ISD1700 Design Guide - pdf1
ISD1700 Design Guide - pdf1
ISD1700 Design Guide - pdf1
October 2006
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ISD1700 SERIES
TABLE OF CONTENTS
1 2 3 4 5 6 GENERAL DESCRIPTION ..............................................................................................................6 FEATURES..................................................................................................................................... .7 BLOCK DIAGRAM ...........................................................................................................................8 PINOUT CONFIGURATION ............................................................................................................9 PIN DESCRIPTION .......................................................................................................................10 FUNCTIONAL DESCRIPTION ......................................................................................................14 6.1 Detailed Description ...............................................................................................................14 6.1.1 Audio Quality................................................................................................................14 6.1.2 Message Duration........................................................................................................14 6.1.3 Flash Storage...............................................................................................................14 6.2 Memory Array Architecture ....................................................................................................14 6.3 Modes of Operations..............................................................................................................16 6.3.1 Standalone (Push-Button) Mode .................................................................................16 6.3.2 SPI Mode .....................................................................................................................16 7 ANALOG PATH CONFIGURATION (APC) ...................................................................................17 7.1 APC Register .........................................................................................................................17 7.2 Device Analog Path Configurations .......................................................................................18 8 STANDALONE (PUSH-BUTTON) OPERATIONS ........................................................................19 8.1 Sound Effect (SE) Mode ........................................................................................................19 8.1.1 Sound Effect (SE) Features.........................................................................................19 8.1.2 Entering SE Mode........................................................................................................19 8.1.3 SE Editing ....................................................................................................................19 8.1.4 Exiting SE Mode ..........................................................................................................20 8.1.5 Sound Effect Duration..................................................................................................20 8.2 Operation Overview ...............................................................................................................20 8.2.1 Record Operation ........................................................................................................21 8.2.2 Playback Operation .....................................................................................................22 8.2.3 Forward Operation .......................................................................................................22 8.2.4 Erase Operation...........................................................................................................23 8.2.5 Reset Operation...........................................................................................................25 8.2.6 VOL Operation .............................................................................................................26 8.2.7 FT (Feed-Through) Operation .....................................................................................26 8.3 vAlert Feature (Optional)........................................................................................................26
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8.4 Analog Inputs .........................................................................................................................26 8.4.1 Microphone Input .........................................................................................................26 8.4.2 AnaIn Input...................................................................................................................27 8.5 System Management .............................................................................................................27 9 CIRCULAR MEMORY ARCHITECTURE (CMA) ..........................................................................28 9.1 Restoring Circular Memory Architecture ................................................................................30
10 SERIAL PERIPHERAL INTERFACE (SPI) MODE........................................................................31 10.1 Microcontroller Interface ........................................................................................................31 10.2 SPI Interface Overview ..........................................................................................................31 10.2.1SPI Transaction Format ...............................................................................................31 10.2.2MOSI Data Format.......................................................................................................32 10.2.3MISO Data Format.......................................................................................................33 10.3 SPI Command Overview........................................................................................................34 10.4 Switching from SPI mode to Standalone Mode .....................................................................35 10.5 ISD1700 Device Registers .....................................................................................................35 10.5.1Status Register 0 (SR0) ...............................................................................................35 10.5.2Status Register 1 (SR1) ...............................................................................................37 10.5.3APC Register ...............................................................................................................37 10.5.4Playback Pointer (PLAY_PTR) ....................................................................................38 10.5.5Record Pointer (REC_PTR) ........................................................................................38 10.5.6DEVICEID Register .....................................................................................................38 11 SPI COMMAND REFERENCE......................................................................................................39 11.1 SPI Priority Commands..........................................................................................................41 11.1.1PU (0x01) Power Up ....................................................................................................41 11.1.2STOP (0x02) ................................................................................................................42 11.1.3RESET (0x03)..............................................................................................................42 11.1.4CLR_INT(0x04)............................................................................................................43 11.1.5RD_STATUS (0x05) ....................................................................................................43 11.1.6PD (0x07) Power Down ...............................................................................................44 11.1.7DEVID (0x09) Read Device ID ....................................................................................45 11.2 Circular Memory Commands .................................................................................................45 11.2.1PLAY (0x40).................................................................................................................46 11.2.2REC (0x41) ..................................................................................................................46 11.2.3ERASE (0x42)..............................................................................................................47 11.2.4G_ERASE (0x43) Global Erase...................................................................................48
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11.2.5FWD (0x48)..................................................................................................................48 11.2.6CHK_MEM (0x49) Check Circular Memory.................................................................49 11.2.7RD_PLAY_PTR (0x06) ................................................................................................50 11.2.8RD_REC_PTR (0x08)..................................................................................................50 11.3 Analog Configuration Commands ..........................................................................................51 11.3.1RD_APC (0x44) Read APC Register ..........................................................................51 11.3.2WR_APC1 (0x45) Load APC Register ........................................................................51 11.3.3WR_APC2 (0x65) Load APC Register ........................................................................52 11.3.4WR_NVCFG (0x46) Write APC data into Non-Volatile Memory .................................53 11.3.5LD_NVCFG (0x47) Load APC register from Non-Volatile Memory.............................53 11.4 Direct Memory Access Commands .......................................................................................54 11.4.1SET PLAY (0x80).........................................................................................................54 11.4.2SET_REC (0x81) .........................................................................................................55 11.4.3SET_ERASE (0x82) ....................................................................................................56 11.5 Additional Command..............................................................................................................57 11.5.1EXTCLK (0x4A) ...........................................................................................................57 11.6 General Guidelines for Writing Program Code ......................................................................58 11.7 Examples of Various Operating Sequences ..........................................................................59 11.7.1Record, Stop and Playback operations .......................................................................60 11.7.2SetRec and SetPlay operations...................................................................................61 11.7.3Wr_APC2, SetRec and SetPlay operations.................................................................62 11.7.4Playback 3 Messages as 1 Message (using SetPlay).................................................63 12 TIMING DIAGRAMS ......................................................................................................................64 12.1 Record Operation...................................................................................................................64 12.2 Playback Operation................................................................................................................65 12.3 Erase Operation .....................................................................................................................66 12.4 Forward Operation .................................................................................................................67 12.5 Global Erase Operation .........................................................................................................68 12.6 Reset Operation .....................................................................................................................68 12.7 Looping Playback Operation ..................................................................................................69 12.8 Global Erase Operation to Restore Circular Memory Architecture........................................70 12.9 Playback Operation with AUD Ouput.....................................................................................70 12.10 SPI Operation ......................................................................................................................71 13 ABSOLUTE MAXIMUM RATINGS ................................................................................................72 13.1 Operating Conditions .............................................................................................................73
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14 ELECTRICAL CHARACTERISTICS .............................................................................................74 14.1 DC Parameters ......................................................................................................................74 14.2 AC Parameters.......................................................................................................................75 15 TYPICAL APPLICATION CIRCUITS .............................................................................................76 15.1 Good Audio Design Practices ................................................................................................79 16 ORDERING INFORMATION .........................................................................................................80 17 VERSION HISTORY......................................................................................................................81
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1 GENERAL DESCRIPTION
The Winbond ISD1700 ChipCorder Series is a high quality, fully integrated, single-chip multimessage voice record and playback device ideally suited to a variety of electronic systems. The message duration is user selectable in ranges from 26 seconds to 120 seconds, depending on the specific device. The sampling frequency of each device can also be adjusted from 4 kHz to 12 kHz with an external resistor, giving the user greater flexibility in duration versus recording quality for each application. Operating voltage spans a range from 2.4 V to 5.5 V to ensure that the ISD1700 devices are optimized for a wide range of battery or line-powered applications. The ISD1700 is designed for operation in either standalone or microcontroller (SPI) mode. The device incorporates a proprietary message management system that allows the chip to self-manage address locations for multiple messages. This unique feature provides sophisticated messaging flexibility in a simple push-button environment. The devices include an on-chip oscillator (with external resistor control), microphone preamplifier with Automatic Gain Control (AGC), an auxiliary analog input, antialiasing filter, Multi-Level Storage (MLS) array, smoothing filter, volume control, Pulse Width Modulation (PWM) Class D speaker driver, and current/voltage output. The ISD1700 devices also support an optional vAlert (voiceAlert) feature that can be used as a new message indicator. With vAlert, the device flashes an external LED to indicate that a new message is present. Besides, four special sound effects are reserved for audio confirmation of operations, such as Start Record, Stop Record, Erase, Forward, Global Erase, and etc. Recordings are stored into on-chip Flash memory, providing zero-power message storage. This unique single-chip solution is made possible through Winbonds patented Multi-Level Storage (MLS) technology. Audio data are stored directly in solid-state memory without digital compression, providing superior quality voice and music reproduction. Voice signals can be fed into the chip through two independent paths: a differential microphone input and a single-ended analog input. For outputs, the ISD1700 provides a Pulse Width Modulation (PWM) Class D speaker driver and a separate analog output simultaneously. The PWM can directly drive a standard 8 speaker or typical buzzer, while the separate analog output can be configured as a singleended current or voltage output to drive an external amplifier. While in Standalone mode, the ISD1700 devices automatically enter into power down mode for power conservation after an operation is completed. In the SPI mode, the user has full control via the serial interface in operating the device. This includes random access to any location inside the memory array by specifying the start address and end address of operations. SPI mode also allows access to the Analog Path Configuration (APC) register. This register allows flexible configuration of audio paths, inputs, outputs and mixing. The APC default configuration for standalone mode can also be modified by storing the APC data into a non-volatile register (NVCFG) that is loaded at initialization. Utilizing the capabilities of ISD1700 Series, designers have the control and flexibility to implement voice functionality into the high-end products.
Notice: The specifications are subject to change without notice. Please contact Winbond Sales Offices or Representatives to verify current or future specifications. Also, refer to the website for any related application notes.
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2 FEATURES
y Integrated message management systems for single-chip, push-button applications o o o o o o
REC : level-trigger for recording PLAY : edge-trigger for individual message or level-trigger for looping playback sequentially ERASE : edge-triggered erase for first or last message or level-triggered erase for all messages FWD : edge-trigger to advance to the next message or fast message scan during the playback VOL : 8 levels output volume control RDY INT : ready or busy status indication
o RESET : return to the default state o Automatic power-down after each operation cycle y Selectable sampling frequency controlled by an external oscillator resistor
Sampling Frequency Rosc 12 kHz 60 k 8 kHz 80 k 6.4 kHz 100 k 5.3 kHz 120 k 4 kHz 160 k
Selectable message duration o A wide range selection from 30 secs to 240 secs at 8 kHz sampling frequency y Message and operation indicators o Four customizable Sound Effects (SEs) for audible indication o Optional vAlert (voiceAlert) to indicate the presence of new messages o LED: stay on during recording, blink during playback, forward and erase operations y Dual operating modes o Standalone mode: Integrated message management techniques Automatic power-down after each operation cycle o SPI mode: Fully user selectable and controllable options via APC register and various SPI commands Two individual input channels o MIC+/MIC-: differential microphone inputs with AGC (Automatic Gain Control) o AnaIn: single-ended auxiliary analog input for recording or feed-through Dual output channels o Differential PWM Class D speaker outputs directly drives an 8 speaker or a typical buzzer o Configurable AUD (current) or AUX (voltage) single-ended output drives external audio amplifier ChipCorder standard features o High-quality, natural voice and audio reproduction o 2.4V to 5.5V operating voltage o 100-year message retention (typical) o 100,000 record cycles (typical) Temperature options: o Commercial: 0C to +50C (die); 0C to +70C (packaged units) o Industrial: -40C to +85C (packaged units) Packaging types: available in die, PDIP, SOIC and TSOP Package option: Lead-free packaged units
y y
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3 BLOCK DIAGRAM
ROSC
Internal Clock
Timing
Sampling Clock
AnaIn
Amp
AUD / AUX
MUX
MIC+ MICAGC
Smoothing Filter
Volume Control
Power Conditioning
Device Control
SPI Interface
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4 PINOUT CONFIGURATION
V CCD LED RESET MISO MOSI SCLK SS V SSA AnaIn MIC+ MICV SSP2 SPV CCP
1 2 3 4 5 6 7 8 9 10 11 12 13 14
28 27 26 25 24 23
V SSD INT / RDY FW D ERASE REC PLAY FT V CCA R OSC VOL AGC AUD / AUX V SSP1 Sp+
ISD1700
22 21 20 19 18 17 16 15
SOIC / PDIP
V SSA AnaIn MIC+ MICV SSP2 SPV CCP Sp+ V SSP1 AUD/AUX AGC VOL R OSC V CCA
1 2 3 4 5 6 7 8 9 10 11 12 13 14
28 27 26 25 24
SS SCLK MOSI MISO RESET LED V CCD V SSD INT / RDY FWD ERASE REC PLAY FT
ISD1700
23 22 21 20 19 18 17 16 15
TSOP
5 PIN DESCRIPTION
PIN NAME VCCD PDIP / SOIC 1 TSOP 22 FUNCTIONS
[3]
Digital Power Supply: It is important to have a separate path for each power signal including VCCD, VCCA and VCCP to minimize the noise coupling. Decoupling capacitors should be as close to the device as possible. LED: With an LED connected, this output turns an LED on during recording and blinks LED during playback, forward and erase operations. RESET: When Low, the device enters into a known state and initializes all [1] pointers to the default state. This pin has an internal pull-up resistor . Master In Slave Out: Data is shifted out on the falling edge of SCLK. When the SPI is inactive ( SS = high), its tri-state. Master Out Slave In: Data input of the SPI interface when the device is configured as slave. Data is latched into the device on the rising edge of [1] SCLK. This pin has an internal pull-up resistor . Serial Clock: Clock of the SPI interface. It is usually generated by the master device (typically microcontroller) and is used to synchronize the data transfer in and out of the device through the MOSI and MISO lines, [1] respectively. This pin has an internal pull-up resistor . Slave Select: This input, when low, selects the device as slave device [1] and enables the SPI interface. This pin has an internal pull-up resistor . Analog Ground: It is important to have a separate path for each ground signal including VSSA, VSSD, VSSP1 and VSSP2 to minimize the noise coupling. AnaIn: Auxiliary analog input to the device for recording or feed-through. An AC-coupling capacitor (typical 0.1uF) is necessary and the amplitude of the input signal must not exceed 1.0 Vpp. Depending upon the D3 of APC register, AnaIn signal can be directly recorded into the memory, mixed with the Mic signal then recorded into the memory or buffered to the speaker and AUD/AUX outputs via feed-through path. MIC+: Non-inverting input of the differential microphone signal. The input signal should be AC-coupled to this pin via a series capacitor. The capacitor value, together with an internal 10 K resistance on this pin, determines the low-frequency cutoff for the pass band filter. The Mic analog path is also controlled by D4 of APC register. MIC-: Inverting input of the differential microphone signal. The input signal should be AC-coupled to the MIC+ pin. It provides input noisecancellation, or common-mode rejection, when the microphone is connected differentially to the device. The Mic analog path is also controlled by D4 of APC register. Ground for Negative PWM Speaker Driver: It is important to have a separate path for each ground signal including VSSA, VSSD, VSSP1 and VSSP2 to minimize the noise coupling.
