Scotle Technology Group Ltd

Scotle IR6000 V3

BGA Rework Station User Manual

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Scotle IR6000 V3
IR6000 BGA rework stations features
IR6000 BGA Rework Station is designed to meet the ever-changing demands

of todays fast BGA Rework manufacturing environments . Have the following characteristics:
1 IR6000 Excellent quality - CE certificated 2 IR6000 Larger Pre-heating area 21cmx21cm 3 IR6000 Air Protection Switch- More safer 4 IR6000 Detachable K

type thermocouple

5 IR6000 Taiwan FOTEK SSR inside 6 IR6000 Rework station for laptop motherboards, desktop computer motherboards,

server boards, industrial computer boards, all kinds of game boards, communications equipment motherboards, LCD TVs and other large circuit board BGA rework. 7IR6000 Innovative designs .An effective solution to general of infrared rework station vulnerable to the impact of air flow. Will lead an inaccurate of temperature control. Maximum temperature up to 400 C. Can easily deal with lead-free soldering rework. 8 IR6000 can set up 8 rising temperature segments and 8 constant temperature segments to control. It can save 10 groups of temperature curves at one time. 9 IR6000 can be connected to a computer to be controlled more conveniently with a built-in PC RS232 serial port and proprietary Software attached to it. programmable 10 IR6000 can easily rework the variety of CPU's seat, all kinds of shielding enclosures, replacement of various components slotCan easily deal with lead-free soldering rework 11 IR6000 sensitive temperature measurement sensor to obtain an accurate and instantaneous temperature reading and monitoring 12 IR6000 BGA rework station the technology of closed-loop temperature control ensures accurate temperature process and even heat distribution. 13 IR6000 Machine overall system integration Design, Rework station more integrated workbench area occupied by smaller, Didn't mixed and disorderly of cables. 14 IR6000 Linear guide type Bracket for BGA Reworkscan be locking adjusted by rotating the handle, Can be very easily fixed PCB board, effectively prevent the deformation of PCB board. 2

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Safety Instructions
Electrical safety

Make sure the supply power voltage accord with the standards---220V-250V/50hz alternating current before installing.

To avoid possible electric shock caused serious damage, please disconnect the power cord from the outlet temporary before moving machines.

If the machine damages, please contact us for maintenance. If the damage caused by the users when they dismantle or repair independently, they should take on the loss by themselves.

Operating safety Please carefully read the relevant information provided by the manual before starting using this product. Make sure the power cord has been properly connected properly before using the products. Installed the equipment in stable work platform to use, where the air mobility should be small as possible. Avoid it closing to air conditioners, fans and the other outlet. In case of electrical short-circuit, avoid the products contacting with water. Forbid using this equipment in flammable and explosive substances. The operators hands or other parts of the body should maintain a safe distance from the heater. Forbid touching the heater to avoid scalding. If you have any technical questions or suggestions in the course of using this product, please contact with our technology department., We will try our best to solve.

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Environmental requirements of operation and conservation 1. Operation environment of products Operation temperature:15 ~ 45 Operation humidity:5% to 95%, non-condensing Products should be kept in the air mobility of a smaller environment under the welding operation. 2. Conservation environment of products Storage temperature:-20 ~ 70 Storage humidity: 5% to 95%, non-condensing

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Scotle
BGA Rework Station
The parameters of
Basic Parameters
Heating Dimension Weight IR6000 V3

BGA Rework Station

IR
L 475mmW480mmH420 mm 16kg

Total weight Electrical Parameters

Power Upper Heating Size of Upper heating Consumption of upper heating Bottom Heating Size of Bottom heating

About 17 kg, vary with the differen need of the users

220V AC IR 80mm80 mm 450W IR 210 mmx 210 mm

Consumption of Bottom heating 1800W

Total

power

2400W

Temperature Control
Independent temperature control, high-precision closed-loop Control mode of Upper control, precision 0.5%, Alarm Independent temperature control, high-precision closed-loop Control mode of Bottom control, precision 0.5%, NO Alarm

Rework Function Suit for welding, remove or repair packaged devices SMD such as BGA,PBGA,CSP,multi-layer substratesEMI metallic shield product and solder/lead free Rework

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welding
Size of applicable chips Size of applicable PCB 70mm70 mm 400mm305 mm

Hardware description
IR6000 V3 BGA Rework Station is composed of upper part of Heating Components /

Bottom Preheat Module / Bracket / Temperature Control Parts! Temperature control Table is control the upper and lower heating, Can Simultaneously heated or first preheat, then the upper part of heating.

