TDA2050

32 W hi-fi audio power amplifier

Features

High output power (50 W music power IEC 268.3 rules) High operating supply voltage (50 V) Single or split supply operations Very low distortion Short-circuit protection (OUT to GND) Thermal shutdown The high power and very low harmonic and crossover distortion (THD = 0.05% typ, at VS = 22 V, PO = 0.1 to 15 W, RL= 8 ohm, f = 100 Hz to 15 kHz) make the device most suitable for both hi-fi and high-end TV sets. Table 1. Device summary
Package Pentawatt vertical Pentawatt V

Description
The TDA 2050 is a monolithic integrated circuit in a Pentawatt package, intended for use as an audio class-AB audio amplifier. Thanks to its high power capability the TDA2050 is able to provide up to 35 W true RMS power into a 4 ohm load at THD = 0%, VS = 18 V, f = 1 kHz and up to 32 W into an 8 ohm load at THD = 10%, VS = 22 V, f = 1 kHz. Moreover, the TDA2050 delivers typically 50 W music power into a 4 ohm load over 1 sec at VS = 22.5 V, f = 1 kHz. Figure 1. Test and application circuit

Order code TDA2050V

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Device overview

TDA2050

Device overview
Table 2.
Symbol Vs Vi Vi Io Ptot Tstg, Tj

Absolute maximum ratings

Parameter Supply voltage Input voltage Differential input voltage Output peak current (internally limited) Power dissipation at TCASE = 75 C Storage and junction temperature Value 25 Vs 15 5 25 -40 to 150 Unit V V A W C

Table 3.
Symbol Rth j-case

Thermal data
Parameter Thermal resistance junction-case Value 3 (max) Unit C

Figure 2.

Pin connections (top view)

Figure 3.

Schematic diagram

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Device overview The values given in the following table refer to the test circuit VS = 18 V, Tamb = 25 C, f = 1 kHz, unless otherwise specified.

Table 4.
Symbol
V

Electrical characteristics
Parameter Supply voltage range Quiescent drain current Input bias current Input offset voltage Input offset current d = 0.5%, RL = 4 RL = 8 Vs = 22 V, RL = 8 d = 10%, RL = 4 RL = 8 Vs = 22 V, RL = 8 Music power IEC268.3 rules d = 10%, T = 1s RL = 4 ; Vs = 22.5 V Po = 0.1 to 24W, RL = 4 , f = 1 kHz f = 100 to 10 kHz, Po = 0.1 to 18 W 24 22 28 18 25 35 22 32 50 0.03 0.5 0.5 Vs = 4.5 Vs = 25 Vs = 22 Vs = 22 Test conditions Min. 4.5 30 55 0.1 Typ. Max. 25 50 90 0.5 15 200 Unit V mA mA A mV nA W W W W W W W % %

Id Ib VOS IOS

Output power
P

Distortion

Vs = 22 V, RL = 8 , f = 1 kHz, Po = 0.1 to 20 W, f = 100 Hz to 10 kHz; Po = 0.1 to 15 W 5 f = 1 kHz f = 1 kHz Vi = 200 mW, RL = 4 ; B = Curve A B = 22 Hz to 22 kHz 500 Rg = 22 k, f = 100 Hz; Vripple = 0.5 VRMS Po = 28 W, RL = 4 Po = 25 W, RL = 8 ,Vs = 22 V, 30

0.02 0.5 8 80 30.5 20 to 80.000 4 5 10 31

% % V/s dB dB Hz V V k

SR
Gv Gv

Slew rate Voltage gain (open loop) Voltage gain (closed loop) Power bandwidth (-3dB) Input noise voltage Input resistance (pin 1) Supply voltage rejection

BW eN Ri SVR

45 65 67 150

dB % % C

Efficiency Thermal shutdown junction temperature

Tsd-j

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Device overview Figure 4. Split-supply typical application circuit

TDA2050

Figure 5.

PC board and component layout of split-supply typical application circuit

TDA2050

RL R4 R3 +Vs R2 C2 R1 C4 C1 Vi -Vs C6 C3 C7 C5

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Split-supply application suggestions

Split-supply application suggestions

The recommended values of the external components are those shown on the application circuit of Figure 5. Different values can be used. The following table can help the designer.