LED RESET
2 3 4 5
23 24 25 26
MISO MOSI
SCLK
27
SS
7 8
28 1
VSSA
AnaIn
MIC+
10
MIC-
11
VSSP2
12
PDIP / SOIC 13
TSOP 6
FUNCTIONS
[3]
SP-: The negative Class D PWM provides a differential output with SP+ pin to directly drive an 8 speaker or typical buzzer. During power down or not used, this pin is tri-stated. This output can be controlled by D8 of APC register. The factory default is set at on state. Power Supply for PWM Speaker Driver: It is important to have a separate path for each power signal including VCCD, VCCA and VCCP to minimize the noise coupling. Decoupling capacitors to VSSP1 and VSSP2 should be as close to the device as possible. The VCCP supply and VSSP ground pins have large transient currents and need low impedance returns to the system supply and ground, respectively. SP+: The positive Class D PWM provides a differential output with the SP- pin to directly drive an 8 speaker or typical buzzer. During power down or not used, this pin is tri-stated. This output can be controlled by D8 of APC register. The factory default is set at on state. Ground for Positive PWM Speaker Driver: It is important to have a separate path for each ground signal including VSSA, VSSD, VSSP1 and VSSP2 to minimize the noise coupling. Auxiliary Output: Depending upon the D7 of APC register, this output is either an AUD or AUX output. AUD is a single-ended current output, whereas AUX is a single-ended voltage output. They can be used to drive an external amplifier. The factory default is set to AUD. This output can be powered down by D9 of APC register. The factory default is set to On state. For AUD output, there is a ramp up at beginning and ramp down at the end to reduce the pop. Automatic Gain Control (AGC): The AGC adjusts the gain of the preamplifier dynamically to compensate for the wide range of microphone input levels. The AGC allows the full range of signals to be recorded with minimal distortion. The AGC is designed to operate with a nominal capacitor of 4.7 F connected to this pin. Connecting this pin to ground (VSSA) provides maximum gain to the preamplifier circuitry. Conversely, connecting this pin to the power supply (VCCA) provides minimum gain to the preamplifier circuitry. Volume: This control has 8 levels of volume adjustment. Each Low going pulse decreases the volume by one level. Repeated pulses decrease volume level from current setting to minimum then increase back to maximum, and continue this pattern. During power-up or RESET , a default setting is loaded from non-volatile configuration. The factory default is set to maximum. This output can also be controlled by <D2:D0> [1] of APC register. This pin has an internal pull-up device and an internal [2] debounce (TDeb) for start and end allowing the use of a push button switch. Oscillator Resistor: A resistor connected from ROSC pin to ground determines the sample frequency of the device, which sets the duration. Please refer to the Duration Section for details.
VCCP
14
SP+
15
VSSP1
16
AUD / AUX
17
10
AGC
18
11
VOL
19
12
ROSC
20
13
PDIP / SOIC 21
TSOP 14
FUNCTIONS
[3]
Analog Power Supply. It is important to have a separate path for each power signal including VCCD, VCCA and VCCP to minimize the noise coupling. Decoupling capacitors to VSSA should be as close to the device as possible. Feed-through: In Standalone mode, when FT is engaged low, the AnaIn feed-through path is activated. As a result, the AnaIn signal is transmitted directly from AnaIn to both Speaker and AUD/AUX outputs with Volume Control. However, SPI overrides this input, while in SPI mode, and feedthrough path is controlled by a D6 of APC register. This pin has an [1] [2] internal pull-up device and an internal debounce (T Deb) for start and end allowing the use of a push button switch. Playback: Pulsing PLAY to Low once initiates a playback operation. Playback stops automatically when it reaches the end of the message. Pulsing it to Low again during playback stops the operation. Holding PLAY Low constantly functions as a sequential playback operation loop. This looping continues until PLAY returns to High. This [1] [2] pin has an internal pull-up device and an internal debounce (TDeb) for start and end allowing the use of a push button switch.
FT
22
15
PLAY
23
16
REC
24
17
ERASE
25
18
Record: The device starts recording whenever REC switches from High to Low and stays at Low. Recording stops when the signal returns to [1] High. This pin has an internal pull-up device and an internal debounce [2] (TDeb) for start allowing the use of a push button switch. Erase: When active, it starts an erase operation. Erase operation will take place only when the playback pointer is positioned at either the first or last message. Pulsing this pin to Low enables erase operation and deletes the current message. Holding this pin Low for more than 3 sec. initiates a global erase operation, and will delete all the messages. This pin has an [1] [2] internal pull-up device and an internal debounce (TDeb) for start and end allowing the use of a push button switch. Forward: When triggered, it advances to the next message from the current location, when the device is in power down status. During playback cycle, pulsing this pin Low stops the current playback operation and advances to the next message, and then re-starts the playback [1] operation of the new message. This pin has an internal pull-up device [2] and an internal debounce (TDeb) for start and end allowing the use of a push button switch. An open drain output. Ready (Standalone mode): This pin stays Low during record, play, erase and forward operations and stays High in power down state Interrupt (SPI mode): After completing the SPI command, an active low interrupt is generated. Once the interrupt is cleared, it returns to High.
FWD
26
19
RDY INT
27
20
PDIP / SOIC 28
TSOP 21
FUNCTIONS
[3]
Digital Ground: It is important to have a separate path for each ground signal including VSSA, VSSD, VSSP1 and VSSP2 to minimize the noise coupling.
Note:
[1]
600 k TDeb = Refer to AC Timing [3] For any unused pins, left floated.
[2]
6 FUNCTIONAL DESCRIPTION
6.1 DETAILED DESCRIPTION
6.1.1 Audio Quality
Winbonds patented ChipCorder Multi-Level Storage (MLS) technology provides a natural, high-quality record and playback solution on a single chip. The input voice signals are stored directly in the Flash memory and are reproduced in their natural form without any of the compression artifacts caused by digital speech solutions. 6.1.2 Message Duration
The ISD1700 Series offer record and playback duration from 20 seconds to 480 seconds. Sampling frequency and message duration, TDur, are determined by an external resistor connected to the ROSC pin. Table 6.1 Duration vs. Sampling Frequency
Sample Freq. ISD1730 20 secs 12 kHz 8 kHz 6.4 kHz 5.3 kHz 4 kHz 30 secs 37 secs 45 secs 60 secs ISD1740 26 secs 40 secs 50 secs 60 secs 80 secs ISD1750 33 secs 50 secs 62 secs 75 secs 100 secs ISD1760 40 secs 60 secs 75 secs 90 secs 120 secs ISD1790 ISD17120 ISD17150 ISD17180 ISD17210 ISD17240 60 secs 80 secs 100 secs 120 secs 140 secs 160 secs 90 secs 112 secs 135 secs 180 secs 120 secs 150 secs 181 secs 240 secs 150 secs 187 secs 226 secs 300 secs 180 secs 225 secs 271 secs 360 secs 210 secs 262 secs 317 secs 420 secs 240 secs 300 secs 362 secs 480 secs
6.1.3
Flash Storage
The ISD1700 devices utilize embedded Flash memory to provide non-volatile storage. A message can be retained for a minimum of 100 years without power. Additionally, each device can be re-recorded over 100,000 times (typical). 6.2 MEMORY ARRAY ARCHITECTURE The memory array provides storage of four special Sound Effects (SEs) as well as the voice data. The memory array is addressed by rows. A row is the minimum storage resolution by which the memory can be addressed. The memory assignment is automatically handled by the internal message management system in standalone mode. While in SPI mode, one has the full access to the entire memory via the eleven address bits. Table 6.2 shows the minimum storage resolution with respect to the sampling frequency. Table 6.2 Minimum Storage Resolution vs. Sampling Frequency Sampling Frequency Minimum Storage Resolution 12 kHz 83.3 msec 8 kHz 125 msec 6.4 kHz 156 msec 5.3 kHz 187 msec 4 kHz 250 msec
For example, at 8 kHz sampling frequency, the minimum storage resolution is 125 msec, so each Sound Effect (SE) is approximately 0.5 second long.
Table 6.3 shows the maximum row address of each device in the ISD1700 family. The four sound effects (SE) occupy the first sixteen rows in the memory array with four rows for each SE. That means from address 0x000 to address 0x00F. The remaining memory is dedicated to voice data storage. Hence, the address of voice message storage will start from 0x010 to the end of memory array. Table 6.3 Device Maximum Row Address
Device Maximum Address ISD1730 0x0FF ISD1740 0x14F ISD1750 0x19F ISD1760 0x1EF ISD1790 ISD17120 ISD17150 ISD17180 ISD17210 ISD17240 0x2DF 0x3CF 0x4BF 0x5AF 0x69F 0x78F
Below figure shows the memory array architecture for ISD1700 series.
000 - 003 004 - 007 008 - 00B 00C - 00F 010 0FF 14F 19F 1E F 2D F
SE1 SE2 SE3 SE4 1st row of V oice M essage Last row of IS D 1730 Last row of IS D 1740 Last row of IS D 1750 Last row of IS D 1760 Last row of IS D 1790
3C F 17120
Last row of IS D
4B F 17150
Last row of IS D
5A F
69F
78F
6.3 MODES OF OPERATIONS The ISD1700 Series can operate in either Standalone (Push-Button) or microcontroller (SPI) mode. 6.3.1 Standalone (Push-Button) Mode Standalone operation entails use of the REC , PLAY , FT , FWD , ERASE , VOL and RESET pins to trigger operations. The internal state machine automatically configures the audio path according to the desired operation. In this mode, the internal state machine takes full control on message management. This allows the user to record, playback, erase, and forward messages without the needs to know the exact addresses of the messages stored inside the memory. For additional information, refer to Standalone Mode Design Reference Guide. 6.3.2 SPI Mode In SPI mode, control of the device is achieved through the 4-wire serial interface. Commands similar to the push button controls, such as REC , PLAY , FT , FWD , ERASE , VOL and RESET , can be executed through the SPI interface. In addition, there are commands that allow the modification of the analog path configuration, as well as commands that direct access the memory address of the array, plus others. The SPI mode allows full control of the device and the ability to perform complex message management rather than conform to the circular memory architecture as push-button mode. Refer to SPI Mode sections for details. In addition, it is suggested that both the microcontroller and the ISD1700 device have the same power supply level for design simplicity.