1. Highly Sensitive K-temperature sensor 2. PCB Table 3. Power Switch 4. Upper Heater 5. X-Y Lifting Regulator 6. LED Auxiliary Lighting 7. Bottom Heater (Pre-Heater)
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8. Lighting Switch 9. Upper fan Switch 10. Start Switch 11. Stop Switch 12. Upper Programmable Temperature Control pc410 13. Bottom Temperature Control CH6

Self-help Install

PCB Table 1.
Installation side support.

2.

Installation Slip.

3.

Installation side support.

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Upper Heater

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Cable connector

Temperature sensor

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Installation of RS232 communication interface
Both suitable for Desktop & Laptop

Interface for desktop

transfer cable for laptop

Programmer/Controller General Description

The programmable controller contains an in-built setpoint generator in addition to the controller function. This setpoint generator can produce a temperature/time profile with 16 segments (09). When the program is running, the current setpoint from the setpoint generator is fed to the control algorithm. The current setpoint is continuously shown on the lower display.

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The sixteen segments are defined in the order: Ramp 1, Dwell period 1, Ramp 2, Dwell period 2..., and are executed in succession.

S.N.

Item

Functions

Parameters setting key (Up key) Increase value (Down key) Decrease value Selects the program pattern number Starts/hold the program, changes the mode from fixed value control to program control

Program parameters setup Changes the indication on SV/MV/TIME display Output indicator Indicates the step number of program (Program monitor indicator) During program control, / is lit when the PV is rising During program control, - is lit when the PV is constant During program control, \ is lit when the PV is falling (Pattern number display) Indicates the pattern number 09 (Program control runing indicator) The LED indicator is lit during program control (PV Display) Indicates the Process/Measured value It is lit when the Setting Value(SV) is being displayed on the lower display 11

OUNT STEP PRO

PTN RUN PV SV

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TIME MV SV (SV/MV/TIME display) It indicates the Setting Value(SV), Manipulating Value(MV), or Time(TIME) (The display content can be changed by the DISP/SELECT key) It is lit when the Alarm1 output is ON (Communication indicator) It flashes when the controller is in active communication with a host computer

AL1 COM

Program Parameters Setting

Ramp Rate1: A ramp consists of a slope(linear gradient) and a target setpoint. The control setpoint increases or decreases at a linear ramp rate from the actual measured value until a specified target setpoint is reached. The relative positions of the actual measured value and the target setpoint determine whether the slope of the ramp is positive or negative. Parameters R1, R2, R3... express the ramping rate in unites per minute(0.01~99.99), parameters L1, L2, L3... the appropriate target setpoint in display units. If R1 = END, the program will be ended when the program runs to the slope. Target Setpoint 1: The target value to which the setpoint ramps when the programmer has been placed into RVN. Dwell period 1: In a Dwell period, the target setpoint, which has been attained, remains unchanged for a fixed period. All the dwell periods are defined by their duration in minutes with parameters D1, D2, D3...(0~9999). When the program is running, these parameter display the time remaining in the active dwell period. If the parameter equals zero, the dwell period is skipped. When the controller runs in the PV displaying status: 1). Select the target program pattern number with the PTN/ key. 2). press SET/PROG key, the first program parameter appears in the upper display. The value associated with this parameter will be shown in the lower display. 3). Use and key to modify the value. 4). Press the PAR/SET key, the next parameter appears. At the same time, the modification has been saved in the memory. Use and key to modify the value. Repeat this procedure till all the parameters are set. Or if there is no key operation within 16 seconds, the menu times out automatically.

