The SN54LS07 and SN74LS17 are

obsolete and are no longer supplied.

SN54LS07, SN74LS07, SN74LS17
HEX BUFFERS/DRIVERS
WITH OPENCOLLECTOR HIGHVOLTAGE OUTPUTS

SDLS021C MAY 1990 REVISED FEBRUARY 2004

1 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D Convert TTL Voltage Levels to MOS Levels
D High Sink-Current Capability
D Input Clamping Diodes Simplify System
Design
D Open-Collector Driver for Indicator Lamps
and Relays
description/ordering information
These hex buffers/drivers feature high-voltage
open-collector outputs to interface with high-level
circuits or for driving high-current loads. They are
also characterized for use as buffers for driving TTL inputs. The LS07 devices have a rated output voltage of
30 V, and the SN74LS17 has a rated output voltage of 15 V. The maximum sink current is 30 mA for the
SN54LS07 and 40 mA for the SN74LS07 and SN74LS17.
These circuits are compatible with most TTL families. Inputs are diode-clamped to minimize transmission-line
effects, which simplifies design. Typical power dissipation is 140 mW, and average propagation delay time is
12 ns.
ORDERING INFORMATION
T
A
PACKAGE

ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP N Tube SN74LS07N SN74LS07N
SOIC D
Tube SN74LS07D
LS07
0C to 70C
SOIC D
Tape and reel SN74LS07DR
LS07
0 C to 70 C
SOP NS Tape and reel SN74LS07NSR 74LS07
SSOP DB Tape and reel SN74LS07DBR LS07

Package drawings, standard packing quantities, thermal data, symbolization, and PCB
design guidelines are available at www.ti.com/sc/package.
logic diagram (positive logic)
1A
2A
3A
4A
5A
6A
1Y
2Y
3Y
4Y
5Y
6Y
1
3
5
9
11
13
2
4
6
8
10
12
Copyright 2004, Texas Instruments Incorporated

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1Y
2A
2Y
3A
3Y
GND
V
CC
6A
6Y
5A
5Y
4A
4Y
SN54LS07 . . . J PACKAGE
SN74LS07, SN74LS17 . . . D, DB, N, OR NS PACKAGE
(TOP VIEW)
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MILPRF38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
The SN54LS07 and SN74LS17 are
obsolete and are no longer supplied.
SN54LS07, SN74LS07, SN74LS17
HEX BUFFERS/DRIVERS
WITH OPENCOLLECTOR HIGHVOLTAGE OUTPUTS

SDLS021C MAY 1990 REVISED FEBRUARY 2004

2 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
schematic (each gate)
Input
V
CC
Output
GND
9 k
1 k
2 k
2 k
5 k
Resistor values shown are nominal.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

Supply voltage, V
CC
7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, V
I
(see Note 1) 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage, V
O
(see Notes 1 and 2): SN54LS07, SN74LS07 30 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74LS17 15 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
JA
(see Note 3): D package 86C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DB package 96C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 80C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 76C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range,T
stg
65C to 150C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to GND.
2. This is the maximum voltage that should be applied to any output when it is in the off state.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
The SN54LS07 and SN74LS17 are
obsolete and are no longer supplied.
SN54LS07, SN74LS07, SN74LS17
HEX BUFFERS/DRIVERS
WITH OPENCOLLECTOR HIGHVOLTAGE OUTPUTS

SDLS021C MAY 1990 REVISED FEBRUARY 2004

3 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
recommended operating conditions (see Note 4)
SN54LS07
SN74LS07
SN54LS07
SN74LS07
SN74LS17
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
V
CC
Supply voltage 4.5 5 5.5 4.75 5 5.25 V
V
IH
High-level input voltage 2 2 V
V
IL
Low-level input voltage 0.8 0.8 V
V
OH
High-level output voltage
LS07 30 30
V V
OH
High-level output voltage
SN74LS17 15
V
I
OL
Low-level output current 30 40 mA
T
A
Operating free-air temperature 55 125 0 70 C
NOTE 4: All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER TEST CONDITIONS

SN54LS07
SN74LS07
SN74LS17
UNIT PARAMETER TEST CONDITIONS

MIN MAX MIN MAX

UNIT
V
IK
V
CC
= MIN, I
I
= 12 mA 1.5 1.5 V
I
OH
V
CC
= MIN, V
IH
= 2 V
LS07, V
OH
= 30 V 0.25 0.25
mA I
OH
V
CC
= MIN, V
IH
= 2 V
SN74LS17, V
OH
= 15 V 0.25
mA
V
OL
V
CC
= MIN, V
IL
= 0.8 V
I
OL
= 16 mA 0.4 0.4
V V
OL
V
CC
= MIN, V
IL
= 0.8 V
I
OL
= MAX

0.7 0.7
V
I
I
V
CC
= MAX, V
I
= 7 V 1 1 mA
I
IH
V
CC
= MAX, V
I
= 2.4 V 20 20 A
I
IL
V
CC
= MAX, V
I
= 0.4 V 0.2 0.2 mA
I
CCH
V
CC
= MAX 14 14 mA
I
CCL
V
CC
= MAX 45 45 mA

For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.