In either mode, it is strongly recommended that any unused pins, no matter input or output, must be left floated or unconnected. Otherwise, it will cause the device becoming malfunction.
0 = Monitor_input is Disabled
Combined with FT in standalone mode or SPI_FT bit 0 = Mix_Input is Off (D6) in SPI mode, D4 controls the input selection for recording. D4 = 0
FT / D6= 0 FT / D6= 1
AnaIn REC Mic REC (Mic + AnaIn) REC Mic REC 0 = Enable SE_Editing
D4 = 1
FT / D6= 0 FT / D6= 1
D5
SE_Editing
Enable or disable editing of Sound Effect in Standalone mode: where 0 = Enable, 1 = Disable
Bit D6
Name SPI_FT
Description For SPI mode only. Once SPI_PU command is sent, the FT is disabled and replaced by this control bit (D6) with the same functionality. After exiting SPI mode through the PD command, the FT resumes control of feed-through (FT) function. D6 = 0 D6 = 1 FT function in SPI mode is On FT function in SPI mode is Off
D7 D8 D9 D10 D11
Analog Output: AUD/AUX PWM SPK PU Analog Output vAlert EOM Enable
Select AUD or AUX: 0 = AUD, 1 = AUX PWM Speaker +/- outputs: 0 = Enabled, 1 = Disabled PowerUp analog output: 0 = On, 1 = Off vAlert: 0 = On, 1 = Off. EOM Enable for SetPlay operation: 0 = Off, 1 = On. When this bit is set to 1, SetPlay operation will stop at EOM location, rather than the End Address.
7.2 DEVICE ANALOG PATH CONFIGURATIONS Table 7.2 demonstrates the possible analog path configurations with ISD1700. The device can be in power-down, power-up, recording, playback and/or feed-through state depending upon the operation requested by the push-buttons or related SPI commands. The active path in each of these states is determined by D3 and D4 of the APC register, as well as either D6 of the APC register in SPI mode or the FT status in standalone mode. In addition,.D7~D9 of the APC register determine which output drivers are activated. Table 7.2 Operational Paths APC Register D4 D3 D6 / FT Mix Mon 0 0 0 0 0 1 0 1 0 0 1 1 1 1 1 0 0 1 1 1 0 1 0 1 Operational Paths Idle AnaIn FT AnaIn FT (Mic + AnaIn) FT (Mic + AnaIn) FT FT Disable FT disable FT disable FT disable Record AnaIn Rec AnaIn Rec + AnaIn FT (Mic + AnaIn) Rec (Mic + AnaIn) Rec + (Mic + AnaIn) FT Mic Rec Mic Rec + Mic FT Mic Rec Mic Rec + Mic FT Playback (AnaIn + MLS) --> o/p (AnaIn + MLS) --> o/p (AnaIn + MLS) --> o/p (AnaIn + MLS) --> o/p MLS --> o/p MLS --> o/p MLS --> o/p MLS --> o/p
8.1
SE mode can be manipulated by several control pins as described below. There are four special sound effects (SE1, SE2, SE3, and SE4). Audio clips can be programmed into the SEs as various indications. Each SE occupies four designated memory rows and the first sixteen memory rows are reserved for these four SEs evenly and sequentially. 8.1.1 o o o o Sound Effect (SE) Features SE1: Beginning of recording, forward or global erase warning SE2: End of recording, single erase or forward from last message SE3: Invalid erase operation SE4: Successful global erase
The functions of SEs are used to indicate the status of the following operations:
In general, the LED flashes once for SE1, twice for SE2, and so forth. It is crucial to recognize that the LED flashes accordingly regardless the SEs are programmed or not. When none of them is programmed, the blinking periods of SE1, SE2, SE3 and SE4 are defined as TLS1, TLS2, TLS3 and TLS4, respectively. Once they are programmed, during operation, the device flashes LED and plays the related SE simultaneously. Nevertheless, the period of blinking LED, under this condition, is limited by the duration of the recorded SE. In addition, they are defined as TSE1, TSE2, TSE3 and TSE4, respectively. These timing parameters also apply to the conditions elaborated in the following related sections. (Refer to AC timing parameter for details.) 8.1.2 Entering SE Mode
First press and hold FWD Low for 3 seconds or more roughly. This action on FWD will usually blink LED once (and play SE1 simultaneously if SE1 is recorded). However, if playback pointer is at the last message or memory is empty, the chip will blink the LED twice (and play SE2 simultaneously if SE2 is recorded). While holding FWD Low, press and hold the REC Low until the LED blinks once. The LED flashing once again indicates that the device is now in SE mode. Once entering into SE mode, the SE1 is always the first one to be accessible. SE Editing
8.1.3
After into SE editing mode, one can perform record, play, or erase operation on each SE by pressing the appropriate buttons. For example, to record SE, simply press and hold
REC . Similarly for play or erase function, pulse PLAY or ERASE , respectively. Record source can be either Mic+/- or AnaIn.
A subsequent FWD operation moves the record and playback pointers to the next SE sequentially. The LED will also blink one to four times after such operation to indicate which SE is active. If FWD is pressed while in SE4, the LED will flash once to indicate that SE1 is again active. While the LED is blinking, the device will ignore any input commands. One must wait patiently until the LED stops blinking completely before any record, play, erase or forward input should be sent. Exiting SE Mode
8.1.4
The required steps are the same as Entering SE mode. First press and hold FWD until the LED stops blinking (and related SE is played if SEs are programmed). Then, simultaneously press and hold the REC Low until the LED blinks twice (and device will play SE2 if SE2 is programmed). The device now exits the SE editing mode. Sound Effect Duration
8.1.5
The duration of SEs is determined by the sampling frequency selected and illustrated in below table. Table 8.1 Sound Effect Duration vs. Sampling Frequency Sampling Frequency Duration of SE 12 kHz 0.33 sec 8 kHz 0.5 sec 6.4 kHz 0.625 sec 5.3 kHz 0.75 sec 4 kHz 1 sec
If messages are present, the record pointer points to the last message and the playback pointer points message. The playback pointer is affected either by the FWD or updated to the next available memory row after each REC 8.2.1 Record Operation
the next available memory row following to the beginning of the last recorded
REC operation. The record pointer is operation.
The REC controls recording operation. Once setting this pin Low, the device starts recording from the next available row in memory and continues recording until either the REC returns to High or the memory is full. The source of recording is from either MIC+/- or AnaIn, whereas the active analog configuration path is determined by the desired operation and the state of the FT . The REC is debounced internally. After recording, the record pointer will move to the next available row from the last recorded message and the playback pointer will position at the beginning of the newly recorded message. However, it is important to perform an Erase operation on the desired location before any recording proceeds. In addition, the power supply must remain On during the entire recording process. If power is interrupted during recording process, the circular memory architecture will be destroyed. As a result, next time when a push button operation starts, the LED will blink seven times, which indicates that something unusual has occurred, and the device will fail to perform the requested operation. Under such scenario, the only way to recover the chip to a proper state is to perform a Global Erase operation. Message recording indicators: The built-in message management technique associates special Sound Effects, SE1 and SE2, within the recording process. a) When REC goes Low: If SE1 is not programmed, then the LED turns On immediately to indicate that a recording is in progress. If SE1 is programmed, device plays SE1 and blinks LED simultaneously. Then LED turns On to show recording is in process. The LED blinking period of SE1 is determined by the recorded duration of SE1 (TSE1). (Refer to AC timing parameter and timing diagrams for details.) b) When REC goes High or when the memory is full: If SE2 is not programmed, then the LED turns Off immediately to indicate that the recording halts. If SE2 is programmed, device plays SE2 and flashes LED simultaneously. Then LED turns Off to show recording stops. The LED blinking period of SE2 is determined by the recorded duration of SE2 (TSE2). Triggering of REC during a play, erase or forward operation is an illegal operation and will be ignored.
8.2.2
Playback Operation
Two playback modes can be executed by PLAY , which is internally debounced. a) Edge-trigger mode: Pulsing PLAY Low once initiates a playback operation of the current message. Playback automatically stops at the end of the message. Pulsing PLAY again will re-play the message. During playback, the LED flashes and goes Off when the playback completes. Pulsing PLAY to Low again during playback stops the playback operation. Under these circumstances, the playback pointer remains at the start of the played message after the operation is completed. b) Looping Playback mode: As PLAY is held Low constantly, the device plays all messages sequentially from the current message to its previous message and loops the playback action. During the entire playback process, the LED flashes non-stop. Meanwhile, the looping playback mechanism is implemented in the following sequence: start playback from current message; as playback is over, perform a forward operation; start playback of new message; once playback completes, perform another forward action; start playback of new message, ..and so on. This looping pattern continues until PLAY is released. As PLAY is released, device will continue to playback the current message until completion. When playback stops, the playback pointer is set at the start of the halted message. If no SE1 and SE2 are programmed, after playing a message, except the last one, device flashes LED once with blinking period TLS1 due to forward action. As after the last message, device flashes LED twice with blinking period TLS2. If both SE1 and SE2 are programmed, after playing a message, except the last one, device plays SE1 and flashes LED simultaneously due to forward action. Then device keeps on the playback of new message. Alternatively, after playing the last message, device plays SE2 and flashes LED simultaneously due to forward action. Then device maintains the playback of the first message. The LED blinking period of SE1 and SE2 are determined by the recorded durations of SE1 and SE2, respectively. Triggering PLAY during a record, erase, or forward operation is an illegal operation and will be ignored. 8.2.3 Forward Operation
The FWD allows the device to advance the playback pointer to the next message in a forward direction. When the pointer reaches the last message, it will jump back to the first message. Hence, the movement is alike a circular fashion among the messages. The FWD is debounced internally. The effect of a Low-going pulse on the FWD depends on the current state of the device: a) If the device is in power-down state and the playback pointer does not point to the last message, then: The playback pointer will advance to the next message. If SE1 is not recorded, device will flash LED once with blinking period TLS1. However, if SE1 is recorded, device plays SE1 and blinks the LED once simultaneously. The LED blinking period is determined by the recorded duration, TSE1, of SE1.
b) If the device is in power-down state and the playback pointer points to the last message, then: The playback pointer will advance to the first message. If SE2 is not recorded, device will flash LED twice with blinking period TLS2. However, if SE2 is recorded, device plays SE2 and blinks the LED twice simultaneously. The LED blinking period is determined by the recorded duration, TSE2, of SE2. c) If the device is currently playing a message that is not the last one, then the device: Halts the playback operation. Advances the playback pointer to the next message. If SE1 is not recorded, device will flash LED once with blinking period TLS1. However, if SE1 is recorded, device plays SE1 and blinks the LED once simultaneously. The LED blinking period is determined by the recorded duration, TSE1, of SE1. Playback the new message. The LED flashes during this entire process. d) If the device is currently playing the last message, then the device: Halts the playback operation. Advances the playback pointer to the first message. If SE2 is not recorded, device will flash LED twice with blinking period TLS2. However, if SE2 is recorded, device simultaneously plays SE2 and blinks the LED twice. The LED blinking period is determined by the recorded duration, TSE2, of SE2. Playback the first message. The LED flashes during this entire process. Triggering of the FWD operation during an erase or record operation is an illegal operation and will be ignored. 8.2.4 Erase Operation
Erasing individual message takes place only if the playback pointer is at either the first or the last message. Erasing individual messages other than the first or last message is not permitted in standalone mode. However, global erase can be executed at any message location and will erase all messages, once completed successfully. The ERASE is debounced internally. These two erase modes are described as follows: a) Individual Erase: Only the first or last messages can be individually erased. Pulsing ERASE Low enables device responses differently pending upon the status of the device and the current location of the playback pointer: If the device is in power down mode and the playback pointer currently points to the first (or last) message, then the device will:
o o o
Erase first (or last) message and flash LED twice with blinking period TLS2, if SE2 is not programmed. If SE2 is programmed, simultaneously play SE2 and flash the LED twice. The LED blinking period is determined by the recorded duration, TSE2, of SE2. Update the playback pointer to the new first message - previously the second message (or new last message - originally the second to the last message).
