Bob Lempkowski

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Industry-recognized authority interested in pioneering new technologies in RF design, antenna applications, MEMS, metamaterials, carbon nanotechnologies, applying 3D electromagnetics simulation, and establishing cross-disciplinary teaming relationships.

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Papers by Bob Lempkowski

Printed circuit embedded capacitors

Structure and method for fabricating semiconductor optical waveguide structures utilizing the formation of a compliant substrate

Normally open and normally closed RF MEMS switches in a mobile computing device and corresponding method

Micro-electro-mechanical system varactor

Nanostructured tunable antennas for communication devices

Optical communication device for rotary motion assemblies

Organic MEMS devices and MWCNT (multi-wall carbon nanotube) interconnects

SPIE Proceedings, 2010

RF system front ends need to be mounted on a circuit board and interconnected to other devices su... more RF system front ends need to be mounted on a circuit board and interconnected to other devices such as antennas and surrounding circuitry functions. Providing suitable RF performing interconnects between or within devices on multi-layer construction has been done typically with doped semiconductors, copper, and occasionally other conductors. This paper discusses the use of organic printed circuit board MEMS switches and varactors, and the use of multi-wall carbon nanotubes as transmission lines and antennas. Carbon nanotube active transistors use single wall carbon nanotubes (SWCNT) with efforts to improve percentages of semiconducting structures. Interconnects are needed not only to connect CNT devices to each other, but to larger structures in order to be able to use subsystems that integrate CNT devices, large scale multifunction ICs, and RF devices used in RF front ends, including antennas. This paper addresses the use of organic substrates as the media for integration of MEMS, interconnects to devices on the substrate, and planar antennas. These methods will be required until complete assembly of all devices and interconnects can be done with processes at the nano-scale level, which is assumed to still need efficient radiative antenna structures at a larger scale for commonly used consumer wireless products.

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Applications of MEMS

Electrical Engineering Handbook, 2011

Embedded assembly including moveable element and antenna element

Micro electro-mechanical system method

US Patent, 2004

A meso-scale MEMS device having a cantilevered bean is formed using standard printed wiring board... more A meso-scale MEMS device having a cantilevered bean is formed using standard printed wiring board and high-density interconnect technologies and practices. The beam includes at least some polymer material to constitute its length, and in some embodiments also comprises a conductive material as a load-bearing component thereof. In varying emobdiments, the beam is attached at a location proximal to an end thereof, or distal to an end thereof.

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Printed circuit embedded capacitors