I
OL
= 30 mA for SN54 series parts and 40 mA for SN74 series parts.
switching characteristics, V
CC
= 5 V, T
A
= 25C (see Figure 1)
PARAMETER
FROM TO
TEST CONDITIONS MIN TYP MAX UNIT PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
TEST CONDITIONS MIN TYP MAX UNIT
t
PLH
A Y R
L
= 110 , C
L
= 15 pF
6 10
ns
t
PHL
A Y R
L
= 110 , C
L
= 15 pF
19 30
ns
The SN54LS07 and SN74LS17 are
obsolete and are no longer supplied.
SN54LS07, SN74LS07, SN74LS17
HEX BUFFERS/DRIVERS
WITH OPENCOLLECTOR HIGHVOLTAGE OUTPUTS

SDLS021C MAY 1990 REVISED FEBRUARY 2004

4 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
t
PHL
t
PLH
t
PLH
t
PHL
LOAD CIRCUIT
FOR 3-STATE OUTPUTS
High-Level
Pulse
Low-Level
Pulse
VOLTAGE WAVEFORMS
PULSE DURATIONS
Input
Out-of-Phase
Output
(see Note D)
3 V
0 V
V
OL
V
OH
V
OH
V
OL
In-Phase
Output
(see Note D)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
V
CC
R
L
Test
Point
From Output
Under Test
C
L
(see Note A)
LOAD CIRCUIT
FOR OPEN-COLLECTOR OUTPUTS
LOAD CIRCUIT
FOR 2-STATE TOTEM-POLE OUTPUTS
(see Note B)
V
CC
R
L
From Output
Under Test
C
L
(see Note A)
Test
Point
(see Note B)
V
CC
R
L
From Output
Under Test
C
L
(see Note A)
Test
Point
5 k
NOTES: A. C
L
includes probe and jig capacitance.
B. All diodes are 1N3064 or equivalent.
C. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
D. S1 and S2 are closed for t
PLH
, t
PHL
, t
PHZ
, and t
PLZ
; S1 is open and S2 is closed for t
PZH
; S1 is closed and S2 is open for t
PZL
.
E. Phase relationships between inputs and outputs have been chosen arbitrarily for these examples.
F. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, Z
O
50 , t
r
1.5 ns, t
f
2.6 ns.
G. The outputs are measured one at a time, with one input transition per measurement.
S1
S2
t
PHZ
t
PLZ
t
PZL
t
PZH
3 V
3 V
0 V
0 V
t
h
t
su
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Timing
Input
Data
Input
3 V
0 V
Output
Control
(low-level
enabling)
Waveform 1
(see Notes C
and D)
Waveform 2
(see Notes C
and D)
1.5 V
V
OH
0.5 V
V
OL
+ 0.5 V
1.5 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
1.3 V 1.3 V
1.3 V 1.3 V
1.3 V
1.3 V 1.3 V
1.3 V 1.3 V
1.3 V
1.3 V
t
w
1.3 V 1.3 V
1.3 V 1.3 V
1.3 V 1.3 V
V
OL
V
OH
Figure 1. Load Circuits and Voltage Waveforms





















































PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
SN74LS07D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS07DBLE OBSOLETE SSOP DB 14 TBD Call TI Call TI
SN74LS07DBR ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS07DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS07DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS07DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS07DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS07DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS07DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS07DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS07N ACTIVE PDIP N 14 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS07NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS07NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS07NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS07NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS17D OBSOLETE SOIC D 14 TBD Call TI Call TI
SN74LS17N OBSOLETE PDIP N 14 TBD Call TI Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 1
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)
W
(mm)
Pin1
Quadrant
SN74LS07DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74LS07DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74LS07NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LS07DBR SSOP DB 14 2000 346.0 346.0 33.0
SN74LS07DR SOIC D 14 2500 346.0 346.0 33.0
SN74LS07NSR SO NS 14 2000 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E JANUARY 1995 REVISED DECEMBER 2001
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,90 7,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
20 16
6,50 6,50
14
0,05 MIN
5,90 5,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M 0,15
08
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150