If the device is in power down mode and the playback pointer is at any message other than the first or last message, then the device will: o o o o o Not erase any message and flash LED three times with blinking period TLS3, if SE3 is not programmed. If SE3 is programmed, simultaneously play SE3 and flash the LED three times. The LED blinking period is determined by the recorded duration, TSE3, of SE3. Not change to the playback pointer. Stops the playback operation. Erases the message as scenario one of individual erase mentioned earlier.
If the device is currently playing any message other than the first or last message, then the device will: o o Stops the playback operation. Behave like scenario two of individual erase mentioned above.
b) Global Erase: Level-triggering ERASE at Low for more than 2.5 seconds and holding it continuously will initiate the Global Erase operation and deletes all messages, except the Sound Effects (SEs). See the below figure for operation details. The device reacts differently according to the current condition of the device. If SEs are not programmed o o o The device will blink LED twice with blinking period TLS2 once ERASE is triggered to indicate the current message being erased if it is either the first or last one. Or if current message is neither the first nor last one, LED will blink three times with blinking period TLS3 to show that current message is not erased.
If ERASE is kept Low constantly, the LED will be blinked seven times to indicate all messages being erased. However, if ERASE is released before the first three blinks of LED, then global erase operation will be abandoned. Otherwise, the global erase operation will be performed. The estimated total period of blinking seven times is defined as (3*TLS1 +TLS4). If SEs are programmed, o o The device will play SE2 and flash the LED twice simultaneously once ERASE is triggered to indicate the current message being erased if it is either the first or last one. Or if current message is neither the first nor last one, the device will play SE3 and flash the LED three times simultaneously to indicate that current message is not erased.
o o
After ERASE continues to be held Low for 2.5 seconds or more, the device plays SE1 three times with LED flashing simultaneously. This serves as a warning signal that after playing SE1 three times, then global erase will be performed. However, if ERASE is released before the playback of the third SE1, then global erase operation will be abandoned. As ERASE is maintained Low continuously, the device will erase all messages and play SE4 with LED flashing simultaneously upon completion. During this process, the blinking periods of twice, three times and four times are limited by the recorded durations of SE2, SE3 and SE4 (T SE2,TSE3 and TSE4) respectively.
However, it is vital to maintain the power supply On during the erase process. If power is interrupted during such process, the circular memory architecture will be destroyed. As a result, next time when a push button operation starts, the LED will blink seven times, which indicates that something abnormal has occurred, and the device will fail to perform the requested operation. Under such scenario, the only way to recover the chip to a proper state is to perform a Global Erase operation. Triggering ERASE for individual erase during a record or forward operation is an illegal operation and will be ignored. However, triggering ERASE for an individual erase operation during playback will delete the current played message, if it is the first or last one.
ERASE key is Pressed and Held Play SE1 &/or blink LED 3 times to Signalify for Global Erase to start. Release ERASE key to abort Global Erase operation
Case 1 :
Current messge location : 1st or Last Play Erase 1st SE2 or last &/or blink message LED 2x Global Erase Wait Play Play Play SE1 SE1 SE1 &/or blink &/or blink &/or blink LED once LED once LED once
Case 2 :
Current messge location : Not at 1st or Last Play SE3 &/or blink LED 3x Wait Global Erase Play Play Play SE1 SE1 SE1 &/or blink &/or blink &/or blink LED once LED once LED once Play SE4 &/or blink LED 4x
A 0.1 F capacitor is recommended to connect the RESET to ground if a push button switch is used on this control. After RESET is triggered, the device will be in power down state and place both the record and the playback pointers at the last message. When a microcontroller is used for a power-on-Reset, RESET must stay active for at least 1 sec after all supply rails reach their proper specifications.
8.2.6
VOL Operation
Pulsing VOL Low changes the volume output. Each pulse on VOL will decrease the volume until the minimum setting is reached. Subsequent pulses will increase the volume until the maximum level is reached and the cycle will start again. There are 8 steps of volume control. Each step changes the volume by 4 dB. The VOL is debounced internally. A RESET operation will re-initialize the volume level to the factory default state, which is the maximum level. One can change this default setting using related SPI command. 8.2.7 FT (Feed-Through) Operation
The FT controls the feed-through path from the input to the output of the chip. By factory default, when FT is held Low, FT mode is enabled. Active FT mode will pass AnaIn signal to both SPK and AUD outputs when the device is idle. During recording, device will record the AnaIn signal into the memory. However, the FT path is subject to the contents of NVCFG register during power-on-reset. Once power-up, one can configure the feed-through path by changing the setting of the APC register using the related SPI commands.
8.3 VALERT FEATURE (OPTIONAL) If this optional feature is enabled, after a recording operation, the LED ou tput will blink once every few seconds to indicate the presence of a new message, while the device is in power-down state. After any subsequent operations, which power-up the device, the vAlert will stop flashing.
AGC
MIC IN
8.4.2
AnaIn Input
IN TE R N A L TO TH E D E V IC E
Cc ou p 0.1uF ANAIN R a = 42 K
R a = 42K
ANAIN IN PU T AM PLIF IE R
8.5 SYSTEM MANAGEMENT While in Standalone mode, it is recommended the designer to utilize the feedback from the
RDY INT pin, visual and optional SE indications for effective system management with respect to
its operations.
(Null) 0x010
RECORD
1
RECORD
1 2
RECORD
1 2 3
RECORD
1 2 3 4
FF
FWD x2
1 2 3 4
FWD x3
1 2 3 4
ERASE
2 3 4
FWD x2
2 3 4
2 3
ERASE
Figure 9.1 Circular Memory Management An example of the Circular memory management is shown in Figure 9.1. Here the memory array starts with an empty memory, the ISD1700 detects this and sets the record pointer to point at row 0x010, the first row of normal memory. A subsequent REC command will record message 1. Now the playback pointer will point to the beginning of message 1 and the record pointer to the next row after message 1. Three more recordings will write message 2, 3 and 4. This results the record and playback pointers are at next row after message 4 and beginning of message 4, respectively. If two FWD commands are now sent, the playback pointer will jump from last message to message 1 then message 2. Note that the erase pointer is now invalid since erase is restricted to only the first or last message. If three FWD commands were executed, the playback pointer would end up back at message 1 after wrapping around the last message. Because the pointer is at the first message an erase command is valid. An ERASE will remove message 1 from the memory. Note that the record pointer has been unaffected by all these operations. A further two FWD and a subsequent ERASE commands will remove message 4.
: Play PTR
: Record PTR
: Erase PTR
2 3 3 4
7b
RECORD x3
7b
FWD x2
3 4 4 5 6 7a
3 4 4 5 5 6 7a
FWD
RECORD
7b 7b 8 3 4 5 6 7a
7b
ERASE
3 4 5 6 7a
7b 3 4 5 6 7a
ERASE
7b 4 5 6 7a
FWD x3
7b 4 5 6 7a
ERASE
4 5 6
ERASE
4 5
Figure 9.2 Further Circular Message Management A Further example of circular memory management is shown in Figure 9.2. Here note how the three REC commands cause message 7 to be split across the end of memory boundary. Two FWD commands will wrap the playback pointer to message four the second message in the circular queue. Now if we record until the memory is full, the record pointer becomes invalid and no further record commands will be accepted by the device. Either the first or last message must be erased first. The example above demonstrates erasing the last and then the first message as well.
9.1
In case the circular memory architecture is damaged, the LED will blink seven times of duration TLErr when either REC , PLAY , ERASE or FWD button or alike SPI commands are activated. During such occurrence, the only way to recover back to an operating status is to perform a successful global erase operation. In order to perform this effectively, one has to press-and-hold the ERASE for approximately twelve seconds (time for LED to blink seven times plus period for global erase) at 8 kHz sampling frequency. As a result, the device will resume back to the normal condition. Details are shown in the related timing diagram.
MSB
7th Byte End Address (High Byte)
MOSI
CMD_Byte
LSB
1st Byte 2nd Byte 3rd Byte Data Byte 1 or SR0 (Low Byte) 4th Byte Data Byte 2 or SR0 (High Byte) 5th Byte SR0 (Low Byte) 6th Byte SR0 (High Byte)
MSB
7th Byte SR0 (Low Byte)
MISO
10.2.2 MOSI Data Format MOSI is the Master Out Slave In data line of the SPI interface. Data is clocked into the device on the rising edge of the SCLK signal, with the least significant bit (LSB) first. Depending upon the command type, the format may be two bytes or as long as seven bytes. The generalized sequence of MOSI data is shown in the table below. The first byte sent to the device is always the command opcode byte, which determines the operation to be performed. Bit 4 (C4) of the command byte determines whether the LED feature is activated for related operations. When C4=1, the LED is On. Subsequent bytes are data associated with the type of command, which may include start and end addresses for operation or other data bits. Table 10.1 MOSI Data Sequence
MSB Bit 7 C7 MSB Bit 15 X/D7 MSB Bit 23 X/S7 MSB Bit 31 X MSB Bit 39 E7 MSB Bit 47 X MSB Bit 55 X Bit 54 X Bit 46 X Bit 38 E6 Bit 14 X/D6
rd
1 Byte: Command Byte Bit 6 C6 Bit 5 C5 2 Bit 13 X/D5 Bit 21 X/S5 Bit 29 X
th nd
st
LSB Bit 1 C1 Bit 9 X/D1 Bit 17 D9/S1 Bit 25 S9 Bit 33 E1 Bit 41 E9 Bit 49 X Bit 0 C0 LSB Bit 8 X/D0 LSB Bit 16 D8/S0 LSB Bit 24 S8 LSB Bit 32 E0 LSB Bit 40 E8 LSB Bit 48 X
Bit 2 C2 Bit 10 X/D2 Bit 18 D10/S2 Bit 26 S10 Bit 34 E2 Bit 42 E10 Bit 50 X
Note:
Majority of commands are two-byte commands. The DEV_ID, RD_STATUS and WR_APC nd rd command are three-byte, in which the 2 and 3 bytes are data for WR_APC. The, RD_APC and Read pointer commands are four-byte. However, SET commands are seven-byte with Start address <S10:S0> and End address <E10:E0> and the rest address bits are reserved for future use (recommend 0). Address count starts at address 0x000, which is the start location of the first Sound Effect. Address locations 0x000-0x00F inclusively are reserved equally for 4 sound effects. Address 0x010 is the first address of non-reserved storage. For minimum storage resolution, please refer to Section 6.2.
10.2.3 MISO Data Format Data is clocked out of the Master In Slave Out pin of ISD1700 device on the falling edge of the SCLK signal, with LSB first. MISO returns the status generated by the last command and current row address <A10:A0> in the first two bytes for all operations. The commands RD_STATUS, DEVID, RD_PLAY_PNTR, RD_REC_PNTR and RD_APC provide additional information in the subsequent bytes (see below sections for more details). The sequence of MISO is shown in the table below.
1 Byte : Status Register 0 (Low Byte) Bit 1 Memory Full Bit 9 A4 Bit 17 D1/ Memory Full Bit 25 D9 / A4 Bit 33 Memory Full Bit 41 A4 Bit 2 Power Up 2
nd
st
MSB Bit 6 A1 Bit 14 A9 Bit 22 D6 / A1 Bit 30 D14 / A9 Bit 39 A1 Bit 46 A9 Bit 54 A1 Bit 7 A2 MSB Bit 15 A10 MSB Bit 23 D7 / A2 MSB Bit 31 D15 / A10 MSB Bit 39 A2 MSB Bit 47 A10 MSB Bit 55 A2
Bit 3 EOM Bit 11 A6 Bit 19 D3 / EOM Bit 27 D11 / A6 Bit 35 EOM Bit 43 A6 Bit 51 EOM
Bit 4 Interrupt Bit 12 A7 Bit 20 D4 / Interrupt Bit 28 D12 / A7 Bit 36 Interrupt Bit 44 A7 Bit 52 Interrupt
Bit 10 A5
rd
The status bits of the 1 byte provide important information on the result of the previous command sent. In particular, bit 0 (command error bit) indicates whether the chip is able to process the previous command or not. The address bits <A10:A0> represent the address location. The contents of the Data Bytes 1 & 2 are depended upon the previous th th th command. The 5 , 6 and 7 bytes are the repeat of SR0 status.