Table 5.
Component R1 R2 R3 R4 C1 C2 C3, C4 C5, C6 C7

Recommended values of external components

Recommended value 22 k 680 22 k 2.2 1 F 22 F 100 nF 220 F 0.47 F Purpose Input impedance Feedback resistor Frequency stability Input decoupling DC Inverting input DC decoupling Supply voltage bypass Supply voltage bypass Frequency stability Increase of switch ON/OFF noise Larger than recommended value Increase of input impedance Decrease of gain(1) Increase of gain Danger of oscillations Higher low-frequency cutoff Higher low-frequency cutoff Danger of oscillation Danger of oscillation Danger of oscillation Smaller than recommended value Decrease of Input Impedance Increase of gain Decrease of gain(1)

1. The gain must be higher than 24 dB

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Split-supply application suggestions

TDA2050

2.1

Printed circuit board

The layout shown in Figure 5 should be adopted by the designers. If different layouts are used, the ground points of input 1 and input 2 must be well decoupled from the ground return of the output in which a high current flows.

Figure 6.

Single-supply typical application circuit

Figure 7.

PC board and component layout of single-supply typical application circuit

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Single-supply application suggestions

Single-supply application suggestions

The recommended values of the external components are those shown in the application circuit of Figure 6. Different values can be used. The following table can help the designer.

Table 6.
Component R1, R2, R3 R4 R5 R6 C1 C2 C3 C4 C5 C6 C7

Recommonded values
Recommended value 22 k 680 22 k 2.2 2.2 F 100 F 1000 F 22 F 100 nF 0.47 F 1000 F Purpose Biasing resistor Feedback resistor Frequency stability Input decoupling DC Supply voltage rejection Supply voltage bypass Inverting input DC decoupling Supply voltage bypass Frequency stability Output DC decoupling Increase of switching ON/OFF Worse turn-off transient Worse turn-on delay Danger of oscillations Worse turn-off transient Higher low-frequency cutoff Danger of oscillations Danger of oscillations Higher low-frequency cutoff Increase of gain Decrease of gain(1) Danger of oscillations Higher low-frequency cutoff Decrease of gain(1) Increase of gain Larger than recommended value Smaller than recommended value

1. The gain must be higher than 24 dB

Note:

If the supply voltage is lower than 40 V and the load is 8 ohm (or more), a lower value of C2 can be used (i.e. 22 mF). C7 can be larger than 1000 F only if the supply voltage does not exceed 40 V.

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Typical characteristics (split-supply test circuit unless otherwise specified)

TDA2050

Typical characteristics (split-supply test circuit unless otherwise specified)

Output power vs. supply voltage Figure 9. Distortion vs. output power

Figure 8.

Figure 10. Output power vs. supply voltage

Figure 11. Distortion vs. output power

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Typical characteristics (split-supply test circuit unless otherwise specified)

Figure 12. Distortion vs. frequency

Figure 13. Distortion vs. frequency

Figure 14. Quiescent current vs. supply voltage

Figure 15. Supply voltage rejection vs. frequency

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Typical characteristics (split-supply test circuit unless otherwise specified) Figure 16. Supply voltage rejection vs. frequency (single-supply) for different values of C2 (Figure 6)

TDA2050

Figure 17. Supply voltage rejection vs. frequency (single-supply) for different values of C2 (Figure 6)

Figure 18. Total power dissipation and efficiency vs. output power

Figure 19. Total power dissipation and efficiency vs. output power

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Short-circuit protection

Short-circuit protection
The TDA2050 has an original circuit which limits the current of the output transistors. The maximum output current is a function of the collector emitter voltage, hence the output transistors work within their safe operating area. This function can therefore be considered as being peak power limiting rather than simple current limiting. It reduces the possibility that the device gets damaged during an accidental short-circuit from AC output to ground.

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Thermal shutdown

TDA2050

Thermal shutdown
The presence of a thermal limiting circuit offers the following advantages: 1. 2. An overload on the output (even if it is permanent), or an above-limit ambient temperature can be easily tolerated since Tj cannot be higher than 150 C. The heatsink can have a smaller factor of safety compared with that of a conventional circuit. There is no possibility of device damage due to high junction temperature. If for any reason, the junction temperature increases up to 150 C, the thermal shutdown simply reduces the power dissipation and the current consumption.

The maximum allowable power dissipation depends upon the thermal resistance junctionambient. Figure 20 shows this dissipable power as a function of ambient temperature for different thermal resistances. Figure 20. Maximum allowable power dissipation vs. ambient temperature

6.1

Mounting instructions
The power dissipated in the circuit must be removed by adding an external heatsink. Thanks to the pentawatt package, the heatsink mounting operation is very simple, a screw or a compression spring (clip) being sufficient. Between the heatsink and the package it is better to insert a layer of silicon grease, to optimize the thermal contact; no electrical isolation is needed between the two surfaces. Figure 21 shows an example of a heatsink.

