BT136-600E

4Q Triac
30 September 2013 Product data sheet

1. General description
Planar passivated sensitive gate four quadrant triac in a SOT78 plastic package intended for use in general purpose bidirectional switching and phase control applications. This sensitive gate "series E" triac is intended to be interfaced directly to microcontrollers, logic integrated circuits and other low power gate trigger circuits.

2. Features and benefits

Direct triggering from low power drivers and logic ICs High blocking voltage capability Low holding current for low current loads and lowest EMI at commutation Planar passivated for voltage ruggedness and reliability Sensitive gate Triggering in all four quadrants

3. Applications

General purpose motor control General purpose switching

4. Quick reference data

Table 1. Symbol VDRM ITSM IT(RMS) Quick reference data Parameter repetitive peak offstate voltage non-repetitive peak on- full sine wave; Tj(init) = 25 C; state current tp = 20 ms; Fig. 4; Fig. 5; Fig. 3 RMS on-state current full sine wave; Tmb 107 C; Fig. 1; Fig. 2; Fig. 3 Static characteristics IGT gate trigger current VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 C; Fig. 7 VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 C; Fig. 7 VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 C; Fig. 7 5 10 mA 4 10 mA 2.5 10 mA Conditions Min Typ Max 600 25 4 Unit V A A

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TO -2

20A

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BT136-600E
4Q Triac

Symbol

Parameter

Conditions VD = 12 V; IT = 0.1 A; T2- G+; Tj = 25 C; Fig. 7

Min -

Typ 11 2.2

Max 25 15

Unit mA mA

IH

holding current

VD = 12 V; Tj = 25 C; Fig. 9

5. Pinning information
Table 2. Pin 1 2 3 mb Pinning information Symbol Description T1 T2 G T2 main terminal 1 main terminal 2 gate mounting base; main terminal 2 Simplified outline
mb

Graphic symbol
T2
sym051

T1 G

1 2 3

TO-220AB (SOT78)

6. Ordering information
Table 3. Ordering information Package Name BT136-600E BT136-600E/L01 TO-220AB TO-220AB Description plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB Version SOT78 SOT78 Type number

BT136-600E

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7. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDRM IT(RMS) ITSM Parameter repetitive peak off-state voltage RMS on-state current non-repetitive peak on-state current full sine wave; Tmb 107 C; Fig. 1; Fig. 2; Fig. 3 full sine wave; Tj(init) = 25 C; tp = 20 ms; Fig. 4; Fig. 5; Fig. 3 full sine wave; Tj(init) = 25 C; tp = 16.7 ms; Fig. 5; Fig. 4 I t dIT/dt
2

Conditions

Min -

Max 600 4 25 27 3.1 50 50 50 10 2 5 0.5 150 125

Unit V A A A
2

I2t for fusing rate of rise of on-state current

tp = 10 ms; SIN IT = 6 A; IG = 0.2 A; dIG/dt = 0.2 A/s; T2+ G+ IT = 6 A; IG = 0.2 A; dIG/dt = 0.2 A/s; T2+ GIT = 6 A; IG = 0.2 A; dIG/dt = 0.2 A/s; T2- GIT = 6 A; IG = 0.2 A; dIG/dt = 0.2 A/s; T2- G+

A s A/s A/s A/s A/s A W W C C

IGM PGM PG(AV) Tstg Tj

peak gate current peak gate power average gate power storage temperature junction temperature over any 20 ms period

-40 -

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5 IT(RMS) (A) 4

003aae828

12 IT(RMS) (A) 10 8

003aae830

3 6 2 4 1 2 0 10- 2

0 - 50

50

100

Tmb (C)

150

10- 1

1 10 surge duration (s)

Fig. 1.

RMS on-state current as a function of mounting base temperature; maximum values Fig. 2.
8

f = 50 Hz Tmb 107 C RMS on-state current as a function of surge duration; maximum values
003aae827

conduction form angle factor Ptot (degrees) a (W) 30 4 6 60 2.8 90 2.2 120 1.9 180 1.57

= 180 120 90 60 30

IT(RMS) (A)

= conduction angle a = form factor = IT(RMS) / IT(AV) Fig. 3. Total power dissipation as a function of RMS on-state current; maximum values

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30 ITSM (A) 25

003aae831

20 15

10 5

IT

ITSM t 1/f Tj(init) = 25 C max

10

102

103

number of cycles

104

f = 50 Hz Fig. 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values
103
003aae829

IT
ITSM (A)

ITSM t tp Tj(init) = 25 C max

102

(1) (2)

10 10- 5

10- 4

10- 3

10- 2

tp (s)

10- 1

tp 20 ms (1) dIT/dt limit (2) T2- G+ quadrant limit Fig. 5. Non-repetitive peak on-state current as a function of pulse width; maximum values

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8. Thermal characteristics
Table 5. Symbol Rth(j-mb) Thermal characteristics Parameter thermal resistance from junction to mounting base thermal resistance from junction to ambient
10 Zth(j-mb) (K/W) 1 unidirectional bidirectional

Conditions half cycle; Fig. 6 full cycle; Fig. 6 in free air

Min -

Typ 60

Max 3.7 3 -

Unit K/W K/W K/W

Rth(j-a)

003aae836

10- 1

tp

10- 2 10- 5

10- 4

10- 3

10- 2

10- 1

tp (s)

10

Fig. 6.