SPI Format
SS
SCLK
LSB MSB C1 C2 C3 C4 C5 C6 C7 D0 D1 D2 D3 Dv Dx Dy Dz
MOSI
C0
MISO
LSB B0
where Cn & Dn represent input data bit of MOSI, while Bn are output data bit. The initial condition of the SPI inputs to the ISD1700 should be: o o o
SS = High
10.3 SPI COMMAND OVERVIEW The SPI commands offer greater control over the device than that in standalone mode. There are several types of commands: Priority commands: o Accepted at any time and do not require state machine intervention. o PU, STOP, PD, RD_STATUS, CLR_INT, DEVID, RESET Circular memory commands: o Execute operations similar to in Standalone mode. o PLAY, REC, FWD, ERASE, G_ERASE, RD_REC_PTR, RD_PLAY_PTR Analog configuration commands: o Enable/disable various configuration paths, load/write APC and NVCFG registers, etc. o RD_APC, WR_APC, WR_NVCFG, LD_NVCFG, CHK_MEM, Direct memory access commands: o Execute operations with start and end addresses. o SET_ERASE, SET_REC, SET_PLAY
A SPI command always consists of a command byte. The command byte has one special purpose bit, bit 4 (LED). This bit controls the operation of the LED output. If the user wishes to enable the operation of the LED, all opcodes should have this bit set to 1.
In SPI mode, the memory location is fully accessible via row address. The microcontroller (C) can access any rows including the reserved Sound Effect rows (0x000-0x00F). The SET_PLAY, SET_REC, and SET_ERASE commands require a specified start address and end address. If start address and end address are the same, ISD1700 will perform the operation on that row only. The SET_ERASE operation erases all rows specified by start address and end address inclusively. The SET_REC operation begins recording from start address and ends recording at end address, also writes an EOM marker at the end address. The SET_PLAY operation plays back message from start address and stops at end address. Additionally, SET_PLAY, SET_REC, and SET_ERASE commands have a one deep FIFO buffer to offer seamless transitions from one block of memory to the next. This deep FIFO buffer is only valid for same type of SET commands, i.e. SET_PLAY followed by SET_ERASE will not utilize the buffer and a command error will be generated. The RDY bit in Status Register 1 will indicate when the chip is ready to accept the second command. Also, interrupt will be issued when the operation is completed. For example, if two consecutive SET-PLAY commands with two different pairs of addresses are sent correctly, then the buffer is full. After completing playback of the first message st and the 1 SET_PLAY operation encounters an EOM, it will ignore the normal action for EOM, i.e. nd stop playback. Instead the device continues to execute the 2 SET_PLAY command. As a result, the chip will playback the second message. This action will minimize any potential dead time between two recorded messages and allow the device to concatenate two individual messages smoothly. If circular memory architecture is satisfied, one can use PLAY, REC, FWD, RESET, ERASE and G_ERASE commands, which will function similarly as the REC , PLAY , FWD , RESET , ERASE and global-erase in standalone mode, respectively. These commands will ensure that memory organization remain compatible with standalone operations. However, sound effects will not be activated like in standalone mode. If one wishes to switch between SPI and standalone modes, care must be taken in using SET_REC and SET_ERASE to follow the circular memory architecture.
FROM
SPI
MODE TO
STANDALONE
While doing so, the following precautions have to be taken into account due to the circular memory architecture. First, the arrangement of messages created in SPI mode must match the circular memory structure. Second, only one empty slot is allowed inside the memory array. Third, the device must be Reset either before or after exiting the SPI mode, prior to any standalone functions being performed. Failure to do so will cause malfunctioning in standalone mode. As a result, LED will flash seven times. When happened, restoring circular memory architecture must be required.
10.5 ISD1700 DEVICE REGISTERS There are several registers returning the internal state of the ISD1700 device. The following describes each and its access mode. 10.5.1 Status Register 0 (SR0) SR0 is a two bytes data returning from MISO, which includes 5 status bits (D4:D0) and 11 address bits (A10:A0).
SR0
Byte #1 Byte #2 Bit # : Name : Bit # : Name : Description: Access
Device status register Every SPI command returns SR0 as first two bytes in MISO
Description Current row address bit 2 Current row address bit 1 Current row address bit 0 This bit is set to 1 when current operation is done. It can be cleared by CLR_INT command. This bit is set to 1 when an EOM is detected. It can be cleared by CLR_INT command. This bit is set to 1 when the device is powered up and operating in SPI mode. This bit, when set to 1, indicates memory array is full. That means the device cannot record any new messages unless old messages are deleted. This bit is only valid when user follows push button format to program and erase the array. This bit indicates the previous SPI command is invalid when is set to 1, if: C sends less than 5 bytes of row address, SPI command is decoded but ignored. Current row address bit 10 Current row address bit 9 Current row address bit 8 Current row address bit 7 Current row address bit 6 Current row address bit 5 Current row address bit 4 Current row address bit 3
CMD_ERR
15 14 13 12 11 10 9 8
A10 A9 A8 A7 A6 A5 A4 A3
Device secondary status register RD_STATUS command. <D7:D0> is the third byte of MISO
Table 10.4
SR1 Bit 7 6 5 4 3 2 1 0 Name SE1 SE2 SE3 SE4 REC PLAY ERASE RDY
Table 10.5
DEVICEID Bits <7:3>
Name CHIPID
Description
DDDDD
76543 11100 11101 11110 11000 11001 11010 10100 10101 10110 10000
Device ISD17240 ISD17210 ISD17180 ISD17150 ISD17120 ISD1790 ISD1760 ISD1750 ISD1740 ISD1730
<2:0>
Reserved
Reserved
Data Byte1
Description
0x00 0x00 0x00 0x00 0x00 0x00 Stop the current operation Reset the device Clear interrupt and EOM bit Returns status bits & current row st counter in first 1 2 bytes and rd operating status in 3 byte 0x00 Returns status bits & current row st counter in 1 2 bytes and playback rd th pointer in 3 & 4 bytes Power down the device 0x00 0x00 Returns status bits & current row st counter in 1 2 bytes and Record rd th pointer in 3 & 4 bytes Read the device ID register. Play from current location without LED action until EOM or STOP command received Record from current location without LED action until end of memory or STOP command received Erase current message to EOM location Erase all messages (not include Sound Effects)
RD_PLAY_PTR
0x06
0x00
0x00
PD RD_REC_PTR
0x07 0x08
0x00 0x00
DEVID PLAY
0x09 0x40
0x00 0x00
0x00
REC
0x41
0x00
ERASE G_ERASE
0x42 0x43
0x00 0x00
Instructions
[1]
Data Byte1
Description
RD_APC
0x00
Returns status bits & current row st counter in first 1 2 bytes and the rd th contents of APC register in 3 & 4 bytes. Write the data <D11:D0> into the APC register with volume setting from VOL pin
WR_APC1
0x45
<D7:D0>
<xxxx D11:D8>
WR_APC2
0x65
<D7:D0>
<xxxx D11:D8>
Write the data <D11:D0> into the APC register with volume setting from bits <D2:D0> Write the contents of APC to NVCFG Load contents of NVCFG to APC Register Forward playback pointer to start address of next message. Forward will be ignored during operating, except Play Check circular memory Enable/disable external clock mode
0x00 0x00 0x00 <S7:S0> <xxxxx S10:S8> <xxxxx S10:S8> <xxxxx S10:S8>
<xxxx xxxx Play from start address <S10:S0> to xxxxxE10:E0> end address <E10:E0> or stop at EOM, depending on the D11 of APC <xxxx xxxx Record from start address <S10-S0> xxxxxE10:E0> to end address <E10:E0> <xxxx xxxx Erase from start address <S10:S0> to xxxxxE10:E0> end address <E10:E0>
0x81 0x82
0x00 0x00
<S7:S0> <S7:S0>
Set initial SPI condition as listed in Section 10.2 before any SPI command is sent. Bit C4 (LED) must be set to 1 if LED indication is required. During the active state of LED output, no new command will be accepted. For xxx, recommend to use 000
[3]
Before starting to write the program code, one has to fully understand the definition of each command and how to implement each of them correctly. If not, you may end up to spend lots of time and efforts in debugging the program code. The following several sections illustrate exactly how the communication sequence of each SPI command should be. Bear in mind that the first bit of each input data byte shifting into the MOSI must be LSB, whereas the first bit of data byte coming out from the MISO is LSB. Also, care must be provided to fulfill the initial conditions on the SS , SCLK and MOSI inputs (as shown in Section 10.2). If wrong format is sent, then the device may not response at all or may respond strangely. Also, not every command will generate an interrupt feedback signal to the host in responding to the operation requested. Thus, precautions must be well considered to ensure that the device is ready to accept a new instruction. Otherwise, the instruction sent will be ignored.
11.1 SPI PRIORITY COMMANDS This class of SPI commands will always be accepted by the ISD1700. They control power up and down of the device, interrogating the status of the device and clearing interrupt requests. 11.1.1 PU (0x01) Power Up
SS SCLK MOSI
LSB MSB LSB B2 B3 B4 B5 B6 B7
Status Register 0 : Bytes #1 & #2
10
11
12
13
14
15
Command (01h)
MISO
B0 B1
PU Byte Sequence: Description: State before Execution State after Execution Registers Affected
0x01
Interrupt: 0x00
No
This command wakes up the ISD1700 device and enables it into the idle state. Upon executing this command, PU bit of SR0 and RDY bit of SR1 are set to 1. This command does not generate an interrupt. Once in SPI mode, the input from FT pin is ignored and its function is replaced by Bit 6 of the APC register. SPI mode is exited via a PD (power down) command.
10
11
12
13
14
15
Command (02h)
MISO
B0 B1
STOP Byte Sequence: Description: State before Execution State after Execution Registers Affected
0x02
Interrupt: 0x00
Yes
Stop the current operation REC, PLAY, SET_PLAY, SET_REC Idle/FT SR0: INT bit, SR1: RDY/PLAY/REC bits
This command stops the current operation and returns the device back to the state prior to the operation. This command is only valid for the PLAY, REC, SET_PLAY and SET_REC operations. Upon completion, an interrupt is generated. The CMD_ERR bit of SR0 is set when the STOP command is sent during ERASE, G_ERASE and SET_ERASE operations. As STOP is sent while the device is idle, no action is taken and no interrupt is generated. 11.1.3 RESET (0x03)
SS SCLK MOSI
LSB MSB LSB B2 B3 B4 B5 B6 B7 B8
Status Register 0 : Bytes #1 & #2
10
11
12
13
14
15
Command (03h)
MISO
B0 B1
0x03
Interrupt: 0x00
No
This command stops the current operation, if any, puts the device back to power down state, and clears the status of interrupt & EOM bits. As a result, all interrupt & EOM bits are cleared and INT is released. 11.1.4 CLR_INT(0x04)
SS SCLK MOSI MISO
LSB B0 B1 B2 MSB LSB B3 B4 B5 B6 B7 B8 MSB B9 B10 B11 B12 B13 B14 B15 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
Command (04h)
Data Byte 1
CLR_INT Byte Sequence: Description: State before Execution State after Execution Registers Affected
0x04
Interrupt: 0x00
No
Does not affect state, clears the INT bit and INT pin. SR0: INT bit, EOM bit
The Clear Interrupt command reads the status of the device and clears the status of interrupt & EOM bits. As a result, all interrupt & EOM bits are cleared and INT is released. 11.1.5 RD_STATUS (0x05)
SS
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
SCLK
Command (05h) Data Byte 1 Data Byte 2
MOSI
LSB MSB LSB B1 B2 B3 B4 B5 B6 B7 B8 MSB LSB MSB
MISO RD_STATUS
B0
B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23
Status Register 1
Opcode:
0x05
0x00
0x00
Interrupt:
No
Byte Sequence: Description: State before Execution State after Execution Registers Affected
0x05 SR0
0x00
0x00 SR1
The Read Status command reads the status of the device. This command has three bytes. See Table 10.3 and Table 10.4 for description of status register bits.
1st B yte S tatus R e g ister 0 Sta tu s B its Cu rre nt Ro w Ad d re s s Bits 2nd B yte 3rd B yte S tatus R e g ister 1 Status B its
Fu ll PU CM D _E R R
RD Y
PL A Y
SE 0 SE 1
SE 2 SE 3
ER A S E
REC
Command (07h)
Data Byte 1
PD Byte Sequence: Description: State before Execution State after Execution Registers Affected
0x07
Interrupt: 0x00
No
Power down the device and enter into standby mode Any. If sent during a REC, PLAY or ERASE operation, device will finish operation before powering down. PD SR0: PU bit
This command places the ISD1700 into power-down mode and also enable standalone mode. If command is sent during an active play/record/erase operation, the device will first finish the current operation then power down. Upon completion, the device generates an interrupt. While exiting SPI mode, the INT /RDY pin status switches from INT to RDY state. 11.1.7 DEVID (0x09) Read Device ID
SS
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
SCLK
Command (09h) Data Byte 1 Data Byte 2
MOSI
LSB MSB LSB B1 B2 B3 B4 B5 B6 B7 B8 MSB LSB MSB
MISO
B0
B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23
Device ID
DEVID Byte Sequence: Description: State before Execution State after Execution Registers Affected
0x09
Interrupt: 0x00
No 0x00 DEVICEID
Read the DEVICEID register to identify the device family Does not affect state. None
The Read Device ID command reads the ID register and returns the device name in the third byte of MISO to identify which device is present. See Table 10.5 for a description of DEVICEID register bits.
