
+6.0
VI(A0)
input voltage on pin A0
3.0
VCC + 0.3
VI(A1)
3.0
VCC + 0.3
VI(A2)
3.0
VCC + 0.3
II(PIN)
input current on input pins
5.0
+5.0
mA
IO(OS)
output current on pin OS
10.0
mA
VO(OS)
output voltage on pin OS
0.3
+6.0
VESD
electrostatic discharge
voltage
human body model
1000
machine model
150
Tstg
storage temperature
65
+150
Tj
junction temperature
150
10. Recommended operating conditions

Table 16.
Recommended operating characteristics
Symbol
Parameter
Min
Typ
Max
Unit
VCC
supply voltage
Conditions
2.8
5.5
Tamb
ambient temperature
55
+125
SE95_7
Product data sheet
15 of 27
SE95
NXP Semiconductors
11. Static characteristics

Table 17. Static characteristics
VCC = 2.8 V to 5.5 V, Tamb = 55 C to +125 C; unless otherwise specified.
Symbol Parameter
Tacc
temperature accuracy
Min
Typ[1]
Max
Unit
Tamb = 25 C to +100 C
1.0
+1.0
Tamb = 55 C to +125 C
2.0
+2.0
Tamb = 25 C to +100 C
+2
Tamb = 55 C to +125 C
Conditions
[2]
VCC = 2.8 V to 3.6 V
[2]
VCC = 3.6 V to 5.5 V
+3
Tres
temperature resolution
11-bit digital temperature data
0.125
tconv(T)
temperature conversion time
normal mode
33
ms
150
supply current
ICC
normal mode:
I2C-bus
inactive
normal mode:
I2C-bus
active
shutdown mode
HIGH-level input voltage
VIH
VIL
LOW-level input voltage
VI(hys)
hysteresis of input voltage

HIGH-level input current
IIH
1.0
mA
7.5
digital pins
[3]
0.7VCC
VCC + 0.3
digital pins
[3]
0.3
+0.3VCC
pins SCL and SDA
300
mV
pins A2 to A0
300
mV
digital pins; VIN = VCC
[3]
1.0
+1.0
[3]
1.0
+1.0
IIL
LOW-level input current
digital pins; VIN = 0 V
VOL
LOW-level output voltage
pins SDA and OS; IOL = 3 mA
0.4
IOL = 4 mA
0.8
ILO
output leakage current
pins SDA and OS; VOH = VCC
10
VPOR
power-on reset voltage
VCC supply below which the

logic is reset
1.0
2.5
OSQ
OS fault queue
programmable
Tos
overtemperature shutdown
threshold
default value
80
fsam
sampling rate
programmable
0.125
10
30
sample/s
Thyst
hysteresis temperature
default value
75
Ci
input capacitance
digital pins
20
pF
[1]
Typical values are at VCC = 3.3 V and Tamb = 25 C.
[2]
Assumes a minimum 11-bit temperature reading.
[3]
The digital pins are pin SCL, SDA and A2 to A0.
[4]
Device analog-to-digital conversion.
SE95_7
Product data sheet
[4]
16 of 27
SE95
NXP Semiconductors
12. Dynamic characteristics

Table 18. Dynamic characteristics[1]
VCC = 2.8 V to 5.5 V, Tamb = 55 C to +125 C; unless otherwise specified.
Symbol Parameter
TCLK
SCL clock period
Conditions
Min
Typ
Max
Unit
see Figure 11
2.5
t(SCL)H
HIGH period of the SCL clock
0.6
t(SCL)L
LOW period of the SCL clock
1.3
tHD;STA
hold time (repeated) START condition
100
ns
tSU;DAT
data set-up time
100
ns
tHD;DAT
data hold time
ns
tSU;STO
set-up time for STOP condition
100
ns
tf
fall time
250
ns
[1]
pins SDA and OS;

CL = 400 pF; IOL = 3 mA
These specifications are guaranteed by design and not tested in production.
SDA
tLOW
tf
tSU;DAT
tf
tHD;STA
SCL
tHD;STA
tHD;DAT
tHIGH
sr
tSU;STO
s
001aad616
Fig 11.
Timing diagram
SE95_7
Product data sheet
17 of 27
SE95
NXP Semiconductors
13. Performance curves
25
ICC(SD)
(A)
20
001aad617
001aad618
300
VCC = 5.5 V
ICC
(A)
VCC = 5.5 V
3.9 V
3.3 V
2.8 V
200
15
3.9 V
10
3.3 V
2.8 V
100
0
50
25
25
50
75
Fig 12. Shutdown supply current as a function of

temperature
001aad619
300
30 conversions/s
ICC
(A)
200
0
50
100
125
T (C)
10 conversions/s
25
25
50
75
100
125
T (C)
Fig 13. Typical normal I2C-bus inactive supply current