Transient thermal impedance from junction to mounting base as a function of pulse width

BT136-600E

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9. Characteristics
Table 6. Symbol IGT Characteristics Parameter gate trigger current Conditions VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 C; Fig. 7 VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 C; Fig. 7 VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 C; Fig. 7 VD = 12 V; IT = 0.1 A; T2- G+; Tj = 25 C; Fig. 7 IL latching current VD = 12 V; IG = 0.1 A; T2+ G+; Tj = 25 C; Fig. 8 VD = 12 V; IG = 0.1 A; T2+ G-; Tj = 25 C; Fig. 8 VD = 12 V; IG = 0.1 A; T2- G-; Tj = 25 C; Fig. 8 VD = 12 V; IG = 0.1 A; T2- G+; Tj = 25 C; Fig. 8 IH VT VGT holding current on-state voltage gate trigger voltage VD = 12 V; Tj = 25 C; Fig. 9 IT = 5 A; Tj = 25 C; Fig. 10 VD = 12 V; IT = 0.1 A; Tj = 25 C; Fig. 11 VD = 400 V; IT = 0.1 A; Tj = 125 C; Fig. 11 ID dVD/dt off-state current VD = 600 V; Tj = 125 C VDM = 402 V; Tj = 125 C; (VDM = 67% of VDRM); exponential waveform; gate open circuit tgt gate-controlled turn-on ITM = 6 A; VD = 600 V; IG = 0.1 A; dIG/ time dt = 5 A/s 2 s 0.1 0.5 mA 0.25 0.4 V 2.2 1.4 0.7 15 1.7 1 mA V V 4 20 mA 2.5 15 mA 10 20 mA 3 15 mA 11 25 mA 5 10 mA 4 10 mA Min Typ 2.5 Max 10 Unit mA

Static characteristics

Dynamic characteristics rate of rise of off-state voltage 50 V/s

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3 IGT IGT (25 C)

(1)

003aae833

3 IL IL(25C)

003aae835

(2) (3) (4) (1) (2) (3) (4)

0 - 60

- 10

40

90

Tj (C)

140

0 - 60

- 10

40

90

Tj (C)

140

(1) T2- G+ (2) T2- G(3) T2+ G(4) T2+ G+ Fig. 7. Normalized gate trigger current as a function of junction temperature
2.0 IH IH(25C) 1.5
003aae837

Fig. 8.

Normalized latching current as a function of junction temperature

12 IT (A) 8

003aae834

1.0 4 0.5
(1) (2) (3)

0 - 60

- 10

40

90

Tj (C)

140

VT (V)

Fig. 9.

Normalized holding current as a function of junction temperature

Vo = 1.27 V Rs = 0.091 (1) Tj = 125 C; typical values (2) Tj = 125 C; maximum values (3) Tj = 25 C; maximum values Fig. 10. On-state current as a function of on-state voltage

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1.6 VGT VGT (25 C) 1.2

003aae832

0.8

0.4

0 - 60

- 10

40

90

Tj (C)

140

Fig. 11. Normalized gate trigger voltage as a function of junction temperature

BT136-600E

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10. Package outline

Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78

E p q D1

A A1

mounting base

L1(1) b1(2) (3) b2(2) (2)

1 2 3

L2(1) Q

b(3) e e

0 DIMENSIONS (mm are the original dimensions) UNIT mm A 4.7 4.1 A1 1.40 1.25 b 0.9 0.6 b1(2) 1.6 1.0 b2(2) 1.3 1.0 c 0.7 0.4 D 16.0 15.2 D1 6.6 5.9 E 10.3 9.7

5 scale

10 mm

e 2.54

L 15.0 12.8

L1(1) 3.30 2.79

L2(1) max. 3.0

p 3.8 3.5

q 3.0 2.7

Q 2.6 2.2

Notes 1. Lead shoulder designs may vary. 2. Dimension includes excess dambar. OUTLINE VERSION SOT78 REFERENCES IEC JEDEC 3-lead TO-220AB JEITA SC-46 EUROPEAN PROJECTION ISSUE DATE 08-04-23 08-06-13

Fig. 12. Package outline TO-220AB (SOT78)

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In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customers sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customers applications and products planned, as well as for the planned application and use of customers third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customers applications or products, or the application or use by customers third party customer(s). Customer is responsible for doing all necessary testing for the customers applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customers third party customer(s). NXP does not accept any liability in this respect. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customers general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the
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11. Legal information

11.1 Data sheet status
Document status [1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status [3] Definition

Development This document contains data from the objective specification for product development. Qualification This document contains data from the preliminary specification. This document contains the product specification.

Production

Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

11.2 Definitions
Preview The document is a preview version only. The document is still subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

11.3 Disclaimers
Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors.

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grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors specifications such use shall be solely at customers own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors standard warranty and NXP Semiconductors product specifications. Translations A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.

11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, IC-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE are trademarks of NXP B.V. HD Radio and HD Radio logo are trademarks of iBiquity Digital Corporation.

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12. Contents
1 2 3 4 5 6 7 8 9 10 11 11.1 11.2 11.3 11.4 General description ............................................... 1 Features and benefits ............................................1 Applications ........................................................... 1 Quick reference data ............................................. 1 Pinning information ............................................... 2 Ordering information ............................................. 2 Limiting values .......................................................3 Thermal characteristics .........................................6 Characteristics ....................................................... 7 Package outline ................................................... 10 Legal information .................................................11 Data sheet status ............................................... 11 Definitions ...........................................................11 Disclaimers .........................................................11 Trademarks ........................................................ 12

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For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 30 September 2013

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