11.2 CIRCULAR MEMORY COMMANDS A circular memory command performs a simple typical operation similar to the related function as in standalone mode except it does not automatically playback sound effects (SE) for audio feedback of the operation. So if sound effects are required to mimic the standalone operations, separate commands are needed to perform the features. These commands need to comply with the circular memory architecture. Before these commands are executed, the ISD1700 checks the memory structure first. If it does not match the circular memory architecture. then CMD_ERR bit in Status Register 0 (SR0) will be set to one and command will not execute. In addition to the push-button similar commands, commands to read the record and playback pointers as well as to check whether current memory structure matches the circular memory architecture are available, thus allow the SPI host to track the locations of the recorded messages for its own message management.
10
11
12
13
14
15
Command (40h)
MISO
B0 B1
PLAY Byte Sequence: Description: State before Execution State after Execution Registers Affected
0x40
Interrupt: 0x00
Yes
The PLAY command starts playback operation from current message and stops when it reaches EOM or receives STOP command. During playback, the device only responds to STOP, RESET, CLR_INT, RD_STATUS and PD commands. The CMD_ERR of SR0 is set when other commands are sent. Both RDY and PLAY bits of SR1 are Low during PLAY. 11.2.2 REC (0x41)
SS SCLK MOSI
LSB MSB LSB B2 B3 B4 B5 B6 B7
Status Register 0 : Bytes #1 & #2
10
11
12
13
14
15
Command (41h)
MISO
B0 B1
0x41
Interrupt: 0x00
Yes
The REC command starts record operation from current REC_PTR and stops when it receives STOP command or memory array is full. In record mode, the device only responds to STOP, RESET, CLR_INT, RD_STATUS and PD commands. The CMD_ERR bit of SR0 is set while other commands are sent. Both RDY and REC bits of SR1 are Low during recording. Power supply must be remained during the entire operation. 11.2.3 ERASE (0x42)
SS SCLK MOSI
LSB MSB LSB B2 B3 B4 B5 B6 B7 B8
Status Register 0 : Bytes #1 & #2
10
11
12
13
14
15
Command (42h)
MISO
B0 B1
ERASE Byte Sequence: Description: State before Execution State after Execution Registers Affected
0x42
Interrupt: 0x00
Yes
Device will delete the message from current message if at first or last message Idle Idle SR0, SR1: ERASE & RDY bits
The ERASE command erases the current message row by row when it is either the first or the last one. It stops when it reaches EOM. In erase mode, the device only responds to RESET, CLR_INT, RD_STATUS and PD commands. The CMD_ERR bit of SR0 is set while other commands are sent or the current message is neither the first nor the last message. Both RDY and ERASE bits of SR1 are Low during erase. Power supply must be remained during the entire operation.
10
11
12
13
14
15
Command (43h)
Data Byte 1
MISO
B0 B1
B2 B3 B4
B5 B6
B7
G_ERASE Byte Sequence: Description: State before Execution State after Execution Registers Affected
0x43
Interrupt 0x00
Yes
The G_ERASE command deletes all messages within the entire memory array, except the SE portion (rows 0x000-0x00F), regardless the location of the PLAY_PTR. In the G_ERASE mode, the device only responds to RESET, CLR_INT, RD_STATUS and PD commands. The CMD_ERR of SR0 is set when other commands are sent. Both the RDY and ERASE bits of SR1 are Low during erase process. 11.2.5 FWD (0x48)
SS SCLK MOSI
LSB MSB LSB MSB
10
11
12
13
14
15
Command (48h)
Data Byte 1
MISO
B0 B1
B2 B3 B4
B5 B6
B7
0x48
Interrupt 0x00
Yes
This command enables the PLAY_PTR to jump from current address to the start address of next message. Unlike the FWD in standalone mode, FWD doesnt interrupt a current playback operation and can only be issued in the SPI idle state. To emulate a FWD during playback in standalone mode, the STOP command must first be issued, then followed by FWD and PLAY commands. To determine the location of the PLAY_PTR, the RD_PLAY_PTR command can be used. 11.2.6 CHK_MEM (0x49) Check Circular Memory
SS SCLK MOSI
LSB MSB LSB MSB
10
11
12
13
14
15
Command (49h)
Data Byte 1
MISO
B0 B1
B2 B3 B4
B5 B6
B7
CHK_MEM Byte Sequence: Description: State before Execution State after Execution Registers Affected
0x49
Interrupt 0x00
Yes
The CHK_MEM command enables the device to check whether the arrangement of the messages conforms to circular memory architecture under standalone condition. The device must be powered up and in idle state for this command to operate. When existing memory structure fails circular memory check, the CMD_ERR of SR0 is set. Upon the successful completion, the record and playback pointers are initialized, i.e. the playback pointer points to the last message and the record pointer points to the first available memory row. The read pointer commands can now be used to determine the positions of both pointers. Also with the FWD command applied, the start address of the subsequent messages can be located.
SCLK
Command (06h) Data Byte 1 Data Byte 2 & Byte 3
MOSI
LSB MSB LSB B1 B2 B3 B4 B5 B6 B7 B8 MSB LSB B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 MSB B30 B31
MISO
B0
RD_PLAY_PTR Byte Sequence: Description: State before Execution State after Execution Registers Affected
0x06 SR0
0x00
Interrupt 0x00
0x06
PP<7:0>
Read the current position of the PLAY_PTR PP<10:0>. After CHK_MEM or idle Idle None
This command reads out the playback pointer address, where a push-button compatible playback or PLAY starts from. Prior sending this command, ensure circular memory architecture is satisfied by performing CHK_MEM. Otherwise, invalid data is obtained. 11.2.8 RD_REC_PTR (0x08)
SS
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 29 30 31
SCLK
Command (08h) Data Byte 1 Data Byte 2 & Byte 3
MOSI
LSB MSB LSB B1 B2 B3 B4 B5 B6 B7 B8 MSB LSB B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20
Record Pointer <RP10:RP0>
MISO
B0
RD_REC_PTR Byte Sequence: Description: State before Execution State after Execution Registers Affected
0x08 SR0
0x00
Interrupt 0x00
0x08
RP<7:0>
Read the current position of the REC_PTR RP<10:0>. After CHK_MEM or idle Idle None
This command reads out the record pointer address, where a push-button compatible record or REC starts from. Prior sending this command, ensure circular memory architecture is satisfied by performing CHK_MEM. Otherwise, invalid data is obtained.
11.3 ANALOG CONFIGURATION COMMANDS These kind of commands allow the SPI host to configure the analog properties of the device. 11.3.1 RD_APC (0x44) Read APC Register
SS
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 29 30 31
SCLK
Command (44h) Data Byte 1 Data Byte 2 & Byte 3
MOSI
LSB MSB LSB B1 B2 B3 B4 B5 B6 B7 B8 MSB LSB B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20
APC Register <A11:A0>
MISO
B0
RD_APC Byte Sequence: Description: State before Execution State after Execution Registers Affected
0x44 SR0
0x00 0x00
0x00 0x00
0x00
Interrupt 0x00
No
0x44
APC<7:0>
xxxxx APC<11:8>
This command reads out the contents of APC register. After sending SR0, the device will send out the APC register data. This command has 4 bytes. 11.3.2 WR_APC1 (0x45) Load APC Register
SS
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
SCLK
Command (45h) Data Byte 1 Data Byte 2 X X X X MSB
MOSI
LSB
MISO
B0
B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23
Status Register 0 : Byte #1
WR_APC1 Byte Sequence: Description: State before Execution State after Execution Registers Affected
<D7:D0> <D7:D0>
Interrupt
No
Load the data <D11:D0> to the APC register with volume setting from VOL pin Idle Idle APC
The WR_APC1 command loads the desired data into the APC Register. There are three bytes involved: the first byte is command code, the second byte has data for APC<7:0> and the third byte contains APC<11:8>. The five most significant bits of the third byte are ignored. In this command, volume setting is from VOL pin, rather than the VOL bits <D2:D0>. Care must be taken as changing the volume level if the device is executing an active command. Otherwise unintended transients may occur on the analog path. 11.3.3 WR_APC2 (0x65) Load APC Register
SS
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
SCLK
Command (65h) Data Byte 1 D0 D1 D2 D3 D4 D5 D6 D7 D8 LSB MSB LSB B1 B2 B3 B4 B5 B6 B7 B8 MSB LSB Data Byte 2 D9 D10 D11 X X X X MSB
MOSI MISO
B0
B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23
Status Register 0 : Byte #1
WR_APC2 Byte Sequence: Description: State before Execution State after Execution Registers Affected
<D7:D0> <D7:D0>
Interrupt
No
Load the data <D11:D0> to the APC register with volume setting from <D2:D0> bits Idle Idle APC
The WR_APC2 command loads the desired data into the APC Register. There are three bytes involved: the first byte is command code, the second byte has data for APC<7:0> and the third byte contains APC<11:8>. The five most significant bits of the third byte are ignored. In this command, volume setting is from the bits <D2:D0>, rather than VOL pin. Care must be taken as changing the volume level if the device is executing an active command. Otherwise unintended transients may occur on the analog path.
10
11
12
13
14
15
Command (46h)
Data Byte 1
MISO
B0 B1
B2 B3 B4
B5 B6
B7
WR_NVCFG Byte Sequence: Description: State before Execution State after Execution Registers Affected
0x46
Interrupt 0x00
No
Write the current content of the APC register into the NVCFG register
This command writes the data of the APC register into the NVCFG register. This value is loaded from NVCFG register to the APC register after a power-on condition or RESET. The CMD_ERR bit of SR0 is set if ISD1700 is not in idle state when this command is sent. 11.3.5 LD_NVCFG (0x47) Load APC register from Non-Volatile Memory
SS SCLK MOSI
LSB MSB LSB MSB
10
11
12
13
14
15
Command (47h)
Data Byte 1
MISO
B0 B1
B2 B3 B4
B5 B6
B7
LD_NVCFG Byte Sequence: Description: State before Execution State after Execution Registers Affected
0x47
Interrupt 0x00
No
This command loads the contents of the NVCFG register into the APC register. The CMD_ERR bit of SR0 is set if ISD1700 is not in idle state when this command is sent.