as a function of temperature
001aad620
0.25
VOL(SDA)
(V)
VCC = 2.8 V
0.20
3.3 V
3.9 V
5.5 V
0.15
1 conversions/s
0.125 conversions/s
0.10
100
0.05
0
50
25
25
50
75
Fig 14. Typical normal I2C-bus inactive supply current

as a function of temperature
001aad621
25
tconv(T)
(ms)
20
0
50
100
125
T (C)
Fig 15.
25
VOL(OS)
(V)
20
15
10
10
25
25
50
75
100
125
T (C)
Fig 16. Typical conversion time as a function of

temperature
25
50
75
100
125
T (C)
001aad622
VCC = 2.8 V
3.3 V
3.9 V
5.5 V
0
50
25
25
50
75
100
125
T (C)
Fig 17. Typical OS VOL as a function of temperature
SE95_7
Product data sheet
Typical SDA VOL as a function of temperature
15
0
50
25
18 of 27
SE95
NXP Semiconductors
14. Application information

The SE95 is sensitive to power supplies with ramp-up time 2 ms and could NACK or
hang the I2C-bus. In most applications the SE95 will function properly since power
supplies have a >2 ms ramp-up time. If the power supply ramp-up time is 2 ms, use an
RC network with R = 300 and C = 10 F, as shown in Figure 18, to add about 3 ms to
the ramp-up time. The 10 F capacitor is the same as the bypass capacitor that is
typically used to prevent fluctuations on the power supply. The 300 resistor will reduce
the supply voltage by about 45 mV since the SE95 supply current is about 150 A. Ensure
the SE95 is the only device connected to the end of 300 resistor since additional
devices would draw more current and cause a larger voltage drop across the resistor.
power supply
300
power supply
10 k
10 F
VCC
SCL
I2C-bus
SDA
SE95
OS
A2
A1
GND
A0
detector or
interrupt line
digital logic
or tie to
VCC or GND
002aae891
Fig 18.
Typical application circuit
SE95_7
Product data sheet
19 of 27
SE95
NXP Semiconductors
15. Package outline

SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
A
X
c
y
HE
v M A
Z
5
Q
A2
(A 3)
A1
pin 1 index
Lp
1
4
e
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
D (1)
E (2)
HE
Lp
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
inches
0.069
0.010 0.057
0.004 0.049
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
0.05
0.01
0.01
0.004
0.028
0.012
0.244
0.039 0.028
0.041
0.228
0.016 0.024
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT96-1
076E03
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 19. Package outline SOT96-1 (SO8)

SE95_7
Product data sheet
20 of 27
SE95
NXP Semiconductors
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
c
y
HE
v M A
A2
pin 1 index
(A3)
A1
Lp
L
4
detail X
e
w M
bp
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
D(1)
E(2)
HE
Lp
Z(1)
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
0.65
5.1
4.7
0.94
0.7
0.4
0.1
0.1
0.1
0.70
0.35
6
0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-04-09
03-02-18
SOT505-1
Fig 20. Package outline SOT505-1 (TSSOP8)

SE95_7
Product data sheet
21 of 27
SE95
NXP Semiconductors
16. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 Surface mount reflow
soldering description.
16.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and reflow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
16.3 Wave soldering

Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities

SE95_7
Product data sheet
22 of 27
SE95
NXP Semiconductors
16.4 Reflow soldering

Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 21) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 19 and 20
Table 19.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (C)

Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
220
Table 20.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (C)

Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 21.
SE95_7
Product data sheet
23 of 27
SE95
NXP Semiconductors
maximum peak temperature

= MSL limit, damage level
temperature
minimum peak temperature

= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 21. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365

Surface mount reflow soldering description.
17. Abbreviations
Table 21.
Abbreviations
Acronym
Description
ADC
Analog-to-Digital Converter
ESD
ElectroStatic Discharge
HBM
Human Body Model
I2C-bus
Inter-Integrated Circuit bus
I/O
Input/Output
LSB
Least Significant Bit
LSByte
Least Significant Byte
MM
Machine Model
MSB
Most Significant Bit
MSByte
Most Significant Byte
OTP
One-Time Programmable
POR
Power-On Reset
SMBus
System Management Bus
SE95_7
Product data sheet
24 of 27
SE95
NXP Semiconductors
18. Revision history

Table 22.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
SE95_7
20090902
Product data sheet
SE95_6
Modifications:
Figure 1 Block diagram of SE95: changed from AVD CONTOL to ADC CONTROL
Section 14 Application information:
Added first paragraph
Figure 18 Typical application circuit modified
Added soldering information