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Thermal shutdown

6.2

Dimension recommendations
The following table shows the length that the heatsink in Figure 21 must have for several values of Ptot and Rth. Table 7. Dimension recommendations
12 60 4.2 8 40 6.2 6 30 8.3

Ptot (W) Length of heatsink (mm) Rth of heatsink (C/W)

Figure 21. Example of heatsink

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TDA2050

Appendix A
A.1 Music power concept
Music power is (according to the IEC clauses n.268-3 of Jan. 83) the maximum power which the amplifier is capable of producing across the rated load resistance (regardless of nonlinearity) 1 sec after the application of a sinusoidal input signal of frequency 1 kHz. According to this definition our method of measurement comprises the following steps:

Set the voltage supply at the maximum operating value Apply a input signal in the form of a 1 kHz tone burst of 1 sec duration: the repetition period of the signal pulses is 60 sec The output voltage is measured 1 sec from the start of the pulse Increase the input voltage until the output signal shows a THD=10% The music power is then V2out /RL, where Vout is the output voltage measured in the condition of point 4 and RL is the rated load impedance

The target of this method is to avoid excessive dissipation in the amplifier.

A.2

Instantaneous power
Another power measurement (maximum instantaneous output power) was proposed by the IEC in 1988 (IEC publication 268-3 subclause 19.A). We give here only a brief extract of the concept, and a circuit useful for the measurement. The supply voltage is set at the maximum operating value. The test signal consists of a sinusoidal signal whose frequency is 20 Hz, to which are added alternate positive and negative pulses of 50 s duration and 500 Hz repetition rate. The amplitude of the 20 Hz signal is chosen to drive the amplifier to its voltage clipping limits, while the amplitude of the pulses takes the amplifier alternately into its current-overload limits. A circuit for generating the test signal is given in Figure 22. The load network consists of a 40 F capacitor, in series with a 1 ohm resistor. The capacitor limits the current due to the 20 Hz signal to a low value, whereas for the short pulses the effective load impedance is of the order of 1 ohm, and a high output current is produced. Using this signal and load network the measurement may be made without causing excessive dissipation in the amplifier. The dissipation in the 1 ohm resistor is much lower than a rated output power of the amplifier, because the duty-cycle of the high output current is low. By feeding the amplifier output voltage to the Xplates of an oscilloscope, and the voltage across the 1 ohm resistor (representing the output current) to the Y=plates, it is possible to read on the display the value of the maximum instantaneous output power. The result of this test applied on the TDA2050 is: Peak power = 100 W typ

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TDA2050 Figure 22. Test circuit for peak power measurement

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Package mechanical data

TDA2050

Package mechanical data

Figure 23. Pentawatt V package
DIM. A C D D1 E E1 F F1 G G1 H2 H3 L L1 L2 L3 L4 L5 L6 L7 L9 L10 M M1 V4 V5 DIA MIN. mm TYP. MAX. MIN. 4.80 1.37 2.80 0.094 1.35 0.047 0.55 0.014 1.19 0.030 1.05 0.031 1.40 0.039 3.60 0.126 7.00 0.260 10.40 10.40 18.15 0.691 15.95 0.612 21.6 0.831 22.7 0.878 1.29 3.00 0.102 15.80 0.594 6.60 0.236 2.70 0.083 4.80 0.170 4.75 0.167 4.25 0.148 40 (Typ.) 90 (Typ.) 3.85 0.143 inch TYP. MAX. 0.188 0.054 0.11 0.053 0.022 0.047 0.041 0.055 0.142 0.275 0.41 0.409 0.715 0.628 0.850 0.894 0.051 0.118 0.622 0.260 0.106 0.189 0.187 0.187

OUTLINE AND MECHANICAL DATA

2.40 1.20 0.35 0.76 0.80 1.00 3.20 6.60

Weight: 2.00gr

3.40 6.80

0.134 0.267

17.55 15.55 21.2 22.3 2.60 15.10 6.00 2.10 4.30 4.23 3.75

17.85 15.75 21.4 22.5

0.703 0.620 0.843 0.886

4.5 4.0

0.178 0.157

Pentawatt V

3.65

0.151

L L1 E M1 A C D1 L5 L2 L3 D V5 H2
F E V4 E1

H3 Dia. L9 L10 L7 L6 L4 F1 H2 F

G G1

V4

RESIN BETWEEN LEADS

PENTVME

0015981 F

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.

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Revision history

Revision history
Table 8.
Date

Document revision history

Revision Changes Removed minimum value from Pentawatt (vertical) package dimension H3 in Figure 23: Pentawatt V package Revised general presentation, minor textual updates

31-Aug-2011

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