11.4 DIRECT MEMORY ACCESS COMMANDS These types of commands allow the SPI host to perform random access to any memory location by specifying the start and the end addresses. For the record and playback operations, the next pair of addresses can be preloaded. As a result, the subsequent operation jumps to the next start address seamlessly, when the operation on the first pair of addresses is finished. All these commands require a START_ADDRESS and an END_ADDRESS. They operate from START_ADDRESS to END_ADDRESS inclusively. Because the memory is configured as a circular fashion, an END_ADDRESS smaller than START_ADDRESS is allowed. In this case, the ISD1700 will wrap around from the last row of the memory to the address 0x010 (excluding the SEs) and continue until END_ADDRESS is reached. If an END_ADDRESS is smaller than START_ADDRESS and an END_ADDRESS is also smaller than 0x10, then it will cause the device to loop endlessly, as the END_ADDRESS never matches the current address. Thus, precautions must be paid to address to the beginning of the memory. Also, care must be taken in accessing the SE rows (0x000-0x00F) and SEs should be handled independently. 11.4.1 SET PLAY (0x80)
SS SCLK MOSI
LSB MSB LSB B1 B2 B3 B4 B5 B6 B7 B8 0 20 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 21 22 23 24 25 26 27 28 29 30 31
Command (80h)
Data Byte 1
S0 MSB LSB S1 S2 S3 S4
MISO
B0
B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23 B24 B25 B26 B27 B28 B29 B30 B31 Status Register 0 : Bytes #1 & #2
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
B32 B33 B34 B35 B36 B37 B38 B39 B40 B41 B42 B43 B44 B45 B46 B47 B48 B49 B50 B51 B52 B53 B54 B55 Status Register 0 : Bytes #1 & #2 Status Register 0 : Byte #1
0x00 0x00
Start a playback operation from start address <S10:S0> to end address <E10:E0> inclusive or stop at EOM, depending on the D11 of APC. Idle Idle SR0, SR1:PLAY, RDY
The SET_PLAY command initiates playback operation from start address <S10:S0> and stops at end address <E10:E0>. In SET_PLAY mode, the device only responds to SET_PLAY, STOP, RESET, CLR_INT, RD_STATUS and PD commands. The CMD_ERR bit of SR0 is set if other commands are sent while in this mode. The RDY bit of SR1 is Low until the device has latched the addresses and begun the playback operation. If no further command is sent, the device will play until the end address <E10:E0>. Once the RDY bit of SR1 returns to High, another SET_PLAY can be sent immediately. By doing so, a second pair of START_ address and END_address is loaded into a FIFO buffer. So when the device reaches the EOM from the first end address, it doesnt stop. Instead it automatically jumps to the second start address to continue to playback operation. The purpose of executing two consecutive SET_PLAY commands is to minimize any potential dead time between two recorded messages and allow the device to concatenate two individual messages smoothly. 11.4.2 SET_REC (0x81)
SS SCLK MOSI
LSB MSB LSB B1 B2 B3 B4 B5 B6 B7 B8 0 20 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 21 22 23 24 25 26 27 28 29 30 31
Command (81h)
Data Byte 1
S0 MSB LSB S1 S2 S3 S4
MISO
B0
B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23 B24 B25 B26 B27 B28 B29 B30 B31 Status Register 0 : Bytes #1 & #2
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
B32 B33 B34 B35 B36 B37 B38 B39 B40 B41 B42 B43 B44 B45 B46 B47 B48 B49 B50 B51 B52 B53 B54 B55 Status Register 0 : Bytes #1 & #2 Status Register 0 : Byte #1
0x00 0x00
Start a record operation from start address <S10:S0> to end address <E10:E0> inclusive. Idle Idle SR0, SR1:REC, RDY
The SET_REC command records from start address <S10:S0> and stops at end address <E10:E0>. In SET_REC mode, the device only responds to SET_REC, STOP, RESET,
CLR_INT, RD_STATUS and PD commands. The CMD_ERR bit of SR0 is set if other commands are sent while in this mode. The RDY bit of SR1 is Low until the device has latched addresses and begun recording. If no further command is sent, the device will record until end address <E10:E0> and write an EOM marker there. Once the RDY bit of SR1 returns to High, another SET_REC command can be sent. By doing so, a second pair of START_ address and END_address is loaded into a FIFO buffer. So when the device reaches the first end address, no EOM is written there and it automatically jumps to the second start address, then continue the recording operation. During the record process, power supply cannot be interrupted. Otherwise, it will cause the device malfunctioned. 11.4.3 SET_ERASE (0x82)
SS SCLK MOSI
LSB MSB LSB B1 B2 B3 B4 B5 B6 B7 B8 0 20 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 21 22 23 24 25 26 27 28 29 30 31
Command (82h)
Data Byte 1
S0 MSB LSB S1 S2 S3 S4
MISO
B0
B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23 B24 B25 B26 B27 B28 B29 B30 B31 Status Register 0 : Bytes #1 & #2
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
B32 B33 B34 B35 B36 B37 B38 B39 B40 B41 B42 B43 B44 B45 B46 B47 B48 B49 B50 B51 B52 B53 B54 B55 Status Register 0 : Bytes #1 & #2 Status Register 0 : Byte #1
0x00 0x00
Start an erase operation from start address <S10:S0> to end address <E10:E0> inclusive. Idle Idle SR0, SR1:ERASE, RDY
The SET_ERASE command erases rows from start address <S10:S0> to end address <E10:E0> inclusively. In this mode, the device will only respond to RESET, CLR_INT, RD_STATUS and PD commands. The CMD_ERR bit of SR0 is set when other commands are sent. The RDY bit of SR1 is Low until erasure is completed and an interrupt is generated. During the erase process, power supply cannot be interrupted. Otherwise, it will cause the device malfunctioned.
11.5 ADDITIONAL COMMAND The additional command enhances the functionality and performance of the device in order to fulfill extra features and requirements that the designers may wish. 11.5.1 EXTCLK (0x4A)
SS SCLK MOSI
LSB MSB LSB MSB
10
11
12
13
14
15
Command (4Ah)
Data Byte 1
MISO
B0 B1
B2 B3 B4
B5 B6
B7
EXTCLK Byte Sequence: Description: State before Execution State after Execution Registers Affected
0x4A 0x4A
Interrupt
No
The EXTCLK command toggles the enable and disable of the external clock (XCLK) mode on the device. When XCLK mode is activated, the internal oscillator of the device is disabled. Instead, an external clock is required to apply to the Rosc pin and the external resistor at Rosc pin must be removed. When XCLK mode is disabled, then the external clock signal must be disconnected from Rosc pin and an external resistor must be connected back, so that the device runs from its internal clock accordingly. This mode is very useful for synchronization of the I1700 device with an external component, such as microcontroller, when precision timing is essential. An active XCLK state can also be reset by RESET command or RESET pin. Hence, the device will operate via its internal oscillator, provided that the external resistor is hooked up to the Rosc pin. The frequencies of the required external clock with respect to the various sampling frequencies are listed in the below table, but duty cycle is not important since it will be taken care internally by the device.
Sampling Freq. [kHz] External Clock Freq. [MHz] 12 3.072 8 2.048 6.4 1.638 5.3 1.356 4 1.024
11.6 GENERAL GUIDELINES FOR WRITING PROGRAM CODE Besides realizing the basic functions under Standalone mode (if not, one should study the contents of Section 8), the software engineers must also fully understand the definition of each SPI command and how to implement each of them correctly (if not, one should review and comprehend the contents from Section 10 through Section 11.5). Then the next move is how to link up the operating codes together and perfectly, so that the program runs smoothly. The following rules, but not limited to, should be applied. Rule #1: Is the command just sent being accepted and executed correctly? In order to validate this, one has to ensure that: (a) Is the device ready to accept the new instruction? Solution : Before any new instruction is sent, one can query the devices ready status and confirm that from either the RDY bit of SR1 or the RDY INT pin. (b) Is the prior command sent being accepted? Solution : One can check and confirm whether the CMD_ERR bit of SR0 is set (=1) or not after the instruction code is sent. All these can be achieved by utilizing the RD_STATUS command. Rule #2: After the newly instruction code is accepted and executed, one needs to know Does the operation function as expected? The LED indication associated with certain operations in Standalone mode is not automatically embedded in the SPI similar functions. Hence, enabling the LED feature (bit C4) on all the operations is a good habit because this will provide a direct visual illustration to the end user, such as LED on during recording or LED blinking during playback, if LED is connected appropriately, and etc. Rule #3: While an operation is in progress, one needs to know When the current operation completes. So that the next instruction code can be sent immediately to make the best use of the microcontrollers time and efficiency. This requires a feedback from ISD1700 device and can be achieved by monitoring the status change on either the INT bit of SR0 or the
RDY INT pin.
Rule #4: One must also be conscious about the characteristics of the interrupt. Once an interrupt is set, its status remains unaltered until it is cleared. The only way to clear an interrupt is to issue a CLR_INT command. In order to avoid any confusion on monitoring the interrupt status of consecutive instruction codes, one must immediately clear the interrupt set by the just-finished operation before the next instruction code is sent. Rule #5: As mentioned earlier, some commands (14 out of 24) have no interference on the interrupt status. These commands are: PU, PD, RESET, CLR_INT, RD_STATUS, DEV_ID, RD_APC, WR_APC1, WR_APC2, WR_NVCFG, LD_NVCFG, RD_PLAY_PTR, RD_REC_PTR, EXTCLK
Since most of these commands perform inquiries from the device or changing the internal setting within the device, some people may think the device would perform the task fairly quick. Thus, a common mistake will occur that two consecutive command codes are submitted without checking whether the device is ready to accept the next command (as
Rule #1) or inserting an appropriate delay between the codes. As a result, the 2 command will be ignored. Bear in mind that no matter how quick the related task in ISD1700 can be performed, but its speed is still slower than that of code transmission from microcontroller. Therefore, after any of these commands is issued, one need to monitor the status on either the RDY bit of SR1 or the RDY INT pin to guarantee that the device is in Ready mode prior to a new instruction being sent. Otherwise, the new instruction will be omitted. Nevertheless, some programmers may prefer to insert a delay between two instruction codes for simplicity, rather than to monitor the Ready status. If thats the case, one must insert a sufficient delay between the instruction codes. With a sufficient delay provided, one then can guarantee that the next instruction code will be successfully accepted after the execution on the current operation completes. Remember the frequency that the ISD1700 operates is pending upon an external resistor (typically, the common used ones have +/-5% or +/-10% accuracy for cost reason). Another precaution is that microcontrollers run code in sec, but the ISD1700 completes a task in msec. Since the time for ISD1700 to accomplish a task is a variable factor pending upon the type of task, sampling frequency and other external factors, one may need to do the trial and error experiments in order to search for an optimum number. For example, with 8kHz sampling frequency, one can use 100 msec as a starting point, then adjust back and forth to search for that number. Due to the uncontrollable external factors, the approach of utilizing delay is not recommended, unless additional buffer on the delay is factored in. Rule #6: Set initial SPI condition as listed in Section 10.2 before any SPI command is sent. Rule #7: To access the sound effects, one needs to use Set commands. The debounce time needed for certain operation in Standalone mode is not required in SPI mode. 11.7 EXAMPLES OF VARIOUS OPERATING SEQUENCES The following flow chart examples illustrate various generic approaches on certain types of operating sequences. The flow charts review the typical required steps among different kinds of operations. The objective is to ensure each desired operation is performed as expected without any omission. These examples merely serve as references for writing program codes and make no representation that they are guaranteed to be functional at any systems flawlessly. Its software engineers responsibility to debug their own program code faultlessly in their system designed according to the applications. The operating sequences on the ISD1700 devices are not limited to those as shown. The following example sequences are mainly to demonstrate: - Record, Stop and Playback sequence. - SetErase, SetRec and SetPlay sequence. - Wr_APC2, SetRec and SetPlay sequence. - Playback 3 messages as 1 message sequence. Once the programmers get familiar with the methodology, they can apply the similar techniques on the related SPI commands and generate their own sequences with respect to the applications required. These examples offer a number of advantages, ultimately resulting in less effort and resources spending on programming, providing a viable path for code development in an effective and efficient way.
nd
Send PU
Check CMD_ERR N
Send Record
*
W ait Record Duration
Send Stop
Monitor INT status for Com pletion
Clr_Int
*
Send Play
Monitor INT status for Com pletion
PD
Send PU
Y
Check CMD_ERR N
N Device Ready Y
Send SetErase
Monitor INT status for Com pletion
* *
PD
Send PU
Y
Check CMD_ERR N
Send SetRec
Monitor INT status for Com pletion
Clr_Int
*
Send SetPlay
Monitor INT status for Com pletion
PD
Send PU
Y
Check CMD_ERR N
N Device Ready Y
* *
Note: Utilizing 3 consecutive SetPlay on 3 individual messages as shown, then these 3 messages will be played back sequentially as one message with almost no dead silence between each message.
Clr_Int Clr_Int
Monitor INT status for Msg 3 Com pletion Check RDY bit
PD
12 TIMING DIAGRAMS
The following estimated timing diagrams are for basic operation and are not in proper scale. The LED and optional SE indications include automatically in certain operations under Standalone mode, but not under the SPI mode. 12.1 RECORD OPERATION
Tr
Tf
LED
Mic+/-, AnaIn
Tf
TER
TRD TRU
SE2
TRD
T Set1
LED
Mic+/-, AnaIn
12.2
PLAYBACK OPERATION
> T Deb
Tf
TRD
TCyc
Sp+, Sp-
> TDeb
Tf
TDeb
TRDT Set1
TCyc
Sp+, Sp-
12.3
ERASE OPERATION
> TDeb
Tf
TRD
TLS2
TSc2
>T Deb
Tf
TRD
TSE2
TRD TSc2
12.4
FORWARD OPERATION
Tr FW D TDeb RDY
> T Deb
Tf
TRD
TLS1 or T LS2
Tr FW D TDeb RDY
TDeb
Tf
TRD
TSE1 or TSE2
T RD
12.5
Tr ERASE T Deb RDY TSc1 TSc2 TGE1 or (TE + TLS2 or TSE2) 3x(T LS1 or TSE1) TGE2 LED TLS4 or T SE4
Tf
TRD
Sp+, SpNote: If SEs are recorded, then Sp+/- will have output.
