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    Product End-of-Life Disassembly Instructions

    Uploaded by

    kalavida
    The document provides disassembly instructions for recycling or treatment facilities to remove components from HP notebooks and tablet PCs requiring selective treatment per EU directive 2002/96/EC. It lists items like batteries, printed circuit boards, LCDs over 100 sq cm, and cables that require selective treatment. The instructions describe removing over 25 screws, doors, and other parts to access these items, with an optional illustration showing disassembly of an LCD module. Tools typically used are screwdrivers.

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    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd

    Product End-of-Life Disassembly Instructions

    Uploaded by

    kalavida
    105 views4 pages
    The document provides disassembly instructions for recycling or treatment facilities to remove components from HP notebooks and tablet PCs requiring selective treatment per EU directive 2002/96/EC. It lists items like batteries, printed circuit boards, LCDs over 100 sq cm, and cables that require selective treatment. The instructions describe removing over 25 screws, doors, and other parts to access these items, with an optional illustration showing disassembly of an LCD module. Tools typically used are screwdrivers.

    Original Description:

    laptop diassembly

    Original Title

    Disassembly Notebo 20091141838

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    © Attribution Non-Commercial (BY-NC)

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    PDF, TXT or read online from Scribd

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    The document provides disassembly instructions for recycling or treatment facilities to remove components from HP notebooks and tablet PCs requiring selective treatment per EU directive 2002/96/EC. It lists items like batteries, printed circuit boards, LCDs over 100 sq cm, and cables that require selective treatment. The instructions describe removing over 25 screws, doors, and other parts to access these items, with an optional illustration showing disassembly of an LCD module. Tools typically used are screwdrivers.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    105 views4 pages

    Product End-of-Life Disassembly Instructions

    Uploaded by

    kalavida
    The document provides disassembly instructions for recycling or treatment facilities to remove components from HP notebooks and tablet PCs requiring selective treatment per EU directive 2002/96/EC. It lists items like batteries, printed circuit boards, LCDs over 100 sq cm, and cables that require selective treatment. The instructions describe removing over 25 screws, doors, and other parts to access these items, with an optional illustration showing disassembly of an LCD module. Tools typically used are screwdrivers.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
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    Product End-of-Life Disassembly Instructions

    Product Category: Notebooks and Tablet PCs Marketing Name / Model [List multiple models if applicable.] Name / Model #1Consumer NB jones / HP Pavilion dv6 Name / Model #2 Name / Model #3 Name / Model #4 Name / Model #5 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Quantity of items Item Description Notes included in product Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) Batteries Mercury-containing components Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB/PCT) Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height External electrical cables and cords Gas Discharge Lamps Plastics containing Brominated Flame Retardants Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances EL-MF877-00 Template Revision A Include the cartridges, print heads, tubes, vent chambers, and service stations. With a surface greater than 10 sq cm All types including standard alkaline and lithium coin or button style batteries For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Includes background illuminated displays with gas discharge lamps 5 2 2 1 0 0 1 0 0 0 0 0 0 0 Page 1

    2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) Description #1 Description #2 Description #3 Description #4 Description #5 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. Get out cell battery. Loose two M2.5*5L screws on HDD door then take out HDD . Loose one M2*3L screw than take out mini card from HDD door housing Loose three M2*5L screw than take out RAM door Loose one M2*3L screw than take out TV tunner board loose three M2.5X6.5 screws iin HDD housing and Loose three M2.5*4L screws In battery housing region and two M2.5*6.5L screws . Reverse chassis and take out kb retainer Loose three M2*3L and take out keyboard Loose four M2*6.5L and take out lcd module Loose one M2.5*4L screws from hinge support R and loose one M2.5*4L from center of speaker and Motherboard Loose three M2.5*5L screws from hinge cavity on rear side Loose one M2.5*6.5L screws on mini door then take out ODD Loose eight M2.5*6.5L screws on base and loose two M2.5*6.5L on ram door Reverse chassis and take out top_assy Loose a M2.5*6.5L screw then take out MB Loose four spring screws from CPU region and three normal screw frome VGA region then take out thermal module from MB. Loose a M2.5*6.5L screw then take out audio board from BASE case assy. Loose a M2.5*6.5L screw then take out USB board from BASE case assy. Loose a M2.5*6.5L screw then take out DC-IN bracket from BASE case assy. Loose a M2.5*1.8L screw then take out Finger printer module from top_assy Loose a M2*3L screw then take out bluetooth from top_assy Loose two M2.0*3.0L screws then take out audio board from BASE case assy. Loose two M2.5*6.5L screws, then take out LCD bezel Take out inverter board, Loose six M2.5*5L screws then take out hinge and Loose four M2 *3L screws then take out LCD module. Type-cross #1 (JIS B 4633-1987)

    3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).

    EL-MF877-00 Template Revision A

    Page 2

    Standard Operating Procedure


    Purpose

    MODEL Issued date Dep.

    LP156WH1-TLA1 2008.10.27
    NB Qualification Team

    Prepared by Sumi Chae

    Checked by Rich Kim

    LCM Disassembly Method

    STEP 1

    Remove Side Tape &Wire Fixing Tape & Bottom Tape

    AL Tape

    Left Tape STEP 2 Remove PCB Cover Shield

    Wire Fixing Tape

    Bottom Tape (Including AL Tape)

    PCB Cover Shield

    STEP 4

    Separate Metal Chassis from Plastic Frame (From Bottom Hook to Left/Right Hook)

    Metal Chassis

    Plastic Frame

    STEP 5 Separate Panel Assembly from Backlight Unit

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