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Program Parameter List

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Rework Operation Steps
1be all set
Fixed motherboard

shift sensor sensor press close to BGA chip

Adjust the height of heating head with adjustment knobPromptBGA chip in the middle of heating head heating head away from BGA chip2CM

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2Start heating

1Open power switch. 2Select the appropriate temperature program segment, and then press the start switch. In the operation can press the stop switch, stop operating.

3After the program is running, repairing automatic alarm, and automatically cut off the heating power, this time you can check the following solder ball BGA chip is completely liquefied, BGA chips should be subject to settlement, floating state

3Heating completed 1 Close Switch for top and bottom Then Moving Heating head and Sensor 2 Remove motherboard Clear insulating tape 3 BGA Rework Station Cooled ,Then close Total Power

Warning
If BGA Rework Station NO Cooling Do not close the Total Power !
When the temperature is not cooled, do not touch heating module!

Prompt
1 Installed the equipment in stable work platform to use where the air mobility should be small as possible .Avoid it closing to air conditioners, fans and the other outlet.

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2 IR6000 Rework Station sensor Direct contact with motherboardSo Temperature display is Actual temperature 3 In order to avoid damage to the motherboard capacitorSO use insulation tape please Maintenance completed ,then Removal of insulation tape So as to avoid short-circuit 4 After removal of BGA chip PCB Bonding Pad Need to clean up Avoid cold solder joint See BGA chip tin completely liquefied, Then To move the BGA chipSo as to avoid Bonding Pad Damage 5 BGA chips should be subject to settlement, floating state Prohibited in all solder ball did not fully liquefied, by force if removal of chips, so as to avoid pad off, chip or motherboard scrap! 6 To improve success rate of Rework , PCB and chips need drying and processing in principle PCB board or chip moist heat process will occur in the burst phenomenon, the Rework process may hear the blasting sound of a minorAccording to actual situation Please self-control. 7 PCB board heating time is too long or repeated several times the surface heating will lead to discoloration. 8 Users from modifying temperature parametersPlease use scrap PCB testedHeating whole time about 10 seconds before the end of solder balls should be fully liquefiedf the liquefaction advanced or delayed,Should be regulating up/down the temperature setting. So as to avoid heat damage to chips or low-temperature sealing-off 9 The factory equipped with two sets of programmable temperature control table used parameters:

The attached curve setting for reference

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Rework temperature curve to set examples
1Lead Sn63Pb37 numeric numeric slope/S al value temperature al value r1 0.45 L1 85 r2 r3 2Lead-free slope/S Sn96.5Ag3Cu0.5 r1 r2 r3 r4 1 1 L2 L3 150 185 Temperature time S d1 d2 d3 numeric al value S 85 40 40 numeric al value S 92 40 40 40 numeric al value S 90 45 40 45 numeric al value S 90 40 50 45 numeric al value S 90 40 60 65 numeric al value S 90 45 60 65

numeric numeric al value temperature al value 0.45 1 1 1 L1 L2 L3 L4 85 150 180 220

Temperature time S d1 d2 d3 d4

3. Lead (Computer)

numeric numeric slope/S al value temperature al value r1 r2 r3 r4

Temperature time S d1 d2 d3 d4 Temperature time S d1 d2 d3 d4 Temperature time S d1 d2 d3 d4 Temperature time S d1 d2 d3 d4

0.5 L1 90 0.85 L2 135 0.8 L3 170 1 L4 185 numeric numeric 4. Lead-free slope/S al value temperature al value (Computer) r1 0.45 L1 90 r2 1 L2 145 r3 1 L3 180 r4 1 L4 220 numeric numeric 5For XBOX slope/S al value temperature al value r1 0.40 L1 90 r2 0.85 L2 135 r3 1 L3 170 r4 1 L4 220 numeric numeric al value temperature al value 0.40 L1 90 0.85 L2 135 1 L3 180 1 L4 220

6For PS3

slope/S r1 r2 r3 r4

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