Added Section 17 Abbreviations
SE95_6
20090604
Product data sheet
SE95_5
SE95_5
20071213
Product data sheet
SE95_4
SE95_4
20070212
Product data sheet
SE95_3
SE95_3
(9397 750 14388)
20051212
Product data sheet
SE95_2
SE95_2
(9397 750 14163)
20041005
Objective specification
SE95_1
SE95_1
(9397 750 10265)
20031003
Objective specification
SE95_7
Product data sheet
25 of 27
SE95
NXP Semiconductors
19. Legal information

19.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term short data sheet is explained in section Definitions.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
19.3 Disclaimers
General Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customers own risk.
Applications Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus logo is a trademark of NXP B.V.
20. Contact information

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
SE95_7
Product data sheet
26 of 27
SE95
NXP Semiconductors
21. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.5
7.6
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
19
19.1
19.2
19.3
19.4
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
General operation . . . . . . . . . . . . . . . . . . . . . . . 4
OS output and polarity . . . . . . . . . . . . . . . . . . . 6
OS comparator and interrupt modes . . . . . . . . 6
OS fault queue . . . . . . . . . . . . . . . . . . . . . . . . . 6
Shutdown mode . . . . . . . . . . . . . . . . . . . . . . . . 7
Power-up default and power-on reset . . . . . . . . 7
I2C-bus serial interface . . . . . . . . . . . . . . . . . . . 7
Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Register list . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Register pointer . . . . . . . . . . . . . . . . . . . . . . . . 8
Configuration register . . . . . . . . . . . . . . . . . . . . 9
Temperature register. . . . . . . . . . . . . . . . . . . . . 9
Overtemperature shutdown threshold
and hysteresis registers . . . . . . . . . . . . . . . . . 11
Protocols for writing and reading
the registers . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 15
Recommended operating conditions. . . . . . . 15
Static characteristics. . . . . . . . . . . . . . . . . . . . 16
Dynamic characteristics . . . . . . . . . . . . . . . . . 17
Performance curves . . . . . . . . . . . . . . . . . . . . 18
Application information. . . . . . . . . . . . . . . . . . 19
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20
Soldering of SMD packages . . . . . . . . . . . . . . 22
Introduction to soldering . . . . . . . . . . . . . . . . . 22
Wave and reflow soldering . . . . . . . . . . . . . . . 22
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 22
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 23
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 25
Legal information. . . . . . . . . . . . . . . . . . . . . . . 26
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
20
21
Contact information . . . . . . . . . . . . . . . . . . . . 26
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section Legal information.
NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: [email protected]
Date of release: 2 September 2009
Document identifier: SE95_7

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SE95

Ultra high accuracy digital temperature sensor and thermal

Product data sheet

Temperature register (Temp) to store the digital Temp reading

Identification register (ID) to store manufacturer numbers

Ultra high accuracy digital temperature sensor and thermal watchdog

Pin-for-pin replacement for industry standard LM75/LM75A

System thermal management

plastic small outline package; 8 leads; body width 3.9 mm

plastic thin shrink small outline package; 8 leads;

Product data sheet

NXP B.V. 2009. All rights reserved.

Rev. 07 2 September 2009

Ultra high accuracy digital temperature sensor and thermal watchdog

ADC CONTROL AND OTP CONTROL

I2C-BUS INTERFACE LOGIC

Block diagram of SE95

Pin configuration for SO8

Pin configuration for TSSOP8

6.2 Pin description

I2C-bus serial bidirectional data line digital I/O; open-drain

I2C-bus serial clock digital input

overtemperature shutdown output; open-drain

ground; to be connected to the system ground

user-defined address bit 2 digital input

Product data sheet

NXP B.V. 2009. All rights reserved.

Rev. 07 2 September 2009

Ultra high accuracy digital temperature sensor and thermal watchdog

Pin description continued

user-defined address bit 1 digital input

user-defined address bit 0 digital input

Product data sheet

NXP B.V. 2009. All rights reserved.

Rev. 07 2 September 2009

Ultra high accuracy digital temperature sensor and thermal watchdog

reading temperature limits

Product data sheet

NXP B.V. 2009. All rights reserved.

Rev. 07 2 September 2009

Ultra high accuracy digital temperature sensor and thermal watchdog

7.2 OS output and polarity

7.3 OS comparator and interrupt modes

7.4 OS fault queue

Fault queue table

Fault queue data

Fault queue value

Product data sheet

NXP B.V. 2009. All rights reserved.

Rev. 07 2 September 2009

Ultra high accuracy digital temperature sensor and thermal watchdog

7.5 Shutdown mode

7.6 Power-up default and power-on reset

Normal operation mode

8. I2C-bus serial interface

8.1 Slave address

Product data sheet

NXP B.V. 2009. All rights reserved.

Rev. 07 2 September 2009