Figure 12.9: Global Erase Operation with or without Sound Effects 12.6 RESET OPERATION
Tf
TSet2
LED
12.7
Tf
TRD
TCyc
1st Message
(If SE1 recorded)
2nd Message
Sp+, Sp-
Tf
T RD
LED
1st Message (If SE1 recorded) 2nd Message (If SE2 recorded) 1st Message
Sp+, Sp-
12.8
Tr ERASE T Deb RDY TSc1 LED TLErr TGE1 3x(T LS1 or TSE1) TGE2 TLS4 or T SE4
Tf
TRD
Sp+, SpNote: If SEs are recorded, then Sp+/- will have output.
Figure 12.13: Global Erase Operation to recover a broken circular memory architecture 12.9 PLAYBACK OPERATION WITH AUD OUTPUT
> T Deb
Tf
T RD
TCyc
TRD
AUD
Figure 12.14: Playback Operation with ramp up and ramp down effect at AUD output
TSSH
T SSmin
SS
TSSS TSCKlow
TSCKhi
SCLK
T DIS T DIH
MOSI
T PD
LSB
MSB TDF
MISO
(TRISTATE)
LSB
MSB
TYP
MAX
SS SS
Data in Setup Time Data in Hold Time Output Delay Output Delay to HighZ
SS
HIGH
SCLK High Time SCLK Low Time CLK Frequency Power-Up Delay Notes:
[1]
TPUD
Timing parameter given is based upon 8 kHz sampling freq and varied according to sampling freq.
[1]
Condition
Junction temperature Storage temperature range Voltage Applied to any pads Power supply voltage to ground potential 150 C
0 0
Value
-65 C to +150 C (VSS - 0.3V) to (VCC + 0.3V) -0.3V to +7.0V
0
[1]
Condition
Junction temperature Storage temperature range Voltage Applied to any pins Voltage applied to any pin (Input current limited to +/-20 mA) Power supply voltage to ground potential
[1]
Value
150 C -65 C to +150 C (VSS - 0.3V) to (VCC + 0.3V) (VSS 1.0V) to (VCC + 1.0V) -0.3V to +7.0V
0 0 0
Stresses above those listed may cause permanent damage to the device. Exposure to the absolute maximum ratings may affect device reliability. Functional operation is not implied at these conditions.
13.1
OPERATING CONDITIONS
OPERATING CONDITIONS (DIE) CONDITIONS VALUES 0C to +50C +2.4 V to +5.5 V 0V 0 V to 5.5 V (VSS 0.3 V) to (VCC +0.3 V)
Operating temperature range Supply voltage (VCC) Ground voltage (VSS) Input voltage (VCC)
[1] [1] [2]
OPERATING CONDITIONS (PACKAGED PARTS) CONDITIONS Operating temperature range (Case temperature) Supply voltage (VDD) Ground voltage (VSS) Input voltage (VDD)
[1] [1] [2]
VALUES -40C to +85C +2.4V to +5.5V 0V 0V to 5.5V (VSS 0.3V) to (VDD +0.3V)
[1] [2]
14 ELECTRICAL CHARACTERISTICS
14.1
DC PARAMETERS
SYMBOL VDD VIL VIH VOL VOH IDD_Record IDD_Playback IDD_Erase ISB IILPD1 IILPD2 RMIC+,RMICRAnaIn VIN1 VIN2 AMSP RSPK RAux Pout MIN 2.4 VSS-0.3 0.7xVDD VSS-0.3 0.7xVDD TYP
[1]
PARAMETER Supply Voltage Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage Record Current Playback Current Erase Current Standby Current Input Leakage Current Input Current Low Preamp Input Impedance AnaIn Input Impedance MIC Differential Input AnaIn Input Voltage Gain from MIC to SP+/Speaker Output Load AUX Output Load Speaker Output Power
1 1 -10
300 1 40
UNITS V V V V V mA mA mA A A A k k mV V dB k mW mW mW mW V
CONDITIONS
ImA[2] OL = 4.0 [2] IOH = -1.6 mA VDD = 5.5 V, No load, Sampling freq = 12 kHz VDD = 5.5 V, T=25C Force VDD Force VSS , others at Vcc Power-up AGC When active [5] Peak-to-Peak Peak-to-Peak VIN = 15~300 mV, AGC = 4.7 F, VCC = 2.4V~5.5V Across both Speaker pins When active VDD = 5.5 V 1Vp-p, VDD = 4.4 V 1 kHz sine wave at VDD= 3 V AnaIn. RSPK VDD= 2.4 V = 8 . RSPK = 8 (Speaker), Typical buzzer Peak-to-Peak When active VDD =4.5 V, REXT= 390 8 steps of 4dB each reference to output 15 mV p-p 1 kHz sine wave, Cmessage weighted
[3] [4]
Speaker Output Voltage AUX Output Swing AUX Output DC Level AUD Volume Output Total Harmonic Distortion
[1] [2] [3] [4] [5]
V V mA dB %
Notes:
Conditions: VCC = 4.5V, 8 kHz sampling frequency and TA = 25C, unless otherwise stated. LED output during Record operation. VCCA, VCCD and VCCP are connected together. VSSA, VSSP1, VSSP2 and VSSD are connected together.
CCD. Balanced input signal applied between MIC+ and MIC- as shown in the applications example. Single-ended MIC+ or MIC- input is recommended no more than 150 mV p-p.
14.2
AC PARAMETERS
SYMBOL FS TDur Tr Tf TDeb TRU TRD TSc1 TSc2 TER TLH TLS1 TLS2 TLS3 TLS4 TSE1 TSE2 TSE3 TSE4 TE TGE1 TGE2 TReset TSet1 TSet2 TLErr TCyc MIN 4 TYP
[1]
CHARACTERISTIC [2] Sampling Frequency [3] Duration Rising Time Falling Time Debounce Time Ramp Up Time Ramp Down Time Initial Scan Time after power is applied Initial Scan Time from PD state End Recording Time LED High Time LED Flash Time for SE1 LED Flash Time for SE2 LED Flash Time for SE3 LED Flash Time for SE4 SE1 Recorded Duration SE2 Recorded Duration SE3 Recorded Duration SE4 Recorded Duration Erase Time Global Erase Wait Time Global Erase Time RESET Pulse Settle Time Settle Time after Reset LED Error Time LED Cycle frequency
Notes:
[1] [2]
Sect. 6.1.2
192/FS 128/FS 128/FS DRN/8/FS DRN/16/FS 32/FS 0.5K/FS 3.5K/FS 7.5K/FS 11.5K/FS 15.5K/FS 4K/FS 4K/FS 4K/FS 4K/FS 10MRN/FS 20K/FS 34/FS 1 128/FS 64/FS 27.5K/FS 4
UNITS CONDITIONS [4] kHz sec nsec nsec msec [4] [6] msec msec [4] msec DRN= device row# msec msec msec sec sec sec sec sec sec sec sec sec sec sec sec msec msec msec Hz
After a PB operation is [4] run
[4] [4]
SE1 not recorded SE2 not recorded SE3 not recorded SE4 not recorded
[4] [5] [4] [5] [4] [5] [4] [5]
MRN=message row #
[4] [5]
[4]
All Fs
[4] [4] [4] [5]
[4]
Pending upon FS
Typical values: VCC = 4.5 V, FS = 8 kHz and @ TA = 25C, unless otherwise stated. Characterization data shows that sampling frequency resolution is 5 percent across temperature and voltage ranges. [3] Characterization data shows that duration resolution is 5 percent across temperature and voltage ranges. [4] Vcc=2.4 V~5.5V [5] K = 1024 [6] Debounce time is only applicable to operations in standalone mode and is not applicable to the related SPI commands.
* **
These capacitors may be needed in order to optimize for the best voice quality, which is also dependent upon the layout of the PCB. Depending on system requirements, they can be 10 F, 4.7 F or other values. Please refer to the applications notes or consult Winbond for layout advice. It is important to have a separate path for each ground and power back to the related terminals to minimize the noise. Also, the power supplies should be decoupled as close to the device as possible.
24 23 25 26 19 22
Reset
0.1 F
Vcc
1 0.1 F VCCD * VCCA VCCP ** V VCCA CCD **
Gnd
V SSD 28 VCCA 21
VCC 7 6 4.7 K 4.7 F 4.7 K 10 0.1 F 0.1 F 4.7 K Rosc *** 20 18 4.7 F *** At 8kHz sampling freq, Rosc = 80 K : Digital ground; 9 11 5 4
VSSA 8
ISD1700
VSSP1 16 0.1F
Speaker or Buzzer
VCC
Speaker
AUD
8050C
AUX
390
INT/RDY
27
0.1 F
: Analog ground;
24 23 25 26 19 22
Reset
0.1 F
RESET
1K D1 vAlert
LED
Vcc
V ** VCCD VCCP 0.1 F *
CCA
Gnd
**
7 6 5 4
VSSA 8
ISD1700
VCCP * 0.1 F *
VSSP1 16 0.1F
Speaker or Buzzer
VCC
Speaker
AUD
VCCD
8050C 390
INT/RDY
27
100 K Optional
AUX
0.1 F
Optional: based upon the applications : Digital ground; : Analog ground; : Ground for SP+; : Ground for SP-
24 23 25 26 19 22
Reset
RESET LED
2 1K D1 vAlert
0.1 F
Vcc
VCCD 0.1 F * VCCA 0.1 F VCCP * 0.1 F * * ** V VCCA CCD VCCP **
Gnd
VCCD 1 VSSD 28
7 6 To uC SPI 5 4
ISD1700
V SSP1 16 0.1F
SP+ SPAUD/AUX
Speaker or Buzzer
VCC
Speaker
AUD AUX
390
8050C
20 18
0.1 F
INT/RDY
4.7 F *** At 8kHz sampling freq, Rosc = 80 K : Digital ground; : Analog ground;
15.1
To ensure the highest quality of voice reproduction, it is important to follow good audio design practices in layout and power supply decoupling. See recommendations from below links or other Application Notes in our websites. Design Considerations for ISD1700 Family AN-CC1002 Design Considerations for ISD1700 Family Good Audio Design Practices http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf Single-Chip Board Layout Diagrams http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf
16 ORDERING INFORMATION
Product Number Descriptor Key
I17xxxxxxxxx
Product Name: I = ISD Product Series: 17 = 1700 Duration: 30 40 50 60 90 : 20 60 secs : 26 80 secs : 33 100 secs : 40 120 secs : 60 180 secs Package Type: X = E S P = = = Die Thin Small Outline Package (TSOP) Small Outline Integrated Circuit (SOIC) Package Plastic Dual Inline Package (PDIP) Special Features Field: Blank = None 01 = vAlert
Temperature: I = Industrial (-40C to +85C) Blank = Commercial Die (0C to +50C) Package (0C to +70C) Lead-Free: Y = Lead-Free
120 : 80 240 secs 150 : 100 300 secs 180 : 120 360 secs 210 : 140 420 secs 240 : 160 480 secs
When ordering ISD1700 devices, please refer to the above ordering scheme. Contact the local Winbond Sales Representatives for any questions and the availability.
For the latest product information, please contact the Winbond Sales/Rep or access Winbonds worldwide web site at http://www .winbond-usa.com
17 VERSION HISTORY
VERSION 0 DATE October 2006 Initial version DESCRIPTION
Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or sustain life. Furthermore, Winbond products are not intended for applications wherein failure of Winbond products could result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur. Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Winbond for any damages resulting from such improper use or sales. The contents of this document are provided only as a guide for the applications of Winbond products. Winbond makes no representation or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice. No license, whether express or implied, to any intellectual property or other right of Winbond or others is granted by this publication. Except as set forth in Winbond's Standard Terms and Conditions of Sale, Winbond assumes no liability whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual property. The contents of this document are provided AS IS, and Winbond assumes no liability whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual property. In no event, shall Winbond be liable for any damages whatsoever (including, without limitation, damages for loss of profits, business interruption, loss of information) arising out of the use of or inability to use the contents of this documents, even if Winbond has been advised of the possibility of such damages. Application examples and alternative uses of any integrated circuit contained in this publication are for illustration only and Winbond makes no representation or warranty that such applications shall be suitable for the use specified. The 100-year retention and 100K record cycle projections are based upon accelerated reliability tests, as published in the Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond. This product incorporates SuperFlash . This datasheet and any future addendum to this datasheet is(are) the complete and controlling ISD ChipCorder product specifications. In the event any inconsistencies exist between the information in this and other product documentation, or in the event that other product documentation contains information in addition to the information in this, the information contained herein supersedes and governs such other information in its entirety. This datasheet is subject to change without notice. Copyright 2005, Winbond Electronics Corporation. All rights reserved. ChipCorder and ISD are trademarks of Winbond Electronics Corporation. SuperFlash is the trademark of Silicon Storage Technology, Inc. All other trademarks are properties of their respective owners.